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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 616. Отображено 100.
19-01-2012 дата публикации

IMAGE SENSORS AND FABRICATION METHOD THEREOF

Номер: US20120012959A1
Автор: CHEN Po-Shuo
Принадлежит: VisEra Technologies Company Limited

An image sensor is provided. The image sensor includes a pixel sensor, a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween, and a gapless microlens array comprising a plurality of microlenses formed on the color filter array. The invention also provides a method for fabricating the image sensor. 1. An image sensor , comprising:a pixel sensor;a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween; anda gapless microlens array comprising a plurality of microlenses formed on the color filter array.2. The image sensor as claimed in claim 1 , wherein the color filter in the plurality of color filters comprises a first gap along a row direction claim 1 , a second gap along a column direction and a third gap along a diagonal direction.3. The image sensor as claimed in claim 2 , wherein the first gap is similar to the second gap.4. The image sensor as claimed in claim 2 , wherein the third gap is larger than the first gap and the third gap is larger than the second gap.5. The image sensor as claimed in claim 1 , wherein the color filter is polygonal or rectangular.6. The image sensor as claimed in claim 1 , wherein the microlens comprises photoresist or thermoplastic resins.7. The image sensor as claimed in claim 2 , the microlens on the color filter has a height determined by the first gap claim 2 , the second gap and the third gap.8. The image sensor as claimed in claim 2 , the microlens on the color filter has a slope determined by the first gap claim 2 , the second gap and the third gap.9. A method for fabricating an image sensor claim 2 , comprising:providing a pixel sensor;forming a color filter array comprising a plurality of color filters on the pixel sensor, wherein two adjacent color filters have a gap therebetween;coating a transparent material on the color filter array; ...

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15-03-2012 дата публикации

APPARATUS AND METHOD FOR CULTURING STEM CELLS

Номер: US20120064627A1
Принадлежит:

A method is provided to prepare a plurality of microwells suitable for the formation of embryoid bodies from embryonic stem cells. The method requires applying an image-forming material to a heat sensitive thermoplastic material in a designed pattern and heating the material under conditions that reduce the size of the receptive material by at least about 60% to create a mold. A polymer such as PDMS is then applied to the mold and removed to form the microwells. In an alternative aspect, the plurality of microwells on receptive material are prepared by etching a microwell designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the receptive material by at least about 60%. 1. A method to prepare an apparatus comprising a plurality of wells , this method comprising:a) applying a first material to a second material in a designed pattern, wherein the second material is a thermoplastic material,b) heating the first and second material under conditions that reduce the length and width of the second material by at least 20% and increase the thickness by at least 120% of the area of the second material to which the first material is applied, thereby producing a mold, andc) preparing the plurality of wells on a third material via molding using the mold, thereby preparing the plurality of wells.2. A method according to claim 1 , wherein the second material of step b) is heated under conditions that reduce the length and width of the second material by at least 40% and increase the height by at least 3 times of the area of the second material to which the first material is applied.3. A method according to claim 1 , wherein the molding of step c) is lithography or imprint lithography.4. (canceled)5. A method according to claim 1 , wherein the second material is a polymer or polystyrene.6. (canceled)7. A method according to claim 1 , wherein the third material is a polymer or ...

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26-04-2012 дата публикации

Wireless charging system, battery with wireless charging function and electronic devices with the same

Номер: US20120098484A1
Принадлежит: SAE Magnetics (H.K.) Ltd.

A battery adapted to a wireless charging system which comprises a coil, a PCB, a core, a shield and a case. The coil is configured to induce the magnetic power transmitted from the transmitter of the wireless charging system to generate inductive current. The PCB is electrically connected the coil to transform the inductive current of the coil into electrical power. The core is electrically connected the PCB to store the electrical power. The shield is sandwiched between the coil and the core to protect the core from magnetic power of the transmitter and enhance inductance of the coil; and the case is configured to enclose the coil, the PCB, the core, and the shield therein. The invention also discloses a wireless charging system with such a battery, a electronic device with wireless charging function. 1. A battery adapted to a wireless charging system , the wireless charging system comprising a transmitter for generating and transmitting magnetic power , the battery comprising:a coil, configured to induce the magnetic power transmitted from the transmitter of the wireless charging system to generate inductive current;a PCB, electrically connecting the coil to transform the inductive current of the coil into electrical power;a core, electrically connecting the PCB to store the electrical power;a shield, being sandwiched between the coil and the core to protect the core from magnetic power of the transmitter and enhance inductance of the coil; anda case, configured to enclose the coil, the PCB, the core, and the shield therein.2. The battery as claimed in claim 1 , wherein the coil is printed on the PCB by plating claim 1 , etching or silkscreen processes.3. The battery as claimed in claim 1 , wherein the coil is printed on a FPCB by etching or silkscreen processes and then connected with the PCB.4. The battery as claimed in claim 1 , wherein the coil is metal magnet wire.5. The battery as claimed in claim 1 , wherein the PCB is integrated with a resonant circuit ...

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10-05-2012 дата публикации

Accessing Android Media Resources from Sony Dash

Номер: US20120117184A1
Принадлежит:

A process of accessing media resources on Android capable wireless devices running an i-jetty HTTP server from a personal Internet interface device such as the Sony Dash. Activating a servlet on the Android device to transmit an IP address to a Dash capable device and establishing a wireless communication connection from the Dash device to the Android device using the IP address. Operating a service on the Dash device that accesses multimedia resources on the Android device where the Android device dynamically generates multimedia metadata for extraction and display on the Dash device. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. 1. A process for accessing multimedia resources comprising:initiating an i-jetty HTTP server on a first wireless device;establishing a wireless communication connection from a personal Internet interface client to the first wireless device using the IP address of the first wireless device;initiating a function on the personal Internet interface client that parses and displays multimedia content;sending requests to the i-jetty HTTP server on the first wireless device for the collection of multimedia content and metadata;transmitting the multimedia content and metadata from the first wireless device to the personal Internet client through the use of XML files; andoperating a service on the personal Internet interface client that accesses multimedia resources on the first wireless device where the first wireless device dynamically generates multimedia metadata for transmission to the personal Internet interface client for extraction and display on the mobile device.2. A method for accessing multimedia resources comprising:initiating an HTTP server on a first wireless device;establishing a wireless communication connection from the personal Internet interface device to the first wireless device using the IP address of the first wireless device; andoperating a ...

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17-01-2013 дата публикации

METHOD FOR RECLAIMING HIGH EXPLOSIVE FROM WARHEAD BY MELTING-OUT IN SUPERCRITICAL FLUID

Номер: US20130014866A1
Принадлежит:

A method for the retraction of an explosive component from a high explosive, including the steps of loading a high explosive containing an explosive component into an extraction vessel. A supercritical fluid is supplied to the extraction vessel. The high explosive is contacting with the supercritical fluid at a temperature below the melting point of the explosive component and at a pressure sufficient to extract the explosive component.

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31-01-2013 дата публикации

Fractional and integer pll architectures

Номер: US20130027102A1
Принадлежит: Qualcomm Inc

A digital fractional PLL introduces an accumulated phase offset before the digital VCO to achieve the fractional part of the division ratio. To provide this phase offset, the digital accumulator can integrate a fractional component Δn. By forcing Δn to zero, the PLL becomes an integer-N PLL. A de-skew timing configuration can be used to remove any time mismatch between integer and fractional counters of the PLL. A digital PLL can merge the function of frequency generation (DVCO) and that of fractional frequency counting into the same circuit block by reusing various phases of the frequency output to generate a fractional frequency count. A digital integer PLL can include a comparator, wherein the feedback loop of this PLL forces the phase difference between the reference clock and feedback signals to approach zero. By changing the duty cycle of feedback signal, the frequency tracking behavior of the loop can be varied.

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21-02-2013 дата публикации

LOW POWER/HIGH SPEED TSV INTERFACE DESIGN

Номер: US20130043541A1

A TSV interface circuit for a TSV provided in an interposer substrate that forms a connection between a first die and a second die includes a driving circuit provided in the first die and a receiver circuit provided in the second die where the driving circuit is coupled to a first supply voltage and a second supply voltage that are both lower than the interposer substrate voltage that substantially reduces the parasitic capacitance of the TSV. The receiver circuit is also coupled to the first supply voltage and the second supply voltage that are both lower than the interposer substrate voltage. 1. A through-substrate via interface circuit for a through-substrate via provided in an interposer substrate that forms a connection between a first die and a second die , wherein the interposer substrate is at an interposer substrate voltage , V , the through-substrate via interface circuit comprising:a driving circuit provided in the first die, the driving circuit having an input and an output that is coupled to the through-substrate via,wherein the driving circuit is coupled to a first supply voltage −N*VDD and a second supply voltage −(N+1)*VDD, and{'sub': 'I', 'wherein the first and second supply voltages are both lower than the interposer substrate voltage, V.'}2. The through-substrate via interface circuit of claim 1 , wherein the driving circuit is a CMOS inverter comprising a PMOS transistor and an NMOS transistor connected in parallel configuration between the input and the output of the driving circuit claim 1 ,wherein each of the PMOS transistor and the NMOS transistor comprising a gate terminal, a bulk terminal, and a source terminal, andwherein the PMOS transistor's bulk and source terminals are connected to the first supply voltage −N*VDD and the NMOS transistor's bulk and source terminals are connected to the second supply voltage −(N+1)*VDD.3. The through-substrate via interface circuit of claim 2 , further wherein the interposer substrate voltage claim 2 , ...

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28-02-2013 дата публикации

FEEDBACK CONTROL OF A DC/DC POWER CONVERTER

Номер: US20130049715A1
Автор: Chen Shuo, Groom Terry
Принадлежит: LINEAR TECHNOLOGY CORPORATION

A current mode power conversion system and method operates in cycles. Each cycle includes an on time and an off time. The system includes an inductor connected to store energy during the on time of each cycle and use the energy during the off time of each cycle. The system provides a stable output voltage and a maximum-limited output current to a load during constant load conditions. The system comprises a feedback control linearly operable so as to control the output voltage across the load during constant load conditions, and non-linearly operable so as to control the output voltage across the load during certain detected changes in load conditions as a function of the derivative of the current in the inductor so as to speed up the transient response of the power conversion system when a fault condition exists. 1. A current mode power conversion system that operates in cycles , each cycle including an on time and an off time , the system including an inductor connected to store energy during the on time of each cycle and use the energy during the off time of each cycle , the system providing a stable output voltage and a maximum-limited output current to a load during constant load conditions , the system comprising:a feedback control linearly operable so as to control the output voltage across the load during constant load conditions, and non-linearly operable so as to control the output voltage across the load during certain detected changes in load conditions as a function of the derivative of the current in the inductor so as to speed up the transient response of the power conversion system when a fault condition exists.2. A current mode power conversion system according to claim 1 , wherein the feedback control includes a transient detector constructed and arranged so as to detect a change in load conditions claim 1 , the feedback control being responsive to the transient detector for switching from linear operation to nonlinear operation when the threshold ...

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28-02-2013 дата публикации

METHOD FOR FABRICATING IMAGE SENSORS

Номер: US20130052337A1
Автор: CHEN Po-Shuo
Принадлежит: VisEra Technologies Company Limited

An image sensor is provided. The image sensor includes a pixel sensor, a color filter array comprising a plurality of color filters formed on the pixel sensor, wherein two adjacent color filters have a gap therebetween, and a gapless microlens array comprising a plurality of microlenses formed on the color filter array. The invention also provides a method for fabricating the image sensor. 1. A method for fabricating an image sensor , comprising:providing a pixel sensor;forming a color filter array comprising a plurality of color filters on the pixel sensor, wherein two adjacent color filters have a gap therebetween;coating a transparent material on the color filter array; andhardening the transparent material to form a gapless microlens array comprising a plurality of microlenses.2. The method for fabricating an image sensor as claimed in claim 1 , wherein the color filter array is formed by a photolithography process.3. The method for fabricating an image sensor as claimed in claim 1 , wherein the color filter in the plurality of color filters comprises a first gap along a row direction claim 1 , a second gap along a column direction and a third gap along a diagonal direction.4. The method for fabricating an image sensor as claimed in claim 3 , wherein the first gap is similar to the second gap.5. The method for fabricating an image sensor as claimed in claim 3 , wherein the third gap is larger than the first gap and the third gap is larger than the second gap.6. The method for fabricating an image sensor as claimed in claim 1 , wherein the transparent material comprises photoresist or thermoplastic resins.7. The method for fabricating an image sensor as claimed in claim 1 , wherein the transparent material is hardened by a thermal reflow and curing process.8. The method for fabricating an image sensor as claimed in claim 3 , the microlens on the color filter has a height determined by the first gap claim 3 , the second gap and the third gap.9. The method for ...

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14-03-2013 дата публикации

SYSTEM AND METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENTH CONVERSION LAYERS

Номер: US20130062646A1
Автор: Chen De-Shuo, Yen Jui-Kang
Принадлежит: SEMILEDS OPTOELECTRONICS CO., LTD.

A system for fabricating light emitting diode (LED) dice includes a wavelength conversion layer contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The system also includes a curing apparatus configured to reduce the adhesiveness of the adhesive layer to facilitate removal of the wavelength conversion layer from the substrate, and an attachment apparatus configured to remove the wavelength conversion layer from the substrate and to attach the wavelength conversion layer to a light emitting diode (LED) die. A method for fabricating light emitting diode (LED) dice includes the steps of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die. 1. A system for fabricating light emitting diode (LED) dice comprising:a light emitting diode (LED) die;a wavelength conversion layer configured for attachment to the light emitting diode (LED) die contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy;a curing apparatus configured to reduce the adhesiveness of the adhesive layer to facilitate removal of the wavelength conversion layer from the substrate; andan attachment apparatus configured to remove the wavelength conversion layer from the substrate and to attach the wavelength conversion layer to the light emitting diode (LED) die.2. The system of wherein the wavelength conversion layer has a first peripheral shape which substantially matches a second peripheral shape of an area on the light emitting diode (LED) die.3. The system of wherein the wavelength conversion layer includes one or more features that align with one or more corresponding features on the light emitting diode (LED) die.4. The ...

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04-07-2013 дата публикации

Packages with Passive Devices and Methods of Forming the Same

Номер: US20130168805A1

A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the passivation layer and electrically coupled to the metal pad. An Under-Bump Metallurgy (UBM) is disposed over and electrically coupled to the PPI line. A passive device includes a portion at a same level as the UBM. The portion of the passive device is formed of a same material as the UBM.

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04-07-2013 дата публикации

METHOD FOR REMOVING GERMANIUM SUBOXIDE

Номер: US20130171830A1
Принадлежит: NATIONAL CHIAO TUNG UNIVERSITY

A method for removing germanium suboxide between a germanium (Ge) substrate and a dielectric layer made of metal oxide includes causing a supercritical fluid composition that includes a supercritical carbon dioxide fluid and an oxidant to diffuse into the germanium suboxide such that metal residues in the dielectric layer, the germanium suboxide and the oxidant are subjected to a redox reaction so as to reduce the germanium suboxide into germanium. 1. A method for removing germanium suboxide between a germanium (Ge) substrate and a dielectric layer made of metal oxide , comprising causing a supercritical fluid composition that includes a supercritical carbon dioxide (scCO) fluid and an oxidant to diffuse into the germanium suboxide such that metal residues in the dielectric layer , the germanium suboxide and the oxidant are subjected to a redox reaction so as to reduce the germanium suboxide into germanium.2. The method of claim 1 , wherein the redox reaction among the metal residues in the dielectric layer claim 1 , the germanium suboxide and the oxidant includes oxidizing the metal residues through the oxidant to generate a reducing agent claim 1 , followed by reducing germanium suboxide into germanium through the reducing agent.3. The method of claim 1 , wherein the oxidant has a volume not greater than 10% based on the volume of scCO.4. The method of claim 1 , wherein the supercritical fluid composition is at a temperature not higher than 200° C.5. The method of claim 4 , wherein the supercritical fluid composition is at a temperature ranging from 100° C. to 200° C.6. The method of claim 1 , wherein the oxidant is selected from the group consisting of water vapor claim 1 , hydrogen peroxide and a combination thereof.7. The method of claim 1 , wherein the supercritical fluid composition further includes a solubilizer for increasing solubility of the oxidant in the supercritical carbon dioxide fluid claim 1 , the volume of the solubilizer being not greater than 10 ...

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11-07-2013 дата публикации

Half-Heusler Alloys with Enhanced Figure of Merit and Methods of Making

Номер: US20130175484A1
Принадлежит:

Thermoelectric materials and methods of making thermoelectric materials having a nanometer mean grain size less than 1 micron. The method includes combining and arc melting constituent elements of the thermoelectric material to form a liquid alloy of the thermoelectric material and casting the liquid alloy of the thermoelectric material to form a solid casting of the thermoelectric material. The method also includes ball milling the solid casting of the thermoelectric material into nanometer mean size particles and sintering the nanometer size particles to form the thermoelectric material having nanometer scale mean grain size. 1. A thermoelectric half-Heusler material comprising at least one of Ti , Zr , Hf , at least one of Ni and Co and at least one of Sn and Sb , wherein the material comprises grains having at least one of a median grain size and a mean grain size less than one micron.2. The thermoelectric material of claim 1 , wherein the half-Heusler material is an n-type material which has a formula HfZrNiSnSb claim 1 , where 0.25 Подробнее

12-09-2013 дата публикации

Methods of Synthesizing Thermoelectric Materials

Номер: US20130234375A1

Methods for synthesis of thermoelectric materials are disclosed. In some embodiments, a method of fabricating a thermoelectric material includes generating a plurality of nanoparticles from a starting material comprising one or more chalcogens and one or more transition metals; and consolidating the nanoparticles under elevated pressure and temperature, wherein the nanoparticles are heated and cooled at a controlled rate.

