УСТРОЙСТВО ОЧИСТКИ ТЕХНОЛОГИЧЕСКИХ ГАЗОВ СИСТЕМЫ ПАЙКИ ОПЛАВЛЕНИЕМ ПРИПОЯ

Устройство содержит множество камер очистки, в которых содержится очищающая жидкость для очистки технологического газа, при этом каждая из указанных камер выполнена с возможностью пропускания через нее подаваемого по питающему трубопроводу загрязненного технологического газа и вывода из нее по выпускному трубопроводу очищенного технологического газа. Каждая камера очистки выполнена в виде модулей очистки, которые имеют различные принципы очистки, при этом количество установленных параллельно модулей очистки позволяет обеспечить требуемую пропускную способность по технологическому газу, а количество последовательно установленных модулей очистки обеспечивает требуемую степень чистоты технологического газа. Изобретение позволяет обеспечить относительно эффективную очистку технологического газа независимо от общих условий, устанавливаемых системой, и адаптировать устройство очистки к различным системам пайки за счет гибкости системы. 9 з.п. ф-лы, 5 ил.

ЧИСТЯЩЕЕ УСТРОЙСТВО ДЛЯ ОЧИСТКИ ТЕХНОЛОГИЧЕСКИХ ГАЗОВ СИСТЕМЫ ОПЛАВЛЕНИЯ ПАЙКОЙ

... 1. Устройство очистки технологических газов системы пайки оплавлением, содержащее множество камер очистки, в которых содержится очищающая жидкость для очистки технологического газа, при этом каждая из указанных камер выполнена с возможностью пропускания через нее подаваемого по питающему трубопроводу загрязненного технологического газа, и вывода из нее по разгрузочному трубопроводу очищенного технологического газа, отличающееся тем, что каждая камера очистки выполнена в виде модулей, при этом количество установленных параллельно модулей позволяет обеспечить требуемую пропускную способность по технологическому газу, а количество последовательно установленных модулей обеспечивает требуемую степень чистоты технологического газа. 2. Устройство очистки по п.1, отличающееся тем, что модули, имеющие различные принципы осуществления осаждения, соединены последовательно один за другим. 3. Устройство по п.1 или 2, отличающееся тем, что очищающая жидкость протекает через последовательно соединенные ...

ПАЯЛЬНИК

... 1. Паяльник (1), содержащий по меньшей мере одно сменное жало (2) и несущий его держатель (3) с участком (10) рукоятки, а также примыкающий к держателю (3) жала концевой участок (4) корпуса, отличающийся тем, что держатель (3) жала вместе с жалом (2) представляет собой сменный модуль (5), выполненный с возможностью разъемного соединения с концевым участком (4) корпуса.2. Паяльник по п.1, отличающийся тем, что жало (2) интегрировано в держатель (3) жала.3. Паяльник по п.1 или 2, отличающийся тем, что жало (2) на своем рабочем конце (6) содержит активный в отношении пайки материал (7).4. Паяльник по п.1 или 2, отличающийся тем, что участок (10) рукоятки содержит теплоизолирующий синтетический материал.5. Паяльник по п.1 или 2, отличающийся тем, что участок (10) рукоятки нанесен на держатель (3) жала напылением.6. Паяльник по п.1 или 2, отличающийся тем, что участок (10) рукоятки имеет форму, соответствующую анатомии кисти, по меньшей мере на части своей длины в продольном направлении (8) ...

Schweiss- oder Lötvorrichtung mit Verbrauchsreduzierung

Vorrichtung zum Schweißen oder Löten von Werkstücken mit einem versorgungsspannungsgespeisten Leistungsteil (1) zur Energiebeaufschlagung des Schweiß- oder Lötprozesses (3), einer Steuerungseinheit (6) für das Leistungsteil (1) und mit mindestens einer externen Komponente (4, 5), wobei mindestens ein steuerbares Schaltmittel (8) vorgesehen ist, mit dem die mindestens eine externe Komponente (4, 5) von einem ersten Zustand in einen gegenüber dem ersten Zustand hinsichtlich des Energieverbrauchs reduzierten zweiten Zustand umschaltbar ist, wobei dem mindestens einen Schaltmittel (8) ein Detektormittel (9) zur Erfassung des Verbrauchs einer elektrischen Größe, insbesondere Strom, Spannung oder Leistung, der mindestens einen externen Komponente (4, 5) zugeordnet ist und die Ansteuerung des mindestens einen Schaltmittels (8) beim Erreichen einer vorgebbaren Bedingung bezüglich des Energieverbrauchs der mindestens einen externen Komponente (4, 5) erfolgt, wobei die mindestens eine externe Komponente ...

AUTOMATISCHES DRAHT-LÖTSYSTEM

Ein automatisches Draht-Lötsystem umfasst: einen Träger, der eingerichtet ist, ein zu lötendes elektrisches Produkt zu laden; einen Roboter, der eingerichtet ist, den Träger, auf welchem das elektrische Produkt geladen ist, zu greifen und zu bewegen; einen Lötpaste-Behälter, der konfiguriert ist, eine Lötpaste zu enthalten; und eine Heizvorrichtung, die konfiguriert ist, die in dem Lötpaste-Behälter enthaltene Lötpaste aufzuheizen, so dass die Lötpaste zu Flüssigkeit geschmolzen wird. Der Roboter ist eingerichtet, Drähte des elektrischen Produkts in den Lötpaste-Behälter zu bewegen, um die Drähte durch die Lötpaste in dem Lötpaste-Behälter zusammenzulöten. Das automatische Draht-Lötsystem kann die Aufgabe des Lötens von Drähten des elektrischen Produkts automatisch ausführen. Dadurch kann es geeignet sein, elektrische Massenprodukte automatisch zu löten und die Löt-Effizienz zu verbessern.

Lötsystem

Lötsystem (1), umfassend mindestens eine Lötstation (2), eine Steuervorrichtung (7) und einen Lötkolben (4), wobei der Lötkolben (4) zum Löten aus einer Kolbenablage (5) der Lötstation (2) entnehmbar ist und bei Beendigung des Lötens in der Kolbenablage (5) ablegbar ist, und eine Saugvorrichtung (9), die mit mindestens einem Sauger (10) verbunden ist, der eine bewegliche Drosselklappe (21) umfaßt, zu deren Bewegung ein Motor (19) am Sauger (10) vorgesehen ist, wobei der Motor (19) mittels der Steuervorrichtung (7) durch Ablage des jeweiligen Lötkolbens (4) in der Kolbenablage (5) und/oder durch Entnahme des jeweiligen Lötkolbens (4) aus der Kolbenablage (5) ansteuerbar ist, um eine Stellung der jeweiligen Drosselklappe (28) zu ändern.

LOTNIVELLIERER

Loetvorrichtung

Handwerkzeug, insbesondere Lötkolben

Handwerkzeug (1), insbesondere Lotkolben (2), mit zumindest einem Handgriff (3) und einem von diesem vorstehenden Werkzeugelement (4) mit einem Betätigungsendabschnitt (6) am freien Ende (5), wobei das Handwerkzeug (1) mehr als eine Leuchte (7, 8, 9) zur Beleuchtung eines Einsatzortes (10) des Handwerkzeugs (1) aufweist und die Leuchten an einem das Werkzeugelement umrandenden Endflansch (11) in einer sich radial zum Werkzeugelement (4) erstreckenden und im Wesentlichen in Richtung Einsatzort weisenden Handgriffendfläche (12) des Handgriffs (3) in einer Dreiecksanordnung und mit einer Ausrichtung zur schattenfreien Beleuchtung des Einsatzortes angeordnet sind.

Modulares Kamera-, Mikrofon- und Antriebssystem für Schweißbrenner

Vorrichtung zur Beobachtung, Abhörung und Antrieb eines manuell ausgeführten Lichtbogen-, Laser- oder Hybrid-Schweiß- oder Lötprozesses dadurch gekennzeichnet, dass die modular aufgebaute Vorrichtung an Handbrennern jeder Bauart angebracht werden, Sensoren Bild- und Tonsignale des Schweißprozesses an unterschiedliche Ausgabegeräte übertragen anhand derer sie dargestellt werden können und der Brenner durch ein Modul der Vorrichtung angetrieben werden kann.

Vorrichtung fuer das Zusammenloeten einzelner Rinnenstuecke auf dem Rinnenbaum

Adapter of connector at dry construction wall, has outside accessible recess portions are formed base portion for inserting an installation spacer, and material strip that is provided in adapter portion and attached to connector

The adapter has the outside accessible recess portions (6.1,6.2) are formed the base portion (1) for inserting the installation spacer. A material strip (16) is provided in the adapter portion and attached to the connector (R-1), so that the installation spacer is supported. The material strip is formed with an opening for receiving the installation spacer, and a recess portion (19) for receiving a fixing portion such as screws.

Replenishing molten baths, esp. in soldering electronic components - where replenishing material is melted before entering bath

The substance being used for replenishment, e.g. a rod (a) is pref. fed dropwise and by gravity into the bath, esp. using automatic replenishment controlled by monitoring the height of the molten bath. Pref. a rod(a) is located in a tube mounted above the molten bath and held in that tube by a heater located at the bottom end of the tube. When the heater is switched on, the rod(a) melts dropwise, the drops falling into the bath. Instead of a tube, a heated crucible may be used, the heat controlling the flow of molten drops used for replenishing the bath. Used e.g. in the automatic soldering of electronic components onto printed circuit boards, where the height of molten tin solder in the bath is very important and must be kept constant in mass prodn.

Soldering unit for soldering surface components has solder bath with removable cover and gas nozzle producing a protective gas atmosphere between the solder bath and the cover

A soldering unit for soldering surface components comprises a container (2) for a solder bath (7) in which at least one wave (reflow) is produced (3, 4). There is a cover (5) and a gas nozzle (13) to produce a protective gas atmosphere between solder bath and cover. The cover has at least one hood (11, 12) over the waves that can be moved from closed to open positions when the solder is exposed for soldering the components (20).

Improvements relating to processes of soldering

... 391,762. Soldering electric lamps. NAAMLOOZE VENNOOTSCHAP PHILIPS' GLOEILAMPENFABRIEKEN, 13D, Emmasingel, Eindhoven, Holland. July 30, 1931. No. 21789. Convention date, Nov. 5, 1930. Void [Published under Sect. 91 of the Acts]. [Classes 83 (ii) and 83 (iv).] Die-rolling.-Solder with an external coating of flux is used in soldering together two or more articles. The solder may be in the form of wire provided with depressions or notches to receive the flux as shown in Fig. 3. In soldering leading-in wires to the caps of electric incandescent lamps one or more solder wires may be fed by rolls 2, 3 from a storage roll 11 between felt or indiarubber rollers 7, the lower of which dips in a concentrated solution of borax or other flux in a container 5. The wire then passes through an adjustable guide nozzle 14 to the lamp 8, soldering being effected by a movable soldering iron 10. The rolls 2, 3 are provided with teeth 4A which form the depressions in the wire.

SOLDER LEVELLER

DEVICES FOR REMOVING SOLDER

Solder removing device

A solder removing device is disclosed including fibres of temperature-resistant non-metallic material, such as a synthetic polymeric material, for example FEP or PTFE, which are coated with a metal rendering them more receptive to solder flux. The metallized fibres are coated with solder flux rendering them more capable of wetting with molten solder, interstices between the fibres serving to absorb molten solder by capillary attraction.

Method of producing cycle frames

SOLDERING AND DESOLDERING APPARATUS

APPARATUS FOR ASSISTING IN THE MANUFACTURE OF COMPONENT BOARDS

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

SOLDERING PLANT WITH SOLDERING MODULES AND AT LEAST A MOBILE ONE AND A REPLACEABLE IN A SOLDERING MODULE APPLICABLE ONE SOLDERING STATION; APPROPRIATE CONDITION BY STATION

REINIGUNGSEINHEIT FÜR LÖTKOLBEN

PROCEDURE FOR THE PRODUCTION OF A PLATE-TYPE HEAT EXCHANGER ASSISTANCE OF A SENTENCE OF DISTANCE BLOCKS WITH ESSENTIALLY POLYGONAL OR ELLIPTICAL FORM

AUTOMATIC ORDER DEVICE FOR A LIQUID OR A PASTY COATING MATERIAL.

LOETGARNITUR FOR ASSEMBLY WORKS.

Solder container

An intelligent soldering cartridge for automatic soldering connection validation

Abstract An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, 5 monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an 10 interface for transmitting the indication signal. 1 0- 2 )XI ...

Method and apparatus for separating dross floating on solder

SOLDER REMOVAL DEVICES

OF INVENTION This invention relates to apparatus for use in connection with material such as fluxed, woven, copper ribbon, sometimes called "desoldering braid" to capture and remove unwanted, molten solder from electronic components. A preferred embodiment comprises a hand-held desoldering braid gun having a handle in which a supply of desoldering braid may be stored, a finger trigger actuated pincer-type cutter positioned in the mouth of the "barrel" of the gun, a guide conduit for forming a path for desoldering braid coming from the handle through the cutter, and a thumbactuated drive mechanism for moving desoldering braid to and fro past the cutters. Another embodiment includes a handle to receive a pre-packaged cassette of desoldering braid. Using embodiments of this invention, a length of desoldering braid may be introduced to unwanted solder which has been rendered molten to a liquid state, to capture and remove it from its site, following which the cutter may be actuated to sever ...

FILTRATION OF FLUX CONTAMINANTS

A two-stage filtration system is coupled with an oven, such as a solder reflow oven, to remove a vapor stream from the oven and to remove organic compounds that have volatilized from a solder flux and other contaminants from the vapor stream. The filtration system includes a first stage for trapping larger particles and a second stage including a packed bed of wettable media, such as steel balls, for trapping smaller particles and serving as a nucleation site for condensed organic compounds. The first stage can be a centrifugal self- cleaning element in the form of a mesh strainer coupled with a rotary motor for spinning the mesh strainer.

PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALS

WAVE SOLDERING NOZZLE HAVING AUTOMATIC ADJUSTABLE THROAT WIDTH

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle.

PNEUMATIC WELD HEAD

A pressure regulator system for a pneumatically or hydraulically actuated weld head (10). The weld head (10) includes a switching valve (21) comprising several ports: an inflow port (44) attached to a source of pressurized gas, preferably air; an exhaust port (46); a first line port (50); and a second line port (48). Two-way valves (52, 54) are provided on the first line port (50) and the second line port (48). A valve sensor (56) connected to a switch (40) for determining weld force in the weld head (10) is connected to means (82) for simultaneously closing the first line port valve (50) and the second line valve port (48) when a desired weld force is attained between one or more electrodes (14, 15) and a workpiece (16), thereby maintaining a constant, maximum pressure in the cylinder (12) and consequently maintaining the desired weld force between the electrode(s) (14, 15) and the workpiece (16) during the welding operation.

PNEUMATIC WELD HEAD WITH AUTOMATICALLY ADJUSTED PRESSURE

A pressure regulator system for a pneumatically or hydraulically actuated weld head (10). The weld head (10) includes a switching valve (21) comprising several ports: an inflow port (44) attached to a source of pressurized gas, preferably air; an exhaust port (46); a first line port (48); and a second line port (50). Two-way valves (52, 54) are provided on the first line port (48) and the second line port (50). A valve sensor connected to a switch (40) for determining weld force in the weld head (10) is connected to means (82) for simultaneously closing the first line port valve (52) and the second line valve port (54) when a desired weld force is attained between one or more electrodes (14, 15) and a workpiece (16), thereby maintaining a constant, maximum pressure in the cylinder (12) and consequently maintaining the desired weld force between the electrode(s) (14, 15) and the workpiece (16) during the welding operation.

Lötvorrichtung.

Verbundkörper aus durch Lötung elektrisch leitend miteinander verbundenen Metallteilen.

Metallgegenstand zum Verbinden mit einem andern Metallgegenstand.

Lötvorrichtung.

