СПОСОБ ПОДДЕРЖАНИЯ ЗАДАННОГО РАССТОЯНИЯ МЕЖДУ СОПЛОМ И ОБРАБАТЫВАЕМОЙ ПОВЕРХНОСТЬЮ ПРИ ЛАЗЕРНОЙ ОБРАБОТКЕ МАТЕРИАЛОВ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

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Изобретение относится к новому лазерному станку для распиливания алмазов. Техническим результатом является повышение качества и скорости распиливания алмазов. Для этого станок состоит из источника лазерного излучения, интерфейса центрального навигационного вычислительного устройства (числового программного управления CNC), системы подачи луча, переключающего высокочастотного драйвера модулятора добротности лазера, блока для охлаждения, камеры замкнутой телевизионной системы и прибора с зарядной связью (CCTV & CCD), блока подачи энергии, серво-стабилизатора и блока компьютера. 20 з.п. ф-лы, 9 ил.

КООРДИНАТНОЕ УСТРОЙСТВО

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Способ и устройство для концевого закругления щетинок

Группа изобретений относится к способу и устройству для концевого закругления щетинок секции зубной щетки, содержащей множество щетинок. Способ включает обеспечение сфокусированного лазерного луча, распространяющегося вдоль геометрического основного направления распространения и имеющего основную точку облучения, обеспечение относительного перемещения между концом каждой щетинки и основной точкой облучения сфокусированного лазерного луча таким образом, чтобы конец каждой щетинки перемещался через основную точку облучения на траектории, имеющей основной компонент, поперечный к продольной протяженности щетинки. Сфокусированный лазерный луч направлен так, что геометрическое основное направление распространения имеет основной компонент, поперечный к продольной протяженности соответствующей щетинки, конец которой расположен в основной точке облучения. Закругление конца обеспечивается сфокусированным лазерным лучом, нагревающим конец и заставляющим его частично плавиться и образовывать закругленный ...

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Изобретение относится к установке для лазерной обработки внутренней поверхности изделия. Оптическая система установки содержит размещенные в стойке и штанге зеркала, линзу, отклоняющий элемент и защитное стекло, установленные на выходной части штанги в головке. Головка состоит из корпуса со светоизлучающими элементами и составного сопла. Составное сопло содержит корпусную часть со светонаправляющими отверстиями, оси которых направлены в зону обработки, и коаксиально размещенную в ней втулку с внутренней поверхностью, образующую сопло для подачи потока в зону обработки. В корпусной части и втулке и размещены газораспределительные отверстия, выполненные в виде цилиндрических каналов, оси которых направлены под углом в сторону защитного стекла, в зону прохождения через него светового и лазерного излучения. Установка также содержит распределительную камеру, связанную с газораспределительными отверстиями и штуцером подачи технологического газа. Внутренняя поверхность корпусной части и наружная ...

УСТАНОВКА ДЛЯ ЛАЗЕРНО-УЛЬТРАЗВУКОВОЙ ОБРАБОТКИ ПОВЕРХНОСТИ МЕТАЛЛОВ

... 1. Установка для лазерно-ультразвуковой обработки поверхности металлов, включающая лазерный излучатель, ультразвуковой излучатель с волноводом и станину, отличающаяся тем, что лазерный излучатель снабжен оптико-волоконным световодом, который установлен рабочим концом перпендикулярно обрабатываемой поверхности, а волновод установлен под углом 45° к обрабатываемой поверхности и соединен с ультразвуковым излучателем через магнитострикционный преобразователь, при этом в волноводе выполнено отверстие, через которое пропущен световод таким образом, что их оси сходятся на обрабатываемой поверхности. ! 2. Установка по п.1, отличающаяся тем, что волновод выполнен продольно-крутильным, а диаметр отверстия для световода равен 3÷8 мм.

УСТАНОВКА ДЛЯ ТЕРМИЧЕСКОЙ РЕЗКИ

... 1. Установка для термической резки, содержащая стол для заготовки, портал, установленный с возможностью перемещения вдоль стола, каретку, установленную на портале с возможностью перемещения по порталу, плазменный резак, установленный на каретке, приводы портала и каретки, систему управления установкой, подключенную к плазменному резаку и приводам портала и каретки, отличающаяся тем, что она снабжена фокусирующим объективом, установленным на каретке, и лазером, подключенным к системе управления установкой и связанным оптически с фокусирующим объективом. ! 2. Установка по п.1, отличающаяся тем, что лазер установлен на портале. ! 3. Установка по п.1, отличающаяся тем, что в качестве лазера использован твердотельный лазер.

УСТРОЙСТВО ДЛЯ ЛАЗЕРНОЙ РЕЗКИ ОТВЕРСТИЙ СЛОЖНЫХ КОНТУРОВ В ТРУБАХ С ПОПЕРЕЧНЫМ СЕЧЕНИЕМ ПРОИЗВОЛЬНОЙ ФОРМЫ

... 1. Устройство для лазерной резки отверстий сложных контуров в трубах с поперечным сечением произвольной формы, содержащее технологический лазер, режущую головку, укрепленную на подвижном портале, систему подачи технологического газа, опорную станину с узлом крепления и поворота обрабатываемой трубы, привод вращения обрабатываемой трубы с электродвигателем, пару шарикоподшипников для вращения обрабатываемой трубы, систему автоматического управления порталом и приводом вращения, отличающееся тем, что в устройство введены, по крайней мере, три опорные полые колонны, при этом опорная станина расположена между двумя из них, привод вращения выполнен в виде отдельного узла, механически связанного с узлом крепления и поворота с помощью цепной передачи, при этом привод вращения содержит вал, установленный осесимметрично в зажимном патроне, один конец вала привода соединен с валом электродвигателя, а на другом конце вала привода жестко закреплена ведущая шестерня цепной передачи, узел крепления и ...

ПОДЛОЖКА С МИКРОРЕЛЬЕФОМ ДЛЯ ПОЛУЧЕНИЯ НЕТКАНОГО ПОЛОТНА И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ. СПОСОБ ПОЛУЧЕНИЯ НЕТКАНОГО ПОЛОТНА И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

Предложены подложка со сформированным микрорельефом и способ изготовления подложки со сформированным микрорельефом, применяемой для получения нетканого полотна, в частности нетканого полотна, напоминающего трикотаж. Подложка со сформированным микрорельефом включает корпус, имеющий верхнюю поверхность с узором, образованным множеством пиков и впадин и множеством отверстий. Отверстия имеют коническую верхнюю часть, окруженную скоплением пиков и впадин. Расстояние между центрами соседних отверстий меньше, чем наибольший диаметр конической верхней части отверстий. Подложку со сформированным микрорельефом получают фокусированием лазерного луча так, что фокальная точка находится ниже верхней поверхности исходной заготовки, и нанесением с помощью лазерного луча заранее определенного рисунка, образованного конусообразными отверстиями. Рисунок из конусообразных отверстий образует скопление пиков и впадин, окружающих каждое отверстие на верхней поверхности полученной подложки. Указанные признаки ...

ГОЛОВКА ДЛЯ ЛАЗЕРНОЙ РЕЗКИ С ДВУМЯ ПОДВИЖНЫМИ ЗЕРКАЛАМИ ДЛЯ РЕГУЛИРОВКИ ПУЧКА И/ИЛИ КОЛЕБАТЕЛЬНОГО ДВИЖЕНИЯ

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УСТАНОВКА ДЛЯ ЛАЗЕРНОЙ ПЕРФОРАЦИИ МНОГОСЛОЙНЫХ РУЛОННЫХ МАТЕРИАЛОВ

Установка для лазерной перфорации отверстий многослойных рулонных материалов, содержащая несущую раму, на противоположных вертикальных стойках которой смонтированы с возможностью вращения исходный и приемный валы, смонтированные между ними с возможностью вращения промежуточные валы, привод, соединенный с приемным валом, узел перфорации, включающий лазерный излучатель, блок управления и питания лазерного излучателя и поддерживающий рабочий элемент, продольная ось которого параллельна продольным осям промежуточных валов и который смонтирован между промежуточными валами в зоне выполнения перфорации, систему вытяжки и защитные экраны, отличающаяся тем, что узел перфорации установки снабжен сканирующим устройством, включающим сканатор с линейным приводом его перемещения, соединенный с лазерным излучателем посредством оптического волокна, а установка снабжена управляющим компьютером, датчиками вращения исходных валов и скорости движения материала и вторым исходным валом, смонтированным с возможностью ...

УСТАНОВКА ДЛЯ ЛАЗЕРНОЙ ОБРАБОТКИ

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... 1. Устройство для лазерной сварки угловых соединений тел вращения с плоскостью, содержащее фокусирующую линзу, установленную под линзой на ее оптической оси камеру избыточного давления для подачи газа в зону обработки, рабочий стол с приводами перемещения с системой ЧПУ, отличающееся тем, что камера избыточного давления снабжена поворотным коленом, верхняя часть которого соосно оптической оси содержит одноплоскостной радиально-упорный подшипник и механизм ориентации колена относительно камеры, выполненный в виде двух взаимно пересекающихся двусторонних равноплечих подпружиненных и охватывающих одними концами неподвижную стойку камеры избыточного давления, а другими концами подвижную стойку - водила планетарного редуктора Джемса рычагов, причем поворотное колено в нижней своей части выполнено переходящим в наклонное сопло и содержит винтовой механизм поперечной его регулировки, расположенный соосно отклоненной оптической оси. 2. Устройство по п. 1, отличающееся тем, что эпициклическая шестерня ...

ЛАЗЕРНОЕ УСТРОЙСТВО МЕХАНИЧЕСКОЙ ОБРАБОТКИ И СПОСОБ ЛАЗЕРНОЙ ОБРАБОТКИ, СОДЕРЖАЩИЕ ОДИНОЧНУЮ ЛИНЗУ ДЛЯ ФОКУСИРОВКИ

... 1. Лазерное устройство (1) механической обработки, содержащее точку (В) выхода света, которая обеспечивается для излучения несфокусированного лазерного света (А), и одиночную линзу (8), расположенную после точки (В) выхода света в направлении излучения, которая фокусирует лазерный свет (А) и предназначена для направления сфокусированного лазерного света (А) на точку механической обработки обрабатываемой детали (7) и которая может перемещаться в упомянутом направлении излучения,отличающееся тем, чторасстояние (m, m) между линзой (8) и точкой (В) выхода света и расстояние (l, l) между линзой (8) и точкой механической обработки обрабатываемой детали (7) и расстояние между точкой (В) выхода света и упомянутой выше точкой механической обработки могут изменяться.2. Лазерное устройство (1) механической обработки по п.1, отличающееся тем, что линза (8) является асферической.3. Лазерное устройство (1) механической обработки по любому из пп.1 или п.2, отличающееся тем, что диапазон перемещения упомянутой ...

СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОКАНАЛЬНЫХ УСТРОЙСТВ И МНОГОКАНАЛЬНЫЕ УСТРОЙСТВА ДЛЯ ОСУЩЕСТВЛЕНИЯ СПОСОБА

... 1. Способ изготовления многоканального устройства, содержащий следующие этапы: (а) изготовление частичного ламината, содержащее следующие этапы: (i) обеспечение базовой полосы, имеющей первую кромку и вторую кромку, причем вторая кромка расположена напротив и по существу параллельно первой кромке и первой поверхности, (ii) обеспечение первой кромочной полосы, (iii) обеспечение второй кромочной полосы, (iv) обеспечение, по выбору, одной или более дополнительных полос, (v) выравнивание первой кромочной полосы с первой кромкой базовой полосы, (vi) соприкосновение первой кромочной полосы с первой поверхностью базовой полосы, (vii) выравнивание второй кромочной полосы со второй кромкой базовой полосы, (viii) соприкосновение второй кромочной полосы с первой поверхностью базовой полосы, (ix) выравнивание любых, по выбору, дополнительных полос между первой кромочной полосой и второй кромочной полосой, (x) соприкосновение любых, по выбору, дополнительных полос с первой поверхностью базовой полосы ...

Установка для лучевой обработки

Устройство для резания материала лучом лазера

Устройство для автоматического отклонения и фокусирования луча при лазерной обработке

Использование: в сварке и в технике упрочняющей обработки деталей лучом лазера , преимущественно тел вращения сложного профиля с плавными криволинейными образующими. Сущность изобретения: для расширения технологических возможностей установок лазерного упрочнения необходимо обеспечить нормальное падение луча на обрабатываемую поверхность деталей сложного профиля, выдерживая при этом постоянным расстояние от фокусирующей линзы до поверхности обработки. Для этого в процессе работы копировальный рычаг , контактируя под действием пружины с деталью, аппроксимирует участок криволинейной поверхности и устанавливает поворотную рамку с фокусирующей линзой и выходным оптическим элементом по норма ли или другим наперед заданным углом к аппроксимированной поверхности. Кинематическая связь рамки с поворотной платформой , на которой установлен входной оптический элемент, обеспечивает соответствующий поворот этого элемента, что позволяет отклонить луч лазера на требуемый угол. Непрерывный контакт копировального ...

Станок для обработки листового материала

Изобретение относится к машиностроению , а именно к станкам для обработки листовых материалов лазерной резки и обработкой со снятием стружки . Цель изобретения - расширение технологических возможностей, уменьшение .металлоемкости, повьш1ение надежности и точности обработки. Станок содержит смонтированные на фундаменте портальную стойку 1 с основанием 2 и продольной балкой 3, рабочий инструмент , выполненный в виде лазера А или фрезерной головки, установленный с возможностью перемещения вдоль продольной балки 3, станину 5 с направляющими 6, расположенными перпен- дикулярно продольной балке 3, и смонтированную на этих направляющих подвижную каретку 7 с захватом 17 обрабатываемого листового материала Станина 5 соединена с основанием 2 портальной стойки 1 с возможностью перестановки станины 5 относительно оси фрезерной головки. Станок оснащен установленным на станине 5 столом 12 П-образной формы с размещением полок вдоль боковых граней направляющих 6 станины 5, а каретка 7 установлена на опорной ...

Стол-спутник металлообрабатывающего станка для лазерной обработки заготовок

Изобретение относится к станкостроению , в частности к оснастке для закреп ления изделий при обработке Цель упрощение констрчкции и расширение технологических возможностей путем обеспечения закрепления заготовок различной формы и размеров Заготовку 5 устанавливают на опорные иглы, размещенные в наклонных пазах 4 плиты 3, прижимают ее по двум сторонам к зажимам 10 и фиксируют зажимами 10 с третьей стороны Базирующая поверхность зажимов К) выполнена цилиндрической ступенчатой, а их установка с возможностью наладочного не ремещения в наклонных по отношению ч при долыюй оси стола 4 1юшо;яет i i- креплять заготовки различной формы и мера. 4 ил.

Устройство регулирования температуры

Устройство для нарезания спиральной канавки на заготовках пленочных резисторов

Способ управления процессом нанесения перфорации на оболочку табачных изделий

... 1. СПОСОБ УПРАВЛЕНИЯ ПРОЦЕССОМ НАНЕСЕНИЯ ПЕРФОРАЦИИ НА ОБОЛОЧКУ ТАБАЧНЫХ ИЗДЕЛИЙ, предусматр .вакмций измерение текущего значения воздухопроницаемости оболочки табачных изделий , отлич.ающийся тем, что, с целью повьпиения точности путем поддержания заданного соотношения всасываемого дополнительного Е Оздуха к дыму, нанесение перфорации осуществл )пот в зависимости от оказываемого набивкой сопротивления прохождению дыма, ...

Druckkopf

Rohrbalken mit zentralem Einzelträger

Vorrichtung zum Umformen eines Blechs zu einem durchgehenden Balken mit vier Außenwänden und einem gemeinsamen zentralen Träger, welcher sich zwischen zwei einander gegenüberliegenden Wänden erstreckt, wobei die vier Außenwände einen rechteckigen Querschnitt definieren, und der gemeinsame zentrale Träger den rechteckigen Querschnitt in ein erstes und ein zweites aneinandergrenzendes Rohr teilt, wobei der gemeinsame zentrale Träger gerundete Enden aufweist, welche jeweils Gleitebenen senkrecht zu dem gemeinsamen zentralen Träger definieren, und wobei das Blech Kanten aufweist, welche an die gerundeten Enden anstoßen, umfassend: Walzprofilierstationen mit Walzen zum Umformen des Blechs zu einem durchgehenden Balken mit den vier Außenwänden und dem gemeinsamen zentralen Träger; und eine Schweißstation mit Schweißeinrichtungen und einer Schweißboxvorrichtung, wobei die Schweißboxvorrichtung einen Vorrichtungsrahmen und äußere Dorne beinhaltet, welche von dem Vorrichtungsrahmen gestützt werden ...

