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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 16. Отображено 16.
26-02-2016 дата публикации

MEMS Sensor Module and MEMS Sensor Package Module

Номер: KR0101598257B1
Автор: 정원규, 이정원, 송종형
Принадлежит: 삼성전기주식회사

... 본 발명의 일실시예에 따른 MEMS 센서모듈은 센싱부와, 상기 센싱부에 연결된 기판과, 전도성 연결부에 의해 상기 기판에 연결된 외부보드를 포함하고, 상기 기판에는 상기 센싱부에 대향되어 캐비티가 형성된다.

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Номер записи: 1
27-09-2017 дата публикации

ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170108383A
Автор: KANG PIL JOONG, KIM, KWANG SU, NAM, JI HYE, LEE, JEONG IL, SONG, JONG HYEONG, KANG, YUN SUNG, SHIN, SEUNG JOO, LEE, NAM JUNG
Принадлежит:

The present disclosure relates to an element package and a manufacturing method thereof. The element package includes a substrate, a device disposed on the substrate, and a cap configured to receive the device, wherein one of the substrate and the cap includes a groove and the other of the substrate and the cap includes a protrusion coupled to the groove. A first and a second metal layer to form a metal bonding between the groove and the protrusion is disposed on the element package. Accordingly, the present invention minimizes a bonding area. COPYRIGHT KIPO 2017 ...

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Номер записи: 2
02-06-2016 дата публикации

ACCELERATION SENSOR

Номер: KR1020160062395A
Автор: YANG, JEONG SUONG, KIM, JONG WOON, SONG, JONG HYEONG
Принадлежит:

According to an embodiment of the present invention, an acceleration sensor may alleviate a stress concentration on a portion coupling a mass to a beam and a portion coupling a support to the beam, by coupling the mass to the support adjacent to the mass and forming a chamfer unit or a round unit with a curvature radius on an edge of the beam elastically supporting the mass. Thereby, reliability and durability of the acceleration sensor may be improved by reducing a threat of damage possibly inflected by an external shock or the like. COPYRIGHT KIPO 2016 ...

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Номер записи: 3
14-08-2017 дата публикации

ACOUSTIC WAVE FILTER DEVICE AND PACKAGE FOR MANUFACTURING ACOUSTIC WAVE FILTER DEVICE

Номер: KR1020170092955A
Автор: KANG, YUN SUNG, KANG PIL JOONG, KIM, KWANG SU, NAM, JI HYE, YANG, JEONG SUONG, LEE, JEONG IL, SONG, JONG HYEONG
Принадлежит:

Disclosed is an acoustic wave filter device with excellent oxidation resistance and excellent mechanical properties of fracture toughness or the like. The acoustic wave filter device comprises: an acoustic wave filter unit; a base in which the acoustic wave filter unit is formed on one surface, and a bonding unit is formed around the acoustic wave filter unit; and a cap bonded to the base by forming a bonding corresponding unit corresponding to the bonding unit. The bonding unit has a first bonding layer composed of a gold material. The bonding corresponding unit is bonded to the first bonding layer, and has a second bonding layer composed of a tin material. COPYRIGHT KIPO 2017 ...

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Номер записи: 4
08-05-2015 дата публикации

MEMS SENSOR AND DEVICE HAVING SAME

Номер: KR1020150049057A
Автор: JEUNG, WON KYU, LIM, CHANG HYUN, LEE, JUNG WON, SONG, JONG HYEONG
Принадлежит:

A MEMS sensor according to an embodiment of the present invention comprises: a sensing unit; and a substrate connected to the sensing unit. The substrate faces an outer circumference unit of the sensing unit. A flexible printed circuit board (FPCB) is formed on the substrate. When thermal strain and external stress are delivered to the substrate by an external board, the thermal strain and the external stress are decreased and offset by the FPCB formed on the substrate. The thermal strain and the external stress are not delivered to the sensor unit, and the sensor unit prevents sensitivity degradation and damage. Therefore, the reliability of the MEMS sensor is improved. COPYRIGHT KIPO 2015 ...

