Verdrahtungssubstrat

Ein Verdrahtungssubstrat umfasst ein Substrat mit einem Verdrahtungsmuster und ein linienförmiges Isoliermuster, das auf dem Substrat derart gebildet ist, daß es das Verdrahtungsmuster schneidet und einen Teil des Verdrahtungsmusters für eine Anschlußbereichselektrode definiert. Das Isoliermuster umfasst eine Mehrzahl von linienförmigen Abschnitten, die miteinander verbunden sind, um eine rahmenartige Struktur zu bilden. A wiring substrate includes a substrate having a wiring pattern and a line-shaped insulating pattern formed on the substrate so as to intersect the wiring pattern and define a part of the wiring pattern for a terminal area electrode. The insulating pattern includes a plurality of line-shaped portions connected together to form a frame-like structure.

Multilayered ceramic substrate comprises substrate ceramic layers each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer containing an inorganic material in the non-sintered state and wiring cable

Multilayered ceramic substrate comprises at least two types of substrate ceramic layers (2, 3) each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer (4) containing an inorganic material in the non-sintered state and wiring cable. An Independent claim is also included for the production of a multilayered ceramic substrate comprising preparing a green composite laminate product and calcining the structure.

Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device

In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus

Manufacturing method for electronic device and electronic device

LAMINATED CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To solve the problem that a small edge angle of an external terminal electrode formed by burning a conductive paste increases loss of a laminated ceramic electronic component which is used in high frequency bands. SOLUTION: A burried part 32 of a periheral part of the external terminal electrode 27 expanding into the component 23 formed by the ceramic layer 22 eliminates an influence caused by the small edge angle. COPYRIGHT: (C)2004,JPO ...

SUBSTRATE OUT OF MONOLITHIC CERAMICS, ITS PROCESS OF DESIGN AND MANUFACTURE AND ELECTRONIC DEVICE USING It

Dans un corps d'empilement brut (2) incluant une pluralité de couches brutes de base (11) et une pluralité de couches brutes de restriction de retrait (12) pour former un substrat en céramique monolithique en utilisant un processus sans retrait, les couches brutes de restriction qui sont en contact avec les surfaces principales des couches brutes de base individuelles présentent des épaisseurs différentes de telle sorte qu'une couche brute de restriction relativement plus épaisse soit en contact avec une couche brute de base relativement plus épaisse et qu'une couche brute de restriction relativement plus mince soit en contact avec une couche brute de base relativement plus mince. In a blank stack body (2) including a plurality of base blank layers (11) and a plurality of shrink restriction blank layers (12) for forming a monolithic ceramic substrate using a shrink-free process, the layers Restricted bricks which are in contact with the major surfaces of the individual basic raw layers have different thicknesses so that a relatively thicker restriction layer is in contact with a relatively thicker base coat and relatively thinner restriction layer is in contact with a relatively thinner base coat.

COMPOSITION OUT OF THICK FILM INSULATING AND ELECTRONIC ELECTRONIC CERAMICS ETAPPAREIL DEVICE USING It

Monolithic ceramic substrate and method for making the same

A monolithic ceramic substrate includes a green laminate having a plurality of green functional ceramic layers including a functional ceramic material, green support layers including a ceramic material that does not sinter at a sintering temperature for the green functional ceramic material to prevent shrinkage of the functional ceramic layers, first conductor patterns including a thin-film conductor, and second conductor patterns including a thick-film conductor. The green laminate is fired at the sintering temperature for the green functional ceramic material.

Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus

An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

Mehrlagiges Keramiksubstrat und Verfahren zur Herstellung desselben

Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode

The wiring board includes a substrate (1) with a wiring pattern (4) and a insulating pattern (8) that is formed on the substrate in such a way that it intersects the wiring pattern and defines part of the wiring pattern as a connection region electrode (7). A further insulating pattern may be formed on the substrate, parallel to the first insulating pattern. Independent claims are included for a method of manufacturing a wiring board, a method of manufacturing a wiring pattern, and an electrical device provided with the wiring board.

Zusammensetzung für keramisches Substrat sowie keramischer Bestandteil eines Schaltkreises

SUBSTRATE OUT OF MONOLITHIC CERAMICS, ITS PROCESS OF DESIGN AND DEFABRICATION AND ELECTRONIC DEVICE USING It

Insulating thick film composition, ceramic electronic device and apparatus using the same.

An insulating thick film composition for forming a solder resist layer and for suppressing warping and undulation of a multilayer ceramic substrate provides the substrate with superior electrical characteristics. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the film composition is smaller than that of the powdered ceramic contained in the green ceramic body. A device (1) comprises a multilayer green ceramic substrate (2) with semiconductor device (9) mounted thereon, internal conductive patterns (3) and vias (4) formed therein, internal insulating layer (7) formed of the insulating thick film composition for reinforcing a strength of the ceramic substrate, and surface insulating layers (8) composed of the insulating thick film composition which serve as solder resist layers.

COIL MODULE

Substrate-side wiring electrode patterns , which form a part of a coil electrode , are provided on a wiring substrate , and as a result reductions in the size and profile of a resin insulating layer , in which a coil core is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns , which form a part of the coil electrode , are provided on the wiring substrate , the heat generated by a coil can be efficiently released from the substrate-side wiring electrode patterns to the wiring substrate . Therefore, the heat dissipation property of the coil module can be improved at low cost. 1. A coil module equipped with a coil including a coil core and a coil electrode wound around a periphery of the coil core in a spiral shape , the coil module comprising:a wiring layer provided with a wiring electrode including a one-side coil electrode comprising a part of the coil electrode;a resin insulating layer stacked on one main surface of the wiring layer, having the coil core buried therein and provided with another-side coil electrode comprising a remaining part of the coil electrode;a component provided on the wiring layer and connected to the wiring electrode; anda plurality of columnar connection conductors buried in the resin insulating layer, wherein one end of each of the plurality of columnar connection conductors is exposed at one main surface of the resin insulating layer as an external connection terminal and another end of each of the plurality of columnar connection conductors is connected to the wiring electrode of the wiring layer, wherein the one main surface of the resin insulating layer is located on an opposite side to the wiring layer;wherein the coil electrode comprises the another-side coil electrode of the resin insulating layer ...

Monolithic ceramic substrate manufacturing and designing methods therefor and electronic device

Insulating thick film composition calcined with a ceramic blank used in mobile communication devices consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank

Une composition en film épais isolante (7, 8) pour former une couche de réserve de soudure présentant un degré élevé de positionnement est proposée, laquelle permet d'atténuer le gauchissement et l'ondulation d'un substrat en céramique multicouche et permet de maintenir ses caractéristiques électriques supérieures. La composition en film épais isolante (7, 8) est essentiellement constituée par une céramique pulvérulente qui présente le même système de composition que celui d'une céramique pulvérulente qui est contenue dans une feuille en céramique de base (2), et le diamètre de particule moyen de la céramique pulvérulente de la composition en film épais isolante (7, 8) est inférieur à celui de la céramique pulvérulente qui est contenue dans le corps en céramique de base (2).

PACKAGE STRUCTURE FOR CIRCUIT COMPONENT

PURPOSE: To cut down work manday, reduce cost and improve quality reliability by filling up an insulation adhesive into a recessed section of a circuit device formed by trimming and mounting the device with a printed board. CONSTITUTION: An inner electrode 3 for trimming is trimmed by sand blast by a specified amount so as to obtain a desired capacity value, and an inductance value. A recessed section 5 is formed by trimming on the surface of a circuit device 2. The recessed section 5 of the circuit device 2 is located on the bottom side while the top of the circuit device 2 is fat and smooth, which makes it possible to chuck by an automatic device. A printed board 8 is coated with an insulation adhesive 7. The recessed section 5 is arranged to be on the adhesive 7, which makes it possible to mount the circuit device 1 with the printed board 8 in an attempt to fill the recessed section with the adhesive 7. Therefore, this construction makes it possible to eliminate the work process which ...

MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate having a reliable, three-dimensional wiring conductor without going through each process for forming a through hole in a ceramic green sheet and filling a conductive paste into the through hole. SOLUTION: A conductor in a plane 13 is formed on the ceramic green sheet 11 by using the conductive paste, and then a projecting conductor 14 that should become a through conductor is formed so that it is mounted on the conductor 13 in the plane at least partially. Then, by pressing the ceramic green sheet 11 entirely in a thickness direction along with the projecting conductor 14, the projecting conductor 14 is buried into the ceramic green sheet 11 along with one portion of the conductor 13 in a plane. The processes are repeated, and a plurality of ceramic green sheets are piled up for baking, thus obtaining the multilayer ceramic substrate. COPYRIGHT: (C)2007,JPO&INPIT ...

Multilayer monolithic ceramic substrate has thick boundary green layer in contact with thick base green layer

The substrate includes boundary green layers, which lie in contact with the main surfaces of the individual base green layers, and which have differing thickness, so that there is a relatively thick boundary green layer in contact with a relatively thick base green layer, and there is a relatively thin boundary green layer in contact with a relatively thin base green layer. Independent claims are included for a method of manufacturing a monolithic ceramic substrate, and for a method of designing a monolithic ceramic substrate, and for an electronic device with such a substrate.

Insulating thick film composition calcined with a ceramic blank used in mobile communication devices consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank

Insulating thick film composition calcined with a ceramic blank consists of a first ceramic powder having the same setting system as the second ceramic powder contained in the blank. The average particle diameter of the first ceramic powder is smaller than that of the second powder. Preferred Features: The average particle diameter of the first ceramic powder is 10 % smaller than that of the second powder. The average particle diameter of the second ceramic powder is 0.5-10 microns m and the average particle diameter of the first ceramic powder is 0.45-9 microns m. The thick film composition contains a maximum of 3 % oxide powder of Cr, Co, Cu, Ni, Fe or Ti.

