СИСТЕМА С ЗОНДОМ КЕЛЬВИНА С ВРАЩАЮЩЕЙСЯ ВНЕШНЕЙ ПОВЕРХНОСТЬЮ ЗОНДА

Sensor arrangement for determining position of neutral-conductor in three-phase alternating current cable, has detecting unit detecting voltage difference between measuring electrodes such that position of neutral-conductor is determined

The arrangement (100) has two measuring electrodes (102, 104) attachable at a circumference of a three-phase alternating current (AC) cable, where one of the electrodes covers minimum 50% of the circumference while the other electrode covers less than 50% of the circumference. The electrodes are rotatable around a central axis of the AC cable for measurement purpose. A detecting unit (110) detects a voltage difference between the measuring electrodes such that a position of a neutral-conductor is determined based on the measured voltage difference.

Optoelektronischer Oszilloskoptastkopf zur potentialfreien Erfassung elektrischer Größen

ELEKTROOPTISCHES SCHNITTSTELLENSYSTEM UND BETRIEBSVERFAHREN

Elektrooptische Sonde

Es wird eine elektrooptische Sonde bereitgestellt, die es ermöglicht, dass das von den optischen Bauelementen in der elektrooptischen Sonde reflektierte überflüssige Licht nicht in die Photodioden eintritt. DOLLAR A Die optischen Bauelemente, die eine Abrennungseinrichtung bilden, sind unter einem bestimmten Winkel bezüglich des optischen Weges eines parallelen Lichtstrahles angeordnet, der von einer Kollimatorlinse ausgeht, so dass von den Oberflächen dieser optischen Bauelemente reflektierte überflüssige Lichtstrahlen nicht in Photodioden eintreten. DOLLAR A Der Neigungswinkel dieser optischen Bauelemente liegt innerhalb eines Winkelbereiches, der durch einen Winkel bestimmt ist, der durch einen optischen Weg von dem jeweiligen optischen Bauelement zu einem Lichtempfangselement in der Photodiode und dem Durchmesser des Lichtempfangselements gebildet wird und einem Winkel, der für das optische Bauelement noch zulässig ist, um seinen Transmissionsgrad beizubehalten.

Electrooptic probe

In an electrooptic probe comprising a laser diode 29 and an electrooptic element 26, the probe head 23 and support member 44 are formed of an insulator eg polyacetal resin. The laser diode 41 can be enclosed in a copper foil screen and the photodiodes 38,39 and isolating beam splitters 30,33 can be enclosed in an aluminium screen. The aim is to reduce signal noise detected in the photodiodes 38,39. If the probe is attached to an electrooptic sampling oscilloscope, the laser diode can be used in pulsed mode. Alternatively it can be used in continuous mode if connected to a real time oscilloscope.

Electrooptic probe

Electrooptic probe

An electrooptic probe for an electrooptic sampling oscilloscope comprises a probe unit (15), metal pin (1a) and electrooptic element (2) having a reflector (2a) at one surface. The probe unit contains a reduced number of optical parts, which are arranged such that the optical axis of incoming beams to the electrooptic element differs from the optical axis of outgoing beams of the electrooptic element. A laser beam from laser diode (11) is converged by a converging lens (10a), and is incident on the electrooptic element and reflected from the reflector, the reflected beam being converted to a parallel beam by a collimator lens (3), or converged by a converging lens (10b, fig 2). Polarisation detector (14) separates the beam into two polarised beams by means of quarter wave plate (5) and polarising beam splitter (6), and photodiodes (12, 13) convert the polarised beams to electric signals. The waveform of a measured signal can be determined based on differences between the electric signals ...

Electro-optic probe

SIGNAL SAMPLING APPARATUS

... 1,254,622. Modulating light. INTERNATIONAL BUSINESS MACHINES CORP. 30 July, 1969 [19 Aug., 1968], No. 38208/69. Headings H4F and H4T. [Also in Division G1] The amplitude of an electrical signal fed from a source 11 to a transmission line structure 7 is sampled by passing linearly polarized light pulses, e.g. from a mode locked or modulated laser 1, through an electro-optic element 5 contained in the structure 7, the group velocity of the light pulses through the element 5 and the parallel component of the phase velocity of the electric signal along the structure 7 being made equal, and analysing the state of polarization of the emergent light pulses by an analyser 15 and photo-cell 17. The spatial extent of the pulses in the medium should be substantially less than the optical path length through the medium. A sampling time of about 1 picosec may be achieved, although the response of the cell 17 may be relatively slow. The output of cell 17 may be fed to the holding circuit 19 of a sampling ...

ELECTRO-OPTIC SIGNAL MEASUREMENT

Direct voltage measurements of electrical signals are extracted from transmission lines for display in a manner to permit such measurements with picosecond temporal and submicron spatial resolution utilizing a noncontacting electro-optic probe. The probe may have multiple quantum well (MQW) structure. The NQW structure defines an active region sufficiently small (less than a micron if desired) in width so that it can be placed between neighboring lines on an integrated circuit. A short pulse laser beam is used to sense the absorption change at the time window of interest. The electroabsorption effect in the MQW structure is a nonlinear function of the strength of the electric field. Detection can be carried out by sampling techniques to provide the measurement of the voltage or the display of the signal. Problems arising from crosstalk from neighboring conductors or elements and the lack of bipolar response of the electroabsorption effect have been solved using a reference electrode on ...

ELECTRO-OPTIC SIGNAL MEASUREMENT

Electro-optic probes which are adapted to be placed in the fringe field from electrical signals propagating on conductors (which may be conductors of an integrated circuit) and which modulate optical pulses passing therethrough, for example by modulating the polarization of the light in accordance with the Pockels effect, utilize thin bodies of electro-optic material, such as a single crystal of GaAs in a manner to reduce physical damage to the probe and to the circuit and to precisely locate the probe in the field of the signal being measured, such as adjacent to the conductor of interest. The electro-optic material that is used may also be implanted with high energy ions of low Z materials (e.g. hydrogen or oxygen) so as to create charge trapping sites and to reduce the photo conductivity of the semiconductive electro-optic material sufficiently that the dielectric relaxation time (where photo current through the material reduces by 1/e) is less than the duration of the optical pulses ...

Electrooptic probe

Combined test instrument probe and voltage detector

A voltage detector 44 is mounted on a probe 32 for an instrument such as a multimeter, so voltage is safely detected even if the instrument or probe misfunctions. The probe has a conductive member 50 having a portion 52 acting as probe tip. The voltage detector has means for detecting voltage, which may be a conductive tip 54, possibly interconnected to the probe tip 52, or a non-contacting sensing element (54, figure 3A). The voltage detector has a voltage indicator e.g. LEDs 56 and/or speaker 58. The probe and voltage detector may be combined in a unitary structure (figure 4A). The voltage detector may be mounted on the probe by split rings (132, 134, figure 5) or a strip of adhesive or double-sided tape (150, figure 6).

Electro-optic probe

Probe for electro-optic sampling oscilloscope

Optical driver optical ouput type voltage sensor and IC testing apparatus using them

Electromagnetic field detector

An electromagnetic field detector adapted to display potential hazard to humans and other animals arising from illuminating electromagnetic energy over the frequency range determined to be hazardous by the American National Standards Institute; the detector being designed with various sensing means to create a sensitivity vs. frequency response that is the inverse of the A.N.S.I. protection guides.

ELECTROMAGNETIC FIELD DETECTOR

PROCEDURE FOR THE DIRECT CURRENT MEASUREMENT WITH LARGE MEASUREMENT FLUCTUATION, ELECTRONIC ARRANGEMENT WITH SUCH A MEASURING DEVICE AND DEVICE FOR THE POWER CUT WITH SUCH AN ARRANGEMENT

DEVICE FOR THE ELECTRICAL FUNCTIONAL TEST OF WIRING FIELDS, IN PARTICULAR OF PRINTED CIRCUIT BOARDS.

DEVICE FOR THE ELECTRICAL FUNCTIONAL TEST OF WIRING FIELDS, IN PARTICULAR OF PRINTED CIRCUIT BOARDS.

ARRANGEMENT FOR THE PROOF OF A CHANGE OF LIGHT INTENSITY.

MEASUREMENT OF ELECTRICAL SIGNALS WITH A DISSOLUTION OF SUBPICOSEKUNDEN.

ELECTROOPTICAL INTERFACE SYSTEM AND OPERATING PROCEDURE

TENSION DETECTION PIN

MANY PROBE TEST HEAD AND TESTING METHOD

Capacitive pickup clip

Scanning single electron transistor microscope for imaging ambient temperature objects

Electro-optic voltage sensor head

PRINTED CIRCUIT BOARD TESTING USING NON-TOUCHING PLASMA CONTACTING

A drive device for an apparatus for electrical function testing of wiring matrices, which has optimally simple electrode shapes for the purpose of a further miniaturization with a two-electrode arrangement. For testing printed circuit boards a non-touching plasma contacting is used whereby two respectively selected measuring locations of a wiring matrix can be contacted via allocated discharge channels and their electrodes. The drive of the measuring locations (test points) occurs via control gas discharges that are generated by applying an adequately high voltage between the electrodes. By applying a voltage between the gas discharges, a current conduction that can be evaluated for test purposes is generated for a conductive connection between the test points.

CAPACITIVE PICKUP CLIP

A clip is used for receiving one of a plurality of wires of various sizes. The clip includes a non-movable portion including a wire receiving surface and a movable portion disposed at least partially externally of the nonmovable portion. The movable portion includes a wire engaging surface disposed opposite and facing the wire receiving surface, with the surfaces defining wire receiving jaws operable between a closed jaw condition and an open jaw condition. A biasing element is coupled to the portions biasing the surfaces to the closed jaw condition. The movable portion is reciprocally movable from the closed jaw condition to the open jaw condition against the urging of the biasing element.

Device for tests ultra high frequencies with broad band carried out in situ.

ELECTRO-OPTIC PROBE FOR MEASURING SIGNALS OR ELECTRIC FIELDS AND ITS APPLICATION

DISPLACEMENT MEASUREMENT OF DEFORMABLE BODIES

A method for measuring a position of an object, the method includes probing a sensing mark arranged in a first plane on a substrate to determine the position of the object, a portion of the substrate connecting the sensing mark to the object. An edge of the object can be sufficiently close to an edge of the sensing mark to reduce measurement errors in the position of the object caused by a deformation of the substrate ...

CONNECTION DEVICE AND METHOD FOR MANUFACTURING CONNECTION DEVICE

This connection device is used for inspecting a semiconductor element having an electrical signal terminal through which an electrical signal is propagated and having an optical signal terminal through which an optical signal is propagated, and is provided with: optical connectors (100) that are optically connected to the optical signal terminal; and an electrical connector (200) that is electrically connected to the electrical signal terminal.

DIGITAL SIGNAL TESTING

In an electronic system having logic agents that communicate with each other through one or more signal lines, a method for testing high speed digital signaling on the signal lines is disclosed. The method involves sensing a first crosstalk signal induced by a first digital signal. The first digital signal is driven by a first logic agent into a signal line to communicate with a second agent. The second agent is coupled to receive the first digital signal from the signal line. A logic waveform that represents the digital signal is recorded and/or displayed, based upon the crosstalk signal. The technique may also be used for testing simultaneous bidirectional signaling on the same signal line.

SCANNING ELECTROMAGNETIC-FIELD IMAGER WITH OPTICAL-FIBER-BASED ELECTRO-OPTIC FIELD-MAPPING SYSTEM

A microwave and millimeter-wave electric-field mapping system based on electro-optic sampling has been developed using micromachined Gallium Arsenide crystals mounted on gradient index lenses and single-mode optical fibers. The probes are able to detect three orthogonal polarizations of electric fields and, due to the flexibility and size of the optical fiber, can be positioned not only from the extreme near-field to the far-field regions of microwave and millimeter-wave structures, but also inside of enclosures such as waveguides and packages. A microwave electric-field-mapping system based on micromachined GaAs electro-optic sampling probes mounted on gradient index lenses and single-mode optical fibers can extract field images from the interior of an enclosed microwave cavity.

MULTI-PROBE TEST HEAD

According to the invention, a group of probes in a test head for a scanning probe microscope for testing integrated electronic circuits without contact is placed on a support, said probes having been manufactured by three-dimensional additive lithography. The probes are directed at a central point above the probe group. The conductive probes and the foot end of the capacitive probe are connected to conductor structures on the base for connection to a measuring circuit.

Photon assisted sub-tunneling electrical probe, probe tip, and probing method

An improved non-contact electrical measurement system, method, probe assembly, and probe. A probe having a photoemissive coating deposited thereon is provided and disposed substantially adjacent a measurement site of a test sample. The photoemissive coating of the probe is illuminated by a light source, and electrical measurements are made upon the photoemissive coating to determine the electrical characteristics of the measurement site.

