Timing controller capable of switching between graphics processing units

Method and apparatus for managing and uniformly maintaining pixel circuitry in a flat panel display

The present invention describes a method and apparatus for measuring the voltage and current characteristics of the OLED pixel as it ages and correlating the measured data to the decrease in quantum efficiency and changes in OLED impedance over the life of the OLED, so that corrections can be made to the image drive system to prevent image sticking and color point drift. The method and apparatus of the present invention do not require any additional circuitry or changes in the display design. The circuitry of the present invention is implemented in the display driver integrated circuit (IC) chips. The basis of the invention is the luminance-current-voltage (LIV) curves which characterize the OLED materials over their life time. A series of these curves are stored in memory representing a OLED material at various ages. The apparatus of the present invention is used to measure driver voltages and currents for a pixel having an OLED, which measurements are then used to extract the voltage ...

Active matrix emissive micro LED display

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

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Circuitry for independent gamma adjustment points

A display architecture providing independent adjustment of gamma with respect to each color channel of a display is provided. In one embodiment, gamma adjustment circuitry may utilize separate resistor strings for each color channel of the display. Gamma adjustment voltage taps for each resistor string may each be coupled to a respective switching logic block that includes a plurality of switches, each of which may be coupled to different respective locations of the resistor string. Based upon a gamma correction profile defining optimal gamma adjustment points for a particular color channel based at least partially upon its transmittance sensitivity characteristics, appropriate control signals may be provided to each of the switching logic blocks to facilitate the connection of the gamma adjustment voltage taps to desired adjustment points on a respective resistor string in order to optimize gamma correction and provide for increased accuracy in color output.

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

DISPLAY WITH A REDUCED REFRESH RATE

In one embodiment, a display system includes a display panel having a plurality of display elements, a scan driver to control a leaky switch to select a storage capacitor of a display element of the plurality of display elements to receive a data signal, and a data driver to provide the data signal to the storage capacitor when the leaky switch is in an on state at each of an on voltage to illuminate the display element and an off voltage and to hold the on voltage at an input of the leaky switch when the leaky switch is in an off state.

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Active matrix display panel with ground tie lines

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Switch for graphics processing units

Methods and apparatuses are disclosed for improving switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of GPUs, a multiplexer coupled to the plurality of GPUs, a timing controller coupled to the multiplexer, where the timing controller may provide an indication signal to the multiplexer indicative of a period when a first GPU is experiencing a first blanking interval.

SYSTEMS AND METHODS FOR OPERATING A DISPLAY

Embodiments of the electronic device include a display driver with the ability to receive image data in a streaming display mode or a frame-buffered display mode. In some embodiments, the electronic device may switch seamlessly between the two display modes based on which display mode will provide reduced power usage given the type and/or variability of the image data being received.

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ELECTRO-STATIC DISCHARGE AND ELECTRIC OVERSTRESS PROTECTION STRATEGY FOR MICRO-CHIP ARRAY ON PANEL

A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event. 1. A display system comprising:a display substrate;an array of light emitting diodes (LEDs) on the display substrate;a first driver chip bonded to the display substrate, the first driver chip to drive a first group of LEDs of the array of LEDs;a second driver chip bonded to the display substrate, the second driver chip to drive a second group of LEDs of the array of LEDs;a first protection chip bonded to the display substrate, the first protection chip including one or more electro-static discharge (ESD) protection devices, wherein:the one or more ESD protection devices are connected through one or more signal lines of the display substrate, one or more power supply voltage lines of the display substrate, and an electrical ground line of the display substrate to the first and second driver chips, andthe first protection chip is to assist with protecting the first and second driver chips from damage caused by an ESD event.2. The display system of claim 1 , wherein:at least one of the first driver chip, the second driver chip, the first protection chip, or one or more of the LEDs in the array of LEDs is a micro device.3. ...

DISPLAY SYSTEM WITH IMPROVED GRAPHICS ABILITIES WHILE SWITCHING GRAPHICS PROCESSING UNITS

Methods and apparatuses are disclosed for improving graphics abilities while switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of graphics processing units (GPUs) and a memory buffer coupled to the GPUs via a timing controller, where the memory buffer stores data associated with a first video frame from a first GPU within the plurality of GPUs and where the timing controller is switching between the first GPU and a second GPU within the plurality.

Systems and methods for operating a display

Embodiments of the electronic device include a display driver with the ability to receive image data in a streaming display mode or a frame-buffered display mode. In some embodiments, the electronic device may switch seamlessly between the two display modes based on which display mode will provide reduced power usage given the type and/or variability of the image data being received.

Active matrix display panel with ground tie lines

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Timing controller capable of switching between graphics processing units

A display system is disclosed that is capable of switching between graphics processing units (GPUs). Some embodiments may include a display system, including a display, a timing controller (T-CON) coupled to the display, the T-CON including a plurality of receivers, and a plurality of GPUs, where each GPU is coupled to at least one of the plurality of receivers, and where the T-CON selectively couples only one of the plurality of GPUs to the display at a time.

CIRCUITRY FOR INDEPENDENT GAMMA ADJUSTMENT POINTS

A display architecture providing independent adjustment of gamma with respect to each color channel of a display is provided. In one embodiment, gamma adjustment circuitry may utilize separate resistor strings for each color channel of the display. Gamma adjustment voltage taps for each resistor string may each be coupled to a respective switching logic block that includes a plurality of switches, each of which may be coupled to different respective locations of the resistor string. Based upon a gamma correction profile defining optimal gamma adjustment points for a particular color channel based at least partially upon its transmittance sensitivity characteristics, appropriate control signals may be provided to each of the switching logic blocks to facilitate the connection of the gamma adjustment voltage taps to desired adjustment points on a respective resistor string in order to optimize gamma correction and provide for increased accuracy in color output.

TIMING CONTROLLER FOR GRAPHICS SYSTEM

One embodiment takes the form of an apparatus for changing a frequency of an image data stream, including: a timing controller; a buffer operably connected to the timing controller; wherein the buffer accepts the image data stream at a first frequency; the buffer transmits the image data stream to the timing controller; and the timing controller outputs the image data stream at a second frequency that is lower than the first frequency. In such an embodiment, the image data stream may include a blanking interval; and a data portion; wherein the buffer removes or reduces the blanking interval from the image data stream; and the buffer adjusts the frequency of the data portion such that the data portion and reduced blanking interval occupy a time equal to that of the blanking interval plus the data portion prior to adjustment.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

SWITCH FOR GRAPHICS PROCESSING UNITS

Methods and apparatuses are disclosed for improving switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of GPUs, a multiplexer coupled to the plurality of GPUs, a timing controller coupled to the multiplexer, where the timing controller may provide an indication signal to the multiplexer indicative of a period when a first GPU is experiencing a first blanking interval.

Active matrix emissive micro LED display

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

Method of fabricating a light emitting diode display with integrated defect detection test

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

TIMING CONTROLLER CAPABLE OF SWITCHING BETWEEN GRAPHICS PROCESSING UNITS

A display system is disclosed that is capable of switching between graphics processing units (GPUs). Some embodiments may include a display system, including a display, a timing controller (T-CON) coupled to the display, the T-CON including a plurality of receivers, and a plurality of GPUs, where each GPU is coupled to at least one of the plurality of receivers, and where the T-CON selectively couples only one of the plurality of GPUs to the display at a time.