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24-10-2013 дата публикации

DIGITAL CLOSED-LOOP FIBER OPTICAL CURRENT SENSOR

Номер: US20130278241A1
Принадлежит: CHINA ELECTRIC POWER RESEARCH INSTITUTE

This present inversion provides a digital closed-loop fiber optical current sensor. The modulation signal of the optical wave “phase modulator” of the fiber optical current sensor system is modulation square wave, signal processing system extracts any harmonic wave of the photoelectric converter output modulation square waves, and extracts the measured current information from it. The preamplifier of signal processing system is transimpedance amplifier TIA, the bandwidth is extracted 1/650 instantaneous amplitude square wave directly from the modulation square wave (existing), thus the thermal noise of the preamplifier output and shot noise level is reduced to the existing technology of below 1/650; the current-voltage gain of transimpedance amplifier TIA does not depend on the feedback network resistance, thus it can have high current-voltage conversion gain and use low resistance in the feedback network TIA at the same time. So it can reduce resistance thermal noise to negligible that is accounted for a large proportion of TIA output noise. 1. A digital closed-loop fiber optical current sensor , which is characterized in that: the modulation signal of the optical wave “phase modulator” of said the fiber optical current sensor system is modulation square wave , signal processing system extracts only any harmonic wave of the photoelectric converter output modulation square waves , and extracts the measured current information from it.2. A digital closed-loop fiber optical current sensor said according to claim 1 , the optical path consists of:a broadband light source, the output light of the source passes through the polarizer and becomes a low coherence length of the linear polarized light;an integrated waveguide type optical phase modulator, its function is to adds positive, negative 90° bias phase to the existing linear polarized light, and the its period is set already, and the feedback phase opposite to existing light wave phase;at least one polarization- ...

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21-11-2013 дата публикации

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20130307119A1

A package includes a chip formed in a first area of the package and a molding compound formed in a second area of the package adjacent to the first area. A first polymer layer is formed on the chip and the molding compound, a second polymer layer is formed on the first polymer layer, and a plurality of interconnect structures is formed between the first polymer layer and the second polymer layer. A metal-insulator-metal (MIM) capacitor is formed on the second polymer layer and electrically coupled to at least one of the plurality of interconnect structures. A metal bump is formed over and electrically coupled to at least one of the plurality of interconnect structures. 1. A package comprising:a chip formed in a first area of the package;a molding compound formed in a second area of the package adjacent to the first area;a first polymer layer formed on the chip and the molding compound;a second polymer layer formed on the first polymer layer;a plurality of interconnect structures formed between the first polymer layer and the second polymer layer;a metal-insulator-metal (MIM) capacitor formed on the second polymer layer and electrically coupled to at least one of the plurality of interconnect structures; anda metal bump formed over and electrically coupled to at least one of the plurality of interconnect structures.2. The package of claim 1 , wherein the MIM capacitor is formed in at least one of the first area or the second area.3. The package of claim 1 , wherein the plurality of interconnect structures is formed in at least one of the first area or the second area.4. The package of claim 1 , wherein the metal bump is formed over and electrically coupled to the MIM capacitor.5. The package of claim 1 , further comprising an isolation coating over the MIM capacitor.6. The package of claim 1 , wherein the MIM capacitor comprises a lower metal layer claim 1 , a capacitor dielectric layer and an upper metal layer claim 1 , and the capacitor dielectric layer comprises a ...

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28-11-2013 дата публикации

ZERO-VALENT IRON TWO-PHASE ANAEROBIC REACTOR

Номер: US20130313172A1
Принадлежит: Dalian University of Technology

The invention, belongs to the field of wastewater treatment technology, is a two-phase anaerobic reactor enhanced by addition of zero valent iron (ZVI). In the reactor, 2˜4 ZVI-filling layers are settled in the middle of the anaerobic hydrolysis-acidification tank, the effluent of which is fed into the rear anaerobic methanogenic tank. The degradation of organics is effectively enhanced in the anaerobic hydrolysis-acidification tank with dosing of ZVI, which may produce more acetic acid that is a desired substrate for the subsequent methanogenesis. Meanwhile, the acidic environment of the hydrolysis-acidification tank is helpful for the dissolution of ZVI to maintain its activity. The reactor is reasonably designed with high performance and strong shock resistance in anaerobic treatment of various wastewaters. Tests in lab-scale showed that hydrolysis-acidification and methanogenesis in this combined system were significantly improved compared with a reference reactor without addition of ZVI. 11361465113116. A two-phase anaerobic reactor enhanced by zero-valent iron (ZVI) mainly consists of an anaerobic hydrolysis-acidification tank () equipped with ZVI-filling layer () , and an anaerobic methanogenesis tank () , wherein the effluent of hydrolysis-acidification tank () flows to a middle tank () and then is fed in anaerobic methanogenesis tank () using a pump () , the influent for hydrolysis-acidification tank () is also delivered by a pump () , and the reactor is featured as follows: 2˜4 ZVI-filling layers () are set in the middle of the hydrolysis-acidification tank () to accelerate acidification of organics and produce more acetate beneficial for the subsequent methanogenesis and , after the enhanced hydrolysis acidification tank () , the wastewater is transported into the methanogenic tank ().231. The two-phase anaerobic reactor enhanced by ZVI of claim 1 , wherein the bottom of the ZVI-filling layers () is set at the half of the height (H) of the anaerobic ...

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19-12-2013 дата публикации

METHOD FOR RECLAIMING TNT AND TNT-BASE HIGH EXPLOSIVE FROM WARHEAD BY STRIP DOWN IN SUPERCRITICAL FLUID

Номер: US20130338407A1
Принадлежит: TAI CHAM TECHNOLOGY CO. LTD.

A method for the retraction of an explosive component from a high explosive, including the steps of loading a high explosive containing an explosive component into an striping down vessel; supplying a supercritical fluid to the striping down vessel; contacting the high explosive with the supercritical fluid at a temperature below the melting point of the explosive component and at a pressure sufficient to strip down the explosive component; and inducing a sonicating process on the striping down vessel simultaneously at a frequency of 2 MHz to 10 MHz. 1. A method for the strip down of an explosive component from a high explosive , comprising the steps of:(a) loading a high explosive containing an explosive component into a striping down vessel;(b) supplying a supercritical fluid to the striping down vessel;(c) contacting the high explosive with the supercritical fluid at a temperature below the melting point of the explosive component and at a pressure sufficient to strip down the explosive component; and(d) inducing a sonicating process on the striping down vessel simultaneously at a frequency of 2 MHz to 10 MHz.2. The method of claim 1 , wherein the explosive component is at least one of TNT and TNT-based high explosive.3. The method of claim 2 , wherein the TNT-based high explosive is selected from the group consisting of Comp B claim 2 , Amatol claim 2 , Octol claim 2 , and Ammonal.4. The method of claim 2 , wherein the supercritical fluid is liquid carbon dioxide.5. The method of claim 2 , wherein the temperature is between about 50 and 75 degrees Celsius and the pressure is between about 15 and 40 MPa.6. The method of claim 5 , wherein the temperature is about 55 degrees Celsius and the pressure is about 25 MPa.7. The method of claim 3 , wherein the explosive component is striped down from the TNT-based high explosive has at least 99% TNT.8. The method of claim 1 , wherein steps (a) claim 1 , (b) claim 1 , (c) claim 1 , and (d) are done by batches operation.9. ...

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02-01-2014 дата публикации

Package with Passive Devices and Method of Forming the Same

Номер: US20140001635A1

An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.

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30-01-2014 дата публикации

Band Pass Filter for 2.5D/3D Integrated Circuit Applications

Номер: US20140029205A1

The present disclosure relates to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip comprising a plurality of capacitors embedded in a common molding compound along with a transceiver chip, and arranged within a polymer package. Ultra-thick metallization layers are disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layers also form a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area penalty as compared to conventional solutions. The band pass filter may also be coupled to a plurality of solder balls comprising a Flip Chip Ball Grid Array suitable for 2.5D and 3D integrated circuit applications. 1. A filter , comprising;an integrated passive device chip arranged within a polymer package and comprising a plurality of capacitors, wherein respective capacitors comprise one or more metallization layers, and a first dielectric layer separating the one or more metallization layers;an ultra-thick metallization layer disposed within the polymer package, and including a plurality of transmission lines, wherein respective transmission lines are configured to couple the integrated passive device chip to a transceiver chip; anda common molding compound within which the integrated passive device chip and the transceiver chip are embedded.2. The filter of claim 1 , wherein;the ultra-thick metallization layer is coupled to a plurality of solder balls comprising a ball grid array; andrespective solder balls are not positioned directly above or below the transceiver chip.3. The filter of claim 2 , comprising a first passive interposer coupled to the ball grid array claim 2 , wherein the first passive interposer is ...

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13-02-2014 дата публикации

Semiconductor Devices and Methods of Manufacture Thereof

Номер: US20140042612A1

Semiconductor devices and methods of manufacture thereof are disclosed. In an embodiment, a method of manufacturing a semiconductor device includes forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width. The second width is different than the first width. The method includes forming a second conductive structure in a second metallization layer proximate the first metallization layer, and coupling a portion of the second conductive structure to the first portion of the first conductive structure. 1. A method of manufacturing a semiconductor device , the method comprising:forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width, the second width being different than the first width;forming a second conductive structure in a second metallization layer proximate the first metallization layer; andcoupling a portion of the second conductive structure to the first portion of the first conductive structure.2. The method according to claim 1 , wherein forming the first conductive structure comprises forming the first portion comprising a signal interconnect and forming the second portion comprising a ground interconnect proximate the signal interconnect.3. The method according to claim 2 , wherein forming the first conductive structure comprises forming the second portion comprising a first ground interconnect proximate a first side of the signal interconnect and a second ground interconnect proximate a second side of the signal interconnect claim 2 , the second side being opposite the first side.4. The method according to claim 3 , wherein a first distance between the first ground interconnect and the signal interconnect is substantially the same as a second distance between ...

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06-03-2014 дата публикации

LUMINESCENT KEYSWITCH MODULE AND KEYBOARD THEREOF

Номер: US20140061017A1
Автор: CHEN Chien-Shuo
Принадлежит: CHICONY ELECTRONICS CO., LTD.

A luminescent keyswitch module includes a base plate, a keyswitch, a light guide plate, a light source, a diffusion structure, and a reflector. The keyswitch is disposed on the base plate. The light guide plate, disposed under the base plate, has an accommodating space communicated with a through hole of the base plate. The light source passes through the through hole, is accommodated in the accommodating space, and emits light having a first divergence angle. The diffusion structure is accommodated in the accommodating space and located between the light source and the light guide plate. The light passes through the diffusion structure. The light leaving the second light exit surface has a second divergence angle larger than the first divergence angle. The reflector is disposed under the light guide plate, so as to reflect the light to pass through the light guide plate and the base plate to the keyswitch. 1. A luminescent keyswitch module comprising:a base plate having a through hole;a keyswitch disposed on the base plate;a light guide plate disposed under the base plate and having an accommodating space, wherein the accommodating space is communicated with the through hole;a light source passing through the through hole and accommodated in the accommodating space, the light source having a first light exit surface and emitting light from the first light exit surface, and the light leaving the first light exit surface having a first divergence angle;a diffusion structure accommodated in the accommodating space and located between the light source and the light guide plate, the diffusion structure having a light entrance surface and a second light exit surface, the light leaving the first light exit surface then entering the diffusion structure from the light entrance surface and leaving the diffusion structure from the second light exit surface, wherein the light leaving the second light exit surface has a second divergence angle, and the second divergence angle ...

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06-03-2014 дата публикации

WASTEWATER PROCESSING METHOD OF HYDROLYSIS-ACIDIFICATION ENHANCED BY ADDITION OF ZERO-VALENT IRON (ZVI)

Номер: US20140061125A1
Принадлежит:

The invention discloses a wastewater processing method of hydrolysis-acidification enhanced by addition of zero-valent iron (ZVI), including the following steps: 3˜6 ZVI-filling layers are settled in the middle of an anaerobic hydrolysis-acidification reactor. Excess sludge taken from sewage treatment plant using as seed sludge is added into this anaerobic hydrolysis-acidification reactor for startup and domestication. In the present invention, ZVI are added into this anaerobic hydrolysis-acidification reactor to accelerate organic matters degradation and produce more acetic acids, accompanied with higher COD removal obtained. ZVI can be protected from rust in this anaerobic biological environment due to the air isolation. Also, ZVI can enhance anaerobic hydrolysis of wastewater through reducing refractory pollutants involved in wastewaters. This novel method made the effluent from the hydrolysis-acidification reactor present less COD concentration and simpler substrate form, benefiting for the following anaerobic methanogenesis or aerobic treatment. 1{'b': 2', '1', '3, '(a) 3˜6 ZVI-filling layers () are settled in the middle of the anaerobic hydrolysis-acidification reactor (), at the bottom of which the wastewater is pumped () into and passes through the ZVI layers, and after the interaction among microorganism, wastewater and ZVI, the wastewater is discharged from the upper part of the reactor into the subsequent anaerobic or aerobic process; and'}{'b': '1', '(b) excess sludge taken from sewage treatment plant as seed sludge is used for start-up and domestication of this reactor (),'}wherein step (a) includes the following sub-steps;(a1) scrap iron of 5˜10 mm is selected to dip in the NaOH of 0.1 mol/L, and then to pickle in the HCL of 10%, finally to wash by water to remove surface greasy dirt as well as rust, and the treated ZVI are dried for reserve;(a2) the dry ZVI are added to the ZVI-filling layers;{'b': 2', '1, '(a3) ZVI-filling layers () are settled in ...

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06-03-2014 дата публикации

Metal Pads with Openings in Integrated Circuits

Номер: US20140061898A1

A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI. 1. A device comprising:a metal pad;a passivation layer comprising portions overlapping edge portions of the metal pad; a trace portion overlying the passivation layer; and', 'a pad portion connected to the trace portion; and, 'a Post-Passivation-Interconnect (PPI) comprising an upper portion over the PPI; and', 'a plug portion extending into, and encircled by, the pad portion of the PPI., 'a first polymer layer comprising2. The device of claim 1 , wherein the plug portion of the first polymer layer is in a transition region of the pad portion of the PPI claim 1 , and wherein the transition region is close to the trace portion of the PPI.3. The device of further comprising:an Under-Bump-Metallurgy (UBM) extending into the first polymer layer to contact the pad portion of the PPI; andan electrical connector overlying the UBM.4. The device of claim 3 , wherein the plug portion of the first polymer layer is misaligned with the UBM.5. The device of further comprising:a second polymer layer over the metal pad and underlying the PPI; anda metal via in the second polymer layer.6. The device of claim 1 , wherein the plug portion of the first polymer layer has a bottom surface substantially level with a bottom surface of the PPI.7. The device of claim 1 , wherein the metal pad and the passivation layer are comprised in a chip claim 1 , and wherein the device further comprises a molding material encircling the chip.8. The device of further comprising a second polymer layer over the metal pad claim 7 , wherein the molding material comprises a top surface substantially level with a top ...

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13-03-2014 дата публикации

Packages with Passive Devices and Methods of Forming the Same

Номер: US20140073091A1

A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the passivation layer and electrically coupled to the metal pad. An Under-Bump Metallurgy (UBM) is disposed over and electrically coupled to the PPI line. A passive device includes a portion at a same level as the UBM. The portion of the passive device is formed of a same material as the UBM. 1. A method comprising:molding a die in a polymer, with the polymer encircling the die;planarizing the polymer to expose a metal pillar of the die;forming an Under-Bump Metallurgy (UBM) electrically coupled to the metal pillar;forming a first portion of a passive device, wherein the first portion of the passive device and the UBM are formed simultaneously; andforming a solder ball on the UBM.2. The method of further comprising:before the forming the UBM, forming a Post-Passivation Interconnect (PPI) line, with the UBM electrically coupled to the metal pillar through the PPI line; andforming a second portion of the passive device, wherein the second portion of the passive device and the PPI line are formed simultaneously.3. The method of further comprising:after the planarizing the polymer, forming a dielectric layer overlying and contacting the polymer and the die;forming a via in the dielectric layer; andforming a third portion of the passive device, wherein the third portion of the passive device and the via are formed simultaneously.4. The method of claim 1 , wherein the first portion of the passive device comprises a portion overlapping the polymer.5. The method of further comprising:forming a dielectric mask layer over the passive device and the UBM; andpatterning the dielectric mask layer to expose the solder ball, wherein the passive device is covered by a remaining portion of the dielectric mask layer.6. The method of further comprising:bonding the solder ball to a package component; ...