A.C. capacitive gauging system

A compensated capacitive probe system in which the probe and a guard ring are placed in the feedback path of an operational amplifier. An input signal is applied to the operational amplifier in combination with a portion of the guard signal. The resulting configuration compensates for stray capacitance at a measuring electrode of the probe and for the fact that the operational amplifier is other than mathematically ideal.

Voltage detector

Electro-optic system controller and method of operation

A method for calibrating a laser module system includes the processes of connecting testing equipment used for laser calibration to the laser output; setting preamplifier gain to nominal; connecting input of preamplifier to ground; turning off the DC bias for laser; canceling the offset voltage of the preamplifier; recording the monitoring photodiode dark current; incrementing the DC bias to the laser; reading PL; computing dPL/dIL; setting the DC bias to threshold; recording PLTH; recording the photodiode current IPT; recording the temperature of laser module; connecting the preamplifier to provide a VREF input signal to the laser module input increment preamplifier gain G1 while reading power output PL with instrument; determining the preamplifier gain GF needed to obtain full scale output of laser power (PLM); determining the corresponding photodiode current for above condition IPM; calculating the effective responsivity Reff of the module containing the laser and the photodiode; and ...

Capacitive pickup clip

A clip is used for receiving one of a plurality of wires of various sizes. The clip includes a non-movable portion including a wire receiving surface and a movable portion disposed at least partially externally of the non-movable portion. The movable portion includes a wire engaging surface disposed opposite and facing the wire receiving surface, with the surfaces defining wire receiving jaws operable between a closed jaw condition and an open jaw condition. A biasing element is coupled to the portions biasing the surfaces to the closed jaw condition. The movable portion is reciprocally movable from the closed jaw condition to the open jaw condition against the urging of the biasing element.

Method and apparatus for predicting DC offset potential in a liquid crystal display (LCD) device

Methods and apparatus to predict the DC offset potential of a liquid crystal display (LCD) device are described. Surface potential measurements of each half of an LCD device are made before final assembly into the finished LCD device, thereby providing a method of predicting the DC offset potential that will exist in the finished LCD device. The surface potentials of the surfaces that mate with the liquid crystal layer, control the DC offset potential that exists in the finished LCD device.

ELECTROMAGNETIC RADIATION DETECTING SYSTEM AND METHOD

An electromagnetic radiation detecting system within an electric system, the electromagnetic radiation detecting system comprising: a plurality of induction rings, each for surrounding one of a plurality of electric lines of the electric system; and a controller connected to the plurality of induction rings, for measuring voltages produced by the plurality of induction rings, and for indicating, from the measuring, electric lines corresponding to induction rings having non-zero sum total electric current flows, thereby indicating the electric lines as being electromagnetic radiation pollution sources.

GWR probe for interface measurement and viscous fluids

There is disclosed a probe used with a measurement instrument including a pulse circuit for generating pulses. A coaxial connector is secured to the probe case so that the probe case is electrically connected to the ground shield. A center rod has a top end received in the probe case and to extend into a process liquid. The center rod is electrically connected to the center terminal for conducting the pulses. Ground rods are spaced around the center rod and are secured to the probe case. The probe provides an open configuration less susceptible to build-up between the center rod and the ground rods. One or more of the ground rods may by tubes, connected to a flushing port, with nozzles for cleaning the enter rod. Another ground rod may be tubular for carrying a conductor connected to a bottom of the center rod for bottom-up measurement.

MEASUREMENT APPARATUS AND METHOD

Fiberoptic techniques for measuring the magnitude of local microwave fields and power

Fiberoptic sensors of various configurations are provided for measuring the magnitude of the electric or magnetic fields, and thereby the power, at local points within a relatively high-power electromagnetic heating environment such as occurs, for example, in a microwave oven or an industrial microwave processing chamber. Each type of sensor includes one element that is heated by either the oscillating electric or magnetic field, and an optical temperature measuring element positioned to be heated by the first element, its temperature being optically determined by an instrument to which an opposite end of the optical fiber length is connected.

Elektro-optische Abtastanordnung

Kapazitive Testvorrichtung und Verfahren für das kapazitive Testen einer Komponente

Testkopf (160) für das Testen einer Komponente (130), umfassend:eine Halteeinheit (142), die konfiguriert ist, die Komponente (130) zu ergreifen, zu halten und freizugeben,eine Elektrode (152), die konfiguriert ist, mittels kapazitiver Kopplung ein Signal von der Komponente (130) zu empfangen, undeinen Vorverstärker (156), der konfiguriert ist, das , mittels kapazitiver Kopplung empfangene Signal zu verstärken, wobei der Testkopf (160) konfiguriert ist, die Komponente (130) zu einem Testtablett (110) zu bewegen und auf dem Testtablett (110) zu platzieren.

Vorrichtung zur Suche einer elektromagnetischen Störquelle

Verfahren und Vorrichtung zum Suchen nach der Quelle einer elektromagnetischen Störung und kontaktlose Sonde dafür

ELECTROMAGNETIC FIELD DETECTOR

ELECTRO-OPTIC SIGNAL MEASUREMENT

Electrooptic probe

Electro-optical probe for oscilloscope measuring signal waveform

Applying a test signal to a node of a signal path via a parasitic capacitance

Applying a test signal to a node of a signal path using a parasitic capacitance associated with the node. A parasitic capacitance associated with a bond pad may be used to apply a test signal to a signal path. Alternatively, a parasitic capacitance associated with a shielding element may be used to apply a test signal to the signal path. This has application particularly in testing transducers, such as micro-electromechanical (MEMS) capacitive transducers.

AS CAPACITIVE SENSOR SERVING PLATE WITH SHIELDED CONNECTION

Capacity coupled rf voltage probe

Electromagnetic Radiation Detecting System and Method

An electromagnetic radiation detecting system (10) 5 within an electric system (62), the electromagnetic radiation detecting system (10) comprising: a plurality of induction rings (32a, 32b, 32c, 32d), each for surrounding one of a plurality of electric lines (34a, 34b, 34c, 34d) of the electric system (62); and a controller (60) connected to the plurality of induction 10 rings (32a, 32b, 32c, 32d), for measuring voltages produced by the plurality of induction rings (32a, 32b, 32c, 32d), and for indicating, from the measuring, electric lines (34a, 34b, 34c, 34d) corresponding to induction rings (32a, 32b, 32c, 32d) having non-zero sum total electric current flows, thereby 15 indicating the electric lines (34a, 34b, 34c) as being electromagnetic radiation pollution sources. C-, C-o C%4 yo C) ,:T ...

Current sensor and electric network comprising such a current sensor

Current sensor and electric network comprising such a current sensor 5 A current sensor (2) comprising a measurement torus (22), arranged in a casing (20) positioned around an electric conductor (12) able to transmit an electric current, and means (24) for detecting a voltage in the electric conductor. The detection means (24) are configured for surrounding the electric conductor (12) when the current sensor (2) is installed. Figure 3 30- Fig.5 - --- ~ ----_ _ _ _------ 12 +--30 -- ---- - - - - - - - - - - - - - ---- --- --------------- r---------12 24----- p---- 1 3234| 3 3 2 3T3 34 d 34 + 34 + 8 28 28 Fig. 6 ...

PROBE ASSEMBLY WITH MULTI-DIRECTIONAL FREEDOM OF MOTION AND MOUNTING ASSEMBLY THEREFOR

An improved test probe assembly has an improved mounting assembly which provides the test probe multi-directional freedom of movement with respect to a base in order to resist damage frequently caused to the test probe. The improved mounting assembly may, for example, include at least a first resilient mount disposed on the base and having at least a first support and at least a first resilient element. The at least a first resilient element, which may, for example, be at least a first spring, is deflectable when the test probe engages a structure, such as a device under testing (DUT). Accordingly, the improved test probe assembly of the invention can be deflected an infinite number of positions, in order to resist damage caused, for example, by misalignment between the probe and the DUT.

CAPACITIVE PROBE TYPE CIRCUIT BOARD WITH SHIELDED CONNECTOR

A connector (305) is provided, for making electrical connections to a replaceable circuit card (301). A shielded connection is provided by the connector, maintaining high signal integrity without degradation of S/N ratio by loss of signal or introduction of external noise as a result of connection characteristics without noise across the connection. The circuit card includes only features which are inexpensive to produce, resulting in a low circuit card replacement cost.

Together of fiberoptic reel

L'invention concerne un ensemble de bobine de fibre optique destiné à être utilisé dans des systèmes de mesure de la pression acoustique, de la température, etc. Il comprend une bobine (1) de fibre optique portée par l'intermédiaire d'une structure d'encapsulage creuse (2) et un moyen (4, 5) d'ajustement de force servant à réduire sensiblement la force globale qui, sinon, s'exercerait sur la structure de bobine afin de produire un changement de longueur de la bobine lorsque la bobine est soumise à une pression acoustique. Le moyen d'ajustement de force ajuste les amplitudes relatives des forces s'exerçant sur la bobine dans des directions différentes, de façon que l'effet net de ces forces sur la longueur de la fibre optique soit sensiblement nul.

비접촉 전압 계측 장치

... 비접촉 전압 계측 센서(1)에 있어서, 검출 프로브(11)는 판 스프링으로 구성되어 있고, 외력이 인가됨으로써, 상기 판 스프링의 장력이 작용하는 방향으로 권회하도록 변형된다.

CAPACITIVE TEST NEEDLE FOR MEASURING ELECTRICALLY CONDUCTIVE LAYERS IN PRINTED CIRCUIT BOARD HOLES

The invention relates to a test needle for measuring electrically conductive layers in holes in printed circuit boards, and to a test probe having a test needle of this type and a finger tester for testing printed circuit boards which has a test needle of this type or a test probe of this type. The test needle has a capacitive measuring element which is connected to a capacitive measuring device by means of a cable. The cable is shielded and therefore only the capacitive measuring element is able to form a capacitive coupling with additional electrically conductive elements. As a result, this capacitive coupling can be determined with high spatial resolution.

Voltage detector

A voltage detector detects a voltage developing in a selected area of an object such as an integrated circuit by utilizing an electro-optic material equipped in an optical probe. A change in refractive index of an electro-optic material which is caused by the voltage in the object, is detected as a change of polarization of a light beam passing through the electro-optic material. In order to avoid undesired changes of polarization of the light beam when passing through optical fibers, a polarizer, beam splitters, and an analyzer are assembled together and connected to the electro-optic material to form a compact optical probe.

A.C. power measuring apparatus and A.C. power measuring method

An A.C. power measuring apparatus includes a voltage detecting unit that detects voltage waveforms of each of phases of a set of insulated cables for supplying a three-phase A.C. power to a load, by performing a contactless measurement by electrostatic capacitance coupling, and a current detecting unit that detects current waveforms of the set of insulated tables, by performing a contactless measurement by electromagnetic induction coupling. The apparatus further includes a processing unit that computes a power to be supplied to the load, based on line-to-line voltage waveforms, the current waveforms, and prescribed voltage values, by normalizing the voltage waveforms of each of the phases so that as amplitude ratio of the voltage waveforms becomes in accordance with a grounding type of the three-phase A.C. power, and obtaining the line-to-line voltages of the set of three insulated cables based on the normalized voltage waveforms of each of the phases.

Optical voltage sensor, group of optical parts and method of manufacturing same

A group of thermal change resistant optical parts has: at least one intermediate optical part (25,26); and two optical parts (27,28) which are positioned on the same optical axis as that of said intermediate optical part and are arranged on a light incoming side and a light outgoing side of the intermediate optical part, respectively, wherein the two optical parts (27,28) are integrated into one by cure of an inorganic adhesive (11), thereby the intermediate optical part is sandwiched by the optical parts (27,28) of both sides thereof, and is fixed to the optical parts (27,28) of both sides thereof by friction which is generated in a not-bonded contact faces of the optical parts (27,28) of both sides.

Spatially resolved electromagnetic property measurement

A scanning probe detects phase changes of a cantilevered tip proximate to a sample, the oscillations of the cantilevered tip are induced by a lateral bias applied to the sample to quantify the local impedance of the interface normal to the surface of the sample. An ac voltage having a frequency is applied to the sample. The sample is placed at a fixed distance from the cantilevered tip and a phase angle of the cantilevered tip is measured. The position of the cantilevered tip is changed relative to the sample and another phase angle is measured. A phase shift of the deflection of the cantilevered tip is determined based on the phase angles. The impedance of the grain boundary, specifically interface capacitance and resistance, is calculated based on the phase shift and the frequency of the ac voltage. Magnetic properties are measured by applying a dc bias to the tip that cancels electrostatic forces, thereby providing direct measurement of magnetic forces.

