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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 1345. Отображено 200.
06-08-2015 дата публикации

Gehäuse eines integrierten Schaltkreises und Verfahren zum Bilden desselben

Номер: DE102014019634A1
Принадлежит:

Eine Ausführungsform einer Gehäuse-auf-Gehäuse(PoP)-Vorrichtung umfasst eine Gehäusestruktur, einen Gehäuseträger und eine Vielzahl von Anschlüssen, die die Gehäusestruktur mit dem Gehäuseträger verbinden. Die Gehäusestruktur umfasst einen Logikchip, der mit einem Speicherchip verbunden ist, eine Formmasse, die den Speicherchip umschließt und eine Vielzahl leitfähiger Stifte, die sich durch die Formmasse hindurch erstrecken. Die Vielzahl der leitfähigen Stifte ist an Kontaktpolstern auf dem Logikchip befestigt.

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18-03-2010 дата публикации

SEKUNDÄRBATTERIE MIT KONSTANTSPANNUNG

Номер: DE602005019188D1
Принадлежит: LG CHEMICAL LTD, LG CHEMICAL LTD.

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02-10-2008 дата публикации

Magnetischer Direktzugriffspeicher mit hoher Selektivität

Номер: DE602004010316T2

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23-11-2006 дата публикации

Steuerverfahren für einen Mikrowellenofen

Номер: DE0010138934B4

Verfahren zum Steuern eines Mikrowellenofens, wobei der Mikrowellenofen aufweist: ein Gleichrichter- und Glättungsteil (3) zum Erzeugen einer Gleichspannung aus einer von einem Stromversorgungsteil (1) zugeführten Wechselspannung, einem Wechselrichterteil (5) zum Erzeugen einer Wechselspannung aus der vom Gleichrichter- und Glättungsteil (3) zugeführten Gleichspannung, einem Hochspannungstransformator (7) zum Erzeugen einer Hochspannung aus der vom Wechselrichterteil (5) zugeführten Wechselspannung, und einem Magnetron (9) zum Erzeugen von Mikrowellenstrahlung aus der vom Hochspannungstransformator (7) zugeführten Hochspannung; und wobei das Verfahren die Schritte aufweist: Feststellen (S25), ob der Strom der vom Gleichrichter- und Glättungsteil (3) dem Wechselrichter (5) zugeführten Gleichspannung über einem vorbestimmten Stromwert liegt; wenn festgestellt wird, dass der Strom oberhalb des vorbestimmten Stromwerts liegt, Unterbrechen (S27-S31) der Stromzufuhr zum Magnetron (9) für eine ...

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29-12-2017 дата публикации

A TORQUE TRANSMISSION DEVICE, IN PARTICULAR FOR MOTOR VEHICLE

Номер: FR0003053092A1
Принадлежит: VALEO EMBRAYAGES

L'invention concerne un dispositif de transmission de couple (1), notamment pour véhicule automobile, comportant un élément d'entrée de couple (7), destiné à être couplé en rotation à un vilebrequin d'un moteur, un élément intermédiaire (19) et un élément de sortie de couple (11), destiné à être couplé en rotation à un arbre d'entrée d'une boîte de vitesses, des premiers moyens d'amortissement étant montés entre l'élément d'entrée de couple (7) et l'élément intermédiaire (19) et des seconds moyens d'amortissement étant montés entre l'élément intermédiaire (19) et l'élément de sortie de couple (11), l'élément d'entrée de couple (7), l'élément de sortie de couple (11) et l'élément intermédiaire (19) étant aptes à pivoter les uns par rapport aux autres autour d'un axe (X), caractérisé en ce que les premiers moyens d'amortissement (20, 21) sont aptes à exercer un effort dirigé circonférentiellement, ou respectivement un effort comprenant une composante radiale, les seconds moyens d'amortissement ...

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22-05-1998 дата публикации

TWO-TRACK VALVE OF THE TYPE HAS DETECTION OF PRESSURE HAS DOUBLE SENS

Номер: FR0002732438B1
Автор: KIM, LEE

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28-01-2005 дата публикации

SYSTEM OF TELECOMMUNICATIONS FOR VEHICLE

Номер: FR0002832284B1
Автор: CHEN, LEE, HUANG
Принадлежит: SIN ETKE TECHNOLOGY CO., LTD.

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18-12-2009 дата публикации

SYSTEM OF AUDIO-VISUAL TRANSMISSION IN A NETWORK VDI

Номер: FR0002923122B1
Автор: LEE HENRI
Принадлежит: CASANOVA

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23-09-2005 дата публикации

PROCESS OF TRANSFER Of INFORMATION ON INSTALLATIONS BY RADIO AND CENTREDE MANAGEMENT

Номер: FR0002832278B1
Автор: CHEN, LEE, HUANG
Принадлежит: SIN ETKE TECHNOLOGY CO., LTD.

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24-06-2005 дата публикации

CIRCUIT AND PROCESS OF VERTICAL ORDER OF DIMENSIONS AND HORIZONTAL DEL' SCREEN Of a MONITOR HAS Cathode tube

Номер: FR0002841677B1
Автор: LEE
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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22-06-2012 дата публикации

OPTICAL DEVICE Of TACTILE AND PROCEEDED ENTRY OF ORDERING OF THIS DEVICE

Номер: FR0002969330A1
Принадлежит: LG DISPLAY CO LTD

L'invention présente un dispositif optique d'entrée tactile qui ajuste par division une sortie optique d'une unité d'émission de lumière (110) avant et pendant une opération de contact pour réduire une consommation d'énergie, et un procédé de commande de celui-ci. Le dispositif optique d'entrée tactile comprend un panneau d'affichage (70), une pluralité d'éléments d'émission de lumière infrarouge (110) disposés sur deux côtés contigus du panneau d'affichage (70), une unité de lentilles (155) disposée sur les deux côtés contigus restants du panneau d'affichage (70) et réfléchissant la lumière émise par les éléments d'émission de lumière infrarouge (110), une unité de réception de lumière (120) disposée sur les deux côtés contigus du panneau d'affichage (70), et une unité de commande tactile (180) comprenant une unité de calcul de coordonnées de contact (130) pour calculer un ensemble de coordonnées d'un point de contact et une unité de commande d'émission de lumière (112) pour diviser les ...

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20-07-2007 дата публикации

LIMP OF JUNCTION FOR VEHICLES AND PROCESS FOR ITS ASSEMBLY

Номер: FR0002866779B1
Автор: LEE, SONG
Принадлежит: TYCO ELECTRONICS AMP KOREA LTD

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12-09-2014 дата публикации

A HEADLAMP WITH A COMBINATION OF HIGH BEAM AND LOW BEAM FOR A BICYCLE

Номер: FR0003003010A3
Автор: LEE WEN-SUNG
Принадлежит:

La présente invention porte sur un phare à combinaison de faisceaux haut et bas pour bicyclette, qui comprend un corps principal (1), une lentille (2), une source de lumière vers le bas (3) et une source de lumière directe (4), le corps principal (1) ayant une première surface (12) et une deuxième surface (13) formées dans celui-ci, la lentille (2) étant en regard de la deuxième surface (13), la source de lumière vers le bas (3) étant assemblée à la première surface (12) et une partie du faisceau lumineux qu'elle émet passe de manière oblique à travers l'espace de réception (11) de façon à former une région d'éclairage de faisceau bas, la source de lumière directe (4) étant assemblée à la deuxième surface (13), le faisceau lumineux de la source de lumière directe (4) passant à travers la lentille (2) de façon à former une région d'éclairage de faisceau haut.

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22-11-2013 дата публикации

ELECTRIC CONNECTOR

Номер: FR0002990804A3
Принадлежит:

Un connecteur électrique comprend une carte de base (200) ayant plusieurs premières pastilles de contact (201) et secondes pastilles de contact (202) exposées sur la carte de base (200), plusieurs premières bornes (210) et secondes bornes (230) ayant chacune une extrémité connectée avec respectivement la première (201) et la seconde (202) pastille de contact correspondante, et un boîtier isolant (240) ayant une fenêtre (241). L'autre extrémité de la première borne (210) est inclinée vers le bas selon un angle puis recourbée vers le haut et l'arrière pour former une partie de contact en forme d'ardillon (211). L'autre extrémité de la seconde borne (230) définit une saillie de contact (231). La carte de base (200) et les premières (210) et secondes (230) bornes sont disposées dans le boîtier isolant (240). Les parties de contact (211) et les saillies de contact (231) sont exposées à l'extérieur à travers la fenêtre (241).

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19-03-1999 дата публикации

COIL Of VACUUM CLEANER

Номер: FR0002722385B1
Принадлежит: DAEWOO ELECTRONICS CO

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05-06-2009 дата публикации

NAVIGATION SYSTEM EXCEPT ROAD

Номер: FR0002854455B1
Принадлежит: SIN ETKE TECHNOLOGY CO., LTD.

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18-04-2008 дата публикации

FLASHLIGHT HAS MULTIPLE SWITCHING FUNCTION.

Номер: FR0002907190A1
Автор: KANG, LEE, ALI
Принадлежит: PELICAN PRODUCTS INC

L'invention concerne une lampe torche (100) comportant une batterie et deux interrupteurs (112, 196) permettant chacun d'activer une source d'émission de lumière de la lampe. Les interrupteurs sont des interrupteurs à trois positions reliés entre eux et présentent une fonction d'activation momentanée. Des contacts placés sur une partie intermédiaire du cylindre sont destinés à établir le contact avec un dispositif chargeur électrique. Un ressort est placé entre le dispositif de commutation situé au-dessus du cylindre et le dessus de la batterie tandis qu'un autre ressort est placé sur la base du cylindre au niveau du dessous de la batterie. Une tête élargie est placée au-dessus du cylindre et il existe une partie intermédiaire entre la partie tête et le cylindre. La partie intermédiaire reçoit une partie du premier interrupteur. Le deuxième interrupteur est placé dans un couvercle arrière (108) de la lampe torche.

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20-06-2008 дата публикации

HEAT EXCHANGER FOR A VEHICLE

Номер: FR0002909939A1
Автор: JUN, SIM, CHO, JEON, LEE, JUNG

L'invention concerne un échangeur de chaleur pour un véhicule. Celui-ci comprend deux réservoirs (40, 50) pour fournir un agent de refroidissement à travers un thermostat pour régler l'ouverture/la fermeture en fonction de la température de l'agent de refroidissement et d'une pompe à eau, et évacuant l'agent refroidi vers un côté moteur; un collecteur (10) couplé avec le réservoir auquel l'agent de refroidissement est fourni; des tubes d'échange de chaleur (20) pour communiquer avec l'organe de chauffage, et agencés en parallèle à une direction du vent de roulement; un collecteur (10) à l'autre côté couplé au réservoir à l'autre côté, qui est fixé à l'autre portion d'extrémité du tube d'échange de chaleur (20) pour communiquer avec celui-ci de manière à évacuer l'agent dans le moteur, et une portion de noyau (60) incluant des ailettes (30) brasées entre les tubes (20) . L'invention est applicable à des échangeurs de chaleur.

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07-02-2014 дата публикации

COMPOUNDS [3.3.3] HEXAAZA PROPELLANE AS KEY INTERMEDIATES FOR NEW MOLECULAR EXPLOSIVES AND METHOD FOR MAKING SAME

Номер: FR0002994182A1
Принадлежит: AGENCY FOR DEFENSE DEVELOPMENT

Il est proposé des composés hexaaza[3.3.3]propellane représentés par la formule (I) suivante, qui peuvent être utilisés comme structure de squelette principale pour de nouveaux explosifs moléculaires et un procédé de préparation de ceux-ci : dans laquelle R est H, un alkyle en C1 à C20, un cycloalkyle, un arylalkyle ou un aryle, qui peut contenir des hétéroatomes tels que l'oxygène, l'azote, le soufre, un halogène, etc. ou des insaturations ; et X est H2, O ou S.

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15-05-2015 дата публикации

SWITCHING METHOD AND CONNECTION LINES FOR A CONNECTOR WITH A PORT COMBO-

Номер: FR0002964521B1
Принадлежит: ARCADYAN TECHNOLOGY CORPORATION

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21-01-2011 дата публикации

DEVICE AND PROCESS OF PILOTING Of a SCREEN Of POSTING HAVE Liquid crystals

Номер: FR0002882850B1
Автор: LEE SEOK WOO, KIM NAM HEE
Принадлежит: LG DISPLAY CO LTD

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23-11-2012 дата публикации

ALGORITHMS AND PROCESSES OF DETECTION OF SPECTRUM.

Номер: FR0002906657B1
Принадлежит: SAMSUNG ELECTRO MECHANICS CO., LTD

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19-09-2014 дата публикации

METHOD HARDNESS

Номер: FR0002979069B1

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13-03-2009 дата публикации

BROADBAND OSCILLATOR VOLTAGE-CONTROLLED.

Номер: FR0002920924A1
Принадлежит: SAMSUNG ELECTRO MECHANICS CO., LTD

Un oscillateur à large bande contrôlé en tension comprend des transistors fournissant un signal d'oscillation stable, une unité inductrice, une batterie de varactors connectée à l'unité inductrice et ayant une capacitance de varactor variant avec le premier signal de commutation et une tension de syntonisation, une batterie de condensateurs de connectée à l'unité inductrice et ayant des capacitances prédéterminées pour un groupement de sections de fréquences, et une batterie de condensateurs à pondération binaire connectée à l'unité.

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30-09-2016 дата публикации

EFFECTIVE COOLING FLOW PATH DESIGN AND SUPPORT CONSTITUTION OF HELICALLY COILED LIQUID METAL-TO-AIR HEAT EXCHANGER WITH AN EXTERNAL AIR COOLING MECHANISM AND RESIDUAL HEAT REMOVAL SYSTEM OF LIQUID METAL COOLED REACTORS HAVING THE SAME

Номер: FR0003034180A1
Принадлежит:

La présente description décrit un échangeur de chaleur métal liquide - air, comprenant un flasque étendu et formé dans une direction verticale, une chambre supérieure prévue au niveau d'une partie supérieure d'une circonférence interne du flasque pour loger et décharger un métal liquide introduit par une branche chaude, une chambre inférieure prévue au niveau d'une partie inférieure d'une circonférence interne du flasque, et raccordée à une branche froide pour décharger un métal liquide, un tube d'entrée d'air configuré pour former une première trajectoire d'écoulement dans une direction ascendante pour inhaler l'air, un tube de sortie d'air configuré pour former une seconde trajectoire d'écoulement dans une direction ascendante pour décharger l'air, un tube interne raccordé au tube d'entrée d'air et au tube de sortie d'air, et une pluralité de tubes de transfert de chaleur enroulés dans une direction hélicoïdale dans un premier espace annulaire entre une circonférence externe du tube interne ...

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14-12-2007 дата публикации

CIRCUIT Of CANCELLATION OF SHIFT HAS D.C. CURRENT AND AMPLICATEUR HAS GAINPROGRAMMABLE USING THIS ONE

Номер: FR0002902248A1
Автор: PARK, YANG, LEE
Принадлежит: SAMSUNG ELECTRO MECHANICS CO., LTD

Dans un circuit d'annulation de décalage à courant continu, un amplificateur opérationnel est pourvu d'une borne inverseuse, d'une borne non inverseuse et d'une borne de sortie. Une première résistance est connectée à la borne non inverseuse. Une seconde résistance est connectée entre la borne inverseuse et la borne de sortie. Une résistance d'annulation de décalage à courant continu est connectée entre la borne inverseuse et la borne non inverseuse. De même, dans chacun des premier et second circuits d'annulation de décalage à courant continu de l'amplificateur à gain programmable, un amplificateur opérationnel est pourvu d'une borne inverseuse, d'une borne non inverseuse et d'une borne de sortie. Une première résistance est connectée à la borne non inverseuse. Une seconde résistance est connectée entre la borne inverseuse et la borne de sortie. Un circuit d'annulation de décalage à courant continu est connecté entre la borne inverseuse et la borne non inverseuse. Ici, les premier et second ...

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15-05-2009 дата публикации

WASHING MACHINE AND PROCEEDED OF OPERATION THIS ONE

Номер: FR0002923496A1
Принадлежит: LG ELECTRONICS INC

Le procédé de fonctionnement d'une machine à laver est décrit, et comprend : une étape de lavage (S10) destinée à laver le linge ; une étape de rinçage (S20) destinée à rincer le linge en fournissant de l'eau après avoir effectué l'étape de lavage (S10) et qui comprend un processus d'élimination de l'eau restante (S44) ; et une étape d'essorage final (S30) destinée à essorer le linge après avoir effectué l'étape de rinçage (S20). La solution détergente ayant une certaine concentration restant à l'intérieur de la machine à laver peut être éliminée par le biais du processus d'élimination de l'eau restante (S44), empêchant ainsi la contamination de l'eau propre fournie due à la solution détergente, afin d'homogénéiser le processus de rinçage (S20) du linge. De plus, le problème des restes de détergent dans le linge après l'étape de rinçage (S20) peut être résolu.

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24-03-2017 дата публикации

MULTI-LAYERED SYSTEMS

Номер: FR0002953184B1
Принадлежит: KWANG YANG MOTOR CO., LTD.

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06-12-2013 дата публикации

PROCESS OF PANIFICATION

Номер: FR0002944187B1
Принадлежит: PARIS CROISSANT CO LTD

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20-12-2013 дата публикации

SYSTEM AND METHOD FOR USING THE SECURE SETTLEMENT NFC.

Номер: FR0002921786B1
Автор: DOO HOJIN, LEE SCHANGWOOK
Принадлежит: SMART CARD LABORATORY, INC.

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17-04-2015 дата публикации

ORGANIC ELECTROLUMINESCENT DISPLAY COMPENSATION METHOD AND DEGRADATION THEREOF

Номер: FR0002999327B1
Автор: LEE JIWON, KIM SEONGGYUN
Принадлежит: LG DISPLAY CO., LTD.

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17-04-2015 дата публикации

A TOASTER

Номер: FR0003011726A3
Принадлежит:

L'invention concerne un grille-pain et il comprend un boîtier qui contient une chambre de travail et une chambre de chauffage. Un côté du boîtier comporte une première ouverture et le boîtier est pourvu d'au moins une deuxième ouverture. La chambre de travail et la chambre de chauffage sont reliés l'un avec l'autre ; Les rainures longitudinales autant que les deuxièmes ouvertures sont situées dans le boîtier et s'étendent à partir des deuxièmes ouvertures. Au moins une cloison mobile transparente est reliée de manière coulissante à la rainure longitudinale, et la surface latérale de la paroi mobile correspond à la première ouverture. Au moins un mécanisme de positionnement reliée au boîtier et positionne ou soutient une cloison mobile. De l'extérieur du grille-pain, à travers la première ouverture et la cloison mobile transparente sera en mesure d'observer la nourriture pour faciliter à l'utilisateur de comprendre l'état de la nourriture chauffée. La cloison mobile est reliée aux rainures ...

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25-03-2011 дата публикации

TEXTILE STRUCTURE WITH PARTICLES OF PHEROMONE

Номер: FR0002950367A3
Автор: LEE SIMON
Принадлежит:

L'invention porte sur une structure textile avec des particules de phéromone, qui comprend un textile (10) et plusieurs particules de phéromone (20) fixées au textile (10). Le parfum produit par les phéromones (20) du sexe opposé peut provoquer un comportement particulier ou une réponse physiologique particulière pour produire un effet d'excitation, d'augmentation du charme, rendant ainsi plus aisé pour le porteur de développer des relations interpersonnelles. Le textile (10) peut être fabriqué en différents styles de vêtement destinés à être porté par le porteur, augmentant ainsi la commodité d'utilisation.

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07-10-2016 дата публикации

LASER DIODE PACKAGE.

Номер: FR0003034579A3
Автор: LEE HSUN-FU, LEE HOU-CHIEH
Принадлежит:

L'invention concerne un boitier pour diode laser, comprenant une platine conductrice de chaleur isolée électriquement avec un circuit électronique sur celle-ci; une puce à diode laser montée sur le circuit électronique de la platine conductrice de chaleur isolée électriquement et possédant une anode et une cathode, reliées respectivement à une plage de soudure externe pour des connexions électriques externes ; et un support conducteur de chaleur installé sur une surface de la platine conductrice de chaleur isolée électriquement afin de conduire la chaleur générée par la puce à diode laser vers le support conducteur de chaleur à travers la platine conductrice de chaleur isolée électriquement, dans lequel la puce à diode laser émet la lumière à partir d'un bord de la platine conductrice de chaleur isolée électriquement et la surface d'un plan de contact entre la platine conductrice de chaleur isolée électriquement et le support conducteur de chaleur est ajustée suivant les besoins en puissance ...

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02-12-2005 дата публикации

DEVICE OF MOBILE COMMUNICATION OF THE TYPE HAS SMALL ISLANDS

Номер: FR0002858904B1
Автор: HSU, CHEN, LEE
Принадлежит: FAR EAS TONE TELECOMMUNICATIONS CO LTD

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28-09-2018 дата публикации

METHOD FOR OPERATING A MEMORY DEVICE AND ELECTRONIC DEVICE

Номер: FR0002916085B1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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26-08-2011 дата публикации

SYSTEM AND a METHOD FOR LIMITING the EFFECTS Of ARCS IN MATRICES Of TRANSMITTERS OF FIELDS

Номер: FR0002909484B1
Автор: WILSON COLIN R, LEE JI UNG
Принадлежит: GENERAL ELECTRIC COMPANY

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04-04-2014 дата публикации

Multistandard socket adapter, has set of terminals cooperating with 125 volts socket, and another set of terminals cooperating with 250 volts socket, and penetrating through interface to form earthing portion

Номер: FR0002996366A1
Автор: LEE CHIU-SAN
Принадлежит:

La présente invention concerne un adaptateur de prises de courant multistandard (1), comprenant au moins une interface (10) à prises femelles et un boîtier (11) fixé à cette interface. L'intérieur du boîtier (11) comporte un premier ensemble de bornes (12) et un deuxième ensemble de bornes (14) conformes respectivement aux spécifications des prises en 125 volts et en 250 volts. L'adaptateur de prises (1) comprend en outre un premier ensemble de prises femelles (13) et un deuxième ensemble de prises femelles (15) correspondant au premier et deuxième ensembles de bornes (12, 14) respectivement et conforme aux spécifications des prises pour du 125 volts et du 250 volts. Le deuxième ensemble de bornes (14) peut être utilisé pour des entrée et sortie de tension en 125 volts. Avec une telle structure, des prises mâles en 125 volts et en 250 volts peuvent être branchées dans les prises femelles correspondantes de l'adaptateur (1), réalisant lesdites sorties et entrées de tension et améliorant ...

