07-02-2018 дата публикации
Номер: KR1020180012914A
Принадлежит:
The present invention relates to an O-ring composition for sealing of semiconductor manufacturing equipment, and to an O-ring using the same. The O-ring composition for sealing of semiconductor manufacturing equipment includes fluorine-based rubber, carbon black, a reinforcing agent, an oxidant and a vulcanizing agent, wherein the composition is characterized by 65-75 parts by weight of the fluorine-based rubber, 20-30 parts by weight of the carbon black, 5-8 parts by weight of the reinforcing agent, 2-5 parts by weight of the oxidant, and 0.5-1.5 parts by weight of the vulcanizing agent per 100 parts by weight of the O-ring composition. Therefore, the present invention provides an O-ring composition for sealing of semiconductor manufacturing equipment, wherein mechanical properties, in particular, hardness, tensile strength, friction coefficient, and permanent compressive shear rate satisfy the highest standard at home and abroad. COPYRIGHT KIPO 2018 (AA) Domestic O-ring (BB) Imported ...
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