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06-01-2022 дата публикации

ELECTRONIC DEVICE

Номер: US20220003961A1
Принадлежит:

An electronic device includes at least one optical lens assembly. The optical lens assembly includes four lens elements, and the four lens elements are, in order from an outside to an inside, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an outside surface being convex in a paraxial region thereof. The second lens element has an inside surface being convex in a paraxial region thereof. The fourth lens element has an inside surface being concave in a paraxial region thereof, wherein at least one of an outside surface and the inside surface of the fourth lens element includes at least one critical point in an off-axis region thereof. 1. An electronic device , comprising at least one optical lens assembly , which comprises four lens elements , the four lens elements being in order from an outside to an inside:a first lens element, a second lens element, a third lens element and a fourth lens element;wherein each of the four lens elements has an outside surface facing towards the outside and an inside surface facing towards the inside;wherein the outside surface of the first lens element is convex in a paraxial region thereof, the inside surface of the first lens element is concave in a paraxial region thereof, the outside surface of the second lens element is convex in a paraxial region thereof, the inside surface of the fourth lens element is concave in a paraxial region thereof, and at least one of the outside surface and the inside surface of the fourth lens element comprises at least one critical point in an off-axis region thereof; [{'br': None, 'i': 'Vd/Nd', '0.65<2<1.54;'}, {'br': None, 'i': 'Vd/Nd', '0.65<3<1.54;'}, {'br': None, 'i': 'Vd/Nd', '0.65<4<1.54; and'}, {'br': None, 'i': 'Vd', '10.0<1<38.0.'}], 'wherein, when a measurement is made in accordance with a reference wavelength as a d-line, an Abbe number of the first lens element is Vd1, an Abbe number of the second lens element is ...

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07-01-2021 дата публикации

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Номер: US20210005562A1

A package structure includes a first dielectric layer, a first semiconductor device over the first dielectric layer, a first redistribution line in the first dielectric layer, a second dielectric layer over the first semiconductor device, a second semiconductor device over the second dielectric layer, a second redistribution line in the second dielectric layer, a conductive through-via over the first dielectric layer and electrically connected to the first redistribution line, a conductive ball over the conductive through-via and electrically connected to the second redistribution line, and a molding material. The molding material surrounds the first semiconductor device, the conductive through-via, and the conductive ball, wherein a top of the conductive ball is higher than a top of the molding material. 1. A package structure , comprising:a first dielectric layer;a first semiconductor device over the first dielectric layer;a first redistribution line in the first dielectric layer;a second dielectric layer over the first semiconductor device;a second semiconductor device over the second dielectric layer;a second redistribution line in the second dielectric layer;a conductive through-via over the first dielectric layer and electrically connected to the first redistribution line;a conductive ball over the conductive through-via and electrically connected to the second redistribution line; anda molding material surrounding the first semiconductor device, the conductive through-via, and the conductive ball, wherein a top of the conductive ball is higher than a top of the molding material.2. The package structure of claim 1 , wherein a bottom of the conductive ball is lower than the top of the molding material.3. The package structure of claim 1 , wherein the molding material has a portion vertically overlapping the first semiconductor device.4. The package structure of claim 1 , wherein the top of the molding material is higher than a top of the first semiconductor ...

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02-01-2020 дата публикации

SEMICONDUCTOR PACKAGE WITH DUAL SIDES OF METAL ROUTING

Номер: US20200006234A1
Принадлежит:

A method includes forming a redistribution structure over a carrier, the redistribution structure having conductive features on a surface of the redistribution structure distal the carrier; forming a conductive pillar over the surface of the redistribution structure; attaching a die to the surface of the redistribution structure adjacent to the conductive pillar, where die connectors of the die are electrically coupled to the conductive features of the redistribution structure; and attaching a pre-made substrate to the conductive pillar through a conductive joint, where the conductive joint is on the conductive pillar and comprises a different material from the conductive pillar, where the conductive joint and the conductive pillar electrically couple the redistribution structure to the pre-made substrate. 1. A semiconductor device comprising:a die embedded in a first molding material, a first side of the die having die connectors;a first conductive pillar embedded in the first molding material and laterally spaced apart from the die;a redistribution structure at the first side of the die, the die connectors being bonded to conductive features of the redistribution structure by solder;a substrate at a second side of the die opposing the first side; anda first solder region interposed between the first conductive pillar and the substrate, wherein the first solder region and the first conductive pillar electrically couple the redistribution structure to the substrate.2. The semiconductor device of claim 1 , wherein a surface of the first conductive pillar distal from the redistribution structure is closer to the redistribution structure than the second side of the die.3. The semiconductor device of claim 2 , wherein the first molding material extends continuously from the redistribution structure to the substrate claim 2 , and wherein the first solder region is embedded in the first molding material.4. The semiconductor device of claim 1 , further comprising an ...

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03-01-2019 дата публикации

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Номер: US20190006309A1
Принадлежит:

A method for forming a chip package structure is provided. The method includes forming a first dielectric layer over a carrier substrate. The first dielectric layer is a continuous dielectric layer and has openings. The method includes forming a first wiring layer over the first dielectric layer and in the openings. The first dielectric layer and the first wiring layer together form a redistribution structure, and the redistribution structure has a first surface and a second surface. The method includes disposing a first chip and a first conductive bump over the first surface. The method includes forming a first molding layer over the first surface. The method includes removing the carrier substrate. The method includes disposing a second chip and a second conductive bump over the second surface. The method includes forming a second molding layer over the second surface. 1. A method for forming a chip package structure , comprising:forming a first dielectric layer over a carrier substrate, wherein the first dielectric layer has first openings;forming a first wiring layer over the first dielectric layer and in the first openings, wherein the first dielectric layer and the first wiring layer together form a redistribution structure, and the redistribution structure has a first surface and a second surface opposite to the first surface;disposing a first chip and a first conductive bump over the first surface, wherein the first conductive bump is between the first chip and the redistribution structure;forming a first molding layer over the first surface to surround the first chip and the first conductive bump;removing the carrier substrate;disposing a second chip and a second conductive bump over the second surface, wherein the second conductive bump is between the second chip and the redistribution structure; andforming a second molding layer over the second surface to surround the second chip and the second conductive bump.2. The method for forming the chip package ...

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03-01-2019 дата публикации

SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

Номер: US20190006341A1

A semiconductor device package includes a redistribution structure, a first semiconductor device, a plurality of second semiconductor devices, at least one warpage adjusting component, and an encapsulating material. The first semiconductor device is disposed on the redistribution structure. The second semiconductor devices are disposed on the redistribution structure and surround the first semiconductor device. The at least one warpage adjusting component is disposed on at least one of the second semiconductor devices. The encapsulating material encapsulates the first semiconductor device, the second semiconductor devices and the warpage adjusting component, wherein a Young's modulus of the warpage adjusting component is greater than or equal to a Young's modulus of the encapsulating material, and a coefficient of thermal expansion (CTE) of the warpage adjusting component is smaller than a CTE of the encapsulating material. 1. A semiconductor device package comprising:a redistribution structure;a first semiconductor device disposed on the redistribution structure;a plurality of second semiconductor devices disposed on the redistribution structure;at least one warpage adjusting component disposed on at least one of the second semiconductor devices; andan encapsulating material encapsulating the first semiconductor device, the second semiconductor devices and the warpage adjusting component, wherein a Young's modulus of the warpage adjusting component is greater than or equal to a Young's modulus of the encapsulating material.2. The semiconductor device package as claimed in claim 1 , wherein the redistribution structure is a fan-out redistribution structure comprising a plurality of redistribution lines (RDLs) and a plurality of dielectric layers stacked alternately on top of one another claim 1 , and the encapsulating material is extended over the redistribution structure.3. The semiconductor device package as claimed in claim 1 , wherein a coefficient of thermal ...

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03-01-2019 дата публикации

WIRELESS CHARGING SYSTEM AND WIRELESS CHARGING METHOD

Номер: US20190006874A1
Принадлежит: KINPO ELECTRONICS, INC.

The invention provides a wireless charging system and a wireless charging method. The method includes: sending a first control signal by a processor; moving a wireless charging apparatus to a first position near an electronic apparatus according to a first control signal by a moving platform; and wirelessly charging the electronic apparatus by the wireless charging apparatus. 1. A wireless charging system , comprising:a placement platform, comprising a placement plane for placing an electronic apparatus;a wireless charging apparatus;a moving platform, connected with the wireless charging apparatus; anda processor, coupled to the wireless charging apparatus and the moving platform, whereinthe processor sends a first control signal,the moving platform moves the wireless charging apparatus to a first position near the electronic apparatus according to the first control signal, andthe wireless charging apparatus wirelessly charges the electronic apparatus.2. The wireless charging system according to claim 1 , wherein the wireless charging apparatus and the moving platform are disposed in the placement platform.3. The wireless charging system according to claim 1 , further comprising:a sensor, coupled to the processor, wherein in the operation of the processor sending the first control signal,the sensor senses the electronic apparatus and generates sensing information, andthe processor sends the first control signal according to the sensing information.4. The wireless charging system according to claim 3 , wherein before the operation of the sensor sensing the electronic apparatus and generating the sensing information claim 3 ,the electronic apparatus sends charging information, andthe processor controls the sensor to sense the electronic apparatus according to the charging information.5. The wireless charging system according to claim 3 , wherein the sensor comprises an image capturing device claim 3 , and in the operation of the processor sending the first control ...

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14-01-2021 дата публикации

METHOD OF PREPARATION OF CONDUCTIVE POLYMER/CARBON NANOTUBE COMPOSITE NANOFILTRATION MEMBRANE AND THE USE THEREOF

Номер: US20210008503A1
Принадлежит:

A method for preparation of conductive polymer/carbon nanotube (CNT) composite nanofiltration (NF) membrane and the use thereof. This conductive polymer/CNT composite NF membrane is obtained by polymerizing conductive polymer into a CNT membrane and then in-situ cross-linking with glutaraldehyde under acidic condition. The synthetic method for the conductive polymer/CNT composite NF membrane is simple and has no need of expensive equipment. The prepared membrane has controllable membrane structure and possesses superior electrical conductivity and electrochemical stability. The membrane can couple with electrochemistry for electrically assisted filtration. With the electrical assistance, the membrane can achieve improved ion rejection performance while retaining high permeability by enhancement of membrane surface charge density, which alleviates the permeability-selectivity trade-off. Furthermore, the electrically assisted NF membrane filtration can also enhance the removal for small molecular organic pollutants. 1. A method for preparing a conductive polymer/carbon nanotube (CNT) composite nanofiltration (NF) membrane , wherein , the method comprising the following steps:{'sub': 3', '2', '4, '(1) CNTs are oxidized in mixed acid solution of 70 wt. % concentrated HNOand concentrated HSOsolution with 1:3 (v/v) at 40˜100° C. for 30˜120 min; then the obtained dispersion is diluted with ultrapure water and filtered; the resulting oxidized CNTs are washed and dried; after that, the oxidized CNTs are re-dispersed to form a uniform aqueous dispersion and then vacuum-filtered onto a membrane support to yield CNT membranes; finally, the prepared CNT membrane is dried at 40˜80° C.;'}(2) the prepared CNT membrane is soaked in a monomer solution of the corresponding conductive polymer for 10˜30 min before draining off the excess solution; afterwards, the CNT membrane is put into an initiator solution for initiating the polymerization of monomer; after polymerizing at 0˜25° C. ...

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14-01-2016 дата публикации

PHARMACEUTICAL USES OF SULFUR-CONTAINING COMPOUND

Номер: US20160009642A1
Принадлежит:

The invention relates to uses of the sulfur-containing compound in inhibiting activities of a factor related to cancer metastasis and/or growth. Preferably, the invention relates to uses of the sulfur-containing compound in inhibiting lung cancer metastasis and/or growth. 19-. (canceled)11. (canceled)12. (canceled)13. (canceled)14. The method according to claim 10 , wherein the lung cancer is non-small cell lung carcinoma.15. The method according to claim 10 , wherein the lung cancer is Lewis lung carcinoma.16. The method according to claim 10 , wherein the compound is administered by injection. 1. Field of the InventionThe invention relates to uses of a sulfur-containing compound. Said sulfur-containing compound has ability to inhibit activities of a factor related to cancer metastasis and/or growth and to inhibit lung cancer metastasis and/or growth.2. Description of the Related ArtNon-small cell lung cancer (NSCLC) is one of the main causes of cancer death, and its incidence is increasing. Surgery, radiotherapy, and chemotherapy are the major treatment methods to reduce lung cancer mortality (Saba, N. F.; Khuri, F. R. Chemoprevention strategies for patients with lung cancer in the context of screening. 2005, 7, 92-99), however, these treatments have harmful side effects on normal healthy cells in the human body. Therefore, it is important to discover new agents to treat lung cancer safely without affecting the body's healthy cells. The deregulation of signaling pathways such as PI3K/Akt is often implicated in the pathogenesis of NSCLC (Li, C. M.; Narayanan, R.; Lu, Y.; Hurh, E.; Coss, C. C.; Barrett, C. M.; Miller, D. D.; Dalton, J. T. 2-Arylthiazolidine-4-carboxylic acid amides (ATCAA) target dual pathways in cancer cells: 5′-AMP-activated protein kinase (AMPK)/mTOR and PI3K/Akt/mTOR pathways. 2010, 37, 1023-1030). Thus, the need for the accelerated development of effective NSCLC therapies is critical. At present, the design of new therapeutic strategies ...

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14-01-2021 дата публикации

SYSTEM AND METHOD FOR ORCHARD RECOGNITION ON GEOGRAPHIC AREA

Номер: US20210012109A1
Принадлежит:

A system and a method for recognition of an orchard on a geographic area are provided. The system includes a pre-processing module for deriving a target section of an aerial image containing a parcel of an orchard, an image optimization module for performing customized image processing on the target section of the aerial image, and a recognition module for determining a type and a border of the orchard present on the target section of the aerial image with a deep learning mechanism. Accordingly, farmers and agricultural entities can effectively monitor orchards within different geographic areas so as to yield better fruit production and conduct better fruit quality control and land utilization. 1. A computer-implemented system for recognizing an orchard on a geographic area , comprising:a pre-processing module configured for deriving a target section of an aerial image containing a parcel of the orchard and a mask corresponding to a shape of the orchard from the aerial image and a shapefile;an image optimization module configured for conditioning the target section of the aerial image; anda recognition module configured for determining a type of the orchard and a border of the orchard within the target section of the aerial image by a deep learning mechanism based on the mask corresponding to the shape of the orchard and the conditioned target section of the aerial image containing the parcel of the orchard.2. The computer-implemented system of claim 1 , wherein the border of the orchard winds along the orchard.3. The computer-implemented system of claim 1 , wherein the image optimization module conditions the target section of the aerial image by:determining type of flaws in the target section of the aerial image with a classifier; andperforming at least one of cloud and haze removal, color calibration, image modulating and shadow removal on the target section based on the type of flaws with an optimizer.4. The computer-implemented system of claim 1 , wherein the ...

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10-01-2019 дата публикации

Semiconductor package with dual sides of metal routing

Номер: US20190013273A1

A method includes forming a redistribution structure over a carrier, the redistribution structure having conductive features on a surface of the redistribution structure distal the carrier; forming a conductive pillar over the surface of the redistribution structure; attaching a die to the surface of the redistribution structure adjacent to the conductive pillar, where die connectors of the die are electrically coupled to the conductive features of the redistribution structure; and attaching a pre-made substrate to the conductive pillar through a conductive joint, where the conductive joint is on the conductive pillar and comprises a different material from the conductive pillar, where the conductive joint and the conductive pillar electrically couple the redistribution structure to the pre-made substrate.

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09-01-2020 дата публикации

Display apparatus and display method thereof

Номер: US20200013376A1
Автор: Enhui Guan, LU Tong, Shuo Chen
Принадлежит: BOE Technology Group Co Ltd

A display method of a display apparatus includes: obtaining at least one set of viewing position parameters; determining a target display area within an active area of the display apparatus according to the at least one set of viewing position parameters; and displaying images in the target display area.

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19-01-2017 дата публикации

A METHOD FOR THE HIGH-THROUGHPUT PREPARATION OF CARBON NANOTUBE HOLLOW FIBER MEMBRANES

Номер: US20170014777A1
Принадлежит:

The invention, belonging to the field of membrane technology, presents a method for the high-throughput preparation of carbon nanotube hollow fiber membranes. This method contains three major steps. Firstly, the pristine carbon nanotubes (CNTs) are added into a mixture of concentrated nitric acid and sulfuric acid, which is then heated at 40˜80° C. for 0.5˜6 hours. Secondly, the surface-functionalized CNTs and polyvinyl butyral (PVB) are dispersed and dissolved, respectively, in organic solvents at a mass ratio of 1:0.2˜1:4˜8 to form homogeneous spinning solution, which is squeezed into water as shell liquid with water as core liquid at a flow rate ratios of 0.5˜5:1 through a spinneret to form CNT/PVB hollow fibers. Finally, the dry fibers are calcinated at 600˜1000 ° C. for 1˜4 hours in absence of oxygen to produce free-standing CNT hollow fiber membranes. The method involved in this invention is simple and highly efficient without needing any templates, expensive apparatuses and chemicals. Additionally, the obtained electrically conductive CNT hollow fiber membranes feature a high porosity, high water flux and strong acid/alkali resistance. 1. A method for the high-throughput preparation of carbon nanotube hollow fiber membranes features some steps as follows:(1) Surface modification of pristine CNTs: Carbon nanotubes (CNTs) are added into a mixture of concentrated sulfuric acid and nitric acid (≦5:1, v/v), which is heated at 40˜80° C. for 0.5-6 hours. CNTs are then recovered by filtration.(2) Wet-spinning process: The surface-functionalized CNTs and polyvinyl butyral (PVB) are dispersed and dissolved, respectively, in organic solvents at a mass ratio of 1:0.2˜1:4˜8 to produce homogeneous spinning solution. The spinning solution and water as shell liquid and core liquid, respectively, are squeezed at a flow rate ratio of 0.5˜5:1 into water through a spinneret to form CNT/PVB hollow fibers.(3) Calcination: The obtained fibers are dredged up from the water and dried ...