Probe card device and rectangular probe thereof

A rectangular probe of a probe card device includes an upper positioned segment, an upper contacting segment, a deformable segment, a lower positioned segment, and a lower contacting segment. The upper positioned segment includes an offset portion, a first positioned portion extending from the offset portion along a first direction, and a second positioned portion extending from a second direction being parallel to and opposite to the first direction. In a width direction perpendicular to the first direction, a width of the first positioned portion is 25%-95% of a width of the offset portion, and a width of the second positioned portion is 25%-95% of the width of the offset portion. The upper contacting segment extends from the first positioned portion along the first direction. The deformable segment, the lower positioned segment, and the lower contacting segment sequentially extend from the second positioned portion along the second direction.

Electro-optic measurements of voltage waveforms on electrical conductors

The longitudinal electro-optic effect is used with an external probe to make voltage measurements on electrical conductors.

LASER-ASSISTED DEVICE ALTERATION USING SYNCHRONIZED LASER PULSES

A pulsed-laser LADA system is provided, which utilizes temporal resolution to enhance spatial resolution. The system is capable of resolving CMOS pairs within the illumination spot using synchronization of laser pulses with the DUT clock. The system can be implemented using laser wavelength having photon energy above the silicon bandgap so as to perform single-photon LADA or wavelength having photon energy below the silicon bandgap so as to generate two-photon LADA. The timing of the laser pulses can be adjusted using two feedback loops tied to the clock signal of an ATE, or by adjusting the ATE's clock signal with reference to a fixed-pulse laser source. 1. A laser assisted device alteration (LADA) system operable in conjunction with an automated testing equipment (ATE) for testing integrated circuit device under test (DUT) , comprising:a controller receiving and analyzing test signals from the ATE;timing electronics receiving a clock signal from the ATE, the timing electronics including a first feedback loop generating a synch signal for synchronization of laser pulses to the clock signal;a tunable pulsed laser source generating the laser pulses and having a tunable laser cavity and having a second feedback loop to control the tunable laser cavity so as to generate desired pulse rate of the laser pulses;optical arrangement receiving laser pulses from the tunable pulsed laser source and directing the laser pulses onto desired location on the DUT;wherein the timing electronics is configured for timing the laser pulses to arrive at transistors in the DUT at times synchronized to the clock time to thereby alter the transistors response to test signals applied to the DUT from the ATE, and wherein the controller is configured to detect the altered transistors response.2. The system of claim 1 , wherein the first feedback loop comprises phase-locked loop.3. The system of claim 1 , wherein the second feedback loop comprises phase-locked loop.4. The system of claim 1 , ...

Electro-optic voltage probe with fibre optic plate

An E-O probe (320) for a two-dimensional voltage detecting apparatus comprises a fiber optic plate (126,128) having a bottom face, comprising a plurality of cores (126) separated from one another by cladding (128), and an electro-optic material (122) attached to an end of each core at said bottom face side, having a reflecting surface (124) for reflecting light on the side remote from said bottom face, an refractive index of said electro-optic material varying in response to an intensity of an electric field applied to said electro-optic material. A two-dimensional voltage detecting apparatus using the E-O probe has a high spatial resolution. ...

Voltage detector

Electric field measuring apparatus

DIFFERENTIAL CAPACITIVE PROBE FOR MEASURING CONTACT RESISTANCE

СИСТЕМА С ЗОНДОМ КЕЛЬВИНА С ВРАЩАЮЩЕЙСЯ ВНЕШНЕЙ ПОВЕРХНОСТЬЮ ЗОНДА

Система (100) с зондом Кельвина для анализа исследуемого образца (134), содержащая привод (102), управляемый и приводимый в действие с помощью средства (103) управления приводом/источника питания, для вращения элемента (106, 120) вокруг оси вращения; соединенную с приводом (102) головку (120) с зондом Кельвина, содержащую зонд Кельвина (122) и имеющую на одном конце внешнюю поверхность (124) зонда Кельвина; отличающаяся тем, что внешняя поверхность зонда Кельвина находится на боковой поверхности, по отношению к оси вращения, головки с зондом Кельвина. Предложены также калибровочная система для системы (100) зонда Кельвина и способ измерений с использованием системы (100) зонда Кельвина для определения присутствия водорода. Техническим результатом при реализации заявленной группы изобретений выступает повышение точности анализа исследуемого объекта, а именно обеспечивается возможность избежать помех, уменьшить степень повреждений зонда в процессе анализа, и, кроме того, постоянная самокалибровка ...

Measuring arrangement for electrical and magnetic fields - has spiral pipe measurement probe with filling and emptying valves and pump

An arrangement for measuring electrical and magnetic fields has a closed pipe measurement probe with spiral curvature of similar size to the effective dia. of a rotating plate carrying permanent magnets. Valves for filling and emptying are arranged at the pipe system ends. Pumps are used to set up and maintain a desired internal water column pressure. USE/ADVANTAGE - For use with therapeutic device for generating pulsed magnetic fields. Enables verification of anticipated charge storage property differences in liquids or other capacitors between undisturbed standard electrical and magnetic fields and modified, anomalous fields.

Optischer Sensor und Verfahren zu seiner Herstellung

Optical fibre coil assemblies

An optical fibre coil assembly for use in systems for the detection of acoustic pressure, temperature etc comprises a coil of optical fibre 1 supported by means of a hollow encapsulating structure 2 and force adjustment means 4 for substantially reducing the overall force which would otherwise act on the coil structure to produce a change of length of the coil when the coil is subjected to acoustic pressure etc. The plates 4,5 seal the ends of the hollow support 2, removing from the central region 3 any influence of external pressure and amplifying axial forces on support from pressures Pe. Outward radial pressure is produced by the axial pressures Pe, the magnitude determined by the size of the central hole and Poisson's ratio of the material. This outward pressure balances the inward acoustic pressure, counteracting any change in the coil diameter and thus its overall length. ...

VOLTAGE DETECTOR

System for electrical signal sampling with ultrashort optical pulses

Electrooptic probe

An electrooptic probe (21) facilitating easy replacement of a metallic pin (32) comprises a probe head (24) constituting a tip end portion (22a) of the probe body (22). The probe head comprises a head body (30) for retaining an electrooptic element (26) and a tip member (31) detachably provided on the head body (30) for retaining the metallic pin (32). A reflecting film (28) is coated on the tip member side of the electrooptic element to reflect light from a laser diode (25) passing through the electrooptic element, and a buffer plate (not shown) may be provided between the electrooptic element (26) and reflective film (28) and the base end of the metallic pin (32a), so when attaching and detaching tip member (31), no damage occurs to the element (26). The attachment means may comprise a male threaded portion (30a) on the head body (30) protruding towards the tip member (31) side, and a female threaded portion (31a) in the tip member (31), which are engagable with each other. Other attachment ...

Electro-optic sampling probe and its adjustment

An electro-optic sampling probe, particularly for measuring electric fields on an IC chip, comprises a probe assembly (see figure 4) which includes a sampling optical system module (figure 1 and parts 11 11a 96 6a in figure 4), an aiming camera (8, fig 4), and has an electro-optic material (2, fig 4) placed on top of an IC chip (1, fig 4) with a reflecting side facing the IC chip. The electric field from wiring in the IC chip changes the refractive index of the electro-optic material which alters the detected polarisation of the probe laser beam (path A, fig 4). The sampling optical system module comprises means 11b 11c to adjust the optical axis and the collimation of the input laser beam. The laser beam passes though the isolation system 60 to the probe assembly and is reflected back through the isolation system to photo diodes 67, 68. The isolation system 60 includes half wave plates 61,64 quarter wave plate 62, polarisation beam splitters 63 and 66 and Faraday element 65. Adjustment ...

Probe signal outputting apparatus

Electro-optic sampling probe with multiple optical excitation of IC wafer

An IC wafer 1 has an electro-optic element 2 in contact with the IC wiring and a sampling light beam from module 6a is reflected through the element 2 and back to the module 6a where changes due to the electrical signal on the wiring can be detected. The sampling module is detachably connected via portion 5a to first probe body 41. The probe also has second probe body 42 onto which is detachable connected via portions 5b, 5c excitation modules 6b, 6b' which use a common objective lens 34 for condensing the excitation light onto the IC 1. The optical axis of at least one of the excitation modules differs such that at least two excitation light beams can irradiate different portions of the IC. The modules attached to the two probe modules 41 and 42 are interchangeable, potentially allowing either the reverse or both sides of the IC to be measured. The light source 11 for the excitation and measurement may be shared between modules 6a, 6b, 6b'.

Electro-optic probe

Electrooptic probe

Current sensor and electric network comprising such a current sensor

Current sensor and electric network comprising such a current sensor 5 A current sensor (2) comprising a measurement torus (22), arranged in a casing (20) positioned around an electric conductor (12) able to transmit an electric current, and means (24) for detecting a voltage in the electric conductor. The detection means (24) are configured for surrounding the electric conductor (12) when the current sensor (2) is installed. Figure 3 30- Fig.5 - --- ~ ----_ _ _ _------ 12 +--30 -- ---- - - - - - - - - - - - - - ---- --- --------------- r---------12 24----- p---- 1 3 6| 6 3 36 34d 134 + 34 + 8 28 28 Fig. 6 ...

Circuit for leading-out trigger signal from AC line

SAMPLING SYSTEM UTILIZING ELECTRO?OPTIC TECHNIQUES

SENSOR OF ELECTRIC FIELD HAS EFFECT POCKELS.

ELECTRODE FOR MEASURING THE RELATIVE PERMITTIVITY.

METHOD AND APPARATUS FOR LOCATING DEFECTS BY SHORT CIRCUITS

Non-contact type probe card management apparatus

Electrical connecting apparatus and contacts used therefor

An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.

In-process electrical connector

Characteristics of partially assembled photovoltaic modules can be determined using electrical connection apparatuses and methods.

Singulated semiconductor device separable electrical interconnect

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

Measuring device for electrically measuring a flat measurement structure that can be contacted on one side

A measuring device for electrically measuring a measurement structure that can be electrically contacted at one measuring side, in particular an optoelectronic element, such as a solar cell, including at least two contacting units for electrically contacting the measurement structure and at least one support element for supporting the measurement structure with the measuring side on the support element. It is essential that the measuring device includes at least one suction line for the connection to the suction unit and at least one suction opening that is connected in a fluid-conducting manner to the suction line, wherein the suction opening is arranged in and/or on the support element such that the measurement structure can be pressed against the support element by suctioning via the suction opening. When the measurement structure rests on the support element, the contacting unit can be pressed against the measuring side of the measurement structure for the electrical contacting thereof.

Adapted test apparatus for electronic components

An adapted test apparatus for electronic components includes a case assembly, a plurality of first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a plurality of test connectors and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and substantially perpendicular to the motherboard. The test connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts a plurality of electronic components into the test connectors in a vertical direction, tests the electronic components and removes the electronic components after the electronic components are tested.

Socket for a semiconductor device

A device, wherein, at cells 10 ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20 S of contact terminals 20 ai that have the same structure as each other, and wherein, at the cells 10 ai that correspond to ground lines, contact points 20 CT 2 of the contact terminals 20 ai are inserted in through-holes 12 ai of the lower housing 12, and their contact points 20 CT 1 are inserted into small diameter holes 22 b of conductive collars 22 that touch the inner surfaces of the cells 10 ai.

Vertical probe tip rotational scrub and method

A vertical probe tip rotational scrub and method is described. The vertical probe includes a wafer prober chuck; a wafer positioned on the wafer prober chuck; and at least one probe having a probe tip, the at least one probe tip rotatably mounted such that the probe tip provides a rotational scrub on a surface of a wafer surface. A method for wafer probing is also described, the method includes: determining a vertical location of a wafer surface relative to at least one probe having a probe tip; retracting the probe tip; and imparting an upward motion on the at least one probe in response to the retracting of the probe tip, wherein the upward motion results in a rotational scrub of the wafer surface.

Computing device and method of compensating center position of mechanical arms

In a method of compensating the center position of a mechanical arm which has a first probe, a second probe, and a platform, a first test point and a second test point are selected on an electronic product and coordinates of the two points are acquired. A distance R between the first probe and the mechanical arm is received, and an angle θ between the platform and a line formed according to the two points is computed to obtain compensated coordinates of the mechanical arm. The mechanical arm moves to the location of the compensated coordinates, and thus locating the first probe and the second probe respectively at the first test point and the second test point.