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06-06-2008 дата публикации

Field emitter array for e.g. X-ray tube, has emitters emitting electrons when emission voltage is applied on grid and substrate layers, where grid layer has resistive layer with electrical resistance to locate effects of arc formation

Номер: FR0002909484A1
Автор: WILSON, LEE
Принадлежит: GENERAL ELECTRIC COMPANY

Système et procédé pour limiter les effets de la formation d'arcs dans des matrices d'émetteurs d'électrons du type à émission de champ, améliorant la robustesse de ces matrices. Les matrices d'émetteurs d'électrons du type à émission de champ ont globalement un substrat (32), un isolant (34) et une électrode de grille (36). En incluant une substance résistive (38) dans la grille (36) de la matrice d'émetteurs, les phénomènes de formation d'arcs peuvent être isolés pour un seul émetteur de façon que les autres émetteurs d'une matrice puissent poursuivre l'émission (50) d'électrons et/ou pour que le courant de court-circuit de l'arc puisse être limité.

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13-01-2017 дата публикации

CONTROL METHOD FOR A LAUNDRY TREATING APPARATUS

Номер: FR0002999195B1
Автор: KIM JEONGYUN, LEE SANGIK
Принадлежит: LG ELECTRONICS INC.

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13-05-2016 дата публикации

Mode Size Converters For Reducing A Modal Profile Of Incoming Light

Номер: FR0003028324A1
Автор: TAO LING, LEE JONATHAN
Принадлежит: TE CONNECTIVITY CORPORATION

Convertisseur de taille de mode (102) incluant un guide d'ondes de recouvrement (106) qui comporte une extrémité d'entrée (130) configurée pour recevoir de la lumière provenant d'un élément optique (104). Le guide d'ondes de recouvrement (106) présente un premier indice de réfraction. Le convertisseur de taille de mode (102) comprend également un guide d'ondes de signal (108) qui est intégré dans le guide d'ondes de recouvrement (106) et présente un deuxième indice de réfraction qui est supérieur au premier indice de réfraction. Le guide d'ondes de signal (108) comprend des premier et deuxième segments de bras (160, 162) et un segment de tronc (164) qui forment une jonction en Y (166). Les premier et deuxième segments de bras (160, 162) sont configurés pour réduire un profil modal de la lumière qui se propage vers le segment de tronc (164) depuis l'extrémité d'entrée (130) du guide d'ondes de recouvrement (106). Chacun des premier et deuxième segments de bras (160, 162) comporte une extrémité ...

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10-07-2015 дата публикации

HELICOPTER WITH AN H-SHAPED FRAME

Номер: FR0003016155A1
Автор: LEE HUNG-FU
Принадлежит:

Un hélicoptère ayant une structure en forme de H est fourni. Avec un mécanisme de transmission (50) en forme de H fonctionnant en collaboration avec deux paires d'ensembles formant rotor (20), qui sont disposées sur deux côtés d'une partie avant (11) et d'une partie arrière (12) d'un fuselage (10) et qui est mis en rotation dans des sens opposés, les couples générés par les deux paires d'ensembles formant rotor (20), en rotation dans des sens opposés, sont neutralisés. Ainsi, une posture de vol et une direction de rotation pendant le vol de l'hélicoptère sont maintenus de façon équilibrés, et, dans le même temps, l'hélicoptère est équipé d'une structure simple pour aussi assurer la sécurité des vols.

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13-06-2014 дата публикации

ORGANIC ELECTROLUMINESCENCE DISPLAY DEGRADATION COMPENSATION AND METHOD THEREOF

Номер: FR0002999327A1
Автор: LEE JIWON, KIM SEONGGYUN
Принадлежит:

Afficheur électroluminescent organique comportant un panneau d'affichage comportant des pixels, une unité de réglage de zone de compensation 141 pour sélectionner une zone nécessitant une compensation supplémentaire, laquelle est davantage dégradée qu'une dégradation moyenne, en fonction de données de détection de dégradation indiquant un degré de dégradation de diodes électroluminescentes organiques formées dans les pixels, une unité d'extraction d'informations de bords 142 qui analyse des données d'image d'entrée correspondant à la zone nécessitant une compensation supplémentaire et obtient des informations de bords d'une image d'entrée, une unité de calcul de gain de compensation 143 pour calculer différentiellement un gain de compensation à appliquer aux données de compensation dans chacun de blocs de compensation appartenant à la zone nécessitant une compensation supplémentaire en fonction d'une quantité d'informations de bords, et une unité de modulation de données 144 produisant ...

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31-01-2014 дата публикации

REACTIVE PLASTICIZER BASED ETHER FOR EXPLOSIVES WITH A PLASTIC BINDER

Номер: FR0002993883A1
Принадлежит:

La présente invention concerne un plastifiant réactif énergétique pour un explosif à liant plastique (PBX), et spécifiquement un plastifiant réactif énergétique pour PBX qui possède des performances et une insensibilité élevées sans fuite de plastifiant, en étant lié à un liant polymère pour un explosif à liant plastique.

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14-12-2012 дата публикации

PROCEEDED OF ORDERING OF TRANSMISSION CLUTCH DOUBLE OF VEHICLE HAS

Номер: FR0002976243A1
Принадлежит: HYUNDAI MOTOR COMPANY, KIA MOTORS CORP.

Un procédé de commande d'une transmission à embrayage double d'un véhicule, pour réaliser une série d'opérations de rétrogradation d'une vitesse précédente (N+1) à une vitesse suivante (N-1) par l'intermédiaire d'une vitesse actuelle (N) en réponse à une décélération du véhicule, peut comprendre le maintien (S10) d'un embrayage, qui a été dans un état enclenché à la vitesse précédente (N+1), dans l'état enclenché jusqu'à un instant après qu'un ordre de passer à la vitesse suivante (N-1) peut être généré, lors du changement de la vitesse précédente (N+1) à la vitesse actuelle (N), le relâchement (S30) de l'embrayage après que l'ordre de passer à la vitesse suivante (N-1) peut être généré, et l'enclenchement (S40) d'un pignon de vitesse de la vitesse suivante (N-1) après le relâchement de l'embrayage.

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23-10-2015 дата публикации

OLED SUPPORTED TRANSPARENT ELECTRODE

Номер: FR0003020179A1
Автор: LEE YOUNGSEONG, HAN JINWOO
Принадлежит: SAINT-GOBAIN GLASS FRANCE

La présente invention concerne une électrode transparente supportée pour OLED, comprenant, successivement (i) un substrat transparent en verre minéral, (ii) une couche diffusante formée d'un émail haut indice contenant au moins 30 % en poids de Bi2O3, (iii) une couche barrière d'au moins un oxyde métallique diélectrique choisi dans le groupe constitué de Al2O3, SiO2, TiO2, ZrO2 et HfO2 déposée par ALD, (iv) une couche d'un oxyde conducteur transparent (TCO). Elle concerne également un procédé de fabrication d'une telle électrode et une OLED comprenant une telle électrode.

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01-07-2016 дата публикации

CONTAINER INCLUDES A SHORT STROKE PUMP

Номер: FR0003031093A1
Автор: LEE DO HOON
Принадлежит: PUM-TECH KOREA CO., LTD

La présente invention propose un récipient compact comprenant une pompe ayant une faible course, qui comprend un corps de récipient 10 pourvu d'un côté d'un bouton 11 et un couvercle de récipient 20 accouplé au moyen d'une charnière à un côté du corps de récipient 10, le récipient compact comprenant : un récipient intérieur 30 comportant un espace récepteur de contenu 31 ; une plaque de support de pompe 40 accouplée à un sommet du récipient intérieur 30 pour sceller le récipient intérieur 30 et pourvue en son centre d'un cylindre 51 ; et une pompe installée sur une partie centrale supérieure de la plaque de support de pompe 40 pour pomper un contenu et ayant une distance de course de 1,5 mm à 2,5 mm, dans laquelle le rapport entre la distance de course et le diamètre intérieur du cylindre 51 vaut de 1/5 à 1/13.

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06-07-2007 дата публикации

Liquid crystal display device for use as e.g. screen of television, has common voltage generator generating common voltages to independently deliver voltages to two lines connected to respective common voltage supply lines

Номер: FR0002895827A1
Автор: HWANG, LEE, CHO
Принадлежит: LG DISPLAY CO LTD

Un dispositif d'affichage à cristaux liquides comporte : un substrat inférieur (101) ayant une première (118a) et une deuxième (118b) lignes d'alimentation en tension commune, des régions de pixels définies par des lignes de grille (GL1-GLn) et des lignes de données (DL1-DLm), et des lignes communes (VL1-VLn) raccordées électriquement à la deuxième ligne d'alimentation en tension commune ; un substrat supérieur (103) faisant face au substrat inférieur et ayant une électrode commune raccordée électriquement à la première ligne d'alimentation en tension commune. Un générateur de tension commune (108) génère une première (Vcom1) et une seconde (Vcom2) tensions communes pour délivrer de manière indépendante la première et la seconde tensions communes aux première et deuxième lignes d'alimentation en tension commune.

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24-06-2011 дата публикации

PROCESS OF REDUCTION OF the DURATION Of SCHEDULING OF PACKAGES OF AUTOMATIC TRANSFER OF COMMUNICATION OF LAYER 3 AND FINAL CORRESPONDING SATELLITE

Номер: FR0002954657A1

Un procédé est proposé pour réduire la durée d'ordonnancement des paquets d'un transfert automatique de communication de couche de niveau 3, ainsi qu'un terminal satellite mobile correspondant. Ce procédé pour réduire la durée d'ordonnancement des paquets d'un transfert d'un routeur mobile (120) dans un agent local (140) d'un réseau satellite connecté au routeur mobile comprend : la transmission d'un premier paquet et d'un deuxième paquet au routeur mobile par le biais d'une liaison satellite du routeur mobile ; la transmission d'un paquet de contrôle de séquence au routeur mobile par le biais de la liaison satellite ; et la transmission d'un troisième paquet au routeur mobile via une liaison sans fil du routeur mobile. Le paquet de contrôle de séquence propose un temps de référence pour réordonner rapidement les deuxième et troisième paquets qui atteignent le routeur mobile dans une séquence inverse.

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06-03-2009 дата публикации

DEVICE OF TUBE Of a DISHWASHER

Номер: FR0002920289A1
Автор: LEE GANG HYUN
Принадлежит: LG ELECTRONICS INC

Un dispositif de buse (200) d'un lave-vaisselle comprenant une buse de lavage (210) configurée pour injecter l'eau de lavage sur des cibles qui doivent être lavées, une partie de passage d'alimentation d'eau (240) pour permettre l'écoulement de l'eau de lavage fournie à la buse de lavage (210), une partie de passage de vidange pour permettre l'écoulement de l'eau de lavage qui doit être évacuée, et une partie d'empêchement de siphon configuré pour empêcher un phénomène de siphon de survenir sur la partie de passage de vidange, moyennant quoi un espace nécessaire pour configurer un passage de vidange et une structure destinée à empêcher le phénomène de siphon peuvent être minimisés de façon à maintenir la taille compacte du lave-vaisselle et à améliorer l'utilisation de l'espace.

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12-03-2010 дата публикации

SYSTEM OF CONNECTOR OF CABLES

Номер: FR0002935844A1
Принадлежит: GENERAL ELECTRIC COMPANY

Dans un système de connecteur de câbles, une prise femelle pour le système de connecteur comprend une paire de plaques de compression opposées et au moins un élément rotatif conçu pour déplacer les plaques de compression opposées lorsque tourne l'élément rotatif. Les plaques de compression créent un contact avec une partie de la prise mâle insérée entre celles-ci.

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27-11-2015 дата публикации

MOBILE TERMINAL AND METHOD FOR CONTROLLING THE SAME

Номер: FR0003021425A1
Принадлежит: LG ELECTRONICS INC.

L'invention concerne un terminal mobile (100) pouvant commander efficacement la réception d'un appel entrant dans un état dans lequel un terminal externe capable d'assister une sortie audio est connecté avec le terminal mobile (100) et un procédé de commande associé. Ledit terminal mobile (100) inclut une unité de communication sans fil (110) configurée pour communiquer avec le terminal externe, une unité de détection (140) configurée pour détecter un mouvement du terminal mobile (100), une unité de sortie audio (150) et un appareil de commande (180), si un premier mouvement est détecté par l'unité de détection (140) pendant la réception de l'appel entrant dans un premier état de configuration dont une sortie audio est réalisée via un premier terminal externe, configuré pour accepter l'appel entrant et permuter à une deuxième configuration sortant un signal d'appel pour l'appel entrant accepté via l'unité de sortie audio au lieu du premier terminal externe.

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06-05-2011 дата публикации

DEVICE AND PROCESS OF DETECTION OF INTERIOR POSITION BY USING A NUMERICAL SIGNAL OF BROADCASTING

Номер: FR0002952188A1
Автор: SIN CHEON SIG, LEE HO JIN

L'invention décrit un dispositif de réception (130) pour détecter une position intérieure en utilisant des signaux de radiodiffusion numérique, comprenant : une unité de réception recevant un signal de radiodiffusion numérique, qui comprend des informations de navigation utilisées pour déterminer une position du dispositif de réception, transmis à partir d'un dispositif de transmission de signaux de radiodiffusion numérique (121 à 124) ; et une unité de sortie délivrant un signal à l'extérieur du dispositif de réception via une communication sans fil, dans lequel l'unité de réception reçoit les signaux de radiodiffusion numérique à partir d'une pluralité de dispositifs de transmission de signaux de radiodiffusion numérique (121 à 124).

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24-08-2012 дата публикации

TECHNIQUE BY SPECTRAL DOPPLER HAS MULTIPLE BEAMS OF THE IMAGERY OF DIAGNOSTIC MEDICAL BY ULTRASOUND

Номер: FR0002971696A1
Принадлежит: SIEMENS MEDICAL SOLUTIONS USA, INC

Des informations Doppler Spectral distinctes spatialement sont acquises (30). Des faisceaux d'émission distincts spatialement sont formés (26) à un même instant ou en parallèle. Un ou plusieurs faisceaux de réception sont formés (28) en réponse à chaque faisceau d'émission, fournissant des échantillons pour une pluralité d'emplacements à distance latéralement les uns des autres. Un spectre est déterminé (30) pour chacun d'une pluralité d'emplacements. Suivant une autre technique, des échantillons sont acquis pour des régions différentes à des instants différents. Le balayage pour chaque région est entrelacé (40) sur la base de l'opération anatomique. Comme l'estimation (30) spectrale repose sur des séries continues dans le temps d'émission et de réception, le balayage pour les régions a lieu sur une durée suffisante pour une estimation spectrale avant que le balayage pour une région différente ait lieu. En utilisant une opération anatomique, un temps suffisant est fourni pour l'estimation ...

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19-06-2009 дата публикации

MANUFACTORING PROCESS Of a GALLIUM NITRIDE SUBSTRATE

Номер: FR0002925071A1
Автор: LEE JEONG SIK
Принадлежит: CORNING PRECISION MATERIALS CO., LTD

La présente invention concerne un procédé de fabrication d'un substrat de nitrure de gallium (GaN) fournissant un film épais de GaN sans provoquer ni incurvation ni fissure pouvant survenir dans un processus de croissance. Dans ce but, une couche de nitrure destinée à être enrobée (20) ayant une pluralité de vides (50) dans celle-ci est enrobée entre une couche de GaN (30) et un substrat de base (10). Le procédé comprend la préparation d'un substrat de base (10), la croissance, sur ce dernier, de la couche (20) ayant une pluralité de parties riches en indium (40) à une première température, et la croissance d'une couche de GaN (30) sur la couche (20) à une seconde température inférieure à la première température, pour métalliser la partie (40) pour former une pluralité de vides (50) dans la couche (20).

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08-07-2011 дата публикации

SCREEN OUT OF PAPER ELECTRONIC AND MANUFACTORING PROCESS OF THIS ONE

Номер: FR0002954992A1
Принадлежит: SAMSUNG ELECTRO MECHANICS CO LTD

Il est décrit ici un écran en papier électronique et un procédé de fabrication de celui-ci. L'écran en papier électronique peut être configuré pour inclure : un substrat ; une couche de fils qui est formée sur le substrat ; un ensemble tampon qui est connecté électriquement à la couche de fils et est disposé sur le substrat ; une couche barrière qui est disposée sur la couche de fils ; une électrode à segment qui est disposée sur la couche barrière et est connectée électriquement à la couche de fils ; un film de papier électronique qui est disposé sur le substrat incluant l'électrode à segment ; et une puce pilote qui est montée sur l'ensemble tampon.

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27-03-2009 дата публикации

OSCILLATOR LLC IN SQUARING INCLUDING/UNDERSTANDING a COMPENSATOR OF DEFECT Of ADAPTATION OF PHASE AND AMPLITUDE

Номер: FR0002921526A1
Принадлежит: SAMSUNG ELECTRO MECHANICS CO., LTD

Dans un mode de réalisation particulier de l'invention, il est proposé un oscillateur LC en quadrature comprenant deux oscillateurs LC interconnectés l'un avec l'autre pour générer des signaux d'horloge I/Q et un compensateur de défaut d'adaptation de phase et d'amplitude. Le détecteur de défaut d'adaptation de phase et d'amplitude peut comprendre un détecteur de défaut d'adaptation d'amplitude, un transconducteur, et un condensateur pour compenser à la fois les défaut d'adaptation de phase et d'amplitude entre les signaux d'horloge I/Q générés par l'oscillateur LC en quadrature.

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06-03-2009 дата публикации

MACHINE AND STEAM GENERATOR HAS LAVER/SECHER INCLUDING/UNDERSTANDING THIS ONE.

Номер: FR0002920446A1
Автор: LEE KYU WON
Принадлежит: LG ELECTRONICS INC

Générateur de vapeur et machine à laver/sécher comprenant celui-ci, le générateur de vapeur (200) comprenant: un boîtier (210, 220) avec une ouverture (221) sur un côté de celui-ci, une unité de chauffage (231) formée pour pénétrer dans l'ouverture ; et un ensemble de fixation monté au niveau de l'ouverture de manière à étanchéiser l'ouverture et supporter l'unité de chauffage (231), dans lequel l'ensemble de fixation comprend un élément d'étanchéité (233) pour étanchéiser l'ouverture et l'ouverture comprend une partie (222) de protection contre les fuites pour empêcher une formation d'interstice entre l'ouverture (221) et l'élément d'étanchéité (233) quand l'élément d'étanchéité est déformé, en empêchant ainsi une fuite entre l'ouverture du boîtier et un élément d'étanchéité, même si le boîtier ou l'élément d'étanchéité est déformé thermiquement ...

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22-08-2000 дата публикации

OPTICAL READING DEVICE

Номер: FR0035480161B1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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05-07-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0039762358B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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20-11-2000 дата публикации

OPTICAL READING DEVICE

Номер: FR0030389139B1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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13-12-2000 дата публикации

SADDLE OF BICYCLE

Номер: FR0039595106B1
Автор: LEE
Принадлежит: LEE

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17-02-2000 дата публикации

PROCESS AND DEVICE TO CODE A VECTOR OF DISPLACEMENT

Номер: FR0033146642B1
Автор: LEE
Принадлежит: MAPLE VISION TECHNOLOGIES INC.

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09-03-2000 дата публикации

PROCESS AND DEVICE TO CODE A VECTOR OF DISPLACEMENT

Номер: FR0037441291B1
Автор: LEE
Принадлежит: MAPLE VISION TECHNOLOGIES INC.

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10-08-2000 дата публикации

APPARATUS TO PREVENT an ERROR Of AUTOCONVERGENCE IN a RECEIVER DETELEVISION HAS PROJECTION.

Номер: FR0033331623B1
Автор: LEE, KIM
Принадлежит: LG ELECTRONICS INC

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13-05-2000 дата публикации

APPARATUS TO PREVENT an ERROR Of AUTOCONVERGENCE IN a RECEIVER DETELEVISION HAS PROJECTION.

Номер: FR0034414700B1
Автор: LEE, KIM
Принадлежит: LG ELECTRONICS INC

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26-04-2000 дата публикации

SADDLE OF BICYCLE

Номер: FR0036012669B1
Автор: LEE
Принадлежит: LEE

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01-12-2000 дата публикации

SADDLE OF BICYCLE

Номер: FR0033216616B1
Автор: LEE
Принадлежит: LEE

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24-07-2000 дата публикации

OPTICAL READING DEVICE

Номер: FR0033651997B1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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19-03-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0031209442B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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13-11-2000 дата публикации

PROCESS AND DEVICE TO CODE A VECTOR OF DISPLACEMENT

Номер: FR0030124638B1
Автор: LEE
Принадлежит: MAPLE VISION TECHNOLOGIES INC.