Verfahren zur Herstellung von supraleitenden Hohlraumresonatoren, insbesondere für Teilchenbeschleuniger

Verfahren zum Löten und Vorrichtung zur Ausübung desselben

Handwerkzeug zum Reinigen von inneren Mantel- und Anschlagflächen, insbesondere für Lötfittings

Lötmittelbehälter

Einrichtung zur getrennten Aufnahme von Lot und Flussmittel

Vorrichtung zum Spannen eines Bandes, das zum Verbinden zweier stumpf aneinanderstossender prismatischer Körper die beiden Körper längs der Stossfuge umschlingt

Löteinrichtung

METHOD AND APPARATUS FOR MOUNTING DEVICES ON A SUBSTRATE.

Heating device for a soldering apparatus for soldering printed circuit boards and preheating module.

Eine Heizvorrichtung umfasst wenigstens eine Heizschlaufe (1), wenigstens einen Transformator, eine elektrische Quelle und eine Druckluft- oder Druckgasquelle. Die Heizschlaufe (1) ist so geformt, dass ihre beiden Enden beieinander liegen, und ist aus wenigstens einem Lochblech (3, 4) gebildet. Jeder Transformator weist eine Primärwicklung und eine Sekundärwicklung auf. Die Sekundärwicklung weist eine einzige Windung auf und ist mit den beiden Enden der Heizschlaufe (1) verbunden. Die elektrische Quelle ist mit der Primärwicklung des Transformators verbunden und speist die Primärwicklung mit einer Wechselspannung oder einem Wechselstrom, deren/dessen Frequenz im Kilohertz-Bereich liegt. Die Druckluft- oder Druckgasquelle und Leitungen dienen dazu, Luft oder ein Gas durch die Löcher des wenigstens einen Lochblechs (3, 4) zu blasen.

Heating device for a soldering apparatus for soldering printed circuit boards and preheating module.

Eine Heizvorrichtung umfasst wenigstens eine Heizschlaufe (1), wenigstens einen Transformator, eine elektrische Quelle und eine Druckluft- oder Druckgasquelle. Die Heizschlaufe (1) ist so geformt, dass ihre beiden Enden beieinander liegen, und ist aus wenigstens einem Lochblech (3, 4) gebildet. Jeder Transformator weist eine Primärwicklung und eine Sekundärwicklung auf. Die Sekundärwicklung weist eine einzige Windung auf und ist und mit den beiden Enden der Heizschlaufe (1) verbunden. Die elektrische Quelle ist mit der Primärwicklung des Transformators verbunden und speist die Primärwicklung mit einer Wechselspannung oder einem Wechselstrom, deren/dessen Frequenz im Kilohertz-Bereich liegt. Die Druckluft- oder Druckgasquelle und Leitungen dienen dazu, Luft oder ein Gas durch die Löcher des wenigstens einen Lochblechs (3, 4) zu blasen.

Electrodynamic Lotwellenpumpe.

Eine Lotwellenpumpe umfasst eine Lotwanne (1), eine Ausgleichswanne (3), einen Düsenhals (9) mit einem Düsenaufsatz (10), wenigstens einen ersten Pumpkanal (5) und wenigstens einen zweiten Pumpkanal sowie einen Stator (8). Der Stator (8) weist einen Eisenkern (13) mit Zähnen (14) und Nuten (15) auf. Jeder erste Pumpkanal (5) ist mit der Lotwanne (1) verbunden und mündet in den Düsenhals (9). Jeder zweite Pumpkanal ist mit der Ausgleichswanne (3) und mit der Lotwanne (1) verbunden. Die Lotwellenpumpe weist entweder einen einzigen ersten Pumpkanal (5) oder genau zwei erste Pumpkanäle (5) auf. Die Breite des einzigen Pumpkanals (5) ist um mindestens einen Faktor 6 grösser bzw. die Breite der beiden Pumpkanäle (5) ist je um mindestens einen Faktor 3 grösser als die in Pumprichtung gemessene Breite (Z) der Zähne (14) des Eisenkerns (13). Der Schlitz des Düsenaufsatzes (10) hat eine Länge von wenigstens 300 mm.

Electrodynamic Lotwellenpumpe.

Eine Lotwellenpumpe umfasst eine Lotwanne (1), eine Ausgleichswanne (3), einen Düsenhals (9) mit einem Düsenaufsatz (10), wenigstens einen ersten Pumpkanal (5) und wenigstens einen zweiten Pumpkanal, sowie einen Stator (8) auf. Der Stator (8) weist einen Eisenkern (13) mit Zähnen (14) und Nuten (15) auf. Jeder erste Pumpkanal (5) ist mit der Lotwanne (1) verbunden und mündet in den Düsenhals (9). Jeder zweite Pumpkanal ist mit der Ausgleichswanne (3) und mit der Lotwanne (1) verbunden. Die Lotwellenpumpe weist entweder einen einzigen ersten Pumpkanal (5) oder genau zwei erste Pumpkanäle (5) auf. Die Breite des einzigen Pumpkanals (5) ist um mindestens einen Faktor 6 grösser bzw. die Breite der beiden Pumpkanäle (5) ist je um mindestens einen Faktor 3 grösser als die in Pumprichtung gemessene Breite (Z) der Zähne (14) des Eisenkerns (13). Der Schlitz des Düsenaufsatzes (10) hat eine Länge von wenigstens 300 mm.

Device inerting solder bath of a machine wave soldering

Soldering mask for wave soldering procedures and wave soldering procedures.

Die Erfindung betrifft eine Lötmaske für Wellenlötverfahren. Sie enthält wenigstens ein einzelnes Lötfenster, das mindestens teilweise von einer Vertiefung umschlossen ist, oder wenigstens zwei Lötfenster (2.1, 2.2, 2.3), die durch einen Kanal (4) verbunden sind. Ein Wellenlötverfahren zum Verlöten von Leiterplatten, die mit SMD- und THT-Bauteilen bestückt sind, mit den THT-Bauteilen, bei dem eine solche Lötmaske (1) die bereits gelöteten SMD-Bauteile abdeckt und mindestens ein Lötfenster (2.1, 2.2, 2.3) aufweist, das Anschlussbeine der THT-Bauteile zum Kontakt mit einer Lotwelle freilegt, ist dadurch gekennzeichnet, dass die Lotwelle eine mit Hilfe eines Lochblechs erzeugte Lochwelle ist, die eine vergleichsweise ruhige Oberfläche aufweist, die Transportrichtung der Lötmaske in horizontaler Richtung verläuft, und ein Abstand zwischen dem Lochblech und der Lötmaske höchstens vier Millimeter beträgt.

Soldering mask for wave soldering procedures.

Die Erfindung betrifft eine Lötmaske (3) für Wellenlötverfahren, die wenigstens zwei Lötfenster (2.1, 2.2, 2.3) enthält, die durch einen Kanal (4) verbunden sind.

Soldering system comprises a solder pump comprising solder nozzle having wave plate for soldering components, which are mounted on printed circuit board, which is transported through soldering system in horizontal transport direction

Soldering system (1) comprises a solder pump (3) for soldering components, which are mounted on a printed circuit board. The circuit boards are transported through the soldering system in a horizontal transport direction (2). The solder pump comprises a solder nozzle (4) having a wave plate (5) which has a first flat surface and a second surface. The first surface is aligned horizontally and is provided with at least one opening for forming a solder wave. The second surface is arranged after the first surface when viewed in the transport direction. Soldering system (1) comprises a solder pump (3) for soldering components, which are mounted on a printed circuit board. The circuit boards are transported through the soldering system in a horizontal transport direction (2). The solder pump comprises a solder nozzle (4) having a wave plate (5) which has a first flat surface and a second surface. The first surface is aligned horizontally and is provided with at least one opening for forming a ...

Inductive Soldering method and apparatus.

Ein Verfahren umfasst das induktive Erhitzen einer Verbindungsstelle zwischen einem ersten elektrischen Werkteil (5) und einem zweiten elektrischen Werkteil (6) mittels eines Hochfrequenzgenerators (2) und einer Induktionsspule (4), das Heranführen eines Lots (8) an die Verbindungssteile zwischen den beiden elektrischen Werkteilen (5, 6) und das Schmelzen des Lots (8) an der Verbindungsstelle. Erfindungsgemäss wird ein Heissluftstrom auf das geschmolzene Lot mittels eines Heissluftgebläses (9) in einer Richtung entgegen der Fliessrichtung des Lots gerichtet. Dies verhindert, dass das Lot über den Rand der Lötstelle hinwegfliesst. Die Erfindung wird insbesondere auf das Löten eines Autobatteriekabels und einem Kabelschuh (6) mit elektrischem Anschlusselement (7) angewendet. Es wird auch eine Vorrichtung (1) zur Durchführung des Verfahrens beansprucht.

Rotating-base welding machine

Combined type vibrator mounting device

Welding fixing graphite fixture and using method thereof

Convenient-to-adjust clamping device for processing of electronic product parts

Welding device

Self-recovery fuse pin bending mechanism and welding equipment thereof

A method for welding wire of connection to a semiconductor body and device for this purpose

Brazing apparatus the webs to ribbon

Process of operation of stations for welding and cutting of metals under water

Process of fixing of band switched on mounting of comb and device of implementation

Welding of the refrigerating apparatuses with absorption

Improvements brought to the machines being used to seal envelopes in thin metal sheet

Soldering and/or brazing wire feed device - ensures regular feed without blockage of the nozzle

Depositing solder paste on electric components - using dosing machine where plungers transfer blobs of paste onto components

Plate heat exchanger fabricating method, involves arranging block between plates, injecting fluid in inner space of block, brazing exchanger, forming depression in hollow space of block to liberate space between plates, and removing block

Improvements with the processes of welding

APPRATUS AND METHOD FOR LASER PROCESSING

REFLOW FURNACE

METHOD FOR PREVENTING GOLD PLATED TERMINAL PART OF PRINTED CIRCUIT BOARD FROM BEING CONTAMINATED

PURPOSE: A method for preventing a gold plated terminal part of printed circuit board from being contaminated is provided to prevent contamination of a gold plated terminal part due to gas floating matter or the likes generated at a point of wave soldering or flux penetration as well as preventing a lead from being fused on the gold plated terminal part during the soldering process. CONSTITUTION: A vinyl synthetic resin is manufactured by adding a material having a coagulable masking solution(40), for example, poly vinyl chloride, poly vinyl acetate, etc., to gold plated terminal parts(10a) of a printed circuit board(10). A vinyl solution is manufactured by bringing the vinyl synthetic resin into solution by heat. The vinyl solution is coated by using a coating unit like a brush(30). The coagulable masking solution(40) is coated on all the gold plated terminal parts(10a) of the printed circuit board(10) since the printed circuit part(10) generally has the gold plated terminal parts(10a) ...

APPARATUS AND METHOD FOR SOLDERING IN MANUFACTURING SYSTEM OF COMBI-TYPE IC CARD

NOZZLE APPARATUS OF MOUNTER

PURPOSE: A nozzle apparatus of a mounter is provided to improve the component blow performance by correctly dividing components from a nozzle. CONSTITUTION: A holder unit(120) is comprised of a holder and a holder shaft(122) formed on a lower surface thereof. The holder is mounted to a socket shaft(114) by the elasticity of an elastic member(115) coupled to the socket shaft(114). A nozzle(130) includes a moving member installed within the holder shaft(122). The moving member performs peaking and placing operations on the components by moving to a vertical direction. The nozzle(130) is comprised of a first nozzle shaft installed within the holder shaft(122) and a second nozzle shaft installed on an end of the first nozzle shaft. The moving member moves within a space formed on an outer side of the first nozzle shaft and an inner side of the second nozzle shaft. © KIPO 2003 ...

Método de controle do teor de cobre em um banho de imersão de solda

METHOD AND DEVICE FOR CLEANING A SOLDERING NOZZLE

The invention relates to a method and a device for cleaning a soldering nozzle and to a soldering device. Impurities on the soldering nozzle are removed by ultrasounds of an ultrasonic source leading to a thorough and simple cleaning.

PNEUMATIC WELD HEAD WITH AUTOMATICALLY ADJUSTED PRESSURE

A pressure regulator system for a pneumatically or hydraulically actuated weld head (10). The weld head (10) includes a switching valve (21) comprising several ports: an inflow port (44) attached to a source of pressurized gas, preferably air; an exhaust port (46); a first line port (48); and a second line port (50). Two-way valves (52, 54) are provided on the first line port (48) and the second line port (50). A valve sensor connected to a switch (40) for determining weld force in the weld head (10) is connected to means (82) for simultaneously closing the first line port valve (52) and the second line valve port (54) when a desired weld force is attained between one or more electrodes (14, 15) and a workpiece (16), thereby maintaining a constant, maximum pressure in the cylinder (12) and consequently maintaining the desired weld force between the electrode(s) (14, 15) and the workpiece (16) during the welding operation.

SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING HEAD HAVING THERMALLY CONDUCTIVE MATERIALS

Provided a semiconductor chip bonding apparatus including a body, a heater disposed on a lower surface of the body, a collet disposed on a lower surface of the heater, and a head disposed on a lower surface of the collet, the head has a rectangular plate shape, a lower surface and side surfaces of the head are exposed, an upper surface of the head is in contact with the lower surface of the collet, an area of the upper surface of the head is smaller than an area of the lower surface of the collet, the head includes a central section including a recess, and an outer surface constituting a part of the side surfaces of the head, and a peripheral section connected to the recess and disposed on each corners of the head, and a thermal conductivity of the peripheral section is different from that of the central section.

RESISTANCE SOLDERING SYSTEM

A resistance soldering system includes a power input receiving an alternating current from a power source and a controller circuit generating a control signal indicative of a desired power level delivered for a desired time. The resistance soldering system further includes a silicon-controlled rectifier connected to the power input and the controller circuit and producing a control voltage proportional to the control signal and a transformer having a primary side receiving the control voltage and a secondary side having output leads configured to apply an output voltage to a solder joint disposed between the output leads. The controller circuit determines the control signal applied to the silicon-controlled rectifier required to melt the solder joint based on the desired power level and the desired time. The controller circuit controls the desired power level independent of the desired time. A method of operating a resistance soldering system is also presented.

Method for mounting devices on a substrate

The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies.

Moisture-collecting hood assembly

A moisture-collecting hood assembly (10) for a vapor-generating machine (12) includes a hood (14) having an open bottom (15)and upwardly tapering sides (16) and ends (18). On the inside of the hood is a gutter (24) for collecting moisture in the vapor condensing on the hood interior. Vapors from the machine that enter the hood are exhausted through a horizontally-oriented, moisture-collecting sleeve that has a central portion (46) whose cross-sectional area is larger than that of an inlet (43) in communication with the hood, and an outlet (48) in communication with a negatively pressurized exhaust line (49). The central portion of the sleeve serves to collect moisture in its lower portion that condenses from the vapor exhausted from the hood.

Soldering stand

FORMIC ACID DECOMPOSITION APPARATUS AND FORMIC ACID DECOMPOSITION METHOD

To provide a formic acid decomposition apparatus and method, which can dispose of formic acid safely and quickly and determine the activity of a filled catalyst. The apparatus is for decomposing formic acid contained in exhaust gas exhausted from a soldering apparatus in which a surface oxide film is reduced with formic acid, into water and carbon dioxide. The apparatus has a formic acid decomposition part in which a formic acid decomposition catalyst is filled; a gas introduction pipe for introducing gas containing formic acid into the decomposition part; and a gas introduction unit for introducing oxygen or gas containing oxygen into the decomposition part. In the apparatus, the activity of the catalyst is determined on the basis of an amount of change of a catalyst temperature by heat generation during a decomposition reaction of formic acid. The method includes mixing exhaust gas containing formic acid exhausted from the soldering apparatus, and oxygen or gas containing oxygen such ...

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.

INTEGRATED CIRCUIT ALIGNMENT TOOL

A solderability alignment tool for aligning conductive interface surfaces of an IC with predetermined interface surfaces on a test board. The solderability tool includes a platen having a support surface for supporting a test board and an IC displacement assembly including an elongate tubular member in selective fluid communication with a vacuum source for precisely locating an IC on said test board. The tool may also include a microscope positioned opposite the platen support surface for precisely observing the position and alignment of the IC on said test board.