Test Contact System For Testing Integrated Circuits With Packages Having An Array Of Signal and Power Contacts

A test fixture ( 120 ) is disclosed for electrically testing a device under test ( 130 ) by forming a plurality of temporary mechanical and electrical connections between terminals ( 131 ) on the device under test ( 130 ) and contact pads ( 161 ) on the load board ( 160 ). The test fixture ( 120 ) has a replaceable membrane ( 150 ) that includes vias ( 151 ), with each via ( 151 ) being associated with a terminal ( 131 ) on the device under test ( 130 ) and a contact pad ( 161 ) on the load board ( 160 ). In some cases, each via ( 151 ) has an electrically conducting wall for conducting current between the terminal ( 131 ) and the contact pad ( 161 ). In some cases, each via ( 151 ) includes a spring ( 152 ) that provides a mechanical resisting force to the terminal ( 131 ) when the device under test ( 130 ) is engaged with the test fixture ( 120 ).

Wafer level testing structure

A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober.

Probe card wiring structure

The present disclosure provides a probe card for wafer level testing. The probe card includes a space transformer having first power/ground lines and first signal lines embedded therein, wherein the first power/ground and signal lines are configured to have a first wiring pitch on a first surface and a second wiring pitch on a second surface, the second wiring pitch being substantially less than the first wiring pitch; a printed circuit board bonded to the first surface of the space transformer, wherein the printed circuit board includes second power/ground lines and second signal lines embedded in the printed circuit board and coupled to the first power/ground and signal lines; and conductive lines configured to a surface of the printed circuit board remote to the first surface of the space transformer, wherein each of the conductive lines includes a first end coupled to one of the second signal lines and a second end coupled to a different location of the printed circuit board.

Wireless probe card verification system and method

A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober.

High-frequency coupling testing device by coupling effect

Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes.

Non-Linear Vertical Leaf Spring

An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

3D IC Testing Apparatus

A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once.

Positioning and socketing for semiconductor dice

Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

Automatic probe configuration station and method therefor

A probe system for facilitating the inspection of a device under test. System incorporates a storage rack; a probe bar gantry assembly; a probe assembly configured to electrically mate the device under test; and a robot system for picking the probe assembly from the storage rack and deliver the probe assembly to the probe bar gantry. The robot system is also enabled to pick a probe assembly from the probe bar gantry and deliver the probe assembly to the storage rack. The probe assembly includes a clamping assembly for attaching the probe assembly to the probe bar gantry or the storage rack. The probe assembly may include an array of contact pins configured to mate with conductive pads on the device under test when the probe assembly is installed on the probe bar gantry assembly.

Wiring board and method of manufacturing the same

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

High Voltage Sensing Mechanism with Integrated On-Off Switch

The present invention is an efficient high voltage sensing mechanism that operates only when an individual needs to test the voltage across a wire. The present invention attaches around a tested wire using a jaw and a hook. The hook is tensioned using an expansion spring. The operator propels the hook outwards from the jaw, around the tested wire; thereafter, the expansion spring retracts to latch onto the tested wire against the jaw. An on-off switch is integrated into the mechanical hook device. As the hook is propelled outwards, the on-off switch moves into the “on” position, which powers the electrical processing and voltage analysis equipment. Once the hook is returned to the initial position, the on-off switch moves to the “off” position. This arrangement allows the present invention to remain unpowered for any instance a wire is not being tested. The present invention detects voltage through capacitive coupling.

Probe card and method for testing magnetic sensors

A probe card and method are provided for testing magnetic sensors at the wafer level. The probe card has one or more probe tips having a first pair of solenoid coils in parallel configuration on first opposed sides of each probe tip to supply a magnetic field in a first (X) direction, a second pair of solenoid coils in parallel configuration on second opposed sides of each probe tip to supply a magnetic field in a second (Y) direction orthogonal to the first direction, and an optional third solenoid coil enclosing or inscribing the first and second pair to supply a magnetic field in a third direction (Z) orthogonal to both the first and second directions. The first pair, second pair, and third coil are each symmetrical with a point on the probe tip array, the point being aligned with and positioned close to a magnetic sensor during test.

Wafer prober integrated with full-wafer contacter

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

Probing device

A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

Probe Calibration Device and Calibration Method

A calibration device applied for a test apparatus with at least a first probe and a second probe, the calibration device comprising: a first testing region and a second testing region, the first testing region and the second testing region divides into n×n sensing units respectively, the first testing region for generating n×n average electricity corresponding to a contact degree of the first probe contacted with the calibration device, and the second testing region for generating another n×n average electricity corresponding to a contact degree of the second probe contacted with the calibration device, and the pitch is the distance between the center of the first testing region to the center of the second testing region that is the same as that of the center of the first probe to the center of the second probe.

Indirect non-contact high voltage measurement on electrical power line

A non-contact electrical power line voltage measurement device comprises a probe including an insulated shield supporting an electrode to sense electrostatically induced voltage from the power line. The shield houses a high voltage resistor connected in series with the electrode. A meter comprises a housing operatively associated with the shield and enclosing a measurement circuit electrically connected to the high voltage resistor for measuring induced electrode voltage. A calibration circuit correlates measured electrode voltage to power line voltage. A display is driven by the measurement circuit for displaying actual power line voltage responsive to the electrode being a select distance from the power line.

Probe card and manufacturing method thereof

There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

Jig for use in semiconductor test and method of measuring breakdown voltage by using the jig

A jig for use in a semiconductor test of the present invention includes; a base on which a probe pin and an insulating material are provided such that the probe pin is surrounded by the insulating material in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are provided. The stage is capable of receiving a test object placed on a surface facing the base. When the test object is placed on the stage and the base and the stage move in a direction in which they get closer to each other, the probe pin comes into contact with an electrode formed on the test object, and the insulating material comes into contact with both the test object and the stage.

Hybrid Electrical Contactor

An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

Vertical probe assembly with air channel

A vertical probe assembly includes an upper die; a lower die; a plurality of probes, the probes comprising an electrically conductive material, wherein the probes extend from the upper die through the lower die; and an air channel located between the upper die and the lower die, such that airflow through the air channel passes through the plurality of probes.

Methods and apparatus for three-dimensional microfabricated arrays

In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate. 1. A method comprising fabrication of at least one electrical connection between a first surface and a second surface by electrical deposition , wherein:the first and second surfaces are separated, except for the at least one electrical connection, by a gap of not more than 100 micrometers; andthe first and second surfaces are off angle with respect to each other.2. The method of claim 1 , wherein the electrical deposition comprises electroplating.3. The method of claim 1 , wherein the electrical deposition comprises electroless deposition.4. The method of claim 1 , wherein the at least one electrical connection comprises multiple electrical connections claim 1 , and the pitch between at least some of the multiple electrical connections is less than 50 micrometers.5. The method of claim 4 , wherein the pitch between at least some of the multiple electrical connections is less than 40 micrometers.6. The method of claim 5 , wherein the pitch between at least some of the multiple electrical connections is less than 30 micrometers.7. The method of claim 1 , wherein the method further comprises ...

Uniform field area testing apparatus and testing method using same

A uniform field area (UFA) testing apparatus, used for an UFA test, including a testing rack and a plurality of field strength probes. The plurality of field strength probes are mounted on the testing rack. The plurality of field strength probes are positioned on a vertical plane and forms a probe grid array corresponding to the testing points of the UFA test, the grid spacing of the probe grid array corresponds to the distance of the neighboring testing points of the UFA test.

SYSTEM AND ADAPTER FOR TESTING PACKAGED INTEGRATED CIRCUIT CHIPS

High precision connectivity for a device under test (DUT) in an electronic test system at reduced cost and superior performance characteristics is provided by incorporating an appropriate contact structure into a printed circuit board (PCB) of the electronic test system. Alternatively, a superior adapter that is formed on the basis of highly precise volume production techniques, for example using well-established semiconductor materials and related manufacturing techniques, is provided to support high precision connectivity. 1. An electronic test system , comprisinga printed circuit board having a first surface and an oppositely arranged second surface;a support structure attached to said printed circuit board and configured to receive and hold in position a packaged semiconductor device to be tested; anda contact structure formed on said printed circuit board and configured to directly and removably connect to a complementary contact structure of said packaged semiconductor device to be tested.2. The electronic test system of claim 1 , wherein said support structure comprises a load mechanism configured to temporarily bias said packaged semiconductor device against said contact structure.3. The electronic test system of claim 1 , wherein said support structure comprises at least one guide element configured to fix a lateral position of said packaged semiconductor device.4. The electronic test system of claim 1 , wherein said contact structure comprises conductors extending through said printed circuit board from said first surface to said second surface.5. The electronic test system of claim 1 , wherein said contact structure comprises elastic conductive portions.6. The electronic test system of claim 4 , wherein said conductors are formed of an elastic material.7. The electronic test system of claim 4 , wherein said contact structure comprises fixed contact elements formed on said second surface of said printed circuit board.8. The electronic test system of claim ...

Wiring board and probe card using the same

A wiring board 3 according to the present invention includes a first resin layer 18 a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18 a ; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18 a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18 a.

Methods and Systems for Cleaning Needles of a Probe Card

A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles. 1. A method of cleaning needles of a probe card in a test system , the method comprising:mounting the probe card having a plurality of device under tests (DUTs) and needles in a card mounting part;scanning the DUTs and needles using a camera positioned in the test system to provide a scan result;focusing a laser beam on at least one of the needles based on the scan result; andirradiating the laser beam on the at least one of the needles to clean the at least one of the needles.2. The method of claim 1 , wherein the laser beam comprises a plurality of laser beams and the at least one needle comprises a plurality of needles and wherein focusing the laser beams comprises comparing the scan result with a stored image corresponding a case where the laser beams are focused on the needles and moving the laser beams or the probe card to focus the laser beams on the needles based on the comparison of the scan result and the stored image.3. The method of claim 2 , wherein irradiating the laser beams is followed by scanning the cleaned needles using the camera to provide a cleaning result image.4. The method of claim 3 , wherein scanning the cleaned needles is followed by:identifying ones of the needles that are not yet clean based on the cleaning result image; andrepeating focusing the laser beams and irradiating the laser beams to clean the identified ones of the needles that are not yet cleaned.5. The method of claim 4 , wherein identifying ones of the needles includes displaying the cleaning result ...

Replaceable coupon for a probing apparatus

The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

WIRING BOARD AND PROBE CARD USING THE SAME

A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability. 1. A wiring board comprising:a core substrate; anda buildup layer formed on the core substrate, a plurality of resin layers laminated on the core substrate;', 'a plurality of pads formed on a topmost layer of the resin layers and to which a plurality of probes are respectively connected;', 'a plurality of wiring conductors formed on either the resin layers or the core substrate and electrically connecting the plurality of pads individually to an external circuit;', 'a via conductor penetrating through the resin layer in a thickness direction thereof and electrically connecting the pad and the wiring conductor together; and', 'a dummy via conductor penetrating through the resin layer in the thickness direction thereof without electrically connecting the pad and the wiring conductor together,, 'wherein the buildup layer includeswherein the via conductor and the dummy via conductor are arranged immediately below each of the pads,the pads include a first pad with at least one of the dummy via conductors arranged immediately therebelow, and a second pad with only the via conductor arranged immediately therebelow, andwherein a total amount of the dummy via conductors and a quantity of the via conductors formed immediately below the first pad is equal to an amount of the via conductors formed immediately below the second pad.2. The wiring board according to claim 1 ,wherein the plurality of wiring conductors include a first wiring conductor electrically connected to the first pad, and a second wiring conductor positioned in a layer different from a layer in which the first wiring conductor is positioned and electrically connected to the second pad.3. The wiring board according to claim 1 ,wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are distanced away from each other with the resin layer ...

Probe assembly

Provided is a probe assembly that can be used for fine-pitch pads and can be made with lower cost. The probe assembly includes: a vertical probe which is formed by etching metal foil, and touches a to-be-inspected semiconductor chip electrode; an output terminal which projects from a side opposite to the side of the vertical probe and touches a wiring board; a thin plate-shaped probe which has a substantially rectangular cross section at a part thereof and includes an opening which engages a support rod; and a support rod which includes a first guide groove which guides the opening, a second guide groove which guides the vertical probe, and a third guide groove which guides the output terminal.

TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact. 1. A method comprising:forming a plurality of probes in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,wherein tips of said plurality of probes are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;attaching said sacrificial material comprising said plurality of probes to a space transformer,wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes;removing said sacrificial substrate; andremoving said sacrificial material, while leaving said plurality of probes intact.2. The method of wherein said ...

