СПОСОБ ИЗГОТОВЛЕНИЯ СВЕРХПРОВОДЯЩЕГО КАБЕЛЯ

Изобретение относится к области электротехники, к сверхпроводящим кабелям с криогенной оболочкой, в частности к способу изготовления сверхпроводящего кабеля, состоящего из кабельного сердечника, содержащего, по меньшей мере, один удлиненный сверхпроводящий элемент, и охватывающей кабельный сердечник гибкой трубы, включающий в себя следующие этапы: а) непрерывную размотку кабельного сердечника с источника кабеля; б) непрерывную размотку металлической ленты с источника ленты; в) непрерывное формование металлической ленты вокруг кабельного сердечника в трубную заготовку, заварку продольного шва и последующее гофрирование заваренной трубы, причем внутренний диаметр гофрированной трубы больше наружного диаметра кабельного сердечника; г) намотку состоящего из кабельного сердечника и гофрированной трубы сверхпроводящего кабеля на кабельный барабан или укладку сверхпроводящего кабеля в, по меньшей мере, один виток; д) завершающее механическое соединение концов кабельного сердечника с концами гофрированной ...

СПОСОБ ИЗГОТОВЛЕНИЯ СВЕРХПРОВОДЯЩЕГО ПРОВОДА, СПОСОБ МОДИФИЦИРОВАНИЯ ОКСИДНОГО СВЕРХПРОВОДЯЩЕГО ПРОВОДА И ОКСИДНЫЙ СВЕРХПРОВОДЯЩИЙ ПРОВОД

Способ производства оксидного сверхпроводящего провода, включает в себя стадии получения материала провода в виде, при котором порошок исходного материала оксидного сверхпроводящего материала покрыт металлом, и стадии термообработки, заключающиеся в том, что полученный материал провода подвергают термообработке в атмосфере повышенного давления с общим давлением 1 МПа или более и менее 50 МПа в ходе термообработки, при этом операцию повышения давления начинают при такой температуре, с которой 0,2%-ый условный предел текучести металла становится меньшим, чем общее давление в ходе термообработки. Технический результат - обеспечение подавления образования пустот между кристаллами оксидного сверхпроводящего материала и вздутие материала оксидного сверхпроводящего провода, а также обеспечение возможности легко регулировать парциальное давление кислорода во время термообработки, что приводит к улучшению плотности критического тока полученного материала провода. 5 н. и 17 з.п. ф-лы, 27 ил., 3 табл ...

СПОСОБ ПОЛУЧЕНИЯ ДЛИННОМЕРНЫХ КОМПОЗИЦИОННЫХ ПРОВОДОВ НА ОСНОВЕ ВЫСОКОТЕМПЕРАТУРНЫХ СВЕРХПРОВОДЯЩИХ СОЕДИНЕНИЙ

Изобретение относится к области электротехники, в частности к технологии получения длинномерных проводов на основе сверхпроводящих соединений. Способ включает формирование моножильной заготовки путем засыпки порошка висмутовой керамики в серебряную оболочку, деформацию полученной моножильной заготовки до требуемых размеров волочением без нагрева со степенью деформации за проход 0,5-20%, резку деформированной заготовки на мерные части, сборку многожильной заготовки путем размещения требуемого количества мерных частей деформированной моножильной заготовки в серебряной оболочке многожильной заготовки, экструзию многожильной заготовки при температуре в диапазоне 100-200°С и с величиной коэффициента вытяжки от 4 до 30, прокатку на воздухе без нагрева со степенью деформации за проход 1-50%, термомеханическую обработку, включающую несколько стадий термообработки при температуре 830-860°С и в течение времени, обеспечивающего формирование в керамической сердцевине фазы требуемого состава и структуры ...

ПОЛИМЕРНАЯ КОМПОЗИЦИЯ ДЛЯ ЭЛЕКТРОТЕХНИЧЕСКИХ УСТРОЙСТВ

Изобретение относится к кабелю, в том числе к силовому кабелю, или силовому кабелю постоянного тока, или сшиваемому силовому кабелю, а также к способу изготовления кабеля. Кабель содержит проводник, окруженный по меньшей мере одним слоем, который выполнен из полимерной композиции. Полимерная композиция содержит (а) полиэтилен, полученный в присутствии катализатора полимеризации олефинов, (б) ненасыщенный гомополимер этилена низкой плотности (ПЭНП) или ненасыщенный сополимер этилена низкой плотности и (в) анионообменную добавку в количестве от 0,000001 до менее 1 мас.%. Причем полиэтилен (а) выбран из сополимеров этилена очень низкой плотности (ПЭОНП), линейных сополимеров полиэтилена низкой плотности (ЛПЭНП), сополимеров этилена средней плотности (ПЭСП) или гомополимеров или сополимеров полиэтилена высокой плотности (ПЭВП). Полученный кабель обладает низкой проводимостью. 2 н. и 15 з.п. ф-лы, 1 ил., 2 табл., 5 пр.

НОВАЯ ПОЛИВИНИЛСУЛЬФОНОВАЯ КИСЛОТА, ЕЕ ПРИМЕНЕНИЕ И СПОСОБ ЕЕ ПОЛУЧЕНИЯ

Изобретение относится к поливинилсульфоновой кислоте, используемой в качестве легирующей высокомолекулярной добавки, к способу получения поливинилсульфоновой кислоты, к композиту, к вариантам дисперсии, к вариантам способа получения дисперсии, а также к вариантам электропроводного слоя. Поливинилсульфоновая кислота включает звенья винилсульфоновой кислоты общей формулы:где R, Rи R, Z представляют собой атом водорода. При этом молярное количество сульфокислотных групп, образованных мономерной винилсульфоновой кислотой, относительно общего молярного количества мономерных звеньев составляет от 50,0 до 98,0 моль. %. Поливинилсульфоновая кислота имеет оптическую плотность от 0,1 до 2,0 (водный раствор, 0,2 масс. %, длина ячейки 10 мм) в диапазоне длин волн от 255 до 800 нм. Способ получения поливинилсульфоновой кислоты заключается в том, что проводят полимеризацию мономерной винилсульфоновой кислоты общей формулы:где R, Rи R, Z представляют собой атом водорода. Затем нагревают полученную поливинилсульфоновую ...

СПОСОБ ПОЛУЧЕНИЯ ИЗДЕЛИЙ НА ОСНОВЕ ВЫСОКОТЕМПЕРАТУРНЫХ СВЕРХПРОВОДЯЩИХ СОЕДИНЕНИЙ ДЛЯ ЭЛЕКТРОТЕХНИЧЕСКИХ УСТРОЙСТВ

Изобретение относится к технической сверхпроводимости, в частности, к технологии получения как коротких, так и длинномерных многожильных композиционных проводов. Изобретение характеризуется тем, что проводят легирование серебра сурьмой в количестве 0,5-5 ат.% при плавлении в интервале температур 1050-1100°С, изготавливают из этого сплава полую ампулу и оболочку сложной заготовки, заполняют ампулу керамическим порошком высокотемпературного сверхпроводящего соединения, деформируют полученную ампульно-порошковую систему до требуемого размера, разрезают деформированную ампульно-порошковую систему на мерные части, формируют сложную заготовку путем размещения в оболочке сложной заготовки требуемого количества мерных частей деформированной ампульно-порошковой системы, деформируют сложную заготовку до требуемых размеров и проводят термомеханическую обработку. Технический результат заключается в уменьшении стоимости изделия за счет подбора режимов изготовления провода, которые позволяют использовать ...

СВЕРХПРОВОДЯЩЕЕ УСТРОЙСТВО И СВЕРХПРОВОДЯЩИЙ КАБЕЛЬ

Изобретение относится к области электротехники, в частности к сверхпроводящему устройству, которое имеет оксидный сверхпроводящий провод. При этом оксидный сверхпроводящий материал в этом оксидном сверхпроводящем проводе имеет плотность после спекания 93% или более, предпочтительно - 95% или более, более предпочтительно - 99% или более, которую получают путем термообработки провода в атмосфере повышенного давления по меньшей мере 1 МПа и менее 50 МПа. При термообработке провода в атмосфере повышенного давления подавляется формирование зазоров и пузырчатости. Техническим результатом изобретения является создание сверхпроводящего устройства и сверхпроводящего кабеля с высокой критической плотностью тока, за счет образования стабильной оксидной сверхпроводящей фазы Bi2223. 2 н. и 4 з.п. ф-лы, 32 ил., 4 табл.

СПОСОБ ИЗГОТОВЛЕНИЯ СВЕРХПРОВОДЯЩЕГО ПРОВОДА

Изобретение относится к области электротехники, а именно к способу изготовления сверхпроводящего провода, и может быть использовано при изготовлении сверхпроводящих проводов методом реактивного магнетронного напыления. Повышение скорости изготовления буферных слоев сверхпроводящего провода с высоким критическим током является техническим результатом изобретения. C этой целью металлооксидные пленки сверхпроводящего провода стабильно формируют с высокой скоростью посредством регулирования реакций в переходной области реактивного магнетронного напыления, а способ включает в себя формирование на подложке буферного слоя, содержащего слой Al2O3, причем слой Al2O3 формируют методом реактивного магнетронного напыления, в котором применяют первый газообразный кислород в качестве реакционного газа и распыляемую мишень, выполненную из металлического алюминия, при этом слой Al2O3 формируют с подачей первого газообразного кислорода при первой концентрации, являющейся концентрацией первого газообразного ...

СПОСОБ ПОЛУЧЕНИЯ МЕДНОЙ ПРОВОЛОКИ

Способ может быть использован для получения медной проволоки непосредственно из медьсодержащего материала. Заявленный способ включает сочетание трех отдельных технологий получения медной проволоки непосредственно из относительно загрязненного источника меди, например медной руды или медьсодержащих отходов. Первая из этих технологий включает экстракцию растворителем, вторая - электроосаждение и третья - обработку металла. Изобретение позволяет получить медную проволоку более простым и дешевым способом по сравнению с известными способами, 9 з.п.ф-лы, 3 ил.

СВЕРХПРОВОДЯЩАЯ КОМПОЗИЦИЯ И СПОСОБ ЕЕ ПОЛУЧЕНИЯ

Использование: в электротехнике для изготовления сверхпроводящего кабеля переключателей, магнитов, микроэлектроника. Сущность изобретения: сверхпроводящая композиция отвечает номинальной формуле BiaSrbCacCu3Ox, где a 1 - 3, b 3/8 - 4, c 3/16 - 2, x =(1,5 + b + c +y), где y 2 - 5 при условии, что сумма b+c равна 3/2 - 5, содержит металлооксидную фазу формулы Bi2Sr3-ZCa2Cu2O8+w, где значение Z - от 0,1 - 0,9, а значения w превышает 0, но меньше 12. Температура перехода композиции Тс77 - 115 К. Способ получения композиции заключается в смешении стехиометрических количеств окислов или предшественников окислов, нагревании смеси с доступом воздуха до температуры 775 - 900oС, выдержке при указанной температуре в течение 8 -48 ч и охлаждении до температуры ниже 100oС. 2 с. и. 8 з. п. ф-лы.

СПОСОБ ИЗГОТОВЛЕНИЯ ФАСОННЫХ ИЗДЕЛИЙ ИЗ ВЫСОКОТЕМПЕРАТУРНОГО СВЕРХПРОВОДНИКА

Сущность изобретения:предложен способ изготовления фасонных изделий из высокотемпературного сверхпроводника, состоящего из окислов висмута, стронция, кальция, меди и в случае необходимости свинца, а также сульфатов стронция и/или бария. При осуществлении способа окислы висмута, стронция, кальция, меди и в случае необходимости свинца в желаемом молярном соотношении, а также дополнительно 2-30 вес.% сульфата стронция и/или 1-20 вес.% сульфата бария, соответственно пересчитанные на смесь окислов, тщательно смешивают друг с другом, расплавляют смесь в тигле из металла платиновой группы при 870-1600oC, разливают расплав в кокили нужной формы и размера и медленно охлаждают в них, освобождают полученные фасонные изделия от материала кокилей и подвергают отжигу в течение 6-200 ч при 700-900oC в атмосфере, содержащей кислород. 6 з. п. ф-лы, 2 табл.

ТЯГОВОЕ УСТРОЙСТВО

Тяговое устройство относится к электротехнике, в частности к производству кабельных изделий. Цель изобретения - повышение удобства обслуживания и сохранение исходного качества кабеля при обеспечении надежной его протяжки. Гусеницы привода в виде бесконечных ремней устанавливают на двух каретках. Каретки рычагами (Р) равной длины соединяют с корпусом (К), несущим направляющие ролики (НР). Другой К с НР закрепляют на станине с помощью механизма фиксации в заданном положении. Каретки могут перемещаться относительно гаек (Г) вдоль оси ходового винта механизма сближения. Между Г и каретками расположены элементы, упругие в направлении сжатия кабеля. Одна из Г снабжена лимбом регистрации усилия сжатия кабеля.

СПОСОБ ИЗГОТОВЛЕНИЯ ГИБКИХ ПРОВОДОВ

Изобретение относится к кабельной технике, в частности к технологии изготовления проводов и шнуров гибких, используемых для присоединения машин и приборов к электрическим сетям. Технический результат - повышение эксплуатационных характеристик гибкого провода за счет улучшения его гибкости. Способ включает обработку медной проволоки, скрутку из нее стренг, их изолирование, скрутку изолированных стренг и наложение на полученную заготовку оболочки. В этом способе используют медную проволоку диаметром 0,03-3,0 мм, количество проволок и шаг скрутки при скрутке из них стренг выбирают, исходя из кратности шага скрутки 4-30, а количество стренг и шаг скрутки при скрутке стренг в заготовку выбирают исходя из кратности шага скрутки 20-40, при этом скрутку каждого последующего повива при скрутке стренг в заготовку ведут с увеличением кратности шага скрутки.

СВЕРХПРОВОДЯЩИЙ ПРОВОД И СПОСОБ ЕГО ПОЛУЧЕНИЯ

... 1. Сверхпроводящий провод, содержащий металлическую подложку и расположенный сверху сверхпроводящий слой (3), причем указанная металлическая подложка является текстурированной металлической подложкой (1), выровненной так, чтобы иметь поверхностный слой, простирающийся от ее поверхности на глубину 300 нм, со смещением кристаллографической оси относительно ориентационной оси по большей мере на 25° и шероховатостью Rp_v поверхности по большей мере 150 нм. 2. Сверхпроводящий провод по п.1, в котором указанная текстурированная металлическая подложка (1) расположена под промежуточным слоем (2), а указанный промежуточный слой (2) лежит под указанным сверхпроводящим слоем (3). 3. Способ получения сверхпроводящего провода, включающий в себя стадии выравнивания текстурированной металлической подложки (1) так, чтобы она имела поверхностный слой, простирающийся от ее поверхности на глубину 300 нм, со смещением кристаллографической оси относительно ориентационной оси по большей мере на 25° и шероховатостью ...

СПОСОБ ПОЛУЧЕНИЯ СВЕРХПРОВОДЯЩЕГО ПРОВОДА

... 1. Способ получения сверхпроводящего провода (1), включающего в себя жилу (2), которая содержит фазу Bi-2223, и оболочку (3), покрывающую эту жилу, включающий в себя стадию заполнения, стадию волочения, стадию прокатки и стадию спекания, причем перед упомянутой стадией спекания в составе упомянутой жилы (2) на основе порошка исходных материалов Bi2O3, PbO, SrCO3, CaCO3 и CuO отсутствует фаза Bi-2223. 2. Способ получения сверхпроводящего провода по п.1, в котором упомянутую стадию спекания осуществляют при условиях парциального давления кислорода по меньшей мере 0,03 атм. и не более 0,21 атм., температуры спекания по меньшей мере 810°C и не более 850°C и продолжительности спекания по меньшей мере 20 ч и не более 100 ч. 3. Способ получения сверхпроводящего провода по п.1, в котором перед упомянутой стадией спекания упомянутая жила (2) характеризуется отношением компонентов Bi и Pb в ее составе, которое составляет по меньшей мере 0,14 и не более 0,18 в соответствии с атомным отношением, представленным ...

СПОСОБ ИЗГОТОВЛЕНИЯ СВЕРХПРОВОДЯЩЕГО КАБЕЛЯ

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Изобретение относится к технике электрорадиомонтажа. Способ изготовления жгутов из проводов реализован в устройстве. В соответствии с заданной схемой жгута на монтажном шаблоне 1 устанавливают трассировочные штыри (TD1) 3. Затем прокладывают струны (С) 2, пропуская их через отверстия каждого ТИ 3, натягивая и фиксируя каждую С 2 прижимными планками 6 таким образом, чтобы направление трассы жгута не совпадало со С 2 и чтобы прямолинейные участки трассы до места изгиба не пересекали С 2. Процесс обвязки жгута вьтолняют по. зигзагообразной траектории-по участкам , расположенным между С 2, при этом обвязывающая петля подбирает уложенные провода 7, формируя их в жгут, и обвязьшает их, минуя С 2. Причем перед ТШ 3 процесс обвязки прекращают, нити фиксируют и продолжают процесс i обвязки уже за ТШ 3 таким образом, чтобы не захватить С 2. Способ высокопроизводителен и дает повышенное качество жгута. 4 ил. (Л ...

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Устройство для укладки проводов на плате

Устройство для изготовления,хранения и транспортировки маслонаполненного кабеля

УСТРОЙСТВО ДЛЯ ИЗГОТОВЛЕНИЯ, ХРАНЕНИЯ И ТРАНСПОРТИРОВКИ МАСЛША- ПОШЕННОГО КАБЕЛЯ, выполненное В виде барабана для размоцения кабеля, укрепленного в герметичном корпусе с возможностью вращения вокруг оси, снабженное приспособлением для ком-^ пенсации давления среды, о т л и - ч а ю щ е -е с я тем, что, с целью исключения налокения временной обо~ лочки на кабель путем исполвзования указанного устройства в процессе монтажа и повышения надежности, оноснабжено эластичной перегородкой, делящей полость на две ге^)метичные части, одна из которых ограничена внешней поверхн^эстью барабана, а участок поверхности другой использован Для упомянутой компенсации.2.Устройство по п. 1, отли- ч' а ю щ е е с я тем, что упомянутнй эластичная перегородка выполнена на барабане.3.Устройство по п. 1, отличающееся тем, что упомянутая эластичная перегородка выполнена на корпусе устройства.4; Устройство по П. 3, отличающееся тем, чтоГ внут'рен- няя полость барабана выполнена герметичной и имеет разъемное соединение ...

Способ изготовления жгутов проводов

СПОСОБ ИЗГОТОВЛЕНИЯ ЖГУТОВ ПРОВОДОВ, заключающийся в раскладке проводов на монтажном шаблоне между шпильками, установленнЕлми с разных сторон трассы жгута, с последующей обвязкой их гибкой нитью, отличающийся тем, что, с целью снижения трудоемкости, перед раскладкой проводов между шпильками, последние последовательно с разных сторон трассы жгута огибают эластичной нитью, например резиновым тнуром, обвязку производят крючком путем перебрасывания эластичной нити с одной стороны жгута проводов на другую с образованием петель, при этом последнюю петлю скрепляют с концом эластичной нити. С о со 00 ...

