Kratzfeste Beschichtung für Halbleiterbauelemente

The aim of the invention is to increase the scratchproofness of a surface passivation, especially for fingerprint sensors. To this end, a sliding layer made of fat, oil, surfactants and/or wax is applied. Said layer reduces shearing forces. In a preferred embodiment, an emulsion made of water, paraffin oil, propyl glycol, lactarimic acid, cetylic acid, TEA, beeswax, carbomer 954, methylparaben, propylparaben and optionally perfume is used.

Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen

Sensoreinrichtung zur Erfassung von biometrischen Merkmalen, insbesondere Fingerminutien, mit einem biometrischen Sensorchip (1) und einem Flexleiterband (8), auf dem mit dem Sensorchip (1) in elektrischem Kontakt stehende Leiterbahnen (7) aufgebracht sind, dadurch gekennzeichnet, daß auf dem Flexleiterband (8) elektronische Bauelemente (12, 14) montiert und mit den Leiterbahnen (7) elektrisch verbunden sind.

SENSOR FACILITY FOR THE COLLECTION OF BIOMETRIC CHARACTERISTICS, IN PARTICULAR FINGERMINUTIEN

SCRATCH-PROOF COATING FOR SEMICONDUCTOR COMPONENTS

BIOMETRIC SENSOR AND PROCEDURE FOR ITS PRODUCTION

HOUSING FOR BIOMETRIC SENSOR CHIPS

ELECTRONIC ELEMENT AND USE OF A IN IT ABSTENTION PROTECTION STRUCTURE

Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen

The invention relates to a sensor device for detecting biometric characteristics, especially finger prints, wherein electronic components (12, 14) are disposed on the flexible conductor strip (8) where they are electrically connected to the strip conductors (7).

BIOMETRIC SENSOR AND CORRESPONDING PRODUCTION METHOD

The invention relates to a biometric sensor and to a corresponding production method, wherein a sensor chip (2) with terminal contacts (5) in the form of electrically conductive bumps (9) is provided. The sensor chip (2) is inserted into a chip housing (1), wherein the bumps (9) contact the corresponding connecting leads (5) of the chip housing (1). While contacting is performed, the sensor chip (2) is simultaneously glued in the chip housing (1) using an adhesive layer (10) that surrounds and seals off the sensor field (8). © KIPO & WIPO 2007 ...

Elektronisches Bauelement und Verwendung einer darin enthaltenen Schutzstruktur

The invention relates to an electronic component, comprising a dielectric layer (2) which is configured on a substrate (10), conductive surfaces (4; 14) which are configured on said dielectric layer and an electroconductive protective structure (6) which is arranged in a plane above the conductive surfaces (6) in such a way that the conductive surfaces (4; 14) are not (entirely) covered by the protective structure (6).

Scratch-resistant coating for a semiconductor component

To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

Housing assembly for an electronic component

METHOD OF CUTTING AN OPTICAL FIBRE IN TWO, AND A METHOD OF PRODUCING AN END PIECE ON AN OPTICAL FIBRE

FILE, THIS AMENDED TRANSLATION 11 For the cutting of an optical fiber (2), it is known to scratch a fiber (2) which is stabilized under tensile stress against evasive movements on its circumference so that the microdiscontinuity formed in this way propagates diametrically, forming a cut surface. In this connection there is the danger of an undesired propagation of the crack or discontinuity in the axial direction of the fiber (2). In accordance with the invention, the cut surface is produced by a particle beam (21) which is directed against the fiber (2).

Housing for biometric sensor chips

Electronic component and utilization of a guard structure contained therein

An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

Housing assembly for an electronic device and method of packaging an electronic device

A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

Biometrische Sensoreinrichtung mit formschlüssiger Zugentlastungseinrichtung zwischen Flexleiterband und Chipgehäuse

The invention relates to a sensor device for detecting biometric characteristics, especially fingerprint minutiae. According to the invention, a positive engaging load compensation device is provided between a flexible conductor strip (8) and a chip housing (3).

ELEKTRONISCHES BAUELEMENT UND VERWENDUNG EINER DARIN ENTHALTENEN SCHUTZSTRUKTUR

BIOMETRISCHER SENSOR UND VERFAHREN ZU DESSEN HERSTELLUNG

Sensoreinrichtung zur Erfassung von biometrischen Merkmalen

VERFAHREN ZUM TRENNEN EINER OPTISCHEN WELLENLEITERFASER UND VERFAHREN ZUM HERSTELLEN EINES ENDSTÜCKES EINER OPTISCHEN WELLENLEITERFASER

HOUSING ASSEMBLY FOR AN ELECTRONIC COMPONENT

The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect. © KIPO & WIPO 2007 ...

