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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 14. Отображено 14.
07-03-2013 дата публикации

BARRIER LAYER DIELECTRIC FOR RFID CIRCUITS

Номер: US20130056537A1
Принадлежит: E. I. DU PONT DE NEMOURS AND COMPANY

This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.

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21-03-2013 дата публикации

THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS

Номер: US20130068512A1
Принадлежит: EI DU PONT DE NEMOURS AND COMPANY

This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. 2. The polymer thick film conductive composition of claim 1 , further comprising:(d) 1-20 wt % of a third organic solvent, wherein the third organic solvent is diacetone alcohol and wherein the weight percent is based on the total weight of said polymer thick film conductive composition.3. The polymer thick film conductive composition of or claim 1 , wherein said silver is in the form of silver flakes.4. The polymer thick film conductor composition of claim 3 , wherein said thermoplastic urethane resin is a urethane homopolymer or a polyester-based copolymer5. The polymer thick film conductive composition of claim 4 , wherein said thermoplastic urethane resin is a polyester-based copolymer.65. A capacitive switch circuit comprising a conductor formed from the dried polymer thick film conductive composition of any of -.7. The capacitive switch circuit of claim 6 , wherein said capacitive switch circuit is thermoformed.8. The capacitive switch circuit of claim 6 , further comprising a dried encapsulant layer covering said dried polymer thick film conductive composition claim 6 , said dried encapsulant layer comprising the same polymers in the same ratios as present in said PTF silver composition.9. The capacitive switch circuit of claim 8 , wherein said capacitive switch circuit is thermoformed.105. A thermoformed electrical circuit comprising a conductor formed by the dried polymer thick film conductive composition of any of - and a dried ...

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19-05-2015 дата публикации

Photonic sintering of polymer thick film conductor compositions

Номер: US0009034417B2

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.

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05-11-2013 дата публикации

Polymer thick film encapsulant and enhanced stability PTC carbon system

Номер: US0008575260B2

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.

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27-10-2011 дата публикации

POLYMER THICK FILM ENCAPSULANT AND ENHANCED STABILITY PTC CARBON SYSTEM

Номер: US20110263781A1
Принадлежит: E. I. DU PONT DE NEMOURS AND COMPANY

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.

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22-03-2012 дата публикации

POLYMER THICK FILM ENCAPSULANT AND ENHANCED STABILITY PTC CARBON SYSTEM

Номер: US20120067867A1
Принадлежит: E. I. DU PONT DE NEMOURS AND COMPANY

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and , in particular, in PTC heater circuitry in mirror heater and seat heater applications.

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10-01-2012 дата публикации

Polymer thick film encapsulant and enhanced stability PTC carbon system

Номер: US0008093328B2

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.

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21-02-2017 дата публикации

Polymer thick film positive temperature coefficient carbon composition

Номер: US0009573438B2
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY, DU PONT

The invention is directed to a polymer thick film positive temperature coefficient carbon resistor composition consisting essentially of: (a) organic medium consisting of: (i) a fluoropolymer resin consisting of a copolymer of vinylidene difluoride and hexafluoropropylene; and (ii) an organic solvent consisting of triethyl phosphate; and (b) conductive carbon powder. The composition may be processed at a time and temperature necessary to remove all solvent. The invention is further directed to positive temperature coefficient (PTC) circuits comprising the composition of the invention which has been dried to remove the solvent and to articles, e.g., mirror heaters and seat heaters, containing such PTC circuits as well as a method for making such PTC circuits.

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20-02-2014 дата публикации

PHOTONIC SINTERING OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS

Номер: US20140048751A1
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. 1. A method for forming an electrical conductor in an electrical circuit , comprising:a) providing a substrate;b) providing a polymer thick film conductor composition selected from the group consisting of a polymer thick film solder alloy conductor composition, a polymer thick film solder alloy/metal conductor composition, and mixtures thereof;c) applying said thick filmconductor composition onto said substrate; andd) subjecting said thick film conductor composition to photonic sintering to form said electrical conductor.2. The method of claim 1 , said method further comprising a step of drying said thick film conductor composition claim 1 , wherein said step of drying is carried out following step (c) but before step (d).3. The method of claim 1 , wherein said polymer thick film conductor composition is a polymer thick film solder alloy conductor composition comprising:{'sup': '2', '(a) 65 to 95 wt % solder alloy powder consisting of tin, silver, and copper and possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.2 to 1.3 m/g; dispersed in'} 'wherein the wt % are based on the total weight of the polymer thick film solder alloy conductor composition.', '(2) organic solvent comprising a dibasic ester;'}, '(i) a vinyl co-polymer resin of vinylidene chloride and acrylonitrile, dissolved in'}, '(b) 5 to 35 wt % organic medium comprising'}4. The method of claim 2 , ...

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16-10-2014 дата публикации

POLYMER THICK FILM POSITIVE TEMPERATURE COEFFICIENT CARBON COMPOSITION

Номер: US20140305923A1
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

The invention is directed to a polymer thick film positive temperature coefficient carbon resistor composition consisting essentially of; 1. A polymer thick film positive temperature coefficient carbon resistor composition , consisting essentially of: (i) a fluoropolymer resin consisting of a copolymer of vinylidene difluoride and hexafluoropropylene; and', '(ii) an organic solvent consisting of triethyl phosphate, wherein the fluoropolymer resin is 10 to 50 weight percent of the total weight of the organic medium and is dissolved in the organic solvent; and, '(a) 50 to 99 weight percent organic medium, consisting of(b) 1 to 50 weight percent conductive carbon powder, wherein the conductive carbon powder is dispersed in the organic medium and wherein the weight percent of the organic medium and the conductive carbon powder are based on the total weight of the polymer thick film positive temperature coefficient carbon resistor composition.2. The polymer thick film positive temperature coefficient carbon resistor composition of claim 1 , wherein the conductive carbon powder is conductive carbon black powder.3. The polymer thick film positive temperature coefficient carbon resistor composition of claim 1 , wherein the fluoropolymer resin is 30 to 40 weight percent of the total organic medium.4. The polymer thick film positive temperature coefficient carbon resistor composition of claim 1 , wherein the organic medium is 80 to 95 weight percent of the total polymer thick film positive temperature coefficient carbon resistor composition.5. A positive temperature coefficient circuit comprising the polymer thick film positive temperature coefficient carbon resistor composition of claim 1 , wherein the polymer thick film positive temperature coefficient carbon resistor composition has been dried to remove the solvent.6. The positive temperature circuit of claim 5 , wherein the conductive carbon powder is carbon black powder.7. An article containing the positive temperature ...

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14-03-2013 дата публикации

Barrier layer dielectric for rfid circuits

Номер: WO2013036369A1
Принадлежит: E. I. DU PONT DE NEMOURS AND COMPANY

This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.

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16-07-2014 дата публикации

Barrier layer dielectric for rfid circuits

Номер: EP2754202A1
Принадлежит: EI Du Pont de Nemours and Co

This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.

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27-10-2011 дата публикации

Polymer thick film encapsulant and enhanced stability ptc carbon system

Номер: WO2011133614A1
Принадлежит: E. I. DU PONT DE NEMOURS AND COMPANY

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, inparticular, in PTC heater circuitry in mirror heater and seat heater applications.

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27-02-2013 дата публикации

Polymer thick film encapsulant and enhanced stability ptc carbon system

Номер: EP2561017A1
Принадлежит: EI Du Pont de Nemours and Co

The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, inparticular, in PTC heater circuitry in mirror heater and seat heater applications.

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