Prevention of dripping of material for material injection

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

Method for soldering metallic joint partners and device therefor

Verfahren zum Verlöten von metallischen Fügepartnern (4, 5), die mit Lötmaterial beschichtet sind, bei dem die Lötmaterialschichten der Fügepartner (4, 5) in einem Lötbereich (6) zusammengepresst und aufgeschmolzen werden, wobei sich Schmelzen aus flüssigem Lötmaterial bilden, die nach ihrer Vermischung im erstarrten Zustand die Fügepartner (4, 5) im Lötbereich (6) verbinden, wobei auf die Schmelzen aus flüssigem Lötmaterial vor dem Erstarren ein mechanischer Impuls übertragen wird.

A METHOD AND A MEANS FOR THE FIXATION OF OBJECTS

CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR ELIMINATING METHOD, FLUX RECOVERY METHOD AND SOLDER PROCESSING METHOD

Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation device 700 according to the present invention includes an outer cooling unit 720 including one or two or more inner tubes 722, an outer tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the outer tube 724.

ВАКУУМНАЯ ПЕЧЬ ДЛЯ ПАЙКИ ДАВЛЕНИЕМ И СПОСОБ ЕЕ ИСПОЛЬЗОВАНИЯ

Изобретение относится к промышленным вакуумным термическим печам и может быть использовано, например, для пайки крупных металлических деталей. Вакуумная печь имеет работающий под давлением корпус с цилиндрической стенкой. Размеры и расположение крышки корпуса позволяют закрыть один конец цилиндрической стенки корпуса. На крышке смонтирована система манипулирования с опорой для термически обрабатываемой в печи или соединяемой пайкой детали. Система манипулирования имеет устройство, предназначенное для вращения детали во время ее обработки в печи. Первая вакуумная система соединена с корпусом и предназначена для создания разрежения внутри корпуса, включая зону нагрева. Деталь соединяется со второй вакуумной системой, предназначенной для создания разрежения внутри детали во время ее пайки. Изобретение обеспечивает получение качественного соединения пайкой очень крупных металлических деталей. 2 н. и 19 з.п. ф-лы, 11 ил.

УСТРОЙСТВО И СПОСОБ ОЧИСТКИ ТЕХНОЛОГИЧЕСКОГО ГАЗА В УСТАНОВКЕ ДЛЯ ПАЙКИ ОПЛАВЛЕННЫМ ПРИПОЕМ

Изобретение относится к очистке технологических газов в установках для пайки оплавленным припоем. Устройство содержит сосуд, который имеет верхнюю часть, в которой расположен, по меньшей мере, один слой насадки, и нижнюю часть, предназначенную для размещения жидкости, газоподвод, предназначенный для подачи в сосуд сверху технологического газа и пропускания его через увлажненный слой насадки, газоотвод и приспособление для подачи жидкости сверху на слой насадки. Способ очистки с использованием заявленного устройства состоит в том, что технологический газ сначала вводят в контакт с жидкостью, а затем пропускают через, по меньшей мере, один слой насадки. Технический результат: надежное удаление побочных продуктов из технологического газа, снижение расходов на техническое обслуживание и текущий ремонт паяльной установки. 2 н. и 25 з.п. ф-лы, 3 ил.

РАБОТАЮЩЕЕ ПО ПРИНЦИПУ "С РУЛОНА НА РУЛОН" ПРОИЗВОДСТВЕННОЕ ОБОРУДОВАНИЕ ДЛЯ ОСУЩЕСТВЛЕНИЯ ВЗАИМОСОГЛАСОВАННЫХ НЕПРЕРЫВНЫХ И ПРЕРЫВИСТЫХ ЭТАПОВ ОБРАБОТКИ

Repair apparatus and method for circuit board assembly

A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Soldering apparatus

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

Inert environment enclosure

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps

A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

In-Situ Accuracy Control in Flux Dipping

A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.

Reflow furnace

To prevent evaporated flux from being attached to rotation axes of motors which rotate fans positioned in a preheating zone, a main heating zone and a cooling zone and being solidified, the evaporated flux is efficiently and surely collected with the flux liquefying before the flux is solidified and having fluidity. A drain portion 20 constituting a flux collection apparatus 10 A is formed at a side of a motor base 16 opposed to the fan and at a circumferential portion of the rotation axis 14. A surface of the drain portion 20 opposed to the fan is formed as an inclined surface 20 A which is inclined from a level position of the motor base 16 to a discharge port 46 provided at a back side of the motor base 16. The flux collected to a center portion of the motor base 16 by the rotation drive of the fan is flown to the drain portion 20 formed in the center portion of the motor base 16, is flown along the inclined surface 20 A and contained into a collection container 34 from the drain portion 20 through the discharge port 46, a drain pipe and a pipe 48.

Brazing system and method

A brazing system has a first gas source, a second gas source, a first enclosure, a second enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

Dross Removal

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

METHOD OF BONDING A MEMBER TO A SUPPORT BY ADDITION OF MATERIAL, AND DEVICE FOR ARRANGING TWO ELEMENTS, ONE ON THE OTHER

A method having a step of heating a mass forming a braze. Before the heating step, the method includes steps of arranging the mass and the member on the support. In particular, it includes a step of positioning the mass on the support and a step of applying a first compressive force on the mass so as to compress said mass against the support, the intensity of the first force increasing up to a predetermined first value chosen so as to flatten the mass. Next, the method includes a step of positioning the member on the flattened mass and a step of applying a second compressive force to the member so as to compress said member against the flattened mass and the support, the intensity of the second force increasing up to a second predefined value, the second predefined value being lower than the first predefined value. 1. A method of soldering a component to a holder by addition of a mass forming solder , of the type comprising a step in which the mass is heated , characterised in that , before the heating step , it comprises the following steps of arranging the mass and the component on the holder:positioning the mass on the holder;applying a first compressive force on the mass so as to compress the mass against the holder and attenuate surface irregularities of the mass, the intensity of the first force increasing up to a predefined first value chosen so as to flatten the mass;positioning the component on the flattened mass; andapplying a second compressive force to the component so as to compress the component against the flattened mass and the holder, the intensity of the second force increasing up to a second predefined value, the second predefined value being less than the first predefined value.2. The method according to claim 1 , whereinduring the step of positioning the mass on the holder, the mass is moved towards the holder until detection of a position where the mass comes into contact with the holder, andduring the application step, the intensity of the ...

Apparatus for and method of brazing aluminium products with closed loop conveyor within the furnace

An apparatus ( 10 ) for the production of brazed aluminium products on a continuous flow basis includes, in sequence, a flux application zone ( 12 ), a tunnel furnace ( 14 ), a cooling zone ( 15,16 ) and a transportation element ( 25 ) for conveying ( 26 ) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying ( 26 ) and return ( 27 ) runs within the tunnel furnace.

Apparatus And Method For Providing An Inerting Gas During Soldering

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap. 1. An enclosure for providing an inerting gas during soldering of a work piece comprising:a base comprising an interior volume in fluid communication with an inerting gas source,a neck comprising an interior volume in fluid communication with the interior volume of the base and an opening,a cap proximal to the opening, anda tube comprising one or more openings for the flow of the inerting gas therethrough, wherein the tube resides within the base and is in fluid communication with the inerting gas source;wherein the inerting gas travels through the tube into the interior volume of the base and neck and out through the opening.2. The enclosure of claim 1 , wherein the neck further comprises one or more holes along its surface.3. An apparatus for providing an inerting gas during soldering of a work piece claim 1 , the apparatus comprising:at least one groove on the bottom of the apparatus for placing onto at least one edge of a solder reservoir, wherein the solder reservoir contains molten solder and wherein at least one side wall of the groove and at least one wall of the apparatus define a chamber outside of the solder reservoir;at least one opening on the ...

Brazed assembly and method of forming

An assembly includes a first plate member with a first generally planar abutting surface and a second plate member with a second generally planar abutting surface. The first abutting surface being generally planar and having a plurality of micro reservoirs for storing brazing material. The first abutting surface and the second abutting surface being positioned adjacent each other and being joined by brazing material from the plurality of micro reservoirs.

Aluminum airfoil

A method of making an aluminum airfoil includes brazing a first airfoil piece and a second airfoil piece together using a braze material that includes an element selected from magnesium and zinc, to form a braze joint between the first airfoil piece and the second airfoil piece. At least one of the first airfoil piece or the second airfoil piece has an aluminum alloy composition that includes greater than 0.8% by weight of zinc.

REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD

In the present invention, when a power module is soldered to a heatsink, steam which is temperature-adjusted to at least the melting point of a solder is introduced from a steam generating tank into the flow path provided in the heatsink, the heatsink is heated and the solder is melted. Inert gas is introduced into a soldering tank from another route so as not to mix with the steam supplied to the heatsink. Voids in the solder are reduced and condensed by pressure regulation and as a result the negative impact of voids is eliminated. 2. The reflow soldering device according to characterized in that:the heating body is a plate-like member provided fixedly in the soldering tank and formed in such a manner that the soldered work is disposed to be in contact with the heating body; andthe soldered work is disposed on one surface or both surfaces of the heating body.3. The reflow soldering device according to characterized in that:the heating body is a heatsink formed of a plate-like member that is joined to the soldered work with the solder and formed integrally with the soldered work.4. The reflow soldering device according to claim 1 , characterized by further comprising:a pipe portion that is pulled into the soldering tank from the heat transfer medium supplying tank to transport the heat transfer medium,wherein the pipe portion is an elastic joint of an accordion structure.5. A reflow soldering method claim 1 , characterized by comprising:disposing a soldered work to which solder is applied on a heating body in a soldering tank;reducing an internal pressure of the soldering tank;introducing an inert gas into the soldering tank;supplying a heat transfer medium which is temperature-adjusted at least to a melting point of the solder to a flow path provided in the heating body by a route isolated from an internal space of the soldering tank to melt the solder by heating the heating body and the soldered work;reducing voids in the solder by reducing the internal pressure ...

Ex Flux

A flux application device is disclosed that allows users to solder copper pipe together with just one hand, thus the flux application device combines a brush and flux into one unit. The flux application device comprises a nozzle, a reservoir which typically comprises flux and is in fluid communication with the nozzle, and a brush head for applying the flux. The reservoir is a flexible reservoir containing flux that is secured to the nozzle to deliver the flux to a user. The flexible reservoir can be a reusable reservoir that a user would manually fill with flux, or a pre-filled replacement tube of flux.

BONDING APPARATUS

To provide a bonding apparatus capable of bonding at a high speed without performing a height measurement of a bonding point before a searching operation and the bonding. 1. A bonding apparatus comprising: a confocal optical system mounted on a bonding arm pivotable upward and downward and configured to perform detection of a focus of a bonding point located on a surface of a bonded part; a bonding tool configured to be movable integrally with the bonding arm and perform bonding; and position detecting means configured to detect the position of the bonding tool , whereinthe position detecting means is configured to detect the position of the bonding tool on the basis of focus detection by the confocal optical system while the bonding tool moves downward to the bonding point.2. The bonding apparatus according to claim 1 , wherein the bonding tool is configured to move downward by a predetermined distance from a position of the bonding tool detected by the position detecting means by focus detection by the confocal optical system to a preset bonding point (amount of downward movement from a focus) and stop on the bonding point.3. The bonding apparatus according to claim 1 , wherein the bonding tool controls to start downward movement on the basis of data of a tool height which corresponds to a distance from an origin position of the preset bonding tool to the bonding point claim 1 , calculate a new tool height from the data of the position of the bonding tool detected by the position detecting means by the focus detection by the confocal optical system during the downward movement of the bonding tool to the bonding point claim 1 , change the preset tool height to a new tool height claim 1 , and stop the bonding tool on the bonding point.4. The bonding apparatus according to claim 1 , wherein when the position of the bonding tool detected by the position detecting means by the focus detection by the confocal optical system while the bonding tool moves downward to the ...

WAVE SOLDERING CARRIER

A wave soldering carrier includes a base plate and a fixing member positioned on the base plate. The base plate defines a receiving recess and a number of through holes communicating with the receiving recess. The receiving recess receives a circuit board. The through holes are arranged and shaped corresponding to a number of electronic components on the circuit board. The fixing member includes a shaft including a fixing shaft fixed to the base plate and a restricting shaft extending from an end of the fixing shaft. A diameter of the restricting shaft is greater than that of the fixing shaft, thereby forming a step. The fixing member further includes a rotatable member rotatably connected to the fixing shaft and sandwiched between the shoulder and the base plate. The rotation member is rotatable to a preset position, where a distal end of the rotatable member firmly contacts the circuit board. 1. A wave soldering carrier comprising:a base plate defining a receiving recess for receiving a circuit board therein and a plurality of through holes defined in a bottom in the receiving recess, a contour of the receiving recess being shaped conforming to the circuit board, the through holes communicating with the receiving recess, and the through holes being arranged and shaped corresponding to a plurality of electronic components on the circuit board, the base plate defining a plurality of fixing holes around the receiving recess; a shaft comprising a fixing shaft for insertion into one of the fixing holes of the base plate and a restricting shaft extending from an end of the fixing shaft, a diameter of the restricting shaft being greater than that of the fixing shaft, thereby forming a step therebetween;', 'a rotatable member rotatably connected to the fixing shaft and sandwiched between the step and the base plate;, 'a fixing member positioned on the base plate, the fixing member comprisingwherein the rotation member is rotatable between a first position where the ...

SOLDER BALL PRINTING AND MOUNTING APPARATUS

A substrate is mounted on a first conveying carrier including a flat surface, transferred onto a printing table of a flux printer, transferred from the flux printer onto a second conveying carrier, transferred from the second conveying carrier onto a printing table of a solder ball printer, and transferred from the solder ball printer onto a third conveying carrier using a first carry-in mechanism, a first carry-out mechanism, a second carry-in mechanism, and a second carry-out mechanism including a plurality of vacuum attraction pads. Images of alignment marks provided at four corners of the substrate on the printing tables and four corners of a mask are simultaneously picked up by separate camera units on a front side and a rear side in a conveying direction to calculate a positional deviation amount. 1. A solder ball printing and mounting apparatus comprising:a first conveying unit including a first conveying carrier configured to be mounted with a substrate and convey the substrate to a flux printer;a first carry-in mechanism provided in an upper part on the flux printer side of the first conveying unit and provided above the first conveying carrier to be movable in a substrate conveying direction for transferring the substrate from the first conveying carrier to the flux printer;a first carry-out mechanism for transferring the substrate, on which flux is printed by the flux printer, onto a second conveying carrier;a second carry-in mechanism for transferring the substrate from the second conveying carrier onto a solder ball printer; anda second carry-out mechanism for transferring the substrate loaded with a solder ball onto a third conveying carrier, whereina camera unit provided in the first carry-in mechanism and a camera unit provided in the first carry-out mechanism simultaneously pick up images of alignment marks provided at four corners of the substrate placed on a printing table of the flux printer and alignment marks provided at four corners of a mask ...

Method And System For Joining Workpieces

A system for joining articles includes a joining unit; a positioning unit coupled to the joining unit, the positioning unit positioning the joining unit; a vision system obtaining an image of an item to be joined on a workpiece; a controller for processing the image and controlling a position of the joining unit relative to the item to be joined in response to the image; and a temperature probe for monitoring a temperature; wherein the controller adjusts the position of the joining unit in response to the temperature. 1. A system for joining articles , the system comprising:a joining unit;a positioning unit coupled to the joining unit, the positioning unit positioning the joining unit;a vision system obtaining an image of an item to be joined on a workpiece;a controller for processing the image and controlling a position of the joining unit relative to the item to be joined in response to the image; anda temperature probe for monitoring a temperature;wherein the controller adjusts the position of the joining unit in response to the temperature.2. The system of wherein:wherein the controller adjusts heat output of the joining unit in response to the temperature.3. The system of wherein:the joining unit includes a torch, the controller adjusting fuel to the torch to adjust the heat output.4. The system of wherein:the joining unit includes an induction brazer, the controller adjusting power to the induction brazer to adjust the heat output.5. The system of further comprising:a second vision system obtaining a second image of the item to be joined on the workpiece;the controller processing the second image and controlling the position of the joining unit relative to the item to be joined in response to the image and the second image.6. The system of wherein:the vision system and second vision system are positioned on orthogonal axes.7. The system of wherein:the controller processes the image to detect a feature in the image.8. The system of wherein:the controller ...