Stripping device useful for automated stripping of rotatable component, which is held on vehicle, comprises laser source, cooler, controller, processing head, carriage comprising traversing unit, receiving device, and rotational means

Stripping device (1) for automated stripping of a rotatable component (2), which is held on a vehicle, a machine or to another object, in a normal mounted condition, comprises a laser source (5), a cooler (6), a controller (7), a processing head with integrated laser optic comprising laser, a carriage comprising a traversing unit, a receiving device, which is arranged on the carriage, and a rotational means, which is held at the carriage. The processing head is mounted on the receiving means for automatically rotating the component, which is to be stripped. Stripping device (1) for automated stripping of a rotatable component (2), which is held on a vehicle, a machine or to another object, in a normal mounted condition, comprises a laser source (5), a cooler (6), a controller (7), a processing head with integrated laser optic comprising laser, a carriage comprising a traversing unit, a receiving device, which is arranged on the carriage, and a rotational means, which is held at the carriage ...

Cutting machine for plate type material using beam e.g. laser - includes table arranged on machine bed for reception of material with radiation source above

The machining table (12) and the radiation source (14) can be moved relative to each other by means of a drive operated by a control. The table can be moved in the longitudinal direction (X) to the machine bed (10), and the radiation source in the transverse direction (Y). A partition wall (18) is arranged laterally underneath the travel range of the radiation source by which a radiation collection and suction chamber (16) is separated from an adjacent workpiece collection chamber (20). The drives of the machining table and the radiation source are so operated by the control that the centre of gravity of a surface, which is defined by a closed cutting contoour, after passage through the complete cutting contour, lies outside the radiation collection and suction chamber (16), on the side of the workpiece collection chamber. USE/ADVANTAGE - Cutting machine using beam or jet source, e.g. gas burner, plasma burner, laser beam and water jet. Known type considerably improved. Cut out pieces of ...

Zusatzachsenschneidkopf mit Überlastschutz und Laserschneidmaschine

Zusatzachsenschneidkopf (1) mit einem Grundkörper (2) zur Aufnahme einer Schneidoptik, einem Düsenkörper (3) zur Beaufschlagung eines Werkstücks mit Laserstrahlung in einer z-Richtung, einem Schlitten (4) zur translatorischen Bewegung der Schneidoptik und des Düsenkörpers (3) in einer x-y-Ebene, und einer Überlastschutzvorrichtung (5, 20), wobei die Überlastschutzvorrichtung (5, 20) ein Sollbruchelement (5) umfasst, durch das der Düsenkörper (3) mit dem Schlitten (4) lösbar und starr verbunden ist, und welches Sollbruchstellen (8) aufweist, und wobei die Überlastschutzvorrichtung (5, 20) zwischen Schlitten (4) und Düsenkörper zusätzlich eine Stoßdämpfungseinrichtung (17) aufweist, welche eine Bewegung des Düsenkörpers (3) gegenüber dem Schlitten (4) entgegen der z-Richtung abdämpft.

Verfahren zur Ausrichtung eines Laserstrahles auf die Oeffnung einer Düse und Fokussierkopf zur Laserstrahlbearbeitung.

Anordnung zur Fabrikation mikrooptischer Elemente

VERFAHREN ZUM BILDEN VON MIKROPERFORATIONEN AUF DER FLAECHE EINES WALZZYLINDERS.

Gerät zum Schneiden und/oder Schweißen flexibler Verpackung

Treatment of bore surfaces in workpieces

The invention relates to a method for treating the surfaces (I) of component bores, especially for treating the tracks (I) of cylinder bores (B1, B2, B3, B4) of engine blocks (M) with a laser beam (X) which is directed at the surface requiring treatment by means of deflecting optical device (100), and a device intended for said treatment. Said devices enable the surfaces of component bores to be treated easily, with greater precision and improved efficiency. The inventive method is characterized in that during the treatment process the component (M) is rotated around a rotational axis which is aligned paraxially with the longitudinal axis of the bore being treated whilst the deflecting optical device (100) remains stationary. Any imbalances which appear when said component (M) is rotated are corrected by correction gauges (21, 22).

Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs

Verfahren zur Bearbeitung eines Werkstücks (13) unter Verwendung einer Laserbearbeitungsvorrichtung (10) zur Herstellung eines Schneidwerkzeugs, bei dem der Materialabtrag ein Abtragsprofil aufweist, das dem Querschnittsprofil einer herstellbaren Nut entspricht,mit einem Laser (11) zur Erzeugung eines Laserstahls (12), unter Verwendung einer im Lichtweg des Laserstrahls (12) angeordneten ansteuerbaren Ablenkeinrichtung (15), die den von dem Laser (11) einfallenden Laserstrahl (12a) während der Werkstückbearbeitung in wenigstens zwei Raumrichtungen (X, Y) ablenkt und den abgelenkten Laserstrahl (12b) auf das Werkstück (13) richtet, sowie unter Verwendung einer Positionieranordnung (30),wobei die Ablenkeinrichtung (15) die Auftreffstelle (18) des abgelenkten Laserstrahls (12b) innerhalb einer Schraffurfläche (16) auf der Werkstückoberfläche (17) entlang wenigstens einer Spiralbahn (19) bewegt, und wobei die Positionieranordnung (30) während der Bearbeitung das Werkstück (13) und die Ablenkeinrichtung ...

Additional axis cutting head useful in a laser cutting machine, comprises a base body for receiving cutting optics, a nozzle body, a carriage for the movement of the cutting optics and the nozzle body, and an overload protection device

Additional axis cutting head (1) comprises a base body (2) for receiving cutting optics, a nozzle body (3) for applying a workpiece with a laser beam in a z-direction, a carriage for the translatory movement of the cutting optics and the nozzle body in a x-y-plane, and an overload protection device. The overload protection device has a predetermined breaking element (5), through which the nozzle body is removable and rigidly connected with the carriage. The breaking element comprises predetermined break points. The overload protection device comprises an additional shock absorbing device. Additional axis cutting head (1) comprises a base body (2) for receiving cutting optics, a nozzle body (3) for applying a workpiece with a laser beam in a z-direction, a carriage for the translatory movement of the cutting optics and the nozzle body in a x-y-plane, and an overload protection device. The overload protection device has a predetermined breaking element (5), through which the nozzle body is ...

VERFAHREN UND VORRICHTUNG ZUM PERFORIEREN VON ZIGARETTEN UND DERGLEICHEN MITTELS LASERSTRAHLEN.

Thermal processing of rod-like workpiece by thermal processing beam, comprises: clamping workpiece in clamping devices along feed direction, supporting workpiece by supporting element, and rotating rod-like workpiece

Thermal processing of a rod-like workpiece (2) by a thermal processing beam emerging from a processing head (17), comprises: clamping the workpiece in two mutually spaced clamping devices along a feed direction of the workpiece; supporting the workpiece by at least one supporting element, where the supporting element is arranged in the feed direction after the clamping devices; and rotating the rod-like workpiece about its longitudinal axis during processing the workpiece with the processing beam to a processing point. The clamping device or the supporting element is movably mounted. Thermal processing of a rod-like workpiece (2) by a thermal processing beam emerging from a processing head (17), comprises: clamping the workpiece in two mutually spaced clamping devices along a feed direction of the workpiece; supporting the workpiece by at least one supporting element, where the supporting element is arranged in the feed direction after the clamping devices; and rotating the rod-like workpiece ...

VORRICHTUNG ZUM PERFORIEREN EINES HUELLMATERIALSTREIFENS FUER ARTIKEL DER TABAKVERARBEITENDEN INDUSTRIE

Verfahren zur Überwachung einer eine Energiequelle führenden Vorrichtung wie Handhabungsgerät

Werkstückträger für eine Bearbeitungsmaschine

VERFAHREN ZUM HERSTELLEN EINER BESCHRIFTUNG AUF AUS SICH BEI EINWIRKUNG EINER LASERSTRAHLUNG VERFAERBENDEM KUNSTSTOFF BESTEHENDEN TASTENKNOEPFEN FUER SCHREIB-ODER BUEROMASCHINEN.

A laser beam is used to inscribe the symbols on the keys (4a-4n) of office machine keyboards (1) by using blank heads of the keys made of a plastic which changes its colour by energy radiation. The keyboard is moved relative to the radiation source (3) in such a way that each head is placed by a position scanner (11) in the focus. A memory (6) with a data input (9) for the data logger (8) and a programme register (7) supplies the inputs for the control unit (5) of the laser gun (3) and the coordinate drive (10) of a carriage (2) with the keyboard (1).

Verfahren, Vorrichtung und Beugungsgitter zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, durch Änderung besagten Beugungsgitters

Verfahren zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, wie Halbleiterelementen, die in einem Wafer aus Halbleitermaterial gebildet werden, unter Verwendung eines Lasers, der mindestens einen primären Laserstrahl produziert, wobei besagter mindestens ein primäre Laserstrahl in eine Vielzahl von sekundären Laserstrahlen unter Verwendung eines ersten Beugungsgitters aufgetrennt wird, das eine erste Gitterstruktur besitzt und durch Auftreffen lassen des besagten mindestens einen primären Laserstrahls auf besagte erste Beugungsstruktur, und wobei mindestens eine erste Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine erste Richtung gebildet wird, besagtes Verfahren ferner umfassend einen Schritt zur Bildung mindestens einer zweiten Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine zweite Richtung, charakterisiert dadurch, dass besagte zweite Gitterstruktur durch besagtes erstes Beugungsgitter umfasst ist, und ...

Deflecting device for a laser unit

A deflecting device for a laser unit for deflecting the laser beam in the x and y directions has in the path of the laser beam a first mirror for the y deflection, which can be pivoted by a drive motor about an axis perpendicular to the impinging laser beam, and a second mirror for the x deflection, which can be pivoted by a drive motor about an axis perpendicular to the impinging laser beam and to the pivoting axis of the first mirror. A third mirror, which is at an unalterable angle with respect to the direction of the rays of the laser beam(s) coming from the first mirror (12), is mounted unpivotably and is interchangeable with a second mirror (16). The second and the third mirrors (16, 20) are arranged on a slide which can be moved between two positions in such a way that, in the one position of the slide (22), the second mirror (16) lies in the path of the rays of the laser beam(s) and, in the other position of the slide (22), the third mirror (20) lies in the path of the rays of the ...

Laserbohrsystem

Structuring the surface of materials

Material such as glass, plastic, semiconductor material, wood or ceramic is surface worked using a laser beam of wavelength 1.4-3.0 mu m.

Verfahren zum Herstellen eines Schneidwerkzeugs

Eine Steuerung 13 führt einen ersten Prozess des Abtastens eines zylindrischen Bestrahlungsbereichs aus, umfassend einen fokussierten Punkt des Laserlichts 2, das von einem Laserlicht-Emitter 10 emittiert wurde, um eine Freiflächenseite eines Werkstücks 20 zu bearbeiten, um ein Schneidwerkzeug herzustellen, das eine Vielzahl von in einer Reihe angeordneten Schneidkanten aufweist. In dem ersten Prozess tastet die Steuerung 13 den zylindrischen Bestrahlungsbereich entlang eines Abtastpfads, der Periodizität aufweist und eine Bearbeitungstiefe ändert, um die Vielzahl von Schneidkanten zu bilden, ab. Die Steuerung 13 führt ferner einen zweiten Prozess des Abtastens des zylindrischen Bestrahlungsbereichs aus, umfassend den fokussierten Punkt des Laserlichts, das in einer Richtung unterschiedlich von einer Bestrahlungsrichtung des Laserlichts in dem ersten Prozess emittiert wird, um eine Spanflächenseite des Werkstücks 20 zu bearbeiten.

Anlage und Verfahren zur Herstellung eines Solarzellenmoduls

Die Erfindung bezieht sich auf ein Verfahren sowie eine Anlage zur Herstellung eines Solarzellenmoduls, umfassend in zumindest zwei zueinander ausgerichteten wie parallel zueinander und auf einer Unterlage angeordneten Reihen von untereinander verschalteten Solarzellen. Um das Handling zu vereinfachen und Beschädigungen von Solarzellen bzw. Querverbindern bei der Herstellung weitgehend zu vermeiden, werden die Verfahrensschritte vorgeschlagen: - Bereitstellen und Ausrichten der Unterlage, - Ausrichten der Solarzellen und Positionieren dieser auf der Unterlage, - Auflegen von Zellenverbindern auf einander zugewandten Randbereichen von aneinander grenzenden Solarzellen und Verbinden der Zellenverbindern mit den Randbereichen, - Verbinden der untereinander verbundenen Solarzellen mit Querverbindern und - Abdecken der verschalteten Solarzellen mit einer Abdeckung.

Verfahren und Vorrichtung zur Metallblechverarbeitung

Vorrichtung zum endlosen und verformungsfreien Schweissen von optischen Elementen

Verfahren zum Behandeln eines Substrates und entsprechende Vorrichtung

Verfahren zum Behandeln eines Substrats (10), um darauf ein Muster zu erzeugen, mit den folgenden Schritten, dass ein Substrat (10) vorgesehen wird; eine Substratbehandlungsvorrichtung (121) vorgesehen wird; ein Steuersystem (110, 111) vorgesehen wird; ein Verschiebemechanismus verwendet wird, eine kontinuierliche relative Verschiebung zwischen dem Substrat (10) und der Behandlungsvorrichtung (121) zu bewirken, der ein Verschiebesignal liefert, das die Verschiebung angibt; das Steuersystem (110, 111) verwendet wird, das Verschiebesignal zu überwachen und zu bewirken, dass die Behandlungsvorrichtung (121) das Substrat (10) in Intervallen behandelt, um so das Muster zu erzeugen, während die kontinuierliche Verschiebung erfolgt, wobei das Steuersystem (110, 111) einen Taktvergleichsschritt zur Synchronisation des Verschiebesignals mit den Intervallen ausführt, wobei die relative Verschiebung eine Winkelbewegung um eine Achse herum ist und das Muster um diese Achse herum ausgebildet wird, dadurch ...

Vorrichtung zum Ausbilden einer geschlossenen, gekrümmten Schnittfläche

Vorrichtung zum Ausbilden einer ein Teilvolumen (T) innerhalb eines transparenten Materials (5) umschließenden Schnittfläche (9), mit einer Laserstrahlungsquelle (S), die Laserstrahlung (3) in das Material (5) fokussiert und dort optische Durchbrüche (8) bewirkt, wobei die Vorrichtung eine Scaneinrichtung (6, 10), die den Fokuspunkt (7) dreidimensional verstellt, und eine Steuereinrichtung aufweist, die die Scaneinrichtung (6, 10) ansteuert, um die Schnittfläche (9) durch Aneinanderreihen der optischen Durchbrüche (8) im Material (5) zu bilden, dadurch gekennzeichnet, dass die Scaneinrichtung zur Verstellung der Lage des Fokuspunktes (7) längs der optischen Achse (A) ein verstellbares Teleskop (6) aufweist und dass die Steuereinrichtung den Fokuspunkt (7) entlang einer Raumspirale (22) verstellt, die in der Schnittfläche (9) liegt und entlang einer im Wesentlichen rechtwinklig zur optischen Achse (A) liegenden Hauptachse (H) verläuft.

Bearing component useful for a workpiece support, comprises a supporting segment attachable to a base plate of a workpiece support, supporting part and stroke limiting part

Bearing component (12) comprises a supporting segment (14), at least one supporting part (15) and at least one stroke limiting part (33). The supporting segment is attachable to a base plate of a workpiece support (4) by the supporting part and/or the stroke limiting part in tilting or wobbling manner. An independent claim is also included for a processing machine, comprising a collecting device for a machining beam, which is arranged at least predominantly below a support plane of a workpiece support of the processing machine, with respect to the workpiece support, where workpiece support comprises at least one bearing component.

Method of reducing or preventing oscillation amplitudes on a welding seam of a laser optics for making a laser welding seam, involves isolating the tool across the machining line

The method involves using a tool (2) which is isolated or at least cushioned against the natural frequency of the robot gripper arm (1) and/or oscillations appearing as impact. The oscillation of the tool across the machining line is isolated or damped. An Independent claim is also included for a device for carrying out the method.

Abfüllanlage für ein Produkt aus viskosem Material

Die Erfindung betrifft eine Abfüllanlage für ein Produkt aus viskosem Material, insbesondere eine chemotechnische Zubereitung, das aus einer Portionierungseinrichtung (10, 11) in Strangform ausgetragen und mittels einer Einrichtung zum Durchtrennen des Produktstrangs (12) endportioniert wird. Erfindungsgemäß ist vorgesehen, dass die Durchtrennungseinrichtung einen Laser umfasst, dessen Strahl (15) quer zur Produktaustragrichtung gerichtet ist und den Produktstrang (12) zur Endportionierung durchsetzt.

