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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 10512. Отображено 100.
19-01-2012 дата публикации

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Номер: US20120012999A1
Принадлежит: Hitachi Chemical Co Ltd

The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

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26-01-2012 дата публикации

Golf ball

Номер: US20120021852A1
Автор: Kazuhiko Isogawa
Принадлежит: SRI Sports Ltd

A golf ball 2 includes a spherical core 4 , an adhesive layer 6 covering the core 4 , and a cover 8 covering the adhesive layer 6 . The core 4 includes a spherical center 10 and a mid layer 12 covering the center 10 . The adhesive layer 6 is formed from an adhesive. The base polymer of the adhesive is a two-component curing type epoxy resin obtained by curing a bisphenol A type epoxy resin with a curing agent including a polyamine compound. The gel fraction of the adhesive is equal to or greater than 40% but equal to or less than 80%. The ratio of the epoxy equivalent to the amine active hydrogen equivalent in the adhesive is equal to or greater than 2.0/1.0 but equal to or less than 13.0/1.0. The amine active hydrogen equivalent of the curing agent is equal to or greater than 100 g/eq but equal to or less than 800 g/eq. In the adhesive, the proportion of water to the entire volatile component is equal to or greater than 90% by weight.

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02-02-2012 дата публикации

Room temperature curing epoxy adhesive

Номер: US20120024477A1
Автор: Michael A. Kropp
Принадлежит: 3M Innovative Properties Co

Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

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02-02-2012 дата публикации

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Номер: US20120025400A1
Принадлежит: Nitto Denko Corp

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, in which the film for flip chip type semiconductor back surface before thermal curing has, at the thermal curing thereof, a volume contraction ratio within a range of 23° C. to 165° C. of 100 ppm/° C. to 400 ppm/° C.

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02-02-2012 дата публикации

Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor device

Номер: US20120028050A1
Принадлежит: Nitto Denko Corp

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected onto an adherend, the film for flip chip type semiconductor back surface having a ratio of A/B falling within a range of 1 to 8×10 3 (%/GPa), in which A is an elongation ratio (%) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing and B is a tensile storage modulus (GPa) of the film for flip chip type semiconductor back surface at 23° C. before thermal curing.

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02-02-2012 дата публикации

Curable adhesive compositions, process, and applications

Номер: US20120029116A1
Принадлежит: Trillion Science Inc

The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

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05-04-2012 дата публикации

Endoscopic device

Номер: US20120082842A1
Принадлежит: OLYMPUS MEDICAL SYSTEMS CORP

An endoscope device is provided, which includes at least two component members bonded together through an adhesive layer which is formed by curing an adhesive composition, the adhesive composition containing a main agent containing a bisphenol A epoxy resin, a phenol novolac epoxy resin, and an acrylic rubber, a curing agent containing xylylenediamine and its derivative, and a filler. The filler is spherical silica having an average particle size of 0.5 to 20 μm, and accounts for 22 to 44% by mass of a total amount of the adhesive composition.

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19-04-2012 дата публикации

Cationically curable compositions and a primer therefor

Номер: US20120094137A1
Принадлежит: Henkel Ireland Ltd Dublin

The present invention relates to one-part cationically curable compositions with storage stability, wherein cure is independent of external stimuli such as heat and UV irradiation. In particular, the present invention provides for compositions with a long shelf life that will cure only upon application of the composition to the target surface, i.e. the surface is involved in initiating cure of the cationically curable component. Suitable compositions comprise those for curing on a surface comprising carbon-halogen covalent bonds comprising a cationically curable component and a non-halide silver salt. The present invention also relates to a primer capable of promoting cure of cationically curable non-halide silver salt compositions.

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21-06-2012 дата публикации

Curable and cured adhesive compositions

Номер: US20120156501A1
Принадлежит: 3M Innovative Properties Co

Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured adhesive compositions can be used as structural adhesives.

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12-07-2012 дата публикации

Resin with high heat transfer

Номер: US20120178851A1
Принадлежит: Cupa Innovacion SL

A resin with high heat transfer and potential is specially designed to transfer heat between two layers of different nature. One of the layers acts as an energy receiver via the outer face thereof and an energy emitter via the inner face thereof, and the other layer acts as a receiver of the accumulated energy in the resin, acting as connecting bridge between the two layers. The resin with high heat transfer of the invention includes granular particles of slate and preferably granular particles of a metallic nature, in a polymeric matrix.

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20-09-2012 дата публикации

Amine adducts

Номер: US20120238710A1
Принадлежит: Individual

Embodiments include an amine adduct obtainable by reacting an amine compound having at least two amino groups and a monoalkylpolyalkylene glycidyl ether having the formula (C 2 H 3 O)—CH 2 —O—(CH 2 —(CHR 1 )—O) n , —R 2 , wherein n is 1 to 50, each R 1 is independently H or CH 3 , and R 2 is an alkyl group. Embodiments include a curable composition including a resin component and a hardener component that includes the amine adduct.

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04-10-2012 дата публикации

Plastic pressure vessel for biopharmaceutical applications and methods thereof

Номер: US20120252118A1
Принадлежит: 3M Innovative Properties Co

Described herein is a molded plastic pressure vessel for biopharmaceutical applications and methods thereof. The molded plastic pressure vessel has a surface area of at least 500 inches2 and comprises a polyphenylene oxide polymer; and at least one antioxidant.

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25-10-2012 дата публикации

Die attach film

Номер: US20120270381A1
Принадлежит: LG Chem Ltd

Provided are a die attach film, a semiconductor wafer, and a semiconductor packaging method. The die attach film can prevent generation of burrs or scattering of chips in a dicing process, and exhibits excellent expandability and pick-up characteristics in a die pressure-sensitive adhesive process. Further, the die attach film can prevent release, shifting, or deflection of a chip in a wire pressure-sensitive adhesive or molding process. Thus, it is possible to improve embeddability, inhibit warpage of a wafer or wiring substrate, and enhance productivity in a semiconductor packaging process.

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22-11-2012 дата публикации

Method for attaching an optical lens to a printed circuit board with electronic light source

Номер: US20120294011A1
Принадлежит: Shat-R-Shield Inc

The present invention relates to a LED assembly and method for attaching an optical lens to a printed circuit board having an electronic light source such as an LED or OLED, by application of an adhesive comprising silicone or an epoxy and heat curing the adhesive material at a low temperature.

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29-11-2012 дата публикации

Multilayer structure, and a method for making the same

Номер: US20120301714A1
Принадлежит: Dow Global Technologies LLC

The instant invention is a multilayer structure, and a method for making the same. The multilayer structure comprises: (a) at least one substrate layer comprising a polymeric material; (b) at least one adhesion layer, wherein said adhesion layer is derived from an adhesion promoter composition comprising: at least one aqueous epoxy dispersion; at least one hardening agent; optionally at least one leveling agent; at least one toughening agent; and optionally at least one filler; and (c) at least one surface layer comprising a plating metal; wherein said adhesion layer is disposed therebetween said at least one substrate layer and said at least one surface layer.

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29-11-2012 дата публикации

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same

Номер: US20120302667A1
Принадлежит: Cheil Industries Inc

An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.

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14-02-2013 дата публикации

Electrical conductor coated in a bonding layer, and a method of manufacturing such an electrical conductor

Номер: US20130037305A1
Принадлежит: Individual

The invention relates to an electrical conductor coated in an insulating layer itself coated in a bonding layer, the conductor being characterized in that said bonding layer is obtained from a composition comprising a thermoplastics polymer and a settable resin. The invention also applies to a method of manufacturing such an electrical conductor coated in a bonding layer, the method being characterized in that it comprises applying said composition on said electrical conductor coated in said insulating layer, and applying treatment to cause said settable resin to be cured at least in part.

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07-03-2013 дата публикации

Structural adhesives

Номер: US20130056153A1
Автор: Michael Czaplicki
Принадлежит: Zephyros Inc

A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

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28-03-2013 дата публикации

ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS

Номер: US20130079475A1
Принадлежит: Henkel Corporation

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly. 125-. (canceled)26. A composition comprising:An epoxy component;A silane-modified epoxy component;A thermoplastic urethane; andDiaminodiphenyl sulfone.27. The composition of claim 26 , in the form of a pre-applied adhesive.29. The composition of claim 28 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:100 to 100:1.30. The composition of claim 28 , wherein component (C) is made from components (A) and (B) in a by weight ratio of 1:10 to 10:1.31. (canceled) 1. FieldAdhesive compositions are provided and more specifically adhesive compositions useful in the die attach process. The adhesive compositions exhibit excellent adhesive film release and die attach properties while also exhibiting void-free coverage in die attach applications.2. Related TechnologyAdhesive compositions play a prominent role in many industrial applications. For example, in the electronics industry, packaging engineers faced with increased challenges of finding new and better ways of creating and attaching dies during the dicing and subsequent die placement processes often rely on adhesive compositions to secure a silicon wafer to a dicing substrate during the dicing process and also to secure the individual diced chips to a circuit board or other substrate during die placement. Numerous adhesive compositions have been proposed for use in such die attach processes, including those described in one or more of U.S. Pat. ...

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11-04-2013 дата публикации

Epoxy resin composition

Номер: US20130088542A1
Автор: Akane Hisanaga
Принадлежит: Canon Inc

An epoxy resin contains at least a bisphenol-F-type epoxy resin, a latent hardener, and a thixotropic agent. When the amount of the bisphenol-F-type epoxy resin is 100 parts by mass, the amount of the thixotropic agent is in the range of 3.0 parts by mass to 5.0 parts by mass.

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11-04-2013 дата публикации

RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET

Номер: US20130089743A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler. 1. A resin composition comprising:a non-halogen epoxy resin (A);a biphenyl aralkyl phenolic resin (B);a maleimide compound (C); andan inorganic filler (D).2. The resin composition according to claim 1 , wherein the non-halogen epoxy resin (A) is selected from the group consisting of phenol phenyl aralkyl epoxy resins claim 1 , phenol biphenyl aralkyl epoxy resins claim 1 , and naphthol aralkyl epoxy resins.4. The resin composition according to claim 1 , wherein the non-halogen epoxy resin (A) is contained in an amount of 20 to 60 parts by weight based on 100 parts by weight in total of the resins.5. The resin composition according to claim 1 , wherein the biphenyl aralkyl phenol resin (B) is contained in an amount that meets a requirement of an OH/Ep ratio of 0.7 to 1.4 wherein OH represents the number of hydroxyl groups in the biphenyl aralkyl phenol resin; and Ep represents the number of epoxy groups in the non-halogen epoxy resin (A).6. The resin composition according to claim 1 , wherein the maleimide compound (C) is contained in an amount of 5 to 50 parts by weight based on 100 parts by weight in total of the resins.7. The resin composition according to claim 1 , wherein the inorganic filler (D) is contained in an amount of 50 to 150 parts by weight based on 100 parts by weight in total of the resins.8. The resin composition according to claim 1 , which further comprises (E) a naphthol aralkyl resin.9. The resin composition according to claim 8 , wherein the content of the naphthol aralkyl resin (E) is not more ...

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11-04-2013 дата публикации

STORAGE-STABLE HEAT-ACTIVATED TERTIARY AMINE CATALYSTS FOR EPOXY RESINS

Номер: US20130090431A1
Принадлежит:

Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability. 1. A heat-activatable catalyst composition comprising mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin that has a weight average molecular weight of at least about 3000.2. The heat-activatable catalyst composition of wherein the tertiary amine compound includes at least one aminophenol.3. The heat-activatable catalyst composition of wherein the aminophenol is 2-(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,6-bis(dimethylaminomethyl)phenol claim 2 , 2 claim 2 ,4-bis(dimethylaminomethyl)phenol or 2 claim 2 ,4 claim 2 ,6-tris(dimethylaminomethyl)phenol.4. The heat-activatable catalyst composition of wherein the novolac resin has a weight average molecular weight of from 5000 to 20 claim 1 ,000.5. The heat-activatable catalyst composition of wherein the novolac resin is a phenol novolac resin.6. The heat-activatable catalyst composition of wherein the weight ratio of the tertiary amine compound and the novolac resin is from 40:60 to 70:30.7. The heat-activatable catalyst composition of which is made in a process that includes the steps of:a) combining a tertiary amine catalyst having a melting temperature of no greater than 60° C. and a boiling temperature of at least 130° C. with a particulate novolac resin having a weight average molecular weight of at least 5000 and a volume average particle size of 175 microns or less, at proportions such that from 0.1 to 10 equivalents of phenol groups are provided by the novolac resin per equivalent of tertiary amine groups provided by the tertiary amine catalyst;b) heating the mixture formed in step a) to a temperature of ...

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25-04-2013 дата публикации

Dual cure adhesives

Номер: US20130102698A1
Принадлежит: Henkel Corp

This invention is a dual cure adhesive that can be designed to have a proper balance of properties by choosing formulation materials to meet certain inequalities. The dual cure adhesive comprises ethylenically unsaturated compounds capable of UV-initiated free radical polymerization and epoxy compounds and their corresponding curing agents capable of thermal cure. In a particular embodiment, the dual cure adhesive comprises (A) one or more monofunctional acrylate compounds containing an oxygen-containing cyclic unit, (B) one or more monofunctional acrylate compounds in which the ester group contains a hydrocarbon group consisting of at least six carbon atoms, and (C) one or more thermoplastic, solid, amorphous epoxy compounds having a softening point or melting point between 60° C. and 100° C.

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25-04-2013 дата публикации

Tribologically Modified Glass-Fiber Reinforced Polyoxymethylene

Номер: US20130102718A1
Принадлежит: TICONA GMBH

The present invention relates to a molding composition, a process for the manufacturing of said molding composition, molded parts obtainable therefrom as well as the use of the molding composition for the manufacturing of molded parts used in the automotive industry, for housings, latches, window winding systems, wiper systems, sun roof systems, seat adjustments, levers, gears, claws, pivot housing or wiper arms. 1. A molding composition comprisinga) at least one polyoxymethylene (A),b) at least one coupling agent (B),c) at least one reinforcing fiber (C),d) one or more tribological modifier (D) ande) optionally at least one formaldehyde scavenger (E).2. A molding composition according to claim 1 , wherein the tribological modifier comprises ultrahigh molecular weight polyethylene having an average molecular weight of higher than 1.0·10g/mol.3. A molding composition according to claim 1 , wherein the tribological modifier comprises an ultrahigh molecular weight polyethylene having a viscosity number of higher than 1000 ml/g (determined according to ISO 1628 claim 1 , part 3; concentration in decahydronaphthalin: 0.0002 g/ml).4. A molding composition according to claim 1 , wherein the tribological modifier comprises an ultrahigh molecular weight polyethylene (UHMW-PE) which has a mean particle diameter Dranging from 1 to 5000 μm.5. A molding composition according to claim 1 , wherein the tribological modifier comprises ultrahigh molecular weight polyethylene which is present in the molding composition in an amount up to 30 wt.-% claim 1 , wherein the amount is based on the total weight of the composition.6. A molding composition according to claim 1 , wherein polyoxymethylene (A) is present in an amount up to 95 wt. % claim 1 , preferably ranging from 40 to 90 wt.-%.7. A molding composition according to claim 1 , wherein the coupling agent (B) is a polyisocyanate.8. A molding composition according to claim 1 , wherein the coupling agent (B) is present in an amount ...

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23-05-2013 дата публикации

ADHESIVE FOR FIXING AND/OR EMBEDDING AN ELECTRONIC COMPONENT AND METHOD AND USE

Номер: US20130126091A1

In the case of an adhesive for fixing an electronic component on a circuit board and/or for embedding an electronic component into a circuit board, the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond on a ply or layer of a circuit board, and fixing optionally being followed by jacketing by plies, and/or by covering by at least one further ply, an epoxy resin-based adhesive is selected, which has at least one added additive to adjust the surface tension and/or viscosity, especially a defoamer and/or an additive for adjusting the levelling properties, which can achieve reliable fixing of a component, especially with avoidance of cavities or air inclusions below the surface of the component to be fixed. Also provided are a method and a use. 1. An adhesive for fixing an electronic component to a circuit board and/or embedding an electronic component into a circuit board , the electronic component to be fixed and/or embedded being fixed by means of an adhesive bond to a ply or layer of a circuit board , in particular a multilayer circuit board , and after fixing being optionally encapsulated , in particular by layers matched to the outer contours of the component to be embedded , and/or covered by at least one further layer , wherein an epoxy resin-based adhesive is selected , which comprises at least one additive added for adjusting the surface tension and/or viscosity , in particular a defoamer and/or an additive for adjusting the levelling properties.2. The adhesive according to claim 1 , wherein a defoamer claim 1 , for instance a silicone-free defoamer claim 1 , is added to the adhesive in an amount of less than 3% by weight and claim 1 , in particular claim 1 , about 0.1 to 2.0% by weight.3. The adhesive according to claim 1 , wherein an acrylate claim 1 , e.g. poly(butyl acrylate) claim 1 , an acrylate copolymer claim 1 , e.g. methacrylate copolymer claim 1 , an epoxy resin comprising free hydroxyl claim 1 , isocyanate and ...

