Soldering apparatus

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

Jig for round solder ball attachment

Disclosed herein is a jig for solder ball attachment capable of sensing whether missing balls occur by electrical sensing using an electrical sensor structure in which a conductive thin film is embedded in the jig and electrically sensing whether abnormal solder balls, for example, large ball/small ball/ball size are attached, without confirming whether abnormal solder balls, for example, large ball/small ball/ball size are attached by vision one by one, thereby shortening operating time and improving workability.

Inert environment enclosure

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Device for supplying an inert gas to a wave soldering installation

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

Apparatus And Method For Providing An Inerting Gas During Soldering

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap. 1. An enclosure for providing an inerting gas during soldering of a work piece comprising:a base comprising an interior volume in fluid communication with an inerting gas source,a neck comprising an interior volume in fluid communication with the interior volume of the base and an opening,a cap proximal to the opening, anda tube comprising one or more openings for the flow of the inerting gas therethrough, wherein the tube resides within the base and is in fluid communication with the inerting gas source;wherein the inerting gas travels through the tube into the interior volume of the base and neck and out through the opening.2. The enclosure of claim 1 , wherein the neck further comprises one or more holes along its surface.3. An apparatus for providing an inerting gas during soldering of a work piece claim 1 , the apparatus comprising:at least one groove on the bottom of the apparatus for placing onto at least one edge of a solder reservoir, wherein the solder reservoir contains molten solder and wherein at least one side wall of the groove and at least one wall of the apparatus define a chamber outside of the solder reservoir;at least one opening on the ...

SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE SAME

Disclosed herein is a solder bump forming apparatus including: a flux dispenser dispensing a flux to a processing substrate; a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; and driver driving the flux dispenser and the solder dispenser. 1. A solder bump forming apparatus comprising:a flux dispenser dispensing a flux to a processing substrate;a solder dispenser dispensing a solder to the processing substrate to which the flux is applied while moving following the flux dispenser; anddriver driving the flux dispenser and the solder dispenser.2. The solder bump forming apparatus according to claim 1 , wherein the flux dispenser includes a first temperature controller heating the flux to a preset active temperature.3. The solder bump forming apparatus according to claim 2 , wherein a heating or cooling temperature of the first temperature controller is 140 to 210° C.4. The solder bump forming apparatus according to claim 1 , wherein the solder dispenser includes a second temperature controller heating the solder to a preset temperature claim 1 , anda heating temperature of the second temperature controller is controlled so as to satisfy an active temperature of the flux in the flux dispenser as well as melt the solder.5. The solder bump forming apparatus according to claim 4 , wherein the heating temperature of the second temperature controller is 170 to 230° C.6. The solder bump forming apparatus according to claim 1 , further comprising a heat insulator provided between the flux dispenser and the solder dispenser to block heat of the solder dispenser from being transferred to the flux dispenser.7. The solder bump forming apparatus according to claim 1 , further comprising a discharger discharging a flux vaporized on the processing substrate to the outside between the flux dispenser and the solder dispenser.8. The solder bump forming apparatus according to claim 7 , wherein the ...

Solder bump forming apparatus and soldering facility including the same

Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

SOLDER BALL SUPPLYING APPARATUS

Disclosed herein is a solder ball supplying apparatus including: a cartridge formed in a box shape and having a plurality of solder balls embedded therein; a vibration unit coupled to a lower portion of the cartridge; and a metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof. 1. A solder ball supplying apparatus comprising:a cartridge formed in a box shape and having a plurality of solder balls embedded therein;a vibration unit coupled to a lower portion of the cartridge; anda metal mask coupled integrally with a lower portion of the vibration unit and having a plurality of holes formed over the entire surface thereof.2. The solder ball supplying apparatus according to claim 1 , wherein the vibration unit is mounted at an upper end of a support body claim 1 , the support body being coupled to an upper portion of the metal mask claim 1 , such that a movement space of the solder balls is formed under the cartridge.3. The solder ball supplying apparatus according to claim 1 , wherein the vibration unit is a vibrator or a linear motor vibrated in a horizontal direction with respect to an upper surface of the metal mask coupled to the lower portion thereof.4. The solder ball supplying apparatus according to claim 3 , wherein the vibration unit is vibrated in a direction orthogonal to a movement direction of the solder ball supplying apparatus.5. The solder ball supplying apparatus according to claim 1 , wherein the cartridge includes a nitrogen gas inlet formed at one side thereof in order to inject nitrogen (N) gas claim 1 , and an inner portion of the cartridge is maintained under a nitrogen atmosphere by the nitrogen gas injected through the nitrogen gas inlet.6. The solder ball supplying apparatus according to claim 5 , wherein the cartridge further includes a solder ball outlet formed at the lower portion thereof in order to discharge the embedded solder balls to the outside. ...

METHOD FOR MANUFACTURING MOUNT ASSEMBLY, MOUNTING JIG, APPARATUS FOR MANUFACTURING MOUNT ASSEMBLY, IMAGING APPARATUS, AND ENDOSCOPE APPARATUS

A method for manufacturing a mount assembly in which pins and electronic components are connected to a same surface of a substrate. Each pin including a connecting section and a shaft section having a diameter smaller than that of the connecting section. A height of each electronic component being not larger than that of each pin when being mounted. The method includes: setting the pins and the electronic components so as to be aligned; and disposing the pins and the electronic components which are aligned, on a stage of a mounting apparatus, lowering a head unit of the mounting apparatus on which the substrate is adsorbed, and connecting the pins and the electronic components collectively to the surface of the substrate by applying heat and pressure while solder applied to a land on the substrate and the connecting section of each pin are in contact with each other. 1. A method for manufacturing a mount assembly in which a plurality of pins and a plurality of electronic components are connected to a same surface of a substrate , each of the plurality of pins including a connecting section and a shaft section having a diameter smaller than that of the connecting section , a height of each of the plurality of electronic components being not larger than that of each of the plurality of pins when being mounted ,the method comprising:a setting step of setting the plurality of pins and the plurality of electronic components so as to be aligned; anda connection step of disposing the plurality of pins and the plurality of electronic components which are aligned, on a stage of a mounting apparatus, lowering a head unit of the mounting apparatus on which the substrate is adsorbed, and connecting the plurality of pins and the plurality of electronic components collectively to the surface of the substrate by applying heat and pressure while solder applied to a land on the substrate and the connecting section of each of the plurality of pins are in contact with each other.2. ...

Solder ball mounter

An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.

METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface. 1. A method of bonding a flexible part including inclined leads , in which at least one inclined lead of a first part that is inclined with respect to a plane where the first part and a second part face each other , is bonded to at least one inclined pad of the second part formed to face the at least one inclined lead , the method comprising:(a) clamping the first part by using a first fixing member mounted to a support bracket that is rotatably mounted with respect to a base;(b) clamping the second part by using a second fixing member mounted to the support bracket;(c) transporting the second fixing member by using a second transporting unit that is fixed to the support bracket and transports the second fixing member relative to the support bracket so as to align a location of the second part with respect to the first part clamped by the first fixing member;(d) moving the first part, which is clamped by the first fixing member, near the second part clamped by the second fixing member, by using a first transporting unit that is mounted to the support bracket and transports the first fixing member relative to the support bracket;(e) rotating the support bracket with respect to the base by using a tilt unit rotating the support bracket with respect to the base, such that the at least one inclined lead of the first part and the at least one inclined pad of the second part face a bonding head bonding the at least one inclined lead to the at least one inclined pad; and(f) bonding the at least one inclined lead of the first part to the at least one inclined pad of the second part by using the bonding head ...

WAVE SOLDERING APPARATUS AND NOZZLE THEREOF

An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings. 1. An apparatus used for wave soldering , comprising:a nozzle device configured to discharge molten solder to a circuit board near a solder tank,wherein, the nozzle device comprises at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings.2. The apparatus according to claim 1 , wherein each nozzle opening of the pair of nozzle openings is formed by a vertical plate and an inclined plate claim 1 , the vertical plate of each nozzle opening at the inner side of the pair of nozzle openings claim 1 , and the inclined plate of each nozzle opening at the outer side of the pair of nozzle openings.3. The apparatus according to claim 1 , wherein the distance between the pair of nozzle openings is configured so that the time period during which the component on the circuit board passes through the high temperature solder between the pair of nozzle openings conforms to a specification on the staying period of a component in a high temperature solder.4. The apparatus according to claim 2 , wherein the inclination of the inclined plate of each nozzle opening is adjustable between 0 and 90 degree5. The apparatus according to claim 1 , further comprising a pump device being a single pump device and configured to drive the molten solder in the solder tank through a conduit to each nozzle opening in the adjacent nozzle openings of the nozzle device.6. The apparatus according to claim 5 , wherein the pump device is installed on a side of the solder tank.7. The apparatus according to claim 6 , wherein the pump device comprises:a rotation shaft inserted into the solder tank through an ...

APPARATUS FOR ADSORBING SOLDER BALL AND METHOD OF ATTACHING SOLDER BALL USING THE SAME

Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins.

WAVE SOLDER NOZZLE WITH AUTOMATED EXIT WING

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave. A linear actuator is connected via a linkage to the exit wing to allow the linear actuator to adjust an orientation of the exit wing with respect to the nozzle core frame. 1. A wave soldering machine to perform a wave soldering operation on a printed circuit board , the wave soldering machine comprising:a housing;a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing; anda wave soldering station coupled to the housing, the wave soldering station including a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave, the wave solder nozzle assembly having a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave, the wave solder nozzle assembly further having a linear actuator external to the wave soldering station, the linear actuator being connected to the exit wing and configured to adjust an orientation of the exit wing with respect to the nozzle core frame.2. The wave soldering machine of claim 1 , wherein the linear actuator is connected to the exit wing by a linkage.3. The wave soldering machine of claim 2 , wherein the exit wing includes a first end coupled by the hinge to the nozzle core frame and a second end claim 2 , and wherein the linkage includes at least one rotating link having a first end rotatably coupled to the ...

SYSTEMS AND METHODS FOR POSITIONING A PLURALITY OF SPHERES

An apparatus for the presentation of solder spheres to one or more pickup locations of assembly equipment simultaneously. An exemplary method conveys spherical material from a bulk reservoir by the use of a vacuum ported rotating cylinder with a number of apertures. Apertures in the rotating cylinder correspond with pickup locations on a host machine. 1. An apparatus for conveying a plurality of solder spheres to a host machine , the apparatus comprising:a body having a basin therein, the basin at least partially filled with the plurality of solder spheres;a hollow, rotatable cylinder disposed at least partially within the basin, the rotatable cylinder configured with a set of apertures therethrough;a rotation mechanism coupled to the rotatable cylinder; anda vacuum source coupled to an inner chamber of the rotatable cylinder.2. The apparatus of claim 1 , wherein the rotation mechanism comprises an electric motor.3. The apparatus of claim 1 , wherein the rotation mechanism comprises a pneumatic connection from the host machine.4. The apparatus of claim 1 , wherein the rotation mechanism comprises a mechanical link from the host machine.5. The apparatus of claim 1 , wherein the vacuum source is electrically controlled.6. The apparatus of claim 1 , wherein the vacuum source is mechanically controlled by rotation of the rotatable cylinder.7. The apparatus of claim 1 , wherein the vacuum source is mechanically controlled by the host machine.8. The apparatus of claim 1 , wherein the vacuum source is mechanically controlled by the rotation mechanism.9. The apparatus of claim 1 , wherein the set of apertures in the rotatable cylinder are arranged in a line parallel to a rotational axis of the rotatable cylinder.10. The apparatus of claim 1 , wherein the rotatable cylinder comprises an outer cylinder and an inner cylinder that are indexable with respect to one another in order to form the set of apertures therethrough.11. A method of conveying a plurality of solder spheres ...

Jet Solder Bath And Jet Soldering Apparatus

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate. 1. A jet solder bath comprising:a first jet nozzle which injects molten solder by a first pump;a second jet nozzle which injects the molten solder by a second pump, the second jet nozzle being arranged on a downstream side of the first jet nozzle along a carrying direction of a substrate; anda bridge member arranged between the first and second jet nozzles, a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing to the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing to an upstream side of the second jet nozzle, and', 'side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate., 'wherein the bridge member includes2. The jet solder bath according to claim 1 , wherein the bridge member extends from a vicinity of an upper end on an upstream end of the second jet nozzle to a vicinity of an upper end on a downstream end of the first jet nozzle.3. The jet solder bath according to claim 2 , further comprising ...

DISRUPTING AFFINITY BETWEEN METALLIC SPHERES

Implementations described and claimed herein address the foregoing problems by providing a soldering method including mixing a plurality of spheres in a bond-head hopper wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than the rest of the plurality of spheres. 1. A method , comprising:mixing a plurality of spheres;wherein a first number of the plurality of the spheres have a diameter that is at least fifty (50) percent larger than diameter of rest of the plurality of spheres.2. The method of claim 1 , wherein the first number of the plurality of the spheres form approximately at least ten (10) percent the volume of the total volume of the plurality of the spheres.3. The method of claim 1 , wherein the diameter of the first number of the plurality of the spheres is at least 100 μm whereas the diameter of the rest of the plurality of spheres is less than 50 μm.4. The method of claim 1 , wherein the diameter of the first number of the plurality of the solder spheres is at least 200 μm whereas the diameter of the rest of the plurality of solder spheres is less than 40 μm.5. The method of claim 1 , further comprising determining the number of the first number of the plurality of the solder spheres to be added to a bond-head hopper.6. The method of claim 5 , wherein determining the number of the first number of the plurality of the spheres further comprises determining the number of the first number of the plurality of the spheres that results in the first number of the plurality of the spheres forming approximately at least ten percent (10) of the volume of the total volume of the bond-head hopper.7. The method of claim 1 , wherein the first number of spheres is greater than approximately 16 claim 1 ,000 and number of the rest of the plurality of spheres are approximately 250 claim 1 ,000.8. The method of claim 1 , wherein the first number of the plurality of the spheres are made of a material that is not ...

