Photosensitive resin composition and method for producing photosensitive resin film

Disclosed is a photosensitive resin composition which is suppressed in the formation of bubbles during drying under reduced pressure and capable of providing a photosensitive resin film that has excellent film thickness uniformity after drying. Specifically disclosed is a photosensitive resin composition which is characterized by containing (a) at least one resin selected from among polyimides, polybenzoxazoles, precursors of polyimides and precursors of polybenzoxazoles, (b) a sensitizer, (c) an organic solvent that has a boiling point at atmospheric pressure of 100-130 DEG C (inclusive), and (d) an organic solvent that has a boiling point at atmospheric pressure of not less than 150 DEG C and a viscosity at 20 DEG C of more than 1.1 mPas but less than 1.5 mPas. The photosensitive resin composition is also characterized in that the content of the component (c) is 40-90% by weight (inclusive) relative to the total weight of the organic solvents and the content of the component (d) is 10 ...

Photosensitive resin composition, method for producing heat-resistant resin film and display device

The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent.

Resin composition and display device formed using same

A resin composition is characterized by comprising (a) a polyimide, polybenzoxazole, polyimide precursor, or polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermally crosslinking agent having a specific structure. The resin composition is capable of giving a cured film having a reduced transmittance in the visible light region, while enabling the uncured resin film to retain a transmittance.

Resin composition and manufacturing process therefor

Provided is a polyamic acid resin composition which exhibits excellent storage stability and which can yield, through heat treatment, a film having excellent heat resistance. The polyamic acid resin composition is characterized by comprising (a) a polyamic acid which comprises structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In general formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In general formula (2), Ws are divalent organic groups each having two or more carbon atoms, and are mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups each having two or more carbon atoms, exclusive of the groups represented by general formulae (5) and (6), while in general formula (3), Ys are divalent organic groups each having two or more carbon atoms, exclusive ...

Polyamic acid resin composition and method of producing the same

Therein disclosed is a polyamic acid resin composition, containing (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A', C, C' are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A', or C, C'.

RESIN COMPOSITION AND MANUFACTURING PROCESS THEREFOR

A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6). 4. The resin composition according to claim 1 , further comprising (c) inorganic particles. The present invention relates to polyamic acid resin compositions. Particularly, it relates to a polyamic resin composition to be used suitably for, e.g., flexible substrates of a flat-panel display, an electronic papers, and a solar battery, a surface protective coat of a semiconductor element, a dielectric film among layers, an insulation layer or spacer layer of an organic electro-luminescence device (organic EL element), a planarization layer of a thin film transistor substrate, an insulation layer of an organic transistor, a flexible printed circuit board, and a binder for electrodes of a lithium ion secondary battery.Organic films are advantageous in that they are more flexible and less prone to rupture in comparison to glass. Recently, there is an increasing move toward rendering displays more flexible by replacing the substrates of flat display panels from conventional glass to organic films.In the event that a display is produced on an organic film, a process is common in which the organic film ...

POLYAMIC ACID RESIN COMPOSITION AND METHOD OF PRODUCING THE SAME

The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A′, C, C′ are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A′, or C, C′. 4. The polyamic acid resin composition according to claim 1 , further comprising (c) inorganic particles. The present invention relates to a polyamic acid resin composition. More specifically, the present invention relates to a polyamic acid resin composition to be used suitably for, e.g., flexible substrates of a flat-panel display, electronic paper, a solar battery, and the like; a surface protective coat for a semiconductor device; a dielectric film among layers; an insulation layer or spacer layer of an organic electro-luminescence device (organic EL device); a planarization layer of a thin film transistor substrate; an insulation layer of an organic transistor; a flexible printed circuit board; and a binder for electrodes of a lithium ion secondary battery.Organic films are advantageous in that they are excellent in flexibility and less prone to rupture as compared with glass. Recently, there is an increasing move toward rendering displays more flexible by replacing the substrates of flat display panels from conventional glass to organic films.In the event that a display is produced on an organic film, a process is common in which the organic film is formed on a substrate and the organic film is peeled off from the substrate after the production of a device. An organic film can be formed on a substrate by the following methods. One example is a method in which an organic film is stuck on a glass substrate with an adhesive (e.g., Patent Document 1). Alternatively, another example is a method in which a substrate is coated with a solution containing a resin as a raw material of a film ...

PHOTOSENSITIVE COLORED RESIN COMPOSITION

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less. 1. A photosensitive colored resin composition comprising an alkali-soluble resin (a) , a photosensitive compound (b) , and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm , the photosensitive compound (b) containing a photosensitive compound (b 1) , the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.2. A photosensitive colored resin composition as set forth in claim 1 , wherein the photosensitive compound (b1) accounts for 5 parts by mass or more of the total quantity claim 1 , which accounts for 100 parts by mass claim 1 , of the photosensitive compound (b).3. A photosensitive colored resin composition as set forth in either claim 1 , wherein the photosensitive compound (b1) is a 4-naphthoquinone diazide sulfonyl ester compound.4. A photosensitive colored resin composition as set forth in claim 1 , wherein the alkali-soluble resin ...

