Optoelectronic transmitter, optoelectronic receiver and optoelectronic transceiver

An optoelectronic transmitter including a semiconductor substrate, at least one laser source, and a high numerical aperture (NA) waveguide is provided. The laser source is disposed on the semiconductor substrate and configured to emit at least one laser beam. The high numerical aperture (NA) waveguide has an NA greater than or equal to 0.5 and is disposed on the semiconductor substrate. At least a part of the laser beam from the laser source enters the high NA waveguide, wherein no lens is disposed on the light path of the laser beam between the laser source and the high NA waveguide. An optoelectronic receiver and an optoelectronic transceiver are also provided.

OPTOELECTRONIC TRANSMITTER, OPTOELECTRONIC RECEIVER AND OPTOELECTRONIC TRANSCEIVER

An optoelectronic transmitter including a semiconductor substrate, at least one laser source, and a high numerical aperture (NA) waveguide is provided. The laser source is disposed on the semiconductor substrate and configured to emit at least one laser beam. The high numerical aperture (NA) waveguide has an NA greater than or equal to 0.5 and is disposed on the semiconductor substrate. At least a part of the laser beam from the laser source enters the high NA waveguide, wherein no lens is disposed on the light path of the laser beam between the laser source and the high NA waveguide. An optoelectronic receiver and an optoelectronic transceiver are also provided. 1. An optoelectronic transmitter comprising:a semiconductor substrate;at least one laser source disposed on the semiconductor substrate and configured to emit at least one laser beam; anda high numerical aperture (NA) waveguide having an NA greater than or equal to 0.5 and disposed on the semiconductor substrate, at least a part of the laser beam from the laser source being transmitted into the high NA waveguide directly without penetrating a lens disposed between the laser source and the high NA waveguide.2. The optoelectronic transmitter according to claim 1 , wherein the at least one laser source is a plurality of laser sources claim 1 , the high NA waveguide comprises a plurality of branches claim 1 , and laser beams emitted from the laser sources enter the branches claim 1 , respectively.3. The optoelectronic transmitter according to claim 2 , wherein the branches combine into a single light emitting end of the high NA waveguide claim 2 , and the laser beams transmitted through the branches are combined into a mixed signal beam and outputted from the light emitting end.4. The optoelectronic transmitter according to further comprising a lens disposed on a light path of the mixed signal beam from the light emitting end.5. The optoelectronic transmitter according to further comprising a lens fiber ...

Optical coupler module having optical waveguide structure

An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.

OPTICAL CONNECTION MODULE

An optical connection module includes a substrate, a light source, an optical detector, at least one first optical channel, at least one second optical channel, an oblique surface and a light guide device. The light source is disposed on the substrate and is configured to emit a first light. The first optical channel is configured to transmit the first light, and the light guide device is configured to guide the first light propagating from the light source into the first optical channel in a manner of light transmission. The optical detector is disposed on the substrate and is configured to receive a second light. The second optical channel is configured to transmit the second light, and the oblique surface is configured to guide the second light propagating from the second optical channel into the optical detector in a manner of reflection. 1. An optical connection module , comprising:a substrate:a light source, configured to emit a first light, disposed on the substrate;an optical detector, configured to receive a second light, disposed on the substrate;at least one first optical channel, configured to transmit the first light;at least one second optical channel, configured to transmit the second light;a light guide device, configured to guide the first light propagating from the light source into the first light channel in a manner of light transmission; andan oblique surface, configured to guide the second light propagating from the second optical channel into the optical detector in a manner of light reflection.2. The optical connection module of claim 1 , further comprising:a cover plate, wherein the oblique surface is disposed on the cover plate and the second optical channel is fixed between the cover plate and the substrate.3. The optical connection module of claim 2 , wherein the substrate has a recess claim 2 , and the optical detector is disposed in the recess claim 2 ,4. The optical connection module of claim 2 , wherein the substrate has a protrusion ...

