METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

A method for manufacturing light emitting device is revealed. Firstly, provide a substrate. Then arrange a light emitting unit on the substrate. Next form at least one electrode and arrange at least one protective layer on the electrode. The protective layer is to prevent a phosphor layer following formed on the light emitting unit from covering the electrode. After forming the phosphor layer, flatten the phosphor layer and the protective layer. That means to remove part of the phosphor layer over the protective layer and the protective layer. Thus the electrode is not affected by the phosphor layer and conductivity of the electrode is improved to resolve phosphor thickness and uniformity problems of the light emitting device. Therefore, the thickness of the light emitting device with LED is effectively reduced and stability of white color temperature control is significantly improved. 1. A method for manufacturing light emitting devices comprising the steps of:providing a substrate;forming a light emitting unit on the substrate;arranging at least one electrode that is electrically connected to the light emitting unit;forming at least one protective layer on the electrode;disposing a phosphor layer on the light emitting unit and the phosphor layer covering both the light emitting unit and the protective layer;removing part of the phosphor layer over the protective layer; andremoving the protective layer.2. The method as claimed in claim 1 , wherein in the step of removing part of the phosphor layer over the protective layer claim 1 , the phosphor layer is removed by abrasive cutting or machining so that the height of the phosphor layer is no more than the height of the protective layer.3. The method as claimed in claim 1 , wherein in the step of removing the protective layer claim 1 , the protective layer is removed by etching.4. The method as claimed in claim 1 , wherein the thickness of the phosphor layer ranges from 10 micrometers to 50 micrometers.5. The method ...

ALTERNATING CURRENT LIGHT-EMITTING DEVICE

The present invention provides an alternating current light-emitting diode (AC LED), which uses a light compensation layer disposed on the light-emitting surface of the AC LED. The materials of the light compensation layer can be phosphorescent or fluorescent materials. The light-emitting mechanism is mainly the light-emitting mechanism of electron-hole pairs in a triplet state. By absorbing light of the AC LED, the flashes occurred when the power of the AC LED alters from a positive half-cycle to a negative one can be compensated. Thereby, the AC LED can emit light full-timely. 1. An alternating current light-emitting device , comprising:an alternating current light-emitting diode; anda light compensation layer, disposed on the light-emitting surface of said alternating current light-emitting diode;where in each cycle of power, the light-emitting duration of said alternating current light-emitting diode is shorter than the light-emitting duration of said light compensation layer.2. The alternating current light-emitting device of claim 1 , wherein the material of said light compensation layer is chosen from the group consisting of yellow fluorescent powders claim 1 , green fluorescent powders claim 1 , red fluorescent powders claim 1 , and any combination of the above.3. The alternating current light-emitting device of claim 1 , wherein the material of said light compensation layer is chosen from the group consisting of yellow phosphorescent powders claim 1 , green phosphorescent powders claim 1 , red phosphorescent powders claim 1 , and any combination of the above.4. The alternating current light-emitting device of claim 1 , wherein said alternating current light-emitting diode includes a blue light-emitting diode chip.5. The alternating current light-emitting device of claim 4 , wherein the material of said light compensation layer is chosen from the group consisting of yellow fluorescent powders claim 4 , yellow phosphorescent powders claim 4 , red fluorescent ...

SOLID STRUCTURE GLASS AND METHOD FOR MAKING THE SAME

The present invention discloses a solid structure glass with a thin cross-sectional plane and a method for making the same. The solid structure glass includes an inner surface and an outer surface each combined of a curved surface, or at least two curved surfaces, or a curved surface and at least one flat surface, or at least two flat surfaces. As a result, the solid structure glass can easily be made with different shapes so as to be especially compatible with the form factor of products. Besides, the solid structure glass is made by heating a glass preform and a mold together into a forming temperature of the glass preform under condition that the glass preform is in a softened state. 1. A solid structure glass with a thin cross-sectional plane , comprising:an inner surface combined of a curved surface, or at least two curved surfaces, or a curved surface and at least one flat surface, or at least two flat surfaces; andan outer surface combined of a curved surface, or at least two curved surfaces, or a curved surface and at least one flat surface, or at least two flat surfaces; whereinthe solid structure glass is made by heating a glass preform and a mold together into a forming temperature of the glass preform under condition that the glass preform is in a softened state.2. The solid structure glass as claimed in claim 1 , wherein a thickness of the solid structure glass between the outer surface and the inner surface is within a range of 0.1 mm to 10 mm.3. The solid structure glass as claimed in claim 1 , further comprising a body and at least one bending portion connecting the body claim 1 , outer and inner surfaces of the body each being a flat surface claim 1 , or a curved surface claim 1 , or a combination of a flat surface and a curved surface claim 1 , outer and inner surfaces of the bending portion each being a curved surface claim 1 , outer and inner surfaces of the solid structure glass being a combination of a flat surface and a curved surface.4. The ...

OXYNITRIDE PHOSPHOR AND METHOD OF MANUFACTURING THE SAME

An oxynitride phosphor and a method of manufacturing the same are revealed. The formula of the oxynitride phosphor is BaSiON: Y(0≦x≦1). Y is praseodymium (Pr) or terbium (Tb) used as a luminescent center. The oxynitride phosphor is synthesized by solid-state reaction. The oxynitride phosphor is excited by vacuum ultraviolet light with a wavelength range of 130 nm to 300 nm or ultraviolet to visible light with a wavelength range of 300 nm to 550 nm to emit light with a wavelength range of 400 nm to 700 nm. Moreover, the full-width at half-maximum of the emission spectrum is smaller than 30 nm. Thus the oxynitride phosphor is suitable for applications of backlights, plasma display panels and ultraviolet excitation. The oxynitride phosphor has higher application value. 1. An oxynitride phosphor having a formula BaSiON: Y , wherein x is ranging from 0 to 1;wherein Y is praseodymium (Pr) or terbium (Tb) used as a luminescent center; andwherein full-width at half-maximum of a peak of emission wavelength of the oxynitride phosphor is smaller than 30 nm.2. The oxynitride phosphor as claimed in claim 1 , wherein the oxynitride phosphor is excited by light with a wavelength range of 300 nm to 550 nm or 130 nm to 300 nm.3. A method of manufacturing an oxynitride phosphor as claimed in comprising the steps of:providing a precursor; andsintering the precursor by solid-state reaction for synthesis of an oxynitride phosphor.4. The method as claimed in claim 3 , wherein the precursor includes at least one of elements selected from barium carbonate claim 3 , silicon dioxide claim 3 , silicon nitride claim 3 , and praseodymium oxide.5. The method as claimed in claim 3 , wherein the precursor includes at least one of elements selected from barium carbonate claim 3 , silicon dioxide claim 3 , silicon nitride claim 3 , and terbium oxide.6. The method as claimed in claim 3 , wherein a sintering temperature is ranging from 1200 degrees Celsius to 1800 degrees Celsius7. The method as ...

ALTERNATING CURRENT LINE EMULATOR

An alternating current (AC) line emulator includes an AC power supply and an automatic regulating load. The AC power supply is used for providing an AC line frequency and an AC line voltage. The automatic regulating load is coupled between the AC power supply and a grid-connected power generation system for functioning as a test load of the grid-connected power generation system, and preventing current from reversing to the AC power supply and shutting down the AC power supply. When the grid-connected power system is tested, power consumption of the automatic regulating load is equal to a sum of output power of the grid-connected power generation system and output power of the AC power supply. 1. An alternating current (AC) line emulator , comprising:an AC power supply for providing an AC line frequency and an AC line voltage; andan automatic regulating load coupled between the AC power supply and a grid-connected power generation system for functioning as a test load of the grid-connected power generation system, and preventing current from reversing to the AC power supply and shutting down the AC power supply, wherein power consumption of the automatic regulating load is equal to a sum of output power of the grid-connected power generation system and output power of the AC power supply when the grid-connected power generation system is tested.2. The AC line emulator of claim 1 , wherein the AC power supply is used for simulating various conditions of an AC line.3. The AC line emulator of claim 1 , wherein the grid-connected power generation system is a photovoltaic generator.4. The AC line emulator of claim 1 , wherein the automatic regulating load comprises:a power resistor chamber comprising a plurality of parallel resistors for consuming the output power of the grid-connected power generation system and the output power of the AC power supply; anda load controller for automatically regulating an equivalent resistance of the power resistor chamber to make the ...

HIGH-VOLTAGE LIGHT-EMITTING DEVICE

The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18-25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency. 1. A light-emitting device , comprising:a substrate; anda set of light-emitting diode chips, disposed on the substrate and having a number about 18 to 25 chips;wherein the light-emitting diode chips have a mis-aligned arrangement.2. The light-emitting device of claim 1 , wherein the driving voltage of each of the light-emitting diode chips is about 3.1 to 3.5V.3. The light-emitting device of claim 1 , wherein the luminous area of the light-emitting diode chips is about 60% to 80% of the surface of the substrate.4. The light-emitting device of claim 1 , wherein the light-emitting diode chips are connected to one another in series.5. The light-emitting device of claim 1 , wherein the total driving voltage of the light-emitting diode chips is 70-75V.6. The light-emitting device of claim 1 , wherein one of the light-emitting diode chips comprising a transparent conductive layer claim 1 , disposed on the top of the light-emitting diode chip.7. The light-emitting device of claim 6 , wherein one the light-emitting diode chips further comprising a current blocking layer claim 6 , disposed in the transparent conductive layer.8. The light-emitting device of claim 1 , wherein one of the light-emitting diode chips comprising an optical reflection layer disposed at the bottom of chip. This invention relates to a light-emitting device, especially to a high-voltage light-emitting device having light-emitting diode chip interleaved arrangement therein.Due to the recent gradual decrease in fossil energy, and consequently the growing demand for energy-saving products, the light-emitting diode (LED) ...

LIGHT-EMITTING DIODE CHIP

A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation. 1. A light-emitting diode (LED) chip comprising:a first semiconductor layer;an active layer disposed on said first semiconductor layer;a second semiconductor layer disposed on said active layer;a plurality of metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer;wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation.2. The LED chip as claimed in claim 1 , wherein said indentation deposited on and penetrated said second semiconductor layer and said active layer claim 1 , and reached said first semiconductor layer; and said first metal layer deposited therein and connected to said first semiconductor layer.3. The LED chip as claimed in further comprising a plurality of insulating layers deposited between said first and second metal layer claim 1 , and between said first metal layer and said second semiconductor layer.4. The LED chip as claimed in claim 1 , wherein said metal layers branched ...

Light emitting component and light emitting device using same

A light emitting device including a light emitting component is provided, wherein said light emitting comprising an integrated light emitting diode and a semiconductor field effect transistor. The semiconductor field effect transistor may prevent situations such as overheating and voltage instability by controlling a current passing through the light emitting diode as well as enhancing the ability to withstand electrostatic discharge and reducing cost of the light emitting device in multiple aspects.

Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device

A sapphire substrate configured to form a light emitting diode (LED) chip providing light in multi-directions, a LED chip and an illumination device are provided in the present invention. The sapphire substrate includes a growth surface and a second main surface opposite to each other. A thickness of the sapphire substrate is thicker than or equal to 200 micrometers. The LED chip includes the sapphire substrate and at least one LED structure. The LED structure is disposed on the growth surface and forms a first main surface where light emitted from with a part of the growth surface without the LED structures. At least a part of light beams emitted from the LED structure pass through the sapphire substrate and emerge from the second main surface. The illumination device includes at least one LED chip and a supporting base. The LED chip is disposed on the supporting base.

LIGHT EMITTING DEVICE

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. 1. A light emitting device , comprising:a sapphire substrate, having a support surface; andat least one light emitting diode chip comprising a plurality of light emitting surfaces, disposed on said support surface of said substrate, one of said light emitting surfaces and said support surface forming a first main surface;wherein a light emitting angle of said light emitting diode chip is wider than 180°, and the light emitted by said light emitting diode chip penetrates into said substrate from said support surface and at least partially emerges from a second main surface corresponding to said first main surface of said sapphire substrate.2. The light emitting device of claim 1 , wherein the thickness of said sapphire substrate is greater than or equal to 200 μm.3. The light emitting device of claim 1 , wherein the difference between the color temperature of said first main surface and the color temperature of said second main surface is equal to or less than 1500K.4. The light emitting device of claim 1 , further comprising a wavelength conversion layer disposed on said first main surface and/or on said second main surface claim 1 , wherein said wavelength conversion layer receives at least a portion of the light emitted by said light emitting diode chip and converts the wavelength thereof.5. The light emitting device of claim 4 , wherein said wavelength conversion ...