Pixel driver circuit with load-balance in current mirror circuit

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor.

Switch for graphics processing units

Methods and apparatuses are disclosed for improving switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of GPUs, a multiplexer coupled to the plurality of GPUs, a timing controller coupled to the multiplexer, where the timing controller may provide an indication signal to the multiplexer indicative of a period when a first GPU is experiencing a first blanking interval.

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. 1. A reflective bank structure comprising:a substrate;an insulating layer on the substrate;an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls; anda reflective layer spanning the sidewalls of each of the bank openings in the insulating layer.2. The reflective bank structure of claim 1 , wherein each of the bank openings has a maximum width of 1 μm-100 μm.3. The reflective bank structure of claim 1 , further comprising a corresponding array of vertical light emitting diode devices mounted within the corresponding array of bank openings.4. The reflective bank structure of claim 3 , wherein a top surface of each vertical light emitting diode device is above a top surface of the insulating layer.5. The reflective bank structure of claim 4 , wherein each vertical light emitting diode device comprises a top conductive electrode and a bottom conductive electrode.6. The reflective bank structure of claim 4 , wherein each vertical light emitting diode device has a maximum width of 1 μm-100 μm.7. The reflective bank structure of claim 3 , further comprising a transparent passivation layer spanning sidewalls of the array of vertical light emitting diode device and least partially filling the array of bank openings.8. The reflective bank structure of claim 7 , wherein the transparent passivation layer does not completely cover the top conductive electrode of each vertical light emitting diode device.9. The reflective bank structure of claim 8 , further comprising a transparent conductor layer over and in electrical contact with the top conductive electrode ...

Content-Based Adaptive Refresh Schemes For Low-Power Displays

A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame. 1. An active matrix display system comprising:a display panel that includes a plurality of rows of display elements arranged as a display matrix;a scan driver coupled to the display panel to select one of the rows at a time to receive data signals;a data driver coupled to the display panel to provide the data signals; anda timing controller coupled to the scan driver and the data driver, the timing controller operable to signal the scan driver to thereby cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame.2. The active matrix display system of claim 1 , further comprising:refresh logic operable to compare content of the first row in the current data frame with content of the first row in a previous data frame to generate a comparison result, and to determine whether the first row is to be refreshed in the current data frame based on the comparison result.3. The active matrix display system of claim 2 , wherein the refresh logic is coupled to the timing controller.4. The active matrix display system of claim 2 , wherein the refresh logic is located within a processor that generating data frames claim 2 , or on a path between the processor and the display panel.5. The ...

Light emitting diode display with redundancy scheme

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Smart pixel lighting and display microcontroller

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Light emitting device reflective bank structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINES

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area. 1. A display panel comprising:a thin film transistor (TFT) substrate including a pixel area and a non-pixel area, wherein the pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings;a ground line in the non-pixel area; andan array of ground tie lines running between the bank openings in the pixel area and electrically connected to the ground line in the non-pixel area.2. The display panel of claim 1 , wherein the non-pixel area is around the pixel area.3. The display panel of claim 2 , wherein the ground line is a ground ring in the non-pixel area around the pixel area.4. The display panel of claim 3 , wherein the array of ground tie lines are electrically connected to the ground ring on opposite sides of the pixel area.5. The display panel of claim 1 , wherein the array of bottom electrodes are formed on sidewalls of the corresponding array of bank openings.6. The display panel of claim 5 , wherein the bottom electrodes are reflective to the visible wavelength range.7. The display panel of claim 6 , further comprising a post of solder material on the bottom electrode within each bank opening.8. The display panel of claim 1 , further comprising a patterned insulator layer covering the array of bottom electrodes claim 1 , and an array of openings in the patterned insulator layer exposing the array of bottom electrodes.9. The display panel of claim 8 , wherein the patterned insulator layer covers edges of the array of ...

Switch for Graphics Processing Units

Methods and apparatuses are disclosed for improving switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of GPUs, a multiplexer coupled to the plurality of GPUs, a timing controller coupled to the multiplexer, where the timing controller may provide an indication signal to the multiplexer indicative of a period when a first GPU is experiencing a first blanking interval.

Pixel driver circuit

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor ...

Timing Controller Capable of Switching Between Graphics Processing Units

A display system is disclosed that is capable of switching between graphics processing units (GPUs). Some embodiments may include a display system, including a display, a timing controller (T-CON) coupled to the display, the T-CON including a plurality of receivers, and a plurality of GPUs, where each GPU is coupled to at least one of the plurality of receivers, and where the T-CON selectively couples only one of the plurality of GPUs to the display at a time. 1. A system , comprising:a display;a host computer;a plurality of graphics processing units (GPUs), wherein each GPU of the plurality of GPUs is configured to generate a respective one of a plurality of video image signals; and receive the plurality of video image signals;', 'process each video image signal of the plurality of video image signals;', 'send a first processed video image signal to the display;', 'select a second processed video image signal dependent upon a power consumption of a respective one of the plurality of GPUs; and', 'send the selected second processed video image signal to the display., 'a timing controller coupled to the host computer and the plurality of GPUs, wherein the timing controller is configured to2. The system of claim 1 , wherein each video image signal of the plurality of video image signals includes one or more synchronization signals.3. The system of claim 2 , wherein to process each video image signal of the plurality of video image signals claim 2 , the timing controller is further configured to determine one or more blanking intervals dependent upon the one or more synchronization signals.4. The system of claim 2 , wherein the one or more synchronization signals include a frame synchronization signal and a lines synchronization signal.5. The system of claim 1 , wherein to process each video image signal of the plurality of video image signals claim 1 , the timing controller is further configured to translate each video image signal of the plurality of video image ...

PIXEL DRIVER CIRCUIT WITH LOAD-BALANCE IN CURRENT MIRROR CIRCUIT

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor. 127-. (canceled)28. A pixel driver circuit for use in a display , comprising: a switch transistor having a gate connected to a first select line, a first terminal connected to a data line, and', 'a feedback transistor having a gate connected to a second select line, a first terminal connected to a second terminal of the switch transistor;, 'switching circuitry for providing a reference current input, the switching circuitry includinga light emitting device; and a drive transistor for conveying the drive current through the light emitting device;', 'a reference transistor for receiving the reference current, the reference transistor having a gate connected to a gate of the drive transistor, the reference transistor having a drain terminal connected either to a second terminal of the feedback transistor or to a second terminal of the switch transistor; and', 'a capacitor for storing a program voltage independent of a transistor threshold voltage, the program voltage settling on the ...