TRANSLATORS COUPLEABLE TO OPPOSING SURFACES OF MICROELECTRONIC SUBSTRATES FOR TESTING, AND ASSOCIATED SYSTEMS AND METHODS

Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods are disclosed. An arrangement in accordance with one embodiment includes a microelectronic substrate having a first major surface, a second major face facing opposite from the first major surface, and electrically conductive through-substrate vias extending through the substrate and electrically accessible from both the first and second surfaces. The arrangement further includes a first translator releasably connected to the substrate and positioned in a first region extending outwardly from the first surface, the first translator including first electrical signal paths that access the vias from the first surface, and a second translator releasably connected to the substrate simultaneously with the first translator, the second translator being positioned in a second region extending outwardly from the second surface, the second translator including second electrical signal paths that access the vias from the second surface. 1. A method for testing a microelectronic substrate , comprising;positioning a first translator in a first region proximate to a microelectronic substrate, the microelectronic substrate having a first major surface and a second major surface facing away from the first major surface, the microelectronic substrate having electrically conductive through-substrate vias extending through the substrate, a first region extending outwardly from the first major surface of the microelectronic substrate and a second region extending outwardly from the second major surface;releasably fixing the first translator relative to the microelectronic substrate at the first region;releasably fixing a second translator relative to the microelectronic substrate at the second region while the first translator is fixed relative to the microelectronic substrate at the first region;electrically accessing a first through-substrate via of the ...

Probe Card And Manufacturing Method Therefor

The present invention provides a ST board that is formed with an lower surface electrode ; a unit attachment plate that is fastened on the ST board and formed with an opening part exposing the lower surface electrode ; a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on the unit attachment plate ; and an electrically conductive wire that connects the lower surface electrode and the probe electrode to each other through the opening part . The probe unit can be fastened on the ST board with the unit attachment plate intervening, and through the opening part of the unit attachment plate , the probe electrode and the lower surface electrode can be electrically connected to each other. 1. A probe card comprising:a wiring substrate that is formed with an electrode terminal;a unit attachment plate that is fastened on said wiring substrate and formed with an opening part exposing said electrode terminal;a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on said unit attachment plate; andan electrically conductive wire that connects said electrode terminal and said probe electrode to each other through said opening part.2. The probe card according to claim 1 , wherein:two or more said electrode terminals are exposed from said opening part in common; andtwo or more said probe electrodes on said probe unit are respectively connected to corresponding ones of said electrode terminals through two or more electrically conductive wires passing through said opening part in common.3. The probe card according to claim 2 , wherein:two or more probe units are arranged on said unit attachment plate in common; andsaid opening part has a long narrow shape that extends along outer edge parts of said probe units.4. A probe card manufacturing method comprising:a step of fastening a probe substrate formed with a contact probe and a probe electrode on a unit attachment plate ...

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. 1. A process for providing a custom electrically conductive terminal on a first surface of a wiring substrate , wherein said wiring substrate comprises electrically conductive vias from said first surface to an opposite surface of said wiring substrate , said process comprising:forming a hole at a first one of said vias from said first surface into said wiring substrate and thereby removing all electrically conductive material of said first via in a gap from said first surface into said wiring substrate;depositing an electrically insulating material into said hole such that said electrically insulating material is disposed between all remaining electrically conductive material of said first via and said first surface of said wiring substrate; andproviding on said first surface of wiring substrate and said insulating material said custom terminal such that said custom terminal overlaps said first via and a second one of said vias that is adjacent to said first via without electrically contacting said first via.2. The process of claim 1 , wherein said custom terminal overlaps said first via and said second via and a third one of said vias.3. The process of ...

METHOD FOR THERMAL STABILIZATION OF PROBE CARD AND INSPECTION APPARATUS

In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable. 1. A method for thermal stabilization of a probe card by using an inspection apparatus including: a horizontally and vertically movable mounting table; a probe card having a plurality of probes , disposed above the mounting table; a vertical drive mechanism configured to vertically move the mounting table; a temperature control unit configured to control a temperature of the mounting table; and a control unit configured to control the vertical drive mechanism and the temperature control unit , wherein before inspecting electrical characteristics of an inspection target at a predetermined temperature , the probe card is thermally stabilized by mounting a heat transfer substrate on the mounting table , adjusting the probe card to a predetermined temperature through the heat transfer substrate on the mounting table of which temperature is adjusted by the temperature control unit , and controlling a contact load between the heat transfer substrate and the probes to a predetermined target load by vertically moving the mounting table through the vertical drive mechanism , the method comprising:a first step of mounting the heat ...

LATERALLY DRIVEN PROBES FOR SEMICONDUCTOR TESTING

A method for testing a semiconductor device. The method comprises moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure. A tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure. The method also includes moving the probe in a lateral direction towards the electrical structure to contact the electrical structure. The probe tip mechanically and electrically engages the electrical structure. 1. A method for testing a semiconductor device , the method comprising:moving a probe in a vertical direction towards an electrical structure on a semiconductor device to position the probe alongside the electrical structure, wherein a tip of the probe is positioned lower than an elevation of an outermost periphery of the electrical structure; andmoving the probe in a lateral direction towards the electrical structure to contact the electrical structure, wherein the probe tip mechanically and electrically engages the electrical structure.2. The method of claim 1 , wherein the probe tip exerts a force against the electrical structure that is proportional to an amount of lateral overdrive after first mechanical contact between the probe tip and the electrical structure claim 1 , wherein the lateral overdrive is an amount of lateral movement of the probe.3. The method of further comprising claim 1 , after contact with the electrical structure claim 1 , moving the probe tip over an upper surface of the electrical structure and away from the outermost periphery of the electrical structure.4. The method of claim 1 , wherein the probe tip is positioned substantially in the middle of a space defined by the outermost periphery of the electrical structure and an outermost periphery of an adjacent electrical structure.5. The method of further comprising withdrawing the probe from the electrical structure along a direction substantially ...

Test device for testing a pop stacked-chip

A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

PROBE CARD AND MANUFACTURING METHOD

There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips. 1. A probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies , the probe card comprising:a printed circuit board on which a plurality of pads are formed;a block plate having a plurality of grooves and attached to the printed circuit board;a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; anda plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.2. The probe card of claim 1 , a body part having a plurality of slits that define a space transformation path; and', 'a plurality of micro pins that are inserted into the plurality of slits to electrically connect the printed circuit board to the sub-probe units., 'wherein the interposer/space transformer unit comprises3. The probe card of claim 2 ,wherein one of the interposer/space ...

Probe-on-substrate

Probes are directly patterned on a test substrate, thereby eliminating a need for an interposer. Probe contact structures are formed as a two-level structure having a greater lateral dimension for a lower level portion than for an upper level portion. First cavities are formed in a masking layer applied to a test substrate, filling the cavities with a conductive material, and planarizing the top surfaces of the conductive material portions to form lower level portions. Another masking layer is applied over the lower level portions and patterned to define second cavities having a smaller lateral dimension that the lower level portions. The second cavities are filled with at least one conductive material to form upper level portions of the probe contact structures. The upper level portion of each probe contact structure can be employed to penetrate a surface oxide of solder balls.

HIGH FREQUENCY PROBE CARD

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. 1. A high frequency probe card comprising:at least one substrate each having at least one first opening;an interposing plate disposed on the at least one substrate and provided with at least one second opening corresponding to the at least one first opening respectively;a circuit board disposed on the interposing plate and provided with a third opening corresponding to the at least one first opening and the at least one second opening; and at least one N-type ground probe; and', an N-type signal probe; and', 'a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe; wherein an insulation layer is disposed between the N-type signal probe and the first conductor., 'at least one high frequency signal probe penetrating through the corresponding at least one substrate and the interposing plate, passing through the third opening and being electrically connected with the circuit board; each said high frequency signal probe comprising], 'at least one probe module disposed on the at least one substrate ...

Probe Card Assemblies And Probe Pins Including Carbon Nanotubes

A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes. 1. A probe card assembly for testing circuit boards comprising:a multi-layered dielectric plate aligned with an integrated circuit, said integrated circuit having arrayed upon its surface a first plurality of electrical contacts arranged in a pattern, said dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching said first plurality of electrical contacts;a carbon nanotube interposer interposed between said dielectric plate and said integrated circuit, said nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on said integrated circuit and said dielectric plate; anda plurality of substantially non-compliant vertical probes arrayed in a pattern upon said nanotube interposer and joined with said nanotubes, said vertical probes making electrical contact with said first plurality of electrical contacts and said second plurality of electrical ...

Interposer to regulate current for wafer test tooling

An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.

Docking device, docking method

A docking device for connecting a semiconductor probe to a semiconductor handler has in each case one probe-side and one handler-side connecting device, a handling device for handling a contact-making device and a coupling device for coupling the connecting devices. The coupling device has a first shifting device, which allows the translational and guided shifting of the probe-side connecting device relative to the handler-side connecting device towards and away from one another.

AC OR DC POWER TRANSMISSION SYSTEM AND A METHOD OF MEASURING A VOLTAGE

The present invention relates to an AC or DC power transmission system. The system comprises a first electrical conductor, a second electrical conductor and an insulating space there between. The system further comprises an electric field measurement device comprising the following components being mounted in optical continuation: a first optical fibre being connected to a light source, a first optical lens, a circular polarization filter, a crystal rod having electro-optical properties, a linear polarization filter, a second optical lens, and a second optical fibre being connected to a light detection unit. The electric field measurement device is located adjacent the first electrical conductor and defines a first minimum distance between the crystal rod and the first electrical conductor and a second minimum distance between the crystal rod and the second electrical conductor. The second minimum distance is at least 10 times larger than the first minimum distance. 116-. (canceled)17. An AC or DC power transmission system comprising a first electrical conductor , a second electrical conductor and an insulating space between said first electrical conductor and said second electrical conductor , said power transmission system further comprising an electric field measurement device , said electric field measurement device comprising:a housing made of dielectric material and defining a first open end and a second open end opposite said first open end;a first optical fiber configured for connection to a light source;a first optical lens mounted in said housing at said first open end and in optical continuation with said first optical fiber;a circular polarization filter mounted in said housing in optical continuation with said first optical lens;a crystal rod having electro-optical properties received in and encapsulated within said housing in optical continuation with said circular polarization filter;a linear polarization filter mounted in said housing in optical ...

Integrated Circuit Die Having Input and Output Circuit Pads, Test Circuitry, and Multiplex Circuitry

Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible. 1. An integrated circuit die comprising:A. input and output circuit pads;B. core circuits having core input leads and core output leads coupled with the input and output circuit pads; i. a core input lead;', 'ii. a first circuit pad lead connected with a first circuit pad;', 'iii. a second circuit pad lead connected with a second circuit pad;', 'iii. a tristate output buffer having an input connected with the core input lead, an output connected with the first circuit pad lead, and a control input;', 'iv. compare circuitry having a first input connected with the core input lead, a second input connected with the first circuit pad lead, a third input coupled with the second circuit pad lead, a scan input, a scan output, and a scan control input; and, 'C. test circuitry havingD. multiplex circuitry having inputs connected to core output leads of the core circuits, a core select input, and a selected core output connected to the core input lead of the compare circuitry.2. The integrated ...

Space Transformation Methods

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

Fine pitch interposer structure

A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate.

FINE PITCH INTERFACE FOR PROBE CARD

A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit. 1. A probe card interface comprising:an impedance control element to interface a first set of pins of a probe head with a first circuit, wherein the impedance control element is configured to control the impedance of the first set of pins; anda printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit, wherein the PCB is coupled to provide at least one of power or ground to the second set of pins.2. The probe card interface of claim 1 , wherein the impedance control circuitry comprises a dielectric substrate coupled between two ground planes claim 1 , and wherein the first set of pins is disposed claim 1 , at least in part claim 1 , within the dielectric substrate.3. The probe card interface of claim 2 , wherein one or more of the pins of the first set of pins comprises a conductive wire.4. The probe card interface of claim 2 , wherein the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer.5. The probe card interface of claim 4 , wherein the first conductive layer is coupled to ground claim 4 , and wherein the second conductive layer is coupled to a ...

PROBE CARD FOR CIRCUIT-TESTING

A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes. 1. A probe card for circuit-testing c comprising:a testing print circuit board;a probe head having a plurality of probes provided with a fine pitch arrangement and held inside; anda silicon interposer substrate for conveying signals between said probes and said test PCB, wherein the interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process; a plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate; the pitch between said upper terminals is larger than the pitch between said lower terminals; and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.2. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon interposer substrate comprises:a silicon substrate with a TSV conductive structure; anda redistribution layer arranged on the upper surface of said silicon substrate, wherein said upper terminals are arranged on the upper surface of said redistribution layer.3. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon ...