Monolithic ceramic substrate, manufacture and design methods therefor, and device.

A green laminate body includes a plurality of base green layers (3) comprising a low-temperature sinterable ceramic and a plurality of constraining green layers (4) which include non-sinterable inorganic particles for forming a monolithic ceramic substrate. When the thicknesses of the base green layers (3) differ from each other, a thicker layer (3c) shrinks more than a thinner layer (3a) during sintering and the substrate may warp. To overcome this warping, the constraining layers applied to the base layers have different constraining forces to constrain the shrinkage. This is achieved by the constraining layers, which are in contact with the main surfaces of the individual base green layers, having different thicknesses (4c, 4a), or by having different sized inorganic particles contained therein, or by having different types of inorganic particles contained therein.

Wiring substrate, method of producing the same, and electronic device using the same

Composite substrate and method for manufacturing composite substrate

A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers.

Monolithic ceramic substrate and method for making the same

A monolithic ceramic substrate includes a green laminate having a plurality of green functional ceramic layers including a functional ceramic material, green support layers including a ceramic material that does not sinter at a sintering temperature for the green functional ceramic material to prevent shrinkage of the functional ceramic layers, first conductor patterns including a thin-film conductor, and second conductor patterns including a thick-film conductor. The green laminate is fired at the sintering temperature for the green functional ceramic material.

Wiring substrate, method of producing the same and electronic device using the same

A ceramic multilayer substrate (12) comprises a substrate of laminated ceramic green sheets with wiring patterns and conductive vias (3a) formed therein. The upper surface (9) of the substrate has surface wiring patterns (4) provided which connect with vias (3a). Line shaped insulation patterns (8) are formed over the surface wiring patterns (4) to form soldering land electrodes (7) to which various semiconductor devices may be electrically connected to. The insulating patterns (8) have a low solder wetting property which enable high precision, fine soldering lands to be formed.

Composite substrate and method for manufacturing composite substrate

In a composite body, a frame body includes a frame member and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole and extends along a peripheral portion of a substrate body. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member. Each of the first and second strips of the connection member is exposed on a major surface extending around the through-hole. The first strip and the second strip extend in a direction in which the connection members face each other, and opposed ends of the middle strip are continuously connected to the first strip and the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member.

COMPOSITE SUBSTRATE AND METHOD OF MANUFACTURING COMPOSITE SUBSTRATE

A composite substrate in which thermal stress and impact stress in a joined portion are relieved by a simple structure and its manufacturing method are provided. A frame body (20) joined to one major surface (12b) of a substrate body (12) comprises (1) a frame member (22) made of an insulating material, having a through hole (23) at the center, and extending, in the form of a frame, along the edges of the one major surface (12b) and (2) a plurality of connection members (30) each formed by bending a sheet metal and in which a first piece (32) and a second piece (36) are continuous with the respective ends of an intermediate piece (34). Each of the connection members (30) is so disposed on the frame member (22) that the first and second pieces face each other on both sides of the through hole (23). The first piece (32) and the second piece (36) of each of the connection members (30) are exposed on both major surfaces extending along the through hole (23) of the frame member (22), extended ...

THICK FILM INSULATOR COMPOSITION AND CERAMIC ELECTRONIC COMPONENT AND ELECTRONIC DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a thick film insulator composition for forming solder resist layer which is high in positional precision, as well as suppressing a warp or wave of a ceramic multiplayer substrate and keeping excellent electric characteristics. SOLUTION: The thick film insulator composition is composed of ceramic powder as a main component which is same composition as ceramic powder in ceramic green sheet, and contains the ceramic powder whose median value of grain diameter is smaller than that of ceramic powder of ceramic green sheet. COPYRIGHT: (C)2001,JPO ...

Verdrahtungssubstrat, Verfahren zum Herstellen desselben und elektronische Vorrichtung, die dasselbe verwendet

Verdrahtungssubstrat mit definierten Lötanschlussbereichselektroden (7; 27; 37; 44-47), die von einem linienförmigen Isoliermuster (8; 28a, 28b; 35a, 35b; 48a-c), das auf einer äußeren Oberfläche des Verdrahtungssubstrats angeordnet ist, begrenzt werden, dadurch gekennzeichnet, daß das linienförmige Isoliermuster mehrere Leiter eines Leitermusters (4; 34; 43a-c) schneidet sowie eine im Vergleich zu dem Leitermuster geringe Breite aufweist, und das linienförmige Isoliermuster einen definierten Abstand von den Leitermusterenden aufweist.

ELECTRONIC COMPONENT PROVIDED WITH MULTILAYER BOARD AND MANUFACTURE THEREOF

PURPOSE: To provide a method of manufacturing an electronic component provided with a multilayer board which is stable quality and free from warpage and cracks. CONSTITUTION: Boards 1 and 2 of different kinds, which are provided with passive elements inside and different from each other in electrical properties (e.g. dielectric constant), are previously burned. Then, the boards 1 and 2 are pasted together interposing adhesive agent 3 whose main component is glass between them, outer electrode (conductive paste) 4 is applied onto both the side faces of the boards 1 and 2, and the adhesive agent 3 and the outer electrodes 4 are burned at the same time. COPYRIGHT: (C)1993,JPO&Japio ...

MANUFACTURE OF IC CHIP

PURPOSE: To improve the manufacturing efficiency of an IC chip and to enhance a mass productivity by a method wherein the through holes of a master substrate are metallized to form through holes, a plurality of semiconductor elements are mounted on the peripheries of the through holes and are wire bonded and at the same time, after each semiconductor element is sealed, the through holes are respectively divided. CONSTITUTION: A plurality of through holes 2 are bored in a master substrate 1, a conductive paste is printed on the inner walls of the holes 2 and through holes 3 are formed. After this, by firing simultaneously the substrate 1 and electrodes 6 in a non-oxidizing atmosphere, the master substrate 1 is completed. An Au plating is applied to the electrodes 6 of the substrate 1 and through hole electrodes, each semiconductor element 4 is mounted and die bonded on the intermediate position among every 4 through holes 3 and each element 4 and the electrodes 6 are bonded to each other ...

WIRING SUBSTRATE AND METHOD OF PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a method of producing a small ceramic wiring substrate of high-density wiring on which refined and accurate soldered lands are formed. SOLUTION: The method of producing the ceramic wiring substrate comprises a process of forming a number of wiring patterns 4 on a ceramic green sheet, a process of forming a line-shaped insulation pattern 28b, extending across a number of wiring patterns 4 and covering one end of the each pattern 4 to define a part of each pattern as a land 27, and a process of baking the ceramic green sheet with a number of the wiring patterns 4 and the insulation pattern 28b. COPYRIGHT: (C)2006,JPO&NCIPI ...

Zusammengesetztes Substrat und Verfahren zum Herstellen eines zusammengesetzten Substrats

Ein zusammengesetztes Substrat, das folgende Merkmale aufweist: einen Substratkörper, der einen Anschluss an zumindest einer ersten Hauptoberfläche desselben aufweist; und einen Rahmenkörper, der mit der ersten Hauptoberfläche des Substratkörpers verbunden ist, wobei der Rahmenkörper ein Rahmenbauglied, das aus einem isolierenden Material gebildet ist, und eine Mehrzahl von Verbindungsbaugliedern umfasst, die durch Biegen dünner Metallplatten gebildet sind, wobei das Rahmenbauglied ein Durchgangsloch an der Mitte desselben aufweist und sich entlang einem peripheren Abschnitt der ersten Hauptoberfläche des Substratkörpers erstreckt, um eine Rahmenform zu bilden, wobei jedes der Mehrzahl von Verbindungsbaugliedern einen ersten Streifen und einen zweiten Streifen aufweist, die kontinuierlich mit irgendeinem Ende eines mittleren Streifens verbunden sind; wobei die Mehrzahl von Verbindungsbaugliedern in dem Rahmenbauglied angeordnet sind, um einander zugewandt zu sein, wobei sich das Durchgangsloch ...

INDUCTOR COMPONENT MANUFACTURING METHOD AND INDUCTOR COMPONENT

An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component. 1. A method of manufacturing an inductor component , the method comprising:a preparation step of preparing an inductor electrode, the inductor electrode having first and second column-shaped conductors that form input and output terminals and a connecting conductor that connects one end of each of the first and second column-shaped conductors to each other, and the inductor electrode being arranged such that other ends of the first and second column-shaped conductors oppose each other;a mounting step of mounting the other ends of the first and second column-shaped conductors to one main surface of a support plate;a resin layer forming step of laminating a resin layer onto the one main surface of the support plate such that the inductor electrode is embedded within the resin layer; anda removing step of removing the support plate so as to expose the other ends of the first and second column-shaped conductors from the resin layer,wherein the resin layer forming step forms the resin layer as a single-layer structure by embedding the first and second column-shaped ...

MULTILAYER CERAMIC BOARD

PURPOSE: To use a thin conductor layer as a conductor layer for a wiring of a cavity which is structurally weak and to prevent deformation, warpage by forming a plurality of conductor layers of at least two types of conductor layers having different thicknesses, and setting the thickness of the thinner conductor layer to a special range. CONSTITUTION: A multilayer ceramic board 1 has a cavity 2, a coil 4 and a capacitor 6. The thicknesses of conductor layers 32-35 for wirings of the cavity 2, conductor layers 39-42 for a capacitor of the capacitor 6 and shield ground conductor layers 37, 43 are set to 0.8-5μm, and hence deformation amount of the cavity 2, warpage amount of the board 1 can be reduced. The thickness of a conductor layer 36 for bonding is set to 5-10μm, thereby improving bondability. On the other hand, since a conductor layer 38 for a coil of the coil 4 has a narrow occupying area and is scarcely affected by a shrinkage stress distortion, its thickness is contrarily increased ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING IT

PROBLEM TO BE SOLVED: To enable the attachment of a cover for covering a mounted component without increasing the planar dimensions of a multilayer ceramic electronic component and without decreasing an area for mounting the component to be mounted in the multilayer ceramic electronic component which is provided with an LGA (land grid array) type external terminal electrode. SOLUTION: A notch 50 is provided in a side surface 49 of an electronic component body 48, and a joining electrode 46 formed by dividing a joining via hole conductor is formed at a portion of a bottom surface of the notch 50. A leg is provided in the cover. By joining the leg to the joining electrode 46 with the leg of the cover being positioned inside the notch 50, the cover is secured to the electronic component body 48. COPYRIGHT: (C)2006,JPO&NCIPI ...