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. 1. (canceled)2. A light emitting assembly comprising:an array of light emitting diode (LED) device and an array of microcontroller chips arranged in an array of micro-matrices, each micro matrix including a matrix of light emitting diode (LED) devices electrically connected with a microcontroller chip;wherein each microcontroller chip includes a first output pin that is electrically coupled with a first string of LED devices to drive the first string of LED devices, and a second output pin that is electrically coupled with a second string of LED devices to drive the second string of LED devices.3. The assembly of claim 2 , further comprising one or more column drivers electrically connected with the array of microcontroller chips.4. The assembly of claim 3 , further comprising one or more row drivers electrically connected with the array of microcontroller chips.5. The assembly of claim 3 , further comprising distribution lines to electrically connect the array of microcontroller chips and the array of LED devices.6. The assembly of claim 5 , wherein each LED device in the array of LED devices has a maximum length or width dimension of 1 to 100 μm.7. The assembly of claim 2 , further comprising distribution lines to electrically connect the array of microcontroller chips and the array of LED devices claim 2 , wherein the distribution lines electrically connect a plurality of microcontroller chips of the array of microcontroller chips to one another.882. The assembly of claim 7 , wherein each LED device in the array of LED devices has a maximum length or width dimension of 1 to 100 m.9. The assembly of claim 8 , wherein the array of LED devices is bonded to landing pads in electrical connection with the ...

Backplane led integration and functionalization structures

Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.

Light emitting device reflective bank structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area. 1. A display panel comprising:a lower conductive layer including a ground line;a planarization layer over the lower metal layer;an opening in the planarization layer; an array of bottom electrodes; and', 'a ground contact within the opening in the planarization layer and in electrical contact with the ground line;, 'a patterned top conductive layer over the planarization layer, wherein the patterned top conductive layer includesa corresponding plurality of light emitting diodes (LEDs) bonded to the plurality of bottom electrodes; andone or more top electrode layers on and in electrical contact with the plurality of LEDs and the ground contact.2. The display panel of claim 1 , wherein each LED comprises an inorganic semiconductor-based p-n diode.3. The display panel of claim 2 , wherein each LED is a vertical LED with a maximum width of 1 μm-100 μm.4. The display panel of claim 3 , wherein each bottom electrode is independently addressable.5. The display panel of claim 4 , wherein each LED device has a maximum width of 1 μm-20 μm.6. The display panel of claim 3 , wherein the one or more top electrode layers includes a single top electrode layer on and in electrical contact with the plurality of LEDs and the ground contact.7. The display panel of claim 3 , wherein the one or more top electrode layers includes a plurality of top electrode layers.8. The display panel of claim 7 , wherein each top electrode layer spans ...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. (canceled)2. A display panel with redundancy scheme comprising:an array of micro LED devices arranged in an array of redundant micro LED device pairs in array of pixels, each pixel of the array of pixels including a first subpixel, a second subpixel and a third subpixel;each first subpixel including a first redundant micro LED device pair designed to emit a first primary color emission;each second subpixel including a second redundant micro LED device pair designed to emit a second primary color emission;each third subpixel including a third redundant micro LED device pair designed to emit a third primary color emission;wherein the first, second and third primary color emissions are different from one another.3. The display panel of claim 2 , wherein the display panel further comprises an array of micro controller chips to drive the array of micro LED devices.4. The display panel of claim 3 , wherein each micro LED device has a maximum width of 1 to 100 μm.5. The display panel of claim 3 , wherein each micro LED device has a maximum width of 1 to 30 μm.6. The display panel of claim 3 , wherein each micro LED device has a maximum width of 1 to 10 μm.7. The display panel of claim 3 , further comprising a plurality of top electrode layers in electrical contact with the array of redundant micro LED device pairs.8. The display panel of claim 7 , further comprising separate top ...

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. 1. A light emitting assembly comprising:an array of light emitting diode (LED) devices; andan array of microcontroller chips to switch and drive the array of LED devices, wherein at least one microcontroller chip is configured to receive digital input and to drive associated light emitting diode (LED) devices at a standard frame rate, or a content dependent frame rate.2. The assembly of claim 1 , wherein the at least one microcontroller chip comprises a smart pixel microcontroller that includes a storage device and an output circuitry.3. The assembly of claim 2 , wherein the smart pixel microcontroller is configured to receive the digital input including pixel data when new content is available for an associated LED device of the array of LED devices claim 2 , without following a fixed schedule.4. The assembly of claim 3 , wherein the smart pixel microcontroller is configured to receive the pixel data whenever new content is available for the associated LED device claim 3 , without following the fixed schedule and without a periodic refresh operation.5. The assembly of claim 3 , wherein the smart pixel microcontroller is configured to store the pixel data claim 3 , which is transmitted faster than a scheduled display frame rate claim 3 , in the storage device of the smart pixel microcontroller.6. The assembly of claim 3 , wherein the smart pixel microcontroller is configured to read the pixel data from the storage device at a scheduled update interval or a content dependent frame rate and this enables multiple frames of pixel data to be sent in a burst mode to the output circuitry of the smart pixel microcontroller.7. The assembly of claim 1 , wherein the array of LED devices and the array of ...

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. 1. A light emitting structure comprising:a substrate;an insulating layer on the substrate;an array of bank openings extending completely through a thickness of the insulating layer, each bank opening including sidewalls;an array of laterally separate reflective bank layers within an array of bank openings in the insulating layer, wherein each reflective bank layer spans the sidewalls of a corresponding bank opening and is on the substrate within the bank opening;a corresponding array of vertical light emitting diode devices on the array of reflective bank layers within the array of bank openings.2. The light emitting structure of claim 1 , further comprising an array of sidewall passivation layers claim 1 , each sidewall passivation layer around the sidewalls of a corresponding light emitting diode device within a reflective bank layer.3. The light emitting structure of claim 2 , wherein each reflective bank layer is electrically connected to circuitry within the substrate.4. The light emitting structure of claim 3 , wherein a bottom surface of each reflective bank layer is on a conductive contact pad electrically connected to the circuitry within the substrate.5. The light emitting structure of claim 2 , wherein each vertical light emitting diode device in the array of vertical light emitting diode devices includes a micro p-n diode that includes a top p-doped or n-doped layer claim 2 , a lower p-doped or n-doped layer claim 2 , and one or more quantum well layers between the top and lower p-doped or n-doped layers claim 2 , and wherein the micro p-n diode includes one or more layers based on II-VI ...