WAVE SOLDERING NOZZLE SYSTEM AND METHOD OF WAVE SOLDERING

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle system adapted to create a solder wave. The wave solder nozzle system has a nozzle frame, and a nozzle plate secured to the nozzle frame. The nozzle plate includes a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate. 1. A wave soldering machine to perform a wave soldering operation on a printed circuit board , the wave soldering machine comprising:a housing;a conveyor coupled to the housing, the conveyor being configured to deliver a printed circuit board through the housing;a wave soldering station coupled to the housing, the wave soldering station including a reservoir of solder material, and a nozzle frame, and', 'a nozzle plate secured to the nozzle frame, the nozzle plate including a first zone of openings positioned adjacent a leading edge of the nozzle plate, a second zone of openings positioned proximate a middle of the nozzle plate, and a third zone having no openings positioned adjacent a trailing edge of the nozzle plate., 'a wave solder nozzle system adapted to create a solder wave, the wave solder nozzle system having'}2. The wave soldering machine of claim 1 , wherein the first zone of the nozzle plate has less openings than the second zone.3. The wave soldering machine of claim 2 , wherein openings of the second zone of the nozzle plate are spaced closer together than openings of the first zone.4. The wave soldering machine of claim 3 , wherein openings of the second zone of the nozzle plate are spaced from one ...

BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOF

The present disclosure relates to a ball planting device for mounting a solder ball and a ball planting method thereof. The device includes a substrate, a dielectric layer, and a solder paste. The substrate includes a surface. The dielectric layer is disposed on the surface. The dielectric layer includes a plurality of apertures. The solder paste fills the apertures. A top surface of the solder paste is aligned with an exposed surface of the dielectric layer. 1. A ball planting device , comprising:a substrate including a surface;a dielectric layer disposed on the surface, wherein the dielectric layer includes a plurality of apertures; anda solder paste filled within the apertures, wherein a top surface of the solder paste is coplanar with an exposed surface of the dielectric layer.2. The ball planting device according to claim 1 , wherein the solder paste contacts with the surface of the substrate.3. The ball planting device according to claim 1 , wherein the top surface along a direction perpendicular to a normal of the substrate includes a predetermined width.4. The ball planting device according to claim 1 , wherein the substrate is a glass substrate.5. A ball planting method claim 1 , comprising:providing a substrate;disposing a dielectric layer on a surface;photo-lithographing the dielectric layer to thereby form a plurality of apertures in the dielectric layer;coating a solder paste in the apertures, wherein a top surface of the solder paste is coplanar with an exposed surface of the dielectric layer;providing a wafer layer, wherein at least one under bump metal (UBM) layer is disposed on a connecting surface of the wafer layer;reflowing the wafer layer and the substrate to thereby bond the solder paste to the at least one UBM layer;removing the dielectric layer; andreflowing the solder paste above the at least one UBM layer so as to form a solder ball.6. The ball planting method according to claim 5 , wherein the reflowing step further includes a step of ...

LOGIC SWITCHING DEVICE AND METHOD OF MANUFACTURING THE SAME

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode. 1. A logic switching device comprising:a channel;a source and a drain both connected to the channel;a gate electrode arranged to face the channel; anda domain switching layer between the channel and the gate electrode,wherein the domain switching layer is a non-memory element and comprises at least one structure including at least one ferroelectric material region comprising a ferroelectric domain and at least one anti-ferroelectric material region comprising an anti-ferroelectric domain.2. The logic switching device of claim 1 , wherein the domain switching layer has substantially a non-hysteretic behavior characteristic at a polarization change according to an external electric field.3. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction parallel to the gate electrode.4. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction perpendicular to the gate electrode.5. The logic switching device of claim 1 , wherein the domain switching layer comprises two structures claim 1 , a first structure including the at least one ferroelectric material region and the at least one anti- ...

DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS

A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate. 1. A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface , the apparatus comprising:a material dispensing station for dispensing a bonding material onto the substrate;a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate; andan activating gas generator positioned before the die attachment station for introducing activated forming gas onto the substrate, the activated forming gas being operative to reduce oxides on the substrate.2. The die attachment apparatus as claimed in claim 1 , further comprising a heat tunnel that is filled with shielding gas and closed with a heat tunnel cover for containing the substrate when the substrate is undergoing processing at the respective stations.3. The die attachment apparatus as claimed in claim 2 , wherein the activating gas generator is positioned over an opening in the heat tunnel cover and the activated forming gas is projected through the opening onto the substrate in the heat tunnel.4. The die attachment apparatus as claimed in claim 3 , wherein the activating gas generator is movable at least perpendicularly to a direction of conveyance of the substrate inside the heat tunnel.5. The die attachment apparatus as claimed in claim 4 , further comprising a slidable cover connected to and is movable with the activating gas generator claim 4 , the slidable cover being operative to minimize the leakage of activated ...

Jet Nozzle and Jet Soldering Apparatus

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition. 1. An electronic package , comprising:a first substrate;a second substrate; and first interconnects, wherein the first interconnects have a first volume and a first material composition; and', 'second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition., 'an array of interconnects electrically coupling the first substrate to the second substrate, wherein the array of interconnects comprises2. The electronic package of claim 1 , wherein a number of first interconnects is greater than a number of second interconnects.3. The electronic package of claim 2 , wherein the number of first interconnects is at least one-hundred times greater than the number of second interconnects.4. The electronic package of claim 1 , wherein one or more corner locations in the array of interconnects are each populated by second interconnects.5. The electronic package of claim 1 , wherein one or more center locations in the array of interconnects are each populated by second interconnects.6. The electronic package of claim 1 , wherein second interconnects are located at a non-critical-to-function (NCTF) pin claim 1 , a ...

GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY

An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation, the apparatus including a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component, a retaining member for each mounting hole, passing through said mounting hole, a resilient biasing member for each retaining member, wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB. 1. An apparatus configured to temporarily support a Ball Grid Array (BGA) component against a printed circuit board (PCB) during a manufacturing reflow operation , the apparatus comprising:a support plate sized to fit over the BGA and having one or more mounting holes external to the periphery of the Ball Grid Array component;a retaining member for each mounting hole, passing through said mounting hole;a resilient biasing member for each retaining member,wherein the resilient biasing member urges the support plate against the BGA component from below the BGA component such that the BGA component is urged against the PCB.2. The apparatus of claim 1 , wherein the support plate and BGA component create a cumulative weight claim 1 , and wherein the support plate is urged against the BGA component with a force greater than the cumulative weight.3. The apparatus of claim 1 , wherein the resilient biasing member includes a spring.4. The apparatus of claim 1 , wherein the retaining member includes a bolt having a shoulder and the resilient member is mounted on the retaining member.5. The apparatus of claim 1 , wherein the retaining member is coupled to the PCB by a fastening member.6. The apparatus of claim 1 , wherein the support plate has the shape of a window frame.7. The apparatus of claim 1 , wherein the support plate includes a plurality of apertures to ...

ELECTRODE FORMING DEVICE, ELECTRODE FORMING SYSTEM AND ELECTRODE FORMING METHOD

An electrode forming device has a pressing unit that presses a substrate on a printing table from above, a suction unit that sucks the substrate on the printing table, a mask member integrally formed with a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, a squeegee head that applies the flux via the first mask section, an air cylinder that moves the mask member, and a filling head that fills a conductive ball via the second mask section. 1. An electrode forming device comprising:a pressing unit that presses a substrate on a printing table from above;a suction unit that sucks the substrate pressed by the pressing unit on the printing table and continues to suck the substrate after the pressing unit is released;a mask member that has a first mask section used for applying flux on the substrate and a second mask section used for filling a conductive ball on the substrate applied with the flux, the first mask section and the second mask section being connected to each other or being integrally formed;a squeegee head that applies the flux via the first mask section on the substrate sucked by the suction unit;a mask member moving unit that moves the mask member to adjust a relative position of the mask member to the substrate; anda filling head that fills a conductive ball via the second mask section of the mask member to form an electrode on the substrate sucked by the suction unit.2. The electrode forming device according to further comprising a camera moving unit that moves a camera used for aligning the mask member and the substrate claim 1 , wherein the camera moving unit moves the pressing unit with the camera.3. The electrode forming device according to claim 1 , wherein the mask member moving unit comprises a head moving unit that moves a head as the squeegee head or the filling head and a relative position fixing unit that fixes a relative position of ...

ELECTRODE FORMING DEVICE AND ELECTRODE FORMING METHOD

An electrode forming device has a flux application unit that applies flux on a substrate; a plurality of ball filling units that are arranged in series at a downstream side of the flux application unit and fill conductive balls on the substrate applied with the flux to form electrodes; and a first conveying device, a second conveying device, a first bypass conveyor and a second bypass conveyor that convey the substrate to one of the ball filling units and conveys the substrate in such a way as to bypass the other ball filling unit. 1. An electrode forming device comprising:a flux application unit that applies flux on a substrate;a plurality of ball filling units that are arranged in series at a downstream side of the flux application unit and fill a conductive ball on the substrate applied with the flux to form an electrode; anda bypass unit that conveys the substrate to one ball filling unit and conveys the substrate in such a way as to bypass other ball filling unit.2. The electrode forming device according to claim 1 , wherein the bypass unit has a bypass path arranged in parallel with each ball filling unit claim 1 , and a conveying unit that is arranged between the flux application unit and each ball filling unit and conveys the substrate received from an upstream side of the conveying unit to either the ball filling unit or the bypass path located at a downstream side of the conveying unit.3. The electrode forming device according to claim 1 , wherein the plurality of ball filling units comprise a first ball filling unit that is arranged at a downstream side of the flux application unit and a second ball filling unit that is arranged at a downstream side of the first ball filling unit claim 1 , and the bypass unit comprises a first bypass unit that conveys the substrate applied with the flux by the flux application unit to the second ball filling unit in such a way as to bypass the first ball filling unit and a second bypass unit that conveys the substrate ...

SOLDERING DEVICE AND SOLDERING SYSTEM

A soldering device, particularly solder pots for selective wave soldering or a fluxer device, having a receiving means configured to store a liquid, particularly a solder reservoir, configured to store a solder, particularly a liquid solder, or having a flux tank configured to store flux, with a nozzle, particularly a solder nozzle or fluxer nozzle, and having a pump, particularly a solder pump or a flux pump, configured to deliver the liquid from the receiving means through the nozzle in the direction of a Z-axis. 1. A soldering device , particularly a solder pot for selective wave soldering or a fluxer device , having a receiving means configured to store a liquid , particularly a solder reservoir that is configured to store a solder , particularly a liquid solder , or having a flux tank configured to store flux , with a nozzle , particularly a solder nozzle or a fluxer nozzle , and having a pump , particularly a solder pump or a flux pump , that is configured to deliver the liquid from the receiving means through the nozzle in the direction of a z-axis , characterized in that the soldering device comprises a moving device that is disposed on the soldering device and configured for independent movement of the soldering device in a working area.2. The soldering device according to claim 1 , wherein the soldering device comprises a top part and a bottom part claim 1 , wherein said top part can be detachably coupled to the bottom part and comprises the receiving means and the nozzle claim 1 , wherein a delivery duct of the pump is disposed in the top part claim 1 , which at least in some sections extends along a circular path claim 1 , and wherein a device for generating a moving magnetic field of the solder pump claim 1 , which device includes at least one magnet claim 1 , and is configured such that said magnet is moved along said delivery duct claim 1 , is disposed in the bottom part.3. The soldering device according to claim 1 , wherein the moving means comprises ...

Substrate processing device and method of manufacturing the same

Disclosed herein is a substrate processing device, including: a first mask disposed over a base substrate and provided with a first opening which exposes a connection pad of the base substrate; a first squeeze inserting a flux ball into a first opening of the first mask; and a first heating means heating a flux ball which is disposed on the connection pad.

SOLDERING SYSTEM WITH MONITORING UNIT

The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle. 1. Soldering system for wave soldering , comprising at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle ,characterized in that the device for monitoring the state of the spray jet has a test surface in the form of a tensioned paper web which has an upper face and a lower face and is designed such that a shape and/or position of the spray jet can be imaged on the upper face of the paper web by bringing the spray jet into contact with the lower face of the paper web, andin that a camera is provided which is arranged above the upper face of the test surface and is designed to detect the shape and/or position of the spray jet that is imaged on the upper face of the test surface.2. Soldering system for wave soldering , comprising at least one solder pot having at least one soldering nozzle and a device for monitoring a state of a standing wave of the soldering nozzle , characterized in that the device for monitoring the state of the standing wave has a test surface in the form of a transparent plate which has an upper face and a lower face and is designed such that a shape and/or position of the standing wave can be imaged on the upper face of the plate by bringing the standing wave into contact with the lower face of the plate , and comprising a camera which is arranged above the upper face of the test surface and is designed to detect at least one of the shape and position of the standing wave that is imaged on the upper face of the test surface.3. Soldering system according to claim 1 , wherein the test surface is planar.4. Soldering system according to claim 1 , wherein the paper of the paper web is designed such that at least one of the shape and position of the spray jet is imaged on the upper face of the paper web by wetting the paper web from ...