LIGHT EMITTING APPARATUS

The present invention relates to a light emitting apparatus comprising at least one light emitting device and a support mechanism. The light emitting device includes a transparent substrate which light can pass through; at least one LED chip emitting light omni-directionally is disposed on one surface of the substrate, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. The support mechanism is coupled to the light emitting device; a first angle is formed between the substrate and the support mechanism. According to the present invention, the light emitting apparatus using LED chips can provide sufficient lighting intensity and uniform lighting performance. 1. A light emitting apparatus , comprising: a substrate, having a support surface; and', 'at least one light emitting diode chip comprising a plurality of light emitting surfaces, disposed on said support surface of said substrate, one of said light emitting surfaces and said support surface forming a first main surface, wherein a light emitting angle of said light emitting diode chip is wider than 180°, and the light emitted by said light emitting diode chip penetrates into said substrate from said support surface and at least partially emerges from to a second main surface corresponding to said first main surface of said substrate; and, 'at least one light emitting device, includinga support mechanism, coupled to said light emitting device, and forming a first angle with said substrate.2. The light emitting apparatus of claim 1 , further comprising a wavelength conversion layer disposed on said first main surface and/or on said second main surface of said light emitting device claim 1 , wherein said wavelength conversion layer receives at least a portion of the light emitted by said light emitting diode chip and converts the wavelength thereof.3. The light emitting apparatus of claim 1 , wherein the difference between the ...

LIGHT EMITTING ELEMENT AND ILLUMINATION DEVICE THEREOF

A light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED chips. Each of the LED chips includes a first electrode and a second electrode. Light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface. An illumination device includes the light emitting element and a supporting base. The light emitting element is disposed on the supporting base, and an angle is formed between the light emitting element and the supporting base. 1. A light emitting element , comprising:a transparent substrate, having a support surface and a second main surface disposed opposite to each other; anda plurality of light emitting diode (LED) chips, wherein at least some of the LED chips are disposed on the support surface and form a first main surface where light emitted from with at least a part of the support surface without the LED chips, and each of the LED chips comprises a first electrode and a second electrode,wherein light emitted from at least one of the LED chips passes through the transparent substrate and emerges from the second main surface.2. The light emitting element of claim 1 , further comprising a wavelength conversion layer disposed on the LED chips claim 1 , the first main surface claim 1 , or the second main surface claim 1 , wherein the wavelength conversion layer at least partially absorbs light beams emitted from the LED chips and coverts the light beams into another light beams having different wavelength range.3. The light emitting element of claim 1 , further comprising wavelength conversion layers disposed on the first main surface and the second main surface claim 1 , ...

SECURE UNIVERSAL TWO-STEP PAYMENT AUTHORIZATION SYSTEM

A system and methods expedite and make secure payment data entry, and payment and authorization and authorization, for both in-store and online purchases. A mobile app, or widget or browser extension or installed service, on a mobile communication device, generates a barcode to be scanned at a point-of-sale terminal. Optional confirmation is sent to an app, or browser extension or widget or installed service, on a mobile or fixed communication device, to confirm a purchase. An independent app, or browser extension or widget or installed service, on a mobile or fixed communication device, generates a barcode that is sent directly to an online point-of-sale system. The method allows a purchaser to use the same app, or widget or browser extension or installed service, to purchase from any retailer with installed collaborating software. 120.-. (canceled)21. A financial institution subsystem in communication with a commercial entity subsystem , the financial institution subsystem comprising:at least one processor component;at least one memory component; andat least one communications component, wherein the financial institution subsystem is configured to:receive from the commercial entity subsystem a request for payment authorization, the request containing at least an encrypted digital representation of a commerce credential for the requested payment transaction, the commerce credential containing no payment credentials usable in any other future transactions;after the receiving, retrieve a payment credential from the memory component using the encrypted digital representation received from the commercial entity subsystem;after the retrieving, process the requested payment authorization; andafter the processing, send an approval-or-denial reply regarding the payment authorization request to the commercial entity subsystem.22. The financial institution subsystem of claim 21 , wherein the financial institution subsystem is further configured to communicate with a merchant ...

WAFER CONTAINER AND METHOD FOR HOLDING WAFER

Provided is a wafer container including a frame having a first sidewall and a second sidewall extending along a YZ plane; a plurality of first support structures disposed on the first sidewall and arranged along a Z direction; and a plurality of second support structures disposed on the second sidewall and arranged along the Z direction. One of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder. The wafer holder includes a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along a X direction. A method for holding at least one wafer is also provided. 1. A wafer container , comprising:a frame having opposite sidewalls; and a first support structure having a first connection portion and a plurality of first comb portions connected to the first connection portion, wherein one of the plurality of first comb portions comprises a first main portion and a plurality of first island structures disposed over the first main portion, and the plurality of first island structures are separated from each other; and', 'a second support structure having a second connection portion and a plurality of second comb portions connected to the second connection portion, wherein one of the plurality of second comb portions comprises a second main portion and a plurality of second island structures disposed over the second main portion and the plurality of second island structures are separated from each other., 'at least a pair of support structures respectively disposed on the opposite sidewalls of the frame, wherein the at least a pair of support structures comprise2. The wafer container of claim 1 , wherein the frame having a first sidewall and a second sidewall extending along a YZ plane claim 1 , wherein the entire first sidewall is parallel with the entire second side wall.3. The wafer container of claim 1 , wherein the ...

ILLUMINATION DEVICE

A semiconductor light emitting element includes a transparent substrate and a plurality of light emitting diode (LED) chips. The transparent substrate has a support surface and a second main surface disposed opposite to each other. At least some of the LED structures are disposed on the support surface and form a first main surface where light emitted from with a part of the support surface without the LED structures. Each of the LED structures includes a first electrode and a second electrode. Light emitted from at least one of the LED structures passes through the transparent substrate and emerges from the second main surface. An illumination device includes the semiconductor light emitting element and a supporting base. The semiconductor light emitting element is disposed on the supporting base, and an angle is formed between the semiconductor light emitting element and the supporting base. 1. An illumination device , comprising:a supporting base having a symmetrical center; anda plurality of semiconductor light emitting elements disposed on the supporting base and around the symmetrical center; a transparent substrate, having a support surface and a second main surface disposed opposite to each other; and', 'a light emitting diode (LED) structure disposed on the support surface and form a first main surface where light emitted from with at least a part of the support surface without the LED structure, and at least a part of light emitted from the LED structure may pass through the transparent substrate and emerge from the second main surface., 'wherein at least one of the semiconductor light emitting elements comprising2. The illumination device of claim 1 , wherein a first angle exists between at least one of the semiconductor light emitting elements and the supporting base claim 1 , and the first angle may range from 30 to 150 degrees.3. The illumination device of claim 1 , wherein a first angle exists between at least one of the semiconductor light emitting ...

Ceramic module for power semiconductor integrated packaging and preparation method thereof

A ceramic module for power semiconductor integrated packaging and a preparation method thereof are disclosed. The ceramic module includes a ceramic substrate and an integrated metal dam layer. By providing the integral metal dam layer on the upper surface of the ceramic substrate and forming cavities around die bonding regions, the semiconductor chip can be hermetically sealed. By providing a heat dissipation layer on the lower surface of the ceramic substrate, the heat generated by the semiconductor chip can be quickly conducted to the outside. The product has a simple production process and high product consistency.

Automatic Pick-Up Equipment

An automatic pick-up equipment adapted to pick up components having different shapes includes a base mounted on a manipulator of a robot, a first pick-up device mounted on the base and including a pair of first gripping mechanisms opposite to each other, and a second pick-up device mounted on the base and including a pair of second gripping mechanisms opposite to each other and a rotation mechanism. The first gripping mechanisms are configured to linearly reciprocate relative to each other to grip a first component. The second gripping mechanisms are configured to pivotally reciprocate relative to each other to grip a second component. The rotation mechanism is configured to drive the second gripping mechanisms to rotate relative to the base to change a posture of the second component.

OPTIMIZING STREAM-MODE CONTENT CACHE

A system and method, called ADD (adaptive data descriptor) and FP (functional proximity), optimizes data transfer between inbound and outbound streams for TCP or other data transfer mechanisms. ADD minimizes data copying in the steam mode, while allowing simultaneous reading from the inbound stream, and writing into the outbound stream from a stored file. ADD and FP jointly minimize total latency in stream-mode data transfer, with or without caching, over multi-core computing systems. 2. The method of claim 1 , wherein a read process claim 1 , utilizing the data descriptor DDi through the “peek” data-transfer path claim 1 , reads data claim 1 , in part or in whole claim 1 , from said input stream to user space.3. The method of claim 2 , wherein DDi and DDo are modified so that the data pointers associated with DDi and DDo are modified to point to null objects claim 2 , for discarded data in said input stream or said output stream.4. The method of claim 3 , wherein if and when said input stream contains an HTTP (hypertext transfer protocol) command claim 3 , said read process reads an HTTP command in part.5. The method of claim 4 , wherein said computing system is Linux-based claim 4 , said zero-copy mechanism is the splice system call or the system services in the future generation of the Linux operating system that provide zero-copy data transfer from one data construct to another data construct.6. The method of claim 5 , wherein said computing system is a TCP splicing box that provides TCP splicing between a plurality of senders and a plurality of receivers.7. A machine-implemented method to assign processes to different CPUs (central processing units) or cores in a multi-core computing system claim 5 , for the purpose of minimizing cache misses and cache accesses claim 5 , for stream-mode data-transfer applications claim 5 , comprising:assigning functionally similar processes to the same CPU or core processor as much as possible, according to a priori broad ...

LIGHT EMITTING DEVICE

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. 1. A light-emitting apparatus comprising: a substrate with a support surface and a plurality of side surfaces;', 'a first light-emitting diode chip disposed on the support surface;', 'a second light-emitting diode chip disposed on the support surface; and', 'a wavelength conversion layer continuously covering the first light-emitting diode chip and the second light-emitting diode chip without covering the plurality of side surfaces; and, 'a light-emitting device comprising'}a support base coupled to the first light-emitting device and forming a first angle with the substrate.2. The light-emitting apparatus of claim 1 , wherein the substrate has a main surface opposite to the support surface claim 1 , the first light-emitting diode chip is capable of emitting light capable of penetrating into the substrate from the support surface and emerging from the main surface.3. The light-emitting apparatus of claim 2 , wherein the wavelength conversion layer is arranged to cover the main surface.4. The light-emitting apparatus of claim 1 , wherein the s s rate comprises aluminum oxide claim 1 , sapphire containing aluminum oxide claim 1 , glass claim 1 , plastics claim 1 , or rubber.5. The light-emitting apparatus of claim 1 , wherein the wavelength conversion layer directly contacts the first light-emitting diode chip and the second light-emitting diode chip.6. The light-emitting ...

Method of fabricating perovskite solar cell

A method of fabricating a perovskite solar cell includes forming a hole transport layer on a transparent electrically conductive substrate, and forming a perovskite layer on the hole transport layer via a two-stage vacuum evaporation process. Then, an electron transport layer and an electrode layer are formed in order. The two-stage vacuum evaporation process includes first vacuum evaporating a first material on the hole transport layer and then vacuum evaporating a second material on the first material so as to react the first material with the second material in situ and form the perovskite layer.

Light emitting component and light emitting device using same

A light emitting device including a light emitting component is provided, wherein said light emitting comprising an integrated light emitting diode and a semiconductor field effect transistor. The semiconductor field effect transistor may prevent situations such as overheating and voltage instability by controlling a current passing through the light emitting diode as well as enhancing the ability to withstand electrostatic discharge and reducing cost of the light emitting device in multiple aspects.