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13-06-2013 дата публикации

ONE PART EPOXY RESIN INCLUDING ACRYLIC BLOCK COPOLYMER

Номер: US20130146816A1
Принадлежит: TRILLION SCIENCE INC.

An adhesive composition comprising a phenoxy resin, a latent hardener, an acrylic block co-polymer dispersant and a weak solvent wherein the dispersant enables the phenoxy resin to be dispersed in a weak solvent that does not attack the latent hardener thereby providing a composition with good shelf life. The compositions are useful in making anisotropic conductive films. 1. An adhesive coating composition comprising: (i) a phenoxy resin , (ii) a latent hardener , (iii) a multifunctional epoxide , (iv) an acrylic block co-polymer , and (v) a weak solvent having a solubility parameter less than 9.5 , the acrylic block co-polymer dispersing the phenoxy resin in the weak solvent.2. The composition of wherein the phenoxy resin is a linear polymer of bisphenol A diglycidyl ether claim 1 , and the block copolymer has a first flexible block and a second rigid block that makes the copolymer compatible with the uncured phenoxy resin claim 1 , wherein a mixture of the phenoxy resin and the block copolymer forms a dispersion of the phenoxy resin in the weak solvent claim 1 , the solvent having a solubility parameter less than about 9.0.3. The composition of wherein the rigid block is polymethyl methacrylate.4. The composition of wherein the flexible block is formed from a poly(alkyl acrylate) wherein the alkyl group has about 2 to 8 carbon atoms.5. The composition of wherein the flexible block is formed from poly(butyl acrylate).6. The composition of wherein the block copolymer is a triblock copolymer terminating in polymethyl methacrylate blocks.7. The composition of wherein the latent hardener is a microencapsulated curing agent.8. The composition of wherein the latent hardener is an encapsulated imidazole.9. The composition of wherein the block copolymer is present in an amount up to about 15% by weight.10. The composition of wherein the weak solvent is selected from the group consisting of as EtOAc claim 9 , PrOAc claim 9 , i-PrOAc claim 9 , BuOAc claim 9 , sec-BuOAc claim ...

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13-06-2013 дата публикации

ADHESIVE MATERIAL

Номер: US20130149531A1
Принадлежит: Zephyros, Inc.

An adhesive material and articles incorporating the same is disclosed. The adhesive material includes a liquid epoxy resin and rubber, a solid epoxy resin and rubber, one or more curing agents, and a filler. 1. A heat activatable adhesive composition , comprising:a) at least one liquid epoxy including a rubber and present in an amount of at least about 10% by weight to about 40% by weight of the total adhesive composition;b) at least one solid epoxy including a rubber and present in an amount of at least about 30% by weight to about 60% by weight of the total adhesive compositiond) an epoxy cure activator that activates curing at a temperature as low as about 120° C.2. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a butadiene rubber.3. The adhesive composition of claim 1 , wherein the at least one solid epoxy is a CTBN modified resin.4. The adhesive composition of including at least one curing agent accelerator and at least one filler.5. The adhesive composition of claim 4 , wherein the filer is clay and the filler is present in an amount of between about 3 percent and about 10 percent by weight.6. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a core/shell polymer.7. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a low viscosity epoxy resin.8. The adhesive composition of claim 1 , wherein the at least one epoxy liquid includes a bisphenol-F epoxy resin.9. A heat activatable adhesive composition claim 1 , comprising:a) a solid epoxy including a CTBN rubberb) a liquid epoxy including a core/shell polymer;c) an polyethylene copolymer;d) a plurality of curing agents; andf) a clay filler.10. The adhesive composition of claim 9 , wherein the plurality of curing agents includes a dicyandiamide curing agent and a blocked amine curing agent.11. The adhesive composition of claim 9 , wherein the clay filler is present in an amount of between about 3 percent and ...

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13-06-2013 дата публикации

FLAME-RETARDANT COPOLYETHERESTER COMPOSITION AND ARTICLES COMPRISING THE SAME

Номер: US20130149533A1
Автор: NI YONG
Принадлежит: E I DU PONT DE NEMOURS AND COMPANY

Disclosed herein is a flame-retardant copolyetherester composition comprising: (a) at least one copolyetherester; (b) about 5-35 wt % of at least one halogen-free flame retardant; (c) about 0.1-20 wt % of at least one nitrogen-containing compound; (d) about 0.1-10 wt % of at least one aromatic phosphate and (e) about 0.1-10 wt % of at least at least one phenoxy resin. Further disclosed herein are articles comprising component parts formed of the flame-retardant copolyetherester composition. 2. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 25-94.7 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.3. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 40-94.7 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.4. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one copolyetherester is present at a concentration of 40-90 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.5. The flame-retardant copolyetherester composition of claim 1 , wherein claim 1 , in the at least one halogen-free flame retardant claim 1 , each of Rand R claim 1 , is hydrogen.6. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is aluminum hypophosphite.7. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is present at a concentration of 5-30 wt % claim 1 , with the total wt % of all components of the copolyetherester composition totaling to 100 wt %.8. The flame-retardant copolyetherester composition of claim 1 , wherein the at least one halogen-free flame retardant is present at a ...

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20-06-2013 дата публикации

ADHESIVE FILM AND ELECTRONIC DEVICE INCLUDING THE SAME

Номер: US20130154125A1
Принадлежит:

An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0. 1. An adhesive film , comprising:an amine curing agent; anda phenolic curing agent,wherein, the adhesive film has a ratio of a storage modulus at 170° C. after 80% or more curing to a storage modulus at 40° C. before curing in the range of about 1.5 to about 3.0.2. The adhesive film as claimed in claim 1 , wherein the amine curing agent is a diamino diphenyl sulfone curing agent.3. The adhesive film as claimed in claim 1 , wherein the phenolic curing agent is a bisphenol A or bisphenol F curing agent.4. The adhesive film as claimed in claim 1 , wherein the adhesive film has a post-molding die-shear strength of 9 kgf or more after curing at 125° C. for 1 hour claim 1 , at 150° C. for 10 minutes claim 1 , and at 175° C. for 1 hour.5. The adhesive film as claimed in claim 1 , wherein the adhesive film has a void area ratio of 5% or less on an adhesive film-attached area claim 1 , after curing at 125° C. for 1 hour and at 150° C. for 1 hour claim 1 , molding at 175° C. for 60 seconds claim 1 , and mold curing at 175° C. for 1 hour.6. An adhesive film claim 1 , comprising:an amine curing agent; anda phenolic curing agent,{'sup': 6', '2, 'the adhesive film having a die-shear strength of 9 kgf or more after curing at 125° C. for 1 hour and at 175° C. for 1 hour, and a storage modulus at 170° C. of 5.0×10dyne/cmor more after 80% curing.'}7. The adhesive film as claimed in claim 6 , wherein the adhesive film has a void area ratio of 5% or less on an adhesive film-attached area claim 6 , after curing at 125° C. for 1 hour and at 150° C. for 1 hour claim 6 , molding at 175° C. for 60 seconds claim 6 , and mold curing at 175° C. for 1 hour.8. The adhesive film as claimed in claim 6 , wherein the amine curing agent is diamino diphenyl sulfone.9. ...

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20-06-2013 дата публикации

ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE SAME

Номер: US20130154129A1
Принадлежит:

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst. 1. A semiconductor device bonded by an anisotropic conductive film , the anisotropic conductive film comprising:a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;a hydrogenated epoxy resin; anda sulfonium cation curing catalyst.2. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film includes:about 1 to about 20 parts by weight of the reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;about 5 to about 50 parts by weight of the hydrogenated epoxy resin; andabout 0.1 to about 10 parts by weight of the sulfonium cation curing catalyst, all parts by weight being based on 100 parts by weight of the anisotropic conductive film in terms of solid content.3. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film further includes a binder resin and conductive particles.4. The semiconductor device as claimed in claim 3 , wherein the binder resin includes at least one selected from the group of a polyimide resin claim 3 , a polyamide resin claim 3 , a phenoxy resin claim 3 , an epoxy resin claim 3 , a polymethacrylate resin claim 3 , a polyacrylate resin claim 3 , a polyurethane resin claim 3 , an acrylate modified urethane resin claim 3 , a polyester resin claim 3 , a polyester urethane resin claim 3 , a polyvinyl butyral resin claim 3 , a styrene-butylene-styrene resin and epoxy modifications thereof claim 3 , a styrene-ethylene-butylene-styrene resin and modifications thereof claim 3 , and acrylonitrile butadiene rubber and hydrogenated compounds thereof.5. The semiconductor device as claimed in claim 3 , wherein the anisotropic conductive ...

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20-06-2013 дата публикации

LIQUID CURABLE EPOXY RESIN COMPOSITION AND ADHESIVE AGENT CONTAINING SAME

Номер: US20130158231A1
Принадлежит: NIPPON SODA CO., LTD.

An object of the present invention is to provide a curable epoxy resin composition containing an epoxy resin, wherein the composition is excellent in storage stability and curing characteristics and provides a cured product excellent in characteristics, particularly organic solvent resistance; an adhesive agent consisting of the composition; and an adhesive agent consisting of a curable epoxy resin composition excellent in adhesive strength. The curable epoxy resin composition of the present invention is a liquid curable epoxy resin composition containing the following (A) and (B): (A) an epoxy resin or an epoxy-polyester hybrid resin; and (B) a clathrate containing the following (b1) and (b2): (b1) at least one compound selected from the group consisting of a carboxylic acid compound represented by the formula A(COOH)(wherein A represents a C1-C6 chain hydrocarbon group optionally having a substituent, a C3-C10 monocyclic hydrocarbon group optionally having a substituent, or a C6-C10 bicyclic hydrocarbon group optionally having a substituent; and a represents 2 or 3) and the like; and (b2) at least one compound selected from the group consisting of a compound represented by formula (II) and 1,8-diazabicyclo[5.4.0]undecene-7. 4. The liquid curable epoxy resin composition according to claim 3 , wherein the compound represented by formula (V) is 5-t-butylisophthalic acid claim 3 , 5-hydroxyisophthalic acid claim 3 , or 5-nitroisophthalic acid.5. An adhesive agent containing a liquid curable epoxy resin composition according to .6. The adhesive agent according to claim 5 , wherein the number of moles of component (b2) in component (B) is 0.008 to 0.4 with respect to 1 mol of epoxy group of component (A).8. An adhesive agent containing a liquid curable epoxy resin composition according to .9. An adhesive agent containing a liquid curable epoxy resin composition according to .10. An adhesive agent containing a liquid curable epoxy resin composition according to .11. The ...

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27-06-2013 дата публикации

Adhesive resin composition for hdd motor and hdd motor fabricated using the same

Номер: US20130165551A1
Автор: Hyung Kyu Kim, Kun Kim
Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided an adhesive resin composition for a HDD motor and a HDD motor fabricated using the same. The adhesive resin composition for a HDD motor includes: 25 to 35 parts by weight of a bisphenol E-epoxy resin; 10 to 25 parts by weight of an epoxy resin; 10 to 20 parts by weight of mercaptan; and 5 to 15 parts by weight of imidazole. The constituents of an epoxy adhesive material may be controlled, such that a curing speed may be increased, as compared to the case of the related art, thereby enhancing working efficiency and reliability.

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04-07-2013 дата публикации

Composition Capable of Radiation Activated Catalysis and Radiation Curable Urethane Containing the Composition

Номер: US20130171454A1

A composition capable of radiation activated catalysis is provided. The composition comprises a metal compound, a mercapto compound and an olefinic compound. Radiation curable urethane compositions comprising the disclosed composition are also provided. The radiation curable urethane compositions comprise the disclosed composition, a hydroxyl compound and an isocyanate compound. Activation of the composition by radiation in a urethane formulation provides for an efficient method of curing the urethane composition, Coating and adhesive compositions comprising the radiation curable urethane compositions are also provided. In addition, methods for coating and bonding substrates are disclosed. 113.-. (canceled)14. A method of coating an article comprising applying a coating composition to the surface of the article then irradiating the coated article with radiation to cure the coating composition wherein the coating composition comprises a radiation curable urethane composition comprising a) a composition capable of radiation activated catalysis comprising a metal compound having catalytic activity , a mercapto compound which passivates the metal compound by inhibiting the catalytic activity of the metal compound , and an olefinic compound which reacts with the mercapto compound wherein the reaction between the mercapto compound and the olefinic compound is caused by the radiation; b) a hydroxyl compound; and c) an isocyanate compound.15. The method of coating an article as claimed in claim 14 , wherein the article is selected from the group consisting of glass claim 14 , wood claim 14 , metal claim 14 , plastic claim 14 , ceramic claim 14 , stone claim 14 , iron claim 14 , steel claim 14 , aluminum claim 14 , copper claim 14 , galvanized steel claim 14 , zinc claim 14 , wood claim 14 , fiberboard claim 14 , reaction injection molding urethanes claim 14 , (sheet molding compound) claim 14 , vinyl claim 14 , acrylic claim 14 , polymeric material claim 14 , plastic ...

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04-07-2013 дата публикации

Biphenyl Polyphosphonate, Method for Preparing the Same and Thermoplastic Resin Composition Including the Same

Номер: US20130172471A1
Принадлежит: Cheil Industries Inc

Disclosed herein is a biphenyl polyphosphonate. The biphenyl polyphosphonate is represented by Formula 1: wherein R is hydrogen, substituted or unsubstituted C 1 -C 5 alkyl, substituted or unsubstituted C 2 -C 5 alkenyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 5 -C 6 cycloalkenyl, substituted or unsubstituted C 6 -C 20 aryl, or substituted or unsubstituted C 6 -C 20 aryloxy, R 1 and R 2 are the same or different and are each independently substituted or unsubstituted C 1 -C 6 alkyl, substituted or unsubstituted C 5 -C 6 cycloalkyl, substituted or unsubstituted C 6 -C 12 aryl, or halogen, a and b are the same or different and are each independently an integer from about 0 to about 4, and n is an integer from about 4 to about 500.

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11-07-2013 дата публикации

Adhesive composition containing resin having carbon-carbon multiple bond

Номер: US20130177763A1
Принадлежит: Nissan Chemical Corp

An adhesive composition has a polymer that contains a unit structure of Formula (1): L 1 -O-T 1 -O  Formula (1) (where L 1 is an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and T 1 is a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group) and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures:

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11-07-2013 дата публикации

Low-Tack, UV-Cured Pressure Sensitive Adhesive Suitable for Reclosable Packages

Номер: US20130178554A1
Принадлежит:

UV-cured pressure sensitive adhesive including one or more UV-curable acrylic oligomers, one or more tack control components, and, optionally, an elastomeric material is described herein. The adhesive includes an adhesive component ratio of the various adhesive components effective to provide desired first peel adhesions and subsequent peel adhesions. 2. The pressure sensitive adhesive of claim 1 , wherein the pressure sensitive adhesive includes about 1 to about 90 percent of the UV-curable acrylic oligomer claim 1 , about 1 to about 65 percent of the tack control component claim 1 , and about 5 to about 20 percent of the elastomeric material.3. The pressure sensitive adhesive of claim 1 , wherein the UV-curable acrylic oligomer is an acrylic acid ester.4. The pressure sensitive adhesive of claim 3 , wherein the acrylic acid ester is an acrylic acid ester of a vegetable oil.5. The pressure sensitive adhesive of claim 1 , wherein the elastomeric material includes one of curable elastomeric acrylate esters or methacrylate esters selected from the group consisting of polybutadiene claim 1 , saturated polybutadiene claim 1 , and polyurethane.6. The pressure sensitive adhesive of claim 1 , wherein the tack control component is an aliphatic urethane acrylate oligomer.7. The pressure sensitive adhesive of claim 1 , wherein the adhesive has a viscosity below about 50 claim 1 ,000 Os at about 70 to about 75° F.8. The pressure sensitive adhesive of claim 7 , wherein the viscosity is about 5000 cPs or less at about 160° F.9. The pressure sensitive adhesive of claim 1 , wherein the adhesive is cured with ultraviolet radiation supplied at an energy between about 100 and about 800 mJ/cmso that the UV-cured pressure sensitive adhesive withstands at least 100 double rubs with methyl ethyl ketone.10. The pressure sensitive adhesive of claim 1 , wherein the adhesive exhibits a rolling ball tack between about 4 to about 14 inches. This application is a continuation of prior ...