BALL MOUNT MODULE

Embodiments of the invention provide a ball mount module for sucking and sticking balls positioned in a ball supply bath, transferring the balls, and mounting the balls on a ball pad of a substrate. The ball mount module includes a sucking head, a sucking base coupled to the sucking head and having irregular air channels, and a sucking and sticking panel including bail sucking and sticking holes formed therein so as to be in communication with the irregular air channels of the sucking base and coupled to the sucking head. The sucking base is made of ceramic. 1. A ball mount module comprising:a sucking head;a sucking base coupled to the sucking head and having irregular air channels; anda sucking and sticking panel comprising ball sucking and sticking holes formed therein so as to be in communication with the irregular air channels of the sucking base and coupled to the sucking head.2. The ball mount module according to claim I , wherein the sucking base is made of ceramic.3. The ball mount module according to claim 1 , wherein the sucking head is coupled to the sucking base while enclosing an upper surface and both side surfaces of the sucking base.4. The ball mount module according to claim 1 , wherein the sucking and sticking panel is detachably coupled to the sucking base.5. The ball mount module according to claim 4 , wherein the sucking and sticking panel is coupled to the sucking base by bolts.6. The ball mount module according to claim 1 , wherein the ball sucking and sticking hole is formed to have an inner diameter that becomes larger from a portion thereof closely adhered to the sucking base toward the outside.7. The ball mount module according to claim 1 , wherein the sucking and sticking panel comprises a plurality of ball sucking and sticking holes formed therein at predetermined intervals.8. The ball mount module according to claim 1 , wherein the ball sucking and sticking hole has a height lower than a radius of the ball. This application claims the ...

SOLDERING PUMP

A soldering pump for pumping an electrically conductive fluid—in particular, a liquid solder—said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation. 11010020014121618202022202214. Soldering pump ( , , ) for pumping an electrically conductive fluid , including a liquid solder , having a feed channel () which travels at least in segments along a circular path () and has an inlet () and an outlet () , and having a device () for generating a moving magnetic field , characterized in that the device () comprises at least one permanent magnet () and that the device () is designed such that the at least one permanent magnet () is moved along the feed channel () during operation.210100200223414221010020020223512. Soldering pump ( , , ) according to , characterized in that the at least one permanent magnetic () or ferromagnetic material () is arranged on a side of the feed channel () that faces away from the permanent magnet (). (Currently amended) Soldering pump ( , , ) according to , characterized in that the device () is designed such that , during operation , the at least one permanent permanent magnet () rotates about an axis of rotation () arranged concentrically relative to the circular path ().4101002002222142426. Soldering pump ( claim 1 , claim 1 , ) according to claim 1 , characterized in that at least two permanent magnets () are provided that are arranged such that the at least two permanent magnets () face toward the feed channel () with different magnetic poles ( claim 1 , ).51010020022142426. Soldering pump ( claim 1 , claim 1 , ) according to claim 1 , characterized in that a plurality of permanent magnets () is provided that alternately face toward the feed ...

Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate

An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced. 1. An apparatus for placing and mounting solder balls on an integrated circuit substrate comprising: a fixture , a vacuuming device , a guiding plate , and a storage tank; whereinthe fixture includes a plurality of first grooves defined therein, and each first groove has an upper opening and a lower opening, a diameter of the upper opening is less than that of the lower opening, and each first groove is provided to receive a respective one of a plurality of solder balls, and the fixture also includes a plurality of through holes formed therein and located on the plurality of first grooves;the vacuuming device is disposed over the fixture and includes a vacuum chamber arranged therein and having a plurality of connecting orifices for corresponding to the plurality of through holes of the fixture, the vacuum chamber has an air pore defined on a central portion thereof so that when air is drawn out of the vacuum chamber via the air pore, the plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released, the vacuuming device includes a turning ...

AUTOMATIC WELDING EQUIPMENT

Automatic welding equipment includes a wave soldering machine including a tank, a plurality of first nozzles, a first pump, and a first guide plate. The tank has an opening. The first nozzles and melted solder are disposed in the tank. The first pump is disposed in the tank for jetting the solder via the first nozzles. The first guide plate is located at the opening and includes a first plate portion and a second plate portion. The first plate portion is located over the first nozzles and has a plurality of first holes for passed through by the solder jetted from the first nozzles. The second plate portion, connected to the first plate portion, guides the solder to flow out of the first holes. The solder guided by the second plate portion passes through second holes of the second plate portion and returns into the tank. 1. Automatic welding equipment comprising: a tank having an opening and used to accommodate melted solder;', 'a plurality of first nozzles disposed in the tank;', 'a first pump, disposed in the tank, for jetting the solder via the first nozzles; and', a first plate portion, located over the first nozzles, and having a plurality of first holes, for passed through by the solder jetted from the first nozzles; and', 'a second plate portion, connected to the first plate portion and inclined toward the tank, for guiding the solder to flow out of the first holes, the second plate portion having a plurality of second holes, and the solder guided by the second plate portion passing through the second holes and returning into the tank., 'a first guide plate located at the opening and comprising], 'a wave soldering machine comprising2. The automatic welding equipment of claim 1 , wherein the wave soldering machine comprises:a plurality of second nozzles disposed in the tank and adjacent to the first nozzles;a second pump disposed in the tank for jetting the solder via the second nozzles; anda second guide plate located at the opening and adjacent to the first ...

BALL BOX AND SOLDER BALL ATTACHMENT APPARATUS HAVING THE SAME

A solder ball attachment apparatus including an open ball box configured to accommodate a plurality of solder balls, the open ball box including, a pocket portion at a bottom thereof, the pocket portion configured to accommodate the solder balls, and an inclined portion extending from the pocket portion toward an outer surface of the open ball box, a solder ball attachment tool configured to apply suction pressure to a lower surface thereof, the lower surface configured to face the open ball box, the lower surface configured to adsorb the solder balls accommodated in the ball box by moving between a first position and a second position, the first position being a standby position, the second position being a position for adsorbing the solder balls, and a vibration member connected to the open ball box may be provided. 1. A solder ball attachment apparatus comprising: a pocket portion at a bottom thereof, the pocket portion configured to accommodate the solder balls, and', 'an inclined portion extending from the pocket portion toward an outer surface of the open ball box,, 'an open ball box configured to accommodate a plurality of solder balls, the open ball box including,'}a solder ball attachment tool configured to apply suction pressure to a lower surface thereof, the lower surface configured to face the open ball box, the lower surface configured to adsorb the solder balls accommodated in the ball box by moving between a first position and a second position, the first position being a standby position, the second position being a position for adsorbing the solder balls; anda vibration member connected to the open ball box.2. The apparatus of claim 1 , wherein the pocket portion comprises a bottom surface having a first level claim 1 , and a side surface extending from an edge of the bottom surface to a second level higher than the first level.3. The apparatus of claim 2 , wherein when the solder ball attachment tool is positioned at the second position claim 2 , ...

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD

Provided are a soldering device and method which allow for oldering at low cost with high yield and high reliability. To solve the above problems, the soldering device has: a first processing section that immerses workpiece member having copper electrode in organic fatty acid-containing solution, and horizontally move immersed workpiece member in organic fatty acid-containing solution a second processing section having ejection unit to spray a jet stream of molten solder to workpiece member while pulling out workpiece member processed in the first processing section to space section that has a pressurized steam atmosphere and is provided above organic fatty acid-containing solution a third processing section having ejection unit to spray organic fatty acid-containing solution to excess molten solder on workpiece member for removal while pulling down workpiece member processed in the second processing section after horizontally moving in space section and a fourth processing section that picks up workpiece member processed in the third processing section by pulling out from organic fatty acid-containing solution after horizontally moving in organic fatty acid-containing solution 1. A soldering device , comprising:a first processing section that immerses a workpiece member having a copper electrode in organic fatty acid-containing solution, and horizontally move the workpiece member in the organic fatty acid-containing solution;a second processing section having an ejection unit to spray a jet stream of a molten solder to the workpiece member while pulling out the workpiece member processed in the first processing section to a space section that has a pressurized steam atmosphere and is provided above the organic fatty acid-containing solution;a third processing section having an ejection unit to spray the organic fatty acid-containing solution to excess molten solder on the workpiece member for removal while pulling down the workpiece member processed in the second ...

Soldering device

A soldering device, in particular a soldering crucible for selective flow soldering, having a solder reservoir which is designed for storing a solder, in particular a molten solder, with a soldering nozzle and with a solder pump which is designed for conveying the solder out of the solder reservoir through the soldering nozzle, wherein the soldering device has an upper part and a lower part, wherein the upper part is releasably connectable to the lower part, and comprises the solder reservoir and the soldering nozzle, wherein a feed channel of the solder pump is disposed in the upper part and a device for generating a moving magnetic field of the solder pump is disposed in the lower part, designed (said device for generating a moving magnetic field) for generating a moving magnetic field along the feed channel.

Solder bump correction method

A pattern formed on a silicon wafer is fine so that solder bumps formed on the silicon wafer are also fine and hence, when a failure occurs, the failure cannot be corrected so that an entire silicon wafer as a workpiece is discarded. Provided is a correction method where, on solder bumps formed on the silicon wafer, a mask in which holes are formed with the same pattern as the solder bumps is placed so as to cover the solder bumps and, thereafter, molten solder is caused to come into contact with the solder bumps through the mask thus filling hole portions of the mask with the molten solder.

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

A fill head apparatus includes at least one chamber for holding a fluid. The chamber has an outlet for expelling the fluid. A vacuum device has an inlet for a suction device adjacent to the fluid outlet. A plurality of flexible and resilient sealing devices contact a top surface of a workpiece. The sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, such that the sealing devices create at least a partial seal around a cavity defined by the workpiece and the cavity is beneath both the chamber outlet and the vacuum outlet. 1. A fill head apparatus , comprising:at least one chamber for holding a fluid, the chamber having an outlet for expelling the fluid;at least one vacuum device having an inlet adjacent to the fluid outlet; anda plurality of flexible and resilient sealing devices contacting a top surface of a workpiece, the sealing devices are positioned on opposing sides of the chamber outlet and on opposing sides of the vacuum device inlet, wherein the sealing devices create at least a partial seal around a cavity defined in the workpiece and beneath both the chamber outlet and the vacuum inlet.2. The apparatus of claim 1 , wherein the sealing device creates at least a partial vacuum in the cavity when positioned over the cavity.3. The apparatus of claim 1 , wherein the sealing devices maintain contact with the top surface of the workpiece as the workpiece is moved longitudinally sliding the sealing device along the surface of the workpiece.4. The apparatus of claim 1 , wherein the chamber is pressurized.5. The apparatus of claim 1 , wherein the chamber is pressurized for expelling a liquid.6. The apparatus of claim 1 , wherein the pressurized chamber outlet is positioned after the vacuum device outlet in relation to a direction of movement of a workpiece.7. The apparatus of claim 1 , wherein liquid is solder.8. The apparatus of claim 1 , wherein the workpiece moves in a longitudinal direction ...

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole. 1. An apparatus for increasing solder hole-fill in a Printed Circuit Board Assembly (PCBA) , comprising:a first hardware component for causing, in the PCBA, a pin of a device to move in a first direction, the PCBA comprising a Printed Circuit Board (PCB) and the device, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material, the causing the pin to move resulting in drawing the solder material into the hole up to a second distance, wherein the second distance is greater than the first distance; anda second hardware component for allowing the pin to move in a second direction, wherein the move in the second direction returns the pin to an initial position in the hole, and wherein the allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.2. The apparatus of claim 1 , further comprising:a third hardware component for repeating, the causing, the drawing, and the allowing a number of times at a first frequency, wherein the repeating causes the solder material to reach a threshold distance into the hole.3. The apparatus of claim 1 , further comprising:a ...

METHOD OF MOUNTING CONDUCTIVE BALL

Provided is a method of mounting a conductive ball, and more particularly, a method of mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the method of mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without omitting any conductive balls. 1. A method of mounting a conductive ball , the method comprising:step (a), providing a mask comprising a plurality of mounting holes formed such that a plurality of conductive balls is respectively mounted in the plurality of mounting holes and fixing the mask horizontally;step (b), supporting the mask by bringing a support plate into contact with a lower surface of the mask, the support plate having a flat upper surface to contact the lower surface of the mask and block a lower portion of each of the plurality of mounting holes;step (c), mounting the plurality of conductive balls in the plurality of mounting holes of the mask using a mounting unit;step (d), maintaining the conductive balls respectively in a state of being mounted in the mounting holes of the mask using the hold unit by bringing a holding unit into contact with an upper surface of the mask;step (e), while performing the step (d), placing a substrate below the mask by transporting at least one of the mask, the support plate, and the substrate that is coated with a flux using a transporting unit; andstep (f), dropping the conductive balls mounted in the mounting holes of the mask onto the substrate by stopping operation of the holding unit using a controller.2. The method of claim 1 , wherein the step (d) comprises clamping the conductive balls mounted in the mounting holes via an electrostatic force using the holding unit including ...