Herstellungsmethode eines Mehrlagensubstrates

COPPER-METALLIZED COMPOSITION, CERAMIC WIRING SUBSTRATE USING THE SAME AND METHOD OF FABRICATION

PROBLEM TO BE SOLVED: To provide a copper-metallized composition that enables to calcine simultaneously with a mixed ceramic (BAS ceramic) material containing BaO, Al2O3 and SiO2 and is utilized usefully to obtain a conductor film having a high adhesive strength to a ceramic body including the BAS ceramic material. SOLUTION: The copper-metallized composition is comprised of adding a particle of total 0.5 to 30.0 wt.%, whose average particle size is of 0.1 to 10.0 μm and which is composed of a transition metal belonging to a quaternary A family and/or a quintuple A family and/or a transition-metal oxide belonging to the same according to a periodic law table, to a main component comprising a mixture of Cu, CuO and Cu-CuO, a mixture of Cu-Cu2O or a mixture of CuO- Cu2O. COPYRIGHT: (C)2002,JPO ...

INDUCTOR COMPONENT

An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode. 1. An inductor component including an inductor electrode , comprising:an insulating layer; andan outer electrode for external connection on one main surface of the insulating layer, whereinthe inductor electrode includes a metal pin for input/output that has one end surface connected to the outer electrode and that is embedded in the insulating layer,the outer electrode includes a base electrode on the one main surface of the insulating layer, the base electrode being composed of a conductive paste, and a surface electrode on the base electrode, the surface electrode comprising plating, andan area of a cross section of the surface electrode perpendicular to a thickness direction of the surface electrode on an outer layer side away from the base electrode is larger than an area of a cross section of the surface electrode perpendicular to the thickness direction on an inner layer side close to the base electrode.2. The inductor component according to claim 1 , further comprisinga coil core disposed inside the insulating layer, whereinthe inductor electrode is wound around the coil core.3. The inductor component ...

Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component

In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A ...

Multilayer ceramic electronic component has cover which is secured to electronic component by joining leg of cover to joining electrode located at inner surface of notch formed in electronic component

A notch (50) is formed in a side surface (49) of the electronic component (48). A cover covering the component, has a leg which is positioned inside the notch. The cover is secured to the component by joining the leg to the joining electrode (46) located at the inner surface of the notch. An external terminal electrode arranged on the component surface (44), connects the component to a wiring substrate. Independent claims are also included for the following: (1) multilayer ceramic electronic component fabrication method; and (2) electronic component aggregate.

Method for manufacturing multilayer ceramic electronic device

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly is prepared that includes laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device, and the resin is cured.

MANUFACTURING METHOD OF MODULE SUBSTRATE

【課題】 基板の両面に硬化度が異ならないように樹脂層を形成する製造方法を提供する。 【解決手段】 部品実装ベース基板２と液状樹脂２１を硬化冶具３１に収容し、部品実装ベース基板２を液状樹脂２１に浸漬する。熱硬化で部品実装ベース基板２の両主面に樹脂層８を形成し、硬化冶具から取出す。ローラ型ブレード３４で両主面の樹脂層８の上面を研磨し、ビアホール１１を形成し、外部接続用電極１２を形成し、ダイサーで分割して、モジュール基板１０を形成する。 【選択図】 図１

Zusammensetzung für keramisches Substrat sowie keramischer Bestandteil eines Schaltkreises

COIL COMPONENT AND METHOD OF MAKING THE SAME

A coil component includes a core and a coil that is wound around the core. The coil includes a plurality of pin members that are joined together. 1. A coil component comprising:a core; anda coil that is wound around the core,wherein the coil includes a plurality of pin members that are joined together.2. The coil component according to claim 1 ,wherein the plurality of pin members are joined together by using a joining material.3. The coil component according to claim 1 ,wherein at least some of the pin members that are adjacent to each other in an axial direction of the coil are isolated from each other with a space therebetween.4. The coil component according to claim 1 ,wherein at least some of the pin members that are adjacent to each other in an axial direction of the coil are isolated from each other with a dielectric material therebetween.5. The coil component according to claim 1 ,wherein the plurality of pin members include a plurality of first pin members and a plurality of second pin members, andwherein the first pin members and the second pin members have different shapes and are alternately joined together.6. The coil component according to claim 5 ,wherein the first pin members are bent pins that are substantially U-shaped and the second pin members are straight pins that extend substantially straight.7. The coil component according to claim 1 ,wherein the core is annular, andwherein the coil component further comprises a holding member that holds the coil, the holding member being disposed between at least one of two end surfaces of the core in an axial direction of the core and a part of the coil that faces the at least one of the two end surfaces of the core.8. The coil component according to claim 7 ,wherein the holding member is disposed between each of the two end surfaces of the core in the axial direction of the core and a part of the coil that faces a corresponding one of the two end surfaces of the core.9. The coil component according to ...

COMPOSITE MULTILAYER SUBSTRATE, AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To solve the problem that, although the exemplary composite multilayer substrate used in a conventional high-frequency semiconductor device is so constituted as to join the rear surface of a ceramic substrate to the composite resin material layer comprising an epoxy resin and an inorganic filler, since the ceramic substrate and the composite resin material layer are joined to each other via a resin material, the force whereby the ceramic substrate and the composite resin material layer are joined to each other has been so weak that the ceramic substrate and the composite resin material layer are stripped from each other by such an external force as the impact force generated when dropping them. SOLUTION: A composite multilayer substrate 1 so has a ceramic multilayer substrate 2 and so has a resin layer 3 as to join the ceramic multilayer substrate 2 to the resin layer 3. The ceramic multilayer substrate 2 so has a circuit pattern 4 and the resin layer 3 so has via-hole ...

Inductor component

An inductor component including an inductor electrode includes an insulating layer and an outer electrode for external connection formed on the upper surface of the insulating layer. The inductor electrode includes a metal pin for input/output that has an upper end surface connected to the outer electrode and that is embedded in the insulating layer. The outer electrode includes a base electrode formed on the upper surface of the insulating layer and composed of a conductive paste, and a surface electrode formed on the base electrode by plating. The surface electrode is formed such that the area of a cross section thereof perpendicular to the thickness direction on an outer layer side away from the base electrode is larger than the area of a cross section thereof perpendicular to the thickness direction on an inner layer side close to the base electrode.

CONDUCTIVE PASTE AND CERAMIC MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate hardly causing warpage of a substrate body and high in adhesion of the substrate body to a conductive sintered part formed in the inside and outside of the substrate, in a multilayer ceramic substrate manufactured by simultaneously baking a ceramic molded body and a wiring circuit layer for an external conductor and the like. SOLUTION: Conductive paste used for forming the conductive sintered part is prepared by adding an organic vehicle in a mixture of copper powder coated with a metal oxide and powder of a metal oxide; the ratio of the metal oxide used for coating is set in a range of 0.05-5.0 wt.% in the total quantity of the coating copper powder and the powder of the metal oxide; and the total quantity of the coated copper powder and the powder of the metal oxide is set in a range of 1.0-12.0 wt.%. Thereby, contraction start temperatures of the ceramic and the conductive paste can be adjusted to the same level, and warpage ...

MULTILAYERED CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DESIGNING METHOD THEREFOR AND ELECTRONIC DEVICE

PURPOSE: To solve the problem where a warpage occurs on a provided multilayer ceramic substrate since a ticker green layer for substrate is shrunk more noticeably in burning process, when the thickness of each of green layers for substrate is mutually different, although plural green layers for substrate and plural green layers for restraint are laminated concerning a green laminate prepared for providing the multilayered ceramic substrate on the basis of the so-called nonshrink process. CONSTITUTION: The thickness of each of green layers 12 for a restraint, located in contact with the principal side of each of green layers 11 for substrate, is made to be mutually different. Thus, a green layer 12(c) for the restraint, in contact with a thicker green layer 11(c) for substrate, is made thicker, and a green layer 12(a) for restraint in contact with a thinner green layer 11(a) for substrate is made thinner. © KIPO & JPO 2002 ...

MANUFACTURING METHOD FOR MULTILAYER CERAMIC SUBSTRATE AND COPPER CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To solve the problem where cracks, projection or gap occur on a provided multilayer ceramic substrate as a result since conductive paste for a wiring conductor formed on a green laminate starts shrinking on a stage so as not to exert a shrink suppression effect based on an inorganic material layer for shrink suppression upon a green sheet for substrate, in a burning process, when producing the multilayer ceramic substrate by burning the green laminate which laminates the green sheet for substrate containing low- temperature sintered ceramic materials and the inorganic material layer for shrink suppression, containing inorganic materials for shrink suppression. SOLUTION: The copper conductive paste containing Cu2O is used for forming a conductive paste 4. In the burning process, the shrinking action to occur, when reducing Cu2O to Cu is approximated with the shrinking action of low- temperature sintered ceramic materials contained in a green sheet 2 for substrate, by ...