VERFAHREN ZUM GRAVIEREN VON DRUCKFORMEN MITTELS ENERGIESTRAHLEN

Laserbearbeitungsmaschine und Verfahren zum Umrüsten derselben

Die Erfindung betrifft eine Laserbearbeitungsmaschine (1), insbesondere eine Laser-Flachbettmaschine, zur wahlweisen Bearbeitung von plattenartigen oder von rohrförmigen Werkstücken, umfassend: eine Verschiebeeinrichtung (8), an welcher ein Werkstücktisch (7) zur Auflage eines plattenartigen Werkstücks (22) festlegbar ist, um den Werkstücktisch (7) in einen Bearbeitungsbereich (2) der Laserbearbeitungsmaschine (1) und aus diesem heraus zu bewegen, sowie eine Handhabungseinrichtung (3, 4, 5, 6) zur Handhabung eines rohrförmigen Werkstücks (22) bei der Bearbeitung des rohrförmigen Werkstücks (22) in dem Bearbeitungsbereich, wobei die Handhabungseinrichtung mindestens eine Stützeinrichtung (4, 5, 6) zur Unterstützung des rohrförmigen Werkstücks (22) bei der Bearbeitung aufweist. Die Stützeinrichtung (5) ist in Längsrichtung (X) des rohrförmigen Werkstücks (22) mindestens über 20%, bevorzugt mindestens über den halben Bearbeitungsbereich (2) gesteuert bewegbar und ist bevorzugt an der Verschiebeeinrichtung ...

Device for manufacturing band stock from a material web comprises a cutting device dividing the material web into sub-webs, a cutting device dividing the sub-webs into complementary band stocks, and a transport device

Device for manufacturing 4n band stock from a material web (6) comprises a first cutting device, a second cutting device, and a transport device for transporting the material web and/or the first and second cutting device in a machine direction (MR). The second cutting device divides the material web with 2n-1 cuts (5) along the machine direction into 2n sub-webs (7). The first cutting device is moved perpendicular to the machine direction and is arranged above the material web to divide the 2n sub-webs into at least two complementary band stocks (2a, 2b) in the form of a cut crossing the central axis (8) of the sub-webs along the machine direction. An independent claim is also included for the production of 4n band stock from a material web.

Element, useful for a workpiece support of processing machine, comprises a shaft, and support elements, where a locking device is provided between the element and shaft, by which support element is releasably arranged to the shaft

The workpiece support element (11) comprises a shaft (12), and support elements (14), on which a workpiece is provided for processing a machine. A locking device is provided between the support element and the shaft, by which the support element is releasably arranged to the shaft. The shaft comprises a rotary bearing (16) for a rotatable arrangement of the support elements from a working position (13) into a resting position in a workpiece support. The locking device is detachably mounted by a plug-in-, clamping-, locking-, or a snap connection. The workpiece support element (11) comprises a shaft (12), and support elements (14), on which a workpiece is provided for processing a machine. A locking device is provided between the support element and the shaft, by which the support element is releasably arranged to the shaft. The shaft comprises a rotary bearing (16) for a rotatable arrangement of the support elements from a working position (13) into a resting position in a workpiece support ...

Laserbohren von nicht kreisförmigen Öffnungen

Micro laser perforation of line patterns in strip material involves repeated cutting of rows of waveform, zig-zag or similar pattern lines over a set material length using a deflected laser beam

Laser beam deflections are synchronized with the speed of the strip material passing below each perforating head. Perforations produced by each head have a waveform(47), zig-zag or similar shape as single(33) or multiple(34) perforation lines over a set strip length(36,37). The repeated pattern of lines does not run parallel with the direction of strip movement(32). Laser beam deflection is controlled by vibrating or non-symmetric, rotating beam deflectors which move the beam from its central axis to vary the position of perforated lines(33,34) parallel to the transporting direction. Use of a non-symmetric reflecting cone continuously changes the deflection angle of the laser beam as the cone rotates through 360[deg]. A wide range of perforation patterns can be produced with regard to the number of lines and their profile. Line profiles are precalculated in a control unit and used to control the beam deflections. Perforating heads for producing a group of lines are not in the same horizontal ...

Schweissvorrichtung

Method of producing cutouts in a workpiece, e.g. in a vehicle body part

A clamping unit (20) with a guided cutting element (12) is attached to the part to be cut out of a workpiece (10). The clamping unit incorporates a clamping element (18) with opposing clamping surfaces for the workpiece material, and is provided with the cutting element. An Independent claim is also included for a device for carrying out the method.

METHOD AND DEVICE FOR FIXING CHIPS BY ENERGY BEAMS

Laserstrahlbearbeitungsmaschine

Verfahren und Vorrichtung zum Bearbeiten von Werkstücken mittels eines Laserstrahls

VORRICHTUNG UND VERFAHREN ZUM FUEGEN MIT LASERSTRAHLUNG

Vorrichtung zum Bearbeiten von Hohlzylindern mittels eines Lasers.

EINRICHTUNG ZUM AUSRICHTEN EINES LASERSTRAHLES

Vorrichtung, Anordnung und Verfahren zur Interferenzstrukturierung von flächigen Proben

Vorrichtung zur Interferenzstrukturierung einer flächigen Probe (P) mit einem Laser (1), einem im Strahlengang des Lasers angeordneten ein- oder mehrteiligen Fokussierelement (3, 3a, 3b), mit dem die Laserstrahlung (2) in einer ersten Raumrichtung (y) fokussierbar ist, einem Probenvolumen (5), in dem die flächige Probe (P) in einem Interferenzbereich (6) platzierbar ist, einem im Strahlengang des Lasers (1) angeordneten ersten Prisma (4), einem im Strahlengang des Lasers (1) vor dem ersten Prisma (4) angeordneten weiteren, zweiten Prisma (13), mit dem die Laserstrahlung (2) auf zwei erste Strahlenbündel (2a', 2b') so aufteilbar ist, dass diese ersten Strahlenbündel (2a', 2b') zumindest teilweise getrennt voneinander sind, bevor sie auf das erste Prisma (4) auftreffen, wobei die ersten Strahlenbündel (2a', 2b') mit dem ersten Prisma (4) in einer zweiten Raumrichtung (x) als zweite Strahlenbündel (2a, 2b) so auf das Probenvolumen (5) richtbar sind, dass die beiden zweiten Strahlenbündel ( ...

Verfahren und Vorrichtung zum Schweißverbinden zweier Bauteile

The invention concerns a device for connecting two components (2, 4) by welding with a laser beam (22), the components overlapping in a partial region of their mutually facing surfaces. According to the invention, the device comprises an optical beam divider (18) which has an inlet for the laser beam (22) and a device (20) for alternately distributing the laser beam (22) to a plurality of outlets (16). Each of the outlets (16) is optically coupled via a beam-guiding device (14) to a laser welding head (12) which contains a focusing and deflection lens system for guiding the focused laser beam (22) over the surface of the component (4) facing the laser welding head (12).

Producing radiation line focus on moving workpiece - esp. for automatically welding layered or tubular synthetic film

A device for treating a workpiece by moving focused radiation across it, e.g. in the welding of a synthetic film, includes an optical system for the prodn. of a line focus of a radiation beam on the moving workpiece, so that the direction of the line focus is at right angles to the direction of motion of the workpiece. It includes also means of deflecting the focussed beam over the workpiece in a direction which has a component in the direction of motion of the }workpiece of such a dimension that the actual motion of the line focus of the radiation beam relatively to the workpiece takes place in a straight line along the line focus. The optical system consists of a cylindrical focussing leans, a spherical intermediate focussing lens and a projecting lens. The deflectors consists of a mirror positioned between the intermediate lens and the projector, the alignment of which, relatively to the cylindrical lens can be altered, so as to alter the direction of the deflected track of the focussed ...

Vorrichtung und Verfahren zum Abtragen von Schichten auf einem Werkstück

The invention relates to a device and a method for removing thin layers on a support material, especially for removing barrier layers of a thin-layer solar cell. The aim of the invention is to provide an economical means of removing strips of up to a few millimetres in width without damaging the substrate of the thin-layer solar cell underlying the layer to be removed. To this end, a laser treatment device with a laser resonator and an optical system is provided. The optical system projects the treatment beam produced by the layer resonator over an area of 1 mm<2> to 1 cm<2> on the surface to be treated with an essentially homogenous distribution of power. Thin layers can be effectively removed from the substrate at pulse width of less than 100 ns and with a pulse energy density of 0.1 J/cm<2> to 10 J/cm<2>.

VORRICHTUNG ZUR HERSTELLUNG VON VENTILATIONSOEFFNUNGEN IN ZIGARETTEN ODER AEHNLICHEN RAUCHWAREN

ROBOTERSYSTEM ZUR FUEHRUNG VON ELEKTROMAGNETISCHEN WELLEN

Manipulatorsteuerung

Verfahren und Vorrichtung zum Ausschneiden von Blechzuschnitten

Verfahren und Vorrichtung zum Ausschneiden von Blechzuschnitten, vorzugsweise aus von auf ein Coil (2) gewickeltem Dünnblech (4) mit schrittweisem Abwickeln und Ausrichten des Bleches (4) in Längsrichtung der Vorrichtung bzw. mit Einlegen von Blechtafeln auf eine Arbeitsfläche (10). Das Blech (4) wird in einem ersten Arbeitsgang über der Arbeitsfläche (10) von einem seitlichen Spannrahmen (14) erfasst und quer zur Vorschubrichtung gespannt in einer Schneidposition (6) hauptsächlich bis auf die die Blechzuschnitte im Restblech (4) haltenden Stege vorgeschnitten. Danach wird das vorgeschnittene Blech (4) weiterhin eingespannt bleibend über eine Ablagefläche (12) in eine Ablageposition (7) durch das Blechband (4) in Längsrichtung spannende Auszugsrollen (8) verfahren. Dort werden in einem zweiten Arbeitsgang die Blechzuschnitte durch Zerschneiden der Stege geordnet abgestapelt. Danach wird das Restblech (4) von der Ablageposition (7) weiter zu einer Entsorgung (9) befördert. Das vorgeschnittene ...

Laserschweissmaschine zum Schweissen von Profilen auf grossformatigen Strukturbauteilen

High Throughput Solar Cell Ablation System

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Устройство одновременного сканирования двумя лазерными пучками

Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими лазерные пучки на всей плоскости ростовой зоны. Технический результат заключается в расширении технологических возможностей обработки и изготовления деталей при обеспечении их высокого качества и точности обработки за счет обеспечения полного перекрытия рабочей зоны. 3 з.п. ф-лы. Ц 1 174390 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) (2 за зао 0 (51) МПК В23К 26/08 (2014.01) СО2В 26/10 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21)(22) Заявка: 2016144179, 10.11.2016 (24) Дата начала отсчета срока действия патента: 10.11.2016 Дата регистрации: 11.10.2017 Приоритет(ы): (22) Дата подачи заявки: 10.11.2016 (45) Опубликовано: 11.10.2017 Бюл. № 29 Адрес для переписки: 197046, Санкт-Петербург, пр-кт Каменноостровский, 1-3, пом. 30, ООО "Юридическая фирма Городисский и Партнеры" (72) Автор(ы): Орлов Андрей Евгеньевич (КО), Смоленцев Сергей Сергеевич (КО), Тимофеев Владимир Андреевич (КО), Ксенофонтов Алексей Олегович (КП) (73) Патентообладатель(и): Российская Федерация в лице Министерства промышленности и торговли Российской Федерации (Минпромторг России) (КП) (56) Список документов, цитированных в отчете о поиске: У\О 2016128287 А1, 18.08.2016. ГР 2001075039 А, 23.03.2001. 0$ 20040129685 АТ, 08.07.2004. \УО 2013061587 А1, 02.05.2013. (54) УСТРОЙСТВО ОДНОВРЕМЕННОГО СКАНИРОВАНИЯ ДВУМЯ ЛАЗЕРНЫМИ ПУЧКАМИ (57) Реферат: Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими ...

Automated beam marker

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

Optical device and laser beam machining apparatus having optical device

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Laser processing method and laser processing apparatus

The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Defect correcting apparatus and defect correcting method

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

Orthogonal integrated cleaving device

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Scanned laser light source

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Laser machining apparatus with switchable laser system and laser machining method

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Laser processing method and apparatus

A laser processing method processes spots on an object in a scan area with a laser beam emitted from a laser emitter. The method includes steps of covering the scan area in such a way as to transmit the laser beam and define a closed space over the scan area, jetting an inert gas into the closed space so that the jetted inert gas forms a gas curtain sweeping along the scan area in the closed space, and discharging the inert gas from the closed space while maintaining a positive pressure in the closed space, thereby removing plumes from the spots processed with the laser beam and preventing the spots from oxidizing. The method is capable of stably laser-processing the object without changing the color of the processed spots.

Annealing method and annealing apparatus

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

Wafer dividing method

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

Method for Printing a Substrate Using an Anilox Roll, an Anilox Roll for a Printing Method and a Printing Apparatus

The invention relates to an anilox roll for a printing apparatus. The anilox roll comprises a cylinder having a surface. The surface comprises a fluid distribution structure for receiving, distributing and transferring a fluid such as an ink. The fluid distribution structure comprises a channel formed in the surface having channel walls. This channel is arranged for distributing the fluid over the fluid distribution structure. The channel comprises channel parts, wherein the courses of connected channel parts are at an angle with respect to each other for preventing a linear distribution of the fluids to be received in a course direction of the channel, allowing a meandering distribution of the fluid to be received in the channel. Side walls of the channel are arranged for allowing a meandering flow of the fluid throughout the fluid distribution surface.

Method and Apparatus for Forming an Anilox Roll

The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.

Laser match honing system and method

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Laser processing systems and methods for beam dithering and skiving

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

Printing Method With a Printing Apparatus Provided With an Anilox Roll

A printing apparatus has a printing device having a supply for a substrate to be printed and a supply for ink. The printing device has a printing roll with an image and an anilox roll mounted in a bearing. The anilox roll comprising a cylinder having a surface with a fluid distribution structure for receiving the fluid. The fluid distribution structure has a channel formed in the surface for distributing the fluid over the fluid distribution structure. The channel having a course and opposite channel walls positioned next to each other in a relative parallel oscillating fashion. Printing in a first operational mode, heavy layers of ink on said substrate with relatively large fluid droplets and Printing in a second operational mode, details on said substrate with relatively small fluid droplets.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Laser ablation tooling via distributed patterned masks

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

Laser Processing Machines

A laser processing machine includes a workpiece support, a movement unit that is movable relative to the workpiece support, the movement unit being configured to move a laser processing head over the workpiece support, and a switch cabinet in which one or more control components of the laser processing machine are provided. An arrangement of the switch cabinet provides a free movement space disposed underneath at least a portion of the switch cabinet, wherein at least a portion of the movement unit is disposed within the free movement space.

METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS

The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts () are joined into one connecting flange. The device has a clamping device () for clamping the sheet metal parts () to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (). Moreover, the device has a compensation shaft () which tracks the laser beam () according to a relative movement between the connecting flange and a guidance apparatus. 1. A device for joining sheet metal parts each with a flange , by laser , wherein the flanges of the sheet metal parts are joined into one connecting flange , in which the flanges of the sheets to be joined abut flat against each other and thus form a joint with a flange planewherein the device has clamping device to clamp the sheet metal parts to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam which is designed to route a laser beam substantially parallel to the connecting flange and transverse to the clamping direction to a front side of at least one of the flanges of the sheet metal parts to be joined,whereinthe device further comprises a compensation shaft which, when the device is connected to a guidance apparatus, tracks the laser beam according to a relative motion between the connecting flange and the guidance apparatuscharacterized in that the beam guidance system has at least one optical element with which a beam angle at which the laser beam runs on a plane perpendicular to the main clamping direction is to be influenced in such a way that switching between different beam angles is possible in the area of a possible processing point such that in each instance a lateral angle is produced away from a sheet part projecting beyond the joint andthat the device has an apparatus for monitoring the ...

LASER-IRRADIATED THIN FILMS HAVING VARIABLE THICKNESS

A crystalline film includes a first crystalline region having a first film thickness and a first crystalline grain structure; and a second crystalline region having a second film thickness and a second crystalline grain structure. The first film thickness is greater than the second film thickness and the first and second film thicknesses are selected to provide a crystalline region having the degree and orientation of crystallization that is desired for a device component. 1. A system for processing a film comprising:a laser source capable of producing a pulsed laser beam;one or more optical elements capable of generating a first laser beam and a second laser beam having different beam characteristics from the pulsed laser beam, wherein the first laser beam has a first energy density to melt a first region of a film to be crystallized to form a first crystalline region having a first grain structure and the second laser beam has a second energy density sufficient to melt a second region of the film to be crystallized to form a second crystallized region having a second grain structure, wherein the first energy density is greater than the second energy density;a stage configured to support and position a film to be crystallized such that the first laser beam is directed to and irradiates a first portion of the stage and a second laser beam is directed to and irradiates a second portion of the stage; anda computer for controlling the laser source, optical elements, and stage to facilitate the delivery of the first laser beam and the second laser beam to portions of the stage corresponding to first and second regions of a film to be crystallized..2. The system of claim 1 , comprising a film positioned on the stage.3. The system of claim 2 , wherein the first laser beam irradiates a first region of the film and the second laser beam irradiates a second region of the film.4. The system of claim 3 , wherein the irradiations of the first region of the film and the second ...