Подробнее
04-01-2000 дата публикации

OPTICAL READING DEVICE

Номер: FR0032974718B1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

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20-04-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0031728068B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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24-02-2000 дата публикации

APPARATUS TO PREVENT an ERROR Of AUTOCONVERGENCE IN a RECEIVER DETELEVISION HAS PROJECTION.

Номер: FR0034584026B1
Автор: LEE, KIM
Принадлежит: LG ELECTRONICS INC

Подробнее
19-05-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0035878999B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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02-08-2000 дата публикации

PROCESS AND DEVICE TO CODE A VECTOR OF DISPLACEMENT

Номер: FR0037963351B1
Автор: LEE
Принадлежит: MAPLE VISION TECHNOLOGIES INC.

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17-08-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0033584581B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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08-06-2000 дата публикации

SADDLE OF BICYCLE

Номер: FR0035111789B1
Автор: LEE
Принадлежит: LEE

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13-01-2000 дата публикации

APPARATUS TO PREVENT an ERROR Of AUTOCONVERGENCE IN a RECEIVER DETELEVISION HAS PROJECTION.

Номер: FR0037406216B1
Автор: LEE, KIM
Принадлежит: LG ELECTRONICS INC

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08-10-2000 дата публикации

PROCESS AND DEVICE TO CODE A VECTOR OF DISPLACEMENT

Номер: FR0036852230B1
Автор: LEE
Принадлежит: MAPLE VISION TECHNOLOGIES INC.

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24-10-2000 дата публикации

CLEANING ROBOT, SYSTEM OF CLEANING ROBOTIZES AND PROCEEDED OF ORDER DECELUI-CI

Номер: FR0039537388B1
Автор: SONG, LEE, KO
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

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02-08-2012 дата публикации

Polyphosphonat, Verfahren zu dessen Herstellung und flammhemmende, thermoplastische Harzzusammensetzung, die selbiges einschliesst

Номер: DE102011090017A1
Принадлежит:

Die vorliegende Erfindung stellt ein Polyphosphonat mit einem Säurewert von etwa 5,5 mg KOH/g oder weniger und dargestellt durch Formel 1 bereit: [Formel 1]wobei A eine Einfachbindung, C1- bis C5-Alkylen, C1- bis C5-Alkyliden, C5- bis C6-Cycloalkyliden -S- oder -SO2- darstellt, R eine substituierte oder unsubstituierte C6- bis C20-Arylgruppe oder eine substituierte oder unsubstituierte C6- bis C20-Aryloxygruppe darstellt, R1 und R2 jeweils unabhängig eine substituierte oder unsubstituierte C1- bis C6-Alkylgruppe, eine substituierte oder unsubstituierte C3- bis C6-Cycloalkylgruppe, eine substituierte oder unsubstituierte C6- bis C12-Arylgruppe oder ein Halogenatom darstellen, a und b jeweils unabhängig eine ganze Zahl von etwa 0 bis etwa 4 darstellen und n eine ganze Zahl von etwa 1 bis etwa 500 darstellt.

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17-09-2009 дата публикации

Erzeugung von Identifizierungsinformationen

Номер: DE602006008209D1
Автор: LEE SANG-HO, PARK IN-HO, LEE, PARK

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12-01-2012 дата публикации

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Номер: US20120007219A1
Принадлежит: HYNIX SEMICONDUCTOR INC.

A semiconductor device, includes: a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer; a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer; a storage node contacting a top surface of the second storage node contact plug; and a second interlayer insulation layer formed over the first interlayer insulation layer, wherein the second interlayer insulation layer surrounds an outer sidewall at a bottom region of the first storage node, and the second storage node contact plug, and wherein the first storage node contact plug protruding above the first interlayer insulation layer and the second storage node contact plug. 1. A semiconductor device , comprising:a first storage node contact plug penetrating a first interlayer insulation layer and partially protruding above the first interlayer insulation layer;a second storage node contact plug contacting the first storage node contact plug that protrudes above the first interlayer insulation layer;a storage node contacting a top surface of the second storage node contact plug; anda second interlayer insulation layer formed over the first interlayer insulation layer, the second interlayer insulation layer surrounding an outer sidewall at a bottom region of the storage node, the second storage node contact plug, and the first storage node contact plug protruding above the first interlayer insulation layer.2. The semiconductor device of claim 1 , wherein the first interlayer insulation layer comprises an oxide layer.3. The semiconductor device of claim 1 , wherein the second interlayer insulation layer comprises a nitride layer.4. The semiconductor device of claim 1 , wherein the first interlayer insulation layer comprises an oxide layer and the second interlayer insulation layer comprises a nitride layer.5. The semiconductor device of claim 1 ...

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26-01-2012 дата публикации

Light Emitting Diode Having Vertical Topology And Method Of Making The Same

Номер: US20120018700A1
Принадлежит:

An LED having vertical topology and a method of making the same is capable of improving a luminous efficiency and reliability, and is also capable of achieving mass productivity. The method includes forming a semiconductor layer on a substrate; forming a first electrode on the semiconductor layer; forming a supporting layer on the first electrode; generating an acoustic stress wave at the interface between the substrate and semiconductor layer, thereby separating the substrate from the semiconductor layer; and forming a second electrode on the semiconductor layer exposed by the separation of the substrate. 1. A light emitting device , comprising:a supporting layer; 'a first electrode on the connection metal layer, the first electrode comprising a reflective electrode;', 'a connection metal layer comprising a first layer on the supporting layer, a diffusion barrier layer on the first layer, and a second layer on the diffusion barrier layer, wherein the first layer comprising a bonding layer for attaching the supporting layer;'}a semiconductor structure on the first electrode, the semiconductor structure comprising a first-type layer, an active layer on the first-type layer, and an second-type layer on the active layer; anda second electrode on the semiconductor structure.2. The device according to claim 1 , wherein the connection metal layer comprises Cu claim 1 , Au claim 1 , Sn claim 1 , In claim 1 , Ag or an alloy of any combination thereof or a stack of any combination thereof.3. The device according to claim 1 , wherein the first layer comprises Au.4. The device according to claim 1 , wherein the first layer comprises an Au layer or a Cu layer.5. The device according to claim 1 , wherein the diffusion barrier layer comprises Ni claim 1 , W claim 1 , Ti or Pt.6. The device according to claim 1 , wherein the second layer comprises Ni claim 1 , W claim 1 , Ti claim 1 , Pt claim 1 , Au claim 1 , Pd claim 1 , Cu claim 1 , Al claim 1 , Cr claim 1 , Ag or an alloy of ...

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15-03-2012 дата публикации

HEAT CONDUCTING SLUG HAVING MULTI-STEP STRUCTURE AND THE LIGHT EMITTING DIODE PACKAGE USING THE SAME

Номер: US20120061717A1
Принадлежит: SEOUL SEMICONDUCTOR CO., LTD.

The present invention relates to a light-emitting diode package having a plurality of inner leads, a plurality of outer leads extending from the inner leads, a slug electrically connected to at least one of the inner leads, the slug having a thermally conductive material, a light-emitting chip arranged on the slug, and a housing supporting the light-emitting diode package. 1. A light-emitting diode (LED) package , comprising:a plurality of inner leads;a plurality of outer leads extending from the inner leads;a slug electrically connected to at least one of the inner leads, the slug comprising a thermally conductive material;a light-emitting chip arranged on the slug; anda housing supporting the light-emitting diode package.2. The LED package of claim 1 , wherein the plurality of inner leads comprises at least two inner leads spaced apart from each other.3. The LED package of claim 2 , wherein the plurality of inner leads further comprises at least two inner leads connected with each other.4. The LED package of claim 1 , further comprising a plurality of support leads claim 1 , wherein the support leads are coupled to the slug.5. The LED package of claim 1 , wherein the slug comprises a multi-step structure.6. The LED package of claim 5 , wherein the slug comprises a first slug claim 5 , a second slug arranged on the first slug claim 5 , and a third slug arranged on the second slug.7. The LED package of claim 6 , wherein the first slug comprises a cylindrical shape.8. The LED package of claim 7 , wherein the second slug comprises a rectangular shape.9. The LED package of claim 8 , wherein the third slug comprises a rectangular shape.10. The LED package of claim 9 , wherein the second slug and the third slug are arranged to cross each other at 45 degrees.11. The LED package of claim 1 , wherein the light-emitting chip comprises a vertical light-emitting chip.12. The LED package of claim 11 , wherein the vertical light-emitting chip is coupled to the slug via a ...

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29-03-2012 дата публикации

SYSTEMS AND METHODS FOR INITIATING A TELEPHONE CONFERENCE

Номер: US20120076286A1
Принадлежит:

One example discloses a system for initiating a telephone conference. The system can comprise a memory for storing computer executable instructions and a processing unit for accessing the memory and executing the computer executable instructions. The computer executable instructions can comprise a communication client configured to receive a communication from a network, the communication having a plurality of unique telephone numbers and at least one conference code. The computer executable instructions can also comprise a conference call interface that can be configured to receive a selected telephone number and a selected conference code and to store a memory record in the memory, the memory record having the selected telephone number and the selected conference code. The conference call interface can further be configured to output the selected conference code from the memory record in response to a call to the selected telephone number. 1. A system for initiating a telephone conference comprising:a memory for storing computer executable instructions; a communication client configured to receive a communication from a network, the communication having a plurality of unique telephone numbers and at least one conference code;', receive a selected telephone number of the plurality of unique telephone numbers;', 'receive a selected conference code from the at least one conference code;', 'store a memory record in the memory, the memory record having the selected telephone number and the selected conference code; and', 'output the selected conference code from the memory record in response to a call to the selected telephone number., 'a conference call interface configured to], 'a processing unit for accessing the memory and executing the computer executable instructions, the computer executable instructions comprising2. The telephone system of claim 1 , wherein the conference call interface is further configured to generate a uniform resource identifier (URI) ...

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24-05-2012 дата публикации

METHOD FOR FABRICATING CAPACITOR

Номер: US20120125879A1
Принадлежит: HYNIX SEMICONDUCTOR INC.

A method for fabricating a capacitor includes: forming a first mold layer having a first through hole on a semiconductor substrate; forming a hole blocking layer filling and blocking an entrance of the first through hole; forming a second mold layer on the hole blocking layer and the first mold layer; forming a second through hole passing through the second mold layer and aligned with the first through hole; selectively removing the hole blocking layer exposed to the second through hole; forming a storage node along a profile of the first and second through holes; and selectively removing a portion of the first and second mold layers. 1. A method for fabricating a capacitor , comprising:forming a first mold layer having a first through hole on a semiconductor substrate;forming a hole blocking layer filling and blocking an entrance of the first through hole;forming a second mold layer on the hole blocking layer and the first mold layer;forming a second through hole passing through the second mold layer and aligned with the first through hole;selectively removing the hole blocking layer exposed to the second through hole;forming a storage node along a profile of the first and second through holes; andselectively removing a portion of the first and second mold layers.2. The method of claim 1 , further comprising:forming an interlayer dielectric layer between the first mold layer and the semiconductor substrate;forming a storage node contact passing through the interlayer dielectric layer and aligned with the first through hole; andforming an etch stop layer at an interface between the interlayer dielectric layer and the first mold layer.3. The method of claim 2 , wherein the first mold layer is formed using an insulation layer comprising at least one of a phosphorous silicate glass (PSG) layer and a tetraethylorthosilicate (TEOS) layer.4. The method of claim 3 , wherein the second mold layer is formed using an insulation layer which is substantially identical to the ...

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28-02-2013 дата публикации

GRINDING TOOL

Номер: US20130052922A1
Принадлежит:

Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target. 1. A grinding tool comprising:a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder;a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage; anda ring-shaped shank disposed under the second disk and comprising grinding tips to grind a target.2. The grinding tool of claim 1 , further comprising an intake recess in at least one of the second disk and the shank to take air in claim 1 ,wherein the shank has at least one air intake hole that communicates with the intake recess to introduce the air to the central portion of the grinding tool.3. The grinding tool of claim 2 , wherein the intake recess has a predetermined curvature in a direction of rotation of the grinding tool.4. The grinding tool of claim 1 , wherein the partition has a predetermined curvature in a direction of rotation of the grinding tool.5. The grinding tool of claim 1 , wherein the grinding tips have a predetermined curvature in a direction of rotation of the grinding tool.6. The grinding tool of claim 1 , further comprising an auxiliary partition between the partitions.7. The grinding tool of claim 2 , further comprising an auxiliary partition between the partitions.8. The grinding tool of claim 2 , further comprising a dust cover that separates the partition and ...

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19-09-2013 дата публикации

SWIRL FLOW TYPE PRE-MIXED LOW-POLLUTION COMBUSTION APPARATUS

Номер: US20130239857A1
Принадлежит: GLOBAL STANDARD TECHNOLOGY CO., LTD

The disclosure relates to a waste gas purification apparatus, and more particularly, to a waste gas combustion apparatus to burn and process waste gases. The disclosure provides the waste gas combustion apparatus to process the waste gases generated in an industrial process, such as a chemical process, a semiconductor manufacturing process, or an LCD manufacturing process. The waste gas combustion apparatus includes a combustion gas supply unit provided with a first combustion region in which the waste gases are primarily burned by supply of fuel gases which are pre-mixed with diluted fuel gases, and a second combustion region which is supplied with support gases so as to completely burn fuel gases which are not reacted in the first combustion region. 1. A swirl flow type pre-mixed low-pollution combustion apparatus to process waste gases generated in an industrial process , such as a chemical process , a semiconductor manufacturing process , or an LCD manufacturing process , the combustion apparatus comprising:a combustion gas supply unit provided with a first combustion region, the first combustion region being a space where a flame is formed by supply of pre-mixed fuel gases, which are pre-mixed with diluted fuel gases, and support gases; andan ignition unit which includes an ignition device and is provided with a second combustion region, the second combustion region being a space where the flame formed in the first combustion region is diffused.2. The combustion apparatus according to claim 1 , wherein the combustion gas supply unit is formed therein with the first combustion region claim 1 , and further includes a gas nozzle member claim 1 , which is provided with a pre-mixed fuel gas nozzle to inject the pre-mixed fuel gases and a support gas nozzle to inject the support gases.3. The combustion apparatus according to claim 2 ,wherein the pre-mixed fuel gas nozzle is comprised of a plurality of pre-mixed fuel gas nozzles which are disposed to be inclined ...

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03-10-2013 дата публикации

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

Номер: US20130256916A1
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package. 1. A semiconductor package , comprising:a mounting substrate;a first semiconductor chip on an upper surface of the mounting substrate;a unit package stacked on the first semiconductor chip, the unit package including a package substrate and a second semiconductor chip mounted thereon;a plurality of bonding wires connecting bonding pads of the mounting substrate and connection pads of the unit package to electrically connect the first and second semiconductor chips to each other; anda molding member on the mounting substrate to cover the first semiconductor chip and the unit package.2. The semiconductor package of claim 1 , wherein the first semiconductor chip is mounted on the mounting substrate such that an active surface of the first semiconductor chip faces the upper surface of the mounting substrate.3. The semiconductor package of claim 2 , wherein the first semiconductor chip is mounted on the mounting substrate by a flip chip process.4. The semiconductor package of claim 1 , wherein the molding member covers at least a side portion of the mounting substrate.5. The semiconductor package of claim 1 , wherein the unit package is stacked on the first semiconductor chip using an adhesive layer such that a lower surface of the package substrate is exposed.6. The semiconductor package of claim 5 , wherein the bonding pads are arranged ...

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24-10-2013 дата публикации

APPARATUS AND METHOD FOR TREATING PERFLUORO-COMPOUND

Номер: US20130280154A1
Принадлежит: Global Standard Technology Co., Ltd.

The present invention discloses an apparatus and method for treating perfluoro-compounds (PFCs). The method for treating PFCs includes: (a) decomposing PFCs and eliminating a first acid gas generated by the decomposition through a pre-cleaner; (b) filtering out dust particles from the exhaust gas through a filter; (c) electrifying the dust particles in the exhaust gas by electrical discharge and collecting dusts through a dust collector; (d) decomposing PFCs using a regenerative/catalytic reaction through a catalytic reactor; (e) eliminating a second acid gas generated by the regenerative/catalytic reaction through a post-cleaner; and (f) letting the purified exhaust gas out through a fan. 1. An apparatus for treating a perfluoro-compound , which apparatus is to purify an exhaust gas containing a perfluoro-compound , the apparatus comprising:a pre-cleaner for decomposing the perfluoro-compound and removing a first acid gas produced by the decomposition;a filter for filtering out dust particles contained in the exhaust gas;a dust-collector for electrifying the dust particles contained in the exhaust gas by electrical discharge and collecting dusts;a catalytic reactor for decomposing the perfluoro-compound through a regenerative/catalytic reaction;a post-cleaner for eliminating a second acid gas generated by the regenerative/catalytic reaction; anda fan for letting the exhaust gas out,wherein the pre-cleaner, the filter, the dust-collector, the catalytic reactor, the post-cleaner, and the fan are arranged in series and sequentially put into operation.2. The apparatus as claimed in claim 1 , wherein the pre-cleaner claim 1 , the filter claim 1 , the dust-collector claim 1 , the catalytic reactor claim 1 , the post-cleaner claim 1 , and the fan are arranged outside a clean room equipped with devices for performing a semiconductor process.3. The apparatus as claimed in claim 1 , wherein the pre-cleaner comprises first and second pre-treatment wet scrubbers arranged in ...

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14-11-2013 дата публикации

Capacitor and method for fabricating the same

Номер: US20130299942A1
Принадлежит: Individual

A method for fabricating a capacitor includes forming a mold structure over a substrate, wherein the mold structure has a plurality of open parts and has a mold layer stacked with a support layer; forming cylinder type lower electrodes in the open parts; forming a first upper electrode over an entire surface of a structure including the cylinder type lower electrodes to fill the cylinder type lower electrodes; defining a through hole that passes through portions of the first upper electrode and the support layer; removing the mold layer through the through hole and exposing the cylinder type lower electrodes; forming a second upper electrode to fill the through hole and spaces between the cylinder type lower electrodes; and forming a third upper electrode to connect the second upper electrode and the first upper electrode with each other.

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28-11-2013 дата публикации

INTERGRATED APPARATUS AND METHOD FOR TESTING OF SEMICONDUCTOR COMPONENTS USING A TURRET MACHINE

Номер: US20130314113A1
Автор: LEE HENG LEE
Принадлежит: EXIS TECH SDN BHD

The invention discloses a semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components wherein at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed are provided. The delivery system is also provided with multiple output means such as a tube, a tape or a bin or a combination thereof for semiconductor components determined to be non defective. 1. A semiconductor components delivery system associated with a turret type testing apparatus for testing integrity and functionality of semiconductor components comprising:at least two input feeders loadable with semiconductor components to be vision checked, tested and/or packed; a receiving module to receive semiconductor components fed sequentially from the input feeder;', 'a rotary or gimbal module capable of adjusting the orientation of the semiconductor component placed on this module;', 'at least one test module to perform integrity and/or functionality test and/or parametric test on the semiconductor component placed by the pick-up head on this module;', 'at least one output module for non defective semiconductor components and', 'at least one output module for rejected components; and, 'a plurality of spaced apart, sequentially arranged module positions for each input feeder, with selected module positions provided with modules, the modules seated on a locator mounted on a base plate of the testing apparatus, the modules includea plurality of pick-up heads coupled to a periphery of a rotatable turret of the testing apparatus, with a pick-up head aligned vertically above each module position, and with each pick-up head advancing to the next module position concurrently with all other pick-up heads as the turret advances one module position at a time and with each pick-up head moveable vertically up and down to place, press on and/or pick up a semiconductor component from ...

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20-02-2014 дата публикации

SYSTEM AND METHOD FOR PROVIDING FRIEND'S LOCATION INFORMATION

Номер: US20140052369A1
Автор: HAN Jong Kook
Принадлежит: THINKWARE SYSTEMS CORPORATION

A system and method of providing friend location information is provided. More particularly, when a friend appears in a region desired by a user, it is possible to track a travel route of the friend and display for the user a map where the travel route is marked and thereby enable the user to understand preferred places or the friend. 1. A system for providing friend location information , the system comprising:a friend information receiving unit configured to receive from a user an identification information of a friend;a region selection unit configured to receive from the user a selection of a region to verify location of the friend;a location information receiving unit configured to receive the friend location information which is obtained based on the identification information of the friend;a location information storage unit configured to store in a database the friend location information; anda location information provider configured to provide the user with current location information of the friend by referring to the database,wherein the location information provider further configured to provide the user with a notification of the friend when the friend is in close proximity to or is becoming separated from the region selected by the user.2. The system of claim 1 , wherein the friend location information is stored in the database claim 1 , and wherein the location information provider provides the user with a map including a travel route of the friend by referring to the database.3. The system of claim 2 , wherein the location information storage unit stores in the database the travel route of the friend for each predetermined period.4. The system of claim 3 , wherein the predetermined period is input from the user.5. The system of claim 1 , wherein the region selected by the user comprises the current location of the user.6. The system of claim 5 , wherein the location information receiving unit further comprises:a distance calculation unit configured ...