CAPACITOR STRUCTURE AND STACK-TYPE CAPACITOR STRUCTURE

A capacitor structure is provided, which includes a conductive substrate, a first dielectric layer, and a first metal layer. The conductive substrate includes a first surface and at least one first concave located on the first surface. The first dielectric layer covers the first surface and the first concave. The first metal layer covers the first dielectric layer, wherein the first dielectric layer and the first metal layer respectively have concave structures corresponding to the first concave. A stack-type capacitor structure is also provided. 1. A capacitor structure , comprising:a conductive substrate comprising a first surface and at least one first concave located on the first surface;a first dielectric layer covering the first surface and the first concave; anda first metal layer covering the first dielectric layer, wherein the first dielectric layer and the first metal layer respectively have concave structures corresponding to the first concave.2. The capacitor structure according to claim 1 , wherein the number of the first concave is two or more.3. The capacitor structure according to claim 1 , further comprising:a second dielectric layer, wherein the conductive substrate further comprises a second surface opposite to the first surface and at least one second concave located on the second surface, and the second dielectric layer covers the second surface and the second concave; anda second metal layer covering the second dielectric layer, wherein the second dielectric layer and the second metal layer respectively have concave structures corresponding to the second concave.4. The capacitor structure according to claim 3 , wherein the first concave is substantially aligned with the second concave.5. The capacitor structure according to claim 3 , wherein the first concave is not substantially aligned with the second concave.6. The capacitor structure according to claim 1 , wherein the material of the conductive substrate comprises a semiconductor or metal.7 ...

5-WAY TCP OPTIMIZATION

A system and method optimizes the response speed and/or throughput of TCP sessions for web browsing and large-file applications. TCP sessions may be terminated in a TCP proxy. When a TCP sessions enters a slow-start phase or a fast retransmit phase, the congestion window is creased to above a threshold, or the transmission timer is set above a fixed threshold, or the slow-start threshold is set above a fixed threshold. 1. A machine-implemented method to optimize TCP performance in response speed and/or throughput over a network with possibly wireless links , comprising:placing a TCP termination proxy at a location, which is in the paths of a plurality of TCP sessions, TCP termination being a technology also known as TCP splicing or split TCP;the TCP termination device performing TCP optimization for each of said plurality of TCP sessions, the method further comprising:upon a said TCP session entering a slow-start phase or a fast retransmit phase,(1) setting the congestion window of said TCP session to above a fixed threshold;(2) or setting the retransmission timer of said TCP session to above a fixed threshold;(3) or setting the slow-start threshold of said TCP session to above a fixed threshold;(4) or a partial or full combination of (1), (2), and (3).2. A machine-implemented method to optimize a TCP session in response speed and/or throughput over a network with possibly wireless links , comprising:upon said TCP session entering a slow-start phase or a fast retransmit phase,(1) setting the congestion window of said TCP session to above a fixed threshold;(2) or setting the retransmission timer of said TCP session to above a fixed threshold;(3) or setting the slow-start threshold of said TCP session to above a fixed threshold;(4) or a partial or full combination of (1), (2), and (3).3. A TCP proxy for optimizing TCP performance in response speed and/or throughput over a network with possibly wireless links , comprising:at least a processor component;at least a ...

Pll frequency synthesizer with multi-curve vco implementing closed loop curve searching using charge pump current modulation

A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a set of operating curves, each operating curve corresponding to a different frequency range over a control voltage range. The phase-locked loop circuit includes a phase and frequency detector driving a charge pump and a digital control circuit configured to perform a closed loop curve search operation to select one of the operating curves in the multi-curve VCO and to perform a curve tracking operation using the selected operating curve, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop. In one embodiment, the digital control circuit increases the charge pump current above a nominal current value during the closed loop curve search operation and set the charge pump current to the nominal current during the curve tracking operation.

LIGHT EMITTING DIODE AND ILLUMINATION DEVICE USING SAME

The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively. 1. A light emitting diode comprises:an LED die comprising a transparent substrate and a light emitting structure disposed on said transparent substrate;at least two metal pads setting on said LED die, wherein top surfaces of said metal pads set on the same plane essentially; anda fluorescent layer setting on said LED die and exposing said metal pads;wherein said light emitting structure comprises a first semiconductor, a light emitting layer set on said first semiconductor layer, and a second semiconductor layer set on said light emitting layer; andwherein said metal pads set on said transparent substrate, and the thickness of said fluorescent layer is greater than 30 um.2. The light emitting diode of claim 1 , wherein said LED die is one of a plurality of LED dies claim 1 , and the emitting diode further comprises said LED dies; and wherein said transparent substrate of said LED dies is identical and comprises a support surface and a second main surface corresponding to said support surface.3. The light emitting diode of claim 1 , wherein said transparent substrate comprises a support surface and a second main surface corresponding to said support surface claim 1 , and said LED die may emit light in multi directions that at least part of the light emitted from said light emitting structure of said LED die ...

ADDITIVE FORMULATION FOR REDUCTION OR PREVENTION OF MICROBIALLY INDUCED CORROSION IN CONCRETE OR CEMENTITIOUS MATERIAL

An additive formulation for reduction or prevention of microbially induced corrosion in concrete, cementitious material (such as mortar or grout), or a combination thereof. The additive formulation comprises a Quat Silane and a fungicide, wherein the ratio of the Quat Silane to the fungicide in the formulation is in a range of about 10:1 to about 1:10, preferably in a range of about 5:1 to about 1:5. 1. A method of using comprising:adding an additive formulation comprising a Quat Silane and a fungicide to a material selected from the group consisting of concrete, a cementitious material, or a combination thereof, wherein the addition results in a reduction or an elimination of microbially induced corrosion.2. The method of using according to claim 1 , wherein the Quat Silane is in a ratio of the Quat Silane to the fungicide in a range of about 10:1 to about 1:10.3. The method of using according to claim 2 , wherein the Quat Silane is in a ratio of the Quat Silane to the fungicide in a range of about 5:1 to about 1:5.4. The method of using according to claim 1 , wherein the addition is to a water-free system.5. The method of using according to claim 1 , wherein the additive formulation further comprises a defoamer.6. The method of using according to claim 5 , wherein the defoamer is selected from the group consisting of polyether amine claim 5 , ethoxylated alcohol claim 5 , silicone-based defoamer claim 5 , tributyl phosphate claim 5 , and a combination thereof.7. The method of using according to claim 5 , wherein the defoamer is from about 2 weight % to about 25 weight % of the amount of the Quat Silane in the formulation8. The method of using according to claim 1 , wherein the fungicide is selected from the group consisting of Sodium OrthophenylPhenol claim 1 , Imazalil Sulphate claim 1 , diiodomethyl-p-tolylsulfone claim 1 , carbamate claim 1 , isothiazolinone claim 1 , azole claim 1 , chlorothalonil claim 1 , zinc pyrithione claim 1 , copper pyrithione claim 1 , ...

STORING AND TRANSFERRING APPLICATION DATA BETWEEN DEVICES

Methods, systems, and apparatus are described for storing and transferring application data between devices. In one aspect, a method includes receiving, by a first service running on a first device, from a second service running on a second device, application data for a first set of applications on the second device; causing, by the first service and for each application in the first set, the first device to store the application data for the application; receiving, by the first service and from a third service running on a third device, a request for application data for a second set of applications on the third device; determining, by the first service, that the first device stores application data for the second set of applications; and causing, by the first service, the first device to provide stored application data to the third service running on the third device. 1. A computer-implemented method , comprising:receiving, by a first service running on a first device, from a second service running on a second device, application data for each application in a first set of one or more applications that are installed on the second device and supported by the second service, each application in the first set being separate from the second service;causing, by the first service and for each application in the first set, the first device to store the application data for the application;receiving, by the first service and from a third service running on a third device, a request for application data for each application in a second set of one or more applications that are installed on the third device, each application in the second set being separate from the third service;determining, by the first service, that the first device stores application data for a subset of the one or more applications in the second set of applications; andcausing, by the first service, the first device to provide stored application data for at least one application in the subset to the ...

TRANSFERRING APPLICATION DATA BETWEEN DEVICES

Methods, systems, and apparatus are described for transferring application data between devices. In one aspect, a method includes causing, by a first service running on a first device, the first device to establish a wireless connection with a second device; receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service; determining, by the first service, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first service; receiving, by the first service, first application data from the first application; and causing, by the first service, the first device to send the first application data to the second service running on the second device using the wireless connection. 1. A computer-implemented method , comprising:causing, by a first service running on a first device, the first device to establish a wireless connection with a second device;receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service;determining, by the first service, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first service;receiving, by the first service, first application data from the first application; andcausing, by the first service, the first device to send the first application data to the second service running on the second device using the wireless connection.2. The method of claim 1 , further comprising:determining, by the first service, that a second application installed on the first device matches a second of the one or ...

LIGHT-EMITTING DIODE

A light-emitting diode (LED) is provided. An LED die includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first electrode and a second electrode. At least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer. The first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively. At least two metal pads are disposed on top of the first electrode and the second electrode of the LED die respectively. Each of the metal pads has a side surface. A fluorescent layer is disposed on a surface of the LED die. The fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads. 1. A light-emitting diode (LED) , comprising: a first semiconductor layer;', 'a light-emitting layer disposed on the first semiconductor layer;', 'a second semiconductor layer disposed on the light-emitting layer, wherein at least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer; and', 'a first electrode and a second electrode disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively;, 'an LED die comprisingat least two metal pads disposed on top of said first electrode and said second electrode of said LED die respectively, wherein each of the metal pads has a side surface; anda fluorescent layer disposed on a surface of said LED die, wherein the fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads, and the top surface of the fluorescent layer is flat in a cross-section view, and the thickness of the fluorescent layer is greater than 30 μm, and all side surfaces of the fluorescent layer are respectively aligned with all outer side surfaces of the LED die.2. The LED of claim 1 , wherein the materials of the ...

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE

A manufacturing method of a semiconductor package includes the following steps. At least one lower semiconductor device is provided. A plurality of conductive pillars are formed on the at least one lower semiconductor device. A dummy die is disposed on a side of the at least one lower semiconductor device. An upper semiconductor device is disposed on the at least one lower semiconductor device and the dummy die, wherein the upper semiconductor device reveals a portion of the at least one lower semiconductor device where the plurality of conductive pillars are disposed. The at least one lower semiconductor device, the dummy die, the upper semiconductor device, and the plurality of conductive pillars are encapsulated in an encapsulating material. A redistribution structure is formed over the upper semiconductor device and the plurality of conductive pillars. 1. A semiconductor package , comprising:a first lower semiconductor device and a second lower semiconductor device disposed in a side by side manner;a plurality of first conductive pillars disposed on the first lower semiconductor device along a first direction parallel to a side of the first lower semiconductor device;a plurality of second conductive pillars disposed on the second lower semiconductor device along a second direction parallel to a side of the second lower semiconductor device, wherein the first direction is substantially collinear with the second direction;an upper semiconductor device disposed on the first lower semiconductor device and the second lower semiconductor device and revealing a portion where the plurality of first conductive pillars and the plurality of second conductive pillars are disposed;an encapsulating material encapsulating the first lower semiconductor device, the second lower semiconductor device, the plurality of first conductive pillars, the plurality of second conductive pillars, and the upper semiconductor device; anda redistribution structure disposed over and ...

PACKAGE STRUCTURE

A package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip. 1. A package structure , comprising:a first chip connected to a pair of first signal lines and a plurality of first power lines; anda second chip connected to a pair of second signal lines and a plurality of second power lines,wherein the first chip and the second chip belong to a common wafer, and a separated street is between the first chip and the second chip.2. The package structure of claim 1 , wherein the first chip and the second chip perform the same function.3. The package structure of claim 1 , wherein the first chip and the second chip perform different functions.4. The package structure of claim 1 , wherein the first power lines are disposed at two sides of the pair of first signal lines.5. The package structure of claim 1 , wherein the second power lines are disposed at two sides of the pair of second signal lines.6. The package structure of claim 5 , wherein the separated street is between one of the first power lines and one of the second power lines.7. The package structure of claim 1 , wherein the pair of first signal lines are adjacent to the pair of second signal lines.8. The package structure of claim 7 , wherein the pair of first signal lines and the pair of second signal lines are disposed between the first power lines and the second power lines.9. The package structure of claim 7 , wherein the separated street is between one of the pair of first signal lines and one of the pair of second signal lines.10. The package structure of claim 1 , wherein separated street is an invalid circuit area.11. The package structure of claim 1 , wherein the first chip is dependent ...

