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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 599. Отображено 145.
18-11-2015 дата публикации

Unidirectional rotation's bearing

Номер: CN0204784297U
Автор: LU WENLI, WANG YINGYI, ZHOU SHIJIAO
Принадлежит:

The utility model discloses an unidirectional rotation's bearing, it includes outer lane, inner circle, ball, holder and unidirectional rotation device, the outside edge of inner circle is provided with the annular tooth of a coaxial body coupling with it, the unidirectional rotation device includes base, restriction card strip and restriction pressure spring, the bottom surface and the inboard body coupling in outer lane of base, it is articulated with the base phase -match that the restriction blocks the terminal of strip, is somebody's turn to do the top and annular tooth phase -match joint of restriction card strip, restriction card strip side is equipped with the pressure spring and cup joints the lug, and the outer lane inboard is equipped with the pressure spring and cup joints the hole, the both ends of pressure spring are cup jointed lug and pressure spring with the pressure spring respectively and are cup jointed the hole phase -match and cup joint. The utility model discloses ...

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Номер записи: 1
11-06-2014 дата публикации

New method for comprehensive utilization of 1,4-butanediol distillation substrate

Номер: CN103849306A
Автор: ZHOU ZHEN, YAN LIXIU, ZHOU XIAOHUA, WAN YUPING, FENG LIN, LU WENLI
Принадлежит:

The invention provides a new method for comprehensively utilizing a 1,4-butanediol distillation substrate and in particular relates to a method for comprehensively utilizing 1,4-butanediol distillation substrate. The new method for comprehensively utilizing the 1,4-butanedio distillation substrate is that 1,4-butanedio distillation substrate is taken as a raw material and diluted firstly, so that a diluent is prepared, then grading ultrafiltration is carried out, and finally a cross linking reaction is carried out, so that alcohol ether oligomer spray drying powder and alcohol ether oligomer degradable paint are prepared. The new method for comprehensively utilizing a 1,4-butanedio distillation substrate has the characteristics of mild preparation conditions, simple operation steps, high product purity, high ratio of comprehensive utilization of resources, environment friendliness, no pollution and the like. The alcohol ether oligomer spray drying powder prepared by adopting the new method ...

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Номер записи: 2
21-10-2015 дата публикации

Elevator lift bearing

Номер: CN0204716752U
Автор: ZHOU SHIJIAO, WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses an elevator lift bearing, it includes the outer lane, the inner circle of suit in the outer lane, install a plurality of rolling elements between outer lane and inner circle through the holder, and the working of plastics of injection moulding outside the outer lane, annular positioning groove has been seted up on the outer lane, be provided with on the working of plastics and fix a position protrudingly with the annular positioning groove matched with annular, set up the crossing straight constant head tank with annular positioning groove on the outer wall of outer lane, be provided with on the working of plastics and directly fix a position the arch with straight constant head tank matched with. The utility model discloses a working of plastics injection moulding adopts constant head tank and the bellied cooperation in location moreover on the outer lane, the working of plastics is firmly connected on the outer lane, makes it rotate along with the outer lane ...

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Номер записи: 3
11-06-2014 дата публикации

Novel method for preparing skin-protective composite protein facial mask

Номер: CN103845228A
Автор: YU WENQIN, ZHOU XIAOHUA, YAN LIXIU, WAN YUPING, FENG LIN, LU WENLI
Принадлежит:

The invention provides a novel method for preparing a skin-protective composite protein facial mask. The method adopts commercial defatted rice protein and collagen as raw materials, and comprises the following steps: preparing a small-molecular rice protein peptide solution; preparing a small-molecular collagen peptide solution; preparing a composite protein solution; and preparing the composite protein facial mask. According to the produced composite protein facial mask, the effective component rice protein-collagen composite protein is bonded to cellulose non-woven fabric facial mask paper through an ether bond of glycidyl ether, the bonding is firm and cannot easily fall, the facial mask paper can be repeatedly used to reduce cost; the facial mask is mild and non-irritative to skin by combining the advantages of non allergy of rice protein and strong skin-protection of collagen; furthermore, the facial mask is weak in adsorption capacity to nutrition and functional factors, so that ...

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Номер записи: 4
22-07-2009 дата публикации

Bupropion hydrochloride sustained-release pellet and preparation method thereof

Номер: CN0101485633A
Автор: PING QINENG, LU WENLI, CHEN LINGPING, QINENG PING, WENLI LU, LINGPING CHEN
Принадлежит:

The invention relates to the field of a drug preparation, in particular to a hydrochloric acid bupropion slow release micro pill and a method for preparing the same. The micro pill consists of a drug containing pill core and a slow release coating layer which consists of slow release materials and a pore-forming agent, wherein the weight of the slow release materials against the weight of the drug containing pill core is between 8 and 15 percent, and the weight of the pore-forming agent against the weight of the slow release materials is between 1 and 6 percent. The micro pill does not need to be combined by a plurality of micro pills with different release modes, and only adopts a single micro pill to achieve the good release performance, thereby lowering production cost and simplifying production process.

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Номер записи: 5
18-07-2012 дата публикации

Multi-wire cutting machine mortar jet flow device

Номер: CN0101966727B
Автор: XIANCHENG LIU, WENLI LU, JIABIN LIU, JINGYING JIA, JIEHONG GONG, LIU XIANCHENG, LU WENLI, LIU JIABIN, JIA JINGYING, GONG JIEHONG
Принадлежит:

The invention discloses a multi-wire cutting machined mortar jet flow device, which is used in a multi-wire cutting machine for cutting semiconductor silicon chips or solar silicon cells in batch. The outer sleeve (1) of the device is fixedly provided with an inner pipe (2) of which one end is a mortar inlet and of which the other end is closed; an annular gap (6) is reserved between the outer wall of the inner pipe (2) and the inner wall of the outer sleeve (1); the upper part of the inner pipe (2) is provided with a plurality of small round holes (7) which are uniformly distributed along the axis of the inner pipe, and the small round holes (7) are communicated with the cavity of the inner pipe and the annular gap; and the lower side of the outer sleeve (1) has a slit open slot (8) along the axis. Due to the structural characteristics of the device and the changes of the flowing direction of the mortar in the device, the flow rate and density distribution uniformity of the mortar are ...

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Номер записи: 6
01-08-2023 дата публикации

Intermediate alloy containing rare earth and copper and preparation method thereof

Номер: CN116516193A
Автор: YANG HONGBO, LI SHUAN, YANG WENSHENG, WANG ZHIQIANG, DONG RUIFENG, MAO NING, LU WENLI, ZHANG XIAOQIANG, LIU XIN
Принадлежит:

The invention discloses an intermediate alloy containing rare earth and copper and a preparation method of the intermediate alloy. The intermediate alloy comprises rare earth metal and copper, the rare earth metal content is 10-90 wt%, the Cu content is 10-90 wt%, the density is 6.4 g/cm < 3 >-9.4 g/cm < 3 >, the melting point is 424-1006 DEG C, the oxygen content is smaller than 200 ppm, the carbon content is smaller than 300 ppm, the maximum size of inclusions is smaller than 50 micrometers, and the total amount of the inclusions is smaller than 0.5 wt%. By adjusting the proportion, density and melting point of the intermediate alloy containing the rare earth and the copper, the intermediate alloy can quickly enter the middle part or the middle lower part of the molten copper after being added into the molten copper, the rare earth and a copper matrix are fully mixed, and the effect of the rare earth is improved.

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Номер записи: 7
17-08-2021 дата публикации

Agricultural product intelligent logistics packaging device and method

Номер: CN113264242A
Автор: LU WENLI, 路文利
Принадлежит:

The invention discloses an agricultural product intelligent logistics packaging device and method, and belongs to the technical field of agricultural product packaging. The intelligent logistics packaging device comprises a base and is characterized in that supports which are symmetrically distributed left and right are slidably connected to the two sides of the base, and first reset springs are fixedly connected between the bottoms of the supports and the base; fixing rods which are symmetrically distributed front and back are jointly and fixedly connected between the two supports, and a supporting plate is jointly connected to the surfaces of the two fixing rods in a left-right sliding mode; and the supports are arranged and matched with the first reset springs so that the supports can be tightly attached to the surfaces of pumpkins, protruding pumpkin vines can be conveniently removed as much as possible, a cutting chain can accurately and automatically position the pumpkin vines between ...

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Номер записи: 8
28-10-2015 дата публикации

Bearing convenient to installation is dismantled

Номер: CN0204729472U
Автор: ZHOU SHIJIAO, LU WENLI
Принадлежит:

The utility model discloses a bearing convenient to installation is dismantled, it includes the outer lane, a plurality of rolling elements between outer lane and inner circle are installed through the holder to the inner circle of suit in the outer lane, the rolling element is the spheroid, the holder is formed by connecting to after closing half holder on the left side and half right holder, is provided with the buckle on the half left holder, seted up on the half right holder with buckle matched with card hole. The utility model discloses a set up matched with buckle and card hole, the split of the half left and right holder of being convenient for is provided with wear -resisting circle moreover, extend bearing's life.

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Номер записи: 9
24-02-2016 дата публикации

Appearance lower jaw strutting arrangement far away is looked in study

Номер: CN0205041606U
Автор: DONG ZHANZHUO, HU YUANSHENG, LU WENLI
Принадлежит:

The utility model discloses an appearance lower jaw strutting arrangement far away is looked in study relates to the protector technical field of eyes. The utility model discloses be applied to study and look appearance far away, the support arm of lens hood both sides is fixed in including the activity to and be located the lower jaw protector at support arm middle part, the support arm is rotatory around the movable fixed point with the lens hood to set up the angle scale at rotatory position, lower jaw protector is equipped with the recess. The utility model discloses the support arm is rotatory fixed around the movable fixed point with the lens hood, measure with the angle scale, play the memory function, can adjust to the right place through the knob according to angle numerical value is direct after knowing, the present invention is convenient for users, the lower jaw protector who is located the support arm middle part can rotate, during user's activity lower jaw, lower jaw protector ...

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Номер записи: 10
20-08-2003 дата публикации

Circulating tea-flatting machine

Номер: CN0001436473A
Автор: LU WENLI, WENLI LU
Принадлежит:

The circulating tea-flatting machine includes system unit, heat source below the system unit, transmission mechanism connected to the system unit and operation mechanism connected to the transmissionmechanism. The system unit includes support, semi-circular pot, pressing board assembly, backing plate assembly, straightening board assembly, pressing board frame assembly, baffle assembly and shaft; the transmission mechanism includes shaft, operation support, motor, reducer, reducer frame, adjustable shaft bearing assembly, pulley set and chain wheel-chain combination. The circulating tea-flatting machine can complete pressing, straightening and other tea stir-frying courses to flatten, tighten and straighten tea in high efficiency.

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Номер записи: 11
04-04-2023 дата публикации

Rare earth iron alloy cored wire and preparation method thereof

Номер: CN115896394A
Автор: DONG RUIFENG, YANG WENSHENG, MAO NING, LI SHUAN, CHEN DEHONG, WANG ZHIQIANG, LU WENLI, ZHANG DONGWEI, PANG ZENGDONG, LIU DEZHONG
Принадлежит:

The invention discloses a rare earth iron alloy cored wire which comprises a core part and a protective layer, the core part is a rare earth iron alloy, the mass percentage of iron in the rare earth iron alloy is 10-85 wt.%, and the mass percentage of rare earth is 15-90 wt.%; and the protective layer is one of low-oxygen pure iron, low-carbon steel and ultra-low-carbon steel. The rare earth-iron alloy cored wire is prepared by taking rare earth-iron alloy powder as a core part and one of low-oxygen pure iron, low-carbon steel and ultra-low-carbon steel as an outer layer, and rare earth metal and iron are molten together in advance, so that rare earth oxidation is effectively prevented, introduction of rare earth oxide is reduced, and the melting point and density of the material are improved; in the using process, rare earth metal and inclusions of the rare earth metal can be effectively prevented from floating upwards to react with casting powder, the property of the casting powder is ...

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Номер записи: 12
21-10-2015 дата публикации

Deep groove ball bearing

Номер: CN0204716745U
Автор: ZHOU SHIJIAO, WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses a deep groove ball bearing, including outer lane, inner circle, holder, shield and location closing cap, the outer lane axial is cup jointed in the inner circle, region between inner circle and the outer lane is placed a plurality of and is used the spin of outer lane as axle center uniform annular, a plurality of spin is passed through the holder and is formed a whole, the axial both ends that are close to its medial surface in the outer lane are provided with the breach of a rectangle, the outside of shield is along being provided with a curved turn -up, the turn -up is located the breach, location closing cap coaxial arrangement on the axial terminal surface of outer lane, should fix a position the closing cap towards the one side of breach for the inclined plane, inclined plane and turn -up joint. The utility model discloses an it is very convenient that deep groove ball bearing dismantles the shield, can not damage it again.

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Номер записи: 13
29-09-2020 дата публикации

Twin-screw dry granulation for producing solid formulations

Номер: US0010786459B2
Автор: Sampada Bhaskar Upadhye, Ronald S. Vladyka, R.ph, Michael Andrew Repka, Jun-Bom Park, Roshan Vijay Tiwari, Hemlata Gunga Patil, Joseph Thomas Morott, Jr., Wenli Lu, UPADHYE SAMPADA BHASKAR, VLADYKA R PH RONALD S, REPKA MICHAEL ANDREW, PARK JUN-BOM, TIWARI ROSHAN VIJAY, PATIL HEMLATA GUNGA, MOROTT JR JOSEPH THOMAS, LU WENLI, Upadhye, Sampada Bhaskar, Vladyka, R.ph, Ronald S., Repka, Michael Andrew, Park, Jun-Bom, Tiwari, Roshan Vijay, Patil, Hemlata Gunga, Morott, Jr., Joseph Thomas, Lu, Wenli
Принадлежит: R. P. Scherer Technologies LLC, University of Mississippi, SCHERER TECHNOLOGIES LLC R P, UNIV MISSISSIPPI, UNIVERSITY OF MISSISSIPPI

A dry granulation process using a twin-screw extruder for granulating a powder mixture which includes at least one active ingredient and at least one carrier. The process includes steps of kneading the powder mixture in the screw barrel of the twin-screw extruder at a barrel temperature below a melting point of the at least one active ingredient and a melting point or a glass transition temperature of the at least one carrier to provide a kneaded powder mixture, and extruding the kneaded powder mixture to form granules. Granules and tablets produced using the dry granulation process in the twin-screw extruder are also provided.

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Номер записи: 14
28-10-2015 дата публикации

But diameter runout's bearing

Номер: CN0204729468U
Автор: LU WENLI, ZHOU SHIJIAO
Принадлежит:

The utility model discloses a but diameter runout's bearing, it includes outer lane (1), inner circle (2), ball (3), support frame (4) and outer lane mount (5), outer lane mount (5) and outer lane (1) clearance are mated and are cup jointed, are provided with cylinder slide bar (51) of a body coupling with it in these outer lane mount (5), are provided with on outer lane (1) and mate radial hole (11) of cup jointing with cylinder slide bar (51). The utility model adopts the above structure for the radial movement of by a small margin can be carried out for the outer lane mount in the interior outer lane of this bearing, is used for satisfying the diameter runout of portion rotating axle, thereby lightens the radial effort to the bearing, improves the life of bearing.

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Номер записи: 15
05-11-2020 дата публикации

TWIN-SCREW DRY GRANULATION FOR PRODUCING SOLID FORMULATIONS

Номер: US20200345643A1
Автор: Sampada Bhaskar Upadhye, Ronald S. Vladyka, Michael Andrew Repka, Jun-Bom Park, Roshan Vijay Tiwari, Hemlata Gunga Patil, Joseph Thomas Morott, JR., Wenli Lu, UPADHYE SAMPADA BHASKAR, VLADYKA RONALD S, REPKA MICHAEL ANDREW, PARK JUN-BOM, TIWARI ROSHAN VIJAY, PATIL HEMLATA GUNGA, MOROTT JR JOSEPH THOMAS, LU WENLI, Upadhye, Sampada Bhaskar, Vladyka, Ronald S., Repka, Michael Andrew, Park, Jun-Bom, Tiwari, Roshan Vijay, Patil, Hemlata Gunga, Morott, JR., Joseph Thomas, Lu, Wenli
Принадлежит: R.P. Scherer Technologies, LLC, UNIVERSITY OF MISSISSIPPI

A dry granulation process using a twin-screw extruder for granulating a powder mixture which includes at least one active ingredient and at least one carrier. The process includes steps of kneading the powder mixture in the screw barrel of the twin-screw extruder at a barrel temperature below a melting point of the at least one active ingredient and a melting point or a glass transition temperature of the at least one carrier to provide a kneaded powder mixture, and extruding the kneaded powder mixture to form granules. Granules and tablets produced using the dry granulation process in the twin-screw extruder are also provided.

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Номер записи: 16
08-04-2009 дата публикации

Self-emulsifying formulation of biphenyldicarboxylate and preparation method thereof

Номер: CN0101401788A
Автор: PING QINENG, LU WENLI, WANG SHAN, SONG YUNMEI, QINENG PING, WENLI LU, SHAN WANG, YUNMEI SONG
Принадлежит:

The invention relates to the field of pharmaceutical preparation, in particular to a bifendate self-emulsifying preparation and a method for preparing the same. The bifendate self-emulsifying preparation is characterized by adopting the mixture of polyethylene glycol-12-hydroxy-stearic acid ester and polyoxyethylene hydrogenated castor oil or the mixture of the polyethylene glycol-12-hydroxy-stearic acid ester and polyoxyethylene castor oil as an emulsifier. The bifendate self-emulsifying preparation is emulsified spontaneously to form micro-emulsion droplets of which the particle diameter is less than 200 nanometers after oral administration, thereby enhancing the solubility and the dissolving speed of the bifendate so as to improve the bioavailability of bifendate. At the same time, the bifendate self-emulsifying preparation prepared by adding a solid adsorption material into a liquid self-emulsifying preparation not only effectively improves the defects of liquid preparations in production ...

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Номер записи: 17
25-08-2023 дата публикации

Additive for magnesium alloy and preparation method thereof

Номер: CN116640956A
Автор: LI SHUAN, DONG RUIFENG, YANG BINGZHENG, YANG HONGBO, WANG ZHIQIANG, YANG WENSHENG, MAO NING, LU WENLI, GAO YONG, QI SONGBAI, ZHANG DONGWEI
Принадлежит:

The invention discloses an additive for magnesium alloy and a preparation method thereof, and the additive for magnesium alloy is of a porous structure and comprises rare earth metal and magnesium, the content of rare earth metal is 2.3 wt%-95 wt%, and the content of magnesium is 5 wt%-97.7 wt%; the density of the additive for the magnesium alloy ranges from 1.77 g/cm < 3 > to 6.44 g/cm < 3 >, the melting point ranges from 449 DEG C to 900 DEG C, O is smaller than 0.02 wt%, C is smaller than 0.03 wt%, P is smaller than 0.01 wt%, and S is smaller than 0.01 wt%. The magnesium alloy additive of a porous structure is adopted, the density and melting point of the additive are adjusted, the specific surface area of the intermediate alloy is increased, the buoyancy and viscous resistance of the intermediate alloy are improved, it is guaranteed that the intermediate alloy does not make contact with the bottom of a molten pool, and the dispersion condition of rare earth in molten liquid is improved ...

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Номер записи: 18
09-05-2012 дата публикации

Self-emulsifying formulation of biphenyldicarboxylate and preparation method thereof

Номер: CN0101401788B
Автор: LU WENLI, PING QINENG, WANG SHAN, SONG YUNMEI, WENLI LU, QINENG PING, SHAN WANG, YUNMEI SONG
Принадлежит:

The invention relates to the field of pharmaceutical preparation, in particular to a bifendate self-emulsifying preparation and a method for preparing the same. The bifendate self-emulsifying preparation is characterized by adopting the mixture of polyethylene glycol-12-hydroxy-stearic acid ester and polyoxyethylene hydrogenated castor oil or the mixture of the polyethylene glycol-12-hydroxy-stearic acid ester and polyoxyethylene castor oil as an emulsifier. The bifendate self-emulsifying preparation is emulsified spontaneously to form micro-emulsion droplets of which the particle diameter isless than 200 nanometers after oral administration, thereby enhancing the solubility and the dissolving speed of the bifendate so as to improve the bioavailability of bifendate. At the same time, thebifendate self-emulsifying preparation prepared by adding a solid adsorption material into a liquid self-emulsifying preparation not only effectively improves the defects of liquid preparations in production ...

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Номер записи: 19
14-04-2023 дата публикации

Steel-concrete combined section

Номер: CN115961539A
Автор: SHANG GUANBING, SU QINGTIAN, SU HANG, WANG SHENGYUN, ZHANG GUOXUAN, LU WENLI, LI BO
Принадлежит:

The invention is applied to the field of bridges, and particularly relates to a steel-concrete combined section, the steel-concrete combined section is used for being arranged between a concrete transition section and a steel beam transition section, the steel-concrete combined section comprises a concrete cast-in-place section and a steel beam connecting section, and the concrete cast-in-place section is used for being connected with the concrete transition section; one end of the steel beam connecting section is connected with the steel beam transition section, the other end of the steel beam connecting section is connected with the concrete cast-in-place section, the connecting face of the steel beam connecting section and the concrete cast-in-place section is of a step-shaped structure in the main pressure stress direction of a main beam, and a pressure-bearing steel plate is arranged on the step-shaped structure. The steel-concrete combined section with the step-shaped combined surface ...

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Номер записи: 20
07-07-2023 дата публикации

Treatment and recovery method and system for waste gas containing hydrogen fluoride

Номер: CN116392949A
Автор: ZHAO YONGLU, LU WENLI, WANG SHIGANG, TAN HANMING, ZHANG ZUOQI, MA XIONGYA, WANG FUBING, ZHANG ANJIANG, YAN ZHIGANG, QI ZHENGLIANG, LUO SHULEI, LIAN ZHENG, WEI CHANGLAI
Принадлежит:

The invention belongs to the technical field of process waste gas treatment and recovery, and particularly relates to a hydrogen fluoride-containing waste gas treatment and recovery method and system, the system at least comprises: a quenching absorption tower, the feed port of which is communicated with a hydrogen fluoride waste gas pipeline, the tower top spray liquid inlet of which is communicated with an ammonia water absorption liquid pipeline, and the exhaust port of which is communicated with an unabsorbed gas discharge pipeline; a feed port of the liquid conveying equipment is communicated with a liquid phase discharge port of the quenching absorption tower, and a discharge circulation port of the liquid conveying equipment is communicated with a tower top spray liquid inlet of the quenching absorption tower through an absorption liquid circulation pipeline; a feeding hole of the evaporative crystallization equipment is communicated with a product discharging hole of the liquid ...

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Номер записи: 21
21-05-2014 дата публикации

Method for preparing antibacterial, degradable cationic cassia bean gum polymer

Номер: CN103804505A
Автор: FENG LIN, YAN LIXIU, WAN YUPING, LU WENLI, ZHOU XIAOHUA
Принадлежит:

The invention relates to a method for preparing an antibacterial degradable cationic cassia bean gum polymer. According to the method, an alkaline cationic etherifying agent is prepared with cassia beam gum as the raw material, then a hydrated cassia bean gum alkaline cationic etherifying agent mixture and a hammering etherifying agent are prepared respectively, subsequently cationic cassia bean gum dried powder is prepared, and finally cationic cassia bean gum polymer is prepared. The cationic cassia bean gum polymer produced according to the method combines 1,2-cyclohexyl bis glycidyl ether, or 1,4-butanediol diglycidyl ether or ethylene glycol diglycidyl ether to firmly adhere titanium phosphate to the indoor wall of a building, has no bubbles and cracks, does not fall off and has no moulds; no bacterial colonies are found and the film is in good condition after the polymer is coated on a glass plate, put into water and then stored tightly for 90 days; the coating film can be totally ...

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Номер записи: 22
21-05-2014 дата публикации

Pharmaceutical application of akebin E

Номер: CN103800351A
Автор: FANG ZHAOQIN, XU JI, REN HONGYAN, LIANG CHAO, LU WENLI, ZHANG YUANYUAN, PAN ZHIQIANG, LIU XIAOMEI
Принадлежит:

The invention discloses a pharmaceutical application of akebin E. The pharmaceutical application is to prepare anti-tumor drugs with akebin E as one of the active ingredients or a sole active ingredient. Study results show that akebin E can inhibit malignant proliferation of liver cancer cells, lung cancer cells, breast cancer cells, stomach cancer cells and other tumor cells by inducing severe endoplasmic reticulum stress, and can be widely used in preparing pharmaceutical preparations for treating primary liver cancer, lung cancer, breast cancer, stomach cancer and other malignant tumors. When akebin E is used in combination with other therapeutic drugs or chemotherapeutic drugs, the drug resistance of tumor cells is decreased due to endoplasmic reticulum stress, and cell apoptosis or death is accelerated, so that dose reduction and efficacy enhancement are achieved, the toxic and adverse effects of drugs are reduced, the treatment opportunity of patients is increased, and the effective ...

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Номер записи: 23
22-12-2004 дата публикации

一种稳定性提高的灯盏花素注射剂及其制备方法

Номер: CN0001555807A
Автор: GUO JIANXIN, PING QINENG, LU WENLI, JIANXIN GUO, QINENG PING, WENLI LU, 郭健新
Принадлежит:

A breviscapine injection or perfusion in the form of liquid or powder is prepared from breviscapine, medicinal organic alkali, medicinal organic acid, antioxidizing agent, isotonic agent and water for injection. Its advantages are its improving stability, high transparency and low dosage.

