08-07-2021 дата публикации
Номер: US20210210361A1
A base plate for cooling a power electronics device is provided, the base plate comprising cooling fins, the base plate configured to receive the power electronics device directly above the cooling fins, the cooling fins integral to the base plate, the base plate configured to conduct a liquid coolant past the cooling fins 1. A method of manufacturing a base plate for a semiconductor , method comprising:forming a plurality of pieces of the base plate from a metal sheet by etching openings in the metal sheet, wherein after etching, a first set of the pieces comprises a plurality of cooling fins and a second set of the pieces comprises openings for passages;stacking the pieces such that each of the pieces comprising the cooling fins is adjacent to a corresponding one of the pieces comprising openings for the passages; andbonding the stacked pieces together to form the base plate or a portion thereof, the cooling fins and the passages between the cooling fins being integral to, and included within, the base plate.2. The method of wherein the bonding is diffusion bonding.3. A method of manufacturing a base plate for a semiconductor claim 1 , method comprising:forming a plurality of pieces of the base plate from a metal sheet by etching openings in the metal sheet, wherein after etching, the pieces comprise a plurality of cooling fins;etching a portion of each of the cooling fins to form a corresponding passage adjacent to the respective one of the cooling fins;stacking the pieces; andbonding the stacked pieces together to form the base plate or a portion thereof, the cooling fins and the passages between the cooling fins being integral to, and included within, the base plate.4. A system for cooling a power electronics device claim 1 , the system comprising: a base plate including cooling fins claim 1 , the base plate configured to receive the power electronics device directly above the cooling fins claim 1 , the cooling fins integral to the base plate claim 1 , the base ...
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