GLASS MOLDING METHOD AND GLASS MOLDING DEVICE USED IN THE METHOD

A glass molding method for molding a glass preform to a glass product via an assembly mold includes the following steps. The glass preform is preheated to a glass molding temperature. The assembly mold is heated to a predetermined mold temperature lower than the glass molding temperature and maintained at the mold temperature. The preheated glass preform is transferred to the assembly mold. The assembly mold is closed together for molding the glass preform to the glass product. The glass product and the assembly mold are gradually cooled to an open temperature. Then the assembly mold is opened to take the glass product out of the assembly mold. 1. A glass molding method comprising:providing a glass preform and an assembly mold, the assembly mold comprising at least two sub-molds;heating the glass preform to a glass molding temperature at which the glass preform is moldable;heating each of the sub-molds to predetermined mold temperatures and maintaining the mold temperatures;transferring the glass preform heated to the glass molding temperature to a molding surface of one of the sub-molds heated to the mold temperature;closing the sub-molds together to form the glass preform into a glass product with a predetermined shape;gradually cooling the glass product and the closed assembly mold to a predetermined open temperature; andseparating the sub-molds to take the glass product out of the assembly mold.2. The glass molding method of claim 1 , wherein the glass molding temperature is higher than a glass transition temperature of the glass preform.3. The glass molding method of claim 1 , wherein each of the mold temperatures of the sub-molds is lower than the glass molding temperature.4. The glass molding method of claim 1 , wherein a molding force applied on the glass preform when the sub-molds are closed together is in a range of from about 0.1 million pascal to about 5 million pascal.5. The glass molding method of claim 1 , further comprising executing an annealing ...

Illumination system

The invention is an illumination system comprising a semiconductor light source module. The illumination system comprises a reflector comprising a curved reflective surface, a holder coupled to the reflector, and a semiconductor light source module comprising a first light-emitting unit and a second light-emitting unit. The holder comprises a second holding section and a first holding section disposed between the reflector and the second holding section. The semiconductor light-source module is disposed on the second holding section to face the curved reflective surface. An angle between at least a light-emitting unit and at least a part of the first holding section is formed and ranges from 145 to 175 degrees.

Metal Bumps and Method Forming Same

A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening. 1. A method of forming an integrated circuit structure , the method comprising:forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer;applying a polymer layer over the patterned passivation layer, wherein the polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and wherein the polymer layer comprises aliphatic amide as a solvent;performing a light-exposure process on the polymer layer;performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening;baking the polymer; andforming a conductive region comprising a via portion extending into the second opening.2. The method of claim 1 , wherein the polymer layer comprises alkoxy decane.3. The method of claim 1 , wherein the baking process is performed at a temperature in a range between about 120° C. and about 210° C.4. The method of claim 1 , wherein the via portion comprise:a straight sidewall;a straight bottom surface; anda round corner comprising a top end connecting to the straight sidewall, and a bottom end connecting to ...

LIGHT EMITTING APPARATUS

A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device. 1. A light emitting apparatus , comprising:a first light emitting device comprising:a first substrate having a first upper surface and a first bottom surface;a plurality of first LED chips disposed on the first upper surface and emitting a light penetrating the first substrate; anda first wavelength conversion layer directly contacting the plurality of first LED chips and the first upper surface, and having a first shape in a cross-sectional view; anda second wavelength conversion layer directly contacting first bottom surface, and having a second shape in the cross-sectional view, wherein the second shape is substantially the same as the first shape;a second light emitting device separated from the first light emitting device, and comprising a second substrate and a plurality of second LEDs disposed on the second substrate; anda support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; anda first ...

LIGHT-EMITTING DEVICE

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface. 1. A light-emitting device comprising:a light-emitting diode comprising:an active layer;a pad electrically connected to the active layer;a metal bump, formed on the pad, and having a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis; anda reflective insulation layer, directly contacting the first side surface, and exposing the first bottom surface.2. The light-emitting device of claim 1 , wherein the first side surface comprises a curved portion.3. The light-emitting device of claim 1 , further comprising a plurality of scratched lines formed on the metal bump and exposed in a bottom view of the light-emitting device.4. The light-emitting device of claim 1 , further comprising a plurality of scratched lines formed on the reflective insulation layer.5. The light-emitting device of claim 1 , further comprising a wavelength conversion layer formed on the reflective insulation layer and the light-emitting diode.6. The light-emitting device of claim 5 , wherein the wavelength conversion layer has a sidewall is substantially coplanar with the reflective insulation layer.7. The light-emitting device of claim 1 , wherein the metal bump includes a lead-free solder.8. The light-emitting device of claim 1 , wherein the pad comprises an area and the metal bump comprises a projection area projected to the area claim 1 , and the projection area is smaller than the area.9. The light- ...

NON-REPUDIATION IN DRM

A system and method is provided for non-repudiated evidence that a copied digital item received by a buyer is sent by a specific and authorized distributor, and the copy is uncorrupted and legitimate for sale by the distributor. Non-repudiated evidence is generated based on unique encryption keys and hash codes identifying a specific distributor and a specific digital item. Credential checking is performed by a distribution system operator which is also responsible for collecting funds directly or indirectly. A potential buyer of a digital item is enabled to produce a digital object to send to the system operator to authenticate a received digital item. By checking the distributor's credential, the system operator authenticates the distributor and sends back a transaction ID and an encryption key. Once the buyer has purchased the digital item, the buyer can then be authorized to be a distributor of the digital item. 1. A method for assuring authenticity of a seller and authenticity and integrity of a digital item to be sold in a transaction by the seller , with an operator , using computing devices over a communications network , comprising:creating by the seller a new symmetric encryption key for a new transaction;generating by the seller an encrypted digital item by encrypting the digital item by said symmetric encryption key;generating by the seller a hash code from said encrypted digital item;sending by the seller to the operator, said symmetric encryption key, said hash code, and a seller credential, and a digital-item credential to the operator;authenticating by the operator the seller with the received seller credential;authenticating by the operator the digital item with the received digital-item credential;generating by the operator a public-private encryption-decryption key pair for a new transaction, comprising a public key and a corresponding private key;generating by the operator a onetime transaction ID for the transaction;sending by the operator said ...

Semiconductor package and manufacturing method thereof

A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

WAFER CONTAINER AND METHOD FOR HOLDING WAFER

Provided is a wafer container including a frame and at least a pair of the stents. The frame has opposite sidewalls. The at least a pair of the stents is respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer. A method for holding at least one wafer is also provided. 1. A wafer container , comprising:a frame having opposite sidewalls; andat least a pair of the stents respectively disposed on the sidewalls of the frame, wherein the at least a pair of the stents is configured to provide at least three supporting points to support at least one wafer.2. The wafer container of claim 1 , wherein the pair of the stents comprises a first stent and a second stent opposite to each other claim 1 ,the first stent comprises a first comb structure, wherein the first comb structure comprises a first connection portion and a plurality of first comb portions connected to the first connection portion, andthe second stent comprises a second comb structure, wherein the second comb structure comprises a second connection portion and a plurality of second comb portions connected to the second connection portion.3. The wafer container of claim 2 , wherein the plurality of first comb portions are arranged to correspond to the plurality of second comb portions.4. The wafer container of claim 2 , wherein the plurality of first comb portions are arranged interleavingly with the plurality of second comb portions.5. The wafer container of claim 2 , wherein one of the plurality of first comb portions and the plurality of second comb portions comprises a pillar structure extending in a direction perpendicular to the sidewalls.6. The wafer container of claim 5 , wherein the pillar structure comprises a rectangular pillar structure claim 5 , a triangular pillar structure claim 5 , a polygonal pillar structure claim 5 , a circular pillar structure claim 5 , or a combination ...

POWER SUPPLY FAILOVER SYSTEM AND METHOD

A power supply failover system/method providing uninterruptable power to protected load devices (PLD) is disclosed. The system includes a failover switch controller (FSC) with inputs from an AC I/V monitor (AIV), AC cycle counter (ACC), failover switch timer (FST), and overcurrent protection timer (OPT). The FSC utilizes these inputs to control failsafe switching of a bypass phase switch (BPS) and AC phase switch (ACS) to the PLD when power from the APS is determined to be good by the AIV. When power from the APS is determined to be compromised by the AIV, the FPS disables the ACS/BPS and enables a DC switch (DCS) and battery isolation switch (BIS) to connect a DC source to the PLD after a time period determined by the FST. APS/DCS overcurrent protection is limited by OPT intervals allowing a smooth transition between the APS to DCS during power failover/failback. 1. A power supply failover system comprising:(a) failover switch controller (FSC);(b) AC current/voltage (I/V) monitor (AIV);(c) AC cycle counter (ACC);(d) failover switch timer (FST);(e) overcurrent protection timer (OPT);(f) manual bypass switch (MBS);(g) bypass phase switch (BPS);(h) bypass relay switch (BRS);(i) AC phase switch (ACS);(j) AC relay (ACR);(k) DC switch (DCS);(l) battery isolation switch (BIS);(m) AC power source (APS);(n) AC/DC battery charger (ABC);(o) DC battery power source (DBS);(p) battery overcurrent protection device (BOP); and(q) AC overcurrent protection device (AOP);wherein:said APS and said ACB are connected in series between a reference neutral connection (RNC) and an AC power node (APN);said MBS is connected in series with a protected load device (PLD) between said APS and said RNC;said series connection between said MBS and said PLD forming a protected load node (PLN) at the connection between said MBS and said PLD;said ACR is connected in series with said ACS between said APN and said PLN;said BRS is connected in series with said BPS between said APN and said PLN;said ABC ...

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS COMPRISING THE SAME

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip. 1. A light-emitting unit , comprising:an LED chip having a first top surface, a first bottom surface, and a first side surface arranged between the first top surface and the bottom surface;a wavelength conversion layer directly formed on the first top surface, and having a second top surface, a second bottom surface substantially coplanar with the first bottom surface, and a second side surface arranged between the second top surface and the second bottom surface;an optical diffusion layer directly formed on the wavelength conversion layer, and having a third side surface; anda reflective layer directly formed on the optical diffusion layer, and having a fourth side surface;wherein the second side surface, the third surface, and the fourth side surface are flush with each other.2. The light-emitting unit of claim 1 , wherein the second side surface is parallel to the first side surface.3. The light-emitting unit of claim 1 , wherein the wavelength conversion layer fully covers the first side surface.4. The light-emitting unit of claim 1 , wherein the light-emitting unit has a first light intensity in a lateral direction claim 1 , and a second light intensity in a vertical direction claim 1 , the second intensity is lower than the first light intensity by 10% or more.5. The light-emitting unit of claim 1 , wherein the first top surface is parallel to the second top surface.6. The light-emitting unit of claim 1 , wherein the second top surface is parallel to the second bottom surface.7. The light-emitting unit of claim 1 , further comprising a first bonding pad and a second bonding pad arranged on a same side of the first LED chip.8. A light- ...

Reactor for sewage treatment

A reactor for sewage treatment including: an inner layer including a water distribution zone; a middle layer including a biological aerated filter, the biological aerated filer including a wall and a bottom including a water outlet; and an outer layer including an artificial wetland, the artificial wetland including a bottom including a water inlet. The water distribution zone, the biological aerated filter, and the artificial wetland are in the shape of a circle. The sewage is introduced into the water distribution zone via a water inlet pipe. The water distribution zone communicates with the biological aerated filter via a first overflow. The water outlet arranged on the bottom of the biological aerated filer is connected to the water inlet arranged on the bottom of the artificial wetland to allow the biological aerated filter to communicate with the artificial wetland.