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Номер записи: 24
07-10-2015 дата публикации

Motor lift bearing

Номер: CN0204692318U
Автор: ZHOU SHIJIAO, WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses a motor lift bearing, including outer lane, inner circle, shield and the increment cover the same with the inner circle external diameter and the axial face is connected, the outer lane axial circles including cup jointing the ball support that is provided with the ball between inner circle and the outer lane and is used for the support roll pearl, prevent dust and be stamped two axial both ends that lie in the outer lane respectively, the interior border of outer lane is provided with the annular, the joint is followed in the annular in the outside of shield, the axial one end of increment cover is provided with a plurality of uniform annular's the locating lever and the screw of activity, the axial one end of inner circle be provided with with the locating hole of locating lever cooperation joint and with the nut of screw connection. The utility model discloses a motor lift bearing has reduced use cost effectively.

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Номер записи: 25
18-08-2023 дата публикации

Process method and system for recovering hydrogen fluoride from iron trifluoride-containing mixture

Номер: CN116605841A
Автор: LU WENLI, TAN HANMING, YIN JIE, WANG FUBING, YAN ZHIGANG, ZHANG ZHAOBIN, WANG ZHIGUO, WANG SHIGANG, MA XIONGYA, YANG DONG, ZHANG ANJIANG, LIU KAI, QI ZHENGLIANG
Принадлежит:

The invention belongs to the technical field of titanium dioxide production by a fluorination method, and particularly relates to a process method and system for recovering hydrogen fluoride from a mixture containing ferric fluoride. The method at least comprises the following steps: 1) firstly heating solid residues containing FeF3 through a solid residue preheater; (2) carrying out pyrohydrolysis reaction on the preheated solid residues and high-temperature steam in a pyrohydrolysis furnace; and (3) discharging a solid-phase product Fe2O3 after the pyrohydrolysis reaction into a Fe2O3 cooler for cooling. Solid residues mainly containing FeF3 are heated by a solid residue preheater and then enter a thermal hydrolysis furnace, and Fe2O3 and hydrogen fluoride gas can be generated after the solid residues react with high-temperature steam in the thermal hydrolysis furnace. And then the solid material Fe2O3 discharged from the pyrohydrolysis furnace can be stored after being cooled by a Fe2O3 ...

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Номер записи: 26
21-10-2015 дата публикации

Ball bearing

Номер: CN0204716746U
Автор: ZHOU SHIJIAO, WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses a ball bearing, it includes outer lane (1) and ball (2), the inside wall of outer lane (1) is provided with a plurality of ball hole (11), ball hole (11) be with the big hemisphere hole of ball (2) assorted, these ball hole (11) are the axle center with the axial lead of outer lane (1) and are circular array evenly distributed on the inside wall of outer lane (1), ball (2) inlay card is gone into in ball hole (11). The utility model adopts the above structure, simple structure is practical, can directly support rotation axis relative motion through the ball on the inside wall of outer lane.

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Номер записи: 27
09-02-2011 дата публикации

Multi-wire cutting machine mortar jet flow device

Номер: CN0101966727A
Автор: XIANCHENG LIU, WENLI LU, JIABIN LIU, JINGYING JIA, JIEHONG GONG, LIU XIANCHENG, LU WENLI, LIU JIABIN, JIA JINGYING, GONG JIEHONG
Принадлежит:

The invention discloses a multi-wire cutting machined mortar jet flow device, which is used in a multi-wire cutting machine for cutting semiconductor silicon chips or solar silicon cells in batch. The outer sleeve (1) of the device is fixedly provided with an inner pipe (2) of which one end is a mortar inlet and of which the other end is closed; an annular gap (6) is reserved between the outer wall of the inner pipe (2) and the inner wall of the outer sleeve (1); the upper part of the inner pipe (2) is provided with a plurality of small round holes (7) which are uniformly distributed along the axis of the inner pipe, and the small round holes (7) are communicated with the cavity of the inner pipe and the annular gap; and the lower side of the outer sleeve (1) has a slit open slot (8) along the axis. Due to the structural characteristics of the device and the changes of the flowing direction of the mortar in the device, the flow rate and density distribution uniformity of the mortar are ...

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Номер записи: 28
08-10-2008 дата публикации

Metformin hydrochloride and Glipizide sustained-release pellet and method of preparing the same

Номер: CN0101278919A
Автор: PING QINENG, FAN WENYUAN, XIAO YANYU, LU WENLI, CAO FENG, QINENG PING, WENYUAN FAN, YANYU XIAO, WENLI LU, FENG CAO
Принадлежит:

The invention discloses a metformin hydrochloride and glipizide sustained-release pellet and a preparation method thereof. In the preparation method, a sustained release coated pellet of the metformin hydrochloride and a sustained release pellet of the glipizide are prepared respectively; and the two pellets are filled in capsules in a proportion of 250g-500g of the metformin hydrochloride and 2.5g-10g of the glipizide in every 1000 capsules; wherein, the coated pellet of the metformin hydrochloride is prepared by pill pericardium sustained release coating membrane; the sustained release pellet of the glipizide is prepared directly by extrusion-spheronization method. In the invention, the two pellets are filled into one capsule, thereby being convenient for quality control; octodecyl alcohol is taken as sustained release material for the sustained-release pellet of the glipizide, which is convenient for the forming of the pellet so as to reduce bursting release effectively. The metformin ...

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Номер записи: 29
08-08-2023 дата публикации

Rare earth additive for copper and copper alloy and preparation method of rare earth additive

Номер: CN116555609A
Автор: YANG WENSHENG, MAO NING, YANG HONGBO, LU WENLI, WANG ZHIQIANG, DONG RUIFENG, LI SHUAN, HAN LIGUO, YANG ZIKUN, ZHANG YIBO
Принадлежит:

The invention discloses a rare earth additive for copper and copper alloy and a preparation method of the rare earth additive, the rare earth additive comprises a sealing shell and a plurality of internal alloys arranged in the sealing shell, and inert gas with a first preset pressure value is contained in the sealing shell; the sealing shell is made of copper; the internal alloy comprises rare earth metal, copper and transition metal, the content of the rare earth metal is 5 wt%-95 wt%, the content of the copper is 5 wt%-90 wt%, the content of the transition metal is 0 wt%-35 wt%, the oxygen content is smaller than 90 ppm, and the average size of inclusions is smaller than 30 micrometers. By introducing inert gas with a preset pressure value, as the shell is melted and thinned and the gas is heated to expand, the internal intermediate alloy breaks through the shell under the positive pressure of the gas and uniformly diffuses to the periphery of the solution, so that the intermediate alloy ...

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Номер записи: 30
12-05-2023 дата публикации

Rare earth metal deoxidation method and deoxidation device

Номер: CN116103703A
Автор: PAN BO, CHEN DEHONG, YU CHUANG, LU WENLI, ZHANG XIAOWEI, YANG WENSHENG, ZHANG DONGWEI, WANG YIXUAN
Принадлежит:

The embodiment of the invention relates to a rare earth metal deoxidation method and a deoxidation device. The method comprises the following steps: placing a rare earth metal bar in a molten salt system; heating to melt the molten salt system at a preset temperature, and keeping the rare earth metal bar in a solid state; the rare earth metal bar is connected to a solid-state electromigration power source, and the direct current of the electromigration direct current power source is started and slowly increased at the preset temperature; adjusting the temperature of the rare earth metal bar to be kept at a preset temperature, and starting to calculate the electromigration time t; when the electromigration time is calculated, an electrochemical deoxidation direct-current power supply is turned on; after a first preset time, the voltage is kept unchanged; and after a second preset time, turning off the solid-state electromigration power supply and the electrochemical deoxidation power supply ...

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Номер записи: 31
27-05-2009 дата публикации

Pharmaceutical composition containing lycopene and preparation method thereof

Номер: CN0101439030A
Автор: QINENG PING, WENLI LU, FEI RONG, MAO MAO, PING QINENG, LU WENLI, RONG FEI
Принадлежит:

The invention relates to the pharmaceutical preparation field, in particular to a pharmaceutical composition with lycopene. The pharmaceutical composition is characterized in that poloxamer 188 is added so as to greatly improve the water solubility of the lycopene; in particular, after the lycopene and the poloxamer 188 are prepared into solid dispersion or, together with cyclodextrin, are prepared into a cyclodextrin iclusion complex, bioavailability of the lycopene is remarkably improved.

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Номер записи: 32
07-10-2015 дата публикации

Ball mouth bearing is filled out in area

Номер: CN0204692317U
Автор: WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses a ball mouth bearing is filled out in area, including outer lane, first inner circle, 2 second inner circles and 2 spin mechanisms, the inboard of outer lane is provided with a bellied first step face in centre and is located first step face controls the second step face of both ends and indent, be provided with sunken first fillet between first step face and the second step face, first inner circle and 2 second inner circles all coaxial and set up in the inboard of outer lane with the outer lane, and wherein the second inner circle sets up respectively in the left and right sides of first inner circle and rather than threaded connection, the lateral surface diameter of second inner circle is less than the lateral surface of first inner circle, and the lateral surface of second inner circle is provided with the second fillet of indent, 2 individual spin mechanism all sets up in the clearance between outer lane and first inner circle to be located the left and ...

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Номер записи: 33
21-10-2015 дата публикации

Take locking device's bearing

Номер: CN0204716747U
Автор: WANG YINGYI, LU WENLI
Принадлежит:

The utility model discloses a take locking device's bearing, it includes outer lane, inner circle, ball, holder and locking device, locking device includes guide rod, locking gear and ejector pin, guide rod, locking gear and ejector pin be the coaxial coupling in proper order, the inboard of outer lane is equipped with guide board, semicircle gear locking groove, gear baffle and outer baffle, the guide be equipped with on the board with guide rod assorted guiding groove, be equipped with on the gear baffle with ejector pin assorted through -hole, be equipped with on the outer baffle with ejector pin assorted hole, semicircle gear locking groove is located between guide board and the gear baffle, and cup joint with locking gear phase -match in this semicircle gear locking groove, the axial side of inner circle is equipped with and locks gear assorted annular tooth. The utility model discloses the above -mentioned locking device who sets up, relative motion is not made with the outer lane ...

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Номер записи: 34
25-08-2023 дата публикации

Porous-structure rare earth aluminum intermediate alloy additive and preparation method thereof

Номер: CN116640967A
Автор: LU WENLI, YANG HONGBO, WANG ZHIQIANG, YANG WENSHENG, LI SHUAN, MAO NING, DONG RUIFENG, ZHANG XIAOWEI, CHENG JUN, QIN GUOHUA
Принадлежит:

The invention discloses a porous-structure rare earth-aluminum intermediate alloy additive and a preparation method thereof, the porous-structure rare earth-aluminum intermediate alloy additive comprises rare earth and aluminum, and the rare earth-aluminum intermediate alloy additive is of a porous structure; wherein the weight percentage of each component is as follows: 1.0%-97.5% of rare earth, 2.5%-99.0% of aluminum, less than 0.02% of O, less than 0.03% of C, less than 0.01% of P and less than 0.01% of S; the density is 2.70 g/cm < 3 > to 8.84 g/cm < 3 >, and the melting point is 547 DEG C to 1150 DEG C. By adopting the rare earth aluminum alloy additive with the porous structure, the contact area between the additive and an aluminum alloy melt is increased, the dissolution rate of the additive is increased, the buoyancy and viscous resistance of the additive in the melt are improved, and the technical problem that an intermediate alloy additive rapidly sinks to the bottom due to overhigh ...

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Номер записи: 35
29-07-1998 дата публикации

Fruit tree nutrient solution

Номер: CN0001188597A
Автор: LU WENLI, WENLI LU
Принадлежит:

A nutritive liquid for preventing and eliminating nutrient-deficiency diseases of fruit tree, promoting growth of fruit tree and increasing yield of fruit by spraying it onto leaves and fruit contains beta-cyclodextrin, trace elements including B, Zn, Ca, P and K, and active emulsifier and features balanced nutrients, high adhesion and penetrability, and easy absorption.

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Номер записи: 36
17-08-2021 дата публикации

Pretreatment equipment for bearing assembly

Номер: CN113263295A
Автор: LU KAI, LI PEIYAO, LU WENLI, 卢锴, 李培尧, 卢文立
Принадлежит:

The invention discloses pretreatment equipment for bearing assembly, and relates to the field of industrial technology. The pretreatment equipment for bearing assembly comprises a placing bin, and a support frame and a heating block which are installed on the placing bin, wherein a stirring device is movably connected into the placing bin, and performs circular motion in the placing bin through a rotating device; a conical hole is formed in the stirring device, and is used for extruding bubbles generated during pretreatment; a limiting device is installed on the inner wall of the placing bin, and comprises a steel ring; and the steel ring is connected to the inner wall of the placing bin. According to the pretreatment equipment for bearing assembly provided by the invention, the inner wall of the placing bin is provided with a storage groove and an extrusion block; and when the stirring device rotates, the stirring device is limited by the storage groove and the extrusion block, the stirring ...

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Номер записи: 37
18-07-2023 дата публикации

Test system of flow control valve and control method of test system

Номер: CN116448405A
Автор: HE JING, LU WENLI, CAI ZHENHUI, YANG DIANYONG, WANG GUOZHENG, LI KUO
Принадлежит:

The invention relates to a test system of a flow control valve and a control method of the test system. Comprising a fuel supply module which is respectively communicated with an inflow port and an outflow port of a to-be-tested flow control valve and is used for providing fuel with preset pressure for the flow control valve, the fuel supply module and the inflow port and the outflow port of the flow control valve form a loop, and the flow control valve comprises a sealing chamber arranged between the inflow port and the outflow port; the flow sensor is arranged at the flow outlet of the flow control valve and used for measuring the first flow at the flow outlet of the flow control valve; the pressure sensor is communicated with the sealed chamber and is used for measuring the pressure in the sealed chamber; the processing module is electrically connected with the flow sensor and the pressure sensor and used for determining the characteristics of the flow control valve according to the ...

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Номер записи: 38
11-08-2023 дата публикации

Rare earth-containing additive and preparation method thereof

Номер: CN116574864A
Автор: YANG HONGBO, LI SHUAN, WANG ZHIQIANG, ZHANG XIAOWEI, MAO NING, DONG RUIFENG, YANG WENSHENG, LU WENLI, PANG ZENGDONG, HAN LIGUO
Принадлежит:

The invention discloses a rare earth-containing additive and a preparation method thereof. The rare earth-containing additive comprises a closed shell and a plurality of intermediate alloys arranged in the shell, wherein the intermediate alloy contains rare earth elements; the shell is filled with gas with preset pressure. By adopting a gas-solid two-phase structure sealed in the additive shell, after the additive is added into molten steel, as the wall of the shell is thinned, gas breaks through the shell to push the internal solid additive to all directions, and the distribution uniformity of rare earth in a final product and the yield of the rare earth are improved.

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Номер записи: 39
30-09-2015 дата публикации

Low noise bearing

Номер: CN0204677604U
Автор: WANG YINGYI, ZHOU SHIJIAO, LU WENLI
Принадлежит:

The utility model discloses a low noise bearing, including outer lane, inner circle, ball mechanism, 2 shields and a plurality of locking mechanism, place in proper order from inside to outside inner circle, ball mechanism and outer lane, the inner circle passes through the cooperation transmission of ball mechanism with the outer lane and is connected, locking mechanism includes holding screw, latch segment, briquetting and spring, the axial terminal surface of outer lane is provided with first through -hole, the outer disc of outer lane is provided with the second through -hole that feeds through with first through -hole, spring, briquetting and holding screw place in proper order in first through -hole, and holding screw and first through -hole threaded connection, first through -hole axially movable is followed to the briquetting, the latch segment is pegged graft in the second through -hole to all be provided with the inclined plane with the briquetting, the briquetting makes the latch ...

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Номер записи: 40
03-12-2008 дата публикации

Glipizide calcium alginate gel rubber pellet and preparation method thereof

Номер: CN0101313892A
Автор: PING QINENG, FAN WENYUAN, XIAO YANYU, LU WENLI, CAO FENG, QINENG PING, WENYUAN FAN, YANYU XIAO, WENLI LU, FENG CAO
Принадлежит:

The invention relates to a glipizide calcium alginate gel micro pill and a preparation method thereof, belonging to the medical technical field. In the method, mixture solution of glipizide and alginic acid sodium salt is prepared, wherein, the glipizide and the alginic acid sodium salt can be mixed and then put into a solvent, or the glipizide is put into a solution of the alginic acid sodium salt solution; the ratio of the alginic to the alginic acid sodium salt is between 10 to 1 and 1 to 10(w/w), and the concentration of the alginic acid sodium salt is between 0.5 and 5.0 percent; the mixture solution is added to a solution of calcium chloride in the condition of stirring, and reacts for 1 minute to 72 hours; products are filtered, taken out, washed and dried to obtain the glipizide calcium alginate gel micro pill. The preparation method adopts a calcium alginate micro pill as carrier, prepares the glipizide calcium alginate gel micro pill by dropping method in one step, has simple ...

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Номер записи: 41
04-04-2023 дата публикации

Iron-copper-rare earth intermediate alloy and preparation method thereof

Номер: CN115896603A
Автор: YANG WENSHENG, HUANG XIAOWEI, MAO NING, WANG ZHIQIANG, CHEN DEHONG, PAN BO, YU CHUANG, LU WENLI, ZHANG DONGWEI, LIU XIN, HAN LIGUO, PANG ZENGDONG
Принадлежит:

The invention relates to an iron-copper-rare earth intermediate alloy and a preparation method thereof, the intermediate alloy comprises the following components in percentage by weight: 40-90% of iron, 5-30% of copper and 5-30% of rare earth metal, and the density of the iron-copper-rare earth intermediate alloy is 7.80-7.92 g/cm < 3 >. By introducing high-density antioxidant copper elements, the rare earth additive with the density similar to that of molten steel is obtained, the rare earth is uniformly distributed in the molten steel, the occurrence state of the rare earth in the intermediate alloy is changed, and the rare earth additive is effectively prevented from being oxidized in the storage and use processes. The problem of effective addition of rare earth in the steelmaking process at present is effectively solved.

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Номер записи: 42
06-01-2010 дата публикации

Combined attenuated live vaccine for measles, mumps and encephalitis B and preparation method thereof

Номер: CN0101618213A
Автор: PINGPING LI, LILI JIA, XIAOMING YANG, ZHIZHENG FANG, GUANMU DONG, LINGCONG SUN, LING YI, JINZHU GUI, WENLI LU, GUANGZHI YUE, XIAONA LIU, LILI XIA, GANG LIU, DEXIANG HU, ZHIXIONG HU, ZHIWEI WANG, HONGSHAN XU, XINYU LIU, LI PINGPING, JIA LILI, YANG XIAOMING, FANG ZHIZHENG, DONG GUANMU, SUN LINGCONG, YI LING, GUI JINZHU, LU WENLI, YUE GUANGZHI, LIU XIAONA, XIA LILI, LIU GANG, HU DEXIANG, HU ZHIXIONG, WANG ZHIWEI, XU HONGSHAN, LIU XINYU
Принадлежит:

The invention relates to a method for preparing a combined attenuated live vaccine for measles, mumps and encephalitis B, which comprises the following steps: (1) preparing measles stock vaccine solution, mumps stock vaccine solution and encephalitis B stock vaccine solution respectively; (2) mixing the three types of univalent stock solution with gelatin and sucrose as vaccine protective agents and human serum albumin respectively to obtain measles univalent vaccine solution, mumps univalent vaccine solution and encephalitis B univalent vaccine solution; and (3) mixing the three types of univalent solution according to the volume ratio of the measles univalent vaccine solution to the mumps univalent vaccine solution to the encephalitis B univalent vaccine solution of 1-3:1-5:2-7, packaging the mixture, freezing-drying the packaged mixture to obtain the combined attenuated live vaccine for the measles, the mumps and the encephalitis B. The method preparing the combined attenuated livevaccine ...

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Номер записи: 43
01-08-2023 дата публикации

Rare earth-containing additive

Номер: CN116516106A
Автор: YANG WENSHENG, YANG HONGBO, WANG ZHIQIANG, HUANG XIAOWEI, LI HONGWEI, ZHANG XIAOWEI, DONG RUIFENG, LI SHUAN, MAO NING, LU WENLI, ZHANG YANLING
Принадлежит:

The invention discloses a rare earth-containing additive, which comprises rare earth metal and iron, the content of the rare earth metal is 5 wt%-90 wt%, and the content of the iron is 10 wt%-95 wt%; the density of the additive is 6.3-8.4 g/cm < 3 >, the melting point is 850-1450 DEG C, the oxygen content is smaller than or equal to 150 ppm, the maximum size of inclusions is smaller than or equal to 35 microns, and the total amount of the inclusions is smaller than or equal to 0.5 wt%. By regulating and controlling the density, melting point and appearance of the additive containing rare earth and iron, an additive applicable component window is increased, the speed that the additive is added into molten steel and penetrates through an upper slag layer is increased, the viscous resistance of the molten steel to the additive is effectively reduced, the influence of the slag layer is eliminated, and the input depth of the additive containing rare earth is increased; and the adding depth of ...

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Номер записи: 44
28-10-2015 дата публикации

Radar base bearing

Номер: CN0204729466U
Автор: LU WENLI, WANG YINGYI
Принадлежит:

The utility model discloses a radar base bearing, it includes outer lane, the inner circle of suit in the outer lane to and install a plurality of rolling elements between outer lane and inner circle through the holder, and the holder includes holding ring and the perpendicular first bulge loop that sets up in holding ring one end that is used for fixing a position the rolling element, first bulge loop evenly is provided with a plurality of driving cogs outside stretching out outer lane and inner circle on the outer wall of outer lane. The utility model discloses a bearing can drive the rotation of radar with actuating mechanism lug connection, has reduced the installation of drive wheel, makes the structure of radar simpler, has improved the installation accuracy, has reduced manufacturing cost.

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Номер записи: 45
12-01-2012 дата публикации

CONDUCTIVE PILLAR FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE

Номер: US20120007228A1
Автор: Cheng Ming-Da, Ho MIng-Che, Lin Chih-Wei, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

An embodiment of the disclosure includes a conductive pillar on a semiconductor die. A substrate is provided. A bond pad is over the substrate. A conductive pillar is over the bond pad. The conductive pillar has a top surface, edge sidewalls and a height. A cap layer is over the top surface of the conductive pillar. The cap layer extends along the edge sidewalls of the conductive pillar for a length. A solder material is over a top surface of the cap layer. 1. A semiconductor die comprising:a substrate;a bond pad over the substrate;a conductive pillar over the bond pad, the conductive pillar having a top surface, edge sidewalls and a height;a cap layer over the top surface of the conductive pillar that extends along the edge sidewalls of the conductive pillar for a length; anda solder material over a top surface of the cap layer.2. The semiconductor die of claim 1 , wherein a ratio of the length to the height is between about 0.0022 to about 0.088.3. The semiconductor die of claim 1 , wherein the conductive pillar comprises copper claim 1 , gold claim 1 , tin claim 1 , or silver.4. The semiconductor die of claim 1 , wherein the cap layer comprises nickel claim 1 , gold claim 1 , tin claim 1 , or silver.5. The semiconductor die of claim 1 , wherein the cap layer has a thickness of about 1000 Å to about 4000 Å.6. The semiconductor die of claim 1 , further comprising a package substrate bonded to the solder material.7. The semiconductor die of claim 1 , wherein the conductive pillar comprises copper and the cap layer comprises nickel.8. A semiconductor die comprising:a substrate;a bond pad over the substrate;a protection layer over the bond pad and the substrate, the protection layer having a first opening;a buffer layer over the protection layer, the buffer layer having a second opening, wherein the first opening and the second opening form a combined opening having sidewalls and exposing a portion of the bond pad;a UBM layer lining the sidewalls of the combined ...

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Номер записи: 46
01-03-2012 дата публикации

Pillar Bumps and Process for Making Same

Номер: US20120049346A1
Автор: Chou Meng-Wei, Huang Ying-Jui, Hwang Chien Ling, Lin Cheng-Chung, Lin Kuo Cheng, Liu Chung-Shi, Lu De-Yuan, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art. 1. An apparatus , comprising:a semiconductor substrate having at least one input/output terminal on a surface thereon; a bottom portion contacting the input/output terminal;', 'an upper portion having a first width; and', 'a base portion over the bottom portion having a second width greater than the first width., 'a pillar disposed over the at least one input/output terminal comprising2. The apparatus of claim 1 , wherein the base portion has a shape claim 1 , in cross-section claim 1 , which is a trapezoidal shape.3. The apparatus of claim 1 , further comprising an under bump metallization layer underlying the pillar claim 1 , the under bump metallization layer comprising a seed layer and a barrier layer.4. The apparatus of claim 3 , wherein the seed layer comprises copper.5. The apparatus of wherein the barrier layer comprises titanium.6. The apparatus of claim 1 , wherein the pillar comprises copper.7. The apparatus of claim 1 , wherein the pillar further comprises the upper portion having vertical sides and disposed over the base portion claim 1 , the base portion having sides with non vertical portions further comprising sloping sides that extend from the bottom of the base portion and that intersect the vertical sides of the upper portion at an angle greater than 90 degrees.8. The apparatus of claim 1 , wherein the base portion ...