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %. 1. A cured film obtained by curing the negative-type photosensitive resin composition comprising an (A1) first resin , a (A2) second resin , a (C) photopolymerization initiator , and a (D) coloring agent ,wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, andwherein the (A2) second resin is one or more species selected from a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, andwherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within a range of 25 to 90 mass %.2. The cured film according to claim 1 , wherein the (D) coloring agent contains a (D1) pigment and the (D1) pigment content ratio in the entire solid content of the negative photosensitive resin composition is within a range of 5 to 70 mass %.3. The cured film according to claim 1 , wherein the (D) coloring agent contains a (Da) black coloring agent and the (Da) black coloring agent contains a (D1a) black pigment.5. The cured film according to ...

Photosensitive resin composition, cured film, element equipped with cured film, organic el display device equipped with cured film, cured film production method, and organic el display device production method

The present invention provides a photosensitive resin composition which has a light-blocking property, and at the same time, a high sensitivity, and has excellent half-tone characteristics. The present invention provides a photosensitive resin composition including an (A) alkali-soluble resin, a (B) radically polymerizable compound, a (C) photo initiator, and a (D) colorant, where the (A) alkali-soluble resin contains a polyimide, a polyimide precursor, a polybenzoxazole precursor, and/or a copolymer thereof, and the (B) radically polymerizable compound contains a (B-1) bifunctional or higher (meth)acrylic compound that has a glass transition temperature of 150° C. or higher as a homopolymer, and a (B-2) tetrafunctional or higher (meth)acrylic compound other than the (B-1).

PHOTOSENSITIVE RESIN COMPOSITION FOR THIN FILM TRANSISTORS, CURED FILM, THIN FILM TRANSISTOR, LIQUID CRYSTAL DISPLAY DEVICE OR ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, METHOD FOR PRODUCING CURED FILM, METHOD FOR MANUFACTURING THIN FILM TRANSISTOR, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE OR ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE

The purpose of the present invention is to provide a photosensitive resin composition for thin film transistors, a cured film of which generates an extremely small amount of an outgas, and which is capable of forming an insulating layer for thin film transistors having excellent drive performance. In order to achieve the above-described purpose, the present invention has the configuration described below. Namely, a photosensitive resin composition for thin film transistors, which contains (A) an alkali-soluble resin having an amide group and/or an imide group, (B) a photosensitive compound and (C) organic solvents, and wherein the content of an organic solvent having nitrogen atoms in the organic solvents (C) is 1% by mass or less relative to the total mass of the organic solvents. 1. A photosensitive resin composition for thin film transistors , comprising (A) an amide group- and/or imide group-containing alkali-soluble resin , (B) a photosensitive compound , and (C) an organic solvent , wherein the organic solvent (C) contains 1% by mass or less of a nitrogen atom-containing organic solvent based on the organic solvent in total.2. The photosensitive resin composition for thin film transistors according to claim 1 , wherein the organic solvent (C) contains 80% by mass or more of an organic solvent satisfying the following (1) and (2) based on the organic solvent in total:{'sup': 3', '1/2, '(1) a solubility parameter of 8.0 or more and 11.0 or less [unit: (cal/cm)]; and'}(2) an organic compound composed of a carbon atom, a hydrogen atom, and an oxygen atoms.3. The photosensitive resin composition for thin film transistors according to claim 1 , wherein the organic solvent (C) contains 0.01% by mass or more and 1% by mass or less of the nitrogen atom-containing organic solvent based on the organic solvent in total.4. The photosensitive resin composition for thin film transistors according to claim 1 , wherein the organic solvent (C) contains 0.01% by mass or more and ...

ORGANIC EL DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

The purpose is to provide an organic EL display device which has good sensitivity and is free from the occurrence of luminance decrease or pixel shrinkage, thereby having excellent long-term reliability. In order to achieve the above-described purpose, provided is the following configuration. Namely, an organic EL display device wherein an insulating layer formed on a first electrode is a cured film obtained by curing a photosensitive resin composition; and the residual amount of acid anhydrides contained in the cured film is from 0.003 to 0.04 (inclusive) when the residual amount of aromatic rings contained in the cured film is taken as 1 (the reference value). 1. An organic EL display device in which an insulating layer formed on a first electrode comprises a cured film produced by curing a photosensitive resin composition , wherein the residual amount of acid anhydrides in the cured film is 0.003 to 0.04 inclusive when the residual amount of aromatic rings in the cured film is taken as 1 (the reference value).3. The organic EL display device according to claim 2 , wherein the photosensitive resin composition comprises (A) an alkali-soluble resin having a carboxylic acid structure claim 2 , (B) a photosensitizing agent and (C) an organic solvent.4. The organic EL display device according to claim 3 , wherein the alkali-soluble resin having a carboxylic acid structure (A) is an alkali-soluble resin having an aromatic carboxylic acid structure.5. The organic EL display device according to claim 3 , wherein the alkali-soluble resin having a carboxylic acid structure (A) contained in the photosensitive resin composition is a polyimide precursor.6. The organic EL display device according to claim 3 , wherein the alkali-soluble resin having a carboxylic acid structure (A) contained in the photosensitive resin composition is a polyimide precursor having an amic acid structure.8. The organic EL display device according to claim 3 , wherein the photosensitizing agent (B) ...

