28-08-2014 дата публикации
Номер: US20140238574A1
A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component. 1. A method of forming a mold structure having high-precision multi-dimensional components comprising:depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of said oxide layers;repositioning said substrates to enable said oxide layers make contact with one another;bonding in sequential order said repositioned substrates using dielectric bonding, forming a three dimension (3D) mold; andfilling said 3D mold with filling material and removing overburden of said filling material present on a top surface of said component.2. The method of wherein said plurality of substrates is made of silicon claim 1 , silicon germanium claim 1 , quartz claim 1 , polymers claim 1 , or organic compounds.3. The method of further comprising backside grinding the top semiconductor substrate with an endpoint of a grinding process on said patterned dielectric bonding layer upon removal of the semiconductor layer.4. The method of wherein said filling said mold structure is performed with bulk metallic glass employing thermo-compression molding or blowmolding.5. The method of wherein said overburden removal is performed using backside grinding from a side of said mold in which said filling material is introduced.6. The method of claim 1 , further comprising forming a cavity of said 3D mold filled with material.7. The method of claim 6 , wherein said filling ...
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