Probe tip formation for die sort and test

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

ORGANIC PROBE SUBSTRATE

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate. 1. A method of manufacturing an organic probe substrate structure comprising:attaching an organic laminate to a daughter card;planarizing a top surface of the organic laminate after attaching the organic laminate to the daughter card; andbuilding a plurality of probes on top of the organic laminate.2. The method of claim 1 , wherein planarizing the top surface of the organic laminate comprises milling a sacrificial layer on the top surface of the organic laminate.3. The method of claim 2 , wherein the top surface is planar.4. The method of claim 1 , wherein the daughter card includes a ledge on each side claim 1 , each of which includes a fastening hole claim 1 , wherein when mounted claim 1 , the daughter card is unsupported at corners of the daughter card.5. The method of claim 1 , wherein the attaching the organic laminate to the daughter card is through solder connection.6. The method of claim 5 , further comprising applying soldering paste on a bottom surface of the organic laminate and a top surface of the daughter card claim 5 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter cards via the solder paste.7. The method of claim 6 , further comprising applying a filling material between the organic laminate claim 6 , the daughter card claim 6 , and about a plurality of solder connections.8. The method of claim 1 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter card using a solder reflow process.9. The method of claim 1 , wherein the daughter card includes a plurality of through vias.10. The method of claim 9 , wherein the organic laminate includes a plurality of probe vias on a pitch that is less than a pitch of the through vias ...

PROBE MODULE SUPPORTING LOOPBACK TEST

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened. 1. A probe module , which is provided between a printed circuit board (PCB) and a device-under-test (DUT) to perform a loopback test , comprising:an adapter, which has a surface, and is provided with two connecting circuits;two probes, wherein each of which has an end electrically connected to one of the connecting circuits, while another end thereof, which is a tip, contacts a tested pad on the DUT;two inductive components provided at the surface of the adapter, wherein each of the inductive components has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the PCB through a conductive member; anda capacitive component provided at the surface of the adapter, wherein the capacitive component has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the other one of the connecting circuits.2. The probe module of claim 1 , wherein the adapter has a first surface claim 1 , a second surface opposite to the first ...

DEVICES AND METHODS FOR TESTING INTEGRATED CIRCUITS

An integrated circuit includes a first power unit, a second power unit, and a selection switch. The first power unit generates a first output voltage and is coupled to a first load pin. The first load pin is coupled to a first load. The second power unit generates a second output voltage and is coupled to a second load pin. The second load pin is coupled to a second load. The selection switch outputs either the first output voltage or the second output voltage to a voltage pin according to a selection signal. 1. An integrated circuit , comprising:a first power unit, generating a first output voltage and coupled to a first load pin, wherein the first load pin is coupled to a first load;a second power unit, generating a second output voltage and coupled to a second load pin, wherein the second load pin is coupled to a second load; anda selection switch, outputting either the first output voltage or the second output voltage to a voltage pin according to a selection signal.2. The integrated circuit of claim 1 , wherein the selection switch is a multiplexer.3. The integrated circuit of claim 1 , wherein each of the first load and the second load is a resistor or an electronic load.4. The integrated circuit of claim 1 , wherein the selection switch further serially outputs the first output voltage and the second voltage to the voltage pin.5. An integrated-circuit testing device claim 1 , comprising: a first power unit, generating a first output voltage and coupled to a first load pin;', 'a second power unit, generating a second output voltage and coupled to a second load pin; and', 'a selection switch, outputting either the first output voltage or the second output voltage to the voltage pin according to a selection signal;, 'an integrated circuit, comprising an integrated-circuit slot, wherein the integrated circuit is detachably placed in the integrated-circuit slot;', 'a first load probe, coupled to the first load pin and coupled to a first load; and', 'a second load ...

Contactor Arrangement, IC Test Handler and IC Test Arrangement

Contactor arrangement of an IC test handler, comprising: a contactor unit which has test contacts for contacting an IC in test and for temporarily pressing the IC against the test contacts, a plunger head, which has a recessed central region corresponding to the geometrical configuration of the IC, such that those surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, and a contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit. 1. Contactor arrangement of an IC test handler , comprising:a contactor unit which has test contacts for contacting an IC or a group of ICs in test and for temporarily pressing the IC against the test contacts, a plunger head,which has a recessed central region corresponding to the geometrical configuration of the IC, such that that surface of the IC which is adjacent to the upper surface of the plunger head does not touch the plunger head surface, anda contactor unit interface, which includes a vacuum suction system for actively attracting the IC to an IC contact surface of the contactor unit interface, that corresponds with an adjacent surface of the IC having IC device contacts and, thus, towards the test contacts of the contactor unit.2. Contactor arrangement of claim 1 , wherein the vacuum suction system comprises at least one vacuum channel one end of which has a connecting port to be connected to a vacuum generator and which has at least one opening in in the IC contact surface of the contactor unit interface.3. Contactor arrangement of claim 2 , wherein the vacuum suction system comprises a plurality of openings in the IC contact surface claim 2 , in particular claim 2 , in a matrix-like arrangement.4. Contactor arrangement of claim 1 , ...

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. 125-. (canceled)26. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side site.27. The apparatus of claim 26 , wherein the nanospikes are made of a material selected from a group consisting of tantalum nitride claim 26 , tungsten carbide claim 26 , hafnium carbide claim 26 , titanium carbide claim 26 , titanium diboride claim 26 , molybdenum carbide claim 26 , rhenium diboride claim 26 , and a combination thereof.28. The apparatus of claim 26 , wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 26 , triangular claim 26 , convex claim 26 , and a combination thereof.29. The apparatus of claim 26 , wherein a shape of the nanospikes is selected from a group consisting of a star claim 26 , a blade claim 26 , a cross claim 26 , a spike claim 26 , and a combination thereof.30. The apparatus of claim 26 , wherein the nanospikes comprise a cover material.31. The apparatus of claim 26 , wherein the nanospikes are approximately 0 ...

Probe Card Support Apparatus for Automatic Test Equipment

Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other. 1. A test head comprising:a probe card support apparatus;wherein the probe card support apparatus is configured to be positioned over a device under test (DUT) area of a probe card and provide stiffening support and planarization to the DUT area of the probe card; andwherein the test head is configured to be used with an automated test unit to test electronic components.2. The test head of comprising a probe card locking frame claim 1 , wherein the probe card support apparatus is positioned in a center area of the probe card locking frame.3. The test head of wherein the probe card support apparatus is configured to be connected to the probe card over the DUT area.4. The test head of wherein the probe card support apparatus comprises a fastener configured to be positioned over the DUT area of the probe card and connect the probe card support apparatus to the probe card.5. The test head of wherein the probe card support apparatus comprises a planar surface configured to contact an opposing planar surface on the probe card and planarize the test head relative to the probe card.6. The test head of wherein the test head comprises a fastener configured to connect the test head to a wafer prober.7. The test head of wherein the test head includes a planar surface configured to contact an opposing planar surface on the wafer prober to planarize the test head relative to ...

MODULAR WIRELESS COMMUNICATION DEVICE TESTING SYSTEM

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device. 1. A test module for testing mobile devices , the test module comprising:a frame;a test bed coupled to the frame;a device platform coupled to the test bed and configured to hold a Device Under Test (DUT); a first belt and a second belt;', 'a first set of pulleys and a second set of pulleys; and', 'a first motor and a second motor,', 'wherein the first belt is engaged with the first set of pulleys and the first motor, and', 'wherein the second belt is engaged with the second set of pulleys and the second motor;, 'a motion system coupled to the frame and configured to move a carriage assembly horizontally along an X axis and a Y axis, the motion system comprisingan actuator arm coupled to the carriage assembly;an actuator arm mount coupled to the actuator arm, the actuator arm mount configured to move vertically along a Z axis and engage the DUT, the actuator arm mount comprising a tip configured to engage a screen of the DUT and one or more User Interface (UI) elements of the DUT; anda controller configured to control the motion system and the actuator arm to perform various tests with respect to the DUT.2. The test module of claim 1 , wherein the actuator arm mount comprises a shaft and a coil spring coupled to the tip.3. The test module of claim 1 , wherein the tip comprises a capacitive tip.4. The test module of claim 1 , further comprising:a sliding drawer movably coupled to the frame below the test bed, the sliding drawer being configured to slide at least partially out from below the test bed,wherein the controller is mounted on ...

PROBE HEAD AND CONDUCTIVE PROBE THEREOF

A probe head and a conductive probe thereof are provided. The conductive probe includes a first long lateral surface and an opposite second long lateral surface. The first long lateral surface and the second long lateral surface define a central axis there-between. The conductive probe includes a middle segment, an upper connecting segment and a lower connecting segment respectively extending from the middle segment in two opposite directions, and an upper contacting segment and a lower contacting segment respectively extending from the upper and the lower connecting segments in two opposite directions. The upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis. The upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis, and the extension and the protrusion are spaced apart from each other. 1. A probe head for an integrated circuit (IC) test , comprising:an upper die unit and a lower die unit that is spaced apart from the upper die unit; and a middle segment arranged between the upper die unit and the lower die unit;', 'an upper connecting segment and a lower connecting segment which respectively extend from two opposite ends of the middle segment in two opposite directions parallel to the central axis, wherein the upper connecting segment is arranged in the upper die unit, and the lower connecting segment is arranged in the lower die unit, and wherein the upper connecting segment includes an extension extending from the first long lateral surface in a direction away from the central axis;', 'an upper contacting segment extending from the upper connecting segment in a direction away from the middle segment along the central axis to protrude from the upper die unit, wherein the upper contacting segment includes a protrusion extending from the first long lateral surface in a direction away from the central axis ...

CHEVRON INTERCONNECT FOR VERY FINE PITCH PROBING

An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear. 1. An apparatus comprising:a substrate having a plane; andan array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip,wherein the one or more conductive probes comprise at least three points that are non-collinear.2. The apparatus of claim 1 , wherein the at least one conductive probe comprises a first segment that extends from the substrate at a first angle with respect to the plane of the substrate claim 1 , the first segment having a first end affixed to the substrate and a second end distal to the first end claim 1 , and a second segment that extends from the second end of the first segment at a second angle that is rotated azimuthally 180 degrees from the first angle.3. The apparatus of claim 2 , wherein the at least one conductive probe has a chevron shape.4. The apparatus of claim 2 , wherein the at least one conductive probe comprises a third segment having a first end affixed to the second end of the third segment and extending therefrom at a third angle that is rotated azimuthally from the second angle claim 2 , terminating at a second end.5. The apparatus of claim 3 , wherein the at least one conductive probe comprises a fourth segment having a first end affixed to the second end of the third segment and extending therefrom to a second end at a fourth angle that is rotated azimuthally from the third angle claim 3 , terminating at a second end.6. The apparatus of claim 4 , wherein all of the segments are coplanar.7. The apparatus of wherein two or more ...

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT TESTING WITH CONICAL BIAS PAD AND CONDUCTIVE TEST PIN RINGS

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. an anti-intrusion layer proximate said upper probe guide plate, said layer having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, or receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said anti-intrusion later, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a stop where said cross member engages said upper plate;f. said proximal ends of said test probes being group into a plurality of subgroups, each of the ends in said subgroup having the same height as measured from the lower probe ...

Probe unit

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

INSPECTION APPARATUS AND CONTROL METHOD FOR INSPECTION APPARATUS

An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator. 1. An inspection apparatus comprising:a stage on which a substrate having an inspection target is placed;a probe card having probes that supply a current to the inspection target;a light irradiator to irradiate light to heat the substrate; and uniformly heat the inspection target by the light from the light irradiator, and', 'heat an outer peripheral portion of the inspection target by the light from the light irradiator., 'a controller to control the light irradiator configured to2. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on heat generation of the inspection target.3. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on an internal variables for controlling the light irradiator.4. The inspection apparatus of claim 1 , further comprising:a tester connected to the probe card to inspect the inspection target,wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on a signal from the tester that indicates start of the inspection of the inspection target.5. The inspection apparatus of claim 1 , further comprising:a tester connected to the ...

