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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 9. Отображено 9.
23-08-2012 дата публикации

MICROWAVE UNIT AND METHOD THEREFORE

Номер: US20120211487A1
Автор: Leif Bergstedt, Bengt Madeberg, BERGSTEDT LEIF, MADEBERG BENGT
Принадлежит: Huawei Technologies Co., Ltd.

A microwave unit comprising a motherboard and a package adapted to be assembled automatically in, e.g., a Surface Mounted Device, SMD, machine is disclosed. The microwave unit preferably comprises a connecting component interconnecting the motherboard and the package, and operable to make the signal ways on a same level at both the motherboard and at the package. Furthermore, the microwave unit preferably comprises a micro-strip adapted soldering tag for soldering on two sides.

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Номер записи: 1
22-08-2013 дата публикации

Microwave Module

Номер: US20130215576A1
Автор: Goran Wennberg, Peter Hammar, Bengt Madeberg, Leif Bergstedt
Принадлежит: Huawei Technologies Co., Ltd.

The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board. 1. A microwave module comprising:a printed circuit board (PCB);a first housing part;a second housing part; anda diplexer,wherein the first housing part and the second housing part are adapted to act as a shielding cover, andwherein the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the PCB.2. The microwave module according to claim 1 , wherein the PCB is positioned between the first housing part and the second housing part claim 1 , wherein the PCB comprises a microwave side with a large plated area facing the second housing part claim 1 , wherein the second housing part comprises a filter geometry facing the PCB claim 1 , and wherein the diplexer is made out of the filter geometry and the plated area.3. The microwave module according to claim 2 , wherein the plated area is adapted to function as a metal cover towards the filter geometry of the second housing part.4. The microwave module according to claim 1 , wherein the first housing part functions as a mechanical fix point adapted to be fastened to an antenna.5. The microwave module according to claim 4 , wherein the first housing part comprises a wave guide adapted to lead a microwave signal in and out of the module.6. The microwave module according to claim 4 , wherein the first housing part comprises two backshort cavities.7. The microwave module according to claim 4 , wherein an outside of the first housing part comprises cooling flanges in a 45° direction claim 4 , and wherein the module is adapted to be fastened to the antenna such that the cooling ...

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Номер записи: 2
27-10-2015 дата публикации

Module and coupling arrangement

Номер: US0009172126B2
Автор: Bengt Madeberg, Leif Bergstedt, MADEBERG BENGT, BERGSTEDT LEIF
Принадлежит: Huawei Technologies Co., Ltd., HUAWEI TECH CO LTD, HUAWEI TECHNOLOGIES CO., LTD.

The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

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Номер записи: 3
24-04-2014 дата публикации

Module and Coupling Arrangement

Номер: US20140111292A1
Автор: Bengt Madeberg, Leif Bergstedt, MADEBERG BENGT, BERGSTEDT LEIF
Принадлежит: Huawei Techonologies Co., Ltd.

The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.

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Номер записи: 4
29-03-2016 дата публикации

Microwave module

Номер: US0009301426B2
Автор: Goran Wennberg, Peter Hammar, Bengt Madeberg, Leif Bergstedt, WENNBERG GORAN, HAMMAR PETER, MADEBERG BENGT, BERGSTEDT LEIF
Принадлежит: Huawei Technologies Co., Ltd., HUAWEI TECH CO LTD, HUAWEI TECHNOLOGIES CO., LTD.

The present application relates to a microwave module comprising a printed circuit board, a first housing part, a second housing part, and a diplexer. It is specifically proposed that the first and second housing parts are adapted to act as a shielding cover, and that the diplexer and its filter are an integrated part in the module and are made out of the shielding cover and the printed circuit board.

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Номер записи: 5
02-02-2016 дата публикации

Coupling arrangement

Номер: US0009252474B2
Автор: Bengt Madeberg, Leif Bergstedt, MADEBERG BENGT, BERGSTEDT LEIF
Принадлежит: Huawei Technologies Co., Ltd., HUAWEI TECH CO LTD, HUAWEI TECHNOLOGIES CO., LTD.

A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.

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Номер записи: 6
24-04-2014 дата публикации

COUPLING ARRANGEMENT

Номер: US20140111293A1
Автор: Bengt Madeberg, Leif Bergstedt, MADEBERG BENGT, BERGSTEDT LEIF
Принадлежит: Huawei Technologies Co., Ltd.

A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling. 1. A coupling arrangement for transfer of a microwave signal , the arrangement comprising:a motherboard comprising a substrate with a first microstrip conductor;a module comprising a substrate with a second microstrip conductor;wherein the module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor; andwherein the connection comprises the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.2. The coupling arrangement according to claim 1 , wherein the slot coupling comprises a slot in the substrate integrated waveguide connected to a slot in a ground plane on a side of the module substrate claim 1 , wherein the two slots are connected by a connecting substance around their peripheries claim 1 , and wherein the module conductor is situated opposite the ground plane slot on a side of the module substrate opposite the side with the ground plane.3. The coupling arrangement according to claim 2 , wherein the slots are aligned with each other.4. The coupling arrangement ...

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Номер записи: 7
25-12-2013 дата публикации

Coupling arrangement

Номер: EP2676321A1
Автор: Bengt Madeberg, Leif Bergstedt
Принадлежит: Huawei Technologies Co Ltd

The invention concerns a coupling arrangement (1) for transfer of a microwave signal, the arrangement (1) comprising: - a motherboard (2) comprising a substrate (3) with a microstrip conductor (4), and - a module (5) comprising a substrate (6) with a microstrip conductor (7). Further, the module (5) is attached to the motherboard (2) such that the motherboard conductor (4) by means of a connection (17) is in electrical contact with the module conductor (7), whereby the microwave signal may be transferred between the motherboard conductor (4) and the module conductor (7). The invention is distinguished in that the connection (17) comprises the motherboard conductor (4) connected to a substrate integrated waveguide (8) on the motherboard (2), which substrate integrated waveguide (8) is connected to the module conductor (7) via a slot coupling (9).

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Номер записи: 8
04-07-2012 дата публикации

A microwave unit and method therefore

Номер: EP2471351A1
Автор: Bengt Madeberg, Leif Bergstedt
Принадлежит: Huawei Technologies Co Ltd

A microwave unit (10) comprising a motherboard (12) and a package (14) adapted to be assembled automatically in, e.g., a Surface Mounted Device, SMD, machine is disclosed. The microwave unit (10) preferably comprises a connecting component (16) interconnecting the motherboard (12) and the package (14), and operable to make the signal ways on a same level at both the motherboard (12) and at the package (14). Furthermore, the microwave unit (10) preferably comprises a micro-strip adapted soldering tag (18) for soldering on two sides (18 1 , 18 2 ).

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Номер записи: 9