28-09-2017 дата публикации
Номер: US20170277054A1
A carrier for two-component developer includes a magnetic particle and a resin coating layer that covers the magnetic particle and contains a resin, wherein a weight average molecular weight of the resin contained in the resin coating layer is from 1,800,000 to 5,000,000. 1. A carrier for two-component developer comprising:a magnetic particle; anda resin coating layer that covers the magnetic particle and contains a resin,wherein a weight average molecular weight of the resin is from 1,800,000 to 5,000,000.2. The carrier for two-component developer according to claim 1 , wherein the resin contained in the resin coating layer is selected from the group consisting of polyethylene claim 1 , polypropylene claim 1 , polystyrene claim 1 , polyvinyl ether claim 1 , polyvinyl ketone claim 1 , styrene-acrylic acid copolymer claim 1 , acrylic resin claim 1 , silicone resin claim 1 , fluorine resin claim 1 , polyester claim 1 , polycarbonate claim 1 , phenol resin claim 1 , and epoxy resin.3. The carrier for two-component developer according to claim 1 , wherein the resin contained in the resin coating layer is a homopolymer or a copolymer of cycloalkyl methacrylate.4. The carrier for two-component developer according to claim 1 , wherein a glass transition temperature (Tg) of the resin contained in the resin coating layer is from 50° C. to 150° C.5. The carrier for two-component developer according to claim 1 , wherein the resin coating layer contains resin particles.6. The carrier for two-component developer according to claim 5 , wherein a volume average particle diameter of the resin particles is in a range of 50 nm to 500 nm.7. The carrier for two-component developer according to claim 5 , wherein a weight average molecular weight of the resin particles is from 1 claim 5 ,800 claim 5 ,000 to 5 claim 5 ,000 claim 5 ,000.8. The carrier for two-component developer according to claim 1 , wherein the resin coating layer contains resin particles selected from thermosetting ...
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