CRYOGENIC POWER CONTROL

An apparatus comprising a cryogenic chamber and a galvanic input interface to the cryogenic chamber configured to receive a lower amplitude electric current A converter is located within the cryogenic chamber and configured to convert the lower amplitude electric current provided by the galvanic input interface to a higher amplitude electric current for supply to a load within the cryogenic chamber A controller is configured to control the converter and to detect the onset of quench by comparing the duration of the charge/discharge cycle of the convertor with a stored value. The controller may also compare an instantaneous value of load current with a stored value of load current. 1. An apparatus comprising:a cryogenic chamber;a device for storing electric charge located within the chamber, the device being connected to an interface on the exterior of the chamber and to a load within the chamber, wherein the device operates according to predetermined charge and discharge cycles such that energy is stored and subsequently transferred to the load in a successive manner in use; and,a controller configured to monitor the charge and/or discharge cycle of the device in order to determine the onset of an adverse operating condition within the chamber.2. An apparatus according to claim 1 , wherein the adverse condition is a quench condition.3. An apparatus according to claim 1 , wherein the device is arranged to transfer a predetermined quantum of energy to the load during each discharge cycle.4. An apparatus according to claim 1 , wherein the controller monitors the duration of a charge and/or discharge cycle of the device.5. An apparatus according to claim 4 , wherein the controller compares an instantaneous duration of the charge and/or discharge cycle of the device with a stored duration value.6. An apparatus according to claim 1 , wherein the controller is arranged to monitor the current on the load.7. An apparatus according to claim 6 , wherein the load comprises a ...

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element. 1. A micro-electromechanical system (MEMs) package , comprising:a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate;a heating element electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers, wherein the heating element is vertically separated from the first substrate by the dielectric structure;a MEMs substrate coupled to the first substrate and comprising a MEMs device, wherein a hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate; andan out-gassing material disposed laterally between the hermetically sealed chamber and the heating element.2. The MEMS package of claim 1 , further comprising:a capping substrate coupled to an opposite side of the MEMs substrate as the first substrate, wherein the capping substrate has sidewalls and a horizontally extending surface that define the hermetically sealed chamber.3. The MEMs package of claim 1 , wherein the out-gassing material directly contacts sidewalls and a horizontally extending surface of ...

PRESSING PUMP

A press pump () comprises a press pump body ) in which a spring tube () is provided, a spring () is contained within the spring tube (); a cylinder head () mounted on the press pump body ) and including a internal bore (); a press head () including a pressing portion () and a rod portion (), the rod portion () is fit within the internal bore () of the cylinder head (), and a lower portion of the rod () engages with the spring (), so that the spring () applies an upward bias force on the press head (); and a piston (50) connected to the press head () and is slidably and sealingly engaged with the internal circumference of the press pump body ). The press pump () can use a spring () with relatively small size, while meet the requirement of large displacement, thus reducing manufacturing cost, and also can prevent contact between the product and the spring (), avoiding negative effects between them. 1. A press pump , characterized in that the press pump includes:a press pump body in which a spring tube is provided, a spring is contained within the spring tube;a cylinder head mounted on the press pump body and including an internal bore;a press head including a pressing portion and a rod portion, the rod portion is fit within the internal bore of the cylinder head, and a lower part of the rod portion engages with the spring, so that the spring applies an upward bias force on the press head; anda piston connected to the press head and is slidably and sealingly engaged with the internal circumference of the press pump body.2. The press pump according to claim 1 , wherein a spring tube mount is provided within the press pump body claim 1 , the spring tube is securely mounted in the spring tube mount claim 1 , wherein an engaging recess is provided on one of an outer circumferential surface of the spring tube and an inner circumferential surface of the spring tube mount claim 1 , and an engaging annular rib is provided on the other one of the outer circumferential surface ...

ANTI-STICTION PROCESS FOR MEMS DEVICE

A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process. 1. A method for treating a micro electro-mechanical system (MEMS) component , the method comprising the steps of:providing a first wafer;treating the first wafer to form cavities and at least one oxide layer on a top surface of the first wafer using a first chemical vapor deposition process;providing a second wafer;bonding the second wafer on a top surface of the at least one oxide layer;treating the second wafer to form a first plurality of structures; anddepositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second chemical vapor deposition process.2. The method of claim 1 , wherein the step of treating the first wafer further comprises the step of:etching the first wafer to create a first plurality of upward facing cavities.3. The method of claim 2 , wherein the step of treating the first wafer further comprises the step of:depositing an oxide layer on the top of the first wafer with the first plurality of the upward facing cavities using the first chemical vapor deposition process, wherein the first chemical vapor contains at least the oxide.4. The method of claim 1 , wherein the step of treating the second wafer further comprises the step of:fusing the second wafer on a top of the at least one oxide layer; andetching the second wafer to form a second plurality of structures.5. The method of claim 4 , wherein the step of ...