EMISSION CONTROL APPARATUSES AND METHODS FOR A DISPLAY PANEL

Methods and apparatuses relating to controlling an emission of a display panel. In one embodiment, a display driver hardware circuit includes row selection logic to select a number of rows in an emission group of a display panel, wherein the number of rows is adjustable from a single row to a full panel of the display panel, column selection logic to select a number of columns in the emission group of the display panel, wherein the number of columns is adjustable from a single column to the full panel of the display panel, and emission logic to select a number of pulses per data frame to be displayed, wherein the number of pulses per data frame is adjustable from one to a plurality and a pulse length is adjustable from a continuous duty cycle to a non-continuous duty cycle. 1. (canceled)2. A display system comprising:a display panel including an active area;an array of microdriver chips mounted in the active area;an array of micro light emitting diodes (LEDs) mounted in the active area, wherein each microdriver chip is connected to a group of micro LEDs; a digital memory cell to modulate pulse width of an emission pulse to be sent to a corresponding micro LED; and', 'an analog current source including storage capacitor to control current level of the emission pulse., 'wherein each microdriver chip includes a hybrid unit cell including3. The display system of claim 2 , wherein the digital memory cell includes a counter claim 2 , a register claim 2 , and a comparator.4. The display system of claim 3 , wherein the register includes a pulse width modulation (PWM) data input.5. The display system of claim 4 , wherein the counter includes a reset input to reset the counter to zero.6. The display system of claim 4 , wherein the hybrid unit cell includes a comparator for each micro LED of the group of micro LEDs.7. The display system of claim 4 , wherein the comparator includes an input to receive a number of pulses from the counter and an input to receive PWM data from the ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. A portable electronic device comprising:a display substrate including a display area and a bevel width around the display area, wherein the bevel width is less than 1 mm;wherein the display substrate includes a front side and a second side;a first wiring layer on the front side; andan array of micro LEDs on and in electrical contact with the wiring layer on the front side of the display substrate.2. The portable electronic device of claim 1 , wherein the display substrate is flexible.3. The portable electronic device of claim 1 , wherein the display substrate further comprises a contact ledge area claim 1 , wherein the contact ledge is wider than the bevel width.4. The portable electronic device of claim 3 , further comprising a driver IC bonded to the first wiring layer in the contact ledge area.6. The portable electronic device of claim 4 , further comprising a passivation layer laterally surrounding the array of micro LEDs.7. The portable electronic device of claim 6 , further comprising on or more top electrode layers over the passivation layer and in electrical contact with the array of micro LEDs.8. The portable electronic device of claim 7 , further comprising an array of openings in the passivation layer within the display area exposing an array of ground contacts claim 7 , wherein the one or more top electrode layers are in electrical contact ...

ACTIVE MATRIX DISPLAY PANEL WITH GROUND TIE LINES

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area. 1. A display panel comprising:a display substrate including an array of ground tie lines;a bank layer including an array of bank openings, and an array of ground tie line openings exposing the array of ground tie lines underneath the bank layer;an array of bottom electrodes, each discrete bottom electrode spanning a bottom of a corresponding bank opening and over the bank layer;an array of ground tie line contacts spanning a bottom of the array of ground tie line openings and over the bank layer; andan array of vertical LED devices, each vertical LED device comprising an inorganic semiconductor-based p-n diode bonded to the bottom electrode for a corresponding bank opening.2. The display panel of claim 1 , further comprising a sidewall passivation layer laterally around the array of vertical LED devices and filling the array of bank openings.3. The display panel of claim 2 , further comprising a top electrode layer over and in electrical contact with the array of vertical LED devices and the array of ground tie line contacts.4. The display panel of claim 3 , wherein the top electrode layer comprises a material selected from the group consisting of PEDOT and ITO.5. The display panel of claim 1 , wherein the bottom electrodes are formed of a metallic film.6. The display panel of claim 5 , wherein the ground tie lines comprise copper.7. The display panel of claim 6 , wherein the ground tie line contacts comprise aluminum.8. The display panel of claim 1 , wherein the array of ...

Display panel redundancy schemes

Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. A display panel with redundancy scheme comprising:a display substrate including a pixel area that includes an array of subpixels, each subpixel including a pair of landing areas;an array of redundant LED bonding site pairs, each landing area including a corresponding LED bonding site;wherein the array of subpixels includes a first subpixel array, a second subpixel array, and a third subpixel array, wherein the first, second, and third subpixel arrays are designed to emit different primary color emissions;circuitry to switch and drive the array of subpixels; andone or more LED device irregularities among the array of redundant LED bonding site pairs, wherein each corresponding landing area containing a micro LED device irregularity is electrically disconnected from the circuitry.2. The display panel of claim 2 , wherein each corresponding landing area is cut to electrically disconnect the corresponding landing area from the circuitry.3. The display panel of claim 3 , wherein the circuitry is contained within an array of micro controller chips.4. The display panel of claim 3 , wherein the array of micro controller chips is bonded to the display substrate.5. The display panel of claim 4 , wherein each micro controller chip is bonded to the display substrate within the pixel area.6. The display panel of claim 5 , wherein each micro controller chip is connected to a scan driver ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. An electronic device including:a display substrate including a front side, a back side, and a curved display area on the front side of the display substrate;an array of light emitting diodes (LEDs) mounted on the front side of the display substrate and within the display area; anda plurality of interconnects extending through the display substrate from the first side to the back side of the display substrate.2. The electronic device of claim 1 , wherein the display substrate includes a bevel width around the display area claim 1 , wherein the bevel width is less than 1 mm.3. The electronic device of claim 2 , wherein the display substrate further comprises a contact ledge area claim 2 , wherein the contact ledge area is wider than the bevel width.4. The electronic device of claim 1 , further comprising a passivation layer laterally surrounding the array of LEDs.5. The electronic device of claim 4 , further comprising one or more top electrode layers over the passivation layer and in electrical contact with the array of LEDs.6. The electronic device of claim 5 , further comprising a top encapsulation layer over the top contact layer.7. The electronic device of claim 5 , further comprising an array of openings in the passivation layer exposing an array of ground contacts claim 5 , wherein the one or more top electrode layers are in electrical contact with ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. A display module comprising:a display substrate including a front side and a back side;an array of light emitting diodes (LEDs) on the front side of the display substrate;an array of micro chips bonded to the front side of the display substrate and interspersed among the array of LEDs;a plurality of wiring layers that interconnect the array of LEDs to the array of micro chips, wherein each micro chip is connected to one or more LEDs; anda plurality of interconnects that are electrically connected to the array of micro chips and extend through the display substrate from the front side to the back side.2. The display module of claim 1 , wherein each LED comprises an inorganic semiconductor.3. The display module of claim 2 , each LED is a vertical LED.4. The display module of claim 3 , further comprising a passivation layer over the front side of the display substrate claim 3 , wherein the passivation layer laterally surrounds the array of LEDs and the array of micro chips.5. The display module of claim 4 , further comprising a transparent conductor layer spanning over the passivation layer and electrically connected to the array of LEDs.6. The display module of claim 5 , further comprising an encapsulation layer formed over the transparent conductor layer.7. The display module of claim 5 , wherein the transparent conductor layer is connected to one more of ...

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. 1. A light emitting structure comprising:a substrate;a bank layer on the substrate; a micro p-n diode that includes a top surface, a bottom surface, and a plurality of layers including a p-doped layer, an n-doped layer, and a quantum well layer between the p-doped layer and the n-doped layer;', 'a top conductive electrode; and', 'a bottom conductive electrode, wherein the bottom surface of the micro p-n diode is wider than the bottom conductive electrode;, 'a vertical light emitting diode (LED) device mounted on a conductive contact pad adjacent the bank layer, wherein the vertical LED device includesa transparent conductor layer over and in electrical contact with the top conductive electrode of the vertical LED device.2. The light emitting structure of claim 1 , wherein the bottom conductive electrode comprises a metal stack.3. The light emitting structure of claim 1 , wherein the bottom conductive electrode is bonded to the conductive contact pad with a bonding layer comprising a material selected from the group consisting of indium claim 1 , gold claim 1 , silver claim 1 , molybdenum claim 1 , tin claim 1 , and aluminum.4. The light emitting structure of claim 1 , further comprising an electrode terminal on the bank layer claim 1 , wherein the transparent conductor layer electrically connects the top conductive electrode with the electrode terminal.5. The light emitting structure of claim 4 , wherein the electrode terminal is a cathode claim 4 , and the conductive contact pad is an anode.6. The light emitting structure of claim 4 , further comprising a passivation layer spanning sidewalls of the ...