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11-07-2013 дата публикации

TWO-PART, CYANOACRYLATE /CATIONICALLY CURABLE ADHESIVE SYSTEMS

Номер: US20130178560A1
Принадлежит: Henkel Ireland Limited

Two part cyanoacrylate/cationically curable adhesive systems, are provided. 1. A two part curable composition comprising:(a) a first part comprising a cyanoacrylate component and a cationic catalyst; and(b) a second part comprising a cationic curable component, wherein when mixed together the cationic catalyst initiates cure of the cationic curable component.2. The composition of claim 1 , wherein the cyanoacrylate component comprises HC═C(CN)—COOR claim 1 , wherein R is selected from alkyl claim 1 , alkoxyalkyl claim 1 , cycloalkyl claim 1 , alkenyl claim 1 , aralkyl claim 1 , aryl claim 1 , allyl and haloalkyl groups.3. The composition of claim 1 , wherein the cationic catalyst comprises salts of lithium and metals from Group II of the Periodic Table claim 1 , and non-nucleophilic acids.4. The composition of claim 1 , wherein the cationic catalyst is a non-nucleophilic acid having a pH of less than 1.0 when measured as a 10% by weight solution in water.5. The composition of claim 1 , wherein the cationic catalyst is a member selected from the group consisting of fluoroboric claim 1 , fluoroarsenic claim 1 , fluoroantimonic and fluorophosphoric acids; lithium tetrafluoroborate claim 1 , calcium di-tetrafluoroborate claim 1 , magnesium di-tetrafluoroborate claim 1 , lithum hexafluorophosphate claim 1 , calcium di-hexafluorophosphate claim 1 , magnesium di-hexafluorophosphate claim 1 , lithium hexafluoroantimonate and lithium hexafluoroarsenate; lanthanide triflate salts claim 1 , aryl iodonium salts claim 1 , aryl sulfonium salts claim 1 , lanthanum triflate claim 1 , ytterbium triflate claim 1 , trimethoxyboroxine claim 1 , trimethoxyboroxine-aluminum acetyl acetonate claim 1 , amine-boron trihalide complexes claim 1 , quaternary ammonium salts claim 1 , quaternary phosphonium salts claim 1 , tri-aryl sulfonium salts claim 1 , di-aryl iodonium salts claim 1 , and diazonium salts; trialkoxyboroxine curing agents; and combinations thereof.6. The composition of claim ...

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18-07-2013 дата публикации

HEAT-CURING RESIN COMPOSITION, HEAT-CURING ADHESIVE SHEET, AND METHOD FOR PRODUCING HEAT-CURING ADHESIVE SHEET

Номер: US20130183520A1
Автор: Natori Toshiki
Принадлежит: DEXERIALS CORPORATION

The present invention provides a heat-curing resin composition which is curable without UV irradiation or the like and in which exudation of unreacted epoxy resin and the like at the time of pressure thermoforming is satisfactory. The heat-curing resin composition comprises: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for the epoxy resin, wherein the curing agent contains organic acid dihydrazide, and part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group. 1. A heat-curing resin composition , comprising: an acrylic copolymer containing an epoxy group-containing (meth)acrylic ester monomer; an epoxy resin; and a curing agent for said epoxy resin ,wherein part of epoxy groups of the acrylic copolymer are cross-linked by liquid polyamine or liquid polyamidoamine, each having at least one of a primary amino group and a secondary amino group.2. The heat-curing resin composition according to claim 1 , wherein not less than 1% of epoxy groups of the acrylic copolymer are cross-linked by the liquid polyamine or the liquid polyamidoamine claim 1 , each having at least one of a primary amino group and a secondary amino group.3. The heat-curing resin composition according to claim 2 , wherein 3 to 12% of epoxy groups of the acrylic copolymer are cross-linked by the liquid polyamine or the liquid polyamidoamine claim 2 , each having at least one of a primary amino group and a secondary amino group.4. The heat-curing resin composition according to claim 3 , wherein the curing agent contains organic acid dihydrazide.5. The heat-curing resin composition according to claim 4 , wherein a blend ratio of the epoxy group-containing (meth)acrylic ester monomer is 3 to 15% by mass with respect to the acrylic copolymer.6. The heat-curing resin composition according to claim 4 , ...

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25-07-2013 дата публикации

SHAPE MEMORY MATERIAL BASED ON A STRUCTURAL ADHESIVE

Номер: US20130186562A1
Принадлежит: SIKA TECHNOLOGY AG

A composition including at least one curable structural adhesive, and at least one chemically cross-linked elastomer, wherein the chemically cross-linked elastomer is present in the structural adhesive as penetrating polymer network. Such a composition constitutes a so-called shape memory material and is suitable for reinforcing cavities in structural components, such as, for example, in automobile bodies.

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01-08-2013 дата публикации

B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES

Номер: US20130197130A1
Принадлежит: Henkel Corporation

An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler. 1. An adhesive composition comprising:(A) an elastomeric polymer comprising a mixture of a vinyl elastomer and an epoxy elastomer, the mixture present in an amount within the range of 20% to 40% by weight,(B) an epoxy resin, present in the adhesive composition in the range of 3% to 10% by weight,(C) reactive diluent comprising a combination of two or more diluents, one of which must have carbon to carbon unsaturation, the combination present in the adhesive composition within the range of 35% to 50% by weight of the composition, and(D) filler, sufficient to bring the total of the composition to 100% by weight.2. The adhesive composition according to in which the mixture of vinyl elastomer and epoxy elastomer are present in a weight ratio of 1:3 and have weight average molecular weights (MW) within the range of 3000 to 100 claim 1 ,000.3. The adhesive composition according to in which the vinyl and epoxy elastomers will have glass transition temperatures (Tg) within the range of −65° to 20° C.4. The adhesive composition according to in which the vinyl and epoxy elastomers are selected from the group consisting of butadiene-acrylonitrile rubbers claim 1 , butadiene rubbers claim 1 , nitrile butadiene rubbers claim 1 , polyurethane elastomers claim 1 , polyisobutene elastomers claim 1 , polyisoprene elastomers claim 1 , polyester amide elastomers claim 1 , ethylene-vinyl acetate copolymer elastomers claim 1 , polypropylene elastomers claim 1 , polyethylene elastomers ...

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15-08-2013 дата публикации

Epoxy Composition with Crystallization Inhibition

Номер: US20130210961A1
Принадлежит:

An epoxy resin composition formed, at least in part, as the reaction product of a mixture comprising 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines, wherein each aromatic amine contains no more than two amine hydrogen atoms is provided. Also provided is a method of using the epoxy resin composition including incorporating the epoxy resin composition into a coating, an adhesive, a sealant, a casting, a laminate, or a composite. 1. An epoxy resin composition comprising the reaction product of a mixture comprising between 95 and 99 wt % of an epoxy component comprising one or more diglycidyl ethers of Bisphenol A and between 1 and 5 wt % of an additive component comprising one or more aromatic amines , wherein each aromatic amine contains no more than two amine hydrogen atoms.2. The epoxy resin composition of wherein the one or more aromatic amines are selected from aniline claim 1 , ortho-toluidine claim 1 , meta-toluidine claim 1 , para-toluidine claim 1 , 4-propylaniline claim 1 , 4-ethylaniline claim 1 , 3-chloroaniline claim 1 , 4-hydroxyaniline claim 1 , 3-cyanoaniline claim 1 , 2 claim 1 ,4-dimethylaniline claim 1 , 2 claim 1 ,6-dimethylaniline claim 1 , N claim 1 ,N′-dimethylbenzene-1 claim 1 ,4-diamine claim 1 ,1-naphthalenamine claim 1 , and combinations and mixtures thereof3. The epoxy resin composition according to wherein the one or more aromatic amines comprises aniline.4. The epoxy resin composition of wherein the mixture comprises between 98.7 and 97.5 wt % of one or more diglycidyl ethers of Bisphenol A and between 1.3 and 2.5 wt % aromatic amine.5. The epoxy resin composition of wherein the mixture comprises 97.5 wt % of one or more diglycidyl ethers of Bisphenol A and 2.5 wt % of aniline.6. The epoxy resin composition according to wherein the one or more diglycidyl ethers of Bisphenol A have an epoxide equivalent ...

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15-08-2013 дата публикации

METHODS FOR MAKING POLYMER PARTICULATES IN GEL FORM

Номер: US20130211005A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS, LLC

Methods for making polymer particles in gel form via an emulsion and/or suspension process are provided. The method can include preparing a reactant mixture comprising a carrier fluid and a monomer component containing one or more phenolic compounds and optionally one or more crosslinking compounds, a mixture of Maillard reactants, or a combination thereof. The monomer component can polymerize to form the polymer particles in gel form. The reactant mixture can be located within a reactor having one or more inner surfaces in contact with the reactant mixture during polymerization of the monomer component. The one or more inner surfaces limit a release of metal, metal ions, or a combination thereof into the reactant mixture to produce the polymer particles in gel form containing less than 1 wt % metal atoms, metal ions, or a combination thereof, based on the total weight of the polymer particles in gel form. 1. A method for making polymer particles in gel form via an emulsion or suspension process , the method comprising: the monomer component polymerizes to form the polymer particles in gel form,', 'the reactant mixture is located within a reactor having one or more inner surfaces in contact with the reactant mixture during polymerization of the monomer component, and', 'the one or more inner surfaces limit a release of metal, metal ions, or a combination thereof into the reactant mixture to produce the polymer particles in gel form containing less than 1 wt % metal atoms, metal ions, or a combination thereof, based on the total weight of the polymer particles in gel form., 'preparing a reactant mixture comprising a carrier fluid and a monomer component containing one or more phenolic compounds and optionally one or more crosslinking compounds, a mixture of Maillard reactants, or a combination thereof, wherein2. The method of claim 1 , wherein the reactant mixture further comprises one or more catalysts; and wherein the one or more catalysts is substantially free of ...

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22-08-2013 дата публикации

Polyamine Polyamidoamine Epihaloohydrin Compositions and Processes for Preparing and Using the Same

Номер: US20130213593A1
Принадлежит: KEMIRA OYJ

Compositions of and processes for preparing a polyamine-polyamidoamine-epihalohydrin resin generally include reacting a first polyamine, a polyamidoamine, and an epihalohydrin to form the polyamine-polyamidoamine-epihalohydrin (PPAE) resin, wherein the polyamidoamine is prepared by reacting a polycarboxylic acid or a polycarboxylic acid derivative with a second polyamine to form the polyamidoamine, wherein a molar ratio of the polyamine to the polycarboxylic acid is 1.05 to 2.0. The PPAE resin can be used in an adhesive formulation for use in creping applications for forming paper products such as tissue products. 113-. (canceled)14. A process for forming a creped paper product comprising:applying an adhesive formulation comprising a polyamine-polyamidoamineepihalohydrin resin to a drying surface, wherein the polyamine-polyamidoamine-epihalohydrin resin has a rewettability ratio of 5 to 100, and an insolubility percentage of 5 to 100%, and wherein the polyamidoamine is prepared by a process comprising reacting a polycarboxylic acid and/or a polycarboxylic acid derivative with a second polyamine to form the polyamidoamine, wherein a molar ratio of the second polyamine to the polycarboxylic acid and/or polycarboxylic acid derivative is 1.05 to 2.0;pressing a paper web against the drying surface to effect adhesion of the paper web to the surface; anddislodging the paper web from the drying surface by contact with a doctor blade to form the creped paper product.15. The process of claim 14 , wherein the creped paper product is an article selected from the group consisting of facial tissue claim 14 , bath tissue claim 14 , wipes claim 14 , paper towels claim 14 , paper napkins claim 14 , filter papers claim 14 , and coffee filters.16. The process of claim 14 , wherein the epihalohydrin is epichlorohydrin.1730-. (canceled) The present disclosure generally relates to polymers that are useful in papermaking processes. More particularly, the present disclosure relates to ...

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22-08-2013 дата публикации

CURABLE AND CURED COMPOSITIONS

Номер: US20130217804A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The reactive liquid modifier is an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings. 1. A curable composition having a first part and a second part , the curable composition comprising:a) an epoxy resin, wherein the epoxy resin is in the first part of the curable composition;{'sup': 1', '1, 'b) a curing agent having at least two groups of formula —NRH where Ris selected from hydrogen, alkyl, aryl, or alkylaryl, wherein the curing agent is in the second part of the curable composition;'}c) a toughening agent, wherein the toughening agent is in the first part, in the second part, or in both the first part and the second part of the curable composition and wherein the toughening agent is a core-shell polymer, a butadiene-nitrile rubber, acrylic polymer or copolymer, an adduct of an amino-terminated material and an epoxy resin, or an adduct of a carboxy-terminated material and an epoxy resin; andd) a reactive liquid modifier that is in the first part of the curable composition, the reactive liquid modifier comprising an acetoacetate ester of a polyol that is a vegetable oil, that is prepared from a vegetable oil, or that is a mixture thereof, wherein the polyol comprises a triglyceride having at least two hydroxyl groups and wherein the acetoacetate ester has at least two acetoacetoxy groups.2. (canceled)4. The curable composition of claim 1 , wherein the curable composition comprises 20 to 90 weight percent epoxy resin claim 1 , 3 to 30 weight percent curing agent claim 1 , 3 to 20 weight percent reactive liquid modifier claim 1 , and 5 to 55 weight percent ...

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29-08-2013 дата публикации

Curable compositions

Номер: US20130225725A1
Принадлежит: 3M Innovative Properties Co

Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured compositions can be used as structural adhesives. The reactive liquid modifier is an acetoacetate ester of a dimer alcohol. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.

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29-08-2013 дата публикации

PRIMER COMPOSITION

Номер: US20130225726A1
Принадлежит: SUMITOMO METAL MINING CO., LTD.

Disclosed herein is a primer composition for metal materials, capable of forming a primer layer excellent in adhesion properties and film-forming properties on the surfaces of various metal materials such as common steel, stainless steel, aluminum, aluminum alloy, copper, and zinc plating to impart high bond strength and high bond durability when the metal materials are bonded with an epoxy-based adhesive. The primer composition is intended to be applied onto the surface of a metal material to be bonded with an epoxy-based adhesive and includes an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin containing at least a phenol novolac-type epoxy resin, a curing agent composed of cyandiamide, a curing catalyst composed of imidazole, and an inorganic oxide filler composed of silica and titanium oxide. 1. A primer composition for metal materials to be applied onto a surface of a metal material to be bonded with an epoxy-based adhesive , comprising: an epoxy resin containing both a bifunctional epoxy resin containing at least a bisphenol A-type epoxy resin and a multifunctional epoxy resin , excluding a bifunctional epoxy resin , containing at least a phenol novolac-type epoxy resin; a curing agent composed of cyandiamide; a curing catalyst composed of imidazole; and an inorganic oxide filler composed of silica and titanium oxide , wherein a solvent is not contained.2. The primer composition for metal materials according to claim 1 , whereinthe bifunctional epoxy resin is a bisphenol A-type epoxy resin alone or a mixture of a bisphenol A-type epoxy resin and a bisphenol F-type epoxy resin, andthe multifunctional epoxy resin is a phenol novolac-type epoxy resin alone or a mixture of a phenol novolac-type epoxy resin and a p-aminophenol-type epoxy resin.3. The primer composition for metal materials according to claim 2 , wherein the epoxy resin containing both the bifunctional epoxy ...

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05-09-2013 дата публикации

Two-component structural adhesive which is impact resistant at room temperature

Номер: US20130230726A1
Принадлежит: SIKA TECHNOLOGY AG

The disclosure relates to the field of two-component epoxy resin compositions and to the use thereof as a repair adhesive, in particular in vehicle manufacturing. The two-component epoxy resin compositions according to the disclosure contain a curing component K2, which comprises between 1 and 10 wt. % of an amino group-terminated polyamide B, together with an epoxy resin component K1. The compositions show that the impact resistance is highly increased while an acceptable sheer strength is simultaneously retained.

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19-09-2013 дата публикации

ADHESIVE COMPOSITION, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION OR THE ADHESIVE SHEET

Номер: US20130245160A1
Принадлежит: Toray Industries, Inc.

The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).) 2. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.3. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and contains at least a filler with an average particle diameter of 6 μm or more and 15 μm or less and a filler with an average particle diameter of 30 μm or more.4. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes a filler that the pH of the liquid prepared when 10 g of the thermally conductive filler is added to 100 g of water is not more than 6.0.5. The adhesive composition according to claim 1 , wherein the thermally conductive filler (C) includes alumina.8. The adhesive sheet according to claim 7 , wherein the thermally conductive filler (C) includes two or more fillers differing in the average particle diameter and at least one filler has an average particle diameter of 6 μm or more.9. The adhesive sheet according to claim 7 , wherein the thermally conductive filler ( ...

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26-09-2013 дата публикации

SEALING COMPOSITION AND METHOD FOR MANUFACTURING DISPLAY PANEL USING THE SAME

Номер: US20130248110A1
Принадлежит: Samsung Display Co., Ltd.