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

The present disclosure relates to micro-electromechanical system (MEMS) package that uses polysilicon inter-tier connections to provide for a low parasitic capacitance in MEM device signals, and a method of formation. In some embodiments, the MEMS package has a CMOS substrate with one or more semiconductor devices arranged within a semiconductor body. A MEMS substrate having an ambulatory element is connected to the CMOS substrate by a conductive bonding structure. The conductive bonding structure is arranged on a front-side of the MEMS substrate at a location laterally offset from the ambulatory element. One or more polysilicon vias extend through the conductive MEMS substrate to the bonding structure. The one or more polysilicon vias are configured to electrically couple the MEMS substrate to the CMOS substrate. By connecting the MEMS substrate to the CMOS substrate using the polysilicon vias, the parasitic capacitance and form factor of the MEMS package are reduced. 1. A micro-electromechanical system (MEMS) package , comprising:a CMOS substrate having one or more semiconductor devices arranged within a semiconductor body;a MEMS substrate having an ambulatory element, wherein the MEMS substrate is connected to the CMOS substrate by a conductive bonding structure arranged on a front-side of the MEMS substrate at a location that is laterally offset from the ambulatory element; andone or more conductive polysilicon vias extending through the MEMS substrate to the conductive bonding structure, wherein the one or more conductive polysilicon vias extend from a lower surface of the MEMS substrate that faces the CMOS substrate to a top surface of the MEMs substrate that faces away from the CMOS substrate, and wherein the one or more conductive polysilicon vias protrude outward from the top surface.2. The MEMS package of claim 1 , further comprising:a dielectric layer arranged onto a back-side of the MEMS substrate, wherein the one or more conductive polysilicon vias ...

HEATER DESIGN FOR MEMS CHAMBER PRESSURE CONTROL

The present disclosure relates to a MEMs package having a heating element configured to adjust a pressure within a hermetically sealed chamber by inducing out-gassing of into the chamber, and an associated method. In some embodiments, the MEMs package has a CMOS substrate having one or more semiconductor devices arranged within a semiconductor body. A MEMs structure is connected to the CMOS substrate and has a micro-electromechanical (MEMs) device. The CMOS substrate and the MEMs structure form a hermetically sealed chamber abutting the MEMs device. A heating element is electrically coupled to the one or more semiconductor devices and is separated from the hermetically sealed chamber by an out-gassing layer arranged along an interior surface of the hermetically sealed chamber. By operating the heating element to cause the out-gassing layer to release a gas, the pressure of the hermetically sealed chamber can be adjusted after it is formed. 1. A micro-electromechanical system (MEMs) package , comprising:a CMOS substrate having one or more semiconductor devices arranged within a semiconductor body;a MEMs structure connected to the CMOS substrate and comprising a micro-electromechanical (MEMs) device, wherein a hermetically sealed chamber abutting the MEMs device is arranged between the CMOS substrate and the MEMs structure; anda heating element electrically coupled to the one or more semiconductor devices and separated from the hermetically sealed chamber by an out-gassing layer arranged along an interior surface of the hermetically sealed chamber.2. The MEMS package of claim 1 , wherein the out-gassing layer is configured to release a gas into the hermetically sealed chamber during operation of the heating element to generate heat.3. The MEMS package of claim 1 , wherein the MEMs structure comprises:a MEMS substrate comprising an ambulatory element abutting the hermetically sealed chamber; anda capping substrate comprising a depression disposed within a surface ...

ANTI-STICTION PROCESS FOR MEMS DEVICE

A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process. 1. A device , comprising:a first wafer, wherein the first wafer comprises a first plurality of cavities and a first plurality of layers;a second wafer bonded over the first wafer, wherein the second wafer comprises a first plurality of structures and a second plurality of layers, wherein the second plurality of layers comprises a layer of germanium; anda complementary metal-oxide-semiconductor (CMOS) wafer eutecticly bonded to the second wafer, wherein the first wafer and the second wafer are coated with Self-Assembling Monolayer (SAM).2. The device of claim 1 , wherein the SAM is coated to a surface that has a contact angle larger than 90 degrees.3. The device of claim 1 , wherein the layer of germanium is etched to form a second plurality of structures.4. The device of claim 1 , wherein the layer of germanium is a patterned layer.5. The device of claim 1 , wherein:the first plurality of cavities comprises upward facing cavities.6. The device of claim 5 , wherein:the first plurality of layers comprises at least one oxide layer on the first plurality of cavities.7. The device of claim 6 , wherein:the second wafer is bonded on a top surface of the at least one oxide layer.8. The device of claim 1 , wherein:the second plurality of layers comprises a plurality of MEMS actuators.9. The device of claim 8 , wherein:at least part of the SAM is on the plurality of MEMS actuators ...

Semiconductor Isolation Structure with Air Gaps in Deep Trenches

A device includes a semiconductor substrate, a contact plug over the semiconductor substrate, and an Inter-Layer Dielectric (ILD) layer over the semiconductor substrate, with the contact plug being disposed in the ILD. An air gap is sealed by a portion of the ILD and the semiconductor substrate. The air gap forms a full air gap ring encircling a portion of the semiconductor substrate. 1. A method comprising:forming a first trench in a substrate, the first trench extending around a first active area and a second active area, the first trench comprising a plurality of trench extensions extending between the first active area and the second active area, the first trench being a continuous trench, the plurality of trench extensions being separated from each other in a direction from the first active area to the second active area device by a portion of the substrate;forming a first dielectric layer over the substrate, the first dielectric layer extending into the first trench, wherein a first air gap is sealed in the first trench by the first dielectric layer, wherein at least a portion of the first air gap is disposed in the first trench below a top surface of the substrate; andforming a contact plug extending through the first dielectric layer.2. The method of claim 1 , wherein the substrate along a first sidewall of the first trench contacts the first air gap.3. The method of claim 1 , further comprising claim 1 , prior to forming the first dielectric layer claim 1 , forming a second dielectric layer over the substrate claim 1 , the second dielectric layer being interposed between the first dielectric layer and the substrate.4. The method of claim 3 , wherein the second dielectric layer extends over a bottom of the first trench.5. The method of claim 3 , wherein the first dielectric layer completely covers the second dielectric layer.6. The method of claim 1 , wherein the substrate comprises a semiconductor-on-insulator substrate claim 1 , and wherein the first ...