TRANSFERRING APPLICATION DATA BETWEEN DEVICES

Methods, systems, and apparatus are described for transferring application data between devices. In one aspect, a method includes causing, by a first service running on a first device, the first device to establish a wireless connection with a second device; receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service; determining, by the first service, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first service; receiving, by the first service, first application data from the first application; and causing, by the first service, the first device to send the first application data to the second service running on the second device using the wireless connection. 1. (canceled)2. A computer-implemented method , comprising:receiving over a first network, by a first application running on a first device, first application data for the first application;causing, by a first service running on the first device, the first device to establish a wireless connection with a second device, wherein the second device is unable to receive the first application data for the first application over the first network, and the wireless connection is a connection that is separate from the first network;receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service and the first service;determining, by the first service, that the first application installed on the first device matches one of the applications installed on the second device, the matching one of the applications being the first application, the first application being ...

TRANSFERRING APPLICATION DATA BETWEEN DEVICES

Methods, systems, and apparatus are described for transferring application data between devices. In one aspect, a method includes causing, by a first service running on a first device, the first device to establish a wireless connection with a second device; receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service; determining, by the first service, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first service; receiving, by the first service, first application data from the first application; and causing, by the first service, the first device to send the first application data to the second service running on the second device using the wireless connection. 1. A computer-implemented method , comprising:receiving, by a first application running on a first device, first application data for the first application;causing, by a first service running on the first device, the first device to establish a wireless connection with a second device;receiving, from a second service running on the second device, data specifying applications that are installed on the second device and supported by the second service, each of the applications being separate from the second service;determining, by the first service, that the first application installed on the first device matches one of the applications installed on the second device, wherein the first application is separate from the first service, and wherein the first application data has not been received by the second device;receiving, by the first service, the first application data from the first application; andcausing, by the first service, the first device to send the first application data to the second service running on the ...

Light-emitting device

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.

UNIVERSAL LOGIN AUTHENTICATION SERVICE

A system and method enables secure login at linked sites with a universal ID (UID) and possibly different or same password to linked identities. In such logins, a user stays at the linked login page, and the login name and password are sent to a UID provider for authentication. A UID provider may perform optional multi-factored authentication. A UID user is able to manage all his accounts, which are linked to his UID service, by changing the login names, passwords, security requirements, privacy requirements, and authentication requirements, with group-wise control. Successful or failed logins to linked accounts may be reported to a UID user. A UID user may disable logins at a group of linked accounts. 1. A machine-implemented method of third-party authentication with single-instance sign-on , comprising:linking one or more online services with an authentication service, each said online service referred to as a linked service;registering, by a user at the authentication service, one or more accounts (each account at a linked service), thereby each said account (referred to as an origin account) at a said linked service is linked to an account (referred to as a registered account) at the authentication service;setting, by the user at the authentication service, a stored login name and a stored password for a registered account, the login name referred to as a linked login name for the registered account, and the password referred to as a linked password for the registered account; and entering, by a user at the linked service, a login name and a password, for signing onto an origin account at the linked service;', 'forwarding, by the linked service, the login name and password, both entered by the user, to the authentication service, without redirecting the user away from the linked service;', 'after the forwarding, authenticating, by the authentication service, the user by verifying that the forwarded login name matches a linked login name for the registered ...

MULTI-LAYER STRUCTURES AND METHODS OF FORMING

A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other. 1. A method , comprising:depositing a plurality of layers on a substrate;patterning a first mask overlying the plurality of layers;performing a first etching process on the plurality of layers using the first mask as an etching mask, wherein after the first etching process the plurality of layers extend laterally beyond the first mask, and sidewalls of the plurality of layers are tapered;forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers;removing the polymer material, wherein the removing of the polymer material consumes a portion of the first mask to form a remaining first mask; andperforming a second etching process on the plurality of layers using the remaining first mask, wherein after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and wherein a first angle of the first portion and a second angle of the second portion are different.2. The method according to claim 1 , wherein the removing of the polymer material causes sidewalls of the first mask to be tapered.3. The method according to claim 1 , wherein the first angle is formed by the first portion with respect to a major ...

Semiconductor Package and Method

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner. 1. A semiconductor device , comprising:a first die, the first die comprising a chamfered corner;an encapsulant over a front-side surface of the first die, the encapsulant at least partially surrounding the first die;a redistribution structure on the encapsulant;a thermal interface material on the back-side surface of the first die;a thermal module thermally and physically coupled to the back-side surface of the first die with the thermal interface material; anda bolt extending through the redistribution structure and the thermal module, the bolt being adjacent to the chamfered corner.2. The semiconductor device of claim 1 , wherein the first die is an integrated circuit die.3. The semiconductor device of claim 1 , wherein the first die is a dummy die.4. The semiconductor device of claim 1 , wherein the first die comprises four chamfered corners.5. The semiconductor device of claim 1 , wherein the first die has only one chamfered corner.6. The semiconductor device of claim 1 , wherein the chamfered corner comprises a straight line shape.7. The semiconductor device of claim 1 , wherein the chamfered corner comprises a concave shape.8. The semiconductor device of claim 1 , wherein the chamfered corner comprises a convex shape.9. The semiconductor device of claim 1 , wherein the chamfered corner comprises an inverted corner.10. A packaged semiconductor device claim 1 , comprising:a first chamfered corner on a first die;a second chamfered corner on a second die;a third chamfered corner on a third die;a fourth chamfered corner on a fourth die;a redistribution structure over the first die, the second die, the ...

PLL FREQUENCY SYNTHESIZER WITH MULTI-CURVE VCO IMPLEMENTING CLOSED LOOP CURVE SEARCHING

A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a set of operating curves, each operating curve corresponding to a different frequency range over a control voltage range. The phase-locked loop circuit includes a digital control circuit configured to generate a curve select signal using a closed loop curve search operation to select one of the operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop. In one embodiment, the digital control circuit implements a binary jump method and an operating curve is selected when the operating curve has an output frequency meeting the target frequency with the control voltage being within a first voltage range being a narrowed and centered voltage range within the control voltage range. 1. A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a plurality of operating curves , each operating curve corresponding to a different frequency range over a control voltage range , the phase-locked loop configured to receive an input signal having a reference frequency and to generate a control voltage to control the multi-curve VCO to generate an output signal using the one of the plurality of operating curves , the output signal having a fixed relation to the phase of the input signal , the phase-locked loop circuit comprises:a digital control circuit configured to generate a curve select signal using a closed loop to curve search operation to select one of the plurality of operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop,wherein the digital control circuit implements a binary jump method for choosing one or more operating curves from the ...

LIGHT-EMITTING DIODE CHIP

A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesses corresponding to the plurality of indentations. 1. A light-emitting diode (LED) chip , comprising:a first semiconductor layer;an active layer disposed on the first semiconductor layer;a second semiconductor layer disposed on the active layer;a plurality of indentations, wherein each indentation extends downward to reach the first semiconductor layer and exposes the first semiconductor layer, wherein each indentation comprises a bottom part and two side surfaces in a cross sectional view;an exposing area exposing the first semiconductor layer at a side of the LED chip;a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; anda first insulating layer formed on the second semiconductor layer and between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer;wherein the first metal layer continuously extends to the plurality ...

SUPPLYING SYSTEM OF ADDING GAS INTO POLISHING SLURRY AND METHOD THEREOF

A supplying system of adding gas into the polishing slurry and method thereof are described. The supplying system includes a slurry container, a gas-mixed container, an adjusting device, a first flow controller, and a second flow controller. The supplying system utilizes the adjusting device to mix the polishing slurry with gas for forming the gas-mixed polishing slurry. The supplying system of adding the gas into the polishing slurry and method thereof are capable of increasing the material removal rate of the surface of the substrate in order to improve the processing quality of the substrate. 1. A supplying system of adding a gas into a polishing slurry , which is applicable to a planarization process apparatus to be used in a substrate , for polishing the substrate , the supplying system comprising:a slurry container, for storing the polishing slurry;a gas-mixed container connected to the slurry container, for receiving the polishing slurry;a gas container, for storing the gas and transporting the gas to the gas-mixed container;an adjusting device connecting the gas-mixed container to the gas container, for controlling the gas container to transport the gas with a predetermined flow rate to the gas-mixed container; anda first flow controller connected to the gas-mixed container, for controlling the gas-mixed container to output a gas-mixed polishing slurry into the planarization process apparatus to allow the planarization process apparatus for polishing the substrate by using the supplying system when the gas is dissolved in the polishing slurry to form the gas-mixed polishing slurry.2. The supplying system of claim 1 , further comprising a pressure gauge connected to the gas-mixed container claim 1 , for displaying a first pressure value of the gas stored in the gas-mixed container.3. The supplying system of claim 1 , further comprising a gas sensor connected to the gas-mixed container claim 1 , for sensing a gas content of the gas-mixed polishing slurry ...

HUB TV DISTRIBUTED SYSTEM

A method and system, called Hub-TV system, allows a mass of consumers who individually owns a private infrastructure to share the burden of storing, searching, authentication, and delivery of digital media items, for the purpose of selling and distributing digital items over the Internet. The consumer may have previously purchased a media item and is compensated for contributing to redistribute the media item through his private infrastructure, which comprises server resources, storage resources, and bandwidth resources. A platform provider of a Hub-TV system provides the control and management functions to ensure that a plurality of broker agents, a plurality of delivery agents, a plurality of payment agents, and a mass of consumer-distributors, are compensated for their services in the Hub-TV system. 111.-. (canceled)12. A machine-implemented method to sell or resell digital media items over the Internet , through an infrastructure referred to as the Hub-TV system , comprising:one or more platform providers, each platform provider being called a PP;a large number of consumer-distributors, each consumer-distributor being called a CD;a plurality of broker agents, each broker agent being called a BA;a plurality of payment agents, each payment agent being called a PA;a plurality of delivery agents, each delivery agent being called a DA;wherein control and management functions of the Hub-TV system are provided by a control infrastructure, comprising infrastructures of the PPs;wherein delivery functions of the Hub-TV system are provided by a delivery infrastructure, comprising infrastructures of the DAs and the CDs;wherein sales functions of the Hub-TV system are provided by a sales infrastructure, comprising infrastructures of the BAs and their storefronts;wherein payment functions of the Hub-TV system are provided by a payment infrastructure, comprising infrastructures of the PAs;wherein a CD pays for a private infrastructure comprising storage resources, server ...

LIGHT EMITTING DEVICE

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. 1. A light-emitting device comprising:a substrate, comprising a top surface, and a bottom surface opposite to the top surface; anda plurality of LED chips, disposed on the top surface, and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces;wherein the substrate is pervious to the bottom light;wherein the top light and the bottom light have a color temperature difference of not greater than 1500K.2. The light-emitting device of claim 1 , further comprising a first conductor and a second conductor located on the substrate and electrically connected to the plurality of LED chips.3. The light-emitting device of claim 2 , wherein the each LED chip comprises a first electrode and a second electrode electrically connected to the first conductor and the second conductor respectively.4. The light-emitting device of claim 1 , further comprising a wavelength conversion layer covering the top surface and the bottom surface.5. The light-emitting device of claim 4 , wherein the wavelength conversion layer directly contacts the plurality of LED chips.6. The light-emitting device of claim 4 , wherein the wavelength conversion layer comprises one or more kinds of fluorescent powders.7. The light-emitting device of claim 1 , wherein the substrate has a ...

PLL FREQUENCY SYNTHESIZER WITH MULTI-CURVE VCO IMPLEMENTING CLOSED LOOP CURVE SEARCHING USING CHARGE PUMP CURRENT MODULATION

A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a set of operating curves, each operating curve corresponding to a different frequency range over a control voltage range. The phase-locked loop circuit includes a phase and frequency detector driving a charge pump and a digital control circuit configured to generate a curve select signal using a closed loop curve search operation to select one of the operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop. In one embodiment, the digital control circuit increases the charge pump current above a nominal current value during the closed loop curve search operation and set the charge pump current to the nominal current value after an operating curve is selected. 1. A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a plurality of operating curves , each operating curve corresponding to a different frequency range over a control voltage range , the phase-locked loop configured to receive an input signal having a reference frequency and to generate a control voltage to control the multi-curve VCO to generate an output signal using the one of the plurality of operating curves , the output signal having a fixed relation to the phase of the input signal , the phase-locked loop circuit comprises:a phase and frequency detector configured to receive the input signal and a feedback signal and generate one or more control signals for controlling a charge pump in response to the phase difference between the input signal and the feedback signal, the feedback signal being related to the output signal, the charge pump providing a charge pump current to drive a control voltage node to generate the control voltage to control the multi-curve VCO; anda digital control circuit configured to generate a ...