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Номер записи: 47
19-04-2012 дата публикации

CONDUCTIVE PILLAR STRUCTURE

Номер: US20120091574A1
Автор: Cheng Ming-Da, Chou Meng-Wei, Kuo Hung-Jui, Lin Chih-Wei, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

The invention relates to a bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate; a contact pad over the substrate; a passivation layer extending over the substrate having an opening over the contact pad; and a conductive pillar over the opening of the passivation layer, wherein the conductive pillar comprises an upper portion substantially perpendicular to a surface of the substrate and a lower portion having tapered sidewalls. 1. A semiconductor device comprising:a substrate;a contact pad over the substrate;a passivation layer extending over the substrate having an opening over the contact pad; anda conductive pillar over the opening of the passivation layer, wherein the conductive pillar comprises an upper portion substantially perpendicular to a surface of the substrate and a lower portion having tapered sidewalls.2. The semiconductor device of further comprisingan under-bump-metallurgy (UBM) layer between the contact pad and conductive pillar.3. The semiconductor device of claim 2 , wherein the under-bump-metallurgy (UBM) layer comprisesa first under-bump-metallurgy (UBM) sub-layer having a first width over the contact pad; anda second under-bump-metallurgy (UBM) sub-layer having a second width over the first under-bump-metallurgy (UBM) sub-layer, wherein the second width is less than the first width.4. The semiconductor device of claim 3 , wherein a difference between the first width and second width is in the range of about 0.5 to 10 μm.5. The semiconductor device of claim 3 , wherein a ratio of the first width to the second width is from about 1.01 to 1.20.6. The semiconductor device of claim 3 , wherein a thickness of the second under-bump-metallurgy (UBM) sub-layer is in the range of about 4000 and 6000 angstroms.7. The semiconductor device of claim 3 , wherein a ratio of a thickness of the first under-bump-metallurgy (UBM) sub-layer to a thickness of the second under-bump-metallurgy (UBM) sub- ...

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Номер записи: 48
03-05-2012 дата публикации

VIBRATING-TYPE ELECTROMAGNETIC GENERATOR

Номер: US20120104874A1
Автор: HWANG Yeong-Maw, Lu Wen-Long
Принадлежит:

A vibrating-type electromagnetic generator includes a substrate, a metal wire, and a magnetic member. The substrate includes a vibrating arm member and an opening disposed on the vibrating arm member; the metal wire is configured on the substrate and is passed around the opening, and has a first electrode end and a second electrode end; and the magnetic member is configured in the opening, in which when the vibrating arm member receives an external force, the metal wire induces an electric energy with the magnetic member through vibration of the vibrating arm member, and outputs the electric energy through the first electrode end and the second electrode end. 1. A vibrating-type electromagnetic generator , comprising:a substrate, comprising a vibrating arm member and an opening disposed on the vibrating arm member;a metal wire, configured on the substrate and passed around the opening, and having a first electrode end and a second electrode end; anda magnetic member, configured in the opening;wherein when the vibrating arm member receives an external force, the metal wire induces an electric energy with the magnetic member through vibration of the vibrating arm member, and outputs the electric energy through the first electrode end and the second electrode end.2. The vibrating-type electromagnetic generator according to claim 1 , wherein the vibrating arm member is further configured with a weight unit.3. The vibrating-type electromagnetic generator according to claim 1 , wherein the vibrating arm member is flexible.4. The vibrating-type electromagnetic generator according to claim 1 , wherein the substrate further comprises a space claim 1 , for allowing the vibrating arm member to vibrate when receiving the external force.5. The vibrating-type electromagnetic generator according to claim 1 , wherein the magnetic member is a magnet.6. The vibrating-type electromagnetic generator according to claim 1 , wherein the first electrode end and the second electrode end are ...

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Номер записи: 49
17-05-2012 дата публикации

CABLE MANAGEMENT APPARATUS

Номер: US20120119038A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A cable management apparatus includes a securing board and a cable management tray. The securing board has a securing arm extending upward from the securing board. The cable management tray is hung on the securing arm and includes a base and a door rotatably secured to the base. A hook is substantially perpendicular to the base, and a clasping hole is defined in the door. The door is rotatable relative to the base between a first position and a second position. In the first position, the hook is engaged in the clasping hole, the base and the door together define a space, and a cable is received in the space in a direction substantially parallel to the base. In the second position, the hook is removed from the clasping hole, to disengage the cable from the space. 1. A cable management apparatus , comprising:a securing board comprising a securing arm, and the securing arm extends from the securing board; anda cable management tray located on the securing arm and substantially parallel to the securing board, the cable management tray comprising a base and a door rotatably secured to the base; a hook located on the base; and a clasping hole defined in the door; wherein the base comprising a plane substantially parallel to the securing board, and an extending direction of the hook substantially perpendicular to the plane of the base;wherein the door is rotatable relative to the base between a first position and a second position; in the first position, the hook is engaged in the clasping hole, the base and the door together define a space, and a cable is received in the space in a direction substantially parallel to the plane; in the second position, the hook is removed from the clasping hole to disengage the cable from the space.2. The cable management apparatus of claim 1 , wherein the door is substantially parallel to the plane when in the first position.3. The cable management apparatus of claim 1 , wherein a connecting flange connected to the securing arm and ...

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Номер записи: 50
31-05-2012 дата публикации

MOUNTING APPARATUS

Номер: US20120132772A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for mounting a circuit board to a bottom plate includes a positioning member, a mounting member and a maintaining member; the mounting member is mounted to the positioning member and adapted to removably mount the positioning member to the bottom plate; the maintaining member defines a top surface and a bottom surface, and a maintaining piece extends from the bottom plane; the positioning member defines a first maintaining plane and a second maintaining plane, and a distance between the first maintaining plane and the bottom plate is larger than that between the second maintaining plane and the bottom plate; the maintaining member is mounted to the positioning member in a first position, where the maintaining piece abuts the second maintaining plane, or a second position, where the maintaining piece abuts the first maintaining plane; the circuit board abuts the top surface of the maintaining member. 1. A mounting apparatus comprising:a bottom plate;a positioning member mounted to the bottom plate;a locking member, adapted to secure a circuit board to the bottom plate, mounted to the positioning member; anda maintaining member defining a top surface and a bottom surface, a maintaining piece extending from the bottom surface, and the top surface adapted to abut the circuit board;wherein the positioning member defines a first maintaining plane and a second maintaining plane, and a distance between the first maintaining plane and the bottom plate is larger than that between the second maintaining plane and the bottom plate; the maintaining member is mounted to the positioning member in a first position, where the maintaining piece abuts the second maintaining plane, or a second position, where the maintaining piece abuts the first maintaining plane.2. The mounting apparatus of claim 1 , wherein a distance between the circuit board and the bottom plate when the maintaining member is in the first position is larger than that when the maintaining ...

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Номер записи: 51
14-06-2012 дата публикации

ENCLOSURE WITH MOUNTING MEMBER

Номер: US20120145723A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

An enclosure includes an enclosure body and a mounting member. The enclosure body includes a bottom panel. The mounting member includes a mounting protrusion and a securing element. The securing element secures the mounting protrusion to an inner side of the bottom panel. The mounting protrusion includes a mounting portion and a stopper portion extending from the mounting portion. A cross section of the mounting portion is less than a cross section of the bottom panel taken along a plane parallel to the bottom panel. 1. An enclosure comprising:an enclosure body, the enclosure body comprising a bottom panel; and a mounting protrusion, the mounting protrusion comprising a mounting portion and a stopper portion extending from the mounting portion; and a cross section of the mounting portion less than a cross section of the bottom panel taken along a plane parallel to the bottom panel; and', 'a securing element; the securing element securing the mounting protrusion to an inner side of the bottom panel., 'a mounting member, the mounting member comprising2. The enclosure of claim 1 , wherein a through hole is defined in the bottom panel claim 1 , and the securing element extending through the through hole to secure the mounting protrusion.3. The enclosure of claim 2 , wherein the bottom panel defines a recess portion claim 2 , the through hole is defined in the recess portion; and the mounting protrusion comprises a positioning portion located in the recess portion to prevent the mounting protrusion from rotating about an axis perpendicular to the bottom panel.4. The enclosure of claim 3 , wherein the recess portion is polygon-shaped claim 3 , and the positioning portion has a polygon shape corresponding to the recess portion.5. The enclosure of claim 2 , wherein a securing hole is defined in the mounting protrusion corresponding to the through hole claim 2 , and the securing element extends through the through hole to be secured in the securing hole.6. The enclosure of ...

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Номер записи: 52
14-06-2012 дата публикации

MOUNTING APPARATUS FOR EXPANSION CARD

Номер: US20120145858A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a chassis, a mounting member, a mounting tray and a securing member. The mounting member secures an expansion card and includes a flange. The mounting tray is received in the chassis and includes a top panel, a front panel and a retaining panel connected to the front panel. The securing tab extends from the top panel. The securing member includes a base engaged with the front panel and a securing plate substantially perpendicular to the base. The resilient arm extends from the securing plate along a direction substantially parallel to a surface of the base. A clasping portion is located on the resilient arm. The flange is located between the retaining panel and the securing member, the clasping portion is engaged with the securing tab, and the resilient arm is deformable in the direction to disengage the clasping portion from the securing tab. 1. A mounting apparatus comprising:a chassis;a mounting member, adapted to secure an expansion card, comprising a flange;a mounting tray, received in the chassis, comprising a top panel, a front panel and a retaining panel connected to the front panel; a securing tab extending from the top panel; anda securing member comprising a base engaged with the front panel and a securing plate substantially perpendicular to the base; a resilient arm extending from the securing plate along a direction substantially parallel to a surface of the base, and a clasping portion located on the resilient arm;wherein the flange is located between the retaining panel and the securing member, the clasping portion is engaged with the securing tab, and the resilient arm is deformable in the direction to disengage the clasping portion from the securing tab.2. The mounting apparatus of claim 1 , wherein the clasping portion comprises a slanting surface claim 1 , and the slanting surface abuts the securing tab to deform the resilient arm.3. The mounting apparatus of claim 1 , wherein the resilient arm comprises a coupling ...

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Номер записи: 53
14-06-2012 дата публикации

MOUNTING APPARATUS FOR EXPANSION CARD

Номер: US20120145859A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for expansion card comprising a chassis, a mounting frame secured to the chassis and located in a first portion of the chassis, a hull secured to the chassis and located in a second portion of the chassis opposite to the first portion, and a mounting member. The mounting member comprises an elastically deformable latching portion. The hull comprises two limiting portions and defines a positioning opening, and the mounting member is engaged in the two limiting portions and is slidable relative to the hull. The mounting member is slid to a side edge of the hull towards to the mounting frame when the elastically deformable latching portion is engaged in the positioning opening. 1. A mounting apparatus for expansion card comprising:a chassis;a mounting frame secured to the chassis and located in a first portion of the chassis;a hull secured to the chassis and located in a second portion of the chassis opposite to the first portion; anda mounting member comprising an elastically deformable latching portion;wherein the hull comprises two limiting portions and defines a positioning opening, and the mounting member is engaged in the two limiting portions and is slidable relative to the hull, the mounting member is slid to a side edge of the hull towards to the mounting frame when the elastically deformable latching portion is engaged in the positioning opening, and when an expansion card is secured, a first end of the expansion card is secured to the mounting frame, a second end of the expansion card opposite to the first end is secured between the hull and the mounting member.2. The mounting apparatus for expansion card of claim 1 , wherein the chassis comprises a bottom plate and a flange that is substantially perpendicular to the bottom plate claim 1 , the mounting frame comprises a rear wall that is substantially perpendicular to the flange claim 1 , and the hull is adapted to guide air flow flowing towards the rear wall.3. The mounting apparatus ...

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Номер записи: 54
14-06-2012 дата публикации

MOUNTING APPARATUS FOR FAN

Номер: US20120145877A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for a fan includes a mounting frame adapted to mount the fan, a chassis, a handle, and a positioning assembly. The chassis comprises a side plate. The handle is rotatably attached to the mounting frame and defines a slot. The positioning assembly is mounted to the side plate and comprises a mounting post and two limiting boards. The mounting frame is mounted between the two limiting boards. The mounting post is located between the two limiting boards and engaged in the slot. 1. A mounting apparatus for a fan , the mounting apparatus comprising:a mounting frame adapted to mount the fan;a chassis comprising a side plate;a handle rotatably attached to the mounting frame and defining a slot; anda positioning assembly mounted to the side plate and comprising a mounting post and two limiting boards;wherein the mounting frame is mounted between the two limiting boards, and the mounting post is located between the two limiting boards and engaged in the slot.2. The mounting apparatus of claim 1 , wherein the chassis further comprises a positioning post located in the side plate claim 1 , the positioning assembly defines a locking hole claim 1 , and the positioning post is engaged in the locking hole.3. The mounting apparatus of claim 2 , wherein the locking hole comprises an inserting portion and a locking portion communicating with the inserting portion claim 2 , and the positioning post is engaged in the locking portion through the inserting portion.4. The mounting apparatus of claim 2 , wherein the positioning assembly comprises a first positioning member and a second positioning member connected to the first positioning member claim 2 , the locking hole is defined in the first positioning member claim 2 , and the mounting post and the two limiting boards are located in the second positioning member.5. The mounting apparatus of claim 4 , wherein the positioning assembly further comprises an operating member located in the first positioning member and ...

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Номер записи: 55
14-06-2012 дата публикации

MOUNTING APPARATUS FOR POWER SUPPLY

Номер: US20120147576A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a chassis, a mounting tray and a securing member. The mounting tray is received in the chassis and includes a side panel. A transferring card is located on the inside of the side panel. The securing member includes a flat base and a securing tray. A positioning portion is located on the flat base, and a sliding hole is defined in the flat base. The securing tray defines a receiving space adapted to receive a power supply connected to the transferring card. The flat base is slidable relative to the side panel between a locked position, where the clasping piece is positioned at a first end of the sliding hole, and the positioning portion is engaged in the positioning hole, and an unlock position, where the clasping piece is positioned at a second end of the sliding hole, and the positioning portion is disengaged from the positioning hole. 1. A mounting apparatus comprising:a chassis;a mounting tray received in the chassis and comprising a side panel; a transferring card located on an inside of the side panel; a positioning hole defined in the side panel, and a clasping piece extending outside of the side panel; anda securing member comprising a flat base and a securing tray located on the flat base, a positioning portion located on the flat base, and a sliding hole defined in the flat base; the securing tray defining a receiving space adapted to receive a power supply connected to the transferring card;wherein the flat base is slidable relative to the side panel between a locked position, where the clasping piece is positioned in a first end of the sliding hole, and the positioning portion is engaged in the positioning hole, and an unlock position, where the clasping piece is positioned in a second end of the sliding hole, and the positioning portion is disengaged from the positioning hole.2. The mounting apparatus of claim 1 , wherein a first securing portion and a second securing portion are located on the securing tray claim 1 , and ...

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Номер записи: 56
28-06-2012 дата публикации

COMPUTER SYSTEM WITH AIR GUIDING DUCT

Номер: US20120162907A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A computer system includes a computer case and an air guiding duct. The motherboard is attached to the computer case, and a heat sink is attached to the motherboard. The air guiding duct includes a top panel. A mounting member is slidably attached to the top panel and is clipped to the heat sink. A limiting device is located on the top panel and engaged with the mounting member to prevent the mounting member from sliding relative the top panel. 1. A computer system comprising:a computer case;a motherboard attached to the computer case;a heat sink attached to the motherboard;an air guiding duct comprising a top panel and a mounting member slidably attached to the top panel; anda limiting device located on the top panel;wherein the heat sink is latched by the mounting member to retain the air guiding duct to the heat sink, and the limiting device is engaged with the mounting member to prevent the mounting member from moving relative to the top panel.2. The computer system of claim 1 , wherein the limiting device comprises a resisting member and a stopping member claim 1 , and the mounting member is slidably located between the resisting member and the stopping member.3. The computer system of claim 2 , wherein an opening is defined in the top panel claim 2 , and the resisting member is located at an edge of the opening and slanted relative to the top panel.4. The computer system of claim 3 , wherein the mounting member comprises a bottom panel and a clasping portion extending from a bottom surface of the bottom panel claim 3 , and the clasping portion extends through the opening.5. The computer system of claim 4 , wherein the heat sink comprise a plurality of fins claim 4 , each of the plurality of fins comprising a main body and a flange extending from an edge of the main body claim 4 , at least two fins of the plurality of fins defines a receiving slot claim 4 , and the clasping portion is received in the receiving slot and engaged with the flange.6. The computer ...

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Номер записи: 57
12-07-2012 дата публикации

LIGHT EMITTING DIODE CUP LAMP

Номер: US20120175655A1
Автор: Cheng Chi-Chen, Hsieh Chin-Kun, Lu Wen-Cheng
Принадлежит: LEXTAR ELECTRONICS CORPORATION

A light emitting diode (LED) cup lamp including a base, an LED light source and a light guiding device is disclosed. The LED light source is disposed on the base. The light guiding device is disposed above the LED light source. The light guiding device has a light guiding region facing the LED light source. After the light emitted from the LED light source is guided through the light guiding region, the light is further guided by other parts of the light guiding device so that the light is emitted towards the exterior of the LED cup lamp. 1. A light emitting diode (LED) cup lamp , comprising:a base;an LED light source disposed on the base; anda light guiding device disposed above the LED light source, wherein the light guiding device has a light guiding region facing the LED light source, and after the light emitted from the LED light source is guided through the light guiding region, the light is further guided by other parts of the light guiding device so that the light is emitted towards the exterior of the LED cup lamp.2. The LED cup lamp according to claim 1 , wherein the light guiding device comprises:a lens; anda light guiding element disposed adjacent to the lens, wherein the light guiding element faces the LED light source, and the locating region of the light guiding element defines the light guiding region.3. The LED cup lamp according to claim 2 , wherein after the light emitted from the LED light source is reflected by the light guiding element and then emitted to the lens claim 2 , the light is guided by the lens to be emitted towards the exterior of the LED cup lamp.4. The LED cup lamp according to claim 2 , wherein the lens has a recess with a bottom side and the light guiding element is disposed on the bottom side.5. The LED cup lamp according to claim 4 , wherein the bottom side is a concave surface protruded downwards.6. The LED cup lamp according to claim 4 , wherein the bottom side is a planar surface.7. The LED cup lamp according to claim 4 , ...

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Номер записи: 58
23-08-2012 дата публикации

FLEXIBLE DISPLAY DEVICE

Номер: US20120212797A1
Автор: Chen Lee-Tyng, Chiang Ming-Sheng, Huang Jen-Shiun, LU Wen-Chang, LUAN Ta-Nien, Tsai Hung-Yi, Tsai You-Chi, TSAI Yuan-Chih, Wu Chi-Ming
Принадлежит: E Ink Holdings Inc.

A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force. 1. A flexible display device , comprising:a flexible substrate;a display layer arranged on the flexible substrate;a first protecting layer arranged on the display layer; andat least one light-pervious polymer film arranged on the first protecting layer.2. The flexible display device according to claim 1 , wherein the light-pervious polymer film is made of material selected from a group consisting of optical clear adhesive claim 1 , polyethylene terephthalate claim 1 , and polycarbonate.3. The flexible display device according to claim 1 , wherein the at least one light-pervious polymer film comprises a plurality of the light-pervious polymer films claim 1 , and the light-pervious polymer films are stacked on the first protecting layer in sequence.4. The flexible display device according to claim 1 , further comprising a first encapsulation layer claim 1 , wherein the first encapsulation layer is arranged on the flexible substrate and surrounds the display layer and the first protecting layer.5. The flexible display device according to claim 1 , further comprising a second protecting layer claim 1 , wherein the second protecting layer is arranged on the at least one light-pervious polymer film.6. The flexible display device according to claim 5 , wherein each of the first protecting layer and the second protecting layer is made of material selected from a group consisting of transparent plastic claim 5 , transparent glass claim 5 , partially transparent plastic claim 5 , and partially transparent glass.7. ...

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Номер записи: 59
23-08-2012 дата публикации

DISPLAY APPARATUS

Номер: US20120212888A1
Автор: Chiang Ming-Sheng, Huang Jen-Shiun, LU Wen-Chang, LUAN Ta-Nien, Wu Chi-Ming
Принадлежит: E Ink Holdings Inc.

A display apparatus includes a display panel, at least one anisotropic conductive adhesive and at least one chip. The display panel has a peripheral circuit region, and the anisotropic conductive adhesive is adhered in the peripheral circuit region. The chip is disposed on the anisotropic conductive adhesive, and the chip has an electric coupling region on a surface facing the anisotropic conductive adhesive. The electric coupling region is equipped with a plurality of electric coupling parts, and the electric coupling parts are electrically coupled to the peripheral circuit region by the anisotropic conductive adhesive. An interval is existed between a boundary of the electric coupling region and a boundary of the chip, and the electric coupling region is located in a bonding region of the anisotropic conductive adhesive. The bonding region of the anisotropic conductive adhesive is located in the boundary of the chip. The display apparatus has better reliability. 1. A display apparatus , comprising:a display panel having a peripheral circuit region;at least one anisotropic conductive adhesive adhered in the peripheral circuit region of the display panel; andat least one chip disposed on the anisotropic conductive adhesive, and the chip having a surface facing the anisotropic conductive adhesive and an electric coupling region located on the surface, the electric coupling region being equipped with a plurality of electric coupling parts, and the electric coupling parts being electrically coupled to the peripheral circuit region by the anisotropic conductive adhesive, wherein an interval is existed between a boundary of the electric coupling region and a boundary of the chip, the electric coupling region is located in a bonding region of the anisotropic conductive adhesive, and the bonding region of the anisotropic conductive adhesive is located in the boundary of the chip.2. The reflective display apparatus according to claim 1 , wherein the display panel is a ...

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Номер записи: 60
13-09-2012 дата публикации

FAN FRAME

Номер: US20120230819A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A fan frame includes a blade holder, a pair of ventilation plates, and at least one side plate. The pair of ventilation plates is attached to opposite sides of the blade holder along a first direction and includes a pair of securing blocks. The at least one side plate is attached to the blade holder along a second direction substantially perpendicular to the first direction and located between the pair of ventilation plates. The pair of mounting slots is defined in the at least one side plate and engaged with the pair of securing blocks, thereby securing the pair of ventilation plates and the at least one side plate to the blade holder. 1. A fan frame comprising:a blade holder having opposite sides;a pair of ventilation plates respectively attached to the opposite sides of the blade holder along a first direction, and comprising a pair of securing blocks;at least one side plate attached to the blade holder along a second direction substantially perpendicular to the first direction, and located between the pair of ventilation plates, wherein a pair of mounting slots are defined in the at least one side plate and engaged with the pair of securing blocks, thereby securing the pair of ventilation plates and the at least one side plate to the blade holder.2. The fan frame of claim 1 , further comprising a plurality of securing members claim 1 , wherein the blade holder comprises a pair of planar frames at an air outlet and an air inlet of the blade holder claim 1 , at least one mounting hole is defined in each of the pair of planar frames claim 1 , at least one securing hole is defined in each of the pair of ventilation plates claim 1 , and at least one of the securing members extends through the at least one securing hole and the at least one mounting hole to attach each of the pair of ventilation plates to the blade holder.3. The fan frame of claim 2 , wherein each of the securing members comprises a head claim 2 , a first concave portion claim 2 , a pair of resisting ...

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Номер записи: 61
13-09-2012 дата публикации

CONNECTOR CONVERTING DEVICE

Номер: US20120231670A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A connector converting device includes a mounting member, a circuit board, and a cover member. A receiving space, a front opening, and a rear opening are defined in the mounting member. The circuit board includes a board body, a first socket extending from the board body, and a first connecting end. The board body is received in the receiving space. The first connecting end extends out of the mounting member via the front opening to electrically connect to a second socket. The first socket electrically connects to a cable via the rear opening. The cover member engages with the mounting member to secure board body to the mounting member. 1. A connector converting device , comprising:a mounting member defining a receiving space, a front opening, and a rear opening ;a circuit board comprising a board body, a first socket extending from the board body, and a first connecting end, the board body being received in the receiving space, the first connecting end extending out of the mounting member via the front opening for electrically connecting to a second socket, the first socket being adapted to electrically connect to a cable via the rear opening; anda cover member engaging with the mounting member to secure the board body to the mounting member.2. The connector converting device of claim 1 , wherein the mounting member comprises a bottom panel claim 1 , two side panels claim 1 , a front panel claim 1 , and a rear panel; the two side panels extend from the bottom panel and are substantially parallel to each other; the rear panel and the front panel extend from the bottom panel and are connected between the two side panels; the front opening is defined in the front panel and the rear opening is defined in the rear panel; and the receiving space is surrounded by the side panels claim 1 , the front panel claim 1 , and the rear panel.3. The connector converting device of claim 2 , wherein the mounting member further comprises a first positioning portion and a second ...

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Номер записи: 62
18-10-2012 дата публикации

LIGHT EMITTING DIODE CUP LIGHT

Номер: US20120262932A1
Автор: Cheng Chi-Cheng, Lu Wen-Cheng
Принадлежит: LEXTAR ELECTRONICS CORPORATION

A light emitting diode (LED) cup light includes a base, a substrate, a LED light source and a fixing structure. The base includes a frame and a carrying member. The frame is surroundingly coupled to a periphery of the carrying member. The carrying member has a through hole. The substrate is disposed on the carrying member of the base. The LED light source is disposed on the substrate. The fixing structure presses on substrate and is engaged with a bottom surface of the carrying member of the base through the through hole. 1. A light emitting diode (LED) cup light , comprising:a base comprising a frame and a carrying member, wherein the frame is surroundingly coupled to a periphery of the carrying member, and the carrying member has a through hole;a substrate disposed on the carrying member of the base;a LED light source disposed on the substrate; anda fixing structure, which presses on the substrate and is engaged with a bottom surface of the carrying member of the base through the through hole.2. The LED cup light according to claim 1 , wherein the fixing structure comprises:a pressing plate pressing on the substrate; anda hook, which is coupled to the pressing plate, extends through the through hole from the pressing plate, and is engaged with the bottom surface of the carrying member.3. The LED cup light according to claim 2 , wherein the substrate comprises:a first plate member disposed on the carrying member of the base; anda second plate member disposed on the first plate member, wherein the LED light source is embedded into the second plate member, and the pressing plate presses on the first plate member and surrounds a periphery of the second plate member.4. The LED cup light according to claim 3 , wherein an outer sidewall of the second plate member has a salient claim 3 , an inner sidewall of the pressing plate has a notch claim 3 , and the salient is accommodated within the notch.5. The LED cup light according to claim 3 , wherein a bottom surface of the ...