PHOTOSENSITIVE COMPOSITION, CURED FILM AND ORGANIC EL DISPLAY DEVICE

A photosensitive composition containing at least one compound selected from the group of the following (a-1) to (a-3) and containing (b) a photosensitizer: 2. The photosensitive composition according to claim 1 , further comprising (c) an inorganic pigment having near infrared shielding property.3. The photosensitive composition according to claim 2 , wherein the (c) inorganic pigment having near infrared shielding property contains at least one inorganic pigment selected from an inorganic black pigment having a titanium atom(s) claim 2 , an inorganic black pigment having a zirconium atom(s) claim 2 , and amorphous carbon black.4. The photosensitive composition according to claim 1 , wherein the long-chain alkyl group of the compound selected from the group consisting of the (a-1) to the (a-3) is a branched alkyl group having a total of three or more tertiary carbon(s) and/or quaternary carbon(s).6. The photosensitive composition according to claim 1 , comprising at least one compound of the (a-2) and the (a-3) claim 1 , wherein the resin having a structure represented by the general formula (1) is a polyimide resin claim 1 , and wherein the resin having a structure represented by the general formula (2) is a cardo resin.7. The photosensitive composition according to claim 1 , further comprising (d) an organic black pigment.8. The photosensitive composition according to claim 1 , having negative photosensitivity claim 1 , wherein the (b) photosensitizer comprises a compound having two or more radical polymerizable groups and comprises a photopolymerization initiator.9. The photosensitive composition according to claim 1 , having positive photosensitivity claim 1 , wherein the (b) photosensitizer comprises a photo-acid generator.10. The photosensitive composition according to claim 1 , further comprising (e) a vanadyl phthalocyanine near infrared absorbing dye.11. The photosensitive composition according to claim 1 , wherein a cured film claim 1 , 2.0 μm thick claim ...

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR

The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. 1. A negative type photosensitive resin composition comprising , as an alkali-soluble resin (A) , at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2) ,the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, andthe unsaturated group-containing resin (A2) having an ethylenically unsaturated double bond group.2. A negative type photosensitive resin composition as set forth in claim 1 , wherein the weakly acidic group-containing resin (A1) having one or more acidic groups selected from the group consisting of phenolic hydroxyl group claim 1 , silanol group claim 1 , hydroxyimide group claim 1 , and hydroxyamide group.3. A negative type photosensitive resin composition as set forth in further comprising a radical-polymerizable compound (B) and a photosensitive agent (C).4. A negative type photosensitive resin composition as set forth in claim 1 , wherein the weakly acidic group-containing resin (A1) having no ethylenically unsaturated double bond group claim 1 , andthe weakly acidic group-containing resin (A1) accounting for 30 to 99 mass % of the alkali-soluble resin (A).5. A negative type photosensitive resin composition as set forth in claim 4 , wherein the weakly acidic group-containing resin (A1) accounts for 70 to 97 mass % of the alkali-soluble resin (A).6. A negative type photosensitive resin composition as set forth in claim 1 , wherein the weakly acidic group-containing resin (A1) has an acid equivalent in the range of 200 to 1 claim 1 ,200 g/mol.7. A negative type photosensitive resin composition as set forth in claim 1 , wherein the unsaturated group-containing resin (A2) has a double bond ...

Organic el display device

An organic EL display device having excellent light-emitting reliability while it has pixel division layer ( 8 ) and/or planarization layer ( 4 ) having excellent optical properties is provided. An organic EL display device comprising first electrode ( 10 ), the pixel division layer ( 8 ), light emitting pixel ( 9 ), second electrode ( 5 ), the planarization layer ( 4 ), and substrate ( 6 ) wherein the pixel division layer ( 8 ) and/or the planarization layer ( 4 ) contains a yellow pigment having the benzimidazolone structure represented by the structural formula (1):