PLL FREQUENCY SYNTHESIZER WITH MULTI-CURVE VCO IMPLEMENTING CLOSED LOOP CURVE SEARCHING

A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a set of operating curves, each operating curve corresponding to a different frequency range over a control voltage range. The phase-locked loop circuit includes a digital control circuit configured to generate a curve select signal using a closed loop curve search operation to select one of the operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop. In one embodiment, the digital control circuit implements a binary jump method and an operating curve is selected when the operating curve has an output frequency meeting the target frequency with the control voltage being within a first voltage range being a narrowed and centered voltage range within the control voltage range. 1. A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a plurality of operating curves , each operating curve corresponding to a different frequency range over a control voltage range , the phase-locked loop configured to receive an input signal having a reference frequency and to generate a control voltage to control the multi-curve VCO to generate an output signal using the one of the plurality of operating curves , the output signal having a fixed relation to the phase of the input signal , the phase-locked loop circuit comprises:a digital control circuit configured to generate a curve select signal using a closed loop curve search operation to select one of the plurality of operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop,wherein the digital control circuit implements a binary jump method for choosing one or more operating curves from the ...

Multi-Layer Structures and Methods of Forming

A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

RESONANT DC/DC CONVERTER

Disclosed is a resonant DC/DC converter, comprising a DC source unit, a power conversion unit, a control unit and an output rectification unit, wherein the power conversion unit comprises a resonance circuit and at least a phase-shift circuit, the phase-shift circuit comprises at least a pair of first switching elements S S and a phase-shift inductance La, one end of the phase-shift inductance is connected with the bridge node of the first switching element S S and the other end is coupled to the resonance circuit; the control unit drives each switching element of the power conversion unit, and the switching frequency and the phase shifting angle of the first switching element are calculated according to the feedback signals of the output rectification unit. Further, the resonant DC/DC converter is applicable to series connection solution, which can be extended to more than two circuits in parallel, to achieve intersection; and a phase-shift circuit is added in the resonant DC/DC converter and by adjusting the phase shift angle to drop the output voltage and achieve the adjustment of a wide range of output voltage of the resonant circuit. 11212. A resonant DC/DC converter , comprising a DC source unit , a power conversion unit , a control unit and an output rectification unit , the DC source unit is connected with the power conversion unit so as to provide energy for the power conversion unit; wherein the power conversion unit comprises a resonance circuit and at least a phase-shift circuit , the phase-shift circuit comprises at least a pair of first switching elements S , S and a phase-shift inductance La , one end of the phase-shift inductance is connected with the bridge node of the first switching element S , S , and the other end is coupled to the resonance circuit; the control unit drives each switching element of the power conversion unit , and the switching frequency and the phase shifting angle of the first switching element are calculated according to the ...

POWER SUPPLY APPARATUS AND POWER SUPPLY METHOD

A power supply method and a power supply apparatus including a power conversion circuit, a first and a second switching circuit, and a control circuit are provided. The power conversion circuit is coupled between a DC power source and a power supply terminal and performs a boosting operation according to a DC voltage of the DC power source to generate a boost voltage. The first switching circuit is coupled between an AC power source and the power supply terminal. The second switching circuit is coupled between the power conversion circuit and the power supply terminal. The control circuit enters a first mode after turning on the first and the second switching circuit, so the first switching circuit transmits a main AC voltage of the AC power source to the power supply terminal in the first mode. The boost voltage is greater than a peak value of the main AC voltage. 1. A power supply apparatus , comprising:a power conversion circuit coupled between a DC power source and a power supply terminal and configured to perform a boosting operation according to a DC voltage of the DC power source to generate a boost voltage;a first switching circuit coupled between an AC power source and the power supply terminal;a second switching circuit coupled between the power conversion circuit and the power supply terminal; anda control circuit coupled to the power conversion circuit, the first switching circuit and the second switching circuit, wherein the control circuit enters a first mode after turning on the first switching circuit and the second switching circuit, so that the first switching circuit transmits a main AC voltage of the AC power source to the power supply terminal in the first mode,wherein a voltage value of the boost voltage is greater than a peak value of the main AC voltage.2. The power supply apparatus according to claim 1 , whereinin the first mode, the control circuit determines whether the power conversion circuit is abnormal, and if the control circuit ...

QR SYSTEM FOR BUSINESS CARDS

A method and system to digitize printed information on a business card and to link the digitized data to a social networking service, referred to as a Meeting-Spot (or simply an MSP) service, employs quick response codes (QRCs) to uniquely identify business cards printed with a QRC. 2. The method and system of claim 1 , wherein the said identifier is a UUID (universal unique identifier) claim 1 , which complies with the identifier standard set by the Open Software Foundation (OSF).3. The method and system of claim 2 , wherein the said identifier is optionally replaced by a proprietary hash code that can uniquely identify a business card.4. The method and system of claim 3 , wherein the data encoded in the QRC claim 3 , which is printed on an MSP business card claim 3 , may further comprise a company-ID claim 3 , which identifies the company or organization whose name is printed on said MSP business card.5. The method and system of claim 4 , wherein said MSP service maintains a contact database claim 4 , in which an individual data item in the database is referred to as a contact data item; wherein each contact data item corresponds to a unique business card claim 4 , and comprises at least the name of the cardholder of a business card claim 4 , the name of the company or organization printed on the said business card claim 4 , and contact information printed on the said business card.6. The method and system of claim 5 , wherein an MSP app on a mobile device maintains a local database of contact data items for a member of the MSP service; wherein a contact data item stored at said local database in a mobile device is similar to a contact data item stored in the database at said MSP service; wherein a contact data item stored by the MSP app may further comprise additional personal notes or other information claim 5 , which is not stored in the corresponding contact data item stored at the MSP service.7. The method and system of claim 6 , wherein a contact data item ...

BYZANTINE FAULT-TOLERANT ALGORITHM WITH FOUR STEPS

A method of adding a new block to a blockchain system with a plurality of system nodes, with the purpose of recording a set of submitted transactions in the face of Byzantine faults, based on data consistency among the system nodes. Upon receiving a set of submitted transactions (this set of transactions to be recorded in a new block in the blockchain), each system node generates a digital representation of the set of submitted transactions. The digital representations at the system nodes are made consistent among the system nodes, thereby a submitted transaction is determined to be included in the new block based on the synchronized digital representations at the system nodes. 1. A blockchain system with a plurality of system nodes , each node maintaining a blockchain of the system , the system employing a method of building or adding a new block , with the purpose of recording or accepting a set of submitted transactions which is received at least a majority of the system nodes , to the blockchain system , comprising:Step (I): each system node generates a digital representation, the digital representation indicating all said submitted transactions received at the node, and sends the digital representation to all other system nodes;Step (II): each system node, based on digital representations received at the node, modifies its digital representation generated in step (I), so that if at least a fixed portion of all system nodes has indicated a particular said submitted transaction, the modified digital representation at the node also indicates the particular said submitted transaction;Step (III): a new block is built based on the modified digital representation at a system node, so that a submitted transaction is included in the new block only if it is also indicated in the modified digital representation;Step (IV): the blockchain system adds a new block only if the new block is built in accordance with step (III).2. The blockchain system of claim 1 , wherein the ...

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS COMPRISING THE SAME

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip. 1. A method of manufacturing a light-emitting device , comprising:arranging a plurality of light-emitting packages on a carrier, each light-emitting package comprising a light-emitting chip and an encapsulating layer covering the light-emitting chip;providing a covering sheet which is uncured and has a uniform thickness, to cover the plurality of light-emitting packages; andcuring the covering sheet provided on the plurality of light-emitting packages,wherein the encapsulating layer has a side surface and a first top surface, andwherein after the curing step, the covering sheet contacts the side surface and the first top surface.2. The method of claim 1 , further comprising a step of arranging an adhesive layer under the carrier.3. The method of claim 1 , wherein after the curing step claim 1 , the covering sheet contacts the carrier.4. The method of claim 1 , wherein the each of the light-emitting chips has a lateral surface and a second top surface claim 1 , the encapsulating layer contacts the lateral surface and the second top surface.5. The method of claim 1 , wherein the covering sheet contacts the encapsulating layer without reaching the light-emitting chip.6. The method of claim 1 , wherein the encapsulating layer includes a wavelength conversion layer.7. The method of claim 1 , wherein the encapsulating layer includes a light-transmitting material.8. The method of claim 1 , wherein the carrier comprises a flexible material.9. The method of claim 1 , wherein the side surface is perpendicular to the carrier.10. The method of claim 1 , wherein the covering sheet includes silicone or epoxy. This application is a continuation application of ...

Micro-connection structure and manufacturing method thereof

A micro-connection structure is provided. The micro-connection structure includes an under bump metallurgy (UBM) pad, a bump and an insulating ring. The UBM pad is electrically connected to at least one metallic contact of a substrate. The bump is disposed on the UBM pad and electrically connected with the UBM pad. The insulating ring surrounds the bump and the UBM pad. The bump is separate from the insulating ring with a distance and the bump is isolated by a gap between the insulating ring and the bump.

HOME-HUB PRIVATE CLOUD

A method and system to architect a private cloud, called a Home-Hub system, so that a user is given sufficient control over data stored in a Home-Hub system over a home or small-business network. A Home-Hub system comprises a home or office network, and 2 types of devices directly attached to the network: Hub devices and Branch devices. A Hub device is a wireless access point and a storage node. A Hub device is a central node for data exchange in a home network. A Branch device is a terminal, relay or peer node. 2. The method of claim 1 , wherein a Hub device or a Branch device may be implemented by integrating Hub or Branch functionalities into a common home or office electronic device claim 1 , while these devices including claim 1 , but not restricted to: TV sets claim 1 , routers claim 1 , switches claim 1 , wireless APs claim 1 , TV set-top boxes claim 1 , home gateway nodes claim 1 , game boxes claim 1 , personal computers claim 1 , and server computers.3. The method of claim 2 , wherein one or more of the following components may be present in a Hub or Branch device: (1) a digital storage device; (2) a wireless AP or terminal; (3); a positioning device such as a GPS (global positioning system) receiver; (4) one or more (wireless or fixed-line) modems connecting to the Internet; (5) a NDVR (network digital video recorder); (6) software that provides data sync and data backup; (7) an OS for a home cloud; and (8) a display unit.4. The method of claim 3 , wherein a Home-Hub system provides an API (application program interface) or an inter-app software mechanism to allow third-party apps to utilize the native services provided by the Home-Hub system OS claim 3 , while said services provided by Home-Hub OS may include data sync claim 3 , data backup claim 3 , data transfer claim 3 , data security claim 3 , and data secrecy (privacy).5. The method of claim 4 , wherein a plurality of Home-Hub systems form a Home-Hub community claim 4 , in which a user of a said Home ...

Separation of transaction and account data in blockchains

A method of for improving performance scalability of an application blockchain system in which application data are organized according to accounts, and changes in application data are caused by account transactions. A composite blockchain system comprises 2 types of subsystem blockchains: an ABC (account blockchain) type stores detailed account data for a set of accounts, and a TBC (transaction blockchain) type stores data necessary to perform account transactions for a set of accounts. A TBC chain writes account data into an ABC chain, and a TBC chain reads account data from an ABC chain.

