CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF

A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided. 1. A manufacturing method of a circuit carrier board , comprising:providing a first temporary carrier board;forming a first substrate on the first temporary carrier board, wherein the first substrate comprises a first circuit layer and a plurality of conductive structures, and the conductive structures being adapted to be electrically connected to a plurality of electronic elements;performing a bonding step of bonding the first substrate to a second temporary carrier board, and the conductive structures are located between the first circuit layer and the second temporary carrier board;removing the first temporary carrier board; a plurality of dielectric layers; and', 'a plurality of second circuit layers disposed in the dielectric layers, wherein a bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and a topmost layer of the second circuit layers is electrically connected to the first circuit layer; and, 'forming a second substrate on the first substrate to bond the second substrate to ...

Substrate structure and manufacturing method thereof

A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

Circuit board structure and manufacturing method thereof

A circuit board structure including an insulating layer, first and second dielectric layers, and first and second inductors is provided. The insulating layer includes a first surface, a second surface, and a first conductive through hole. The first dielectric layer is disposed on the first surface. The first inductor is disposed on the first surface and includes a first conductive coil in a solenoid form penetrating the first dielectric layer and a first magnetic flux axis of which the direction is substantially parallel to the first surface. The second dielectric layer is disposed on the second surface. The second inductor is disposed on the second surface and includes a second conductive coil in a solenoid form penetrating the second dielectric layer and a second magnetic flux axis of which the direction is substantially parallel to the second surface. A manufacturing method of a circuit board structure is provided.

Circuit carrier board structure and manufacturing method thereof

A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided. 1. A light-emitting diode package structure , comprising:a carrier, comprising a first build-up circuit;at least one self-assembled material layer, disposed on the first build-up circuit;a first solder mask layer, disposed on the first build-up circuit, having at least one opening to expose a portion of the at least one self-assembled material layer; andat least one light-emitting diode, disposed on the first build-up circuit, having a self-assembled pattern, wherein the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.2. The light-emitting diode package structure as claimed in claim 1 , wherein the at least one opening comprises at least one first opening claim 1 , at least one second opening claim 1 , and at least one third opening claim 1 , wherein a size of the at least one first opening is greater than a size of the at least one second opening claim 1 , and the size of the at least one second opening is greater than a size of the at least one ...

Manufacturing method of circuit carrier board structure

A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Manufacturing method of light-emitting diode package structure

A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

A light emitting device includes a light emitting diode package structure. The light emitting diode package structure includes a circuit structure, a plurality of light emitting diodes, and an encapsulation layer. The light emitting diodes are disposed on the circuit structure and electrically connected to the circuit structure. The encapsulation layer covers top surfaces and side surfaces of the light emitting diodes and a side surface of the circuit structure.

Light-emitting diode package structure and manufacturing method thereof

A light-emitting diode package structure includes a carrier, at least one self-assembled material layer, a first solder mask layer, and at least one light-emitting diode. The carrier includes a first build-up circuit. The self-assembled material layer is disposed on the first build-up circuit. The first solder mask layer is disposed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the self-assembled material layer. The light-emitting diode is disposed on the first build-up circuit. The light-emitting diode has a self-assembled pattern. The light-emitting diode is self-assembled into the opening of the first solder mask layer through a force between the self-assembled pattern and the self-assembled material layer. A manufacturing method of the light-emitting diode package structure is also provided.

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure. A substrate structure obtained by the manufacturing method of the substrate structure is provided.

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE

A manufacturing method of the light-emitting diode package structure is provided. A carrier is formed. The carrier comprises a first build-up circuit. At least one self-assembled material layer is formed on the first build-up circuit. A first solder mask layer is formed on the first build-up circuit. The first solder mask layer has at least one opening to expose a portion of the at least one self-assembled material layer. At least one light-emitting diode is disposed on the first build-up circuit. The at least one light-emitting diode has a self-assembled pattern, and the at least one light-emitting diode is self-assembled into the at least one opening of the first solder mask layer through a force between the self-assembled pattern and the at least one self-assembled material layer.

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.

Package structure and preparation method thereof

A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided.

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided. 1. A manufacturing method of a circuit carrier board , comprising:providing a first temporary carrier board;forming a first substrate on the first temporary carrier board, wherein the first substrate comprises a first circuit layer and a plurality of conductive structures, and the conductive structures being adapted to be electrically connected to a plurality of electronic elements;performing a bonding step of bonding the first substrate to a second temporary carrier board, and the conductive structures are located between the first circuit layer and the second temporary carrier board;removing the first temporary carrier board; a plurality of dielectric layers; and', 'a plurality of second circuit layers disposed in the dielectric layers, wherein a bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and a topmost layer of the second circuit layers is electrically connected to the first circuit layer; and, 'forming a second substrate on the first substrate to bond the second substrate to ...

CIRCUIT CARRIER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided. 1. A manufacturing method of a circuit carrier board structure , comprising:providing a temporary carrier board;forming a first substrate on the temporary carrier board, wherein the first substrate has a first surface and a second surface opposite to the first surface;providing a second substrate having a third surface and a fourth surface opposite to the third surface;disposing an adhesive layer on one of the first substrate and the second substrate, wherein the adhesive layer is located between the first substrate and the second substrate;combining the second surface of the first substrate to the third surface of the second substrate; andremoving the temporary carrier board,wherein the first substrate is electrically connected to the second substrate.2. The manufacturing method of the circuit carrier board structure of claim 1 , wherein the step of forming the first substrate comprises:forming a release layer on the temporary carrier board; andforming a plurality of first build-up layers stacked on the release layer in sequence,wherein each of the first build-up layers comprises ...