ORGANIC EL DISPLAY DEVICE

An organic EL display device includes a photosensitive resin composition including an (A) alkali-soluble resin, a (B) coloring agent, a (C) radical polymerizable compound, and a (D) photopolymerization initiator. The (A) alkali-soluble resin is an (A-1) alkali-soluble resin having a carboxy group. A sum of the content of at least one of a metal element and a halogen element in a non-volatile component measured by time-of-flight secondary ion mass spectrometry in a cured product formed by curing the photosensitive resin composition is 1×10atom/cmor larger and 1×10atom/cmor smaller. In an organic EL element constituted of at least a substrate, a first electrode, a second electrode, a light emitting pixel, a flattening layer, and a pixel division layer, the photosensitive resin composition is arranged in at least one of the flattening layer and the pixel division layer. 1. An organic EL display device comprising:a photosensitive resin composition comprising an (A) alkali-soluble resin, a (B) coloring agent, a (C) radical polymerizable compound, and a (D) photopolymerization initiator,wherein the (A) alkali-soluble resin is an (A-1) alkali-soluble resin having a carboxy group;{'sup': 17', '3', '22', '3, 'further a sum of content of at least one of a metal element and a halogen element in a non-volatile component measured by time-of-flight secondary ion mass spectrometry in a cured product formed by curing the photosensitive resin composition is 1×10atom/cmor larger and 1×10atom/cmor smaller; and'}in an organic EL element constituted of at least a substrate, a first electrode, a second electrode, a light emitting pixel, a flattening layer, and a pixel division layer, the photosensitive resin composition is arranged in at least one of the flattening layer and the pixel division layer.2. The organic EL display device according to claim 1 , wherein at least one of the metal element and the halogen element is an ionic compound.3. The organic EL display device according to ...

RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME

The resin composition of the present invention is a resin composition characterized by including (a) a polyimide, a polybenzoxazole, a polyimide precursor or a polybenzoxazole precursor, (b) 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, or 2,3-dihydroxynaphthalene, and (c) a thermal cross-linking agent having a specific structure. By the use of the resin composition of the present invention, it is possible to reduce the transmittance in the visible region of a cured film while maintaining the transmittance of a resin film before curing. 2. The resin composition according to claim 1 , wherein the change in transmission of light having a wavelength of 450 nm for a prebaked film and a cured film each having a thickness of 3.0 μm of said resin composition is 20% or more.3. A display device comprising a substrate in which a thin film transistor has been formed claim 1 , a planarization film and/or a dielectric layer and a display element in this order claim 1 , wherein said planarization film and dielectric layer are obtained by curing the resin composition according to .4. The display device according to claim 3 , wherein the display element is an organic electroluminescent element. The present application is a 37 C.F.R. §1.53 (b) divisional of, and claims priority to, U.S. application Ser. No. 13/146,794, filed Aug. 9, 2011. application Ser. No. 13/146,794 is the national phase under 35 U.S.C. §371 of International Application No. PCT/JP2010/050402, filed on Jan. 15, 2010, which claims priority to Japanese Application No. 2009-017790 filed on Jan. 29, 2009. The entire contents of each of these applications is hereby incorporated by reference.The present invention relates to resin compositions. Particularly, it relates to resin compositions suited for applications such as surface protective films and interlayer dielectric films of semiconductor elements, dielectric layers of organic electroluminescent (hereinafter referred to as EL) ...

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, ORGANIC EL DISPLAY PROVIDED WITH CURED FILM, AND METHOD FOR PRODUCING SAME

The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2). 122-. (canceled)23. A negative type photosensitive resin composition comprising an alkali-soluble resin (A) , a radical polymerizable compound (B) , a photo initiator (C1) , and a black colorant (Da);the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); andthe radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).26. A negative type photosensitive resin composition as set forth in claim 23 , wherein the first resin (A1) contains one or more selected from the group consisting of polyimide (A1-1) claim 23 , ...

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR

An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure. 2. The negative photosensitive resin composition according to claim 1 ,wherein the (Da) black colorant contains a (D1a) black pigment, andthe (D1a) black pigment contains, as a (D1a-1) black organic pigment, one or more selected from the group consisting of a (Da-1a) benzofuranone-based black pigment, a (Da-1b) perylene-based black pigment, and an (D1a-1c) azo-based black pigment.3. The negative photosensitive resin composition according to claim 2 ,wherein the (D1a-1) black organic pigment contains a (D1a-1a) benzofuranone-based black pigment.4. The negative photosensitive resin composition according to claim 1 ,wherein the (Da) black colorant contains a (D1a) black pigment,the (D1a) black pigment contains, as (D1a-3) coloring pigment mixture of two or more colors, a (D1a-3a) coloring pigment mixture including a blue pigment, a red pigment, and a yellow pigment, a (D1a-3b) coloring pigment mixture including a purple pigment and a yellow pigment, a (D1a-3c) coloring pigment mixture including a blue pigment, a red pigment, and an orange pigment, or a (D1a-3d) coloring pigment ...

Resin composition, method for producing heat-resistant resin film, and display device

A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

Black pigment, method for producing same, pigment dispersion liquid, photosensitive composition and cured product of said photosensitive composition

Provided is a black pigment that enables pattern formation of pixel division layer while suppressing generation of development residue. The black pigment comprises (a) a core containing at least one organic black pigment selected from the group consisting of benzodifuranone-based black pigments, perylene-based black pigments, azo-based black pigments, and isomers thereof and (b) a coating layer containing silica and/or a metal oxide and/or a metal hydroxide.