TRANSFERRING APPLICATION DATA BETWEEN DEVICES

Methods, systems, and apparatus are described for transferring application data. In one aspect, a method includes causing, by a first component on a first device to establish a wireless connection with a second device; receiving, from a second component on the second device, data specifying one or more applications that are installed on the second device and supported by the second component, each of the applications being separate from the second component; determining, by the first component, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first component; receiving, by the first component, first application data from the first application; and causing, by the first component, the first device to send the first application data to the second component running on the second device using the wireless connection. 1. A computer-implemented method , comprising:causing, using a first component on a first device, the first device to establish a wireless connection with a second device, wherein the wireless connection is a connection that is separate from an Internet connection, and wherein the first device is unable to communicate with the second device via the Internet connection;receiving, from a second component on the second device, data specifying one or more applications that are installed on the second device and supported by the second component, each of the applications being separate from the second component and the first component;determining, by the first component, that a first application installed on the first device matches one of the applications installed on the second device, wherein the first application is separate from the first component and has first application data to be shared;receiving, by the first component, the first application data from the first application; andcausing, by the first component, the first device to send the ...

LIGHT EMITTING DEVICE

A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 μm and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

Secure Universal Two-Step Payment Authorization System

A system and methods expedite and make secure payment data entry, and payment and authorization and authorization, for both in-store and online purchases. A mobile app, or widget or browser extension or installed service, on a mobile communication device, generates a barcode to be scanned at a point-of-sale terminal. Optional confirmation is sent to an app, or browser extension or widget or installed service, on a mobile or fixed communication device, to confirm a purchase. An independent app, or browser extension or widget or installed service, on a mobile or fixed communication device, generates a barcode that is sent directly to an online point-of-sale system. The method allows a purchaser to use the same app, or widget or browser extension or installed service, to purchase from any retailer with installed collaborating software. 2. The method of claim 1 , wherein the POS system storing the generated barcode for each purchase without storing any other form of payment card data for said purchase.3. The method of claim 2 , wherein the USA server system storing the generated barcode for each purchase without storing any other form of payment card data for said purchase.4. The method of claim 1 , wherein biometric data from a said purchaser being required as an option for payment authentication and authorization through a fixed or mobile communication device or a wearable device.5. The method of claim 1 , wherein the USA server system making payment authentication and authorization request directly to a payment system operator.6. The method of claim 1 , wherein claim 1 , the barcode generated for each purchase being an encoded UUID (universally unique identifier).7. The method of claim 6 , wherein the encoded UUID for each purchase being encrypted with a onetime encryption key.8. The method of claim 1 , wherein confirmation from a said purchaser being required for payment authentication and authorization when and if the purchase amount is greater than a fixed ...

Connector with variable contour

The plug connector includes an insulative housing and a terminal module wherein the terminal module is able to be moveable relative to the housing via sliding or rotation or translation or even detachment so as to have the front mating portion of the terminal module independently mated with the thin receptacle connector or cooperate with the housing to be mated with the regular RJ-45 modular jack.

UNIVERSAL LOGIN AUTHENTICATION SERVICE

A system and method enables secure login at linked sites with a universal ID (UID) and possibly different or same password to linked identities. In such logins, a user stays at the linked login page, and the login name and password are sent to a UID provider for authentication. A UID provider may perform optional multi-factored authentication. A UID user is able to manage all his accounts, which are linked to his UID service, by changing the login names, passwords, security requirements, privacy requirements, and authentication requirements, with group-wise control. Successful or failed logins to linked accounts may be reported to a UID user. A UID user may disable logins at a group of linked accounts. 2. The method of claim 1 , wherein claim 1 , a UID user being allowed to group linked sites or accounts claim 1 , registered under his UID account claim 1 , according to categories specified by said UID user; a UID user assigning same or different login names for different groups of registered linked sites or accounts; a UID user assigning same or different passwords for different groups of registered sites or linked accounts.3. The method of claim 1 , wherein communications between a UID user claim 1 , a linked site claim 1 , and a UID provider being encrypted with standard or common encryption technology;optionally, a one-time symmetric key being employed to encrypt data in a message.4. The method of claim 1 , wherein a linked site or a UID provider reporting failed or successful logins at a linked account to a UID user.5. The method of claim 1 , wherein a UID user being allowed to disable login at a group of linked accounts.6. The method of claim 1 , wherein a UID user being allowed to disable second-factor or third factor authentication requirement for a group of linked accounts.7. A method of claim 2 , wherein a UID user being allowed to specify security claim 2 , privacy claim 2 , and authentication requirements for each group of linked sites or accounts claim 2 ...

Wire joint and manufacturing method thereof

Disclosed are a wire joint and a manufacturing method thereof. The wire joint includes a wire and a joint; the wire includes a plurality of strands of core wires and a first wire skin, each strand of the core wires is wrapped by the first wire skin, the first wire skin outside the each strand of the core wires is stripped within a threshold interval, the each strand of the core wires in the threshold interval is subjected to a tin-impregnation treatment, and an insulating wire fastener is provided between the each strand of the core wires in the threshold interval; the joint includes a connection section and an extraposition section, the insulating wire fastener is wrapped in the extraposition section, and the connection section is connected at one end of the extraposition section and wraps outside the first wire skin of the plurality of strands of core wires.

5-WAY TCP OPTIMIZATION

A system and method optimizes the response speed and throughput of TCP sessions for web browsing or large-file applications. TCP sessions are classified into long and short sessions, and steered to designated devices for TCP and application optimization. A TCP session may send packets as fast as possible without regard to the ACK packets. TCP termination is applied at a point where the available bandwidth on one side of a path is significantly larger than the available bandwidth of the path on the other side. TCP sessions are classified according to groups and each group is optimized separately.

SEMICONDUCTOR COMPONENT AND LIGHT EMITTING DEVICE USING SAME

A semiconductor component including a Wheatstone bridge rectifying circuit and a transistor is provided, wherein the Wheatstone bridge rectifying circuit and the transistor are formed on a same growth substrate, and wherein the Wheatstone bridge rectifying circuit includes a first rectifying diode; a second rectifying diode electrically connected to the first rectifying diode; a third rectifying diode electrically connected to the second rectifying diode; and a fourth rectifying diode electrically connected to the third rectifying diode. 1. A semiconductor component , comprising:a growth substrate; a first first semiconductor layer;', 'a second semiconductor layer formed on the first first semiconductor layer;', 'a third semiconductor layer formed on the second semiconductor layer;', 'a gate electrode, a drain electrode, and a source electrode formed on the third semiconductor layer; and', a first rectifying diode;', 'a second rectifying diode electrically connected to the first rectifying diode;', 'a third rectifying diode electrically connected to the second rectifying diode; and', 'a fourth rectifying diode electrically connected to the third rectifying diode., 'a Wheatstone bridge rectifying circuit formed on the growth substrate, comprising], 'a first transistor formed on the growth substrate, comprising2. The semiconductor component of claim 1 , wherein each of the first rectifying diode claim 1 , the second rectifying diode claim 1 , the third rectifying diode claim 1 , and the fourth rectifying diode further comprises a cathode electrode and an anode electrode.3. The semiconductor component of claim 2 , further comprising a first light emitting diode formed on the growth substrate claim 2 , and the first light emitting diode comprising:a second first semiconductor layer;an active layer formed on the second first semiconductor layer; anda fourth semiconductor layer formed on the active layer.4. The semiconductor component of claim 1 , wherein the material of ...

LIGHT EMITTING DEVICE

The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180° , and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance. 1. A light-emitting apparatus comprising:a lamp housing defining a geometric center axis;a first light-emitting device comprising a first substrate with a first front surface, a first rear surface opposite to the first front surface, and a first side surface extending between the first front surface and the first rear surface, and a first light-emitting diode chip disposed on the first front surface; anda second light-emitting device comprising a second substrate with a second front surface, a second rear surface opposite to the second front surface, and a second side surface extending between the second front surface and the second rear surface, and a second light-emitting diode chip disposed on the second front surface;wherein the first side surface and the second side surface are arranged to point toward the geometric center axis.2. The light-emitting apparatus of claim 1 , further comprising a first wavelength conversion layer covering the first front surface and a second wavelength conversion layer covering the second front surface.3. The light-emitting apparatus of claim 2 , wherein the first substrate comprises a first end portion and a second end portion not covered by the first wavelength conversion layer.4. The light-emitting apparatus of claim 2 , wherein the first side surface is not covered by the first wavelength conversion layer claim 2 , the second side ...

FEDERATED CACHE NETWORK

A system and method, called federated cache network (FCN), places and optimizes content caches located in an access or backhaul network of a network service provider or multiple system operator. A FCN comprises a trunk cache and a plurality of branch caches and leaf caches. In a mobile carrier network, the mobility management entity (MME) informs a TCP termination device that a mobile device is moving toward a new base station. The live and terminated TCP sessions associated with a mobile terminal that is moving to a new base station are copied and re-terminated at the new base station, in anticipation of a possible handoff. 2. The method of claim 1 , wherein the trunk cache has a capacity roughly equal to the sum of capacities of all directly connected (the path between the 2 caches does not go through a 3FCN cache) downstream said branch and leaf caches; each said branch cache has a capacity roughly equal to the sum of all capacities of all directly connected downstream said branch and leaf caches.3. The method of claim 2 , wherein the content of the trunk cache is roughly the aggregate of contents in all the directly connected downstream branch and leaf caches; the content of each said branch cache is roughly the aggregate of all contents in all the directly connected downstream branch and leaf caches.4. The method of claim 3 , wherein the said trunk cache is located at a gateway or hub between the core network and said access or backhaul network; a said branch cache is located at a gateway or hub between a regional service area and the core network; a said branch or a leaf cache is located at a base transmission station or access point.5. The method of claim 3 , wherein the said trunk cache is located at a gateway or hub between the core network and said access or backhaul network; a said branch cache is located at a gateway or hub between a regional service area and the core network; a said branch or a leaf cache is located at a local distribution hub or ...

LIGHT-EMITTING DIODE CHIP

A light-emitting diode (LED) chip including a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on said active layer; at least one indentation comprising a bottom part extending downward to reach the first semiconductor layer and exposing the first semiconductor layer; a first metal layer disposed on the second semiconductor layer, connecting to the first semiconductor layer at the bottom part of the indention; 1. A light-emitting diode (LED) chip comprising:a first semiconductor layer;an active layer disposed on the first semiconductor layer;a second semiconductor layer disposed on the active layer;at least one indentation comprising a bottom part extending downward to reach the first semiconductor layer and exposing the first semiconductor layer;a first metal layer disposed on the second semiconductor layer, connecting to the first semiconductor layer at the bottom part of the indention; andan first insulating layer deposited on the second semiconductor layer and between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer.2. The LED chip as claimed in claim 1 , further comprising a second metal layer disposed on the second semiconductor layer and partially overlapped with the first metal layer.3. The LED chip as claimed in claim 1 , further comprising a plurality of the indentations distributed over a surface of the LED chip.4. The LED chip as claimed in claim 2 , further comprising a second insulating layer disposed on the first metal layer and between the first metal layer and the second metal layer to isolate the first metal layer from the second metal layer.5. The LED chip as claimed in claim 1 , further comprising a transparent conductive layer deposited on the second semiconductor layer.6. The LED chip as claimed in claim 1 , wherein the first insulating layer is disposed along side surfaces of the indentation.7. ...

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING APPARATUS COMPRISING THE SAME

The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip. 1. A light-emitting device , comprising:a first light-emitting unit, comprising,an LED chip having a first top surface, a bottom surface, and a side surface arranged between the first top surface and the bottom surface;a first reflective layer arranged on the LED chip and having a second top surface substantially parallel with the first top surface from a first edge to a second edge of the second top surface; andan optical diffusion layer formed between the first reflective layer and the first LED chip; anda flexible carrier facing the bottom surface and supporting the first light-emitting unit.2. The light-emitting device of claim 1 , wherein the flexible carrier comprises hyper-polyvinylidene fluoride.3. The light-emitting device of claim 1 , wherein the light-emitting device has an illumination uniformity larger than 80% claim 1 , and the illumination uniformity is measured at a measuring point with an offset angle between 30° and 90° claim 1 , the offset angle is measured with respect to a virtual line normal to a top surface of the light-emitting device claim 1 , is larger than 80%.4. The light-emitting device of claim 1 , wherein the first light-emitting unit has an light intensity increasing at a range of the offset angle between 0° and 30° and decreasing at a rage of the offset angle between 40° and 70° further comprises a wavelength conversion layer between the LED chip and the optical diffusion layer.5. The light-emitting device of claim 1 , wherein the flexible carrier has a transparency larger than 90% and a glass transition temperature larger than 160° C.6. The light-emitting device of claim 1 , wherein the flexible carrier has a ...