OLED DISPLAY PANEL AND METHOD FOR MANUFACTURING SAME

The present disclosure provides an organic light emitting diode (OLED) display panel and a method for manufacturing same. The OLED display panel includes a substrate, a thermal insulating layer, a buffer, a driving TFT, and a storage capacitor. The substrate includes an arrangement area. The thermal insulating layer is disposed in the arrangement area. The buffer layer is disposed on the substrate. Both the driving TFT and the storage capacitor are disposed on the buffer layer to correspond to the arrangement area. According to the present disclosure, the thermal insulating layer prevents heat in the amorphous silicon layer from dissipating rapidly when an annealing treatment is performed for the amorphous silicon layer to have amorphous silicon crystallize. 1. An organic light emitting diode (OLED) display panel , comprising:a substrate including an arrangement area, wherein a driving thin film transistor (TFT) for driving an OLED device to emit light and a storage capacitor corresponding to the driving TFT are disposed in the arrangement area;a thermal insulating layer including at least one thermal insulating sublayer disposed in the arrangement area;a buffer layer disposed on the substrate and covering the thermal insulating layer;the driving TFT disposed on the buffer layer to correspond to the arrangement area; andthe storage capacitor disposed on the buffer layer to correspond to the arrangement area;wherein both the driving TFT and the storage capacitor include a polysilicon layer disposed on the buffer layer, the thermal insulating layer is configured to enhance, when amorphous silicon crystallizes to form the polysilicon layer, heat stability in the amorphous silicon;wherein the thermal insulating layer includes a first thermal insulating sublayer disposed on the substrate and a second thermal insulating sublayer disposed on the first thermal insulating sublayer, the first thermal insulating sublayer is made of a material different from that of the second ...

ANTI-LOOSENING EMULSION PUMP

An anti-loosening emulsion pump comprises a press head, a toothed sleeve, a cylinder and a piston rod, wherein the press head and the toothed sleeve are respectively provided with standing tooth pieces and standing tooth blocks interacting with each other. When the press head is rotated in a locking direction, the standing tooth pieces can move beyond the standing tooth blocks, and when the press head is rotated in an opening direction, the standing tooth pieces and the standing tooth blocks interact with each other, the rotation of the press head can be prevented. The press head of the anti-loosening emulsion pump further includes a press mouth which is movable relatively. The anti-loosening emulsion pump of the present invention can prevent the press head from being open due to such reasons as impact and the like, and can prevent the toothed sleeve from loosening from the opening of the container. 1. An anti-loosening emulsion pump , the anti-loosening emulsion pump comprising:a press head including a press mouth;a toothed sleeve connected to an opening of a container mounted with the anti-loosening emulsion pump;a cylinder, an upper end of which is connected to the toothed sleeve, and the other end of which extends into the container;a piston rod, an upper end of which is connected to the press head, and a lower end of which extends into a space within the cylinder, with a bore of the piston rod being communicated with an outlet of the press mouth;at least one first standing tooth piece provided at one of an inner surface of a press head sleeve of the press head and an outer surface of the toothed sleeve, which includes a first guide surface extending from the one of the inner surface of the press head sleeve and the outer surface of the toothed sleeve in an opening direction of the press head and forming an angle with a tangential direction of the press head or of the toothed sleeve, and a first stop surface provided at a side of the first standing tooth piece ...

HYBRID YARNS FORMED WITH FIBERS HAVING ROUNDED TIPS AND METHOD OF MAKING THE SAME

A hybrid yarn and a fabric including the hybrid yarn are provided. The hybrid yarn is formed of a plurality of fibers of a plurality of different fiber compositions. The fibers of different configurations are homogenized and intimate with one another throughout the yarn. The yarn may be formed using fibers made of the same material or a plurality of different materials. The different fiber compositions may include fibers of three or more different cross sections, fibers made of different materials or a combination of the two. Fibers having tips or ends are made so that the tips are rounded rather than squared to improve the manufacture and quality of the yarn. The materials may be synthetic and/or natural materials. Fabrics made with the hybrid yarn will have selectable functional features and also be of lighter weight than previously possible. Hybrid spinnerets may be used to produce hybrid yarns with three or more different fiber cross sections wherein spinneret portals that have tips are made with the tips rounded. 1. A hybrid yarn comprising a plurality of fibers , wherein the plurality of fibers includes fibers of at least three different fiber shapes , wherein three of the different fiber shapes are:one that has a cross section that is at least partially voided,one that is Y-shaped, andone that is W-shaped,wherein the Y-shaped fibers include three tips and the W-shaped fibers include five tips, wherein each of the tips of the Y-shaped fibers and the W-shaped fibers is rounded.2. (canceled)3. The hybrid yarn of wherein the fibers are textured after extrusion so that they are homogenized and intimate with one another throughout the yarn.4. The hybrid yarn of wherein the fibers of the yarn are made of the same material.5. The hybrid yarn of wherein the fiber with a cross section that is at least partially voided comprises between about 15% and about 85% of the total number of fibers of the hybrid yarn.6. The hybrid yarn of wherein the number of fibers of each of ...