SOLDER BALL FEEDING DEVICE

The invention relates to a solder ball feeding device (), comprising a solder ball reservoir () for receiving an amount of solder balls and a metering device () for dispensing a metered feeding amount of solder balls () to a discharge device (), wherein the metering device comprises an ultrasound device () and a dispensing nozzle () with a dispensing cannula (), the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection () which serves to introduce a pressurized gas into the solder ball feeding device. 1. A solder ball feeding device , comprising:a solder ball reservoir receiving an amount of solder balls; anda metering device dispensing a metered feeding amount of solder balls from the solder ball reservoir to a discharge device, wherein the metering device an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device applying vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection introducing a pressurized gas into the solder ball feeding device.2. The solder ball feeding device according to claim 1 , in which the ultrasound device is independent of the dispensing nozzle.3. The solder ball feeding device according to claim 2 , in which the ultrasound device is arranged on a container body of the solder ball reservoir.4. The solder ball feeding device according to claim 3 , in which the ultrasound device is detachably arranged on the container body of the solder ball reservoir by a support device.5. The solder ball feeding device according to claims 1 , in which the pressure connection is arranged above a receiving chamber formed in the solder ball reservoir receiving the amount of solder balls.6. The solder ball feeding device according to claim 5 , in which the pressure connection is ...

INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF

An injection-molded solder (IMS) tool assembly apparatus, the apparatus including an IMS tool for dispensing a molten material via a round extrusion part to coat an inside or an outside wall of a pipe (and a chiller for providing cooling water to flow through an inside of the pipe.) 1. An injection-molded solder (IMS) tool assembly apparatus , the apparatus comprising:an IMS tool for dispensing a molten material via a round extrusion part to coat an outside wall of a pipe; anda chiller for providing cooling water to flow through an inside of the pipe.2. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the IMS tool comprises:a tungsten head for dispensing the molten material into the round extrusion part;a heater for maintaining a molten state of the molten material in the tungsten head; anda pressure source for supplying pressure to the molten material causing the molten material to dispense from the tungsten head into the round extrusion part.3. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein an inner diameter of the round extrusion part is greater than an outer diameter of the pipe.4. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein the pipe comprises a carbon steel pipe.5. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a temperature of the cooling water is set such that the pipe is cooled to avoid melting of a material of the pipe while the molten material touches the outside wall of the pipe.6. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting temperature of the molten material is greater than a melting temperature of the pipe.7. The injection-molded solder (IMS) tool assembly apparatus of claim 4 , wherein the molten material includes a material to coat the pipe such that the pipe has a stainless steel property.8. The injection-molded solder (IMS) tool assembly apparatus of claim 1 , wherein a melting ...

SOLDERING APPARATUS, COMPUTER-READABLE MEDIUM, AND SOLDERING METHOD

Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process. 1. A soldering apparatus comprising:a motor configured to move a soldering iron relative to a system origin point; and receive gerber data including definitions of a plurality of physical features of a substrate, the definitions including substrate coordinates for each of the physical features relative to a substrate origin point on the substrate, the substrate origin point being different from the system origin point,', 'receive, separately from the gerber data, system coordinates for the substrate origin point, the system coordinates for the substrate origin point being relative to the system origin point,', 'extract from the received gerber data, the substrate coordinates of at least one of the physical features,', 'use the extracted substrate coordinates to derive system coordinates for the at least one of the physical features of the substrate, the system coordinates for the at least one of the physical features being relative to the system origin point, and', 'control the motor according to at least some of the derived system coordinates in order to perform a soldering process on ...

SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO THE UNDERSIDE OF A PCB, METHOD OF REDUCING THE RATE OF OCCURRENCE OF DEWETTING OF A SOLDER NOZZLE

A soldering nozzle for delivering molten solder to the underside of a PCB. The nozzle comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle of the present invention achieves an improved dewetting performance. 1. A soldering nozzle for delivering molten solder to the underside of a PCB , the nozzle comprising a nozzle outlet , the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet , and the nozzle having an outer surface configured to support a return flow of molten solder , the nozzle also being adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.2. A nozzle according to claim 1 , the nozzle further comprising a nozzle body and a nozzle tip at the end of which the nozzle outlet is located claim 1 , the nozzle outlet having an inner width dimension of between 1.5 and 2.5 mm.3. A nozzle according to claim 1 , wherein the nozzle's outlet provides an upwards directed upper outlet and the or each aperture points its outlet generally downwards with respect to the upwards directed upper outlet.4. A soldering nozzle according to comprising first and second stackable parts configured such that in use they will be fluidly connected to allow molten solder to be pumped therethrough to overflow the nozzle outlet.5. A nozzle according to claim 4 , wherein the first and second stackable parts cooperate to define the or each aperture therebetween.6. A nozzle according to claim 4 , wherein the stackable parts claim 4 , once stacked ...

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XYθ stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion. 1. A solder ball printing apparatus that fills plural openings formed in a mask with solder balls using a squeegee and mounts the solder balls on plural electrode portions formed on a surface of a substrate facing the mask , the machine comprising:a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed;an XYθ stage which can drive a table on which the substrate mounting table is mounted in a horizontal plane;first vertically-driving means that can vertically drive the table on which the substrate mounting table is mounted;a mask absorption portion which has members including permanent magnets fitted into the plural hole portions formed in the back surface of the substrate mounting table; andsecond vertically-driving means which can vertically drive the mask absorption portion and is provided under the substrate mounting table,wherein the first vertically-driving means and the second vertically-driving means can be driven independently from each other.2. The solder ball printing apparatus according to claim 1 , wherein the members that are provided in the mask absorption portion and can be fitted into the plural hole portions of ...

PICKHEAD FOR SOLDER BALL PLACEMENT ON AN INTEGRATED CIRCUIT PACKAGE

Embodiments of the present disclosure are directed toward a pickhead for solder ball placement on an integrated circuit (IC) package, and associated systems and techniques. The pickhead may include a body having a bottom surface that defines a bottom plane of the pickhead. The pickhead may further include a plurality of cavities in the bottom surface to hold respective solder balls to be placed on the IC package. Individual cavities of the plurality of cavities may be recessed from the bottom surface by different recess amounts to provide different extensions of the solder balls with respect to the bottom plane. Other embodiments may be described and/or claimed. 1. A pickhead , comprising:a body having a bottom surface that defines a bottom plane of the pickhead; anda plurality of cavities in the bottom surface to hold respective solder balls to be placed on an integrated circuit (IC) package, wherein individual cavities of the plurality of cavities are recessed from the bottom surface by different recess amounts to provide different extensions of the solder balls with respect to the bottom plane.2. The pickhead of claim 1 , wherein the recess amounts correspond to a warpage pattern of the IC package.3. The pickhead of claim 1 , wherein the plurality of cavities include a first set of cavities including a plurality of cavities that are recessed by a first recess amount and a second set of cavities including a plurality of cavities that are recessed by a second recess amount claim 1 , wherein the second recess amount is less than the first recess amount.4. The pickhead of claim 3 , wherein the plurality of cavities further include a third set of cavities including a plurality of cavities that are recessed by a third recess amount.5. The pickhead of claim 3 , wherein the first set of cavities includes a plurality of cavities in an outer region of the pickhead claim 3 , and wherein the second set of cavities includes a plurality of cavities in a middle region of the ...

AUTOMATED WIRE PROCESSING SYSTEM AND METHODS

Systems and methods are provided for wire processing. In certain examples, a wire processing system may be disclosed. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing. 1. An apparatus comprising:a wire guide configured to receive and position a wire;a pair of solder sleeve pinchers associated with the wire guide, wherein each solder sleeve pincher comprises a pinching portion configured to hold the wire and/or a solder sleeve, and wherein the pair of solder sleeve pinchers are configured to move between at least a first pincher position, a second pincher position, and a third pincher position to hold and/or move the wire and/or the solder sleeve; anda pincher sensor coupled to at least one of the solder sleeve pinchers and configured to output sensor data associated with a position of the solder sleeve pincher.2. The apparatus of claim 1 , further comprising a controller communicatively connected to the pincher sensor and configured to receive sensor data from the pincher sensor and determine claim 1 , from the sensor data claim 1 , that the pair of solder sleeve pinchers are holding the solder sleeve.3. The apparatus of claim 2 , wherein the controller is further communicatively connected to the pair of solder sleeve pinchers and is further configured to:provide instructions to move the pair of solder sleeve pinchers between the first and second pincher positions; andprovide instructions to the pair of solder sleeve pinchers, after detecting that the solder sleeve pincher are holding the solder sleeve, to move to the third pincher position while holding the solder sleeve.4. The apparatus of claim 1 , wherein the pair of solder sleeve pinchers are configured to rotate to hold the wire and/or the ...

Device For Soldering Electrical Or Electronic Components

A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

NOZZLE FOR CONNECTING OR DISCONNECTING SOLDER JOINTS BETWEEN HEAD BONDING PADS IN A HARD DISK DRIVE, AND LASER SOLDERING OR REFLOWING TOOL WITH THE SAME

A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation. 1. A nozzle for connecting or disconnecting solder joints between head bonding pads of a head gimbal assembly for a hard disk drive , comprising:a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads of a head gimbal assembly; anda central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip;wherein the tip when positioned in proximity to the head bonding pads comprises a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.2. The nozzle according to claim 1 , wherein the interference-free structure includes a chamfer-cut formed on the side faces of the tip.3. The nozzle according to claim 1 , wherein the interference-free structure ...

METHOD AND DEVICE FOR JETTING DROPLETS

An ejector for jetting droplets of viscous media onto a substrate is disclosed. The ejector comprises a jetting nozzle having a nozzle space and a nozzle outlet, and an impacting device for impacting a volume of the viscous medium in the nozzle space such that droplets of viscous medium is jetted from the nozzle space through the nozzle outlet towards the substrate. The ejector also comprise a sensor arrangement arranged after the jetting nozzle in the jetting direction, wherein the sensor arrangement is adapted to detect a jetted droplet of viscous medium passing thereby. 130.-. (canceled).31. A method of jetting droplets of viscous medium onto a substrate , the method comprising the steps of:providing a jetting nozzle comprising a nozzle space and a nozzle outlet;providing a sensor arrangement after the jetting nozzle in the jetting direction;feeding said viscous medium into the nozzle space;impacting said viscous medium in the nozzle space, thereby jetting viscous medium from the nozzle space in the form of droplets through the nozzle outlet towards the substrate;monitoring a sensor parameter reflecting presence of viscous medium at the sensor arrangement; andgenerating a repair jetting program based on information detected by said sensor arrangement, wherein said repair jetting program is adapted to control an associated jetting process in order to jet a required amount of viscous medium onto required positions on said substrate, and wherein said associated, or supplemental, jetting process is performed in response to at least one of detection of missed shots, detection of droplets having a volume being outside a predetermined reference volume range, and/or detection of droplets having a velocity being outside a predetermined reference velocity interval.32. The method according to claim 31 , wherein said step of monitoring comprises:calculating at least one presence value (PV), said calculation including a comparison between at least one sensor value (SV) of ...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

A semiconductor package includes a semiconductor substrate, a first conductive pattern on the semiconductor substrate, a top surface of the first conductive pattern including a first inclined surface and a second inclined surface that are inclined with respect to a top surface of the semiconductor substrate, and a distance between the first and second inclined surfaces decreasing away from the top surface of the semiconductor substrate, a second conductive pattern extending along the top surface of the first conductive pattern; and a solder ball disposed on the second conductive pattern. 1. A semiconductor package , comprising:a semiconductor substrate;a first conductive pattern on the semiconductor substrate, a top surface of the first conductive pattern including a first inclined surface and a second inclined surface that are inclined with respect to a top surface of the semiconductor substrate, and a distance between the first and second inclined surfaces decreasing away from the top surface of the semiconductor substrate;a second conductive pattern extending along the top surface of the first conductive pattern; anda solder ball disposed on the second conductive pattern.2. The semiconductor package as claimed in claim 1 , wherein the first and second inclined surfaces extend from opposing sidewalls of the first conductive pattern claim 1 , respectively.3. The semiconductor package as claimed in claim 1 , wherein the first and second inclined surfaces are upwardly convex.4. The semiconductor package as claimed in claim 1 , wherein the first conductive pattern is not in direct contact with the solder ball.5. The semiconductor package as claimed in claim 1 , wherein a width of the second conductive pattern increases away from the top surface of the semiconductor substrate.6. The semiconductor package as claimed in claim 1 , wherein a width of a bottom surface of the first conductive pattern is less than a width of a top surface of the second conductive pattern.7. ...

Estimation device

A soldering device includes a detection sensor which can detect a liquid level height of molten solder inside a solder bath. It is determined whether or not a detection height which is the detected liquid level height is greater than or equal to a first set height which is arbitrarily set. In a case where the detection height is greater than or equal to the first set height, it is estimated that the amount of molten solder capable of performing a soldering work for a predetermined number or more of boards is stored in the solder bath. The amount of molten solder stored in the solder bath is estimated by multiplying a difference between a detection height which is the detected liquid level height of the molten solder and a second set height which is preset, by an area inside the solder bath in a horizontal direction.