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Номер записи: 63
01-11-2012 дата публикации

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Номер: US20120273842A1
Автор: Lo Chun-Yuan, LU WEN-PIN, Yih Cheng-Ming
Принадлежит: MACRONIX INTERNATIONAL CO., LTD.

A memory array including a plurality of memory cells, a plurality of word lines, a dummy word line, and a plug is provided. Each word line is coupled to corresponding memory cells. A dummy word line is directly adjacent to an outmost word line of the plurality of word lines. The plug is located between the dummy word line and the outmost word line. 1. A memory array , comprising:a plurality of memory cells;a plurality of word lines, each word line coupled to corresponding memory cells;a dummy word line directly adjacent to an outmost word line of the plurality of word lines; anda first plug located between the dummy word line and the outmost word line of the corresponding memory cells.2. The memory array of claim 1 , wherein no first conductive region is disposed on one side of the dummy word line far from the outmost word line.3. The memory array of claim 2 , wherein the first conductive region is a source region.4. The memory array of further comprising a plurality of second conductive regions disposed between the word lines.5. The memory array of claim 4 , wherein the second conductive regions comprise a plurality of drain regions and a plurality of source regions and the drain regions and the source regions are alternatively arranged between the word lines.6. The memory array of further comprising a plurality of second plugs located on the plurality of drain regions and electrically connected to the plurality of drain regions.7. The memory array of claim 1 , wherein a plurality of drain regions and a plurality of source regions are alternatively arranged between the dummy word line and the plurality of word lines.8. The memory array of claim 7 , wherein the first plug located in one of the plurality of drain regions between the dummy word line and the outmost word line of the corresponding memory cells.9. A method of fabricating a memory array claim 7 , comprising:forming a plurality of memory cells;forming a plurality of first plugs; andforming a plurality of ...

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Номер записи: 64
06-12-2012 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20120304457A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a bottom panel, a first mounting member, and a second mounting member. The bottom panel includes a top surface and a bottom surface. The first mounting member includes a positioning portion and an installation portion. A concave portion is defined in the bottom surface, for receiving and preventing the positioning portion from rotating relative to the bottom panel. The bottom panel defines a through hole, for an installation portion. The second mounting member includes a locking portion. The locking portion defines an installation hole, for locking the installation portion. The bottom panel top surface t is between locking portion and positioning portion. The positioning portion bottom surface place in the same plane with the bottom panel bottom surface or is between the bottom panel top surface and the bottom panel bottom surface. 1. A mounting apparatus comprising:a bottom panel defining a top surface and a bottom surface; a concave portion located on the top surface, and a through hole defined in the concave portion;a first mounting member comprising a positioning portion, and an installation portion; anda second mounting member comprising a locking portion and a stopper portion; and an installation hole is defined by the locking portion;wherein the installation portion extends through the through hole and is engaged in the installation hole; the positioning portion abuts the concave portion; a thickness of the positioning portion is less than a depressed depth of the concave portion; a positioning portion bottom surface is located between the bottom panel top surface and the bottom panel bottom surface; and a circuit board is located between the stopper portion and the bottom panel.2. The mounting apparatus of claim 1 , wherein shape of the concave portion is polygon-shaped claim 1 , and the positioning portion has a polygon shape that corresponds to the concave portion.3. The mounting apparatus of claim 1 , wherein the second ...

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Номер записи: 65
20-12-2012 дата публикации

WARNING LAMP ASSEMBLY FOR SAFETY HELMET

Номер: US20120320569A1
Автор: LU Wen-Chi
Принадлежит:

A warning lamp assembly for use in a safety helmet is disclosed to include a watertight housing having a part thereof transparent, a circuit board mounted inside the housing and carrying a control circuit, a direction and speed sensor and a warning lamp set that are electrically connected together, a battery pack mounted inside the housing and electrically connected to the circuit board to provide battery power to the components at the circuit board, and a mounting device located on the outside of the housing and detachably connectable to a safety helmet. Thus, the warning lamp assembly has the characteristics of simple structure and ease of installation and is detachably connectable to a safety helmet. 1. A warning lamp assembly for use in a safety helmet , comprising:a housing externally watertight, said housing having at least one part thereof transparent;a circuit board mounted inside said housing, said circuit board comprising a control circuit, a direction and speed sensor and a warning lamp set respectively electrically connected together;a battery pack mounted inside said housing and electrically connected to said circuit board to provide battery power to the components at said circuit board; anda mounting device located on the outside of said housing and detachably connectable to a safety helmet.2. The warning lamp assembly for safety helmet as claimed in claim 1 , wherein said warning lamp set comprises a plurality of light-emitting diodes.3. The warning lamp assembly for safety helmet as claimed in claim 2 , wherein said warning lamp set comprises two yellow light-emitting diodes disposed at opposing left and right sides and three red light-emitting diodes equally spaced between said yellow light-emitting in a transverse row.4. The warning lamp assembly for safety helmet as claimed in claim 1 , wherein said battery pack is selected from the group of dry battery and rechargeable battery.5. The warning lamp assembly for safety helmet as claimed in claim 1 , ...

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Номер записи: 66
27-12-2012 дата публикации

MOUNTING APPARATUS FOR PCI CARD

Номер: US20120327578A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for a PCI card includes an enclosure, a mounting bracket, a securing bracket, and a securing member and a resilient member. The mounting bracket is configured to secure a first end of the PCI card. The securing bracket includes a bracket body and a securing plate. The securing member includes a main body and a securing portion. The main body defines a mounting slot. The securing member is configured to rotate to enable the securing portion to engage the securing plate, and to enable the mounting slot to receive a second end of the PCI card. The resilient member is mounted to the securing bracket and deformed to resist the securing member. The resilient member releases to drive the securing member to move away from the PCI card when the securing portion disengages from the securing plate. 1. A mounting apparatus for a PCI card , comprising:an enclosure;a mounting bracket configured to secure a first end of the PCI card;a securing bracket mounted in the enclosure, the securing bracket comprising a bracket body and a securing plate extending from the bracket body;a securing member pivotably mounted on the securing bracket, the securing member comprising a main body and a securing portion extending from the main body; the main body defining a mounting slot; wherein the securing member is configured to be rotated such that the securing portion is engaged with the securing plate, and a second end of the PCI card is received in the mounting slot; anda resilient member mounted to the securing bracket and being deformed to resist the securing member; and the resilient member is released to drive the securing member to move away from the PCI card when the securing portion is disengaged from the securing plate.2. The mounting apparatus of claim 1 , wherein the securing bracket further comprises a first mounting tab extending from bracket body; the bracket body defines an inserting hole; the resilient member comprises a connecting end inserted in the ...

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Номер записи: 67
27-12-2012 дата публикации

CONNECTOR ASSEMBLY

Номер: US20120329336A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A connector assembly includes a receptacle connector and a plug connector. The receptacle connector includes a plurality of receiving cavities. At least one of the plurality of receiving cavities comprising a first receiving portion, a second receiving portion, and a separating plate that is located between the first receiving portion and the second receiving portion and spaced from the top wall. The plug connector includes a plurality of plug units engageable with the plurality of receiving cavities. At least one of the plurality of plug units includes a first plug portion, a second plug portion, and a separating slot located between the first plug portion and the second plug portion. The first plug portion is engaged with the first receiving portion. The second plug portion is engaged with the second receiving portion. The separating plate is received in the separating slot. 1. A connector assembly comprising:a receptacle connector comprising a plurality of receiving cavities, a top wall and a pair of sidewalls extending from opposite sides of the top wall, the plurality of receiving cavities located between the pair of sidewalls, at least one of the plurality of receiving cavities comprising a first receiving portion, a second receiving portion, and a separating plate located between the first receiving portion and the second receiving portion and spaced from the top wall; anda plug connector comprising a plurality of plug units engageable with the plurality of receiving cavities, at least one of the plurality of plug units comprising a first plug portion, a second plug portion, and a separating slot located between the first plug portion and the second plug portion;wherein the first plug portion is engaged with the first receiving portion, the second plug portion is engaged with the second receiving portion, and the separating plate is received in the separating slot.2. The connector assembly of claim 1 , wherein the plurality of receiving cavities comprise a ...

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Номер записи: 68
27-12-2012 дата публикации

USB CHARGING CIRCUIT FOR A COMPUTER

Номер: US20120331312A1
Автор: LU Wen-Sheng
Принадлежит: HON HAI PRECISION INDUSTRY CO., LTD.

A Universal Serial Bus (USB) charging circuit for a computer includes a USB interface, a USB power terminal, a standby power terminal, a switch unit, a IC chip, and a control unit. The control unit disconnects the USB interface from the standby power terminal when receiving a high voltage level from the system power terminal or a first control signal from the IC chip. The control unit connects the standby power terminal supply to the USB interface when receiving a second control signal from the IC chip and the first switch signal from the switch unit; the control unit disconnects the standby power terminal supply from the USB interface when receiving a second control signal from the IC chip and the second switch signal from the switch unit. 1. A Universal Serial Bus (USB) charging circuit for a computer , comprising:a USB interface;a USB power terminal connected with the USB interface to supply power to the USB interface when the computer is in ON state or sleep state;a standby power terminal connected with the USB interface to supply power to the USB interface when the computer is in hibernation state or in OFF state;a switch unit for generating a first switch signal to connect the standby power terminal to the USB interface, and generating a second switch signal to disconnect the standby power terminal form the USB interface;an Integrated Circuit (IC) chip for outputting a first control signal when the computer is in sleep state, and outputting a second control signal when the computer is in hibernation state or in OFF state; anda control unit connected with the USB power terminal, the standby power terminal, the switch unit, the USB interface, and the IC chip, wherein the control unit disconnects the USB interface from the standby power terminal when receiving a high voltage level from a system power terminal or the first control signal from the IC chip; the control unit connects the standby power terminal to the USB interface when receiving a second control ...

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Номер записи: 69
03-01-2013 дата публикации

CABLE ASSEMBLY

Номер: US20130000976A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A cable assembly includes a cable and a cable securing member. The cable includes a metal portion and an insulation surrounding the metal portion. The metal portion includes a connecting end exposed out of the insulation. The cable securing member defines a securing hole. A first receiving opening and a second receiving opening are defined in the cable securing member. The first receiving opening is aligned with the second receiving opening. The first receiving opening is greater than the second receiving opening. The first receiving opening receives the insulation. The second receiving opening receives the connecting end. 1. A cable assembly , comprising:a cable, the cable comprising a metal portion and an insulation surrounding the metal portion, the metal portion comprising a connecting end exposed out of the insulation; anda cable securing member, the cable securing member defining a securing hole, wherein a first receiving opening and a second receiving opening are defined in the cable securing member; the first receiving opening is aligned with the second receiving opening; the first receiving opening is greater than the second receiving opening; the first receiving opening receives the insulation; and the second receiving opening receives the connecting end.2. The cable assembly of claim 1 , wherein the cable securing member comprises a base portion claim 1 , two mounting tabs extend from opposite sides of the base portion claim 1 , and two securing portions extend from opposite sides of the base portion; the first receiving opening is defined by the base portion and the two mounting tabs; and the second receiving opening is defined by the base portion and the two securing portions.3. The cable assembly of claim 2 , wherein a slot is defined between the two mounting tabs.4. The cable assembly of claim 2 , wherein a cross-section of each mounting tab taken along a plane is arc-shaped; and a cross-section of the base portion taken along the plane is arc-shaped. ...

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Номер записи: 70
10-01-2013 дата публикации

Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers

Номер: US20130009307A1
Автор: Cheng Ming-Da, Lii Mirng-Ji, Lin Chih-Wei, Lin Hsiu-Jen, Liu Chung-Shi, Lu Wen-Hsiung, Wu Yi-Wen, Yu Chen-Hua
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method includes forming a passivation layer over a metal pad, which is overlying a semiconductor substrate. A first opening is formed in the passivation layer, with a portion of the metal pad exposed through the first opening. A seed layer is formed over the passivation layer and to electrically coupled to the metal pad. The seed layer further includes a portion over the passivation layer. A first mask is formed over the seed layer, wherein the first mask has a second opening directly over at least a portion of the metal pad. A PPI is formed over the seed layer and in the second opening. A second mask is formed over the first mask, with a third opening formed in the second mask. A portion of a metal bump is formed in the third opening. After the step of forming the portion of the metal bump, the first and the second masks are removed. 1. A method comprising:forming a passivation layer over a metal pad, wherein the metal pad is further overlying a semiconductor substrate;forming a first opening in the passivation layer, wherein a portion of the metal pad is exposed through the first opening;forming a seed layer over the passivation layer, wherein the seed layer is electrically coupled to the metal pad;forming a first mask over the seed layer, wherein the first mask comprises a second opening, with the second opening being directly over at least a portion of the metal pad;forming a post-passivation interconnect (PPI) over the seed layer and in the second opening;forming a second mask over the first mask;forming a third opening in the second mask;forming at least a portion of a metal bump in the third opening; andafter the step of forming the portion of the metal bump, removing the first and the second masks.2. The method of claim 1 , wherein the first and the second masks are photo resists.3. The method of claim 1 , wherein the first and the second masks are in physical contact with each other.4. The method of further comprising claim 1 , after the step of removing ...

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Номер записи: 71
10-01-2013 дата публикации

DETECTION APPARATUS FOR CIRCUIT BOARD

Номер: US20130009629A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A detection apparatus comprises a first signal transmission line, a second signal transmission line, a first conducting member, a second conducting member and a mounting bracket. A first terminal of the first signal transmission line is electrically connected to a circuit board for receiving first output signals. A second terminal of the first signal transmission line is electrically connected to a first terminal of the first conducting member. A first terminal of the second signal transmission line is electrically connected to the circuit board for receiving second output signals. A second terminal of the second signal transmission line is electrically connected to a first terminal of the second conducting member. The first conducting member and the second conducting member are mounted on the mounting bracket. Each of a second terminal of the first conducting member and a second terminal of the second conducting member extends out of the mounting bracket. 1. A detection apparatus , comprising:a first signal transmission line, a second signal transmission line, a first conducting member, a second conducting member and a mounting bracket; a first terminal of the first signal transmission line is electrically connected to a circuit board for receiving first output signals; a second terminal of the first signal transmission line is electrically connected to a first terminal of the first conducting member; a first terminal of the second signal transmission line is electrically connected to the circuit board for receiving second output signals; a second terminal of the second signal transmission line is electrically connected to a first terminal of the second conducting member; each of the first conducting member and the second conducting member is mounted on the mounting bracket; and each of a second terminal of the first conducting member and a second terminal of the second conducting member extends out of the mounting bracket.2. The detection apparatus of claim 1 , ...

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Номер записи: 72
10-01-2013 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20130010437A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for fixing a circuit board having a position block comprises an enclosure having a bottom plate; a first mounting member having a first securing portion, and a second mounting member having a first position portion and a first mounting portion. A first through hole is defined on the bottom plate. A first depressed portion is defined around the first through hole on the bottom plate. A first fixing hole is defined on the first securing portion. The first position portion is received in the first depressed portion to prevent the first position portion rotating relative to the bottom plate. The first mounting portion passes through the first through hole to be fixed in the first fixing hole. The bottom plate is fixed between the first securing portion and the first position portion. The position block engages the position slot to fix the circuit board on the enclosure. 1. A mounting apparatus assembly , comprising:a circuit board comprising a position block;an enclosure comprising a bottom plate, a first through hole defined on the bottom plate, and a first depressed portion defined around the first through hole;at least one first mounting member comprising a first securing portion, and a first fixing hole defined on the first securing portion; anda second mounting member comprising a first position portion and a first mounting portion, and a position slot defined in the first position portion; wherein the first position portion is received in the first depressed portion to prevent the first position portion from rotating relative to the bottom plate; the first mounting portion passes through the first through hole to be fixed in the first fixing hole; the bottom plate is fixed between the first securing portion and the first position portion; and the position block engages the position slot to fix the circuit board on the enclosure.2. The mounting apparatus assembly of claim 1 , wherein the at least one first mounting member further comprises a ...

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Номер записи: 73
31-01-2013 дата публикации

ELECTRONIC DEVICE WITH IMPACT-RESISTANT DISPLAY MODULE

Номер: US20130027853A1
Автор: CHEN Wan-Tien, Chiang Ming-Sheng, Huang Jen-Shiun, Lee Tsung-Ting, LU Wen-Chang, Tsai Chen-Fa, Tsai Hung-Yi, TSAI Yuan-Chih, TSENG CHU-KUANG, Wu Chi-Ming
Принадлежит: E Ink Holdings Inc.

An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening The display module is disposed in the shell and faces the opening The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module. 1. An electronic device , comprising:a shell comprising a bottom plate and a top plate, the top plate defining an opening;a display module disposed in the shell and facing the opening, the display module spaced from the bottom plate; anda cushion disposed between the display module and the bottom plate, the cushion being in contact with the display module.2. The electronic device according to claim 1 , wherein a gap is formed between the display module and the bottom plate and filled with air claim 1 , the air in the gap acts as the cushion.3. The electronic device according to claim 1 , wherein the cushion is formed by an elastic element set between the display module and the bottom plate.4. The electronic device according to claim 1 , wherein the cushion is formed by an elastic material filled between the display module and the bottom plate.5. The electronic device according to claim 1 , further comprising a transparent plate disposed between the display module and the top plate of the shell claim 1 , wherein the transparent plate covers the opening claim 1 , and the display module is in contact with the transparent plate.6. The electronic device according to claim 5 , wherein the display module is flexible and curved claim 5 , a middle portion of the display module protrudes towards the transparent plate and supports the transparent plate.7. The electronic device according to claim 5 , wherein the transparent plate is fixed to the top plate of the shell.8. The ...

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Номер записи: 74
21-02-2013 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20130044445A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for circuit board comprises a bottom or base board of a chassis, a securing structure and a reinforcing member. The securing structure is secured to the bottom board in which a securing hole is defined. The reinforcing member engages with the securing structure. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing any lateral movement of the circuit board. 1. A mounting apparatus for a circuit board comprising:a chassis comprising a bottom board and two sidewalls located on two opposite sides of the bottom board;a securing structure secured to the bottom board, the securing structure defining a securing hole; anda reinforcing member engaged with the securing structure, the reinforcing member secured to the bottom board, a fixing member extending through a through hole, defined in the circuit board, to engage in the securing hole, for preventing the circuit board from moving relative to the bottom board along a direction parallel to the two sidewalls.2. The mounting apparatus of claim 1 , wherein the bottom board defines a positioning hole claim 1 , the securing structure comprises a first securing member and a second securing member claim 1 , and the second securing member extends through the positioning hole to engage with the first securing member.3. The mounting apparatus of claim 2 , wherein the reinforcing member comprises a reinforcing portion with a receiving hole claim 2 , and the securing structure is engaged in the receiving hole.4. The mounting apparatus of claim 3 , wherein the reinforcing member further comprises two connecting portions extending from two opposite sides of the reinforcing portion claim 3 , and a first obtuse angle is defined between each connecting portion and the reinforcing portion.5. The mounting apparatus of claim 4 , wherein the reinforcing member further comprises two limiting portions correspondingly extending from the two connecting ...

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Номер записи: 75
21-02-2013 дата публикации

CIRCUIT BOARD MOUNTING APPARATUS

Номер: US20130044449A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A circuit board mounting apparatus comprises a chassis and a securing structure. The chassis comprises a bottom board and two sidewalls located on two opposite sides of the board. The securing structure comprises a reinforcing member and a securing member secured to the reinforcing member. The reinforcing member is secured to the bottom board. The securing member defines a securing hole. A fixing member extends through a through hole defined in the circuit board to engage in the securing hole, for preventing the circuit board from moving laterally. 1. A circuit board mounting apparatus comprising:a chassis comprising a bottom board and two sidewalls located on two opposite sides of the bottom board; anda securing structure comprising a reinforcing member and a securing member secured to the reinforcing member, the reinforcing member secured to the bottom board, the securing member defining a securing hole, and a fixing member extending through a through hole defined in a circuit board to engage in the securing hole so that the circuit board is prevented from moving relative to the bottom board along a direction parallel to the two sidewalls.2. The circuit board mounting apparatus of claim 1 , wherein the securing member comprises a securing portion claim 1 , the bottom board defines a positioning hole claim 1 , and the securing portion is engaged in the positioning hole.3. The circuit board mounting apparatus of claim 2 , wherein the securing member further comprises a stopping portion extending from the securing portion claim 2 , and the stopping portion abuts on the bottom board.4. The circuit board mounting apparatus of claim 2 , wherein the reinforcing member comprises a reinforcing portion configured to support the circuit board claim 2 , and the securing portion is engaged with the reinforcing portion.5. The circuit board mounting apparatus of claim 3 , wherein the reinforcing member further comprises two limiting portions claim 3 , each of the two limiting ...

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Номер записи: 76
07-03-2013 дата публикации

BATTERY MOUNTING DEVICE

Номер: US20130059188A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A battery mounting device includes a bracket and case. The bracket includes a rear wall and defines a receiving space. A first latching portion is located on the rear wall. The case includes a front plate opposite to the rear wall. A restricting portion is located on the front plate. The bracket is slidably mounted in the case; the first latching portion is adapted to secure a first end of a battery in the receiving space, and the restricting portion is adapted to secure a second end of the battery in the receiving space. 1. A battery mounting device , comprising:a bracket comprising a rear wall and defining a receiving space, and a first latching portion located on the rear wall; anda case comprising a front plate opposite to the rear wall, and a restricting portion located on the front plate;wherein the bracket is slidably mounted in the case; the first latching portion is adapted to secure a first end of a battery in the receiving space, and the restricting portion is adapted to secure a second end of the battery in the receiving space, and the second end is opposite to the first end.2. The battery mounting device of claim 1 , wherein the bracket further comprises a bottom wall and a front wall claim 1 , the bottom wall is substantially perpendicular to the rear wall claim 1 , and the front wall is substantially parallel to the rear wall; the first latching portion comprises a first limiting piece and a first latching block; the first latching block is opposite to the restricting portion claim 1 , and the first latching block and the restricting portion are adapted to secured the battery therebetween and to prevent the battery from moving along a first direction substantially perpendicular to the bottom wall; the first limiting piece is opposite to the front wall claim 1 , and the first limiting piece and the front wall are adapted to secured the battery therebetween and to prevent the battery from moving along a second direction substantially parallel to the ...

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Номер записи: 77
14-03-2013 дата публикации

Packaging Methods and Structures for Semiconductor Devices

Номер: US20130062761A1
Автор: Chen Meng-Tse, Cheng Ming-Da, Huang Kuei-Wei, Jang Bor-Ping, Lii Mirng-Ji, Lin Chih-Wei, Lin Chun-Cheng, Lin Hsiu-Jen, Lin Wei-Hung, Liu Chung-Shi, Lu Wen-Hsiung, Tsai Yu-Peng, Yu Chen-Hua
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. 1. A packaged semiconductor device , comprising;a redistribution layer (RDL), the RDL comprising a first surface and a second surface opposite the first surface;at least one integrated circuit coupled to the first surface of the RDL;a plurality of metal bumps coupled to the second surface of the RDL; anda molding compound disposed over the at least one integrated circuit and the first surface of the RDL.2. The packaged semiconductor device according to claim 1 , wherein the at least one integrated circuit comprises a substrate with a plurality of through-substrate vias (TSVs) formed therein claim 1 , wherein the at least one integrated circuit comprises at least one first integrated circuit claim 1 , further comprising at least one second integrated circuit disposed over at least a portion of the at least one first integrated circuit claim 1 , portions of the at least one second integrated circuit being electrically coupled to portions of the at least one first integrated circuit claim 1 , to the RDL claim 1 , or to both the at least one first integrated circuit and the RDL.3. The packaged semiconductor device according to claim 1 , wherein the at least one integrated circuit comprises at least one first integrated circuit claim 1 , further comprising at least one second integrated circuit disposed over at least the RDL claim 1 , the at least one second integrated circuit being electrically coupled to the RDL by a plurality of connections disposed in the molding compound between the ...

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Номер записи: 78
21-03-2013 дата публикации

ELECTRONIC DEVICE WITH TOUCH PANEL

Номер: US20130070157A1
Автор: FU JI-BAO, HSIEH KUAN-HONG, HUANG LI-ZHANG, LU WEN-HSIANG, WANG HAN-CHE
Принадлежит:

An electronic device includes a power management unit, a touch panel including a first touch area and a second touch area, a first indicator, a second indicator, and a processing unit. The first touch area and the second touch area are respectively located on two sides of the touch panel, and is used to produce touch signals in response to a user's touch. The position of the first indicator and a second indicator are respectively corresponding to the first touch area and the second touch area. The processing unit controls the power management unit to provide power to the first indicator only when determining the first touch area is touched by the user according to the touch signals received by it, and control the power management unit to provide power to the second indicator only when determining the second touch area is touched. 1. An electronic device comprising:a power management unit, configured to manage the power of a power source;a touch panel comprising a first touch area and a second touch area, wherein, the first touch area and the second touch area are respectively located on two sides of the touch panel, and is configured to produce touch signals in response to a user's touch;an indication unit comprising a first indicator and a second indicator, wherein, the position of the first indicator and a second indicator are respectively corresponding to the first touch area and the second touch area;a processing unit, configured to receive the touch signals produced by the first touch area or the second touch area, and determine whether the first touch area or the second touch area is touched according to the received touch signals, and control the power management unit to provide power to the first indicator and stop providing power to the second indicator when determining the first touch area is touched by the user, and control the power management unit to stop providing power to the first indicator and provide power to the second indicator when determining ...