A sealing composition and a method of manufacturing a display panel using the sealing composition are disclosed. The sealing composition includes about 10% by weight to about 80% by weight of a denatured epoxy resin having a methacrylate group, about 5% by weight to about 40% by weight of a photo-curing acrylate monomer, about 1% by weight to about 10% by weight of a heat-curing agent, about 1% by weight to about 10% by weight of a photo-polymerization initiator, about 5% by weight to about 50% by weight of a filler, about 1% by weight to about 10% by weight of a flexibility improving agent and about 0.001% by weight to about 8% by weight of an additive. 1. A sealing composition comprising , based on a total weight of the sealing composition:about 10% by weight to about 40% by weight of a denatured epoxy resin comprising a methacrylate group;about 10% by weight to about 40% by weight of a photo-curing acrylate monomer;about 1% by weight to about 10% by weight of a heat-curing agent;about 1% by weight to about 10% by weight of a photo-polymerization initiator;about 10% by weight to about 50% by weight of a filler;about 1% by weight to about 10% by weight of a flexibility improving agent; andabout 10% by weight to about 30% by weight of a solvent.2. The sealing composition of claim 1 , wherein the denatured epoxy resin comprises at least one resin selected from the group consisting of a bisphenol A-based epoxy resin claim 1 , a bisphenol F-based epoxy resin claim 1 , a novolac-based epoxy resin claim 1 , a brominated epoxy resin claim 1 , a cycloaliphatic-based epoxy resin claim 1 , a rubber modified-based epoxy resin claim 1 , an aliphatic polyglycidyl-based epoxy resin claim 1 , a glycidyl amine-based epoxy resin claim 1 , a biphenyl-based epoxy resin claim 1 , a naphthalene-based epoxy resin and a tris-phenol methane-based epoxy resin.3. The sealing composition of claim 1 , wherein the a photo-curing acrylate monomer comprises at least one acrylate selected from ...

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26-09-2013 дата публикации

ADHESIVE FILM

Номер: US20130251989A1
Принадлежит: LG CHEM, LTD.

The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability. 1. An adhesive composition for encapsulating an organic electronic element , comprising: a curable adhesive resin that is in a solid or semi-solid phase at room temperature; a moisture absorbent that is comprised in an amount of 1 to 100 parts by weight , relative to 100 parts by weight of the adhesive resin; and a filler that is comprised in an amount of 1 to 50 parts by weight , relative to 100 parts by weight of the adhesive resin.2. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin has a viscosity of at least 10poise at room temperature.3. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin has a water vapor transmission rate in a thickness direction of 50 g/m·day or less under a state where the curable adhesive resin is cured to be in the shape of a film having a thickness of 80 μm.4. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin is an epoxy resin.5. The adhesive composition for encapsulating an organic electronic element of claim 1 , wherein the curable adhesive resin is a silane modified epoxy resin.6. The adhesive composition for encapsulating an organic electronic element of claim 5 , wherein the silane modified epoxy resin is an aromatic epoxy resin to which a silane compound of the following Chemical Formula 1 is introduced ...

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26-09-2013 дата публикации

Adhesive composition and uses thereof

Номер: US20130253093A1

Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

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03-10-2013 дата публикации

CURABLE ADHESIVE COMPOSITION

Номер: US20130255879A1
Принадлежит:

The present invention relates to a curable adhesive composition comprising a first part and a second part, the curable adhesive composition comprising: in the first part at least one epoxy resin and in the second part at least one curing agent in the form of an epoxy-amine and/or epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group. 117-. (canceled)18. A method for bonding at least two substrates together , the method comprising: i) the first part comprises at least one epoxy resin; and', 'ii) the second part comprises at least one curing agent in the form of an epoxy-amine adduct or an epoxy-thiol adduct obtainable by reacting at least one primary amine, secondary amine, and/or a thiol with at least one polyol compound comprising at least one terminal epoxy group;, 'a) providing a mixed adhesive composition by mixing a first part and a second part of a curable adhesive composition in an appropriate ratio, wherein'}b) covering one or both substrates at least partially with the mixed adhesive composition, wherein one or both substrates are covered with an oil layer, which is not removed before applying the mixed adhesive composition;c) bringing the substrates into contact in a section covered with the mixed adhesive composition; andd) curing the mixed adhesive composition.19. The method of claim 18 , wherein the polyol compound comprises a polyester polyol claim 18 , a polyether polyol claim 18 , polyurethane polyol claim 18 , polyurea polyol claim 18 , polycarbonate polyol claim 18 , polyol from a renewable source claim 18 , or a mixture thereof.20. The method of claim 18 , wherein the primary and secondary amine comprises a polyetheramine claim 18 , polyamidoamine claim 18 , polyamide claim 18 , Mannich base claim 18 , or a mixture thereof.21. The method of claim 18 , wherein the epoxy-amine adduct and/or the epoxy-thiol adduct has a Mw of ...

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03-10-2013 дата публикации

RESIN COMPOSITION, COMPOSITE CURED PRODUCT USING SAME, AND METHOD FOR PRODUCING THE COMPOSITE CURED PRODUCT

Номер: US20130261229A1
Принадлежит: Toray Industries, Inc.

A resin composition including 10 to 90% by mass of (A) a component to be polymerized containing a compound represented by Formula (1), and 90 to 10% by mass of (B) a thermosetting resin, the (A) and (B) each being capable of undergoing a reaction to increase molecular weight by itself when heated: 2. The resin composition according to claim 1 , wherein said compound represented by Formula (1) is one selected from the group consisting of a cyclic polyphenylene sulfide claim 1 , a cyclic polyphenylene ether ether ketone claim 1 , a cyclic polyphenylene ether ketone and a cyclic polyphenylene ether sulfone.3. The resin composition according to claim 1 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 1 , a bismaleimide resin and a polyimide resin.4. The resin composition according to claim 1 , further comprising a zero-valent transition metal compound.5. The resin composition according to claim 4 , wherein said zero-valent transition metal compound comprises a metal belonging to Groups 8 to 11 and Periods 4 to 6 of the periodic table.6. The resin composition according to claim 1 , further comprising an alkali metal salt.7. The resin composition according to claim 1 , further comprising (C) a reinforcement fiber.8. The resin composition according to claim 7 , wherein said (C) reinforcement fiber is a carbon fiber.9. A method of producing a composite cured product comprising allowing the resin composition according to to react by heating to obtain a composite cured product.10. A method of producing a composite cured product comprising impregnating the resin composition according to into a reinforcement fiber and then allowing said resin composition to react by heating to obtain a composite cured product.12. The composite cured product according to claim 11 , further comprising (C) a reinforcement fiber.13. The resin composition according to claim 2 , wherein said (B) is one selected from the group consisting of an epoxy resin claim 2 , ...

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10-10-2013 дата публикации

STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING CHAIN-EXTENDED ELASTOMERIC TOUGHENERS CAPPED WITH PHENOL, POLYPHENOL OR AMINOPHENOL COMPOUNDS

Номер: US20130263995A1
Принадлежит:

Structural adhesives are prepared from a chain extended elastomeric toughener that contains urethane and/or urea groups, and have terminal isocyanate groups that are capped with a phenol, a polyphenol or an aminophenol compound. The adhesives have very good storage stability and cure to form cured adhesives that have good lap shear and impact peel strengths. 1. A one-part structural adhesive comprising:A) at least one epoxy resin;B) a reactive elastomeric toughener containing capped isocyanate groups; andC) one or more epoxy curing agents; a) reacting an excess of a polyisocyanate with a 300-3000 equivalent weight polyol or with a mixture of a 300-3000 equivalent weight polyol and a branching agent, to form an isocyanate-terminated prepolymer;', 'b) reacting the isocyanate-terminated prepolymer with a chain extender to produce a chain extended, isocyanate-terminated prepolymer, and', 'c) capping at least 90% of the terminal isocyanate groups of the chain extended, isocyanate-terminated prepolymer with a capping agent selected from a monophenol, a polyphenol or an aminophenol., 'wherein the elastomeric toughener is formed by'}2. The structural adhesive of claim 1 , wherein the 300-3000 equivalent weight polyol is a polyether claim 1 , a hydroxyl-terminated polybutadiene or a mixture of a polyether and a hydroxyl-terminated polybutadiene.3. The structural adhesive of claim 1 , wherein the chain extender contains two phenolic hydroxyl groups.4. The structural adhesive of wherein the capping agent is a monophenol.5. The structural adhesive of wherein the capping agent is a polyphenol.6. The structural adhesive of wherein the capping agent is an aminophenol.7. The structural adhesive of claim 1 , wherein the epoxy resin includes at least one diglycidyl ether of a polyhydric phenol.8. The structural adhesive of claim 1 , which contains at least one epoxide-terminated liquid rubber.9. The structural adhesive of claim 1 , further comprising a latent catalyst which becomes ...

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10-10-2013 дата публикации

HIGH SHEAR APPLICATION IN PROCESSING OILS

Номер: US20130266703A1
Принадлежит: H R D Corporation

Herein disclosed is a method of processing oil, comprising providing a high shear device comprising at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid; contacting a gas with an oil in the high shear device, wherein the gas is an inert gas or a reactive gas; and forming a product, wherein the product is a solution, a dispersion, or combination thereof. Herein also disclosed is a high shear system for processing oil, comprising; at least one high shear device, having an inlet and at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid; a gas source fluidly connected to the inlet; an oil source fluidly connected to the inlet; and a pump positioned upstream of a high shear device, the pump in fluid connection with the inlet and the oil source. 1. A method of producing an oil comprising providing a high shear device comprising at least one rotor and at least one complementarily-shaped stator configured to mix a gas with a liquid;contacting a gas with an oil in said high shear device, wherein said gas is an inert gas or a reactive gas; andforming a product, wherein said product is a solution, a dispersion, or combination thereof2. The method of wherein the solution is saturated or supersaturated with the gas.3. The method of wherein the solution is no less than 5% supersaturated with the gas.4. The method of wherein the dispersion comprises gas bubbles with a mean diameter of less than 50 μm.5. The method of wherein said gas comprises nitrogen claim 1 , a noble gas claim 1 , carbon dioxide claim 1 , hydrogen claim 1 , or hydrogen sulfide.6. The method of wherein said oil comprises vegetable oil.7. The method of wherein said oil comprises edible oil or inedible oil.8. The method of wherein said oil comprises soybean oil.9. The method of wherein said oil comprises ostrich oil.10. The method of wherein said oil is selected from the group consisting of soybean oil claim 1 , ...

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24-10-2013 дата публикации

JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF

Номер: US20130277092A1
Принадлежит: NITTO DENKO CORPORATION

A joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid. 1. A joining sheet comprising:solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid.2. The joining sheet according to claim 1 , whereinthe blocked carboxylic acid is a reacting product of vinyl ether and a carboxylic acid.3. The joining sheet according to claim 2 , whereinthe vinyl ether is alkyl vinyl ether and the carboxylic acid is a bifunctional carboxylic acid.4. The joining sheet according to claim 1 , whereinthe dissociation temperature of the blocked carboxylic acid is 150° C. or more.5. The joining sheet according to claim 1 , whereinthe volume ratio of the thermosetting resin to the thermoplastic resin is 25:75 to 75:25.6. The joining sheet according to claim 1 , whereinthe thermosetting resin is an epoxy resin.7. The joining sheet according to claim 1 , whereinthe thermoplastic resin is an acrylic resin.8. The joining sheet according to claim 1 , whereinthe solder particles are made of a tin-bismuth alloy.9. The joining sheet according to claim 1 , whereinthe joining sheet further contains a curing agent.10. A method for producing a joining sheet comprising:preparing a mixture by mixing solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid to heat the mixture at a temperature that is below the dissociation temperature of the blocked carboxylic acid and below the melting point of the solder particles, and not less than the softening temperature of the thermoplastic resin to be formed into a sheet shape.11. A method for producing an electronic component comprising the steps of:preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, whereinthe joining sheet comprisessolder particles, a thermosetting resin, a thermoplastic ...

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24-10-2013 дата публикации

Thermally conductive adhesive

Номер: US20130279118A1
Принадлежит: Dexerials Corp

A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

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24-10-2013 дата публикации

HEAT-CURING SEALING COMPOUND COMPOSITIONS HAVING FAST SKIN FORMATION AND GOOD STORAGE STABILITY

Номер: US20130280526A1
Принадлежит: SIKA TECHNOLOGY AG

The invention relates to heat-curing sealing compound compositions comprising at least epoxy resin, a heat-activatable hardening agent or accelerators (B) for epoxy resins, isocyanate group-containing polyurethane polymer (PUP) and a special polyaldimine. Said single-component sealing compound compositions are characterized by a good skin formation time and extraordinarily good storage stability and low blistering. Due to these properties, said sealing compound compositions are optimally suitable for use as sealants in autobody work because they can be excellently coated with a KTL paint. 2. The heat-curing sealing compound composition according to claim 1 , wherein Rand R 'each, independently of one another, stands for methyl, ethyl, propyl, isopropyl, butyl, 2-ethylhexyl, cyclohexyl or benzyl,', 'either'} 'together—including the nitrogen atom—they form a ring, in particular a pyrrolidine, piperidine, morpholine or N-alkyl piperazine ring, wherein this ring is optionally substituted.', 'or'}3. The heat-curing sealing compound composition according to claim 1 , wherein the weight ratio of epoxy resin (A) to polyurethane polymer (PUP) containing isocyanate groups is between 0.1 and 0.5.4. The heat-curing sealing compound composition according to claim 1 , Wherein the polyaldimine (PA) is present in an amount in the sealing compound composition claim 1 , such that the ratio of the number of aldimino groups to the number of isocyanate groups has a value of 0.2 to 0.8.5. The heat-curing sealing compound composition according to claim 1 , wherein the heat-activatable curing agent or accelerator (B) for epoxy resins is solid at room temperature and has a melting point of more than 80° C.6. The heat-curing sealing compound composition according to claim 1 , wherein the heat-activatable curing agent or accelerator (B) for epoxy resins is selected from the group consisting of dicyanodiamide claim 1 , guanamines claim 1 , guanidines claim 1 , aminoguanidines and their ...

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24-10-2013 дата публикации

TWO-COMPONENT CURABLE COMPOSITION

Номер: US20130280530A1
Принадлежит:

In the context of a curable agent based on at least one silyl-terminated polymer, the adhesion spectrum for bonding plastics, and the speed at which adhesion builds up, are to be improved. This is achieved by making available a curable agent containing two components (1) and (2) that are not in mutual contact, where component (1) contains at least one polymer having at least one terminal group of formula (I) -A-CH—SiXYZ (I), in which A is a divalent bonding group, X, Y, Z are, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy groups, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy group, and n is 0 or 1; and component (2) contains at least water and at least one silanol condensation catalyst. A further subject of the present invention is the use of the agent according to the present invention as an adhesive and/or sealant. 1. A curable agent containing two components (1) and (2) that are not in mutual contact , wherein {'br': None, 'sub': n', '2, '-A-CH—SiXYZ\u2003\u2003(I),'}, 'component (1) contains at least one polymer having at least one terminal group of the general formula (I)'}in whichA is a divalent bonding group containing at least one heteroatom,{'sub': 1', '8', '1', '8', '1', '8', '1', '8', '1', '8, 'X, Y, Z are substituents on the Si atom and, mutually independently, are Cto Calkyl, Cto Calkoxy, or Cto Cacyloxy residues, where at least one of the substituents is a Cto Calkoxy or Cto Cacyloxy residue, and'} 'component (2) contains at least water and at least one silanol condensation catalyst.', 'n is 0 or 1; and'}2. The curable agent according to claim 1 , wherein the divalent bonding group A in formula (I) is a carbamate group or urea group.3. The curable agent according to claim 1 , wherein X claim 1 , Y claim 1 , Z in formula (I) are claim 1 , mutually independently in each case claim 1 , a methyl claim 1 , an ethyl claim 1 , a methoxy claim 1 , or an ethoxy residue.4. The curable agent according to claim 1 , ...

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24-10-2013 дата публикации

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME

Номер: US20130281559A1
Принадлежит:

An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. 1. An adhesive composition for a semiconductor , the adhesive composition having two exothermic peaks between 65° C. and 350° C. and having an area ratio of voids (Vm) of less than 10% , measured after 1-cycle curing at 150° C. for 30 minutes and then molding at 175° C. for 60 seconds ,wherein a first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C. with the proviso that the second exothermic peak appears at a higher temperature than the first exothermic peak.2. The adhesive composition as claimed in claim 1 , wherein the adhesive composition includes:a thermoplastic resin;an epoxy resin;a curing agent; anda curing accelerator.3. The adhesive composition as claimed in claim 2 , wherein the curing agent includes two different kinds of curing agents each having a different reaction temperature range.4. The adhesive composition as claimed in claim 2 , wherein the curing agent includes a phenolic curing agent and an amine curing agent.7. The adhesive composition as claimed in claim 4 , wherein a ratio of the phenolic curing agent to the amine curing agent is 3:1 to 1:11.8. The adhesive composition as claimed in claim 2 , wherein the curing accelerator has a melting point of 100° C. to 160° C.9. The adhesive composition as claimed in claim 2 , wherein the adhesive composition includes 15 to 70 wt % of the thermoplastic resin claim 2 , 5 to 35 wt % of the epoxy resin claim 2 , 0.5 to 15 wt % of a phenolic curing agent claim 2 , 1 to 15 wt % of an amine curing agent claim 2 , 0.01 to 10 wt % of the curing accelerator ...