LIGHT EMITTING DIODE PACKAGE STRUCTURE, MANUFACTURING METHOD OF LIGHT EMITTING DIODE PACKAGE STRUCTURE AND LIGHT EMITTING PANEL

A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.

Circuit carrier board and manufacturing method thereof

A circuit carrier board includes a first substrate and a second substrate bonding to the first substrate. The first substrate includes a first circuit layer connecting to a plurality of conductive structure. The conductive structures connect to electronic elements. The second substrate contacts the first circuit layer. The second substrate includes a plurality of stacked dielectric layers, and a plurality of second circuit layers are disposed in the dielectric layers. The bottommost layer of the second circuit layers is exposed outside of the dielectric layers, and the topmost layer of the second circuit layers is electrically connected to the first circuit layer. The conductive structure includes a pad and a conductive via. The pad electrically connects to the first circuit layer. A linewidth of the first circuit layer is smaller than a linewidth of the second circuit layer. A manufacturing method of the circuit carrier board is also provided.

MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

Manufacturing method of substrate structure

A manufacturing method of a substrate structure includes the following steps. A first build-up circuit structure is formed. At least one copper pillar is formed on the first build-up circuit structure. A dielectric layer is formed on the first build-up circuit structure, and the dielectric layer wraps the copper pillar. A second build-up circuit structure and a capacitive element are formed on the dielectric layer. In particular, the second build-up circuit structure and the first build-up circuit structure are respectively located at two opposite sides of the dielectric layer. The capacitive element is disposed in a capacitive element setting region within the second build-up circuit structure. The copper pillar penetrates the dielectric layer and is electrically connected to the second build-up circuit structure and the first build-up circuit structure.

PACKAGE STRUCTURE AND PREPARATION METHOD THEREOF

A method of preparing a package structure is provided, which includes providing a carrier plate including a supporting layer, a first release layer, and a first metal layer; forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, each of the holes having an end portion substantially coplanar with each other at a same plane; forming a plurality of conductive protrusions filling the holes, each of the conductive protrusions having a first end and a second end opposite thereto; forming a circuit layer structure including at least one circuit layer and at least one second dielectric layer, the circuit layer being connected to the second end, the second dielectric layer being disposed over the circuit layer; removing the carrier plate; and removing a portion of the first dielectric layer to expose the conductive protrusions. A package structure is also provided. 1. A method of preparing a package structure , comprising:providing a carrier plate, the carrier plate including a support layer, a first metal layer, and a first release layer disposed between the support layer and the first metal layer;forming a first dielectric layer over the first metal layer, the first dielectric layer having a plurality of holes, wherein each of the holes adjacent to the first metal layer has an end portion, and each of the end portions is substantially coplanar with each other at a same plane;forming a plurality of conductive protrusions, each of the conductive protrusions filling each of the holes, each of the conductive protrusions having a first end and a second end opposite thereto, wherein each of the first ends corresponds to each of the end portions;forming a circuit layer structure over the first dielectric layer and each of the conductive protrusions, wherein the circuit layer structure comprises at least one circuit layer and at least one second dielectric layer, and the circuit layer is connected to the second end of ...

Circuit board structure and manufacturing method thereof

一種線路板結構，包括絕緣層、第一介電層、第一電感、第二介電層以及第二電感。絕緣層包括第一導電通孔、第一表面以及第二表面。第一導電通孔貫穿絕緣層以連通第一表面以及第二表面。第一介電層位於第一表面。第一電感位於第一表面且包括第一導電線圈以及第一磁通軸。第一導電線圈以螺旋形式貫穿第一介電層，且第一磁通軸的方向平行於第一表面。第二介電層位於第二表面。第二電感位於第二表面且包括第二導電線圈以及第二磁通軸。第二導電線圈以螺旋形式貫穿第二介電層，且第二磁通軸的方向平行於第二表面。一種線路板結構的製作方法亦被提出。

Tire chain assembly having a tension adjustment function

A tire chain assembly includes a chain body having a first side having a first end provided with a first snapping member and a second end provided with a second snapping member detachably engaged with the first snapping member. The chain body has a second side having a first end provided with a rack and a second end provided with an adjustment locking mechanism detachably engaged with the rack. Thus, the adjustment locking mechanism is adjustably movable on the rack to change the relative position between the adjustment locking mechanism and the rack so as to adjust the tension of the chain body so that the tire chain assembly is available for tires of different sizes.

Parallel connection structure for bicycle

Structure of parallel-connected electric bicycles

Tire chain assembly operated easily

A tire chain assembly includes a chain body having a first side provided with a first snapping member and a second snapping member detachably engaged with the first snapping member and a second side provided with a snapping hole and a rotation locking mechanism detachably locked on the snapping hole. The rotation locking mechanism includes a connecting plate, a snapping member, and a locking hook. Thus, the chain body is directly enclosed around the tire of a car without needing aid of a jack and without having to move the car, so that the tire chain assembly is mounted on the tire easily, thereby facilitating a user operating the tire chain assembly.