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Номер записи: 79
21-03-2013 дата публикации

Touch input device and electronic device using the same

Номер: US20130070158A1
Автор: Han-Che Wang, Ji-Bao Fu, Kuan-Hong Hsieh, Li-Zhang Huang, Wen-Hsiang Lu
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

A touch input device is provided. The touch input device includes a touch panel and a touch control. The touch panel includes a number of touch sensor groups, each touch sensor group includes a line of touch sensors, each touch sensor produces a touch signal in response to a user's touch, the touch sensor groups are arranged on the touch panel one by one along a predetermined path, the quantity of touch sensors of each touch sensor group is increased or decreased gradually, and the arrangement direction of the touch sensors of each touch sensor group is perpendicular to the direction of the predetermined path. The touch control is connected to the touch panel and is used to receive the touch signals produced by the touch sensor, and determine a touch path according to the changes of the quantity of the received touch signals.

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Номер записи: 80
11-04-2013 дата публикации

Packaging Process Tools and Packaging Methods for Semiconductor Devices

Номер: US20130089952A1
Автор: Cheng Ming-Da, Huang Kuei-Wei, Lin Chih-Wei, Lin Chun-Cheng, Lin Wei-Hung, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region. 1. A packaging process tool for semiconductor devices , comprising:a mechanical structure comprising a frame including a plurality of apertures adapted to retain a plurality of integrated circuit dies therein, wherein the frame comprises at least one hollow region.2. The packaging process tool according to claim 1 , wherein the mechanical structure comprises a jig.3. The packaging process tool according to claim 2 , wherein the frame of the mechanical structure includes a first side claim 2 , a second side opposite the first side claim 2 , and a plurality of connecting members coupled between the first side and the second side at edges of the first side and the second side.4. The packaging process tool according to claim 3 , wherein the first side claim 3 , the second side claim 3 , and the plurality of connecting members of the frame comprise a thickness of about 0.1 mm to about 10 mm.5. The packaging process tool according to claim 3 , wherein the first side claim 3 , the second side claim 3 , and the plurality of connecting members of the frame comprise stainless steel claim 3 , aluminum claim 3 , ceramic claim 3 , rubber claim 3 , epoxy claim 3 , a plastic polymer claim 3 , or combinations thereof.6. The packaging process tool according to claim 3 , wherein the frame further comprises at least one support member coupled between the first side and the second side or between opposing connecting members.7. The packaging process tool according to claim 6 , wherein the at least one support member of the frame is disposed substantially perpendicular to the first side and the second side or to the opposing ...

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Номер записи: 81
18-04-2013 дата публикации

Process for Forming Package-on-Package Structures

Номер: US20130093078A1
Автор: Chen Meng-Tse, Cheng Ming-Da, Huang Kuei-Wei, Lin Chih-Wei, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material. 1. A device comprising:an inter-layer dielectric;a first device die under the inter-layer dielectric;a die-attach film under the inter-layer dielectric and over the first device die, wherein the die-attach film is attached to the device die;a first plurality of redistribution lines comprising first portions level with the die-attach film;a first plurality of Z-interconnects electronically coupled to the device die and the first plurality of redistribution lines; anda first polymer-comprising material under the inter-layer dielectric, wherein the first device die, the die-attach film, and the first plurality of Z-interconnects are disposed in the first polymer-comprising material.2. The device of claim 1 , wherein a top surface of the die-attach film contacts a bottom surface of the inter-layer dielectric.3. The device of claim 1 , wherein the first plurality of redistribution lines further comprises second portions extending into the inter-layer dielectric claim 1 , wherein top surfaces of the first plurality of redistribution lines and a top surface of the inter-layer dielectric form a planar surface.4. The device of further comprising:a second plurality of redistribution lines electrically coupled to the first plurality of Z-interconnects, wherein the first and the second plurality of redistribution lines are on opposite sides of the first plurality ...

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Номер записи: 82
25-04-2013 дата публикации

Process for Forming Packages

Номер: US20130102112A1
Автор: Chen Meng-Tse, Cheng Ming-Da, Huang Kuei-Wei, Lin Wei-Hung, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method includes loading a first package component on a concave boat, and placing a second package component over the first package component. A load clamp is placed over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat. A reflow step is performed to bond the second package component to the first package component. During a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat. 1. A method comprising:loading a first package component on a concave boat;placing a second package component over the first package component;placing a load clamp over the second package component, wherein the load clamp is supported by a temperature-variable spacer of the concave boat; andperforming a reflow step to bond the second package component to the first package component, wherein during a temperature-elevation step of the reflow step, the temperature-variable spacer is softened in response to an increase in temperature, and wherein a height of the softened temperature-variable spacer is reduced, until the load clamp is stopped by a rigid spacer of the concave boat.2. The method of claim 1 , wherein the reflow step further comprises a temperature-lowering step claim 1 , and wherein during the temperature-lowering step claim 1 , the temperature-variable spacer is hardened claim 1 , and raises the load clamp up from the rigid spacer.3. The method of further comprising removing the load clamp from over the concave boat after a temperature of the concave boat is lowered claim 1 , and a top surface of the temperature-variable spacer is higher than a top surface of the rigid spacer.4. The method of claim 1 , wherein during the reflow step claim 1 , no additional force is applied on the load clamp to push ...

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Номер записи: 83
09-05-2013 дата публикации

Apparatus and Methods for Molded Underfills in Flip Chip Packaging

Номер: US20130115735A1
Автор: Chen Meng-Tse, Cheng Ming-Da, Lin Chun-Cheng, Lin Hsiu-Jen, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed. 1. A method , comprising:loading a flip chip substrate comprising at least one flip chip mounted integrated circuit on the substrate into a selected one of an upper mold chase and a lower mold chase of a mold press at a first temperature;positioning a molded underfill material in the at least one of the upper and lower mold chases overlying the flip chip substrate and the at least one integrated circuit, while maintaining the upper and lower mold chases at the first temperature which is lower than a melting temperature of the molded underfill material;closing the upper and lower mold chases together to form a sealed mold cavity and creating a vacuum in the mold cavity;raising the temperature of the molded underfill material to a second temperature greater than the melting point of the molded underfill material to cause the molded underfill material to flow over the flip chip substrate and beneath the at least one flip chip mounted integrated circuit, forming an underfill layer and forming an overmolded layer;cooling the flip chip substrate and the mold cavity to ...

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Номер записи: 84
23-05-2013 дата публикации

MOUNTING DEVICE FOR FAN MODULE

Номер: US20130128451A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting device secures a fan module to a chassis. The mounting device includes a bracket and a spring. The bracket includes a bottom plate and a vent plate substantially perpendicular to the bottom plate. The bottom plate defines a through hole. The spring is fixed on the bottom plate adjacent to the vent plate. The spring includes an elastic portion and a securing tab protruding through the through hole. The elastic portion can retract the securing tab into the bracket. 1. A mounting device for securing a fan module to a chassis , comprising:a bracket comprising a bottom plate and a vent plate substantially perpendicular to the bottom plate, the bottom plate defines a through hole; anda spring fixed on the bottom plate adjacent to the vent plate, the spring comprises an elastic portion and a securing tab protruding through the through hole,wherein the elastic portion is configured to retract the securing tab into the bracket.2. The mounting device of further comprising a pressing member fixed on the vent plate claim 1 , wherein the pressing member is configured to deform the elastic portion of the spring.3. The mounting device of claim 2 , wherein a deforming direction of the pressing member is substantially parallel to the bottom plate and the vent plate.4. The mounting device of claim 2 , wherein the elastic portion is curved inside claim 2 , and the pressing member abuts the elastic portion.5. The mounting device of claim 2 , wherein the pressing member comprises an urging portion claim 2 , and the urging portion is resilient.6. The mounting device of claim 2 , wherein the pressing member comprises an operating portion claim 2 , the vent plate defines a cutout claim 2 , and the operating portion is located in the cutout.7. The mounting device of claim 1 , wherein the spring is substantially U-shaped.8. The mounting device of claim 7 , wherein the spring is mounted to the bottom plate at one end of the spring claim 7 , and is mounted to the vent plate at an ...

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Номер записи: 85
06-06-2013 дата публикации

SELF-ALIGNED IMPLANTS TO REDUCE CROSS-TALK OF IMAGING SENSORS

Номер: US20130140666A1
Автор: Fu Shih-Chi, LU Wen-Chen, TZENG Kai
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate. The method includes patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate. The method further includes performing a first implant to form a deep doped region between the two neighboring sensor elements and starting at a distance below a top surface of the substrate. The method further includes performing a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region. 1. A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate , the method comprising:patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate;performing a first implant to form a deep doped region between the two neighboring sensor elements and starting at a distance below a top surface of the substrate; andperforming a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with a top portion of the deep doped region.2. The method of claim 1 , wherein performing the second implant comprises decreasing a size of the two neighboring sensor elements.3. The method of claim 1 , further comprising forming an etch stop layer between the substrate and the oxide layer claim 1 , wherein performing the first implant comprises performing the first implant through the etch stop layer claim 1 , and performing the second implant comprises performing the second implant through the etch stop layer.4. The method of claim 1 , further comprising removing the oxide layer after the second implant.5. The method of claim 1 , further comprising forming a shallow isolation feature in the substrate between the two neighboring sensor elements ...

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Номер записи: 86
13-06-2013 дата публикации

FILTRATION DEHYDRATION APPARATUS

Номер: US20130146515A1
Автор: BAI Ming-Der, CHEN Kuo-Ti, LAN Te-Chang, LEE Hom-Ti, LIN Yun-Huin, LU Wen-Chang
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A filtration dehydration apparatus, comprises: a filter, having a filtration layer and an absorption layer while allowing a surface of the filtration layer opposite to the absorption layer to be a first side of the filter, and allowing a surface of the absorption layer opposite to the filtration layer to be a second side of the filter; a supporting structure, for supporting and fixedly secured the filter; a solid collector, for collecting any solid object left on the first side; and an extrusion unit, for pressing the absorption layer so as to squeeze liquid containing in the absorption layer out of the same; wherein the first side is provided for a solid-liquid mixture to be placed thereon for allowing the liquid containing therein to flow into the absorption layer through the filtration layer while enabling any solid object filtered out and thus left on the first side. 1. A filtration dehydration apparatus , comprising:a filter, composed of a filtration layer and an absorption layer while allowing a surface of the filtration layer that is orientated opposite to the absorption layer to be a first side of the filter, and allowing a surface of the absorption layer that is orientated opposite to the filtration layer to be a second side of the filter;a supporting structure, for supporting and fixedly securing the filter;a solid collector, for collecting any solid object left on the first side; andan extrusion unit, for pressing the absorption layer so as to squeeze liquid containing in the absorption layer out of the same;wherein, the first side is provided for a solid-liquid mixture to be placed thereon for allowing the liquid containing in the solid-liquid mixture to flow into the absorption layer through the filtration layer while enabling any solid object in the solid-liquid mixture to be filtered out and thus left on the first side.2. The filtration dehydration apparatus of claim 1 , wherein the supporting structure is arranged piecing through the filter.3. The ...

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Номер записи: 87
13-06-2013 дата публикации

FILTRATION DEHYDRATION APPARATUS

Номер: US20130146520A1
Автор: BAI Ming-Der, CHEN Kuo-Ti, LAN Te-Chang, LEE Hom-Ti, LIN Yun-Huin, LU Wen-Chang
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A filtration dehydration apparatus, which comprises: a filter, composed of a filtration layer and an absorption layer while allowing the filtration layer that is orientated facing toward the absorption layer to be a first side, and allowing a surface of the absorption layer that is orientated facing toward the filtration layer to be a second side; a supporting structure, for supporting and fixedly securing the filter; a solid waste collector, for collecting solid object left on the first side; and an extrusion unit, for pressing the absorption layer to squeeze out water in the absorption layer; wherein the first side is provided for a solid-liquid mixture to be placed thereon so as to allow the liquid containing in the solid-liquid mixture to flow into the absorption layer through the filtration layer while enabling solid object in the solid-liquid mixture to be filtered out and thus left on the first side. 1. A filtration dehydration apparatus , comprising:a filter, composed of a filtration layer and an absorption layer while allowing a surface of the filtration layer that is orientated opposite to the absorption layer to be a first side of the filter, and allowing a surface of the absorption layer that is orientated opposite to the filtration layer to be a second side of the filter;a supporting structure, for supporting and fixedly securing the filter;a solid collector, for collecting any solid object left on the first side; andan extrusion unit, for pressing the absorption layer so as to squeeze liquid containing in the absorption layer out of the same;wherein, the first side is provided for a solid-liquid mixture to be placed thereon for allowing the liquid containing in the solid-liquid mixture to flow into the absorption layer through the filtration layer while enabling any solid object in the solid-liquid mixture to be filtered out and thus left on the first side.2. The filtration dehydration apparatus of claim 1 , wherein the supporting structure is arranged ...

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Номер записи: 88
13-06-2013 дата публикации

SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERCONNCET

Номер: US20130147031A1
Автор: Chen Hsien-Wei, Lu Wen-Hsiung, Wu Yi-Wen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A semiconductor device includes a post-passivation interconnect (PPI) structure having a landing pad region. A polymer layer is formed on the PPI structure and patterned with a first opening and a second opening to expose portions of the landing pad region. The second opening is a ring-shaped opening surrounding the first opening. A bump structure is formed on the polymer layer to electrically connect the landing pad region through the first opening and the second opening. 1. A semiconductor device , comprising:a passivation layer overlying a semiconductor substrate;an interconnect structure overlying the passivation layer;a protective layer overlying the interconnect layer and comprising a first opening and a second opening exposing portions of the interconnect layer, wherein the first opening is surrounded by the second opening; anda bump structure formed overlying the protective layer and electrically connected to the interconnect structure through the first opening and the second opening.2. The semiconductor device of claim 1 , wherein the second opening is a continuous ring-shaped opening.3. The semiconductor device of claim 1 , wherein the second opening is a discontinuous ring-shaped opening.4. The semiconductor device of claim 3 , wherein the second opening comprises at least two separated sub-openings.5. The semiconductor device of claim 1 , the bump structure fills the first opening and the second opening.6. The semiconductor device of claim 1 , wherein the bump structure comprises a solder bump.7. The semiconductor device of claim 6 , wherein the solder bump fills the first opening and the second opening.8. The semiconductor device of claim 6 , wherein the bump structure comprises a barrier layer formed between the solder bump and the interconnect layer.9. The semiconductor device of claim 8 , wherein the barrier layer partially fills the first opening and the second opening.10. The semiconductor device of claim 9 , wherein the barrier layer in the second ...

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Номер записи: 89
27-06-2013 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20130163213A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a chassis and a fixing module. The chassis includes a bottom plate, and a circuit board attached to the bottom plate. The fixing module includes a blocking member. The blocking member is rotatably secured to the bottom plate and abuts the circuit board, to prevent the circuit board from moving along a direction parallel to the bottom plate. 1. A mounting apparatus comprising:a chassis, the chassis comprises a bottom plate, a circuit board attached to the bottom plate, and a limiting portion locating the bottom plate; anda fixing module, the fixing module comprising a blocking member, the blocking member being rotatably secured to the limiting portion and abuts the circuit board, to prevent the circuit board from moving along a direction parallel to the bottom plate.2. The mounting apparatus of claim 1 , wherein the blocking member comprises a fixing board and a blocking board claim 1 , the fixing board is rotatably secured to the bottom plate claim 1 , and the blocking board abuts the circuit board.3. The mounting apparatus of claim 2 , wherein the blocking member further comprises a connecting portion claim 2 , connecting the fixing board and the blocking board claim 2 , and the connecting portion is substantially perpendicular to the fixing board and the blocking board.4. The mounting apparatus of claim 3 , wherein the fixing board is substantially parallel to the blocking board.5. The mounting apparatus of claim 2 , wherein the fixing module further comprises a securing member; the fixing board defines a fixing hole; the limiting portion defines a limiting hole; and the securing member is engaged in the fixing hole and the limiting hole claim 2 , to rotatably secure the blocking member to the limiting portion.6. The mounting apparatus of claim 2 , wherein the fixing module further comprises a locking member; the blocking board defines a locking hole; the bottom plate defines a first securing hole; and the fixing module is engaged in ...

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Номер записи: 90
04-07-2013 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20130167366A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a chassis and a fixing module. The chassis includes a bottom plate. The fixing module includes a securing member and a blocking member. The securing member is secured to the bottom plate. The blocking member is pivoted to the securing member and configured to block a circuit board, to prevent the circuit board from moving along a direction perpendicular to a plane that is perpendicular to the bottom plate. 1. A mounting apparatus comprising:a chassis comprising a bottom plate; anda fixing module comprising a securing member and a blocking member, the securing member being secured to the bottom plate, the blocking member being rotatably secured to the securing member; and the blocking member being configured to block a circuit board, to prevent the circuit board from moving along a direction parallel to the bottom plate.2. The mounting apparatus of claim 1 , wherein the blocking member comprises a blocking board and two supporting bases located on the blocking board claim 1 , the blocking board is configured to abut the circuit board claim 1 , and the two supporting bases stand on the bottom plate.3. The mounting apparatus of claim 2 , wherein each of the two supporting bases comprises a connecting tab and a resisting tab connected to the connecting tab claim 2 , the connecting tab is substantially perpendicular to the blocking board claim 2 , and the connecting tab is substantially parallel to the blocking board.4. The mounting apparatus of claim 1 , wherein the blocking member comprises two pivot pieces claim 1 , the securing member comprises two positioning pieces claim 1 , and the two pivot pieces are rotatably attached to the two positioning pieces respectively.5. The mounting apparatus of claim 4 , wherein the fixing module further comprises a pivot shaft claim 4 , each of the two pivot pieces defines a pivot hole claim 4 , each of the two positioning pieces defines a positioning hole; and the pivot shaft extends through the pivot ...

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Номер записи: 91
04-07-2013 дата публикации

MOUNTING APPARATUS FOR POWER SUPPLY

Номер: US20130168518A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a chassis and a mounting tray for receiving a power supply. The chassis includes a side plate. The side plate includes a side plate body, a securing flange extending from the side plate body, and a mounting portion extending from the side plate body. The mounting tray includes a positioning portion and an engaging portion. The engaging portion engages the securing flange to prevent the mounting tray from moving along a first direction substantially parallel to the side plate body. The positioning portion defines a positioning space receiving the mounting portion to prevent the mounting tray from moving along a second direction substantially perpendicular to the side plate body. The positioning portion moves along a third direction substantially opposite to the first direction to enable the mounting portion to be received in the positioning space. 1. A mounting apparatus comprising:a chassis comprising a side plate; the side plate comprising a side plate body, a securing flange extending from the side plate body, and a mounting portion extending from the side plate body; anda mounting tray for receiving a power supply, the mounting tray comprises a positioning portion and an engaging portion; the engaging portion engages the securing flange to prevent the mounting tray from moving along a first direction that is substantially parallel to the side plate body; the positioning portion defines a positioning space receiving the mounting portion to prevent the mounting tray from moving along a second direction that is substantially perpendicular to the side plate body; and the positioning portion configured to move along a third direction that is substantially opposite to the first direction, to enable the mounting portion to be received in the positioning space.2. The mounting apparatus of claim 1 , wherein the mounting tray comprises a base body; the positioning portion extends from the base body; the positioning portion comprises a ...

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Номер записи: 92
04-07-2013 дата публикации

Seamless Multi-Poly Structure and Methods of Making Same

Номер: US20130168794A1
Автор: Chen Chih-Yuan, Fu Shih-Chi, KUO Ching-Sen, LU Wen-Chen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A sensor array is integrated onto the same chip as core logic. The sensor array uses a first polysilicon and the core logic uses a second polysilicon. The first polysilicon is etched to provide a tapered profile edge in the interface between the sensor array and the core logic regions to avoid an excessive step. Amorphous carbon can be deposited over the interface region without formation of voids, thus providing for improved manufacturing yield and reliability. 1. A method for forming an integrated circuit comprising:forming a first gate oxide on a substrate, the substrate including a sensor array region, a core logic region, and an input/output (I/O) region;depositing a first polysilicon over the first gate oxide;patterning the first polysilicon to have a tapered profile edge at an interface between the sensor array region, and the core logic region;forming a second gate oxide over the first polysilicon and the substrate;patterning the second gate oxide to remove the second gate oxide from the core region;forming a third gate oxide over the second gate oxide and over the substrate in the core region;depositing a second polysilicon over the third gate oxide and removing the second polysilicon over the sensor array region, wherein the second polysilicon is formed over the tapered profile edge of the first polysilicon, and removing the second gate oxide and the third gate oxide over the sensor array region;depositing an amorphous carbon layer over the second polysilicon, wherein the amorphous carbon layer is void free at the interface between the sensor array region and the core logic region; andpatterning the amorphous carbon layer and patterning the first polysilicon and the second polysilicon using the patterned amorphous carbon layer as a hard mask.2. The method of wherein the step of removing the second polysilicon over the sensor array region comprises:depositing a photoresist material over the second polysilicon;patterning the photoresist material to have at ...

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Номер записи: 93
04-07-2013 дата публикации

LED LAMP

Номер: US20130170182A1
Автор: CHEN TE-SHENG, HSIEH KUAN-HONG, LU WEN-HSIANG, YANG BO-YONG, YI LIANG, Zhang Yu
Принадлежит:

An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The body includes a rear cover, a front cover, a fixing member, a lamp board, a number of LED light sources and a driving circuit board. The fixing member includes a ring-shaped fixing element. The lamp board is mounted on an external circumferential surface of the fixing element, the LED light sources are mounted on the lamp board facing an inside of the rear cover. The driving circuit board is configured to drive the LED light sources to emit light beams towards the rear cover. The rear cover is configured for allowing a portion of the light beams from the LED light sources to pass therethrough and reflecting remaining portion of the light beams to the front cover, and the front cover is configured for allowing the reflected light to pass therethrough. 1. A light emitting diode (LED) lamp comprising:a socket for insertion into a bulb seat thus being electrically connected to an external power source; and a rear cover and a front cover;', 'a driving circuit board;', 'a fixing member comprising a first ring-shaped fixing element and a second ring-shaped fixing element, wherein the first fixing element protrudes from the second fixing element toward the rear cover, and is configured for fixing the rear cover and the driving circuit board to the fixing member;', 'a first lamp board mounted on an external circumferential surface of the second fixing element; and', 'a plurality of LED light sources mounted on the first lamp board facing an inside of the rear cover; the driving circuit board electrically connected to the socket and the first lamp board, the driving circuit board configured for driving the LED light sources to emit light beams towards the rear cover;, 'a shallow dish-shaped body detachably connected to the socket, the body comprisingwherein, the rear cover is configured for allowing a portion of the light beams from the LED light sources to pass therethrough ...

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Номер записи: 94
04-07-2013 дата публикации

Led lamp

Номер: US20130170183A1
Автор: Bo-Yong Yang, Kuan-Hong Hsieh, LIANG Yi, Te-Sheng Chen, Wen-Hsiang Lu, Yu Zhang
Принадлежит: Individual

An LED lamp includes a socket and a shallow dish-shaped body detachably connected to the socket. The socket is electrically connected to an external power source. The body includes a rear cover, a transparent front cover, a lamp board, a number of LED light sources, a driving circuit board and a fixing member. The LED light sources are mounted on the lamp board facing the front cover, wherein the LED light sources are visible from an outside of the transparent front cover when they are lit. The driving circuit board is electrically connected to the socket and the lamp board, and is configured for driving the LED light sources to emit light beams. The fixing member is configured for fixing the rear cover, the driving circuit board and the lamp board together.

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Номер записи: 95
04-07-2013 дата публикации

LED ILLUMINATING DEVICE

Номер: US20130170202A1
Автор: CUI JUN-JIE, KUNG TE-YUAN, LEI QI-QIANG, LU WEN-HSIANG, WANG ZHAO-YU, YANG TSANG-CHIANG
Принадлежит:

An LED illuminating device includes a base, an LED substrate mounted on the base, at least one LED on the substrate and an envelope fixed on the base. The envelope includes a plurality of transmission regions and a plurality of reflective regions. The lights beams emitted by the LED reaches the envelope. A first portion of the light beams reaching transmission regions can pass therethough. A second portion of the light beams are internally reflected in multiple times by the reflective regions until they finally escape to outside through the transmission regions. The direction of the light beams can reach various locations of each of the transmission regions at various angles. 1. An LED illuminating device comprising:a base;an LED substrate mounted on the base;at least one LED arranged on the LED substrate;a driving circuit module accommodated in the base and electrically connected with the at least one LED; andan envelope fixed on the base and comprising a plurality of transmission regions and a plurality of reflective regions, the plurality of transmission regions allowing a first portion of light beams emitted by the at least one LED to pass therethrough, the plurality of reflective regions being configured to reflect a second portion of the light beams emitted by the at least one LED and allowing light beams emitted by the at least one LED to reach various locations of the plurality of transmission regions at various angles.2. The LED illuminating device of claim 1 , wherein the envelope is made of transparent plastic or glass.3. The LED illuminating device of claim 1 , wherein the plurality of reflective regions are discrete reflective films formed on an internal surface of the envelope.4. The LED illuminating device of claim 3 , wherein the discrete reflective film are a metal reflective coating chosen from the group consisting of an aluminum coating claim 3 , a gold coating and a silver coating.5. The LED illuminating device of claim 1 , wherein the plurality ...