SELECTIVE NITRIDE OUTGASSING PROCESS FOR MEMS CAVITY PRESSURE CONTROL

The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity. 1. A method for manufacturing a micro-electromechanical systems (MEMS) package , the method comprising:forming an outgassing element within a passivation layer over a CMOS substrate;forming an outgassing resistive layer to cover the outgassing element;removing the outgassing resistive layer from over the outgassing element; andbonding a MEMS substrate to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity, wherein after removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.2. The method of claim 1 , wherein outgassing resistive layer comprises silicon nitride.3. The method of claim 1 , wherein the outgassing element is formed by depositing and patterning a high density plasma oxide layer within a trench of the passivation layer claim 1 , wherein the outgassing element is formed to have an upper surface aligned with that of a hard mask overlying the passivation layer. ...

ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THEREOF

An organic light emitting diode (OLED) display and a method of manufacturing thereof are provided. The OLED display panel includes a substrate; a thin film transistor (TFT) layer on the substrate; a pixel defining layer above the TFT layer, the pixel defining layer having a via hole; a light emitting unit located in the via hole of the pixel defining layer, the light emitting unit includes an anode located at a bottom of the via hole, an organic light emitting material above the anode, a cathode located above the organic light emitting material, and a first reflective metal layer between the organic light emitting material and the pixel defining layer. 1. An organic light emitting diode (OLED) display panel , comprising:a substrate;a thin film transistor (TFT) layer on the substrate;a pixel defining layer above the TFT layer, the pixel defining layer having a via hole;a light emitting unit located in the via hole of the pixel defining layer, the light emitting unit comprises an anode located at a bottom of the via hole, an organic light emitting material above the anode, a cathode located above the organic light emitting material, and a first reflective metal layer between the organic light emitting material and the pixel defining layer;wherein the via hole of the pixel defining layer has a rectangular cross section in a direction parallel to the substrate, and an inverted trapezoid cross section perpendicular to the direction of the substrate; wherein, the inverted trapezoid is an isosceles trapezoid, and an angle between the waist of the inverted trapezoid and the vertical direction is greater than or equal to 5°.2. The OLED display panel according to claim 1 , wherein the anode of the light emitting unit is a laminated structure of a first transparent conductive layer/a second reflective metal layer/a second transparent conductive layer.3. The OLED display panel according to claim 2 , wherein a material of the first reflective metal layer and the second ...

Organic light emitting diode display panel and manufacturing method thereof

An organic light emitting diode (OLED) display panel and manufacturing method thereof are provided. The display panel includes a substrate, a thin film transistor layer, and a light emitting structure, wherein the thin film transistor layer includes a polysilicon layer, a gate dielectric layer positioned on the polysilicon layer, a gate metal layer positioned on the gate dielectric layer, a gate buffer layer positioned on the gate dielectric layer, and an interlayer dielectric layer covering the gate dielectric layer, the gate metal layer, and the gate buffer layer.

LIQUID PUMP USING ELASTOMERIC PISTON, PISTON ASSEMBLY AND MANUFACTURING METHOD THEREOF

The invention provides a liquid pump using an elastomeric piston. The liquid pump has a piston assembly (), which comprises: a piston rod (); a piston head (); a piston engaging portion () which is between the piston rod and the piston head in a necking shape; and a piston () made of an elastomeric material and sleeved around the piston engaging portion between the piston rod and piston head. The piston rod and piston head are formed separately and then assembled together. The piston engaging portion () is composed of a piston-engaging-portion formation part of at least one of the piston rod and the piston head. The invention also provides a method of manufacturing the piston assembly (). The invention further provides a piston assembly () for a liquid pump. The piston assembly has a piston () which is provided with an annular notch () formed on the periphery of an upper end of the piston () where an annular inner flange () is formed. The piston assembly and its manufacture method are helpful to improving product precision and quality and facilitate automated assembly, and are specially used for the liquid pumps using an elastomeric piston. 1. A liquid pump using an elastomeric piston , for mounting on a liquid container to pump liquid in said container out of said container , said liquid pump comprising a piston assembly which is disposed in a cylinder slidably in a longitudinal direction of the pump , said cylinder defining a liquid reservoir for accommodating liquid therein , said piston assembly comprising:a piston rod, formed with a fluid passage in a center of the piston rod in the longitudinal direction;a piston head, connected to a lower end of said piston rod;a piston engaging portion in the form of a neck between said piston rod and said piston head, said piston head being connected with said piston rod via said piston engaging portion, said piston engaging portion being formed with a transverse passage that diametrically extending through said piston ...

Mass spectrum resolution device for measuring laser ablation ion species with improved time of flight mass spectrometry

A mass spectrum resolution device for measuring laser ablation ion species with improved time of flight mass spectrometry includes a vacuum system unit, a plasma production unit, and a particle restraint selection and separation unit, wherein the particle restraint selection and separation unit comprises a particle limit selector and a plurality of ion pulse accelerated electrode plates; the particle limit selector comprises a restrainer lifting block, a restrainer and a restrainer selection baffle; a through hole is formed in the restrainer lifting block; a plurality of circular holes with different apertures are formed in the restrainer selection baffle, and the restrainer and the restrainer selection baffle are arranged in the restrainer lifting block and can move; and the ion pulse accelerated electrode plates are arranged in the advance direction of particles and are axially parallel to the restrainer lifting block.