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. 1. A light emitting structure comprising:a substrate;a group of conductive contact pads on the substrate, wherein each conductive contact pad is coupled to a corresponding driving transistor in the substrate;an insulating layer over the substrate;a group of bank openings in the insulating layer, each bank opening exposing a corresponding conductive contact pad;a group of vertical light emitting diode devices the group of conductive contact pads within the group of bank openings.2. The light emitting structure of claim 1 , wherein each vertical light emitting diode device in the group of vertical light emitting diode devices includes a micro p-n diode that includes a top p-doped or n-doped layer claim 1 , a lower p-doped or n-doped layer claim 1 , and one or more quantum well layers between the top and lower p-doped or n-doped layers claim 1 , and wherein the micro p-n diode includes one or more layers based on II-VI materials or III-V materials.3. The light emitting structure of claim 2 , wherein each vertical light emitting diode device in the group of vertical light emitting diode devices has a maximum width of 1 μm-100 μm.4. The light emitting structure of claim 3 , wherein each vertical light emitting diode device in the group of vertical light emitting diode devices has a maximum width of 1 μm-5 μm.5. The light emitting structure of claim 3 , wherein each vertical light emitting diode device in the group of vertical light emitting diode devices has a maximum thickness of 5 μm or less.6. The light emitting structure of claim 3 , wherein no vertical light emitting diode device of the group of ...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. A display panel redundancy scheme comprising:a display substrate;a first micro light emitting diode (LED) and a second LED arranged within a subpixel;wherein the first micro LED and the second micro LED each comprises a p-n diode, a top conductive contact, and a bottom conductive contact that is bonded to the display substrate;a passivation material over the second micro LED; anda top electrode layer over the first micro LED and the second micro LED, wherein the top electrode layer is in electrical contact with the first micro LED and the passivation material physically separates the top electrode layer from the second micro LED.2. The display panel of claim 1 , wherein each of the first micro LED and the second micro LED has a maximum width of 1 to 100 μm.3. The display panel of claim 2 , wherein the top electrode layer is formed of a material selected from the group consisting of a transparent conductive oxide and a transparent conducting polymer.4. The display panel of claim 2 , further comprising a Vss tie line.5. The display panel of claim 4 , wherein the top electrode layer is in electrical contact with the Vss tie line.6. The display panel of claim 5 , further comprising a passivation layer covering sidewalls of the first micro LED and the second micro LED claim 5 , and the top electrode layer spans over a top surface of the passivation layer.7. The display panel of ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. A display module comprising:a display substrate including a front surface, a back surface, and a display area on the front surface;a plurality of interconnects extending through the display substrate from the front surface to the back surface;an array of light emitting diodes (LEDs) in the display area and electrically connected with the plurality of interconnects; andone or more driver circuits on the front surface or the back surface of the display substrate.2. The display module of claim 1 , wherein the plurality of interconnects extend through the display substrate from the front surface to the back surface directly behind the display area claim 1 , and the one or more driver circuits are on the back surface of the display substrate.3. The display module of claim 1 , wherein the plurality of interconnects are through vias extending through the display substrate from the front surface to the back surface.4. The display module of claim 1 , further comprising a battery on the back surface of the display substrate.5. The display module of claim 2 , wherein a flexible printed circuit does not connect the one or more driver circuits to the display substrate.6. The display module of claim 1 , further comprising a ground via through the display substrate.7. The display module of claim 2 , further comprising an array of micro chips on the front surface of the ...

Active matrix display panel with ground tie lines

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. (canceled)2. An electronic device comprising:a substrate including a first side and a second side;a first wiring layer on the first side;an array of LEDs on and in electrical contact with the first wiring layer on the first side of the substrate;a second wiring layer on the second side of the substrate.a plurality of interconnects extending between and electrically connecting the first wiring layer to the second wiring layer.2. The electronic device of claim 1 , further comprising an array of micro chips connected with the first wiring layer to drive the array of LEDs.3. The electronic device of claim 2 , wherein each micro chip is connected with a corresponding plurality of LEDs.4. The electronic device of claim 3 , wherein the array of LEDs is located in a display area of the substrate.5. The electronic device of claim 4 , further comprising a timing controller chip electrically connected with the second wiring layer.6. The electronic device of claim 5 , wherein the array of micro chips is interspersed among the array of LEDs.7. The electronic device of claim 4 , further comprising a plurality of integrated circuit (IC) chips in electrical connection with the second wiring layer.8. The electronic device of claim 7 , wherein the plurality of interconnects is located outside of the display area.9. The electronic device of claim 7 , wherein the plurality ...

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. A method of forming a display panel comprising:electrostatically transferring an array of micro LED devices from one or more carrier substrates to a corresponding array of bottom electrodes within a corresponding array of subpixels on a display substrate;imaging a surface of the display substrate to detect irregularities in the array of micro LED devices; andforming a passivation layer material over a plurality of irregularities to electrically insulate the plurality of irregularities.2. The method of claim 1 , further comprising forming one or more top electrode layers in electrical contact with the array of micro LED devices without making electrical contact to the plurality of irregularities.3. The method of claim 1 , wherein imaging the surface of the display substrate comprises imaging the surface with a camera.4. The method of claim 3 , wherein an image produced from the camera is used to detect irregularities in the array of micro LED devices selected from the group consisting of missing micro LED devices and contaminated micro LED devices.5. The method of claim 3 , wherein imaging the surface of the display substrate comprises:illuminating the surface of the display substrate with a light source to cause the array of micro LED devices to fluoresce; andimaging the fluorescence of the array of micro LED devices with the camera.6. The method of claim 5 , wherein an image ...

Emission control apparatuses and methods for a display panel

Methods and apparatuses relating to controlling an emission of a display panel. In one embodiment, a display driver hardware circuit includes row selection logic to select a number of rows in an emission group of a display panel, wherein the number of rows is adjustable from a single row to a full panel of the display panel, column selection logic to select a number of columns in the emission group of the display panel, wherein the number of columns is adjustable from a single column to the full panel of the display panel, and emission logic to select a number of pulses per data frame to be displayed, wherein the number of pulses per data frame is adjustable from one to a plurality and a pulse length is adjustable from a continuous duty cycle to a non-continuous duty cycle.