Optical Inertial Sensing Module

An optical inertial sensing module is proposed. The optical inertial sensing module includes a substrate, having a concave structure, and a through hole structure. The concave structure is formed on the top surface and has a first reflection surface and a second reflection surface, and the through hole structure passes through from the top surface to the bottom surface of the substrate. A light emitting device is disposed within the through hole structure of the substrate. A light-guiding structure is configured in the concave structure and located between the first reflection surface and the second reflection surface. At least one photo detector is disposed on the top surface of the substrate, and a mother board is used for the substrate configured thereon. 1. An optical inertial sensing module , comprising:a substrate, having a concave structure and a through hole structure, wherein said through hole structure passes through from a top surface to a bottom surface of said substrate;a light emitting device, disposed within said through hole structure of said substrate, wherein said light emitting device is capable of emitting an optical signal; andan inertial sensor, disposed above said light emitting device, wherein said inertial sensor extends into said through hole structure of said substrate for reflecting light emitted from said light emitting device.2. The module of claim 1 , further comprising a light-guiding structure configured in said concave structure.3. The module of claim 1 , further comprising at least one photo detector disposed on said top surface of said substrate.4. The module of claim 1 , further comprising a mother board for said substrate configured thereon.5. The module of claim 1 , further comprising a flexible printed board configured on said substrate.6. An optical inertial sensing module claim 1 , comprising:a substrate, having a concave structure and a through hole structure, wherein said concave structure is formed on a top surface of ...

OPTICAL CONNECTION MODULE

An optical connection module includes a substrate, an arrayed wavelength grating structure, an optical detector, and an oblique surface. The arrayed wavelength grating structure is disposed on the substrate and the arrayed wavelength grating structure is configured to transmit a light. The optical detector is disposed on the substrate, and the optical detector is configured to detect the light propagating through the arrayed wavelength grating structure. The oblique surface is configured to redirect the light from the arrayed wavelength grating structure to the optical detector. 1. An optical connection module , comprising:a substrate;an arrayed wavelength grating structure, configured to transmit a light, disposed on the substrate;an optical detector, configured to detect the light propagating through the arrayed wavelength grating structure, disposed on the substrate; andan oblique surface configured to redirect the light from the arrayed wavelength grating structure to the optical detector.2. The optical connection module of claim 1 , wherein the arrayed wavelength grating structure has a light input portion and a light output portion that are opposite claim 1 , and the oblique surface connects to the light output portion.3. The optical connection module of claim 1 , wherein the oblique surface is located on the arrayed wavelength grating structure.4. The optical connection module of claim 3 , wherein the arrayed wavelength grating structure has a first surface and a second surface connected with the oblique surface the first surface opposite to the second surface is closer to the optical detector claim 3 , and an angle formed by the oblique surface and the first surface is an acute angle.5. The optical connection module of claim 4 , wherein an angle formed by the oblique surface and the second surface is an obtuse angle.6. The optical connection module of claim 1 , the arrayed wavelength grating structure comprises:a first cladding layer;a second cladding layer, ...

Optical coupler module having optical waveguide structure

The optical coupler module for converting and transmitting electrical/optical signals (27; 38) includes a semiconductor substrate (20; 30), a first film (21; 31), a second film (22; 32), an electrical transmission unit (23; 33), at least one signal conversion unit and an optical waveguide structure (26; 36). The first film (21; 31) and the second film (22; 32) are formed on opposite surfaces (201, 202; 301, 302) of the semiconductor substrate (20; 30). The signal conversion unit and the optical waveguide structure (26; 36) are disposed on opposite sides of the semiconductor substrate (20; 30). The optical waveguide structure (26; 36) has a reflector and (263; 363) a waveguide body (260; 360). The optical signal (28) generated from the signal conversion unit sequentially passes the first film (21), the semiconductor substrate (20) and the second film (22) and enters the optical waveguide structure (26). Then, the optical signal (28) is reflected by the reflector (263) and transmitted in the waveguide body (260) to be outputted. Alternatively, the optical signal (38) is transmitted in a reverse direction from the optical waveguide structure (36) to the signal conversion unit.