Movement Microelectromechanical Systems (MEMS) Package

The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided. 1. A microelectromechanical systems (MEMS) package comprising:a device substrate comprising a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate; anda CMOS substrate bonded to the device substrate by a first bonding pad attached to the device substrate and a second bonding pad attached to the CMOS substrate, the first bonding pad and the second bonding pad meeting at a bonding interface;wherein a surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon;wherein the conformal anti-stiction layer is disposed between the device substrate and the first bonding pad.2. The MEMS package of claim 1 , wherein the moveable or flexible part is made of monocrystalline silicon.3. The MEMS package of claim 1 , wherein the conformal anti-stiction layer has a thickness in a range of from about 5 kÅ to about 50 kÅ and a root mean square (RMS) surface roughness in a range of from about 10 nm to about 30 nm.4. The MEMS package of claim 1 , wherein the CMOS substrate is bonded to the device substrate by an Al—Ge eutectic bonding pad claim 1 , and wherein the conformal anti-stiction layer is disposed between the device substrate and the Al—Ge eutectic bonding pad.5. The MEMS package of claim 1 , further comprising a cap substrate having a lower surface that abuts an upper surface of the device substrate such ...

Inter-poly connection for parasitic capacitor and die size improvement

The present disclosure, in some embodiments, relates to a method of forming a micro-electromechanical system (MEMS) package. The method includes forming one or more depressions within a capping substrate. A back-side of a MEMS substrate is bonded to the capping substrate after forming the one or more depressions, so that the one or more depressions define one or more cavities between the capping substrate and the MEMS substrate. A front-side of the MEMS substrate is selectively etched to form one or more trenches extending through the MEMS substrate, and one or more polysilicon vias are formed within the one or more trenches. A conductive bonding structure is formed on the front-side of the MEMS substrate at a location contacting the one or more polysilicon vias. The MEMS substrate is bonded to a CMOS substrate having one or more semiconductor devices by way of the conductive bonding structure.

OPTICAL SENSOR AND METHODS OF MAKING THE SAME

Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures. 1. A sensing apparatus , comprising:an image sensor;a collimator above the image sensor, wherein the collimator includes an array of apertures; andan optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.2. The sensing apparatus of claim 1 , wherein the portion of light is infrared light.3. The sensing apparatus of claim 1 , wherein the optical filtering layer includes metal oxide.4. The sensing apparatus of claim 1 , wherein the optical filtering layer extends continuously directly above the collimator and has an opening outside of the collimator.5. The sensing apparatus of claim 4 , further comprising:a conductive feature coupled to the image sensor, wherein the conductive feature extends through the opening.61. The sensing apparatus of claim 1 , wherein the optical filtering layer includes a plurality of sub-layers and has a total thickness greater than micrometer.7. The sensing apparatus of claim 1 , further comprising:an illumination layer above the optical filtering layer, wherein the illumination layer includes a plurality of light emitting pixels, and a portion of the plurality of light emitting pixels is configured to illuminate an object placed above the illumination layer.8. The sensing apparatus of claim 7 , further comprising:a blocking layer between the illumination layer and the optical filtering layer, wherein the blocking layer has a plurality of openings under the portion of the plurality of light emitting pixels, the opening ...

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

The present disclosure relates to a micro-electromechanical system (MEMS) structure including one or more semiconductor devices arranged on or within a first substrate and a MEMS substrate having an ambulatory element. The MEMS substrate is connected to the first substrate by a conductive bonding structure. A capping substrate is arranged on the MEMs substrate. The capping substrate includes a semiconductor material that is separated from the first substrate by the MEMS substrate. One or more conductive polysilicon vias include a polysilicon material that continuously extends from the conductive bonding structure, completely through the MEMS substrate, and to within the capping substrate. The semiconductor material of the capping substrate covers opposing sidewalls of the polysilicon material and an upper surface of the polysilicon material that is between the opposing sidewalls. 1. A micro-electromechanical system (MEMS) structure , comprising:one or more semiconductor devices arranged on or within a first substrate;a MEMS substrate having an ambulatory element, wherein the MEMS substrate is connected to the first substrate by a conductive bonding structure;a capping substrate arranged on the MEMs substrate, wherein the capping substrate comprises a semiconductor material that is separated from the first substrate by the MEMS substrate; andone or more conductive polysilicon vias comprising a polysilicon material that continuously extends from the conductive bonding structure, completely through the MEMS substrate, and to within the capping substrate, wherein the semiconductor material of the capping substrate covers opposing sidewalls of the polysilicon material and an upper surface of the polysilicon material that is between the opposing sidewalls.2. The MEMS structure of claim 1 , wherein the one or more conductive polysilicon vias comprise a polysilicon sidewall that is directly between sidewalls of the MEMS substrate and that is directly between sidewalls of ...

Multifunctional collimator for contact image sensors

Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm−3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Multifunctional collimator for contact image sensors

Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×10 19 per cubic centimeter (cm −3 ) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Permanently magnetic bearing

On-line digital dimmer, LED lighting device, dimming device and dimming method for adjusting brightness or color temperature plus color

本發明是一種在線數位調光器、LED照明裝置、調光裝置及調整亮度或色溫與顏色的調光方法，該在線數位調光器與LED照明裝置串聯於交流電源之供電迴路上，該在線數位調光器包含一開關電路、一觸發電路及一調光控制電路，其中，該調光控制電路係把調整亮度或色溫與顏色之調光信號編碼成以複數個0與1位元所構成之數位調光指令，根據該數位調光指令所含之0與1位元之不同而控制該觸發電路觸發時間的不同，使該開關電路產生具不同導通百分比之編碼電源傳遞至該LED照明裝置，再由LED照明裝置還原解出該數位調光指令，據此調整LED照明裝置之發光亮度或色溫與顏色，達到LED多彩多姿照明調光的目的。

Process for removing water from ammonia

Multifunctional collimator for contact image sensors

Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.