MOUNTING STRUCTURE FOR SURFACE MOUNTING COMPONENT

PROBLEM TO BE SOLVED: To provide a mounting structure for surface mounting component which can mount surface mounting components on a wiring board without inclining, and can reduce the gap between the both without affecting strain resistance and impact resistance even if the coating amount of a solder slightly disperses. SOLUTION: The mounting structure for surface mounting components is obtained by opposing the external electrode 21 of the surface mounting component 20 to the land 11 provided on the wiring board 10 and soldering by a solder 30 the external electrode 21 of the surface mounting component 20 to the land 11. The area of the external electrode 21 in the opposed surface of the surface mounting component 20 opposed to the wiring board 10 is made larger than that of the land 11 in the region 12 of the wiring board 10 to which the surface mounting component 20 is projected perpendicularly. COPYRIGHT: (C)2004,JPO&NCIPI ...

PRODUCTION METHOD OF CERAMIC MULTILAYER SUBSTRATE, AND METHOD FOR ADJUSTING AMOUNT OF WARPAGE OF CERAMIC MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To produce a ceramic multilayer substrate with little warpage even if a method for forming a temporary sticking body while repeating lamination of sheets and temporary sticking is used. SOLUTION: A plurality of ceramic green sheets are laminated by repeating lamination of prepared ceramic green sheets and temporary sticking, and a plurality of temporary sticking bodies are produced. A compound temporary sticking body 30 is formed by arranging a plurality (at least two) of temporary sticking bodies 21 and 22 so that the vertical relation of at least one (first temporary sticking body 21) of the plurality of temporary sticking bodies becomes opposite from that of other temporary sticking body (second temporary sticking body 22) assuming that a ceramic green sheet is laminated at first on the underside and laminated later on the upper side when the ceramic green sheets are laminated sequentially. The compound temporary sticking body 30 is then stuck actually to produce ...

Herstellungsmethode eines Mehrlagensubstrates

MANUFACTURE OF LAMINATED BASE SHEET

PURPOSE: To prevent unevenness from being generated due to the thickness of a conductive layer on an obtained laminated base sheet, while the position- accuracy of the conductive layer is improved by a method in which ceramic slurry is fed on a ceramic green sheet, and said materials are dried in the static where the level difference due to thickness of the conductive layer having been printed on the ceramic green sheet is smoothed. CONSTITUTION: In the manufacture of a ceramic laminated base sheet, ceramic slurry 3 is fed on the carrier film 1 sent continuously in one direction shown by an arrow A1 from a slurry reservoir 2, and after the ceramic slurry 13 has been formed into the sheet with a certain thickness by a doctor blade 4, it is dried. A conductive layer 6 is printed on a formed ceramic green sheet 5 by a screen print, etc. Ceramic slurry 8 is fed on the ceramic green sheet 5 from a slurry reservoir 7, while the conductive layer 6 is covered with said slurry, and after the ceramic ...

TEMPERATURE SENSOR ELEMENT

PROBLEM TO BE SOLVED: To provide a temperature sensor element whose size can be reduced and detecting accuracy can be enhanced and which is excellent in reliablity. SOLUTION: Joining members 13 and 13 are interposed in a pair of opposed end parts of insulating substrates 11 and 12 between a first insulating substrate 11 to form a heating resistor RH and a second insulating substrate 12 to form a temperature compensating resistor RK, and are three-dimensionally adhered and integrally constituted so that resistance pattern forming surfaces of the respective insulating substrates 11 and 12 become an outside surface. A space corresponding to a thickness of the joining members 13 is formed between the insulating substrates 11 and 12 so as to penetrate through a pair of end surfaces. COPYRIGHT: (C)1997,JPO ...

NONLINEAR DIELECTRIC ELEMENT

PROBLEM TO BE SOLVED: To provide a nonlinear dielectric element, which is small-sized and large capacity, without the need for the formation of a complicated glass cover layer, and in which the deterioration of hysteresis in electric field-change characteristics is hardly occurs. SOLUTION: A plurality of inner electrodes 3a-3e are arranged to lie on top of another in thickness direction through dielectric layers within the dielectric 2, having nonlinear property which shows hysteresis in electric field-change property, and first and second outer electrodes 4a and 4b are made to cover the end faces 2a and 2b, and the outer electrodes 4a and 4b are connected electrically with the specified inner electrodes 3a and 3b. COPYRIGHT: (C)1999,JPO ...

SURFACE MOUNT COIL COMPONENT AND MANUFACTURING METHOD FOR THE SAME, AND DC-DC CONVERTER

A surface mount coil component includes an element body defining a compact including magnetic material particles; a coil that is buried, excluding an end portion of the coil, in the element body; and an input-output terminal electrically connected to the end portion of the coil. A thermoplastic resin layer is provided on a surface on a mounting surface side of the element body. An interlayer connection conductor is provided in the thermoplastic resin layer. The input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor. 1. A surface mount coil component comprising:an element body defining a compact including magnetic material particles;a coil that is buried, excluding an end portion of the coil, in the element body; andan input-output terminal electrically connected to the end portion of the coil; whereina thermoplastic resin layer is provided on a surface on a mounting surface side of the element body;an interlayer connection conductor is provided in the thermoplastic resin layer; andthe input-output terminal is provided on a surface of the thermoplastic resin layer and is electrically connected to the end portion of the coil via the interlayer connection conductor.2. The surface mount coil component according to claim 1 , wherein the magnetic material particles are magnetic metal powder claim 1 , and the element body is a pressurized powder compact including the magnetic metal powder.3. The surface mount coil component according to claim 1 , wherein a plating film is provided on a surface of the input-output terminal.4. The surface mount coil component according to claim 1 , whereina width of a wire defining the coil is smaller than a width of the interlayer connection conductor; andthe end portion of the coil projects from the surface of the element body and is positioned inside the interlayer connection conductor.5. The surface mount coil ...

Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode

The wiring board includes a substrate (1) with a wiring pattern (4) and a insulating pattern (8) that is formed on the substrate in such a way that it intersects the wiring pattern and defines part of the wiring pattern as a connection region electrode (7). A further insulating pattern may be formed on the substrate, parallel to the first insulating pattern. Independent claims are included for a method of manufacturing a wiring board, a method of manufacturing a wiring pattern, and an electrical device provided with the wiring board.

COMPOSITION FOR VIA HOLE CONDUCTOR, MULTILAYER CERAMIC SUBSTRATE AND ITS PRODUCING METHOD

PROBLEM TO BE SOLVED: To provide a composition for via hole conductor, in which bulging of a part of via hole conductor, breaking or cracking of a ceramic layer, cracking of the via hole conductor or delamination in the vicinity of interface between the via hole conductor and a conductor film due to firing process is prevented at producing of a multilayer ceramic substrate, comprising a plurality of ceramic layers containing BaO-Al2O3-SiO2 mixture ceramic and via hole conductors, arranged to penetrate specified ceramic layers. SOLUTION: The composition for via hole conductor contains a conductor material containing Cu, or the like, and an inorganic boron compound, wherein the content of inorganic boron compound is set in the range of 0.5-30.0 vol.% with respect to the total conductive material and the inorganic boron compound. COPYRIGHT: (C)2002,JPO ...

CONDUCTIVE PASTE

PURPOSE: To secure an excellent electric characteristic by improving a debinder effect in a firing process in a non-oxidation atmosphere so as to prevent generation of a void and a structural defect while preventing increase of continuity resistance. CONSTITUTION: Conductive paste 2 is compounded of 40 to 70wt.% of copper powder having an average grain diameter 0.3 to 2μm, a grain diameter range 0.1 to 4μm, and 1 to 15wt.% of ceramic raw material powder whose main component is common to the main component of a ceramic raw material composing a ceramic layer while having a grain diameter range 0.5 to 8μm, and an organic vehicle and a solvent 25 to 60wt.%. COPYRIGHT: (C)1993,JPO&Japio ...

ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

【課題】 樹脂基板、電子部品内蔵樹脂基板、電子部品を内蔵した電子部品などの電子デバイスの製造方法において、導電ビアと内部の接続用電極との接合を確実におこなう。また、そのような導電ビアを、簡易に形成する。 【解決手段】 本発明の電子デバイスの製造方法は、接続用電極１ａが形成された配線基板２を準備する工程と、接続用電極１ａ上に柱状ダミー体４ａを形成する工程と、柱状ダミー体４ａを埋設して、配線基板２の主面に樹脂層５を形成する工程と、樹脂層５に埋設された柱状ダミー体４ａを、樹脂層５は溶解しにくいが柱状ダミー体４ａは溶解可能な薬液を用いて溶解し、樹脂層５に柱状ダミー体と略同形状の空孔６ａを形成する工程と、空孔６ａ内に導電成分を充填し、導電ビア７ａを形成する工程と、を備えたものとした。 【選択図】 図１

LOW PASS FILTER AND ELECTRONIC EQUIPMENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a low pass filter that both transmission and reflection are reduced in an attenuating region and the power can be absorbed inside. SOLUTION: Inside a substrate 2 made of dielectric materials whose dielectric tangents in frequencies 1 MHz are ≥0.001, two ground layers 3 and 5 and a line layer 4 interposed between the ground layers are included. In this case, ground electrodes 3a and 5a are formed over almost the whole face of the ground layers 3 and 5, and meandering line 4a is formed on the line layer 4 so that strip lines in a triplate structure can be constituted as a whole. Then, the both ends of the line 4a are connected with an input terminal 6 and an output terminal 7. In this case, the dielectric tangents of the dielectric materials are set larger than those of dielectric materials for general strip lines. Therefore, as the frequencies of a signal become higher, attenuating amounts due to the dielectric loss are increased so that a low pass filter ...

INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

A small-sized inductor with desired characteristics is provided. An inductor 1includes a resin layer and an inductor electrode which includes an inner winding portion and an outer winding portion The inner winding portion and the outer winding portion forming the inductor electrode 6 include the metal pins to and the wiring boards to Here, the inner winding portion and the outer winding portion include the metal pins to and the wiring boards to which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode , and improve the characteristics of the inductor . The inductor can reduce its size by including the inductor electrode wound to have a multiplex winding structure. 1. An inductor , comprising:a resin layer having a main surface; andan inductor electrode wound around a winding axis set in the resin layer,wherein the inductor electrode includes an inner winding portion and an outer winding portion, a plurality of wiring first metal boards having first ends disposed at one side of the winding axis and second ends disposed at another side of the winding axis when viewed in a direction perpendicular to the main surface, the plurality of wiring first metal boards being arranged in a winding axis direction at a first side of the winding axis in the direction perpendicular to the main surface,', 'a plurality of wiring second metal boards having first ends disposed at one side of the winding axis and second ends disposed at another side of the winding axis when viewed in the direction perpendicular to the main surface, the plurality of wiring second metal boards being arranged in the winding axis direction at a second side of the winding axis in the direction perpendicular to the main surface to form a plurality of pairs with the respective first metal boards,', 'a plurality of first metal pins connecting the first ends of the first metal boards to the first ends of the second ...

Wiring substrate, method of producing the same, and electronic device using the same

A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To integrally manufacture a multilayer ceramic substrate provided with at least two kinds of ceramic layers, containing ceramic materials different from each other, respectively, by baking simultaneously without causing delaminations, etc. SOLUTION: A raw composite laminate 1a, under the condition where a green sheet 4a for repressing shrinkage containing an inorganic material that is not sintered at the sintering temperature for a low-temperature sintering ceramic material, is placed between two green sheets 2a and 3a for substrate that contain the low-temperature sintering ceramic materials different from each other, respectively, is manufactured, and it is baked. In a baking process, the low-temperature sintering ceramic material is sintered, while shrinkage in a principal surface direction of the green sheets 2a and 3a for substrate is repressed by the green sheet 4a for repressing shrinkage. The inorganic material remains under an unsintered condition, and glass ...

MODULE AND METHOD FOR MANUFACTURING THE MODULE

A module includes an insulating layer, a ring-shaped magnetic core built in the insulating layer, a coil electrode disposed in the insulating layer so as to spirally wind around the magnetic core, and heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer. Building the magnetic core into the insulating layer as described above eliminates the need to provide the principal face of the insulating layer with a large mounting area for mounting a coil formed by the magnetic core and the coil electrode. This allows the area of the principal face of the insulating layer to be reduced to achieve miniaturization of the module. The presence of the heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer improves dissipation of the heat generated from the coil.

Ceramic substrate composition and ceramic circuit component

A ceramic substrate composition includes about 26 to 48% by weight of a CaO-Al2O3-B2O3-SiO2 type glass, about 35 to 68% by weight of at least one of alumina, mullite, cordierite and forsterite, and about 3 to 24% by weight of quartz, said glass being capable of being crystallized to wollastonite by firing of the composition at a temperature of about 800 to 1000° C. A ceramic circuit component contains a circuit formed on the ceramic substrate obtained by firing the composition.

Inductor component and method of manufacturing inductor component

An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with end faces 70a to 70d of the metal pins 7a to 7d exposed from an upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect the end faces 70a and 70c of the short metal pins 7a and 7c and the end faces 70b and 70d of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and the wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating.

ELECTRICALLY CONDUCTIVE PASTE FOR ELECTROLYTIC PLATING AND ELECTROLYTIC PLATING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To prevent the variation in plated film thickness from occurring, to enable shortening of the plating time and also, to prevent any reduction in mechanical strength and deterioration of electric characteristics of an element of the electronic parts from occurring at the time of plating electronic parts. SOLUTION: This conductive paste 12 is obtained by mixing a metal powder and a vehicle consisting of a resist together and has 55 to 90wt.% of the metal powder content based on the total weight of the paste 12. Then, an area between every adjacent two of electrodes 2 and a connection part of one of the electrodes 2 to the cathode (-) of a DC power source, on an object to be plated 10 are coated with the conductive paste 12 to form electrical continuity among the electrodes 2 and between the cathode (-) of the DC power source and the electrodes 2. Thereafter, the object to be plated 10 and a metallic plate that is used for plating and connected to the anode (+) of the ...

Inductor component

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position.

MONOLITHIC CERAMIC ELECTRONIC PART, MANUFACTURING METHOD THEREFOR AND AGGREGATE ELECTRONIC PART

PROBLEM TO BE SOLVED: To install a cover for covering a loaded part without enlarging the plane size of a monolithic ceramic electronic part, and without narrowing a mounting area for the loaded part in the monolithic ceramic electronic part with an LGA (a land-grid-array) type external terminal electrode. SOLUTION: A notch 50 is formed to the side face 49 of an electronic part body 48, and an electrode 46 for a joining obtained by dividing a via hole conductor for the joining is formed to a part of the internal surface of the notch 50. Leg sections are mounted on the cover, and the cover is fixed onto the electronic part body 48 by joining the leg sections to the electrodes 46 for the joining under the state, in which the leg sections for the cover are placed in the notches 50. COPYRIGHT: (C)2003,JPO ...

COIL MODULE

A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured. 1. A coil module that includes a coil having a coil core and a coil electrode helically wound around the coil core , the coil module comprising:a coil component including an insulating layer having the coil core embedded therein, and the coil electrode comprising a component-side coil electrode provided in the insulating layer and having a non-helical shape; anda wiring substrate having the coil component thereon and provided with a substrate-side coil electrode and other wiring electrodes, the coil electrode further comprising the substrate-side coil electrode and the substrate-side coil electrode having a non-helical shape,wherein the component-side coil electrode of the coil component is connected to the substrate-side coil electrode of the wiring substrate to helically constitute the coil electrode.2. The coil module according to claim 1 , wherein the wiring substrate includes a first multilayer insulating layer; andthe coil component is mounted on a first principal surface of the first multilayer insulating layer, and the component-side coil electrode is connected to the substrate-side coil electrode embedded in the first multilayer insulating layer.3. The coil module according to claim 2 , wherein a plurality of first columnar conductors embedded in ...

CONDUCTIVE PASTE AND CERAMIC MOLDED BODY

PROBLEM TO BE SOLVED: To avoid the curing or deformation of a ceramic multi-layer board that is co-fired with conductive paste giving a connection part in a via hole formed in the multi-layer board. SOLUTION: The conductive paste used for forming via hole connection parts 13 to 19 includes conductive powder covered with a metal oxide such as silver or a metal essentially composed of silver each covered with a metal oxide having a higher melting point than silver has. A shrinkage starting temperature in the firing of the conductive paste is made higher than a shrinkage end temperature in the firing of a ceramic formed body for making the ceramic body 2 having a ceramic layer 4. Strain by the shrinkage of the conductive paste does not effect the ceramic formed body while the body contracts in co-firing. COPYRIGHT: (C)2004,JPO ...

Laminated ceramic electronic component and method of producing the same

A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

COIL COMPONENT

A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component

A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

INDUCTOR COMPONENT AND METHOD OF MANUFACTURING INDUCTOR COMPONENT

An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with end faces 70a to 70d of the metal pins 7a to 7d exposed from an upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect the end faces 70a and 70c of the short metal pins 7a and 7c and the end faces 70b and 70d of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and the wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating.

MULTILAYER CERAMIC BOARD AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To allow even a relatively thick constraint layer to be sufficiently densified when a sufficient constraint force is affected in a baking step, by increasing a thickness of the constraint layer contacted with a ceramic layer for a base in response to the thickness of the ceramic layer in a raw laminate prepared to obtain a multilayer ceramic board by a so-called non-shrinking process. SOLUTION: A method for manufacturing the multilayer ceramic board comprises a step of baking the raw laminate 1 at a baking temperature for baking a ceramic material powder included in the ceramic layers 2 to 10 for the base though an inorganic material powder included in the constraint layers 11 to 17 is not sintered, and a step of containing at least one type of glass powder having a softening point at least lower than the baking temperature in the layers 11 to 17 when the ceramic board is intended to be manufactured at the previous step. The glass powder is embedded in gaps among the ...

Electrically conductive paste ceramic multi-layered substrate

Provided is an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than the contraction ending temperature of said ceramic body during the sintering treatment. Also provided is an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, the particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.

Multilayer ceramic electronic component, multilayer ceramic substrate, and method for manufacturing multilayer ceramic electronic component

This invention provides a multilayered ceramic electronic component, which has excellent impact resistance and capability of meeting a size reduction requirement and, at the same time, has a good dimensional accuracy and is highly reliable, and a multilayered ceramic substrate, and a method for manufacturing a multilayered ceramic electronic component. In a partial region of a first main plane (14) in a multilayered ceramic element assembly (4) comprising a ceramic base material layer and a shrinkage suppressing layer stacked on top of each other and having a predetermined conductor pattern, a seating part (11) comprising a nonmetallic inorganic powder and a resin and fixed onto the first main plane (14) with the aid of a resin is provided. Further, viahole conductors (17) are provided in the seating part (11) so that one side end face is exposed on the surface of the seating part (11). A surface mounting-type electronic component such as a semiconductor element (13) is joined through an ...