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03-04-2014 дата публикации

LIGHT EMITTING DIODE HAVING VERTICAL TOPOLOGY AND METHOD OF MAKING THE SAME

Номер: US20140091277A1
Принадлежит:

An LED having vertical topology and a method of making the same is capable of improving a luminous efficiency and reliability, and is also capable of achieving mass productivity. The method includes forming a semiconductor layer on a substrate; forming a first electrode on the semiconductor layer; forming a supporting layer on the first electrode; generating an acoustic stress wave at the interface between the substrate and semiconductor layer, thereby separating the substrate from the semiconductor layer; and forming a second electrode on the semiconductor layer exposed by the separation of the substrate. 1. A light emitting device , comprising:a supporting layer;a semiconductor structure on the supporting layer, the semiconductor structure comprising a first surface, a second surface opposite the first surface, and an inclined side surface with reference to the first surface;a light-extraction structure that is part of the second surface of the semiconductor structure;a passivation layer disposed around the semiconductor structure;a connection metal layer between the supporting layer and the first surface of the semiconductor structure and between the supporting layer and the passivation layer, a width of the connection metal layer in a width direction perpendicular to a thickness direction of the supporting layer being wider than a width of the light-extraction structure in the width direction;a first electrode between the connection metal layer and the first surface of the semiconductor structure; anda second electrode on the second surface of the semiconductor structure.2. The device according to claim 1 , wherein the width of the connection metal layer in the width direction comprises:a first width of a first part of the connection metal layer between the supporting layer and the first surface of the semiconductor structure; anda second width of a second part of the connection metal layer disposed between the supporting layer and the passivation layer, the ...

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07-01-2021 дата публикации

Method of making leadframe strip

Номер: US20210005540A1
Принадлежит: Texas Instruments Inc

A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad and first and second dam bars located adjacent to opposite first and second sides of the die attach pad, respectively. A plurality of continuous lead structures extend, uninterrupted by other structure, between opposing ones of the dam bars of horizontally adjacent leadframes. The plurality of integrally connected leadframes are arranged in a plurality of vertical columns, wherein die attach pads in one vertical column are vertically offset from die attach pads in adjacent vertical columns.

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12-01-2017 дата публикации

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

Номер: US20170012025A1
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A semiconductor package including a mounting substrate, a first semiconductor chip mounted on an upper surface of the mounting substrate, a unit package stacked on the first semiconductor chip may be provided. The unit package includes a package substrate and a second semiconductor chip mounted on the package substrate. A plurality of bonding wires connects bonding pads of the mounting substrate and connection pads of the unit package, thereby electrically connecting the first and second semiconductor chips to each other. A molding member is provided on the mounting substrate to cover the first semiconductor chip and the unit package. 1. A method of manufacturing a semiconductor package , comprising:mounting a first semiconductor chip on an upper surface of a mounting substrate to form a preliminary package;testing the preliminary package;stacking a unit package on the first semiconductor chip, the unit package including a package substrate and a second semiconductor chip mounted thereon;connecting bonding pads of the mounting substrate and connection pads of the unit package using a plurality of bonding wires to electrically connect the first and second semiconductor chips to each other; andforming a molding member on the mounting substrate to cover the first semiconductor chip and the unit package.2. The method of claim 1 , wherein if the preliminary package passes the testing claim 1 , the stacking a unit package on the first semiconductor chip is performed.3. The method of claim 1 , wherein the stacking a unit package on the first semiconductor chip comprises:adhering a plurality of the preliminary packages on a carrier frame; andstacking a plurality of the unit packages on the preliminary packages, respectively.4. The method of claim 3 , wherein the molding member covers at least a side portion of the mounting substrate.5. The method of claim 1 , wherein the bonding pads of the mounting substrate comprises data signal_bonding pads and control signal_bonding ...

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03-02-2022 дата публикации

Method for diagnosis and prognosis of chronic heart failure

Номер: US20220033905A1

Present application relates to methods for determining whether a subject has heart failure or is at risk of having heart failure, specifically that of heart failure with reduced left ventricular ejection fraction (HFREF) and a heart failure with preserved left ventricular ejection fraction (HFPEF), comprising determining the level of selected miRNA(s) observed in a sample obtained from the subject and wherein an altered level of the miRNA(s) compared to control indicates that the subject has heart failure or is at risk of developing heart failure. Also encompassed are methods of determining an altered risk of death or disease progression to hospitalization and death based on alteration of selected miRNAs in a sample from the subject and kits thereof.

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17-04-2014 дата публикации

LOW-POLLUTION BURNING METHOD USING SYSTEM FOR INDIVIDUALLY CONTROLLING CO AND NOx

Номер: US20140106282A1
Принадлежит: GLOBAL STANDARD TECHNOLOGY CO., LTD

The disclosure relates to a waste gas purification method, and more particularly, to a waste gas burning method of reducing CO and NOx by burning waste gases using a system for individually controlling CO and NOx. In accordance with the disclosure, there is provided a low-pollution burning method using a system for individually controlling CO and NOx including a waste gas introduction and flame injection step; a first waste gas burning step; and a second waste gas burning step. 1. A low-pollution burning method of processing a waste gas generated in an industrial process , such as a chemical process , a semiconductor manufacturing process , or an LCD manufacturing process , using a system for individually controlling CO and NOx , the low-pollution burning method comprising:a waste gas introduction and flame injection step of introducing the waste gas into a first combustion region and generating a flame by igniting a fuel gas in which a combustible gas and a support gas are pre-mixed;a first waste gas burning step of burning the waste gas in the first combustion region by the waste gas coming into contact with the flame arising from igniting the fuel gas in which the combustible gas and the support gas are pre-mixed;{'sub': '4', 'a second waste gas burning step of inducing complete combustion by burning unburned components (CO and CH), which remain in a waste gas moved to a second combustion region after going through the first waste gas burning step, together with a support gas, which is additionally introduced into the second combustion region, in the second combustion region; and'}a waste gas discharge step of discharging a waste gas purified through the second waste gas burning step to the outside,{'sub': '2', 'wherein the combustible gas is made of any one or more of LNG (liquefied natural gas), LPG (liquefied petroleum gas), and hydrogen gas, and the support gas is made of any one or more of air and O.'}2. The low-pollution burning method according to claim 1 ...

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28-01-2016 дата публикации

SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING INTERPOSER SUBSTRATE

Номер: US20160027764A1
Принадлежит:

Provided is a semiconductor package stack structure. The semiconductor package stack structure includes a lower semiconductor package, an interposer substrate disposed on the lower semiconductor package and having a horizontal width greater than a horizontal width of the lower semiconductor package, an upper semiconductor package disposed on the interposer substrate, and underfill portions filling a space between the lower semiconductor package and the interposer substrate and surround side surfaces of the lower semiconductor package. 1. A semiconductor package stack structure , comprising:a lower semiconductor package;an interposer substrate disposed on the lower semiconductor package, the interposer substrate having a horizontal width greater than a horizontal width of the lower semiconductor package;an upper semiconductor package disposed on the interposer substrate; andan underfill portion filling a space between the lower semiconductor package and the interposer substrate, and surround side surfaces of the lower semiconductor package.2. The semiconductor package stack structure of claim 1 , wherein side surfaces of the underfill portion include a first side surface vertically aligned with side surfaces of the interposer substrate claim 1 , and a second side surface extending from the first side surface and having a slope claim 1 , respectively.3. The semiconductor package stack structure of claim 2 , wherein the second side surface has a concave shape.4. The semiconductor package stack structure of claim 2 , wherein the second side surface has a linear shape.5. The semiconductor package stack structure of claim 1 , wherein the underfill portion comprises:side surfaces vertically aligned with side surfaces of the interposer substrate; anda lower surface coplanar with a lower surface of a lower package substrate of the lower semiconductor package.6. The semiconductor package stack structure of claim 1 , wherein the interposer substrate comprises:a lower ...

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24-04-2014 дата публикации

METHODS OF FABRICATING A STORAGE NODE IN A SEMICONDUCTOR DEVICE AND METHODS OF FABRICATING A CAPACITOR USING THE SAME

Номер: US20140113431A1
Принадлежит: SK HYNIX INC.

Methods of forming a storage node in a semiconductor device are provided. The method includes forming an interlayer insulation layer on a substrate, forming an etch stop layer and a first sacrificial layer on the interlayer insulation layer, patterning the first sacrificial layer and the etch stop layer to form a first sacrificial layer pattern and an etch stop layer pattern that define a storage node contact hole, forming a recessed first storage node conductive pattern that conformally covers a lower sidewall and a bottom surface of the storage node contact hole, forming a second storage node conductive pattern that includes a first portion surrounded by the recessed first storage node conductive pattern and a second portion conformally covering an upper sidewall of the storage node contact hole, and removing the first sacrificial layer pattern. The recessed first storage node conductive pattern and the second storage node conductive pattern constitute a storage node. 1. A method of a storage node in a semiconductor device , the method comprising:forming an interlayer insulation layer on a substrate;sequentially forming an etch stop layer and a sacrificial layer on the interlayer insulation layer;patterning the sacrificial layer and the etch stop layer to form a sacrificial layer pattern and an etch stop layer pattern that define a storage node contact hole;forming a storage node conductive pattern that conformally covers a sidewall and a bottom surface of the storage node contact hole;forming a recessed conductive pattern that fills a lower portion of the storage node contact hole surrounded by the storage node conductive pattern;forming a metal layer on a top surface of the recessed conductive pattern; andremoving the sacrificial layer pattern,wherein the metal layer, the recessed conductive pattern, and the storage node conductive pattern constitute a storage node.2. The method of claim 1 , wherein the storage node contact hole is formed to have a depth of at ...

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05-02-2015 дата публикации

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Номер: US20150035065A1
Принадлежит:

A semiconductor device includes a substrate with an active region defined by a device isolation layer. A word line extends over the active region in a first direction, and a plurality of interconnections extends over the word line in a second direction perpendicular to the first direction. A contact pad is disposed between and spaced apart from the word line and the plurality of interconnections, extending in the first direction to overlap the plurality of interconnections and the active region when viewed from a plan view. A lower contact plug electrically connects the contact pad to the active region. An upper contact plug electrically connects the contact pad to one of the plurality of interconnections. 1. A semiconductor device comprising:a substrate including an active region defined by a device isolation layer;a word line extending over the active region in a first direction;a plurality of interconnections extending over the word line in a second direction perpendicular to the first direction;a contact pad disposed between and spaced apart from the word line and the plurality of interconnections, the contact pad extending in the first direction to overlap the plurality of interconnections and the active region when viewed from a plan view;a lower contact plug electrically connecting the contact pad to the active region; andan upper contact plug electrically connecting the contact pad to one of the plurality of interconnections.2. The semiconductor device of claim 1 , wherein a length of the contact pad in the first direction is greater than a width of the active region in the first direction.3. The semiconductor device of claim 1 , wherein the upper contact plug is laterally spaced apart from the lower contact plug in the first direction.4. The semiconductor device of claim 1 , wherein a width of the contact pad in the second direction is greater than a width of the lower contact plug in the second direction.5. The semiconductor device of claim 1 , wherein ...

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07-02-2019 дата публикации

ANTI-INFLAMMATORY COMPOSITION COMPRISING CLAVASPIRIN PEPTIDE ANALOGUE AS EFFECTIVE INGREDIENT

Номер: US20190038714A1
Принадлежит:

An anti-inflammatory composition includes a clavaspirin peptide analogue as an effective ingredient. CSP-4 peptide as a synthetic peptide produced by substituting the 9th and 12th amino acids of clavaspirin peptide originating from stalked sea squirt (Styela clava) with positively charged lysine (K) has an excellent anti-inflammatory effect against an animal model with inflammation response that is caused by antibiotics-resistant bacteria, and exhibits almost no cytotoxicity. Thus, CSP-4 peptide as a clavaspirin peptide analogue of the present invention can be advantageously used as an effective ingredient of a pharmaceutical composition, a cosmetic composition, a food additive, or the like for preventing or treating an inflammatory disorder. 1. A composition for preventing or alleviating an inflammatory disorder , comprising a clavaspirin peptide analogue having the amino acid sequence of SEQ ID NO: 2 as an effective ingredient.2. A functional health food comprising the composition of .35-. (canceled)6. A pharmaceutical comprising the composition of .710-. (canceled)11. An anti-inflammatory drug comprising the composition of .1213-. (canceled)14. A method of preventing or alleviating an inflammatory disorder claim 1 , comprising administering or applying to a subject in need thereof a composition comprising a clavaspirin peptide analogue having the amino acid sequence of SEQ ID NO: 2 as an effective ingredient.15. The method of claim 14 , wherein the inflammatory disorder is caused by bacteria.16. The method of claim 15 , wherein the bacteria are at least one selected from the group consisting of Gram-negative bacteria claim 15 , Gram-positive bacteria and antibiotics-resistant bacteria.17Escherichia coliProteus vulgaris;. The method of claim 16 , wherein Gram-negative bacteria are or{'i': Listeria monocytogenes, Staphylococcus epidermidis, Bacillus subtilis', 'Staphylococcus aureus, 'Gram-positive bacteria are , or ; and'}{'i': 'Staphylococcus aureus', 'the ...

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24-02-2022 дата публикации

SEMICONDUCTOR DEVICE WITH LOW-K SPACER

Номер: US20220059543A1
Принадлежит:

A semiconductor device includes: a semiconductor device, comprising: a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate; a storage node contact plug that is spaced apart from the bit line structure; a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and a seed liner that is positioned between the conformal spacer and the bit line and thinner than the conformal spacer. 1. A semiconductor device , comprising:a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate;a storage node contact plug that is spaced apart from the bit line structure;a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; anda seed liner that is positioned between the conformal spacer and the bit line,wherein the seed liner is thinner than the conformal spacer.2. The semiconductor device of claim 1 , wherein the conformal spacer and the seed liner directly contact each other claim 1 ,3. The semiconductor device of claim 1 , wherein the conformal spacer has a lower dielectric constant than the seed liner.4. The semiconductor device of claim 1 , wherein the conformal spacer includes an impurity-containing silicon-based dielectric material including an impurity of at least one of carbon claim 1 , or boron.5. The semiconductor device of claim 1 , wherein the conformal spacer includes at least one of SiC claim 1 , SiCO claim 1 , SiCN claim 1 , SiOCN claim 1 , SiBN or SiBCN.67. The semiconductor device of claim 1 , wherein the seed liner includes silicon nitride. . The semiconductor device of claim 1 , wherein the seed liner has a thickness of approximately 1 to approximately 20 Å.8. The semiconductor device of claim 1 , wherein the seed liner directly contacts the bit line and the bit line ...

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19-02-2015 дата публикации

DETECTING METHOD OF ABNORMALITY OF MACHINE TOOL OPERATION

Номер: US20150051728A1
Принадлежит:

Provided is a detecting method of abnormality of a machine tool operation, and the detecting method includes a preparing step S; a reference waveform obtaining step S of measuring a drive voltage and a drive current, while machining the material in a normal state of the machine tool, and obtaining a reference waveform; a monitoring section setting step S of setting a monitoring section and thus automatically calculating a maximum load value and a minimum load value; a permissible limit setting step S of setting maximum and minimum permissible limits; and a monitoring step S of obtaining a machining load generated and determining whether a difference between maximum and minimum load values of the machining load is out of the maximum or minimum permissive limit and then outputting normality or abnormality thereof. 1. A detecting method of abnormality of a machine tool operation , which detects chucking miss of a material , wear and damage of a tool or the like , comprising:{'b': '100', 'a preparing step S of setting a kind of tool and a machining process at a host computer in a state that a current sensor and a voltage sensor are installed at a power line of a motor drive unit of the machine tool and connected to a sensor processor, and the sensor processor is connected to a monitoring controller, and the monitoring controller is connected to the host computer and a machine tool controller;'}{'b': '200', 'a reference waveform obtaining step S of measuring a drive voltage and a drive current using the current sensor and the voltage sensor, while machining the material in a normal state of the machine tool, and obtaining a reference waveform which functions as a standard for determining abnormality of the tool;'}{'b': 300', '200, 'a monitoring section setting step S of setting a monitoring section with respect to the reference waveform obtained in the reference waveform obtaining step S and thus automatically calculating a maximum load value and a minimum load value ...

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26-02-2015 дата публикации

SEMICONDUCTOR DEVICE WITH AIR GAP

Номер: US20150056801A1
Принадлежит: SK HYNIX INC.

A method of fabricating a semiconductor device may include forming isolation structures that include openings, over a substrate; forming sacrificial spacers on sidewalks of the openings; forming, on the sacrificial spacers, first conductive patterns that are recessed in the openings; removing the sacrificial spacers, and defining air gaps; forming a liner layer that caps the first conductive patterns and the air gaps; forming second conductive patterns through silicidation of the liner layer; and forming third conductive patterns over the second conductive patterns. 1. A method of fabricating a semiconductor device , comprising , the method comprising:forming isolation structures that include openings, over a substrate;forming sacrificial spacers on sidewalls of the openings;forming, on the sacrificial spacers, recessed first conductive patterns in the openings;removing the sacrificial spacers to define air gaps;forming a liner layer to cap the first conductive patterns and the air gaps;forming second conductive patterns through silicidation of the liner layer; andforming third conductive patterns over the second conductive patterns.2. The method according to claim 1 , wherein claim 1 , before the forming the liner layer claim 1 , the method further comprises:forming a capping layer over an entire surface of the first conductive patterns and the air gap to cap the air gaps; andforming capping patterns to expose surfaces of the first conductive patterns and cap the air gaps, through etching of the capping layer.3. The method according to claim wherein the forming the liner layer comprises:forming a polysilicon layer over an entire surface of the capping layer, the first conductive patterns and the air gap to cap the air gaps.4. The method according to claim wherein the forming the second conductive patterns comprises:forming a metal layer over the liner layer;silicidation-reacting the metal layer and the liner layer through annealing; andremoving any unreacted metal ...

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25-02-2021 дата публикации

SHARK FIN ANTENNA FOR VEHICLE

Номер: US20210057805A1
Принадлежит:

Disclosed is a shark fin antenna for a vehicle. The shark fin antenna has a pad and a base disposed on the pad to provide a space for a printed circuit board and a plurality of antenna components. The shark fin antenna includes a holder having a groove therein for exposing at least a portion of an upper surface of a printed circuit board, a first antenna unit supported by the holder and having an antenna pattern formed on a surface thereof to receive an AM/FM frequency band signal, a first auxiliary unit covering at least a portion of an upper surface of the first antenna unit, and a spring mounted in the groove to elastically support the first auxiliary unit and the first antenna unit in a vertical direction of the upper surface of the printed circuit board. 1. A shark fin antenna for a vehicle , wherein the shark fin antenna has a pad and a base disposed on the pad to provide a space for a printed circuit board and a plurality of antenna components , the shark fin antenna comprising:a holder having a groove therein for exposing at least a portion of an upper surface of a printed circuit board;a first antenna unit supported by the holder and having an antenna pattern formed on a surface thereof to receive an AM/FM frequency band signal;a first auxiliary unit covering at least a portion of an upper surface of the first antenna unit; anda spring mounted in the groove to elastically support the first auxiliary unit and the first antenna unit in a vertical direction of the upper surface of the printed circuit board.2. The shark fin antenna for a vehicle according to claim 1 , wherein the first antenna unit includes a fixing hole penetrating through the first antenna unit on a side thereof claim 1 , and one end of the spring may be inserted into the fixing hole.3. The shark fin antenna for a vehicle according to claim 2 , wherein the spring is electrically connected to the antenna pattern of the first antenna unit.4. The shark fin antenna for a vehicle according to ...

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05-06-2014 дата публикации

SCANNER FOR AUTOMATICALLY DETECTING OBJECT TO BE SCANNED AND SCANNING METHOD USING SAME

Номер: US20140153067A1
Автор: Lah Jong Kook
Принадлежит: WISECUBE CO., LTD.

A scanner for automatically detecting a scan target includes a transparent scan region configured to support the target, an image sensor including a light source for irradiating light toward the scan region and a light receiving element array for sensing the incident light through the scan region, a drive unit configured to linearly move the sensor across the scan region, and a control unit that controls the sensor and the drive unit. The control unit controls the light source of the sensor and the drive unit such that the sensor moves to a detection position and then the array senses the incident light through the scan region with the light source turned on and off. The control unit compares output signals of the array obtained by turning on and off the light source and automatically determines, based on the comparison, whether the target is placed in the scan region. 1. A scanner for automatically detecting a scan target , comprising:a transparent scan region configured to support the scan target;an image sensor including a light source for irradiating light toward the scan region and a light receiving element array for sensing the light incident thereon through the scan region;a drive unit configured to linearly move the image sensor across the scan region; anda control unit configured to control the image sensor and the drive unit,wherein the control unit is configured to control the light source of the image sensor and the drive unit such that the image sensor moves to a detection position and then the light receiving element array senses the light incident thereon through the scan region with the light source turned on and off, the control unit configured to compare output signals of the light receiving element array obtained by turning on and off the light source and to automatically determine, based on a result of the comparison, whether the scan target is placed in the scan region.2. The scanner of claim 1 , wherein the control unit is configured to ...

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12-06-2014 дата публикации

Semiconductor package and method for routing the package

Номер: US20140159237A1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A semiconductor package having improved performance and reliability and a method of fabricating the same are provided. The semiconductor package includes a processing chip including a first pin at a first side to output a first signal, and a second pin at a second side to output a second signal different from the first signal, and a substrate having the processing chip thereon, the substrate including a first bump ball electrically connected to the first pin and a second bump ball electrically connected to the second pin, wherein the first bump ball and the second bump ball are adjacent at one of the first and second sides of the substrate.

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26-03-2015 дата публикации

Method and system for testing semiconductor device

Номер: US20150084667A1
Автор: Kie-Bong Ku, Lee-Bum Lee
Принадлежит: SK hynix Inc

A method for testing a semiconductor device includes testing the semiconductor device in a plurality of operation modes sequentially, and programming the semiconductor device to operate in at least one of the operation modes when the semiconductor device passes the testing.