ELECTRIC CONNECTING APPARATUS

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

ELECTRONIC COMPONENT HANDLING APPARATUS AND ELECTRONIC COMPONENT TESTING APPARATUS

An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: transfer units that each include a DUT transfer part that mounts the DUT on a first tray and removes the DUT from the first tray; contact units that each press the DUT mounted on the first tray against a socket disposed on a test head connected to a tester; and a tray transporter that transports the first tray between the contact units and the transfer units. Either or both of (i) at least one of the contact units and (ii) at least one of the transfer units are removably disposed on the electronic component handling apparatus. 1. An electronic component handling apparatus that handles a device under test (DUT) , the electronic component handling apparatus comprising:transfer units that each comprise a DUT transfer part that mounts the DUT on a first tray and that removes the DUT from the first tray;contact units that each press the DUT mounted on the first tray against a socket disposed on a test head connected to a tester; anda tray transporter that transports the first tray between the contact units and the transfer units, whereineither or both of (i) at least one of the contact units and (ii) at least one of the transfer units are removably disposed on the electronic component handling apparatus.2. The electronic component handling apparatus according to claim 1 , wherein the DUT transfer part is disposed above the tray transporter.3. The electronic component handling apparatus according to claim 1 , wherein the contact units are arranged along a first direction parallel to a horizontal direction of the electronic component handling apparatus claim 1 ,the transfer units are arranged along the first direction, andthe tray transporter transports the first tray along the first direction.4. The electronic component handling apparatus according to claim 1 , whereinthe DUT transfer part comprises a first tray moving device that delivers ...

Probe card

A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.

TESTING PROBE, TESTING DEVICE AND TESTING METHOD

The present disclosure provides in some embodiments a testing probe, including a probe holder, and a probe body at least partially extending into an interior of the probe holder and capable of moving relative to the probe holder. The probe body is configured to be electrically connected to the probe holder within a first travel distance relative to the probe holder so as to output a testing signal, and configured to be electrically disconnected from the probe holder within a second travel distance relative to the probe holder. 1. A testing probe , comprising a probe holder , and a probe body at least partially extending into an interior of the probe holder and capable of moving relative to the probe holder , wherein the probe body is configured to be electrically connected to the probe holder within a first travel distance relative to the probe holder so as to output a testing signal , and configured to be electrically disconnected from the probe holder within a second travel distance relative to the probe holder.2. The testing probe according to claim 1 , wherein the probe holder comprises a channel configured to receive the probe body and provided at one end with an opening; andthe probe body comprises a first signal transmission member arranged within the channel of the probe holder, a second signal transmission member arranged on an end of the first signal transmission member adjacent to the opening and extending beyond the probe holder through the opening, and a probe head arranged on an end of the second signal transmission member away from the first signal transmission member.3. The testing probe according to claim 2 , wherein the first signal transmission member is insulated from the probe holder; andthe second signal transmission member is configured to be electrically connected to a portion of an inner wall of the channel at the opening within the first travel distance and insulated from the portion of the inner wall of the channel at the opening within ...

METHOD FOR PRODUCING PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. 1. A method , comprising:inserting a probe body made electrically conductive materials in an opening of a support such that an end of the probe body is exposed from said opening;polishing the exposed end of the probe body;depositing an electrically conductive contact region having a first hardness value equal to or greater than 300 HV to the polished exposed end of the probe body.2. The method of claim 1 , wherein depositing comprises forming a conductive layer directly on said polished exposed end of the probe body.3. The method of claim 2 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 2 , manganese claim 2 , palladium claim 2 , cobalt claim 2 , rhodium claim 2 , iron claim 2 , molybdenum claim 2 , iridium claim 2 , ruthenium claim 2 , tungsten claim 2 , rhenium and alloys thereof.4. The method of claim 1 , wherein depositing comprises:forming at least one support conductive layer directly on said polished exposed end of the probe body; andforming a conductive layer directly on said at least one support conductive layer.5. The method of claim 4 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 4 , manganese claim 4 , palladium claim 4 , cobalt claim 4 , rhodium claim 4 , iron claim 4 , molybdenum claim 4 , iridium claim ...

COMPACT TESTER

A compact tester including a housing having a base plate and a roof plate being parallel and defining a space therebetween. The compact tester includes one or more device-under-test press units having an actuator and a contact head movable by the actuator. The compact tester includes a reinforcement arrangement having a roof reinforcement sub-arrangement coupled to the roof plate and an upright reinforcement sub-arrangement coupled to the base plate. The upright reinforcement sub-arrangement includes a pair of reinforcing side walls extending upright from the base plate. The roof reinforcement sub-arrangement includes a reinforcing structure having a reinforcing panel portion attached flat against the roof plate and an elongated reinforcing rib portion protruding from the reinforcing panel portion and away from the roof plate. The roof reinforcement sub-arrangement is supported by the upright reinforcement sub-arrangement with the elongated reinforcing rib portion extending between the pair of reinforcing side walls. 1. A compact tester comprising:a housing having a base plate and a roof plate defining a space therebetween, wherein the base plate and the roof plate are parallel to each other; an actuator, and', 'a contact head coupled to the actuator, the contact head being movable by the actuator along an actuation axis parallel to a direction perpendicularly extending between the base plate and the roof plate; and, 'one or more device-under-test (DUT) press units disposed in the space and coupled to the roof plate, each DUT press unit having a roof reinforcement sub-arrangement coupled to the roof plate, and', 'an upright reinforcement sub-arrangement extending from the base plate, the roof reinforcement sub-arrangement and the upright reinforcement sub-arrangement being interconnected to form the reinforcement arrangement,', 'wherein the upright reinforcement sub-arrangement comprises a pair of reinforcing side walls, each extending upright from the base plate,', ...

Test Fixture with Sintered Connections Between Mother Board and Daughter Board

A test fixture includes a mother board that has test signal lines configured to couple to a test station. The mother board includes a recessed region with contact pads coupled to the test signal lines. A daughter board is engaged with the recessed region such that a top surface of the daughter board is approximately coplanar with a top surface of the mother board. The daughter board includes test signal lines coupled to contact pads on the daughter board. The contact pads on the daughter board align with the contact pads on the mother board and are permanently coupled by sintered bonds.

Modular rail systems, rail systems, mechanisms, and equipment for devices under test

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

PROBE SOCKET

A probe socket for inspecting electric characteristics of an object to be tested. The probe socket includes a plurality of power pins for applying power to the object to be tested, a plurality of ground pins arranged in parallel with the power pins, a support block for accommodating and supporting the plurality of power pins or ground pins in parallel, and a conductive plate arranged inside the support block in a direction transverse to lengthwise directions of the power pin and the ground pin and having at least one of a power connection pattern for electrically connecting the plurality of power pins in common and a ground connection pattern for electrically connecting the plurality of ground pins in common. 1. A probe socket for inspecting electric characteristics of an object to be tested , the probe socket comprising:a plurality of power pins configured to be in contact with power terminals of the object to be tested;a support block configured to accommodate and support the plurality of power pins in parallel; anda conductive plate arranged inside the support block in a direction transverse to a lengthwise direction of the power pin and having a power connection pattern to electrically connect the plurality of power pins in common.2. The probe socket according to claim 1 , further comprising a plurality of ground pins configured to be in contact with ground terminals of the object to be tested claim 1 , and supported in the support block claim 1 ,wherein the conductive plate is arranged inside the support block in a direction transverse to a lengthwise direction of the ground pin and having a ground connection pattern to electrically connect the plurality of ground pins in common.3. The probe socket according to claim 2 , wherein the power connection pattern or the ground connection pattern is arranged on an insulation sheet.4. The probe socket according to claim 2 , wherein the conductive plate comprises a first conductive plate having the power connection ...

Apparatus for testing semiconductor packages

A semiconductor integrated circuit test system can include a first semiconductor integrated circuit tester configured to conduct a first test of a first characteristic of one of a plurality of semiconductor integrated circuits, wherein the first test is completed by the first semiconductor integrated circuit tester within a first test time. A second semiconductor integrated circuit tester, can be coupled to the first semiconductor integrated circuit tester, where the second semiconductor integrated circuit tester can be configured to conduct a second test of a second characteristic of each of the plurality of the semiconductor integrated circuits simultaneously, wherein the second test is completed within a second test time that is at least about two orders of magnitude more than the first test time.

Circuit assembly for the state monitoring and logging of overvoltage protection devices or overvoltage protection systems

The invention relates to a circuit assembly for the state monitoring and logging of overvoltage protection devices or overvoltage protection systems by means of pulse current monitoring, comprising at least one passive RFID transponder having an inductively coupled voltage supply, wherein in the case of an event of the overvoltage protection device or the overvoltage protection system, the RFID transponder antenna circuit is influenced, in particular interrupted, short circuited, or detuned, so that disturbance processes can be identified. According to the invention, a coil L 2 is provided on a discharge line of the overvoltage protection device or the overvoltage protection system that carries pulse currents that occur, which coil L 2 is oriented in such a way that the field caused by pulse current passes through the coil winding surface, wherein the coil L 2 is connected to at least one switching device, which is connected on the antenna circuit of the RFID transponder to the inductor L 1 there in order to influence the antenna circuit at least at times.

Multipath Electrical Probe And Probe Assemblies With Signal Paths Through Secondary Paths Between Electrically Conductive Guide Plates

A multiple conduction path probe can provide an electrically conductive signal path from a first contact end to a second contact end. The probe can also include an electrically conductive secondary path and an electrically insulated gap between the signal path and the secondary path. The gap can be relatively small and thus provide the probe with a low loop inductance. A probe assembly can comprise multiple such probes disposed in passages in substantially parallel electrically conductive guide plates. The signal path of each of the probes can be electrically insulated from both guide plates, but the secondary path of each probe can be electrically connected to one or both of the guide plates. In some configurations, the probe assembly can include one or more secondary probes disposed in passages of the conductive guide plates and electrically connected to one or both of the guide plates. In some configurations, a probe assembly can comprise probes that are substantially the same shape and/or configuration all of which are disposed in passages through substantially parallel guide plates. Some of the probes can be electrically insulated from the guide plates and thus provide signal paths, and others of the probes can be electrically connected to the guide plates and thus provide secondary paths. Any of the foregoing types of probe assemblies can be part of a test contactor such as a probe card assembly, a load board, or the like. 1. A multipath probe comprising:an electrically conductive first contact end;an electrically conductive second contact end;an electrically conductive signal path between said first contact end and said second contact end;an electrically conductive secondary path electrically insulated from said signal path; anda gap of less than fifty microns between said signal path and said secondary path.2. The probe of claim 1 , wherein said secondary path comprises:an electrically conductive first secondary contact disposed adjacent to but electrically ...

Probe module supporting loopback test

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.

SIGNAL PATH SWITCH AND PROBE CARD HAVING THE SIGNAL PATH SWITCH

A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively. 1. A signal path switch , which is provided between a tester and two probes , comprising:two first electrical lines electrically connected to the probes respectively;two second first electrical lines electrically connected to the first electrical lines respectively;two inductive elements, each of which is electrically connected each of the first electrical lines and the tester respectively; anda capacitor having opposite ends electrically connected to the second first electrical lines respectively.2. The signal path switch of claim 1 , further comprising a substrate claim 1 , wherein the substrate is provided with the first electrical lines claim 1 , the second electrical lines claim 1 , the inductive elements claim 1 , and the capacity.3. The signal path switch of claim 2 , wherein the substrate has a first board and a second board; the first board is provided with the first electrical lines claim 2 , the second electrical lines claim 2 , and the capacity claim 2 , and the second board is provided with the inductive elements; the first board is connected to the second board.4. The signal path switch of claim 2 , wherein the inductive elements are embedded in the substrate.5. The signal path switch of claim 2 , wherein the capacitor is embedded in the substrate.6. The signal path switch of claim 2 , wherein the inductive elements are fixed to a surface of the substrate by welding.7. The signal path switch of ...

Hybrid automated testing equipment for testing of optical-electrical devices

A hybrid optical-electrical automated testing equipment (ATE) system can implement an optical test assembly that includes an electrical interface and an optical interface with an optical-electrical device under test. The optical assembly can include a socket on which the device is placed by the ATE system to connect electrical and optical connections. The optical connections can couple light through the socket and the optical assembly to one or more testing devices to perform efficient testing of optical devices, such as high-speed optical transceivers.

Connecting device for inspection

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

Contact pin and socket

Provided is a contact pin comprising: a hollow first plunger that includes a first contact portion provided on one end side in a first direction and a first enlarged portion which is enlarged in a second direction intersecting the first direction; a second plunger, the one end of which is inserted into the first plunger and that includes a second contact portion provided on the other end side in the first direction and a second enlarged portion provided in a protruding portion protruding from the first plunger so as to be enlarged in the second direction; and a spring provided between the first and second plungers so as to surround the first and second plungers, wherein the first enlarged portion forms a curve shape to bulge outward.