SENSOREINRICHTUNG ZUR ERFASSUNG VON BIOMETRISCHEN MERKMALEN, INSBESONDERE FINGERMINUTIEN

Microscope for use in cleanroom during semiconductor manufacture

A microscope for use by personnel operating in the specialised environment of a cleanroom during semiconductor manufacture is equipped with the means of warming the eyepiece assembly (O) in order to prevent the natural exhalation of the user from misting-up the external surface (S) of the upper lens. A heating coil (A,L,M) is incorporated within the cylinder which forms the eyepiece housing and this may be single or multi-turn (H) as shown in the diagnosis or may comprise a sprayed-on resistive track distributed such as to minimise interference with the optical efficiency of the system and which is energised from a source (V) at the points (conn).

Gehäuse für biometrische Sensorchips

Authentisierungsmedium

According to the invention, a biometric sensor, e.g. a fingerprint sensor FiTiKey, is combined with a standardized medium. The standard of the MultiMediaCard<3> (1) with the corresponding reading devices and with the standardized slots is a preferred embodiment, which consists of the combination of this existing standard for storage applications (MultiMediaCard<3> with the corresponding system peripheral equipment) with the personal, mobile authentication and/or identification key FiTiKey (2) and, optionally, with additional chips (3).

Casing for biometric sensor, for detecting finger prints

The casing has a finger guide aid in the form of a recess (3). The recess is adapted to fit the front part of a finger and has a front stop for the finger tip. The recess (3) preferably has side walls (6) and a front wall (7), to form a U-shaped stop. Preferably, at least part of the surface of the recess is formed as an earth contact surface (10). Preferably at least part of the recess is translucent and has a back light to light up the recess.

Gehäuse für biometrische Sensorchips

Kontaktlose Chipkarte

This invention concerns a contactless chip card containing besides a chip module (2) an induction coil (3) for data transmission. A lead frame (1) serves as the electrical connection for these two components. In contrast to solutions in prior art, the contact between the lead frame (1) and induction coil (3) is much simpler. In the area of the coil pads (7), apertures (5) are made through the coil pads (7) and substrate film (8) through which the lead frame contacts (4) pass and are soldered on the upper surface.

Halbleiterbauelement mit kratzfester Beschichtung

Gehäusebaugruppe für ein elektronisches Bauteil

Semiconductor element separation and positioning method

The semiconductor element separation and positioning method uses a carrier foil (5) to which a number of semiconductor elements (S) are temporarily attached, positioned to bring at least one component (13) into alignment with a component carrier (14). The component is then separated from the foil by a die stamp (18) acting against the rear side of the latter. The components may be secured to the carrier foil by an adhesive layer (23)with its adhesion characteristics reduced upon application of energy via the die stamp, for removal of the positioned component.

Gehäusebaugruppe für ein elektronisches Bauteil

The invention relates to a housing assembly for an electronic component (1) and to a method for packaging an electronic component, said housing assembly being provided with at least one electronic component (2) to the packaged, an outer support (3) and a housing frame (4). An epoxide resin that has a capillary effect is filled into the assembled housing assembly via a feed opening (7) and closes the cavities between the semiconductor chip and the housing frame by virtue of said capillary effect.

Biometrical sensor for fingerprint identification for mobile phone

The sensor chip (2) has connection contacts in the form of electrical conductive bumps (9). The bumps contact connective conductors (5) of the chip housing (1) which are arranged in or on the chip housing. An adhesive layer (10) is located between the scratch proof covering (12) of the upper side of the chip and the chip housing , around the sensor field (8). The thickness of the layer is matched to the height of the bumps so that a rigid connection is created between the sensor chip and the chip housing. In addition to the bumps, a further support bump on the upper side of the sensor chip, is located to prevent tipping of the chip relative to the housing.

KRATZFESTE BESCHICHTUNG FÜR HALBLEITERBAUELEMENTE

SENSOR DEVICE FOR DETECTING BIOMETRIC CHARACTERISTICS, ESPECIALLY FINGERPRINT MINUTIAE

The invention relates to a sensor device for detecting biometric characteristics, especially fingerprint minutiae, using a biometric sensor chip (3), wherein the sensor chip (3) is fixed to a flexible printed board (2) consisting of a highly flexible substrate (5) and conductors (6, 6') placed on the substrate (5), which are in electrical contact with the sensor chip (3) and are guided towards a connecting area (7) of the flexible printed board (2). © KIPO & WIPO 2007 ...