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07-11-2013 дата публикации

LATENT HARDENER WITH IMPROVED BARRIER PROPERTIES AND COMPATIBILITY

Номер: US20130295381A1
Принадлежит:

A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications. 19.-. (canceled)10. A composition comprising an epoxy resin and a curing agent that is comprised of the reaction product of:(a) an amine, and(b) an epoxy resin, and(c) an elastomer-epoxy adduct.11. The composition of wherein the curing agent is the reaction product of:(a) an amine, and(b) an epoxy resin, and(c) a carboxyl-terminated butadiene-acrylonitrile (CTBN)-epoxy adduct; wherein the elastomer-epoxy adduct is a carboxyl-terminated butadiene-acrylonitrile (CTBN)-epoxy adduct which functions as a dispersant; wherein the amine and the epoxy resin are reacted in the presence of the dispersant to produce a dispersion of epoxy resin particles; wherein the particles are encapsulated in a polymer shell.12. The composition of wherein the nitrile content of the CTBN is about 12-35% by weight.13. The composition of wherein the wherein the nitrile content is about 20-33% by weight.14. The composition of wherein the composition is formulated such that it is functional as an adhesive claim 10 , a conducting adhesive claim 10 , a composite claim 10 , a molding compound claim 10 , an anisotropic conducting film (ACF) adhesive claim 10 , a non-random array ACF claim 10 , a non-conductive adhesive film (NCF) claim 10 , a coating claim 10 , an encapsulant claim 10 , an underfill material claim 10 , or as a lead free solder.151. An electronic display comprising an electronic component affixed to a substrate by an epoxy adhesive wherein the epoxy adhesive incorporates the curing agent of claim .161. A circuit board comprising an electronic component affixed to a board substrate with an epoxy adhesive claim 10 , the epoxy adhesive incorporating the curing agent of ...

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07-11-2013 дата публикации

EPOXY RESIN COMPOSITION AND COPPER CLAD LAMINATE MANUFACTURED BY USING SAME

Номер: US20130295388A1
Принадлежит: GUANGDONG SHENGYI SCI. TECH CO., LTD.

The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards. 18.-. (canceled)9. An epoxy resin composition , comprising the following components and weight percentages thereof: epoxy resin 20-70% , curing agent 1-30% , accelerator 0-10% , fluororesin micropowder filler 1-60% , and inorganic filler 0-60% , and further comprising a suitable amount of solvent , Wherein the fluororesin of the fluororesin micropowder filler is the homopolymer of the monomer CFHClor copolymer of CFHCland —{CFH(OCH)—} , wherein x=1-4 , y=0-3; m is an integer of greater than or equal to 1; a and n are the integers of greater than or equal to 1; b and c are the integers of greater than or equal to 0; 2a−b−c≧0; said fluororesin is tetrafluoroethylene resin , tetrafluoroethylene-perfluoro alkoxyethylene copolymer resin , tetrafluoroethylene-hexafluoropropylene copolymer resin , tetrafluorethylene-ethylene copolymer resin , vinylidene fluoride resin , trifluorochloroethylene resin or ethylene-trifluorochloroethylene resin.10. The epoxy resin composition according to claim 9 , wherein the fluororesin ...

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14-11-2013 дата публикации

EPOXY RESIN ADHESIVE COMPOSITION AND PERFORATED FLOOR PANEL FOR CLEAN ROOM COMPRISING THE SAME

Номер: US20130302559A1
Автор: KIM Myun SOO
Принадлежит: HAE KWANG CO., LTD.

The present invention provides an epoxy resin adhesive composition and a perforated floor panel for a clean room including the same. The epoxy resin adhesive composition is a two-component epoxy resin adhesive composition comprising a main material including graphite having conductivity and a curing agent including a amide compound, wherein the main material and the curing agent are mixed at a weight ratio of 2:1. When this epoxy resin adhesive composition is disposed between a base panel and a resin tile constituting the perforated floor panel for a clean room, the adhesion between the base panel and the resin tile becomes high, heat is easily discharged to the outside by graphite, and the generation of static electricity can be reduced. 1. An epoxy resin adhesive composition , which is a two-component epoxy resin adhesive composition , comprising: a main material; and a curing agent ,wherein the main material comprises 18˜25.7 wt % of a basic epoxy resin, 15˜22.4 wt % of a modified epoxy resin, 7.3˜13 wt % of a polyester resin for providing adhesivity, 7˜19.5 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.15˜30.2 wt % of epoxy silane for increasing adhesivity, 6˜15 wt % of graphite for providing conductivity, 8˜30 wt % of a first filler for providing viscosity, 5˜45 wt % of a second filler for providing thixotropy, and 0.01˜10 wt % of a dispersant for dispersing the first and second fillers,the curing agent comprises 14˜30 wt % of a middle-viscosity amide compound, 10˜35 wt % of a low-viscosity amide compound, 1.1˜8.5 wt % of a catalyst for promoting curing, 0.5˜15 wt % of a methyl ethyl ketone (MEK) solvent for adjusting viscosity, 0.01˜8 wt % of aminosilane for increasing adhesivity, 10˜60 wt % of a first filler for providing viscosity, and 3˜17 wt % of a second filler for providing thixotropy, and the main material and the curing agent are mixed at a weight ratio of 2:1.2. The epoxy resin adhesive composition of claim 1 , wherein claim 1 ...

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28-11-2013 дата публикации

EPOXY-THIOL COMPOSITIONS WITH IMPROVED STABILITY

Номер: US20130313693A1
Принадлежит: Henkel Ireland Limited

A curable one-part epoxy resin composition is described. The composition comprises an epoxy component comprising at least one epoxy compound which has two or more groups per molecule; a latent hardener component; a thixotropy-conferrring component; a polythiol component comprising a polythiol having at least one secondary or tertiary thiol group per molecule; and a stabilising component comprising a solid organic acid. The compositions according to the invention are particularly suitable for use in the field of microelectronics. 1. A curable one-part epoxy resin composition , comprising:(a) an epoxy component comprising at least one epoxy compound which has two or more groups per molecule;(b) a latent hardener component;(c) a thixotropy-conferrring component;(d) a polythiol component comprising a polythiol having at least one secondary or tertiary thiol group per molecule; and(e) a stabilising component comprising a solid organic acid.2. The composition according to wherein the polythiol comprises at least two secondary thiol groups.3. The composition according to claim 1 , wherein the polythiol comprises at least three secondary thiol groups.4. The composition according to claim 1 , wherein the polythiol comprises at least four secondary thiol groups.5. The composition according to wherein the polythiol comprises at least two tertiary thiol groups.7. The composition according to suitable for use as an adhesive to mount electronic components.8. The composition according to claim 1 , comprising:(a) about 100 parts of an epoxy component comprising at least one epoxy compound;(b) about 5 to 45 parts of a latent hardener component;(c) about 5 to 40 parts of a thixotropy-conferring component; and(d) about 20 to 200 parts of a secondary polythiol; and(e) about 0.1 to 25 parts of a solid organic acid.9. The composition according to comprising:(a) about 100 parts of an epoxy component comprising at least one epoxy compound;(b) about 10-30 parts of a latent hardener ...

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19-12-2013 дата публикации

POLYETHER HYBRID EPOXY CURATIVES

Номер: US20130333840A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

This invention relates to a polyether-amido-amine corn-pound, obtainable by a two-step reaction of a poly-etheramine with an alkyl acrylate and a polyalkyle-neimine, whereas the polyetheramine and the polyalkyleneimine have at least one primary or secondary amine group, in which the first step comprises the reaction of the polyetheramine with the alkyl acrylate and the second step comprises the reaction of the polyalkyleneimine with the product of the first step. The invention also relates to a method for synthesising a polyether-amido-amine compound by a two-step-reaction. Another object of this invention is a curable composition containing at least one polyether-amido-amine-compound of this invention and a method for coating the surface of a substrate or for binding at least two substrates together using such a curable composition. 1. A polyether-amido-amine compound , obtainable by a two-step reaction of a polyetheramine with an alkyl acrylate and a polyalkyleneimine , whereas the polyetheramine and the polyalkyleneimine have at least one primary or secondary amine group , in which the first step comprises the reaction of the polyetheramine with the alkyl acrylate and the second step comprises the reaction of the polyalkyleneimine with the product of the first step.2. The compound according to claim 1 , characterized in that the first step is conducted via an aza-Michael addition and/or the second step is conducted as a condensation reaction.4. The compound according to claim 1 , characterized in that the polyetheramine comprises at least one end-standing iso-propylamine claim 1 , iso-butylamine or tert-butylamine group.5. The compound according to claim 1 , characterized in that the alkyl rest of the alkyl acrylate has 1 to 10 carbon atoms claim 1 , in particular 1 to 5 claim 1 , preferably the alkyl rest is a methyl or an ethyl rest.7. The compound according to claim 1 , characterized in that the mole ratio of polyetheramine:alkyl acrylate ranges from 10:1 to 1 ...

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19-12-2013 дата публикации

EPOXY RESIN COMPOSITION INCLUDING SILICA AND CORE-SHELL POLYMER PARTICLES

Номер: US20130337165A1
Принадлежит:

Disclosed is an impact resistant adhesive composition including silica and core-shell polymer particles. The impact resistant adhesive composition includes: (a) a first component including an epoxy resin and a polymeric dispersant, or an epoxy resin-polymeric dispersant prepolymer; (b) a second component including silica and core-shell polymer particles having a particle diameter of 20 to 250 nm; and (c) a third component including a curing agent and an additive mixture. The polymeric dispersant is a flexible polyether monoamine or polyether diamine which includes a mixed form of a lipophilic alkyl oxide chain and a hydrophilic ethylene oxide chain in the main chain, and has a weight average molecular weight of 500 to 4,000. 1. An impact resistant adhesive composition comprising:(a) a first component comprising an epoxy resin and a polymeric dispersant, or an epoxy resin-polymeric dispersant prepolymer;(b) a second component comprising silica and core-shell polymer particles having a particle diameter of 20 to 250 nm; and(c) a third component comprising a curing agent and an additive mixture,wherein the polymeric dispersant is a flexible polyether monoamine or polyether diamine comprising a mixed form of a lipophilic alkyl oxide chain and a hydrophilic ethylene oxide chain in the main chain, and having a weight average molecular weight of 500 to 4,000.3. The impact resistant adhesive composition according to claim 2 , wherein the compound of Formula 1 has a weight average molecular weight of 500 to 4 claim 2 ,000.4. The impact resistant adhesive composition according to claim 2 , wherein the ratio x:y in Formula 1 is from 3:10 to 10:3.5. The impact resistant adhesive composition according to claim 1 , wherein the flexible polymeric dispersant or the epoxy resin-polymeric dispersant prepolymer of the first component is present in an amount of 5 to 30% by weight claim 1 , based on the total weight of the composition.6. The impact resistant adhesive composition ...

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06-02-2014 дата публикации

IMPACT-MODIFIED ADHESIVES

Номер: US20140037966A1
Принадлежит:

The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated. 1. An agent for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other , wherein(a) component A comprises at least one compound having two or more isocyanate groups together with one or more further additives,(b) component B comprises at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives,(c) at least one of components A and/or B comprises at least one epoxide prepolymer as an additive,(d) at least one of components A and/or B comprises at least one latent hardener for epoxide prepolymers as an additive, and(e) components A and B contain no blowing agent that is capable of being heat activated.2. The agent according to claim 1 , wherein the at least one compound which has at least two reactive groups selected from hydroxyl groups claim 1 , thiol groups claim 1 , primary amino groups and secondary amino groups and is simultaneously free from ...

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13-02-2014 дата публикации

METHOD FOR MANUFACTURING AN ADHESIVE BOND OR COMPOSITE AND ADHESIVE OR MATRIX MATERIAL SUITABLE FOR THIS PURPOSE

Номер: US20140045964A1
Принадлежит:

The present invention relates to a method for manufacturing an adhesive bond between two components, in which an adhesive is used that can be cured with at least two different curing mechanisms. A first curing mechanism here generates less stiffness in the adhesive than at least one second curing mechanism. The layer of adhesive applied to join the components is cured with the first curing mechanism in the region between the components over the entire layer and with the at least second curing mechanism only locally, so that the stiffness of the adhesive layer varies in the region between the components. In like manner, a composite or composite layer can be manufactured with a matrix material, in which the matrix material is varyingly locally cured. The invention also relates to an adhesive or matrix material suitable for the method. The material and accompanying method can be used for many applications. 1. A method for manufacturing an adhesive bond between two components , in whichan adhesive is used that can be cured with at least two different curing mechanisms, of which a first curing mechanism generates less stiffness in the adhesive than at least one second curing mechanism, anda layer of the adhesive applied to join the components is cured with the first curing mechanism in the region between the components over the entire layer and with the at least second curing mechanism only locally, so that the stiffness of the adhesive layer varies in the region between the components.2. A method for manufacturing a composite or composite layer composed of fibers and/or particles of a first material , which are embedded into a matrix material , in whichuse is made of a matrix material that can be cured with at least two different curing mechanisms, of which a first curing mechanism generates less stiffness in the matrix material than at least one second curing mechanism, and,after mixed with the fibers and/or particles, the matrix material is cured with the first curing ...

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13-03-2014 дата публикации

Epoxy Resins With High Thermal Stability and Toughness

Номер: US20140069583A1
Принадлежит:

Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics. 2. The epoxy resin composition of claim 1 , wherein the polyepoxide resin comprises one or more aliphatic claim 1 , cycloaliphatic or aromatic-based epoxy compounds having about two epoxy groups.4. The epoxy resin composition of claim 1 , wherein Ais phenyl claim 1 , diphenylmethane claim 1 , biphenyl claim 1 , diphenylmethane substituted at the methane group by one or two C-Calkyl groups claim 1 , diphenylketone or diphenylsulfone.6. The epoxy resin composition of claim 1 , wherein the toughening agent is a carboxylated or amine terminated acrylonitrile/butadiene elastomer.8. The epoxy resin composition of claim 7 , further comprising a bisphenol compound selected from bisphenol A claim 7 , bisphenol F claim 7 , bisphenol R claim 7 , bisphenol S and a mixture thereof. Not Applicable.Not applicable.The present invention is directed to epoxy resin compositions which, when cured, exhibit preferred chemical and physical characteristics. In particular, the cured epoxy resin compositions of the present invention demonstrate high glass transition temperature and high fracture toughness.It is well-known epoxy resins may be used to treat surfaces (e.g. concrete, metal, electrical components, and sheetrock) to protect against corrosion and other forms of wear and tear caused by everyday use and the environment. The epoxy resins generally contain a plurality of epoxy or oxirane groups which react with a curing agent to form a network or significantly cross-linked system.Curing agents are to be distinguished from compounds referred to herein as chain extension agents. As used herein, ...

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13-03-2014 дата публикации

ADHESIVE FOR POLARIZING PLATE AND POLARIZING PLATE INCLUDING THE SAME

Номер: US20140072731A1
Принадлежит: LG CHEM, LTD.

The present invention relates to an adhesive composition including 100 parts by weight of a first epoxy compound having a glass transition temperature of a homopolymer of not less than 120° C., 30 parts by weight to 100 parts by weight of a second epoxy compound having a glass transition temperature of a homopolymer of not more than 60° C., and 0.5 parts by weight to 20 parts by weight of a cationic photopolymerization initiator, and a polarizing plate using the same. 1. An adhesive composition for a polarizing plate comprising:100 parts by weight of a first epoxy compound having a glass transition temperature of a homopolymer of not less than 120° C.;30 parts by weight to 100 parts by weight of a second epoxy compound having a glass transition temperature of a homopolymer of not more than 60° C., and0.5 parts by weight to 20 parts by weight of a cationic photopolymerization initiator.2. The adhesive composition of claim 1 , wherein the first epoxy compound is at least one selected from the group consisting of alicyclic epoxy compounds and aromatic epoxy compounds.3. The adhesive composition of claim 2 , wherein the first epoxy compound is at least one selected from the group consisting of 3 claim 2 ,4-epoxycyclohexylmethyl-3 claim 2 ,4′-epoxycyclohexanecarboxylate claim 2 , vinylcyclohexenedioxide claim 2 , dicyclopentadien dioxide claim 2 , bisepoxycyclopentylether claim 2 , bisphenol A epoxy compound claim 2 , and bisphenol F epoxy compound.4. The adhesive composition of claim 1 , wherein the second epoxy compound is at least one selected from the group consisting of alicyclic epoxy compounds and aliphatic epoxy compounds.5. The adhesive composition of claim 4 , wherein the second epoxy compound comprises one or more glycidyl ether group.6. The adhesive composition of claim 5 , wherein the second epoxy compound is at least one selected from the group consisting of 1 claim 5 ,4-cyclohexanedimethanol diglycidyl ether claim 5 , 1 claim 5 ,4-butanediol diglycidyl ...