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12-06-2014 дата публикации

ALUMINUM ALLOY

Номер: US20140161662A1
Принадлежит: HYUNDAI MOTOR COMPANY

Disclosed is an aluminum alloy, which is made of a composition including about 0.7˜7.5 wt % of Ti, about 0.2˜1.5 wt % of B and a residue of Al as a main component, wherein the aluminum alloy is formed by melting the composition at about 950˜1000° C. 1. An aluminum alloy , which is made of a composition comprising about 0.7˜7.5 wt % of Ti , about 0.2˜1.5 wt % of B and a residue of Al as a main component , wherein the aluminum alloy is formed by melting the composition at about 950˜1000° C.2. An aluminum alloy , which is made of a composition comprising about 5˜10 wt % of Ti , about 0.2˜1.5 wt % of B and a residue of Al as a main component , wherein a ratio of Ti to B is about 3.5˜5:1.3. The aluminum alloy of claim 1 , wherein the melting temperature is maintained for about 20˜30 minutes.4. The aluminum alloy of claim 2 , wherein the aluminum alloy is formed by melting the composition at about 950˜1000° C.5. The aluminum alloy of claim 4 , wherein the melting temperature is maintained for about 20˜30 minutes.6. A method of forming an aluminum alloy comprising:Providing a composition comprising about 0.7˜7.5 wt % of Ti, about 0.2˜1.5 wt % of B and a residue of Al as a main component; andmelting the composition at about 950˜1000° C.7. The method of claim 6 , wherein a ratio of Ti to B is about 3.5˜5:1.8. The method of claim 6 , wherein the melting temperature is maintained for about 20˜30 minutes. This application claims under 35 U.S.C. §119(a) the benefit of Korean Patent Application No. 10-2012-0143353 filed Dec. 11, 2012, the entire contents of which are incorporated herein by reference.1. Technical FieldThe present invention relates to an aluminum alloy, particularly an aluminum allow whose physical properties are improved by controlling the shape of coarse AlTi contained therein.2. Description of the Related ArtIn conventional aluminum alloys, the amount of AlTi added is restricted because of the shape of AlTi. The reason for this is that the elongation rate of an ...

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23-03-2017 дата публикации

Light emitting diode having vertical topology and method of making the same

Номер: US20170084789A1
Принадлежит: LG ELECTRONICS INC, LG Innotek Co Ltd

A light emitting device can include a supporting layer; a semiconductor structure including: an active layer between first-type and second-type semiconductor layers, a first top surface and a first bottom surface, and a side surface between the first top and bottom surfaces, which is inclined; a first electrode between the supporting and semiconductor layers; a connection metal layer having a first portion between the first electrode and the supporting layer, which includes a stepped portion having a upper portion contacting the first electrode, and a second portion of the connection metal layer extends beyond the semiconductor structure; and a passivation layer extending from the second portion of the connection metal layer to the side surface of the semiconductor structure, which includes a second bottom surface contacting the second portion of the connection metal layer; and a second top surface opposite to the second bottom surface.

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19-06-2014 дата публикации

APPARATUS FOR DISPERSING NANOCOMPOSITE MATERIAL

Номер: US20140169123A1
Автор: LEE Jong Kook
Принадлежит: HYUNDAI MOTOR COMPANY

Disclosed herein is an apparatus for dispersing a nanocomposite material. That apparatus includes an inner chamber in which a metal powder, a nanocomposite material and inner pellets are charged. The inner chamber also includes a plurality of apertures each having a smaller diameter than that of each inner pellet. Furthermore, the apparatus includes an outer chamber that surrounds the inner chamber and includes outer pellets in a space between a wall of the inner chamber and a wall of the outer chamber. 1. An apparatus for dispersing a nanocomposite material , comprising:an inner chamber in which a metal powder, a nanocomposite material and a plurality of inner pellets are charged, wherein the inner chamber includes a plurality of apertures each having a smaller diameter than each of the inner pellets; andan outer chamber that surrounds the inner chamber, wherein the outer chamber includes a plurality of outer pellets in a space between a wall of the inner chamber and a wall of the outer chamber.2. The apparatus of claim 1 , wherein a diameter of each aperture is about 3˜10 times larger than the diameter of the metal powder.3. The apparatus of claim 1 , wherein a diameter of each inner pellet is about 10˜200 times larger than the diameter of the metal powder.4. The apparatus of claim 1 , wherein the plurality of outer pellets are larger than the plurality of inner pellets.5. The apparatus of claim 1 , wherein a diameter of each outer pellet is about 200˜1000 times larger than the diameter of the metal powder.6. The apparatus of claim 1 , further comprising:a controller configured to rotate the inner chamber and the outer chamber.7. The apparatus of claim 6 , wherein the controller is configured to rotate the inner chamber and the outer chamber to obtain a mixing time in the inner chamber of about 5˜300 minutes and a mixing time in the outer chamber of about 5˜180 minutes.8. The apparatus of claim 1 , further comprising:an outermost chamber that surrounds the outer ...

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21-04-2016 дата публикации

SYSTEM FOR PRODUCING HEAT SOURCE FOR HEATING OR ELECTRICITY USING MEDIUM/LOW TEMPERATURE WASTE HEAT, AND METHOD FOR CONTROLLING THE SAME

Номер: US20160109138A1
Принадлежит: Posco Energy Co., Ltd.

A system for producing a heat source for heating or electricity, using medium/low-temperature waste heat includes: an absorption-type heat pump () supplied with a driving heat source and heat source water to heat a low-temperature heat medium; a regenerator heat exchange unit () for supplying a regenerator () with a driving heat source using waste heat; an evaporator heat exchange unit () for supplying an evaporator with heat source water; a heat medium circulation line () for circulating a heat medium; a generation unit () branching off from the heat medium circulation line () and producing electricity; a heat production unit () branching off from the heat medium circulation line () and supplying a heat-demanding place with a heat source for heating; and a switching valve unit () for controlling the flow of heat medium supplied the generation unit () or the heat production unit (). 1. A system for producing a heat source for heating or electricity , using medium- or low-temperature waste heat , the system comprising:an absorption-type heat pump supplied with a driving heat source and heat source water to increase a temperature of a low-temperature heat medium to a high temperature by means of absorption heat in an absorber and condensation heat in a condenser and to discharge the heat medium;a regenerator heat exchange unit for supplying a regenerator with a driving heat source using medium- or low-temperature waste heat; an evaporator heat exchange unit for supplying an evaporator with heat source water;a heat medium circulation line of a closed loop structure for circulating a heat medium that is heated by passing through the absorber and the condenser;a generation unit branching off from the heat medium circulation line to undergo indirect heat exchange with the high-temperature heat medium and to drive a steam turbine on the basis of a Rankine cycle, thereby producing electricity;a heat production unit branching off from the heat medium circulation line to ...

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10-07-2014 дата публикации

INTEGRATED CIRCUIT PACKAGE

Номер: US20140191378A1
Принадлежит: TEXAS INSTRUMENTS INCORPORATED

An integrated circuit (IC) package including a bottom leadframe, an interposer mounted on the bottom leadframe, a flipchip die mounted on the interposer and a top leadframe electrically connected to the interposer. Also, a method of making an integrated circuit (IC) package including electrically and physically attaching a die to an interposer, attaching the interposer to a bottom leadframe, attaching a discrete circuit component to the interposer and attaching a top leadframe to the bottom leadframe. 1. An integrated circuit (IC) package comprising:a bottom leadframe;an interposer mounted on said bottom leadframe;a flipchip die mounted on said interposer; anda top leadframe electrically connected to said interposer.2. The IC package of further comprising at least one field-effect transistor (FET) mounted on said interposer.3. The IC package of wherein said top leadframe is electrically connected to said bottom leadframe and said at least one FET.4. The IC package of comprising at least one passive circuit device mounted on said top leadframe.5. The IC package of wherein said passive circuit device is electrically connected to said top leadframe.6. The IC package of comprising a molding layer covering said at least one passive circuit device and portions of said top and bottom leadframes.7. The IC package of claim 1 , said bottom leadframe comprising a central pad portion.8. The IC package of claim 7 , said interposer being mounted on said bottom leadframe central pad portion and having an interposer leadframe.9. The IC package of claim 7 , said top leadframe comprising a plurality of leads claim 7 , at least one of said plurality of leads being connected to said interposer leadframe.10. The IC package of said flipchip die comprising a plurality of metal bumps claim 9 , said metal bumps being connected to said interposer leadframe.11. The IC package of claim 10 , said at least one FET being connected to said interposer leadframe.12. The IC package of at least one of ...

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31-07-2014 дата публикации

APPARATUS FOR PICKING, PLACING AND PRESSING SEMICONDUCTOR COMPONENTS

Номер: US20140212246A1
Автор: LEE HENG LEE
Принадлежит: EXIS TECH SDN BHD

An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components () is disclosed. The apparatus () comprises a motor for generating power to rotate a turret () which holds a plurality of pick up heads (), a plurality of pressers (), wherein each of said pressers () is a voice coil assembly () which consist of voice coil actuator assemblies (), at least one stationary frame () to secure said voice coil assemblies () and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (). When current flows into voice coil in said voice coil actuator assembly (), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads () located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads. The pressing force, speed and direction of each actuator can be controlled individually. Furthermore, this invention includes safety measures wherein a real time actuator position feedback system is used to confirm the displacement of said actuators and an urging device () is used to return the actuators back to their original position in the event of power outage. 110. An apparatus for picking and placing or for picking and transferring or for picking , placing and pressing semiconductor components () comprising:{'b': '5', 'a motor in a housing () and a rotor shaft extending there out, said rotor shaft oriented vertically downward;'}{'b': 6', '7', '6, 'a turret () with a plurality of spaced apart pick up heads () mounted thereon, said turret () mounted on said rotor shaft with its vertical axis coaxial with vertical axis of said rotor shaft and rotatable horizontally about the axis of said rotor shaft;'}{'b': 1', '6, 'a first stationary horizontal frame () located vertically above said turret ();'}{'b': 8', '1, 'a ...

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17-05-2018 дата публикации

Aluminum Alloy for Cylinder Head

Номер: US20180135152A1
Принадлежит:

Disclosed herein is an aluminum alloy for a cylinder head. The aluminum alloy according to an embodiment comprises, by weight, Si: 4.5˜5.0%, Cu: 3.0˜4.0%, Fe: 0.2˜0.5%, Mn: 0.02% or less (exclusive of 0%), Mg: 0.1˜0.3%, Zr: 0.1% or less (exclusive of 0%), Cr: 0.1˜0.2%, and a balance of Al and inevitable impurities to form 100%, with a reinforcing phase of Al(Fe,Cr)Si ranging from to to 2.3%. 1. An aluminum alloy comprising , by weight , Si: 4.5˜5.0% , Cu: 3.0˜4.0% , Fe: 0.2˜0.5% , Mn: 0.02% or less (exclusive of 0%) , Mg: 0.1˜0.3% , Zr: 0.1% or less (exclusive of 0%) , Cr: 0.1˜0.2% , and a balance of Al and inevitable impurities to form 100% , with a reinforcing phase of Al(Fe ,Cr)Si ranging from 1.0 to 2.3%.2. The aluminum alloy of claim 1 , having a thermal conductivity of 185 W/mK or higher at 200° C.3. The aluminum alloy of claim 1 , having a tensile strength of 290 MPa or higher.4. The aluminum alloy of claim 1 , having a weight ratio of Fe/Cr ranging from 1.0 to 2.5.5. The aluminum alloy of claim 4 , having a thermal conductivity of 185 W/mK or higher at 200° C.6. The aluminum alloy of claim 4 , having a tensile strength of 290 MPa or higher.7. The aluminum alloy of claim 1 , wherein the reinforcing phase of Al(Fe claim 1 ,Cr)Si is polygonal.8. The aluminum alloy of claim 7 , having a thermal conductivity of 185 W/mK or higher at 200° C.9. The aluminum alloy of claim 7 , having a tensile strength of 290 MPa or higher.10. The aluminum alloy of claim 7 , having a weight ratio of Fe/Cr ranging from 1.0 to 2.5.11. The aluminum alloy of claim 1 , wherein the aluminum alloy has a thermal conductivity of 185 W/mK or higher at 200° C. and a tensile strength of 290 MPa or higher.12. The aluminum alloy of claim 11 , having a weight ratio of Fe/Cr ranging from 1.0 to 2.5.13. The aluminum alloy of claim 11 , wherein the reinforcing phase of Al(Fe claim 11 ,Cr)Si is polygonal.14. A cylinder head for an automotive engine claim 11 , the cylinder head comprising an aluminum ...

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04-06-2015 дата публикации

Preparation of Technetium-99M Tricarbonyl Labeled Glycine Monomer or Oligomer Containing Probes That Have Biomolecules and Its Application as Imaging Complex-Composition

Номер: US20150151011A1
Принадлежит: KOREA ATOMIC ENERGY RESEARCH INSTITUTE

Disclosed is a technetium-99m-labeled glycine oligomer associated with imaging probes for biomolecules of interest. The glycine oligomer can be readily synthesized in a single process using an automated peptide synthesizer. The technetium-99m tricarbonyl-labeled glycine oligomers can be useful as a radiotracer for gamma or SPECT imaging apparatus. The technetium-99m tricarbonyl-labeled glycine oligomers can be applied to various peptidyl biomolecules such as RGD peptide, somatostatin, neurotensin, etc., and exhibit rapid renal clearance without being excessively retained within the body. 1. A method for preparing a technetium-99m-labeled monomer or oligomer , comprising:a) synthesizing a technetium-99m tricarbonyl precursor; andb) labeling a glycine monomer or oligomer with the technetium-99m tricarbonyl precursor.2. The method of claim 1 , wherein the glycine oligomer is a glycine trimer or a glycine pentamer.3. The method of claim 1 , wherein the glycine monomer or oligomer is further conjugated into a targeted peptide.4. The method of claim 3 , wherein the targeted peptide is selected from the group consisting of an RGD peptide (arginylglycylaspartic acid) claim 3 , neurotensin claim 3 , somatostatin claim 3 , angiotensin claim 3 , luteinizing hormone releasing hormone claim 3 , insulin claim 3 , oxytocin claim 3 , neurokinin-1 claim 3 , vasoactive intestinal peptide claim 3 , substance P claim 3 , neuropeptide Y claim 3 , endothelin A claim 3 , endothelin B claim 3 , bradykinin claim 3 , interleukin-1 claim 3 , epidermal growth factor claim 3 , cholecystokinin claim 3 , galanin claim 3 , melanocyte-stimulating hormones claim 3 , lanreotide claim 3 , octreotide claim 3 , and arginine-vasopressin. The present invention relates to a method for preparing a technetium-99m tricarbonyl-labeled glycine monomer or oligomer in a single process using automated peptide synthesis, and an imaging contrast composition containing the technetium-99m tricarbonyl-labeled glycine ...

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04-06-2015 дата публикации

N2,N4-BIS(4-(PIPERAZINE-1-YL)PHENYL)PIRIMIDINE-2,4-DIAMINE DERIVATIVE OR PHARMACEUTICALLY ACCEPTABLE SALT THEREOF, AND COMPOSITION CONTAINING SAME AS ACTIVE INGREDIENT FOR PREVENTING OR TREATING CANCER

Номер: US20150152069A1
Принадлежит:

Disclosed herein are a new N2,N4-bis(4-(piperazin-1-yl)phenyl)pyrimidin-2,4-diamine derivative or a pharmaceutically acceptable salt thereof and a pharmaceutical composition for the prevention or treatment of cancers containing the same as an active ingredient. The compound of the present invention has excellent inhibitory effects against the activities of anaplastic lymphoma kinase (ALK) and activated cdc42-associated kinase (ACK1) and thus can improve the therapeutic effects on the treatment of cancer cells having anaplastic lymphoma kinase fusion proteins such as EML4-ALK and NPM-ALK, and also effectively prevent the recurrence of cancers thus being useful as a pharmaceutical composition for the prevention and treatment of cancers. 2. The N2 ,N4-bis(4-(piperazin-1-yl)phenyl)pyrimidin-2 ,4-diamine derivative or a pharmaceutically acceptable salt thereof ,{'sup': 1', '2', '6', '7', '8, 'wherein Rand Rare independently H, —ORor —NRR,'}{'sup': 6', '7', '8, 'where Ris methyl, ethyl, propyl, isopropyl, butyl, isobutyl or t-butyl unsubstituted or substituted with at least one selected from the group consisting of chloro, bromo, fluoro, iodine, and phenyl, Rand Rare independently H; methyl; ethyl; propyl; isopropyl; butyl; isobutyl; t-butyl; methylcarbonyl; ethylcarbonyl; propylcarbonyl; isopropylcarbonyl; butylcarbonyl; isobutylcarbonyl or phenyl;'}{'sup': 4', '5', '9', '10', '9', '10, 'sub': '2', 'Rand Rare independently H; methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, —C(═O)Ror —SO—Runsubstituted or substituted with hydroxyl, wherein Ris methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, methyloxy, ethyloxy, propyloxy, isopropyloxy, butyloxy, isobutyloxy, t-butyloxy, hydroxymethyl, hydroxyethyl, hydroxypropyl, hydroxyisopropyl, hydroxybutyl, hydroxyisobutyl, amino, methylamino, ethylamino, propylamino, isopropylamino, butylamino or isobutylamino, Ris methyl, ethyl, propyl, isopropyl, butyl, isobutyl, t-butyl, or amino; and'}{'sup': '3', 'Ris ...

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21-08-2014 дата публикации

METHOD AND SYSTEM FOR ADVERTISEMENT OF MAP USING VIRTUAL POI (POINT OF INTEREST)

Номер: US20140236689A1
Автор: HAN Jong Kook
Принадлежит: THINKWARE SYSTEMS CORPORATION

An advertisement system of a map using a virtual POI according to one embodiment of the present invention comprises a map database including map data; a membership database including advertisement display configuration information; a virtual POI database where stored are information about virtual advertisement POI and advertisement location which is the location of the virtual advertisement POI; and a virtual world generation module, generating an image map based on the map data and searching the image map for a virtual advertisement POI associated with a location which can be displayed on the image map and corresponding to the advertisement display configuration information; and displaying the virtual advertisement POI on the advertisement location of the image map. 1. An advertisement system for implementing , on a computer system , a map using a virtual POI , said system comprising:a map database stored on a computer readable medium, said map database including map data;a membership database stored on a computer readable medium, said membership database including advertisement display configuration information;a virtual POI database stored on a computer readable medium, said membership database including stored information about virtual advertisement POI and advertisement location, which is the location of the virtual advertisement POI; anda virtual world generation module for generating an image map based on the map data and searching the image map for a virtual advertisement POI associated with a location that can be displayed on the image map and that corresponds to the advertisement display configuration information; anddisplaying the virtual advertisement POI on the advertisement location of the image map.2. The system of claim 1 , wherein the virtual world generation module displays the virtual advertisement POI on the image map in such a way that the virtual advertisement POI includes advertisement contents.3. The system of claim 1 , wherein the virtual ...

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17-06-2021 дата публикации

LIGHTING-EMITTING DEVICE FILAMENT

Номер: US20210183829A1
Принадлежит: SEOUL SEMICONDUCTOR CO., LTD.

A light emitting device filament includes a substrate, light emitting device chips, two electrode pads, and connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extends in a first direction and has a width in a second direction. The light emitting device chips are disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The connection lines electrically connect the light emitting device chips and the electrode pads. At least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction. 1. A light emitting device filament , comprising:a substrate comprising a first surface and a second surface opposite to the first surface, the substrate extending in a first direction and having a width in a second direction;light emitting device chips disposed on the first surface of the substrate;two electrode pads disposed on the substrate; andconnection lines electrically connecting the light emitting device chips and the electrode pads;wherein at least one of the connection lines includes a first portion extending in the first direction and a second portion extending in the second direction.2. The light emitting device filament of claim 1 , wherein the substrate has a flexibility.3. The light emitting device filament of claim 2 , wherein the substrate comprises a polymer claim 2 , a metal claim 2 , or a metal alloy.4. The light emitting device filament of claim 1 , further comprising a first insulating layer disposed on the first surface and covering the light emitting device chips.5. The light emitting device filament of claim 4 , wherein the first insulating layer is a light conversion layer that converts a wavelength of a light emitted from the light emitting device chip.6. The light emitting device filament of claim 5 , wherein the light conversion layer comprises a fluorescent ...

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18-06-2015 дата публикации

Door division channel for a vehicle

Номер: US20150165884A1
Принадлежит: Hyundai Motor Co, SEJIN CO Ltd

A door division channel for a vehicle is provided between a sliding glass and a fixed glass of the vehicle to support the respective glasses. The door division channel includes an inner panel and an outer panel which are connected to upper and lower ends of a glass frame to cover a gap between the sliding glass and the fixed glass at the indoor side and the outdoor side of the vehicle, respectively; an inner elongation part of the inner panel elongating to the outer panel through the gap; and an outer elongation part of the outer panel elongating to the inner panel through the gap to couple with the inner elongation part.

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18-06-2015 дата публикации

METHOD FOR PRODUCING NANO-CARBON COMPOSITE

Номер: US20150167116A1
Принадлежит:

A method for producing a nano-carbon composite is provided. The method includes mixing nano-carbon powder and matrix alloy powder by milling, to provide a mixed powder and substantially evenly penetrating the nano-carbon powder inside of the matrix alloy by milling the mixed powder. In addition, the method includes clustering the mixed powder by milling the mixed powder slower than in the penetrating process. 1. A method for producing a nano-carbon composite , comprising:mixing nano-carbon powder and matrix alloy powder by milling, to provide a mixed powder;substantially evenly penetrating the nano-carbon powder inside of the matrix alloy powder by milling the mixed powder; andclustering the mixed powder by milling the mixed powder slower than in the penetrating process.2. The method for producing the nano-carbon composite of claim 1 , wherein the nano-carbon powder includes at least one of a group selected of: carbon nano tube (CNT) and carbon nano fiber (CNF).3. The method for producing the nano-carbon composite of claim 1 , wherein the milling condition in the mixing step is about 40 to 60 RPM for about 8 to 11 hours.4. The method for producing the nano-carbon composite of claim 1 , wherein the milling condition in the penetrating step is about 500 to 700 RPM for about 2 to 3 hours.5. The method for producing the nano-carbon composite of claim 1 , wherein the milling RPM in the clustering step is about 75 to 85% of the milling RPM in the penetrating step.6. The method for producing the nano-carbon composite of claim 1 , wherein the milling condition in the clustering step is about 450 to 500 RPM for about 40 to 70 min.7. The method for producing the nano-carbon composite of claim 1 , wherein the matrix alloy powder is aluminum alloy powder.8. The method for producing the nano-carbon composite of claim 1 , wherein the nano-carbon composite includes particles in a size of about 400 μm or greater. The present application claims priority of Korean Patent Application ...