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Номер записи: 96
11-07-2013 дата публикации

PEELING PROCESS OF SUBSTRATE

Номер: US20130174985A1
Автор: Chiang Ming-Sheng, LU Wen-Chang, LUAN Ta-Nien, Wu Chi-Ming
Принадлежит: E Ink Holdings Inc.

A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and then illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. After that, the second substrate is peeled off from the first substrate. 1. A peeling process of substrate suitable for separating a first substrate and a second substrate bonded to each other , wherein the first substrate has a first bonding surface , the second substrate has a second bonding surface and a back surface opposite to each other , the first bonding surface is bonded to the second bonding surface , the peeling process comprising:providing a light beam illuminating the first bonding surface and the second bonding surface by being incident through the back surface of the second substrate with a first incident angle, wherein the first incident angle is larger than 0 degree and smaller than 90 degree; andpeeling off the second substrate from the first substrate.2. The peeling process of substrate according to claim 1 , wherein the light beam comprises a laser beam.3. The peeling process of substrate according to claim 1 , wherein the method of providing the light beam incident through the back surface at the first incident angle comprises:illuminating the first bonding surface and the second bonding surface along different directions at different times by the light beam.4. The peeling process of substrate according to claim 3 , wherein the method of providing the light beam incident through the back surface at the first incident ...

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Номер записи: 97
18-07-2013 дата публикации

Package on Package Interconnect Structure

Номер: US20130181338A1
Автор: Cheng Ming-Da, Lin Chih-Wei, Lin Hsiu-Jen, Liu Chung-Shi, Lu Wen-Hsiung, Wu Yi-Wen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A structure comprises a post passivation interconnect layer formed over a semiconductor substrate, a metal bump formed over the post passivation interconnect layer and a molding compound layer formed over the semiconductor substrate. A lower portion of the metal bump is embedded in the molding compound layer and a middle portion of the metal bump is surrounded by a concave meniscus molding compound protection layer. 1. A structure comprising:a post passivation interconnect layer formed over a semiconductor substrate;a metal bump formed over the post passivation interconnect layer;a molding compound layer formed over the semiconductor substrate, wherein a lower portion of the metal bump is embedded in the molding compound layer; anda concave meniscus molding compound protection layer formed over the molding compound layer, wherein the concave meniscus molding compound protection layer surrounds a middle portion of sidewalls of the metal bump.2. The structure of claim 1 , further comprising an immersion tin layer formed over the post passivation layer claim 1 , wherein the immersion tin layer is embedded in the molding compound layer.3. The structure of claim 1 , wherein the metal bump is a solder ball.4. The structure of claim 1 , wherein the metal bump comprises:a bottom metal portion formed on the post passivation interconnect layer; andan upper solder portion formed over the bottom metal portion.5. The structure of claim 1 , further comprising:a first metal layer formed over the substrate;a first dielectric layer formed on the first metal layer;a second metal layer formed on the first dielectric layer;a first passivation layer formed over the second metal layer;a second passivation layer formed over the first passivation layer;a bond pad embedded in the first passivation layer and the second passivation layer; anda protection layer formed on the second passivation layer.6. The structure of claim 5 , wherein the bond pad is an aluminum bond pad.7. The structure of ...

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Номер записи: 98
25-07-2013 дата публикации

PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME

Номер: US20130187269A1
Автор: Cheng Ming-Da, Lee Chien-Hsiun, Lin Hung-Jen, Liu Chung-Shi, Lu Wen-Hsiung, WANG Tsung-Ding
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A package assembly including a semiconductor die electrically coupled to a substrate by an interconnected joint structure. The semiconductor die includes a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump. The substrate includes a no-flow underfill layer on a conductive region. A second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure. 1. A package assembly , comprising a semiconductor die electrically coupled to a substrate by an interconnected joint structure:wherein the semiconductor die comprises a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump;wherein the substrate comprises a no-flow underfill layer on a conductive region; andwherein a second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure.2. The package assembly of claim 1 , wherein the bump is a solder bump.3. The package assembly of claim 1 , wherein the bump is electrically connected to the conductive region.4. The package assembly of claim 1 , wherein the second portion of the bump protrudes from a top surface of the molding compound layer.5. The package assembly of claim 1 , wherein the semiconductor die further comprises a post-passivation interconnect (PPI) layer between the semiconductor substrate and the molding compound layer.6. The package assembly of claim 5 , wherein semiconductor die further comprises a polymer layer between the PPI layer and the molding compound layer.7. The package assembly of claim 5 , wherein semiconductor die further comprises a polymer layer between the PPI layer and the semiconductor substrate.8. The package assembly of claim 1 , wherein the bump is a solder bump with a diameter greater ...

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Номер записи: 99
15-08-2013 дата публикации

MOUNTING APPARATUS FOR CIRCUIT BOARD

Номер: US20130205585A1
Автор: CHIU PO-WEN, LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus for securing a circuit board to a bottom panel includes a first mounting member and a second mounting member. The first mounting member includes a positioning portion, and an installation portion extending from the positioning portion. The second mounting member includes a stopper portion and a locking portion extending from the stopper portion. An installation hole is defined in the locking portion, and a number of blocking portions located on the stopper portion. The bottom panel defines a through hole, and the circuit board defines an installation opening. The installation portion extends though the through hole and is engaged in the installation hole by rotation of the blocking portions, and the positioning portion abuts the bottom panel. The stopper portion is adapted to extend through the installation opening for engaging with the circuit board. 1. A mounting apparatus for securing a circuit board to a bottom panel , comprising:a first mounting member, the first mounting member comprising a positioning portion and an installation portion extending from the positioning portion;a second mounting member, comprising a stopper portion and a locking portion, extending from the stopper portion; and an installation hole defined in the locking portion, and a plurality of blocking portions located on the stopper portion; andwherein the bottom panel defines a through hole, and the circuit board defines an installation opening; the installation portion extends though the through hole and is engaged in the installation hole via rotating the plurality of blocking portions, and the positioning portion abuts the bottom panel; and the stopper portion adapted to extend through the installation opening, for engaging with the circuit board.2. The mounting apparatus of claim 1 , wherein the bottom panel defines a top surface and a bottom surface claim 1 , relative to the top surface; and a concave portion is located on the bottom surface claim 1 , for ...

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Номер записи: 100
29-08-2013 дата публикации

DEVICE FOR MOUNTING LED LAMP TUBE

Номер: US20130223054A1
Автор: JIA DA-SHENG, Li Jian, LU WEN-HSIANG, XIE HUA-REN, ZHANG LI-TAO
Принадлежит:

A device for mounting an LED lamp tube is provided. The device includes two mounting base, each of which includes a mounting socket, a rotary member and a connection member. The rotary member is received in a cavity defined in the mounting socket, and is rotatable with respect to the mounting socket, and remains static with respect to the mounting socket when not being rotated. The rotary member defines a pair of mounting holes for insertion of pins of the LED lamp tube thereinto. A first connection portion is formed on one end of the mounting socket. A second connection portion is formed on one end of the connection member, the second connection portion is configured for engaging with the first connection portion, to latchingly connect the connection member to the mounting socket, and retain the rotary member in the cavity of the mounting socket. 1. A device for mounting an LED lamp tube , the LED lamp tube comprising a tubular lamp body and a pair of end caps attached to opposite end portions of the lamp body , each end cap comprising a pair of pins; the device comprising a first mounting base and a second mounting base configured for receiving opposite end portions of the LED lamp tube , each of the first mounting base and the second mounting base comprising:a mounting socket including a cavity defined therein and a first connection portion arranged at one end thereof;a rotary member received in the cavity of the mounting socket, and being rotatable with respect to the mounting socket under a pressure applied thereto, and remaining stationary with respect to the mounting socket when the pressure is removed; the rotary member defining a pair of mounting holes for insertion of the pins of the LED lamp tube thereinto; anda connection member, wherein a second connection portion is formed on one end of the connection member, the second connection portion is configured for engaging with the first connection portion, to latchingly connect the connection member to the ...

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Номер записи: 101
29-08-2013 дата публикации

STREET LAMP

Номер: US20130223065A1
Автор: CHEN TE-SHENG, HSIEH KUAN-HONG, LU WEN-HSIANG, PENG ZHEN-RONG, YANG BO-YONG, Zhang Yu
Принадлежит:

A street lamp includes a lamp post and a lamp housing mounted on a distal end of the lamp post. An alternating current cable is received in the lamp post. A light source is received in the lamp housing. A power supplying device is electrically connected to the light source via a connecting cable. A connection device includes an Edison screw socket and an Edison male screw plug being detachably and threadedly engaged in the Edison screw socket. The Edison screw socket is electrically coupled to the alternating current cable, and the Edison male screw plug is electrically and mechanically coupled to the power supplying device. The power supplying device is configured for converting an alternating current into direct current and supplying the direct current to the light source. 1. A street lamp comprising:a lamp post;a lamp housing mounted on a distal end of the lamp post;an alternating current cable received in the lamp post;a light source received in the lamp housing;a power supplying device electrically connected to the light source via a connecting cable; anda connection device comprising an Edison screw socket and an Edison male screw plug being detachably and threadedly engaged in the Edison screw socket, the Edison screw socket electrically coupled to the alternating current cable, and the Edison male screw plug electrically and mechanically coupled to the power supplying device;wherein the power supplying device is configured for converting an alternating current into direct current and supplying the direct current to the light source.2. The street lamp of claim 1 , wherein the Edison screw socket is a standard E27 socket or a standard E40 socket claim 1 , and the Edison male screw plug is correspondingly a standard E27 plug or a standard E40 plug.3. The street lamp of claim 1 , wherein the lamp housing comprising a shell and a cover attached to the shell.4. The street lamp of claim 3 , wherein the cover is pivotally attached to the shell.5. The street lamp of ...

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Номер записи: 102
26-09-2013 дата публикации

IMAGE COMPRESSION

Номер: US20130251256A1
Автор: Deng Dixon De Sheng, Lu Wen Tao
Принадлежит: CANON KABUSHIKI KAISHA

Disclosed is a method of compressing an image to be stored in a memory to satisfy a memory requirement. A size of a region having a uniform colour in the image is determined. The determined size of the region is compared with the candidate values of the region size threshold. A value is selected from the candidate values as the region size threshold based on the comparison between the estimated data amounts to satisfy the region size threshold and the memory requirement. The edges constituting the region which satisfy the selected value of the region size threshold are compressed losslessly. 1. A method of compressing an image to be stored in a memory to satisfy a memory requirement , said method comprising the steps of:determining a size of a region in the image, the region having a uniform colour;obtaining candidate values of a region size threshold;comparing the determined size of the region with at least one of the candidate values of the region size threshold;estimating data amounts to encode edges constituting the region which satisfy the at least one of the candidate values of the region size threshold;selecting a value from the candidate values as the region size threshold based on the comparison between the estimated data amounts and the memory requirement;compressing losslessly edges constituting the region which satisfy the selected value of the region size threshold; andcompressing lossily image data in a region other than the region to be compressed losslessly.2. A method according to claim 1 , wherein the region is defined by the edge pair and the size of the region is determined based on the sum of length of the edge pair and maximum width of the edge pair.3. A method according to claim 1 , wherein the memory requirement is defined by subtracting the amount memory to store lossily compressed image data at a predetermined quality level from a predetermined memory target size.4. A method according to claim 1 , wherein the selected value from the ...

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Номер записи: 103
03-10-2013 дата публикации

PACKAGING DEVICE AND METHOD OF MAKING THE SAME

Номер: US20130256870A1
Автор: Cheng Ming-Da, Huang Chang-Chia, Lin Tsung-Shu, Lu Wen-Hsiung, SU Bor-Rung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace. 1. A device comprising:a first package component;a metal trace on a surface of the first package component, wherein the metal trace has a lengthwise direction, and wherein the metal trace comprises an undercut along the lengthwise direction; anda liquid molding material fills the undercut along the lengthwise direction of the metal trace.2. The device of further comprising:a second package component comprising a metal pillar, wherein the second package component is disposed over the first package component; anda solder region bonding the metal pillar to the metal trace, wherein the solder region contacts a top surface and the first edge of the first portion.3. The device of claim 1 , wherein the metal traces comprises copper claim 1 , tungsten claim 1 , nickel claim 1 , palladium claim 1 , gold claim 1 , or alloys thereof.4. The device of claim 2 , wherein the second packaging component is a passive component that does not have active devices therein.5. The device of claim 2 , wherein the second packaging component is a device die.6. The device of claim 5 , wherein the second packaging component comprises a substrate claim 5 , an interconnect structure claim 5 , which includes metal lines and vias formed therein claim 5 , is formed over the substrate.7. The device of claim 6 , wherein the interconnect structure comprises an inter-layer dielectric layer.8. The device of claim 6 , wherein the interconnect structure comprises an inter-metal dielectric layer claim 6 , and the inter-metal dielectric layer comprises low-k dielectric materials ...

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Номер записи: 104
03-10-2013 дата публикации

ELECTRONIC INK DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20130258447A1
Автор: Chiang Ming-Sheng, JUANG Jen-Yi, LU Wen-Chang, LUAN Ta-Nien, Wu Chi-Ming
Принадлежит: E Ink Holdings Inc.

A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided. 1. A method for manufacturing an electronic ink display device , the method comprising the steps of:forming an electronic ink layer on a driving substrate, wherein an outside of the electronic ink layer has a display surface, and an outside of the driving substrate has a back surface;forming a front protective layer covering the display surface, wherein the front protective layer has a dimension greater than a dimension of the driving substrate; andfilling a sealant covering and surrounding a sidewall of the electronic ink layer between the front protective layer and the back surface of the driving substrate, and a sidewall of the driving substrate.2. The method of claim 1 , wherein the front protective layer comprises a front release film covering an outside surface of the front protective layer.3. The method of claim 2 , further comprising removing the front release film.4. The method of claim 1 , wherein the step of forming the front protective layer comprises forming a back protective layer beneath the driving substrate and covering the back surface of the driving substrate claim 1 , and the back protective layer has a dimension smaller than the dimension of the front protective layer.5. The method of claim 4 , wherein the back protective layer comprises a back release film covering an outside surface of the back protective layer.6. The method of claim 5 , further comprising ...

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Номер записи: 105
07-11-2013 дата публикации

CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION

Номер: US20130295762A1
Автор: CHANG JACKY, Cheng Ming-Da, Lin Chih-Wei, Liu Chung-Shi, Lu Wen-Hsiung, Yu Chen-Hua
Принадлежит:

A method of forming a bump structure includes providing a semiconductor substrate and forming an under-bump-metallurgy (UBM) layer on the semiconductor substrate. The method further includes forming a mask layer on the UBM layer, wherein the mask layer has an opening exposing a portion of the UBM layer. The method further includes forming a copper layer in the opening of the mask layer and removing a portion of the mask layer to form a space between the copper layer and the mask layer. The method further includes performing an electrolytic process to fill the space with a metal layer and removing the mask layer. 1. A method of forming a bump structure , comprising:providing a semiconductor substrate;forming an under-bump-metallurgy (UBM) layer on a semiconductor substrate;forming a mask layer on the UBM layer, wherein the mask layer has an opening exposing a portion of the UBM layer;forming a copper layer in the opening of the mask layer;removing a portion of the mask layer to form a space between the copper layer and the mask layer;performing an electrolytic process to fill the space with a metal layer; andremoving the mask layer.2. The method of claim 1 , wherein the metal layer comprises nickel.3. The method of claim 1 , wherein the metal layer comprises gold.4. The method of claim 1 , wherein the copper layer has a thickness greater than 40 um.5. The method of claim 4 , wherein the electrolytic process forms the metal layer to cover the surface of the copper layer.6. The method of claim 5 , further comprising:forming a cap layer on the metal layer within the opening of the mask layer before removing the mask layer.7. A method of forming a bump structure claim 5 , comprising:forming an under-bump-metallurgy (UBM) layer on a semiconductor substrate;forming a mask layer on the UBM layer, wherein the mask layer has an opening exposing a portion of the UBM layer;forming a copper layer in the opening of the mask layer;performing a mask pullback process to form a space ...

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Номер записи: 106
21-11-2013 дата публикации

METHOD AND APPARATUS FOR ADJUSTING WAFER WARPAGE

Номер: US20130309621A1
Автор: Cheng Ming-Da, Huang Hui-Min, Lin Chih-Wei, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method for adjusting the warpage of a wafer, includes providing a wafer having a center portion and edge portions and providing a holding table having a holding area thereon for holding the wafer. The wafer is placed onto the holding table with the center portion higher than the edge portions and thereafter pressed onto the holding area such that the wafer is attracted to and held onto the holding table by self-suction force. The wafer is heated at a predetermined temperature and for a predetermined time in accordance with an amount of warpage of the wafer in order to achieve a substantially flat wafer or a predetermined wafer level. 1. A method of adjusting warpage of a wafer , the method comprising:providing a wafer having a center portion and edge portions;providing a holding table having a holding area thereon for holding the wafer;placing the wafer onto the holding table with the center portion higher than the edge portions;pressing the wafer onto the holding area such that the wafer is attracted to and held onto the holding table by self-suction force; andheating the wafer at a predetermined temperature and for a predetermined time in accordance with an amount of warpage of the wafer in order to achieve a substantially flat wafer.2. The method of claim 1 , wherein the wafer is a composite wafer.3. The method of claim 2 , wherein the composite wafer comprises a silicon substrate and a polymer layer disposed thereon.4. The method of claim 3 , further comprising claim 3 , before placing the wafer onto the holding table claim 3 , heating the wafer to soften the polymer layer at a temperature at or above the glass transition temperature (T) of polymer.5. The method of claim 1 , wherein the holding area of the holding table has a concave profile.6. The method of claim 5 , wherein the holding area has a predetermined concave profile adapted for use on a wafer having a predetermined warpage profile for decreasing a corresponding amount of warpage in the wafer to ...

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Номер записи: 107
05-12-2013 дата публикации

IMAGE DEVICE AND METHODS OF FORMING THE SAME

Номер: US20130323876A1
Автор: Fu Shih-Chi, Hsieh Ming-Ying, KUO Ching-Sen, LU Wen-Chen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method of forming of an image sensor device includes a patterned hardmask layer is formed over a substrate. The patterned hard mask layer has a plurality of first openings in a periphery region, and a plurality of second openings in a pixel region. A first patterned mask layer is formed over the pixel region to expose the periphery region. A plurality of first trenches is etched into the substrate in the periphery region. Each first trench, each first opening and each second opening are filled with a dielectric material. A second patterned mask layer is formed over the periphery region to expose the pixel region. The dielectric material in each second opening over the pixel region is removed. A plurality of dopants is implanted through each second opening to form various doped isolation features in the pixel region. 1. A method of forming an image sensor device , the method comprising:forming a patterned hard mask layer over a substrate, wherein the patterned hard mask layer has a plurality of first openings in a periphery region of the substrate, and a plurality of second openings in a pixel region of the substrate;forming a first patterned mask layer over the pixel region to expose the periphery region;etching a plurality of first trenches into the substrate in the periphery region;filling each first trench, each first opening and each second opening with a dielectric material;forming a second patterned mask layer over the periphery region to expose the pixel region;removing the dielectric material in each second opening over the pixel region; andimplanting dopant through each second opening to form doped isolation features in the pixel region.2. The method of claim 1 , wherein the first patterned mask layer includes a first type photoresist claim 1 , and the second patterned mask layer includes a second type photoresist claim 1 , wherein the first type is opposite to the second type.3. The method of claim 1 , wherein the first patterned mask layer includes a ...

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Номер записи: 108
05-12-2013 дата публикации

SELF-ALIGNED PATTERNING FOR DEEP IMPLANTATION IN A SEMICONDUCTOR STRUCTURE

Номер: US20130323917A1
Автор: Fu Shih-Chi, KUO Ching-Sen, LI Chen-Yan, LU Wen-Chen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Methods of forming self-aligned patterns for performing oppositely doped deep implantations in a semiconductor substrate are disclosed. The semiconductor substrate has implantation and non-implantation regions. The methods include forming a hardmask pattern for a first implantation with a first conductivity-type dopant, depositing an etch stop layer, filling trenches between the hardmask pattern with a sacrificial filler material having a higher wet etch resistance than the hardmask, removing a top portion of the sacrificial filler material and the etch stop layer over a top surface of the hardmask pattern, removing the hardmask pattern in the implantation region by wet etching, and performing a second ion implantation with a second conductivity type dopant opposite of the first conductivity type. 1. A method comprising:providing a semiconductor substrate having a deep implantation region and a peripheral region;forming a hardmask pattern having a high aspect ratio in the deep implantation region and a blanket hardmask in the peripheral region;performing a first ion implantation with a first conductivity-type dopant;depositing an etch stop layer, wherein the etch stop layer conformally coats the hardmask pattern;filling trenches between the hardmask pattern with a sacrificial filler material having a higher wet etch resistance than the hardmask;removing a top portion of the sacrificial filler material and the etch stop layer over a top surface of the hardmask pattern;removing the hardmask pattern in the deep implantation region by wet etching;performing a second ion implantation with a second conductivity type dopant opposite of the first conductivity type; and,removing remaining etch stop layer, the blanket hardmask in the peripheral region, and the sacrificial filler material.2. The method of claim 1 , wherein the high aspect ratio is greater than 12.3. The method of claim 1 , wherein the forming a hardmask pattern comprises:depositing a hardmask material over the ...

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Номер записи: 109
12-12-2013 дата публикации

Methods and Apparatus of Packaging Semiconductor Devices

Номер: US20130328190A1
Автор: Ho MIng-Che, Liu Chung-Shi, Lu Wen-Hsiung, TU Chia-Wei, Wu Yi-Wen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need. 1. A package device , comprising:a contact pad on a surface of a circuit;a passivation layer over the surface of the circuit and a first portion of the contact pad, wherein a second portion of the contact pad remains exposed;a post passivation interconnect (PPI) line on the passivation layer in contact with the second portion of the contact pad; anda PPI pad connected to the PPI line, the PPI pad made of a conductive material comprising a solid part surrounding a hollow part, the solid part having an opening connected to the hollow part.2. The device of claim 1 , further comprising a polymer layer between the passivation layer and the PPI line and the PPI pad.3. The device of claim 1 , further comprising a solder ball over the hollow part of the PPI pad and in contact with the PPI pad.4. The device of claim 1 , wherein the PPI pad and the PPI line are made as one piece.5. The device of claim 1 , wherein the PPI pad is of an annular shape claim 1 , a rectangle shape claim 1 , or a square shape.6. The device of claim 1 , wherein the PPI pad is of an annular shape with an outer diameter ranging from about 180 um to about 260 um.7. The device of claim 1 , wherein the PPI pad is of an annular shape with a width of a size ranging from about 10 um to about 130 um.8. The device of claim 1 , ...

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Номер записи: 110
26-12-2013 дата публикации

Integrated Circuit Packages and Methods for Forming the Same

Номер: US20130341800A1
Автор: Chen Hsien-Wei, Kuo Yian-Liang, Lu Wen-Hsiung, TSAI Tsung-Fu, TU Chia-Wei
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies. 1. A method comprising:forming an electrical connector over a substrate of a wafer;molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer;performing a first sawing step to form a trench in the polymer layer; andafter the first sawing step, performing a second sawing step to saw the wafer into a plurality of dies.2. The method of claim 1 , wherein after the first sawing step claim 1 , a remaining portion of the polymer layer is left underlying the trench.3. The method of claim 2 , wherein the remaining portion of the polymer layer has a thickness small enough to allow a feature underlying the polymer layer to be visible through the remaining portion claim 2 , and wherein during the second sawing step claim 2 , the feature is used as an alignment mark.4. The method of claim 1 , wherein a kerf of the second sawing step overlaps a center portion of the trench claim 1 , and wherein a width of the kerf is smaller than a width of the trench.5. The method of claim 1 , wherein a portion of the trench overlaps a scribe line between a first chip and a second chip in the wafer.6. The method of claim 5 , wherein the trench further overlaps a portion of a first seal ring in the first chip and a portion of a second seal ring in the second chip.7. The method of claim 1 , wherein sidewalls of the trench are tilted claim 1 , and wherein a bottom of the trench is substantially flat.8. A method comprising:forming a Post-Passivation Interconnect (PPI) over a substrate of a wafer;forming an electrical connector over and electrically coupled to the PPI;molding a polymer layer ...