Method for enhancing fluorine utilization

Fibre channel zoning by logical unit number in hardware

The present invention provides a system and a method for filtering a plurality of frames sent between devices coupled to a fabric by Fiber Channel connections. Frames are reviewed against a set of individual frame filters. Each frame filter is associated with an action, and actions selected by filter matches are prioritized. Groups of devices are “zoned” together and frame filtering ensures that restrictions placed upon communications between devices within the same zone are enforced. Zone group filtering is also used to prevent devices not within the same zone from communicating. Zoning may also be used to create LUN-level zones, protocol zones, and access control zones. In addition, individual frame filters may be created that reference selected portions of frame header or frame payload fields.

Cryogenic power control

An apparatus 2 comprising a cryogenic chamber 4 and a galvanic input interface 6 to the cryogenic chamber 4 configured to receive a lower amplitude electric current 8. A converter 10 is located within the cryogenic chamber 4 and configured to convert the lower amplitude electric current 8, provided by the galvanic input interface 6, to a higher amplitude electric current 12 for supply to a load 14 within the cryogenic chamber 4. A controller 16 is configured to control the converter 10 and to detect the onset of quench by comparing the duration of the charge/discharge cycle of the convertor with a stored value. The controller 16 may also compare an instantaneous value of load current with a stored value of load current.

Cryogenic power control

An apparatus 2 comprising a cryogenic chamber 4 and a galvanic input interface 6 to the cryogenic chamber 4 configured to receive a lower amplitude electric current 8. A converter 10 is located within the cryogenic chamber 4 and configured to convert the lower amplitude electric current 8, provided by the galvanic input interface 6, to a higher amplitude electric current 12 for supply to a load 14 within the cryogenic chamber 4. A controller 16 is configured to control the converter 10 and to detect the onset of quench by comparing the duration of the charge/discharge cycle of the convertor with a stored value. The controller 16 may also compare an instantaneous value of load current with a stored value of load current.

Vacuum package container

Mass spectrum resolution apparatus for improving measurement of laser ablation ion species based on time-of-flight mass spectrometry

Mass spectrum resolution device for measuring laser ablation ion species with improved time of flight mass spectrometry

A mass spectrum resolution device for measuring laser ablation ion species with improved time of flight mass spectrometry includes a vacuum system unit, a plasma production unit, and a particle restraint selection and separation unit, wherein the particle restraint selection and separation unit comprises a particle limit selector and a plurality of ion pulse accelerated electrode plates; the particle limit selector comprises a restrainer lifting block, a restrainer and a restrainer selection baffle; a through hole is formed in the restrainer lifting block; a plurality of circular holes with different apertures are formed in the restrainer selection baffle, and the restrainer and the restrainer selection baffle are arranged in the restrainer lifting block and can move; and the ion pulse accelerated electrode plates are arranged in the advance direction of particles and are axially parallel to the restrainer lifting block.

Selective nitride outgassing process for MEMS cavity pressure control

The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.

Display panel and fabrication method thereof

Provided is a display panel including a substrate layer, an active layer, a first insulating layer, a first metal layer, a second insulating layer, and a second metal layer that are stacked. The second metal layer located in a display area of the display panel comprises a first portion and a second portion, and the second metal layer located in a non-display area of the display panel comprises a third portion, wherein a thickness of the first portion of the second metal layer is less than thicknesses of the second portion and the third portion of the second metal layer.

Object position detection device with integrated lens antenna

Labor-saving hollow blinds

Selective etching of titanium nitride with xenon difluoride

Fibre channel zoning by device name in hardware

The present invention provides a system and a method for filtering a plurality of frames sent between devices coupled to a fabric by Fibre Channel connections. Frames are reviewed against a set of individual frame filters. Each frame filter is associated with an action, and actions selected by filter matches are prioritized. Groups of devices are “zoned” together and frame filtering ensures that restrictions placed upon communications between devices within the same zone are enforced. Zone group filtering is also used to prevent devices not within the same zone from communicating. Zoning may also be used to create LUN-level zones, protocol zones, and access control zones. In addition, individual frame filters may be created that reference selected portions of frame header or frame payload fields.

Fresnel-type LED strip-type lamp

Inter-poly connection for parasitic capacitor and die size improvement

The present disclosure relates to micro-electromechanical system (MEMS) package that uses polysilicon inter-tier connections to provide for a low parasitic capacitance in MEM device signals, and a method of formation. In some embodiments, the MEMS package has a CMOS substrate with one or more semiconductor devices arranged within a semiconductor body. A MEMS substrate having an ambulatory element is connected to the CMOS substrate by a conductive bonding structure. The conductive bonding structure is arranged on a front-side of the MEMS substrate at a location laterally offset from the ambulatory element. One or more polysilicon vias extend through the conductive MEMS substrate to the bonding structure. The one or more polysilicon vias are configured to electrically couple the MEMS substrate to the CMOS substrate. By connecting the MEMS substrate to the CMOS substrate using the polysilicon vias, the parasitic capacitance and form factor of the MEMS package are reduced.

Verfahren zur abtrennung von wasser aus ammoniak

Optical sensor and methods of making the same

Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Multifunctional collimator for contact image sensors

Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction.