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18-06-2015 дата публикации

METHOD OF PRODUCING POROUS ALUMINUM

Номер: US20150167119A1
Автор: LEE Jong Kook
Принадлежит:

A method of producing a porous aluminum is provided. The method includes preparing a powder mixture of at least one of Al and an Al alloy and carbon nanoparticles and melting the powder mixture. In addition, the method includes oxidizing the melt using oxygen bubbling and solidifying the melt. 1. A method of producing porous aluminum , comprising:preparing a powder mixture of at least one of aluminum (Al) and Al alloy and carbon nanoparticles;melting the powder mixture to obtain a melt;oxidizing the melt using oxygen bubbling; andsolidifying the melt.2. The method of claim 1 , wherein in preparing the powder mixture claim 1 , at least one of Al and Al alloy in a powder phase is mixed with the carbon nanoparticles.3. The method of claim 1 , wherein in preparing the powder mixture claim 1 , the powder mixture is compacted in a pellet form.4. The method of claim 2 , wherein the Al or Al alloy powder has a diameter of about 1000 μm or less.5. The method of claim 1 , wherein in preparing the powder mixture claim 1 , the powder mixture has a particle size of about 200 μm or less.6. The method of claim 1 , wherein in melting the mixture claim 1 , the powder mixture is melted together with an Al ingot.7. The method of claim 1 , wherein in melting the mixture claim 1 , the powder mixture is melted together with calcium (Ca).8. The method of claim 7 , wherein the Ca is used in an amount of about 1 to 2 wt %.9. The method of claim 1 , wherein the melting the powder mixture is performed at about 600 to 1100° C.10. The method of claim 1 , wherein the oxidizing is performed by stirring the melt while performing oxygen bubbling. This application claims the benefit of Korean Patent Application No. 10-2013-0155322, filed on Dec. 13, 2013, entitled “Method for producing porous aluminum,” which is hereby incorporated by reference in its entirety into this application.The present invention relates to a method of producing a porous aluminum (Al) as an ultralight Al material for reducing ...

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18-06-2015 дата публикации

SEMICONDUCTOR DEVICE WITH AIR GAP

Номер: US20150171014A1
Принадлежит:

A method of fabricating a semiconductor device may include forming isolation structures that include openings, over a substrate; forming sacrificial spacers on sidewalls of the openings; forming, on the sacrificial spacers, first conductive patterns that are recessed in the openings; removing the sacrificial spacers, and defining air gaps; forming a liner layer that caps the first conductive patterns and the air gaps; forming second conductive patterns through silicidation of the liner layer; and forming third conductive patterns over the second conductive patterns. 120-. (canceled)21. A semiconductor device , including isolation structures having openings exposing surface portions of a substrate , and conductive structures formed in the openings , the conductive structures comprising:recessed first conductive patterns formed in the openings;air gaps defined between sidewalls of the openings and the recessed first conductive patterns;capping patterns to cap the air gaps;second conductive patterns formed over top surfaces of the first conductive patterns and the capping patterns and on upper sidewalls of the openings, the second conductive patterns including a metal silicide; andthird conductive patterns formed over the second conductive patterns.22. The semiconductor device according to claim 21 , wherein the conductive structures comprise plugs.23. The semiconductor device according to claim 21 , wherein the metal silicide comprises a silicide of a polysilicon layer.24. The semiconductor device according to claim 21 , wherein the first conductive patterns comprise a polysilicon layer claim 21 , and the third conductive patterns comprise a metal layer.25. The semiconductor device according to claim 21 , wherein the isolation structures comprise a silicon nitride.26. A semiconductor device comprising:a plurality of conductive structures formed over a substrate, the plurality of conductive structures including conductive patterns;protective spacers formed on sidewalls ...

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25-06-2015 дата публикации

WEAVING METHOD AND APPARATUS FOR PERFORMING THE SAME

Номер: US20150174830A1
Принадлежит:

Disclosed are a method of spinning a continuous fiber without a mandrel to manufacture a hollow cylinder part and an apparatus for manufacturing the hollow cylinder part using the same method. 1. A method of weaving a fiber impregnated with resin to manufacture a three-dimensional hollow fiber structure ,wherein the fiber impregnated with resin is spun within a mold to seat on an internal surface of the mold,wherein a spinning unit spinning the fiber moves along and rotates about a traveling shaft within the mold,wherein the fiber is spun in the circumferential direction by a centrifugal force, andwherein the three-dimensional fiber structure is weaved along the internal shape of the mold.2. The method of claim 1 , wherein the method is performed without a mandrel.3. The method of claim 1 , wherein an angular velocity of the spinning unit is accelerated until the spun fiber arrives at an inner wall of the mold.4. The method of claim 1 , wherein a nozzle where the spinning unit spins the fiber is tilted.5. The method of claim 4 , wherein a shape and a density of the hollow fiber structure are determined by a tilting angle of the nozzle when the spinning unit spins the fiber claim 4 , and a velocity of the spinning unit.6. The method of claim 1 , wherein a weaving thickness of the hollow fiber structure is adjusted by moving the spinning unit forward and backward repeatedly.7. The method of claim 1 , further comprises pressing the weaved fiber structure into the mold claim 1 , heat-curing claim 1 , ultraviolet-curing claim 1 , or dehydrating the weaved fiber structure after separation from the mold.8. An apparatus for manufacturing a hollow fiber structure as a weaved fiber impregnated with resin claim 1 , comprising;a nozzle spinning a fiber;a spinning unit coupled with the nozzle, wherein the spinning unit has a hollow central portion, moves forward and backward, rotates about a central shaft, and allows the fiber to move toward the nozzle through the hollow central ...

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23-06-2016 дата публикации

Making a flat no-lead package with exposed electroplated side lead surfaces

Номер: US20160181122A1
Принадлежит: Texas Instruments Inc

A method of making Flat No-Lead Packages with plated lead surfaces exposed on lateral faces thereof. The method includes providing a plurality of Flat No-Lead Packages having severed, unplated lead surfaces exposed on lateral faces thereof and having plated lead surfaces exposed on bottom faces thereof. The method further includes batch electroplating the severed unplated lead surfaces of the plurality of Flat No-Lead Packages.

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21-06-2018 дата публикации

Thermoelectric material and method for preparing the same

Номер: US20180175270A1

Provided herein are a thermoelectric material and a method for preparing the same, wherein the thermoelectric material has excellent thermoelectric performance and high mechanical properties (in particular, fracture toughness), and thus, when the thermoelectric material is applied to a thermoelectric module, the thermoelectric module has excellent performance and efficiency and a long lifespan.

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28-05-2020 дата публикации

LED PACKAGE SET AND LED BULB INCLUDING SAME

Номер: US20200168660A1
Принадлежит:

An LED package set including a substrate, a first LED package disposed on the substrate and including at least one first LED chip, a second LED package disposed on the substrate and including at least one second LED chip, and a resistor disposed on the substrate, connected to the first LED package in series, and connected to the second LED package in parallel, in which the second LED package is connected in parallel to the first LED package and the resistor, and the first LED package and the second LED package are configured to emit light having different color temperatures. 1. An LED package set comprising:a substrate;a first LED package disposed on the substrate and comprising at least one first LED chip;a second LED package disposed on the substrate and comprising at least one second LED chip; anda resistor disposed on the substrate, connected to the first LED package in series, and connected to the second LED package in parallel;wherein the second LED package is connected in parallel to the first LED package and the resistor, and the first LED package and the second LED package are configured to emit light having different color temperatures.2. The LED package set according to claim 1 , wherein:the substrate comprises a pair of electrode pads;each of the first LED package, second LED package, and the resistor includes a first end and a second end opposing the first end;the first end of the first LED package and the first end of the second LED package are connected to one of the pair of electrode pads;the first end of the resistor is connected to the second end of the first LED package; andthe second end of the second LED package and the second end of the resistor are connected to the other one of the pair of electrode pads.3. The LED package set according to claim 1 , wherein light from the first LED package has a higher color temperature than light from the second LED package.4. The LED package set according to claim 3 , wherein a difference in color ...

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13-06-2019 дата публикации

ALUMINUM ALLOY FOR DIE CASTING

Номер: US20190177817A1
Принадлежит:

Disclosed is an aluminum alloy for a die casting. The aluminum alloy includes aluminum (Al) as a base material and magnesium (Mg) in an amount of about 6.8 to 10 wt % thereby exhibiting sufficient aesthetic appearance without performing additional process and improving strength thereof. 1. An aluminum alloy for a die casting , comprising:magnesium (Mg) in an amount of about 6.8 to 10 wt % based on the total weight of the aluminum alloy, andaluminum (Al) as a base material.2. The aluminum alloy of claim 1 , wherein the aluminum alloy comprises MgSi in an amount of about 10 wt % or greater and about 16 wt % or less based on the total weight of the aluminum alloy.3. The aluminum alloy of claim 1 , wherein the aluminum alloy has a color space value of about 3 or greater than a color space value of a ADC alloy claim 1 ,wherein the color space value is calculated by values of L*, a* and b* as defined by a Lab color coordinate, andwherein L* is a value of lightness, a* is a value representing green and red components of light, and b* is a value representing blue and yellow component of light.4. The aluminum alloy for a die casting of claim 3 , wherein a value of b* is less than about 2.5. The aluminum alloy for a die casting of claim 1 , wherein the aluminum alloy comprises claim 1 ,Si in an amount of about 10 wt % or greater and about 12 wt % or less, andCu in an amount of about 1.5 wt % or greater and about 2.5 wt % or less based on the total weight of the aluminum alloy.6. The aluminum alloy for a die casting of claim 5 , wherein the aluminum alloy comprises claim 5 ,Fe in an amount of about 0 wt % greater and about 1 wt % or less,Zn in an amount of about 0 wt % greater and about 1 wt % or less, andunvoidable impurities in an amount about 1 wt % or less based on the total weight of the aluminum alloy.7. A method of manufacturing an aluminum alloy of claim 1 , comprising:combining a magnesium alloy including Al in an amount of about 9 wt % or greater based on the total ...

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07-07-2016 дата публикации

APPARATUS FOR DISPERSING NANOCOMPOSITE MATERIAL

Номер: US20160193577A1
Автор: LEE Jong Kook
Принадлежит:

Disclosed herein is an apparatus for dispersing a nanocomposite material. That apparatus includes an inner chamber in which a metal powder, a nanocomposite material and inner pellets are charged. The inner chamber also includes a plurality of apertures each having a smaller diameter than that of each inner pellet. Furthermore, the apparatus includes an outer chamber that surrounds the inner chamber and includes outer pellets in a space between a wall of the inner chamber and a wall of the outer chamber. 19-. (canceled)10. A non-transitory computer readable medium containing program instructions executed by a processor or controller , the computer readable medium comprising:program instructions that rotate the inner chamber and the outer chamber.11. The non-transitory computer readable medium of claim 10 , further comprising:program instructions that rotate an inner chamber and an outer chamber to obtain a mixing time in the inner chamber of about 5˜300 minutes and a mixing time in the outer chamber of about 5˜180 minutes. 1. Technical FieldThe present invention relates to an apparatus for dispersing a nanocomposite material, which can improve the dispersibility of a metal powder and a nanocomposite material and prevent nanocomposite molecules from being damaged.2. Description of the Related ArtGenerally, a nanocomposite material is mixed with a metal powder to form an alloy. In addition, to ensure the mechanical characteristics of this alloy are maintained or increased, the metal powder and the nanocomposite material must be sufficiently dispersed. Thus, pellets and raw materials (e.g., metal powder, nanoparticles) are charged in a mixing chamber, and then the mixing chamber is rotated to allow the raw materials to be dispersed by a collision with the pellets. Furthermore, the pellets have a substantially uniform size, and the weight ratio of raw materials to pellets is determined based on the collision energy necessary for the raw materials.Moreover, the metal ...

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05-07-2018 дата публикации

JOINING METHOD OF ULTRA HIGH-STRENGTH STEEL AND NON-STEEL MATERIAL THROUGH TAILORED SOFTENING HEAT TREATMENT USING LASER

Номер: US20180185904A1
Принадлежит:

A method of joining of a ultra high-strength steel and a non-steel material through tailored softening heat treatment using a laser, may include forming a tempering portion by performing heat treatment on a lower plate formed of ultra high-strength steel using the laser; stacking an upper plate formed of a non-steel material on the lower plate formed of the ultra high-strength steel; disposing a connection member on the upper plate; and applying force to the connection member to cause the connection member to pass through the upper plate and then to be inserted into the tempering portion of the lower plate to combine the upper plate and the lower plate. 1. A method of joining of a ultra high-strength steel and a non-steel material through tailored softening heat treatment using a laser , the method including:forming a tempering portion by performing heat treatment on a lower plate formed of the ultra high-strength steel using the laser;stacking an upper plate formed of the non-steel material on the lower plate formed of the ultra high-strength steel;disposing a connection member on the upper plate; andapplying force to the connection member to cause the connection member to pass through the upper plate and then to be inserted into the tempering portion of the lower plate to combine the upper plate and the lower plate.2. The method of claim 1 , wherein the ultra high-strength steel is steel having tensile strength of 980 MPa or more.3. The method of claim 1 , wherein the ultra high-strength steel is steel having tensile strength of 1180 MPa or more.4. The method of claim 1 , wherein the ultra high-strength steel is steel having tensile strength of 1470 MPa or more.5. The method of claim 1 , wherein the non-steel material is carbon fiber reinforced plastic (CFRP) or aluminum.7. The method of claim 1 , wherein hardness of the tempering portion is 270 HV to 350 HV.8. The method of claim 1 , wherein the connection member is a self-piercing rivet (SPR). The present ...

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14-07-2016 дата публикации

Packaged semiconductor device having leadframe features preventing delamination

Номер: US20160204052A1
Принадлежит: Texas Instruments Inc

A semiconductor device has a leadframe with a first ( 401 a ) and a parallel second surface, and an assembly pad ( 410 ) bordered by two opposing sides, which include a plurality of through-holes ( 420 ) from the first to the second pad surface. Another pad side includes one or more elongated windows ( 421 ) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads ( 430 ) with opposite elongated sides castellated by indents ( 431 ). Layers ( 440 ) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip ( 450 ) is attached to the pad and wire-bonded ( 460 ) to the bond spots. A package ( 470 ) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.

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18-06-2020 дата публикации

ROSE-GOLD-COLORED COPPER ALLOY AND VEHICLE INTERIOR MATERIAL USING THE SAME

Номер: US20200190629A1
Принадлежит:

A vehicle interior material made of a rose-gold-colored copper alloy may include 0.07 to 0.21 wt % of aluminum (Al), 0.06 to 0.19 wt % of magnesium (Mg), 0.17 to 0.52 wt % of zinc (Zn), and a balance of copper (Cu) and unavoidable impurities, wherein the sum of the aluminum (Al), the magnesium (Mg), and the zinc (Zn) is 0.5 to 1.5 at %. 1. A vehicle interior material made of a rose-gold-colored copper alloy comprising 0.07 to 0.21 wt % of aluminum (Al) , 0.06 to 0.19 wt % of magnesium (Mg) , 0.17 to 0.52 wt % of zinc (Zn) , and a balance of copper (Cu) and unavoidable impurities , wherein the sum of the aluminum (Al) , the magnesium (Mg) , and the zinc (Zn) is 0.5 to 1.5 at %.2. The vehicle interior material of claim 1 , wherein the atomic fraction of aluminum (Al) claim 1 , magnesium (Mg) claim 1 , and zinc (Zn) is 0.5 to 1.5:0.5 to 1.5:0.5 to 1.5.3. The vehicle interior material of claim 1 , wherein the amount of aluminum is smaller than the sum of magnesium and zinc.4. The vehicle interior material of claim 1 , wherein no precipitate or crystallization is formed in the rose-gold-colored copper alloy.5. The vehicle interior material of claim 1 , wherein the rose-gold-colored copper alloy has a thickness of 0.2 mm or less during hot rolling at a reduction rate of 20% at 500° C.6. The vehicle interior material of claim 1 , wherein the rose-gold-colored copper alloy has a surface hardness of 70 Hv or more.7. The vehicle interior material of claim 1 , wherein the rose-gold-colored copper alloy has an L* value of 82.50 to 87.45 claim 1 , an a* value of 13.80 to 15.76 claim 1 , and a b* value of 16.90 to 19.72 in the CIE Lab color space.8. A rose-gold-colored copper alloy comprising:0.07 to 0.21 wt % of aluminum (Al);0.06 to 0.19 wt % of magnesium (Mg);0.17 to 0.52 wt % of zinc (Zn); anda balance of copper (Cu) and unavoidable impurities,wherein the sum of the aluminum (Al), the magnesium (Mg), and the zinc (Zn) is 0.5 to 1.5 at %.9. The rose-gold-colored copper alloy ...

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30-07-2015 дата публикации

STACKED SEMICONDUCTOR SYSTEM HAVING INTERPOSER OF HALF-ETCHED AND MOLDED SHEET METAL

Номер: US20150214198A1
Принадлежит:

A semiconductor system () has a flat interposer () with a first surface () in a first plane, a second surface () in a parallel second plane, and a uniform first height () between the surfaces; the interposer is patterned in metallic zones separated by gaps (), the zones include metal of the first height and metal of a second height () smaller than the first height; an insulating material fills the gaps and the zone differences between the first and the second heights. Semiconductor chips of a first () and a second () set have first terminals attached to metallic zones of the first interposer surface while the chips of the second set have their second terminals facing away from the interposer. A first leadframe () is attached to the second terminals of the second set chips, and a second leadframe () is attached to respective metallic zones of the second interposer surface. 1. An interposer for semiconductor devices comprising;a flat sheet having a first surface in a first plane, a second surface in a parallel second plane, and a uniform first height between the surfaces;the sheet patterned in metallic zones separated by gaps, the zones including metal of the first height and metal of a second height smaller than the first height; andan insulating material filling the gaps and zone differences between the first and the second heights.2. The interposer of wherein the metal of the zones is selected from a group including copper claim 1 , aluminum claim 1 , iron-nickel alloys claim 1 , and Kovar™.3. The interposer of wherein the insulating material is a molding compound.4. The interposer of wherein the first height is between about 100 and 300 μm.5. A method for fabricating an interposer for semiconductor devices claim 1 , comprising the steps of:providing a flat sheet of metal having a first height, a first surface in a first plane, and a second surface in a second plane;patterning the sheet into a plurality of metal zones separated by gaps;starting from the second ...

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04-07-2019 дата публикации

Integrated circuit package with lead lock

Номер: US20190206770A1
Принадлежит: Texas Instruments Inc

In a described example, a packaged integrated circuit (IC) includes a lead frame with a lead and with an IC chip mount pad. A portion of the lead adjacent to the IC chip mount pad is mechanically deformed to form a lead lock. An integrated circuit chip is mounted on a first side of the IC chip mount pad; and the integrated circuit chip, the IC chip mount pad, and the portion are covered in molding compound.

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02-08-2018 дата публикации

External diagnostics and module status change devices for battery modules

Номер: US20180217208A1
Принадлежит: LG Chem Ltd

Provided is an apparatus for battery diagnosis and module state change device capable of receiving power from a battery module through a connector connection with a battery module and operating, changing a diagnosis reference value for diagnosing, by a battery management system (BMS), a battery, and changing a setting value of the BMS to change a use of the battery module.

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23-10-2014 дата публикации

FLIP-CHIP SEMICONDUCTOR PACKAGE

Номер: US20140312489A1
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A flip-chip semiconductor package is provided that includes a semiconductor chip, a package substrate having a chip attachment surface on which bond sites are formed, and bumps attached to an active surface of the semiconductor chip and bonded to the bond sites, wherein the bond sites are radially arranged around a middle portion of the package substrate. 1. A flip-chip semiconductor package , comprising:a semiconductor chip;a package substrate having a chip attachment surface on which bond sites are formed; andbumps attached to an active surface of the semiconductor chip and bonded to the bond sites,wherein the bond sites are radially arranged around a middle portion of the package substrate.2. The flip-chip semiconductor package according to claim 1 , further comprising conductive leads formed on the chip attachment surface of the package substrate claim 1 ,wherein the bond sites exist on the conductive leads.3. The flip-chip semiconductor package according to claim 1 , further comprising a solder mask layer formed on the chip attachment surface of the package substrate claim 1 ,wherein the solder mask layer has openings formed at the bond sites.4. The flip-chip semiconductor package according to claim 3 , wherein the bond sites include a bond site claim 3 , disposed at the middle portion of the package substrate claim 3 , that does not come into contact with the solder mask layer.5. The flip-chip semiconductor package according to claim 3 , wherein the bond sites include bond sites claim 3 , arranged in a vertical direction along the middle portion of the package substrate claim 3 , that do not come into contact with the solder mask layer.6. The flip-chip semiconductor package according to claim 1 , wherein a cross-sectional length of each bond site at a first distance in a horizontal direction from the middle portion is longer than a cross-sectional length of each bond site at a second distance in the horizontal direction from the middle portion claim 1 , the ...