RESIN COMPOSITION

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: 4. A resin composition as set forth in claim 1 , wherein the alkali-soluble resin of (a) contains polyimide claim 1 , polybenzoxazole claim 1 , polyamide-imide claim 1 , a precursor of any thereof claim 1 , and/or a copolymer thereof.5. A resin composition as set forth in claim 1 , further comprising: (c) a photosensitive compound.6. A resin composition as set forth in claim 1 , further comprising: (d) a thermal crosslinking agent.7. A resin sheet produced from a resin composition as set forth in .8. A cured film produced by curing a resin sheet as set forth in .9. A cured film produced by curing a resin composition as set forth in .10. An organic EL display apparatus comprising a drive circuit claim 8 , a planarization layer claim 8 , a first electrode claim 8 , an insulation layer claim 8 , a luminescence layer claim 8 , and a second electrode disposed on a substrate claim 8 , the planarization layer and/or the insulation layer being formed from a cured film as set forth in either .11. A semiconductor electronic component comprising an electrode claim 8 , a metal wiring claim 8 , an interlaminar insulation layer claim 8 , and/or a surface protection layer disposed on a substrate claim 8 , the interlaminar insulation layer and/or the surface protection layer being formed of a cured film as set forth in either .12. Semiconductor equipment comprising an electrode claim 8 , a metal wiring ...

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY APPARATUS THAT INCLUDE CURED FILM, PRODUCTION METHOD FOR THE SAME

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %. 1. A negative-type photosensitive resin composition comprising an (A1) first resin , a (A2) second resin , a (C) photopolymerization initiator , and a (D) coloring agent ,wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, andwherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, andwherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within a range of 25 to 90 mass %.2. The negative-type photosensitive resin composition according to claim 1 , wherein the content ratio of the (A1) first resin in 100 mass % of a sum of the (A1) first resin and the (A2) second resin is within a range of 51 to 90 mass %.3. The negative-type photosensitive resin composition according to claim 1 , comprising a (B) radical polymerizable compound claim 1 , wherein the content ratio of the (B) radical polymerizable compound in a total of ...

NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY DEVICE PROVIDED WITH CURED FILM, AND PRODUCTION METHOD THEREFOR

The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1). In this resin composition, the radical-polymerizable compound (B) contains a flexible chain-containing radical-polymerizable compound (B1), the flexible chain-containing radical-polymerizable compound (B1) contains a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain, the aliphatic chain has an average molecular weight of 40 to 500, and the content of the pigment (D1) is 5 to 70 mass % of the total solid content. 1. A negative-type photosensitive resin composition comprising: an alkali-soluble resin (A); a radical-polymerizable compound (B); a photopolymerization initiator (C1); and a pigment (D1) ,wherein the radical-polymerizable compound (B) includes a flexible chain-containing radical-polymerizable compound (B1),the flexible chain-containing radical-polymerizable compound (B1) includes a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain,the aliphatic chain has an average molecular weight of 40 to 500, andthe content of the pigment (D1) is 5 to 70 mass % of the total solid content.2. A negative-type photosensitive resin composition as set forth in claim 1 ,wherein the alkali-soluble resin (A) includes a first resin (A1), andthe first resin (A1) includes at least one selected from the group ...

NEGATIVE TYPE COLORED PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT, AND DISPLAY DEVICE

The present invention provides a negative type colored photosensitive resin composition that serves to produce a cured film having a forward tapered shape. This negative type colored photosensitive resin composition includes an alkali-soluble resin (A), a photo initiator (B), a photo polymerizable compound (C), and a coloring agent (D), the alkali-soluble resin (A) containing a polyimide precursor, polybenzoxazole precursor, and/or a copolymer thereof (A-1), each resin (A-1) having a trifluoromethyl group in the backbone chain. 1. A negative type colored photosensitive resin composition comprising an alkali-soluble resin (A) , a photo initiator (B) , a photo polymerizable compound (C) , and a coloring agent (D) , the alkali-soluble resin (A) containing a polyimide precursor , polybenzoxazole precursor , and/or a copolymer thereof (A-1) , each resin (A-1) having a trifluoromethyl group in the backbone chain.5. A negative type colored photosensitive resin composition as set forth in claim 1 , wherein the coloring agent (D) contains an organic pigment and/or an inorganic pigment and turns to black when the film is cured.6. A negative type colored photosensitive resin composition as set forth in claim 5 , wherein the coloring agent (D) contains a benzofuranone based black pigment and/or a perylene based black pigment.7. A negative type colored photosensitive resin composition as set forth in further comprising a dispersing agent (E) claim 5 , the dispersing agent containing a tertiary amino group or a nitrogen-containing heterocyclic basic functional group.8. A negative type colored photosensitive resin composition as set forth in further comprising a chain transfer agent (F).9. A negative type colored photosensitive resin composition as set forth in claim 2 , wherein the resin (A-1) further contains an alkylene oxide group in the backbone chain.10. A negative type colored photosensitive resin composition as set forth in claim 1 , wherein the alkali-soluble resin (A) ...