Laser Puncher for Punching Hole on Tipping Paper in a Curved Manner

The present invention discloses a laser puncher for punching holes on tipping paper in a curve manner, which comprises a panel, a light guiding cylinder, a laser connected with the light guiding cylinder, a transmission system driving a piece of tipping paper to move and at least one focusing optical head and at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is provided with the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the external periphery of the moving optical cylinder is provided with an anti-rotation linear bearing, which is fixed on the panel, and the driving motor drives the focusing optical head to reciprocate back and forth via the screw shaft, the nut, the connecting rod and the moving optical cylinder. The present invention can increase the identifiability of tipping papers on which holes are punched with a laser puncher as well as the air permeability of tipping papers. 1. A laser puncher for punching holes on tipping paper in a curved manner , comprising;a panel;a light guiding cylinder;a laser connected with the light guiding cylinder;a transmission system driving a piece of tipping paper to move; andat least one focusing optical head, wherein at least one driving motor is fixed on the panel, a screw shaft is connected with the driving shaft of the driving motor, a nut is connected with the screw shaft and fixedly connected with a connecting rod, the other end of which is fixedly connected with at least one moving optical cylinder, one end of which is fitted glidingly in the light guiding cylinder, and the other end of which penetrates the panel to be fixedly connected with the focusing optical head, the ...

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Method for welding steel material to ni-based superalloy and welding joint

When a turbine impeller ( 4 ) formed from an Ni-based superalloy and a rotor shaft ( 2 ) formed from a steel material are joined by being fused together via welding in a boundary portion, a mixing ratio of a welding metal ( 6 ) that is formed in the boundary portion by fusing together the Ni-based superalloy forming the turbine impeller ( 4 ) and the steel material forming the rotor shaft ( 2 ) is between 0.5 and 0.8. As a result, it is possible to obtain a sound welding joint in which there are no cracks in the boundary between the welding metal ( 6 ) and the Ni-based superalloy ( 4 ).

APPARATUS AND METHOD FOR MATERIAL PROCESSING USING A TRANSPARENT CONTACT ELEMENT

A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface. 1. A method of preparing an apparatus for material processing by producing optical breakthroughs in or on an object , said apparatus comprising a variable three-dimensionally acting focus adjustment device for focusing pulsed processing laser radiation on different locations in or on the object , whereina contact element, which is transparent for the processing laser radiation and is to be placed on the object, is mounted to the apparatus, said contact element having, on its side to be placed on the object, a contact surface and, located opposite, an entry surface for the processing laser radiation, the contact surface having a known shape;prior to processing the object, the position of the contact surface with respect to the focus adjustment device is determined by irradiation of laser radiation on the contact surface, by focusing measurement laser radiation near or on the contact surface by the variable focus adjustment device, an energy density of the focused measurement laser radiation being too ...

Method and apparatus for marking an article

Numerous embodiments of methods and apparatus for marking articles are disclosed. In one embodiment, a method of marking an article includes providing an article having a preliminary visual appearance; modifying a region of the article; and directing a plurality of optical pulses into the modified region of the article. The plurality of optical pulses can be configured to produce a visible mark on the article. Generally, the mark can be characterized as having a modified visual appearance different from the preliminary visual appearance.

Analyte sensor

Devices and methods are provided for continuous measurement of an analyte concentration. The device can include a sensor having a plurality of sensor elements, each having at least one characteristic that is different from other sensor(s) of the device. In some embodiments, the plurality of sensor elements are each tuned to measure a different range of analyte concentration, thereby providing the device with the capability of achieving a substantially consistent level of measurement accuracy across a physiologically relevant range. In other embodiments, the device includes a plurality of sensor elements each tuned to measure during different time periods after insertion or implantation, thereby providing the sensor with the capability to continuously and accurately measure analyte concentrations across a wide range of time periods. For example, a sensor system 180 is provided having a first working electrode 150 comprising a first sensor element 102 and a second working electrode 160 comprising a second sensor element 104 , and a reference electrode 108 for providing a reference value for measuring the working electrode potential of the sensor elements 102, 104.

Substrate markings

Apparatus, systems, and methods are provided to generate markings on the side of a substrate. The markings represent information. In an embodiment, the information provided in the markings may be used to collect information during an assembly process.

Light Recycling For Additive Manufacturing Optimization

A method and an apparatus pertaining to recycling and reuse of unwanted light in additive manufacturing can multiplex multiple beams of light including at least one or more beams of light from one or more light sources. The multiple beams of light may be reshaped and blended to provide a first beam of light. A spatial polarization pattern may be applied on the first beam of light to provide a second beam of light. Polarization states of the second beam of light may be split to reflect a third beam of light, which may be reshaped into a fourth beam of light. The fourth beam of light may be introduced as one of the multiple beams of light to result in a fifth beam of light. 1. A method , comprising the steps of:multiplexing, by a first optical assembly, multiple beams of light including at least one or more beams of light from one or more light sources;reshaping and blending, by an optical device, the multiple beams of light to provide a first beam of light;applying, by a spatial polarization valve, a spatial polarization pattern on the first beam of light to provide a second beam of light;splitting, by a polarizer, polarization states of the second beam of light to reflect a third beam of light;reshaping, by a second optical assembly, the third beam of light into a fourth beam of light; andintroducing, by the second optical assembly, the fourth beam of light to the first optical assembly as one of the multiple beams of light to result in a fifth beam of light that is emitted through and not reflected by the polarizer.2. The method of claim 1 , wherein the receiving of the multiple beams of light including at least one or more beams of light from the one or more light sources comprises receiving at least the one or more beams of light from at least a solid state laser or a semiconductor laser.3. The method of claim 1 , wherein the applying of the spatial polarization pattern on the first beam of light comprises applying the spatial polarization pattern on the first ...

THIN-FILM DEVICES AND FABRICATION

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations. 122-. (canceled)23. A method of fabricating an optical device , the method comprising , in the following order:depositing a lower transparent conductor layer on a substantially transparent substrate;depositing a defect mitigation insulating (DMIL) layer on the lower transparent conductor layer;removing material down to the DMIL and a predefined depth of material from the lower transparent conductor layer in regions at predefined locations in a bus bar expose area along a side of the substantially transparent substrate;depositing an electrochromic device stack over the substantially transparent substrate; andremoving the electrochromic device stack at the predefined locations to expose the lower transparent conductor layer.24. The method of fabricating the optical device of claim 23 , wherein removing the electrochromic device stack at the predefined locations forms spaced punch through areas penetrating into the lower transparent conductor layer; and further comprising filling the spaced punch through areas with a material to form a bus bar.25. The method of fabricating the optical device of claim 24 ,wherein the spaced punch through areas form a plurality of separated scribe lines along the side of the substantially transparent substrate; andwherein the electrochromic device stack is at least partially intact between the separated scribe lines.26. The method of fabricating the optical device of claim 23 , wherein the bus bar ...

LASER SYSTEM AND METHOD FOR PROCESSING SAPPHIRE

Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire. 1. A method for laser processing a sapphire substrate , the method comprising:periodically switching on a power source to pulse a continuous wave laser, thereby operating the laser in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm;focusing the pulses of laser light at the sapphire substrate; andlaser processing the sapphire substrate with the pulses of laser light.2. The method of further comprising supplying inert gas in a vicinity of the sapphire substrate.3. The method of claim 2 , wherein the inert gas is selected from the group consisting of argon and helium.4. The method of claim 1 , wherein laser processing the sapphire substrate is selected from the group consisting of cutting claim 1 , scribing claim 1 , and drilling.5. The method of claim 1 , wherein laser processing includes cutting with a speed between about 10 and 40 inches per minute claim 1 , and wherein the sapphire substrate has a thickness between about 0.1 and about 1 mm.6. The method of claim 1 , wherein the laser is an ytterbium fiber laser.7. The method of claim 1 , wherein the laser is operated with a duty cycle ranging between about 1% and about 10%.8. The method of claim 1 , wherein ...

SYSTEMS AND METHODS FOR WELDING

A welding fixture including an electromagnet, a non-magnetic support configured to receive at least two sheets of material to be welded, and one or more clamping shoes configured to cooperate with the electromagnet to apply a clamping pressure to the at least two sheets of material and the non-magnetic support as a result of a magnetic force produced by the electromagnet is provided. A first of the at least two sheets of material is in contact with at least one of the one or more clamping shoes, and a second of the at least two sheets of material is in contact with at least the non-magnetic support. The one or more clamping shoes being shaped such that a perimeter defined by the one or more clamping shoes is located in the vicinity of a defined weld line to be welded on the at least two sheets of material, the weld line remaining substantially free from optical obstruction during production of the magnetic force. 1. A welding fixture , comprising:an electromagnet;a non-magnetic support configured to receive at least two sheets of material to be welded; andone or more clamping shoes configured to cooperate with the electromagnet to apply a clamping pressure to the at least two sheets of material and the non-magnetic support as a result of a magnetic force produced by the electromagnet;wherein a first of the at least two sheets of material is in contact with at least one of the one or more clamping shoes, and wherein a second of the at least two sheets of material is in contact with at least the non-magnetic support, the one or more clamping shoes being shaped such that a perimeter defined by the one or more clamping shoes is located in the vicinity of a defined weld line to be welded on the at least two sheets of material, the weld line remaining substantially free from optical obstruction during production of the magnetic force.2. The welding fixture of claim 1 , further comprising a laser welding device or an electron beam welding device.3. The welding fixture of ...

HANDHELD PULSED LASER DEVICE FOR CLEANING OR TREATING A SURFACE

The present invention relates to a handheld pulsed laser device for cleaning or treating a surface, comprising a laser source, a focal distance adjuster and a beam deflector. The laser source is configured to emit a pulsed laser beam and the focal distance adjuster, is configured to change a focal distance of the beam. The beam deflector may comprise at least one movable mirror onto which the beam is deflected, wherein the deflector is configured to deflect the beam to scan the beam along the surface. 1. A handheld pulsed laser device for cleaning or treating a surface , comprising:a laser source, configured to emit a pulsed laser beam;a focal distance adjuster, configured to change a focal distance of the beam, and;a beam deflector, configured to deflect the beam to scan the beam along the surface;at least one sensor, configured to provide a sensor signal, representative for of a parameter that is related to a characteristic of the surface; anda control unit, configured to control the beam deflector to scan the beam along the surface in an, at least, two-dimensional pattern, based on the sensor signal.2. The pulsed laser device according to claim 1 , wherein the pattern of the beam comprises an outer contour and wherein the outer contour is filled-up by the beam with a back-and-forth scanning movement within the outer contour.3. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a sinusoidal pattern.4. The pulsed laser device according to claim 2 , wherein the back-and-forth scanning movement is superpositioned with a spiral pattern.5. The pulsed laser device according to claim 1 , wherein the beam deflector comprises at least one mirror claim 1 , which is tiltable around at least one perpendicular axis.6. The pulsed laser device according to claim 1 , wherein the focal distance adjuster comprises a movable lens element and a piezo-element claim 1 , which is configured move the movable lens element to ...

LASER PROCESSING SYSTEM

There is provided a laser processing system including: a robot; a laser emission section provided on the robot; an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot; a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; and a laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region. 1. A laser processing system comprising:a robot;a laser emission section provided on the robot;an irradiation path calculation section configured to calculate an irradiation path of a laser beam emitted from the laser emission section using information on a position of the robot;a determination section configured to determine whether the irradiation path calculated passes through an allowable irradiation region that is predetermined; anda laser-output reduction section configured to reduce output of the laser beam to be emitted to the irradiation path to a second output lower than a first output for processing in accordance with a determination by the determination section that the irradiation path does not pass through the allowable irradiation region.2. The laser processing system according to claim 1 , whereinthe laser emission section includes a scanner configured to perform scan operation, andthe irradiation path calculation section calculates the irradiation path further using information on a position of the scan operation of the scanner.3. The laser processing system according to claim 2 , whereinthe scanner includes a mirror configured to perform the scan operation and a motor configured ...

CALIBRATION TEST PIECE FOR GALVANOMETRIC LASER CALIBRATION

Some embodiments may include a galvanometric laser system, comprising: a laser device to generate a laser beam; an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam; a support platen located below the laser egress; an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to view a surface of an object located on the support platen using one or more optical components of the X-Y scan head module to generate assessment data associated with a calibration of the X-Y scan head module by imaging the surface of the object, wherein a calibration fiducial is located on the surface of the object. 1. A galvanometric laser system , comprising:a laser device to generate a laser beam;an X-Y scan head module to position the laser beam on a work piece, the X-Y scan head module including a laser ingress to receive the laser beam and a laser egress to output the laser beam;a support platen located below the laser egress and arranged to receive a work piece;an in-machine imaging system integrated with the galvanometric laser, wherein a camera of the in-machine imaging system is arranged to use one or more optical components of the X-Y scan head module to view an object located on the support platen; anda calibration test piece to place on the support platen during a calibration routine prior to positioning the laser beam on the work piece, the calibration test piece with a planar surface including a calibration fiducial usable by the camera to generate calibration data associated with a calibration of the X-Y scan head module.2. The galvanometric laser system of claim 1 , further comprising a selective optic located between the laser ingress and the laser device claim 1 , the selective optic being optically transmissive to the laser beam and optically non-transmissive to light ...

Laser wire processing device

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

LOCATION OF IMAGE PLANE IN A LASER PROCESSING SYSTEM

Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution. 1. A method of processing a workpiece using a laser processing system having a scan lens , the method , comprising:producing a first beam of laser energy characterized by a first spatial intensity distribution having a non-circular perimeter shape at the focal point of the beam when viewed in a plane that is orthogonal to a path along which the beam of laser energy propagates;processing a first workpiece using the first beam of laser energy;the processing comprising forming a plurality of features in the first workpiece, wherein a first distance between the scan lens and the first workpiece during the forming of one of the plurality of features is different from a second distance between the scan lens and the first workpiece during the forming of at least one other of the plurality of features;determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution;setting a process distance as the distance between the scan lens and the first workpiece during the forming of the feature having the shape that most closely resembles the shape of the first spatial intensity distribution;determining an imaging plane as a plane at the process ...

Method for defining a laser tool path

Open patches whose boundary is affected by the laser ray 2 being defined for any areas which could not be machined from validated closed patches 15. Optionally, the method also comprises a step 400 of merging of the validated closed patches 15 into groups 50 of patches.

LASER PROCESSING APPARATUS, METHODS OF LASER-PROCESSING WORKPIECES AND RELATED ARRANGEMENTS

Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed. 1. (canceled)2. An apparatus for laser-processing a workpiece , the apparatus , comprising:a laser source configured to generate a plurality of laser pulses;a scan lens arranged in a beam path along which the plurality of laser pulses are directable to the workpiece to thereby irradiate a process spot at the workpiece;a first positioner including an acousto-optical deflector (AOD) system arranged along the optical path between the laser source and the scan lens, wherein the first positioner is operative to deflect the plurality of laser pulses relative to the scan lens to thereby position the process spot within a first scanning range associated with the first positioner a processor configured to generate one or more control signals to which the first positioner is responsive; and', {'b': 3', '14, 'computer memory accessible by the processor, wherein the computer memory has instructions stored thereon which, when executed by the processor, cause the first positioner to scan the process spot along a process trajectory to form a via in the workpiece, wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with the plurality of laser pulses during formation of the via and wherein a maximum diameter of the via is smaller than or equal to the first scanning range. claims -. (canceled ...

HEATING SYSTEM FOR COMPOSITE REWORK OF AIRCRAFT

A method and apparatus comprising a laser unit and a controller. The laser unit is configured to generate a number of laser beams. The controller is configured to operate the laser unit to generate the number of laser beams resulting in a desired level of heating of a composite patch that cures the composite patch on a composite structure. 115-. (canceled)16. A method for curing a composite patch on a composite structure , the method comprising:attaching a rework system to a location on the composite structure comprising the composite patch;receiving, in a controller configured to operate a laser unit, rework information for generating commands for selecting and transmitting, from the laser unit, a wavelength and intensity required to pass through a vacuum bag with a vacuum applied to the vacuum bag and cause a desired level of heating of the composite patch, within the vacuum bag, for each step needed to cure the composite patch on the composite structure, while avoiding overheating a fiber in the composite patch; andoperating the rework system, controlling the laser unit, a number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure.17. The method of claim 16 , wherein the operating step comprises:identifying parameters for operating the rework system to generate the number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure; andoperating the rework system using the parameters identified to generate the number of laser beams resulting in the desired level of heating of the composite patch that cures the composite patch on the composite structure.18. The method of claim 17 , wherein the operating step further comprises:monitoring heating of the composite patch during operation of the rework system using the parameters identified to generate the number of laser beams resulting in the desired level ...

Method for matching and tracking workpieces in laser etching operation

A method for matching and tracking workpieces in laser etching operation includes generating by the computer a label image that uniquely identifies the workpiece, moving a laser head to the workpiece, setting the laser head to a first power level by a power controller, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with a product image in a pixel wise fashion across the workpiece, moving the laser head to the label by the transport mechanism, setting the laser head to a second power level by the power controller, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in accordance with the label image in a pixel wise fashion across the label. 1. A method for matching and tracking workpieces in laser etching operation , comprising:receiving a product image by a computer, wherein the product image is to be reproduced on a workpiece by laser etching;generating, by the computer, a label image that uniquely identifies the workpiece, wherein the workpiece and the label are placed over a platform in a laser etching apparatus;moving a laser head to the workpiece by a transport mechanism;setting the laser head to a first power level by a power controller;while scanning the laser head across the workpiece, etching the product image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the first power level in accordance with the product image in a pixel wise fashion across the workpiece;moving the laser head to the label by the transport mechanism;setting the laser head to a second power level by the power controller;while scanning the laser head across the label, etching the label image on the workpiece using a laser beam emitted from the laser head, wherein the laser beam is modulated at the second power level in ...