METHOD FOR MANUFACTURING MULTIPLAYER CERAMIC SUBSTRATE

【課題】多層セラミック基板を、マザー多層セラミック基板を個々の多層セラミック基板に分割する工程を経て製造する場合において、焼成後にも個々の多層セラミック基板が配列された状態を維持することが可能な多層セラミック基板の製造方法を提供する。 【解決手段】(ａ)未焼結のマザー多層セラミック基板４０と、焼成工程では焼結しない材料からなり、未焼結のマザー多層セラミック基板の個々の多層セラミック基板４ａとなる領域のそれぞれに連結される凸状構造体２０を備えた補助層２１とを積み重ねることにより、未焼結のマザー多層セラミック基板の一方主面側に補助層が配設された複合積層体Ａを形成し、(ｂ)個々の多層セラミック基板となるべき領域毎に分割されるが、一方主面側に配設された補助層は分割されないように切り込み溝４３を形成した後、(ｃ)補助層は実質的に焼結しないが、未焼結セラミック基材層１および凸状構造体が焼結する温度で焼成する。 【選択図】図４

COMPOSITION FOR VIA HOLE CONDUCTOR AND MULTILAYER CERAMIC SUBSTRATE AND ITS PRODUCING METHOD

PROBLEM TO BE SOLVED: To provide a composition for a via hole conductor in which protrusion at a part of a via hole conductor or cracking of a ceramic layer or the via hole conductor can be prevented at the time of producing a multilayer ceramic substrate comprising a plurality of ceramic layers containing BaO-Al2O3-SiO2 mixture ceramic and the via hole conductors penetrating specified ceramic layers. SOLUTION: The composition of a via hole conductor principally comprises at least one kind selected from Cu, CuO, Cu2O, Cu-CuO compound, Cu-Cu2O compound and CuO-CuO compound, and is added with 0.5-30.0 wt.% of an inorganic bore forming agent composed of tungsten and/or inorganic boron compound having a mean particle size of 0.1-30.0 μm for the total weight of the principal component and the inorganic bore forming agent. COPYRIGHT: (C)2002,JPO ...

WIRING BOARD AND ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE USING IT

PROBLEM TO BE SOLVED: To provide a compact ceramic wiring board with high density wiring where a minute and highly accurate soldering land is made. SOLUTION: This is a ceramic multilayer wiring board 1 which has a linear insulating pattern 8 so that it may straddle a plurality of surface wiring patterns 4 and that it may cross each surface wiring pattern, and in which a soldering land 7 is prescribed by this insulating pattern 8. COPYRIGHT: (C)2001,JPO ...

Electronic component manufacturing method and electronic component

LOW TEMPERATURE SINTERED CERAMIC COMPOSITION, CERAMIC SINTERED COMPACT, LAMINATED LAYER TYPE CERAMIC ELECTRONIC PARTS, AND PRODUCTION METHOD FOR THE PARTS

PROBLEM TO BE SOLVED: To obtain a ceramic sintered compact which has high deflective strength and a high quality coefficient. SOLUTION: As a low temperature sintered ceramic composition for obtaining the ceramic sintered compact composing a ceramic layer 2 to be provided on a multilayer ceramic substrate 1, the one containing a calcined material obtained by subjecting a mixture of each powder of a heat-treated material of kaolinite and a Ca compound to heat treatment in the temperatuer range of 750 to 950°C and alumina powder, is used. When the alumina powder is added in 10 to <60 pts.wt. to 100 pts.wt. of the calcined material, the content of CaO in the calcined material is controlled to 20.0 to 41.6 wt.%. When the content of the alumina powder is 10 to <70 pts.wt., the content of CaO is controlled to 23.9 to 41.6 wt.%. When the content of the alumina powder is 10 to <80 pts.wt., the content of CaO is controlled to 28.0 to 41.6 wt.%. COPYRIGHT: (C)2003,JPO ...

Multilayer ceramic electronic device and method for manufacturing the same

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.

MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate having a reliable, three-dimensional wiring conductor without going through each process for forming a through hole in a ceramic green sheet and filling a conductive paste into the through hole. SOLUTION: A projecting conductor 14 is pressed from the side of a first main surface 16 of the ceramic green sheet 11 and is buried inside the ceramic green sheet 11, a projection 18 formed at the side of a second main surface 17 of the ceramic green sheet 11 is removed, thus exposing the projecting conductor 14 to the side of the second main surface 17 of the ceramic green sheet 11. The plurality of ceramic green sheets 11 thus obtained are piled up for baking, thus obtaining the multilayer ceramic substrate. COPYRIGHT: (C)2007,JPO&INPIT ...

MODULE

A module includes: an insulating layer; an annular coil core in the insulating layer; a coil electrode having outer metal pins arranged along an outer circumferential surface of the coil core, inner metal pins arranged along an inner circumferential surface of the coil core to form pairs with corresponding outer metal pins 7 , bonding wires, each connecting one end surface of each outer metal pin and inner metal pin that form a pair, and wiring electrode patterns, each connecting another end surface of each outer metal pin to another end surface of an inner metal pin adjacent in a predetermined direction to the inner metal pin that forms a pair with the outer metal pin; and a buffer layer, formed from a non-conductive material having a lower elastic modulus than the insulating layer, that covers the surface of the coil core.

Inductor and method for manufacturing the same

A small-sized inductor with desired characteristics is provided. An inductor 1a includes a resin layer 3 and an inductor electrode 6, which includes an inner winding portion 6a and an outer winding portion 6b. The inner winding portion 6a and the outer winding portion 6b forming the inductor electrode 6 include the metal pins 7a to 7d and the wiring boards 8a to 8d. Here, the inner winding portion 6a and the outer winding portion 6b include the metal pins 7a to 7d and the wiring boards 8a to 8d, which have lower specific resistance than conductive paste or plating. This structure thus can reduce the resistance of the entirety of the inductor electrode 6, and improve the characteristics of the inductor 1a. The inductor 1a can reduce its size by including the inductor electrode 6 wound to have a multiplex winding structure.

COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE

A composite substrate that is composed of a resin layer including an interlayer connection metal conductor and multiple ceramic layers that each include interlayer connection metal conductor, such that the resin layer is interposed between the ceramic layers, and the interlayer connection metal conductor in the resin layer is integrated with the interlayer connection metal conductors in the ceramic layers. 1. A composite substrate comprising:a resin layer including an interlayer connection metal conductor disposed therein; anda plurality of ceramic layers each including at least one interlayer connection metal conductor,wherein the resin layer is interposed between a pair of the plurality ceramic layers, andwherein the interlayer connection metal conductor disposed in the resin layer is integrated with the at least one interlayer connection metal conductor in each of the pair of ceramic layers.2. The composite substrate according to claim 1 , wherein the interlayer connection metal conductor in the resin layer comprises a metal material having a proportion that is 40% by weight or greater and 99% by weight or less.3. The composite substrate according to claim 2 , wherein a difference between the proportion (% by weight) of the metal material of the interlayer connection metal conductor in the resin layer and a proportion (% by weight) of a metal material of each interlayer connection metal conductor in the plurality of ceramic layers is 59% by weight or less.4. The composite substrate according to claim 1 , wherein the resin layer comprises a tensile modulus of elasticity that is 3 GPa or less.5. The composite substrate according to claim 1 , wherein the resin layer comprises a relative permittivity εthat is 1.5 or more and 3 or less.6. The composite substrate according to claim 1 , wherein the resin layer comprises a thickness that is 5 μm or more and 100 μm or less.7. The composite substrate according to claim 1 , wherein the resin layer includes a multilayer lead ...

Multilayer ceramic electronic device and method for manufacturing the same

The present invention provides a method for manufacturing a multilayer ceramic electronic device, which is used for fixing the base filling resin of surface mounting type electronic device from leaking and installing the device with a high density and a high precision. The invention also provides the multilayer ceramic electronic device which is manufactured through the method of the invention and has excellent adaptability for impact resistance and miniaturization and has higher reliability. A resin introducing part (11A) which is positioned outside the vertical projection area R of surface mounting type electronic device is installed on a base part (11) which uses non-metal inorganic powder as main component of surface mounting type electronic device (13) of mounting semiconductor component, etc. The resin introducing part is fed with resin (22). The base part and the clearance between the base part and the multilayer ceramic assembly (4) are filled with resin. The unfired multilayer ...

METHOD FOR PRODUCING MULTILAYER CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To prevent occurrence of crack and warpage caused by difference in shrinkage curves between a paste and a ceramic in producing a multiplayer ceramic substrate provided with a wiring conductor comprising coopper as a main component by using a paste containing Cu2O. SOLUTION: In a firing process, when a temperature in a firing furnace is X[°C], a sintering start temperature[°C]±50°C of a ceramic material is T[°C], an oxygen partial pressure Y [mmHg] in an atmosphere in the firing furnace is controlled in Y≤0.28×e0.005X in a heating process from 200°C to 700°C, in 2×10-10×e0.015X≤Y≤0.28×e0.005X in a heating process from 700°C to T°C, in Y≤ in 2×10-10×e0.015X from a heating process from T°C to 1,000°C and in Y≤10-6 in a temperature-fall process from 1,000°C to 200°C to bring the shrinkage curve of the paste close to that of ceramic. COPYRIGHT: (C)2001,JPO ...

Multilayered ceramic substrate and method of producing the same

A multilayered ceramic substrate which includes at least two types of ceramic layers respectively containing different ceramic materials, and which can be produced by simultaneous firing without causing layer peeling is described. A green composite laminated product is prepared in a state in which two substrate green sheets respectively contain different types of low-temperature sintered ceramic materials, and a shrinkage inhibiting green sheet containing an inorganic material which is not sintered at the sintering temperature of each of the low-temperature sintered ceramic material is arranged between the two substrate green sheets, followed by firing. In the firing step, the low-temperature sintered ceramic materials are sintered while inhibiting shrinkage of the substrate green sheets in the direction parallel to the main surfaces thereof by the shrinkage inhibiting green sheet, while the inorganic material remains unsintered and is fixed by glass supplied by firing the low-temperature ...