Способ экранирования герметизированных кабелей

ЖАРОСТОЙКИЙ ПРОВОДНИК

Способ перемотки гибких протяженных изделий

Установка для изготовления кабельных изделий

Установка для изготовления жгутов проводов запоминающих устройств

Устройство для непрерывного гофрирования труб

I. УСТРОЙСТВО ДЛЯ НЕПРЕРЫВНОГО ГОФРдаоВАНВД ТРУБ из пластически деформируемого материала, преимущественно кабельных оболочек из металла , содержащее установленную с возможностью принудительного вращения гофрообразующую головку, на корпусе которой смонтированы с возможностью свободного вращения и со взаимопротивоположным эксцентриситетом втулки с формутащими ребрами на внутренней поверхности, диаметр в свету которых больше диаметра трубы-заготовки, отличающееся тем, что, с целью улучшения качества труб за счет получения равномерных гофров, гофрообразующая головка снабжена механизмом синхронизации вращения втулок одна относительно другой, оси втулок размещены параллельно оси подачи трубы-заготовки, при этом формующие ребра обеих втулок параллельны друг другу, а отнощени е диаметра в свету отверстия втулок к диаметру гофрированной трубы, в зоне впадины гофра составляет целое четное число, не менее 2, с максимальным отклонением 5%. 2.Устройство по п. 1, от л ичающееся тем, что формующее ребро ...

Устройство для фиксации клеем жилы

Mehraderflachkabel

Vorrichtung und Verfahren zum Berechnen der Dicke eines Bündels von elektrischen Drähten

Vorrichtung zum Positionieren eines Steckergehäuses

ELEKTRISCH LEITENDE STRUKTUREN

Electrically conductive structures, such as printed circuit boards, with integrated self-contained connection and plug regions are obtained by the known (semi)-additive method. Both the tracks and the connection and plug regions are metallized in a single operation, and the metallic coating is deposited in these regions with a very low adhesive strength so that it can be readily detached from the surface of the substrate without damaging the latter.

Flachkabelleiter, Verfahren und Vorrichtung zu dessen Herstellung

Method and device for calibrating production systems for thick-film circuit patterns

A calibration method and a calibration device are created for a system for producing a thick-film circuit pattern, in which the pattern-producing system is automatically calibrated in such a way that lines of a desired thickness can be produced with a specific paste. ...

ELEKTRISCH LEITFAEHIGES BARIUMSULFAT UND VERFAHREN ZU SEINER HERSTELLUNG

OXIDISCHER SUPRALEITER UND VERFAHREN ZU SEINER HERSTELLUNG

VERFAHREN ZUR HERSTELLUNG MINDESTENS EINER SCHICHT AUS EINEM METALLOXIDISCHEN SUPRALEITERMATERIAL MIT HOHER SPRUNGTEMPERATUR

Länglicher Formkörper aus supraleitender Keramik und Verfahren zu seiner Herstellung

Verfahren zur Herstellung eines supraleitenden Teiles und Anordnungen und Anlagen, die dieses Teil Aufweisen

Knitted textile substrate with different stitch patterns and electronic textile

A knitted substrate () for electrical connection of electronic components (-) thereto. The knitted substrate comprises a first set of substrate portions (--) knitted with a first stitch pattern resulting in a first tensile stiffness; and a second set of substrate portions (--) knitted with a second stitch pattern resulting in a second tensile stiffness that is greater than the first tensile stiffness. A substrate portion of the first set of substrate portions (--) is provided between substrate portions (--) of the second set of substrate portions, and each substrate portion of the second set of substrate portions (--) comprises conductive yarns (-) arranged to allow electrical connection of at least one of the electronic components (-) thereto. 1. A knitted substrate for electrical connection of electronic components thereto , comprising:a first set of substrate portions knitted with a first stitch pattern resulting in a first tensile stiffness; anda second set of substrate portions knitted with a second stitch pattern resulting in a second tensile stiffness that is greater than said first tensile stiffness,wherein a substrate portion of said first set of substrate portions is provided between substrate portions of said second set of substrate portions, andwherein each substrate portion of said second set of substrate portions comprises conductive yarns arranged to allow electrical connection of at least one of said electronic components thereto.2. The knitted substrate according to claim 1 , wherein substrate portions of said second set of substrate portions are knitted from said conductive yarns and non-conductive yarns.3. The knitted substrate according to claim 1 , wherein said substrate portion of said first set of substrate portions being provided between substrate portions of said second set of substrate portions is rib-knitted.4. The knitted substrate according to claim 1 , wherein at least one of said substrate portions of said second set of substrate ...

TETHER FOR RENEWABLE ENERGY SYSTEMS

The present invention provides a tether () containing strands () comprising high strength fibers and a plurality of conductors (), wherein each conductor () is separated from any other conductor along its length by at least one of said strands. The tether () can be used for transporting electrical power from a high altitude wind energy generator or a wave and tidal energy generator to a ground station. 1. A tether containing strands comprising high strength fibers and a plurality of conductors , wherein each conductor is separated from any other conductor along its length by at least one of said strands.2. The tether of wherein said tether has a length direction and wherein the conductors contained by said tether have an area as measured from a cross section perpendicular to said length direction of the tether of from 15% to 75% of the total area of said cross section.3. The tether of wherein the tether has a length direction and wherein the tether comprises primary strands comprising high strength fibers and at least one conductor claim 1 , the tether has a construction such that it comprises one or more longitudinal voids suitable for receiving the conductor claim 1 , and the area of the at least one conductor in a cross section perpendicular to the length direction of the tether is 15% to 75% of the total area of said cross section.4. The tether of wherein the area of the at least one conductor in the cross section is 20% to 60% of the total area of the cross section.5. The tether of wherein the tether comprises at least two longitudinal voids each containing a conductor.6. The tether of wherein the tether has a diameter of at least 20 mm claim 1 , preferably at least 50 mm.7. The tether of wherein the tether has a length of at least 100 m.8. The tether of wherein the conductor is aluminum or copper claim 1 , preferably aluminum.9. The tether of wherein the conductor is aluminum or copper with a purity of at least 98 wt. % based on the total weight of the ...

Flexible Tube, Manufacturing Method and Apparatus

Apparatus for use with two or more supplies of strip metal comprises, for each supply, a strip feeder and a bending head the feeder being adapted to receive metal from said each supply and deliver same to the head which is adapted to receive and curl metal from the feeder to produce a strip part encircling a central axis in a coiling manner. The heads and feeders are adapted such that the part axes are coincident and the parts are axially offset from one another, with axially adjacent parts being positioned relative to one another throughout their lengths to define a metal strip which encircles the coincident axes in a coiling manner, the metal strip defining a tubular arrangement which can be used at least for armor cable. The parts can have cross sections such that they interlock throughout their lengths and the strip interlocks with itself throughout its length.

CONDUCTIVE MEMBER, PRODUCTION METHOD OF THE SAME, TOUCH PANEL, AND SOLAR CELL

A conductive member containing: a base material; a conductive layer provided on the base material, wherein the conductive layer includes a metallic nanowire having an average short axis length of 150 nm or less and a matrix; and a protective layer including a three-dimensional crosslinked structure represented by the following Formula (I), sequentially in this order, and which has a surface resistivity measured at a surface of the protective layer of 1,000 Ω/□ or less, a production method of the conductive member, and a touch panel and a solar cell, each of which uses the conductive member. The conductive member may provide high resistance against scratches and abrasion, excellent conductivity, excellent transparency, excellent heat resistance, excellent moisture and heat resistance, and excellent bendability. 1. A conductive member comprising:a base material; a metallic nanowire having an average short-axis length of 150 nm or less, and', 'a matrix; and, 'a conductive layer provided on the base material, the conductive layer comprising'} {'br': None, 'sup': 1', '1, '-M-O-M-\u2003\u2003Formula (I), 'a protective layer comprising a three-dimensional crosslinked structure represented by the following Formula (I), sequentially in this order, and a surface resistivity of the conductive member measured at a surface of the protective layer being 1,000Ω/□ or less,'}{'sup': '1', 'wherein, in Formula (I), Mrepresents an element selected from the group consisting of Si, Ti, Zr and Al.'}2. The conductive member according to claim 1 , wherein the matrix is a cured product of a photopolymerizable composition or a sol-gel cured product obtained by hydrolysis and condensation of at least one alkoxide compound of an element selected from the group consisting of Si claim 1 , Ti claim 1 , Zr and Al.3. The conductive member according to claim 1 , wherein the protective layer comprises a sol-gel cured product obtained by hydrolysis and condensation of at least one alkoxide compound of ...

METHODS OF MANUFACTURING METAL WIRING BURIED FLEXIBLE SUBSTRATE BY USING PLASMA AND FLEXIBLE SUBSTRATES MANUFACTURED BY THE SAME

Disclosed are methods or manufacturing a metal wiring buried flexible substrate by using plasma and flexible substrates manufactured by the same. The method includes pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1), forming a metal wiring on the pre-treated substrate in Step 1 (Step 2), forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3), and separating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4), The metal wiring may be inserted into the flexible substrate, and the resistance of the wiring may be decreased. The metal wiring may be clearly separated from the substrate, and impurities on the substrate surface may be clearly removed. The flexible substrate may be easily separated by applying only physical force. 1. A method of manufacturing a metal wiring buried flexible substrate by using a plasma comprising:pre-treating a substrate by irradiating the plasma on the surface of the substrate (Step 1); forming a metal wiring on the pre-treated substrate in Step 1 (Step 2); forming a metal wiring buried polymer layer by coating a curable polymer on the substrate including the metal wiring formed thereon in Step 2 and curing (Step 3); andseparating the polymer layer formed in Step 3 from the substrate in Step 1 (Step 4).21. The method as set forth in claim 1 , wherein the plasma in Step is a plasma of at least one selected from the group consisting of Ar claim 1 , NO claim 1 , CF claim 1 , CH claim 1 , CH claim 1 , HO claim 1 , CHOH claim 1 , hexamethyldisiloxane (HMDSO) and tetramethylsilane (TMS).3. The method as set forth in claim 1 , wherein a contacting angle of the surface of the substrate pre-treated in Step 1 with respect to water is 45° to 150°.4. The method as set forth in claim 1 , wherein a contacting angle of the surface of the substrate pre-treated in Step 1 with respect to water ...

ELECTRICAL CABLE FOR THE ENERGY SUPPLY OF VEHICLES

Electrical cable () particularly for supplying energy to a vehicle (), with a sheath (), in which at least two insulated electrical conductors () are provided that are connected to at least one connector assembly () on at least one first end of the cable (). According to the invention the sheath () and/or the conductors () and/or at least one shaping element () that is preferably integrated in the cable () are designed in such a way that the cable () is held with a restoring force in a resting position, in which the cable () exhibits the form of a spiral and is aligned along a flat or curved resting plane. 115-. (canceled)16. An electrical cable for supplying energy to a vehicle , the cable having a sheath enclosing at least two insulated electrical conductors , the conductors being connected to at least one connector assembly on a first end of the cable , comprising:at least one of the sheath, the conductors and at least one shaping element integrated in the cable holds the cable with a restoring force in a resting position, wherein the cable in the resting position forms a spiral and is aligned along a flat or curved resting plane.17. The cable according to wherein at least a part of the resting plane is formed with a conical shape.18. The cable according to wherein the cable is held fixedly at an outer end of the spiral and is adapted to be connected to a current source or to a load.19. The cable according to wherein at least one of the sheath and the shaping element is made from a shape memory-polymer material or from a metal alloy material having a shape memory property.20. The cable according to wherein the metal alloy material having the shape memory property is a Nitinol material.21. The cable according to wherein the cable is formed at least partially of a thermoplastic caoutchouc material or a thermoplastic elastomer material.22. The cable according to wherein the cable is formed at least partially of at least one of a PUR material and a PVC-nitrile rubber ...

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIBLE SUBSTRATE AS WELL AS ASSEMBLY OF AN ELECTRIC COMPONENT WITH A FLEXIBLE SUBSTRATE

A method is presented for assembling a component () with a flexible substrate (), the component having electric contacts (). The method comprises the steps of 2. Method according to claim 1 , wherein one or more of the electric contacts of the component face away from the substrate and wherein one of the one or more layers is deposited at the first main side of the substrate.3. Method according to or claim 1 , wherein one or more of the electric contacts of the component face towards the substrate claim 1 , the method comprising the additional step of applying perforations in the substrate so that said one or more of the electric contacts of the component face towards the substrate are exposed at a second main side of the substrate and wherein one of the one or more layers is deposited at the second main side.4. Method according to claim 3 , wherein the perforations in the substrate taper outwards in a direction from the first main side to the second main side of the substrate.6. Apparatus according to claim 5 , further comprising a facility for forming a cavity in the substrate for receiving the component.7. Apparatus according to claim 5 , further comprising a facility for perforating the substrate so as to form perforations that expose electric contacts of the component at the second main side of the substrate.9. Assembly according to claim 8 , wherein the length/width ratio of the slits is at least 20. 1. Field of the InventionThe present invention relates to a method for assembling electric components on a flexible substrate.The present invention further relates to an apparatus for assembling electric components on a flexible substrate.The present invention further relates to an assembly of an electric component with a flexible substrate.2. Related ArtFlexible electronic products become more and more important, for example in the form of smart textiles, flexible displays and the like. Flexible electronic products mostly require the incorporation of ...

HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT

High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7. 1. A circuit comprising:a flexible section including a first portion of a flexible insulating layer; a second portion of the flexible insulating layer, and', 'a rigid insulating layer disposed on the second portion of the flexible insulating layer;, 'a rigid section includinga connector disposed on the rigid section, the connector configured to form a pluggable dual-sided, electrically conductive connection; and a first signal trace having a root mean square surface roughness equal to or below 20 micrometers, and', 'a filled signal via configured to pass through at least a portion of the rigid insulating layer,, 'an electrically conductive signal transmission line electrically coupled to the connector, the electrically conductive signal transmission line includingwherein the flexible insulating layer and the rigid insulating layer have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.2. The circuit of claim 1 , further comprising:a first cover layer ...

ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME

Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region. 1. An electronic circuit comprising:a substrate including a device region and an interconnection region;an electronic device disposed on the device region;a conductive line disposed on the interconnection region to electrically connect the electronic devices; anda capping layer on the substrate,wherein the device region is flat; andwherein the interconnection region has an uneven portion.2. The electronic circuit of claim 1 , wherein the uneven portion comprises a concave portion and a convex portion; andwherein the concave portion and the convex portion have a round shape.3. The electronic circuit of claim 2 , wherein the concave portion has a height equal to or lower than that of the device region; andwherein the convex portion has a height higher than that of the concave portion.4. The electronic circuit of claim 1 , wherein the conductive line extends along the uneven portion and has a wavy curve.5. The electronic circuit of claim 1 , wherein the uneven portion has a wavy shape in which a wave propagates in one direction claim 1 , a wavy shape in which a wave propagates in one direction and the other direction perpendicular to the one direction claim 1 , a wavy shape in which a wave propagates in a zigzag direction claim 1 , or a wavy shape in which a wave propagates ...

SWIRL INTERCONNECTION IN A FLEXIBLE CIRCUIT

The present disclosure concerns a flexible electronic circuit () and method of manufacturing. A flexible substrate () with conductive tracks is provided with a rigid electronic component (). The component () comprises electrical contacts () on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (). 1. A flexible electronic circuit comprisinga substrate; a first electrical contact on a first side of the electronic component, and', 'a second electrical contact on a second side of the electronic component opposite the first side; and, 'an electronic component comprising'} a first conductive track formed along a first pathway between a first contact pad contacting one of the electrical contacts of the electronic component and a first main connection to the rest of the conductive tracks disposed at the first side of the electronic component, and', 'a second conductive track formed along a second pathway between a second contact pad contacting the other one of the electrical contacts of the electronic component and a second main connection to the rest of the conductive tracks disposed at the second side of the electronic component; wherein, 'conductive tracks disposed on the substrate; wherein the conductive tracks comprise'}the first pathway comprises a first arced section that approaches the electronic component along a center line of the electronic component and reaches the electronic component exclusively from a third side, which center line intersects the electronic component at the third side of the electronic component transverse to the first side and the second side of the electronic component and between the electrical contacts; andthe second pathway comprises a second arced section that approaches the electronic component along the center line of the electronic ...

Dispersing Element, Method for Manufacturing Structure with Conductive Pattern Using the Same, and Structure with Conductive Pattern

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element () contains a copper oxide (), a dispersing agent (), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2). 1. A dispersing element comprising:a copper oxide, a dispersing agent, and a reductant, whereincontent of the reductant is in a range of a following formula (1), and [{'br': None, '0.0001≤(reductant mass/copper oxide mass)≤0.10\u2003\u2003(1)'}, {'br': None, '0.0050≤(dispersing agent mass/copper oxide mass)≤0.30\u2003\u2003(2)'}], 'content of the dispersing agent is in a range of a following formula (2).'}2. A dispersing element comprising:a copper oxide having a particle diameter of 1 nm or more to 50 nm or less;copper particles having particle diameters of 0.1 μm or more to 100 μm or less; andan organic compound having a phosphate group.3. A dispersing element comprising:a copper oxide and at least one kind of copper particles having shapes extending in one direction, dendritic shapes, or flat shapes.4. The dispersing element according to claim 1 , comprisingcopper particles, the copper particles having shapes extending in one direction, dendritic shapes, or flat shapes.5. The dispersing element according to claim 3 , comprisingat least the copper particles having the dendritic shapes.6. The dispersing element according to claim 1 , whereinthe copper oxide has a particle diameter of 1 nm or more to 50 nm or less.7. The dispersing element according to claim 2 , whereinthe copper particles have a mass ratio to a mass of the copper oxide of 1.0 or more to 7.0 or less.8. The dispersing element according to claim 2 , whereinthe organic compound has a mass ratio to a mass of the copper oxide of 0.0050 or more to 0.30 or less.9. The dispersing element according to claim 2 , comprisinga reductant, whereinthe reductant has a mass ratio to a mass ...

ELASTIC CIRCUIT

The present invention is an elastic electronic circuit adapted to provide three-dimensional elasticity. This is accomplished through a first pattern, a second pattern embedded within the first pattern, and a third pattern. The three-dimension elastic electronic circuit is adapted to conform to a flexible substrate, such as flexible plastic substrates and the like. The resulting three-dimensional elasticity enables the use of electronic circuits on such flexible substrates. 1. An elastic circuit comprising:a first pattern attached to a flexible substrate;a second pattern embedded within the first pattern; anda third pattern applied to said flexible substrate;wherein said first, second, and third patterns provide three-dimensional elasticity to said elastic circuit.2. The elastic circuit of claim 1 , wherein said first pattern is generally horseshoe shaped and further comprises a pattern path claim 1 , a radius of curvature claim 1 , and a turning degree offset.3. The elastic circuit of claim 2 , wherein said turning degree offset further comprises a range between 30 and 60 degrees.4. The elastic circuit of claim 2 , wherein said second pattern is identical in shape to said first pattern.5. The elastic circuit of claim 1 , wherein said third pattern is generally horseshoe shaped and further comprises a radius of curvature and a turning degree offset.6. The elastic circuit of claim 5 , wherein said turning degree offset further comprises a range between 30 and 60 degrees.7. The elastic circuit of claim 6 , wherein a cross-sectional view of said flexible substrate will represent said third pattern.8. The elastic circuit of claim 7 , wherein said flexible substrate is curved claim 7 , and wherein said third pattern is adapted to conform to said curved flexible substrate.9. The elastic circuit of claim 8 , wherein said curved flexible substrate further comprises a convex side and a concave side claim 8 , wherein the horseshoe patterns on said convex side are generally ...