Laser processing apparatus and laser processing method

A laser processing apparatus that condenses a laser beam into an annular shape to irradiate the condensing position of the laser beam within a thickness range of a substrate, and shifts the condensing position in such a manner that the center of the condensing position that is annular moves in a circular manner, at a stage of shifting the condensing position in a thickness direction of the substrate and a planar direction of the substrate.

METHOD AND SYSTEM FOR LASER HARDENING OF A SURFACE OF A WORKPIECE

A method of laser hardening of a surface area of a workpiece, such as a surface of a journal of a crankshaft, including the steps of generating a relative movement between the surface of the workpiece and a laser source to allow a laser spot to subsequently be projected onto different portions of the surface area, and during the relative movement, repetitively scanning the laser beam so as to produce a two-dimensional equivalent effective laser spot on the surface area. The energy distribution of the effective laser spot is adapted so that it is different in a more heat sensitive subarea, such as in an area adjacent to an oil lubrication opening, than in a less heat sensitive subarea, so as to prevent overheating of the more heat sensitive subarea. 1. An apparatus for hardening a surface area of a workpiece , the surface area comprising at least one less heat sensitive subarea and at least one more heat sensitive subarea , the apparatus comprising a laser source arranged to project an effective laser spot onto the surface area and means for generating relative movement between said surface area and the effective laser spot so that said effective laser spot is moved along said surface area so as to subsequently and progressively heat different portions of said surface area to a temperature suitable for hardening , whereby said effective laser spot is arranged to feature a two-dimensional energy distribution , the apparatus further comprising a control system for controlling operation of the apparatus , wherein said control system is arranged to modify said two-dimensional energy distribution so that it is different in said more heat sensitive subarea than in said less heat sensitive subarea.2. The apparatus according to claim 1 , wherein said at least one more heat sensitive subarea includesan area adjacent to a hole in the surface area, such as an oil lubrication hole; and/ora fillet, such as an undercut fillet; and/ora previously hardened portion of the surface ...

LASER SYSTEMS AND TECHNIQUES FOR WORKPIECE PROCESSING UTILIZING OPTICAL FIBERS AND MULTIPLE BEAMS

In various embodiments, a workpiece is processed utilizing primary and secondary laser beams having different wavelengths and which are coupled into specialized optical fibers. The primary and secondary beams may be utilized during different stages of workpiece processing. 1. A method of processing a workpiece utilizing a primary laser beam and a secondary laser beam , wherein a wavelength of the primary laser beam is longer than a wavelength of the secondary laser beam , the method comprising:providing a step-core optical fiber having an input end and an output end opposite the input end, wherein the step-core optical fiber comprises (i) an inner core having a first refractive index, (ii) surrounding the inner core, an outer core having a second refractive index smaller than the first refractive index, (iii) surrounding the outer core, a cladding having a third refractive index smaller than the second refractive index, (iv) a first inner core numerical aperture (NA) relative to the cladding, (v) a second inner core NA relative to the outer core, and (vi) an outer core NA relative to the cladding;disposing a workpiece proximate the output end of the optical fiber;during a first stage, coupling at least the secondary laser beam into the optical fiber to form a first output beam emitted from the output end of the optical fiber and directed to a surface of the workpiece, whereby energy of the first output beam is absorbed by the workpiece; andduring a second stage after at least a portion of the surface of the workpiece reacts to absorption of energy of the first output beam, (i) coupling at least the primary laser beam into the optical fiber to form a second output beam emitted from the output end of the optical fiber and directed to the surface of the workpiece, and (ii) thereduring, causing relative movement between the second output beam and the workpiece, whereby the workpiece is cut along a processing path determined at least in part by the relative movement.2. ...

LOCATION-SPECIFIC LASER ANNEALING TO IMPROVE INTERCONNECT MICROSTRUCTURE

A method (and structure) includes performing an initial partial anneal of a metal interconnect overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer. Orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer is determined, as implemented and controlled by a processor on a computer. A determination is made whether the orientation of the early recrystallizing grain is desirable or undesirable. 1. A method , comprising:performing an initial partial anneal of a metal interconnect and overburden layer for semiconductor devices being fabricated on a chip on a semiconductor wafer;detecting an orientation of an early recrystallizing grain at a specific location on a top surface of the metal overburden layer, as implemented and controlled by a processor on a computer; anddetermining whether the detected orientation of the early recrystallizing grain is desirable or undesirable.2. The method of claim 1 , further comprising performing a laser anneal at specific locations to promote or inhibit certain grain orientations from growing.3. The method of claim 1 , wherein said metal overburden layer comprises copper (Cu).4. The method of claim 1 , wherein said specific location comprises a point of a plurality of points of a discrete sampling grid of said top surface claim 1 , said discrete sampling grid having a sample interval based on an expected overburden grain size.5. The method of claim 4 , wherein said discrete sampling grid is selectively applied to at least one of different regions and different layers of a chip during fabrication of a semiconductor wafer.6. The method of claim 1 , wherein said detecting and determining of orientation comprises evaluation of grain orientation using a scanning electron microscope (SEM) equipped with electron backscatter diffraction (EBSD).7. The method of claim 1 , further comprising:monitoring said initial partial anneal by using a laser ...

LASER MACHINING DEVICE AND LASER MACHINING METHOD

Provided are a laser machining device and a laser machining method capable of stably operating an autofocus function without causing an unfavorable state such as an overshoot etc. A laser machining device and a laser machining method of the present invention performs a normal AF (autofocus) control when a scan position of the machining laser light and the detecting laser light is located in a work central portion, and performs a slow-tracking AF (autofocus) control with a trackability to a displacement of a main surface of a work reduced to be lower than a trackability of the normal AF control when the scan position of the machining laser light and the detecting laser light is located in a work end portion. 1. A laser machining device which condenses a machining laser light inside a work to form a modified region inside the work along a planned dividing line , the laser machining device comprising:a condensing lens configured to condense the machining laser light and a detecting laser light toward the work;a scanner configured to relatively move the condensing lens and the work in a direction orthogonal to an optical axis direction of the condensing lens, to scan the machining laser light and the detecting laser light over the work;an adjuster configured to adjust a distance between the condensing lens and the work;a detector configured to detect a reflected light to output a detection signal according to a height of a main surface of the work, the reflected light being the detecting laser light reflected on the main surface of the work;a first controller configured to control, based on the detection signal output by the detector, the adjuster so as to cause a light condensing point of the detecting laser light to track a displacement of the main surface of the work, in case where a scan position of the machining laser light and the detecting laser light is in a central portion of the work; anda second controller configured to control, based on the detection signal ...

COMPACT DEVICE AND PROCESS FOR THE PRODUCTION OF NANOPARTICLES IN SUSPENSION

The invention shows a device for producing nanoparticles, the device having a pulsed laser with a scanning device for guiding the beam of the laser over a target that is fixed in a flow-through chamber. The flow-through chamber is reversibly connected to a supply line for carrier fluid, so that the flow-through chamber is exchangeable e.g. for a further flow-through chamber having a different target and/or a different dimensioning. 1. A device for the production of nanoparticles , comprising a pulsed laser , a scanning device to guide a beam of the laser , a flow-through chamber having a target support wall , a radiation-transparent wall opposite the target support wall , a supply line connected to at least one reservoir for carrier fluid and connected to the flow-through chamber , a controlled conveying device arranged in the supply line and configured to control a flow velocity of carrier fluid within the flow-through chamber in a range of 1 to 10 mm/s , wherein the laser has a maximum power of 5 W and is configured to emit pulses having a pulse energy of 0.01 to 10 mJ and a pulse duration of 0.5 to 10 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.2. The device according to claim 1 , wherein the laser is configured to emit pulses having a pulse energy of 10 to 1000 μJ and a pulse duration of 0.5 to 1 ns with a repetition rate of 500 to 5000 Hz and a fluence of 0.1 to 10 J/cm.3. The device according to claim 1 , wherein a distance of the radiation-transparent wall section from a target supported by the target support wall is at maximum 5 mm.4. The device according to claim 1 , wherein the scanning device is configured to guide the laser beam at a speed of 0.1 to 10 m/s over a target supported by the target support wall.5. The device according to claim 1 , the conveying device comprising one or both of a controlled valve and a controlled pump.6. The device according to claim 1 , wherein the flow-through chamber is arranged with its ...

Workpiece management method and sheet cutting machine

A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.

Laser patterning apparatus for three-dimensional object

A laser patterning apparatus for a three-dimensional object includes a laser generator, a beam expander configured to adjust a size of a laser beam generated by the laser generator, a dynamic focusing module configured to adjust a z-axis focus position of the laser beam passing through the beam expander, a scan head configured to adjust x- and y-axis focus position of the laser beam passing through the beam expander, a shape recognizer configured to recognize a shape of a three-dimensional object, and a controller configured to extract x-, y-, and z-axis data of the three-dimensional object and to control the scan head and the dynamic focusing module, in order to pattern the three-dimensional object with the laser beam.

Device For Operating A Machine Tool And Machine Tool

A device is provide for operating a machine tool. The machine tool includes a rotation unit designed to rotate a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, the laser being arranged such that material of the workpiece is removed by means of the laser pulses. The device is configured to adjust the rotational speed progression based on geometry data of a specified geometry and/or a specified surface quality characteristic value representative of a corresponding surface quality. 1. A device for operating a machine tool ,wherein the machine tool has a rotation unit that rotates a workpiece about an axis of rotation with an adjustable rotational speed progression, and an ultra-short pulse laser for generating laser pulses, wherein the ultra-short pulse laser is arranged such that material of the workpiece is removed by the laser pulses, andwherein the device is configured to adjust the rotational speed progression based on speed control data comprising at least one of (a) geometry data of a specified geometry or (b) a specified surface quality characteristic value representative of a corresponding surface quality.23-. (canceled)4. The device of claim 1 , wherein the machine tool further comprises a galvanometer scanner arranged between the ultra-short pulse laser and the workpiece and configured to displace a point of impingement of the respective laser pulse on the surface of the workpiece along the axis of rotation with an adjustable scanning speed progression claim 1 , andwherein the device is configured to adjust the scanning speed progression based on the speed control data.5. (canceled)6. A machine tool for machining a workpiece claim 1 , with the machine tool comprising:a rotation unit configured to rotate the workpiece about an axis of rotation with an adjustable rotational speed progression,an ultra-short pulse laser that generates laser pulses and is arranged ...

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. 1. A method for selectively removing a protective coating from a substrate , comprising:applying a protective coating to a substrate; andselectively cutting at least a portion of the protective coating with a removal medium comprising a laser light.2. The method of claim 1 , wherein applying the protective coating comprises applying a polyp-xylylene) coating to the substrate.3. The method of claim 1 , wherein selectively cutting at least the portion of the protective coating comprises exposing a periphery of at least one portion of the substrate through the protective coating.4. The method of claim 1 , wherein exposing the periphery of the at least one portion of the substrate comprises exposing a periphery of a selected feature and/or component of the substrate.5. The method of claim 3 , wherein exposing at least the periphery of the at least one portion of the substrate comprises exposing the protective coating to a laser beam.6. The method of claim 5 , further comprising:exposing an area of the substrate delineated by the periphery of the at least one portion of the substrate.7. The method of claim 6 , wherein the area is exposed by scanning the laser beam across a region of the protective coating located over the area of the substrate.8. The method of claim 7 , wherein scanning comprises raster scanning the laser beam across the region of the protective coating.9. The method of claim 1 , wherein selectively cutting comprises selectively cutting at least the portion of the protective ...

DEVICE FOR CUTTING A WEB OF MATERIAL

A device for cutting a web of material comprises movement means for moving a web of material to be cut, defining a feed path for the web at least partly rotatable about a central axis and equipped with at least one conveyor mounted around the central axis, at least one cutting head equipped with a laser source and an optical system configured to direct the laser beam towards a cutting zone, where the optical system of the cutting head comprises at least one directing member located inside the conveyor to direct the laser beam away from the central axis towards the cutting zone. 1. A device for cutting a web of material , comprising:movement means by which a web of material to be cut is made to advance and defining for the web a feed path which is at least partly rotatable about a central axis; the movement means comprising at least a conveyor mounted around the central axis and defining an at least partly curved cutting zone;at least one laser cutting head laser equipped with a laser source configured to generate a laser beam, and an optical system configured to direct the laser beam towards the cutting zone;Wherein the optical system of the cutting head comprises at least one directing member located inside the conveyor to direct the laser beam away from the central axis towards the cutting zone; the directing member being rotatable about its axis of rotation and oriented in such a way that the laser beam defines on the web a cutting line transversal to the feed path of the web.2. The device according to claim 1 , wherein the conveyor constitutes a curved feed surface for the web and is equipped claim 1 , at the cutting zone claim 1 , with at least one permeable portion permeable to the laser beam and facing the directing member claim 1 , so as to allow the laser beam to pass through the feed surface.3. The device according to claim 2 , wherein the permeable portion is defined by a through opening.4. The device according to claim 2 , wherein the permeable portion ...

LASER APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation. 1. A laser apparatus comprising:a stage;a laser providing unit above the stage and configured to provide a laser beam;a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; anda control unit to control an operation of the scanner,wherein the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.2. The laser apparatus of claim 1 , wherein the control unit calculates a processing area to which the laser beam is irradiated and a non-processing area to which the laser beam is not irradiated.3. The laser apparatus of claim 2 , wherein claim 2 , when a position of a target aiming point of the laser beam is located in the processing area claim 2 , the control unit controls to open the shutter if a moving speed of the target aiming point of the laser beam is higher than or equal to a reference speed claim 2 , and to close the shutter if the moving speed of the target aiming point of the laser beam is lower than the reference speed.4. The laser apparatus of claim 3 , wherein the control unit controls to close the shutter when the position of the target aiming point of the laser beam is located in the non-processing area.5. The laser apparatus of claim 3 , wherein a number of scans of the laser beam per ...

LONG AND HIGH RESOLUTION STRUCTURES FORMED BY ADDITIVE MANUFACTURING TECHNIQUES

A method of additive manufacture suitable for large and high resolution structures is disclosed. The method may include sequentially advancing each portion of a continuous part in the longitudinal direction from a first zone to a second zone. In the first zone, selected granules of a granular material may be amalgamated. In the second zone, unamalgamated granules of the granular material may be removed. The method may further include advancing a first portion of the continuous part from the second zone to a third zone while (1) a last portion of the continuous part is formed within the first zone and (2) the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone. 1. An apparatus for additive manufacture in a three-dimensional space corresponding to longitudinal , lateral , and transverse directions that are orthogonal to one another , the apparatus comprising:a conveyor configured to sequentially advance each portion of a continuous part in the longitudinal direction from a first zone to a second zone;an energy patterning system configured to amalgamate, within the first zone, selected granules of a granular material with unamalgamated granules of the granular material removed within the second zone, wherein the conveyor is configured to advance a first portion of the continuous part from the second zone to a third zone while (1) a last portion of the continuous part is formed within the first zone and (2) the first portion is maintained in the same position in the lateral and transverse directions that the first portion occupied within the first zone and the second zone; anda processor configured to determine a current position or orientation of the continuous part by locating one or more features of a feature map in an intersecting wall that intersects two neighboring portions of the continuous part,wherein, in amalgamating the selected granules of the ...

Laser marking system and method for laser marking a workpiece

A laser marking system for marking a predetermined pattern on a workpiece may include a first light source structured to emit first light at a first wavelength; a second light source structured to emit second light at a second wavelength different from the first wavelength and selected to mark a marking surface of the workpiece; beam shaping optics structured to adjust a focal length of the second light; beam steering optics structured to aim the first laser light and the second laser light; a controller configured to control the first light source to emit the first light at the marking surface of the workpiece and control the beam steering optics to aim the second light so as to mark the marking surface of the workpiece and create the first predetermined pattern; and a camera structured to detect first light reflected from the marking surface and record an image.

LASER WELDING OF TRANSPARENT WORKPIECES

Methods and devices for laser welding of mutually overlapping workpieces by pulsed laser beams, for example, Ultrashort-pulsed (USP) laser beams, are provided. In one aspect, a method includes directing a pulsed laser beam through one workpiece onto the other workpiece and moving the pulsed laser beam in a feed direction relative to the two workpieces to produce a weld seam between the two workpieces bearing against one another. A deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction. 1. A method of laser welding of two mutually overlapping workpieces by a pulsed laser beam , the method comprising:directing the pulsed laser beam through a first workpiece onto a second workpiece, the first and second workpieces mutually overlapping each other; andmoving the pulsed laser beam in a feed direction relative to the first and second workpieces to produce a weld seam between the first and second workpieces,wherein a deflection back and forth of the pulsed laser beam directed transversely or parallel to the feed direction is superposed on the pulsed laser beam moved in the feed direction.2. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece is formed from at least one of glass claim 1 , polymer claim 1 , or glass ceramic.3. The method of claim 2 , wherein the at least one of the first workpiece or the second workpiece is formed partially with an opaque material.4. The method of claim 1 , wherein at least one of the first workpiece or the second workpiece has a transparency of at least 90% at a laser wavelength of the pulsed laser beam.5. The method of claim 1 , wherein the first and second workpieces are moved exclusively in the feed direction and at the same time the laser beam is deflected back and forth exclusively transversely or parallel to the feed direction.6. The method of claim 1 , wherein the first and ...