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21-01-2016 дата публикации

TOUCH CIRCUIT, TOUCH SUBSTRATE AND TOUCH DISPLAY DEVICE

Номер: US20160018918A1
Автор: Chen Shuo
Принадлежит:

The present disclosure discloses a touch circuit, a touch substrate and a touch display device. The touch circuit includes a light sensing module arranged corresponding to a touch area and configured to, when the touch area receives light which meets a first preset condition, transmit a first signal transmitted via a signal input line as a sensing signal to a processor through a first sensing signal transmission line and a second sensing signal transmission line, respectively. The processor determines position information of the touch area based on a first sensing signal transmitted via the first sensing signal transmission line and a second sensing signal transmitted via the second sensing signal transmission line. 1. A touch circuit comprising:a light sensing module arranged corresponding to a touch area and configured to, when the touch area receives light which meets a first preset condition, transmit a first signal transmitted via a signal input line as a sensing signal to a processor through a first sensing signal transmission line and a second sensing signal transmission line, respectively; wherein the processor determines position information of the touch area based on a first sensing signal transmitted via the first sensing signal transmission line and a second sensing signal transmitted via the second sensing signal transmission line.2. The touch circuit of claim 1 , wherein the light sensing module comprises:a light control unit, a first transmission switch and a second transmission switch; whereinthe light control unit is connected with the signal input line, the first transmission switch, the first sensing signal transmission line, respectively; the light control unit is configured to, when being irradiated by the light, change from an off state to an on state; when the light control unit is in the on state, the first signal transmitted via the signal input line is transmitted to the first transmission switch and the first sensing signal transmission ...

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21-01-2021 дата публикации

N-HETEROCYCLIC FIVE-MEMBERED RING-CONTAINING CAPSID PROTEIN ASSEMBLY INHIBITOR, PHARMACEUTICAL COMPOSITION THEREOF, AND USE THEREOF

Номер: US20210017154A1

A N-heterocyclic five-membered ring-containing capsid protein assembly inhibitor, and a pharmaceutical composition and use thereof, specifically relating to a compound as represented by formula I, a stereoisomer, a tautomer, a geometrical isomer, a solvate, an active metabolite, a hydrate, a prodrug or a pharmaceutically acceptable salt thereof, a pharmaceutical composition thereof, and a medical use thereof. The medical use comprises the use in treating diseases benefiting from the capsid protein assembly inhibitor, and in particular, diseases caused by hepatitis B virus infection. 2. The compound of Formula I claim 1 , a stereoisomer claim 1 , a tautomer claim 1 , a geometric isomer claim 1 , a solvate claim 1 , an active metabolite claim 1 , a hydrate claim 1 , a prodrug or a pharmaceutically acceptable salt thereof according to claim 1 , wherein:{'sup': 'a', 'sub': 1-3', '1-3', '2', '1-3', '6-10', '3-6, 'Ris selected from the group consisting of —C(O)Calkyl, Calkyl, —S(O)Calkyl, 5- to 6-membered heteroaryl, Caryl, Ccycloalkyl, and 3- to 6-membered heterocycloalkyl;'}{'sup': 'a', 'sub': 1-3', '1-3', '2', '1-3, 'alternatively, Ris selected from the group consisting of —C(O)Calkyl, Calkyl, and —S(O)Calkyl; and'}{'sup': 'a', 'sub': 3', '2', '3, 'alternatively, Ris selected from the group consisting of —C(O)CH, and —S(O)CH.'}3. The compound of Formula I claim 1 , a stereoisomer claim 1 , a tautomer claim 1 , a geometric isomer claim 1 , a solvate claim 1 , an active metabolite claim 1 , a hydrate claim 1 , a prodrug or a pharmaceutically acceptable salt thereof according to claim 1 , wherein:{'sup': b', 'c, 'sub': 1-3', '1-3', '2', '1-3', '6-10', '3-6, 'Rand Rare each independently selected from the group consisting of —C(O)Calkyl, Calkyl, —S(O)Calkyl, 5- to 6-membered heteroaryl, Caryl, Ccycloalkyl, and 3- to 6-membered heterocycloalkyl; and'}{'sup': b', 'c, 'sub': 1-3', '1-3', '2', '1-3, 'alternatively, Rand Rare each independently selected from the group ...

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16-01-2020 дата публикации

OPTICAL PHOTOGRAPHING LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE

Номер: US20200018934A1
Принадлежит:

An optical photographing lens assembly includes six lens elements, in order from an object side to an image side, the six lens elements are a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The fourth lens element has negative refractive power. The fifth lens element has an object-side surface being concave in a paraxial region thereof. The sixth lens element has an image-side surface being convex in a paraxial region thereof, both an object-side surface and the image-side surface of the seventh lens element are aspheric, and at least one of the object-side surface and the image-side surface of the sixth lens element includes at least one inflection point. 1. An optical photographing lens assembly comprising six lens elements , in order from an object side to an image side , the six lens elements being , a first lens element , a second lens element , a third lens element , a fourth lens element , a fifth lens element and a sixth lens element;wherein the first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof; the second lens element has negative refractive power; the fourth lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof; the fifth lens element has an object-side surface being concave in a paraxial region thereof; the sixth lens element has an object-side surface being concave in a paraxial region thereof and comprising at least one inflection point in an off-axis region thereof; [{'br': None, 'i': f', 'f, '−0.90<4/|2|≤0;'}, {'br': None, 'i': 'TL/f<', '0.50<1.0; and'}, {'br': None, 'i': 'Fno<', '1.20<2.50.'}], 'wherein a focal length of the second lens element is f2, a focal length of the fourth lens element is f4, a focal length of the optical photographing lens assembly is f, an axial distance ...

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16-01-2020 дата публикации

DOCUMENT FIELD DETECTION AND PARSING

Номер: US20200019768A1
Принадлежит:

A system and method for invoice field detection and parsing includes the steps of extracting character bounding blocks using optical character recognition (OCR) or digital character extraction (DCE), enhancing the image quality, analyzing the document layout based on imaging techniques, detecting the invoice field based on the machine learning techniques, and parsing the invoice field value based on the content information. 1. A method of detecting and extracting at least one of character and number values in a document field of a received analog or digital financial document , comprising:providing the analog or digital financial document as an input image or a PDF input;extracting an image layer, when the analog or digital financial document is the PDF input;extracting text and character blocks from the input image or the extracted image layer;extracting connected components from the input image or the extracted image layer and analyzing the extracted connected components to determine document layout information identifying a structure of the input image or the extracted image layer, the document layout information including character information and noncharacter information including at least one of barcodes, tables, and logos in said input image or the extract image layer;detecting a document field from the document layout information of the input image or the extracted image layer; andparsing the detected document field to extract at least one of character and number values from the extracted text and character blocks of the detected document field of the input image or the extracted image layer.2. A method as in claim 1 , wherein extracting text and character blocks comprises processing the input image or the extracted image layer using optical character recognition (OCR).3. A method as in claim 1 , further comprising enhancing an image quality of the input image or the extracted image layer prior to the analysis to determine the document layout information.4. ...

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16-01-2020 дата публикации

PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME

Номер: US20200020623A1
Принадлежит:

A package includes a chip formed in a first area of the package and a molding compound formed in a second area of the package adjacent to the first area. A first polymer layer is formed on the chip and the molding compound, a second polymer layer is formed on the first polymer layer, and a plurality of interconnect structures is formed between the first polymer layer and the second polymer layer. A metal-insulator-metal (MIM) capacitor is formed on the second polymer layer and electrically coupled to at least one of the plurality of interconnect structures. A metal bump is formed over and electrically coupled to at least one of the plurality of interconnect structures. 1. A package comprising:a chip and a molding compound adjacent to each other;a first polymer layer and a second polymer layer that are stacked on the chip and the molding compound, wherein the second polymer layer overlies the first polymer layer;a first interconnect structure between the first and second polymer layers;a capacitor on the second polymer layer and protruding through the second polymer layer to the first interconnect structure, wherein the capacitor comprises a lower electrode, a dielectric layer overlying the lower electrode, and an upper electrode overlying the dielectric layer;a barrier layer overlying and independent of the upper electrode, wherein the barrier layer is conductive;a metal layer overlying the barrier layer, wherein the capacitor, the barrier layer, and the metal layer collectively define a first common sidewall and collectively define a second common sidewall on an opposite side of the capacitor as the first common sidewall;an isolation coating covering the first and second polymer layers and the metal layer, wherein the isolation coating directly contacts a top surface of the metal layer continuously from the first common sidewall to the second common sidewall; anda conductive bump in an opening defined by the isolation coating and level with the capacitor.2. The ...

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10-02-2022 дата публикации

Hand-held massage gun and conversion mechanism thereof

Номер: US20220040032A1
Принадлежит: New Era AI Robotic Inc

A hand-held massage gun and conversion mechanism thereof are disclosed. The hand-held massage gun includes a massage gun body and a conversion mechanism. The massage gun body includes an output rod. The conversion mechanism includes a hollow shell, a movable block and return springs. The hollow shell is detachably connected to the massage gun body, and two ends of the hollow shell are provided with an opening and a long hole. The movable block is accommodated in the hollow shell. The movable block has an inclined surface, an abutting portion and a linkage rod inserted in the long hole. The output rod is inserted in the opening and abutted against the inclined surface. The return springs are elastically supported between the hollow shell and the abutting portion.

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24-01-2019 дата публикации

SMART ORNAMENT CHAIN AND DATA PROCESSING METHOD THEREOF

Номер: US20190021458A1
Автор: Chen Shuo, GUAN Enhui
Принадлежит:

A smart ornament chain and a data processing method are disclosed. The smart ornament chain includes an ornament chain body, and further includes illuminants, a collecting module, a driving module and a processing module arranged in the ornament chain body. The collecting module is configured to collect a current dress color of a user and/or a current ambient brightness. The driving module is configured to drive the illuminants to emit light. The processing module is configured to obtain a color and/or brightness of the ornament chain to be adjusted based on the current dress color and/or the current ambient brightness, and is further configured to control the driving module to perform display based on the color and/or brightness of the ornament chain to be adjusted. The ornament chain can adjust its own color and/or brightness automatically based on the current dress color of the user and/or the current ambient brightness. 1. A smart ornament chain , comprising: an ornament chain body , illuminants , a collecting module , a driving module and a processing module arranged in the ornament chain body; and wherein ,the collecting module is configured to collect a current dress color of a user or a current ambient brightness;the driving module is configured to drive the illuminants to emit light; andthe processing module is configured to obtain a color or brightness of the ornament chain to be adjusted based on the current dress color or the current ambient brightness; and to control the driving module to perform display based on the color or brightness of the ornament chain to be adjusted.2. The smart ornament chain according to claim 1 , wherein the ornament chain body comprises a chain part for wearing; and wherein claim 1 ,the collecting module is further configured to collect a pressure value on the chain part; the processing module is further configured to obtain the pressure value on the chain part, and determine whether the ornament chain is in an operating ...

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10-02-2022 дата публикации

TAP TOOL HOLDER

Номер: US20220040774A1
Принадлежит:

A tap tool holder for a tap tool is disclosed. The tap tool has a cylindrical body and a tap extended from the cylindrical body. The tap tool holder includes a bracket sleeve for inserting the tap and a positioning collar. An annular inner step is formed in one end of the bracket sleeve. The positioning collar is carried on the annular inner step. The positioning collar has an outer ring wall, and the outer ring wall is attached to the annular inner step. The positioning collar has an inner ring wall, and a shape of the inner ring wall corresponds to an outer side wall of the cylindrical body so as to sleeve the cylindrical body. With the positioning collar that can be replaced corresponding to tap tools, tap tools of various sizes can be positioned in the bracket sleeve to facilitate tapping. 1. A tap tool holder for a tap tool , in which the tap tool has a cylindrical body and a tap extended from one end of the cylindrical body along an axial direction of the cylindrical body , and the tap tool holder comprising:a bracket sleeve, two ends of the bracket sleeve being opened for inserting the tap, and one end of the bracket sleeve being a tool end, and an annular inner step being formed in the tool end; anda positioning collar, carried on the annular inner step so that an axial position of the positioning collar is positioned by the annular inner step; the positioning collar having an outer ring wall, and the outer ring wall being attached to the annular inner step so that a radial position of the positioning collar is positioned by the annular inner step; and the positioning collar having an inner ring wall, and a shape of the inner ring wall corresponding to an outer side wall of the cylindrical body so as to sleeve the cylindrical body.2. The tap tool holder according to claim 1 , wherein the bracket sleeve has at least one window on a side wall.3. The tap tool holder according to claim 1 , wherein another end of the bracket sleeve is a workpiece end claim 1 , ...

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26-01-2017 дата публикации

Interconnect Structure for Package-on-Package Devices and a Method of Fabricating

Номер: US20170025397A1
Принадлежит:

An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package. 1. A semiconductor device comprising:a first package comprising: a protective layer over a backside of the integrated circuit die;', 'a molding compound adjacent sidewalls of the integrated circuit die and the protective layer; and', 'through vias extending through the molding compound, a surface of the through vias being level with a surface of the protective layer., 'an integrated circuit die, the integrated circuit die having an active side and a backside, the active side having electrical contacts;'}2. The semiconductor device of claim 1 , wherein the protective layer is attached to the integrated circuit die using an adhesive.3. The semiconductor device of claim 1 , further comprising a second package mounted over the first package claim 1 , the second package being electrically coupled to the through vias.4. The semiconductor device of claim 3 , wherein the first package is electrically coupled to the second package using solder joints directly coupled to the through vias.5. The semiconductor device of claim 1 , wherein a surface of the protective layer is level with a surface of the through via.6. The semiconductor device of claim 5 , wherein the surface of the protective layer is level with a surface of the molding compound.7. The semiconductor device of claim 1 , further comprising one or more redistribution layers (RDLs) adjacent the molding compound and the active side of the integrated circuit die.8. A method of forming a semiconductor device claim 1 , the method comprising:forming a protective layer on a backside of a die using a ...

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25-01-2018 дата публикации

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Номер: US20180025992A1
Принадлежит:

A semiconductor package structure includes a redistribution layer (RDL), a chip, a plurality of interconnecting bumps and an encapsulant. The redistribution layer has a first surface and a second surface opposite to each other. The chip is disposed over the redistribution layer with a plurality of contact pads facing the first surface and electrically connected to the redistribution layer. The interconnecting bumps are disposed over the first surface and electrically connected to the redistribution layer. The encapsulant is disposed over the first surface of the redistribution layer, and the encapsulant encloses the chip and surrounds lateral walls of the interconnecting bumps. 1: A semiconductor package structure , comprising:a redistribution layer (RDL) having a first surface and a second surface opposite to each other;a chip disposed over the redistribution layer with a plurality of contact pads facing the first surface and electrically connected to the redistribution layer;a plurality of interconnecting bumps disposed over the first surface and electrically connected to the redistribution layer;a second chip disposed over the second surface and electrically connected to the redistribution layer; andan encapsulant disposed over the first surface of the redistribution layer, wherein the encapsulant encloses the chip and surrounds lateral walls of the interconnecting bumps.2: The semiconductor package structure of claim 1 , further comprising a circuit board disposed over the second surface of the redistribution layer claim 1 , and a plurality of external connectors disposed between the second surface and the circuit board to electrically connect the redistribution layer with the circuit board.3: The semiconductor package structure of claim 1 , further comprising a package disposed over the encapsulant and electrically connected to the redistribution layer through the interconnecting bumps.4: The semiconductor package structure of claim 1 , wherein each of the ...

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10-02-2022 дата публикации

Ai speech recognition system capable of selecting models

Номер: US20220044674A1
Принадлежит: National Chiao Tung University NCTU

The present invention provides a system for selecting a special speech recognition model through a general model of an AI speech recognition system for users to select an appropriate model. In addition to the AI speech recognition server of a general model, the present invention additionally prepares speech models in various fields, such as sports event model, financial news model, and game live model. Different users can choose different speech models according to their needs or fields, and they can get better services respectively. If the different users have no special choice, the AI speech recognition server of the general model provides speech recognition services for the different users.

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10-02-2022 дата публикации

METHOD FOR GENERATING CAPTION FILE THROUGH URL OF AN AV PLATFORM

Номер: US20220044675A1
Принадлежит:

The present invention provides a method for generating caption file through URL of an AV platform. By using various websites (such as YouTube, Instagram, Facebook, Twitter) for being inputted with the URL of a desired AV Platform and downloading a required AV file and inputting to an ASR (Automatic Speech Recognition) server according to the present invention. A speech recognition system in the ASR server can abstract an audio file from the AV file for a system operation to get a required caption file. Artificial Neural Networks are used in the present invention. 1. A method for generating caption file through URL of an AV platform , comprising steps as below:(a) a server of an automatic speech recognition first parses a URL description given by a user and finds a relevant AV (audio-video) platform;(b) sending an HTTP request to a web application interface provided, by a web server of the AV platform to obtain an HTTP reply of the web server;(c) parsing a content in the HTTP reply to obtain a URL of an AV file, and download the AV file;(d) abstracting an audio track in the AV file to obtain an audio sample, then send the audio sample to a speech recognition system for processing, and then generate a caption file.2. The method for generating caption file through URL of an AV platform according to claim 1 , wherein the speech recognition system has a sentence breaking mechanism claim 1 , firstly judging if a speech playing is ended. If the speech playing is not ended claim 1 , detecting a beginning of a sentence claim 1 , and then detecting a pause of the sentence claim 1 , thereafter translating the sentence and recording a time interval claim 1 , go back to judge if the speech playing is ended claim 1 , if not ended claim 1 , then repeat to translate claim 1 , otherwise a processing is ended to form a caption file.3. The method for generating caption file through URL of an AV platform according to claim 1 , wherein the speech recognition system includes a pre- ...