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Номер записи: 111
26-12-2013 дата публикации

CARD READING APPARATUS FOR USE WITH PERSONAL HANDHELD DEVICE

Номер: US20130343575A1
Автор: LU Wen-Chi
Принадлежит:

A card reading apparatus for use with a personal handheld device is provided, wherein the personal handheld device has an audio socket for connecting with earphones or other corresponding devices. The card reading apparatus includes: a battery unit; a voltage stabilizer unit; a microcontrol unit; a contact terminal module; a digital-to-analog converter electrically connected to the microcontrol unit; an audio plug electrically connected to the digital-to-analog converter and removably connectable with the audio socket of the personal handheld device; and a mobile application program (APP) stored in a recording medium so as to be installed in the personal handheld device, wherein the mobile application program can interpret the data transmitted from the microcontrol unit through the digital-to-analog converter and the audio plug. 1. A card reading apparatus for use with a personal handheld device , wherein the personal handheld device has an audio socket for connecting with earphones or other corresponding devices , the card reading apparatus comprising:a battery unit;a voltage stabilizer unit electrically connected to the battery unit;a microcontrol unit electrically connected to the voltage stabilizer unit;a contact terminal module electrically connected to the microcontrol unit and configured for connecting with contacts of a card and thereby reading data from the card;a digital-to-analog converter electrically connected to the microcontrol unit;an audio plug electrically connected to the digital-to-analog converter and removably connectable with the audio socket of the personal handheld device; anda mobile application program (APP) stored in a recording medium so as to be installed in the personal handheld device, wherein the mobile application program can interpret data transmitted from the microcontrol unit through the digital-to-analog converter and the audio plug.2. The card reading apparatus of claim 1 , further comprising a housing for housing the battery ...

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Номер записи: 112
26-12-2013 дата публикации

SYSTEM OF GENERATING SCRAMBLE DATA AND METHOD OF GENERATING SCRAMBLE DATA

Номер: US20130346679A1
Автор: LU WEN-MIN
Принадлежит: ETRON TECHNOLOGY, INC.

A system of generating scramble data includes a linear feedback shift register and a scramble engine. The linear feedback shift register is used for generating a plurality of first scramble values according to an initial value. The scramble engine is coupled to the linear feedback shift register for utilizing at least one bit of a first scramble value of the plurality of first scramble values to execute a first logic operation on other bits of the first scramble value to generate a second scramble value corresponding to the first scramble value. A bit number of the second scramble value is the same as a bit number of the first scramble value. 1. A system of generating scramble data , the system comprising:a linear feedback shift register (LFSR) for generating a plurality of first scramble values according to an initial value; anda scramble engine coupled to the linear feedback shift register for utilizing at least one bit of a first scramble value of the plurality of first scramble values to execute a first logic operation on other bits of the first scramble value to generate a second scramble value corresponding to the first scramble value, wherein a bit number of the second scramble value is the same as a bit number of the first scramble value.2. The system of claim 1 , further comprising:a logic gate coupled to the scramble engine for executing a second logic operation on the second scramble value and a datum from a host to generate and output a scramble datum corresponding to the datum to a NAND flash, wherein a bit number of the datum, the bit number of the second scramble value, and a bit number of the scramble datum are the same.3. The system of claim 2 , wherein the logic gate is an exclusive OR gate claim 2 , and the second logic operation is an exclusive OR logic operation.4. The system of claim 1 , wherein the scramble engine utilizes a first bit of the first scramble value to execute the first logic operation on other bits of the first scramble value to ...

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Номер записи: 113
09-01-2014 дата публикации

MOUNTING APPARATUS FOR FAN MODULE

Номер: US20140008513A1
Автор: LI ZHAN-YANG, LU WEN-HU
Принадлежит:

A mounting apparatus includes a cage, a cover, a mounting member, an operation member, and a resilient member. The cage is adapted to mount the fan module and defines a cutout. The cover is secured to the cage. The mounting member is secured between the cage and the cover. The operation member is slidably mounted to the mounting member and received in the cutout. The resilient member is secured between the operation member and the mounting member. The operation member is slidable between a locked and an unlocked position relative to the cage. When the operation member is in the locked position, the hook extends out of the cutout and is adapted to engage in a latching slot of a chassis. When the operation member is in the unlocked position, the hook is slid back and received in the cutout and is disengaged from the latching slot. 1. A mounting apparatus for a fan module , the mounting apparatus comprising:a cage for mounting the fan module and defining a cutout;a cover secured to the cage;a mounting member secured between the cage and the cover;an operation member slidably mounted to the mounting member and received in the cutout, and the operation member comprising a hook; anda resilient member secured between the operation member and the mounting member;wherein the operation member is slidable between a locked position and an unlocked position relative to the cage; when the operation member is in the locked position, the hook extends out of the cutout; when the operation member is in the unlocked position, the hook is slid back and received in the cutout.2. The mounting apparatus of claim 1 , wherein the mounting member comprises a receiving portion and two mounting portions located on two opposite ends of the receiving portion claim 1 , the two mounting portions are secured to the cover and the cage claim 1 , and the operation member is received in the receiving portion.3. The mounting apparatus of claim 2 , wherein the receiving portion comprises two first ...

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Номер записи: 114
09-01-2014 дата публикации

Multi-Gate FETs and Methods for Forming the Same

Номер: US20140008734A1
Автор: Lu Wen-Tai
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method includes oxidizing a semiconductor fin to form an oxide layer on opposite sidewalls of the semiconductor fin. The semiconductor fin is over a top surface of an isolation region. After the oxidizing, a tilt implantation is performed to implant an impurity into the semiconductor fin. The oxide layer is removed after the tilt implantation. 1. A method comprising:oxidizing a semiconductor fin to form an oxide layer on opposite sidewalls of the semiconductor fin, wherein the semiconductor fin is over a top surface of an isolation region;after the oxidizing, performing a tilt implantation to implant an impurity into the semiconductor fin; andafter the step of tilt implantation, removing the oxide layer.2. The method of further comprising:forming a gate dielectric on the opposite sidewalls of the semiconductor fin;forming a gate electrode over the gate dielectric; andforming a source/drain region adjacent to the gate dielectric and the gate electrode.3. The method of claim 2 , wherein the impurity has a conductivity type opposite to a conductivity type of the source/drain region.4. The method of claim 1 , wherein the tilt implantation is performed with a tilt angle between about 20 degrees and about 45 degrees.5. The method of claim 1 , wherein during the tilt implantation claim 1 , portions of the impurity penetrate through the semiconductor fin.6. The method of claim 5 , wherein during the tilt implantation claim 5 , portions of the impurity penetrate through portions of the oxide layer on the opposite sidewalls of the semiconductor fin.7. The method of claim 1 , wherein the isolation region comprises:a first portion having a slant top surface, wherein portions of the slant top surface closer to the semiconductor fin are higher than portions of the slant top surface farther away from the semiconductor fin, and wherein a doped semiconductor region level with the first portion has a first impurity concentration of the impurity than a second impurity concentration ...

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Номер записи: 115
23-01-2014 дата публикации

HANDLING APPARATUS FOR MOTHERBOARD

Номер: US20140020243A1
Автор: LU WEN-HU
Принадлежит:

A handing apparatus includes a handle, a tray configured to be secured to a motherboard, and a connecting rod. The connecting rod includes a clamping portion engaged with the tray. A first end of the connecting rod is rotatably secured to the handle by a first shaft, and a second end of the connecting rod is rotatably secured to the tray by a second shaft. The handle is rotatable about the first shaft relative to the connecting rod to disengage the clamping portion from the tray, so that the connecting rod is rotatable about the second shaft relative to the tray. 1. A handling apparatus comprising:a handle defining a sliding slot;a tray configured to be secured to a motherboard; anda connecting rod comprising a clamping portion and a sliding portion slidably received in the sliding slot; a first end of the connecting rod being rotatably secured to the handle by a first shaft; and a second end of the connecting rod being rotatably secured to the tray by a second shaft;wherein the handle is rotatable about the first shaft relative to the connecting rod, and the connecting rod is rotatable about the second shaft relative to the tray, so that the handle is located in a first position and a second position; in the first position, the clamping portion is engaged with the tray, and the sliding portion is located in a first end of the sliding slot; in the second position, the clamping portion is disengaged from the tray, and the sliding portion is located in a second end of the sliding slot.2. The handling apparatus of claim 1 , wherein the sliding slot is substantially arcuate.3. The handling apparatus of claim 1 , wherein the handle defines a securing hole claim 1 , the connecting rod comprises a positioning portion claim 1 , the positioning portion is engaged in the securing hole when the handle is located in the first position claim 1 , and the positioning portion is removed from the securing hole when the handle is located in the second position.4. The handling ...

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Номер записи: 116
30-01-2014 дата публикации

ELECTRONIC DEVICE WITH BLOCKING MECHANISM

Номер: US20140029214A1
Автор: LU WEN-HU
Принадлежит:

A blocking mechanism includes a chassis, a blocking member, and a resilient member. The chassis is configured to secure a circuit board, the chassis comprising a locking structure. The blocking member is configured to abut the circuit board, for preventing the circuit board from sliding towards the blocking member. The blocking member includes a positioning structure slidably engaged with the locking structure. The resilient member is secured to the blocking member and engaged with the locking structure for preventing the blocking member from sliding relative to the locking structure. The resilient member is resiliently deformable. When the resilient member is disengaged from the locking structure, the blocking member is slidable relative to the chassis to disengage the locking structure from the positioning structure. 1. A blocking mechanism comprising:a chassis configured to secure a circuit board, the chassis comprising a locking structure;a blocking member configured to abut the circuit board for preventing the circuit board from sliding towards the blocking member, the blocking member comprising a positioning structure slidably engaged with the locking structure; anda resilient member secured to the blocking member, the resilient member being engaged with the locking structure for preventing the blocking member from sliding relative to the locking structure;wherein the resilient member is resiliently deformable; when the resilient member is disengaged from the locking structure, the blocking member is slidable relative to the chassis to disengage the locking structure from the positioning structure.2. The blocking mechanism of claim 1 , wherein the resilient member comprises a mounting portion claim 1 , a resilient piece claim 1 , and a pressing portion claim 1 , and the resilient piece and the pressing portion extend from the mounting portion; the resilient piece is secured to the blocking member; and the pressing portion is configured to resiliently deform ...

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Номер записи: 117
27-02-2014 дата публикации

LADDER BALANCE ADJUSTING APPARATUS

Номер: US20140054111A1
Автор: LU WEN-HUA
Принадлежит:

A ladder balance adjusting apparatus installed on an n-shaped ladder leg includes an assembly, a base cover, a fixing element, a base cup, a stand rod, and a control element. The assembly has a first component and a second component, and the second component has a side and a bottom to form an L-shaped structure, and after the ladder leg is installed between the two components, the ladder leg is locked by a plurality of locking elements. The base cover is coupled to the assembly and the base cup, and the fixing element is built in the base cover, and the stand rod is provided for passing the aforementioned elements to support the ladder leg, and the control element is provided for controlling the fixing element to adjust the height of the ladder leg, and to simplify the manufacturing process of components, the installation and disassembly of the apparatus. 1. A ladder balance adjusting apparatus , applied and installed to an n-shaped ladder leg of a foldable ladder , for supporting and adjusting the height of the ladder leg to securely install the foldable ladder , comprising: an assembly , a base cover , a fixing element , a base cup , a stand rod , a foot disc and a control element , and the stand rod being a circular rod with a plurality of first threads formed on a surface of the stand rod and a connection portion of a sphere disposed at an end of the stand rod and embedded into the foot disc in a circular shape , and the base cup , the fixing element , the base cover and the assembly being installed at the other end of the stand rod; and the base cover being a tapered hollow cone fixed to the assembly and having a containing chamber formed therein for receiving the fixing element; the base cup being covered by the base cover and the fixing element being sealed into the containing chamber; the control element having a gasket , a pair of first springs , a pull rod and a pull string , and the pull string being coupled to the pull rod , and the pull rod being ...

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Номер записи: 118
27-02-2014 дата публикации

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер: US20140054764A1
Автор: Cheng Ming-Da, Liu Chung-Shi, Lu Wen-Hsiung, Tsai Yu-Peng, TU Chia-Wei, Wu Yi-Wen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region. 1. A semiconductor package , comprising:a semiconductor substrate;a contact pad overlying the semiconductor substrate;an interconnect layer overlying the contact pad;a passivation layer formed between the contact pad and the interconnect layer;a bump overlying the interconnect layer; anda protection layer having a top surface and overlying the interconnect layer and the passivation layer and covering a lower portion of the bump;wherein the protection layer comprises a curved surface region.2. The semiconductor package of claim 1 , further comprising a polymer layer between the passivation layer and the interconnect layer.3. The semiconductor package of claim 1 , further comprising a polymer layer between the protection layer and the interconnect layer.4. The semiconductor package of claim 1 , further comprising a metallization layer between the bump and the interconnect layer.5. The semiconductor package of claim 1 , further comprising a dielectric layer between the semiconductor substrate and the contact pad.6. The semiconductor package of claim 1 , wherein the bump is positioned directly over the contact pad.7. The semiconductor package of claim 1 , wherein the top surface of the protection layer comprises a lowest point and a highest point claim 1 , and an angle between a horizontal line and an inclined line formed between the lowest point and the highest point is between about 10 degrees and about 50 degrees.8. The semiconductor package of claim 1 , wherein the top surface of the protection layer comprises a ...

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Номер записи: 119
27-02-2014 дата публикации

NAVIGATION DEVICE AND CONTROL METHOD THEREOF

Номер: US20140058670A1
Автор: LU WEN-MIN
Принадлежит:

This invention discloses a navigation device and a control method. The navigation device includes input modules, display modules and a processing module. The input modules receive drag signals inputted by a user. The display modules include a primary display screen and at least one secondary display screen, and the primary display screen displays map information or a point of interest, and the at least one secondary display screen is pivotally coupled to an adjacent side of the primary display screen and superimposed onto the primary display screen. The processing module receives the drag signal and analyzes the map information, the point of interest or both according to the drag signal to obtain a regional map, point-of-interest information or a local path planning, and controls the at least one secondary display screen to display the regional map, the point-of-interest information or the local path planning according to the drag signal. 1. A navigation device , comprising:a plurality of input modules, receiving a drag signal inputted by a user;a plurality of display modules, comprising a primary display screen and at least one secondary display screen, and the primary display screen displaying map information or a point of interest, and the at least one secondary display screen being pivotally coupled to an adjacent side of the primary display screen and superimposed onto the primary display screen; anda processing module, receiving the drag signal, and analyzing the map information, the point of interest or both according to the drag signal to obtain a regional map, point-of-interest information or a local path planning, and controlling the at least one secondary display screen to display the regional map, the point-of-interest information or the local path planning according to the drag signal.2. The navigation device of claim 1 , further comprising a navigation mode claim 1 , such that when the navigation device enables the navigation mode claim 1 , the ...

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Номер записи: 120
05-01-2017 дата публикации

PACKAGING DEVICE AND METHOD OF MAKING THE SAME

Номер: US20170005060A1
Автор: Cheng Ming-Da, Huang Chang-Chia, Lin Tsung-Shu, Lu Wen-Hsiung, SU Bor-Rung
Принадлежит:

The present disclosure relates to an integrated chip packaging device. In some embodiments, the packaging device has a first package component. A metal trace is arranged on a surface of the first package component. The metal trace has an undercut. A molding material fills the undercut of the metal trace and has a sloped outermost sidewall with a height that monotonically decreases from a position below a top surface of the metal trace to the surface of the first package component. A solder region is arranged over the metal trace. 1. An integrated chip packaging device , comprising:a first package component;a metal trace arranged on a surface of the first package component, wherein the metal trace comprises an undercut;a molding material that fills the undercut of the metal trace and that has a sloped outermost sidewall with a height that monotonically decreases from a position below a top surface of the metal trace to the surface of the first package component; anda solder region arranged over the metal trace.2. The device of claim 1 , wherein a top surface of the molding material is arranged between a top surface of the metal trace and the surface of the first package component.3. The device of claim 1 , further comprising:a second metal trace arranged on the surface of the first package component and comprising a second undercut, wherein the molding material fills the second undercut but does not continuously extend over the surface between the metal trace and the second metal trace.4. The device of claim 1 , wherein the solder region surrounds a top surface of the metal trace and sidewalls of the metal trace above the molding material.5. The device of claim 4 , wherein the solder region contacts the sidewalls of the metal trace above the molding material.6. The device of claim 4 , further comprising:a metal pillar arranged between the solder region and a metal pad on a surface of a second package component, wherein the second package component is disposed over ...

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Номер записи: 121
15-01-2015 дата публикации

INTERCONNECT STRUCTURE AND METHOD OF FABRICATING SAME

Номер: US20150014851A1
Автор: Ang Ai-Tee, Chen Cheng-Ting, Cheng Ming-Da, Kuo Hsuan-Ting, Liu Chung-Shi, Lu Wen-Hsiung
Принадлежит:

A structure comprises a passivation layer formed over a semiconductor substrate, a connection pad enclosed by the passivation layer, a redistribution layer formed over the passivation layer, wherein the redistribution layer is connected to the connection pad, a bump formed over the redistribution layer, wherein the bump is connected to the redistribution layer and a molding compound layer formed over the redistribution layer. The molding compound layer comprises a flat portion, wherein a bottom portion of the bump is embedded in the flat portion of the molding compound layer and a protruding portion, wherein a middle portion of the bump is surrounded by the protruding portion of the molding compound layer.

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Номер записи: 122
10-01-2019 дата публикации

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер: US20190013284A1
Автор: FANG Jen-Kuang, Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor package device includes a carrier, a first electronic component, and a conductive element on the carrier. The first electronic component is over the carrier. The conductive element is on the carrier and electrically connects the first electronic component to the carrier. The conductive element includes at least one conductive particle and a solder material covering the conductive particle, and the conductive particle includes a metal core, a barrier layer covering the metal core, and a metal layer covering the barrier layer. 1. A conductive particle , comprising:a metal core;a barrier layer surrounding the metal core;a first conductive layer surrounding the barrier layer; anda second conductive layer surrounding the first conductive layer,wherein a ratio of a sum of volumes of the metal core, the barrier layer and the first conductive layer to a volume of the second conductive layer is from about 0.1 to about 200.21. The conductive particle of claim 1 , wherein a ratio of a thickness (t) of the second conductive layer to a distance (r) between a center of the metal core and an outer surface of the first conductive layer is from about 0.04 to about 110.31. The conductive particle of claim 2 , wherein about 0.05 micrometers (μm) Подробнее

Номер записи: 123
10-01-2019 дата публикации

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер: US20190013289A1
Автор: FANG Jen-Kuang, Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor device package includes an electronic component, a first set of conductive wires electrically connected to the electronic component, and an insulation layer surrounding the first set of conductive wires. The insulation layer exposes a portion of the first set of the conductive wires. The insulation layer is devoid of a filler. 1. A semiconductor device package , comprising:an electronic component;a first set of conductive wires electrically connected to the electronic component; andan insulation layer having a top surface and surrounding the first set of conductive wires, the top surface of the insulation layer exposing a portion of the first set of the conductive wires,wherein the insulation layer is devoid of a filler.2. The semiconductor device package of claim 1 , further comprising an encapsulant encapsulating the electronic component and the insulation layer.3. The semiconductor device package of claim 1 , further comprising a first patterned conductive layer disposed over the insulation layer and including a plurality of conductive pads claim 1 , wherein the conductive pads of the first patterned conductive layer are respectively electrically connected to the exposed portion of the first set of conductive wires.4. The semiconductor device package of claim 3 , whereinthe electronic component comprises a plurality of conductive contacts electrically connected to the first set of the conductive wires; anda pitch between at least two adjacent conductive contacts of the electronic component is less than a pitch between at least two adjacent conductive pads of the first patterned conductive layer.5. The semiconductor device package of claim 1 , further comprising a second set of conductive wires disposed on the insulation layer and electrically connected to the exposed portion of the first set of the conductive wires.6. The semiconductor device package of claim 5 , further comprising an encapsulant covering the electronic component claim 5 , the ...

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Номер записи: 124
16-01-2020 дата публикации

SOFT PACKAGE WITH STRENGTHENED HOT PRESSING TRACES AND MANUFACTURING METHOD THEREOF

Номер: US20200017268A1
Автор: CHANG Lu-Wen
Принадлежит:

A soft package with strengthened hot pressing traces includes a first side wall and a second side wall formed with a folded portion along a folding line and the distal edge of the second side wall is securely adhered to that of the first side wall except of the folding line and the distal edge of the folded portion. A top wall is divided into a first portion and a second portion, wherein a distal edge of the first portion of the top wall is securely adhered to that of the folded portion and a distal edge of the second portion is securely adhered to that of a top portion of the first side wall to form a bag structure. Two strengthened pressing traces are formed on two opposite sides of the top wall. A nozzle is mounted onto the top wall and outwardly extending through the top wall. 1. A soft package with strengthened hot pressing traces , comprising:a first side wall;a second side wall having a shape and an area corresponding to that of the first side wall, wherein the second side wall is formed with a folded portion along a folding line and the distal edge of the second side wall is securely adhered to that of the first side wall except of the folding line and the distal edge of the folded portion;a top wall divided into a first portion and a second portion by the folding line, wherein a distal edge of the first portion of the top wall is securely adhered to that of the folded portion and a distal edge of the second portion is securely adhered to that of a top portion of the first side wall to form a bag structure; andtwo strengthened pressing traces formed on two opposite sides of the top wall and corresponding to two opposite outer sides of the first side wall and the second side wall; anda nozzle mounted onto the top wall and outwardly extending through the top wall, wherein the nozzle communicates with an inner periphery of the bag structure.2. The soft package with strengthened hot pressing traces as claimed in claim 1 , further comprising a bottom wall ...

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Номер записи: 125
17-01-2019 дата публикации

Packaging Devices and Methods of Manufacture Thereof

Номер: US20190019765A1
Автор: Chen Hsien-Wei, Cheng Ming-Da, Lu Wen-Hsiung, YU Tsung-Yuan
Принадлежит:

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming an interconnect wiring over a substrate, and forming conductive balls over portions of the interconnect wiring. A molding material is deposited over the conductive balls and the substrate, and a portion of the molding material is removed from over scribe line regions of the substrate. 1. A packaging device comprising:a contact pad over a circuit region of a substrate, the substrate comprising a seal ring proximate a perimeter of the circuit region;a passivation layer over the substrate and over a first portion of the contact pad;a post passivation interconnect (PPI) structure over the passivation layer, wherein the PPI structure is coupled to a second portion of the contact pad;a conductive ball coupled to the PPI structure; anda molding material around the conductive ball, over the PPI structure, and over the passivation layer, wherein the molding material comprises a first thickness directly over the seal ring and a second thickness proximate the conductive ball, the second thickness being greater than the first thickness.2. The package device of claim 1 , wherein the molding material comprises:a first upper surface directly over the seal ring;a second upper surface proximate the conductive ball; anda slanted sidewall connecting the first upper surface and the second upper surface.3. The package device of claim 1 , wherein the conductive ball extends above an uppermost surface of the molding material.4. The package device of claim 1 , wherein the first thickness is about 30 μm or less.5. The package device of claim 1 , wherein the seal ring extends from a first surface of the passivation layer distal the substrate to a second surface of the passivation layer opposing the first surface.6. The package device of claim 5 , wherein the seal ring further extends into the substrate.7. The package ...

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Номер записи: 126
21-01-2021 дата публикации

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20210020533A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor device package includes an electronic component, an encapsulation layer encapsulating the electronic component, and a passivation layer stacking with the encapsulation layer. The passivation layer has a first surface facing the encapsulation layer, a second surface opposite to the first surface, and a first sidewall connecting the first surface and the second surface. The first sidewall inclines with respect to the second surface, and a first projection width of the encapsulation layer is greater than a second projection width of the passivation layer. 1. A semiconductor device package , comprising:an electronic component;an encapsulation layer encapsulating the electronic component; anda passivation layer stacking with the encapsulation layer, wherein the passivation layer has a first surface facing the encapsulation layer, a second surface opposite to the first surface, and a first sidewall connecting the first surface and the second surface, the first sidewall inclining with respect to the second surface, wherein a first projection width of the encapsulation layer is greater than a second projection width of the passivation layer.2. The semiconductor device package of claim 1 , wherein the second surface is smaller than the first surface.3. The semiconductor device package of claim 1 , wherein the encapsulation layer has a third surface facing the passivation layer claim 1 , a fourth surface opposite to the third surface claim 1 , and a second sidewall connecting the third surface and the fourth surface.4. The semiconductor device package of claim 3 , wherein the encapsulation layer hangs over the passivation layer.5. The semiconductor device package of claim 3 , wherein a surface roughness of the second sidewall of the encapsulation layer is larger than a surface roughness of the first sidewall of the passivation layer.6. The semiconductor device package of claim 3 , wherein the third surface is larger than the fourth surface.7. The semiconductor ...

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Номер записи: 127
28-01-2016 дата публикации

METHOD OF PREPARING SELF-ALIGNED ISOLATION REGIONS BETWEEN SENSOR ELEMENTS

Номер: US20160027839A1
Автор: Fu Shih-Chi, LU Wen-Chen, TZENG Kai
Принадлежит:

A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate includes patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate. The method further includes performing a first implant to form a deep doped region between the two neighboring sensor elements, wherein a top portion of the deep doped region is below a top surface of the substrate. The method further includes performing a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with the top portion of the deep doped region. 1. A method of preparing self-aligned isolation regions between two neighboring sensor elements on a substrate , the method comprising:patterning an oxide layer to form an opening between the two neighboring sensor elements on the substrate;performing a first implant to form a deep doped region between the two neighboring sensor elements, wherein a top portion of the deep doped region is below a top surface of the substrate; andperforming a second implant to form a shallow doped region between the two neighboring sensor elements, wherein a bottom portion of the shallow doped region overlaps with the top portion of the deep doped region.2. The method of claim 1 , wherein performing the second implant comprises decreasing a size of the two neighboring sensor elements.3. The method of claim 1 , further comprising forming an etch stop layer between the substrate and the oxide layer.4. The method of claim 3 , wherein performing the first implant comprises performing the first implant through the etch stop layer.5. The method of claim 3 , wherein performing the second implant comprises performing the second implant through the etch stop layer.6. The method of claim 1 , further comprising removing the oxide layer after the second implant.7. The method of claim 1 , further comprising forming a shallow ...