LASER MACHINING ROBOT SYSTEM

A laser machining robot system that simplifies programming of a scanner operation is provided. A laser machining robot system includes a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner. The robot controller includes: a machining information input unit that inputs machining information; a G-code generation unit that generates a G-code program using the machining information; and a G-code communication unit that transmits the G-code program to the scanner controller. The scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner. 1. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner , whereinthe robot controller includes:a machining information input unit that inputs machining information;a G-code generation unit that generates a G-code program using the machining information; anda G-code communication unit that transmits the G-code program to the scanner controller, andthe scanner controller includes a scanner program processing unit that applies the G-code program as a scanner operation program for operating the scanner.2. The laser machining robot system according to claim 1 , whereinthe robot controller further includes a storage unit that stores a template program, andthe G-code generation unit generates the G-code program by editing the template program stored in the storage unit using the machining information.3. A laser machining robot system including a robot controller that controls a robot that performs remote laser machining and a scanner controller that controls a scanner claim 1 , whereinthe robot controller includes:a machining information input unit that inputs machining information; anda machining information communication unit that transmits the machining information to ...

MANUFACTURING METHODS FOR MULTI-LOBED COOLING HOLES

A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface includes forming a cooling hole inlet at the first wall surface, forming a cooling hole outlet at the second wall surface, forming a metering section downstream from the inlet and forming a multi-lobed diffusing section between the metering section and the outlet. The inlet, outlet, metering section and multi-lobed diffusing section are formed by laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof. 1. A method for producing a diffusion cooling hole extending between a wall having a first wall surface and a second wall surface , the method comprising:forming a cooling hole inlet at the first wall surface;forming a cooling hole outlet at the second wall surface;forming a metering section downstream from the inlet; andforming a multi-lobed diffusing section between the metering section and the outlet,wherein the inlet, outlet, metering section and multi-lobed diffusing section are formed by a technique selected from the group consisting of laser drilling, particle beam machining, fluid jet guided laser machining, mechanical machining, masking and combinations thereof.2. The method of claim 1 , wherein the wall comprises a metal or superalloy substrate.3. The method of claim 1 , wherein the second wall surface comprises a coating claim 1 , and wherein at least a portion of the cooling hole extends through the coating.4. The method of claim 3 , wherein the coating comprises:a bond coating; anda thermal barrier coating.5. The method of claim 4 , wherein a portion of the diffusing section is located within the coating.6. The method of claim 5 , wherein the entire diffusing section is located within the coating.7. The method of claim 6 , wherein a portion of the metering section is located within the coating.8. The method of claim 1 , wherein the inlet and metering section ...

METHOD FOR REFINING MAGNETIC DOMAIN OF GRAIN-ORIENTED ELECTRICAL STEEL SHEET, AND DEVICE THEREFOR

Provided is a method and device for refining a magnetic domain of a grain-oriented electrical steel plate. The magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more includes zigzag controlling for straightly transferring the steel plate without being inclined in right and left directions along a production line center, tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state, steel plate support roll position adjusting for controlling a predetermined position of the steel plate in up and down directions while supporting the steel plate, and laser irradiating for irradiating a laser beam to melt the steel plate to form a groove in a surface of the steel plate. 1. A magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more , the method comprising:zigzag controlling for straightly transferring the steel plate without being inclined in right and left directions along a production line center;tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state;steel plate support roll position adjusting for controlling a predetermined position of the steel plate in up and down directions while supporting the steel plate; andlaser irradiating for irradiating a laser beam to melt the steel plate to form a groove in a surface of the steel plate.2. A magnetic domain refining method of a grain-oriented electrical steel plate for stable permanent magnetic domain refining processing even if a steel plate is transferred at high speed of 2 m/s or more , the method comprising:tension controlling for applying tension to the steel plate to maintain the steel plate in a flat state;steel plate support roll position ...

PATTERNED THIN FILMS BY THERMALLY INDUCED MASS DISPLACEMENT

The described invention provides a method of patterning a thin film deposited on a substrate comprising applying a moving focused field of thermal energy to the thin film deposited on the substrate; and dewetting the thin film from the substrate. Dewetting the thin film from the substrate is characterized by a negative space of a desired design; and displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures. 1. A method of patterning a thin film deposited on a substrate comprising:(A) applying a moving focused field of thermal energy to the thin film deposited on the substrate; and(B) dewetting the thin film from the substrate, (i) a negative space of a desired design; and', '(ii) displacement of the thin film into adjacent structures, thereby accumulating thin film in the adjacent structures., 'the dewetting being characterized by2. The method according to claim 1 , wherein the focused field of thermal energy is from a laser.3. The method according to claim 1 , wherein the focused field of thermal energy is at a wavelength matched to the wavelength absorbed by the thin film.4. The method according to claim 3 , wherein the wavelength is not absorbed by the substrate.5. The method according to claim 1 , wherein the thin film is an inorganic compound.6. The method according to claim 1 , wherein the thin film is comprised of a metal or metal alloy.7. The method according to claim 6 , wherein the metal is comprised of bismuth.8. The method according to claim 6 , wherein the metal is comprised tin.9. The method according to claim 1 , wherein the substrate is an inorganic substance.10. The method according to claim 9 , wherein the inorganic substance is selected from the group consisting of glass claim 9 , ceramic claim 9 , silicon oxide and silicon nitride.11. The method according to claim 10 , wherein the inorganic substance is glass.12. The method according to claim 11 , wherein the glass is borosilicate glass.13. ...

Si SUBSTRATE MANUFACTURING METHOD

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction < parallel to a cross line at which a crystal plane { and a crystal plane { intersect or a direction [ orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed. 1100. A silicon substrate manufacturing method for manufacturing a silicon substrate from a silicon ingot in which a crystal plane () is made to be a flat surface , the silicon substrate manufacturing method comprising:{'b': 110', '100', '111', '110, 'a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to silicon to a depth equivalent to a thickness of the silicon substrate to be manufactured from the flat surface and irradiating the silicon ingot with the laser beam while relatively moving the focal point and the silicon ingot in a direction <> parallel to a cross line at which a crystal plane {} and a crystal plane {} intersect or a direction [] orthogonal to the cross line;'}an indexing feed step of executing indexing feed of the focal point and the silicon ingot relatively in a direction orthogonal to a direction in which the separation band is formed; and{'b': '100', 'a wafer manufacturing step of repeatedly executing the separation band forming step and the indexing feed step to form a separation layer parallel to the crystal plane () as a whole inside the silicon ingot and separating the silicon ...

Golf club head hosel marking

A method and a related system of forming laser etched indicia on an external surface of the golf club. The method includes directing a laser beam onto a golf club head, and etching a prescribed indicia into the golf club head. The etching is generated by at least one of: (i) rotating the golf club head relative to the laser beam; and (ii) rotating the laser beam relative to the golf club head.

Laser filamentation

The invention relates to a method and a device for separating the excess glass (32) in the production of hollow glass products (12), wherein the method comprises: centring a hollow glass product (12) in a receiving device (10), which is designed to hold the hollow glass (12) and to rotate about a rotational axis in such a way that a separation line (24) along which the excess glass (32) is to be separated from the hollow glass product (12) to be produced is centred in relation to the rotational axis; processing the hollow glass product (12) in a plurality of positions along the separation line (24) by means of a laser beam in order to generate local filaments with a weakened glass structure during a rotation of the hollow glass product (12) about the rotational axis; and introducing energy along the separation line (24) in order to separate the excess glass (32) along the weakened glass structure.

LASER MACHINING DEVICE

There is provided a laser machining device including a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam, and a determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit. 1. A laser machining device comprising:a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam; anda determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit.2. The laser machining device according to claim 1 ,wherein the determination unit determines the state of the target which relates to intensity of the laser beam.3. The laser machining device according to claim 1 ,wherein the determination unit determines whether or not the target is abnormal.4. The laser machining device according to claim 1 , further comprising:a control unit that controls the state of the target, based on the state of the target which is determined by the determination unit.5. The laser machining device according to claim 1 , further comprising:a scanning unit that changes an irradiation position of the workpiece irradiated with the laser beam,wherein the target is the workpiece, andwherein the determination unit determines an abnormal location of the workpiece, based on the intensity of the heat radiation measured by the heat radiation measurement unit.6. The laser machining device according to claim 5 ,wherein the determination unit determines whether or not a first position or the vicinity of the first position of the workpiece is abnormal, based on a comparison between the intensity of the heat radiation obtained when the first position of the workpiece is irradiated with the laser beam and the ...

CALIBRATED LASER PRINTING METHOD

The present disclosure relates to a calibrated laser printing method, which is a pre-laser machining operation of wafers and comprises steps as follows: a piece of calibration glass is carried and leveled by a leveling system; a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass; true positions of the target points on the piece of calibration glass are measured by an image system; data of measured true positions is transmitted to a resetting system; the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions of above steps in the case of measurement not completed; data between default and true positions of the target points is compared; a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and true positions of the target points out of specification. 1. A calibrated laser printing method , comprising steps as follows:(a) a piece of calibration glass is carried and leveled by a leveling system;(b) a plurality of target points are marked on the piece of calibration glass by a laser system based on data of default positions of the plurality of target points on the piece of calibration glass;(c) true positions of the target points on the piece of calibration glass are measured by an image system;(d) data of measured true positions is transmitted to a resetting system;(e) the piece of calibration glass is shifted to a next location by a displacement system on which the leveling system is carried for repetitive executions from (b) to (e);(f) data between default and true positions of the target points is compared;(g) a reflecting mirror is deflected by an angle for calibrations of laser beams projected on a wafer in the case of any offset between default and ...

ADJUSTMENT ASSISTANCE DEVICE AND LASER WELDING APPARATUS

An adjustment assistance device is attached to a galvanometer scanner at a laser output side of the galvanometer scanner and used to adjust a tool coordinate system of the galvanometer scanner. The adjustment assistance device includes a light-receiving member having a light-receiving surface, which is at least one flat surface; and a connecting member that connects the light-receiving member to the galvanometer scanner and that enables the light-receiving surface to face a laser output port of the galvanometer scanner with a predetermined distance therebetween. The light-receiving member includes a light-receiving mark portion on the light-receiving surface, the light-receiving mark portion being a mark used to quantify a relative positional difference between a reference light-receiving position for light output from the laser output port and an actual light-receiving position at which the light output from the laser output port is received. 1. An adjustment assistance device attached to a galvanometer scanner at a laser output side of the galvanometer scanner and used to adjust a tool coordinate system of the galvanometer scanner , the adjustment assistance device comprising:a light-receiving member having a light-receiving surface, which is at least one flat surface; anda connecting member that connects the light-receiving member to the galvanometer scanner, the connecting member enabling the light-receiving surface to face a laser output port of the galvanometer scanner with a predetermined distance therebetween,wherein the light-receiving member includes a light-receiving mark portion on the light-receiving surface, the light-receiving mark portion being a mark used to quantify a relative positional difference between a reference light-receiving position for light output from the laser output port and an actual light-receiving position at which the light output from the laser output port is received.2. The adjustment assistance device according to claim 1 , ...

PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, SEMICONDUCTOR LASER ELEMENT MANUFACTURING METHOD, AND SEMICONDUCTOR LASER ELEMENT

A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction. 1. A puncture forming method of forming a puncture in a sample by irradiating a surface of the sample with a light beam , the puncture forming method comprising:forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; andforming a second puncture by irradiating a second position on the surface of the sample with a second pulse of the light beam after the forming of the first puncture, the second puncture at least partially overlapping the first puncture, the second position being positioned away from the first position in a first direction,wherein the second puncture has a tip positioned inside the sample, the tip being bent in a direction opposite to the first direction.2. The puncture forming method according to claim 1 ,wherein the light beam is polarized in a direction perpendicular to the first direction.3. The puncture forming method according to claim 1 ,wherein the light beam is a laser beam.4. A semiconductor element manufacturing method of manufacturing a semiconductor element by separating a semiconductor element substrate claim 1 , the semiconductor element manufacturing method comprising:forming a first puncture by irradiating a first position on a surface of the semiconductor element ...

Scanned pulse anneal apparatus and methods

Apparatus, system, and method for thermally treating a substrate. A source of pulsed electromagnetic energy can produce pulses at a rate of at least 100 Hz. A movable substrate support can move a substrate relative to the pulses of electromagnetic energy. An optical system can be disposed between the energy source and the movable substrate support, and can include components to shape the pulses of electromagnetic energy toward a rectangular profile. A controller can command the source of electromagnetic energy to produce pulses of energy at a selected pulse rate. The controller can also command the movable substrate support to scan in a direction parallel to a selected edge of the rectangular profile at a selected speed such that every point along a line parallel to the selected edge receives a predetermined number of pulses of electromagnetic energy.

METHOD AND DEVICE FOR LASER MACHINING A SUBSTRATE WITH MULTIPLE LASER RADIATION DEFLECTION

A method and device for laser machining a substrate, involves deflecting the laser radiation using a galvanometer scanner and an electro-optical deflector. The laser radiation thus deflected multiple times is then directed at a machining position on the substrate. By superposing an additional beam deflection by the electro-optical deflector onto the advance movement in the machining direction, which deflector is operated with steady oscillation excitation for this purpose, the resultant beam deflection follows a circular revolving path. In the process, the series of pulses of a pulsed radiation source is restricted to individual or a plurality of machining positions on the substrate, and forms for example a cutting front so as to thus quickly and reliably produce a kerf having the desired width. 1. A laser machining method for machining a substrate by laser radiation from a mode-coupled laser beam source , the method comprising:deflecting laser radiation two or more times using at least one first deflection unit including a galvanometer scanner and using at least one second deflection unit including an electro-optical deflector; anddirecting radiation at a machining position on the substrate,wherein the laser radiation is deflected using the electro-optical deflector as the electro-optical deflector is moved along a closed revolving path, and in thatwherein a pulse frequency of the laser radiation from a mode-coupled pulsed laser radiation source is controlled such that the machining position on the substrate follows the closed revolving path in a predetermined region depending on the pulse frequency of the laser radiation by means of single pulses and/or a series of pulses.2. The method of claim 1 , wherein the laser radiation is deflected onto the substrate in a manner restricted to a portion of a full revolution on the revolving path.3. The method of claim 1 , wherein the laser radiation is deflected into a particular machining position on the substrate according ...

ARRANGEMENT FOR CLEANING BAKING SURFACES

A laser arrangement cleans baking surfaces configured in a relief-like manner and optionally cleans evaporation and/or sealing strips of baking plates of a baking machine. The laser arrangement has a laser source for outputting a laser beam onto a locally selectable target area by continuous variation of the output direction of the laser beam and traversing a contour forming the target area. Deflecting optics are arranged at a distance from the laser source and in the target area of the laser source for deflecting the laser beam and for projecting the target area formed by the contour onto the baking plate to be cleaned along a projection direction. The deflecting optics has a device for adjustment for varying the projection direction and the outlet direction of the laser beam. 118-. (canceled)19. A configuration , comprising:a baking device with an endless conveyor;a loading device;a first device;a heated baking chamber;a second device;a product removal device;baking tongs disposed on said endless conveyor, said baking tongs each having evaporation and/or sealing strips and baking plates including a lower plate and an upper plate connected pivotably to said lower plate, said baking plates having baking surfaces, said baking tongs are each conveyed successively along said endless conveyor from said loading device for application of a baking mass into an opened baking tong, to said first device for closing a baking tong, through said heated baking chamber, further to said second device for opening said baking tong, and then to said product removal device for removing baked products from the baking tong; a laser source for outputting a laser beam onto a locally selectable target area by continuous variation of an output direction of the laser beam and traversing a contour defining the target area;', 'deflecting optics disposed at a distance from said laser source and in said target area of said laser source for deflecting the laser beam and for projection of the ...

APPARATUSES AND METHODS FOR ACCURATE STRUCTURE MARKING AND MARKING-ASSISTED STRUCTURE LOCATING

Working equipment includes a tool configured to work a structure at a working location thereon, with the structure having an applied marking at a known location with a known relationship with the working location. A computer system is configured to determine placement of the structure, and accordingly position the tool into at least partial alignment with the working location, and which in at least one instance, the tool is aligned with a second, offset location. A camera is configured to capture an image of the structure and including the marking, and further including the second location with which the tool is aligned. And the computer system is configured to process the image to locate the working location, reposition the tool from the second location and into greater alignment with the located working location, and control the repositioned tool to work the structure at the located working location. 1. A working equipment comprising:a tool configured to work a structure at a working location thereon, the structure having a permanent marking applied thereto at a known location with a known relationship with the working location;a computer system coupled to the tool and configured to determine placement of the structure, and position the tool into at least partial alignment with the working location according to the placement, the tool in at least one instance being aligned with a second location offset from the working location; anda camera coupled of the computer system and configured to capture an image of at least a portion of the structure and including the permanent marking, and further including the second location with which the tool is aligned,wherein the computer system is configured to process the image to locate the working location, reposition the tool from the second location and into greater alignment with the located working location, and control the repositioned tool to work the structure at the located working location.2. The working equipment of ...