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Номер записи: 5
01-07-2015 дата публикации

MEMS SENSOR MODULE AND MEMS SENSOR PACKAGE MODULE

Номер: KR1020150073626A
Автор: JEUNG, WON KYU, LEE, JUNG WON, SONG, JONG HYEONG
Принадлежит:

According to an embodiment of the present invention, an MEMS sensor module comprises: a sensing unit; a substrate connected to the sensing unit; and an external board connected to the substrate by a conductive connection unit. A cavity is formed on the substrate opposite to the sensing unit. COPYRIGHT KIPO 2015 ...

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Номер записи: 6
27-05-2016 дата публикации

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020160059766A
Автор: YANG, JEONG SUONG, KIM, JONG WOON, SONG, JONG HYEONG, KIM, TAE YOON
Принадлежит:

The present invention relates to a sensor package capable of minimizing an internal mass body or an internal cap to be damaged due to an external shock or the likes and a manufacturing method thereof. The sensor package according to an embodiment of the present invention comprises: a base which includes the mass body arranged in a space formed in the inner side and a plurality of connection units to connect the mass body; and one or more caps to protect the mass body by being combined with one side of the base. The cap includes one or more buffer members formed in an inner wall which faces the mass body. COPYRIGHT KIPO 2016 ...

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Номер записи: 7
31-10-2022 дата публикации

소자 패키지 및 그 제조방법

Номер: KR102460753B1
Автор: 강필중, 김광수, 남지혜, 이정일, 송종형, 강윤성, 신승주, 이남정
Принадлежит: 삼성전기주식회사

... 본 개시는 기판, 상기 기판에 배치된 소자, 및 상기 소자를 수용하는 캡; 을 포함하며, 상기 기판 및 상기 캡 중 어느 하나는 홈을 포함하고, 상기 기판 및 캡 중 다른 하나는 상기 홈과 결합되는 돌기를 포함하며, 상기 홈과 상기 돌기 사이에는 서로 금속접합을 형성하는 제 1 및 제 2 금속층이 배치된, 소자 패키지 및 그 제조방법에 관한 것이다.

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Номер записи: 8
30-08-2018 дата публикации

LOW VIBRATION ROOT CROP HARVESTING APPARATUS

Номер: KR101893057B1
Автор: LEE, KWON JAE, SONG, JONG HYEONG
Принадлежит: LEE, KWON JAE, SONG, JONG HYEONG

The present invention relates to a low vibration root crop harvesting apparatus. At the above time, the low vibration root crop harvesting apparatus extracts the root crop including garlic and onion, and quickly discharges soil without damaging the crop during transportation from the ground to the ground. The present invention also has a main configuration having a mining blade (10), first and second transfer blade groups (30, 40) in order to be able to operate at low vibration and low output. COPYRIGHT KIPO 2018 ...

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Номер записи: 9
31-10-2022 дата публикации

소자 패키지 및 그 제조방법

Номер: KR102460754B1
Автор: 강필중, 김광수, 이정일, 송종형, 이현기, 강윤성, 신승주, 양정승
Принадлежит: 삼성전기주식회사

... 본 개시는 기판, 상기 기판에 배치된 소자, 상기 소자를 수용하는 캡, 상기 기판과 상기 캡을 접합하는 접합부, 및 상기 접합부의 양 측에 배치된 차단부를 포함하는 소자 패키지 및 그 제조방법에 관한 것이다.

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Номер записи: 10
27-09-2017 дата публикации

ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170108377A
Автор: KANG PIL JOONG, KIM, KWANG SU, LEE, JEONG IL, SONG, JONG HYEONG, LEE, HYUN KEE, KANG, YUN SUNG, SHIN, SEUNG JOO, YANG, JEONG SUONG
Принадлежит:

The present disclosure relates to an element package which includes a substrate, an element disposed on the substrate, a cap for receiving the element, a junction for bonding the substrate and the cap, and a blocking part disposed on both sides of the junction, and a manufacturing method thereof. It is possible to sufficiently perform a bonding process even with a small amount of bonding material regardless of the thickness of the cap and the substrate. COPYRIGHT KIPO 2017 ...