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10-02-2022 дата публикации

PACKAGE STRUCTURE WITH REINFORCED ELEMENT AND FORMATION METHOD THEREOF

Номер: US20220045016A1
Принадлежит:

A package structure and a formation method of a package structure are provided. The method includes forming multiple conductive vias in a carrier substrate and forming a redistribution structure over the carrier substrate. The redistribution structure has multiple polymer-containing layers and multiple conductive features. The method also includes disposing multiple chip structures over the redistribution structure. The method further includes bonding the carrier substrate to a package structure. 1. A method for forming a package structure , comprising:forming a plurality of conductive structures in a carrier substrate;forming a redistribution structure over the carrier substrate, wherein the redistribution structure has a plurality of polymer-containing layers and a plurality of conductive features;bonding a plurality of chip structures over the redistribution structure;forming a protective layer over the redistribution structure to surround the chip structures; andforming a plurality of conductive connectors over a surface of the carrier substrate, wherein the carrier substrate is between the redistribution structure and the conductive connectors.2. The method for forming a package structure as claimed in claim 1 , further comprising bonding the conductive connectors to a package substrate.3. The method for forming a package structure as claimed in claim 1 , further comprising thinning the carrier substrate to expose the conductive structures before the conductive connectors are formed.4. The method for forming a package structure as claimed in claim 1 , wherein the carrier substrate is made of a semiconductor material.5. The method for forming a package structure as claimed in claim 4 , further comprising forming a dielectric layer in the carrier substrate before the conductive structures are formed claim 4 , wherein the dielectric layer electrically isolates the carrier substrate and the conductive structures.6. The method for forming a package structure as ...

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23-01-2020 дата публикации

METHOD FOR FORMING CHIP PACKAGE STRUCTURE

Номер: US20200027837A1

A method for forming a chip package structure is provided. The method includes forming a first redistribution structure over a first carrier substrate. The method includes bonding a chip structure to the first surface through a first conductive bump. The method includes forming a first molding layer over the first redistribution structure. The method includes removing the first carrier substrate. The method includes forming a second conductive bump over the second surface. The method includes forming a second redistribution structure over a second carrier substrate. The method includes bonding the first redistribution structure to the third surface. The method includes forming a second molding layer over the second redistribution structure. The method includes removing the second carrier substrate. The method includes removing a portion of the second redistribution structure from the fourth surface. The method includes forming a third conductive bump over the fourth surface. 1. A method for forming a chip package structure , comprising:forming a first redistribution structure over a first carrier substrate, wherein the first redistribution structure has a first surface and a second surface;bonding a chip structure to the first surface through a first conductive bump;forming a first molding layer over the first surface and surrounding the chip structure;removing the first carrier substrate;forming a second conductive bump over the second surface;forming a second redistribution structure over a second carrier substrate, wherein the second redistribution structure has a third surface and a fourth surface;bonding the first redistribution structure to the third surface through the second conductive bump;forming a second molding layer over the third surface and surrounding the first molding layer, the first redistribution structure, and the chip structure;removing the second carrier substrate;partially removing the second redistribution structure from the fourth surface; ...

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31-01-2019 дата публикации

OFFICE SEAT

Номер: US20190029428A1
Принадлежит:

An office seat is disclosed. The office seat includes a seat body; an adjustment mechanism for adjusting a sitting posture of a user by adjusting a state of the seat body, and the adjustment mechanism being provided on the seat body; an image capture device for detecting the contour of the user's body; a controller, the controller being connected to the adjustment mechanism and the image capture device, respectively, and controlling the adjustment mechanism to adjust the seat body according to the detection result of the image capture device. In certain embodiments the office seat may be able to adjust the user's sitting posture, protect the user's physical health, be comfortable in use. 1. A seat comprising:a seat body;an adjustment mechanism for adjusting a sitting posture of a user by adjusting a state of the seat body, and the adjustment mechanism being provided on the seat body;an image capture device for detecting a contour of the user's body;a controller, the controller being connected to the adjustment mechanism and the image capture device, respectively, and controlling the adjustment mechanism to adjust the seat body according to a detection result of the image capture device.2. The seat according to claim 1 , wherein the seat body comprises a backrest claim 1 , a bottom plate and an armrest claim 1 , and the adjustment mechanism adjusts at least one of a height of the seat body claim 1 , an angle of the backrest claim 1 , and a height of the armrest.3. The seat according to claim 2 , wherein the controller controls the adjustment mechanism to adjust the height of the seat body according to an angle of a user's lower jaw line and a vertical or horizontal direction detected by the image capture device.4. The seat according to claim 3 , wherein the controller controls the adjustment mechanism to raise the height of the seat body when the angle between the user's lower jaw line and the vertical direction detected by the image capture device is greater than a ...

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30-01-2020 дата публикации

Monitoring System and Monitoring Method

Номер: US20200029915A1
Принадлежит:

Disclosed are a monitoring system and a monitoring method. The monitoring system includes: a collection device, configured to collect feature data of a baby; and a processor, coupled to the collection device and configured to receive the feature data collected by the collection device, determine a state condition of the baby according to the feature data, and output prompt information corresponding to the state condition. 1. A monitoring system , comprising:a collection device, configured to collect feature data of a baby; anda processor, coupled to the collection device and configured to receive the feature data collected by the collection device, determine a state condition of the baby according to the feature data, and output prompt information corresponding to the state condition.2. The monitoring system according to claim 1 , further comprising: a storage device claim 1 , coupled to the processor and configured to store a preset database claim 1 , the preset database storing preset feature data corresponding to the state condition of the baby claim 1 , andthe processor is configured to determine a state condition corresponding to the preset feature data as the state condition of the baby in the case where the feature data falls within a range of the preset feature data.3. The monitoring system according to claim 2 , further comprising: a timing device claim 2 , coupled to the processor and configured to obtain a crying time of the baby according to the feature data of the baby claim 2 , andthe processor is configured to receive the crying time and correct the state condition corresponding to the preset feature data in the preset database in the case where the crying time exceeds a preset crying time threshold.4. The monitoring system according to claim 2 , further comprising: a timing device claim 2 , coupled to the processor and configured to obtain a crying time of the baby according to the feature data of the baby claim 2 , andthe processor is configured to ...

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17-02-2022 дата публикации

Camera Surveillance Planning and Tracking System

Номер: US20220051027A1
Принадлежит:

Disclosed herein are system, method, and computer program product embodiments for camera surveillance planning and tracking using, for example, infrared technologies. An embodiment operates by receiving a camera specification input and placement input, calculating a surveillance coverage based on the camera specification and the placement input, displaying the surveillance coverage on a map, and identifying at least one stereo pair. 1. A computer-implemented method for tracking an object of interest , comprising:detecting the object of interest across a set threshold number of frames of each continuous video stream from a corresponding camera of a valid stereo pair of cameras;in response to detecting the object of interest across the set threshold number of frames of each continuous video stream, calculating a geolocation of the object of interest by comparing a 2D location of the object of interest in a frame from a first camera of the valid stereo pair of cameras to a 2D location of the object of interest in another frame from a second camera of the valid stereo pair of cameras; andtracking the geolocation of the object of interest.2. The computer-implemented method of claim 1 , further comprising:{'claim-text': ['determining that the first camera and the second camera are at different locations;', 'determining that a portion of a surveillance coverage of the first camera overlaps with a portion of a surveillance coverage of the second camera; and', 'determining that a functional range of view of the first camera overlaps with a functional range of view of the second camera.'], '#text': 'determining the first camera and the second camera are arranged in the valid stereo pair of cameras by:'}3. The computer-implemented method of claim 1 , further comprising:determining the first camera and the second camera are arranged in the valid stereo pair of cameras by determining that a principle ray of the first camera and a principle ray of the second camera subtend at an ...

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01-02-2018 дата публикации

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20180033770A1
Принадлежит:

A semiconductor package structure includes an encapsulant, a first chip, a second chip, a first redistribution layer and a second redistribution layer. The encapsulant has a first surface and a second surface opposite to each other. The first chip is in the encapsulant, wherein the first chip includes a plurality of contact pads exposed from the first surface of the encapsulant. The second chip is in the encapsulant, wherein second chip includes a plurality of contact pads exposed from the second surface of the encapsulant. The first redistribution layer is over the first surface of the encapsulant and electrically connected to the contact pads of the first chip. The second redistribution layer is over the second surface of the encapsulant and electrically connected to the contact pads of the second chip. 2. The semiconductor package structure of claim 1 , wherein a lateral surface of the first chip and a lateral surface of the second chip are surrounded by the encapsulant.3. The semiconductor package structure of claim 1 , whereinthe first chip is a passive device chip, and the second chip is an active device chip.4. The semiconductor package structure of claim 1 , further comprising a plurality of interconnectors in the encapsulant claim 1 , wherein the interconnectors are exposed from the first surface and the second surface of the encapsulant claim 1 , and the first redistribution layer and the second redistribution layer are electrically connected to each other through the interconnectors.5. The semiconductor package structure of claim 1 , wherein each of the first redistribution layer and the second redistribution layer comprises a conductive pattern claim 1 , and an insulation layer exposing a portion of the conductive pattern.6. The semiconductor package structure of claim 5 ,further comprising:a circuit board, wherein the first external connectors are between the insulation layer of the second redistribution layer and the circuit board, and the conductive ...

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09-02-2017 дата публикации

PIXEL STRUCTURE

Номер: US20170040394A1
Принадлежит:

A pixel structure includes a metal oxide semiconductor layer, a first insulating layer, a second insulating layer, a first conductive layer, a passivation layer, a second conductive layer and a pixel electrode. The metal oxide semiconductor layer includes a second semiconductor pattern. The first insulating layer includes a first capacitance dielectric pattern disposed on the second semiconductor pattern. The second insulating layer includes a second capacitance dielectric pattern disposed on the first capacitance dielectric pattern. The first conductive layer includes a electrode pattern disposed on the second capacitance dielectric pattern. The passivation layer covers the first conductive layer. The second conductive layer includes a second electrode disposed on the passivation layer. The second electrode is electrically connected to the second semiconductor pattern. The second electrode is disposed to overlap the electrode pattern. The second semiconductor pattern, the electrode pattern and the second electrode form a storage capacitor. 1. A pixel structure , comprising:a metal oxide semiconductor layer comprising a first semiconductor pattern and a second semiconductor pattern, wherein the first semiconductor pattern comprises a first doping region, a second doping region and a channel region, the first doping region and the second doping region are disposed respectively on two sides of the channel region, and the second semiconductor pattern comprises a contact portion and an electrode portion;a first insulating layer comprising a first gate insulation pattern and a first capacitance dielectric pattern, wherein the first gate insulation pattern is disposed on the first semiconductor pattern of the metal oxide semiconductor layer, and the first capacitance dielectric pattern is disposed on the second semiconductor pattern of the metal oxide semiconductor layer;a second insulating layer comprising a second gate insulation pattern and a second capacitance ...

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24-02-2022 дата публикации

METHOD FOR UPDATING SPEECH RECOGNITION SYSTEM THROUGH AIR

Номер: US20220059081A1
Принадлежит:

The present invention provides a method for updating speech recognition system through air. Client ASR servers connect with a central ASR cloud server through Internet. New version of ASR system is stored in the central ASR cloud server for being selected and downloaded by the client ASR servers for using. 1. A method for updating speech recognition system through air , comprising steps as below:(a) setting up at least a client ASR server for providing cloud automatic speech recognition, and setting up a central ASR cloud server for connecting with the client ASR server through Internet;(b) a new version of automatic speech recognition system is put at the central ASR cloud server for being selected by the client ASR server through Internet for downloading and using.2. The method for updating speech recognition system through air according to claim 1 , wherein the client ASR server selects the new version of automatic speech recognition system through Internet claim 1 , comprising communication steps of updating as below:(a) the client ASR server actively inquire the central ASR cloud server about the new version;(b) the central ASR cloud server replies with the new version;(c) the client ASR server compares the new version with version in a profile thereof, if the same as the new version, then stop cloud updating;(d) if different with the new version, the client ASR server requests the central ASR cloud server for downloading the new version.3. The method for updating speech recognition system through air according to claim 2 , wherein the client ASR server requests the central ASR cloud server for downloading the new version claim 2 , comprising communication steps of updating as below:(a) the new version has been packaged into a ZIP file by the central ASR cloud server, and an MD5 value thereof will be calculated out, and then the ZIP file and the MD5 value will be downloaded to the client ASR server;(b) the client ASR server performs an MD5 calculation for the ...

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24-02-2022 дата публикации

Source/drain structure for semiconductor devices

Номер: US20220059653A1

The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, an insulating stack formed over the substrate, a vertical structure formed through the insulating stack, a source/drain region formed over the vertical structure, and an isolation structure formed adjacent to the source/drain region and protruding the insulating stack. The source/drain region can include a first side surface and a second side surface. A lateral separation between the first side surface and the vertical structure can be greater than an other lateral separation between the second side surface and the vertical structure.

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18-02-2021 дата публикации

DIRECT IMMUNOHISTOCHEMISTRY AND IMMUNOCYTOCHEMISTRY METHODS

Номер: US20210048432A1
Принадлежит:

The present disclosure provides methods, kits, and compositions for direct immunohistochemical (IHC) staining and direct immunocytochemistry (ICC) techniques, including applications to multiplex assays, chemically stained samples, and cytology samples. 1. A method for detecting a plurality of target epitopes in a sample , the method comprising:(a) a first antibody binding step comprising contacting the sample with a first polymeric-enzyme/antibody conjugate comprising a plurality of a first enzyme molecule and a first antibody recognizing a first target epitope in a condition suitable for forming a first complex comprising the first target epitope and the first polymeric-enzyme/antibody conjugate;(b) a second antibody binding step comprising contacting the sample with a second polymeric-enzyme/antibody conjugate comprising a plurality of a second enzyme molecule and a second antibody recognizing a second target epitope in a condition suitable for forming a second complex comprising the second target epitope and the second polymeric-enzyme/antibody conjugate;(c) a first antibody removal step comprising substantially removing from the sample the first polymeric-enzyme/antibody conjugate that does not form the first complex;(d) a second antibody removal step comprising substantially removing from the sample the second polymeric-enzyme/antibody conjugate that does not form the second complex;(e) a first enzyme substrate contact step comprising contacting the sample with a first enzyme substrate composition for the first enzyme molecule; and(f) a second enzyme substrate contact step comprising contacting the sample with a second enzyme substrate composition for the second enzyme molecule,thereby allowing for detection of the plurality of target epitopes in the sample.2. The method of claim 1 , wherein the first enzyme molecule and the second enzyme molecule are different.3. The method of claim 2 , wherein the first antibody binding step and the second antibody binding ...

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18-02-2016 дата публикации

Anonymous Server Based User Settings Protection

Номер: US20160050218A1
Автор: Chen Shuo, LI Boxin, Xu Zhenbin
Принадлежит: Microsoft Technology Licensing, LLC

Systems and methods for verifying an application data modification are described herein. In one example, a method includes detecting modified application data in a computing device and determining the modified application data did not originate from an automatic program. The method also includes sending an identifier and the modified application data to a signing server. Furthermore, the method includes receiving encrypted data comprising the identifier and the modified application data from the signing server. Additionally, the method includes storing the encrypted data in the computing device. 1. A method for verifying an application data modification comprising:detecting modified application data in a computing device;determining the modified application data did not originate from an automatic program;sending an identifier and the modified application data to a signing server;receiving encrypted data comprising the identifier and the modified application data from the signing server; andstoring the encrypted data in the computing device.2. The method of claim 1 , wherein determining the modified application data did not originate from the automatic program comprises:sending an alphanumeric string to a user based on contact information; andreceiving the alphanumeric string as input.3. The method of claim 1 , wherein determining the modified application data did not originate from the automatic program comprises:requesting a challenge-response test from the signing server;receiving a challenge-response test; anddetecting a correct response to the challenge-response test.4. The method of claim 1 , wherein storing the encrypted data in the computing device comprises storing the encrypted data in a registry.5. (canceled)6. A computing device for verifying an application data modification comprising:a processor to execute processor executable code; detect modified application data in a computing device;', 'request a challenge-response test from a signing server to ...

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22-02-2018 дата публикации

POSITIONER AND POSITIONING EQUIPMENT

Номер: US20180052340A1
Принадлежит:

The present disclosure relates to a positioner and positioning equipment, and relates to the field of display technology. The positioner includes a bottom face and a first side face which are perpendicular and adjacent to each other, the first side face being configured to abut against a work piece to be positioned so as to position the work piece to be positioned, the bottom face being provided with a magnetic member. 1. A positioner comprising a bottom face and a first side face which are perpendicular and adjacent to each other , the first side face being configured to abut against a work piece to be positioned so as to position the work piece to be positioned , the bottom face being provided with a magnetic member.2. The positioner according to claim 1 , wherein the positioner comprises a bottom plate and a side plate which are arranged in an L-shape claim 1 , the bottom plate comprising the bottom face claim 1 , and the side plate comprising the first side face.3. The positioner according to claim 1 , wherein the positioner further comprises a first guide structure on the bottom face; andthe first guide structure is configured to guide the positioner when the positioner is moved.4. The positioner according to claim 3 , wherein the first guide structure is a guide beam on the bottom face.5. The positioner according to claim 4 , wherein the number of the guide beam is at least two and the guide beams are arranged to be parallel to each other.6. The positioner according to claim 1 , wherein the first side face comprises a bar-shaped protrusion.7. The positioner according to claim 6 , wherein a side of the bar-shaped protrusion which abuts against the work piece to be positioned is an arc surface.8. The positioner according to claim 6 , wherein the bar-shaped protrusion extends from the bottom of the first side face to the top of the first side face in a direction perpendicular to the bottom face.9. The positioner according to claim 1 , wherein the magnetic member ...