Method of manufacturing boron coated straws for neutron detection through spiral winding and welding

A method and apparatus are disclosed with a continuous straw forming process for spiral winding boron-coated foil into a rounded tube or cylinder with an overlap and tight contact between the spiral edges, and a welding process utilizing a high precision fiber laser to weld the spiral seem forming a straw tube.

SIMULTANEOUS PATTERN-SCAN PLACEMENT DURING SAMPLE PROCESSING

A laser ablation system, and method, facilitates the execution of user-defined scans (i.e., in which a laser beam is scanned across a sample along a beam trajectory to ablate or dissociate a portion of the sample) and enables the user define additional scans while a scan is being executed. 1. A method for use with a laser ablation system having a sample chamber accommodating a sample within an interior thereof , a laser configured to generate a laser beam having parameters suitable for ablating or otherwise dissociating a portion of the sample within the sample chamber , and at least one scanning component configured to impart relative movement between the sample and the laser beam , the method comprising:processing image data, representative of obtained imagery of the sample, to generate location data, the location data associating at least one location within the obtained imagery with at least one corresponding spatial location within the interior of the sample chamber;controlling an operation of at least one selected from the group consisting of the laser and the at least one scanning component to execute a first scan in a first region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam; andwhile controlling an operation of at least one of the laser and the motion stage to execute the first scan, generating and storing scan data defining a second scan to be executed in a second region-of-interest of the sample where the sample is to be ablated or otherwise dissociated by the laser beam.2. The method of claim 1 , prior to controlling the operation of at least one of the laser and the at least one scanning component to execute the first scan claim 1 , generating and storing scan data defining the first scan.3. The method of claim 1 , further comprising generating and storing scan data defining the first scan in response receiving user input obtained through a user interface.4. The method of claim 1 , after ...

Laser welding systems for aluminum alloys and methods of laser welding aluminum alloys

Systems and methods of a laser welding device to weld aluminum are disclosed. The device includes a laser generator to generate welding-type lasing power and a lens to focus the welding-type lasing power at a focal point on an aluminum workpiece to generate a weld puddle. A laser scanner to control the lens to move the focal point of the welding-type lasing power in multiple dimensions over the aluminum workpiece during welding, the laser generator and the laser scanner to perform the welding without filler metal being added to the workpiece.

Syringe and gasket systems

A process for producing gaskets with an improved channel for use in matched syringe and plunger systems, preferably prefilled plastic syringe systems. In particular, an improved process for making and inspecting continuous channels in a gasket film by laser treatment. The gaskets are useful in matched syringe and plunger systems with high and consistent container closure integrity (CCI), and consistent break loose and glide forces over time, and sealability.

Machining Apparatus for Laser Machining a Workpiece, Set of Parts for a Machining Apparatus for Laser Machining a Workpiece and Method for Laser Machining a Workpiece using such Machining Apparatus

A machining apparatus for laser machining a workpiece () in a machining zone () is provided, having a first interface () for a machining laser source for generating a machining laser beam (), an outlet opening () for the machining laser beam (), In an optical system between the first interface () and the outlet opening (), which has at least one laser beam guiding device () having at least one movable surface () and at least one actuator (), with which the movable surface () is dynamically adjustable, and a cooling device () for cooling the at least one actuator (), wherein the cooling device () has at least one primary circuit () through which a first cooling fluid can flow without contact with the actuator (). Furthermore, a set of parts for a machining apparatus for laser machining a workpiece () and a method of laser machining a workpiece () using such machining apparatus are also provided. 117-. (canceled)18. A machining apparatus for laser machining a workpiece in a machining zone , in particular for laser cutting , in particular a laser machining head , having a first interface for a machining laser source for generating a machining laser beam;an outlet opening for the machining laser beam;an optical system between the first interface and the outlet opening, which has at least one laser beam guiding device having at least one movable surface and at least one actuator, with which the movable surface is dynamically adjustable; anda cooling device for cooling the at least one actuator, wherein the cooling device has at least one primary circuit through which a first cooling fluid can flow without contact with the actuator;characterized in that the cooling device has a closed secondary circuit, through which a second cooling fluid can flow in contact with the actuator and which can be cooled by a first of the primary circuits.19. The machining apparatus according to claim 18 ,wherein the cooling device has at least one element selected from an interior, in which ...

Method and system for laser hardening of a surface of a workplace

A method of laser hardening a surface area of a workpiece, such as a surface of a journal of a crankshaft, includes the step of: generating a relative movement between the surface of the workpiece and a laser source to allow a laser spot to subsequently be projected onto different portions of said surface area. The method also includes the step of repetitively scanning the laser beam so as to produce a two-dimensional equivalent effective laser spot on said surface area, during the relative movement. The scanning pattern can include at least three substantially parallel lines which the laser spot follows in a certain order. When the workpiece includes several journals having different widths, two laser sources may be used to harden the surface area of the wider journals.

Laser machining apparatus that machines surface of workpiece by irradiating laser beam thereon

In a laser machining apparatus, a scanner is configured to scan a laser beam emitted from a laser beam emission device. A first part of a workpiece is exposed through an opening formed in the workpiece. A controller is configured to perform: acquiring shape data indicative of a shape of the workpiece; acquiring machining pattern data indicative of a machining pattern to be machined on the first part; acquiring a length of the machining pattern based on the machining pattern data; calculating an unmachinable position on a setting surface using the length and the shape data, the unmachinable position resulting from a second part of the workpiece hindering the laser beam reaching the first part, at least a part of the machining pattern being unmachinable on the first part in a state where the workpiece is set on the unmachinable position; and displaying the unmachinable position on a display.

Systems and Methods for Monitoring and/or Controlling Wobble-Processing Using Inline Coherent Imaging (ICI)

A system and method may be used to monitor and/or control material processing where a process beam is moved in a wobble pattern, such as a wobble-welding process. While at least one process beam is moved according to a wobble pattern on a processing site (e.g., a weld site) of a workpiece, an ICI system moves an imaging beam at least partially independently of the process beam to one or more measurement locations on the wobble pattern and obtains ICI measurements (e.g., depth measurements) at those locations. The ICI measurement(s) may be used, for example, to evaluate keyhole and/or melt pool characteristics during a welding process. Although the present application describes wobble welding processes, the systems and methods described herein may also be used with other material processing applications where a laser or other energy beam is wobbled or dithered during processing including, without limitation, additive manufacturing, marking and material removal. 1. A laser material processing system comprising:a material modification beam source for generating a process beam;a processing head coupled to the material modification beam source and including at least one process beam scanning actuator, for directing and moving the process beam according to a wobble pattern in at least one axis on a processing site of a workpiece;an inline coherent imaging (ICI) system optically coupled to the processing head, the ICI system including at least one imaging beam scanning actuator for positioning the imaging beam at least partially independently of the process beam; anda control system for controlling at least the material modification beam source, the process beam scanning actuator, and the imaging beam scanning actuator, wherein the control system is programmed to cause the processing head to scan the process beam in the wobble pattern, and wherein the control system is programmed to cause the imaging beam scanning actuator to move the imaging beam to a plurality of ...

Direct Address Laser Ablation

A system and method for selectively removing tire material from the bead portions of a cured tire to reduce one or more harmonics of at least one uniformity parameter are disclosed. According to aspects of the present disclosure, tire material is selectively removed using a plurality of direct address commands. The direct address commands specify ablation parameters for discrete ablation segments at specific angular locations around the bead of the tire. The direct address commands are generated by analyzing the desired ablation pattern for the bead of the tire. The ablation device can then be controlled to selectively remove tire material in discrete ablation segments at identified addresses pursuant to the direct address commands to achieve the desired ablation pattern on one or more tracks along the bead portion of the tire using a single pass of the ablation device. 115-. (canceled)16. A method for reducing one or more harmonics of at least one uniformity parameter in a tire , comprising:receiving a plurality of ablation patterns for a bead of a tire, each ablation pattern associated with a different track location on the bead of the tire in the bead seat, low flange zone and high flange zone, each ablation pattern defining a desired ablation depth relative to an angular location around the bead and calculated to correct for one or more harmonics of at least one uniformity parameter for the tire;identifying a plurality of addresses for the bead, each address being associated with a specific angular location on the bead of the tire;analyzing each ablation pattern to determine a plurality of direct address commands to achieve the plurality of ablation patterns, the plurality of direct address commands specifying ablation parameters for a plurality of discrete ablation segments at one or more of the plurality of addresses along the bead of the tire;controlling the ablation device to selectively remove tire material from the bead in discrete ablation segments ...

LASER WELDING METHOD

Laser welding is performed while moving irradiation positions of a laser beam and a measurement beam in forward, rightward, rearward and leftward directions, and the penetration depth of a weld portion is measured during laser welding in each of the directions. Then, a direction in which a value smaller than a reference value is measured is determined to be an optical axis deviation direction, and a correction value is added to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction. 1. A laser welding method for welding a weld portion by using a laser beam , the method comprising:emitting, to the weld portion, the laser beam and a measurement beam coaxially aligned with the laser beam, the measurement beam having a wavelength different from a wavelength of the laser beam;performing laser welding while moving an irradiation position of the laser beam and an irradiation position of the measurement beam in at least a first direction, a second direction opposite to the first direction, a third direction crossing the first direction, or a fourth direction opposite to the third direction;measuring a penetration depth of the weld portion in accordance with the measurement beam reflected on the weld portion during the laser welding;determining an optical axis deviation direction in which an optical axis of the measurement beam deviates from the laser beam, by relatively comparing a plurality of values measured; andadding a predetermined correction value to the values measured during the laser welding when the laser welding is performed in the optical axis deviation direction.2. The laser welding method of claim 1 , whereinin the determining of the optical axis deviation direction, the plurality of values measured are compared with a predetermined reference value, and a direction in which a value smaller than the reference value is measured is determined to be the optical axis deviation direction.3. The laser ...

COMPOSITIONAL MODIFICATION OF GLASS ARTICLES THROUGH LASER HEATING AND METHODS FOR MAKING THE SAME

Glass articles and methods for modifying a composition of a surface portion of the glass article are disclosed. The method includes heating the surface portion of the glass article with a laser beam to a temperature within a range of about 1100?C to about 2200?C such that the heating evaporates one or more metalloids and/or one or more alkali metals present at the surface portion, and modifies the composition of the surface portion such that the surface portion has a lower alkali metals concentration and/or a lower metalloids concentration as compared to a portion of the glass article that is not heated by the laser beam. 1. A method of modifying a composition of a surface portion of a glass article , the method comprising heating the surface portion of the glass article with a laser beam to a temperature within a range of about 1100° C. to about 2200° C. , such that the heating evaporates one or more metalloids and/or one or more alkali metals present at the surface portion , and modifies the composition of the surface portion such that the surface portion comprises a lower alkali metals concentration and/or a lower metalloids concentration as compared to a portion of the glass article that is not heated by the laser beam.2. The method of claim 1 , further comprising preheating the glass article to a temperature within a range of about 50° C. to about 900° C. before heating the surface portion of the glass article with the laser beam.3. The method of claim 1 , wherein heating the surface portion of the glass article with the laser beam comprises scanning the laser beam along the surface portion of the glass article using a rotating polygon mirror.4. The method of any one of claim 1 , wherein the laser beam has a scan frequency within a range of about 10 kHz to about 100 Hz.5. The method of any one of claim 1 , wherein the laser beam is focused on the surface portion of the glass article using an f-theta lens.6. The method of any one of claim 1 , wherein the laser ...

METHOD FOR STRUCTURING A TRANSPARENT SUBSTRATE WITH A LASER IN A BURST MODE

Method for structuring a top surface of a transparent substrate, the substrate being transparent to visible light with a laser source able to emit a laser beam in a burst mode, the burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time; wherein each of the sets of laser pulses of the train of pulses comprises a first and second pulses with a time interval between them comprised between 5 ns to 50 ns, preferably between 10 ns to 40 ns, and more preferably about 25 ns; wherein each of the first and second pulses has an energy density on the top surface comprised between 0.5 nJ/umand 50 nJ/um; and wherein the train of pulses is able to structure the top surface. 1. A method for structuring a top surface of a transparent substrate , said substrate being transparent to visible light , the method comprising the steps of:(a) providing said transparent substrate with said top surface;(b) providing a laser machining device comprising a laser source able to emit a laser beam in a burst mode, said burst mode being characterized by a train of pulses comprising sets of laser pulses repeated over time; wherein said laser source is a femtosecond laser source;', 'wherein each of said sets of laser pulses of said train of pulses comprises a first and second pulse with a time interval between them between 5 ns to 50 ns;', {'sup': 2', '2, 'wherein each of said first and second pulses has an energy density on said top surface between 0.5 nJ/umand 50 nJ/um; and'}, 'wherein said train of pulses is configured to structure said top surface., '(c) using said laser source for irradiating said transparent substrate from the top surface with a laser beam according to said burst mode;'}2. The method according to further comprising claim 1 , before step (c) claim 1 , the additional step of:determining an ablation threshold of said transparent substrate being defined by an energy density per pulse;wherein said first and second pulses have an energy ...

METHOD AND DEVICE FOR MACHINING A ROTARY TOOL WITH A PLURALITY OF CUTTING BODIES

A rotary tool () working surface () includes a plurality of cutting bodies (). The rotary tool () can be driven about a rotational axis (R). The actual enveloping surface (HF) of the working surface () is ascertained by an optical measuring arrangement (). At least one other target variable (GS) is detected, which describes a microscopic parameter of the working surface (). The actual variable (GI) corresponding to each specified target variable (GS) is detected by the measuring arrangement (), and the deviation between the target variable (GS) and the actual variable (GI) is determined. If the actual enveloping surface (HF) lies outside of a specified target enveloping area (HR) or if a deviation (D) between an actual variable (GI) and the corresponding target variable (GS) is unacceptably large, selected first and/or second cutting bodies () are machined and/or removed by a laser device (). 12124. A method for machining a rotationally drivable rotary tool () comprising a plurality of cutting bodies () , which form at least one tool blade or a cutting area , the method comprising:{'b': 21', '21, 'specifying a target enveloping area (HR) for the rotary tool () about a rotational axis (R) of the rotary tool (),'}{'b': '24', 'i': 'a', 'determining one or more first cutting bodies (), which are to be machined and/or removed, having a position or shape that lies outside of specified tolerances,'}{'b': 24', '24, 'i': a', 'b, 'systematically machining and/or removing the first cutting bodies () and second cutting bodies ().'}2. The method according to further comprising:{'b': 21', '24', '24, 'specifying at least one further target variable (GS), which determines a cutting characteristic of the rotary tool () and which characterizes an individual cutting body () and/or a group of cutting bodies (),'}{'b': 24', '24, 'determining an actual variable (GI) for individual ones of the specified target variables (GS) of an individual cutting body () and/or a group of cutting ...

INSPECTING METHOD FOR INSPECTING INFLUENCE OF INSTALLATION ENVIRONMENT UPON PROCESSING APPARATUS

A method for inspecting the influence of an installation environment upon a processing apparatus includes setting a mark for specifying a relative positional relation between a chuck table and a processing unit, imaging the mark plural times by using an imaging unit when a moving unit is at rest, and detecting the position of the mark from an image and then determining whether or not the influence of the installation environment upon the processing apparatus is present based on whether the change in position of the mark is less than or more than a threshold. 1. An inspecting method for inspecting the influence of an installation environment upon a processing apparatus including a chuck table for holding a workpiece , a processing unit processing said workpiece held on said chuck table , moving mechanism for relatively moving said chuck table and said processing unit , and an imaging unit fixed to said processing unit to image said workpiece held on said chuck table , said inspecting method comprising:a mark setting step of setting a mark for specifying a relative positional relation between said chuck table and said processing unit;an imaging step of imaging said mark plural times by using said imaging unit in the condition where said moving mechanism is at rest; anda determining step of detecting the position of said mark from an image obtained by said imaging step and then determining whether or not the influence of said installation environment upon said processing apparatus is present;said determining step being performed in such a manner that when the amount of change in position of said mark is less than a threshold, it is determined that the relative positional relation between said chuck table and said processing unit is not influenced by said installation environment, whereas when the amount of change in position of said mark is greater than or equal to said threshold, it is determined that the relative positional relation between said chuck table and said ...

