17-01-2013 дата публикации
Номер: US20130015589A1
Принадлежит:
A multi-die semiconductor device is disclosed. The device may include one or more first-sized die on a substrate and one or more second-sized die affixed over the one or more first-sized die. The second-sized die may have a larger footprint than the first-sized die. An internal molding compound may be provided on the substrate having a footprint the same size as the second-sized die. The second-sized die may be supported on the internal molding compound. Thereafter, the first and second-sized die and the internal molding compound may be encapsulated in an external molding compound. 1. A semiconductor device , comprising:a substrate;one or more first-sized die mounted and electrically coupled to the substrate;an internal molding compound formed on the substrate;one or more second-sized die mounted on the internal molding compound and electrically coupled to the substrate, the second-sized die having at least one edge overhanging an edge of the first-sized die, the overhanging edge of the second-sized die supported on the internal molding compound; andan external molding compound formed around the one or more first-sized die, the one or more second-sized die and the internal molding compound.2. The semiconductor device of claim 1 , wherein the internal molding compound is a single block of molding compound having a same footprint as the second-sized die.3. The semiconductor device of claim 1 , wherein the internal molding compound is two or more blocks of molding compound which together have a same footprint as the second-sized die.4. The semiconductor device of claim 1 , wherein the internal molding compound is one or more blocks of molding compound which together have a footprint larger than a footprint of the second-sized die.5. The semiconductor device of claim 1 , wherein the internal molding compound is one or more blocks of molding compound which together have a footprint smaller than a footprint of the second-sized die.6. The semiconductor device of claim 1 , ...
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