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. 1. A light emitting assembly comprising:an array of light emitting diode (LED) devices and an array of tile micro controller chips arranged in an array of tiles, each tile including a matrix of light emitting diode (LED) devices electrically connected with a tile microcontroller chip;wherein each tile microcontroller chips includes a first output pin that is electrically coupled with a first string of LED devices to drive the first string of LED devices, and a second output pin that is electrically coupled with a second string of LED devices to drive the second string of LED devices.2. The assembly of claim 1 , further comprising one or more column drivers electrically connected with the array of tile microcontroller chips.3. The assembly of claim 1 , further comprising one or more row drivers electrically connected with the array of tile microcontroller chips.4. The assembly of claim 1 , further comprising distribution lines to electrically connect the array of tile microcontroller chips and the array of LED devices.5. The assembly of claim 4 , wherein the distribution lines electrically connect a plurality of tile microcontroller chips of the array of tile microcontroller chips to one another.6. The assembly of claim 4 , wherein each LED device in the array of LED devices has a maximum length or width dimension of 1 to 100 μm.7. The assembly of claim 6 , wherein the array of LED devices is bonded to landing pads in electrical connection with the distribution lines.8. The assembly of claim 1 , wherein each tile microcontroller chip in the array of tile microcontroller chips includes one or more input circuits and at least one output circuit.9. The assembly of claim 1 , further comprising a timing ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. An electronic device comprising:a substrate including a first side and a second side;a first wiring layer on the first side;an array of LEDs on and in electrical contact with the wiring layer on the first side of the substrate;a plurality of interconnects extending through the substrate from the first side to the second side; anda second wiring layer on the second side of the substrate.2. The electronic device of claim 1 , further comprising an array of micro chips connected with the first wiring layer to drive the array of LEDs.3. The electronic device of claim 2 , wherein each micro chip is connected with a corresponding plurality of LEDs.4. The electronic device of claim 3 , wherein the array of LEDs is located in a display area of the display substrate.5. The electronic device of claim 4 , further comprising a timing controller chip electrically connected with the second wiring layer.6. The electronic device of claim 5 , wherein the array of micro chips is interspersed among the array of LEDs.7. The electronic device of claim 4 , further comprising a plurality of integrated circuit (IC) chips in electrical connection with the second wiring layer.8. The electronic device of claim 7 , wherein the plurality of interconnects are located outside of the display area.9. The electronic device of claim 7 , wherein the plurality of interconnects are located ...

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. 1. A light emitting assembly comprising:a plurality of light emitting diode (LED) devices; anda plurality of microcontrollers, wherein the plurality of microcontrollers are electrically coupled with each other, and the plurality of microcontrollers are electrically coupled with the plurality of LED devices to switch and drive the plurality of LED devices; andwherein each microcontroller comprises a digital logic, the digital logic including an input block, an output block, and a data storage module.2. The assembly of claim 1 , further comprising a plurality of digital inputs to each microcontroller.3. The assembly of claim 2 , further comprising a Vinput to each microcontroller.4. The assembly of claim 3 , further comprising a Vinput to each microcontroller.5. The assembly of claim 2 , wherein the output block includes a digital control logic coupled with a digital-to-analog converter.6. The assembly of claim 2 , wherein each microcontroller further comprises a relay output coupled with the input block and one or more microcontrollers of the plurality of microcontrollers.7. The assembly of claim 2 , wherein the plurality of LED devices comprises a plurality of groups of LED devices claim 2 , and each microcontroller is coupled to a corresponding group of LED devices.8. The assembly of claim 7 , wherein each group of LED devices is coupled in parallel to a corresponding microcontroller LED output.9. The assembly of claim 8 , wherein the output block includes a digital control logic coupled with a digital-to-analog converter.10. The assembly of claim 8 , wherein each microcontroller further comprises a relay output coupled with the input block and one or more microcontrollers of the plurality of ...

Display panel redundancy schemes

Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. (canceled)2. A display panel redundancy scheme comprising:an array of micro controller chips;an array of micro light emitting diode (LED) pairs connected with the array of micro controller chips in an array of pixel areas;wherein each pixel area includes a micro controller chip connected to a corresponding group of micro LED pairs arranged in a plurality of subpixels; andwherein the group of micro LED pairs includes a group of primary micro LEDs arranged in the plurality of subpixels, and a group of redundant micro LEDs arranged in the plurality of subpixels such that each subpixel includes a micro LED pair.3. The display panel of claim 2 , wherein each pixel area includes a first subpixel claim 2 , a second subpixel claim 2 , and a third subpixel.4. The display panel of claim 3 , wherein:each first subpixel includes a first primary micro LED and a first redundant micro LED to emit a first primary color emission;each second subpixel includes a second primary micro LED and a second redundant micro LED to emit a second primary color emission;each third subpixel includes a third primary micro LED and a third redundant micro LED to emit a third primary color emission; andwherein the first, second and third primary color emissions are different from one another.5. The display panel of claim 2 , wherein each primary micro LED and each redundant micro LED is a separate device that has ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. (canceled)2. An electronic device comprising:a substrate including a first side and a second side;a first wiring layer on the first side;an array of LEDs on and in electrical contact with the first wiring layer in a display area; anda plurality of interconnects extending through the substrate from the back side to the front side of the substrate directly behind the display area.3. The electronic device of claim 2 , further comprising an array of micro chips connected with the first wiring layer to drive the array of LEDs.4. The electronic device of claim 3 , wherein the plurality of interconnects electrically connect the array of micro chips to corresponding data lines claim 3 , power lines claim 3 , and clock lines.5. The electronic device of claim 3 , wherein each micro chip is connected with a plurality of LEDs on the first wiring layer.6. The electronic device of claim 5 , wherein each micro chip includes a first control signal output to drive a first group of LEDs of the corresponding plurality of LEDs.7. The electronic device of claim 5 , further comprising a second wiring layer on the second side of the substrate.8. The electronic device of claim 5 , further comprising a driver integrated circuit (IC) in electrical connection with the second wiring layer.9. The electronic device of claim 8 , further comprising a timing controller chip in electrical ...

HYBRID MICRO-DRIVER ARCHITECTURES HAVING TIME MULTIPLEXING FOR DRIVING DISPLAYS

Systems and apparatuses for hybrid micro-driver architectures having time multiplexing for driving displays are described. In one embodiment, a display (e.g., hybrid display architecture) includes a backplane and a micro-driver circuitry that is coupled to the backplane. The backplane includes circuitry (e.g., sample and hold circuitry) for sampling and holding analog data and for time multiplexing analog data. The micro-driver circuitry includes at least a capacitor of a ramp generator for generating a ramp voltage based on the analog data of the backplane and drive circuitry to cause at least one emission pulse for emitting a display element. 1. A display comprising:a backplane including a circuitry for sampling and holding analog data and for time multiplexing the analog data; anda micro-driver circuitry coupled to the backplane, wherein the micro-driver circuitry includes at least a capacitor of a ramp generator for generating a ramp voltage based on the analog data of the backplane and the micro-driver circuitry includes drive circuitry to cause at least one emission pulse for emitting a display element.2. The display of claim 1 , wherein the circuitry comprises at least one transistor for each row of data to be time multiplexed from the backplane to the micro-driver circuitry.3. The display of claim 2 , wherein the circuitry further comprises a data scan switch and a capacitor for data storage for each row of data to be time multiplexed.4. The display of claim 2 , further comprising:a display circuitry having a plurality of display elements, wherein the display circuitry is configured to receive the at least one emission pulse from the drive circuitry with the at least one emission pulse being applied to one or more rows of display elements.5. The display of claim 4 , wherein the display circuitry shares a single pin with a selected column or color of display elements being selected based on time multiplexing.6. The display of claim 4 , wherein the drive ...