LIGHT CONTROL FILM FORMED WITH A SECURITY FEATURE

A light control film is described that is formed with at least one security feature therein. The security feature is not visible when the film is viewed at an incorrect angle. The security feature only becomes visible when the film is viewed at the correct viewing angle or range of viewing angles. A plurality of security features can be formed in the film at substantially the same location(s), but at different angles, so that each security feature only becomes visible when the film is viewed at the correct respective viewing angle or range of viewing angles. The light control film can be integrated into any type of document where resistance to counterfeiting and fraudulent alteration are important, such as plastic identification or credit cards, or passports. 1. A light control film having a plurality of micro light control structures formed in the film , and a first security feature formed in the micro light control structures , wherein the light control film is generally transparent or translucent at a primary viewing angle , the first security feature is not visible when the light control film is viewed at a first viewing angle , and the first security feature is visible when the light control film is viewed at a correct viewing angle or range of viewing angles.2. The light control film of claim 1 , further comprising a second security feature formed in the micro light control structures located in generally the same area and/or adjacent to the first security feature claim 1 , wherein the film is generally transparent or translucent at the primary viewing angle claim 1 , the second security feature is not visible when the light control film is viewed at the first viewing angle claim 1 , and the second security feature is visible when the light control film is viewed at a correct viewing angle or range of viewing angles claim 1 , the correct viewing angle or range of viewing angles at which the second security feature is visible is different than or the same as ...

METHOD FOR THE VACUUM LASER WELDING OF AN AT LEAST TWO-PART WORKPIECE

A method for the vacuum laser welding of an at least two-part workpiece includes a workpiece or a workpiece carrier, on which the workpiece is arranged, and a welding mask which are moved relatively toward one another and pressed against one another so that a welding chamber is enclosed and sealed in a gas-tight manner. The welding mask is rotatably mounted. The welding chamber is evacuated and an annular connecting region between at least two workpiece parts of the workpiece that is exposed to the vacuum in the welding chamber is welded by a laser beam. The workpiece or the workpiece carrier together with the workpiece and the welding mask are turned in relation to the welding mask holder. Air is admitted to the welding chamber and the workpiece or the workpiece carrier on which the workpiece is arranged and the welding mask are moved relatively away from one another. 1. A method for the vacuum laser welding of an at least two-part workpiece , the method comprising the steps of:(a) providing a workpiece or a workpiece carrier on which the workpiece is arranged, and providing a welding mask rotatably mounted in a welding mask holder;(b) forming a welding chamber that is enclosed and sealed in a gas-tight manner by moving the workpiece or the workpiece carrier and the welding mask relatively toward one another and pressing against one another;(c) evacuating the welding chamber;(d) welding by a laser beam an annular connecting region between at least two workpiece parts of the workpiece that is exposed to the vacuum in the welding chamber, wherein the laser beam propagates through the welding chamber, and wherein the workpiece or the workpiece carrier together with the workpiece and the welding mask are turned in relation to the welding mask holder;(e) admitting air to the welding chamber; and(f) moving the workpiece or the workpiece carrier on which the workpiece is arranged and the welding mask relatively away from one another.2. The vacuum laser welding method as ...

LASER WELDING APPARATUS AND LASER WELDING METHOD

A laser welding apparatus generates laser by a laser oscillator, converges the laser by a condenser lens, and applies the laser to an upper sheet and a lower sheet superposed together so as to weld the upper sheet and the lower sheet to each other. According to this apparatus, by laser irradiation, a melt pool Y is formed in the upper sheet and the lower sheet superposed together. Furthermore, by laser irradiation, the melt pool Y is caused to flow, and the upper sheet and the lower sheet are welded together. 1. A laser welding apparatus for welding a plurality of sheets adjacent to each other , comprising:a laser oscillator that generates laser; anda condenser lens that converges the laser,wherein the laser welding apparatus is configured to weld the plurality of sheets together by applying the laser to a first side of a first sheet from among the plurality of sheets so as to form a melt pool which penetrates completely through at least the first sheet, and applying the laser to the melt pool so that the melt pool flows.wherein the laser welding apparatus is further configured to scan the laser on the melt pool so as to cause a circumferential flow of the melt pool and to cause undulation in the flowing melt pool thereby gathering the melt pool due to surface tension generated in the melt pool, andwherein the undulation includes a portion of the melt pool extending away from the first sheet on a second side of the first sheet opposite the first side.2. The laser welding apparatus according to claim 1 , whereinthe laser welding apparatus is configured to cause the melt pool to flow by scanning the laser applied to the melt pool, by driving the condenser lens.3. The laser welding apparatus according to claim 1 , further comprisinga jig that is drivable while holding the plurality of sheets, whereinthe laser welding apparatus is configured to cause the melt pool to flow by scanning the laser applied to the melt pool, by driving the jig.4. The laser welding apparatus ...

APPARATUS AND METHOD FOR BEAM DIAGNOSIS ON LASER PROCESSING OPTICS

Apparatus for determining geometrical parameters of a laser beam includes an optical system, a device for output coupling radiation, a beam diagnostic device, and a reflector element. The optical system focuses the laser beam into a processing region. The device for output coupling radiation couples out radiation that runs through the optical system in a direction opposite to a direction of the laser beam. The reflector element has a first surface which is partially reflecting and curved, where the curvature is equal to a mean curvature of a wave front of the laser beam in a positioning region of the reflector element. 1. An apparatus for determining geometrical parameters of a laser beam , comprising:an optical system configured to focus the laser beam into a processing region,a device for output coupling of radiation that travels in a direction opposite to a direction of travel of the laser beam through the optical system,a beam diagnostic device, anda first reflector element with a first surface,wherein the first reflector element is placeable in a positioning region between the optical system and the processing region,wherein the first surface of the first reflector element is partially reflecting and is curved,wherein a curvature of the first surface is equal to a mean curvature of a wave front of a focused laser beam in the positioning region of the first reflector element, andwherein the focused laser beam is focused by the optical system.2. The apparatus according to claim 1 , wherein the first surface of the first reflector element is set concentrically to the wave front of the focused laser beam.3. The apparatus according to claim 1 , wherein a center of curvature of the first surface of the first reflector element is set to a target position of a laser beam focus of the focused laser beam.4. The apparatus according to claim 1 , further comprising a positioning apparatus claim 1 , wherein the first reflector element is coupled to the positioning apparatus ...

LASER-PROCESSING APPARATUS, METHODS OF OPERATING THE SAME, AND METHODS OF PROCESSING WORKPIECES USING THE SAME

Numerous embodiments are disclosed. In one, a laser-processing apparatus includes a positioner arranged within a beam path along which a beam of laser energy is propagatable. A controller may be used to control an operation of the positioner to deflect the beam path within first and second primary angular ranges, and to deflect the beam path to a plurality of angles within each of the first and second primary angular ranges. In another, an integrated beam dump system includes a frame; and a pickoff mirror and beam dump coupled to the frame. In still another, a wavefront correction optic includes a mirror having a reflective surface having a shape characterized by a particular ratio of fringe Zernike terms Z4 and Z9. Many more embodiments are disclosed. 1. A laser-processing apparatus , comprising:a laser source operative to generate a beam of laser energy, wherein the beam of laser energy is propagatable along a beam path;a first positioner arranged within the beam path, wherein the first positioner is operative to deflect the beam path; anda controller coupled to the first positioner,wherein the controller is configured to control an operation of the first positioner to deflect the beam path within a first primary angular range and within a second primary angular range, wherein the second primary angular range does not overlap the first angular range and is not contiguous with the first primary angular range, andwherein the controller is further configured to control an operation of the first positioner to deflect the beam path to a first plurality of angles within the first primary angular range and to a second plurality of angles within second primary angular range.2. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a wavelength in the ultraviolet (UV) range of the electromagnetic spectrum.3. The apparatus of claim 1 , wherein the laser source is operative to generate a beam of laser energy having a ...

LASER WELDING OF METAL PIN PAIRS WITH TIME-DEPENDENT SCAN PATTERN AND ENERGY INPUT

A method for laser welding a pair of metal pins delivers a laser beam to a work-side of the pair of metal pins where a respective pair of surfaces of the metal pins are adjacent to each other and face in the same direction. The laser beam first traces a first path on the work-side to form a melt pool by keyhole welding. The first path crosses an interface between the metal pins. After tracing the first path, the laser beam is switched to trace a second path on the work-side with the laser beam at a delivered rate of energy per unit path length that is less than the one used for the first path. The second path crosses the interface and is within the first path. The method is well-suited for welding of hairpin and I-pin stators. 1. A method for laser welding a pair of metal pins , comprising the steps of:delivering a laser beam to a work-side of the pair of metal pins where a respective pair of surfaces of the metal pins are adjacent to each other and face in the same direction;tracing a first path on the work-side with the laser beam at a first delivered rate of energy per unit path length to form a melt pool by keyhole welding, the first path crossing an interface between the metal pins; andafter the tracing a first path step, tracing a second path on the work-side with the laser beam at a second delivered rate of energy per unit path length that is at most ⅔ of the first delivered rate of energy per unit path length, the second path crossing the interface and being within the first path.2. The method of claim 1 , comprising switching from the tracing a first path step to the tracing a second path step before a depth-to-width aspect ratio of a keyhole of the keyhole welding reaches a value of three.3. The method of claim 2 , further comprising keeping the depth-to-width aspect ratio at less than three throughout the tracing a first path step and the tracing a second path step.4. The method of claim 2 , further comprising keeping the depth-to-width aspect ratio at ...

METHOD AND SYSTEM FOR HEATING AN OBJECT USING AN ENERGY BEAM

A method of heating a portion of an object includes the steps of 1. A method of heating at least one selected portion of an object , the method including the following steps:projecting, with a device comprising a scanner, an energy beam onto a surface of the object so as to produce a primary spot on the surface, and repetitively scanning the beam in two dimensions in accordance with a scanning pattern so as to establish an effective spot on the surface, the effective spot having a two-dimensional energy distribution,displacing the effective spot in relation to the surface of the object to progressively heat the at least one selected portion of the object, wherein displacing the effective spot in relation to the surface of the object comprises displacing the effective spot following a track featuring at least one change of direction;whereinthe method includes maintaining the effective spot aligned with the track by modifying operation of the scanner in correspondence with the at least one change of direction.2. The method according to claim 1 , wherein the step of maintaining the effective spot aligned with the track is carried out without pivoting the device around any axis for the purpose of aligning the effective spot with the track.3. The method according to claim 1 , wherein the step of modifying operation of the scanner is carried out so as to turn the effective spot around an axis substantially aligned with the energy beam claim 1 , without turning the device and without turning the object around any axis substantially aligned with the energy beam.4. The method according to claim 1 , wherein the track extends in a plane claim 1 , and wherein the step of modifying operation of the scanner is carried out so as to turn the effective spot around an axis substantially perpendicular to the plane claim 1 , without turning the device and without turning the object around any axis substantially perpendicular to the plane.5. The method according to claim 1 , including ...

METHOD OF PREPARING AN ALUMINUM METAL PIECE FOR WELDING

A method of preparing aluminum metal pieces for welding, along with welded sheet metal assemblies formed from the prepared aluminum metal pieces. In one embodiment, a scanning beam of a laser is directed at an edge portion of the sheet metal piece such that a portion of the scanning beam is configured to impact an oxide layer at the edge portion. The laser is pulsed in a series of ablating pulses at the edge portion, with the ablating pulses creating an ablation plume that includes ablated material from the oxide layer of the primary surface and the peripheral surface of the edge portion. The ablation plume is analyzed, and ablation and analyzing continues until a threshold of at least one constituent in the ablation plume or the analysis plume is met or exceeded. One or more operating parameters of the laser are adjusted based on the analysis of the ablation plume or analysis plume. In some embodiments, two aluminum metal pieces are simultaneously prepared. 1. A method of preparing an aluminum metal piece for welding , the aluminum metal piece having an oxide layer , the method comprising the steps of:directing a beam of a laser at an edge portion of the aluminum metal piece such that a portion of the beam is configured to impact the oxide layer at the edge portion, wherein the edge portion includes at least a part of a primary surface of the aluminum metal piece, at least a part of a secondary surface of the aluminum metal piece, and at least a part of a peripheral surface of the aluminum metal piece, the peripheral surface being situated between the primary surface and the secondary surface;pulsing the laser in a series of cleaning pulses at the edge portion, wherein the cleaning pulses create a cleaning plume that includes ablated material from the oxide layer located at the primary surface and ablated material from the oxide layer located at the peripheral surface;analyzing the cleaning plume for the series of cleaning pulses or analyzing an analysis plume ...

Laser machining method and apparatus

A method of delivering a beam of laser-radiation to a workpiece for processing the workpiece comprises transmitting the beam twice through an acousto-optic modulator (AOM) crystal in opposite zero-order directions of the AOM at separate locations on the AOM crystal, before delivering the beam to the workpiece.

Chamber Systems For Additive Manufacturing

A method of additive manufacture is disclosed. The method may include creating, by a 3D printer contained within an enclosure, a part having a weight greater than or equal to 2,000 kilograms. A gas management system may maintain gaseous oxygen within the enclosure atmospheric level. In some embodiments, a wheeled vehicle may transport the part from inside the enclosure, through an airlock, as the airlock operates to buffer between a gaseous environment within the enclosure and a gaseous environment outside the enclosure, and to a location exterior to both the enclosure and the airlock. 1. A method of additive manufacture , the method comprising:operating a manufacturing facility comprising a first enclosure, a first machine contained within the first enclosure, a first gas management system, and an airlock, the airlock comprising an interior, a first door interfacing between the interior of the airlock and an interior of the first enclosure, and a second door interfacing between the interior of the airlock and an area exterior to the first enclosure;creating, by the first machine during the operating, a first part via a first process comprising additive manufacture using an energy beam to amalgamate selected portions of a powder located within the first enclosure;maintaining, by the first gas management system during the creating, gaseous oxygen within the first enclosure below atmospheric levels;transporting the first part from inside the first enclosure, through the airlock as the airlock operates to buffer between a gaseous environment within the first enclosure and a gaseous environment outside the first enclosure, and to the area; andcontinuously supporting the first part during the transporting.2. The method of claim 1 , wherein:the first part has a weight; andthe continuously supporting comprises continuously supporting, by a vehicle, conveyor system, railway, or belt during the transporting, the weight of the first part from inside the first enclosure, ...

LASER BEAM POSITIONING SYSTEM, LASER PROCESSING DEVICE AND CONTROL METHOD

A method is provided of controlling a laser processing device with at least one laser. The method includes setting an optical path of the laser processing device by at least one rotatable mirror; a first triggering of the laser at a first point in time so as to generate a first laser spot; continuously adjusting, the optical path of the laser processing device; and a second triggering of the laser at a second point in time so as to generate a second laser spot. The method also includes, before the second triggering: determining the second point in time so that the position of the second laser spot has a desired distance, along the path, to the position of the first laser spot. 1. A method of controlling a laser processing device having at least one laser , comprising:setting an optical path of the laser processing device by at least one deflection element, including at least one rotatable mirror, so that a path point which can be generated by a laser beam following the optical path lies on a desired path on or in an object;a first triggering of the laser at a first point in time so as to generate a first laser spot;adjusting, in particular continuously adjusting, the optical path of the laser processing device by the at least one rotatable mirror, so that a path point which can be generated by the laser beam following the optical path lies on the desired path;a second triggering of the laser at a second point in time so as to generate a second laser spot;wherein the method comprises the following step before the second triggering:determining the second point in time on the basis of at least one of a target position, a first or a higher time derivative thereof, and a first or a higher time derivative of an actual position of the path point of the optical path along the desired path, so that a position of the second laser spot has a desired distance, along the desired path, to a position of the first laser spot.2. The method according to claim 1 , wherein the second ...

RECHARGEABLE BATTERY AND MANUFACTURING METHOD THEREOF

A rechargeable battery and a manufacturing method of the same are provided, which can aid in preventing an electric short from occurring between electrode plates by forming a cutting portion of each on the electrode plates in the shape of a curved surface or a bead having a uniform thickness and/or a diameter sufficient to prevent or substantially prevent the cutting portion from piercing a separator separating the electrode plates from each other. In a present embodiment, the electrode assembly includes an electrode plate having a current collector plate, a coating portion having an electrically active material coated on the current collector plate, a non-coating portion formed at an edge of the current collector plate and not coated with the electrically active material, a cutting portion inwardly formed from the non-coating portion, and a curved portion formed along the cutting portion in a thickness direction of the non-coating portion. 1. A rechargeable battery comprising:a case;an electrode assembly in the case; anda terminal electrically connected to the electrode assembly and passing through the case, an electrode plate comprising a current collector plate,', 'a coating portion having an electrically active material coated on the current collector plate,', 'a non-coating portion formed at an edge of the current collector plate and not coated with the electrically active material,', 'a cutting portion inwardly formed from the non-coating portion, and', 'a curved portion formed along the cutting portion in a thickness direction of the non-coating portion., 'wherein the electrode assembly comprises'}2. The rechargeable battery of claim 1 , wherein the curved portion has a circular or oval section perpendicular to a lengthwise direction of the cutting portion.3. The rechargeable battery of claim 1 , wherein each of the cutting portion and the curved portion is bent at least one time.4. The rechargeable battery of claim 1 , wherein each of the cutting portion and ...