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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 3. Отображено 3.
23-06-2023 дата публикации

Polishing device for wafer processing

Номер: CN116276405A
Автор: YANG ZHIYONG, WANG HENG, SHAN QINGXI, LEE JAE-KYUNG, CHENG LURONG
Принадлежит:

The invention discloses a polishing device for wafer processing, and relates to the field of polishing, the polishing device comprises a bottom plate, a frame body is fixedly arranged at the upper end of the bottom plate, two sliding plates are symmetrically arranged on the frame body in a sliding mode, and a sliding assembly used for the two sliding plates to slide in the opposite direction or away from each other is arranged on the frame body; and first rotating pipes are arranged on the two sliding plates in a penetrating mode through bearings correspondingly, and rotating center rotating discs are arranged at the opposite ends of the two first rotating pipes correspondingly. Compared with the prior art, the wafer clamping device has the advantages that when a wafer is clamped, even if granular protrusions appear on the surface of the wafer, the surface of the wafer can be attached in a self-adaptive mode through the extrusion fixing assembly on the center rotating disc or the edge rotating ...

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Номер записи: 1
11-08-2023 дата публикации

Efficient temperature control batch type vertical furnace for semiconductor wafer preparation

Номер: CN116575129A
Автор: YANG ZHIYONG, CHOI YOUNG-HYUN, CHENG LURONG, WANG HENG, SHAN QINGXI
Принадлежит:

The invention discloses an efficient temperature control batch type vertical furnace for semiconductor wafer preparation, which comprises a cylindrical furnace body, a furnace bottom fixedly connected with the bottom of the furnace body and a furnace top fixedly connected with the top of the furnace body, the furnace body is provided with a loading opening, and the loading opening is provided with a lifting door capable of closing the loading opening; a rotating column is mounted in the furnace body, the rotating column is connected with three bearing frames which are annularly distributed at equal intervals, the bearing frames can bear a plurality of semiconductor wafers, and a rotation driving unit capable of driving the rotating column to rotate is mounted at the bottom of the furnace bottom; a lifting partition unit is further installed in the furnace body and comprises three lifting heat insulation plates which are annularly distributed at equal intervals, the three lifting heat insulation ...

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Номер записи: 2
06-06-2023 дата публикации

Plasma photoresist removing device for semiconductor wafer manufacturing

Номер: CN116230601A
Автор: YANG ZHIYONG, CHOI YOUNG-HYUN, CHENG LURONG, WANG HENG, SHAN QINGXI
Принадлежит:

The invention discloses a plasma degumming device for semiconductor wafer manufacturing, which comprises a plasma degumming unit and a material taking and feeding unit, the plasma degumming unit comprises a box body and a cabin door, the box body is internally provided with a working cavity, the working cavity is internally provided with a working table and a movable carrier frame, the working table is connected with an upper substrate and a lower substrate, and the upper substrate and the lower substrate are connected with the cabin door. A feeding and discharging groove is formed between the upper base plate and the lower base plate, the movable carrying frame comprises an upper arc-shaped plate, a lower arc-shaped plate and a plurality of connecting vertical rods which are connected with the upper arc-shaped plate and the lower arc-shaped plate and can be embedded into the upper limiting groove and the lower limiting groove, and the upper arc-shaped plate is provided with a plurality ...

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Номер записи: 3