ELECTRONIC TEXTILE AND METHOD OF MANUFACTURING AN ELECTRONIC TEXTILE

A method of manufacturing an electronic textile () comprising the steps of: providing a textile carrier () comprising a plurality of conductor lines (-); releasably attaching () the textile carrier () to a rigid support plate (); providing () a conductive substance on the textile carrier () in a pattern forming a plurality of sets of connection pads (-) on the textile carrier (), each set of connection pads defining a component placement position for placement of an electronic component (), and each set of connection pads (-) comprising a connection pad overlapping one of the conductor lines, the connection pad having a connection pad length (L) in a direction parallel to the conductor line and a connection pad width (W) in a direction perpendicular to the conductor line, wherein the connection pad width (W) is at least one percent of an extension (W) of the textile carrier () in the direction perpendicular to the conductor line; automatically placing () electronic components () at the component placement positions; curing () the conductive substance to attach the electronic components () to the textile carrier (), thereby forming the electronic textile () and removing () the electronic textile from the rigid support plate. 21. The electronic textile according to claim 1 , wherein said component pad has a component pad length () in a direction parallel to said conductor line and a component pad width (w) in a direction perpendicular to said conductor line claim 1 , and said connection pad width (W) is at least equal to said component pad width of the component pad that is connected to said connection pad.3. The electronic textile according to claim 1 , wherein said connection pad length (L) is at least equal to said component pad length (l).45ab. The electronic textile according claim 1 , wherein said connection pads (-) are formed by conductive glue.56ab. The electronic textile according to claim 1 , wherein said textile carrier comprises a plurality of interwoven ...

STRETCHING-CONTRACTING WIRING SHEET, PRODUCTION METHOD AND PRODUCTION DEVICE THEREFOR, AND STRETCHING-CONTRACTING TOUCH SENSOR SHEET

[Problem] To provide a high-stretchability/contractibility stretchable contractible wiring sheet that can be produced easily at low costs, has high flexibility, high durability, and high conformity to external force, and undergoes small resistance value change along with stretching and contracting and a producing method and apparatus for the same, and a stretchable contractible touch sensor sheet. 1. A stretchable contractible wiring sheet , comprising:a first elastomer sheet that is stretchable and contractible;a second elastomer sheet that is stretchable and contractible, and bonded on the first elastomer sheet in a manner to face the first elastomer sheet; anda lead interposed between the first elastomer sheet and the second elastomer sheet in a state of having a wavy shape periodically curving in-plane in facing surfaces of the first elastomer sheet and the second elastomer sheet and being biased in a direction to restore to a rod-like shape from the wavy shape during unloading.2. The stretchable contractible wiring sheet according to claim 1 ,wherein a cross-sectional shape of the lead in a diameter direction is a circular shape.3. The stretchable contractible wiring sheet according to claim 1 ,wherein a diameter of the lead is at most 50 micrometers.4. The stretchable contractible wiring sheet according to claim 1 ,wherein a Young's modulus of the lead is at least 150 GPa.5. The stretchable contractible wiring sheet according to claim 1 ,wherein a wave height of the wavy shape is from 20 micrometers through 5 mm.6. The stretchable contractible wiring sheet according to claim 1 ,wherein a ratio A/B is from 0.05 through 0.5, where A represents a curvature radius of wave crests of waves in the wavy shape and B represents a periodic pitch interval between adjoining waves of the waves in the wavy shape.7. A method for producing a stretchable contractible wiring sheet claim 1 , the method comprising:elongating a first elastomer sheet and a second elastomer sheet in ...

STRETCHABLE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME

Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection. 1. A method of manufacturing a stretchable electronic device , the method comprising:forming coil interconnections on a first substrate;forming a first stretchable insulating layer that covers the coil interconnection;forming a second substrate on the first stretchable insulating layer;separating the first substrate from the coiling interconnection and the first stretchable insulating layer; andforming a transistor on the coil interconnection.2. The method of claim 1 , wherein the forming of the coil interconnection comprises:forming a sacrificial layer on the first substrate;forming first interconnections on the sacrificial layer;forming pillar interconnections on the first interconnections; andforming second interconnections on the pillar interconnections.3. The method of claim 2 , wherein the sacrificial layer comprises a photoresist claim 2 , polysilicon claim 2 , silicon oxide claim 2 , or silicon nitride film.4. The method of claim 2 , wherein the separating of the first substrate comprises removing the sacrificial layer.5. The method of claim 4 , wherein the forming of the first interconnections comprises:forming a first seed layer on the sacrificial layer;forming a first photoresist pattern on a part of the first seed layer; andforming a first cap interconnection layer on the first seed layer exposed by the first photoresist pattern.6. The method of claim 5 , further comprising claim 5 , after the forming of the first interconnections claim 5 , removing the first photoresist pattern ...

Flexible substrate

According to one embodiment, a flexible substrate includes an insulating base material including an island-shaped portion, a first portion having a band shape and connected to the island-shaped portion, and a second portion having a band shape and connected to the island-shaped portion, and a wiring layer provided on the insulating base material. The first portion includes a first curved portion and a first straight portion connecting the island-shaped portion and the first curved portion, and the second portion includes a second curved portion and a second straight portion connecting the island-shaped portion and the second curved portion.

Preparation method of flexible transparent circuit

A manufacturing method of a flexible transparent circuit includes preparing a circuit template. The method further includes using a flexible transparent polymer material to prepare a cured transparent carrier on the circuit template, wherein the cured transparent carrier has a groove circuit structure. The method includes coating a solution containing a conductive material in a groove of the cured transparent carrier. The method further includes forming a circuit with the high transparency and conductivity after the solvent is volatilized. The circuit are designed and manufactured according to the requirements, and the precision thereof is able to achieve the micron or nanometer level. The formed circuit is light. The circuit can be stretched, bended or twisted many times. The circuit has a good biological compatibility. The circuit manufactured by such method is expected to be applied in various fields such as smart contact lens, flexible transparent electron devices, electronic skins.

FLEXIBLE MULTILAYER SUBSTRATE

A flexible multilayer substrate includes a stacked body including a plurality of stacked resin layers and defining a flexible portion. The stacked body includes an innermost surface that is a surface located inside when the stacked body is bent in use, and an outermost surface that is a surface located outside when the stacked body is bent in use. A plurality of conductor patterns are arranged inside the stacked body to be distributed over a surface of one or more of the plurality of resin layers. A portion located on the innermost surface side with respect to a center plane of the stacked body in a thickness direction is a first portion, and a portion located on the outermost surface side with respect to the center plane is a second portion. An area having a minimum spacing along the longitudinal direction between the conductor patterns arranged in the same plane, in all of the plurality of resin layers, is located in the second portion. 1. (canceled)2. A flexible multilayer substrate , comprising:a stacked body including a plurality of stacked resin layers extending in a longitudinal direction and defining a flexible portion; whereinthe stacked body includes an innermost surface that is a surface located inside when both ends in the longitudinal direction are bent to come closer to each other, and an outermost surface that is a surface located outside when both ends in the longitudinal direction are bent to come closer to each other;a plurality of conductor patterns are arranged inside the stacked body and distributed over a surface of one or more of the plurality of resin layers; anda portion located on an innermost surface side with respect to a center plane of the stacked body in a thickness direction is a first portion, a portion located on an outermost surface side with respect to the center plane of the stacked body in a thickness direction is a second portion, and an area having a minimum spacing along the longitudinal direction between the conductor ...

Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices. 1a flexible substrate having a supporting surface; anda semiconductor structure having a curved internal surface, wherein at least a portion of said curved internal surface is bonded to said supporting surface of said flexible substrate.. A stretchable semiconductor element comprising: This application is a continuation of U.S. patent application Ser. No. 14/220,923 filed Mar. 20, 2014, which is a continuation of U.S. patent application Ser. No. 13/441,618 filed Apr. 6, 2012 (now U.S. Pat. No. 8,754,396 Issued Jun. 17, 2014), which is a continuation of U.S. patent application Ser. No. 12/405,475 filed Mar. 17, 2009 (now U.S. Pat. No. 8,198,621 issued Jun. 12, 2012), which is a divisional of U.S. patent application Ser. No. 11/423,287 filed on Jun. 9, 2006 (now U.S. Pat. No. 7,521,292 issued Apr. 21, 2009), which is a continuation-in-part of U.S. patent application Ser. No. 11/145,542 filed Jun. 2, 2005 (now U.S. Pat. No. 7,557,367 issued Jul. 7, 2009) and U.S. patent application Ser. No. 11/145,574 filed Jun. 2, 2005 (now U.S. Pat. No. 7,622,367 issued Nov. 24, 2009), both of which claim the benefit under 35 U.S.C. 119(e) of U.S. Provisional Patent Application Nos. 60/577,077, 60/601,061, 60/650,305, 60/663,391 and 60/677,617 filed on Jun. 4, 2004, Aug. 11, 2004, Feb. 4, 2005, Mar. 18, 2005, and May 4, ...

FLEXIBLE CIRCUIT BOARD WITH PLANARIZED COVER LAYER STRUCTURE

A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height. 1. A flexible circuit board with a planarized cover layer structure , comprising:a substrate, which comprises a first surface and a second surface;a conductor layer, which is bonded to the first surface of the substrate, the conductor layer comprising a plurality of extended conductive signal lines, the conductive signal lines being spaced from each other by a predetermined distance so as to define a separation area between adjacent ones of the conductive signal lines;a first adhesive layer, which is formed on a surface of the conductor layer; andan insulation cover layer, which is laminated through the first adhesive layer on the surface of the conductor layer;wherein the separation areas between the conductive signal lines of the conductor layer are respectively formed with a filling layer, whereby the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to height of the conductive signal lines.2. The flexible circuit board as claimed in claim 1 , wherein the conductive ...

WIRE FOR USE IN EXTENDABLE ELECTRONIC DEVICE, EXTENDABLE ELECTRONIC DEVICE AND PREPARATION METHOD

Provided are a wire for use in an extendable electronic device, an extendable electronic device and preparation methods thereof. The wire is provided with a hollow region allowing extension and deformation of the wire. 1. A wire for use in an extendable electronic device , comprising:a hollow region allowing extension and deformation of the wire.2. The wire of claim 1 , wherein the wire has a planar structure before the extendable electronic device is deformed.3. The wire of claim 1 , wherein the hollow region has at least two hollow structures spaced apart from each other claim 1 , and an inner edge of at least one of the hollow regions is closed.4. The wire of claim 1 , wherein the hollow region has a smooth inner edge claim 1 , and extends along a straight line or a curve.5. The wire of claim 1 , wherein the wire comprises a conductive layer and an insulating layer wrapping around the conductive layer.6. The wire of claim 1 , wherein different hollow regions extend in an identical way or in different ways.7. The wire of claim 1 , wherein at least two of the hollow regions are substantially half-enclosed with each other claim 1 , and projections in any direction of the two hollow regions substantially half-enclosed with each other have an overlapping area.8. The wire of claim 1 , wherein one of the hollow regions is arranged adjacent to another hollow region claim 1 , and two adjacent hollow regions are substantially half-enclosed with each other.9. The wire of claim 1 , wherein at least one of the hollow regions extends to and is open at an edge of the wire.10. The wire of claim 5 , wherein the wire has at least one deformable extension direction claim 5 , and electrode connection portions for connecting with a functional element are provided at both ends of the wire in the extension direction and exposed outside the insulating layer.11. The wire of claim 10 , wherein the wire and the electrode connection portions are integral.12. The wire of claim 1 , wherein a ...

Integrated Electronic Device with Flexible and Stretchable Substrate

A flexible and stretchable integrated electronic device comprising a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. A method of fabricating an integrated electronic device having a stiffness gradient comprises applying a curing agent to an uncured polymer base material. 1. An integrated electronic device comprising:a substrate comprising a first section and a second section,a rigid electronic device is embedded in the substrate,wherein the first section of the substrate is adjacent to the rigid electronic device and has a uniform stiffness,wherein the second section of the substrate is peripheral to the first section and a has a stiffness gradient with a maximum stiffness at an interface with the first section.2. The integrated electronic device of claim 1 , wherein the substrate comprises an elastic polymer selected from the group consisting of polydimethylsiloxane claim 1 , two-part silicone elastomers claim 1 , room-temperature-vulcanizing silicone rubber claim 1 , tin-catalyzed silicones claim 1 , and platinum-catalyzed silicones .3. The integrated electronic device of :wherein an average of the Young's modulus of the second section is less than the Young's modulus of the first section.4. The integrated electronic device of claim 1 , further comprising:a passive electronic device embedded in the substrate and connected to the rigid electronic device.5. The integrated electronic device of claim 4 , wherein the passive electronic device is selected from the group consisting of an antenna claim 4 , a coil claim 4 , and a wire.6. The integrated electronic device of claim 5 , further comprising a third section of substrate surrounding the passive electronic device claim 5 , wherein the third section has a greater stiffness than an average of the stiffness of the second section.7. ...

Flexible display panel and fabricating method thereof, and image display terminal unit

A flexible display panel, and particularly, to a flexible display panel which is bendable, not an existing glass substrate, a fabrication method thereof, and an image display terminal unit using a flexible display panel are provided. In the case of the flexible display panel, the fabrication method, and the image display terminal unit, the flexible display panel is implemented with a plastic substrate, rather than the conventional glass substrate, and a portion of the non-active area of the display panel is cut to form a cutout portion to insert modules of the image display terminal unit into the cutout portion to thus reduce a receiving space of the lower housing, thereby minimizing a width of the bezel region.

HIGHLY STRETCHABLE WIRING, AND METHOD AND DEVICE FOR PRODUCING THE SAME

Conductor wires and are sandwiched between two elastomer sheets and whose adhesive layers face each other, and both adhere. When the elastomer sheets and are their natural lengths without being subjected to any tension, the conducting wires and are wound around into spiral shapes and contract. When tension is applied to the elastomer sheets and the number of spiral turns of the conductor wires and decreases according to its extension and the conductor wires and extend. The conductor wires and are electrically connected to and fixed to a circuit element at both ends of the elastomer sheets and As a result, it is possible to mass-produce, at low costs, highly stretchable wirings in which a change in resistance values due to extension thereof is small. 1. A highly stretchable wiring capable of extension and contraction , the at least highly stretchable wiring comprising: two elastomer sheets each having an adhesive layer , the both adhesive layers adhering to each other along a longitudinal direction on wide-directional both sides; and a high windable conductor wire wound in a spiral shape and contracted when the elastomer sheets have natural lengths without being subjected to any tension , and extending by reducing the number of spiral turns according to extension due to tension applied between both ends of the elastomer sheets , wherein the conductor wire is interposed between the elastomer sheets , is extended from surfaces of the elastomer sheets on the both ends of the elastomer sheets , is electrically connected with a circuit element , and is fixed thereon.2. The highly stretchable wiring according to claim 1 , wherein a conductor wire formed by coating a surface of a stretchable fiber with silver is used as the conductor wire.3. A matrix-shaped device characterized in that:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'wherein two sets of the highly stretchable wirings according to , in which a plurality of the conductor wires are arranged in parallel, ...

DATA COMMUNICATION CABLE AND METHOD OF MANUFACTURING SUCH CABLE

The present invention generally relates to a data communication cable () comprising: a set of elongated bodies () each formed from an elastic material and having an unextended free length; and for each elongated body (), a set of conductive wires () disposed along the elongated body (), such that each conductive wire () is extendable to more than the free length of the elongated body (), wherein at least one conductive wire () is configured for communicating data between electronic devices; and wherein the conductive wires () are extendable in response to extension of the elongated body (), such that the extended data communication cable () remains useable for said data communication between the electronic devices. 1. A data communication cable comprising:a set of elongated bodies each formed from an elastic material and having an unextended free length; andfor each elongated body, a set of conductive wires disposed along the elongated body, such that each conductive wire is extendable to more than the free length of the elongated body,wherein at least one conductive wire is configured for communicating data between electronic devices; andwherein the conductive wires are extendable in response to extension of the elongated body, such that the extended data communication cable remains useable for said data communication between the electronic devices.2. The data communication cable according to claim 1 , wherein the data communication cable comprises two or more elongated bodies adjacently joined together along their respective longitudinal edges.3. The data communication cable according to claim 2 , wherein the elongated bodies are foldable along the longitudinal edges for the data communication cable to have a thin form factor.4. The data communication cable according to claim 1 , wherein each elongated body with the conductive wires is configured for performing one or more functions claim 1 , the functions comprising high speed data transfer claim 1 , low speed ...

Injection molded element and production method

An injection molded element () made from plastic material from which one or plural electrical conductors () shall exit the electrical conductors are not directly encased when the injection molded element () is injection molded. Instead, an inner element () that has to be inserted into the injection mold first is prefabricated, for example also through injection molding, wherein the electrical conductors () are subsequently inserted into the inner element. The inner element () with the inserted conductors () is then inserted into the injection mold, wherein the inner element () protrudes at its faces beyond the injection molded element () enveloping it on the outside, so that the injection mold has to seal only relative to the outer circumference of the inner element () and not relative to the elastic electrical conductors () themselves. 11. An injection molded element () , comprising:at least one electrical conductor run out from the injection molded element characterized in that{'b': 1', '2, 'the injection molded element () is injection molded onto an inner element (),'}{'b': 3', '2, 'a conductor () is inserted into the inner element (),'}{'b': 2', '2', '4, 'the inner element () envelops the conductor which leaves the inner element () at least at one conductor outlet (), and'}{'b': 2', '1', '4, 'the inner element () protrudes from the injection molded element () at least with the conductor outlet ().'}211. The injection molded element () according to claim 1 , characterized in that the injection molded element () is made from plastic material.31212a, b. The injection molded element () according to claim 1 , characterized in that the inner element () is made from two separate half shells () or half shells connected by a film hinge.41125a, ba, b. The injection molded element () according to claim 3 , characterized in that the half shells () include interacting interlocking devices () and are interlocked with one another in assembled condition.512611123. The injection ...