Apparatus And Method For Providing An Inerting Gas During Soldering

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a base comprising an interior volume in fluid communication with an inerting gas source, a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, and one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube, wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube. 1. An apparatus for supplying inerting gas during soldering of a work piece comprising:a base comprising an interior volume in fluid communication with an inerting gas source;a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough; andone or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube;wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, andwherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube.2. The apparatus of claim 1 , further comprising a second tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough ...

Pick-and-Place Tool for Packaging Process

An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

In wire bonding in which a bonding tool is cleaned through plasma irradiation, the plasma application to a wire and therefore the formation of an unexpectedly large-sized ball in the following bonding operation is prevented. The cleaning of the bonding tool through plasma irradiation is followed by dummy bonding, the bonding tool is cleaned with a ball formed thereon, or a prohibition period is provided during which ball forming is prohibited until the energy of plasma attenuates after the bonding tool is cleaned to prevent the plasma irradiation from having an impact on the bonding operation so that the ball cannot have an increased diameter. 1. A bonding apparatus configured to allow a bonding tool to clean , the apparatus comprising:a discharge device for forming a free-air ball at a tip of a wire;a bonding tool for bonding the free-air ball formed at the tip of the wire to a first bonding position;a plasma irradiation device for performing plasma irradiation to clean the bonding tool; anda controller for controlling the discharge device, the bonding tool, and the plasma irradiation device,wherein the controller is configured to perform a wire bonding process (A) and a cleaning process (B), the wire bonding process (A) comprising:(a) a ball forming step of forming the free-air ball at the tip of the wire extending out from a tip of the bonding tool;(b) a first bonding step of bonding the free-air ball formed at the tip of the wire extending out from the tip of the bonding tool to the first bonding position with the bonding tool to form a deformed ball;(c) a wire looping step of looping the wire toward a second bonding position along a predetermined trajectory of the bonding tool while paying out the wire from the tip of the bonding tool;(d) a second bonding step of bonding the wire extending out from the tip of the bonding tool to the second bonding position; and(e) a wire cutting step of raising the bonding tool while paying out the wire from the tip of the ...

METAL PLATE FOR LASER PROCESSING AND METHOD FOR PRODUCING STAINLESS STEEL PLATE FOR LASER PROCESSING

A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (μm) and a plate thickness t (μm) which satisfy the equation d≦0.0448·t−1.28. 1. A metal plate for a laser processed metal mask characterized in that it has an average grain diameter d (μm) and a plate thickness t (μm) satisfying the following Equation (1):{'br': None, 'i': d≦', '·t−, '0.04481.28 \u2003\u2003(1)'}2. A metal plate for a laser processed metal mask as set forth in wherein the metal plate is selected from an austenitic stainless steel plate claim 1 , a ferritic stainless steel plate claim 1 , and a titanium plate.3. A metal plate for a laser processed metal mask as set forth in having a pattern of small holes or slits formed by laser processing.4. A laser cut metal mask having a plate thickness t of at most 400 μm characterized in that it has an average grain diameter d (μm) and a plate thickness t (μm) satisfying the following Equation (1):{'br': None, 'i': d≦', '·t−, '0.04481.28 \u2003\u2003(1)'}5. A method for producing an austenitic stainless steel plate for a laser processed metal mask characterized by performing hot rolling claim 1 , cold rolling claim 1 , and annealing on an austenitic stainless steel to obtain an austenitic stainless steel plate and then subjecting the austenitic stainless steel plate to final cold rolling with a reduction of at least 30% and subsequent annealing at 800-950° C. for 25-70 seconds.6. A method as set forth in wherein temper rolling with a reduction of at least 20% is carried out after the final cold rolling and subsequent annealing.7. A method as set forth in wherein stress relief annealing at 500-820° C. for 5-150 seconds is carried out after the temper rolling. This invention relates to a metal plate for laser processing such as an austenitic stainless ...

SOLDER PASTE PRINT SQUEEGEE AND METHOD OF PRINTING USING THE SAME

Disclosed herein are a solder paste print squeegee and a method of using the same. The solder paste print squeegee includes: a rotation module driven rotatably; a pair of rods coupled with the rotation module in parallel; a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; and a pair of squeegee blades supported by the squeegee holder. 1. A solder paste print squeegee , comprising:a rotation module driven rotatably;a pair of rods coupled with the rotation module in parallel;a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; anda pair of squeegee blades supported by the squeegee holder.2. The squeegee according to claim 1 , wherein the pair of squeegee blades includes a first squeegee blade shorter than a second squeegee blade.3. The squeegee according to claim 2 , wherein the material of one squeegee blade of the pair of squeegee blades is different from that of the other squeegee blade.4. The squeegee according to claim 3 , wherein the thickness of the first squeegee blade is different from that of the second squeegee blade.5. The squeegee according to claim 1 , wherein the pair of rods includes at least one rod and is fixed to the rotation module.6. A method of printing solder paste on a circuit board claim 1 , in which the solder paste is provided on a metal mask and the solder paste fills holes formed on the metal mask claim 1 , the method comprising:locating a circuit board under a screen print mask;placing on the mask a solder paste print squeegee having a first squeegee blade and a second squeegee blade integrally coupled with each other;first printing solder paste on the circuit board by sliding the solder paste print squeegee from one side to the other side of the mask;detaching the printed circuit board and locating a new circuit board; supplementing solder paste; andsecond printing bumps on the circuit board by sliding from the other side to the one side of the solder ...

Apparatus for Thermal Melting Process and Method of Thermal Melting Process

Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.

REFLOW FURNACE AND SOLDERING METHOD

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board. 1. A reflow furnace that has a heat zone in which a circuit board with a mounted electronic component is heated , and a cooling zone in which the heated circuit board is cooled ,the reflow furnace comprising:a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; anda tunnel-like cover coupled to the opening and extending along a transport direction of the circuit board.2. The reflow furnace according to claim 1 , further comprising an electrostatic-precipitation flux collection apparatus that includes a drawing unit that draws an atmosphere gas out of the reflow furnace in the heat zone claim 1 , and a flux collection unit that collects a flux contained in the atmosphere gas claim 1 , wherein the flux collection apparatus returns the gas to the cooling zone after collecting the flux.3. The reflow furnace according to claim 2 , wherein the drawing unit has a slit-like suction nozzle disposed over a width direction perpendicular to the transport direction of the circuit board in the reflow furnace.4. The reflow furnace according to claim 1 , which satisfies TP1>TP2>TP3>TP4 claim 1 , where TP1 is an ambient temperature of the heat zone claim 1 , TP2 is a temperature inside the tunnel-like cover on the heat zone side of the shield claim 1 , TP3 is a temperature inside the tunnel-like cover on the cooling zone side of the shield claim 1 , and TP4 is an ambient temperature ...

FLUX APPLYING METHOD AND FLUX APPLYING APPARATUS

There is provided a flux applying method using a flux applying apparatus configured to jet and apply a flux to a target. The flux is supplied to a nozzle of the flux applying apparatus. A gas is applied to a foaming pipe with a porous filter included in the nozzle. The gas is jetted from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target. 1. A flux applying method using a flux applying apparatus configured to jet and apply a flux to a target , the method comprising:supplying the flux to a nozzle of the flux applying apparatus;supplying a gas to a foaming pipe with a porous filter included in the nozzle; andjetting the gas from the porous filter of the foaming pipe to the flux supplied to the nozzle, thereby jetting foamed flux to the target.2. The flux applying method according to claim 1 , wherein the gas is jetted from the porous filter of the foaming pipe while supply of the flux stops.3. The flux applying method according to claim 1 , wherein a height of the foamed flux from the nozzle is controlled by controlling supply of the flux and supply of the gas.4. A flux applying apparatus configured to jet and apply a flux to a target claim 1 , the flux applying apparatus comprising:a main tank configured to accommodate therein the flux;a piping configured to pass therethrough the flux which is to be transported from the main tank; anda nozzle comprising a foaming pipe with a porous filter and configured to jet a gas from the porous filter of the foaming pipe to the flux supplied via the piping, thereby jetting a foamed flux.5. The flux applying apparatus according to claim 4 , wherein the nozzle comprises a release hole configured to discharge the foamed flux.6. The flux applying apparatus according to claim 4 , wherein the nozzle comprises a throttle hole configured to adjust the foamed flux to be jetted. This application is based on and claims priority from Japanese Patent Application No. 2016-128325 ...

Processes and tooling associated with diffusion bonding the periphery of a cavity-back airfoil

A fixture assembly includes a first fixture portion, a second fixture portion that interfaces with the first fixture portion, and a sub-fixture movably mounted to the first fixture portion. A multiple of actuators selectively move the sub-fixture toward the second fixture portion. A method of manufacturing a fan blade includes deploying the sub-fixture from the first fixture portion to effectuate a peripheral diffusion bond to join the blade body and the cover of the fan blade.

METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface. 1. A method of bonding a flexible part including inclined leads , in which at least one inclined lead of a first part that is inclined with respect to a plane where the first part and a second part face each other , is bonded to at least one inclined pad of the second part formed to face the at least one inclined lead , the method comprising:(a) clamping the first part by using a first fixing member mounted to a support bracket that is rotatably mounted with respect to a base;(b) clamping the second part by using a second fixing member mounted to the support bracket;(c) transporting the second fixing member by using a second transporting unit that is fixed to the support bracket and transports the second fixing member relative to the support bracket so as to align a location of the second part with respect to the first part clamped by the first fixing member;(d) moving the first part, which is clamped by the first fixing member, near the second part clamped by the second fixing member, by using a first transporting unit that is mounted to the support bracket and transports the first fixing member relative to the support bracket;(e) rotating the support bracket with respect to the base by using a tilt unit rotating the support bracket with respect to the base, such that the at least one inclined lead of the first part and the at least one inclined pad of the second part face a bonding head bonding the at least one inclined lead to the at least one inclined pad; and(f) bonding the at least one inclined lead of the first part to the at least one inclined pad of the second part by using the bonding head ...

REFLOW APPARATUS

A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside. 1. A reflow apparatus comprising:a carrier for a printed circuit board having a semiconductor chip on a top side thereof, the carrier fixing the printed circuit board on a side thereof via a vacuum pressure generated therein; anda processing chamber where the carrier is placed in and discharged from, and wherein a reflow process is performed to mount the semiconductor chip on the printed circuit board,wherein the carrier includes at least one adsorption hole in a side thereof, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing the vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.2. The reflow apparatus of claim 1 , wherein the vacuum control unit comprises a vacuum maintaining unit and a vacuum removing unit.3. The reflow apparatus of claim 2 , wherein at least one of the vacuum maintaining unit and the vacuum removing unit comprises a vacuum valve.4. The reflow apparatus of claim 1 , further comprising a vacuum pump to remove a gas from the vacuum space through the vacuum control unit.5. The reflow apparatus of claim 1 , further comprising a conveying unit traversing the processing chamber and conveying the carrier.6. The reflow apparatus of claim 1 , wherein the carrier further comprises a recess region on one side thereof and the adsorption hole is placed inside the recess region.7. The reflow ...

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES

A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile. 1. A bonding machine for bonding semiconductor elements , the bonding machine comprising:a bond head assembly including a bonding tool for bonding semiconductor elements to a substrate;a support structure for supporting the substrate;a calibration station used in connection with the bond head assembly for measuring a time based z-axis height measurement characteristic of the bond head assembly during a model bonding process; anda computer for determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic.2. The bonding machine of wherein the calibration station is coupled to the support structure and moves along with the support structure along at least one motion axis.3. The bonding machine of wherein the calibration station includes a contact surface configured to be contacted by the bonding tool during the model bonding process.4. The bonding machine of further comprising a plurality of temperature sensors attached to a plurality of locations of the bond head assembly.5. The bonding machine of wherein the bond head assembly includes a force sensor for measuring a downward force applied by the bond head assembly.6. The bonding machine of further comprising a displacement sensor for measuring the time based z-axis height measurement characteristic in connection with the calibration station.7. The bonding machine of wherein the ...

SOLDER BUMP FORMING METHOD AND APPARATUS

Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head for supplying molten solder has a nozzle brought into contact with a mask with openings that is disposed over a substrate . After completing a supply operation, the injection head is forcedly cooled by heat transfer from a cooling unit through a heater unit whose operation has been stopped. Molten solder in the cooled injection head does not drool from the nozzle when the injection head moves up. 1. A solder bump forming method comprising:loading, onto a work stage, a component to be formed with a solder bump on an upper surface thereof, a mask being disposed over the upper surface of the component, the mask having an opening at a position corresponding to a position where the bump is to be formed;preheating the component with a first heater unit;lowering an injection head into contact with an upper surface of the mask disposed over the component, the injection head being configured to hold molten solder therein and supply the molten solder from a nozzle at a bottom thereof;bringing an upper surface of a second heater unit and a lower surface of the component into contact with each other to heat the component, which has already been preheated, to a working temperature thereof;heating the solder in the injection head to a working temperature thereof with a third heater unit;allowing the injection head to slide over the mask while discharging the molten solder heated to the working temperature from the nozzle to flow into the opening in the mask and scraping surplus molten solder off the upper surface of the mask, thereby filling the molten solder into the opening in the mask, and thus supplying a predetermined amount of molten solder onto the component;stopping respective operations of the second heater unit and the third heater unit after completion of supply of molten solder by the ...

METHOD AND APPARATUS FOR MEASURING A FREE AIR BALL SIZE DURING WIRE BONDING

Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed. 1. A method of measuring a free air ball size during a wire bonding process of a wire bonder , the wire bonder having a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire , the method comprising the steps of:forming a free air ball from a wire tail of the bonding wire;using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; andmeasuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor.2. The method of claim 1 , wherein the second position of the bonding tool is a position of the bonding tool with respect to the reference position when the wire tail contacts the conductive surface.3. The method of claim 2 , wherein the second position of the bonding tool ...

DEVICE FOR THERMAL MANAGEMENT OF SURFACE MOUNT DEVICES DURING REFLOW SOLDERING

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device. 1. An apparatus comprising:a top plate sized to cover a plurality of components for a printed circuit board (“PCB”) in a reflow solder operation to attach the plurality of components to a top surface of the PCB; and one or more heat shielding devices, each heat shielding device reducing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat shielding device positioned in the top plate to decrease heat to the component corresponding to the heat shielding device; and', 'one or more heat attracting devices, each heat attracting device increasing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat attracting device positioned in the top plate to increase heat to the component corresponding to the heat attracting device,, 'one or more of'}wherein the top plate is coupled to the one or more heat shielding and heat attracting devices and the top plate comprises a recess for each component of the plurality of components configured with a heat shielding device or a heat attracting device.2. The apparatus of claim 1 , wherein each recess is sized with ...