SOLDERING MODULE

A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot. 11014181418342628384026282224141826282214242218. A soldering module () for a soldering system for selective wave soldering , having at least one first solder pot () and at least one second solder pot () , wherein the at least one first solder pot () and the at least one second solder pot () are displaceable along an x-axis by means of an x-axis drive () , along a y-axis by means of a y-axis drive ( , ) , and along a z-axis by means of a z-axis drive ( , ) , wherein the x-axis , the y-axis and z-axis are all arranged orthogonally in relation to each other , characterized in that two y-axis drives ( , ) and two moving devices ( , ) are provided on which the at least one first solder pot () and the at least one second solder pot () are displaceable along the y-axis by means of the two y-axis drives ( , ) , wherein a first moving device () is associated with the at least one first solder pot () , and wherein a second moving device () which is different from the first moving device () is associated with the at least one second solder pot ().2102628. A soldering module () according to claim 1 , characterized in that a first y-axis drive () can be operated independently of a second y-axis drive ().31010322224. A soldering module () according to claim 1 , ...

APPARATUS AND METHOD FOR AUTOMATED SOLDERING PROCESS

In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire. 1. An apparatus for an automated soldering process comprising:a stepper motor to provide solder;a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire;a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire; anda first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.2. The apparatus of claim 1 , wherein the first heating device is positioned on the terminal fixture to heat the terminal and the exposed portion of the wire.3. The apparatus of claim 2 , wherein the first heating device is a first resistive heating device.4. The apparatus of further comprising a sequential controller configured to control the stepper motor including a rotor to rotate at a predetermined number of degrees to provide the solder to the hot end.5. The apparatus of claim 1 , wherein the hot end provides a predetermined amount of the liquified solder to the terminal and to the exposed portion of the wire.6. The apparatus of further comprising at least one thermocouple positioned on the casing to provide a ...

GUIDING BOARD FOR A BALL PLACEMENT MACHINE

A guiding board for a ball placement machine has a board body. The board body has a top surface, a bottom surface, a ball-dropping area, and multiple guiding grooves. The ball-dropping area is defined on the top surface. The guiding grooves are defined in the ball-dropping area and are parallel to each other. Each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body. 1. A guiding board for a ball placement machine comprising: a top surface;', 'a bottom surface;', 'a ball-dropping area defined on the top surface; and', 'multiple guiding grooves defined in the ball-dropping area and being parallel to each other, wherein each guiding groove has a bottom and multiple ball-dropping holes defined in the bottom and extending through the bottom surface of the board body., 'a board body having'}2. The guiding board as claimed in claim 1 , wherein the board body further hasa ball-collecting area defined on the top surface of the board body and located at a position being adjacent to a front end of the ball-dropping area; andmultiple collecting grooves defined in the ball-collecting area and respectively aligned and communicating with the multiple guiding grooves.3. The guiding board as claimed in claim 2 , wherein a distance defined between the bottom of each guiding groove and the bottom surface of the board body is smaller than a distance between the top surface and the bottom surface of the board body.4. The guiding board as claimed in claim 3 , wherein the board body further has multiple elongated protrusions formed on and protruding from the top surface of the board body claim 3 , being parallel to each other claim 3 , and located respectively between adjacent two of the guiding grooves.5. The guiding board as claimed in claim 4 , wherein each guiding groove has a U-shaped cross section.6. The guiding board as claimed in claim 5 , wherein the board body further hasa retrieval area ...

APPARATUS AND METHOD FOR FILLING A BALL GRID ARRAY

An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the base and configured to be rotatable about a first axis perpendicular to the base. An upper surface of the plate includes a plurality of holes forming the ball grid array template. The stationary ball supply bin is mounted to the base. The base is configured to be inclined at an angle relative to a horizontal plane. The ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis. 1. An apparatus for filling a ball grid array template , the apparatus comprising:a flat base;a plate mounted on the base and configured to be rotatable about a first axis perpendicular to the base, an upper surface of the plate comprising a plurality of holes forming the ball grid array template; anda stationary ball supply bin mounted to the base,wherein the base is configured to be inclined at an angle relative to a horizontal plane; andwherein the ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis.2. The apparatus as claimed in claim 1 , wherein the plate comprises a first plate member mounted on the base and a second plate member coupled to the first plate member such that the first plate member rotationally drives the second plate member.3. The apparatus as claimed in claim 2 , wherein the plurality of holes are disposed on an upper surface of the second plate member.4. The apparatus as claimed in claim 1 , wherein the angle relative to the horizontal plane is adjustable based on a size of the balls and a speed of rotation of the plate.5. The apparatus as claimed in claim 1 , wherein ...

SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING

The present disclosure relates to a method, to distribute a solder-reinforced adhesive on a first substrate (), comprising (i) positioning the first substrate () to receive an adhesive composite () including, an adhesive () and a plurality of solder balls () on a first contact surface () of the first substrate (), (ii) applying, by a distribution nozzle (), on the first contact surface (), the adhesive composite (), and (iii) distributing, by a conductive spreader (), the adhesive composite (). The present disclosure further relates to a method to determine electrical resistance of an solder-reinforced adhesive between a first substrate () and a second substrate (), comprising (i) applying, by a distribution nozzle (), on a first contact surface () of the first substrate (), an adhesive composite () including, an adhesive () and a plurality of solder balls (), (ii) positioning, to a portion of the adhesive composite () opposite the first contact surface (), a second contact surface () of the second substrate (), (iii) attaching, to the first substrate () and the second substrate (), at least one electrical resistance detector (), and (iv) applying, to the first substrate () and the second substrate (), an electrical current. 1110. A method , to distribute a solder-reinforced adhesive on a first substrate () , comprising:{'b': 205', '115', '110', '200, 'applying, by a first distribution nozzle (), on a first contact surface () of a first substrate (), an adhesive ();'}{'b': 205', '300', '300', '200, 'applying, by a second distribution nozzle (), a plurality of solder balls (), such that at least one of the plurality of solder balls () is within the adhesive (); and'}{'b': 520', '300', '300', '115, 'distributing, by a conductive spreader (), the plurality of solder balls (), such that at least one of the plurality of solder balls () is in contact with the first contact surface ().'}2520212115300200. The method of claim 1 , wherein the conductive spreader () traverses ...

SOLDERING MODULE

The invention relates to a soldering module () for the, in particular selective, soldering of components to a circuit board (), having a soldering nozzle () for creating a solder wave. It is proposed that the soldering module () comprises a linear conveyor (), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board () by moving the circuit board () in a conveying direction over the solder wave, and that the linear conveyor () is tiltable, in particular about a first tilting axis (). 1. A soldering module for the , in particular selective , soldering of components to a circuit board having a soldering nozzle for creating a solder wave ,the soldering module comprising a linear conveyor, in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board by moving the circuit board in a conveying direction over the solder wave, and in that the linear conveyor is tiltable, in particular about a first tilting axis.2. The soldering module as claimed in claim 1 , wherein the first tilting axis is oriented substantially perpendicularly to a direction of gravitational force.3. The soldering module as claimed in claim 1 , wherein the linear conveyor is tiltable about the first tilting axis such that the normal of the circuit board encloses an angle of at least 4° claim 1 , preferably of at least 8° claim 1 , more preferably of at least 10° claim 1 , with the direction of gravitational force.4. The soldering module as claimed in claim 2 , wherein the first tilting axis is oriented substantially perpendicularly to a conveying direction or substantially parallel to the conveying direction.5. The soldering module as claimed in claim 4 , wherein the linear conveyor is tiltable about a second tilting axis claim 4 , wherein the second tilting axis is oriented substantially normal to the direction of gravitational force.6. The soldering module as claimed in claim 5 , wherein the first tilting axis and/or the second tilting ...

Device for assembling a chip on a substrate by providing a solder-forming mass

A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.

Apparatus and Method for Placing and Mounting Solder Balls on an Integrated Circuit Substrate

An apparatus for placing and mounting solder balls on an integrated circuit substrate contains: a fixture, a vacuuming device, a guiding plate, and a storage tank. The fixture includes a plurality of first grooves defined therein, the vacuuming device is disposed over the fixture and includes a vacuum chamber which has an air pore so that when air is drawn out of the vacuum chamber via the air pore, a plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released. The guiding plate is secured below the fixture, and the storage tank is arranged below the guiding plate and is applied to accommodate the plurality of solder balls. Thereby, a production yield of placing and mounting the plurality of solder balls on an integrated circuit substrate is enhanced. 1the fixture includes a plurality of first grooves defined therein, and each first groove has an upper opening and a lower opening, a diameter of the upper opening is less than that of the lower opening, and each first groove is provided to receive a respective one of a plurality of solder balls, and the fixture also includes a plurality of through holes formed therein and located on the plurality of first grooves;the vacuuming device is disposed over the fixture and includes a vacuum chamber arranged therein and having a plurality of connecting orifices for corresponding to the plurality of through holes of the fixture, the vacuum chamber has an air pore defined on a central portion thereof so that when air is drawn out of the vacuum chamber via the air pore, the plurality of solder balls are attached, and when the air is fed into the vacuum chamber from the air pore, the plurality of solder balls are released, the vacuuming device includes a turning assembly fixed on two sides thereof so as to leftward or rightward rotate the fixture, the vacuuming device, the guiding plate, and the storage tank over 180 degrees;the guiding ...

SOLDER BALL ATTACHING APPARATUS, FLUX DOTTING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

A solder ball attaching apparatus includes first protrusions on a surface of a first body and a first vacuum part connected to the first vacuum holes. The first protrusions include first vacuum holes and are configured to detachedly hold solder balls. A distance between adjacent ones of the first protrusions is greater than at least a diameter of the solder balls. 1. A solder ball attaching apparatus comprising:first protrusions on a surface of a first body, the first protrusions including first vacuum holes and configured to detachedly hold solder balls, a distance between adjacent ones of the first protrusions being greater than at least a diameter of the solder balls; anda first vacuum part connected to the first vacuum holes.2. The solder ball attaching apparatus of claim 1 , wherein each of the first protrusions protrudes from the surface of the first body by a height greater than at least the diameter of the solder balls.3. The solder ball attaching apparatus of claim 1 , further comprising:second protrusions on a surface of a second body, the second protrusions including second vacuum holes and configured to detachedly hold solder balls,wherein a distance between adjacent ones of the second protrusions is greater than at least the diameter of the solder balls.4. The solder ball attaching apparatus of claim 3 , whereinthe first body is on the second body, andone of the second protrusions is between adjacent ones of the first protrusions.5. The solder ball attaching apparatus of claim 3 , further comprising:a first vacuum line connected to the first vacuum holes and the first vacuum part;a first valve on the first vacuum line;a second vacuum line connected to the second vacuum holes and the first vacuum part; anda second valve on the second vacuum line.6. The solder ball attaching apparatus of claim 3 , further comprising:a second vacuum part connected to the second vacuum holes.7. The solder ball attaching apparatus of claim 1 , wherein the first body includes ...

Separating Strip Arrangement for a Soldering Nozzle and Soldering Nozzle Device for Selective Wave Soldering

The invention relates to an arrangement of at least two solder-wettable separating strips () for a soldering nozzle, for simultaneous wave soldering of rows of soldering points, said rows being arranged so as to be spaced apart. 1. A separating strip arrangement comprising:at least two solder-wettable separating strips for a soldering nozzle for simultaneous selective wave soldering, wherein the at least two separating strips are oriented parallel to one another and are connected fixedly as a group of separating strips to form a strip assembly; andat least two rows of soldering points arranged so as to be spaced apart, in a soldering installation, wherein a depth of the separating strips, for generating a surface tension suctioning off excess solder from the soldering points, along a solder influx direction, amounts to at least a multiple of a thickness of the separating strips.2. The separating strip arrangement according to claim 1 , in which the separating strips have a depth of 4 to 8 mm.3. The separating strip arrangement according to claim 1 , in which the separating strips are connected to one another to form a strip assembly with spacers interposed between the separating strips.4. The separating strip arrangement according to claim 1 , in which the separating strips claim 1 , together with at least one bridge connecting the separating strips claim 1 , forms a one-piece strip assembly.5. The separating strip arrangement according to claim 1 , in which the separating strips claim 1 , together with a frame connecting the separating strips claim 1 , forms a one-piece strip assembly.6. The separating strip arrangement according to claim 4 , in which the strip assembly is a solid metal block with material removed.7. The separating strip arrangement according to claim 4 , in which the the material is removed by water jet cutting claim 4 , wire-electro discharge machining claim 4 , or laser beam cutting.8. (canceled)9. The separating strip arrangement according to ...

ATTACHING AN SMD TO AN INSULATING LAYER WITH A SOLDER JOINT IN A CAVITY FORMED IN AN INSULATING LAYER

The invention relates to a method (S) for attaching an SMD to a printed circuit (), comprising the following steps: —applying an insulating layer () (S) onto the printed circuit (), —forming a cavity () in the insulating layer () above the conductive layer () (S) of the printed circuit, —filling the cavity () with a solder paste (), —positioning the SMD over the cavity () (S), and —applying a heat treatment (S) to the printed circuit (). 1. A process for attaching an electronic component to a printed circuit , said printed circuit comprising a connecting surface having at least one conductive layer and defining an axis Z , said axis Z being normal to the connecting surface , the attachment process S comprising the following steps:applying an insulating layer comprising an electrically insulating material to the connecting surface of the printed circuit, the insulating layer having a minimum thickness determined along the axis Z,forming a cavity in the insulating layer above the conductive layer so that at least part of the conductive layer is exposed, the cavity having a minimum depth determined along the axis Z,filling the cavity with a metal alloy accompanied by a soldering fluxpositioning the electronic component over the cavity,applying a heat treatment to the printed circuit on which the component is placed in order to transform the metal alloy together with the soldering flux into a solder joint so as to attach the component to the printed circuit,the minimum thickness of the insulating layer is such that the depth of the cavity is at least equal to 100 μm, andwherein the electrically insulating material of the insulating layer has a first coefficient of thermal expansion along the axis Z, the metal alloy has a second coefficient of thermal expansion along the axis Z, and wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion.2. The attachment process as claimed in claim 1 , wherein the steps of applying ...