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23-10-2014 дата публикации

TECHNETIUM-99M LABELED COMPLEX OF GOLD NANOPARTICLE-GOLD BINDING PEPTIDES, AND METHOD OF MAKING AND USING THE SAME

Номер: US20140314668A1
Принадлежит: KOREA ATOMIC ENERGY RESEARCH INSTITUTE

There is provided a method for preparing a Tc labeled gold nanoparticles-gold binding peptide, including: (a) coating gold nanoparticles with a gold binding peptide; and (b) labeling a composed Tc tricarbonyl precursor on the gold binding peptide coated on the gold nanoparticles. The Tc labeled gold nanoparticles-gold binding peptide prepared by the method according to the present invention is expected to be usefully employed for manufacturing a molecular contrast agent (imaging agent) which is traceable in organisms using imaging apparatuses such as gamma imaging and single photon emission computed tomography due to high labeling yield and good in-vivo stability. 1. A method of preparing a technetium-99m labeled complex of gold nanoparticle-gold binding peptides , the method comprising:mixing gold nanoparticles with gold binding peptides to attach gold binding peptides to a surface of a gold nanoparticle; andlabeling with a technetium-99m tricarbonyl precursor at least part of the gold binding peptides attached to the gold nanoparticle.2. The method of claim 1 , wherein the gold binding peptides comprise an amino acid sequence of SEQ ID No. 1.3. A technetium-99m labeled complex of gold nanoparticle-gold binding peptides claim 1 , the complex comprising:a gold nanoparticle;gold binding peptides attached onto a surface of the gold nanoparticle; anda technetium-99m labeling connected to at least part of the gold binding peptides.4. A molecular imaging agent comprising the technetium-99m labeled complex of gold nanoparticle-gold binding peptides of .5. A nuclear medicine imaging contrast agent comprising the technetium-99m labeled complex of gold nanoparticle-gold binding peptides of .6. A method of molecular imaging claim 3 , the method comprising:{'claim-ref': {'@idref': 'CLM-00004', 'claim 4'}, 'administering the molecular imaging agent of to a subject in need of such imaging; and'}monitoring behavior of the agent in the subject using an imaging system. This ...

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09-07-2020 дата публикации

BULB-TYPE LIGHT SOURCE

Номер: US20200217460A1
Принадлежит: SEOUL SEMICONDUCTOR CO., LTD.

A bulb-type light source includes a globe transmitting a light and at least one light emitting device filament disposed in the globe. The light emitting device filament includes a substrate including n (n is a natural number equal to or greater than 2) flat portions and n-1 bendable portions disposed between the flat portions, a plurality of light emitting device chips disposed on the flat portions, a fluorescent substance layer covering each light emitting device chip and converting a wavelength of a light from each light emitting device chip, and a connection line disposed on the flat portions and electrically connecting the light emitting device chips adjacent to each other between the adjacent light emitting device chips. 1. A bulb-type light source comprising:a globe transmitting a light; and a substrate comprising n (n is a natural number equal to or greater than 2) flat portions and n-1 bendable portions disposed between the flat portions;', 'a plurality of light emitting device chips disposed on the flat portions;', 'a fluorescent substance layer covering one or more light emitting device chips and converting a wavelength of a light from the light emitting device chip; and', 'a connection line disposed on the flat portions and electrically connecting the light emitting device chips adjacent to each other between the adjacent light emitting device chips., 'at least one light emitting device filament disposed in the globe, the light emitting device filament comprising2. The bulb-type light source of claim 1 , wherein the substrate comprises at least one notch defined in the bendable portions claim 1 , and at least one light emitting device chip is disposed in each flat portion.3. The bulb-type light source of claim 2 , wherein the connection line comprises one or more connection lines that have different widths from each other at the bendable portion.4. The bulb-type light source of claim 2 , wherein the connection line has a zigzag shape at the bendable ...

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09-07-2020 дата публикации

Lighting-emitting device filament

Номер: US20200219857A1
Принадлежит: Seoul Semiconductor Co Ltd

A light emitting device filament includes a substrate having a first surface and a second surface opposite to the first surface and extending in one direction, at least one light emitting device chip disposed on the first surface, and an auxiliary pattern disposed on the second surface and disposed at a position corresponding to the light emitting device chip.

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18-08-2016 дата публикации

Multilevel Leadframe

Номер: US20160240390A1
Принадлежит: Texas Instruments Inc

A method for forming a multilevel leadframe for an integrated circuit is provided. A conductive sheet is etched from one side to form a thinner region within a frame region for leads lines and bond pads. The conductive sheet is etched to form a plurality of bond pads in a first level of the thinner region arranged in at least a first row and a second row. Each bond pad has a pad width and is separated from an adjacent bond pad by a bond pad clearance distance. The conductive sheet is etched from an opposite side to form a plurality of lead lines in a second level of the thinner region having a line width and is separated from an adjacent lead line by at least a lead line clearance distance. Each bond pad of the second plurality of bond pads is connected to one of the plurality of lead lines on the second level that is routed between adjacent bond pads in the first row, so that the lead lines are routed on a different level from the bond pads.

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18-08-2016 дата публикации

DEVICE AND METHOD FOR CONVEYING AND FLIPPING A COMPONENT

Номер: US20160240416A1
Автор: LEE HENG LEE
Принадлежит:

The present invention relates to a device () and method for conveying and flipping a component () for use in conjunction with a rotary turret module (). The device () includes at least a pair of spaced apart flipping arms, a first and second flipping arms ( and ) mounted on a platform (). Each of the flipping arms () is provided with one nozzle () having one end () configured to pick the component () and another end () fixedly mounted on a shaft () supported on the flipping arm () and is operatively connected to a rotary actuating means (). The rotary actuating means () is adapted to be capable of affecting a rotational motion of the shaft (), thereby rotating the nozzles () in a counter direction by substantially degrees. The device is also provided with a linear actuating means () suitably mounted on the platform (). The linear actuating means () is operatively connected to at least one of to the flipping arms ( or and ) and is adapted to be capable of moving the flipping arm () or arms ( and ) in a horizontal direction so as to position the nozzles () substantially proximate to each other for transferring of the component () between the nozzles () and thereby, flipping the component () at 180 degrees. 1110301. A device () for conveying and flipping a component () for use in conjunction with a rotary turret module () , the device () includes{'b': 100', '300', '100', '300', '500', '100', '300', '110', '100', '310', '300', '111', '311', '10', '113', '311', '130', '330', '110', '310', '130', '330', '130', '330', '100', '300', '150', '350', '150', '350', '130', '330', '130', '330', '110', '310, 'at least a pair of spaced apart flipping arms (, ), a first flipping arm () and a second flipping arm (), mounted on a platform (); wherein each of the flipping arms (, ) is provided with one nozzle, a first nozzle () associated with the first flipping arm () and a second nozzle () associated with the second flipping arm (), each having one end (, ) configured to pick the ...

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17-09-2015 дата публикации

LINERLESS PRESSURE VESSEL BY CENTRIFUGAL FORCED WEAVING AND METHOD FOR MANUFACTURING THEREOF

Номер: US20150258740A1
Принадлежит:

A method and an apparatus for manufacturing a linerless pressure vessel can be used for manufacturing a high pressure tank, by spinning of continuous fiber in a centrifugal direction. 1. A method for manufacturing a linerless high pressure tank installed with a three-dimensional blow fibrous structure woven with resin-impregnated fiber , comprising:the resin-impregnated fiber being spun in a mold that is blow-shaped and settled in an inner surface of the mold;a spinning unit spinning the fiber moves and rotates along a moving shaft in the mold;the spinning is conducted in a circumferential direction by centrifugal force; andthe three-dimensional blow fibrous structure is woven along an inner profile of the mold.2. The method of claim 1 , wherein an angular velocity of the spinning in the circumferential direction is accelerated until the spun fiber reaches the inner surface of the mold.3. The method of claim 1 , wherein a nozzle as a unit where the fiber is spinning at the spinning unit is tilted.4. The method of claim 1 , wherein the woven shape of the blow fibrous structure and a density thereof are estimated by a path of the spinning fiber claim 1 , a tilting angle of the nozzle as a unit where the fiber is spinning at the spinning unit claim 1 , a moving velocity of the spinning unit claim 1 , and an internal shape of the mold.5. The method of claim 1 , wherein a woven thickness of the blow fibrous structure becomes thicker as the spinning unit moves forward and backward repeatedly along the moving shaft.6. The method of claim 1 , further comprising:compressing the textiles into the mold after weaving, or curing by heat, UV, or dehydration after being released from the mold.7. The method of claim 1 , wherein the resin is at least one thermosetting resin selected from the group consisting of: isophthalic polyesters claim 1 , vinyl esters claim 1 , epoxies claim 1 , polyesters claim 1 , and polyurethanes.8. The method of claim 1 , wherein the fiber is carbon fiber ...

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17-09-2015 дата публикации

AC-DRIVEN LED LIGHTING APPARATUS WITH MULTI-CELL LED

Номер: US20150264764A1
Принадлежит:

A light-emitting diode (LED) lighting apparatus includes a rectification unit connected to an alternating current (AC) power source, and an LED light emitting module including m multi-cell LEDs each having n light emitting cells, klight emitting cells of the respective m multi-cell LEDs being connected to each other in series to form a klight emitting cell group, n being a positive integer of 2 or greater, m being a positive integer of 1 or greater, and k being a positive integer from 1 to n. The rectification unit is configured to supply a rectified voltage to the LED light emitting module through full-wave rectification of an AC voltage from the AC power source. The LED light emitting module is configured to emit light upon receiving the rectified voltage from the rectification unit, and to control sequential driving of first to nlight emitting cell groups according to a voltage level of the rectified voltage. 1. A light-emitting diode (LED) lighting apparatus , comprising:a rectification unit connected to an alternating current (AC) power source; and{'sup': th', 'th, 'an LED light emitting module comprising m multi-cell LEDs each comprising n light emitting cells, klight emitting cells of the respective m multi-cell LEDs being connected to each other in series to form a klight emitting cell group, n being a positive integer of 2 or greater, m being a positive integer of 1 or greater, and k being a positive integer from 1 to n,'}wherein:the rectification unit is configured to supply a rectified voltage to the LED light emitting module through full-wave rectification of an AC voltage from the AC power source;the LED light emitting module is configured to emit light upon receiving the rectified voltage from the rectification unit; and{'sup': 'th', 'the LED light emitting module is configured to control sequential driving of first to nlight emitting cell groups according to a voltage level of the rectified voltage.'}2. The LED lighting apparatus according to claim 1 ...

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06-09-2018 дата публикации

MCU WAKE-UP DEVICE AND METHOD IN SLEEP MODE

Номер: US20180253137A1
Принадлежит: LG CHEM, LTD.

The present invention provides a device and method for waking up an MCU of a BMS operating in a sleep mode. 1. An MCU wake-up device of a BMS , the device comprising:an MCU power generation unit configured to supply power to an MCU of the BMS;an external power source connected to a first switching unit and a second switching unit to apply a predetermined voltage to the first switching unit and the second switching unit;a first switching unit configured to control connection between the external power source and the MCU power generation unit; anda second switching unit configured to control on or off of the first switching unit;wherein when the external power source is simultaneously applied to the first switching unit and the second switching unit, the first switching unit is turned on and after a predetermined time, and the second switching unit is turned on to turn off the first switching unit, such that the MCU power generation unit provides wake-up power to the MCU only while the first switching unit is turned on.2. The MCU wake-up device of claim 1 , wherein the first switching unit comprises a first FET claim 1 ,wherein a drain terminal of the first FET is connected to an output terminal of the external power source, a source terminal is connected to the MCU power generation unit, and a gate terminal is connected to an output terminal of the external power source and a drain terminal of a second FET.3. The MCU wake-up device of claim 2 , wherein the second switching unit comprises:a second FET;a resistor having a predetermined resistance value; anda capacitor having a predetermined capacitance,wherein a drain terminal of the second FET is connected to a gate terminal of the first FET, a gate terminal is connected to an output terminal of the external power source, a resistor having the predetermined resistance value, and a capacitor having the predetermined capacitance, and a source terminal is connected to ground.4. The MCU wake-up device of claim 3 , ...

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13-09-2018 дата публикации

SEMICONDUCTOR DEVICE

Номер: US20180261616A1
Принадлежит:

A semiconductor device comprises a plurality of stack structures that include gate electrodes sequentially stacked on a substrate and are disposed along a first direction, and a plurality of separating insulation layers each of which is disposed between the stack structures. A plurality of vertical pillars penetrate each of the stack structures and are connected to the substrate. A plurality of bit lines are disposed on the vertical pillars and run across the stack structures in the first direction. A plurality of bit line contact structures connect the vertical pillars to the bit lines. A plurality of first cell dummy lines are disposed on the plurality of separating insulation layers and extend in a second direction crossing the first direction. 1. A semiconductor device , comprising:a plurality of stack structures that include gate electrodes sequentially stacked on a substrate and disposed along a first direction;a plurality of separating insulation layers each of which is disposed between the stack structures;a plurality of vertical pillars that penetrate each of the stack structures and are connected to the substrate;a plurality of bit lines that are disposed on the vertical pillars and run across the stack structures in the first direction;a plurality of bit line contact structures that connect the vertical pillars to the bit lines; anda plurality of first cell dummy lines that are disposed on the plurality of separating insulation layers and extend in a second direction crossing the first direction.2. The semiconductor device of claim 1 , wherein each of the bit line contact structures comprises:a bit line lower contact coupled to its underlying vertical pillar; anda bit line upper contact directly connecting the bit line lower contact,wherein the first cell dummy lines have top surfaces higher than a top surface of the bit line lower contact and lower than a top surface of the bit line upper contact.3. The semiconductor device of claim 2 , wherein the top ...

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13-08-2020 дата публикации

NOVEL ANTIMICROBIAL PEPTIDE FROM SKATE SKIN AND USES THEREOF

Номер: US20200254057A1

A method for treating a microorganism or inflammation caused by the microorganism includes administering or applying a composition comprising an antimicrobial peptide with the amino acid sequence of SEQ ID NO: 1 to a subject in need thereof. Because the antimicrobial peptide with the amino acid sequence of SEQ ID NO: 1 exhibits an excellent antimicrobial activity against Gram-negative bacteria and Gram-positive bacteria and also low cytotoxicity for human erythrocytes, it can be advantageously used for various applications. 113-. (canceled)14: A method for treating a microorganism or inflammation caused by the microorganism , the method comprising administering or applying a composition comprising an antimicrobial peptide with the amino acid sequence of SEQ ID NO: 1 to a subject in need thereof.15: The method of claim 14 , wherein the microorganism comprises at least one of Gram-negative bacteria and Gram-positive bacteria.16EscherichiaPseudomonas aeruginosaAcinetobacter baumannii.: The method of claim 14 , wherein the microorganism comprises Gram-negative bacteria selected from the group consisting of colt claim 14 , claim 14 , and17Escherichia coli.: The method of claim 14 , wherein the microorganism comprises18Pseudomonas aeruginosa.: The method of claim 14 , wherein the microorganism comprises19Acinetobacter baumannii.: The method of claim 14 , wherein the microorganism comprises20Staphylococcus aureus.: The method of claim 14 , wherein the microorganism comprises21: The method of claim 14 , wherein the composition is an antibiotic composition comprising the antimicrobial peptide and antibiotics other than the antimicrobial peptide.22: The method of claim 21 , wherein the antibiotics comprises at least one selected from the group consisting of aminoglycoside-based antibiotics claim 21 , penicillin-based antibiotics claim 21 , sulfonamide-based antibiotics claim 21 , beat-lactam based antibiotics claim 21 , chloramphenicol-based antibiotics claim 21 , ...

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13-08-2020 дата публикации

COATING COMPOSITION HAVING EXCELLENT CORROSION RESISTANCE AND FINGERPRINT RESISTANCE, STAINLESS STEEL SHEET HAVING ETCHING PATTERNS, AND MANUFACTURING METHOD THEREFOR

Номер: US20200255687A1
Принадлежит:

Provided is a coating composition having excellent corrosion resistance and fingerprint resistance, and also provides a stainless steel sheet having etching patterns and a manufacturing method therefor, the stainless steel sheet comprising: a stainless steel sheet; a coating layer, which is formed on the stainless steel sheet and is a cured product of the coating composition; and a quenching coated film layer formed on the coating layer and having a quenching effect, wherein: the coating layer, formed by curing the coating composition having excellent corrosion resistance and fingerprint resistance, is transparent and has high gloss, thereby having an effect of enabling the surface characteristics of the stainless steel sheet to be expressed as they are; the stainless steel sheet having etching patterns has excellent corrosion resistance and fingerprint resistance even on the parts thereof on which the etching patterns are not formed. 1. A coating composition comprising: 10 to 30 wt % of a silane-based compound , 0.5 to 6 wt % of an organic acid , 0.1 to 3 wt % of a vanadium compound , 0.1 to 3 wt % of a magnesium compound , and a remainder of a solvent.2. The coating composition of claim 1 , further comprising: 1 to 2 wt % of a wetting agent claim 1 , and 0.01 to 1 wt % of a defoamer.3. The coating composition of claim 1 , wherein the silane-based compound is one or more selected from the group consisting of epoxy-based silane and amino-based silane.4. The coating composition of claim 1 , wherein the organic acid is one or more selected from the group consisting of formic acid claim 1 , acetic acid and phosphoric acid.5. A stainless steel sheet having etching patterns claim 1 , comprising:a stainless steel sheet;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a coating layer, formed on the stainless steel sheet, and comprising a cured product of the coating composition of ; and'}a quenching coated film layer, formed on the coating layer and having a quenching ...

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20-09-2018 дата публикации

COMMUNICATION TERMINATING RESISTANCE AUTOMATIC SETTING METHOD OF ENERGY STORAGE SYSTEM

Номер: US20180269543A1
Принадлежит: LG CHEM, LTD.

The present invention relates to a method of automatically setting a communication resistance of an energy storage device (ESS), and more particularly, to a method of automatically controlling connection of a battery module and a terminating resistance by using a battery management system (BMS) ID allocated to each battery module constituting the ESS. 1. A connection system of a battery module and a terminating resistance of an energy storage system (ESS) including a plurality of battery modules , the connection system comprising:a master battery management system (BMS) configured to allocate IDs to a plurality of slave modules connected to a master module, calculate the number of all the battery modules through this, and transmit the number to the respective slave modules;a slave BMS configured to compare whether the number of all the battery modules received from the master BMS matches the allocated corresponding ID;a first terminating resistance connected to the lowest slave BMS included in the slave module connected to the lowest one of the plurality of slave modules; anda control unit configured to compare whether the number of all the battery modules matches a corresponding ID and output a connection control signal for controlling a connection of the lowest slave BMS and the first terminating resistance according to a comparison result.2. The connection system of claim 1 , wherein the comparing of whether the number of all the battery modules matches the corresponding ID is performed by the lowest slave BMS.3. The connection system of claim 1 , further comprising a connection switch for connecting or disconnecting the connection between the lowest slave BMS and the first terminating resistance according to a control signal outputted from the control unit.4. The connection system of claim 3 , wherein the control unit outputs an ON signal for connecting the lowest slave BMS and the first terminating resistance to a connection switch if it is determined that the ...

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11-11-2021 дата публикации

Bulb-type light source

Номер: US20210348725A1
Принадлежит: Seoul Semiconductor Co Ltd

A lighting device includes a substrate having a plurality of flat portions and a non-flat portion disposed between the flat portions, a plurality of light emitting sources disposed on the substrate, a fluorescent substrate layer covering one or more light emitting sources and converting a wavelength of a light from the light emitting source, and a connection line disposed on the substrate and electrically connecting the light emitting sources adjacent to each other between the adjacent light emitting sources. The substrate has a first end and a second end are arranged at different distance from a central axis.

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15-10-2015 дата публикации

NANOCARBON-REINFORCED ALUMINIUM COMPOSITE MATERIALS AND METHOD FOR MANUFACTURING THE SAME

Номер: US20150292070A1
Принадлежит:

A nanocarbon-reinforced aluminum composite material and a method of manufacturing the same are provided. The method of manufacturing a nanocarbon-reinforced aluminum composite material is characterized in that composite powder, in which ceramic-coated nanocarbon is surrounded by metal powder, is added to molten aluminum and then casting the molten aluminum with the added composite powder. 1. A method of manufacturing a nanocarbon-reinforced aluminum composite material , comprising:adding composite powder, in which ceramic-coated nanocarbon is surrounded by metal powder, to molten aluminum; andcasting the molten aluminum with the added composite powder.2. The method of claim 1 , further comprising steps of:prior to adding the composite powder to molten aluminum and casting the molten aluminum with the added composite powder,coating nanocarbon with ceramic; andmixing the ceramic-coated nanocarbon with metal powder to prepare the composite powder such that the ceramic-coated nanocarbon is surrounded by the metal powder.3. The method of claim 2 , wherein the nanocarbon includes at least one selected from the group consisting of carbon nanotube claim 2 , carbon nanofiber claim 2 , and graphene; andthe ceramic includes at least one selected from the group consisting of oxide, carbide, nitride, and boride.4. The method of claim 3 , wherein the metal powder is aluminum or a metal alloyed with the aluminum or reacted with the aluminum to form an intermetallic compound.5. The method of claim 1 , wherein the ceramic-coated nanocarbon is mixed with the metal powder by ball milling such that the ceramic-coated nanocarbon is surrounded by the metal powder.6. A nanocarbon-reinforced aluminum composite material claim 1 , manufactured by adding composite powder claim 1 , in which ceramic-coated nanocarbon is surrounded by metal powder claim 1 , to molten aluminum claim 1 , and then casting the molten aluminum with the added composite powder. The present application claims the ...