Electronic apparatus and method for fabricating the same

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

WAVE SOLDERING APPARATUS AND NOZZLE THEREOF

An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings. 1. An apparatus used for wave soldering , comprising:a nozzle device configured to discharge molten solder to a circuit board near a solder tank,wherein, the nozzle device comprises at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings.2. The apparatus according to claim 1 , wherein each nozzle opening of the pair of nozzle openings is formed by a vertical plate and an inclined plate claim 1 , the vertical plate of each nozzle opening at the inner side of the pair of nozzle openings claim 1 , and the inclined plate of each nozzle opening at the outer side of the pair of nozzle openings.3. The apparatus according to claim 1 , wherein the distance between the pair of nozzle openings is configured so that the time period during which the component on the circuit board passes through the high temperature solder between the pair of nozzle openings conforms to a specification on the staying period of a component in a high temperature solder.4. The apparatus according to claim 2 , wherein the inclination of the inclined plate of each nozzle opening is adjustable between 0 and 90 degree5. The apparatus according to claim 1 , further comprising a pump device being a single pump device and configured to drive the molten solder in the solder tank through a conduit to each nozzle opening in the adjacent nozzle openings of the nozzle device.6. The apparatus according to claim 5 , wherein the pump device is installed on a side of the solder tank.7. The apparatus according to claim 6 , wherein the pump device comprises:a rotation shaft inserted into the solder tank through an ...

INTEGRATED COMPRESSED AIR COOLING FOR WELDING SYSTEMS

Systems and methods are disclosed for integrated compressed air cooling for welding systems. In particular, the disclosed systems and methods may employ compressed air to implement one or more welding processes (e.g., a gouging or cutting processes), with the compressed air being conveyed through such welding systems. In some examples, the compressed air is routed within the welding system to provide cooling for one or more components therein. For instance, components such as power conversion circuitry may heat up during the welding process. Routing compressed air to or near the components will introduce relatively cool air to the environment. As the passing compressed air heats in response to interaction with the heated components, heat is drawn from the components and/or the nearby environment. 1. A welding system comprising:one or more channels within the welding system to convey compressed air from a compressed air source;a compressed air outlet to provide compressed air through the one or more channels to a gouging torch; anda cooling pathway to route compressed air through the one or more channels to a component within the welding system, wherein conveyance of the compressed air draws heat from the component.2. The system as defined in claim 1 , wherein the one or more channels comprise a conductive material.3. The system as defined in claim 2 , wherein the conductive material is one of a metal or a semiconductor.4. The system as defined in claim 1 , wherein the one or more channels comprise one or more of a flexible conduit or a rigid conduit.5. The system as defined in claim 1 , further comprising one or more valves to selectively control conveyance of the compressed air to the one or more channels.6. The system as defined in claim 1 , further comprising one or more temperature sensors to monitor temperature of the component.7. The system as defined in claim 1 , wherein the component comprises one or more of a power conversion circuitry or a control ...

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block. 1. An assembly comprising:a cooling block comprising an array of vertical micro channels jets coupled to a heater surface, wherein an outlet micro channel jet of the array is coupled with an adjacent inlet micro channel jet of the array; andan inlet and outlet manifold coupled to the array of vertical micro channel jets, wherein the heater surface and the array of vertical micro channel jets are coupled in the same block material, wherein the heater surface comprises a plurality of micro fins, and wherein a tip of each micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets.2. The assembly of claim 1 , wherein each outlet micro channel jet is coupled with two adjacent micro channel jets.3. The assembly of claim 1 , wherein inlet and outlet micro channel jets are disposed in a staggered configuration.4. The assembly of claim 1 , wherein a bottom portion of each inlet and outlet micro channel jet is chamfered.5. The assembly of claim 1 , wherein the vertical micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface.6. The assembly of claim 1 , further comprises a nozzle coupled to the heater claim 1 , and a die coupled to the nozzle claim 1 , wherein the die is on a substrate disposed on a pedestal.7. The assembly of claim 5 , wherein the assembly comprises a portion of a TCB bonding system.8. The assembly of claim 1 , wherein a TEC pad is disposed between the heater surface and the cooling block of the assembly.9. An assembly comprising:a ...

APPARATUS FOR ADSORBING SOLDER BALL AND METHOD OF ATTACHING SOLDER BALL USING THE SAME

Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins.

COMPONENT HOLDING DEVICE

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board. 1. A component holding device for the fixed-position arrangement of an electric component on a circuit board ,having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element,and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.2. The component holding device according to claim 1 , wherein the first and second latching elements can be detachably latched on the electric component or the circuit board claim 1 , respectively.3. The component holding device according to claim 1 , wherein the first latching element is designed as a latching hook with a rear grip section forming an abutment for the fixed-position latching in the electric component.4. ...

Composite Soldering, De-Soldering Station Load Detection

A soldering and de-soldering station and systems including enhanced features for the soldering heating tools and load detection functionality. 1. A soldering system for use in soldering and de-soldering of electrical devices , the soldering system comprising:a control station including a central processing unit (CPU) and operations programs;a thermal tool assembly including a cable, a handle connected to said control station by said cable, and at least one cartridge removably installed in said handle and powered by said control station, said cartridge including a tip temperature sensor;a load detection circuit within said control station to detect the applied amount of energy during a soldering operation; anda program to monitor the load detection circuit and the power delivered to said cartridge to identify the beginning and completion of each soldering operation based upon the energy load delivered by said control station to said cartridge.2. The soldering system of claim 1 , wherein said load detection circuit comprises: a voltage detector and a current detector to measure the voltage and current delivered by a power supply claim 1 , said voltage detector and said current detector each being connected to and controlled by said CPU.3. The soldering system of claim 1 , wherein said CPU is programmed with a lower level energy input for a soldering event claim 1 , and said CPU causes said control station to generate an indication that the lower level energy input for a soldering event has been delivered by the control station.4. The soldering system of claim 1 , wherein said CPU is programmed with an upper level energy input for a soldering event claim 1 , and said CPU causes said control station to generate an indication that the upper level energy input for a soldering event has been delivered by the control station.5. The soldering system of claim 1 , wherein said CPU of said control station is programmed with a lower level energy input for a soldering event claim ...

Screen printing machine, and screen printing method

A printing operation is repeatedly performed with respect to one substrate 2 , the printing operation including the step of loading the substrate 2 (the step ST 1 ), then contacting an upper surface of the substrate 2 with a mask 13 (the step ST 4 ), reciprocating a squeegeeing operation to slide squeegees 33 b on the mask 13 in contact with the substrate 2 to transfer a paste Pt on the mask 13 to the substrate 2 (the step ST 7 and the step ST 8 ), separating the substrate 2 from the mask 13 for a snap off (the step ST 9 ), and while unloading the substrate 2 (the step ST 11 ), performing mask cleaning to remove the paste Pt that is adhered to a lower surface of the mask 13 (the step ST 12 ).

MASK FOR BUMPING SOLDER BALLS ON CIRCUIT BOARD AND SOLDER BALL BUMPING METHOD USING THE SAME

Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings. 1. A mask for bumping solder balls on a circuit board , comprising:a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; andtrenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.2. The mask according to claim 1 , wherein the trench is formed to connect one opening and another opening to each other.3. The mask according to claim 2 , wherein the trench is connected to two or four other openings around the circumference of one opening.4. The mask according to claim 1 , wherein the opening has a size larger than that of the solder ball and smaller than that of the solder pad.5. The mask according to claim 1 , wherein the opening has a size larger than that of the solder pad.6. The mask according to claim 1 , wherein it is used for fine pitch bumping using the solder ball having a size of 100 μm or less.7. The mask according to claim 1 , wherein it is a dry film mask.8. The mask according to claim 1 , wherein it is attached onto a solder resist having open regions so that the solder pads on the circuit board are exposed.9. A solder ball bumping method comprising:forming a mask on a solder resist having open regions so that solder pads on a circuit board are exposed, the mask including a plurality of openings exposing the solder pads and trenches extended from at least one side of circumferences of the openings so ...

METHOD FOR CONTROLLING AN EJECTOR, AND RELATED SYSTEM

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence. 1. A method for controlling an ejector comprising an actuator arrangement configured to eject a droplet of viscous medium onto a substrate , wherein the droplet forms part of a sequence of a plurality of droplets , the method comprising:obtaining a control parameter for controlling the operation of the actuator arrangement; andoperating the actuator arrangement, using the control parameter, in order to eject the droplet; a time period between the droplet and a previous droplet in the sequence,', 'a difference in target size of the droplet and a size of the previous droplet in the sequence, and', "the droplet's position in the sequence."], 'wherein the obtained control parameter is based on at least one of2. The method according to claim 1 , wherein the obtained control parameter is configured to control an actuating force by which the actuator arrangement ejects the droplet.3. The method according to claim 2 , wherein the obtained control parameter is configured to reduce the actuating force compared to the actuating force used for ejecting the previous droplet in the sequence.4. The method according to claim 2 , wherein the obtained control parameter is configured to increase the actuating force compared to the actuating force used for ejecting the ...

Preheat module, preheat zone and preheat section using the same

The present invention provides a preheat module, which comprises a heating chamber, a blower and a platform; the heating chamber comprises a heating device and a first inlet; the blower comprises a second inlet and a first outlet, and the second inlet is connected to the heating chamber; the platform comprises a third inlet and a second outlet, and the third inlet is connected to the first outlet; the first inlet and the second outlet are set in a same plane. An advantage of the present invention is that it can reduce the energy consumption also can satisfy the requirement of conserving electrical power and protecting the environment.

Soldering System

This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending through the body of the heating plate and the heating plate being configured to supply hot air through the first air exits; a cover disposed on the heating plate, the cover and the heating plate defining a hot air chamber; a plurality of axially movable positioning shafts extending though the body of the heating plate, in which each shaft has a first end and a second end, the first end is in the hot air chamber, and the second end is outside the hot air chamber; and a conduit attached to the cover, the conduit being configured to supply hot air to the hot air chamber.

Soldering Block for LED Tape Light

A soldering block for holding two electrical components in contact or proximity to facilitate their connection, such as by soldering. The soldering block utilizes a pair of fixation elements, such as spring tensioned clamps, to hold the first and second electrical elements in place, conveniently acting as a third hand for the electrician. The soldering block is especially well suited to connecting wires to the terminals of LED tape strip. 1. A soldering block , comprisinga substantially planar top surface;a first fixation element for holding one or more electrical elements to the planar surface; anda second fixation element for holding one or more electrical elements to the planar surface.2. The soldering block of claim 1 , whereinthe first and second fixation elements comprise tensioned elements that sandwich the one or more electrical elements to the planar top surface.3. The soldering block of claim 2 , whereinthe tensioned elements comprise spring clamps.4. The soldering block of claim 3 , whereinthe spring clamps comprise a plurality of teeth.5. The soldering block of claim 1 , whereinthe top surface comprises a plate.6. The soldering block of claim 5 , whereinthe plate comprises metal, ceramic, glass, or organic material.7. The soldering block of claim 6 , whereinthe plate comprises aluminum.8. A method of securing a first electrical element and a second electrical element in contact with each other or in proximity to each other for facilitating connecting them together claim 6 , comprising a substantially planar top surface;', 'a first fixation element for holding one or more electrical elements to the planar surface; and', 'a second fixation element for holding one or more electrical elements to the planar surface, 'by the use of a soldering block comprisingsecuring the first electrical element to the top surface of the soldering block by the first fixation element;securing the second electrical element to the top surface of the soldering block by the second ...

APPARATUS AND METHOD FOR SOLDERING JOINING PARTNERS, SAID APPARATUS COMPRISING A VACUUM CHAMBER AND PLATE ELEMENTS

The invention describes an apparatus and a method for soldering mating parts, in particular electrical components to circuit boards or other carrier elements. The mating parts may be received and pressed together between two plate elements. One of the plate elements, which is heatable, may be flexible and may be elastically biased in the direction of the other plate element, by means of a plurality of elastically biased elements. Alternatively or additionally, heating may be provided for both plate elements. 1. An apparatus for soldering mating parts , in particular electrical components to circuit boards or other carrier elements , the apparatus comprising:a vacuum chamber, which is connective to a vacuum unit;a first plate element in the vacuum chamber;a second plate element in the vacuum chamber, the second plate element being moveable between an open position and a closed position, wherein the second plate element in the closed position is arranged opposite the first plate element, in order to be able to press together mating parts, which are received between the plate elements, wherein one of the plate elements is flexible and the other one is rigid;a plurality of elastically-biased elements, which are capable of contacting the flexible plate element, and to elastically bias the flexible plate element towards the other plate element, andat least one first heating unit, which is capable of heating the flexible plate element.2. The apparatus of further comprising a second heating unit which is capable of heating the other plate element claim 1 , wherein the second heating unit is controllable independent of the first heating unit.3. The apparatus of claim 1 , wherein the plurality of elastically-biased elements is moveably guided in a base plate and biased by at least one spring.4. The apparatus of claim 1 , wherein the first heating unit comprises at least one radiation heater claim 1 , in particular in the form of a heating lamp.5. The apparatus of claim 1 , ...

Heater Sensor Complex With High Thermal Capacity

The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle. 1) A heater-sensor sub-assembly adapted for use in a soldering system comprising:an insulating pipe;a heating wire made of first metallic material having proximal end portion, a central winding portion wrapped around said insulating pipe and a distal end portion;a first non-heating wire made of the same first metallic material as said heating wire, said non-heating wire connected to the proximal end of said heating wire;a second non-heating wire made of a second metallic material, said non-heating wire having a proximal end and a distal end with at least a portion of said non-heating wire extending axially through said insulating pipe;a thermocouple formed by connecting said distal end of said heating wire made of said first metallic material connected to a distal end of said second non-heating wire made of said second metallic material; anda third non-heating wire connected to a proximal end of said first non-heating wire, said third non-heating wire made from a metallic material selected from the group consisting of a metallic material having a lower volume resistivity than said first non-heating wire and a metallic material identical to said second non-heating wire.2) The heater-sensor sub-assembly of claim 1 , further comprising:an iron-chromium alloy material as said first metallic material; anda nickel or nickel alloy material as said second metallic ...

COATING APPARATUS AND CLEANING METHOD

There is provided a coating apparatus which applies a flux liquid on a coating object. A sealed liquid container stores the flux liquid. A nozzle jets the flux liquid. A pressurizing unit supplies a gas to the inside of the liquid container, thereby pressurizing the inside of the liquid container, such that the flux liquid is supplied from the liquid container to the nozzle through a conducting pipe. A detecting unit detects the pressure of the flux liquid in the conducting pipe. A control unit performs liquid pressure control by regulating the pressure of the gas to be supplied to the inside of the liquid container, on the basis of the pressure of the flux liquid detected by the detecting unit, such that the pressure of the flux liquid to be supplied to the nozzle is maintained substantially at a constant value. 1. A coating apparatus for applying a flux liquid on a coating object , comprising:a sealed liquid container that stores the flux liquid;a nozzle that jets the flux liquid;a pressurizing unit that supplies a gas to the inside of the liquid container, thereby pressurizing the inside of the liquid container, such that the flux liquid is supplied from the liquid container to the nozzle through a conducting pipe;a detecting unit that detects the pressure of the flux liquid in the conducting pipe; anda control unit that performs liquid pressure control by regulating the pressure of the gas to be supplied to the inside of the liquid container, on the basis of the pressure of the flux liquid detected by the detecting unit, such that the pressure of the flux liquid to be supplied to the nozzle is maintained substantially at a constant value.2. The coating apparatus according to claim 1 , wherein the detecting unit is provided in the vicinity of a connection portion of the conducting pipe with the nozzle.3. The coating apparatus according to claim 1 , wherein the nozzle applies the flux liquid on the coating object without interposing a cover member for covering ...

BRAZING WITHOUT TOOLS

A method for assembling a set including an inner wall, a shrouded outer wall and an intermediate element, each presenting substantially circular sections, the shrouded outer wall presenting a shape substantially complementary to a shape of outer and inner surfaces of the intermediate element, and whose inner surface covers the outer surface of the intermediate element. In particular, the method includes a step of placing a brazing sheet, whose melting temperature is lower than melting temperatures of other elements of the set, over an assembly surface in contact with another assembly surface, and a step of heating, by a furnace, a set including the outer or inner walls and the intermediate element between which is interposed a brazing sheet so as to fix the outer or inner wall by brazing on the intermediate element. 1. A method for assembling a set comprising an inner wall , a shrouded outer wall and an intermediate element , each presenting substantially circular sections , the shrouded outer wall presenting a shape substantially complementary to a shape of outer and inner surfaces of the intermediate element , and whose inner surface covers the outer surface of the intermediate element ,wherein the method comprises at least one step of placing at least one brazing sheet, whose melting temperature is lower than melting temperatures of other elements of the set, over at least one assembly surface in contact with another assembly surface, and at least one step of heating, by means of a furnace, a set comprising at least one of the outer or inner walls and the intermediate element between which is interposed at least one brazing sheet so as to fix the outer or inner wall by brazing on the intermediate element.2. The method according to claim 1 , wherein the method comprises a step of placing at least one brazing sheet over all or part of the inner surface of the outer wall.3. The method according to claim 1 , wherein the method comprises a step of placing at least one ...