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM AND DISPLAY DEVICE

The present invention provides a photosensitive resin composition which uses a polyimide precursor that has excellent solubility in organic solvents and is capable of reducing the viscosity of a resin composition obtained therefrom. The solution according to the present invention is a photosensitive resin composition which contains: an aromatic amide resin that has, as a main repeating unit, a specific structure having an amide group, a trifluoromethyl group and an aromatic ring; (b) a sensitizer; and (c) a solvent. 1. A photosensitive resin composition comprising: an aromatic amide resin (a1) which has an amide group , a trifluoromethyl group and an aromatic ring and which is soluble in propylene glycol monomethyl ether acetate; a photosensitive agent (b); and a solvent (c) , wherein the photosensitive resin composition has a solid content of 20% by weight and a viscosity of 1 to 15 cp at 25° C.2. A photosensitive resin composition comprising: an aromatic amide resin (a2) which has an amide group , an amide acid ester , a trifluoromethyl group and an aromatic ring and which is soluble in propylene glycol monomethyl ether acetate; a photosensitive agent (b); and a solvent (c) , wherein the photosensitive resin composition has a solid content of 20% by weight and a viscosity of 1 to 15 cp at 25° C.4. The photosensitive resin composition according to claim 3 , wherein the resin (a) having as a main repeating unit a structure represented by the general formula (1) is end-capped with 10 to 100 mol % of a monoamine based on 100 mol % of a tetracarboxylic acid as a monomer component.5. The photosensitive resin composition according to claim 3 , wherein the resin (a) having as a main repeating unit a structure represented by the general formula (1) is end-capped with 10 to 100 mol % of an acid anhydride based on 100 mol % of a diamine as a monomer component.7. The photosensitive resin composition according to claim 1 , wherein the photosensitive agent (b) is a quinone ...

ORGANIC EL DISPLAY DEVICE

An object of the present invention is to provide an organic EL display device which causes neither decrease in emission luminance nor pixel shrinkage and is excellent in long-term reliability. The present invention is directed to an organic EL display device including an insulating layer formed on a first electrode of the organic EL display device and constituted of a cured film obtained from a positive type photosensitive resin composition containing (A) an alkali-soluble resin, (B) an o-quinonediazide compound and (C) an organic solvent, wherein the mole ratio S/C obtained when a section of the cured film is measured is greater than or equal to 0.003 and less than or equal to 0.008. 1. An organic EL display device , comprising an insulating layer formed on a first electrode of the organic EL display device and constituted of a cured film obtained from a positive type photosensitive resin composition containing (A) an alkali-soluble resin , (B) an o-quinonediazide compound and (C) an organic solvent ,wherein the mole ratio S/C of sulfur to carbon obtained when a section of the cured film is measured by means of an electron probe microanalyzer is greater than or equal to 0.003 and less than or equal to 0.008.2. The organic EL display device according to claim 1 , wherein the (A) alkali-soluble resin contained in the positive type photosensitive resin composition is constituted of at least one or more kind of alkali-soluble resin selected among a polyimide claim 1 , a polyimide precursor and a polybenzoxazole precursor or an interpolymer thereof.3. The organic EL display device according to claim 1 , wherein the total amount of gas components derived from the organic solvent among components adsorbed and captured by a purge-and-trap method and detected by gas chromatography-mass spectrometry (GC-MS) in outgassed components emitted when a cured film constituting the insulating layer is heated at 180° C. for 30 minutes is less than or equal to 10 ppm in terms of n- ...

RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE

A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices. 1. A resin composition which is configured such that , when the resin composition is formed into a resin composition film that has a thickness of 3.0 μm after a heat treatment at a temperature within the range from 200 to 350° C. , the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 10% or less at a wavelength of 365 to 436 nm after the heat treatment.2. The resin composition according to claim 1 , wherein claim 1 , when the resin composition is formed into a resin composition film having a thickness of 2.0 μm after a heat treatment at a temperature within the range from 200 to 350° C. claim 1 , the resin composition film forms a heat-resistant resin film having a light transmittance of 50% or more at a wavelength of 365 to 436 nm before the heat treatment and having a light transmittance of 5% or less at a wavelength of 350 to 460 nm after the heat treatment.3. The resin composition according to claim 1 , additionally containing a photo-acid generator and having positive-working photosensitivity.4. A resin composition having positive-working ...

Negative photosensitive resin composition, cured film, element provided with cured film, display device provided with element, and organic el display

The present invention provides a negative photosensitive resin composition that has high pigment dispersibility and stability and can reduce residues of unexposed portions during development. The present invention provides a negative photosensitive resin composition containing an (A) alkali-soluble resin, a (B) dispersant having an amine value exceeding 0, a (C) benzofuranone based organic pigment having an amide structure, a (D) radical polymerizable compound, and a (E) photoinitiator. In this negative photosensitive resin composition, the (A) alkali-soluble resin contains one or more selected from the group consisting of a (A1) polyimide, a (A2) polyimide precursor, a (A3) polybenzoxazole, and a (A4) polybenzoxazole precursor, and the (B) dispersant having an amine value exceeding 0 contains a (B1) dispersant including a repeating unit represented by general formula (2) and a repeating unit represented by general formula (3) and a (B2) dispersant that is an acrylic block copolymer having an amine value of 15 to 60 mgKOH/g and/or a (B3) dispersant having a urethane bond. (In general formula (2), R 1 represents an alkylene group. R 2 and R 3 , which may be the same or different, each represents hydrogen, an alkyl group or a hydroxyl group. x represents an integer of 0 to 20. However, when x is 0, at least one of R 2 and R 3 is an alkyl group. m represents an integer of 1 to 100. In general formula (3), n represents an integer of 1 to 100.)