物位與溫度感測裝置

本發明係一物位與溫度感測裝置，係包含有一纜線、一物位感測模組、一溫度感測模組、一處理模組及一電源模組。本發明係利用射頻導納原理檢測並計算出目前的物料存量，且於該纜線中間隔的埋設有複數溫度感測單元，以檢測沿該纜線佈線方向的溫度變化。本發明係進一步利用溫度與物料電介質的變化關係，校正射頻導納原理中重要的物理參數，物料電容值，並於校正後計算出正確的物料存量，以消除因溫度變化造成的電介質差異所產生的參數誤差，從而避免造成計算物差，以提高利用射頻導納原理計算的物料存量的準確度。本發明同時藉由不同物質介面間溫度陡降的特徵點，提高量測解析度。

Optical sensor and methods of making the same

Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Polysilicium-zwischenlagenverbindung für parasitären kondensator und chipvergrösserung

Die vorliegende Erfindung betrifft ein MEMS-Package (MEMS: mikroelektromechanisches System), das Polysilicium-Zwischenlagenverbindungen verwendet, um eine niedrige parasitäre Kapazität in MEMS-Bauelement-Signalen zu realisieren, und ein Verfahren für seine Herstellung. Bei einigen Ausführungsformen hat das MEMS-Package ein CMOS-Substrat mit einem oder mehreren Halbleiter-Bauelementen, die in einem Halbleiterkörper angeordnet sind. Ein MEMS-Substrat, das ein wanderndes Element hat, ist mittels einer leitenden Bondstruktur mit dem CMOS-Substrat verbunden. Die leitende Bondstruktur ist auf einer Vorderseite des MEMS-Substrats an einer Stelle angeordnet, die gegenüber dem wandernden Element seitlich versetzt ist. Eine oder mehrere Polysilicium-Durchkontaktierungen verlaufen durch das leitende MEMS-Substrat bis zu der Bondstruktur. Die eine oder mehreren Polysilicium-Durchkontaktierungen sind so konfiguriert, dass sie das MEMS-Substrat mit dem CMOS-Substrat elektrisch verbinden. Durch das Verbinden des MEMS-Substrats mit dem CMOS-Substrat unter Verwendung der Polysilicium-Durchkontaktierungen werden die parasitäre Kapazität und der Formfaktor des MEMS-Package verringert.

LED supporting frame structure

具有電量調節功能的製程控制器

本發明係一種具有電量調節功能的製程控制器，係用以與一外部之現場裝置電連接，且包含有一傳輸裝置、一備載電源單元及一控制單元；其中，該備載電源單元係用以供應製程控制器及現場裝置所需的電量，且該控制單元係電連接至該傳輸單元、該備載電源單元及該現場裝置，並內建有一電量檢測暨驅動頻率調節程序，該電量檢測暨驅動頻率調節程序係檢知該備載電源單元可提供之電量與驅動現場裝置所需的電量，以增減每單位時間內驅動現場裝置的次數；可於備援電源單元供應電量較不足時減少驅動現場裝置的次數，避免快耗盡電量而於緊要時間無法驅動現場裝置。

Structure for clearing address translation lookaside buffer and method thereof

Improved assembly structure for lattice windows

Method for testing portable centrifugal microfluidic chip and its device

Modified-material-based high-precision combined antenna for satellite navigation and communications

A modified-material-based high-precision combined antenna for satellite navigation and communications includes a high-frequency satellite navigation antenna metal radiating surface, a low-frequency satellite navigation antenna metal radiating surface, a WIFI/Bluetooth antenna metal radiating surface, a PCB, a shielding metal cavity and an injection molded modified-material-based substrate. The low-frequency satellite navigation antenna metal radiating surface is located between the high-frequency satellite navigation antenna metal radiating surface and the PCB. The WIFI/Bluetooth antenna metal radiating surface is located on a side of the low-frequency satellite navigation antenna metal radiating surface. The injection molded modified-material-based substrate is made of polyphenyl ether doped with a modified material, and the modified material has a relative permittivity of 2.65 and a density of 1.06 g/cm 3 . The injection molded modified-material-based substrate includes a first injection molded modified-material-based substrate and a second injection molded modified-material-based substrate.

Remote-controlled clock

Extraction type terminal wiring box

Shift device of single shot percussion used in pin gun

Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials

Multifunctional collimator for contact image sensors

Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.

磁致伸縮感測器

本發明係關於一種磁致伸縮感測器，主要係於一個以上的內管套設有一外管，且於內管外及外管內套設有一防護管，該內管兩端分設有一上固定座及一下固定座，上固定座內設有一感測模組，又內管內穿設有一磁導材料，且磁導材料一端係穿設於內管及防護管之間並與感測模組電連接，其中，該防護管係使用一堅固且絕緣的材質，故可提供一較佳的支撐力，以避免內管及外管因偏擺而造成組裝誤差，及發生相互摩擦而造成毀損，又維修時，因拆除外管時可避免水氣或異物直接與內管內的感測模組或磁導材料接觸，如此一來即可達到防護感測器及可避免異物或水氣入侵的目的。

Lotion and cream pump

Adsorbent for water removal from ammonia

於模內持壓固化油墨的裝置

White light light-emitting diode

Heizvorrichtungsgestaltung für mems-kammerdrucksteuerung

Die vorliegende Offenbarung betrifft ein MEMS-Paket mit einem Heizelement, das konfiguriert ist, um einen Druck innerhalb einer hermetisch abgedichteten Kammer durch Induzieren von Ausgasung in die Kammer einzustellen, und ein zugehöriges Verfahren. In einigen Ausführungsformen weist das MEMS-Paket ein CMOS-Substrat mit einer oder mehreren Halbleitervorrichtungen auf, die in einem Halbleiterkörper angeordnet sind. Eine MEMS-Struktur ist mit dem CMOS-Substrat und einer mikroelektromechanischen(MEMS) Vorrichtung verbunden. Das CMOS-Substrat und die MEMS-Struktur bilden eine hermetisch abgedichtete Kammer, die an die MEMS-Vorrichtung angrenzt. Ein Heizelement ist elektrisch mit der einen oder den mehreren Halbleitervorrichtungen verbunden und ist von der hermetisch abgedichteten Kammer durch eine Ausgasungsschicht, die entlang einer Innenfläche der hermetisch abgedichteten Kammer angeordnet ist, getrennt. Durch Betätigen des Heizelementes, um die Ausgasungsschicht zu veranlassen, ein Gas freizusetzen, kann der Druck der hermetisch abgedichteten Kammer eingestellt werden, nachdem sie ausgebildet wurde.