WIRING BOARD AND ELECTRONIC APPARATUS

A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics. 1. A wiring board comprising:a base that has extensibility;a first wiring portion that is formed on the base and extends in a first direction crossing a longitudinal direction of the base; anda first conductor portion that is formed on the first wiring portion and extends in the first direction.2. The wiring board according to claim 1 ,wherein the first wiring portion has extensibility, andwherein the first conductor portion has extensibility lower than that of the first wiring portion and has resistivity lower than that of the first wiring portion.3. The wiring board according to claim 1 ,wherein the first wiring portion includes a binder and a conductive filler included in the binder, andwherein the first conductor portion includes metal material or carbon material.4. The wiring board according to claim 1 , wherein the first conductor portion is formed as a layer or a column.5. The wiring board according to claim 1 , wherein an angle between a lateral direction perpendicular to the longitudinal direction of the base and the first direction is smaller than an angle between a diagonal line of the first conductor portion and the first direction.6. The wiring board according to claim 1 , wherein the first conductor portion has a wider end portion in the first direction.7. The wiring board according to claim 6 , wherein the first conductor portion has a ...

ABLATION CABLE ASSEMBLIES AND A METHOD OF MANUFACTURING THE SAME

A cable assembly includes a rigid portion, a flexible central portion, and a radiating portion. The rigid portion is configured to couple to a source of electrosurgical energy and to prevent fluid ingress towards the source of electrosurgical energy. The flexible central portion extends from the rigid portion and includes an inner conductor, a dielectric disposed about the inner conductor, and a conductive braid disposed about the dielectric. The radiating portion extends from the central portion and is configured to deliver electrosurgical energy to tissue. 1. A cable assembly comprising:a rigid portion configured to couple to a source of electrosurgical energy and prevent fluid ingress, the rigid portion including a rigid tube disposed about the dielectric and in electrical communication with the conductive braid; an inner conductor;', 'a dielectric disposed about the inner conductor; and', 'a conductive braid disposed about the dielectric; and, 'a flexible central portion extending from the rigid portion, the central portion includinga radiating portion extending from the central portion configured to deliver electrosurgical energy to tissue.2. The cable assembly according to claim 1 , wherein the entire cable assembly has a diameter of in the range of 0.01 inches to about 0.5 inches.3. The cable assembly according to claim 1 , wherein the conductive braid is in tension between the rigid portion and the radiating portion.4. The cable assembly according to claim 2 , wherein the rigid tube is in intimate contact with the dielectric to prevent fluid ingress towards a proximal portion of the cable assembly.5. The cable assembly according to claim 2 , wherein a proximal end of the inner conductor extends from the rigid tube.6. The cable assembly according to claim 2 , wherein a distal portion of the rigid tube fixes the position of a proximal end of the conductive braid relative to the dielectric.7. The cable assembly according to claim 6 , wherein the distal portion ...

STRETCHABLE ELECTRONIC DEVICE

A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another. 1. A stretchable electronic device , comprising:a substrate;a plurality of electronic elements, disposed on the substrate; anda conductive wiring, disposed on the substrate and electrically connected to the electronic elements, wherein the conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer, a fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, the non-elastic conductive layer comprises a plurality of first fragments separated from one another, the elastic conductive layer is a continuous wiring, and an orthogonal projection of the elastic conductive layer on the substrate overlaps orthogonal projections of a plurality of the first fragments and a plurality of gaps among the plurality of the first fragments on the substrate.2. The stretchable electronic device according to claim 1 , wherein the fracture strain of the elastic conductive layer is greater than 10%.3. The stretchable electronic device according to claim 1 , wherein the fracture strain of the non-elastic conductive layer is less than 10%.4. The stretchable electronic device according to claim 1 , wherein a material of the elastic conductive layer comprises at least one of polyacetylene claim 1 , polypyrrole claim 1 , polythiophene claim 1 , polyaniline claim 1 , poly(p-phenylene) ...

Elastic Wiring Member

To provide an elastic wiring member that is to be used in connection with an electronic component or an external electronic device and that is less likely to undergo a change in resistance when the member is stretched. An elastic wiring member includes a stretchable wiring line having stretchability and connected to a contact of an electronic device main body A and a contact of an electronic component, and a base sheet, formed of a rubber-like elastic body, holding the stretchable wiring line. The elastic wiring member further includes reinforcing members arranged in or on the base sheet. The reinforcing members are located adjacent to connection parts of the stretchable wiring line connected to the contacts and when the base sheet is viewed from above. The reinforcing members inhibit the base sheet from stretching and prevent deformation of the connection parts of the stretchable wiring line. 1. An elastic wiring member comprising:an elastic sheet formed of a rubber-like elastic body;a stretchable wiring line including a conductive line disposed inside the elastic sheet and connection part located on the conductive line; anda reinforcing member disposed adjacent to the connection part and made of a rigid material, the reinforcing member inhibiting the elastic sheet from stretching and contracting, or deforming around the connection part.2. The elastic wiring member according to claim 1 , further comprising:a connection target member in electrical communication with the stretchable wiring line through the connection part.3. The elastic wiring member according to claim 1 , wherein the stretchable wiring line includes a plurality of connection parts.4. The elastic wiring member according to claim 2 , wherein the connection target member is at least one of an electronic device claim 2 , an electronic component claim 2 , and a contact member.5. The elastic wiring member according to claim 2 , wherein the connection target member is fixed to the connection part.6. The ...

BIODEGRADABLE MATERIALS FOR MULTILAYER TRANSIENT PRINTED CIRCUIT BOARDS

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. 1. A transient printed circuit board (PCB) comprising:a substrate; anda plurality of electrical interconnects supported by said substrate; wherein at least a portion of said plurality of electrical interconnects comprises at least one pad for receiving a lead from an electronic component;wherein at least one of said substrate and said plurality of electrical interconnects comprises a selectively transformable material.2. A transient electronic device comprising: a substrate; and', 'a plurality of electrical interconnects supported by said substrate; wherein at least a portion of said plurality of electrical interconnects comprises at least one pad;, 'a transient printed circuit board (PCB) comprisingone or more electronic device components electrically connected to said at least one pad;wherein at least one of said substrate, said plurality of electrical interconnects and said one or more electronic device components comprises a selectively transformable material.3. The transient PCB of claim 1 , wherein said selectively transformable material undergoes a transformation upon application of an internal or external stimulus.4. The transient PCB of claim 3 , wherein said transformation is dissolution or biodegradation to benign end products.5. The transient PCB of claim 3 , wherein said transformation is a change from a first functionally operable state to a second functionally inoperable state.6. The transient PCB of claim 3 , wherein said selectively transformable material undergoes said transformation at a preselected rate.7. The transient PCB of claim 1 , wherein said selectively transformable material is stable in the absence of an internal or external stimulus for a period of at least 5 days.8. The transient PCB of claim 1 , wherein upon exposure to ...

Compressed stranded conductor, method of manufacturing compressed stranded conductor, insulated electric wire, and wire harness

A compressed stranded conductor includes a central stranded wire having a plurality of conductive strands which are twisted together and an outer circumferential stranded wire having a plurality of conductive strands which are twisted together at an outer circumference of the central stranded wire. A composite stranded wire configured by the central stranded wire and the outer circumferential stranded wire is compressed, and an occupancy ratio of the composite stranded wire is 90.2% or more and 91.0% or less.

FLEXIBLE AND STRETCHABLE STRUCTURES

A flexible hybrid electronic system and method includes a first structure and a second structure. The first structure includes a first flexible substrate, a first electronic component secured to the first flexible substrate, and a first flexible conductive trace formed in part from conductive gel. The second structure includes a second flexible substrate, a second electronic component secured to the second flexible substrate, and a second flexible conductive trace formed in part from conductive gel. The first structure is bonded to the second structure at an interconnect region, the first conductive trace is electrically coupled to the second conductive trace within the interconnect region, and the first electronic component is operatively coupled to the second electronic component.

MOVABLE PLUG EXTENSION-CABLE SYSTEM AND METHODS THEREOF

The exemplified systems and methods provide an extension cord system having a cord that is configured to slidably guide a movable plug carriage having conventional plug receptacle. In some embodiments, the movable plug carriage is configured with pierce-able conductors that can be inserted and retracted from a sealed skin of the cord. In other embodiments, the sealed skin can be fastened and unfastened by the movable plug carriage as the movable plug carriage moves over the cord. In yet other embodiments, the movable plug carriage is attachable and detachable from the cord. 1. A system comprising:a flexible elongated member comprising a plurality of electrical conductors surrounded by a non-conductive encapsulation, wherein each of the plurality of electrical conductors extends between a first end and a second end defining the flexible elongated member, wherein at least one of the first end or the second end terminates with a standardized electrical plug; anda receptacle plug carrier having a housing and a standardized electrical receptacle configured to receive an electrical plug, the housing having a longitudinal axis that extends over a portion of the flexible elongated member, the receptacle plug carrier being configured to slidably move between the third end and the fourth end of the of the flexible elongated member.2. The system of claim 1 , wherein the non-conductive encapsulation comprises a set of fastening members configured as a strip that extends between a third end and a fourth end over a portion of the flexible elongated member claim 1 , wherein each fastening member of the set of fastening members is transitionable from a fastened state to an unfastened state and from the unfastened state to the fastened state claim 1 , and wherein the receptacle plug carrier comprises a first fastening element and a second fastening element disposed in the housing claim 1 , wherein each of the first fastening element and the second fastening element is coupled to a ...

STRETCHABLE WIRING BOARD AND METHOD FOR MANUFACTURING STRETCHABLE WIRING BOARD

A stretchable wiring board includes: a first stretchable substrate; an overcoat layer; and a conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer. The conductor layer includes a wiring portion covered with the overcoat layer and a connection portion that has a surface exposed from the overcoat layer. The exposed surface of the connection portion is flush with a top surface of the overcoat layer. 1. A stretchable wiring board comprising:a first stretchable substrate;an overcoat layer; anda conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer, wherein a wiring portion covered with the overcoat layer; and', 'a connection portion that has a surface exposed from the overcoat layer, the exposed surface of the connection portion is flush with a top surface of the overcoat layer., 'the conductor layer comprises2. The stretchable wiring board according to claim 1 , further comprising:a first reinforcing member interposed between the first stretchable substrate and the conductor layer, whereinthe first reinforcing member overlaps with at least a part of the connection portion when viewed from a thickness direction of the conductor layer.3. The stretchable wiring board according to claim 2 , wherein the first reinforcing member is buried in the first stretchable substrate.4. The stretchable wiring board according to claim 1 , further comprising a second reinforcing member that overlaps with at least a part of wiring portion when viewed from a thickness direction of the conductor layer.5. The stretchable wiring board according to claim 4 , wherein the second reinforcing member is harder than the first stretchable substrate.6. The stretchable wiring board according to claim 4 , wherein the stretchable wiring board comprises a plurality of second reinforcing members intermittently disposed along the wiring portion.7. The stretchable wiring board according to claim 6 , wherein ...

TOUCH SENSOR AND MANUFACTURING METHOD THEREOF

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels. 1. A touch sensor comprising:a first stretchable substrate comprising first channels extended in a first direction;a first conductive liquid injected into the first channels;a second stretchable substrate comprising second channels extended in a second direction crossing the first direction; anda second conductive liquid injected into the second channels.2. The touch sensor as claimed in claim 1 , wherein:at least one of the first channels or the second channels comprises straight lines and wedges, and at least one of the wedges comprises a round part;the round part comprises an inner round portion and an outer round portion; and {'br': None, 'i': W≦ROC−', 'W, '0.5×0≦0.63×'}, 'a radius of a curvature of the outer round is expressed in an equation below(where W is at least one width of the straight lines and ROC-O is the radius of the curvature of the outer round portion).3. The touch sensor as claimed in claim 2 , wherein:two adjacent first channels among the first channels comprise a first wedge and a second wedge, respectively;the first wedge and the second wedge are adjacent to each other;at least one of a length in the second direction of the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 600 μm; anda distance between the first wedge and the second wedge is greater than or equal to 150 μm and less than or equal to 200 μm.4. The touch sensor as claimed in claim 1 , wherein the touch sensor further comprises:first electrodes inserted into first holes formed at one end of the first channels; andsecond ...

Stretchable and Foldable Electronic Devices

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device. 144.-. (canceled)45. A stretchable and foldable multilayer electronic device , comprising:a substrate;an isolation layer disposed on a portion of the substrate; at least one device island; and', 'at least one stretchable interconnect coupled to the at least one device island;', 'wherein at least a portion of the device island is in physical communication with the isolation layer; and', 'wherein at least a portion of the stretchable interconnect is not in physical communication with the isolation layer;, 'a functional layer comprisingone or more neutral mechanical surface adjusting layers; and wherein at least one of said one or more neutral mechanical surface adjusting layers is disposed over said functional layer,', 'wherein at least one of said one or more neutral mechanical surface adjusting layers of said multilayer electronic device has a property that is spatially inhomogeneous relative to a location in said multilayer electronic device., 'one or more encapsulating layers disposed over the at least one device island,'}46. The device of claim 45 , wherein said spatially inhomogeneous property claim 45 , said isolation layer claim 45 , said at least one stretchable interconnect claim 45 , and said one or more encapsulating layers position a ...

STRETCHABLE MOUNTING BOARD

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer. 1. A stretchable mounting board comprising:a stretchable substrate having a main surface;a stretchable wiring disposed on the main surface of the stretchable substrate;a mounting electrode section electrically connected to the stretchable wiring;solder electrically connected to the mounting electrode section and including bismuth and tin; andan electronic component electrically connected to the mounting electrode section with the solder interposed between the electronic component and the mounting electrode,whereinthe mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin, anda concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.2. The stretchable mounting board according to claim 1 , wherein the mounting electrode section further includes silver and a resin.3. The stretchable mounting board according to claim 2 , wherein the resin includes at least one resin selected from ...

STRETCHABLE SUBSTRATE, STRETCHABLE PHOTOVOLTAIC APPARATUS, AND STRETCHABLE DEVICE

A stretchable photovoltaic apparatus according to the present invention includes: a stretchable substrate including islands protruded from a base such that the islands are separated by a trench, and a notch formed in an edge of each of the islands; a photovoltaic cell mounted on the stretchable substrate; and an interconnector of which at least a portion is positioned inside the notch, the interconnector electrically connecting the neighboring photovoltaic cells in one pair. According to the present invention, a semiconductor device may be configured in the form of a stretchable array. Therefore, the present invention is expected to be applied to various industrial fields such as a solar cell field, a display field, a semiconductor device field, a medical field, a clothing field, a measurement field, and a filming field. 1. A stretchable photovoltaic apparatus comprising:a stretchable substrate including islands protruded from a base such that the islands are separated by a trench, and a notch formed in an edge of each of the islands;a photovoltaic cell mounted on the stretchable substrate; andan interconnector of which at least a portion is positioned inside the notch, the interconnector electrically connecting the neighboring photovoltaic cells in one pair.2. The stretchable photovoltaic apparatus of claim 1 , wherein the island has at least any one shape of a triangle claim 1 , a rectangle claim 1 , a polygon claim 1 , a circle claim 1 , and an ellipse.3. The stretchable photovoltaic apparatus of claim 1 , wherein the notch has at least any one shape of a triangle claim 1 , a rectangle claim 1 , a polygon claim 1 , a circle claim 1 , and an ellipse.4. The stretchable photovoltaic apparatus of claim 1 , wherein the notch is provided to a center of each of the edges of the island.5. The stretchable photovoltaic apparatus of claim 1 , wherein the interconnector is placed inside the notch when the stretchable substrate is deformed and thus the islands in one pair ...

METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS

A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has a ceramic substrate sheet overlying support substrate, and the ceramic substrate sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the ceramic substrate sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses. 1. A flexible sheet of light-emitting diode (LED) light emitters , comprising:a support substrate including a thermally conductive material;a ceramic substrate sheet overlying support substrate, the ceramic substrate sheet including a plurality of LED light emitters;a flexible circuit sheet overlying the ceramic substrate sheet;a phosphor sheet overlying flexible circuit sheet, the phosphor sheet including a wave-length converting material; anda lens sheet overlying the phosphor sheet, the lens sheet including a plurality of lenses.2. The flexible sheet of LED light emitters of claim 1 , wherein the flexible sheet of LED emitters is also stretchable.3. The flexible sheet of LED light emitters of claim 1 , wherein each of the plurality of lenses in the lens sheet is aligned to a corresponding one of the plurality of LED light emitters.4. The flexible sheet of LED light emitters of claim 1 , wherein the lens sheet comprises pre-formed notches between adjacent lenses.5. The flexible sheet of LED light emitters of claim 1 , wherein the ceramic substrate comprises pre-formed notches between adjacent emitters.6. The flexible sheet of LED light emitters of claim 1 , wherein the lens sheet comprises separate lenses.7. The flexible sheet of LED light emitters of claim 1 , wherein the ceramic ...

Flexible substrate

According to one embodiment, a flexible substrate includes an insulating base including a first surface and a second surface on an opposite side to the first surface, a wiring layer provided on the second surface side of the insulating base and a resin layer including a support located on the first surface side of the insulating base and a coating layer located on the second surface side of the insulating base, the resin layer including a first area and a second area in planar view, the resin layer having a first elastic modulus in the first area and a second elastic modulus in the second area, and the first elastic modulus being greater than the second elastic modulus.

STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF

A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band. 1. A wire bus , comprising:a plurality pads;a plurality of wires, each wire connected with one of the pads;a plurality of electrodes;a plurality of skirts, each skirt having a shot channel,each electrode connected with one of the pads and one of the skirts; anda bus substrate including a plurality of alignment structures and a plurality of shot ports with each shot port aligned with the shot channel of one of the skirts, the skirts and a portion of the electrodes are positioned above a first surface of the bus substrate, and a first portion of the plurality of wires is encapsulated by the bus substrate and a second portion of the plurality of wires is positioned at a distal end of the bus substrate.2. The wire bus of and further comprising:a substrate mounted on the bus substrate, the substrate including an antenna and a near field communication chip coupled with the antenna.3. The wire bus of claim 1 , wherein each wire comprises an insulating outer layer claim 1 , a conductor layer surrounded by the insulating outer layer claim 1 , and a core layer surrounded by the conductor layer.4. The wire bus of claim 1 , wherein each electrode includes an upper surface having a distance above the first surface that ...

ELECTRICAL CONNECTING ELEMENT

An electrical connecting element includes a stretchable insulation sheet, two or more first conductive threads on one surface of the insulation sheet, and two or more first resin threads on the one surface of the insulation sheet. The first conductive threads extend in a predetermined direction and are disposed in parallel with each other orthogonally to the predetermined direction. The first resin threads have thermal adhesiveness. The first resin threads do not overlap with any of the first conductive threads. 1. An electrical connecting element comprising:a stretchable insulation sheet;two or more first conductive threads on one surface of the insulation sheet, the first conductive threads extending in a predetermined direction, the first conductive threads being disposed in parallel with each other orthogonally to the predetermined direction; andtwo or more first resin threads on the one surface of the insulation sheet, the first resin threads having thermal adhesiveness, the first resin threads not overlapping with any of the first conductive threads.2. The electrical connecting element according to claim 1 , whereinthe first conductive threads and the first resin threads are sewn to the insulation sheet.3. The electrical connecting element according to claim 1 , further comprising:two or more second conductive threads on the other surface of the insulation sheet, the second conductive threads extending in a predetermined direction, the second conductive threads being disposed in parallel with each other orthogonally to the predetermined direction; andtwo or more second resin threads on the other surface of the insulation sheet, the second resin threads having thermal adhesiveness, the second resin threads not overlapping with any of the second conductive threads.4. The electrical connecting element according to claim 3 , whereinthe first conductive threads and the first resin threads are sewn to the insulation sheet, orthe second conductive threads and the ...