SOLDERING IRON WITH AUTOMATIC SOLDERING CONNECTION VALIDATION

A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period. 1. A method performed by a handheld soldering iron station for a soldering joint connection validation , the handheld soldering iron station including a soldering cartridge having a soldering tip , the method comprising:identifying a type of the soldering cartridge being used by the soldering iron station and obtaining information related to the identified cartridge;determining that a soldering event has started by measuring a power level delivered to the soldering tip, within a first predetermined time period;performing a preliminary validation by measuring a soldering tip temperature, after the soldering event has started;monitoring the power level delivered to the soldering tip to detect liquidus occurrence;determining a thickness of an intermetallic component (IMC) of the soldering joint as a function of soldering time and soldering tip temperature, after detect the liquidus occurrence;determining whether the thickness of the IMC is within a predetermined rage, within a predetermined cooling time period; andindicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined rage, within the predetermined cooling time period.2. The method of claim 1 , wherein ...

Viscous fluid supply device

A flux unit includes a flux supply device configured to eject flux to a storage tray, an ejection port configured to eject the flux, and an ejection port moving device configured to move the ejection port in the radial direction of the storage tray. By this, the flux is ejected in a wide range in the radial direction of the storage tray. Also, the storage tray is rotated by a tray rotation device. Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.

Brazing method

A brazing method for brazing a material without using a flux includes performing brazing in an inert gas atmosphere, in a state in which the material to be brazed is covered with a cover member formed of an upper cover portion covering the whole upper portion of the material to be brazed and side cover portions covering at least some of the side portions of the material to be brazed, with the upper cover portion contacting the upper portion of the material to be brazed, and the material to be brazed and the cover member are held with a heat transmission promoting member formed of an upper heat transmission promoting portion and a lower heat transmission promoting portion, with the upper heat transmission promoting portion contacting the upper cover portion, and with the lower heat transmission promoting portion contacting the lower portion of the material to be brazed.

Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. 1. A method for the manufacture of a ceramic multi-layer plate device used as a plate in an electrostatic chuck , or in a heater , or other wafer support , used in semiconductor wafer processing , said method comprising the steps of:depositing aluminum onto one or both of a joining interface surface of an upper plate layer and a joining interface surface of a lower plate layer, wherein said joining interface surfaces of said upper plate layer and said lower plate layer are annular rings around an outer area of said upper plate layer and said lower plate area;arranging said upper plate layer and said lower plate layer into a stack to form a joining pre-assembly, wherein said aluminum is disposed between said upper plate layer and said lower plate layer, thereby defining an inner space between said upper plate layer and said lower plate layer within the interior of the deposited aluminum, wherein said upper plate layer comprises a ceramic from the group of aluminum nitride, alumina, beryllium oxide, and zirconia, and said lower plate layer comprises a ceramic from the group of aluminum nitride, alumina, beryllium oxide, and zirconia, and wherein said aluminum comprises 99% by weight or greater aluminum;placing the components of said joining ...

SOLDERING SYSTEM

Provided is a soldering system that can raise the work efficiency related to the supply of a soldering target and soldering work, while decreasing the oxygen concentration by maintaining high airtightness in a space surrounding the soldering target. A soldering system includes a soldering device and a robot related to the soldering device, in which the soldering device is equipped with a container having an openable lid and accommodating a soldering target, and the robot performs conveying of the soldering target to the soldering device and opening/closing of the lid. In an embodiment of the soldering device, the container is a double structure in which an inner container is accommodated in an outer container, and a first nitrogen supply pipe and second nitrogen supply pipe, which are inert gas supply parts of separate systems, are respectively connected to the inner container and outer container. 1. A soldering system comprising a soldering device and a robot related to the soldering device ,wherein the soldering device includes a container having an openable lid, and accommodating a soldering target, andwherein the robot performs conveying of the soldering target to the soldering device, and opening/closing of the lid.2. The soldering system according to claim 1 ,wherein the container is a double structure in which an inner container is accommodated in an outer container, and inert gas supply parts of different systems are connected to the inner container and the outer container.3. The soldering system according to claim 1 ,wherein the robot has a gripping part that simultaneously grips a soldering target and the lid.4. The soldering system according to claim 1 , wherein the lid has an opening for soldering work.5. The soldering system according to claim 1 ,wherein the robot has an inert gas injection part for injecting inert gas, and injects inert gas to inside of the container from the inert gas injection part prior to closing the lid.6. The soldering system ...

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR

Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit. 1. A method of forming a semiconductor package , the method comprising:placing a first semiconductor device in a first unit area on a top surface of a boat, the boat configured to support semiconductor devices, the boat having a plurality of unit retainers, wherein in a top view, the first semiconductor device overlaps at least a portion of a first unit retainer of the plurality of unit retainers; andplacing a cover over the first semiconductor device, the cover being retained to the top surface of the boat by the first unit retainer, the cover clamping the first semiconductor device to the top surface of the boat.2. The method of claim 1 , wherein the cover has a recess at a lower surface of the cover claim 1 , wherein after placing the cover claim 1 , the first semiconductor device fits into the recess.3. The method of claim 2 , wherein the cover has an opening extending from an upper surface of the cover to the lower surface of the cover claim 2 , wherein after placing the cover claim 2 , the opening exposes a portion of the first semiconductor device claim 2 , wherein the method further comprises attaching claim 2 , through the opening of the cover claim 2 , a second semiconductor device to the first semiconductor device.4. The method of claim 3 , further comprising:after attaching the second semiconductor device, performing a ...

VACUUM CARRIERS FOR SUBSTRATE BONDING

A vacuum carrier can be employed to provide a partial vacuum on a back side surface of a substrate thereby holding the substrate flat against a rigid surface of the carrier throughout the duration of a bonding process. The magnitude of vacuum can be optimized to limit the warping of the substrate during and after bonding with another substrate, and to limit the mechanical stress induced in the solder balls during cooling. The vacuum carrier can include a base plate, a seal plate with at least one opening configured to accommodate at least one substrate, and vacuum seal elements configured to create a vacuum environment that pushes the substrate against the base plate when the vacuum carrier is under vacuum. The configuration of the vacuum carrier is chosen to avoid distortion of the substrate due to the vacuum seal elements, while allowing adjustment of the magnitude of the partial vacuum. 1. A structure comprising:a vacuum carrier including a base plate, a seal plate having at least one opening, at least one first vacuum seal element, and a second vacuum seal element; andat least one substrate contacting a planar surface of said base plate and underlying each of said at least one opening, wherein said at least one first vacuum seal element provides a seal at each gap between said at least one substrate and said seal plate, and said second vacuum seal element provides another seal between said base plate and said seal plate, and said vacuum carrier and said at least one substrate includes a reduced pressure environment therein.2. The structure of claim 1 , wherein said base plate includes a planar surface and a vacuum manifold claim 1 , wherein said at least one substrate is pushed against said planar surface by a pressure differential between said reduced pressure environment and an ambient at an atmospheric pressure.3. The structure of claim 1 , wherein a cavity enclosed by said base plate claim 1 , said seal plate claim 1 , said at least one first vacuum seal ...

Brazed Heat Exchanger and Production Method

The invention relates to a heat exchanger which is brazed in a brazing furnace, comprising stacked heat exchanger parts which provide first channels and second channels, and with at least two brazing materials, the one brazing material in the first channels being different than the other brazing material in the second channels. According to one alternative, said heat exchanger is improved by virtue of the fact that there is the other or the one brazing material in one or in a few of the first channels or the second channels or in one or in a few of the first and the second channels, or the other and the one brazing material are present arranged in part regions.

Jet Solder Bath And Jet Soldering Apparatus

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate. 1. A jet solder bath comprising:a first jet nozzle which injects molten solder by a first pump;a second jet nozzle which injects the molten solder by a second pump, the second jet nozzle being arranged on a downstream side of the first jet nozzle along a carrying direction of a substrate; anda bridge member arranged between the first and second jet nozzles, a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing to the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing to an upstream side of the second jet nozzle, and', 'side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate., 'wherein the bridge member includes2. The jet solder bath according to claim 1 , wherein the bridge member extends from a vicinity of an upper end on an upstream end of the second jet nozzle to a vicinity of an upper end on a downstream end of the first jet nozzle.3. The jet solder bath according to claim 2 , further comprising ...

Mechatronic curtain for a process chamber for carrying out thermal processes in the manufacture of electronic assemblies

A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD

Provided is a space-saving soldering device that can perform allowing high-reliability soldering at a low cost and a high yield be produced at low cost with a high yield. For achieving the above-described objects, the soldering device includes: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode, and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component. 1. A soldering device , comprising:a first processor in which a component, having an electrode to be soldered, is set;a second processor that is separated in a sealable manner by a first opening-closing controller, which is provided between the first processor and the second processor, and that sends out the component, which is fed from the first processor, to the subsequent third processor;a third processor that is separated in a sealable manner by a second opening-closing controller, which is provided between the second processor and the third processor, and that causes the component, which is fed from the second processor, to make contact with an organic fatty acid-containing solution, and that moves the component horizontally;a fourth processor that has a molten solder adhesion controller that ...

SOLDERING EQUIPMENT FOR CONNECTING SOLAR CELLS

Soldering equipment for connecting solar cells includes an inductor loop for generating a high-frequently magnetic field for soldering conductors to the solar cells and holding-down devices, which devices penetrate the inductor loop, for pressing the conductor onto the conductor tracks of the solar cells. A field-concentrator element of a ferrite material is arranged in each holding-down pin of the holding-down device, whereby the magnetic field can be locally amplified and concentrated. 1. Soldering equipment for connecting solar cells , comprising:an induction heat source for soldering an electrical conductor to a conductor track on the solar cells, wherein the heat source includes an inductor loop for generating a high-frequency magnetic field for soldering the conductor; andat least one holding-down device for pressing the conductor onto the conductor track, wherein the at least one holding-down device is formed as a field concentrator, whereby the magnetic field is locally amplified and concentrated.2. The soldering equipment according to wherein the at least one holding-down device is formed at least partly of or contains a ferrite material or another material with high magnetic permeability.3. The soldering equipment according to wherein the at least one holding-down device includes a holding-down pin formed of the ferrite material or the another material with high magnetic permeability.4. The soldering equipment according to wherein the at least one holding-down device includes a holding-down pin with a tubular base body claim 1 , wherein a field-concentrator element formed of a ferrite material or another material with high magnetic permeability is arranged in a cavity of the base body in a front end of the base body facing the solar cells.5. The soldering equipment according to wherein the tubular base body is formed open at the front end.6. The soldering equipment according to wherein the tubular base body is closed at the front end.7. The soldering ...

Warpage Control in the Packaging of Integrated Circuits

A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component. 1. A method comprising: an air-penetration layer as a top portion of the vacuum boat, wherein the air-penetration layer comprises a plurality of through-holes therein;', 'a thermal insulation layer;', 'an inner space between the air-penetration layer and the thermal insulation layer, wherein the inner space is connected to the plurality of through-holes;, 'providing a vacuum boat comprisingplacing a package substrate strip overlapping the air-penetration layer, wherein the package substrate strip covers the plurality of through-holes;placing a plurality of package components over the package substrate strip;vacuuming the inner space; andwhen the inner space is vacuumed, reflowing solder regions to join the plurality of package components to the package substrate strip.2. The method of claim 1 , wherein the thermal insulation layer comprises a surface exposed to vacuuming.3. The method of claim 1 , wherein during the reflowing claim 1 , the vacuum boat claim 1 , the package substrate strip claim 1 , and the plurality of package components are moved by a conveyor belt.4. The method of claim 1 , wherein during the reflowing claim 1 , a pump is connected to the inner space to maintain vacuum in the inner space.5. The method of claim 1 , wherein each of the plurality of package components overlaps multiple ones of the plurality of ...

BONDING MATERIALS OF DISSIMILAR COEFFICIENTS OF THERMAL EXPANSION

Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. (canceled)12. (canceled)13. (canceled)14. (canceled)15. (canceled)16. (canceled)17. A method comprising:setting a layer of a first material to a first temperature;setting a layer of a second material to a second temperature, wherein the first material and the second material have different coefficients of thermal expansion;bonding the layer of the first material and the layer of the second material while the layer of the first material is at the first temperature and the layer of the second material is at the second temperature;changing temperatures of the layer of the first material and the layer of the second material toward a third temperature while maintaining relative thermal expansions of the layers essentially equal at all times before the layers reach the third temperature;wherein changing the temperatures of the layer of the first material and the layer of the second material toward the third temperature comprises using a temperature driver in the layer of the first material or the layer of the second material.18. The method of claim 17 , wherein the layer of the first material and the layer of the second material are bonded by direct bonding or flip chip bonding.19. The method of claim 17 , wherein the third temperature is below 40° C.20. The method of claim 17 , wherein the layer of the first material is an X-ray absorption layer configured to absorb X-ray photons; wherein the layer of the second material is an electronics layer comprising an electronics system ...

METHOD AND CLEANING SYSTEM FOR CLEANING THE PROCESS GAS IN SOLDERING INSTALLATIONS

The invention relates to a method for cleaning the process gas in soldering installation and solder suction systems, in particular for reducing the abietic acid in the process gas, wherein the process gas to be cleaned is conducted through a cleaning system which contains one or more of the following compounds (cleaning compounds): 110-. (canceled)11. A method for cleaning the process gas in soldering installations or solder suction systems by reducing abietic acid in the process gas comprising: a) carboxylic acids selected from oxalic acid, formic acid, citric acid, ascorbic acid, or combinations thereof;', 'b) metal compounds of higher oxidation states selected from manganates, permanganates, chromates, dichromates, or combinations thereof;', 'c) alcohols which can be converted into oxalic acid, formic acid, citric acid, and/or ascorbic acid by means of oxidation;', 'd) basic lime compounds; and', 'e) combinations thereof., 'conducting the process gas to be cleaned through a cleaning system comprising a cleaning chamber which contains one or more cleaning compounds selected from the group consisting of12. The method according to claim 11 , wherein the cleaning system comprises oxalic acid and a permanganate claim 11 , calcium hydroxide or combinations thereof.13. The method according to claim 12 , wherein the cleaning system comprising claim 12 , potassium permanganate.14. The method according to claim 11 , wherein the cleaning system comprises a filter material mixed with the one or more cleaning compounds.15. The method according to claim 14 , wherein the one or more cleaning claim 14 , compounds are mixed with the filter material by coating claim 14 , impregnation claim 14 , or combinations thereof claim 14 , whereby the filter material increases the reaction surface of the cleaning chamber compared to a cleaning system without the filter material.16. The method according to claim 15 , wherein the filter material is selected from the group consisting of ...