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21-02-2019 дата публикации

SYSTEM FOR MONITORING DIET

Номер: US20190057766A1
Принадлежит:

A system for monitoring diet. The system for monitoring diet includes: an information transmitter configured to transmit information of a food to be eaten in response to an operation of an eater taking out the food to be eaten; and an information processor configured to receive the information of the food from the information transmitter and to determine whether the food to be eaten meets requirements or not according to the information of the food to be eaten and a pre-stored information regarding the food that the eater needs to ingest. 1. A system for monitoring diet , comprising:an information transmitter configured to transmit information of a food to be eaten in response to an operation of an eater taking out the food to be eaten; andan information processor configured to receive the information of the food from the information transmitter and to determine whether the food to be eaten meets requirements or not according to the information of the food to be eaten and a pre-stored information regarding the food that the eater needs to ingest.2. The system according to claim 1 , wherein the information processor comprises:an information reader configured to receive the information of the food to be eaten and to transmit the read information of the food; anda computing device configured to receive the read information of the food from the information reader and to determine whether the food to be eaten meets requirements or not according to the information of the food to be eaten and the pre-stored information regarding the food that the eater needs to ingest.3. The system according to claim 1 , wherein claim 1 , in response to the information of the food comprising a weight of the food claim 1 , the information processor is configured to determine whether the weight of the food to be eaten is within a weight range of the food that the eater needs to ingest or not according to the weight of the food to be eaten and a pre-stored range of the weight of the food that ...

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28-02-2019 дата публикации

IMAGING LENS SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE

Номер: US20190064484A1
Принадлежит: LARGAN PRECISION CO.,LTD.

An imaging lens system includes five lens elements, which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. At least one of an object-side surface and an image-side surface of the fifth lens element has at least one inflection point. The object-side surface and the image-side surface of the fifth lens element are both aspheric. 1. An imaging lens system comprising five lens elements , the five lens elements being , in order from an object side to an image side: a first lens element , a second lens element , a third lens element , a fourth lens element and a fifth lens element; wherein at least one of an object-side surface of the fifth lens element and an image-side surface of the fifth lens element has at least one inflection point , and the object-side surface and the image-side surface of the fifth lens element are both aspheric;{'b': '45', 'claim-text': [{'br': None, 'i': f×ImgH', 'TL', 'f−TL, '7.0<()/[(×()];'}, {'br': None, 'i': ' Подробнее

12-03-2015 дата публикации

METHOD FOR FABRICATING LIGHT EMITTING DIODE (LED) DICE WITH WAVELENGTH CONVERSION LAYERS

Номер: US20150072455A1
Автор: Chen De-Shuo, Yen Jui-Kang
Принадлежит: SEMILEDS OPTOELECTRONICS CO., LTD.

A method for fabricating light emitting diode (LED) dice includes the step of providing a wavelength conversion layer on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy, such as electromagnetic radiation or heat. The method also includes the step of exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer, removing the wavelength conversion layer from the substrate, and attaching the wavelength conversion layer to the light emitting diode (LED) die. 1. A method for fabricating light emitting diode (LED) dice comprising:providing a light emitting diode (LED) die having a desired configuration;providing a wavelength conversion layer contained on a substrate on an adhesive layer configured to have reduced adhesiveness upon exposure to a physical energy;exposing the adhesive layer on the substrate to the physical energy to reduce the adhesiveness of the adhesive layer and facilitate removal of the wavelength conversion layer from the substrate;removing the wavelength conversion layer from the substrate: andattaching the wavelength conversion layer to the light emitting diode (LED) die.2. The method of wherein the providing the light emitting diode (LED) die comprises providing a plurality of wavelength conversion layers on a substrate on the adhesive layer and the exposing step comprises exposing a selected area of the adhesive layer having a peripheral shape corresponding to that of the light emitting diode (LED) die.3. The method of wherein the physical energy comprises ultraviolet radiation and the exposing step is performed using an ultraviolet radiation curing apparatus.4. The method of wherein the physical energy comprises heat and the exposing step is performed using a hot bar curing apparatus.5. The method of wherein the wavelength conversion layer comprises a feature selected from the group consisting of cut outs claim 1 , openings and slots.6 ...

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12-03-2015 дата публикации

STEPPED SPRING CONTACT

Номер: US20150072543A1
Принадлежит:

In an embodiment, a stepped spring contact may have a first portion, a transition portion, and a second portion. The first portion may include a plurality of windings whose pitch may vary. The second portion may include a plurality of windings that are closely wound. A pitch of the windings contained in the second portion may be, for example, constant. The transition portion may include a winding that may make mechanical and electrical contact with a first electrical conductor (e.g., a pad contained on a printed circuit board (PCB)). The first portion may include a tip. The tip may be, for example, flat shaped or conically shaped. The tip may make electrical contact with a second electrical conductor (e.g., a terminal connector). In operation, the stepped spring contact may provide electrical continuity between the first electrical conductor and the second electrical conductor. 1. A stepped spring contact comprising:a first portion having a plurality of windings;a second portion having a plurality of windings; anda transition portion, the transition portion having a winding that makes electrical contact with a pad on a printed circuit board (PCB), a diameter of the winding in the transition portion being greater than a diameter of the plurality of windings in the second portion at their widest point.2. The stepped spring contact of claim 1 , wherein a diameter of the plurality of windings in the first portion at their widest point is greater than the diameter of the plurality of windings in the second portion at their widest point.3. The stepped spring contact of claim 1 , wherein the first portion includes a tip.4. The stepped spring contact of claim 3 , wherein the tip makes electrical contact with a terminal connector associated with a device.5. The stepped spring contact of claim 4 , wherein the device is a micro-strain gauge (MSG) device.6. The stepped spring contact of claim 3 , wherein the tip is flat shaped claim 3 , andwherein a plurality of windings ...

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08-03-2018 дата публикации

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Номер: US20180068978A1
Принадлежит:

A semiconductor package structure includes a redistribution (RDL) layer, a first chip, at least one second chip, an encapsulant and a third chip. The redistribution layer has a first surface and a second surface opposite to each other. The first chip is over the first surface of the redistribution layer and electrically connected to the redistribution layer. The second chip is over the first surface of the redistribution layer. The second chip includes a plurality of through via structures. The encapsulant is over the first surface of the distribution layer, wherein the encapsulant surrounds the first chip and the second chip. The third chip is over the encapsulant and electrically connected to the first chip through the through via structures of the second chip and the redistribution layer. 1. A semiconductor package structure , comprising:a redistribution layer having a first surface and a second surface opposite to each other;a first chip over the first surface of the redistribution layer and electrically connected to the redistribution layer;a second chip over the first surface of the redistribution layer, wherein the second chip includes a plurality of through via structures;an encapsulant over the first surface of the distribution layer, wherein the encapsulant surrounds the first chip and the second chip; anda third chip over the encapsulant and electrically connected to the first chip through the through via structures of the second chip and the redistribution layer.2. The semiconductor package structure of claim 1 , wherein the first chip includes a plurality of electrical terminals facing the first surface of the redistribution layer and electrically connected to the redistribution layer.3. The semiconductor package structure of claim 1 , wherein a first terminal of the through via structure is coupled to the redistribution layer claim 1 , and a second terminal of the through via structure is coupled to the third chip.4. The semiconductor package structure ...

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24-03-2022 дата публикации

HAND-HELD MASSAGE DEVICE WITH MULTI-MODE OF ACTION

Номер: US20220087894A1
Принадлежит:

A hand-held massage device includes a housing, a first turning plate, a second turning plate, an output rod, and a driving assembly. The housing includes an opening. The first turning plate is accommodated in the housing. The first turning plate has a concave-convex surface. The second turning plate is disposed between the opening and the first turning plate. The output rod is inserted in the second turning plate and rotated with the second turning plate. One end of the output rod is inserted to the opening and another end is abutted to the concave-convex surface. The driving assembly is connected to the first turning plate and the second turning plate. The driving assembly drives the first turning plate to rotate, drives the second turning plate to rotate or simultaneously drives the first turning plate and the second turning plate to rotate. 1. A hand-held massage device with multi-mode of action , the hand-held massage device comprising:a housing, comprising an opening;a first turning plate, accommodated in the housing and comprising a concave-convex surface configured correspondingly to the opening;a second turning plate, accommodated in the housing and disposed between the opening and the first turning plate;an output rod, inserted in the second turning plate and rotated by the second turning plate, wherein one end of the output rod is inserted to and exposed from the opening and another end of the output rod is abutted to the concave-convex surface; anda driving assembly, detachably connected to the first turning plate and the second turning plate, and the driving assembly driving the first turning plate to rotate, or driving the second turning plate to rotate, or simultaneously driving the first turning plate and the second turning plate to rotate.2. The hand-held massage device with multi-mode of action according to claim 1 , further comprising a return spring claim 1 , wherein a limiting hole is disposed on the second turning plate; the output rod is ...

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11-03-2021 дата публикации

CHIP PACKAGE STRUCTURE WITH CAVITY IN INTERPOSER

Номер: US20210074600A1
Принадлежит:

A package structure and a method of forming the same are provided. The package structure includes a package substrate, an interposer substrate over the package substrate, and multiple semiconductor devices over the interposer substrate. The interposer substrate also has one or more cavities to receive or accommodate additional semiconductor devices that are not allowed to be mounted on the surface of the interposer substrate. The cavities enable a thinner overall package structure. Some semiconductor devices received in the interposer substrate cavities may also be electrically connected to the interposer substrate and/or the semiconductor devices over the interposer substrate in order to improve the electrical performance of the overall package structure. 1. A package structure , comprising:a package substrate;an interposer substrate disposed over the package substrate, wherein the interposer substrate includes a silicon substrate, and has a bottom surface facing and adjacent to the package substrate and a first cavity formed on the bottom surface;a first semiconductor device received in the first cavity and electrically connected to the interposer substrate; anda second semiconductor device disposed on a top surface of the interposer substrate opposite the bottom surface.2. The package structure as claimed in claim 1 , wherein the first semiconductor device is disposed on a bottom surface of the first cavity claim 1 , and the bottom surface of the first cavity is spaced apart from the top surface of the interposer substrate.3. The package structure as claimed in claim 1 , wherein the first semiconductor device is separated from the package substrate by a gap.4. The package structure as claimed in claim 1 , wherein the package substrate has a top surface facing and adjacent to the interposer substrate claim 1 , and a second cavity is formed on the top surface of the package substrate and aligned with the first cavity of the interposer substrate claim 1 , wherein ...

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11-03-2021 дата публикации

Chip package structure having warpage control and method of forming the same

Номер: US20210074602A1

A package structure and a method of forming the same are provided. The package structure includes a package substrate, an interposer substrate, a first semiconductor device, a second semiconductor device, and a protective layer. The interposer substrate is disposed over the package substrate. The first semiconductor device and the second semiconductor device are disposed over the interposer substrate, wherein the first semiconductor device and the second semiconductor device are different types of electronic devices. The protective layer is formed over the interposer substrate to surround the first semiconductor device and the second semiconductor device. The second semiconductor device is exposed from the protective layer and the first semiconductor device is not exposed from the protective layer.

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11-03-2021 дата публикации

CHIP PACKAGE STRUCTURE WITH INTEGRATED DEVICE INTEGRATED BENEATH THE SEMICONDUCTOR CHIP

Номер: US20210074678A1
Принадлежит:

A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip over the package substrate, and at least one integrated device integrated with the semiconductor chip. The integrated device is integrated directly beneath the semiconductor chip in order to facilitate signal transmission. Consequently, the signal integrity and the power integrity of the package structure are improved. In addition, the integrated device does not take up installation space over the package substrate, so the size of the package substrate and of the overall package structure can also be reduced. 1. A package structure , comprising:a package substrate;a semiconductor chip disposed over the package substrate, wherein the semiconductor chip has a lower surface facing the package substrate; andan integrated device disposed between the package substrate and the semiconductor chip and bonded to the lower surface of the semiconductor chip.2. The package structure as claimed in claim 1 , wherein the integrated device is located below the semiconductor chip claim 1 , and is located within boundaries of the semiconductor chip when viewed in a direction perpendicular to the lower surface of the semiconductor chip.3. The package structure as claimed in claim 1 , wherein the integrated device is electrically connected to the semiconductor chip through conductive structures between the lower surface of the semiconductor chip and the integrated device.4. The package structure as claimed in claim 3 , further comprising an underfill element configured to surround the conductive structures claim 3 , wherein a portion of the underfill element is between the lower surface of the semiconductor chip and the integrated device.5. The package structure as claimed in claim 1 , wherein the semiconductor chip is electrically connected to the package substrate through conductive structures between the lower surface of the semiconductor chip ...

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11-03-2021 дата публикации

CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Номер: US20210074682A1
Принадлежит:

A package structure and a method of forming the same are provided. The package structure includes a package substrate and an interposer substrate over the package substrate. The interposer substrate has a first surface facing the package substrate and a second surface opposite the first surface. A first semiconductor device is disposed on the first surface, and a second semiconductor device is disposed on the second surface. Conductive structures are disposed between the interposer substrate and the package substrate. The first semiconductor device is located between the conductive structures. A first side of the first semiconductor device is at a first distance from the most adjacent conductive structure, and a second side of the first semiconductor device is at a second distance from the most adjacent conductive structure. The first side is opposite the second side, and the first distance is greater than the second distance. 1. A package structure , comprising:a package substrate;an interposer substrate disposed over the package substrate, wherein the interposer substrate has a first surface facing the package substrate and a second surface opposite the first surface;a first semiconductor device disposed on the first surface of the interposer substrate;a second semiconductor device disposed on the second surface of the interposer substrate; anda plurality of conductive structures disposed between the interposer substrate and the package substrate, configured to bond the interposer substrate to the package substrate,wherein the first semiconductor device is located between the conductive structures,wherein a first side of the first semiconductor device is at a first distance from the most adjacent conductive structure in a first direction, and a second side of the first semiconductor device is at a second distance from the most adjacent conductive structure in the first direction, wherein the first side is opposite the second side, and the first distance is greater ...

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05-06-2014 дата публикации

Backlight Driving Method, Backlight Driving Device, and Display Device

Номер: US20140152710A1
Автор: Chen Shuo
Принадлежит: BOE Technology Group Co., Ltd.

The invention discloses a backlight driving method, a backlight driving device, and a display device. The method comprises steps of: acquiring turn-on timings of respective areas of a backlight source of a display device and an opening timing of a 3D glasses; adjusting driving signals for the respective areas of the backlight source based on each length of overlapping time between the opening timing of the 3D glasses and each of the turn-on timings of the respective areas of the backlight source, thus making brightness of light from pictures corresponding to the respective areas of the backlight source in the display device be the same, said light being received through the 3D glasses; and driving the corresponding areas in the backlight source to be turned on by using the adjusted driving signals for the respective areas of the backlight source. 1. A backlight driving method , wherein the method includes steps of:acquiring turn-on timings of respective areas of a backlight source of a display device and an opening timing of a 3D glasses;adjusting driving signals for the respective areas of the backlight source based on each length of overlapping time between the opening timing of the 3D glasses and each of the turn-on timings of the respective areas of the backlight source, thus making brightness of received light from pictures corresponding to the respective areas of the backlight source in the display device be the same, said light being received through the 3D glasses; anddriving the corresponding areas in the backlight source to be turned on by using the adjusted driving signals for the respective areas of the backlight source.2. The backlight driving method as claimed in claim 1 , wherein the step of adjusting the driving signals for the respective areas of the backlight source further comprises:{'sub': 1', '2', 'n, 'calculating the overlapping time ΔT, ΔT, . . . , ΔTbetween the opening timing of the 3D glasses and each of the turn-on timings of the respective ...

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15-03-2018 дата публикации

INTEGRATED PRESSURE AND TEMPERATURE SENSOR

Номер: US20180073950A1
Принадлежит: SENSATA TECHNOLOGIES, INC.

A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process. 1. A combined temperature and pressure sensing device , comprising:a cylindrical body defining a central axis; 'a tubular orifice offset from the central axis and extending from an open proximal end of the tubular orifice to an enclosed distal end of the tubular orifice;', 'a first cavity extending through the cylindrical body adjacent the central axis, the first cavity comprising 'an second orifice extending from the open distal end of the second cavity toward the proximal through-hole and partially surrounding the tubular orifice;', 'a second cavity extending through the cylindrical body from an open distal end of the second cavity to a proximal through-hole in the cylindrical body offset from the central axis, the second cavity comprisinga wall defining a boundary between the tubular orifice and the second orifice.2. The device of claim 1 , wherein the wall includes a semi-circular geometry in cross-section.3. The device of claim 1 , comprising:a lobe extending distally from the cylindrical body and including the enclosed distal end of the tubular orifice.4. The device of claim 1 , comprising: a conductive proximal surface;', 'a temperature sensing ...