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13-03-2014 дата публикации

TRIAZINE CONTAINING FLUOROPOLYETHER ELASTOMERS HAVING LOW GLASS TRANSITION TEMPERATURE

Номер: US20140073737A1
Принадлежит: 3M INNOVATIVE PROPERTIES COMPANY

There is provided a curable composition comprising: a) fluoropolyethers having a molecular weight of from about 400 g/mole up to about 20,000 g/mole and containing moieties selected from (—(CF)O—), (—(CF)O—), (—CFO—) or combinations thereof and further containing at least one nitrile group at a terminal position or at a position that is adjacent to the terminal position; and b) one or more curing agents selected from non-fluorinated compounds containing one or more functional group linked to a common residue, said residue containing at least three carbon atoms wherein the functional groups are selected from primary amines, secondary amines and functional groups that generate primary or secondary amines upon heat treatment, wherein the composition can be cured by generating groups having a triazine structure. Also provided are cured composition, methods of making cured compositions, articles made by curing the cured compositions and methods of making articles using the curable composition. 1. A curable composition comprising{'sub': 2', '4', '2', '2', '2, 'a) fluoropolyethers having a molecular weight of from about 400 g/mole up to about 20,000 g/mole and containing moieties selected from (—(CF)O—), (—(CF)O—), (—CFO—) or combinations thereof and further containing at least one nitrile group at a terminal position or at a position that is adjacent to the terminal position;'}b) one or more curing agents selected from non-fluorinated compounds containing one or more functional group linked to a common residue, said residue containing at least three carbon atoms wherein the functional groups are selected from primary amines, secondary amines and functional groups that generate primary or secondary amines upon a heat treatment,wherein the composition can be cured to generate groups having a triazine ring structure.2. The curable composition of wherein the fluoropolyethers are represented by the general formula{'br': None, 'X-A-Y'}{'sub': 2', '4', '2', '2', '2, 'wherein X ...

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27-03-2014 дата публикации

BISPHENOL A (BPA) FREE EPOXY RESINS

Номер: US20140088289A1
Автор: Schmidt Daniel
Принадлежит: UNIVERSITY OF MASSACHUSETTS LOWELL

An epoxy resin is provided that includes a diglycidyl ether of a substituted cycloaliphatic diol or bis-thiol, and a thermoset epoxy polymer is provided employing the same. The epoxy resin is bisphenol A free, and capable of forming thermoset epoxy polymers with fewer associated health and environmental concerns than conventional epoxies based on phenolic compounds. 2. The epoxy resin composition of further comprising a second monomer claim 1 , a curative compound claim 1 , or both.3. The epoxy resin composition of wherein the second monomer is a flexible molecule selected from the group consisting of an aliphatic claim 2 , cycloaliphatic or polyetheric molecule comprising at least two functional groups.6. The epoxy resin composition of claim 1 , wherein A and A′ are both either O or S; wherein W claim 1 , X claim 1 , Y and Z are each independently selected from the group consisting of a bond and C;{'sub': 1', '12', '1', '6, 'wherein R-Rare each independently selected from hydrogen, C-Cstraight chain or branched alkyl or alkenyl group; and'}{'sub': 2', '3', '2, 'wherein the alkyl, alkenyl is optionally substituted with one or more substituents, each of which is independently selected from NH, OH, CF, CN, COH, C(O) or halogen.'}7. The epoxy resin composition of claim 1 , wherein A and A′ are both O; wherein W claim 1 , X claim 1 , Y and Z are each independently selected from the group consisting of a bond and C;{'sub': 1', '12', '1', '6, 'wherein R-Rare each independently selected from hydrogen, C-Cstraight chain or branched alkyl.'}8. The epoxy resin composition of claim 1 , wherein R-Rare each independently selected from methyl or ethyl groups.9. The epoxy resin composition of claim 1 , wherein the resin is derived from a diglycidyl ether of a diol selected from the group consisting of 3 claim 1 ,3 claim 1 ,4 claim 1 ,4-tetramethyl-1 claim 1 ,2-cyclobutanediol; 2 claim 1 ,2 claim 1 ,4 claim 1 ,4-tetramethyl-1 claim 1 ,3-cyclobutanediol; 3 claim 1 ,3 claim 1 ,4 ...

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03-04-2014 дата публикации

VACUUM INFUSION ADHESIVE AND METHODS RELATED THERETO

Номер: US20140091496A1
Принадлежит: WESTECH AEROSOL CORPORATION

An epoxy adhesive that is adapted to enable spray delivery and seamless polymerization during epoxy resin vacuum infusion techniques is disclosed. The epoxy adhesive can include one or more epoxy resins and one or more solvents that are used to dissolve the one or more epoxy resins. An adduct, a tackifier, and fumed silica can also be added to the adhesive. 1. A cross-linking adhesive composition comprising: (1) an epoxy resin with a weight per epoxide value of 1500 to 4000 grams per equivalent , (2) an epoxy polyacrylate resin with a weight per epoxide value of 200 to 350 grams per equivalent and a viscosity of 200 to 1500 cP at 25° C. , and (3) a carboxyl terminated butadiene nitrile (CTNB) modified epoxy resin with a weight per epoxide value of 180 to 1000 grams per equivalent , and (4) one or more solvents , wherein the epoxy resin , the epoxy polyacrylate resin , and the CTNB modified epoxy resin are dissolved in the one or more solvents.2. The adhesive of claim 1 , wherein (1) the epoxy resin has a weight per epoxide value of 2300 to 3800 grams per equivalent claim 1 , (2) the epoxy polyacrylate resin has a weight per epoxide value of 300 to 320 grams per equivalent and a viscosity of 800 to 1100 cP at 25° C. claim 1 , and (3) the CTNB modified epoxy resin has a weight per epoxide value of 195 to 210 grams per equivalent.3. The adhesive of claim 1 , wherein the epoxy resin claim 1 , the epoxy polyacrylate resin claim 1 , and the CTNB modified epoxy resin are bisphenol A/epichlorohydrin resins.4. The adhesive of claim 1 , wherein the ratio of the epoxy resin to the CTBN modified epoxy resin ranges from 0.4 parts by weight to 0.6 parts by weight to one part by weight CTBN modified epoxy resin.5. The adhesive of claim 1 , wherein the ratio of the epoxy polyacrylate resin to the CTBN modified epoxy resin ranges from 0.05 parts by weight to 0.7 parts by weight to one part by weight CTBN modified epoxy resin.6. The adhesive of claim 1 , wherein the adhesive contains ...

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03-04-2014 дата публикации

MODIFIED POLYPHENOL BINDER COMPOSITIONS AND METHODS FOR MAKING AND USING SAME

Номер: US20140094562A1
Принадлежит: GEORGIA-PACIFIC CHEMICALS LLC

Modified polyphenol binder compositions and methods for making and using same are provided. In at least one specific embodiment, the binder composition can include at least one unsaturated monomer and at least one polyphenolic compound. The polyphenolic compound can include a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof. 1. A binder composition , comprising:at least one unsaturated monomer; andat least one polyphenolic compound comprising a lignin, a tannin, a novolac resin, a modified phenol formaldehyde resin, bis-phenol A, humic acid, or any mixture thereof.2. The binder composition of claim 1 , wherein the unsaturated monomer is nonionic.3. The binder composition of claim 1 , wherein the unsaturated monomer comprises an unsaturated glycidyl ether claim 1 , an unsaturated glycidyl ester claim 1 , an unsaturated mono-epoxide claim 1 , an unsaturated methylol compound claim 1 , maleic anhydride claim 1 , or any mixture thereof.4. The binder composition of claim 1 , wherein the unsaturated monomer and the polyphenolic compound are at least partially reacted with one another claim 1 , and wherein the binder composition comprises at least two unsaturated monomers.5. The binder composition of claim 1 , wherein the unsaturated monomer does not contain an aromatic ring.6. The binder composition of claim 1 , wherein the binder composition further comprises water in an amount of about 40 wt % to about 70 wt % claim 1 , based on a solids weight of the polyphenolic compound claim 1 , and wherein the binder composition comprises the unsaturated monomer in an amount of about 0.1 wt % to about 50 wt % claim 1 , based on the solids weight of the polyphenolic compound.7. The binder composition 1 claim 1 , wherein the unsaturated monomer comprises an unsaturated glycidyl ether claim 1 , and wherein the unsaturated glycidyl ether comprises vinyl glycidyl ether claim 1 , isopropenyl glycidyl ether claim 1 , ...

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01-01-2015 дата публикации

STRUCTURAL ADHESIVES

Номер: US20150000839A1
Автор: Czaplicki Michael
Принадлежит:

A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be moulded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals. 1. A structural adhesive composition that has the following properties:i. it is non-tacky to the touch at ambient temperature:ii. it is a flexible sold at a temperature in the range from ambient to 120° C.;iii. it crosslinks and develops adhesive properties at a temperature in the range 120° C. to 230° C.; andiv. it provides a shear strength in the range greater than 10 MPa after crosslinking and cooling to ambient temperature.2. The structural adhesive according to having a shear strength in the range greater than 15 MPa.3. The structural adhesive according to having a shear strength in the range greater than 20 MPa.4. The structural adhesive according to claim 1 , wherein the adhesive is in the form of pellets.5. The structural adhesive according to claim 1 , wherein the adhesive is in the form of a tape or strip.6. The structural adhesive according to claim 1 , wherein the adhesive is in the form of a moulded component.7. The structural adhesive according to claim 1 , wherein the adhesive is shaped by extrusion.8. The structural adhesive according to claim 7 , wherein the adhesive is in the form of a film.9. The structural adhesive according to claim 1 , wherein the adhesive has a degree of expansion of less than 100%.10. The structural according to claim 1 , wherein the adhesive has an elastic modulus of approximately 1 GPa or greater.11. The structural adhesive according to claim 1 , wherein the adhesive contains an epoxy resin.12. The structural adhesive according to containing between 2% and 75% by weight epoxy resin.13. The structural adhesive according to claim 1 , containing one or more of additional ingredients selected from:i) polymersii) blowing agent;iii) filler;iv) flow control materials,v) nano particles,vi) pigments;vii ...

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01-01-2015 дата публикации

CRASH-DURABLE ADHESIVE WITH ENHANCED STRESS DURABILITY

Номер: US20150001281A1
Принадлежит:

A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum. 1. A heat-curable structural adhesive comprisingA) at least one non-rubber-modified epoxy resin;B) a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin;C) at least one elastomeric toughener containing capped isocyanate groups;D) one or more epoxy curing agents;E) from 0.5 to 10 weight percent of a moisture scavenger, based on the total weight of the heat-curable structural adhesive; andF) a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin,and further wherein the elastomeric toughener and the rubber portion of the rubber-modified epoxy resin together constitute from 15 to 25% of the total weight of the heat-curable adhesive.2. The heat-curable structural adhesive of whicha) exhibits an impact shear strength of at least 20 N/mm as measured according to the ISO 11343 wedge impact method on 2 mm-thick aluminum 6111 alloy substrates after curing at 160° C. for 10 minutes,b) exhibits a storage modulus of at least 900 MPa at 50° C. as measured by dynamic mechanical analysis according to ASTM E2254-09; and/orc) ...

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07-01-2016 дата публикации

PNEUMATIC SAFETY TIRE

Номер: US20160001601A1
Автор: Oyama Yuji
Принадлежит: BRIDGESTONE CORPORATION

Provided is a pneumatic safety tire in which the durability is improved by improving the compression fatigue property of a carcass ply cord. 2. The pneumatic safety tire according to claim 1 , satisfying the following expressions (3) and (4):{'br': None, 'i': S', '+S', 'S, '0.20≦(23)/1≦1.50\u2003\u2003(3)'}{'br': None, 'i': ≦S', 'S', '+S, '02/(23)≦0.80\u2003\u2003(4).'}3. The pneumatic safety tire according to claim 1 , wherein an adhesive strength of the reinforcing cord of the carcass ply is 12 N or more per cord.4. The pneumatic safety tire according to claim 1 , wherein the carcass ply is folded back around the bead core from the inside to the outside of the tire claim 1 , and an folded-back end portion of the carcass ply is located on a tire radial direction inner side with respect to a maximum thickness portion of the side reinforcing rubber.5. The pneumatic safety tire according to claim 1 , wherein a height of the bead filler is 15 mm or less.6. The pneumatic safety tire according to claim 1 , wherein the carcass ply is folded back around the bead core from the inside to the outside of the tire claim 1 , and an folded-back end portion of the carcass ply is located at a height of 30 mm or less from a center of the bead core.7. The pneumatic safety tire according to claim 1 , wherein the reinforcing cord of the carcass ply is composed of a polyester fiber claim 1 , and an intermediate elongation of the reinforcing cord claim 1 , which is taken out from a product tire claim 1 , of the carcass ply in a crown portion under 66 N falls within 3.5 to 6.5%.8. The pneumatic safety tire according to claim 1 , wherein the reinforcing cord of the carcass ply is composed of an aramid fiber claim 1 , and an intermediate elongation of the reinforcing cord claim 1 , which is taken out from a product tire claim 1 , of the carcass ply in a crown portion under 66 N falls within 0.5 to 2.5%.9. The pneumatic safety tire according to claim 1 , wherein the cross-linkable functional ...

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07-01-2016 дата публикации

DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY

Номер: US20160002510A1
Принадлежит:

Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions. 1. A curable composition reaction products of which are controllably degradable upon exposure to a temperature condition greater than a temperature condition used to cure the composition , comprising:(a) a curable resin component;(b) a curative and(c) a diene/dienophile couple functionalized with at least two carboxylic acid groups.2. An electronic device comprising a semiconductor device and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected claim 1 , assembled using a curable composition according to as an underfill sealant between the semiconductor device and the circuit board or the semiconductor chip and the circuit board claim 1 , respectively claim 1 , wherein reaction products of the composition are capable of softening and losing their adhesiveness under exposure to temperature conditions in excess of those used to cure the composition.3. A method of sealing underfilling between a semiconductor device including a semiconductor chip mounted on a carrier substrate and a circuit board to which said semiconductor device is electrically connected or a semiconductor chip and a circuit board to which said semiconductor chip is electrically connected claim 1 , the steps of which comprise:{'claim-ref': {'@idref': 'CLM-00001', 'claims 1'}, '(a) dispensing into the underfilling between the semiconductor device and the circuit board or the semiconductor chip and the circuit board a composition according to ; and'}(b) exposing the composition as so ...

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04-01-2018 дата публикации

PAEK/PPSU/PES Compositions

Номер: US20180002524A1
Принадлежит: SOLVAY SPECIALTY POLYMERS USA, LLC

A composition [composition (C)] comprising from 1 to 90% by weight (wt. %) of at least one poly(aryl ether ketone) [(PAEK) polymer], from 1 to 25 wt. % of at least one polyphenylsulfone polymer [(PPSU) polymer], from 1 to 90 wt. % of at least one polyethersulfone polymer [(PES)polymer], and from 0.1 to 50 wt. % of at least one reinforcing filler, where all wt. % are based on the total weight of the composition (C) and the (PES) polymer has as melt flow rate(MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than 35 g/10 min. 115-. (canceled)18. The composition (C) of claim 16 , wherein the (PAEK) polymer is present in an amount ranging from 35 to 75 wt. % claim 16 , based on the total weight of the composition (C).19. The composition (C) of claim 16 , wherein the (PPSU) polymer is present in an amount ranging from 4 to 10 wt. % claim 16 , based on the total weight of the composition (C).21. The composition (C) of claim 16 , wherein the PES polymer is present in an amount ranging from 25 to 70 wt. % claim 16 , based on the total weight of the composition (C).22. The composition (C) of claim 16 , wherein the reinforcing filler is a glass fiber and is present in an amount less than or equal to 40 wt. % claim 16 , based on the total weight of the composition (C).23. The composition of claim 22 , wherein the glass fiber has a circular cross section and an elastic modulus of at least 76 GPa as measured according to ASTM C1557-03.24. The composition of claim 22 , wherein the glass fiber has a non-circular cross section and an elastic modulus of at least 76 GPa as measured according to ASTM C1557-03.25. The composition of claim 16 , wherein the (PAEK) polymer is polyetheretherketone (PEEK).26. The composition of claim 16 , wherein the PES polymer has a melt flow rate (MFR) at a temperature of 380° C. and under a load of 2.16 kg according to ASTM D1238 of greater than or equal to 55 g/10 min.27. The composition of claim 16 , ...

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07-01-2021 дата публикации

EPOXY ADHESIVE COMPOSITION

Номер: US20210002528A1
Принадлежит: Sekisui Chemical Co., Ltd.

The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5. 1. An epoxy adhesive composition comprising:a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group;an adhesive layer modifier; andan epoxy resin,the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0,the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.2. The epoxy adhesive composition according to claim 1 ,wherein the acid-modified group is a carboxyl group.3. The epoxy adhesive composition according to claim 1 ,wherein the modified polyvinyl acetal resin has the constitutional unit with an acid-modified group in a side chain.4. The epoxy adhesive composition according to claim 1 ,wherein the amount of the constitutional unit with an acid-modified group in the modified polyvinyl acetal resin is 0.01 to 10 mol %.5. The epoxy adhesive composition according to claim 1 ,wherein the modified polyvinyl ...

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07-01-2021 дата публикации

Product for preventing deterioration of adhesive layer and manufacturing method thereof

Номер: US20210002529A1
Принадлежит: Kunshan Liantao Electronics Co Ltd

The present disclosure provides a product for preventing the deterioration of an adhesive layer and a method for manufacturing the product. The product comprises a first product housing, a second product housing, an adhesive layer, and a protective layer. The second product housing is opposite to the first product housing. A gap exists between the second product housing and the first product housing. The adhesive layer is disposed in the gap between the first product housing and the second product housing, adhering to the first product housing and the second product housing. The protective layer is disposed on the adhesive layer. The protective layer is disposed in the gap, covering the outer surface of the adhesive layer. The protective layer bonds and cross-links to the adhesive layer chemically.