DISPLAY MODULE AND SYSTEM APPLICATIONS

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays. 1. A display module comprising:a display substrate including a front side, a back side, and a display area on the front side;an array of light emitting diodes (LEDs) within the display area; andan array of micro chips within the display area, wherein each micro chip is to switch and drive a corresponding group of the LEDs;a plurality of interconnects extending through the display substrate from the front surface to the back surface directly behind the display area; andone or more integrated circuit (IC) chips on the back side of the display substrate, wherein the plurality of interconnects electrically connect the array of micro chips to the one or more IC chips.2. The display module of claim 1 , wherein the array of LEDs comprises semiconductor-based vertical micro LEDs each having a maximum with of 1 to 100 μm.3. The display module of claim 2 , wherein each micro chip has a maximum with of 1 to 300 μm.4. The display module of claim 3 , wherein the one or IC chips is selected from the group consisting of a scan driver chip claim 3 , a data driver chip claim 3 , power management IC chip claim 3 , processor chip claim 3 , memory chip claim 3 , timing controller chip claim 3 , touch sense IC chip claim 3 , wireless controller chip claim 3 , and communications IC chip.5. The display module of claim 4 , wherein the array of micro chips is electrically connected ...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities. 1. A display panel with redundancy scheme comprising:a display substrate including a pixel area that includes an array of subpixels;an array of redundant micro LED device pairs within the array of subpixels, wherein each subpixel includes a redundant micro LED device pair, and each redundant micro LED device pair within a respective subpixel is designed to emit a same primary color emission; andone or more top electrode layers in electrical contact with the array of redundant micro LED device pairs;wherein the array of supixels includes a first subpixel array, a second subpixel array, and a third subpixel array, wherein the first, second, and third subpixel arrays are designed to emit different primary color emissions.2. The display panel of claim 1 , wherein the first subpixel array is designed to emit a red primary color emission claim 1 , the second subpixel array is designed to emit a green primary color emission claim 1 , and the third array subpixel array is designed to emit a blue primary color emission.3. The display panel of claim 1 , wherein each micro LED device has a maximum width of 1 to 100 μm.4. The display panel of claim 3 , wherein each micro LED device comprises a semiconductor material.5. The display panel of claim 4 , wherein each micro LED device includes a p-doped layer claim 4 , an n-doped layer claim 4 , and a quantum well layer between the p-doped layer ...

Interactive display panel with emitting and sensing diodes

Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit and sense light. Display panels, systems, and methods of operation are described in which LEDs may be used for both emission and sensing.

SMART PIXEL LIGHTING AND DISPLAY MICROCONTROLLER

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices. 1. A light emitting assembly comprising:an array of light emitting diode (LED) devices on a substrate; andan array of microcontroller chips to switch and drive the array of LED devices, wherein the number of microcontroller chips in the array of microcontroller chips is less than the number of LED devices in the array of LED devices, and each microcontroller chip in the array of microcontroller chips is electrically coupled with a plurality of pixels to drive a plurality of LED devices in each pixel.2. The assembly of claim 1 , further comprising distribution lines on the substrate to electrically couple the array of microcontroller chips and the array of LED devices.3. The assembly of claim 2 , wherein the distribution lines electrically couple a plurality of microcontroller chips of the array of micro controller chips to one another.4. The assembly of claim 2 , wherein each LED device in the array of LED devices has a maximum length or width dimension of 1 to 100 μm.5. The assembly of claim 2 , wherein the array of LED devices is bonded to landing pads in electrical connection with the distribution lines.6. The assembly of claim 2 , wherein each microcontroller chip in the array of microcontroller chips includes one or more input circuits and at least one output circuit.7. The assembly of claim 6 , wherein at least one of the one or more input circuits is coupled to a capacitive storage module.8. The assembly of claim 6 , wherein the output circuit includes an analog driving circuit.9. The assembly of claim 6 , wherein at least one of the one or more input circuits further comprises an analog-to-digital converter.10. The assembly of claim 9 , wherein the analog to digital converter of the input ...

INTERACTIVE DISPLAY PANEL WITH IR DIODES

Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode. 1. A display panel comprising:a display substrate having a display region;an array of subpixel circuits, each subpixel circuit comprising a driving circuit to operate a corresponding infrared (IR) emitting LED within the display region in a light emission mode; andan array of selection devices, each selection device coupled to a corresponding sensing IR diode within the display region to operate the corresponding sensing IR diode in a light sensing mode.2. The display panel of claim 1 , wherein each IR emitting LED and each sensing IR diode formed of inorganic semiconductor-based materials.3. The display panel of claim 1 , comprising an array of interactive pixels claim 1 , each interactive pixel comprising an IR emitting LED and a sensing IR diode.4. The display panel of claim 3 , further comprising an additional LED in each interactive pixel claim 3 , the additional LED selected from the group consisting of a red emitting LED claim 3 , a green emitting LED claim 3 , and a blue emitting LED.5. The display panel of claim 3 , further comprising an array of emissive pixels claim 3 , wherein each emissive pixel does not include a sensing IR diode.6. The display panel of claim 5 , wherein a density of emissive pixels is greater than a density of interactive pixels.7. The display panel of claim 1 , wherein the array of subpixel circuits and the array of selection devices are embedded in the display substrate.8. The display ...

Pixel driver circuit with load-balance in current mirror circuit

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor.

LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer. 117-. (canceled)18. A light emitting structure comprising:a substrate;an insulating layer on the substrate;an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls; anda corresponding array of vertical light emitting diode devices mounted within the array of bank openings.19. The light emitting structure of claim 18 , wherein each vertical light emitting diode device in the array of vertical light emitting diode devices has a maximum width of 1 μm-100 μm.20. The light emitting structure of claim 19 , wherein each vertical light emitting diode device in the array of vertical light emitting diode devices includes a micro p-n diode that includes a top p-doped or n-doped layer claim 19 , a lower p-doped or n-doped layer claim 19 , and one or more quantum well layers between the top and lower p-doped or n-doped layers claim 19 , and wherein the micro p-n diode includes one or more layers based on II-VI materials or III-V materials.21. The light emitting structure of claim 20 , wherein no vertical light emitting diode device spans along a sidewall of a corresponding bank opening.22. The light emitting structure of claim 18 , further comprising a patterned reflective layer spanning the sidewalls of each of the bank openings.23. The light emitting structure of claim 22 , wherein the patterned reflective layer completely covers the sidewalls of each of the bank openings.24. The light emitting structure of claim 23 , wherein the patterned reflective layer completely covers the bottom surface of each of the bank openings.25. The light emitting structure of claim ...

Pixel driver circuit with load-balance in current mirror circuit

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor.

Pixel driver circuit with load-balance in current mirror circuit

A pixel circuit for use in a display comprising a plurality of pixels is provided. The load-balanced current mirror pixel circuit can compensate for device degradation and/or mismatch, and changing environmental factors like temperature and mechanical strain. The pixel circuit comprises a pixel drive circuit comprising, switching circuitry, a current mirror having a reference transistor and a drive transistor, the reference transistor and the drive transistor each having a first and second node and a gate, the gate of the reference transistor being connected to the gate of the drive transistor; and a capacitor connected between the gate of the reference transistor and a ground potential, and a load connected between the current mirror and a ground potential, the load having a first load element and a second load element, the first load element being connected to the first node of the reference transistor and the second load element being connected to the first node of the drive transistor.

Interactive display panel with emitting and sensing diodes

Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit and sense light. Display panels, systems, and methods of operation are described in which LEDs may be used for both emission and sensing.

Interactive display panel with IR diodes

Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode.