METHODS FOR COVERING AN ELONGATE SUBSTRATE

A cover assembly for covering an elongate substrate includes a holdout device and a resilient, elastically radially expanded sleeve member. The holdout device includes a core having an axially extending slit defined therein and defining a core passage to receive the substrate, and a designated target region. The sleeve member defines an axially extending sleeve passage. The sleeve member is mounted on the core such that the core is disposed in the sleeve passage and the sleeve member exerts a radially compressive recovery force on the core. When the substrate is disposed in the core passage and a radially directed release force is applied to the target region, the core will reduce in circumference and collapse around the substrate under the recovery force of the sleeve member to a collapsed position. 1. A cover assembly for covering an elongate substrate , the cover assembly comprising: a core having an axially extending slit defined therein and defining a core passage to receive the substrate; and', 'a designated target region; and, 'a holdout device includinga resilient, elastically radially expanded sleeve member defining an axially extending sleeve passage, the sleeve member being mounted on the core such that the core is disposed in the sleeve passage and the sleeve member exerts a radially compressive recovery force on the core;wherein, when the substrate is disposed in the core passage and a radially directed release force is applied to the target region, the core will reduce in circumference and collapse around the substrate under the recovery force of the sleeve member to a collapsed position.2. The cover assembly of wherein the release force applied to the target region causes an axially extending first edge of the core to slide beneath an opposing axially extending second edge of the core claim 1 , thereby allowing the core to curl upon itself under the recovery force.3. The cover assembly of wherein the second edge defines an axially extending ledge.4. ...

Method for manufacturing strecthable circuit board and strecthable circuit board

[Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board. [Solving Mean] A stretchable circuit board is manufactured through: a step in which an external terminal 31 is formed on a main surface 33 b located on one side of a film base 33 ; a step in which a stretchable wiring portion 55 is formed on a main surface 53 a located on one side of a stretchable base 53 ; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31 , and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.

MOISTURE SENSITIVE SHEET AND MOISTURE SENSITIVE SYSTEM

A moisture sensitive sheet includes a stretchable circuit board having stretchability, a moisture absorbing film provided on a main surface of the stretchable circuit board and exhibiting an electric property changing according to an amount of moisture absorption, and a stretchable electrode provided on the main surface, having stretchability, and configured to measure the electric property of the moisture absorbing film. 1. A moisture sensitive sheet comprising:a stretchable circuit board having stretchability;a moisture absorbing film provided on a main surface of the stretchable circuit board and exhibiting an electric property changing according to an amount of moisture absorption; anda stretchable electrode provided on the main surface, having stretchability, and configured to measure the electric property of the moisture absorbing film.2. The moisture sensitive sheet according to claim 1 , further comprising:an adhesive layer formed in a partial region of the stretchable circuit board and exhibiting adhesion.3. The moisture sensitive sheet according to claim 2 , whereinthe adhesive layer is formed such that at least a part of the moisture absorbing film is exposed on the main surface provided with the moisture absorbing film.4. The moisture sensitive sheet according to claim 3 , whereinthe stretchable circuit board includes a moisture impermeable film exhibiting low moisture permeability.5. The moisture sensitive sheet according to claim 2 , whereinthe adhesive layer is formed at a surface on a back of the main surface provided with the moisture absorbing film such that the surface on the back of the main surface corresponding to a first region is at least partially exposed, the moisture absorbing film being formed in the first region.6. The moisture sensitive sheet according to claim 5 , whereinthe stretchable electrode includes multiple electrode portions, andthe adhesive layer is formed such that the surface on the back of the main surface corresponding to ...

STRETCHABLE AND FLEXIBLE ELECTRICAL SUBSTRATE INTERCONNECTIONS

A circuit interconnect may be used in biometric data sensing and feedback applications. A circuit interconnect may be used in device device-to-device connections (e.g., Internet of Things (IoT) devices), including applications that require connection between stretchable and rigid substrates. A circuit interconnect may include a multi-pin, snap-fit attachment mechanism, where the attachment mechanism provides an electrical interconnection between a rigid substrate and a flexible or stretchable substrate. The combination of a circuit interconnect and flexible or stretchable substrate provides improved electrical connection reliability, allows for greater stretchability and flexibility of the circuit traces, and allows for more options in connecting a stretchable circuit trace to a rigid PCB. 1. An apparatus comprising:a stretchable substrate;a first plurality of substrate contacts disposed on a first side of the stretchable substrate; anda biometric sensor disposed on the stretchable substrate and electrically connected to at least one of the first plurality of substrate contacts.21. The apparatus of , further including a first plurality of contact traces in electrical contact with the first plurality of substrate contacts.31. The apparatus of , further including a first molded connector portion disposed on the first side of the stretchable substrate , the first molded connector portion including a first plurality of contact pins in electrical contact with the first plurality of substrate contacts.43. The apparatus of , wherein each of the first plurality of contact pins includes a first spring-loaded conductive portion to increase the electrical conductivity between the first plurality of contact pins and the first plurality of substrate contacts.53. The apparatus of , further including a first rigid PCB disposed on and electrically connected to the first molded connector portion.65. The apparatus of , further including a first plurality of electronic components ...

Soft, Multilayered Electronics for Wearable Devices and Methods to Produce the Same

Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion-controlled soft materials assembly. Well-aligned, multi-layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as microchip integrated circuits (IC), discrete electrical components, and interconnects. These techniques are applied using commercially available materials. These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio-monitoring applications. 1. A method of fabricating a wearable electronic device comprising:affixing a material to a substrate;pattering the material with a laser cutter;removing excess material from the substrate to create a first layer;creating at least one additional layer;joining the first layer and the at least one additional layer; andintegrating an IC component.2. The method of claim 1 , wherein the substrate comprises polydimethylsiloxane.3. The method of claim 2 , further comprising:adjusting the modulus of elasticity of the substrate to affect its adhesion.4. The method of claim 1 , further comprising:patterning the substrate to affect its adhesion.5. The method of claim 1 , wherein the material is an acrylic tape.6. The method of claim 1 , wherein joining the first layer and the at least one additional layer comprises:aligning the substrate of the first layer and a substrate of the at least one additional layer with a locating mechanism.7. The method of claim 6 , wherein the locating mechanism comprises a slot on each of the substrates and a pin.8. A soft multilayer electronic device comprising:a first layer of material patterned in a laser cutter; wherein the at least one additional layer of material is affixed to the first layer via adhesion,', 'wherein the at least one additional layer is transferred from a soft substrate., 'at ...

CURVED DISPLAY DEVICE

A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction. 1. A curved display device , comprising:a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips;a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package; anda display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package,wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.2. The curved display device as claimed in claim 1 , wherein:the input wire unit is simultaneously connected to the plurality of driving chips, anda connection wire for transferring a carry signal is disposed between adjacent driving chips.3. The curved display device as claimed in claim 2 , wherein the input wire unit includes a plurality of input wires claim 2 , each of the input wires including main wires and branched wires branched from the main wires and connected to the driving chips.4. The curved display device as claimed in claim 3 , wherein the driving chips receive the same data through the input wire unit claim 3 , and input data is stored in a ...

METHOD FOR THE ELECTRICAL PASSIVATION OF ELECTRODE ARRAYS AND/OR CONDUCTIVE PATHS IN GENERAL, AND A METHOD FOR PRODUCING STRETCHABLE ELECTRODE ARRAYS AND/OR STRETCHABLE CONDUCTIVE PATHS IN GENERAL

A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste. 1. A method for encapsulating a conductive path formed on a support carrier , said method comprising:forming an encapsulation layer on a substrate;forming at least one through via through said encapsulation layer;aligning said at least one through via with a predefined portion of said conductive path;reciprocally bonding said encapsulation layer and said support carrier.2. The method as claimed in claim 1 , wherein said substrate comprises a transparent carrier claim 1 , said method further comprising removing said transparent carrier once said encapsulation layer and said support carrier have been reciprocally bonded.3. The method as claimed in claim 2 , further comprising forming a silicone rubber layer on said transparent carrier claim 2 , forming said encapsulation layer on said silicone rubber layer claim 2 , and peeling off said silicone rubber layer from said encapsulation layer once said encapsulation layer has been bonded to said support carrier.4. The method as claimed in claim 3 , said method further comprising functionalizing an exposed surface of said silicone rubber layer with a non-stick release layer claim 3 , wherein said encapsulation layer is deposited on said non-stick release layer.5. The method as claimed in claim 1 , wherein said support ...

STRETCHABLE ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Provided are a stretchable electronic device and a method for manufacturing the same. The stretchable electronic device includes lines having lower pads, a chip provided on the lower pads and having first upper pads, which are wider than the lower pads, and an adhesive layer provided outside the lower pads or between the lower pads and bonded to the first upper pads. 1. A stretchable electronic device comprising:lines having lower pads;a chip provided on the lower pads, the chip having first upper pads wider than the lower pads; andan adhesive layer provided outside the lower pads or between the lower pads, the adhesive layer bonded to the first upper pads.2. The stretchable electronic device of claim 1 , further comprising a stretchable substrate in which the lines and the adhesive layer are mounted.3. The stretchable electronic device of claim 2 , further comprising a lower plastic layer provided in the stretchable substrate below the lines and the lower pads.4. The stretchable electronic device of claim 3 , further comprising a first lower fixing layer provided in the stretchable substrate to surround the adhesive layer claim 3 , the lower pads claim 3 , and the upper plastic layer.5. The stretchable electronic device of claim 4 , further comprising a second lower fixing layer configured to surround the first lower fixing layer and provided in the stretchable substrate.6. The stretchable electronic device of claim 5 , wherein each of the first lower fixing layer and the second lower fixing layer comprises PDMS.7. The stretchable electronic device of claim 3 , further comprising a thin film transistor provided in the lower plate layer and connected to the lines.8. The stretchable electronic device of claim 2 , wherein each of the stretchable substrate and the adhesive layer comprises a silicon compound.9. The stretchable electronic device of claim 1 , further comprising an upper fixing layer configured to cover the chip.10. The stretchable electronic device of ...

COILED CORD AND DISPLACEMENT APPARATUS

The present disclosure provides a coiled cord capable of increasing the length of a cable while preventing a winding diameter of the coiled cord in a plane orthogonal to the direction in which the coiled cord is extended and contracted in a natural state from increasing. A first exemplary aspect is a coiled cord around which a cable is wound, the cable being capable of being freely extended and contracted, the coiled cord including: a first layer in which the cable is wound from an inner side of the coiled cord to an outer side thereof in a radial direction, and a second layer in which the cable is wound from the outer side of the coiled cord to the inner side thereof in the radial direction, in which the first and the second layers are continuously connected to each other. 1. A coiled cord around which a cable is wound , the cable being capable of being freely extended and contracted , the coiled cord comprising:a first layer in which the cable is wound from an inner side of the coiled cord to an outer side thereof in a radial direction, and a second layer in which the cable is wound from the outer side of the coiled cord to the inner side thereof in the radial direction, whereinthe first and the second layers are continuously connected to each other.2. The coiled cord according to claim 1 , wherein when a direction in which the coiled cord is extended and contracted is one axial direction claim 1 , a plurality of the cables are stacked and integrated in the direction in which the coiled cord is extended and contracted.3. The coiled cord according to claim 1 , wherein a direction in which the cable of the first layer is wound from the inner side of the coiled cord to the outer side thereof in the radial direction is the same as a direction in which the cable of the second layer is wound from the outer side of the coiled cord to the inner side thereof in the radial direction.4. The coiled cord according to claim 1 , wherein a direction in which the cable of the ...

CAPACITIVE SENSOR SYSTEMS AND METHOD

A capacitive sensor may include a stretchable substrate, a first conductor assembly disposed on the substrate, a second conductor assembly disposed on the substrate and above the first conductor, and a redundancy member coupled to the one of the conductor assemblies. A capacitive sensor may include a first serpentine conductor assembly disposed on the substrate and having first and second terminal ends coupled to the substrate, a second serpentine conductor assembly disposed above and overlapping the first conductor assembly and having first and second terminal ends coupled to the substrate, wherein each of the terminal ends of the first conductor assembly is offset from the corresponding terminal ends of the second conductor assemblies. A sensor system may include a stretchable sensor, an electronics module coupled to the stretchable sensor, and a strain relief member extending from the stretchable sensor and coupling to the electronics module. 1. A capacitive sensor , comprising ,a stretchable substrate;a first serpentine conductor assembly disposed on the substrate and having first and second terminal ends coupled to the substrate; anda second serpentine conductor assembly disposed above and overlapping the first conductor assembly and having first and second terminal ends coupled to the substrate,wherein a terminal end of the first conductor assembly is offset from the corresponding terminal end of the second conductor assemblies.2. The capacitive sensor of claim 1 , the first serpentine conductor assembly comprising a silver ink layer claim 1 , a carbon ink layer disposed above the silver ink layer claim 1 , and an insulation layer disposed above the carbon ink layer.3. The capacitive sensor of claim 2 , the second serpentine conductor assembly comprising a silver ink layer claim 2 , a carbon ink layer disposed above the silver ink layer claim 2 , and an insulation layer disposed above the carbon ink layer.4. The capacitive sensor of claim 3 , wherein the first ...

ENDOSCOPE WOVEN CABLE AND ENDOSCOPE CABLE

An endoscope woven cable includes plural cables arranged in parallel, and a filament woven through the plurality of cables in an alignment direction thereof. The plural cables include at least one rigidity-imparting wire. The rigidity-imparting wire may be arranged at both ends and in a middle of the plurality of cables in the alignment direction thereof or symmetrically positioned about a center of the plurality of cables in the alignment direction thereof. An outer diameter of the rigidity-imparting wire may be not greater than that of a rest of the plural cables. The rigidity-imparting wire may include a bare stainless steel wire or a bare steel wire. 1. An endoscope woven cable , comprising:a plurality of cables arranged in parallel; anda filament woven through the plurality of cables in an alignment direction thereof,wherein the plurality of cables comprise at least one rigidity-imparting wire.2. The endoscope woven cable according to claim 1 , wherein the rigidity-imparting wire is arranged at both ends and in a middle of the plurality of cables in the alignment direction thereof.3. The endoscope woven cable according to claim 1 , wherein the rigidity-imparting wire is symmetrically positioned about a center of the plurality of cables in the alignment direction thereof.4. The endoscope woven cable according to claim 1 , wherein an outer diameter of the rigidity-imparting wire is not greater than that of a rest of the plurality of cables.5. The endoscope woven cable according to claim 1 , wherein the rigidity-imparting wire comprises a bare stainless steel wire or a bare steel wire.6. An endoscope cable claim 1 , comprising the endoscope woven cable according to claim 1 , wherein the endoscope woven cable is spirally arranged inside an endoscopic tube. The present application is based on Japanese patent application No. 2014-198617 filed on Sep. 29, 2014, the entire contents of which are incorporated herein by reference.1. Field of the InventionThe invention ...

METHOD FOR PRODUCING A STRANDED INNER CONDUCTOR FOR COAXIAL CABLE, AND COAXIAL CABLE

The invention relates to a method for producing a stranded inner conductor (), and to a coaxial cable (). In a first step, a stranded inner conductor () is provided, which consists of several wires () twisted together. Then the stranded inner conductor () is rotary swaged by means of a rotary swaging device (). In a further step, the rotary swaged stranded inner conductor () is enclosed with a dielectric (). In a further step, the dielectric () is enclosed with an outer conductor () and a cable sheath (). 19. A method for producing a coaxial cable () comprising the steps of:{'b': 1', '3, 'a) providing a litz inner conductor () comprising a plurality of wires () that have been stranded together;'}{'b': 1', '10, 'b) rotary swaging the litz inner conductor () by means of a rotary swaging device ();'}{'b': 2', '4, 'c) encasing the rotary swaged litz inner conductor () with a dielectric ();'}{'b': 4', '5, 'd) encasing the dielectric () with an outer conductor ().'}21. The method according to claim 1 , wherein the stranded litz inner conductor () includes a constant and/or variable pitch.356. The method according to claim 1 , wherein the outer conductor () in encased with an outer sheath ().45. The method according to claim 1 , wherein an outer conductor () is produced as a braided outer conductor and/or a tube outer conductor and/or a foil outer conductor and/or a tape outer conductor.54. The method according to claim 1 , wherein the dielectric () is designed in multiple layers.63. The method according to claim 1 , wherein a surface of the wires () is coated.73. The method according to claim 6 , wherein the surface of the wires () is coated with gold claim 6 , silver or tin.8110. The method according to claim 1 , wherein the inner conductor () is rotary swaged by means of a plurality of rotary swaging devices () connected one behind the other.92. The method according to claim 8 , wherein the litz inner conductor () is subjected to an additional method step between the ...

STRETCHABLE DISPLAY DEVICE

A stretchable display device includes a display area having stretchable display units each including first islands on which pixels are disposed and first cut-out grooves between the first islands. A peripheral area is adjacent to the display area, the peripheral area includes stretchable peripheral units each including first lines on which driving circuits are disposed and first opening portions between the first lines. A buffer area is disposed between the display area and the peripheral area. The buffer area includes stretchable buffer units each including second islands, second cut-out grooves between the second islands, second lines connected to the second islands, and second opening portions between the second lines. Shapes of the second cut-out grooves may be different from shapes of the first cut-out grooves, and shapes of the second opening portions may be different from shapes of the first opening portions.

CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS

An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration. 125-. (canceled)26. A stretchable electrical device , comprising:two electrical contacts; andan electrical interconnect electrically coupling the two electrical contacts;wherein the electrical interconnect has a meander-shaped base configuration comprising a plurality of nested serpentine-shaped features arranged along the electrical interconnect such that each of the plurality of nested serpentine-shaped features is at least partially nested within an adjacent one of the plurality of nested serpentine-shaped features.27. The stretchable electrical device of claim 26 , wherein the electrical interconnect comprises a single length of conductive material and couples only the two electrical contacts.28. The stretchable electrical device of claim 26 , wherein the meander-shaped base configured has a base amplitude and a base wavelength claim 26 , and wherein each of the plurality of nested serpentine-shaped features has (i) a nested amplitude that is different than the base amplitude claim 26 , and (ii) a nested wavelength that is different than the base wavelength.29. The stretchable electrical device of claim 28 , wherein the nested amplitude is greater than the base amplitude and the nested wavelength is greater than the base wavelength.30. The stretchable electrical device of claim 28 , wherein the nested amplitude is less than the base amplitude and the nested wavelength is less than the base wavelength.31. The stretchable electrical device of claim 26 , further comprising at least one device component in communication with at least one of the two electrical ...