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Номер записи: 128
25-01-2018 дата публикации

Integrated Circuit Packages and Methods for Forming the Same

Номер: US20180025959A1
Автор: Chen Hsien-Wei, Kuo Yian-Liang, Lu Wen-Hsiung, TSAI Tsung-Fu, TU Chia-Wei
Принадлежит:

A method includes forming an electrical connector over a substrate of a wafer, and molding a polymer layer, with at least a portion of the electrical connector molded in the polymer layer. A first sawing step is performed to form a trench in the polymer layer. After the first sawing step, a second sawing step is performed to saw the wafer into a plurality of dies. 1. A chip comprising:a substrate;a metal pad over the substrate;a passivation layer having a portion over the metal pad;a polymer layer over the passivation layer, wherein the polymer layer extends to an edge of the chip, and a first edge of the polymer layer forms a part of the edge of the chip;an electrical connector; and a first horizontal surface substantially perpendicular to the edge of the chip; and', 'a slant sidewall surface, wherein the first horizontal surface is connected to a first end of the slant sidewall surface, and the slant sidewall surface is neither perpendicular to nor parallel to the edge of the chip., 'a molding compound encircling a portion of the electrical connector, wherein a lower portion of the electrical connector is in the molding compound, and wherein the molding compound comprises a surface comprising2. The chip of further comprising a second horizontal surface substantially perpendicular to the edge of the chip claim 1 , wherein the second horizontal surface is connected to a second end of the slant sidewall surface claim 1 , and the first horizontal surface claim 1 , the slant sidewall surface claim 1 , and the second horizontal surface form a step.3. The chip of claim 1 , wherein the first horizontal surface extends to the electrical connector.4. The chip of further comprising:a plurality of dielectric layers underlying the metal pad; anda seal ring proximal edges of the chip, wherein the seal ring extends into the plurality of dielectric layers.5. The chip of claim 4 , wherein the molding compound comprises:first portions on opposite sides of electrical connector, ...

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Номер записи: 129
29-01-2015 дата публикации

MOUNTING APPARATUS FOR DATA STORAGE DEVICE

Номер: US20150029656A1
Автор: LU WEN-HU, TSAI LUNG-SHENG
Принадлежит:

A mounting apparatus for securing a data storage device includes a mounting tray, which includes a bottom wall, two sidewalls perpendicularly extending from the bottom wall, a positioning protrusion extending from the bottom wall, and a latching protrusion extending from each sidewall. The latching protrusions are configured for being received in latching holes defined in the data storage device. Each sidewall is elastically deformable. A distance between the two sidewalls is substantially equal to a width of the data storage device. An extending direction of the positioning protrusion is substantially perpendicular to an extending direction of the latching protrusion. An electronic device with the mounting apparatus is further disclosed.

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Номер записи: 130
28-01-2021 дата публикации

Packaging Devices and Methods of Manufacture Thereof

Номер: US20210028124A1
Автор: Chen Hsien-Wei, Cheng Ming-Da, Lu Wen-Hsiung, YU Tsung-Yuan
Принадлежит:

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming an interconnect wiring over a substrate, and forming conductive balls over portions of the interconnect wiring. A molding material is deposited over the conductive balls and the substrate, and a portion of the molding material is removed from over scribe line regions of the substrate. 1. A method of forming a semiconductor device , the method comprising:forming a contact pad over a circuit region of a substrate, the substrate including a seal ring around the circuit region;forming a passivation layer over the substrate and over the contact pad;forming a post passivation interconnect (PPI) structure over the passivation layer, wherein the PPI structure extends through the passivation layer and is electrically coupled to the contact pad;coupling a conductive ball to the PPI structure;depositing a molding material over the conductive ball, the PPI structure, and the passivation layer; andremoving a first portion of the molding material from over the seal ring.2. The method of claim 1 , further comprising removing a second portion of the molding material from over the conductive ball claim 1 , wherein after removing the first portion and the second portion of the molding material claim 1 , the molding material has a first thickness directly over the seal ring and has a second thickness proximate to the conductive ball claim 1 , wherein the first thickness is different from the second thickness.3. The method of claim 2 , wherein the second thickness is larger than the first thickness.4. The method of claim 2 , wherein removing the second portion of the molding material is preformed after removing the first portion of the molding material.5. The method of claim 2 , further comprising claim 2 , after removing the first portion of the molding material and before removing the second portion of the ...

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Номер записи: 131
28-01-2021 дата публикации

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер: US20210028144A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor device package includes a first substrate having a first surface, a first electrical contact disposed on the first surface of the first substrate, a second substrate having a second surface facing the first surface of the first substrate, and a second electrical contact disposed on the second surface of the second substrate. The first electrical contact has a base portion and a protrusion portion. The second electrical contact covers at least a portion of the protrusion portion of the first electrical contact. The second electrical contact has a first surface facing the first substrate and a second surface facing the second substrate. A slope of a first interface between the second electrical contact and the protrusion portion of the first electrical contact adjacent to the first surface of the second electrical contact is substantially the same as a slope of a second interface between the second electrical contact and the protrusion portion of the first electrical contact adjacent to the second surface of the second electrical contact. A method of manufacturing a semiconductor device package is also disclosed. 1. A semiconductor device package , comprising:a first substrate having a first surface;a first electrical contact disposed on the first surface of the first substrate, the first electrical contact having a base portion and a protrusion portion;a second substrate having a second surface facing the first surface of the first substrate; anda second electrical contact disposed on the second surface of the second substrate and covering at least a portion of the protrusion portion of the first electrical contact, the second electrical contact having a first surface facing the first substrate and a second surface facing the second substrate;wherein a slope of a first interface between the second electrical contact and the protrusion portion of the first electrical contact adjacent to the first surface of the second electrical contact is ...

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Номер записи: 132
01-05-2014 дата публикации

POROUS CARBON MATERIAL AND MANUFACTURING METHOD THEREOF AND SUPERCAPACITOR

Номер: US20140118884A1
Автор: Chen Tsung-Yi, Lin Hong-Ping, Lin Yu-Ming, LU Wen-Ling, PAN Ssu-Jung
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

An embodiment provides a manufacturing method for a porous carbon material including: preparing a first solution including a surfactant, a carbon source material and a solvent; pouring the first solution into a silica sol aqueous solution to form a second solution; preparing a silicate aqueous solution; pouring the silicate aqueous solution into the second solution to form a third solution and to precipitate out an intermediate, wherein the intermediate includes the surfactant, the carbon source material and a silica template; performing a heating process on the intermediate to carbonize the intermediate; and removing the silica template of the carbonized intermediate to form a porous carbon material. Another embodiment of the disclosure provides a porous carbon material. The other embodiment provides a supercapacitor. 1. A manufacturing method for a porous carbon material , comprising:preparing a first solution including a surfactant, a carbon source material, and a solvent;pouring the first solution into a silica sol aqueous solution to form a second solution;preparing a silicate aqueous solution;pouring the silicate aqueous solution into the second solution to form a third solution and to precipitate out an intermediate, wherein the intermediate comprises the surfactant, the carbon source material, and a silica template;performing a heating process on the intermediate to carbonize the intermediate; andremoving the silica template of the carbonized intermediate to form a porous carbon material.2. The manufacturing method of the porous carbon material as claimed in claim 1 , wherein the precipitating of the intermediate comprises:adjusting the pH value of the third solution, such that the third solution is weakly acidic.3. The manufacturing method of the porous carbon material as claimed in claim 2 , wherein the third solution which is weakly acidic has a pH value of about 6.4. The manufacturing method of the porous carbon material as claimed in claim 1 , wherein ...

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Номер записи: 133
17-02-2022 дата публикации

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Номер: US20220052024A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first module, a second module, a first intermediate circuit layer, a first conductive transmission path and a second conductive transmission path. The second module is stacked on the first module. The first intermediate circuit layer is arranged between the first module and the second module. The first conductive transmission is configured to electrically connect the first semiconductor module with the first intermediate circuit layer. The second conductive transmission path is configured to electrically connect the first intermediate circuit layer with the second semiconductor module. 1. A semiconductor device package , comprising:a first semiconductor module;a second semiconductor module stacked on the first semiconductor module;a first intermediate circuit layer arranged between the first semiconductor module and the second semiconductor module;a first conductive transmission path configured to electrically connect the first semiconductor module with the first intermediate circuit layer; anda second conductive transmission path configured to electrically connect the first intermediate circuit layer with the second semiconductor module.2. The semiconductor device package of claim 1 , wherein no electronic component is mounted on the first intermediate circuit layer.3. The semiconductor device package of claim 1 , wherein the first intermediate circuit layer comprises a dielectric layer and an interconnection layer claim 1 , and wherein the first conductive transmission path comprises a through via penetrating the dielectric layer of the first intermediate circuit layer.4. The semiconductor device package of claim 2 , wherein the interconnection layer is disposed on a surface of the dielectric layer which faces the second semiconductor module.5. The semiconductor device package of claim 2 , wherein a portion of the interconnection layer is ...

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Номер записи: 134
30-01-2020 дата публикации

Automatic Transfer Switch utilizing back-to-back mounted Molded Case Circuit Breakers or Molded Case Switches to connect a load to a Normal Power Source and a Standby Power Source

Номер: US20200036222A1
Автор: Lu Wen-Feng
Принадлежит:

An automatic transfer switch (ATS) utilizing molded case circuit breakers (MCCB) or molded case switches (MCS) to connect and disconnect an electrical load to a Normal power source and a Standby power source. The ATS comprising two MCCB or MCS mounted back-to-back one connected to a Normal power source and the other to a Standby power source. Bus bars electrically connect the poles on the load side of the MCCB or MCS connecting the ATS to a load. A rotating cam drive mechanism drives Toggle Levers with attached stored energy opening springs toggles to open and close the MCCB or MCS through the leverage of fulcrum points. A ratchet mounted on the output shaft of a unidirectional gear motor rotates the cam drive mechanism. An interlock bar prevents both MCCB from closing at the same time. 1two molded case circuit breakers (MCCB) or molded case switches (MCS) mounted back-to-back to connect a load to a Normal power source and a Standby power sourcebus bars electrically connecting the poles on the load side of the MCCB or MCS connecting the ATS to a loada rotating cam drive mechanism driving Toggle Levers with attached stored energy opening springs to toggle open and closed the MCCB or MCS through the leverage of fulcrum pointsa ratchet mounted on the output shaft of a unidirectional gear motor to rotate the cam drive mechanism and declutch from motor shaft when cam drive mechanism is manually operateda fixed length non-conducting interlock bar located between movable elements of each MCS or MCCB to prohibit the opposite switch from closing at the same timea safety lock that blocks operation of cam drive by manual transfer handle and also signals the ATS controller to disconnect electric power to the gear motor. An automatic transfer switch (ATS) utilizing molded case circuit breakers (MCCB) or molded case switches (MCS) to connect and disconnect an electrical load to a Normal power source and a Standby power source, said ATS comprising: An automatic transfer switch ...

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Номер записи: 135
04-02-2021 дата публикации

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Номер: US20210035933A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor structure and a method of manufacturing the same are provided. The semiconductor structure includes a first semiconductor element and a first bonding structure. The first semiconductor element has a first element top surface and a first element bottom surface opposite to the element top surface. The first bonding structure is disposed adjacent to the element top surface of the first semiconductor element and includes a first electrical connector, a first insulation layer surrounding the first electrical connector, and a first metal layer surrounding the first insulation layer. 1. A semiconductor structure , comprising:a first semiconductor element having a first element top surface and a first element bottom surface opposite to the first element top surface; and a first electrical connector;', 'a first insulation layer surrounding the first electrical connector; and', 'a first metal layer surrounding the first insulation layer., 'a first bonding structure disposed adjacent to the first element top surface of the first semiconductor element, comprising2. The semiconductor structure of claim 1 , further comprising a first protective layer disposed adjacent to the first element top surface of the first semiconductor element claim 1 , wherein the first protective layer defines a first opening accommodating the first bonding structure.3. The semiconductor structure of claim 2 , further comprising a second insulation layer disposed on the first protective layer claim 2 , wherein the second insulation layer defines a second opening accommodating the first bonding structure.4. The semiconductor structure of claim 3 , wherein the second insulation layer has a second insulation top surface and a second insulation bottom surface and the first insulation layer has a first insulation top surface and a first insulation bottom surface claim 3 , wherein the second insulation top surface of the second insulation layer is substantially coplanar with the first ...

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Номер записи: 136
07-02-2019 дата публикации

SAFE SYRINGE

Номер: US20190038847A1
Автор: LU WEN-CHIN
Принадлежит:

The invention relates to a Safe Syringe comprising a barrel, a needle seat and a plunger, wherein the needle seat has a hook rod, a linkage deformation portion and a barrel clamping portion; and the plunger has a rod body, and a hook insertion hole which can be sleeved with the hook rod of the needle seat and compress the linkage deformation portion for elastic deformation such that the barrel clamping portion of the needle seat is not clamped into the seat clamping slot of the barrel, and the hook insertion hole can hook the hook rod of the needle seat to move the needle seat. The Safe Syringe can allow stable positioning and quick pullback of the needle seat and effectively reduce liquid medicine residue. 1. A Safe Syringe , comprising:{'b': 1', '11', '12', '13', '14, 'a barrel () having a barrel body (), an accommodating chamber (), a seat mounting hole () and a seat clamping slot ();'}{'b': 20', '21', '13', '1', '22', '24', '25', '24', '26', '25', '14', '1, 'a needle seat () having a seat body () mounted in the seat mounting hole () of the barrel (), a needle hole (), a hook rod (), a linkage deformation portion () connected to the hook rod (), and a barrel clamping portion () connected to the linkage deformation portion (), linked thereby and capable of being clamped into the seat clamping slot () of the barrel (); and'}{'b': 3', '31', '41', '24', '20', '25', '26', '20', '14', '1', '41', '24', '20', '20, 'a plunger () having a rod body (), and a hook insertion hole () which is capable of being sleeved with the hook rod () of the needle seat () and compressing the linkage deformation portion () for elastic deformation such that the barrel clamping portion () of the needle seat () is not clamped into the seat clamping slot () of the barrel (), the hook insertion hole () being capable of hooking the hook rod () of the needle seat () to move the needle seat ().'}220272225. The Safe Syringe according to claim 1 , wherein the needle seat () has a recessed chamber () ...

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Номер записи: 137
11-02-2016 дата публикации

DISPLAY PANEL AND MANUFACTURING METHOD THEREOF

Номер: US20160043350A1
Автор: CHO Chia-Te, HSIEH Huan-Hsun, HUANG Cheng-Pei, Lin Wen-Chi, LU Wen-Lung
Принадлежит:

A display panel includes a first substrate, a second substrate, a quarter wavelength phase retarder, and a linear polarizer. The first substrate has a light emitting element disposed on the first substrate. The opposite panel is disposed opposite to the first substrate. The quarter wavelength phase retarder is disposed between the first substrate and the second substrate. The linear polarize is disposed at a side of the second substrate opposite to the quarter wavelength phase retarder. 1. A display panel , comprising:a first substrate having a light emitting element disposed on said first substrate;a second substrate disposed opposite to the first substrate;a quarter wavelength phase retarder disposed between the first substrate and the second substrate; anda linear polarizer disposed at a side of the second substrate opposite to the quarter wavelength phase retarder.2. The display panel of claim 1 , wherein the quarter wavelength phase retarder is made from polymers claim 1 , and the second substrate is made from glass.3. The display panel of claim 1 , wherein the quarter wavelength phase retarder is a coating layer.4. The display panel of claim 1 , wherein a thickness of the quarter wavelength phase retarder is about 0.01 mm.5. The display panel of claim 1 , wherein the first substrate is an active-matrix organic light emitting diode substrate or a passive-matrix organic light emitting diode substrate.6. A display panel claim 1 , comprising:a first substrate having a light emitting element disposed on said first substrate;a second substrate disposed opposite to the first substrate, and the second substrate having two main surfaces opposite to each other;a quarter wavelength phase retarder integrated formed with the second substrate, and disposed on one of the main surfaces; anda linear polarizer disposed at a side of the second substrate opposite to the first substrate.7. The display panel of claim 6 , wherein the quarter wavelength phase retarder is disposed ...

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Номер записи: 138
12-02-2015 дата публикации

Packaging Methods and Structures for Semiconductor Devices

Номер: US20150044819A1
Автор: Chen Meng-Tse, Cheng Ming-Da, Huang Kuei-Wei, Jang Bor-Ping, Lii Mirng-Ji, Lin Chih-Wei, Lin Chun-Cheng, Lin Hsiu-Jen, Lin Wei-Hung, Liu Chung-Shi, Lu Wen-Hsiung, Tsai Yu-Peng, Yu Chen-Hua
Принадлежит:

Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL. 1. A method comprising:forming a redistribution layer (RDL) comprising at least one inter-level dielectric (ILD) and at least one first metallization layer formed in the at least one ILD;coupling a first integrated circuit to a first surface of the RDL, the first integrated circuit in electrical contact with first traces of the at least one first metallization layer;forming a first molding compound over the first integrated circuit and the first surface of the RDL, a first surface of the first molding compound disposed above a top surface of the first integrated circuit;forming a second metallization layer having second traces on the first surface of the first molding compound, the second traces in electrical contact with the first traces;coupling a second integrated circuit to the second traces; andforming a second molding compound over the second integrated circuit and in direct contact with a portion of the first surface of the first molding compound.2. The method of claim 1 , further comprising forming vertical connections over the RDL prior to the forming the first molding compound;wherein the forming the first molding compound comprises forming the first molding compound around the vertical connections; andwherein the forming the second metallization layer comprises forming the second traces in electrical contact with the first traces through the vertical connections.3. The method according to claim 1 , wherein the first integrated circuit comprises through vias;wherein the ...

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Номер записи: 139
25-02-2016 дата публикации

PEELING PROCESS OF SUBSTRATE

Номер: US20160052252A1
Автор: Chiang Ming-Sheng, LU Wen-Chang, LUAN Ta-Nien, Wu Chi-Ming
Принадлежит:

A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. Thereafter, the second substrate is peeled off from the first substrate. 1. A process of peeling a substrate suitable for separating a first substrate and a second substrate bonded to the first substrate , wherein the first substrate has a first bonding surface , the second substrate has a second bonding surface and a back surface opposite to the second bonding surface , the first bonding surface is bonded to the second bonding surface , the peeling process comprising:providing a fixed light source for emitting a tight beam illuminating the first bonding surface and the second bonding surface b being incident through the back surface of the second substrate at a first incident angle;maintaining the first incident angle of the fixed light source illuminating the first bonding surface and the second bonding surface constant at different positions at different times; andpeeling off the second substrate from the first substrate.2. The process of peeling a substrate according to claim 1 , wherein the light beam comprises a laser beam.3. The process of peeling a substrate according to claim 1 , wherein the step of providing a fixed light source for emitting a light beam illuminating the first bonding surface and the second bonding surface by being incident through the back surface of the second substrate at a first incident angle further comprises: ...

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Номер записи: 140
03-03-2022 дата публикации

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20220068781A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and a plurality of conductive through vias. The conductive structure includes a dielectric layer, a circuit layer in contact with the dielectric layer, a plurality of dam portions and an outer metal layer. The dam portions extend through the dielectric layer. The dam portion defines a through hole. The outer metal layer is disposed adjacent to a top surface of the dielectric layer and extends into the through hole of the dam portion. The conductive through vias are disposed in the through holes of the dam portions and electrically connecting the circuit layer.

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Номер записи: 141
23-02-2017 дата публикации

LIGHT EMITTING DEVICE

Номер: US20170051907A1
Автор: Liao Kuan-Yung, LIN JUN-YU, Lu Wen-Jie, Sun Sheng-Yuan
Принадлежит:

A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module. 1. A light emitting device , comprising: an upper cover having a plurality of first holes;', 'a lower cover being opposite to the upper cover; and', 'a plurality of side covers connected to the upper cover and the lower cover, wherein at least two chamfered surfaces are between at least two of the side covers and the upper cover, and the chamfered surfaces have a plurality of second holes; and, 'a heat dissipation casing, comprisingan LED module disposed inside the heat dissipation casing and located on the lower cover, wherein the LED module has a light emitting surface, and the light emitting surface and the first and the second holes are located on opposite sides of the LED module respectively.2. The light emitting device according to claim 1 , wherein an angle between a first normal vector of the upper cover and a second normal vector of any of the chamfered surfaces is smaller than 90 degrees.3. The light emitting device according to claim 2 , wherein the angle between the first normal vector of the upper cover and the second normal vector of any of the chamfered surfaces is smaller than 90 degrees and greater than 45 degrees.4. The light emitting device according to claim 1 , ...

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Номер записи: 142
25-02-2016 дата публикации

Directly Sawing Wafers Covered with Liquid Molding Compound

Номер: US20160056117A1
Автор: Cheng Ming-Da, Liu Chung-Shi, Lu Wen-Hsiung, Tsai Yu-Peng, TU Chia-Wei
Принадлежит:

A method includes forming a passivation layer over a metal pad, wherein the metal pad is further overlying a semiconductor substrate of a wafer. A Post-Passivation Interconnect (PPI) is formed to electrically couple to the metal pad, wherein a portion of the PPI is overlying the passivation layer. A metal bump is formed over and electrically coupled to the PPI. The method further includes applying a molding compound over the metal bump and the PPI, applying a release film over the molding compound, pressing the release film against the molding compound, and curing the molding compound when the release film is pressed against the molding compound. The release film is then removed from the molding compound. The wafer is sawed into dies using a blade, with the blade cutting through the molding compound. 1. A die comprising:a substrate;a metal pad over the substrate;a passivation layer comprising a portion over the metal pad;a polymer layer over the passivation layer;a Post-Passivation Interconnect (PPI) comprising a first portion over the polymer layer, and a second portion extending into the polymer layer, wherein the PPI is electrically coupled to the metal pad;a metal bump over and electrically coupled to a portion of the PPI; anda molding compound over the PPI, wherein the molding compound surrounds, and is in physical contact with, a lower portion of the metal bump, wherein an upper portion of the metal bump protrudes out of the molding compound, and wherein edges of the molding compound extend to respective edges of the die.2. The die of claim 1 , wherein the molding compound is in physical contact with a PPI pad of the PPI.3. The die of claim 1 , wherein the molding compound comprises a filler therein claim 1 , and particles in the filler have sizes smaller than widths of the PPI.4. The die of claim 1 , wherein the molding compound has a glass transition temperature higher than about 150° C. claim 1 , and the glass transition temperature is an inherent property ...

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Номер записи: 143
14-02-2019 дата публикации

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

Номер: US20190051590A1
Автор: FANG Jen-Kuang, Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor package device includes a circuit layer having a top surface, a first electronic component disposed on the top surface of the circuit layer, and a first conductive element disposed on the top surface of the circuit layer, the first conductive element having a top surface. The first electronic component has an active surface and a back surface facing the top surface of the circuit layer. A distance between the active surface of the first electronic component and the top surface of the circuit layer is greater than a distance between the top surface of the first conductive element and the top surface of the circuit layer. 1. A semiconductor package device , comprising:a circuit layer having a top surface;a first electronic component disposed on the top surface of the circuit layer, the first electronic component having an active surface and a back surface facing the top surface of the circuit layer;a first conductive element disposed on the top surface of the circuit layer, the first conductive element having a top surface; anda second electronic component disposed between the first electronic component and the circuit layer,wherein the second electronic component has an active surface facing the top surface of the circuit layer and a back surface facing the back surface of the first electronic component, andwherein a distance between the active surface of the first electronic component and the top surface of the circuit layer is greater than a distance between the top surface of the first conductive element and the top surface of the circuit layer.2. (canceled)3. The semiconductor package device of claim 1 , wherein a distance from the second electronic component to the first conductive element is in a range from 1.89 micrometer (μm) to 1432.2 μm.4. The semiconductor package device of claim 1 , further comprising a package body encapsulating the first electronic component and the first conductive element claim 1 , wherein the package body defines a ...

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Номер записи: 144
25-02-2021 дата публикации

SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS

Номер: US20210057356A1
Автор: Lu Wen-Long
Принадлежит: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm. 1. A semiconductor package device , comprising:a wiring structure including a first insulation layer, a circuit layer in contact with the first insulation layer, and a second insulation layer disposed on the first insulation layer and covering the circuit layer;a semiconductor chip electrically connected to the wiring structure; andan encapsulant disposed on the wiring structure and covering the semiconductor chip, wherein a roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.2. (canceled)3. The semiconductor package device of claim 1 , further comprising a hydrophobic layer disposed on a bottom surface of the second insulation layer.4. The semiconductor package device of claim 3 , wherein a roughness (Ra) of a bottom surface of the hydrophobic layer is less than a roughness (Ra) of the bottom surface of the second insulation layer.5. The semiconductor package device of claim 1 , further comprising a hydrophobic layer disposed on a bottom surface of the wiring structure.6. The semiconductor package device of claim 5 , wherein a water contact angle of the hydrophobic layer is about 150° to about 180°.7. The semiconductor package device of claim 5 , wherein the hydrophobic layer is further disposed on a lateral surface of the wiring structure.8. The semiconductor package device of claim 7 , wherein the hydrophobic layer is further disposed on a top surface of the wiring structure.9. The semiconductor package device of claim 3 , wherein the wiring structure includes an under bump metallization disposed adjacent to a bottom surface thereof claim 3 , and the hydrophobic layer covers at least a portion of the ...

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Номер записи: 145