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05-03-2020 дата публикации

Electron donor biofilm carrier and preparation method thereof

Номер: US20200071214A1
Принадлежит: Dalian University of Technology

The present disclosure provides an electron donor biofilm carrier and preparation method thereof. The electron donor biofilm carrier is mainly used in anaerobic or anoxic suspended carrier biofilm technologies. Electron donors with a standard electrode potential below 100 My are used as the functional material for preparation of electron donorbiofilm carrier. The electron donor biofilm carrier may contribute to the enrichment of the biofilm functional bacteria and the improvement on treatment performance of the anaerobic or anoxic suspended carrier biofilm reactor.

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24-03-2022 дата публикации

RANDOM-ACCESS PERFORMANCE FOR PERSISTENT MEMORY

Номер: US20220091989A1
Принадлежит:

A mapping correspondence between memory addresses and request counts and a cache line flusher are provided, enabling selective cache flushing for persistent memory in a computing system to optimize write performance thereof. Random writes from cache memory to persistent memory are prevented from magnifying inherent phenomena of write amplification, enabling computing systems to implement persistent memory as random-access memory, at least in part. Conventional cache replacement policies may remain implemented in a computing system, but may be effectively overridden by operations of a cache line flusher according to example embodiments of the present disclosure preventing conventional cache replacement policies from being triggered. Implementations of the present disclosure may avoid becoming part of the critical path of a set of computer-executable instructions being executed by a client of cache memory, minimizing additional computation overhead in the critical path. 1. A method comprising:tracking write request counts mapped to write-traced memory addresses of a cache memory;filtering, by a cache line flusher, traced memory addresses based at least in part on request counts mapped thereto; andflushing, by the cache line flusher from the cache memory, cache lines corresponding to memory addresses not excluded by filtering.2. The method of claim 1 , wherein tracking write request counts comprises incrementing a request count upon a write trace of the traced memory address being performed.3. The method of claim 1 , wherein tracking write request counts comprises batch incrementing a plurality of request counts mapped to a plurality of collected traced memory addresses.4. The method of claim 1 , wherein at least filtering traced memory addresses and flushing cache lines are performed after a thread running the cache line flusher wakes upon a wakeup time occurring.5. The method of claim 4 , further comprising setting a wakeup time based on composition of memory ...

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05-03-2020 дата публикации

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH SHIELDING STRUCTURE

Номер: US20200075503A1

Structures and formation methods of a chip package are provided. The method includes forming multiple conductive structures over a carrier substrate. The method also includes disposing a semiconductor die over the carrier substrate such that the conductive structures surround the semiconductor die. The method further includes forming a protective layer to surround the conductive structures and the semiconductor die. In addition, the method includes disposing a shielding element over the semiconductor die and the conductive structures. The shielding element is electrically connected to the conductive structures. 1. A method for forming a chip package , comprising:forming a plurality of conductive structures over a carrier substrate;disposing a semiconductor die over the carrier substrate such that the conductive structures surround the semiconductor die; anddisposing a shielding element over the semiconductor die and the conductive structures, wherein the shielding element is electrically connected to the conductive structures.2. The method for forming a chip package as claimed in claim 1 , further comprising:forming a protective layer to surround the conductive structures and the semiconductor die; andbonding a protective substrate to the conductive structures before the protective layer is formed.3. The method for forming a chip package as claimed in claim 2 , further comprising forming the shielding element over the protective substrate before bonding the protective substrate to the conductive structures.4. The method for forming a chip package as claimed in claim 2 , further comprising forming an antenna element over the protective substrate.5. The method for forming a chip package as claimed in claim 4 , wherein the antenna element is formed over the protective substrate before bonding the protective substrate to the conductive structures.6. The method for forming a chip package as claimed in claim 2 , wherein the protective substrate is bonded to the conductive ...

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05-03-2020 дата публикации

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Номер: US20200075569A1

A package structure and method for forming the same are provided. The package structure includes a first redistribution structure formed over a substrate, and the first redistribution structure includes a first conductive line, a second conductive line and a first overlapping conductive line between the first conductive line and the second conductive line. The first conductive line has a first width, the second conductive line which is parallel to the first conductive line has a second width, and the overlapping conductive line has a third width which is greater than the first width and the second width. The package structure includes a first package unit formed over the first redistribution structure, and the first package unit includes a first semiconductor die and a first die stack, and the first semiconductor die has a different function than the first die stack. 1. A method for forming a package structure , comprising:forming a dielectric layer over a carrier substrate, wherein the carrier substrate comprises a first region, a second region and a third region between the first region and the second region;forming a photoresist layer over the dielectric layer;performing a first exposure process on the photoresist layer to form a first single exposed region;performing a second exposure process on the photoresist layer to form a second single exposed region and a double exposed region, wherein a width of the double exposed region is greater than a width of the first single exposed region;developing the photoresist layer to form a patterned photoresist layer;patterning the dielectric layer to form a trench by using the patterned photoresist layer as a mask;forming a conductive layer in the trench in the dielectric layer, wherein the conductive layer comprises a first conductive line in the first region, a second conductive line in the second region and an overlapping conductive line in the third region, and a third width of the overlapping conductive line is wider ...

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22-03-2018 дата публикации

Vehicle Control Method, Control Device, In-Vehicle System, and Vehicle Control System

Номер: US20180079421A1
Автор: Chen Shuo, GUO Weiqing
Принадлежит: BOE Technology Group Co., Ltd.

A vehicle control method includes: obtaining a current location of a vehicle; judging whether the vehicle is in a temporary waiting state or not according to the current location; determining to turn on or off an automatic start/stop function of the vehicle based on the judgment. The control method can distinguish whether the vehicle is waiting for a traffic light or is in a congestion situation, and choose to turn on the automatic start/stop function according to a current road condition, so as to make the automatic start/stop function of the vehicle to be more real-time and accurate, and maximize the reduction of fuel consumption and exhaust emission. A vehicle control device, an in-vehicle system and a vehicle control system are further provided. 1. A vehicle control method , comprising:judging whether a vehicle is in a temporary waiting state or not; andin the case that a judgment result is that the vehicle is in the temporary waiting state, turning off an automatic start/stop function of the vehicle.2. The method according to claim 1 , wherein judging whether the vehicle is in the temporary waiting state or not comprises:judging whether the vehicle is in the temporary waiting state or not at least according to a current brake frequency of the vehicle.3. The method according to claim 2 , wherein judging whether the vehicle is in the temporary waiting state or not according to the current brake frequency of the vehicle comprises:in a case that the current brake frequency of the vehicle is greater than a brake frequency threshold, determining that the vehicle is in the temporary waiting state, otherwise, determining that the vehicle is not in the temporary waiting state.4. The method according to claim 2 , wherein judging whether the vehicle is in the temporary waiting state or not at least according to the current brake frequency of the vehicle comprises:judging whether the vehicle is in the temporary waiting state or not according to the current brake frequency ...

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23-03-2017 дата публикации

METHOD FOR SETTING IDENTIFICATION CODE OF SMART MOTOR AND MULTI-AXIS CONTROL APPARATUS USING THE SAME

Номер: US20170080568A1
Принадлежит:

A method for setting identification code of smart motors and a multi-axis control apparatus using the same are provided. The method suitable for setting identification codes of a plurality of smart motors includes following steps: entering an identification setting mode when the smart motors receive an identification code setting command; detecting a shaft rotation angle of each smart motor under the identification setting mode, so as to determine whether the shaft rotation angle of each smart motor is larger than a setting value; and when one of the smart motors determines its shaft rotation angle is larger than the setting value, setting the identification code of the smart motor from a preset identification code to a first identification code. 1. A method for setting identification codes of smart motors , adapted to set identification codes for a plurality of smart motors , the method for setting identification codes of the smart motors comprising:entering an identification code setting mode when the smart motors receive an identification code setting command;detecting a shaft rotation angle of each of the smart motors under the identification code setting mode, so as to determine whether the shaft rotation angle of each of the smart motors is larger than a setting value; andsetting an identification code of one of the smart motors from a preset identification code to a first identification code when the one of the smart motors determines that the shaft rotation angle thereof is larger than the setting value.2. The method for setting identification codes of the smart motors as claimed in claim 1 , further comprising:sending a setting indication signal comprising the first identification code by the one of the smart motors;broadcasting the setting indication signal to the other smart motors through a bus; andrecording the first identification code occupied by the one of the smart motors when the other smart motors receive the setting indication signal.3. The ...

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22-03-2018 дата публикации

Package with Passive Devices and Method of Forming the Same

Номер: US20180082966A1

An embodiment is a device comprising a substrate, a metal pad over the substrate, and a passivation layer comprising a portion over the metal pad. The device further comprises a metal pillar over and electrically coupled to the metal pad, and a passive device comprising a first portion at a same level as the metal pillar, wherein the first portion of the passive device is formed of a same material as the metal pillar.

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31-03-2022 дата публикации

IMAGE LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE

Номер: US20220099944A1
Принадлежит:

An image lens assembly includes five lens elements, which are, in order from an object side to an image side along an optical path, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The third lens element has negative refractive power. The fourth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The fifth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The image-side surface of the fifth lens element includes at least one convex critical point in an off-axis region thereof. 1. An image lens assembly comprising five lens elements , the five lens elements being , in order from an object side to an image side along an optical path:a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element;wherein the first lens element has positive refractive power;the third lens element has negative refractive power;the fourth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof; andthe fifth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and the image-side surface of the fifth lens element comprises at least one convex critical point in an off-axis region thereof; [{'br': None, 'i': V', 'V, '2+3<70;'}, {'br': None, 'i': 'f/R', '8≤−0.80;'}, {'br': None, 'i': T', 'T, '0.20<12/23; and'}, {'br': None, 'i': 'f/R', '0.95<7.'}], 'wherein an Abbe number of the second lens element is V2, an Abbe number of the third lens element is V3, a focal length of the image ...

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12-03-2020 дата публикации

Interconnect Structure for Package-on-Package Devices

Номер: US20200083145A1
Принадлежит:

An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package. 1. A method of forming a semiconductor device , the method comprising:forming a protective layer over a backside of an integrated circuit die, wherein a die-attach film is interposed between the protective layer and the integrated circuit die, the integrated circuit die having an active side opposite the backside, the active side having electrical contacts;forming an adhesive layer over a substrate;forming conductors over the adhesive layer;attaching the protective layer to the adhesive layer, wherein the protective layer is interposed between the integrated circuit die and the adhesive layer; andforming a molding compound over the adhesive layer along opposing sidewalls of the integrated circuit die, opposing sidewalls of the conductors, and opposing sidewalls of the protective layer.2. The method of further comprising removing the adhesive layer and the substrate from the protective layer and the molding compound.3. The method of claim 1 , wherein a surface of the conductors are level with a surface of the protective layer.4. The method of claim 1 , wherein forming the conductors comprises:forming a seed layer over the adhesive layer;forming a mask over the seed layer, the mask having openings corresponding to each of the conductors;forming a through via over the seed layer in the openings; andremoving the mask and exposed portions of the seed layer.5. The method of further comprising:attaching a package to the conductors using solder connectors; andforming an underfill between the package and the protective layer and between the package and ...

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21-03-2019 дата публикации

OPTICAL PHOTOGRAPHING LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE

Номер: US20190086642A1
Принадлежит:

An optical photographing lens assembly includes six lens elements, in order from an object side to an image side, the six lens elements are a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The fourth lens element has negative refractive power. The fifth lens element has an object-side surface being concave in a paraxial region thereof. The sixth lens element has an image-side surface being convex in a paraxial region thereof, both an object-side surface and the image-side surface of the seventh lens element are aspheric, and at least one of the object-side surface and the image-side surface of the sixth lens element includes at least one inflection point. 1. An optical photographing lens assembly comprising six lens elements , in order from an object side to an image side , the six lens elements being:a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element;wherein the first lens element has positive refractive power; the fourth lens element has negative refractive power; the fifth lens element has an object-side surface being concave in a paraxial region thereof; and the sixth lens element has an image-side surface being convex in a paraxial region thereof, both an object-side surface and the image-side surface of the sixth lens element are aspheric, and at least one of the object-side surface and the image-side surface of the sixth lens element comprises at least one inflection point; [{'br': None, 'i': f', 'f, '−0.90<4/|2|≤0;'}, {'br': None, 'i': 'TL/f<', '0.50<1.0; and'}, {'br': None, 'i': 'V', '3≤40.'}], 'wherein a focal length of the second lens element is f2, a focal length of the fourth lens element is f4, a focal length of the optical photographing lens assembly is f, an axial distance between an object-side surface of the first lens ...

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25-03-2021 дата публикации

METHOD FOR EMERGENCY TREATMENT BY ARTIFICIAL INTELLIGENCE

Номер: US20210090735A1
Принадлежит:

The present invention provides a method fir emergency treatment by artificial intelligence. An artificial neural network is used as the artificial intelligence. Firstly the artificial neural network is trained to make injury classification, inspection list and medical material scheduling correctly. For a patient entering the hospital, the artificial neural network that has been successfully trained is used to accept a plurality of word vectors and various physiological information of the patient to generate an injury classification. The artificial neural network then determines whether the patient has to perform various inspection items respectively with the highest level of the injury classification. The artificial neural network then determines whether the patient needs the various medical materials with the highest level of the injury classification. 1. A method for emergency treatment by artificial intelligenc , comprising steps as below:(a) Correct injury classification, inspection list and medical material scheduling are inputted into an artificial neural network respectively as training materials, and cooperated with a plurality of feature vectors and a label, so as to let the artificial neural network study how to make injury classification, inspection list and medical material scheduling respectively;(b) a conversation robot catches a self statement of a patient for converting into a plurality of word strings, and then the plurality of word strings are converted into a plurality of word vectors;(c) a plurality of physiological information of the patient are catched through various wearing devices;(d) The plurality of word vectors and the plurality of physiological information are inputted into the artificial neural network to generate injury classifications, and then take a highest level thereof as the basis for deciding inspection list and medical material scheduling.2. The method for emergency treatment by artificial intelligenc according to claim 1 , ...

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05-05-2022 дата публикации

PHOTOGRAPHING LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE

Номер: US20220137371A1
Принадлежит:

A photographing lens assembly includes seven lens elements, which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The third lens element has positive refractive power. The seventh lens element has an image-side surface being concave in a paraxial region thereof, and at least one of an object-side surface and the image-side surface of the seventh lens element includes at least one inflection point. At least one surface of the seven lens elements is aspheric.

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29-03-2018 дата публикации

DIRECT CURRENT CONVERTER

Номер: US20180091053A1
Автор: Chen Shuo, GUAN Enhui
Принадлежит: BOE Technology Group Co., Ltd.

The present application discloses a direct current (DC) converter including a voltage divider for dividing a voltage provided by a DC voltage source, having a positive DC voltage input terminal, a negative DC voltage input terminal, and a divided voltage output terminal; a conversion circuit having a first switch, a second switch, an inductor unit, a first unidirectional conductor, and a second unidirectional conductor; a positive converted voltage output terminal; and a negative converted voltage output terminal. 1. A direct current (DC) converter , comprising:a voltage divider for dividing a voltage provided by a DC voltage source, having a positive DC voltage input terminal, a negative DC voltage input terminal, and a divided voltage output terminal;a conversion circuit having a first switch, a second switch, an inductor unit, a first unidirectional conductor, and a second unidirectional conductor;a positive converted voltage output terminal; anda negative converted voltage output terminal;wherein the first switch is coupled between the positive DC voltage input terminal and the positive converted voltage output terminal; the second switch is coupled between the negative DC voltage input terminal and the negative converted voltage output terminal;the first unidirectional conductor is coupled between the divided voltage output terminal and the positive converted voltage output terminal; the second unidirectional conductor is coupled between the divided voltage output terminal and the negative converted voltage output terminal;the inductor unit is coupled between the positive converted voltage output terminal and the negative converted voltage output terminal; the inductor unit comprises a controller and at least two switchable inductors; andthe controller is configured to control the at least two switchable inductors to be coupled in parallel to each other between the positive converted voltage output terminal and the negative converted voltage output terminal ...

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19-03-2020 дата публикации

INTEGRATED PASSIVE DEVICE PACKAGE AND METHODS OF FORMING SAME

Номер: US20200090955A1
Принадлежит:

An embodiment device package includes a first die, a second die, and a molding compound extending along sidewalls of the first die and the second die. The package further includes redistribution layers (RDLs) extending laterally past edges of the first die and the second die. The RDLs include an input/output (I/O) contact electrically connected to the first die and the second die, and the I/O contact is exposed at a sidewall of the device package substantially perpendicular to a surface of the molding compound opposite the RDLs. 1. A package comprising:a first passive device die encapsulated in a molding compound, wherein all dies encapsulated by the molding compound are free of active devices; a first dielectric layer;', 'a first conductive pattern; and', 'a second conductive pattern, wherein a first portion of the first conductive pattern in the first dielectric layer surrounds a first portion of the second conductive pattern in the first dielectric layer, and wherein the first dielectric layer insulates the first portion of the second conductive pattern from the first portion of the first conductive pattern., 'a redistribution structure electrically connected to the first passive device die, wherein the redistribution structure comprises2. The package of claim 1 , wherein the first portion of the first conductive pattern is coterminous with the molding compound.3. The package of claim 1 , wherein the redistribution structure further comprises:a second dielectric layer over the first dielectric layer, wherein a second portion of the second conductive pattern in the second dielectric layer surrounds a second portion of the first conductive pattern in the second dielectric layer, wherein the second dielectric layer insulates the second portion of the first conductive pattern form the second portion of the second conductive pattern.4. The package of claim 3 , wherein the second portion of the second conductive pattern is coterminous with the molding compound.5. The ...

