21-07-2016 дата публикации
Номер: WO2016114430A1
Принадлежит:
The present invention relates to an apparatus for separating solid thin plates, capable of separating the outermost solid thin plates from multi-layered bonded substrates in which a plurality of solid thin plates have been bonded, without causing damage to the thin plates. The apparatus for separating solid thin plates, according to the present invention, comprises: a lower chuck made of a porous material, for sucking, by means of a vacuum suction force, the lower surface of the lowest substrate among the multi-layered bonded substrates; an upper chuck made of a porous material, for sucking, by means of a vacuum suction force, the upper surface of the top substrate among the multi-layered bonded substrates; a lower transforming ring formed into the shape of a closed curve at the edge of the upper surface of the lower chuck, for forming an airtight space between the upper surface of the lower chuck and the lower surface of the lowest substrate among the multi-layered bonded substrates; an ...
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