Smart pixel lighting and display microcontroller

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Content-based adaptive refresh schemes for low-power displays

A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Smart pixel lighting and display microcontroller

描述一種發光組件。在一個實施例中，一或更多個發光二極體(LED)裝置及一或更多個微控制器接合至基板的相同側面，其中一或更多個微控制器開關及驅動一或更多個LED裝置。

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Light emitting diode display with redundancy scheme

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Timing controller capable of switching between graphics processing units

A display system is disclosed that is capable of switching between graphics processing units (GPUs). Some embodiments may include a display system, including a display, a timing controller (T-CON) coupled to the display, the T-CON including a plurality of receivers, and a plurality of GPUs, where each GPU is coupled to at least one of the plurality of receivers, and where the T-CON selectively couples only one of the plurality of GPUs to the display at a time.

Amoled display backplanes - pixel driver circuits, array architecture, and external compensation

Pixel circuits, array architecture, and external compensation scheme for AMOLED displays are provided. The pixel circuits are current programmed, drive an organic light emitting diode (OLED) with the desired current, and compensate for increase in the threshold voltage of the drive TFT. The new array architecture presented allows the use of current sinks to drive current programmed pixels. The external compensation scheme uses feedback with circuitry that is external to the display array, to monitor changes in the OLED current and adjust the input of the pixel circuit accordingly.

Light emitting diode display with redundancy scheme

Reflecting bank structure for light-emitting device

Es werden reflektierende Bankstrukturen für lichtemittierende Vorrichtungen beschrieben. Die reflektierenden Bankstrukturen können ein Substrat, eine Isolierschicht auf dem Substrat und eine Anordnung von Banköffnungen in der Isolierschicht einschließen, wobei jede Banköffnung eine untere Oberfläche und Seitenwände einschließt. Eine reflektierende Schicht umspannt die Seitenwände jeder der Banköffnungen in der Isolierschicht. Reflecting bank structures for light-emitting devices are described. The reflective bank structures may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer, each bank opening including a bottom surface and sidewalls. A reflective layer spans the sidewalls of each of the bank openings in the insulating layer.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Display panel redundancy schemes

Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

Display module and system applications

本發明描述一種顯示器模組及包含一顯示器模組之系統應用。該顯示器模組可包含一顯示器基板，其包含一前表面、一後表面及該前表面上之一顯示區域。複數個互連件自該前表面延伸穿過該顯示器基板至該後表面。一陣列之發光二極體(LED)係位於該顯示區域中且與該複數個互連件電連接，且一或多個驅動器電路係位於該顯示器基板之該後表面上。例示性系統應用包含可穿戴、可捲動及可折疊顯示器。

Emission control apparatuses and methods for a display panel

Methods and apparatuses relating to controlling an emission of a display panel. In one embodiment, a display driver hardware circuit includes row selection logic to select a number of rows in an emission group of a display panel, wherein the number of rows is adjustable from a single row to a full panel of the display panel, column selection logic to select a number of columns in the emission group of the display panel, wherein the number of columns is adjustable from a single column to the full panel of the display panel, and emission logic to select a number of pulses per data frame to be displayed, wherein the number of pulses per data frame is adjustable from one to a plurality and a pulse length is adjustable from a continuous duty cycle to a non-continuous duty cycle.

Smart pixel lighting and display microcontroller

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Light emitting device reflective bank structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Smart pixel lighting and display microcontroller

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Pixel driver redundancy schemes

Display panel redundancy schemes and redundancy building blocks are described. In an embodiment, pixel driver chips are connected to both primary and redundant strings of LEDs within a local passive matrix, and driver terminal switches within the pixel driver chip are used to select either the primary or redundant strings of LEDs.

Circuitry for independent gamma adjustment points

A display architecture providing independent adjustment of gamma with respect to each color channel of a display is provided. In one embodiment, gamma adjustment circuitry may utilize separate resistor strings for each color channel of the display. Gamma adjustment voltage taps for each resistor string may each be coupled to a respective switching logic block that includes a plurality of switches, each of which may be coupled to different respective locations of the resistor string. Based upon a gamma correction profile defining optimal gamma adjustment points for a particular color channel based at least partially upon its transmittance sensitivity characteristics, appropriate control signals may be provided to each of the switching logic blocks to facilitate the connection of the gamma adjustment voltage taps to desired adjustment points on a respective resistor string in order to optimize gamma correction and provide for increased accuracy in color output.

Display panel redundancy schemes

Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.

Pixel driver redundancy schemes

Display panel redundancy schemes and redundancy building blocks are described. In an embodiment, pixel driver chips are connected to both primary and redundant strings of LEDs within a local passive matrix, and driver terminal switches within the pixel driver chip are used to select either the primary or redundant strings of LEDs.

Pixel Driver Redundancy Schemes

Display panel redundancy schemes and redundancy building blocks are described. In an embodiment, pixel driver chips are connected to both primary and redundant strings of LEDs within a local passive matrix, and driver terminal switches within the pixel driver chip are used to select either the primary or redundant strings of LEDs.

Buried Seam with Kirigami Pattern for 3D Micro LED Display

Display structures and methods of assembly are described. In an embodiment, a display structure includes a display panel including a pattern of trenches extending at least partially through a backplane of the display panel, without extending past a matrix of LEDs in an overlying emission layer stack. The plurality of trenches can be formed in 2D to facilitate bending of the display panel into a 3D film curvature.

Light emitting diode display with redundancy scheme

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Light emitting diode display with redundancy scheme

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Light emitting device reflective bank structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Electro-static discharge and electric overstress protection strategy for micro-chip array on panel

A display system includes an array of light emitting diodes (LEDs), first and second driver chips, and one or more protection chips on a display substrate. The first and second driver chips are to drive a first group of LEDs of the array of LEDs and a second group of LEDs of the array of LEDs, respectively. Each protection chip includes one or more electro-static discharge (ESD) protection devices to assist with protecting the driver chips from damage caused by an ESD event. In one embodiment, each ESD protection device is connected between one or more signal lines, one or more power supply voltage lines, and an electrical ground line of the display substrate. In one embodiment, at least one protection chip comprises one or more electric overstress (EOS) protection devices to assist with protecting the driver chips from damage caused by an EOS event.

Smart pixel lighting and display microcontroller

A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Display module and system applications

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Light emitting diode display with redundancy scheme

A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

Light emitting device reflective bank structure

Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Active matrix display panel with ground tie lines

A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Content-based adaptive refresh schemes for low-power displays

A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame.

Display with a reduced refresh rate

In one embodiment, a display system includes a display panel having a plurality of display elements, a scan driver to control a leaky switch to select a storage capacitor of a display element of the plurality of display elements to receive a data signal, and a data driver to provide the data signal to the storage capacitor when the leaky switch is in an on state at each of an on voltage to illuminate the display element and an off voltage and to hold the on voltage at an input of the leaky switch when the leaky switch is in an off state.

Display system with improved graphics abilities while switching graphics processing units

Methods and apparatuses are disclosed for improving graphics abilities while switching between graphics processing units (GPUs). Some embodiments may include a display system, including a plurality of graphics processing units (GPUs) and a memory buffer coupled to the GPUs via a timing controller, where the memory buffer stores data associated with a first video frame from a first GPU within the plurality of GPUs and where the timing controller is switching between the first GPU and a second GPU within the plurality.