SOLDERING STATION WITH AUTOMATIC SOLDERING CONNECTION VALIDATION

A soldering iron station and a method thereof for a soldering joint connection validation, the method including: identifying a type of the soldering cartridge being used; performing a preliminary validation by measuring the soldering tip temperature, after the soldering event has started; monitoring the power level delivered to the soldering tip to detect liquidus occurrence; determining the thickness of an intermetallic component (IMC) of the soldering joint; determining whether the thickness of the IMC is within a predetermined range, within a predetermined cooling time period; and indicating that a reliable soldering joint connection is formed, when the thickness of the IMC is within the predetermined range, within the predetermined cooling time period. 1. A soldering station comprising:a soldering cartridge having a soldering tip;a power supply for delivering power to the soldering tip;an indicator; anda processor including associated circuits for determining a thickness of an intermetallic component (IMC) of a soldering joint formed by the soldering tip performing a soldering operation, and determining whether the thickness of the IMC is within a predetermined range, whereinthe indicator indicates that a reliable soldering joint connection is formed, when the processor determines the thickness of the IMC is within the predetermined range.2. The soldering station of claim 1 , wherein the processor further performs a preliminary validation by measuring a temperature of the soldering tip.3. The soldering station of claim 1 , wherein the processor further monitors a power level delivered to the soldering tip to detect liquidus occurrence; and determines the thickness of the IMC based on detected liquidus occurrence.4. The soldering station of claim 1 , wherein determining whether the thickness of the IMC is within a predetermined range is performed within a predetermined cooling time period.5. The soldering station of claim 1 , further comprising a memory for ...

INSPECTION APPARATUS AND QUALITY CONTROL SYSTEM FOR SURFACE MOUNTING LINE

An inspection apparatus includes an imaging unit that captures an image of a board having a land on which a solder piece has been printed, an image of the board having a component mounted on the solder piece, or an image of the board having the component soldered to the land, a land determination unit that determines a position of an element on the board other than the land from the image of the board captured by the imaging unit, and determines a position of the land in the image based on the determined position of the element, and an inspection unit that inspects the solder piece or component on the land using the position of the land determined by the land determination unit as a reference. 1. An inspection apparatus for a surface mounting line , the apparatus comprising:an imaging unit configured to capture an image of a board having a land on which a solder piece has been printed, an image of the board having a component mounted on the solder piece, or an image of the board having the component soldered to the land;a land determination unit configured to determine a position of an element on the board other than the land from the image of the board captured by the imaging unit, and determine a position of the land included in the image based on the determined position of the element; andan inspection unit configured to inspect the solder piece or the component on the land using the position of the land determined by the land determination unit as a reference.2. The inspection apparatus according to claim 1 , whereinthe element is a wiring pattern formed on the board.3. The inspection apparatus according to claim 1 , whereinthe land determination unit estimates the position of the land in the image based on positional relationship information defining a relative positional relationship between the element and the land, and the position of the element determined from the image, andthe positional relationship information is information generated by measuring a ...

SOLDER DEVICE AND SYSTEM CONTROLLER THEREOF

A solder device includes a light source, a solder module, an optical guiding assembly, a sensor and a feedback controller. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The optical guiding assembly, the sensor and the feedback controller are integrated as a system controller. Therefore, the volume and weight of the solder module are compacted. 1. A solder device , comprising:a light source emitting waveband light;a solder module, wherein the waveband light is guided to a to-be-soldered area by the solder module for heating to perform a solder operation;an optical guiding assembly disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly,a sensor disposed on another side of the optical guiding assembly relative to the solder module for receiving a sensing light beam and generating a sensing signal according to a sensing result of the sensing light beam, wherein the sensing light beam is guided to the sensor by the optical guiding assembly; anda feedback controller connected with the sensor and the light source for receiving the sensing signal and controlling the light source according to the sensing signal,wherein the optical guiding assembly, the sensor and the feedback controller are integrated as a system controller.2. The solder device according to claim 1 , wherein the light source claim 1 , the optical ...

AN APPLICATOR DEVICE

There is provided an applicator device () for applying a composition to an end of a pipe. The applicator device comprises an applicator head (), the applicator head having a cavity () with an opening into which the end of the pipe can be inserted. The applicator head comprises at least one brush () and at least one aperture () for delivering the composition into the cavity, each brush having bristles which extend into the cavity () to wipe against the end of the pipe, each aperture being closer to the opening of the cavity than to a base of the cavity. There is further provided an applicator device () comprising a supplementary brush for wiping the composition over an internal surface of the pipe, a container () of flux composition for connecting to the applicator device, and a method of applying a composition to an end of a pipe. 1. An applicator device for applying a composition to an end of a pipe , the applicator device comprising an applicator head , the applicator head having a cavity with an opening into which the end of the pipe can be inserted , wherein the applicator head comprises at least one brush and at least one aperture for delivering the composition into the cavity , each brush having bristles which extend into the cavity to wipe against the end of the pipe , each aperture being closer to the opening of the cavity than to a base of the cavity.2. The applicator device of claim 1 , wherein each brush extends from adjacent the base of the cavity to adjacent the opening of the cavity claim 1 , to wipe over a length portion of the pipe at the end of the pipe.3. The applicator device of claim 1 , wherein each brush comprises a base from which the bristles extend and wherein the at least one apertures extend through the bases of the at least one brushes claim 1 , to deliver the composition to the brushes.4. The applicator device of claim 3 , wherein each aperture extends through the base at a location in between the bristles that extend from the base.5. ...

High temperature brazing fixture and method of manufacture

A high temperature brazing fixture and method of manufacture for a gas turbine component made of a superalloy is disclosed herein. The high temperature brazing fixture includes a first and second frame member, a support member, and positioning member, all of which are made from the superalloy and fastened together using tab and tab lock couplings. The support member is configured to interface with and support the gas turbine engine component, and the positioning member is configured to interface with and position at least a first location of or hold a first dimension of the gas turbine component.

DEVICE, METHOD, AND SYSTEM FOR COOLING A FLAT OBJECT IN A NONHOMOGENEOUS MANNER

The apparatus serves for inhomogeneous cooling of a flat object with a first main face and a second main face opposite the first main face. The flat object is cooled by a cooling device from the direction of the first main face. On the second main face, a heating device locally acts upon a first partial face in such a way that the flat object is subjected to heat at said first partial face relative to a second partial face adjoining said first partial face in such a way that said first partial face is cooled more slowly in comparison with the second partial face and, during the cooling process, the second main face of the flat object therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling. 12200202. An apparatus for inhomogeneous cooling of a flat object () with a first main face () and a second main face () opposite said first main face , wherein:{'b': 2', '1', '200', '202', '4', '204', '2', '204', '206', '204', '204', '206', '202', '2, 'the flat object () is cooled by a cooling device () from the direction of the first main face () and wherein, on the second main face (), a heating device () locally acts upon a first partial face () in such a way that the flat object () is subjected to heat at said first partial face () relative to a second partial face () adjoining said first partial face () in such a way that said first partial face () is cooled more slowly in comparison with the second partial face () and, during the cooling process, the second main face () of the flat object () therefore has an inhomogeneous temperature distribution at least in a partial time period of the cooling.'}2. The apparatus as claimed in claim 1 , wherein:{'b': 2', '20', '22', '26', '20', '22, 'the flat object () is a base plate () of a power semiconductor module with a plurality of power electronic substrates () arranged thereon and solder () is arranged between the base plate () and the respective substrate ().'}3. The apparatus as ...

MAGNETIC SOLDERING APPARATUS

A soldering attachment apparatus having bendable magnetic arms and a substantially planar metal base. The base is constructed of a ferrous metal and the arms are comprised of flexible steel gooseneck having a bottom portion with a magnet, and a top portion having an alligator clip or other accessory. The arms are magnetically coupled to the base via the magnet. The arms can be of varying length and are easily removed or slid across the metal base for unlimited repositioning. This repositioning allows the user to angle an object for optimum soldering. The soldering tool can be used to hold circuit boards, jewelry, 3D printed parts and a variety of other objects when soldering. 1. A soldering apparatus comprising:a base constructed of a ferrous metal, the base being substantially planar in shape and having a magnet-receiving surface, and a powder coating disposed upon the magnet receiving surface of the base; anda plurality of arms magnetically coupled to the magnet-receiving surface, each arm in the plurality of arms having a base portion containing a magnet, a bendable arm portion, and an attachment portion, the base portion being shaped in a cone configuration such that a weight load at the attachment portion is distributed at the base portion.2. The apparatus of wherein the attachment portion is interchangeable.3. The apparatus of wherein the attachment further comprises an attachment selected from the group consisting of a clamp claim 1 , an alligator clip claim 1 , a light claim 1 , and a magnifying glass claim 1 , a soldering iron holder claim 1 , a magnet claim 1 , a vice or a combination thereof.4. The apparatus of wherein the plurality of arms may be slideably positioned to a desired configuration on the magnetic receiving surface.5. The apparatus of further comprising at least four feet coupled to a bottom surface of the base claim 1 , the at least four feet being configured to stabilize the base.6. The apparatus of wherein the bendable arm portion is ...

TOOL AND METHOD OF REFLOW

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit. 1. A method comprising:receiving a wafer in a chamber unit; andmoving the wafer in a spiral trace.2. The method of claim 1 , wherein moving the wafer includes reducing a vertical distance between the wafer and a heater.3. The method of claim 1 , wherein moving the wafer includes increasing a vertical distance between the wafer and a heater.4. The method of claim 1 , further comprising performing a reflow process on the wafer.5. The method of claim 1 , wherein moving the wafer includes keeping a vertical distance between the wafer and a heater after reducing the vertical distance between the wafer the heater.6. The method of claim 1 , further comprising transferring the wafer to and from a wafer lifting system in the chamber unit.7. A method comprising:elevating a wafer in a circular motion; andlowering the wafer in a circular motion.8. The method of claim 7 , wherein elevating the wafer includes moving the wafer in an inclined circular motion.9. The method of claim 7 , wherein lowering the wafer includes moving the wafer in an inclined circular motion.10. The method of claim 7 , further comprising moving the wafer in a horizontal circular motion after elevating the wafer.11. The method of claim 7 , further comprising moving the wafer in a horizontal circular motion before lowering the wafer.12. The method of claim 7 , further comprising performing a reflow process on the wafer.13. The method of claim 7 ...

High Speed Jet Flux Control and Monitoring System

A control system for a fluxer, the control system comprising: a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank; a pulse-width-modulated (PWM) valve coupled to the variable speed pump; a jet nozzle coupled to the PWM valve and configured to eject a jet of flux drops onto a substrate to form flux points, lines or areas thereon; and a controller coupled to the variable speed pump and the PWM valve; wherein the controller is configured to generate PWM signals to control the PWM valve, and pump speed signals to control the variable speed pump, to thereby selectively and individually control volume of individual flux drops, and pressure and flow of the liquid flux, to form the flux points, lines or areas on the substrate. 1. A control system for a fluxer , the control system comprising:a variable speed pump configured to provide pressurised flow of liquid flux from a flux supply tank;a pulse-width-modulated (PWM) valve coupled to the variable speed pump;a jet nozzle coupled to the PWM valve and configured to eject a jet of flux drops onto a substrate to form flux points, lines or areas thereon; anda controller coupled to the variable speed pump and the PWM valve;wherein the controller is configured to generate PWM signals to control the PWM valve, and pump speed signals to control the variable speed pump, to thereby selectively and individually control volume of individual flux drops, and pressure and flow of the liquid flux, to form the flux points, lines or areas on the substrate.2. The system of claim 1 , wherein the controller is further configured to receive valve feedback signals from the PWM valve claim 1 , and monitor the PWM valve based on the valve feedback signals.3. The system of claim 1 , wherein the controller is further configured to receive pump feedback signals from the variable speed pump claim 1 , and monitor the variable speed pump based on the pump feedback signals.4. The system of claim 1 , wherein ...

VACUUM MOLDING APPARATUS, SUBSTRATE PROCESSING SYSTEM HAVING THE SAME AND SUBSTRATE PROCESSING METHOD USING THE SAME

Disclosed herein is a substrate processing system, including: a feeding apparatus which feeds a substrate including a plurality of unit substrates into the substrate processing system; a vacuum molding apparatus which molds the substrate fed by the feeding apparatus; a paste printing apparatus which prints a solder paste on the substrate molded by the vacuum molding apparatus; a mounting apparatus which mounts an electronic device on the substrate on which the solder paste is printed; and a reflow apparatus which performs a reflow on the substrate on which the electronic device is mounted, wherein the vacuum molding apparatus includes a substrate molding control unit which controls the molding of the substrate. Therefore, the warpage (CAW) of the substrate is limitedly formed to improve the warpage (CAW) dispersion of the substrate, thereby improving bonding reliability and a mounting yield between the chip die and the bump of the substrate. 1. A substrate processing system , comprising:a feeding apparatus which feeds a substrate including a plurality of unit substrates into the substrate processing system;a vacuum molding apparatus which molds the substrate fed by the feeding apparatus;a paste printing apparatus which prints a solder paste on the substrate molded by the vacuum molding apparatus;a mounting apparatus which mounts an electronic device on the substrate on which the solder paste is printed; anda reflow apparatus which performs a reflow on the substrate on which the electronic device is mounted,wherein the vacuum molding apparatus includes a substrate molding control unit which controls the molding of the substrate.2. The substrate processing system as set forth in claim 1 , wherein the substrate molding control unit supports a warpage of the substrate to control a warpage dispersion of the substrate.3. The substrate processing system as set forth in claim 1 , wherein the substrate molding control unit performs a control so that the electronic device and ...

Flux spray machine

A flux spray machine for spraying flux to printed circuit board assembly (PCBA) is provided, which comprising: a PCBA transfer track to transferring the PCBA for spraying flux, comprising an active beam and a fixed beam; a spray mechanism, a X-Y table of vertical spray mechanism comprising a longitudinal beam, a crossbeam movable on and perpendicular to the longitudinal beam, and a flux nozzle for spraying flux movably provided on the crossbeam; and a flow-controlling mechanism, comprising origin sensors and limit sensors for two different flows in two longitudinal directions of the PCBA transfer track.

METHOD OF DETECTING WIRE BONDING FAILURES

Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate. 1. A method of detecting a bonding failure of a wire bonder , the wire bonder comprising a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire , the method comprising the steps of:forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire;forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive;moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond;detecting whether the second wire bond remains bonded to the substrate; anddetermining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate.2. The method of claim 1 , wherein the step of moving the bonding tool in the direction away from the second wire bond comprises the step of moving the bonding tool in ...

MOUNTING HEAD

A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid. 1. A mounting head , which is used in an electronic component mounting apparatus that bonds electrodes of a semiconductor die and a substrate or electrodes of another semiconductor die ,the mounting head comprising:an attachment, which has an attachment surface for attaching the semiconductor die;a bonding heater, which is disposed on a surface of the attachment opposite to the attachment surface and heats the attachment and the semiconductor die;a body portion, which holds the bonding heater on an end surface;a first opening portion, which is formed on the attachment surface of the attachment;a second opening portion, which is formed on a surface different from the end surface of the body portion;a suction path, which has a first bending portion for bending a flowing path of a gas suctioned from the first opening portion in the body portion and penetrates through the inside of the attachment, the bonding heater, and the body portion, and which discharges the gas suctioned from the first opening portion to the outside in the second opening portion; anda dripping prevention portion, which is formed in the suction path and inhibits droplets formed by condensation of the gas from dripping to the bonding heater.2. The mounting head ...

METHOD OF MANUFACTURING MAGNET ASSEMBLY, MAGNET ASSEMBLY,VIBRATING MOTOR, AND HAPTIC DEVICE

In a method of manufacturing a first magnet assembly, magnets each including a plating layer on a surface of the magnets are used as a first magnet, a second magnet, and a third magnet. In addition, the first magnet, the second magnet, and the third magnet are disposed in a first direction with same poles facing each other, a frame is brought into contact with the magnets in a second direction, and the frame and the magnets are gripped by a jig. Next, the magnets and the frame are welded to each other. After that, the grip of the jig is released and the jig is separated from the magnets and the frame. Thereafter, an adhesive is applied to the magnets and the frame. 1. A method of manufacturing a magnet assembly in which a magnet is fixed to a frame made of a metal , the method comprising:using a magnet including a plating layer on a surface thereof as the magnet;bringing the frame and the magnet into contact with each other and gripping the frame and the magnet with a jig;welding the magnet and the frame to each other;releasing the grip of the jig to separate the jig from the magnet and the frame; andapplying an adhesive to the magnet and the frame.2. A method of manufacturing a magnet assembly in which a first magnet , a second magnet , and a third magnet are fixed to a frame made of a metal , the method comprising:using magnets including a plating layer on a surface thereof as the first magnet, the second magnet, and the third magnet;disposing the first magnet, the second magnet, and the third magnet in a first direction determined in advance with same poles being adjacent to each other;bringing the frame into contact with the first magnet, the second magnet, and the third magnet from a second direction intersecting the first direction and gripping the frame, the first magnet, the second magnet, and the third magnet with a jig;welding the first magnet and the frame to each other, welding the second magnet and the frame to each other, and welding the third magnet ...