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT HAVING CURED FILM, ORGANIC EL DISPLAY, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY

An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a photosensitive resin composition that forms the film. The photosensitive resin composition contains an (A) alkali-soluble resin, a (C) photosensitive agent, a (Da) black colorant, and a (F) a cross-linking agent, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of: a specific (A1-1) polyimide; a (A1-2) polyimide precursor; a (A1-3) polybenzoxazole; and a (A1-4) polybenzoxazole precursor, and contains a structural unit having a fluorine atom at a specific ratio, the content ratio of the (Da) black colorant is a specific ratio, and the (F) cross-linking agent contains an epoxy compound that has a specific structure, and/or an epoxy resin that has a specific structural unit. 1. A photosensitive resin composition comprising an (A) alkali-soluble resin , a (C) photosensitive agent , a (Da) black colorant , and a (F) cross-linking agent ,wherein the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor,the one or more selected from the group consisting of the (A1-1) polyimide, the (A1-2) polyimide precursor, the (A1-3) polybenzoxazole, and the (A1-4) polybenzoxazole precursor contains a structural unit having a fluorine atom at 10 to 100 mol % to all of structural units,a content ratio of the (Da) black colorant is 5 to 70% by mass to a total solid content, andthe (F) cross-linking agent contains one or more selected from the group consisting of:an (F1) epoxy compound having a fluorene skeleton and two or more epoxy groups in a molecule;an (F2) epoxy compound having ...

DIAMINE COMPOUND, AND HEAT-RESISTANT RESIN OR HEAT-RESISTANT RESIN PRECURSOR USING SAME

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1). 113-. (canceled)15. The heat-resistant resin or heat-resistant resin precursor according to claim 14 , including at least one selected from polyimides claim 14 , polybenzoxazoles claim 14 , polybenzoimidazoles claim 14 , and polybenzothiazoles; and respective precursors of these polymers claim 14 , and copolymers of these polymers.17. A photosensitive resin composition claim 14 , comprising the heat-resistant resin or heat-resistant resin precursor (a) recited in claim 14 , and further comprising a photosensitive compound (b) and a solvent (c).18. The photosensitive resin composition according to claim 17 , wherein the photosensitive compound (b) is a quinonediazide compound (b1).19. The photosensitive resin composition according to claim 17 , wherein the photosensitive compound (b) is a photopolymerization initiator (b2).20. The photosensitive resin composition according to claim 19 , further comprising a radical polymerizable compound (d).21. The photosensitive resin composition according to claim 17 , further comprising an alkoxymethyl-group-containing compound claim 17 , and/or a cyclic-polyether-structure-having compound (e).22. A cured film claim 17 , wherein the photosensitive resin composition recited in is cured.23. An element claim 22 , comprising the cured film recited in .24. An organic EL display device claim 22 , wherein the cured film recited in is located over at least one of a planarizing layer over a driving circuit claim 22 , and an insulation layer over a first electrode.25. A method for ...

Cured film and positive photosensitive resin composition

[Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less. The photosensitive resin composition comprises the alkali-soluble resin (a), photoacid generating agent (b), compound (c), thermal crosslinking agent (d), and an organic solvent (e), the compound (c) accounting for 0.1 part by mass or more and 15 parts by mass or less relative to 100 parts by mass of the alkali-soluble resin (a), and the organic solvent (e) accounting for 100 to 3,000 parts by mass relative thereto.

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, DISPLAY DEVICE AND METHOD FOR PRODUCING SAME

A problem to be addressed by the present invention is to obtain: a cured film that has high sensitivity, makes it possible to prevent generation of a development residue arising from a pigment, and has excellent heat resistance and light-blocking ability; and a negative photosensitive resin composition that is formed into the cured film. A main object of the present invention is to obtain and use a negative photosensitive resin composition including: (A) an alkali-soluble resin, (B) a radical polymerizable compound, (C) a photo initiator, and (Da) a black pigment; wherein the (A) alkali-soluble resin contains one or more selected from (A1-1) a polyimide, (A1-2) a polyimide precursor, (A1-3) a polybenzoxazole, and (A1-4) a polybenzoxazole precursor; and wherein the (C) photo initiator contains at least (C1) an oxime ester photo initiator and (C2) an α-hydroxyketone photo initiator, wherein the content ratio of the (C1) oxime ester photo initiator is 51 to 95 mass % in the (C) photo initiator, and the content ratio of the (Da) black pigment is 5 to 50 mass % in all the solid contents of the negative photosensitive resin composition. 1. A negative photosensitive resin composition comprising: (A) an alkali-soluble resin , (B) a radical polymerizable compound , (C) a photo initiator , and (Da) a black pigment;wherein said (A) alkali-soluble resin contains one or more selected from (A1-1) a polyimide, (A1-2) a polyimide precursor, (A1-3) a polybenzoxazole, and (A1-4) a polybenzoxazole precursor; and wherein the content ratio of said (C1) oxime ester photo initiator is 51 to 95 mass % in said (C) photo initiator, and', 'the content ratio of said (Da) black pigment is 5 to 50 mass % in all the solid contents of said negative photosensitive resin composition., 'wherein said (C) photo initiator contains at least (C1) an oxime ester photo initiator and (C2) an α-hydroxyketone photo initiator,'}2. The negative photosensitive resin composition according to claim 1 ,wherein the ...