Terminal Bending Tool

A terminal bending tool comprises a plate, a plurality of receiving grooves, and a plurality of rollers. The plate extends in a first horizontal direction. The receiving grooves are disposed in the plate in a row along the first horizontal direction. The rollers are pivotally mounted in the receiving grooves. A terminal is received and positioned in a first receiving groove and is in contact with an outer circumferential surface of a first roller. When the terminal bending tool is moved in a vertical direction perpendicular to the first horizontal direction, the first roller rotates and moves along a surface of the terminal while pressing and bending the terminal.

Method for forming semiconductor structure having through silicon via for signal and shielding structure

A method for forming a through silicon via for signal and a shielding structure is provided. A substrate is provided and a region is defined on the substrate. A radio frequency (RF) circuit is formed in the region on the substrate. A through silicon trench (TST) and a through silicon via (TSV) are formed simultaneously, wherein the TST encompasses the region to serve as a shielding structure for the RF circuit. A metal interconnection system is formed on the substrate, wherein the metal interconnection system comprises a connection unit that electrically connects the TSV to the RF circuit to provide a voltage signal.

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

A semiconductor device includes semiconductor dies and a redistribution structure. The semiconductor dies are encapsulated in an encapsulant. The redistribution structure extends on the encapsulant and electrically connects the semiconductor dies. The redistribution structure includes dielectric layers and redistribution conductive layers alternately stacked. An outermost dielectric layer of the dielectric layers further away from the semiconductor dies is made of a first material. A first dielectric layer of the dielectric layers on which the outermost dielectric layer extends is made of a second material different from the first material. The first material includes at least one material selected from the group consisting of an epoxy resin, a phenolic resin, a polybenzooxazole, and a polyimide having a curing temperature lower than 250° C. 1. A semiconductor device , comprising:semiconductor dies encapsulated in an encapsulant; anda redistribution structure, extending on the encapsulant and electrically connecting the semiconductor dies,wherein the redistribution structure comprises dielectric layers and redistribution conductive layers alternately stacked,an outermost dielectric layer of the dielectric layers further away from the semiconductor dies is made of a first material,a first dielectric layer of the dielectric layers on which the outermost dielectric layer extends is made of a second material different from the first material, andthe first material comprises at least one material selected from the group consisting of an epoxy resin, a phenolic resin, a polybenzooxazole, and a polyimide having a curing temperature lower than 250° C.2. The semiconductor device of claim 1 , wherein a tensile stress of the first material is at least 1.5 times a tensile stress of the second material.3. The semiconductor device of claim 1 , wherein the second material comprises an epoxy resin having fillers dispersed therein.4. The semiconductor device of claim 1 , further ...

System for bypassing a server to achieve higher throughput between data network and data storage system

A networked system in which the majority of data bypass the server (101) to improve end-to-end performance of network access by achieving higher throughput between the network (130) and storage system (110). The apparatus consists of a network interface (120), server computer interface (240), and storage interface (250); and a switching element (201) and a high-layer protocol decoding and control unit (205). Incoming traffic is decoded and compared against a routing table. If there is a matching entry, it will be routed to the storage interface or sent to the server for further processing by default. The routing table entries are set up based on the initial nature of the applications. Subsequently, barring any changes or errors, there will be no data exchange between the server and the device. There may also be a speed matching funcion between the network and storage, load balancing function for servers, and flow control for priority and QOS purposes.

Method and apparatus for rain removal based on a single image

ENERGY STORAGE DEVICE AND METHOD THEREOF FOR SUPPLYING POWER

An energy storage device and a method thereof are provided. The power transfer circuit transfers a DC voltage provided by a battery module into an AC output voltage to provide the AC output voltage to an output end of the power transfer circuit for providing power to a load. When the AC output voltage is at a default phase, the power transfer circuit is disabled in a default period, and whether the energy storage device may be shut down is determined according to a voltage difference of the AC output voltage sensed by a sensing circuit during the default period.

PLL frequency synthesizer with multi-curve VCO implementing closed loop curve searching

A phase-locked loop circuit using a multi-curve voltage-controlled oscillator (VCO) having a set of operating curves, each operating curve corresponding to a different frequency range over a control voltage range. The phase-locked loop circuit includes a digital control circuit configured to generate a curve select signal using a closed loop curve search operation to select one of the operating curves in the multi-curve VCO, the selected operating curve being used by the VCO to generate an output signal with an output frequency being equal or close to a target frequency of the phase-locked loop. In one embodiment, the digital control circuit implements a binary jump method and an operating curve is selected when the operating curve has an output frequency meeting the target frequency with the control voltage being within a first voltage range being a narrowed and centered voltage range within the control voltage range.

Endolysosomal targeting conjugates for improved delivery of cargo molecules to the endolysosomal compartment of target cells

Endolysosomal targeting conjugates that are engineered to deliver cargo molecules such as cytotoxic drugs or imaging labels with improved efficiency to late endosomes and/or lysosomes in target cells such as tumor cells are described. The endolysosomal targeting conjugate includes a targeting component and a cargo component. The targeting component is configured to bind to a cell surface molecule of a target cell and the cargo component includes a cargo molecule. The targeting component and the cargo component may be fused by a covalent bond or associated by a non-covalent bond. The targeting component may bind to the cell surface molecule or the cargo component with higher affinity in the extracellular space than in an endolysosomal compartment of the target cell.

Stacked electrical connector

Antimicrobial zinc pyrithione composition and method

The present invention relates to the field of antimicrobial formulations, and more specifically, to an antimicrobial formulation comprising zinc pyrithione in a stabilized dispersion.

Partial semiconductor light emitting component

Procedure for the preparation of cement slab products that have antimicrobial properties

Un procedimiento para la preparación de un producto de cemento que tiene propiedades antimicrobianas, elprocedimiento que comprende: la preparación de una matriz de cemento que comprende una suspensión de agua y cemento y un aditivoplastificante; la mezcla de un agregado natural y la matriz de cemento; la adición de un agente antimicrobiano al agregado y la matriz de cemento; la extensión de la mezcla de agregado, matriz de cemento, y agente antimicrobiano en un dispositivo deconformación; la desaireación de la mezcla extendida de agregado, matriz de cemento, y agente antimicrobiano poniendo lamezcla extendida al vacío; la aplicación de un movimiento vibratorio a la mezcla desaireada mientras la mezcla desaireada está al vacío; yla curación de la mezcla extendida y desaireada para formar un producto de cemento, donde el agente antimicrobiano es tolil diyodometil sulfona y está presente en el agregado y la matriz decemento en una cantidad comprendida entre 100 ppm y 10.000 ppm.

Wireless communication device capable of adjusting at least one antenna to improve efficiency of other coexisting antenna (s) and related wireless communication method

A wireless communication device is used for performing wireless communication via at least one of a plurality of antennas. The antennas include a first antenna and a second antenna. The first antenna includes at least one first controllable component. The wireless communication device has at least one communication system and a control circuit. The at least one communication system is used to perform the wireless communication via at least one of the plurality of antennas. The control circuit is used to set the at least one first controllable component according to a first setting when the first antenna and the second antenna are active, and set the at least one first controllable component according to a second setting when the first antenna is inactive and the second antenna is active, where the second setting is different from the first setting.

In situ indicator detection and quantitation to correlate with an additive

An additive formulation includes a carrier material, a first additive present in the carrier material at a first additive concentration, and a tracer present in the carrier material at a first tracer concentration. The tracer is a metal amenable to detection by X-ray fluorescence analysis. Further embodiments include a manufactured article having incorporated therein the additive formulation. A method is also disclosed for detecting an additive in a manufactured article, the method involving application of X-ray fluorescence analysis of the tracer element.

CERAMIC MODULE FOR THE INTEGRATED PACKAGING OF POWER SEMICONDUCTOR AND PREPARATION METHOD THEREOF

La présente invention concerne un module en céramique pour le conditionnement intégré de semi-conducteur de puissance et un procédé de préparation associé. Le module en céramique comprend un substrat en céramique (10) et une couche de retenue métallique intégrée (20). L'utilisation de la couche de retenue métallique intégrée (20) sur la surface supérieure du substrat en céramique (10) et la formation de cavités (21) autour des zones de fixation de puces (40) permettent de sceller hermétiquement la puce semi-conductrice. L'utilisation d'une couche de dissipation thermique (33) sur la surface inférieure du substrat en céramique (10) permet d'acheminer rapidement la chaleur générée par la puce semi-conductrice vers l'extérieur. Le produit présente un procédé de fabrication simple et une cohérence de produit élevée. The present invention relates to a ceramic module for integrated power semiconductor packaging and a related preparation method. The ceramic module comprises a ceramic substrate (10) and an integrated metal retaining layer (20). The use of the integrated metal retaining layer (20) on the upper surface of the ceramic substrate (10) and the formation of cavities (21) around the chip attachment areas (40) seal the semiconductor chip. conductive. The use of a heat dissipation layer (33) on the lower surface of the ceramic substrate (10) makes it possible to rapidly convey the heat generated by the semiconductor chip to the outside. The product has a simple manufacturing process and a high product consistency.

Lamp

Distributed identifier management

An overlay network of volatile nodes, without centralized servers, using DHT-like search algorithms, is programmed to perform One-Number or One-ID services. A user's public number is either the PSTN or PLMN line that is connected to an overlay node, or a voice (or video) over IP number, which is serviced through the overlay. An overlay node is connected to the Internet, and may connect to a PSTN or PLMN phone line as well. The phone numbers allowed in the One-Number service is generally defined. The One-ID service architecture is based on user-proxy, and does not require social networking other one-ID protocols such as OpenID and protocols suites drafted by OASIS. The user-ID of such a One-ID service is not required to be globally unique while a mapping is used to transform a user-defined non-globally unique ID into a site-specific and site-unique ID.

Chamfered die of semiconductor package and method for forming the same

A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Remote control transmitter

A mobile communication device antenna

Semiconductor device and method for forming the same

A method for forming a semiconductor device is provided. The method includes providing a substrate. The method includes forming a mask layer over a surface of the substrate. The mask layer has an opening over a portion of the surface. The method includes depositing a conductive layer over the surface and the mask layer. The method includes removing the mask layer and the conductive layer over the mask layer. The conductive layer remaining after the removal of the mask layer and the conductive layer over the mask layer forms a conductive pad. The method includes bonding a device to the conductive pad through a solder layer. The conductive pad is embedded in the solder layer.

Antimicrobial acrylic polymer

An antimicrobial additive composition is provided which economically and efficiently imparts antimicrobial characteristics to acrylic polymers, and particularly thermoformable acrylic sheets made from such polymers. The antimicrobial composition comprises an alkyl dimethyl ammonium saccharinate, an oxathiazine, an azole, an isothiazoline, a chlorothalonil, and/or mixtures thereof, among others.

Method of automatic reply for radio transmission and radio modem

A radio modem includes a modem: a central processing unit (CPU) connected with the modem for digital data transmission therewith; a read-only-memory (ROM) connected with the CPU; a memory connected with the CPU; and a radio transceiver connected with the modem for receiving/transmitting radio waves and performing an analog signal transmission with the modem. The radio modem has Group ID (GID) and Sort ID functions, and automatically replies according to the order of the Sort ID after identifying the Group ID and confirming that it is necessary to reply.

Endolysosomal targeting conjugates for improved delivery of cargo molecules to the endolysosomal compartment of target cells

Endolysosomal targeting conjugates that are engineered to deliver cargo molecules such as cytotoxic drugs or imaging labels with improved efficiency to late endosomes and/or lysosomes in target cells such as tumor cells are described. The endolysosomal targeting conjugate includes a targeting component and a cargo component. The targeting component is configured to bind to a cell surface molecule of a target cell and the cargo component includes a cargo molecule. The targeting component and the cargo component may be fused by a covalent bond or associated by a non-covalent bond. The targeting component may bind to the cell surface molecule or the cargo component with higher affinity in the extracellular space than in an endolysosomal compartment of the target cell.