PRE-HEATER LATCH AND SEAL MECHANISM FOR WAVE SOLDER MACHINE AND RELATED METHOD

A wave solder machine includes a pre-heating station, a wave soldering station, and a conveyor to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station. The tunnel has a substantially oxygen-free environment. The pre-heating station includes a pre-heater including a support frame assembly, and a heater assembly supported by the support frame assembly. The heater assembly is slidably coupled to the support frame assembly between an operational position and a non-operational position. The pre-heater further includes a seal disposed between the heater assembly and the support frame assembly. The seal provides a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel. 1. A wave solder machine configured to perform a wave solder operation on an electronic substrate , the wave solder machine comprising:a pre-heating station configured to heat the electronic substrate;a wave soldering station configured to attach electronic components to the electronic substrate with solder; anda conveyor configured to transport substrates through a tunnel passing through the pre-heating station and the wave soldering station, the tunnel having a substantially oxygen-free environment, a support frame assembly forming part of the tunnel,', 'a heater assembly supported by the support frame assembly, the heater assembly being slidably coupled to the support frame assembly between an operational position and a non-operational position, and', 'at least one seal disposed between the heater assembly and the support frame assembly, the at least one seal providing a gas-tight seal when the heater assembly is in the operational position to prevent atmosphere from entering the tunnel thereby preserving the substantially oxygen-free environment within the tunnel., 'wherein the pre-heating station includes at ...

LIQUID AGENT SUPPLY DEVICE AND LIQUID AGENT SUPPLY METHOD

A liquid agent supply device includes: a holder that holds a board; a supply head including a plurality of nozzles for supplying a liquid agent to a plurality of supply positions on the board held by the holder are arranged; and a supply head mover that relatively moves the board and the supply head, wherein the supply head mover relatively moves the board and the supply head according to a first movement method in which the board and the supply head relatively move along a specific direction determined regardless of supply positions among the plurality of supply positions, in a supply range including the plurality of supply positions. 1. A liquid agent supply device , comprising:a holder that holds a board;a supply head including a plurality of nozzles for supplying a liquid agent to a plurality of supply positions on the board held by the holder are arranged; anda relative mover that relatively moves the board and the supply head, whereinthe relative mover relatively moves the board and the supply head according to a first movement method in which the board and the supply head relatively move along a specific direction determined regardless of supply positions among the plurality of supply positions, in a supply range including the plurality of supply positions.2. The liquid agent supply device according to claim 1 , whereinwhen the plurality of nozzles move according to the first movement method, the supply head supplies the liquid agent to the supply positions without relatively stopping at the supply positions.3. The liquid agent supply device according to claim 1 , whereinthe board and the supply head reciprocate relatively along the specific direction in the first movement method.4. The liquid agent supply device according to claim 3 , whereina route in which the board and the supply head reciprocate relatively includes an outward route and a return route with an interval therebetween.5. The liquid agent supply device according to claim 4 , whereinthe ...

Method for Enhancing the Yield Rate of Ball Implanting of a Substrate of an Integrated Circuit

A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier. 1. A ball implanting method , comprising:a first step of providing a suction fixture which has a plurality of ball grooves and a plurality of through holes each connected to a respective one of the ball grooves;a second step of providing an evacuating device which is combined with the suction fixture and has a plurality of connecting holes each connected to a respective one of the through holes of the suction fixture, a vacuum chamber connected to each of the connecting holes, and an air hole connected to the vacuum chamber;a third step of providing two pivoting and inverting devices which are mounted on the evacuating device;a fourth step of providing a guide plate which has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture;a fifth step of providing a ball carrier which is movably mounted on the guide plate and contains a plurality of solder balls;a sixth step of providing a substrate which has a plurality of soldering pastes;a seventh step of moving the guide plate to abut the suction fixture to connect each of the guide holes to the respective ball groove of the suction fixture;a eighth step of pivoting the ...

Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method

A solder-ball-supplying method, a solder-ball-supplying device and a solder-bump-forming method, which are flux-less and capable of being also applied to electrodes having a fine pitch. A substrate on which a resist with openings is positioned on electrode(s), which has a diameter of 10 through 30 μm, of the substrate is prepared. Next, plural solder balls SBL each having a grain diameter of 1 through 10 μm are shaken down to the opening(s) of the resist from a hopper and filled therein. Next, by sliding and moving a squeegee on an upper surface of the resist along X-Y direction, the solder balls SBL shaken down to the resist other than the openings are scrapped and removed and the solder balls SBL in the openings and around them are pushed into the openings by the squeegee. 1. A solder-ball-supplying method of supplying a solder ball into an opening of a mask member mounted on a substrate having an electrode , the method comprising:a first step of shaking plural solder balls down to the opening, formed on the electrode, from a hopper positioned over the substrate, a grain diameter of each solder ball being 1 through 10 μm; anda second step of moving a squeegee along a plane direction of the mask member to push and fill the shaken-down plural solder balls into the opening.2. The solder-ball-supplying method according to claim 1 , wherein a side or a diameter of the electrode is within a range of 10 through 30 μm.3. (canceled)4. The solder-ball-supplying method according to claim 1 , wherein in the first and second steps claim 1 , static electricity is eliminated from at least the plural solder balls shaken-down to the mask member.5. The solder-ball-supplying method according to claim 1 , wherein in the second step claim 1 , the plural solder balls shaken-down to the mask member are removed from the mask member using the squeegee.6. A solder-ball-supplying device that supplies solder balls into an opening of a mask member mounted on a substrate having an electrode ...

ELECTRONIC COMPONENT MOUNTING DEVICE

Maintenance of a flow tank is facilitated. A sub-module is provided adjacent to a main module. A board is introduced in the sub-module, and is heated by a heater that is at a heating position, is moved to the main module, solder is applied by a flow tank in parallel with insertion of a component by a component insertion device, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater is moved to a standby position, and the flow tank is moved to a maintenance position of the sub-module. Maintenance is performed on the flow tank and since the component insertion device is not present above the flow tank, it is possible to facilitate inspection, removal, and the like of the flow tank. 1. An electronic component mounting device comprising:an electronic component insertion device that inserts an electronic component into a board from one side of the board within a component mountable region that is set in advance; anda viscous fluid applying device that applies a viscous fluid to the board from the other side of the board in parallel with insertion of the electronic component into the board by the electronic component insertion device,wherein the viscous fluid applying device includes (a) at least one flow tank that accommodates the viscous fluid and ejects the viscous fluid, and (b) a flow tank moving device that moves each of the at least one flow tanks to not only the component mountable region, but also a region outside the component mountable region.2. The electronic component mounting device according to claim 1 ,wherein the region outside the component mountable region includes a maintenance region in which at least one maintenance operation is performed on at least one of the flow tanks.3. The electronic component mounting device according to claim 1 ,wherein the region outside the component mountable region includes at least one of an upstream side region and a downstream side region of the ...

DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS

The invention relates to a device () for the separate application of solder material deposits (), in particular solder balls, comprising a conveying device () for separately conveying the solder material deposits from a solder material reservoir () toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening () of an application nozzle () of the application device into an application position P wherein a first detector device () for triggering a treatment of the solder material deposit arranged in the application position P with laser radiation emitted by a laser device and a second detector device () for locating the solder material deposit are provided. 1. A device for the separate application of solder material deposits , said device comprising:{'b': 1', '2', '3, 'a conveying device separately conveying solder material deposits from a solder material reservoir toward an application device, the conveying device having transport holders formed as passage holes that can each be moved from a receiving position P, in which a solder material deposit is received from the solder material reservoir, into a transfer position P, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening of an application nozzle of the application device into an application position P;'}{'b': '3', 'a first detector device triggering a treatment of the solder material deposit arranged in the application position P with laser radiation emitted by a laser device; and'}a second detector device locating the solder material deposit.22. The device ...

SOLDER BALL FEEDING DEVICE

The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device. 1. A method for dispensing a metered feeding amount of solder balls from a solder ball reservoir to a discharge device using a solder ball feeding device comprisinga solder ball reservoir receiving an amount of solder balls anda metering device dispensing the metered feeding amount of solder balls; wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device applying vibrations to the dispensing nozzle, and the solder ball reservoir being provided with a pressure connection connected to a pressurized gas device and introducing a pressurized gas into the solder ball feeding device, the method comprising:applying a pressurized gas to the amount of solder balls received in a receiving chamber of the solder ball reservoir by applying a pressure cushion to the amount of solder balls while simultaneously applying vibrations.2. The method of claim 1 , wherein the ultrasound device is independent of the dispensing nozzle.3. The method of claim 2 , wherein the ultrasound device is arranged on a container body of the solder ball reservoir.4. The method of claim 3 , wherein the ultrasound device is detachably arranged on the container body of the solder ball reservoir by a support device.5. The method of claim 1 , wherein the pressure connection is arranged above a receiving chamber formed in ...

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole. 1. A computer usable program product comprising a computer readable storage device including computer usable code for increasing solder hole-fill in a Printed Circuit Board Assembly (PCBA) , the computer usable code comprising:computer usable code for causing, in the PCBA, a pin of a device to move in a first direction, the PCBA comprising a Printed Circuit Board (PCB) and the device, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material,the causing the pin to move resulting in drawing the solder material into the hole up to a second distance, wherein the second distance is greater than the first distance; andcomputer usable code for allowing the pin to move in a second direction, wherein the move in the second direction returns the pin to an initial position in the hole, and wherein the allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.2. The computer usable program product of claim 1 , further comprising:computer usable code for repeating, the causing, the drawing, and the allowing a number of times at a ...

LOGIC SWITCHING DEVICE AND METHOD OF MANUFACTURING THE SAME

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode. 1. A logic switching device comprising:a channel;a source and a drain both connected to the channel;a gate electrode arranged to face the channel; anda domain switching layer between the channel and the gate electrode,wherein the domain switching layer comprises at least one structure including at least one ferroelectric material region comprising a ferroelectric domain and at least one anti-ferroelectric material region comprising an anti-ferroelectric domain, andwherein the ferroelectric material region has a negative capacitance, the anti-ferroelectric material region has a positive capacitance and the sum of the two capacitances is positive, respectively during the logic switching device operation.2. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction parallel to the gate electrode.3. The logic switching device of claim 1 , wherein the domain switching layer comprises the at least one ferroelectric material region and the at least one anti-ferroelectric material region are arranged in a direction perpendicular to the gate electrode.4. The logic switching device of claim 1 , wherein the domain switching layer comprises two structures claim 1 , a first structure including the at least one ferroelectric material region and the at least ...

ROBOT APPARATUS FOR SOLDERING

The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder. 1. A robot apparatus comprising:a robot having a plurality of joints;operation tools each of which is connected to the robot;a solder pot having a container for melting and storing solder and a nozzle from which the solder flows out;a table disposed above the robot and supporting a workpiece;a placement member on which the operation tools and the solder pot can be placed; anda controller for controlling the robot, whereinthe operation tools include a flux ejection tool for ejecting soldering flux, and a support tool for supporting the solder pot,the robot has a function of automatically replacing the operation tools,the operation tools and the solder pot are placed on the placement member, andthe controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to a portion of the workpiece to be soldered, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so that the workpiece is heated by heat released from the solder pot, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder to the portion to be soldered.2. The robot apparatus according to claim 1 , comprising a table drive device for rotating the ...

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATMENT METHOD, AND SYSTEM THEREFOR

A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. (canceled)12. (canceled)13. (canceled)14. (canceled)15. (canceled)16. (canceled)17. (canceled)18. (canceled)19. (canceled)20. (canceled)21. (canceled)22. (canceled)23. (canceled)24. (canceled)25. (canceled)26. A heating and melting treatment system for forming a heat-melting material by heating a member with said heat-melting material attached and performing heating and melting treatment on said heat-melting material , the heating and melting treatment system comprising:an application unit for applying said heat-melting material onto the member, and applying a temporary bonding agent onto a surface of the member in order to temporarily bond said heat-melting material;a heating unit for heating the member with said heat-melting material temporarily bonded with said temporary bonding agent interposed therebetween; anda providing unit for providing carboxylic acid vapor to the member in a chamber,wherein before said heat-melting material is melted or while said heat-melting material is melted, the heating unit evaporates said temporary bonding agent in the chamber in which temporarily enhances a vacuum degree so that said temporary bonding agent is easily evaporated, and on the other hand, the heating unit heats the member so as to form said heat-melting material without flux in an atmosphere including the carboxylic acid vapor.27. The heating and melting treatment system according to claim 31 , whereinsaid heat-melting material is a solder material or a eutectic-bonding agent.28. The heating and melting treatment system according to claim 31 , whereinsaid temporary bonding agent is a non-reducing organic agent.29. The heating and melting treatment system according to claim 33 , wherein{' ...