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

A stretchable circuit board includes: a stretchable portion that includes a stretchable base haying stretchability and a stretchable wiring formed on a first main surface of the stretchable base and having stretchability; and a non-stretchable portion that includes a base substrate having stretchability lower than that of the stretchable base and a draw-out wiring formed on a main surface of the base substrate in which the main surface of the stretchable portion and the main surface of the base substrate are joined with each other, and the stretchable wiring and the draw-out wiring are electrically connected with each other. In addition, the main surface of the base substrate has a rough surface with projections and depressions. 1. A stretchable circuit board , comprising:a stretchable portion that includes a stretchable base having stretchability and a stretchable wiring formed on a first main surface of the stretchable base and having stretchability; anda non-stretchable portion that includes a base substrate having stretchability lower than that of the stretchable base and a draw-out wiring formed on a first main surface of the base substrate, whereinthe first main surface of the stretchable base and the first main surface of the base substrate are joined with each other,the stretchable wiring and the draw-out wiring are electrically connected with each other, andthe first main surface of the base substrate is a rough surface having a projection and a depression.2. The stretchable circuit board according to claim 1 , whereinthe base substrate includes a film-like film member and an anchor layer provided between the film member and the draw-out wiring, anda first main surface of the anchor layer is the rough surface.3. The stretchable circuit board according to claim 1 , whereina stretchable supporting member having stretchability equivalent to that of the stretchable base and higher than that of the base substrate is provided in an area including a boundary ...

TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS

The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer. 1. A method of integrating an interposer device with a textile layer , the method comprising the steps of:providing a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn;providing a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards an electrically conductive yarn of the textile layer;positioning the interposer device such that at least one of its contact pads is aligned with at least one of the electrically conductive yarns of the textile layer, thereby defining at least one contacting location between the interposer device and the textile layer;mechanically attaching the interposer device to the textile layer; and locally removing, at the at least one contacting location, electrically insulating materials present between the at least one contact pad and the at least one electrically conductive yarn, and', 'providing an electrically conductive material at the at least one contacting location so that an electrically conductive contact is formed between the respective contact pad and the respective electrically conductive yarn ...

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous. 1. A stretchable circuit board , comprising:a stretchable base;a stretchable wiring portion formed on a main surface located on at least one side of the stretchable base, and having stretchability;a reinforcement base having in-plane rigidity higher than that of the stretchable base; anda draw-out wiring portion formed on a main surface located on at least one side of the reinforcement base, whereinthe main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in a manner such that the main surface of the reinforcement base faces the main surface of the stretchable base, anda part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and are electrically continuous with each other.2. The stretchable circuit board according to claim 1 , whereinthe main surface of the stretchable base and the main surface of the reinforcement base are directly joined together, and a part of the stretchable wiring portion and a part of the draw-out wiring portion are integrally fused.3. The stretchable circuit board according to claim 1 , whereinthe reinforcement base includes a film base having in-plane ...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

A rigid-flexible printed circuit board includes a first circuit substrate, a third circuit substrate, and an adhesive sheet sandwiched between the first circuit substrate and the third circuit substrate. The first circuit substrate is a rigid circuit substrate. The third circuit substrate is a flexible circuit substrate, and includes an exposed area and two lamination areas. The exposed area is sandwiched between the two lamination areas. The first circuit substrate and the adhesive sheet are only laminated onto the two lamination areas. A dielectric layer of the first circuit substrate is a rigid epoxy glass cloth laminate, and a dielectric layer of the third circuit substrate is a flexible epoxy glass cloth laminate. 1. A method for manufacturing a rigid-flexible printed circuit board , comprising:providing a first circuit substrate, a third circuit substrate, and an adhesive sheet, the first circuit substrate being a rigid circuit substrate, and comprising a first dielectric layer, and a first copper foil layer formed on the first dielectric layer, the third circuit substrate being a flexible circuit substrate, and comprising a third dielectric layer, and a second copper foil layer formed on the third dielectric layer, the first dielectric layer being made of a rigid epoxy glass cloth laminate, the third dielectric layer being made of a flexible epoxy glass cloth laminate, the third circuit substrate comprising an exposed area, and two lamination areas, the exposed area being sandwiched between the two lamination areas;stacking and laminating the first circuit substrate, the adhesive sheet, the third circuit substrate onto each other in a described order, thereby obtaining a multilayer substrate, the first copper foil layer being exposed to the outside from one side of the multilayer substrate, and the second copper foil layer being exposed to the outside from the other side of the multilayer substrate;converting the first copper foil layer and the second copper ...

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

An electrical contact assembly that uses an elastomer strip for each row of individual contacts. Each contact comprises a rigid bottom pin and a flexible top pin with a pair of arms which extend over and slide along sloped surfaces of the bottom contact. The elastomer strip is located between rows of the bottom and top pins. A bottom socket housing is provided with grooves which receive each elastomer strip. A row of top pins is then placed over each elastomer strip, and through ducts in the bottom socket housing. Bottom pins are then snapped into place in between the pair of arms. 1. An electrical contact for use in an integrated circuit (IC) device testing apparatus , comprising:{'b': 40', '42', '44', '42, 'a bottom socket housing () having a plurality of horizontal grooves () running parallel with respect to each other, and a plurality of vertical ducts () spaced along each said groove ();'}{'b': 10', '44', '10, 'a plurality of bottom pins (), each bottom pin adapted to be inserted through each said duct (), said bottom pin () formed of an electrically conductive material;'}{'b': 20', '20', '22', '24', '10', '22', '24', '10', '20, 'a plurality of top pins (), each said top pin () having a first () and a second () arm extending over said bottom pin (), said arms (, ) having an inwards bias such that they maintain contact with said bottom pin (), said top pin () formed of an electrically conductive material; and'}{'b': 30', '30', '42', '30', '10', '20, 'at least one elastomer strip (), said elastomer strip () running parallel to said grooves (), and said elastomer strip () located between said plurality of bottom pins () and plurality of top pins (), such that it provides some resilience between the bottom and top pins.'}22028282224. An electrical contact for use in an integrated circuit testing apparatus according to claim 1 , wherein said top pin () having a top portion () which contacts with an IC device claim 1 , said top portion () being narrower than said ...

Composite Wrapped Steel Tubes for Use in Umbilicals

Umbilicals may contain one or more steel tubes as well as low and medium voltage electricals and/or fillers, where one or more of the steel tubes comprise both steel and a carbon fiber composite. In an embodiment, the umbilical cable comprises an outer umbilical sheath and one or more signal conduits disposed within the outer umbilical sheath. In an embodiment, the signal conduit comprises a metallic inner wall and a carbon fiber composite outer wall disposed substantially continuously about an outer surface of the metallic inner wall. One or more conductors are typically disposed within the signal conduit. One or more fillers may be disposed about the signal conduit within the outer umbilical sheath. 1. An umbilical cable , comprising:a. an outer umbilical sheath; i. a metallic inner wall; and', 'ii. a carbon fiber composite outer wall disposed substantially continuously about an outer surface of the metallic inner wall;, 'b. a conduit disposed within the outer umbilical sheath, the conduit comprisingc. a conductor disposed within the signal conduit; andd. a filler disposed proximate the conduit within the outer umbilical sheath.2. The umbilical cable of claim 1 , wherein the metallic inner wall comprises a super duplex material.3. The umbilical cable of claim 1 , wherein the metallic inner wall comprises a lean duplex material.4. The umbilical cable of claim 1 , wherein the metallic inner wall comprises a hyper duplex material.5. The umbilical cable of claim 1 , wherein the metallic inner wall comprises steel.6. The umbilical cable of claim 1 , wherein the conduit further comprises:a. an end; andb. a welded, reinforced interface disposed about the end.7. The umbilical cable of claim 1 , wherein the conductor comprises an electrical conductor.8. The umbilical cable of claim 7 , wherein the electrical conductor comprises a low voltage electrical conductor.9. The umbilical cable of claim 7 , wherein the electrical conductor comprises a medium voltage electrical ...

LENGTH- AND WIDTH-DEFORMABLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

A length- and width-deformable printed circuit board includes a first conductive circuit layer, an elastic film, and a plurality of conductive via holes. The first conductive circuit layer includes a plurality of first conductive circuits. The plurality of first conductive circuits is embedded in the elastic film. The first conductive circuit layer have a plurality of first honeycomb hole. Each of the plurality of conductive via holes corresponds to one of the first honeycomb holes. 1. A length- and width-deformable printed circuit board comprising:a first conductive circuit layer, the first conductive circuit layer comprising a plurality of first conductive circuits, the first conductive circuits having a plurality of first honeycomb holes;an elastic film; anda plurality of conductive via holes embedded in the elastic film;wherein the plurality of first conductive circuits is embedded in the elastic film, each of the plurality of conductive via holes corresponds to one of the first honeycomb holes.2. The length- and width-deformable printed circuit board of claim 1 , further comprising a second conductive circuit layer claim 1 , wherein the second conductive circuit layer faces away from the first conductive circuit layer claim 1 , the second conductive circuit layer comprises a plurality of second conductive circuits claim 1 , the second conductive circuits form a plurality of second honeycomb holes claim 1 , each of the second honeycomb holes corresponds to each of the first honeycomb holes.3. The length- and width-deformable printed circuit board of claim 2 , wherein each of the conductive via holes is electrically connected to one of the first conductive circuits and one corresponding second conductive circuits.4. The length- and width-deformable printed circuit board of claim 2 , wherein the second conductive circuit layer is embedded in the elastic film.5. The length- and width-deformable printed circuit board of claim 2 , wherein the elastic film comprises ...

FLEXIBLE SUBSTRATE

A flexible substrate includes a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed. Each of the plurality of unit wiring structures includes a central section and a plurality of strips disposed at an outer side of the central section. Each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section. The plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation. The plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner. 1. A flexible substrate comprising:a plurality of unit wiring structures and an insulation sheet on which the plurality of unit wiring structures are disposed, whereineach of the plurality of unit wiring structures comprises a central section and a plurality of strips disposed at an outer side of the central section,each of the plurality of strips has a first end and a second end, and is curved along an outer periphery of at least part of the central section, the first end connected to the central section,the plurality of strips in each of the plurality of unit wiring structures curve in a clockwise or a counterclockwise manner with the central section as a center of rotation,the plurality of unit wiring structures include at least four unit wiring structures arranged in a two-dimensional manner,between adjacent unit wiring structures from among the at least four unit wiring structures, the second end of at least one of the plurality of strips of one unit wiring structure and the second end of at least one of the plurality of strips of the other unit wiring structure are mutually connected,the plurality of unit wiring structures, in a plan view, include a gap between the mutually ...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring. 1. A printed circuit board comprising: 'an insulative substrate having a first surface and a second surface opposite to the first surface, the insulative substrate having flexibility and through-holes passing through the insulative substrate from the first surface to the second surface; and wiring provided on the second surface of the insulative substrate to face the through-holes;', 'a printed wiring board comprisinga semiconductor element mounted on the first surface of the insulative substrate of the printed wiring board and having element terminals interposed between the printed wiring board and the semiconductor element; andconductive members filled in the through-holes connecting the element terminals and the wiring.2. The printed circuit board according to claim 1 , wherein the insulative substrate has stretchability.3. The printed circuit board according to claim 1 , wherein the element terminals and the conductive member are bonded to each other with a conductive bonding member.4. The printed circuit board according to claim 1 , whereinthe printed wiring board includes a metal film in a region immediately below each of the element terminals on the first surface of the insulative ...

STRETCHABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD

The stretchable circuit board () includes: a stretchable base (); a stretchable wiring portion () formed on the stretchable base (); a reinforcement base () having in-plane rigidity higher than that of the stretchable base (); a draw-out wiring portion () formed on the reinforcement base (), and electrically continuous with the stretchable wiring portion (); and an elastomer layer () formed on the reinforcement base (). The reinforcement base () overlaps with a partial area () of the stretchable base (). An other area () of the stretchable base () is exposed from the reinforcement base (). The stretchable wiring portion () extends on the other area () and over the partial area (). The elastomer layer () and the stretchable base () are layered and joined with each other. 1. A stretchable circuit board , comprising:a stretchable base;a stretchable wiring portion formed on at least one of a first main surface and a second main surface of the stretchable base;a reinforcement base having in-plane rigidity higher than that of the stretchable base;a conductor portion formed on at least one of a first main surface and a second main surface of the reinforcement base, and electrically continuous with the stretchable wiring portion; andan elastomer layer formed on at least one of the first main surface and the second main surface of the reinforcement base, whereinthe reinforcement base overlaps with a partial area of the stretchable base,an other area of the stretchable base is exposed from the reinforcement base,the stretchable wiring portion extends on the other area and over the partial area, andthe elastomer layer and the stretchable base are layered and joined with each other.2. The stretchable circuit board according to claim 1 , whereinthe elastomer layer lies between the conductor portion and the reinforcement base, andthe conductor portion is in contact with one surface of the elastomer layer.3. The stretchable circuit board according to claim 2 , wherein{'sup': '2', ...

STRETCHABLE CIRCUIT AND LAYOUT METHOD FOR STRETCHABLE CIRCUIT

A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines. 1. A stretchable circuit , comprising:a plurality of segments,wherein each segment comprises a plurality of sub-segments, andwherein each sub-segment comprises at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.2. The stretchable circuit of claim 1 , wherein in each sub-segment claim 1 , the widths of the main lines are greater than claim 1 , equal to claim 1 , or less than the widths of the secondary lines.3. The stretchable circuit of claim 1 , wherein the main lines are configured in an inner ring and the secondary lines are configured in an outer ring claim 1 , or the main lines are configured in the outer ring and the secondary lines are configured in the inner ring.4. The stretchable circuit of claim 1 , wherein the sub-segments are the same size or different sizes.5. The stretchable circuit of claim 1 , wherein the number of main lines in each sub-segment is the same or different.6. The stretchable circuit of claim 1 , wherein the number of secondary lines in each sub-segment is the same or different.7. The stretchable circuit of claim 1 , wherein in each sub-segment claim 1 , the main line comprises a detection point for detecting strain change or stress change in each sub-segment.8. The stretchable circuit of claim 7 , wherein the detection point is configured in a position in front of or behind a knee of the main line or configured in the rib line.9. The stretchable circuit of claim 1 , wherein one of the plurality of segments is electrically connected to another one of the ...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate. 117-. (canceled)18. A wiring board comprising:a substrate including a first surface and a second surface located on an opposite side to the first surface, the substrate having stretchability;an interconnection wire located adjacent to the first surface of the substrate;a stress relaxation layer located between the first surface of the substrate and the interconnection wire, the stress relaxation layer having a modulus of elasticity lower than a modulus of elasticity of the substrate; anda support substrate having a modulus of elasticity higher than the modulus of elasticity of the substrate and supporting the interconnection wire.19. The wiring board according to claim 18 , wherein the modulus of elasticity of the support substrate is higher than or equal to 100 times the modulus of elasticity of the substrate.20. The wiring board according to claim 18 , further comprising an adhesive layer located between the stress relaxation layer and the support substrate and having a modulus of elasticity higher than the modulus of elasticity of the stress relaxation layer.21. The wiring board according to claim 18 , further comprising:a reinforcing member having a modulus of elasticity higher than the modulus of elasticity of the substrate.22. The wiring board according to claim 21 , wherein as viewed in a direction normal to the first surface of the substrate claim 21 , the interconnection wire has an end portion that overlaps the reinforcing member.23. The wiring board according to claim 21 , further comprising:an ...

ELASTIC WIRING BOARD

An elastic wiring board that includes an elastic substrate; a plurality of electrode wirings having elasticity; and an ion-migration resistant layer between at least a first electrode wiring of the plurality of electrode wirings and the elastic substrate. 1. An elastic wiring board , comprising:an elastic substrate;a plurality of electrode wirings having elasticity; andan ion-migration resistant layer between at least a first electrode wiring of the plurality of electrode wirings and the elastic substrate.2. The elastic wiring board according to claim 1 , wherein the ion-migration resistant layer is an insulating layer having low moisture absorption having a moisture absorption ratio of 2.0% or less as measured in accordance with ASTM standard D570.3. The elastic wiring board according to claim 1 , wherein the ion-migration resistant layer is a moisture repellant layer claim 1 , and a contact angle of the moisture repellent layer to water is 100° or more.4. The elastic wiring board according to claim 1 , wherein the elastic substrate includes a urethane resin or an acrylic resin.5. The elastic wiring board according to claim 1 , wherein the first electrode wiring include a mixture of conductive particles and an elastomer.6. The elastic wiring board according to claim 1 , wherein external dimensions of the ion-migration resistant layer are larger than external dimensions of the first electrode wiring.7. The elastic wiring board according to claim 6 , wherein an external shape of the ion-migration resistant layer and an external shape of the first electrode wiring are overlapped in a plan view of the elastic wiring board claim 6 , and a shortest distance from an end of the external shape of the first electrode wiring to an end of the external shape of the ion-migration resistant layer is 20 μm or more.8. The elastic wiring board according to claim 7 , wherein the shortest distance from the end of the external shape of the first electrode wiring to the end of the ...

APPARATUS FOR LAYING CONDUCTIVE PATHWAYS, METHOD OF LAYING CONDUCTIVE PATHWAYS AND TEXTILE PRODUCT COMPRISING CONDUCTIVE PATHWAYS

A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink. 1. An apparatus for laying conductive pathways on a tape to form a conductive tape , the apparatus comprising:a pair of surfaces arranged to apply a bonding pressure;a first conductive pathway laying device configured to lay a first conductive pathway on the tape and configured to vary the lateral position of the first conductive pathway as the tape moves through the pair of surfaces.2. An apparatus according to claim 1 , further comprising a second conductive pathway laying device configured to lay a second conductive pathway on the tape and configured to vary the lateral position of the second conductive pathway as the tape moves through the pair of surfaces claim 1 , wherein the first conductive pathway laying device and/or the second conductive pathway laying device are configured to vary a lateral separation between the first conductive pathway and the second conductive pathway.3. An apparatus according to wherein the first conductive pathway laying device comprises a first yarn position controller arranged to control the lateral position of a first conductive yarn on the tape when the bonding pressure is applied.4. An apparatus according to claim 1 , wherein the second conductive pathway laying device comprises a second yarn position controller arranged to control the lateral position of a second conductive yarn on the tape when the bonding pressure is applied.5. An apparatus ...

COPPER ALLOY WIRE ROD AND METHOD FOR MANUFACTURING THE SAME

A copper alloy wire rod according to the present invention includes a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain CuZrand Cu, wherein the content of Zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less. This copper alloy wire rod can be obtained by including the steps of melting a raw material in such a way that a copper alloy having a Zr content within the above-described range of is produced so as to obtain a molten metal in a melting step, casting the molten metal so as to obtain an ingot in a casting step, and subjecting the ingot to cold wire drawing in a wire drawing step, wherein the wire drawing step and a treatment after the wire drawing step are performed at lower than 500° C. 1. A copper alloy wire rod comprising a copper parent phase and short fiber-shaped composite phases which are dispersed in the copper parent phase and which contain CuZrand Cu ,wherein the content of Zr is within the range of 0.2 atomic percent or more and 1.0 atomic percent or less.2. The copper alloy wire rod according to claim 1 , wherein an area ratio of the composite phases is 0.5% or more and 5.0% or less.3. The copper alloy wire rod according to claim 1 , wherein the length L in the wire drawing direction of the composite phase and the length T in the direction orthogonal to the wire drawing direction satisfy 1.5≦L/T<17.9.4. The copper alloy wire rod according to claim 1 , wherein the length L in the wire drawing direction of the composite phase and the length T in the direction orthogonal to the wire drawing direction satisfy 1.5≦L/T<10.0.5. A method for manufacturing a copper alloy wire rod comprising:a melting step of melting a raw material in such a way that a copper alloy having a Zr content within the range of 0.2 atomic percent or more and 1.0 atomic percent or less is produced so as to obtain a molten metal;a casting step of casting the molten metal so as to ...