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03-01-2019 дата публикации

POLARIZING PLATE USING ADHESIVE COMPOSITION AND OPTICAL MEMBER COMPRISING THE SAME

Номер: US20190002745A1
Принадлежит:

Disclosed are an adhesive composition for polarizing plates, a polarizing plate using the same, a method for preparing the same, and an optical member including the same. The adhesive composition includes (A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator. 1. A polarizing plate comprising a polarizer and a protective film stacked on one or both sides of the polarizer via an adhesive layer ,wherein the adhesive layer comprises:(A) a (meth)acrylic radical compound, (B) a cationic epoxy compound, (C) a phenoxy resin, and (D) a photoinitiator,wherein the polarizer has a maximum shrinkage length of about 2 mm or less at one end thereof when the polarizing plate is dipped in water having a constant temperature of 60° C. for 2 hours.2. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin comprises a non-curable phenoxy resin.3. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin has a repeated structure of bisphenol A.5. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin has a weight average molecular weight of about 30 claim 1 ,000 g/mol to about 60 claim 1 ,000 g/mol.6. The polarizing plate according as claimed in claim 1 , wherein the (C) phenoxy resin is present in an amount of about 0.1 parts by weight to about 5 parts by weight based on 100 parts by weight of (A)+(B)+(C).7. The polarizing plate according as claimed in claim 1 , wherein a weight ratio of the (A) (meth)acrylic radical compound: the (B) cationic epoxy compound ranges from about 10:90 to about 50:50 based on 100 parts by weight of (A)+(B).8. The polarizing plate according as claimed in claim 1 , wherein the (A) (meth)acrylic radical compound comprises a (meth)acrylate containing C-Calkyl group having at least one hydrophilic group.9. The polarizing plate according as claimed in claim 1 , wherein the (B) cationic epoxy compound comprises an ...

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20-01-2022 дата публикации

ULTRAVIOLET RADIATION-CURED PRESSURE SENSITIVE ADHESIVES FROM PLANT OILS OR ANIMAL FATS

Номер: US20220017788A1
Автор: Li Anlong, Li Kaichang
Принадлежит: Oregon State University

A pressure sensitive adhesive construct comprising: 1. A pressure sensitive adhesive construct comprising:(A) a backing substrate; and(B) a pressure sensitive adhesive composition disposed on the backing substrate, wherein the pressure sensitive adhesive composition includes an ultraviolet radiation-cured polymer made from:(a) at least one epoxidized plant oil, at least one epoxidized animal fat, or a mixture thereof;(b) at least one dicarboxylic acid, at least one polycarboxylic acid, or a mixture thereof; and(c) at least one compound that contains both one carbon-carbon double bond (C═C) and at least one carboxylic acid group.2. The construct of claim 1 , wherein component (a) is monocarboxylic acid-modified epoxidized soybean oil.3. The construct of claim 2 , wherein the monocarboxylic acid modifier is formic acid claim 2 , acetic acid claim 2 , propionic acid claim 2 , butyric acid claim 2 , valeric acid claim 2 , caproic acid claim 2 , enanthic acid claim 2 , caprylic acid claim 2 , pelargonic acid claim 2 , capric acid claim 2 , undecylic acid claim 2 , lauric acid claim 2 , tridecylic acid claim 2 , myristic acid claim 2 , pentadecylic acid claim 2 , palmitic acid claim 2 , margaric acid claim 2 , stearic acid claim 2 , nonadecylic acid claim 2 , arachildic acid claim 2 , heneicosylic acid claim 2 , behenic acid claim 2 , tricosylic acid claim 2 , and lignoceric acid claim 2 , naphthalene acid claim 2 , oleic acid claim 2 , linoleic acid claim 2 , myristoleic acid claim 2 , palmitoleic acid claim 2 , sapienic acid claim 2 , elaidic acid claim 2 , vaccenic acid claim 2 , linoelaidic acid claim 2 , linolenic acid claim 2 , arachidonic acid claim 2 , eicosapentaenoic acid claim 2 , erucic acid claim 2 , docosahexanenoic acid claim 2 , abietic acid or tall oil rosin that contains abietic acid claim 2 , benzoic acid claim 2 , phenylacetic acid claim 2 , 1-naphthaleneacetic acid claim 2 , 2-naphthaleneacetic acid claim 2 , 1-naphthoic acid claim 2 , 2-naphthoic ...

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14-01-2021 дата публикации

ADHESIVE FOR ENDOSCOPE, CURED PRODUCT, ENDOSCOPE, AND METHOD FOR PRODUCING ENDOSCOPE

Номер: US20210007579A1
Принадлежит: FUJIFILM Corporation

Provided are a two-component adhesive for an endoscope and a cured product thereof, the adhesive having a base resin and a curing agent. 1. A two-component adhesive for an endoscope , the adhesive comprising a base resin and a curing agent ,wherein the base resin contains an epoxy resin (A), and the epoxy resin (A) includes an epoxy resin (a) having an average degree of polymerization of 2 or more.2. The adhesive for an endoscope according to claim 1 , wherein the epoxy resin (a) is at least one of (a1) to (a4):(a1) an epoxy resin having a polyester structure,(a2) an epoxy resin having a polyurethane structure,(a3) an epoxy resin having an acrylonitrile-derived constituent and a 1,3-butadiene-derived constituent, and(a4) an epoxy resin having a polybutadiene structure.3. The adhesive for an endoscope according to claim 1 , wherein a content of the epoxy resin (a) in the epoxy resin (A) is 5 to 95 mass %.4. The adhesive for an endoscope according to claim 1 , wherein the curing agent includes a polyamine compound (B).5. The adhesive for an endoscope according to claim 4 , wherein the polyamine compound (B) is polyamidoamine or a polyamine compound represented by general formula (I) or (II):{'br': None, 'sub': 2', '2', 'n, 'sup': '1', 'HN—L—(—NH)\u2003\u2003General formula (I)'}{'br': None, 'sub': 2', '2, 'sup': 3', '2', '4, 'HN—L—L—L—NH\u2003\u2003General formula (II)'}{'sup': '1', 'in general formula (I), n represents an integer of 1 to 3, and Lrepresents an aliphatic or alicyclic hydrocarbon group with a valence of n+1, an aromatic hydrocarbon group with a valence of n+1, a group with a valence of n+1 formed of a combination of an aliphatic or alicyclic hydrocarbon group and an aromatic hydrocarbon group, or a group with a valence of n+1 having an aliphatic hydrocarbon chain into which at least one oxygen or nitrogen atom is incorporated, and'}{'sup': 2', '3', '4, 'sub': '2', 'in general formula (II), Lrepresents an alkylene group, —O—, —SO—, or a divalent group ...

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12-01-2017 дата публикации

FURAN-BASED AMINES AS CURING AGENTS FOR EPOXY RESINS IN LOW VOC APPLICATIONS

Номер: US20170009005A1
Принадлежит: SIKA TECHNOLOGY AG

A room temperature or low temperature curable epoxy formulation including a) an epoxy component including at least one epoxy resin and b) a hardener component including at least one compound of formula (I) 3. The room temperature or low temperature curable epoxy formulation according to claim 2 , wherein claim 2 , in formula (II) claim 2 , Rand Rare both H (IIa); Ris H and Ris methyl (IIb); Ris H and Ris Phenyl (IIc); Rand Rare both methyl (IId); Ris methyl and Ris ethyl (IIe); or Ris methyl and Ris isobutyl (IIf).4. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation has a TVOC content after 3 days (TVOC) of less than 50 mg/m claim 1 , when measured as defined in the AgBB evaluation scheme of 2010.5. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation has a benzyl alcohol content of less than 5% by weight.6. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the amine hydrogen to epoxy equivalent ratio is 0.8 to 1.2.7. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the hardener component further comprises at least one further polyamine claim 1 , and/or at least one epoxy-amine adduct thereof claim 1 , and/or at least one accelerator.8. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation is an epoxy coating composition claim 1 , an epoxy flooring material claim 1 , an epoxy adhesive claim 1 , an epoxy grout or potting material claim 1 , an epoxy sealant claim 1 , a waterproofing coating composition or an epoxy composite material.911-. (canceled)12. A method for coating or adhering substrates or for preparing composites using a room temperature or low temperature curable epoxy formulation according to claim 1 , the method comprisinga) mixing the epoxy component and the ...

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12-01-2017 дата публикации

RESIN COMPOSITION

Номер: US20170009071A1
Принадлежит: Denka Company Limited

A resin composition is provided that is capable of inhibiting degradation of the organic EL device. The resin composition, includes: (A) an alicyclic epoxy compound; (B) a bisphenol A epoxy resin; (C) a bisphenol F epoxy resin; and (D) a photocationic polymerization initiator. The bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A) and the resin composition has a moisture content of 1000 ppm or less. Alternatively, the resin composition may further include a filler (H) and may have a moisture content of 50 ppm or more. 1. A resin composition , comprising:(A) an alicyclic epoxy compound;(B) a bisphenol A epoxy resin;(C) a bisphenol F epoxy resin; and(D) a photocationic polymerization initiator, whereinthe bisphenol A epoxy resin (B) and the bisphenol F epoxy resin (C) are compounds not having the alicyclic epoxy compound (A), andthe resin composition satisfies any one of the following characteristics of the items (i) and (ii):(i) the resin composition has a moisture content of 1000 ppm or less, and(ii) the resin composition further comprises a filler (H) and has a moisture content of 50 ppm or more.2. (canceled)3. The resin composition according to claim 1 , further comprising a stabilizer (E).4. The resin composition according to claim 2 , wherein the stabilizer (E) is an ether compound.5. The resin composition according to claim 3 , wherein the stabilizer (E) is a cyclic ether compound.6. The resin composition according to claim 1 , wherein the alicyclic epoxy compound (A) does not have an aromatic group.7. The resin composition according to claim 1 , further comprising a silane coupling agent (F).8. The resin composition according to claim 1 , further comprising a sensitizer (G).9. The resin composition according to claim 1 , wherein the resin composition has a moisture content from not less than 50 ppm and not more than 700 ppm.10. The resin composition according to claim 1 , wherein the resin ...

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12-01-2017 дата публикации

ADHESIVE COMPOSITION FOR POLARIZATION-MAINTAINING OPTICAL FIBER

Номер: US20170009114A1
Принадлежит:

An object of the present invention is to provide an adhesive composition for a polarization-maintaining optical fiber exhibiting a high extinction ratio. The adhesive composition for a polarization-maintaining optical fiber of the present invention contains: a compound (A) having an aromatic ring and a reactive silicon-containing group; a glycidyl compound (B); and a compound (C) having a silsesquioxane ladder structure. 1. An adhesive composition for a polarization-maintaining optical fiber comprising: a compound (A) having an aromatic ring and a reactive silicon-containing group; a glycidyl compound (B); and a compound (C) having a silsesquioxane ladder structure.2. The adhesive composition for a polarization-maintaining optical fiber according to claim 1 , further comprising an imidazole compound (D).3. The adhesive composition for a polarization-maintaining optical fiber according to claim 1 , wherein the reactive silicon-containing group is a hydrolyzable silicon-containing group.4. The adhesive composition for a polarization-maintaining optical fiber according to claim 1 , wherein the compound (A) is obtained by reacting an epoxy compound (e) with a compound (f) having a reactive group that reacts with the epoxy group contained in the epoxy compound (e).5. The adhesive composition for a polarization-maintaining optical fiber according to claim 4 , wherein the epoxy compound (e) is an aromatic epoxy compound claim 4 , and the compound (f) is an iminosilane compound.6. The adhesive composition for a polarization-maintaining optical fiber according to claim 4 , wherein the epoxy compound (e) is an epoxysilane compound claim 4 , and the compound (f) is an aromatic amine compound.7. The adhesive composition for a polarization-maintaining optical fiber according to claim 4 , whereinthe compound (f) has an amino group or an imino group, andthe number of equivalent of active hydrogen in the amino group or the imino group is from 0.1 to 1.0 equivalent relative to the ...

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14-01-2016 дата публикации

WATER SOLUBLE INK-JET COMPOSITION FOR 3D PRINTING

Номер: US20160009917A1
Принадлежит:

A material composition, which may be a support material, for three-dimensional (3D) inkjet printing is disclosed. The material composition may comprise a glycol polymer, a low molecular weight polar substance and a surface-active agent. The glycol polymer may be polyethylene glycol (PEG) having a molecular weight between about 1000 and about 6000 and the low molecular weight polar substance may be 1,8-octanediol. 1. A material composition for three-dimensional inkjet printing comprising:polyethylene glycol (PEG) having a molecular weight between about 1000 and about 6000; and1,8-octanediol, wherein the composition has a melting point between 45° C.-70° C. and solidifies upon cooling.2. The material composition according to claim 1 , further comprises a surface active agent.3. The material composition according to claim 1 , wherein the material composition is water-miscible before hardening and water-soluble after hardening.4. The material composition according to claim 1 , wherein the amount of the PEG is 10-70% w/w of the material composition.5. The material composition according to claim 1 , wherein the amount of the 1 claim 1 ,8-octanediol is 30-90% w/w of the material composition.6. The material composition according to claim 2 , wherein the amount of the surface active agent is about 0.5% w/w of the material composition.7. The material composition according to claim 1 , wherein the molecular weight of the PEG is about 1500.8. The material composition according to claim 1 , wherein the material composition is a soluble support material for three-dimensional inkjet printing.9. The material composition according to claim 1 , wherein the material composition is soluble in water or ethyl alcohol or N-methyl-2-pyrrolydone or a combination thereof.10. The material composition according to claim 2 , wherein the molecular weight of the PEG is 1500 claim 2 , the amount of the PEG is about 25% w/w of the material composition and the amount of the 1 claim 2 ,8-OctaneDiol ...

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14-01-2021 дата публикации

HIGH MODULUS, TOUGHENED ONE-COMPONENT EPOXY STRUCTURAL ADHESIVES WITH HIGH ASPECT RATIO FILLERS

Номер: US20210009871A1
Принадлежит:

One-component toughened epoxy structural adhesives contain fibrous mineral fillers that have an aspect ratio of ≥6. The presence of the fibrous filler leads to a significant increase in elastic modulus while having little if any adverse effect on other properties such as dynamic impact peel resistance. 1. A one-component epoxy structural adhesive comprising in admixture:A) at least one epoxy resin;B) a reactive toughener containing urethane and/or urea groups and capped isocyanate groups;C) one or more epoxy curing agents;D) 1 to 40 weight percent, based on the total weight of the epoxy structural adhesive, of a mineral filler in the form of fibers having a diameter of 3 μm to 25 μm and an aspect ratio of at least 6, wherein the mineral filler in the form of fibers is wollastonite, and the diameter is D50 as measured by microscopy, andE) one or more epoxy curing catalysts,wherein the curing agent(s) and epoxy curing catalyst(s) are selected together such that the structural adhesive exhibits a curing temperature of at least 60° C., wherein the curing temperature is the lowest temperature at which the structural adhesive achieves at least 30% of its lap shear strength according to DIN ISO 1465 at full cure within 2 hours.2. The one-component epoxy structural adhesive of claim 1 , which contains 5 to 20 weight percent of component D).3. The one-component epoxy structural adhesive of claim 2 , wherein the aspect ratio of the mineral filler in the form of fibers has an aspect ratio of at least 9.4. The one-component epoxy structural adhesive of claim 2 , which contains 40 to 70% by weight of component A) claim 2 , and component A) includes one or more bisphenol diglycidyl ethers having an epoxy equivalent weight of 170 to 400.5. The one-component epoxy structural adhesive of claim 2 , which contains 10 to 30 weight percent of the toughener.6. The one-component epoxy structural adhesive of claim 2 , wherein the isocyanate groups of the toughener are capped with a phenol ...

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10-01-2019 дата публикации

ADHESIVE SHEET SET AND METHOD FOR PRODUCING PRODUCT

Номер: US20190010361A1
Принадлежит: Dai Nippon Printing Co., Ltd.

An adhesive sheet set including a pair of adhesive sheets respectively including an adhesive layer capable of being cured and adhered by being in contact with each other, and a method for producing a product using the same. An adhesive sheet set including a first adhesive sheet and a second adhesive sheet, wherein the first adhesive sheet includes a first separator and a first adhesive layer provided on one surface of the first separator, the second adhesive sheet includes a second separator and a second adhesive layer provided on one surface of the second separator, and the first adhesive sheet and the second adhesive sheet are configured to be cured and adhered by the first adhesive layer and the second adhesive layer being in contact with each other. 129-. (canceled)30. An adhesive sheet set comprising a first adhesive sheet and a second adhesive sheet ,wherein the first adhesive sheet includes a first separator and a first adhesive layer provided on one surface of the first separator,the second adhesive sheet includes a second separator and a second adhesive layer provided on one surface of the second separator, andthe first adhesive sheet and the second adhesive sheet are configured to be cured and adhered by the first adhesive layer and the second adhesive layer being in contact with each other.31. The adhesive sheet set according to claim 30 , wherein a tack force of the first adhesive layer and a tack force of the second adhesive layer are in a range of 0.05 N/in or more to less than 1 N/in claim 30 , respectively.32. The adhesive sheet set according to claim 30 , wherein claim 30 , among the first adhesive layer and the second adhesive layer claim 30 , a tack force of one adhesive layer is more than a tack force of another adhesive layer.33. The adhesive sheet set according to claim 32 , wherein a tack force of the one adhesive layer is in a range of 5 N/in or more to 50 N/in or less claim 32 , anda tack force of the another adhesive layer is in a range of ...