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

A system of producing metal cored solder structures on a substrate includes: a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal; a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal; the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; and receiving elements of a substrate being configured to receive the metal core solder contacts thereon, and the metal core solder contacts being exposed and positioned on the substrate. 1. A system for producing metal cored solder structures on a substrate , comprising:a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal;a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal;the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; andreceiving elements of a substrate being configured to receive the metal core ...

SOLDERING APPARATUS

A soldering apparatus includes a solder bath, an ejection nozzle and a solder flow slowing ramp. The solder bath is configured to hold molten solder. The ejection nozzle ejects the molten solder supplied from the solder bath. The solder flow slowing ramp i) is disposed adjacent to an outlet of the ejection nozzle and receives the molten solder overflowing from the ejection nozzle, and ii) downwardly slopes toward a liquefied solder surface of the molten solder in the solder bath so as to return the molten solder overflowing from the ejection nozzle to the solder bath. 1. A soldering apparatus comprising:a solder bath configured to hold molten solder;an ejection nozzle that ejects the molten solder supplied from the solder bath; anda solder flow slowing ramp that i) is disposed adjacent to an outlet of the ejection nozzle and receives the molten solder overflowing from the ejection nozzle, and ii) downwardly slopes toward a liquefied solder surface of the molten solder in the solder bath so as to return the molten solder overflowing from the ejection nozzle to the solder bath.2. The soldering apparatus according to claim 1 , whereina base end portion of the ramp is rotatably attached to the ejection nozzle and rotates about a rotation axis that is parallel to the liquefied solder surface of the molten solder in the solder bath, anda tip end portion of the ramp is configured to float on the liquefied solder surface of the molten solder in the solder bath.3. The soldering apparatus according to claim 2 , whereina specific weight of a material from which the ramp is made is lighter than a specific weight of the molten solder.4. The soldering apparatus according to claim 2 , whereinthe tip end portion of the ramp is buoyant relative to the molten solder.5. The soldering apparatus according to claim 1 , further comprising:a catchment that is provided at a midway position of the ramp to temporarily hold the molten solder.6. The soldering apparatus according to claim 1 , ...

SELECTIVE SOLDERING SYSTEM

The invention relates to a selective soldering plant for the soldering of electronic circuit boards, at least one container for liquid solder, a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided, an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement, and an inflow device being provided, through which gas, in particular protective gas, can in any event flow into the region below the inner shielding device. It is proposed that an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow be provided. 1. A selective soldering plant for the soldering of electronic circuit boards , at least one container for liquid solder , a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided , an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement , and an inflow device being provided , through which gas , in particular protective gas , can in any event flow into the region below the inner shielding device , wherein an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow is provided.2. The selective soldering plant as claimed in claim 1 , wherein the inner shielding device has a cover plate which claim 1 , in a standby position claim 1 , is positioned above the at least one soldering nozzle and which can be lowered into a soldering position in such a way that the at least one soldering nozzle projects through a cover plate orifice claim 1 , assigned to the soldering nozzle claim 1 , in the cover plate claim 1 , preferably in that claim 1 , ...

MOLTEN METAL DISCHARGING DEVICE AND METHOD FOR DISCHARGING MOLTEN METAL

A molten metal discharging device according to the present invention that discharges a molten metal and bonds components with the molten metal discharged includes: a syringe having a tube shape that houses the molten metal therein; a shaft that slides inside the syringe to press the molten metal; a heater (syringe heat insulating heater) that is provided around the syringe and heats the molten metal to maintain a molten state; and the syringe including a shaft sliding portion in which the shaft slides and a nozzle that has an inner diameter smaller than that of the shaft sliding portion and discharges the molten metal from an opening at a tip thereof, a rotation mechanism that rotates the syringe, a rotation center of the rotation being an extending direction of the nozzle, a coating that repels the molten metal being applied to an interior wall of the nozzle. 1. A molten metal discharging device that discharges a molten metal and bonds components with said molten metal discharged , said molten metal discharging device comprising:a syringe having a tube shape that houses said molten metal therein;a shaft that slides inside said syringe to press said molten metal; 'said syringe including a shaft sliding portion in which said shaft slides and a nozzle that has an inner diameter smaller than that of said shaft sliding portion and discharges said molten metal from an opening at a tip thereof,', 'a heater that is provided around said syringe and heats said molten metal to maintain a molten state; and'}a rotation mechanism that rotates said syringe, a rotation center of the rotation being an extending direction of said nozzle,wherein a coating that repels said molten metal is applied to an interior wall of said nozzle.2. The molten metal discharging device according to claim 1 , further comprising a gas piping for spraying gas onto the inside of said nozzle.3. The molten metal discharging device according to claim 1 , whereina cross section of said nozzle along the ...

CONTINUOUS SOLDER TRANSFER TO SUBSTRATES

In an Injection Molded Soldering system, a single, one-layer decal has one or more through hole patterns where each through hole pattern has a plurality of through holes through the decal. A drum with a drum circumference turns while the decal is forced to be adjacent to the drum circumference. The decal passes by a tangent point on the drum circumference where one or more solder-filled through hole patterns align with recessed openings on a substrate at the tangent point of the drum circumference. Applied heat causes the solder structures to melt and flow into the recessed openings. 1. An injection molded solder system comprising:a decal with one or more through hole patterns, each through hole pattern having a plurality of through holes through the decal, the decal capable of being driven in a decal direction, the through holes having a through hole top with a top width and a through hole bottom with a bottom width, the top width being wider than the bottom width;a substrate belt capable of holding a plurality of substrates, the substrate belt driven in a belt direction;a fill head capable of injecting the through holes with solder as the through hole pattern is driven past the protrusion fill head causing a solder structure to form within each of one or more of the through holes; anda drum with a drum circumference, the decal forced to be adjacent to the drum circumference and the drum circumference and decal turning and passing a tangent point, wherein as each of the solder structures are aligned with a recessed opening on a substrate at the tangent point heat causes the solder structures to melt and flow into the recessed opening.2. A system claim 1 , as in claim 1 , where the heat is provided by any one or more of the following: hot gas from an opening in the drum at the tangent point claim 1 , the drum circumference temperature claim 1 , and a heated pressure plate that holds the substrate and decal against the drum circumference at the tangent point.3. A ...

SOLDERING APPARATUS AND SOLDERING METHOD

A soldering apparatus including: a chamber configured to contain solder and include an opening configured to discharge the solder in a bottom surface or a side surface; a pump configured to transport the solder to the chamber and an inner bath configured to communicate with the opening and perform soldering using the solder fed through the opening 1. A soldering apparatus comprising:a chamber configured to contain solder and include an opening configured to discharge the solder in a bottom surface or a side surface;a pump configured to transport the solder to the chamber; andan inner bath configured to communicate with the opening and perform soldering using the solder fed through the opening,whereinthe inner bath contains the solder and includes a discharge hole configured to discharge the contained solder in a bottom surface.2. The soldering apparatus according to claim 1 , whereinthe opening is present in the bottom surface of the chamber.3. The soldering apparatus according to claim 1 , whereinthe pump transports the solder from a lower side to an upper side in direction of gravity.4. The soldering apparatus according to claim 1 , whereinthe pump comprises a screw pump.5. The soldering apparatus according to claim 1 , whereinthe chamber includes a ventilation port configured to communicate with atmosphere.6. The soldering apparatus according to claim 1 , further comprising:an outer bath; a solder intake port configured to link the outer bath upper portion and the outer bath lower portion,', 'an inner bath coupling port configured to communicate with the inner bath,', 'a chamber coupling port configured to communicate with the chamber, and', 'an opening coupling port configured to communicate with the opening; and, 'a base plate configured to divide an interior of the outer bath into an outer bath upper portion configured to receive the solder discharged through the discharge hole and an outer bath lower portion, the base plate includinga shield plate configured ...

DEVICE FOR THE SEPARATE APPLICATION OF SOLDER MATERIAL DEPOSITS

The invention relates to a device () for the separate application of solder material deposits (), in particular solder balls, comprising a conveying device () for separately conveying the solder material deposits from a solder material reservoir () toward an application device (), the conveying device having transport holders that are formed as passage holes and that can each be moved from a receiving position, in which a solder material deposit is received from the solder material reservoir, into a transfer position P in which the solder material deposit is exposed to a pressure gas, and from which the solder material deposit is transferred to an application opening of an application nozzle () of the application device into an application position P wherein a detector device () is provided that serves to trigger a treatment of the solder material deposit arranged in the application position P with laser radiation emitted by a laser device, wherein the detector device has a reflection sensor () that detects reflection radiation () that is reflected by the solder material deposit arranged in the application position P 1. A device for the separate application of solder material deposits , said device comprising:{'b': 1', '2', '3, 'a conveying device separately conveying solder material deposits from a solder material reservoir toward an application device, the conveying device having transport holders formed as passage holes that can each be moved from a receiving position P, in which a solder material deposit is received from the solder material reservoir, into a transfer position P, in which the solder material deposit is exposed to a pressure gas and from which the solder material deposit is transferred to an application opening of an application nozzle of the application device into an application position P;'}{'b': '3', 'a detector device triggering a treatment of the solder material deposit arranged in the application position P with laser radiation emitted by a ...

SYSTEMS AND DEVICES FOR IMPROVED SOLDER DISPENSING

Systems and methods for soldering a workpiece using a solder application system. A nozzle includes a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder. The plurality of walls also define a soldering region that is external to the nozzle reservoir. The plurality of walls in the soldering region define holes that are configured to dispense the liquid solder from the nozzle reservoir. The holes are configured such that the liquid solder dispensed therefrom merges into a combined stream and the workpiece is soldered when placed into the combined stream 1. A nozzle for soldering a workpiece using a solder application system , the nozzle comprising:a plurality of walls and a floor that together define a nozzle reservoir for containing liquid solder filled up to a fill height therein, wherein the plurality of walls also define a soldering region that is external to the nozzle reservoir, wherein the plurality of walls in the soldering region define a plurality of holes that are each defined below the fill height and each configured to dispense a stream of the liquid solder from the nozzle reservoir;wherein when the liquid solder is filled up to at least the fill height, a head pressure is generated at each of the plurality of holes such that the stream of the liquid solder is dispensed therefrom; andwherein the nozzle is configured such that the workpiece is soldered when placed into the soldering region.2. The nozzle according to claim 1 , wherein the plurality of holes are defined such that the streams of the liquid solder dispensed therefrom merge into a combined stream claim 1 , and wherein the workpiece is soldered when placed into the combined stream.3. (canceled)4. The nozzle according to claim 2 , wherein the liquid solder is dispensed based only on head pressure caused by the fill height being higher than the plurality of holes.5. The nozzle according to claim 2 , wherein the plurality of holes include at least two ...

BALANCED CURRENT DISTRIBUTION STRUCTURE FOR LARGE CURRENT DELIVERY

Methods and apparatuses for balancing current delivery. The method couples a low resistance portion of a ball grid array (BGA) to an input portion by at least two vias forming a three-dimensional section. The method couples at least one ball of the BGA to the low resistance portion over a narrow trace. 1. An apparatus comprising:an input portion;a low resistance portion of a ball grid array (BGA) coupled to the input portion by at least two vias forming a three-dimensional section; andat least one ball of the BGA coupled to the low resistance portion over a narrow trace.2. The apparatus of claim 1 , wherein the BGA is comprised of at least four balls.3. The apparatus of claim 2 , wherein the at least two vias are positioned close to a third of the at least four balls.4. The apparatus of claim 2 , wherein the at least two vias are coupled to a fourth of the at least four balls.5. The apparatus of claim 2 , wherein the input portion is coupled between a third ball of the at least four balls and a fourth ball of the at least four balls.6. The apparatus of claim 2 , wherein a section between a first ball and a second ball of the at least four balls is narrower than other routing sections between the at least four balls.7. The apparatus of claim 1 , wherein the BGA is routed around a packet edge.8. The apparatus of claim 1 , wherein the BGA comprises an L-shaped package routing.9. The apparatus of claim 1 , further comprising a printed circuit board (PCB).10. The apparatus of claim 1 , further comprising a flip chip package.11. The apparatus of claim 1 , further comprising a wire bond package.12. A method for balancing current delivery claim 1 , the method comprising:coupling a low resistance portion of a ball grid array (BGA) to an input portion by at least two vias forming a three-dimensional section; andcoupling at least one ball of the BGA to the low resistance portion over a narrow trace.13. The method of claim 12 , wherein the BGA is comprised of at least four ...