Organic el display device

The organic EL display device includes at least a transparent electrode, an organic EL layer, and a non-transparent electrode in this order and further includes a black insulating layer, and the non-transparent electrode has a reflectance of 25%±20%.

Negative photosensitive resin composition, cured film, element and display device each provided with cured film, and method for manufacturing display device

本發明提供一種能鹼顯影的負型感光性樹脂組成物，其能以高解析度且低錐形(low taper)的圖案形狀得到耐熱性及遮光性優異的硬化膜。其特徵為含有(A1)第1樹脂、(A2)第2樹脂、(C)光聚合起始劑及(D)著色劑，前述(A1)第1樹脂係(A1-1)聚醯亞胺及/或(A1-2)聚苯并□唑，前述(A2)第2樹脂係由(A2-1)聚醯亞胺前驅物、(A2-2)聚苯并□唑前驅物、(A2-3)聚矽氧烷、(A2-4)卡多(cardo)系樹脂及(A2-5)丙烯酸樹脂所選出的一種類以上，前述(A1)第1樹脂在前述(A1)第1樹脂及前述(A2)第2樹脂之合計100質量%中所佔的含有比率為25~90質量%之範圍內。

Photosensitive resin composition and method for preparing heat-resistant resin film

Positive photosensitive resin composition

Photosensitive resin composition, resin sheet, cured film, organic EL display device, semiconductor electronic component, semiconductor device, and method for producing organic EL display device

The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

樹脂組成物、樹脂シート、硬化膜

【課題】本発明は、現像密着性および保存安定性の高い樹脂組成物を提供することを課題とする。【解決手段】本発明は、アルカリ可溶性樹脂（ａ）、β―アルコキシプロピオンアミド（ｂ）およびアミド基含有３級アミン化合物（ｃ）を含有し、前記アルカリ可溶性樹脂（ａ）に対するアミド基含有３級アミン化合物（ｃ）の含有量が１～９０ｐｐｍである樹脂組成物である。【選択図】図１

Negative-type photosensitive resin composition, cured film, element and display device provided with cured film, and production method therefor

The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1). In this resin composition, the radical-polymerizable compound (B) contains a flexible chain-containing radical-polymerizable compound (B1), the flexible chain-containing radical-polymerizable compound (B1) contains a compound having (I) a structure derived from a compound having at least three hydroxyl groups in the molecule, (II) at least three ethylenically unsaturated double bond groups, and (III) at least one aliphatic chain, the aliphatic chain has an average molecular weight of 40 to 500, and the content of the pigment (D1) is 5 to 70 mass % of the total solid content.

Polyamido acid resin composition and its producing method

感光性樹脂組成物

【課題】キュア後に低テーパー角であり、かつ高感度を示す感光性樹脂組成物を提供することを目的とする。【解決手段】（ａ）一般式（１）で表される構造単位を有する樹脂、（ｂ）感光剤、（ｃ）アルキレンオキサイド鎖を含有する化合物、および(ｄ）一般式（２）で表される熱架橋剤を含有することを特徴とする感光性樹脂組成物。【化１】【選択図】なし

感光性樹脂組成物、硬化物、積層体、表示装置、および表示装置の製造方法

【課題】隔壁上面の撥液性に優れ、開口部のスカムが少ない隔壁を得ることができる感光性樹脂組成物を提供する。【解決手段】（Ａ）成分、（Ｂ）成分および（Ｃ）成分を含み、前記（Ｂ）成分が、（Ｂ１）成分を含有し、ゲルパーミエーションクロマトグラフィーチャートにおける前記（Ｂ１）成分のピークの総面積１００％中に占める、前記（Ｂ１）成分のポリスチレン換算の分子量１，０００以下の部分の面積の割合が０．１～２５％である、感光性樹脂組成物。（Ａ）成分：撥液材（Ｂ）成分：アルカリ可溶性樹脂（Ｃ）成分：キノンジアジド化合物（Ｂ１）成分：ノボラック型フェノール樹脂【選択図】なし

Xanthene compound, resin composition, cured object, method for producing cured object, organic el display device, and display device

An object of the present invention is to provide a xanthene compound having high heat resistance and capable of shielding light up to a long-wavelength region of visible light as compared to a conventional xanthene compound. In order to solve the above problem, a xanthene compound (b) of the present invention is a xanthene compound (b) represented by Formula (1).