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10-01-2019 дата публикации

Hydraulic fluid and fuel resistant sealants

Номер: US20190010370A1
Автор: Renhe Lin, Weibin Cui
Принадлежит: PRC Desoto International Inc

Compositions that are resistant to hydraulic fluid and aviation fuel contain sulfur-containing prepolymers and solvent-resistant organic fillers. The compositions are useful in aerospace sealant applications.

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09-01-2020 дата публикации

THERMOPLASTIC COMPOSITIONS HAVING GOOD DIELECTRIC AND DUCTILITY PROPERTIES

Номер: US20200010674A1
Автор: Liu Xing, Shan Wei, WANG Jian
Принадлежит:

A thermoplastic composition includes from 29.9 wt % to 84.9 wt % of a base resin including poly(p-phenylene oxide) (PPO), polystyrene (PS) and an impact modifier; from 15 wt % to 70 wt % of a dielectric filler; and from 0.1 wt % to 10 wt % of an impact promoter including a polycarbonate-siloxane copolymer, a polyolefin-siloxane copolymer, or a combination thereof. The thermoplastic composition has a dielectric constant (Dk) of from 3.0-8.0 between 1 and 5 gigahertz (GHz) and a dissipation factor (Df) of less than 0.003 between 1 and 5 GHz. Articles including the thermoplastic composition, and in particular telecommunications devices, are also described. 2. The thermoplastic composition according to claim 1 , wherein the base resin comprises from 20 wt % to 85 wt % PPO claim 1 , from 10 wt % to 50 wt % PS and from 5 wt % to 30 wt % impact modifier.3. The thermoplastic composition according to claim 1 , wherein the PS comprises general purpose PS claim 1 , high impact PS or a combination thereof.4. The thermoplastic composition according to claim 1 , wherein the impact modifier comprises styrene-ethylene/butylene-styrene (SEBS) claim 1 , syndiotactic polystyrene (SPS) claim 1 , styrene-ethylene-propylene-styrene (SEPS) claim 1 , or a combination thereof.5. The thermoplastic composition according to claim 1 , wherein the dielectric filler comprises a ceramic filler.6. The thermoplastic composition according to claim 5 , wherein the ceramic filler comprises TiO claim 5 , BaTiO claim 5 , or a combination thereof.7. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition comprises from 0.5 wt % to 5 wt % of the impact promoter.8. The thermoplastic composition according to claim 1 , wherein the impact promoter comprises from 40 wt % to 80 wt % siloxane units.9. The thermoplastic composition according to claim 1 , wherein the thermoplastic composition has an improved ductility as compared to that of a substantially identical reference ...

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09-01-2020 дата публикации

SEGMENTED FILM ADHESIVE, METHOD OF MAKING THE ADHESIVE AND METHOD OF APPLYING THE ADHESIVE TO A NON-PLANAR SURFACE

Номер: US20200010745A1
Принадлежит: The Boeing Company

A method of applying an adhesive to a non-planar surface. The method includes providing a segmented film adhesive. The segmented film adhesive comprises: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments. The segmented film adhesive is positioned on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface. The liner is removed from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend. 1. A method of applying an adhesive to a non-planar surface , the method comprising:providing a segmented film adhesive, the segmented film adhesive comprising: (i) a liner; and (ii) an adhesive layer on the liner, the adhesive layer comprising a plurality of contiguous, discrete adhesive segments;positioning the segmented film adhesive on a non-planar surface of a first adherend so that a first portion of the discrete adhesive segments are in contact with the non-planar surface and a second portion of the discrete adhesive segments are not in contact with the non-planar surface; andremoving the liner from the non-planar surface, wherein only the first portion of the discrete adhesive segments remain on the non-planar surface of the first adherend.2. The method of claim 1 , wherein after removing the liner from the non-planar surface claim 1 , the second portion of the discrete adhesive segments remain on the liner.3. The method of claim 1 , further comprising heating the discrete adhesive segments remaining on the non-planar surface of the first adherend to a sufficient temperature to melt or cure the adhesive.4. The method of claim 1 , further comprising positioning a second adherend in contact with the discrete adhesive ...

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11-01-2018 дата публикации

Adhesive/Sealing Material for an Electrowetting Device

Номер: US20180011311A1
Принадлежит:

Subject matter disclosed herein relates to improving a contact diameter of an adhesive/sealing material on surfaces of substrates by altering rheological properties of the adhesive/sealing material. An electrowetting display device comprises a first substrate and a second substrate, a first fluid and a second fluid disposed between the first substrate and the second substrate, wherein the first fluid is immiscible with the second fluid. An adhesive/sealing material comprising UV curable epoxy glue is in contact with the second fluid and couples the second substrate to the first substrate. The adhesive/sealing material further comprises silica particles in a range of 1-6% mass fraction of silica that alter rheological properties of the UV curable epoxy glue. 1. A method of sealing an electrowetting device , wherein the electrowetting device comprises a first fluid and a second fluid disposed between a first substrate and a second substrate , the first fluid being immiscible with the second fluid , the method comprising:providing the first substrate;providing the second substrate;applying an adhesive/sealing material on at least a portion of the first substrate or at least a portion of the second substrate, wherein the adhesive/sealing material includes particles that alter rheological properties of the adhesive/sealing material; andcoupling the first substrate to the second substrate via the adhesive/sealing material such that the adhesive/sealing material is in contact with the second fluid.2. The method of claim 1 , wherein the adhesive/sealing material includes particles comprising one or more of (i) clay particles in a range of 0-5% mass fraction of clay particles or (ii) ceramic particles in a range of 0-5% mass fraction of ceramic particles.3. The method of claim 2 , wherein the adhesive/sealing material includes one or more of (i) clay particles having a size in a range of 6-39 nanometers or (ii) ceramic particles having a size in a range of 6-39 nanometers.4. ...

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12-01-2017 дата публикации

PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WORK PRODUCT MANUFACTURING METHOD

Номер: US20170011949A1
Принадлежит:

A protective film forming film is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film and a protective film formed from the protective film forming film is in a range of 1 MPa·% to 250 MPa·%. According to such a protective film forming film , the protective film forming film or the protective film formed from the protective film forming film can be suitably divided in an expanding process performed on a workpiece when the workpiece is divided to obtain a work product. 1. A protective film forming film ,wherein the product of the breaking stress (MPa) measured at a measurement temperature of 0° C. and the breaking strain (unit: %) measured at a measurement temperature of 0° C. in at least one of the protective film forming film and a protective film formed from the protective film forming film is in a range of 1 MPa·% to 250 MPa·%.2. The protective film forming film according to claim 1 , wherein the light transmittance at a wavelength of 1064 nm is 30% or greater.3. A protective film forming sheet claim 1 , comprising:a dicing sheet which includes a base material and an adhesive layer laminated on one surface side of the base material; and{'claim-ref': [{'@idref': 'CLM-00001', 'claim 1'}, {'@idref': 'CLM-00002', '2'}], 'the protective film forming film according to or which is laminated on the adhesive layer side of the dicing sheet.'}4. The protective film forming sheet according to claim 3 , wherein the light transmittance at a wavelength of 1064 nm is 30% or greater.5. A method of manufacturing a work product claim 3 , comprising:a first modified layer forming process of forming a modified layer in the inside of a workpiece by irradiating the workpiece with laser beams in the infrared region such that the laser beams are focused on a focal point set in the inside of the workpiece ...

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15-01-2015 дата публикации

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

Номер: US20150014842A1
Принадлежит:

A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of encapsulating at least part of the connection portions with an adhesive for a semiconductor containing a compound having a group represented by the following formula (1-1) or (1-2): 2. The manufacturing method for a semiconductor device according to claim 1 , wherein the compound is a compound having two carboxyl groups.5. The manufacturing method for a semiconductor device according to claim 4 , wherein mis an integer of 0 to 8 claim 4 , and mis an integer of 0 to 7.6. The manufacturing method for a semiconductor device according to claim 1 , wherein the compound has a melting point of 150° C. or less.7. The manufacturing method for a semiconductor device according to claim 1 , wherein the electron-donating group is an alkyl group having 1 to 10 carbon atoms.8. The manufacturing method for a semiconductor device according to claim 1 , wherein the adhesive for a semiconductor further comprises a polymer component having a weight average molecular weight of 10000 or more.9. The manufacturing method for a semiconductor device according to claim 1 , wherein the adhesive for a semiconductor has a film shape.10. A semiconductor device prepared by the manufacturing method according to . The present invention relates to a manufacturing method for a semiconductor device using an adhesive for a semiconductor, and a semiconductor device prepared by the manufacturing method.To connect a semiconductor chip to a substrate in the related art, a wire bonding method using metal thin lines such as gold wires is widely used. To meet requirements for e.g. higher functions, larger scale integration, and higher speed of semiconductor devices, ...

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03-02-2022 дата публикации

INSULATING MEDIUM RUBBER FILM AND PRODUCTION METHOD THEREOF AND MULTI-LAYER PRINTED-CIRCUIT BOARD

Номер: US20220033642A1
Автор: HE QIONG, He Yueshan, Liu Fei
Принадлежит: SHENZHEN NEWCCESS INDUSTRIAL CO., LTD.

An insulating medium rubber film and a production method thereof, and a multi-layer printed-circuit board. The insulating medium rubber film includes a release film and an insulating medium layer arranged on the surface of the release film, where materials of the insulating medium layer include saturated polyester resin, amino resin or blocked isocyanate, epoxy resin, a curing agent, inorganic filler and a curing accelerator. According to the insulating medium rubber film and the production method thereof and the multi-layer printed-circuit board, by introducing the saturated polyester resin component into an epoxy resin composition, the produced insulating medium rubber film has the advantages that a dielectric constant is low, a dielectric dissipation factor is low, thermal expansion is not liable to happen, and adhesion is good. 110-. (canceled)11. An insulating medium rubber film , comprising: a release film and an insulating medium layer arranged on a surface of the release film , and a material of the insulating medium layer comprises saturated polyester resin , amino resin or blocked isocyanate , epoxy resin , curing agent , inorganic filler and curing accelerator.12. The insulating medium rubber film according to claim 11 , wherein the material of the insulating medium layer comprises claim 11 , by weight claim 11 , 5-30 units of saturated polyester resin claim 11 , 0.5-3 units of amino resin or blocked isocyanate claim 11 , 45-75 units of epoxy Resin claim 11 , 1-25 units of the curing agent claim 11 , 1-100 units of the inorganic filler and 0.1-5 units of the curing accelerator.14. The insulating medium rubber film according to claim 11 , wherein the amino resin is a resin formed by a condensation polymerization of melamine or benzoquanmine claim 11 , with formaldehyde and organic alcohol.15. The insulating medium rubber film according to claim 11 , wherein the blocked isocyanate is selected from the group consisting of phenol-blocked HDI claim 11 , MDI ...

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09-01-2020 дата публикации

VEHICULAR CAMERA WITH ADHESIVELY BONDED CONSTRUCTION

Номер: US20200014827A1
Принадлежит:

A vehicular camera includes a lens accommodated in a lens barrel, a lens holder that accommodates at least part of the lens holder, and a printed circuit board with an imager disposed thereat. After the lens is optically aligned with the imager, the adhesive is initially curable to an initially-cured state in an initial curing process for an initial-cure time period. The initially-cured adhesive is further curable to a further-cured state in a secondary curing process for a further-cure time period that is longer than the initial-cure time period. As further cured, the further-cured adhesive maintains optical alignment of the lens with the imager for use of the vehicular camera in a vehicle. The further-cured adhesive maintains at least 70% strength of bond after being exposed for 1000 hours to a temperature of 85 degrees Celsius and a humidity of 85% RH. 1. A vehicular camera , said vehicular camera comprising:a lens comprising a plurality of optical elements, wherein the lens is accommodated in a lens barrel, and wherein the lens barrel comprises a cylindrical portion;a lens holder comprising a cylindrical passageway that accommodates at least a portion of the cylindrical portion of the lens barrel;a printed circuit board;an imager disposed at the printed circuit board;a flexible electrical ribbon cable with one end electrically connecting at the printed circuit board and with another distal end electrically terminating at an electrical connector of the flexible electrical ribbon cable;wherein said vehicular camera utilizes an adhesive to hold the lens optically aligned with the imager;wherein the adhesive is initially curable in an initial radiation curing process for an initial-cure time period of less than 10 seconds, and wherein the initially-cured adhesive is further curable to a further-cured strength in a secondary curing process;wherein the adhesive is initially cured via the initial radiation curing process after the lens is optically aligned with the ...

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15-01-2015 дата публикации

SHAPE-MEMORY MATERIAL BASED ON A STRUCTURAL ADHESIVE

Номер: US20150017435A1
Принадлежит: SIKA TECHNOLOGY AG

A composition including at least one curable structural adhesive, and at least one chemically crosslinked elastomer on the bases of a silane-functional polymer, wherein the elastomer is in the form of an interpenetrating polymer network in the structural adhesive. The composition can be used to form a shape-memory material and is suitable for reinforcing cavities in structural components such as, for example, in automobile bodies. 1. A composition , comprising:at least one curable structural adhesive; andat least one chemically crosslinked elastomer formed from a silane-functional polymer.2. The composition according to claim 1 , wherein the chemically crosslinked elastomer is present as an interpenetrating polymer network in the structural adhesive.3. The composition according to claim 1 , wherein the silane-functional polymer is obtained by:a reaction of a silane which has at least one group that is reactive with isocyanate groups, with a polyurethane polymer containing isocyanate groups;a reaction of an isocyanatosilane with a polymer that has functional end groups that are reactive with isocyanate groups; ora hydrosilylation reaction of polymers having terminal double bonds.4. The composition according to claim 1 , wherein the curable structural adhesive is a heat-curing epoxy resin composition claim 1 , comprising at least one epoxy resin A and at least one curing agent B for epoxy resins which is activated by elevated temperature.5. The composition according to claim 1 , wherein the composition is obtained by a process comprising:mixing at least one curable structural adhesive with at least one silane-functional polymer; andcrosslinking of the silane-functional polymer in the mixture to form an elastomer.6. The composition according to claim 5 , wherein the silane-functional polymer is crosslinked by reaction of the silane groups with water.7. The composition according to claim 1 , wherein the amount of curable structural adhesive is 50 to 95 wt % claim 1 , ...

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15-01-2015 дата публикации

ADHESIVE COMPOSITION FOR POLARIZING PLATE, ADHESIVE FILM FOR POLARIZING PLATE COMPRISING THE SAME, POLARIZING PLATE COMPRISING THE SAME AND DISPLAY DEVICE COMPRISING THE SAME

Номер: US20150017448A1
Принадлежит:

An adhesive composition for a polarizing plate has good initial curing and an adhesive property. The adhesive composition includes (A) a polymerizable functional group-containing monomer capable of providing an anchor effect; (B) an epoxy group-containing compound; (D) a photoacid generator; and (E) at least one of a photopolymerization initiator and a photosensitizer. 1. An adhesive composition for a polarizing plate , comprising:(A) a polymerizable functional group-containing monomer capable of providing an anchor effect;(B) an epoxy group-containing compound;(D) a photoacid generator; and(E) at least one of a photopolymerization initiator and a photosensitizer.2. The adhesive composition of claim 1 , wherein (A) the polymerizable functional group-containing monomer capable of providing an anchor effect comprises (A1) a polymerizable functional group-containing macromonomer or (A2) an allyl-group-and-hydroxyl-group-containing (meth)acrylate monomer.3. The adhesive composition of claim 2 , wherein the adhesive composition comprises (A1) the polymerizable functional group-containing macromonomer in an amount of about 0.5 parts by weight to about 30 parts by weight claim 2 , (B) the epoxy group-containing compound in an amount of about 40 parts by weight to about 99.5 parts by weight claim 2 , (C) the (meth)acrylic-based monomer in an amount of about 0 parts by weight to about 59.5 parts by weight claim 2 , (D) the photoacid generator in an amount of about 1 part by weight to about 7 parts by weight claim 2 , and (E) the at least one of the photopolymerization initiator and the photosensitizer in an amount of about 0.1 parts by weight to about 7 parts by weight claim 2 , with respect to 100 parts by weight of (A)+(B)+(C).4. The adhesive composition of claim 2 , wherein the adhesive composition comprises (A2) the allyl-group-and-hydroxyl-group-containing (meth)acrylate monomer in an amount of about 20 parts by weight to about 70 parts by weight claim 2 , (B) the epoxy ...

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