MODULAR SOLDERING UNIT

A modular soldering station includes a first platform having a liquid reservoir and a solder dispenser, a power supply assembled to the first platform and configured to power a soldering iron, and a second platform assembled to one of the first platform or the power supply and having a fluid absorbent medium fluidly coupled to the liquid reservoir. 1. A modular soldering unit comprising:a first module having a liquid reservoir and a solder dispenser;a second module having a fluid absorbent medium fluidly coupled to the liquid reservoir;a pump configured to pump liquid contained in the liquid reservoir onto the fluid absorbent medium; anda set of soldering tool holders removably affixed to one of the first or second modules for holding a set of soldering tools, wherein the set of soldering tools include at least one of a brush, a pick, a wire stripper, a scissors, or a tweezers.2. (canceled)3. The modular soldering unit of wherein the set of soldering tools are configured to be rearrangable with respect to the set of soldering tool holders claim 1 , the first module claim 1 , or the second module.4. The modular soldering unit of wherein the set of soldering tool holders are removably affixed to one of the first or second modules.5. The modular soldering unit of wherein the set of soldering tool holders does not include a soldering iron holder.6. The modular soldering unit of wherein the soldering iron holder is configured to be selectively mounted on either of opposing walls of the first or second module.7. The modular soldering unit of wherein the first module includes at least one of a set of solder reels or a set of solder wick reels and a corresponding solder wick dispenser claim 1 , and claim 1 , respectively claim 1 , the solder dispenser dispenses solder from the set of solder reels claim 1 , or the solder wick dispenser that dispenses solder wick from the set of solder wick reels.8. The modular soldering unit of wherein the first module includes a wall having ...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

A method of pressing solder bumps using a pressing apparatus before testing a wafer, including loading the wafer into the pressing apparatus, where the wafer includes a number of chips, and the wafer is aligned with respect to a test head of the pressing apparatus. The test head includes a substrate which has pressing structures arranged across a surface of the substrate facing the wafer. The pressing structures contact the solder bumps, where the solder bumps include a first surface topology and the pressing structures include a pressing surface topology prior to the contact. The caused contact includes altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps then a second surface topology after the caused contact, and the second surface topology of the solder bumps matches the pressing surface topology after the caused contact. 1. A method of pressing a plurality of solder bumps prior to testing a wafer , the method comprising:loading the wafer into a pressing apparatus, wherein the wafer comprises a plurality of chips;aligning the wafer with respect to a test head of the pressing apparatus, wherein the test head comprises a substrate having a plurality of pressing structures disposed across a surface of the substrate facing the wafer at a pressing structure pitch of more than 20,000 pressing structures per square inch; andcausing the plurality of pressing structures to contact a plurality of solder bumps disposed across a surface of the wafer, wherein the plurality of solder bumps comprise a first surface topology and the plurality of pressing structures comprise a pressing surface topology prior to contact, wherein causing the contact comprises altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps comprise a second surface topology subsequent to the caused contact, and wherein the second surface topology of the plurality of solder bumps substantially matches the pressing ...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

A method of pressing solder bumps using a pressing apparatus before testing a wafer, including loading the wafer into the pressing apparatus, where the wafer includes a number of chips, and the wafer is aligned with respect to a test head of the pressing apparatus. The test head includes a substrate which has pressing structures arranged across a surface of the substrate facing the wafer. The pressing structures contact the solder bumps, where the solder bumps include a first surface topology and the pressing structures include a pressing surface topology prior to the contact. The caused contact includes altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps then a second surface topology after the caused contact, and the second surface topology of the solder bumps matches the pressing surface topology after the caused contact. 1. A method of pressing a plurality of solder bumps prior to testing a wafer , the method comprising:loading the wafer into a pressing apparatus, wherein the wafer comprises a plurality of chips;aligning the wafer with respect to a test head of the pressing apparatus, wherein the test head comprises a substrate having a plurality of pressing structures disposed across a surface of the substrate facing the wafer; andcausing the plurality of pressing structures to contact a plurality of solder bumps disposed across a surface of the wafer, wherein the plurality of solder bumps comprise a first surface topology and the plurality of pressing structures comprise a pressing surface topology prior to contact, wherein causing the contact comprises altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps comprise a second surface topology subsequent to the caused contact, and wherein the second surface topology of the plurality of solder bumps substantially matches the pressing surface topology subsequent to the caused contact.2. The method of claim 1 , wherein a ...

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

A method of pressing solder bumps using a pressing apparatus before testing a wafer, including loading the wafer into the pressing apparatus, where the wafer includes a number of chips, and the wafer is aligned with respect to a test head of the pressing apparatus. The test head includes a substrate which has pressing structures arranged across a surface of the substrate facing the wafer. The pressing structures contact the solder bumps, where the solder bumps include a first surface topology and the pressing structures include a pressing surface topology prior to the contact. The caused contact includes altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps then a second surface topology after the caused contact, and the second surface topology of the solder bumps matches the pressing surface topology after the caused contact. 1loading the wafer into a pressing apparatus, wherein the wafer comprises a plurality of chips;aligning the wafer with respect to a test head of the pressing apparatus, wherein the test head comprises a substrate having a plurality of pressing structures disposed across a surface of the substrate facing the wafer, wherein a pressing structure pitch of the plurality of pressing structures matches a solder bump pitch of a plurality of solder bumps disposed across a surface of the wafer, and wherein the pressing structure pitch is greater than 20,000 pressing structures per square inch; andcausing the plurality of pressing structures to contact the plurality of solder bumps disposed across the surface of the wafer, wherein the plurality of solder bumps comprise a first surface topology and the plurality of pressing structures comprise a pressing surface topology prior to contact, wherein causing the contact comprises altering a shape of each of the plurality of solder bumps, such that the plurality of solder bumps comprise a second surface topology subsequent to the caused contact, and wherein the ...

SOLDERING APPARATUS AND SOLDER NOZZLE MODULE THEREOF

A soldering apparatus and solder nozzle module thereof are provided. In one embodiment, the soldering apparatus includes a rectangular base; a plurality of columns disposed on edges of the base; a lower heating module vertically disposed through the base; a spooling mechanism disposed on both the base and the lower heating module; a belt conveyor mechanism disposed on the base and under the spooling mechanism; a movement mechanism moveably disposed on the columns at one side of the base and the columns at the other side of the base; and a solder nozzle module having two sides supported by the movement mechanism and disposed through the spooling mechanism to be disposed on the lower heating module. 1. A solder nozzle module disposed on a movement mechanism of a soldering apparatus , comprising:a frame secured to the movement mechanism and including at least two parallel bars, and a plurality of solder nozzles disposed under each bar;a plurality of positioning holes arranged in rows and disposed on each bar; anda plurality of adjustment members each disposed on the solder nozzle and besides the bar, each adjustment member including a fastening elements selectively sited to the positioning holes so as to alter the position between the bar and the fastening element.2. The solder nozzle module of claim 1 , wherein each adjustment member further comprises a first adjustment seat formed with the fastening element claim 1 , a first fine adjustment element disposed on the first adjustment seat claim 1 , a second adjustment seat secured to the solder nozzles claim 1 , and a second fine adjustment element secured to both the second adjustment seat and the first adjustment seat; and wherein the first fine adjustment element is configured to move along X-axis and the second fine adjustment element is configured to move along Y-axis respectively.3. The solder nozzle module of claim 1 , wherein each solder nozzle includes a pulse soldering electrode assembly.4. A soldering ...

SOLDERING SYSTEM, CONTROL DEVICE, CONTROL METHOD, AND PROGRAM

A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device. 1. A soldering system for jetting molten solder stored inside a solder bath to solder a solder workpiece , the soldering system comprising:a temperature measurer to measure a temperature distribution of a surface of the solder workpiece; anda driver to drive the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurer.2. The soldering system according to claim 1 , further comprising:an identifier to identify whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range; anda learning unit to obtain the control parameter when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range,wherein the driver drives the soldering system based on the control parameter obtained by the learning unit.3. The soldering system according to claim 2 , further comprising:a difference calculator to calculate the measured temperature distribution against a target temperature distribution, and obtain a difference between the measured temperature distribution and the target temperature distribution,wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.4. The soldering system according to claim 2 , further ...

Wave solder nozzle with automated adjustable sliding plate to vary solder wave width

A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame, a solder distribution baffle secured to the nozzle core frame, and a sliding plate that together define a nozzle. The sliding plate is movable with respect to the nozzle core frame between a close proximate position in which the nozzle is configured to produce a reduced width solder wave through the solder distribution baffle and a spaced apart position in which the nozzle is configured to produce an extended width solder wave through the solder distribution baffle.

Wave soldering device with a light emiiting device and a camera

The wave solder apparatus comprises a solder reservoir (4), a pump (5), a nozzle (6), a device (8) for transporting a printed circuit board (1) and a cover. The pump conveys solder from the reservoir through the nozzle, so that a hollow shaft is produced. A sensor is intended for monitoring the hollow shaft and comprises an illumination unit and a camera, which are housed in the cover. The illumination unit comprises a light source and a matted glass, transfers red light, and illuminates the hollow shaft with diffused light. The camera is directed to the hollow shaft. The wave solder apparatus comprises a solder reservoir (4), a pump (5), a nozzle (6), a device (8) for transporting a printed circuit board (1) and a cover. The pump conveys solder from the reservoir through the nozzle, so that a hollow shaft is produced. A sensor is intended for monitoring the hollow shaft and comprises an illumination unit and a camera, which are housed in the cover. The illumination unit comprises a light source and a matted glass, transfers red light, and illuminates the hollow shaft with diffused light. The camera is directed to the hollow shaft. A unit is intended for evaluating the images provided by the camera. The camera is housed in the area of the cover, which is separated from the hollow shaft by a glass pane.

Jetting apparatus and method of improving the performance of a jetting apparatus

A jetting apparatus for jetting droplets of viscous medium onto a substrate and a method of improving the performance of the jetting apparatus are provided. The jetting apparatus includes a jetting outlet through which the droplets are jetted, a flow generator for producing a flow of air past the jetting outlet for removing viscous medium residue at the jetting outlet, a receptacle for receiving viscous medium residue transported by the air flow away from the jetting outlet, and a flow path for the air flow between the jetting outlet and the flow generator, via the receptacle. A flow sensor is arranged in the flow path for measuring the air flow. An air flow signal representative of the air flow is obtained, the air flow signal is evaluated for determining at least one status of the jetting apparatus, and an indication of the status is provided.

Method for bonding flip chip on leadframe

Method for manufacturing printed wiring board

A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer provided on the surface of the wiring substrate, at least one conductor pad formed from a part of the conductor circuit exposed from an opening provided in the solder resist layer, and at least one solder bump for mounting electronic parts on the conductor pad. In the printed wiring board, since the at least one conductor pad is aligned at a pitch of 200 µm or less, and a ratio (W/D) of a diameter W of the solder bump to an opening diameter D of the opening formed in the solder resist layer is within a range of 1.05 to 1.7, connection reliability and insulation reliability can be easily improved.

Soldering apparatus

Homogenization of petroleum oil in molten solder is produced in stages in an agitation chamber formed about the outlet of a solder pump of a standing wave soldering machine. In the first stage, a high pressure stream of oil is directed at the pressure faces of the pump propeller blades to produce intermittent counteracting forces creating turbulence which reduces the oil to small particles and distributing them in the oppositely moving stream of molten solder. In the second stage, droplets or globules of oil remaining in the stream of oil and molten solder separate rising to the top of the agitation chamber to be drawn through an impeller agitator which completes the reduction of the oil globules to finely divided particles which are distributed uniformly throughout the surrounding molten solder by shearing action of the agitator. The homogenized mixture of oil and molten solder flows into a pressure tank of the soldering machine to produce a standing wave of solder at a duct orifice.

Mask for bumping solder ball on circuit board and solder ball bumping method using the same

The present invention relates to a mask for bumping a solder ball on a circuit board and a solder ball bumping method using the same. According to one embodiment of the present invention, the mask for bumping a solder ball on a circuit board includes opening parts which provides a space where a solder ball is inserted and mounted on a solder pad; and a trench which provides an inflow space for the spreading of flux to the mounting part of the solder ball on the solder pad and is extended from at least one side of the circumference of the opening part. Also, a mask for bumping a solder ball on a circuit board and a solder ball bumping method are disclosed.

Solder insertion device for crystal unit base brazing

내용 없음. No content.

INJECTION DEVICE AND METHOD FOR IMPROVING INJECTION DEVICE PERFORMANCE

一种线路板用自动焊锡装置

本发明涉及线路板技术领域，且公开了一种线路板用自动焊锡装置，包括液压杆，所述液压杆的下端固定连接有发热管，所述发热管的下端固定连接有焊咀，所述发热管的侧壁上开设有滑槽，所述滑槽的内部滑动连接有滑块，所述滑块的左端固定连接有支杆，所述支杆远离滑块的一端固定连接有锡管。该线路板用自动焊锡装置，通过发热管上升或下降时驱动第一齿条和焊咀上下移动，再通过第二齿轮、第三齿轮、第四齿轮以及第二齿条驱动锡管上下移动，且锡管的移动速度大于发热管的移动速度，则锡管通过支杆驱动滑块在滑槽内上下滑动，焊咀与锡管内的锡条间歇抵接和分离，模拟人工焊接，从而实现了自动焊接线路板、防止人工焊接发生安全事故的效果。

Welding device for ball type welding flux

本发明涉及激光焊接技术领域，尤其涉及一种球类焊料的焊接装置。本发明公开了一种球类焊料的焊接装置，所述球类焊料的焊接装置包括：料仓部、传输部、焊料检测部、焊接部和底板；所述料仓部用于存储球类焊料；所述传输部与所述料仓部连接，用于从所述料仓部取球类焊料并传输至所述焊料检测部和所述焊接部；所述焊料检测部用于检测所述传输部是否传输有球类焊料；所述焊接部用于接收所述传输部传输的球类焊料，并执行焊接操作；所述底板用于固定所述料仓部、所述传输部、所述焊料检测部和所述焊接部。本发明实现了球类焊料的存储、传输、检测和焊接的一体化，实现了以自动的方式操作焊接装置。