Deposition Substrate Temperature and Monitoring

An apparatus for depositing a coating on one or more parts ( 21 ) has: a chamber ( 22 ); a part holder ( 64 ) for carrying the part(s); a bias voltage source ( 94 ) coupled to the part(s) to apply a bias voltage to the part(s); a source ( 34 ) of the coating material; a plurality of temperature sensors ( 76 ); and a plurality of leads ( 90 ) passing outputs of the temperature sensors out from the chamber. A temperature monitoring system ( 150 ) has a temperature data processor ( 300 ). At least one fiber optic link ( 223 ) couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.

Wire feed pressure lock system

A pressure lock system passes a wire along a wire path from a wire source at a high pressure first region to a destination at a low pressure second region. The pressure lock system includes a pressure lock chamber. A first conduit has an interior positioned to pass the wire along the path and is mounted for rotation. A second conduit has an interior positioned to pass the wire from the pressure lock chamber and is also mounted for rotation. A motor may drive rotation of the first conduit and the second conduit. Pumps may maintain a pressure of the pressure lock chamber lower than a pressure of the first region.

Deposition substrate temperature and monitoring

An apparatus for depositing a coating on one or more parts ( 21 ) has: a chamber ( 22 ); a part holder ( 64 ) for carrying the part(s); a bias voltage source ( 94 ) coupled to the part(s) to apply a bias voltage to the part(s); a source ( 34 ) of the coating material; a plurality of temperature sensors ( 76 ); and a plurality of leads ( 90 ) passing outputs of the temperature sensors out from the chamber. A temperature monitoring system ( 150 ) has a temperature data processor ( 300 ). At least one fiber optic link ( 223 ) couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.

Deposition Substrate Temperature and Monitoring

The disclosure provides an apparatus for depositing a coating on one or more parts (21). The apparatus has: a chamber (22); a part holder (64) for carrying the part(s); a bias voltage source (94) coupled to the part(s) to apply a bias voltage to the part(s); a source (34) of the coating material; a plurality of temperature sensors (76); and a plurality of leads (90) passing outputs of the temperature sensors out from the chamber. A temperature monitoring system (150) has a temperature data processor (300). At least one fiber optic link (223) couples the temperature data processor to the temperature sensors so as to electrically isolate the temperature data processor from the bias voltage.

Wire Feed Pressure Lock System

A pressure lock system passes a wire along a wire path from a wire source at a high pressure first region to a destination at a low pressure second region. The pressure lock system includes a pressure lock chamber. A first conduit has an interior positioned to pass the wire along the path and is mounted for rotation. A second conduit has an interior positioned to pass the wire from the pressure lock chamber and is also mounted for rotation. A motor may drive rotation of the first conduit and the second conduit. Pumps may maintain a pressure of the pressure lock chamber lower than a pressure of the first region.

Wire feed pressure lock system

A pressure lock system passes a wire (24) along a wire path (504) from a wire source (32) at a high pressure first region (40) to a destination at a low pressure second region (30). The pressure lock system includes a pressure lock chamber (82). A first conduit (160A) has an interior positioned to pass the wire (24) along the path (504) and is mounted for rotation. A second conduit (160B) has an interior positioned to pass the wire (24) from the pressure lock chamber (82) and is also mounted for rotation. A motor (240) may drive rotation of the first conduit (160A) and the second conduit (160B). Pumps (94) may maintain a pressure (P 3 ) of the pressure lock chamber (82) lower than a pressure (P 1 ) of the first region (40).

Monitoring of substrate temperature.