INSPECTION JIG AND INSPECTION APPARATUS

Provided are an inspection jig and an inspection apparatus in which a configuration for bending a plurality of contacts in the same direction can be simplified. The inspection jig includes a plurality of contacts each of which has a rod shape, a first support portion that supports the first end portion side of the plurality of contacts, and a second support portion that supports the second end portion side of the plurality of contacts. The first support portion includes a facing support plate that is disposed to face the second support portion in a manner separated from the second support portion and has a plurality of through holes through which the plurality of contacts are inserted, and a cross section of each of the through holes has an elliptical shape whose major axis extends in a predetermined specific direction along a plane direction of the facing support plate. 1. An inspection jig comprising:a plurality of contacts each of which has a rod shape;a first support portion that supports a first end portion side of the plurality of contacts; anda second support portion that supports a second end portion side of the plurality of contacts, whereinthe first support portion includes a facing support plate that is disposed to face the second support portion in a manner separated from the second support portion and has a plurality of through holes through which the plurality of contacts are inserted, anda cross section of each of the through holes has an elliptical shape whose major axis extends in a predetermined specific direction along a plane direction of the facing support plate.2. The inspection jig according to claim 1 , whereinthe plurality of contacts have a cylindrical shape, anda radius of curvature of both end portions of the cross section in the specific direction is smaller than a radius of each of the contacts.3. An inspection jig comprising:a plurality of rod-like contacts;a first support portion that supports a first end portion side of the plurality ...

METHOD AND APPARATUS FOR JUDGING ABNORMALITY OF PROBE CARD

A method for judging abnormality of a probe card includes: a unit failure rate of chips at the same test position in each measurement unit is obtained, and whether the unit failure rate of the chips at the same test position respectively meets the first abnormality condition is judged; when the unit failure rate of the chips at the same test position of each measurement unit meets a first abnormality condition, whether a test sequence for the measurement units meeting the first abnormality condition meets a second abnormality condition is judged; and when the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, it is determined that the probe card is abnormal. 1. A method for judging abnormality of a probe card , comprising:selecting measurement units, and obtaining a unit failure rate of chips at a same test position in each measurement unit respectively;judging whether the unit failure rate of the chips at the same test position of each measurement unit respectively meets a first abnormality condition;when the unit failure rate of the chips at the same test position of any one measurement unit meets the first abnormality condition, judging whether a test sequence for measurement units meeting the first abnormality condition meets a second abnormality condition; andwhen the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, determining that the probe card is abnormal.2. The method for judging the abnormality of the probe card of claim 1 , wherein said selecting the measurement units and obtaining the unit failure rate of the chips at the same test position in each measurement unit respectively comprises:selecting the measurement units and detecting failed chips in each measurement unit respectively;obtaining a number of the failed chips at the same test position in each measurement unit; andcalculating the unit failure rate of the ...

DEVICE FOR TESTING COMPONENTS UNDER ELEVATED GAS PRESSURE

Disclosed is a device for testing components under elevated pressure in which a pressure chamber is provided. The lateral boundary of the pressure chamber included a ring and an annular part, which may move perpendicularly to the plane of the component to be tested. A velvet-like lining is provided on the end face of the annular part or of the ring that faces the component to be tested. The fibers of the lining protrude from the annular part or from the ring toward the component to be tested and bridge the gap between the device and the component. 1176326912762276. Device () for testing electrical/electronic components () under elevated gas pressure with a pressure chamber () , which is provided with test needles () on a needle card () , wherein a lateral boundary of the pressure chamber () , which has at least one ring () , is provided , and wherein there is a gap () between the component () that is to be tested and the lateral boundary of the pressure chamber () , wherein fibers () are provided on the end face facing the component () that is to be tested , where this is the end face of the lateral boundary of the pressure chamber ().222. The device according to claim 1 , wherein the fibers () are oriented essentially perpendicular to the plane of the end face of the lateral boundary of the pressure chamber.32220. The device according to claim 1 , wherein the fibers () are components of a velvet-like lining ().4226. The device according to claim 1 , wherein the fibers () are arranged to prevent the flow of gas from the pressure chamber ().522. The device according to claim 1 , wherein the fibers () have a length of between 300 and 500 micrometers.62267. The device according to claim 1 , wherein the free ends of the fibers () claim 1 , lying separate from the lateral boundary of the pressure chamber () claim 1 , adjoin the component () that is to be tested.71096. The device according to claim 1 , wherein an annular part () is provided on the ring () on a side of the ...

Inspection method and inspection system

An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.

Optical interconnections for hybrid testing using automated testing equipment

A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

Probe head for a testing apparatus of electronic devices with enhanced filtering properties

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

COAXIAL STRUCTURE FOR TRANSMISSION OF SIGNALS IN TEST EQUIPMENT

An example system includes a circuit board having electrical elements; a wafer having contacts; and an interconnect to route signals between the electrical elements and the contacts. The interconnect includes multiple layers, each of which includes a flexible circuit. The flexible circuit includes a conductive trace disposed thereon. The interconnect also includes shielding between adjacent layers of the multiple layers. The shielding is electrically connected to ground. 1. A system comprising:a circuit board comprising electrical elements;a wafer comprising contacts; andan interconnect to route signals between the electrical elements and the contacts, the interconnect comprising multiple layers, each of the multiple layers comprising a flexible circuit, the flexible circuit comprising a conductive trace disposed thereon, the interconnect further comprising shielding between adjacent layers of the multiple layers, the shielding being electrically connected to ground.2. The system of claim 1 , wherein the flexible circuit comprises a dielectric claim 1 , an end of the conductive trace extending beyond the dielectric; andwherein the interconnect comprises a second dielectric, the end of the conductive trace bending around the second dielectric, the end of the conductive trace comprising an electrical contact.3. The system of claim 1 , wherein the shielding for each conductive trace comprises a conductive layer above the conductive trace and a conductive layer below the conductive trace claim 1 , each of the conductive layer above the conductive trace and the conductive layer below the conductive trace having a cut-away portion claim 1 , each of the conductive layer above the conductive trace and the conductive layer below the conductive trace being arranged so that at least part of the conductive trace is between cut-away portions of different conductive layers.4. The system of claim 1 , wherein the shielding comprises:multiple layers of shielding arranged within the ...

Prober

Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo frame attached to a head stage. A wafer chuck is moved toward a probe card while being fixed to a Z-axis movement-rotation unit in a detachable manner, and the wafer chuck is drawn toward the probe card by reducing pressure in an air-tight space formed between the wafer chuck and the probe card using a pressure reducing unit. Then, an electrical inspection of a wafer is performed while the test head, the pogo frame, the probe card, and the wafer chuck are integrated with respect to the head stage.

APPARATUS FOR CLAMPING A PROBE CARD AND PROBE CARD INCLUDING THE SAME

An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased. 1. An apparatus configured to clamp a probe card , the apparatus comprising:a body portion between a printed circuit board (PCB) of the probe card and a test head;an inner clamping portion integrally formed with an upper surface of the body portion and configured to affix a central portion of the PCB to the test head; anda plurality of outer clamping portions integrally formed with a side surface of the body portion to affix a portion of the PCB to the test head, the plurality of outer clamping portions configured to surround the central portion of the PCB.2. The apparatus of claim 1 , wherein the inner clamping portion includes a protrusion configured to protrude from the side surface of the body portion claim 1 , the protrusion having a slant lower surface.3. The apparatus of claim 2 , wherein the inner clamping portion has a gradually decreasing thickness in a radius direction of the body portion.4. The apparatus of claim 1 , wherein the plurality of outer clamping portions are configured to radially extend from a center point of the body portion.5. The apparatus of claim 1 , wherein at least two of the plurality of outer clamping portions are spaced apart from each other by a substantially similar angle.6. The apparatus of claim 1 , ...

FAULT ISOLATION SYSTEM AND METHOD FOR DETECTING FAULTS IN A CIRCUIT

The present invention provides a method and a fault isolation system for detecting errors in an integrated circuit. One feature of the present invention is using a movable second probe to scan and acquire an output signal through the vias or metal line structure of a diagnostic area along a detecting line, so as to find the fault location precisely, and another feature of the present invention is using a cutter in conjunction with the above method to narrow down the fault range. The cutter is used to electrically isolate the portion of diagnostic area step by step for approaching the fault location. This method can help to save a lot of analysis time and also makes the minor fault localization possible. 1. A method for detecting faults in a circuit , comprising:touching with a first probe one terminal of a detecting line having a fault portion to provide an input signal to a diagnostic area through the detecting line, and touching another terminal of the detecting line with a second probe to receiving an output signal;removing a segment of the detecting line to define a remaining detecting line;moving the second probe to touch a terminal of the remaining detecting line to obtain a new output signal comprising a normal signal which is within a predetermined range set by a user if the fault portion is not within the remaining detecting line, and the new output signal is an abnormal signal which is out of the predetermined range set by the user if the fault portion is within the remaining detecting line.2. The method of claim 1 , wherein removing the segment of the detecting line comprises removing less than one-tenth of a length of the detecting line.3. The method of claim 1 , wherein removing the segment of the detecting line comprises electrically isolating the segment from the remaining detecting line without completely removing the segment from a substrate bearing the detecting line.4. The method of claim 1 , further comprising:repeating the removing a segment of ...

TEST SOCKET ASSEMBLY

A test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit. The test socket assembly includes: a plurality of signal probes; a socket block including a bottom surface facing toward the testing circuit, a top surface facing toward the test object, a plurality of probe holes for accommodating the plurality of signal probes to be parallel with one another while opposite ends of the signal probes are exposed from the top surface and the bottom surface, and a recessed portion recessed from at least partial area of the top surface and the bottom surface excluding a circumferential area of the probe holes; and an elastic grounding member accommodated in the recessed portion and made of a conductive elastic material to come into contact with at least one of the test object and the testing circuit. 1. A test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit , the test socket assembly comprising:a plurality of signal probes;a socket block comprising a bottom surface facing toward the testing circuit, a top surface facing toward the test object, a plurality of probe holes for accommodating the plurality of signal probes to be parallel with one another while opposite ends of the signal probes are exposed from the top surface and the bottom surface, and a recessed portion recessed from at least partial area of the top surface and the bottom surface excluding a circumferential area of the probe holes; andan elastic grounding member accommodated in the recessed portion and made of a conductive elastic material to come into contact with at least one of the test object and the testing circuit.2. The test socket assembly according to claim 1 , wherein the socket block comprises an isolation column surrounding an upper end area of the probe and protruding from a lower surface of the recessed portion.3. ...

Dual-Directional Electro-Optic Probe

A probe includes a main electro-optical modulator (), first () and second () optical couplers each having a respective input (), through () and isolated () port, and reference () and test () optical detectors. Reference light and test light, respectively, are received at the inputs () of the optical couplers (). Main electro-optical modulator includes an RF through-line () between input () and output () RF connectors, and a modulator optical path () alongside the RF through-line. The first and second optical couplers couple the reference and test light to opposite ends of the modulator optical path. The reference and test optical detectors are coupled to the second and first isolated ports (), respectively, to generate reference and test IF signals respectively representing forward and reverse RF signal propagation along the RF through-line. The received reference and test light is modulated at an LO frequency, or an auxiliary electro-optical modulator () is provided to modulate unmodulated received light. 1. A dual-directional electro-optic probe , comprising:a main electro-optical modulator, comprising an input radio-frequency (RF) connector, an output RF connector, an RF through-line connected between the input RF connector and the output RF connector, and a modulator optical path extending alongside the RF through-line between a first end and a second end;a first optical coupler comprising an input port optically coupled to receive the modulated reference light, a through port optically coupled to the first end of the modulator optical path, and a first isolated port;a second optical coupler comprising an input port, a through port optically coupled to the second end of the modulator optical path, and a second isolated port, the input port optically coupled to receive modulated test light, the modulated test light and the modulated reference light modulated at a local oscillator frequency;a reference optical detector optically coupled to the second isolated port ...

PROBE CARD HAVING CONFIGURABLE STRUCTURE FOR EXCHANGING OR SWAPPING ELECTRONIC COMPONENTS FOR IMPEDANCE MATCHING

A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate. 1. A probe card having a configurable structure for exchanging electronic components for impedance matching comprising:a supporting unit, the supporting unit having a surface, the surface defining at least one mounting area, and at least one conductive contact pad being disposed in the mounting area;at least one electronic component, the electronic component being disposed in the mounting area and having a conductive end on the bottom, and the conductive end being electrically connected with the conductive contact pad; anda pressing device, the pressing device exerting an applied force so as to make the conductive end of the electronic component tightly contacted with the conductive contact pad of the supporting unit;wherein the placement seat is disposed on the supporting unit and has at least one hollowing portion that is corresponding to the mounting area, the pressing device has a pressing plate which is joined with the placement seat, the pressing plate is configured to be moved between a pressing position and a non-pressing position in reference with respect to the placement seat, the pressing ...