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Номер записи: 11
18-12-2015 дата публикации

MULTI-AXIS SENSOR

Номер: KR1020150141417A
Автор: KANG, PIL JOONG, LEE, JUNG WON, LEE, HYUN KEE, SONG, JONG HYEONG
Принадлежит:

Embodiments of the present invention provide a multi-axis sensor, including a first sensor embedded in an embedded substrate to sense a position, and a second sensor formed on a lower cap substrate bonded on the embedded substrate by a wafer level package scheme to sense an inertial force. As such, the present invention can miniaturize a multi-axis sensor by improving the structure of the multi-axis sensor, and capable of reducing power consumption. COPYRIGHT KIPO 2016 ...

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Номер записи: 12
24-05-2016 дата публикации

ANGULAR VELOCITY SENSOR

Номер: KR1020160057961A
Автор: KIM, JONG WOON, HAN, WON, SONG, JONG HYEONG
Принадлежит:

An angular velocity sensor according to an embodiment of the present invention comprises: a mass body part including first and second mass bodies; a first frame provided at an outer side of the mass body part; a sensing flexible part connecting the mass body part to the first frame; a second frame provided at an outer side of the first frame; an actuating flexible part connecting the first and second frames to each other; a sensing unit sensing displacement of the mass body part and combined with the sensing flexible part; and a driving unit driving the first frame and combined with the actuating flexible part. Wherein the first mass body and the second mass are connected to the first frame by the sensing flexible unit so as to be rotated in a first axis direction and translated in a second axis direction, and the first frame is connected to the second frame by the actuating flexible part so as to be rotated in a third axis direction. COPYRIGHT KIPO 2016 ...

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Номер записи: 13
18-12-2015 дата публикации

INERTIAL SENSOR MODULE HAVING HERMETIC SEAL OF METAL AND MULTI-AXIS SENSOR USING SAME

Номер: KR1020150141418A
Автор: KANG, PIL JOONG, LEE, JUNG WON, LEE, HYUN KEE, SONG, JONG HYEONG
Принадлежит:

According to the present invention, an inertial sensor module having a metallic hermetic seal and a multi-axis sensor using the same comprise: a sensor body which comprises a plurality of wires connected to either a driving electrode of a sensor or a detecting electrode of the sensor and is formed in a wafer level package (WLP) method on a substrate for a lower cap to detect inertial force; a substrate for an upper cap, which is boned onto the sensor body to protect the sensor body; and a metallic hermetic seal which is isolated from the wires and interposed between the sensor body and the substrate for an upper cap wherein the bonding is metal bonding. COPYRIGHT KIPO 2016 ...

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Номер записи: 14
05-01-2016 дата публикации

GYRO SENSOR

Номер: KR1020160000772A
Автор: LEE, YU HEON, KIM, JONG WOON, KIM, CHANG HYUN, SONG, JONG HYEONG
Принадлежит:

According to an embodiment of the present invention, a gyro sensor applies a correction voltage to a driving electrode or a sensing electrode, which are provided on one surface of a piezoelectric material and rotates a mass body, and makes the center of gravity and the center of rotation of the mass body lie in one straight line towards the vibration direction of the mass body; thus eliminating or canceling a quadrature error. COPYRIGHT KIPO 2016 ...

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Номер записи: 15
08-06-2015 дата публикации

MEMS CAP MODULE FOR AND MEMS SENSOR HAVING SAME

Номер: KR1020150062667A
Автор: LEE, JAE CHANG, SONG, JONG HYEONG, KIM, JONG WOON, LEE, HYUN KEE
Принадлежит:

A MEMS cap module according to an embodiment of the present invention comprises: a substrate; a first negative photoresist formed on one surface of the substrate; and a second negative photoresist formed on one surface of the first negative photoresist. COPYRIGHT KIPO 2015 ...

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Номер записи: 16