FLEXIBLE PRINTED CIRCUIT BOARD

A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates. 1. A flexible printed circuit board (PCB) comprising:a first polymer substrate having at least one of flexibility, stretchability, and elasticity;a second polymer substrate having at least one of flexibility, stretchability, and elasticity;a conductive track comprising metal nanowires disposed between the first polymer substrate and the second polymer substrate; anda cured silane coupling agent configured to bond the conductive track to at least one of the first polymer substrate and the second polymer substrate.2. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each have a thickness in a range of about 10 μm to about 3 claim 1 ,000 μm.3. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate each comprise at least one of a polydimethylsiloxane (PDMS)-based resin claim 1 , a polyimide (PI)-based resin claim 1 , a polyamide-based resin claim 1 , a polyester-based resin claim 1 , a polyethylene-based resin claim 1 , a polypropylene-based resin claim 1 , a polyurethane-based resin claim 1 , and a polycarbonate-based resin.4. The flexible PCB of claim 1 , wherein the first polymer substrate and the second polymer substrate comprise a PDMS-based resin.5. The flexible PCB of claim 1 , wherein the metal nanowires have an average aspect ratio in a range of about 20 to about 300.6. The flexible PCB of claim 1 , wherein the metal nanowires have an average diameter in a range of about 1 nm to about 500 ...

High-Frequency Electric Wire, Manufacturing Method Thereof, and Wire Harness

A high-frequency electric wire is provided with a conductor which formed by compressing multiple wire strands, each of which is obtained by coating an outside of a wire rod made of insulating resin with a metal layer, and a sheath provided on the conductor. Each of the wire strands of the conductor is compressed in such a way that a deformation ratio of the wire strand exceeds 0% and is 20% or less. The compression is performed, for example, during bundling and sheathing of the multiple wire strands. 1. A high-frequency electric wire comprising:a conductor in which a plurality of wire strands are compressed, each of the wire strands including a wire rod made of electrically insulating resin and a metal layer coating an outer circumference of the wire rod; anda sheath provided on the conductor,wherein the each of the wire strands of the conductor is compressed so that a deformation ratio of the each of the wire strands exceeds 0% and is 20% or less.2. A method of manufacturing a high-frequency electric wire comprising:obtaining a plurality of wire strands, each of the wire strands including a wire rod made of electrically insulating resin and a metal layer coating an outer circumference of the wire rod, by coating an outer circumference of each of the wire rods with the metal layer; andcompressing the plurality of wire strands by bundling and sheathing,wherein the each of the wire strands is compressed in such a way that a deformation ratio of the each of the wire strands exceeds 0% and is 20% or less.3. A wire harness comprising the high-frequency electric wire according to . This application is a continuation of International Patent Application No. PCT/JP2014/069347 filed on Jul. 22, 2014, claiming priority from Japanese Patent Application No. 2013-151247 filed on Jul. 22, 2013, the contents of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to a high-frequency electric wire, a manufacturing method thereof, and a ...

ELASTIC CIRCUIT BOARD AND PATCH DEVICE IN WHICH SAME IS USED

The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material. 1. A stretchable circuit board comprising a stretchable base material , a stretchable wiring , and a land part that is in contact with the stretchable base material.2. The stretchable circuit board according to claim 1 , wherein the land part is formed of a patterned metal foil claim 1 , or a printed product of an electroconductive ink containing metal particles.3. The stretchable circuit board according to claim 1 , wherein the land part includes in its peripheral edge a connecting part to which the stretchable wiring is connected claim 1 , and a width of the connecting part is narrower than a width of the stretchable wiring.4. The stretchable circuit board according to claim 1 , wherein the stretchable base material is formed of a thermosetting resin composition.5. The stretchable circuit board according to claim 1 , wherein the stretchable base material is formed of a thermoplastic resin composition having a softening point or a melting point of 140° C. or more.6. The stretchable circuit board according to claim 1 , wherein the stretchable wiring has a binder resin and electroconductive particles.7. The stretchable circuit board according to claim 1 , further comprising a second insulating layer laminated on the stretchable base material.8. The stretchable circuit board according to claim 1 , further comprising a second electroconductive layer on a layer position different from a position of the stretchable wiring.9. The stretchable circuit board according to claim 8 , wherein the second electroconductive layer is connected by interlayer connection with the stretchable wiring.10. The stretchable circuit board according to claim 1 , on which an electronic part is mounted.11. ...

Methods and Systems for Fabricating High Quality Superconducting Tapes

An MOCVD system fabricates high quality superconductor tapes with variable thicknesses. The MOCVD system can include a gas flow chamber between two parallel channels in a housing. A substrate tape is heated and then passed through the MOCVD housing such that the gas flow is perpendicular to the tape's surface. Precursors are injected into the gas flow for deposition on the substrate tape. In this way, superconductor tapes can be fabricated with variable thicknesses, uniform precursor deposition, and high critical current densities. 1. A method for fabricating a superconductor film , the method comprising:heating a superconductor substrate tape through ohmic heating with a first roller and a second roller;delivering the heated superconductor substrate tape to a groove in a housing via the first roller and the second roller, wherein the groove is in fluid communication with a chamber positioned between two parallel channels, wherein the groove traverses the housing and is accessible at a first end and a second end of the housing, wherein the first roller is positioned exterior to the housing and guides the heated superconductor substrate tape to the groove at the first end of the housing, and wherein the second roller is positioned exterior to the housing and guides the heated superconductor substrate tape out of the second end of the housing via the groove; andflowing at least one superconductor precursor in a gas phase through the chamber.2. The method of claim 1 , wherein the heating of the superconductor substrate tape comprises pre-heating the superconductor substrate tape through ohmic heating via the first roller and the second roller.3. The method of claim 1 , wherein the heating of the superconductor substrate tape occurs at a temperature between approximately 700° C. and approximately 800° C.4. The method of claim 1 , further comprising measuring the temperature of the superconductor tape with one or more temperature monitoring devices positioned in ...

ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME

Provided is an electronic circuit. The electronic circuit includes: a substrate including a device region and a wiring region; an electronic device disposed on the device region; and a conductive wire disposed on the wiring region and connected to the electronic device, wherein the substrate has a first side where the electronic device and the conductive wire contact and a second side facing the first side; the first side and the second side of the wiring region have a convex structure; the first side of the device region is flat; and the device region is thicker than the wiring region. 1. An electronic circuit comprising:a substrate including a device region and a wiring region;an electronic device disposed on the device region; anda conductive wire disposed on the wiring region and connected to the electronic device,whereinthe substrate has a first side where the electronic device and the conductive wire contact and a second side facing the first side;the first side and the second side of the wiring region have a convex structure;the first side of the device region is flat; andthe device region is thicker than the wiring region.2. The electronic circuit of claim 1 , wherein an uppermost part of the wiring region has a lower level than an uppermost part of the device region.3. The electronic circuit of claim 1 , wherein the wiring region is more flexible than the device region.4. The electronic circuit of claim 1 , wherein the convex structure is rounded.5. The electronic circuit of claim 1 , wherein the convex structure has a waveform in which waves progress in one direction claim 1 , a waveform in which waves progress in one direction and another direction perpendicular to the one direction claim 1 , a waveform in which waves progress in a zigzag direction claim 1 , or a waveform in which waves progress in an irregular direction.6. The electronic circuit of claim 1 , wherein the conductive wire extends along the convex structure and has a curve of a waveform.7. ...

COMPOSITE AND NANOWIRE CONDUIT

An electrical wiring system comprises a plurality of electrical conduits, each of which comprises a plurality of electrically conductive wires, a carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material, and at least connector carried by the carrier in electrical communication with the wires. The electrical wiring system further comprises a junction box comprising a plurality of interconnecting wires and a plurality of connectors electrically coupled together by the interconnecting wires. The plurality of connectors of the junction box are coupled to the plurality connectors of the electrical conduits. 1. An electrical conduit , comprising:a plurality of electrically conductive wires; anda carrier encapsulating and electrically insulating the wires from each other, the carrier being composed of a rigid material.2. The electrical conduit of claim 1 , wherein the rigid material has a modulus of elasticity greater than 1 gigapascal (GPa).3. The electrical conduit of claim 2 , wherein the modulus of elasticity of the material is greater than 2 GPa.4. The electrical conduit of claim 1 , wherein the rigid material is a composite material.5. The electrical conduit of claim 1 , wherein the wires are nanowires.6. The electrical conduit of claim 1 , wherein the carrier is planar claim 1 , and the wires are arranged relative to each other in a single rectilinear plane.7. The electrical conduit of claim 1 , wherein the carrier is cylindrical claim 1 , and the wires are arranged relative to each other in three-dimensional space.8. The electrical conduit of claim 1 , wherein the electrical conduit is entirely solid.9. The electrical conduit of claim 1 , further comprising at least one connector mounted to an end of the carrier and being electrically coupled to the wires.10. The electrical conduit of claim 9 , wherein the at least one connector comprises a plurality of electrically conductive receptacles in ...

Stretchable embedded electronic package

An embedded electronic package includes a stretchable body that includes at least one electronic component, wherein each electronic component includes a back side that is exposed from the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components. In some forms, the embedded electronic package includes a stretchable body that includes an upper surface and a lower surface, wherein the stretchable body includes at least one electronic component, wherein each electronic component is fully embedded in the stretchable body and the same distance from the upper surface of the stretchable body; and a plurality of meandering conductors that are electrically connected to one or more of the electronic components.

PHOTOACTIVATED ETCHING PASTE AND ITS USE

The improved method for the etching of transparent conductive oxide layers placed on flexible polymer substrates, hard substrates like glass or on silicon wafers comprises the use of new etching pastes, which are activated by irradiation. 2. Method according to for the etching of transparent conductive oxide layers claim 1 , which consist of indium tin oxide (ITO) claim 1 , fluorine tin oxide (FTO) claim 1 , or aluminium tin oxide (AZO) or antimony tin oxide (ATO).3. Method according to claim 1 , characterized in that a thin layer of etching paste is applied on to the transparent conductive oxide layer the by spin coating.4. Method according to claim 1 , characterized in that etching paste is applied in a pattern on to the transparent conductive oxide layer by screen printing claim 1 , silk-screen printing claim 1 , pad printing claim 1 , stamp printing and ink-jet printing.5. Method according to claim 4 , characterized in that the applied etching composition is activated by irradiating the entire surface layer claim 4 , by what only the surface areas covered by etching composition are etched.6. Method according to claim 1 , characterized in that at first a photo mask is positioned over the transparent conductive oxide layer claim 1 , which is covered with etching paste and that only those areas are activated by irradiation claim 1 , which are irradiated through the pattern of the photo mask.7. Method according to claim 1 , characterized in that the UV irradiation lasts for 20 seconds to 2 minutes.9. Etching composition according to claim 8 , comprising an etching component in a concentration in the range from about 25 to 50% by weight.10. Etching composition according to claim 8 , comprising phosphoric acid as etching component.11. Etching composition according to claim 8 , comprising a photo-acid generator selected from the group Diphenyliodonium triflat claim 8 , trisulfoniumnonasulfate claim 8 , nitro benzyl esters claim 8 , preferably 4-Nitrobenzyl-9-10- ...

Multilayer substrate

A multilayer substrate includes a multilayer body including a plurality of stacked resin layers and a wiring layer provided in the resin layer. The multilayer body includes a deformable flexible portion which generally defines a wave-shaped portion extending in a direction of travel that is repeatedly changed when viewed in a direction of stacking of the resin layers, the wiring layer being routed along the wave-shaped portion. The flexible portion includes a turn-back portion arranged at a position where the direction of travel is changed and an intermediate portion connecting adjacent turn-back portions to each other. A width of the turn-back portion is greater than a width of the intermediate portion.

STRETCHABLE CONDUCTIVE PATTERN AND STRETCHABLE DEVICE

A stretchable conductive pattern includes a plurality of first closed loop parts spaced apart from each other in a first direction, and at least one first line part extended in the first direction and connecting between adjacent first closed loop parts among the plurality of first closed loop parts. 1. A stretchable conductive pattern , comprising:a plurality of first closed loop parts spaced apart from each other in a first direction; andat least one first line part extended in the first direction and connecting between adjacent first closed loop parts among the plurality of first closed loop parts.2. The stretchable conductive pattern as claimed in claim 1 , wherein the first closed loop part has a rhombus shape.3. The stretchable conductive pattern as claimed in claim 1 , wherein the first closed loop part has a curved closed loop shape.4. The stretchable conductive pattern as claimed in claim 1 , wherein the first line part has a linear shape.5. The stretchable conductive pattern as claimed in claim 1 , wherein the plurality of first closed loop parts and the first line part are integral with each other.6. The stretchable conductive pattern as claimed in claim 1 , wherein an area of the first closed loop part is larger than that of the first line part.7. The stretchable conductive pattern as claimed in claim 1 , further comprising:a plurality of second closed loop parts spaced apart from each other in a second direction intersecting the first direction; andat least one second line part extended in the second direction and connecting adjacent second closed loop parts among the plurality of second closed loop parts, the at least one second line part intersecting and overlapping the at least one first line part.8. The stretchable conductive pattern as claimed in claim 7 , wherein the plurality of second closed loop parts and the second line part are integral with each other.9. The stretchable conductive pattern as claimed in claim 8 , wherein the second line part ...

ELASTIC SIGNAL TRANSMISSION CABLE

An object of the present invention is to provide an elastic signal transmission cable having a length of several centimeters to several meters that has a shape deformation tracking ability and enables high-speed signal transmission. The inventive elastic signal transmission cable has an elasticity of 10% or more and transmission loss of 10 dB/m or less in a relaxed state at 250 MHz, and comprises an elastic cylindrical body having an elasticity of 10% or more and a conductor portion containing at least two conductor wires wound in the same direction around the elastic cylindrical body. 1. An elastic signal transmission cable having an elasticity of 10% or more and transmission loss of 10 dB/m or less in a relaxed state at 250 MHz , and comprising an elastic cylindrical body having an elasticity of 10% or more and a conductor portion containing at least two conductor wires wound in parallel in the same direction around the elastic cylindrical body , wherein the elastic cylindrical body has a void there within , the conductor wires are not adhered to the elastic cylindrical body , the conductor wires are wound without any partial overlapping thereof and air is retained between each conductor wire , an outer coating layer comprised of an insulating fiber of a multifilament containing large amounts of air is formed around the outside of the conductor portion , a wound diameter and winding pitch of the conductor wires are 0.05 to 30 mn and 0.05 to 50 mm in a relaxed state , respectively , an interval between proximal conductor wires , which is defined as an average value of distance between the centers of proximal conductor wires measured in a relaxed state at 30 arbitrary locations , is 0.3 to 20 mm , and a variation r (a difference between the maximum value and minimum value) in the interval between promixal conductor wires is such that 0≦re≦4d , and an average interval d′ between proximal conductor wires when stretched by arbitarily stretching to a stretch limit is ...

STRETCHABLE CIRCUIT SUBSTRATE AND ARTICLE

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring. 1. A stretchable circuit substrate comprising:a base material being stretchable;a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface side of the base material; andan adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein:the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring; andridges and recesses are included at a part where a second surface positioned at an opposite side to the first surface side of the base material overlaps the bellows-like member.2. The stretchable circuit substrate according to claim 1 , wherein the adjustment layer has a Young's modulus larger than a Young's modulus of the base material.3. A stretchable circuit substrate comprising:a base material being stretchable;a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface side of the ...

HYPERELASTIC BINDER FOR PRINTED, STRETCHABLE ELECTRONICS

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object. 1. A stretchable battery , comprising:a stretchable substrate including an elastic and electrically insulative material structured to conform to an outer surface of an object;a current conductor layer attached to the stretchable substrate, wherein the current conductor layer includes a first elastic composite material comprising a first electrical conductor and a multi-block copolymer configured to form a first hyperelastic binder that creates contacts between particles of the first electrical conductor within a network formed by the multi-block copolymer;an anode attached to the current conductor layer and arranged over the stretchable substrate, wherein the anode includes a second elastic composite material comprising a second electrical conductor and the multi-block copolymer configured to form a second hyperelastic binder that creates contacts between particles of the second electrical conductor within a network formed by the multi-block copolymer; anda cathode arranged over the stretchable substrate, wherein the cathode includes a third elastic composite material comprising ...

COVER WINDOW AND DISPLAY DEVICE WITH COVER WINDOW

In a display device, a cover window is capable of increasing transparency of a curved part to improve visibility of a screen and appearance quality of a product. The cover window for the display device includes at least one curved part. In addition, the curved part includes an outer surface formed in an arc having a curvature radius of r1 and an inner surface formed in an arc having a curvature radius of r2, where r1≦r2≦2r1. 1. A cover window for a display device including at least one curved part , wherein said at least one curved part includes an outer surface formed in an arc having a curvature radius of r1 and an inner surface formed in an arc having a curvature radius of r2 , and wherein a condition of r1≦r2≦2r1 is met.2. The cover window for a display device of claim 1 , wherein the cover window is made of a plastic material having a thermal distortion temperature in a range of 90° C. to 150° C.3. The cover window for a display device of claim 2 , wherein the cover window includes any one selected from a group consisting of polycarbonate claim 2 , cyclo olefin polymer claim 2 , and polymethylmethacrylate.4. The cover window for a display device of claim 1 , wherein the cover window has a thickness in a range of 0.4 mm to 1.0 mm.5. The cover window for a display device of claim 1 , wherein the cover window includes a flat part claim 1 , and said at least one curved part comprises a pair of curved parts claim 1 , each curved part being disposed at a respective side of the flat part.6. The cover window for a display device of claim 5 , wherein the curved parts disposed at respective sides of the flat part are formed to have a same curvature and are disposed at a side having a same curvature center.7. The cover window for a display device of claim 1 , wherein said at least one curved part comprises a plurality of curved parts which are continuously formed along one direction of the cover window claim 1 , and two adjacent curved parts of the plurality of curved ...

STRETCHABLE PRINTED ELECTRONIC SHEETS TO ELECTRICALLY CONNECT UNEVEN TWO DIMENSIONAL AND THREE DIMENSIONAL SURFACES

A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object. 1. A method for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface , the method comprising:determining an amount of conductive material to form a conductor between two points on a surface of an object;depositing the determined amount of conductive material on a substrate; andapplying the substrate with the deposited conductive material to the object to form a conductor between the two points on the surface of the object.2. The method of claim 1 , wherein the conductive material is a stretchable conductive material.3. The method of claim 1 , wherein the substrate is a stretchable substrate.4. The method of claim 1 , wherein the conductive material is deposited on the substrate by an inkjet printer that prints conductive material onto the surface of the substrate.5. The method of claim 1 , wherein the conductive material is deposited on the substrate by an embedded three-dimensional (3-D) printer that deposits conductive material into a reservoir within the substrate.6. The method of claim 1 , wherein the conductive material is deposited in a horseshoe pattern on the substrate.7. The method of claim 1 , wherein the substrate with the deposited conductive ...