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19-03-2020 дата публикации

PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

Номер: US20200091029A1
Принадлежит:

A package structure and method for forming the same are provided. The package structure includes a semiconductor die formed over a first side of an interconnect structure, and the semiconductor die has a first height. The package structure also includes a first stacked die package structure formed over the first side of the interconnect structure, and the first stacked die package structure has a second height. The second height is greater than the first height. The package structure includes a lid structure formed over the semiconductor die and the first stacked die package structure. The lid includes a main portion and a protruding portion extending from the main portion, and the protruding portion is directly over the semiconductor die. 1. A package structure , comprising:a semiconductor die formed over a first side of an interconnect structure, wherein the semiconductor die has a first height;a first stacked die package structure formed over the first side of the interconnect structure, wherein the first stacked die package structure has a second height, and the second height is greater than the first height;a lid structure formed over the semiconductor die and the first stacked die package structure, wherein the lid comprises a main portion and a protruding portion extending from the main portion, and the protruding portion is directly over the semiconductor die.2. The package structure as claimed in claim 1 , wherein the protruding portion has a bottom surface claim 1 , the bottom surface of the protruding portion is higher than a top surface of the semiconductor die and lower than a top surface of the first stacked die package structure.3. The package structure as claimed in claim 1 , wherein the first stacked die package structure comprises a plurality of memory dies.4. The package structure as claimed in claim 3 , wherein the semiconductor die has a different function from each of the plurality of the memory dies.5. The package structure as claimed in claim ...

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01-04-2021 дата публикации

METHOD FOR FORMING CHIP PACKAGE STRUCTURE

Номер: US20210098379A1

A method for forming a chip package structure is provided. The method includes forming a first redistribution structure over a first carrier substrate. The method includes bonding a chip structure to the first surface through a first conductive bump. The method includes forming a first molding layer over the first redistribution structure. The method includes removing the first carrier substrate. The method includes forming a second conductive bump over the second surface. The method includes forming a second redistribution structure over a second carrier substrate. The method includes bonding the first redistribution structure to the third surface. The method includes forming a second molding layer over the second redistribution structure. The method includes removing the second carrier substrate. The method includes removing a portion of the second redistribution structure from the fourth surface. The method includes forming a third conductive bump over the fourth surface. 1. A method for forming a chip package structure , comprising:bonding a chip structure to an interposer substrate through a first conductive bump, wherein the interposer substrate comprises a core layer and a conductive via structure passing through the core layer and electrically connected to the chip structure;forming a first molding layer over the interposer substrate and surrounding the chip structure;forming a second conductive bump over the interposer substrate, wherein the interposer substrate is between the second conductive bump and the chip structure;forming a redistribution structure over a carrier substrate, wherein the redistribution structure has a first surface and a second surface;bonding the interposer substrate to the first surface through the second conductive bump;forming a second molding layer over the redistribution structure and surrounding the first molding layer, the interposer substrate, and the chip structure;removing the carrier substrate;partially removing the ...

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26-03-2020 дата публикации

IMAGING OPTICAL SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE

Номер: US20200096734A1
Принадлежит: LARGAN PRECISION CO.,LTD.

An imaging optical system includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. Each of the six lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. At least one lens element of the imaging optical system has at least one aspheric surface having at least one inflection point. 1. An imaging optical system comprising six lens elements , the six lens elements being , in order from an object side to an image side , a first lens element , a second lens element , a third lens element , a fourth lens element , a fifth lens element and a sixth lens element , and each of the six lens elements having an object-side surface facing toward the object side and an image-side surface facing toward the image side;wherein the first lens element has positive refractive power, the image-side surface of the fourth lens element is concave in a paraxial region thereof, and at least one lens element of the imaging optical system has at least one aspheric surface having at least one inflection point;wherein an axial distance between the image-side surface of the sixth lens element and an image surface is BL, an axial distance between the fifth lens element and the sixth lens element is T56, an axial distance between the object-side surface of the first lens element and the image surface is TL, a focal length of the imaging optical system is f, a focal length of the first lens element is f1, a focal length of the third lens element is f3, a focal length of the fourth lens element is f4, a focal length of the sixth lens element is f6, a refractive index of the fifth lens element is N5, a curvature radius of the image-side surface of the second lens element is R4, half of a maximum field of view of the imaging optical system is HFOV, and the following ...

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04-04-2019 дата публикации

ELECTRONIC DEVICE

Номер: US20190101724A1
Принадлежит:

An electronic device includes at least one optical lens assembly. The optical lens assembly includes four lens elements, and the four lens elements are, in order from an outside to an inside, a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has an outside surface being convex in a paraxial region thereof. The second lens element has an inside surface being convex in a paraxial region thereof. The fourth lens element has an inside surface being concave in a paraxial region thereof, wherein at least one of an outside surface and the inside surface of the fourth lens element includes at least one critical point in an off-axis region thereof. 1. An electronic device , comprising at least one optical lens assembly , which comprises four lens elements , the four lens elements being in order from an outside to an inside:a first lens element having an outside surface being convex in a paraxial region thereof;a second lens element having an inside surface being convex in a paraxial region thereof;a third lens element; anda fourth lens element having an inside surface being concave in a paraxial region thereof, wherein at least one of an outside surface and the inside surface of the fourth lens element comprises at least one critical point in an off-axis region thereof; [{'br': None, 'i': Подробнее

02-06-2022 дата публикации

CELL ACTIVATION REACTOR AND CELL ACTIVATION METHOD

Номер: US20220169985A1

A cell activation reactor and a cell activation method are provided. The cell activation reactor includes a body, a rotating part, an upper cover, a microporous film, and multiple baffles. The body has an accommodating space, which is suitable for accommodating multiple cells and multiple magnetic beads. The rotating part is disposed in the accommodating space and includes multiple impellers. The microporous film is disposed in the accommodating space and covers multiple holes of the accommodating space. The baffles are disposed in the body. When the rotating part is driven to rotate, the interaction between the baffles and the impellers separates the cells and the magnetic beads. 1. A cell activation reactor , comprising:a body comprising an accommodating space formed by a closed end, a side portion, and an open end, wherein the accommodating space is adapted for accommodating a cell culture medium containing a plurality of cells and a plurality of magnetic beads;a rotating part disposed in the accommodating space, wherein the rotating part comprises an axis and a plurality of impellers, and the rotating part is adapted to be connected to a driver to be driven to rotate;an upper cover detachably disposed above the body to cover the open end of the accommodating space, wherein the upper cover comprises an opening, and the opening is disposed corresponding to a position of the rotating part, so that the axis of the rotating part penetrates through and is disposed in the opening, the end of the axis of the rotating part is exposed, and the driver is connected to the rotating part through the end;a microporous film disposed at the closed end of the accommodating space, wherein the closed end comprises a plurality of holes therethrough, and the microporous film covers the holes; anda plurality of baffles disposed on the side portion of the accommodating space, wherein when the rotating part is driven to rotate, an interaction of the baffles and the impellers causes the ...

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26-03-2020 дата публикации

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

Номер: US20200098739A1

A method of forming a semiconductor device package includes the following steps. A redistribution structure is formed on a carrier. A plurality of second semiconductor devices are disposed on the redistribution structure. At least one warpage adjusting component is disposed on at least one of the second semiconductor devices. A first semiconductor device is disposed on the redistribution structure. An encapsulating material is formed on the redistribution structure to encapsulate the first semiconductor device, the second semiconductor devices and the warpage adjusting component. The carrier is removed to reveal a bottom surface of the redistribution structure. A plurality of electrical terminals are formed on the bottom surface of the redistribution structure. 1. A structure , comprising:a semiconductor die;a semiconductor package;a warpage adjusting component disposed on a back surface of the semiconductor package; andan encapsulating material encapsulating the semiconductor die, the semiconductor package, and the warpage adjusting component, wherein a Young's modulus of the warpage adjusting component is greater than or equal to a Young's modulus of the encapsulating material.2. The structure as claimed in further comprising a redistribution structure claim 1 , wherein the semiconductor die and the semiconductor package are disposed on and electrically connected to the redistribution structure claim 1 , and the redistribution structure is covered by the encapsulating material.3. The structure as claimed in further comprising:first connectors disposed between the redistribution structure and the semiconductor die;second connectors disposed between the redistribution structure and the semiconductor package; andan underfill encapsulating the first and second connectors, wherein the underfill is encapsulated by the encapsulating material.4. The structure as claimed in claim 3 , wherein the underfill is in contact with sidewalls of the semiconductor die and sidewalls ...

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19-04-2018 дата публикации

COLOR RECOGNITION DEVICE AND COLOR RECOGNITION METHOD

Номер: US20180106679A1
Автор: Chen Shuo
Принадлежит:

The present disclosure provides a color recognition device and a color recognition method, and belongs to the technical field of color recognition. In an embodiment, the color recognition device includes a head portion and a main body portion; the head portion has a groove in which a sensor module configured to capture color information of the object to be detected is disposed; and the main body portion includes: a storage module configured for storing standard color parameters of a variety of colors, and a central processing unit configured for comparing color information of the object to be detected with the standard color parameters of the variety of colors stored in the storage module, to recognize color of the object to be detected. 1. A color recognition device , comprising a head portion and a main body portion; wherein:the head portion has a groove in which a sensor module configured to capture color information of an object to be detected is disposed; andthe main body portion comprises: a storage module configured for storing standard color parameters of a variety of colors, and a central processing unit configured for comparing color information of the object to be detected with the standard color parameters of the variety of colors stored in the storage module, to recognize color of the object to be detected.2. The device of claim 1 , wherein the groove is provided therein with a light source configured to offer brightness to the object to be detected in a state of a darkroom which is formed when the groove is in contact with the object to be detected.3. The device of claim 2 , wherein the light source comprises a standard white-color light source.4. The device of claim 1 , wherein the sensor module comprises an imaging unit claim 1 , a color filtering unit and a color processing unit;the imaging unit is configured to perform an imaging process on the object to be detected;the color filtering unit is configured to separate color in an image of the object ...

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19-04-2018 дата публикации

HEAD LOWERING AND TURNING REMINDING DEVICE, CONTROL METHOD THEREOF AND HELMET

Номер: US20180108238A1
Автор: Chen Shuo, MU Xinxin
Принадлежит: BOE Technology Group Co., Ltd.

A head lowering and turning reminding device, a control method thereof and a helmet are disclosed. The reminding device is disposed on a vehicle or worn by a user of the vehicle, and includes: a speed sensor configured to detect a ground speed of the vehicle; a head posture monitoring module configured to monitor a head posture of the user and generate a signal relevant to a head rotating action of the user; a recognition module configured to receive the signal and recognize at least one of a head lowering action and a head turning action of the user and a duration time of this action; and an alarm module configured to output an alarm for reminding the user upon the ground speed being greater than a speed threshold and the duration time exceeding a preset time threshold. 1. A head lowering and turning reminding device disposed on a vehicle or worn by a user of the vehicle , comprising:a speed sensor configured to detect a ground speed of the vehicle;a head posture monitoring module configured to monitor a head posture of the user and generate a signal relevant to a head rotating action of the user;a recognition module configured to receive the signal generated by the head posture monitoring module, and recognize at least one action of a head lowering action and a head turning action of the user and a duration time of the user holding this action according to the signal; andan alarm module configured to output an alarm for reminding the user upon the ground speed of the vehicle being greater than a speed threshold and the duration time of the user holding the head lowering action or the head turning action exceeding a preset time threshold.2. The reminding device according to claim 1 , wherein the head posture monitoring module is a gyroscope.3. The reminding device according to claim 1 , wherein the head posture monitoring module comprises a compass.4. The reminding device according to claim 1 , wherein the speed sensor is a laser velometer or a radar velometer.5. ...

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29-04-2021 дата публикации

Voice question and answer method and device, computer readable storage medium and electronic device

Номер: US20210125600A1
Принадлежит: BOE Technology Group Co Ltd

A voice question and answer method and device, a computer readable storage medium, and an electronic device are described. The method comprises: receiving question voice information, and obtaining question text information according to the question voice information; performing at least one of general semantic analysis processing and dedicated semantic analysis processing on the question text information to generate an analysis result; and obtaining answer information according to the analysis result. The general semantic analysis is used for semantic analysis in the general field, and the dedicated semantic analysis is used for semantic analysis in the art field.

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10-07-2014 дата публикации

Audio Monitor and Event-Conflict Signaling System

Номер: US20140195139A1
Принадлежит: The Mitre Corporation

Disclosed herein are system, method, and computer program product embodiments for an audio monitoring and event-conflict signaling system. An embodiment operates by receiving airport audio communication originating from an airport control tower (ATCT) of an airport with one or more runways or a flight deck of an aircraft. The system determines one or more keywords corresponding to a runway event affecting operations of a particular runway of the airport. The system detects, within the airport audio communication, a conflict comprising a correspondence between the airport audio communication and one or more of the keywords, and notifies the ACT of the conflict. 1. A computer implemented method comprising:receiving airport audio communication originating from one of an air traffic control tower (ATCT) of an airport with one or more runways or a flight deck of an aircraft;determining one or more keywords corresponding to a runway event affecting operations of a particular runway of the airport;detecting, within the airport audio communication, a conflict comprising a correspondence between the airport audio communication and one or more of the keywords, wherein the conflict indicates that an aircraft has been cleared to use the particular runway associated with the runway event; andnotifying the ATCT of the conflict.2. The method of claim 1 , wherein the airport audio communication is between the ATCT and the flight deck of the aircraft either landing at or taking off from the airport.3. The method of claim 2 , wherein the notifying comprises notifying an air traffic controller of the ATCT of the conflict.4. The method of claim 1 , wherein the detecting comprises:detecting the conflict based on a detection of a combination of two or more keywords within a specified time interval or word interval.5. The method of claim 4 , wherein the keywords include an identification of the particular runway affected by the event.6. The method of claim 5 , wherein the keywords include ...

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28-04-2016 дата публикации

Metal Pads with Openings in Integrated Circuits

Номер: US20160118297A1
Принадлежит:

A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI. 1. A method comprising:forming a first polymer layer over a device die;patterning the first polymer layer to reveal a conductive feature in the device die;depositing a blanket seed layer over the first polymer layer and the conductive feature; an elongated portion;', 'a bulk portion wider than the elongated portion; and', 'a transition portion connecting the bulk portion to the elongated portion, wherein the patterned mask layer comprises a discrete portion in the transition portion of the opening;, 'forming a patterned mask layer over the blanket seed layer, with an opening formed in the patterned mask layer to expose the blanket seed layer, wherein the opening comprisesplating a conductive material on exposed portions of the blanket seed layer;removing the patterned mask layer; andetching portions of the blanket seed layer covered by the patterned mask layer, wherein remaining portions of the blanket seed layer and the conductive material form a Post-Passivation Interconnect (PPI).2. The method of claim 1 , wherein the PPI comprises:a bulk portion;a trace portion; anda transition portion with a through-opening therein.3. The method of further comprising forming a second polymer layer to cover the PPI claim 2 , wherein the second polymer layer extends into the through-opening to form a polymer plug.4. The method of further comprising:encapsulating the device die in an encapsulating material; andplanarizing a top surface of the conductive feature and the encapsulating material, wherein the second polymer layer further overlaps the encapsulating material.5. The method of ...

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09-06-2022 дата публикации

METHOD FOR FORMING PACKAGE STRUCTURE WITH LID

Номер: US20220181232A1
Принадлежит:

A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion. 1. A method for forming a package structure , comprising:forming an interconnect structure over a carrier substrate;forming a semiconductor die over a first side of the interconnect structure, wherein a removable film is formed over the semiconductor die;forming a first stacked die package structure over the first side of the interconnect structure, wherein a top surface of the removable film is higher than a top surface of the first stacked die package structure;forming a package layer over the semiconductor die and the first stacked die package structure;removing a portion of the package layer to expose a portion of the removable film;removing the removable film to form a recess over the semiconductor die; andforming a lid structure over the semiconductor die and the first stacked die package structure, wherein the lid structure has a main portion and a protruding portion extending from the main portion, and the protruding portion is disposed in the recess.2. The method for forming the package structure as claimed in claim 1 , further comprising:removing a portion of the first stacked die package ...

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09-04-2020 дата публикации

OPTICAL IMAGING LENS SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE

Номер: US20200110248A1
Принадлежит: LARGAN PRECISION CO.,LTD.

An optical imaging lens system includes five lens elements which are, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has positive refractive power. The fourth lens element has negative refractive power. The fifth lens element with negative refractive power can have an object-side surface being concave in a paraxial region thereof. 1. An optical imaging lens system comprising five lens elements , the five lens elements being , in order from an object side to an image side , a first lens element , a second lens element , a third lens element , a fourth lens element and a fifth lens element;wherein each of the five lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side, the first lens element has positive refractive power, and the image-side surface of the third lens element is concave in a paraxial region thereof;{'b': 2', '4', '12', '34, 'claim-text': [{'br': None, 'i': V', 'V, '0<(2+4)/2≤21.47;'}, {'br': None, 'tan(HFOV)<0.30; and'}, {'br': None, 'i': T', 'T, '0.60<34/12<6.0.'}], 'wherein an Abbe number of the second lens element is V, an Abbe number of the fourth lens element is V, half of a maximum field of view of the optical imaging lens system is HFOV, an axial distance between the first lens element and the second lens element is T, an axial distance between the third lens element and the fourth lens element is T, and the following conditions are satisfied2. The optical imaging lens system of claim 1 , wherein the object-side surface of the third lens element is convex in a paraxial region thereof.3. The optical imaging lens system of claim 1 , wherein the fourth lens element has negative refractive power claim 1 , and the object-side surface of ...

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