Seasoning method for etch chamber

Optical coupler module having optical waveguide structure

Polyesters with good color tone, process for producing the same and use thereof

The present invention relates to a polyester with good color tone prepared by using a catalyst stabilizing system comprising 1) a polymerization catalyst containing a titanium-containing compound of formula (I) as below: (Me n O) x • (TiO 2 ) y • (H 2 O) z and a zinc-containing compound, 2) a toner containing a compound of formula (II) as below:

Optical transmission module

Semiconductor structure and manufacturing method thereof

A method includes depositing a dielectric layer over a semiconductor substrate; forming a first photoresist layer over the dielectric layer; patterning the first photoresist layer to form through holes, such that a first portion of the first photoresist layer between a first one and a second one of the through holes has a less height than a second portion of the first photoresist layer between the first one and a third one of the through holes; forming a spacer on the first portion of the first photoresist layer; performing an etching process on the dielectric layer to form via holes while the spacer remains covering the first portion of the first photoresist layer; forming a plurality of metal vias in the via holes.

Method of manufacturing semiconductor devices

In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.

Polyester mit gutem farbton, verfahren zu ihrer herstellung und ihre verwendung

Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device includes forming an underlying structure in a first area and a second area over a substrate. A first layer is formed over the underlying structure. The first layer is removed from the second area while protecting the first layer in the first area. A second layer is formed over the first area and the second area, wherein the second layer has a smaller light transparency than the first layer. The second layer is removed from the first area, and first resist pattern is formed over the first layer in the first area and a second resist pattern over the second layer in the second area.

Method for forming semiconductor device

A first group of semiconductor fins are over a first region of a substrate, the substrate includes a first stepped profile between two of the first group of semiconductor fins, and the first stepped profile comprises a first lower step, two first upper steps, and two first step rises extending from opposite sides of the first lower step to the first upper steps. A second group of semiconductor fins are over a second region of the substrate, the substrate includes a second stepped profile between two of the second group of semiconductor fins, and the second stepped profile comprises a second lower step, two second upper steps, and two second step rises extending from opposite sides of the second lower step to the second upper steps, in which the second upper steps are wider than the first upper steps in the cross-sectional view.

Luminaries design platform and the method of processing the same

Method of manufacturing semiconductor devices

In a method of forming a pattern, a first pattern is formed over an underlying layer, the first pattern including main patterns and a lateral protrusion having a thickness of less than 25% of a thickness of the main patterns, a hard mask layer is formed over the first pattern, a planarization operation is performed to expose the first pattern without exposing the lateral protrusion, a hard mask pattern is formed by removing the first pattern while the lateral protrusion being covered by the hard mask layer, and the underlying layer is patterned using the hard mask pattern as an etching mask.

Spraying device

A spraying device to be used in an image transfer process is provided, which includes at least one nozzle. A fluid is supplied to each nozzle, and the nozzles spray the fluid on a substrate to form a liquid film. Further, a dual fluid spraying device is also provided. A dual fluid formed by mixing a liquid with a gas is sprayed on a substrate through at least one nozzle of the spraying device, so as to form a thinner and more uniform liquid film. A photoresist can be laminated to a substrate having the liquid film applied to it with the spraying device to afford enhanced conformability of the photoresist in the substrate in the resulting laminate. This enhanced conformability affords reduced defectivity levels in subsequent processing steps during PCB (printed circuit board) manufacture.

Device and method for image projection

Electrode for electrolysis and electrolysis device and pumping device using the same

The present invention provides a pump device comprising a housing and a electrode device. The housing has an inlet and an outlet arranged at a side of the housing for allowing a first flow flowing into the housing. The electrode device is arranged in the housing, and comprises a rotating body having a fluid inlet, a plurality of first flow channels, at least one first electrode and at least one second electrode. The rotating body is driven to rotate thereby generating a negative pressure for drawing the first fluid into the plurality of first flow channels through the fluid inlet such that the first fluid is reacted with the first and second electrodes thereby generating micro bubbles and is exhausted from the plurality of first flow channels. The first flow having micro bubbles are exhausted from the housing through the outlet.