PRESSURE INTEGRATING METHOD FOR GREEN SHEET

PURPOSE: To employ an inexpensive metal mold which can be easily manufactured by filling filler in a recess formed of each green sheet of laminated state, and pressure integrating it in a state that the filler is not pressed out of the surface side of a second green sheet. CONSTITUTION: One or more of second green sheets 4W8 each having through holes are sequentially laminated on a first green sheet 2, and the sheets 2W8 suitably adhere with an adhesive. Then, powderlike filler 50 composed of resin or the like having the same degree of compressibility at the time of pressurizing as that of the sheet is filled in recesses 24W28 surrounded by the inner peripheral walls 32W42 of the holes 10W14 of the sheets 4W8 and surfaces 44W48. The filter 50 pressed out of the surface side of the sheet of the uppermost stage is removed by a suitable spatula to be flattened. Then, lower and upper metal molds 56, 58 of flat pressurized surfaces are pressed from directions of arrows 60, 62 while bringing ...

THICK-FILM WIRING SUBSTRATE

PURPOSE: To obtain a thick film wiring substrate with improved contact bonding properties between a Cu conductor layer and a ceramic substrate and improved solder wetting properties by forming an oxidized Cu conductor layer on the surface of a ceramic substrate and by laminating a Cu conductor layer which is not oxidized on the oxidized Cu conductor layer. CONSTITUTION: A Cu conductor layer 2 which is subjected to oxidation is formed on the surface of a ceramic substrate 1 and a Cu conductor layer 3 which is not subjected to oxidation is laminated on the oxidized Cu conductor layer 2. For example, Cu pasts is printed in a first printing process 4 and the Cu conductor layer 2 is formed on an alumina substrate 1a. Thus, the Cu conductor layer 2 is heated and dried in a first drying process 5 and the Cu conductor layer 2 is subjected to oxidation process. Then, in a second printing process 6, Cu paste is printed on the lower-layer Cu conductor layer 2, the surface side Cu conductor layer 3 ...

Method of manufacturing multilayered ceramic substrate and green ceramic laminate

The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufactured by laminating base layers each composed of a non-glass type low-temperature sintering ceramic raw material powder as a main component, and shrinkage inhibiting layers each composed of a sintering-resistant powder of alumina or the like as a main component to form a green ceramic laminate, and then firing the green ceramic laminate at the sintering temperature of the low-temperature sintering ceramic raw material powder. The shrinkage inhibiting layers contain a powder which does not soften and flow at the firing shrinkage start temperature of the low-temperature sintering ceramic powder, but permeates into the spaces of the sintering-resistant powder due to softening and flowing to densify the shrinkage inhibiting layers before sintering ...

Conductive paste and ceramic multilayer substrate

A conductive paste used for forming conductive sinters includes a mixture of a copper powder coated with a metal oxide and a metal oxide powder, and an organic vehicle. The content of the metal oxide used for coating the copper powder is in the range of about 0.05% by weight to about 5% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder, and in addition, the total content of the metal oxide used for coating the copper powder and the metal oxide powder is in the range of about 1% by weight to about 12% by weight of the total weight of the copper powder coated with the metal oxide and the metal oxide powder.

Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device

An inductor device (1) includes a magnetic body (2) and a conductor buried in the magnetic body (2), and the conductor includes first conductors (3) as metal pins. The magnetic body (2) is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors (3) one end portions of which are exposed to the second main surface of the magnetic body (2) and a second conductor (4) which is connected to the other end portions of the first conductors (3).

MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured. 1. A multilayer ceramic electronic device in which a surface mount electronic device is mounted on a first principal surface of a multilayer ceramic element assembly , the multilayer ceramic electronic device comprising:a multilayer ceramic element assembly including laminated ceramic base material layers and a predetermined first conductor pattern;a seat portion arranged to mount the surface mount electronic device, the seat portion being disposed in at least a portion of the first principal surface of the multilayer ceramic element assembly, including a non-metallic inorganic powder as a primary component, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device; whereinthe surface mount electronic device is mounted on the seat portion with the second conductor pattern extending therebetween; anda resin is filled in at least the seat portion including the non- ...

SOLID-STATE BATTERY

A solid-state battery that includes a solid-state battery laminate having a main surface configured as a circuit forming surface; and a circuit that controls the solid-state battery on the main surface. 1. A solid-state battery comprising:a solid-state battery laminate having a main surface configured as a circuit forming surface; anda circuit that controls the solid-state battery on the main surface.2. The solid-state battery according to claim 1 , wherein the main surface of the solid-state battery laminate is a support surface that supports the circuit that controls the solid-state battery.3. The solid-state battery according to claim 1 , wherein the circuit includes at least one circuit selected from a protective circuit claim 1 , a charge control circuit claim 1 , a temperature control circuit claim 1 , an output compensation circuit claim 1 , and/or an output stabilization power supply circuit.4. The solid-state battery according to claim 1 , wherein an input/output terminal electrode is on the main surface of the solid-state battery laminate.5. The solid-state battery according to claim 4 , wherein the input/output terminal electrode is a surface mount terminal.6. The solid-state battery according to claim 1 , wherein an input/output terminal electrode is on a side surface of the solid-state battery laminate.7. The solid-state battery according to claim 6 , wherein the input/output terminal electrode is a surface mount terminal.8. The solid-state battery according to claim 1 , wherein the main surface of the solid-state battery laminate is an insulating layer having ion insulation properties.9. The solid-state battery according to claim 8 , wherein the insulating layer contains ceramics.10. The solid-state battery according to claim 8 , wherein the solid-state battery laminate comprises an integrally sintered body that includes a positive electrode layer claim 8 , a negative electrode layer claim 8 , a solid electrolyte layer interposed between the positive ...

INDUCTOR COMPONENT

A first resin layer (resin insulating layer) is formed by forming first and third covering portions in close contact with peripheral surfaces of respective end portions of first and second metal pins on the side closer to first end surfaces thereof, and by forming a body portion in a state of covering the respective surfaces of the first and third covering portions. Therefore, even when the first resin layer is thermally contracted, boundary regions of the one principal surface of the first resin layer around the respective end portions of the first and second metal pins on the side closer to the first end surfaces are filled with the first and third covering portions. Hence gaps can be prevented from being generated in those boundary regions, and a columnar conductor (first metal pin) can be avoided from deviating in position. 1. An inductor component comprising:a resin insulating layer; andan inductor including a first metal pin buried in the resin insulating layer,wherein a first end surface of the first metal pin is exposed at one principal surface of the resin insulating layer, andthe resin insulating layer includes a first covering portion and a body portion,wherein the first covering portion covers a part of a lateral surface of the first metal pin positioned close to the first end surface of the first metal pin, and has a first flat surface exposed at a part of the one principal surface of the resin insulating layer surrounding the first end surface of the first metal pin, andwherein the body portion covers a surface of the first covering portion except for the first flat surface.2. The inductor component according to claim 1 , wherein the first covering portion has a thickness gradually increasing toward the first flat surface.3. The inductor component according to claim 1 , wherein the first metal pin is buried in the resin insulating layer with a second end surface of the first metal pin being exposed at another principal surface of the resin insulating ...

SOLID-STATE BATTERY

A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer. 1. A packaged solid-state battery , comprising:a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface;a supporting substrate supporting the bottom surface of the solid-state battery;an insulating cover layer covering the top surface and the side surfaces of the solid-state battery; andan inorganic cover film on the insulating cover layer.2. The packaged solid-state battery according to claim 1 , wherein the inorganic cover film is a water-vapor barrier film.3. The packaged solid-state battery according to claim 2 , wherein the supporting substrate is a water-vapor barrier substrate.4. The packaged solid-state battery according to claim 1 , wherein the inorganic cover film and/or the supporting substrate has a water-vapor transmission rate of less than 1.0×10g/(m·Day).5. The packaged solid-state battery according to claim 1 , wherein the supporting substrate includes wiring electrically connecting an upper surface and a lower surface of the supporting substrate forms a terminal substrate having an external terminal electrically connected to the solid-state battery.6. The packaged solid-state battery according to claim 5 , wherein the wiring of the supporting substrate and an end surface electrode of the solid-state battery are electrically connected to each other.7. The packaged solid-state battery according to claim 6 , further comprising a conductive connection portion on the supporting substrate that electrically connects the wiring of the supporting substrate and the end ...

Surface mount coil component, method of manufacturing the same, and dc-dc converter using the same

A surface mount coil component includes an element body with a first surface, a second surface that opposes the first surface, and a third surface connecting the first surface and the second surface, the element body being defined by a compact including magnetic particles; a first conductor pattern provided at the first surface of the element body; a second conductor pattern provided at the second surface of the element body; input/output terminals provided at the third surface of the element body; and metal pins embedded in the element body, ends of each metal pin being connected to the first and second conductor patterns. The first conductor pattern, the second conductor pattern, and the metal pins define a coil conductor. The input/output terminals are defined by a pair of metal pins exposed at the third surface.

Inductor component and method for manufacturing inductor component

An inductor component 1 includes a resin layer 2 , a protective film 4 , two metal pins 5 provided to stand in the resin layer 2 , and a metal plate 6 joined to both of the metal pins 5 , and both of the metal pins 5 and the metal plate 6 configure an inductor electrode 7 . Both of the metal pins 5 are provided to stand in the resin layer 2 , upper end surfaces 5 a thereof are exposed to an upper surface 2 a of the resin layer 2 , and lower end surfaces 5 b thereof are exposed to a lower surface 2 b . Recesses 8 are formed around the peripheral edges of the upper end surfaces 5 a of both of the metal pins 5 by laser beam irradiation.