FLEXIBLE PRINTED WIRING BOARD AND BATTERY WIRING MODULE

A flexible printed wiring board according to an aspect includes a base film, a conductive pattern disposed on one surface of the base film, and an extra length absorbing portion protruding from the base film and disposed in a direction of a plane, the extra length absorbing portion including a pattern connected portion connected to the conductive pattern, a coupling portion having a first linear wiring portion, a first arcuate wiring portion, and a second linear wiring portion coupled in this order continuously from the pattern connected portion, and a connecting terminal connected to the coupling portion, the pattern connected portion and the connecting terminal being opposite to each other in a direction in which the extra length absorbing portion protrudes. 1. A flexible printed wiring board comprising:an insulating base film;a conductive pattern disposed on one surface of the base film; andan extra length absorbing portion protruding from the base film and disposed in a direction of a plane for connecting the conductive pattern to an external element, a pattern connected portion connected to the conductive pattern,', 'a coupling portion having a first linear wiring portion, a first arcuate wiring portion, and a second linear wiring portion coupled in this order continuously from the pattern connected portion, and', 'a connecting terminal connected to an end of the coupling portion that is opposite to an end of the coupling portion having the pattern connected portion coupled therewith,, 'the extra length absorbing portion including'}the pattern connected portion and the connecting terminal being opposite to each other in a direction in which the extra length absorbing portion protrudes,the first linear wiring portion and the second linear wiring portion being disposed in this order perpendicularly to the direction in which the extra length absorbing portion protrudes,the first arcuate wiring portion having opposite ends aligned in the direction in which the ...

SUBSTRATES COMPRISING A NETWORK COMPRISING CORE SHELL LIQUID METAL ENCAPSULATES COMPRISING MULTI-FUNCTIONAL LIGANDS

The present invention relates to substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands and processes of making and using such substrates. The core shell liquid metal particles are linked via ligands to form such network. Such networks volumetric conductivity increases under strain which maintains a substrate's resistance under strain. The constant resistance results in consistent thermal heating via resistive heating. Thus allowing a substrate that comprises such network to serve as an effective heat provider. 2. The substrate according to wherein for said encapsulate:a) said liquid metal core comprises a liquid metal alloy is selected from the group consisting of Ga/In, Ga/In/Sn, Ga/In/Sn/Sb, In/Sn/Bi, Bi/Pb/Sn, Bi/Pb/Sn/Cd, Bi/Pb/Sn/Cd/In and mixtures thereof;b) said shell comprises a metal oxide comprising a cation derived from a metal selected from the group consisting of Ga, Sn, Sb, Cd, Bi, In and mixtures thereof; andc) said one or more multi-functional ligands comprises a head group that comprises a material selected from the group consisting of phosphonic acids, trialkoxysilanes, or mixtures thereof3. The substrate according to claim 1 , wherein said encapsulate has a shell thickness of from about 0.5 nanometers to about 5 nanometers.4. The substrate according to wherein said encapsulate has a principal dimension of from about 5 nanometers to about 5 millimeters.5. The substrate according to wherein said linkage has the formula:{'br': None, '*—X—R—X—*'}a) each * represents the chemical attachment point to a core shell liquid metal encapsulate;b) each X represents a molecular segment selected from the group of chemical structures comprising C—S, C—N, C—P—O, C—Si—O, O—Si—O, C—O;c) R represents a molecular segment independently selected from the group of chemical structures comprising C—C, C═C, C—S—C, N—N—N, C—N, O—C—N, C—O—C, Si—O—Si.6. The substrate according to claim 1 , said core shell liquid ...

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING SAME

The present invention relates to architected liquid metal networks and processes of making and using same. The predetermined template design technology of such architected liquid metal networks provides the desired spatial control of electrical, electromagnetic, and thermal properties as a function of strain. Thus, resulting in improved overall performance including process ability. 1. An article comprising a substrate having an average particle attachment strength of from about 2.8 micro-newtons to about 1 newton and a strain at failure of from about 5% to about 10 ,000%; and a plurality of encapsulates comprising a liquid metal core having an external surface , a metal oxide shell that encapsulates said liquid metal core , said shell having an external shell surface; and optionally one or more ligands and/or multi-functional ligands covalently bound to said shell's external surface and/or coordinatively bound to said liquid metal core's external surface:a) said liquid metal core comprising a liquid metal selected from the group consisting of Hg, Pb, Sn, Sb, Cd, Bi, Ga, In, Al, Zn, Ag, Au, Tl and mixtures thereof;b) said shell comprising a metal oxide comprising a cation derived from a metal selected from the group consisting of Ga, In, Sn, Pb, Sb, Cd, Al, Zn, Tl, Bi, Ca, Sc, Ti, V, Cr, Sr, Y, Zr, Nb, Mo, Te, Gd, Hf, Pr, Nd, Pt, Sm, Eu, Dy, Ho, Er, Yb, Pu and mixtures thereof; andc) said one or more ligands comprising a head group that comprises a material selected from the group consisting of thiols, amines, phosphonic acids, alkoxysilanes, halosilanes, carboxylic acids, nitriles, and mixtures thereof;d) said one or more multi-functional ligands comprising a head group that comprises a material selected from the group consisting of thiols, amines, phosphonic acids, alkoxysilanes, halosilanes, carboxylic acids, nitriles, and mixtures thereof.2. The article according to wherein said encapsulates' are chemically bound via a linkage comprising a residue of said ...

DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY SUBSTRATE

Embodiments of the present disclosure provide a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes: a plurality of bearing parts for supporting display assemblies; and a connecting beam located between two bearing parts and connected to the two bearing parts. The connecting beam includes at least one stretchable portion with a hollow portion provided inside the stretchable portion, so that the stretchable portion is deformable in a first direction and a second direction, and the second direction is perpendicular to the first direction. 1. A display substrate , comprising:a plurality of bearing parts for supporting display assemblies; anda connecting beam located between two bearing parts and connected to the two bearing parts,wherein the connecting beam comprises at least one stretchable portion with a hollow portion provided inside the stretchable portion, so that the stretchable portion is deformable in a first direction and a second direction, and the second direction is perpendicular to the first direction.2. The display substrate according to claim 1 , wherein the stretchable portion has a substantially parallelogram shape in a cross section parallel to the display substrate.3. The display substrate according to claim 2 , wherein the stretchable portion has a substantially rhombus shape in the cross section parallel to the display substrate claim 2 , and two diagonal lines of the rhombus are parallel to the first direction and the second direction claim 2 , respectively.4. The display substrate according to claim 3 , wherein the rhombus shape formed by the stretchable portion has a first diagonal line and a second diagonal line claim 3 , the first diagonal line is parallel to the first direction claim 3 , and the second diagonal line is parallel to the second direction; the rhombus shape formed by the stretchable portion has a first included angle and a second included angle claim 3 , and the ...

PATTERNED OVERCOAT LAYER

A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface. 1. A composite article , comprising:a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer comprises a conductive surface;a patterned layer on a first region of the conductive surface, wherein the patterned layer comprises a low surface energy material;an overcoat layer on a first portion of a second region of the conductive surface unoccupied by the patterned layer, wherein the overcoat layer is free of conductive particulates;a via in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer; anda conductive material in the via, wherein the conductive material provides an electrical connection to the conductive surface.2. The composite article according to claim 1 , wherein the via is uncovered by the overcoat layer.3. The composite article according to claim 1 , wherein the via is covered by the overcoat layer claim 1 , and wherein the overcoat layer in the via has a thickness of no more than about 250 nm.4. (canceled)5. The composite article according to claim 1 , wherein the substrate is an optical element.6. The composite article according to claim 1 , wherein the conductive material is selected from conductive adhesives claim 1 , conductive pastes claim 1 , ...

CONDUCTIVE FLEXIBLE AND STRETCHABLE ENCAPSULATION METHOD AND APPARATUS

Apparatus and methods are provided for flexible, stretchable, wearable electronics. In an example, an apparatus for providing flexible and stretchable conductors can include a first elastomer layer, conductive ink applied to the first elastomer layer, and an adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer further configured to allow the apparatus to be attached to a second apparatus. 1. An apparatus for providing flexible and stretchable conductors , the apparatus comprising:a first elastomer layer;conductive ink applied to the first elastomer layer; andan adhesive layer, in cooperation with the first elastomer layer, configured to encapsulate the conductive ink, the adhesive layer configured to allow the apparatus to be attached to a garment and to waterproof a seam of the garment.2. The apparatus of claim 1 , wherein the first elastomer layer includes a thermoplastic elastomer.3. The apparatus of claim 2 , wherein the thermoplastic elastomer includes thermoplastic polyurethane.4. The apparatus of claim 1 , wherein the adhesive layer includes a thermoplastic elastomer.5. The apparatus of claim 4 , wherein the thermoplastic elastomer includes thermoplastic polyurethane.620-. (canceled) The disclosure herein relates generally to wearable electronics and more particularly to flexible and stretchable, wearable electronics.Electronics continue to be developed that are smaller yet more powerful computationally and functionally. Opportunities and challenges continue to arise that push the creative enterprise of electronic designers to provide small powerful electronic products that provide desired user functionality in a convenient package. Wearable electronics have been developed yet have failed to capture widespread use because they are physically rigid, bulky, or lack computational or functional capabilities.The following description and the drawings sufficiently illustrate specific ...

METHOD OF FABRICATING STRAIN-PRESSURE COMPLEX SENSOR AND SENSOR FABRICATED THEREBY

Provided is a method for fabricating a strain-pressure complex sensor and a sensor fabricated thereby. This method includes coating a fabric with a graphene oxide; reducing the graphene oxide coated with the fabric to form a graphene; disposing carbon nanotubes on the fabric coated with the graphene; and connecting an electrode to the fabric. 1. A method for fabricating a strain-pressure complex sensor , comprising:coating a fabric with a graphene oxide;reducing the graphene oxide coated on the fabric to form a graphene;disposing carbon nanotubes on the fabric coated with the graphene; andconnecting an electrode to the fabric.2. The method of claim 1 , wherein the coating of the fabric with the graphene oxide comprises:immersing the fabric in a first solution containing the graphene oxide; anddrying the fabric.3. The method of claim 2 , wherein the first solution comprises water.4. The method of claim 1 , wherein the reducing of the graphene oxide coated on the fabric comprises exposing the fabric coated with the graphene oxide to vapor of a reducing agent.5. The method of claim 4 , wherein the reducing agent is hydrazine.6. The method of claim 4 , wherein the exposing of the fabric coated with the graphene oxide to the vapor of the reducing agent is performed in a sealed chamber at a temperature of 70-80° C.7. The method of claim 1 , wherein the disposing of the carbon nanotubes on the fabric coated with the graphene comprises;immersing the fabric coated with the graphene in a second solution containing carbon nanotubes; anddrying the fabric.8. The method of claim 7 , wherein the second solution comprises at least one of dimethylformamide (DMF) and dichlorobenzene (DCB).9. The method of claim 7 , wherein in the second solution claim 7 , the carbon nanotubes are contained in an amount of 0.01-0.04 wt %.10. The method of claim 1 , wherein the fabric is cotton or wool.11. The method of claim 1 , after the connecting of the electrode to the fabric claim 1 , further ...

STRETCHABLE MEMBER WITH METAL FOIL

Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 μm to 3 μm. 1. A stretchable member with a metal foil , comprising:a stretchable resin base material; anda conductive metal foil provided on the stretchable resin base material,wherein a surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 μm to 3 μm.2. The stretchable member with a metal foil according to claim 1 ,wherein a recovery rate after the stretchable resin base material is subjected to tensile deformation up to strain of 20% is greater than or equal to 80%.3. The stretchable member with a metal foil according to claim 1 ,wherein the metal foil is a copper foil.4. The stretchable member with a metal foil according to claim 1 ,wherein the stretchable resin base material contains (A) a rubber component, andthe rubber component includes at least one kind selected from the group consisting of acrylic rubber, isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene rubber, ethylene propylene rubber, fluorine rubber, sulfurized rubber, epichlorohydrin rubber, and chlorinated butyl rubber.5. The stretchable member with a metal foil according to claim 4 ,wherein a content of the rubber component is 30 mass % to 100 mass % with respect to a mass of the stretchable resin base material.6. The stretchable member with a metal foil according to claim 4 ,wherein the stretchable resin base material further contains a cross-linking polymer of (B) a cross-linking component.7. The stretchable member with a metal foil according to claim 6 ,wherein the cross-linking component is a compound having a reactive ...

Stretchable device and manufacturing method thereof

Provided is a stretchable devices. The stretchable device includes a first stretchable substrate having a first wavy surface that wrinkles in a first direction; first wiring lines extending along the first wavy surface in the first direction; a second stretchable substrate having a second wavy surface that faces the first wavy surface and wrinkles in a second direction intersecting the first direction, wherein the second stretchable substrate is disposed on the first stretchable substrate; second wiring lines extending along the second wavy surface in the second direction; and interlayer insulating layers disposed on the intersections of the first wiring lines and the second wiring lines and disposed between the first wiring lines and the second wiring lines.

STRETCHABLE COMPOSITE CONDUCTORS FOR FLEXIBLE ELECTRONICS, STRETCHABLE PLASMONIC DEVICES, OPTICAL FILTERS, AND IMPLANTABLE DEVICES AND METHODS FOR MANUFACTURE THEREOF

New stretchable electrically conductive composite materials comprising at least one polymer and a plurality of nanoparticles are provided, which exhibit high conductivity even at high strain levels. The composite may comprise polyurethane as the polymer and spherical gold nanoparticles. Such materials have conductivity levels as high as 11,000 Scmat 0% strain and 2,400 Scmat 110% strain. Furthermore, certain embodiments of the composite have a maximum tensile strain of 480% while still exhibiting conductivity of 35 Scm. The inventive materials are highly flexible, highly conductive and suitable for a variety of applications, especially for advanced medical devices, implants, and flexible electronics. The disclosure also provides methods of making such stretchable electrically conductive nanocomposites, including formation by layer-by-layer and vacuum assisted flocculation. In certain embodiments, stretchable chiral plasmonic composite materials for use as optic devices and methods for making them are provided. 1. A stretchable composite material comprising:an elastic polymer having a maximum strain of greater than or equal to about 50%; and{'sup': '−1', 'a plurality of conductive nanoparticles, wherein the stretchable composite material exhibits an electrical conductivity of greater than or equal to about 500 Scmat a tensile strain of greater than or equal to about 15%.'}2. The stretchable composite material of claim 1 , wherein the plurality of conductive nanoparticles has a maximum dimension of less than or equal to about 100 nm and is selected from the group consisting of: gold claim 1 , silver claim 1 , copper claim 1 , nickel claim 1 , iron claim 1 , carbon claim 1 , platinum claim 1 , silicon claim 1 , CdTe claim 1 , CdSe claim 1 , CdS claim 1 , HgTe claim 1 , HgSe claim 1 , HgS claim 1 , PbTe claim 1 , PbSe claim 1 , PbS claim 1 , MoS claim 1 , FeS claim 1 , FeS claim 1 , FeSe claim 1 , and combinations thereof.3. The stretchable composite material of claim 1 ...

Precursor of Superconducting Wire and Method of Manufacturing Superconducting Wire

Proposed is a novel embedded structure for suppressing a disturbance in the cross sectional shape and a non-uniform deformation of a metal member arising in a precursor when producing an MgB2 multi-core wire material by a surface reduction process. This superconductive multi-core wire material precursor is characterized by having: soft Cu and Fe pure metals disposed in the center; mixed powder elements, each comprising as a sheath material a metal such as Fe or Nb having a barrier effect preventing a reaction between Mg and Cu, the mixed powder elements being disposed in a form that surrounds the periphery of the soft metal serving as the central material; and disposed around these, an outer shell layer produced from a harder metal than the central material and the sheath material. 111.-. (canceled)12. A precursor of a superconducting wire , comprising:a core material;a mixed powder element disposed around the core material; andan outer shell layer disposed on an outer side of the core material and the mixed powder element,wherein the mixed powder element includes mixed powders containing Mg powders and boron powders and a metal sheath material covering the mixed powders, andwherein the Vickers hardness is great in an order of the core material, the metal sheath material, and the outer shell layer.13. The precursor of a superconducting wire according to claim 12 ,wherein a difference in hardness between the metal sheath material and the outer shell layer is 30 or greater in terms of a value of the Vickers hardness.14. The precursor of a superconducting wire according to claim 12 ,wherein a difference in hardness between the metal sheath material and the outer shell layer is 50 or greater in terms of a value of the Vickers hardness.15. The precursor of a superconducting wire according to claim 12 ,wherein the core material is any one of Cu, Fe, Nb, and Ni,wherein the metal sheath material is any one of Fe, Nb, and Ta, andwherein the outer shell layer is an alloy ...

Cable with an integrated coiling and reinforcing wrapper

The present invention is a cable, which carries signal, having an integrated coiling and reinforcing wrapper. The cable has a segment near an end that is stiffer than the cable generally. This segment can be bent by hand, and once bent, will retain its bent shape. If the flexible part of the cable is wrapped into a coil, or otherwise gathered together, then the stiffer portion can be bent around the gathered portion to secure it in its gathered form.

STRETCHABLE WIRE TAPE FOR TEXTILE, WEARABLE DEVICE, AND METHOD FOR PRODUCING TEXTILE HAVING WIRES

Provided are a stretchable wire tape for a textile that can maintain high levels in all of stretchability, electrical conductivity, durability, an insulating property, and design and can also have a reduced production cost, wearable devices, and a method for producing textiles having wires. The stretchable wire tape for the textile includes a stretchable electrically conductive wire, and stretchable insulating films each including a first face and a second face opposite to the first face, the stretchable insulating films being bonded to opposite sides of the stretchable electrically conductive wire on their first faces. Since the stretchable insulating films are bonded to the opposite sides of the stretchable electrically conductive wire via bonding layers, durability and an insulating property can be secured while stretchability and electrical conductivity of the electrically conductive wire can be maintained, and design can also be improved. 1. A stretchable wire tape for a textile , comprising:a stretchable electrically conductive wire; andstretchable insulating films each including a first face and a second face opposite to the first face, the stretchable insulating films being bonded to opposite sides of the stretchable electrically conductive wire on their first faces via bonding layers.2. The stretchable wire tape for the textile according to claim 1 , further comprising a hot-melt bonding layer formed on the second face of each stretchable insulating film.3. The stretchable wire tape for the textile according to claim 1 , wherein the stretchable electrically conductive wire includes a stretchable core and at least one electrically conductive wire wound around the stretchable core.4. The stretchable wire tape for the textile according to claim 1 , wherein the stretchable electrically conductive wire includes a stretchable insulating substrate and an electrically conductive wire formed to penetrate through the insulating substrate beyond upper and lower faces ...