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09-12-2021 дата публикации

SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE

Номер: US20210384213A1
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region,; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region. 1. A semiconductor memory device comprising:a substrate including a cell region and a connection region;a first word line stack including a first ground selection line, a plurality of first word lines on the first ground selection line, and a first string selection line on the plurality of first word lines, the plurality of first word lines extending to the connection region:a second word line stack including a second ground selection line, a plurality of second word lines on the second ground selection line, and a second string selection line on the plurality of second word lines, the plurality of second word lines extending to the connection region:vertical channels in the cell region, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; andbit lines connecting the vertical channels,wherein the first ground selection line and the second ground selection line are connected via a local planarized region.2. The semiconductor memory device of claim 1 , wherein each of the first ground selection line and the second ground selection line has a recess that is laterally recessed on a side thereof near the ...

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04-10-2018 дата публикации

METHOD FOR PREVENTING DUPLICATE ALLOCATION OF ID TO BATTERY MODULES

Номер: US20180287218A1
Принадлежит: LG CHEM, LTD.

The present disclosure relates to a method for preventing duplicate allocation of an ID to battery modules, and in particularly, to a method for preventing duplicate allocation of an ID to battery modules wherein an ID is prevented from being allocated in a duplicated manner by diagnosing each state where the ID is to be allocated in a duplicated manner. 1. A method for preventing duplicate allocation of an ID , which prevents duplicate allocation of an ID at a time of sequentially and automatically allocating IDs to battery modules configured in plurality , the method comprising:an ID allocation checking process for checking whether IDs are respectively allocated to battery modules, when external power is input;an ID deletion process for deleting the IDs of all the ID-allocated battery modules, when it is checked that there is a battery module to which an ID is not allocated in the ID allocation checking process; anda battery module termination process for terminating all the battery modules so as to enable IDs of the battery modules to be reallocated, after the IDs allocated to all the ID-allocated battery modules are deleted in the ID deletion process,wherein when it is checked that the IDs are allocated to all the battery modules in the ID allocation checking process, the IDs allocated already are used.2. The method of claim 1 , wherein the ID allocation checking process further comprises a use number checking process for checking a pre-stored number of battery modules to be used claim 1 , wherein it is checked whether the IDs as many as the number of battery modules to be used are allocated.3. The method of claim 1 , wherein in the ID allocation checking process claim 1 , whether the ID is allocated is checked by receiving an ID response signal through a communication connector.4. The method of claim 3 , wherein the communication connector is connected only to a battery module to be driven.5. A method for preventing duplicate allocation of an ID claim 3 , which ...

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13-10-2016 дата публикации

Flippable leadframe for packaged electronic system having vertically stacked chips and components

Номер: US20160300784A1
Принадлежит: Texas Instruments Inc

A leadframe ( 100 ) for electronic systems comprising a first sub-leadframe ( 110 ) connected by links ( 150 ) to a second sub-leadframe ( 120 ), the first and second sub-leadframe connected by tiebars ( 111, 121 ) to a frame ( 130 ); and each link having a neck ( 151 ) suitable for bending the link, the necks arrayed in a line ( 170 ) operable as the axis for bending the second sub-leadframe towards the first sub-leadframe with the necks operable as rotation pivots.

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19-10-2017 дата публикации

SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE

Номер: US20170301684A1
Принадлежит:

A semiconductor memory device includes: a substrate including a cell region and a connection region; a first word line stack comprising a plurality of first word lines that extend to the connection region and are stacked on the cell region; a second word line stack comprising a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line being adjacent to the first word line stack; vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines; a bridge region that connects the first word lines of the first word line stack with the second word lines of the second word line stack; and a local planarized region under the bridge region. 1. A semiconductor memory device comprising:a substrate including a cell region and a connection region;a first word line stack including a plurality of first word lines that extend to the connection region and are stacked on the cell region;a second word line stack including a plurality of second word lines that extend to the connection region and are stacked on the cell region, the second word line stack being adjacent to the first word line stack;vertical channels in the cell region of the substrate, the vertical channels being connected to the substrate and coupled with the plurality of first and second word lines;a bridge region that connects the first word lines of the first word line stack with the corresponding second word lines of the second word line stack; anda local planarized region under the bridge region.2. The semiconductor memory device of claim 1 , further comprising:a first ground selection line under the first word lines; anda second ground selection line under the second word lines,wherein the first ground selection line and the second ground selection line are isolated from one another by the local planarized region.3. The semiconductor memory ...

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17-09-2020 дата публикации

Led lighting apparatus having improved color lendering and led filament

Номер: US20200295237A1
Принадлежит: Seoul Semiconductor Co Ltd

A lighting apparatus including at least one light emitting diode (LED) chip configured to emit blue light; a green phosphor having a light emission peak in a range of 500 nm to 550 nm; and a red phosphor having a light emission peak in a range of 600 nm to 650 nm, in which the red phosphor includes a first red phosphor having a light emission peak in a range of 620 nm to 630 nm and a second red phosphor having a light emission peak in a range of 630 nm to 640 nm, and the full widths at half maximum of the first and second red phosphors are in a range of 20 nm to 60 nm, respectively.

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07-12-2017 дата публикации

APPARATUS FOR MANUFACTURING THERMOELECTRIC MODULE

Номер: US20170352793A1
Принадлежит:

An an apparatus for manufacturing a thermoelectric module is provided. The apparatus includes a thermoelectric element interposed between a lower substrate that includes a lower electrode and an upper substrate that includes an upper electrode. Additionally, the apparatus includes a first block that is configured to support the lower substrate and a second block that is configured to move vertically with respect to the first block and support the upper substrate. A jig is configured to position the thermoelectric element in connection with the upper electrode and the lower electrode.

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06-12-2018 дата публикации

Alloy for vehicle garnish and vehicle garnish

Номер: US20180347012A1

Disclosed herein is an alloy for a vehicle garnish, which is made by mixing Cu as a base with Mg and Si to have a composition of CuaMgbSic, wherein the alloy can have a color close to Au and the color of the alloy can be changed, and wherein the allow can also be made to have a low specific gravity and at a low cost.

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14-12-2017 дата публикации

Method for manufacturing transparent pattern print steel plate

Номер: US20170354991A1
Принадлежит: Posco Co Ltd

A method of manufacturing a transparent pattern printed steel plate includes forming a printed paint film layer by jetting transparent ink onto at least one surface of a steel plate, and curing the printed paint film layer with ultraviolet light to form a cured printed paint film layer. Further, a method of manufacturing a transparent pattern printed steel plate includes preparing a steel plate having a color painted film layer formed on at least one surface thereof, forming a printed paint film layer by jetting transparent ink onto the color painted film layer, and curing the printed paint film layer to form a cured printed paint film layer.

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24-06-2014 дата публикации

Chemical mechanical polishing process

Номер: US8759218B2
Принадлежит: United Microelectronics Corp

A chemical mechanical polishing process includes placing a substrate on a first polishing pad of a first platen, wherein the substrate has a bulk metal layer and a barrier layer; polishing the bulk metal layer by using the first polishing pad having a hardness of above 50 (Shore D) until the barrier layer is exposed; polishing the barrier layer on a second polishing pad of a second platen after removing the bulk metal layer, wherein the second polishing pad has a hardness ranging between 40 and 50 (Shore D) and includes an upper layer and a lower backing layer and the upper layer has a hardness less than 50 (Shore D).

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17-05-2007 дата публикации

Chemical mechanical polishing process

Номер: US20070111517A1
Принадлежит: United Microelectronics Corp

A copper/barrier CMP process includes (a) providing a substrate having a bulk metal layer and a barrier layer; (b) polishing the substrate with a first hard polishing pad on a first platen to substantially remove an upper portion of the bulk metal layer, wherein the first hard polishing pad has a hardness of above 50 (Shore D); (c) polishing the substrate with a second hard polishing pad on a second platen to remove residual copper, thereby exposing the barrier layer, wherein the second hard polishing pad has a hardness of above 50 (Shore D); and (d) polishing the substrate with a third hard polishing pad on a third platen to remove the barrier layer, wherein the third hard polishing pad has a hardness ranging between 40-50 (Shore D).

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06-03-2012 дата публикации

Chemical mechanical polishing process

Номер: US8129278B2
Принадлежит: United Microelectronics Corp

A copper/barrier CMP process includes (a) providing a substrate having a bulk metal layer and a barrier layer; (b) polishing the substrate with a first hard polishing pad on a first platen to substantially remove an upper portion of the bulk metal layer, wherein the first hard polishing pad has a hardness of above 50 (Shore D); (c) polishing the substrate with a second hard polishing pad on a second platen to remove residual copper, thereby exposing the barrier layer, wherein the second hard polishing pad has a hardness of above 50 (Shore D); and (d) polishing the substrate with a third hard polishing pad on a third platen to remove the barrier layer, wherein the third hard polishing pad has a hardness ranging between 40-50 (Shore D).

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12-10-2006 дата публикации

Verfahren zum Empfangen von Paketen in einem mobilen Terminal

Номер: DE602004002162D1
Автор: Jong-Kook Kang
Принадлежит: LG ELECTRONICS INC

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09-06-1995 дата публикации

Modulo reduction method using precalculated table in e.g. smart card

Номер: FR2713365A1
Принадлежит: KT Corp

The modulo reduction method operates in several steps. The first step is to look up a value stored in a table with the aid of an index formed of a number of high order bits, and adds the value accessed in the table to a number of low order bits. If the result obtained by the addition produces an overflow, the overflow is suppressed and the operation terminated. If on the other hand overflow does not occur, N on modulo N is added to the result obtained from the addition, and the operation terminated. The value with a most significant bit of one is selected when the value of N is determined by this last operation.

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03-03-2005 дата публикации

Packet receiving method of mobile terminal

Номер: US20050047418A1
Автор: Jong-Kook Kang
Принадлежит: LG ELECTRONICS INC

A packet receiving method of a mobile terminal in which the mobile terminal sets a TCP connection with a server for a packet reception, and a PS (protocol stack) task priority is set to be higher than a UI (user interface) task priority to receive packets. Then, the number of packets stored in a reception queue and signals of a signal queue are monitored while receiving packets. When the number of packets or signals reaches an upper threshold value of a certain level, the UI task priority is altered to be higher than the PS task priority to stop the packet reception and to process the received packets. The number of packets stored in the reception queue and signals of the signal queue is also monitored while processing the packets. When the number of packets or signals reaches a lower threshold value of a certain level, the UI task priority is again altered to be lower than the PS task priority to re-start the packet reception.

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23-05-1997 дата публикации

Modulo reduction process using a pre-calculated table.

Номер: FR2713365B1
Принадлежит: KT Corp

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03-12-2004 дата публикации

CYCLONE DUST COLLECTION DEVICE FOR VACUUM CLEANER

Номер: FR2855388A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

Ce dispositif de collecte de poussière à cyclone comprend un boîtier supérieur (30), dans lequel est formé un orifice d'aspiration d'air, un boîtier inférieur (40) raccordé au boîtier supérieur pour former une chambre de cyclone (34), une unité de guidage (50) disposée entre le boîtier supérieur et le boîtier inférieur et possédant un premier canal pour faire tourbillonner de l'air chargé de saletés introduites par l'orifice d'aspiration de l'air, et un second canal pour évacuer un air purifié, et un ensemble de filtre (60) monté entre l'unité de guidage et le boîtier inférieur, pour retirer des saletés et de la poussière de l'air introduit.Application notamment aux aspirateurs à usage domestique. This cyclone dust collecting device comprises an upper housing (30), in which an air suction port is formed, a lower housing (40) connected to the upper housing to form a cyclone chamber (34), a guide unit (50) disposed between the upper case and the lower case and having a first channel for swirling air laden with dirt introduced through the air suction port, and a second channel for discharging a purified air, and a filter assembly (60) mounted between the guide unit and the lower housing, for removing dirt and dust from the introduced air.Application in particular to household vacuum cleaners.

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03-12-2004 дата публикации

INPUT UNIT FOR VACUUM CLEANER

Номер: FR2855387A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

Cette unité d'entrée comprend un corps d'entrée (110) possédant un orifice d'entrée de la poussière et couplé de façon amovible à un tuyau d'entrée de l'aspirateur, et un corps d'entrée auxiliaire (150) couplé de manière à être déployé et rétracté dans le corps d'entrée (110) de manière à s'adapter d'une manière variable à un coin faisant un angle désiré, et possédant un orifice d'entrée auxiliaire (168) communiquant avec l'orifice d'entrée de la poussière dans une direction de déploiement et de contraction.Application notamment aux aspirateurs à usage domestique.

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05-05-2006 дата публикации

Suction port assembly for use in vacuum cleaner, has noise reducing unit positioned along connection path, and lower housing comprising two suction ports for transmitting suction force to middle and side portions

Номер: FR2877203A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

The assembly has a lower housing with two suction ports. An upper housing is connected to the lower housing thereby forming a connection path with the suction ports. A noise reducing unit (300) is positioned along the connection path, where the connection path is in fluid communication with a vacuum source. Two suction ports (211, 212) are provided to transmit a suction force to a middle portion and side portions. An independent claim is also included for a vacuum cleaner comprising a suction port assembly in fluid communication.

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06-01-2006 дата публикации

DUST COLLECTION DEVICE FOR VACUUM CLEANER

Номер: FR2872403A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

Ce dispositif de collecte de poussières comprend un corps principal (100) ayant un orifice (110) dans lequel de l'air est aspiré et des premier et second orifices (101,102) d'évacuation de l'air, une première unité à filtre (130) disposée entre l'orifice d'aspiration et le premier orifice d'évacuation pour séparer les poussières de l'air par filtrage, et une unité à cyclone (140) disposée entre l'orifice d'aspiration (110) et le second orifice d'évacuation (102) pour évacuer les poussières de l'air sous l'action de la force centrifuge.Application notamment aux aspirateurs comportant un dispositif de collecte de poussières à cyclone. This dust collection device comprises a main body (100) having an orifice (110) into which air is sucked and first and second air evacuation ports (101, 102), a first filter unit ( 130) disposed between the suction port and the first discharge port to separate the dust from the air by filtering, and a cyclone unit (140) disposed between the suction port (110) and the second exhaust port (102) for discharging dust from the air under the action of centrifugal force.Application including vacuum cleaners having a cyclone dust collection device.

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31-10-2006 дата публикации

METHOD OF RECEPTION OF PACKAGES FOR USE IN A MOVEL TERMINAL

Номер: PT1511273E
Автор: Kang Jong-Kook
Принадлежит: LG ELECTRONICS INC

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04-09-2008 дата публикации

A method of removing hemp bast pectin using microorganism

Номер: WO2008105603A1

A method for extracting hemp bast using microorganisms is provided. More particularly, a method for extracting hemp bast using microorganisms by degumming pectin in hemp bast using the microorganisms and degrading the unity of the bast to thereby obtain pure fibers is provided.

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05-01-2006 дата публикации

Dust collecting apparatus for vacuum cleaner

Номер: US20060000195A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

A dust collecting apparatus for use in a vacuum cleaner provides improved suction cleaning efficiency. The dust collecting apparatus includes a main body comprising a suction port through which a dust-laden air is drawn, and a first and a second discharge ports through which filtered air is discharged. A filter unit disposed between the suction port and the first discharge port, filters out dusts from the air. A parallel cyclone unit, disposed between the suction port and the second discharge port, removes dusts from the air by centrifugal force. The first discharge port is larger in sectional area than the second discharge port, and therefore, the filter unit has higher dust removal rate than the cyclone unit in the initial stage of the operation. Accordingly, the dust collecting apparatus can provide greater initial suction cleaning efficiency than a dust collecting apparatus having only the cyclone unit.

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30-03-2023 дата публикации

Led lighting apparatus having improved color lendering and led filament

Номер: US20230099215A1
Принадлежит: Seoul Semiconductor Co Ltd

A lighting device including at least one light emitter to emit blue light, a green phosphor having an emission peak in a range of 500 nm to 550 nm, a yellow phosphor having an emission peak in a range of 550 nm to 600 nm, and a red phosphor having an emission peak in a range of 600 nm to 650 nm, in which the yellow phosphor and the red phosphor have different full widths at half maximum, and the full width at half maximum of the yellow phosphor is longer than that of the red phosphor, and, in an emission spectrum, an intensity of light emitted from the lighting device increases from 500 nm to 600 nm, and the intensity of light emitted from the lighting device at 700 nm is less than about 10% of the maximum intensity of light emitted from the lighting device.

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20-02-2003 дата публикации

Digital video signal interface module for transferring signals to a long distance

Номер: US20030034963A1
Принадлежит: Ophit Co Ltd

The present invention discloses a digital video signal interface module that enables a distance between a computer having a digital video output and a monitor having a digital video input to length and comprises a laser driver and a laser diode receiving digital video signals of Red (R), Green (G), Blue (B), Clock (C) outputted from a computer and converting the signals to a laser singals, respectively; a photodiode (PD) receiving the respective laser signals and restoring to electric signals; a photodiode amplifier amplifying the signals of the photodiode and transferring the signals to a Liquid Crystal Display (LCD) monitor; a plurality of an optic fiber installed between the respective laser diode and the respective phoptodiode and transferring the laser signals; and a power supply line and a ground voltage line installed between the computer and the LCD monitor along the optic fibers and supplying a power voltge to the laser driver and the PD amplifier.

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26-06-2018 дата публикации

Prefillable auto-retractable safety syringe

Номер: US10004853B2
Автор: Lee Lin Lee, Wen-Hsu Chang
Принадлежит: Bencha International Group Inc

A retractable safety syringe includes a retractable needle hub holding a needle and having a first guiding means; and a hollow barrel having a second guiding means set correspondingly to the first guiding means; and a collapsible plunger comprising of a first plunger element having a protrusion releasably coupled with a second plunger element having a longitudinal slot with a pinched zone to curb the movement of said protrusion; and a spring disposed between the needle hub and hollow barrel and acts between the needle hub and the hollow barrel. The uncoupling of the collapsible plunger triggers the retraction mechanism to enable the needle hub to retract into the barrel by the decompression force of a spring. The reliability of retraction is further improved by a longitudinal slot and a protrusion to facilitate the retreating of the collapsible plunger in an orderly way.

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06-01-2006 дата публикации

SUCTION ASSEMBLY FOR VACUUM CLEANER AND VACUUM CLEANER

Номер: FR2872402A1
Принадлежит: Samsung Gwangju Electronics Co Ltd

Cet ensemble d'aspiration (200) comporte des boîtiers supérieur et inférieur (211, 222), un premier et un second orifices d'aspiration formés dans le boîtier inférieur (222), au moins une ouverture supérieure (213) située dans le boîtier supérieur (211), permettant d'extraire de l'air extérieur, et au moins une ouverture inférieure (235) formée dans le boîtier inférieur (222), positionnée entre les premier et second orifices d'aspiration et communiquant avec l'ouverture supérieure.Ainsi, l'air extrait à travers l'ouverture supérieure (213) est dirigé entre les premier et second orifices d'aspiration pour diffuser les poussières à partir de ceux-ci, de sorte que l'efficacité du nettoyage augmente non seulement au niveau des deux côtés (S), mais aussi au niveau du centre (C) de l'ensemble d'aspiration. This suction assembly (200) has upper and lower housings (211, 222), first and second suction ports formed in the lower housing (222), at least one upper opening (213) located in the housing upper (211), allowing outside air to be extracted, and at least one lower opening (235) formed in the lower housing (222), positioned between the first and second suction ports and communicating with the upper opening Thus, the air extracted through the top opening (213) is directed between the first and second suction ports to diffuse dust therefrom, so that the cleaning efficiency increases not only at level on both sides (S), but also level with the center (C) of the suction assembly.

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19-04-2006 дата публикации

Cyclone dust-separating apparatus

Номер: EP1647218A2
Принадлежит: Samsung Gwangju Electronics Co Ltd

A cyclone dust collector (300) comprises a cyclone body (310) including a cyclone chamber (313), a connection path (311) and a dust chamber (315), wherein the cyclone chamber and the dust chamber are arranged in parallel, a cover unit (330) connected to an upper part of the cyclone body (310) and having a suction path (331) for external air to flow in therethrough, and a backflow prevention member (400) disposed at one sidewall of the dust chamber (315) to prevent collected dust from flowing to the cyclone chamber (313).

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14-06-2007 дата публикации

GPON system and method for bandwidth allocation in GPON system

Номер: US20070133989A1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

In a gigabit-capable passive optical network (GPON) system and in a method for bandwidth allocation in a passive optical network (PON) system, a minimum bandwidth is allocated to optical network units (ONUs) for minimal transmission assurance dependent on a traffic characteristic of each ONU, and when there is a traffic-container (T-CONT) class of an ONU not allocated bandwidth after minimum bandwidth allocation to all ONUs, an extra bandwidth remaining after minimum bandwidth allocation is dynamically allocated to each T-CONT class according to a weight of the T-CONT class. Thus, efficient bandwidth allocation, considering fairness between ONUs and priority of each T-CONT, is realized.

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24-11-2011 дата публикации

Semiconductor system with fine pitch lead fingers and method of manufacturing thereof

Номер: US20110285000A1
Принадлежит: Stats Chippac Pte Ltd

A semiconductor package system, and method of manufacturing thereof, includes: an electrical substrate having a contact pad; a support structure having a lead finger thereon; a bump on the lead finger, the bump clamped on a top and a side of the lead finger and connected with the contact pad; and an encapsulant over the lead finger and the electrical substrate.

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21-07-2011 дата публикации

Method of repairing a polymer mask

Номер: TWI345679B
Автор: Jong-Kook Park, Oug-Ki Lee
Принадлежит: Phicom Corp

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