INDUCTOR DEVICE, INDUCTOR ARRAY, AND MULTILAYERED SUBSTRATE, AND METHOD FOR MANUFACTURING INDUCTOR DEVICE

An inductor device () includes a magnetic body () and a conductor buried in the magnetic body (), and the conductor includes first conductors () as metal pins. The magnetic body () is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors () one end portions of which are exposed to the second main surface of the magnetic body () and a second conductor () which is connected to the other end portions of the first conductors (). 1. An inductor device comprising:a magnetic body; and a conductor buried in the magnetic body,wherein the conductor includes a first conductor and the first conductor is a metal pin.2. The inductor device according to claim 1 ,wherein one end portion of the first conductor is exposed from an outer surface of the magnetic body.3. The inductor device according to claim 2 ,wherein an area of an end surface of the one end portion of the first conductor exposed from the outer surface of the magnetic body is larger than a cross-sectional area of the first conductor inside the magnetic body.4. The inductor device according to claim 1 ,wherein one end portion of the first conductor is provided on an outer surface of the magnetic body and is connected to an outer electrode having an area larger than a cross-sectional area of the first conductor.5. The inductor device according to claim 1 ,wherein the magnetic body has a flat plate shape with a first main surface and a second main surface each having a predetermined shape opposed to each other, and side surfaces connecting the first main surface to the second main surface,the conductor includes the first conductor and a second conductor connected to another end portion of the first conductor,the first conductor is provided so as to extend perpendicularly to the first main surface and the second ...

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE USING THE SAME

Un substrat de câblage multicouche en céramique (1) inclut un motif d'isolation en forme de ligne (8) qui est formé de façon à couvrir plusieurs motifs de câblage en surface (4) et à intersecter les motifs de câblage en surface respectifs, de telle sorte que des électrodes de plage (7) obtenues par soudage soinet définiies par les motifs d'isolation. A ceramic multilayer wiring substrate (1) includes a line-shaped insulation pattern (8) which is formed to cover a plurality of surface wiring patterns (4) and to intersect the respective surface wiring patterns, so that range electrodes (7) obtained by welding are defined by the insulation patterns.

Electrically conductive paste and ceramic multi-layered substrate

The present invention provides an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than a contraction ending temperature of said ceramic body during a sintering treatment. The present invention also provides an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.

Copper paste for internal conductor of multilayer ceramic electronic component

In order to form internal conductors of a multilayer ceramic electronic component such as a multilayer ceramic capacitor, copper paste containing copper powder having a mean particle size of 0.3 to 2 μm in a particle size range of 0.1 to 4 μm and ceramic powder having a main component which is common to that of a ceramic material contained in the multilayer ceramic electronic component and being in a particle size range of 0.5 to 8 μm, as well as an organic vehicle and a solvent with the contents of the copper powder and the ceramic powder and the total content of the organic vehicle and the solvent in ranges of 40 to 70 percent by weight, 1 to 15 percent by weight and 25 to 60 percent by weight respectively is applied onto ceramic green sheets. The ceramic green sheets provided with such copper paste films are stacked and fired so that occurrence of voids in the laminate and deformation of the laminate are suppressed in the as-obtained multilayer ceramic electronic component.

Method of producing a multi-layer ceramic substrate

The invention provides a method of producing a multi-layer ceramic substrate comprising a laminated member having a plurality of ceramic layers made of a ceramic insulating material and a wiring conductor, comprising the steps of: preparing a raw compact (1g) having the plurality of the laminated ceramic green sheets (2g - 8g) containing the ceramic insulating material and the wiring conductor (13 - 18); providing raw sheet type bases (48, 49) on the principal plane at both ends with respect to the lamination direction of the raw compact (1g), the raw sheet type bases (48, 49) containing a ceramic not to be sintered at the baking temperature of the raw compact (1g); baking the raw compact (1g) in the state interposed between the sheet type bases (48, 49) so as to obtain the laminated member; and eliminating the unsintered sheet type bases (48, 49); wherein the heat expansion coefficient difference of the sheet type bases (48, 49) and the laminated member after baking is 2.5 × 10 -6 degK -1 or more.

Inductor component manufacturing method and inductor component

An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

Monolithic ceramic substrate, manufacturing and designing methods therefor, and electronic device

In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Electrically conductive paste and ceramic multi-layered substrate

The present invention provides an electrically conductive paste adapted to be sintered at the same time when a ceramic body is being sintered, wherein said paste has a contraction starting temperature that is higher than a contraction ending temperature of said ceramic body during a sintering treatment. The present invention also provides an electrically conductive paste comprising an electrically conductive component and an organic vehicle component, wherein said electrically conductive component comprises an electrically conductive powder mainly comprising silver, particles of said electrically conductive powder being coated with a metal oxide having a melting point higher than that of silver.

Inductor device, inductor array, and multilayered substrate, and method for manufacturing inductor device

Coil module

Substrate-side wiring electrode patterns 16, which form a part of a coil electrode 12, are provided on a wiring substrate 20, and as a result reductions in the size and profile of a resin insulating layer 31, in which a coil core 11 is buried, can be achieved. Therefore, reductions in the size and the profile of a coil module 1 can be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns 16, which form a part of the coil electrode 12, are provided on the wiring substrate 20, the heat generated by a coil 10 can be efficiently released from the substrate-side wiring electrode patterns 16 to the wiring substrate 20. Therefore, the heat dissipation property of the coil module 1 can be improved at low cost.

Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component

A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Composite substrate and method of manufacturing composite substrate

　簡単な構成で、接合部分の熱応力や衝撃応力を緩和することができる複合基板及びその製造方法を提供する。 　基板本体１２の一方主面１２ｂに接合される枠体２０は、（１）中央に貫通穴２３を有し、基板本体１２の一方主面１２ｂの周縁部に沿って枠状に延在する枠部材２２と、（２）金属薄板の折り曲げ加工により形成され、中間片３４の両端に第１片３２と第２片３６とが連続する複数の接続部材３０とを有する。接続部材３０は、貫通穴２３を介して対向するように枠部材２２に配置される。接続部材３０の第１片３２と第２片３６は、枠部材２２の貫通穴２３の周囲に延在する両主面に露出し、接続部材３０が貫通穴２３を介して対向する方向に延在する。中間片３４は、接続部材３０の第１片３２と第２片３６の互いに反対側の端部にそれぞれ連続し、枠部材２２の内部を斜めに貫通する。

Coil component

A coil electrode of a coil component includes a plurality of lower wiring patterns arranged on a lower surface of an insulating layer; a plurality of upper wiring patterns arranged on an upper surface of the insulating layer; a plurality of inner conductors disposed at an inner peripheral side of the coil core, each inner conductor connecting one end of the corresponding one of the lower wiring patterns and one end of a corresponding one of the upper wiring patterns forming the pair with the lower wiring pattern; and a plurality of outer conductors disposed at an outer peripheral side of the coil core, each outer conductor connecting the other end of the corresponding one of the lower wiring patterns and the other end of the corresponding one of the upper wiring patterns adjacent to an upper wiring pattern forming the pair with the lower wiring pattern.

Solid-state battery

A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.

Solid-state battery

A battery that includes a substrate, a solid-state battery on the substrate, and a circuit for the solid-state battery on the substrate.

Method of manufacturing multilayered ceramic substrate and green ceramic laminate

The present invention provides a multilayered ceramic substrate having high precision and high reliability in which firing shrinkage in the planar direction thereof is suppressed and densification is achieved. The multilayered ceramic substrate is manufactured by laminating base layers each composed of a non-glass type low-temperature sintering ceramic raw material powder as a main component, and shrinkage inhibiting layers each composed of a sintering-resistant powder of alumina or the like as a main component to form a green ceramic laminate, and then firing the green ceramic laminate at the sintering temperature of the low-temperature sintering ceramic raw material powder. The shrinkage inhibiting layers contain a powder which does not soften and flow at the firing shrinkage start temperature of the low-temperature sintering ceramic powder, but permeates into the spaces of the sintering-resistant powder due to softening and flowing to densify the shrinkage inhibiting layers before sintering is completed.

電子部品

【課題】金属箔の配線導体と層間接続導体とを接合することができる電子部品を提供する。 【解決手段】樹脂層３０，３０ｘ〜３０ｚと、樹脂層３０，３０ｘ〜３０ｚの主面にそれぞれ配置された配線導体１０ｐ〜１０ｒ，１２ｐ〜１２ｒ，１４ｐ〜１４ｒ，１６ｐ〜１６ｒ，１８ｐ〜１８ｒと、樹脂層３０，３０ｘ〜３０ｚを貫通し、両端が配線導体１０ｐ〜１０ｒ，１２ｐ〜１２ｒ，１４ｐ〜１４ｒ，１６ｐ〜１６ｒ，１８ｐ〜１８ｒにそれぞれ接続された層間接続導体１１，１３，１５，１７とを含む。層間接続導体１１，１３，１５，１７は、樹脂層３０，３０ｘ〜３０ｚの内部において両端をそれぞれ含む第１及び第２の端部２２，２２ｘ〜２２ｚ；２０，２０ｘ〜２０ｚが互いに異なる材料を用いて形成され、少なくとも第１の端部２２，２２ｘ，２２ｙ，２２ｚが、金属箔を用いて形成された配線導体に接続されている。 【選択図】図２

多層セラミック基板の製造方法

【課題】基板用セラミック層間の特定の界面に沿って部分的に形成される、基板用セラミック層とは異なる機能材料を含む機能材料層を、高い位置精度をもって形成することができる、多層セラミック基板の製造方法を提供する。 【解決手段】キャリアフィルム１４上で、機能材料グリーンシートを成形し、そこに、機能材料層８の輪郭に相当する形状の分断部をレーザ光の照射によって形成し、分断部の外側に位置する機能材料グリーンシートの残部をキャリアフィルム１４から剥離により除去した後、機能材料層８を、キャリアフィルム１４によって位置決めされた状態で、キャリアフィルム１４から特定の基板用セラミックグリーンシート１２上に転写し、この基板用セラミックグリーンシート１２を含む複数の基板用セラミックグリーンシート１２を積層して、生の積層体を得た後、これを焼成することによって、多層セラミック基板を得る。 【選択図】　　　　図６