可排水防風的鋁門窗下框料

Improved structure for adjusting foot stand of system furniture

Adjustable hanging rack improvement

導熱塗層結構及應用該導熱塗層結構之電子元件

Method for testing portable centrifugal microfluidic chip and its device

Color wheel apparatus

Improvement for air tighting strip of aluminum door & window

New material-based high-precision satellite navigation and communication combined antenna

Modified-material-based high-precision combined antenna for satellite navigation and communications

A modified-material-based high-precision combined antenna for satellite navigation and communications includes a high-frequency satellite navigation antenna metal radiating surface, a low-frequency satellite navigation antenna metal radiating surface, a WIFI/Bluetooth antenna metal radiating surface, a PCB, a shielding metal cavity and an injection molded modified-material-based substrate. The low-frequency satellite navigation antenna metal radiating surface is located between the high-frequency satellite navigation antenna metal radiating surface and the PCB. The WIFI/Bluetooth antenna metal radiating surface is located on a side of the low-frequency satellite navigation antenna metal radiating surface. The injection molded modified-material-based substrate is made of polyphenyl ether doped with a modified material, and the modified material has a relative permittivity of 2.65 and a density of 1.06 g/cm 3 . The injection molded modified-material-based substrate includes a first injection molded modified-material-based substrate and a second injection molded modified-material-based substrate.

棘輪扳手之驅動頭套接結構

一種棘輪扳手之驅動頭套接結構，該棘輪扳手係於本體之一端裝設有換向開關、卡掣齒及驅動頭，該驅動頭之外環面係環設有與該卡掣齒嚙合傳動之棘齒部，並於第一端端面凸設有樞軸部，於第二端端面則凸設有呈多角狀之套接柱，以供套接套筒工具之接合端；其中，該驅動頭係於第二端鄰接套接柱周面位置之端面上向內凹設有環槽，使該套接柱於環槽內延伸有連接柱，該連接柱係至少不大於該套接柱的周面尺寸，且該環槽外緣的內徑至少大於該套筒工具之接合端的外徑；藉此，當驅動頭之套接柱套接套筒工具時，即可使套筒工具之接合端的部分長度隱入於驅動頭之環槽內，以縮短套筒工具的凸伸長度，進而達到提升使用便利性之效益。

Lotion pump

Improved structure of push and pull rail for door closet

Pneumatic hammer

Door lock with indication device

具有防逆轉裝置之阻旋式物位開關

Luminous hand-held flag

Improved structure of rear valve cover of pin gun

Improved structure of branch trimming scissors

Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials

Highly viscous emulsion pump

模組化櫥櫃裝置的連接桿結構

Optoelectric liquid level detector

具自動關閉袋口之收集裝置

New material-based high-precision satellite navigation and communication combined antenna

The present invention provides a modified-material-based high-precision combined antenna for satellite navigation and communications, including a high-frequency satellite navigation antenna metal radiating surface, a low-frequency satellite navigation antenna metal radiating surface, a WIFI/Bluetooth antenna metal radiating surface, a PCB and a shielding metal cavity. The low-frequency satellite navigation antenna metal radiating surface is located between the high-frequency satellite navigation antenna metal radiating surface and the PCB. The WIFI/Bluetooth antenna metal radiating surface is located on a side of the low-frequency satellite navigation antenna metal radiating surface. In the present invention, engineering plastic doped with a modified material is employed to integrally form the substrate through injection molding, and then the combined antenna is integrally formed through an electroplating process, which greatly reduces the production cost, and can be widely used in satellite positioning and navigation, surveying and mapping, mobile communications and other related fields.

Lotion pump with an externally installed spring

Portable electric cervical vertebra traction apparatus

排水防風套件

Improved suture scissors for medical use

三合一鼓

本發明係提供一種三合一鼓，其包括鼓腔、鼓皮和壓圈，該壓圈係固設於該鼓腔之上、下方，還包括設置在鼓腔內部且能夠上下調節的打擊托盤，所述打擊托盤上覆蓋有軟墊，所述打擊托盤和軟墊之間設有能夠與電子音源外接的環形打擊觸發器，所述打擊托盤底部還設有能夠與音箱外接的麥克風震動器，所述軟墊在打擊托盤向上調節的作用下能夠緊貼在鼓皮底部。正轉調節杆時，打擊托盤上升使得軟墊緊貼鼓皮，打擊鼓皮不發聲，可實現啞鼓功能；外接電子音源，打擊觸發器傳送電子信號，可實現電子鼓功能；外接音箱，麥克風震動器會把音頻信號成倍擴大，可實現音頻功放功能；反轉調節杆時，打擊托盤下降使得軟墊遠離鼓皮，打擊鼓皮發聲，可實現原音鼓功能。

Quick assemble/disassemble of pressing plate mechanism

Structure of shaped aluminum used in window replacement

Improvement of airtight strap for aluminum door and window

表單資料處理系統

櫃體結合結構

Method for etching high dielectric constant materials and for cleaning deposition chambers for high dielectric constant materials