20-02-2014 дата публикации
Номер: US20140048751A1
This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. 1. A method for forming an electrical conductor in an electrical circuit , comprising:a) providing a substrate;b) providing a polymer thick film conductor composition selected from the group consisting of a polymer thick film solder alloy conductor composition, a polymer thick film solder alloy/metal conductor composition, and mixtures thereof;c) applying said thick filmconductor composition onto said substrate; andd) subjecting said thick film conductor composition to photonic sintering to form said electrical conductor.2. The method of claim 1 , said method further comprising a step of drying said thick film conductor composition claim 1 , wherein said step of drying is carried out following step (c) but before step (d).3. The method of claim 1 , wherein said polymer thick film conductor composition is a polymer thick film solder alloy conductor composition comprising:{'sup': '2', '(a) 65 to 95 wt % solder alloy powder consisting of tin, silver, and copper and possessing an average particle size of 2 to 18 μm and a surface area/mass ratio in the range of 0.2 to 1.3 m/g; dispersed in'} 'wherein the wt % are based on the total weight of the polymer thick film solder alloy conductor composition.', '(2) organic solvent comprising a dibasic ester;'}, '(i) a vinyl co-polymer resin of vinylidene chloride and acrylonitrile, dissolved in'}, '(b) 5 to 35 wt % organic medium comprising'}4. The method of claim 2 , ...
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