SOLDER SUPPLY SYSTEM

A solder supply system that judges whether a solder cup is set on a solder supply device. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by a barcode reader is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside an outer tube is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside the outer tube. 1. A solder supply system comprising:a solder supply device including{'b': '1', '(a-) a solder container that is tubular and open at one end and configured to hold liquid solder,'}{'b': '2', '(a-) a nozzle, for ejecting solder from the solder container, that is inserted into the solder container, and'}{'b': '3', '(a-) a piston that is fixedly provided on an outer circumferential section of the nozzle and that is engaged inside of the solder container from the opening of the solder container,'}wherein the solder supply device supplies solder from the tip of the nozzle by moving at least one of the solder container and the piston such that the piston advances inside the solder container;a reading device for reading an identification code affixed to the solder container; anda control device including{'b': '1', '(b-) a judging section configured to judge that judges whether the solder container is set in the solder supply device, and'}{'b': '2', '(b-) a reading device control section configured to restrict that restricts reading of the identification code by the reading device in a case in which the judging section judges that the solder container is not set in the solder supply device.'}2. The solder supply system according to claim 1 , whereinthe judging section is configured to judge whether the solder container is set in a position at which solder can be supplied ...

Metering apparatus

The invention relates to an apparatus for metering a medium comprising a base element provided for fastening to a robot, a metering valve movably supported at the base element, and at least one piezo actuator by which the metering valve is movable relative to the base element.

HANDLE FOR EXOTHERMIC MOLD WITH SPRING CONNECTORS

Disclosed is a handle clamp for an exothermic mold. The clamp includes a pair of legs, each having a plurality of rods that are shaped to fit into engagement holes on sections of the mold. The rods of each leg engage with one section of the mold. Engagement brackets are rotatably disposed on one or more or the rods. The brackets each have a thumb bolt that can be extended toward a mold section connected with the clamp. When engaged with the mold section, the thumb bolt stabilizes the mold section on the handle. A detent mechanism is provided between the bracket and the leg of the handle. The detent mechanism releaseably holds the bracket in one of a selected plurality of rotational positions with respect to the rod. By selecting different rotational positions for the brackets, the handle can be configured to engage with different configurations of mold. The thumb bolts that are biased toward the mold section by a spring. The bolts include a key that can be aligned or misaligned with a key slot on the bracket. By aligning the key with the key with the key slot, the bolt can be moved toward or away from the mold section under the biasing force of the spring. By misaligning the key and key slot, the bolt can be locked into engagement with the mold section or else held in a disengaged position. 1. A handle clamp for an exothermic mold comprising:a pair of grips;a pair of legs connected with respective ones of the grips, the legs arranged to move toward and away from one another in response to motion of the grips;a plurality of engagement rods disposed on each of the legs, wherein the engagement rods on each leg are adapted to engage with respective sections of an exothermic mold;one or more brackets, each bracket rotatably disposed on one of the rods; anda detent mechanism to releasably hold the bracket in a selected angular position with respect to the rod.2. The handle clamp of claim 1 , wherein the detent mechanism comprises a convex feature and a plurality of ...

Nozzle, system and method

A nozzle for directing a stream of solder during a soldering operation is disclosed. The nozzle comprising a body portion having an inlet for receiving a supply of solder; an outlet portion having one or more outlets for dispensing solder therefrom; and at least one channel fluidly coupling the inlet to the one or more outlets. Therein the outlet portion is adapted to be arranged above the inlet, such that, in use, solder flows from the inlet to the outlet portion along the at least one channel in a generally upward direction. The outlet portion has first and second over-flow sections, each over-flow section being integral with, or connected to, a peripheral edge of an outlet of the one or more outlets, such that in use, the solder is dispensed from an outlet of the one or more outlets and flows over the first and/or second over-flow section. At least a portion of the first over-flow section has a first width, such that in use, solder flowing over the first over-flow section produces a stream of solder with a width substantially corresponding to the first width. At least a portion of the second over-flow section has a second width, different to the first width, such that in use, solder flowing over the second over-flow section produces a stream of solder with a width substantially corresponding to the second width. A method of manufacturing a nozzle of this type and a method of soldering a component with a nozzle of this type are also disclosed.

Method for holding brazing material during a brazing operation

A method for holding a sintering filler material during a brazing/sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position. The method includes providing a wire mesh and attaching the wire mesh to the component in a location corresponding to the damaged area. Further, the method includes forming a gap between the wire mesh and the component. Moreover, the sintering filler material may be inside the wire mesh or both inside and outside the wire mesh in order to secure the sintering filler material to the damaged area.

LOGIC SWITCHING DEVICE AND METHOD OF MANUFACTURING THE SAME

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode. 1. A logic switching device comprising:a channel;a source and a drain both connected to the channel;a gate electrode arranged to face the channel; anda domain switching layer between the channel and the gate electrode,wherein the domain switching layer is a non-memory element and comprises at least one structure including at least one ferroelectric material region comprising a ferroelectric domain and at least one anti-ferroelectric material region comprising an anti-ferroelectric domain.2. The logic switching device of claim 1 , wherein the domain switching layer has substantially a non-hysteretic behavior characteristic at a polarization change according to an external electric field.3. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction parallel to the gate electrode.4. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction perpendicular to the gate electrode.5. The logic switching device of claim 1 , wherein the domain switching layer comprises two structures claim 1 , a first structure including the at least one ferroelectric material region and the at least one anti- ...

System and method for joining structures of dissimilar material

A system and method for joining structures includes a method of joining a first panel to a second panel. A first workpiece formed of a first material is positioned adjacent a second workpiece formed of a second material and joined with a joining process. At least one welding insert is formed from the joined first and second workpieces having an upper portion formed of the first material and a lower portion formed of the second material. The at least one welding insert is positioned between a first panel formed of the first material and a second panel formed of the second material and placed between first and second electrodes of a welding device. First and second electrodes of the welding device generate an electric current to join the first panel, at least one welding insert, and the second panel.

SYSTEM AND METHOD FOR JOINING COMPONENTS

A system and method for joining components together by projection welding and brazing are disclosed. In one embodiment, the method makes use of one or more weld projections extending from a first component and one or more spacer projections extending from either or both of the components. The one or more weld projections are taller than the one or more spacer projections by a meltdown distance that permits projection welding of the first and second components and permits the one or more spacer projections to define a brazing gap between the first and second components after projection welding. 1. A method of joining two components at bonding surfaces , the components including one or more weld projections extending a weld projection height from at least one of the bonding surfaces and including one or more spacer projections extending a spacer projection height from at least one of the bonding surfaces , the weld projection height being greater than the spacer projection height , the method comprising:contacting the one or more weld projections of one component with the other component; melting a distal portion of each of the one or more weld projections; and', 'deforming the one or more distal portions of the one or more weld projections against the other component; and, 'projection welding the components together byceasing the projection welding of the components when the one or more spacer projections of one component contact the other component, the one or more spacer projections defining a gap between the bonding surfaces.2. The method according to claim 1 , comprising claim 1 , after ceasing the projection welding claim 1 , brazing the components together using a brazing material at least partially filling the gap defined between the bonding surfaces.3. The method according to claim 1 , wherein at least one of the bonding surfaces is planar.4. The method according to claim 1 , wherein at least one of the bonding surfaces is curved.5. The method according to ...

Production facility for pipe components

Disclosed is one box body attached to an undercarriage of a trailer, and provided with a brazing area, a gastight testing area, and a finishing area aligned with one another in this order along a first side wall of the box body. In the brazing area, a plurality of members are bonded together by brazing to produce a half-finished product. In the gastight testing area, gas-tightness of the half-finished product is tested. In the finishing area, the half-finished product is covered with a thermal insulator to completely produce a pipe component. As a result, it becomes possible to properly dispose a working area, where the pipe component is produced, in the interior space of one box body without losing workability.

VISCOUS FLUID COATING DEVICE

Solder housed in flow tank is ejected from nozzle by a pump provided inside flow tank . Jet motor that drives the pump is provided outside flow tank , and cooling device is provided between flow tank and jet motor . Cooling device includes cooling pipe that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe , flows along cooling pipe , and flows out of a lower end of cooling pipe so as to be supplied to flow tank . The temperature of the nitrogen gas increases due to heat dissipated from jet motor , thus lowering the temperature of jet motor . Heat is transferred from jet motor to the nitrogen gas, and jet motor is cooled satisfactorily. 1. A viscous fluid coating comprising:a flow tank that houses a viscous fluid in a molten state;a pump, operation of which ejects viscous fluid from the flow tank such that viscous fluid is coated on a circuit board;a jet motor, provided outside the flow tank, that drives the pump; anda cooling device, provided outside the flow tank and including a passage through which a fluid body is capable of flowing, that cools the jet motor using the fluid body.2. The viscous fluid coating device according to claim 1 , whereinat least a portion of the passage is provided between the flow tank and the jet motor.3. The viscous fluid coating device according to claim 1 , whereinthe passage includes multiple curved sections, andthe cooling device includes a heat exchange section provided with the passage formed from the multiple curved sections.4. The viscous fluid coating device according to claim 1 , whereinthe fluid body is an antioxidation gas for preventing oxidation of solder as the fluid body, anda downstream end of the passage is connected to the flow tank. The present invention relates to a viscous fluid coating device that is a configuration element of an electronic component mounter.Disclosed in patent literature 1 is a solder coating device that includes (i) a flow tank that houses solder in a ...

Reflow soldering system for combined convection soldering and condensation soldering

A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate. 1. A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface , the apparatus comprising:a material dispensing station for dispensing a bonding material onto the substrate;a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate; andan activating gas generator positioned before the die attachment station for introducing activated forming gas onto the substrate, the activated forming gas being operative to reduce oxides on the substrate.2. The die attachment apparatus as claimed in claim 1 , further comprising a heat tunnel that is filled with shielding gas and closed with a heat tunnel cover for containing the substrate when the substrate is undergoing processing at the respective stations.3. The die attachment apparatus as claimed in claim 2 , wherein the activating gas generator is positioned over an opening in the heat tunnel cover and the activated forming gas is projected through the opening onto the substrate in the heat tunnel.4. The die attachment apparatus as claimed in claim 3 , wherein the activating gas generator is movable at least perpendicularly to a direction of conveyance of the substrate inside the heat tunnel.5. The die attachment apparatus as claimed in claim 4 , further comprising a slidable cover connected to and is movable with the activating gas generator claim 4 , the slidable cover being operative to minimize the leakage of activated ...

Atomization mechanism for cooling a bond head

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop. 1. A soldering device for soldering a printed circuit board , said device comprising:at least one heating appliance heating molten solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board;at least one actuator mechanically oscillating the printed circuit board at a frequency of oscillation, wherein the actuator, in an area of a first lateral edge of the printed circuit board, indirectly or directly comes to rest against said printed circuit board in such a manner that an oscillation is introduced into the printed circuit board substantially parallel to a plane defined by the printed circuit board, said frequency of oscillation changing between a start frequency and an end frequency; anda fixed stop acting in a manner of a thrust bearing rests against and supports a second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board.2. The soldering device according to claim 1 , in which the actuator includes a piezoelectric transducer.3. The soldering device according to claim 1 , in which the actuator includes a magnetostrictive transducer claim 1 , a transducer being made from a magnetic shape memory alloy and/or an electromagnetic oscillation coil.4. The soldering device according to claim 1 , in which the soldering ...

Jet Nozzle and Jet Soldering Apparatus

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

METHOD FOR ESTIMATING CARBOXYLIC ACID GAS CONCENTRATION AND SOLDERING APPARATUS

To provide a method for estimating a concentration of carboxylic acid gas, which is capable of measuring safely the concentration of carboxylic acid gas such as formic acid gas or the like in a chamber of a soldering apparatus in real time, and a soldering apparatus capable of estimating the concentration of the carboxylic acid gas in the chamber. The method includes the steps of measuring a surface temperature of a same object placed in the chamber at a same point in time by using a thermometer (first thermometer) for measuring a temperature without any influence of infrared absorption by carboxylic acid, and a radiation thermometer (second thermometer) for measuring a temperature by infrared in a wavelength region that the carboxylic acid absorbs, and estimating the concentration of the carboxylic acid gas in the chamber on the basis of a temperature difference (ΔTx) between temperatures indicated by the first and second thermometers. The soldering apparatus includes a heating stage (), a gas introducing part () for introducing a mixed gas of an inert gas and a carboxylic acid gas, a gas discharging part (), first thermometer () and second thermometer (). 1. A method for manufacturing a bonded member , comprising the steps of:estimating a concentration of a carboxylic acid gas in a chamber, the carboxylic acid gas introduced into the chamber being for reaction;wherein the step of estimating the concentration of the carboxylic acid includes the steps of:measuring a surface temperature of a same object placed in the chamber at a same point in time by using a thermometer (first thermometer) for measuring a temperature without any influence of infrared absorption by carboxylic acid, and a radiation thermometer (second thermometer) for measuring a temperature by infrared in a wavelength region that the carboxylic acid absorbs; andestimating the concentration of the carboxylic acid gas in the chamber on the basis of a temperature difference (ΔTx) between temperatures ...

REFLOW OVEN WITH A ZEOLITE BOX, AND A METHOD FOR RECOVERING GAS WITH SUCH ZEOLITE BOX

The present application provides a reflow oven () and a gas recovery method. The reflow oven () comprises a reflow oven hearth (), a separator (), the separator inlet () being connected to the gas outlet () of the reflow oven hearth () so that the gases in the reflow oven hearth () can flow into the separator (), a zeolite box (), the zeolite box inlet () being connected to the separator outlet (), and the zeolite box outlet () being connected to the gas inlet () of the reflow oven hearth () so that the gases flowing through the separator () can enter the zeolite box () and the gases flowing through the zeolite box () can flow out of the zeolite box outlet (), a sensor (), which is provided in the gas passage between said zeolite box outlet () and the gas inlet () of the reflow oven hearth (). The reflow oven () in the present application enables the gases flowing through the separator () to enter the zeolite box (). After most of the flux is removed from the gases in the separator (), the flux is further removed in the zeolite box (). In addition, polygonal zeolites have certain volumes and are supported in the zeolite box () to form clearances, and thus almost no resistance is brought about to the flow of the gases in the zeolite box (). 1101101102103. A reflow oven , said reflow oven comprising a reflow oven hearth () , and said reflow oven hearth () comprising a gas outlet () and a gas inlet () , characterized in that said reflow oven further comprises:{'b': 105', '105', '110', '111', '110', '102', '101', '101', '105, 'a separator (), said separator () comprising a separator inlet () and a separator outlet (), and said separator inlet () being connected to said gas outlet () of said reflow oven hearth () so that the gases in said reflow oven hearth () can flow into said separator (), and'}{'b': 107', '107', '112', '113', '112', '111', '113', '103', '101', '105', '107', '107', '113', '101, 'a zeolite box (), said zeolite box () comprising a zeolite box inlet () ...

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position. 1. A semiconductor chip bonding apparatus , comprising:a bonding head to adsorptively pick up a semiconductor chip;a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage;a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip;a second camera to capture an image of the substrate and to obtain positional information regarding the substrate;a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip; anda bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.2. The apparatus as claimed in claim 1 , wherein the correction device structure further comprises:a fixing unit, the at least one correction chip and the correction substrate being positioned on and fixed to the fixing unit; anda body unit connected to one side of the bonding ...

Apparatus and method for manufacturing semiconductor device

A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.