Biometric sensor and method for its production

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Sensor device for sensing biometric characteristics, in particular finger minutiae

The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Housing for biometric sensor chips and method for producing the housing

A housing for biometric sensor chips and a method for producing such a housing includes a freely accessible fingerprint checking area on a sensor chip, a mount substrate with contact outer surfaces thereon, the mount substrate being a mounting strip with perforated edges, on which the contact outer surfaces are disposed partially outside a housing frame, and the sensor chip is positioned within the housing frame.

Method of producing a biometric sensor

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Method of cutting an optical fibre in two, and a method of producing an end-piece on an optical fibre

A prior art method of cutting optical fibres (2) calls for the fibre (2) to be held firmly to prevent it from yielding, placed under tension and a scratch made on its surface. The microdiscontinuity thus produced propagates diametrically across the fibre to form a parting plane. There is a danger, however, that undesirable cracks or discontinuities spread out in the longitudinal direction in the fibre (2). The invention calls for the parting plane to be produced by a particle beam (21) aimed at the fibre (2).

Biometric sensor and process for producing it

Patente de Invenção: <B>"SENSOR BIOMéTRICO E PROCESSO PARA PRODUçãO DO MESMO"<D>. Em um sensor biométrico e em um processo para produção do mesmo, está previsto um sensor de chip (2) com contatos de ligação (5), na forma de ressaltos (9) eletricamente condutores. O chip de sensor (2) é inserido em uma carcaça de chip (1), sendo que os ressaltos (9) fazem contato com linhas de ligação (5) correspondentes da carcaça de chip (1). Simultaneamente a esse contato, ocorre uma união adesiva do chip de sensor (2) na carcaça de chip (1) por meio de uma camada adesiva (10), que envolve de modo hermético o campo de sensor (8).

Method of producing a biometric sensor

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Scratch-resistant coating for a semiconductor component

To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

Method of cutting an optical fibre in two, and a method of producing an end-piece on an optical fibre.

Pour sectionner une fibre optique (2), il est connu d'entamer extérieurement sous contrainte une fibre (2) après l'avoir bloquée pour lui interdire tout mouvement, de telle sorte que la microfissure ainsi formée se propage diamétralement et donne lieu à un sectionnement. Cependant, il y a alors un risque de propagation non désirée de la rupture ou fissure dans le sens axial de la fibre (2). Selon l'invention, le sectionnement est provoqué par un faisceau de particules (21) dirigé sur la fibre (2). To cut an optical fiber (2), it is known to cut a fiber (2) externally under stress after having blocked it to prevent it from moving, so that the microcrack thus formed spreads diametrically and gives rise to a sectioning. However, there is then a risk of unwanted propagation of the break or crack in the axial direction of the fiber (2). According to the invention, the sectioning is caused by a beam of particles (21) directed onto the fiber (2).

Biometric sensor and method for its production

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

BIOMETRIC SENSOR AND PROCEDURE FOR MANUFACTURING.

Sensor biométrico con un chip sensor (2) y una carcasa (1), en la que está montado el chip sensor (2), caracterizado por las siguientes características: - el chip sensor (2) presenta contactos de conexión en forma de resaltos (9) conductores de electricidad, - sobre la superficie del chip sensor (2) se encuentra una cubierta de protección (12) contra arañazos, - los resaltos (9) contactan con líneas de conexión (5) de la carcasa (1) del chip, que están previstas en o en la proximidad de la carcasa (1) del chip, - entre la cubierta de protección (12) contra arañazos y la carcasa (1) del chip se encuentra al menos alrededor del campo del sensor (8) una capa adhesiva (10), cuyo espesor está adaptado a la altura de los resaltos (9), de tal forma que se crea una conexión hermética entre el chip sensor (2) y la carcasa (1) del chip.

Semiconductor component with edges coated for separation from wafer

The component is of crystalline material bounded by upper and lower main surfaces (2) with separation edges (40), along which a coating of e.g. aluminium is sputtered with a breadth (d) of 20 to 50 mu m. The coating extends to a greater width (D) over the tracks (4) of the grinding disc or saw. It exerts a compressive stress on the underlying semiconductor, in opposition to the tensile stress imparted by the process of separation.

SENSOR DEVICE FOR THE DETECTION OF BIOMETRIC CHARACTERISTICS, ESPECIALLY DACTILAR FOOTPRINTS.

The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Elektronisches bauelement und verwendung einer darin enthaltenen schutzstruktur

Kratzfeste beschichtung für halbleiterbauelemente

Biometrischer sensor und verfahren zu dessen herstellung

Sensoreinrichtung zur erfassung von biometrischen merkmalen, insbesondere fingerminutien

Gehäuse für biometrische sensorchips