Настройки

Укажите год
-

Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

Подробнее
-

Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

Подробнее

Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Ведите корректный номера.
Укажите год
Укажите год
Применить Всего найдено 16629. Отображено 100.
29-04-2019 дата публикации

Безнамоточный индукционный нагреватель для пайки трубопроводов в монтажных условиях

Номер: RU0000188889U1
Автор: Илья Ильшатович Даутов, Олег Юрьев Щекатуров
Принадлежит: Публичное акционерное общество "Авиационная холдинговая компания "Сухой"

Полезная модель относится к технологическому процессу монтажной пайки ТВЧ трубопроводов, может быть использована для монтажной пайки трубопроводов диаметрами от 6 до 25 мм из стали и титановых сплавов.Задачей настоящей полезной модели является повышение качества, снижение трудоемкости монтажной пайки трубопровода.Решение поставленной задачи достигается тем, что в нижнем и верхнем полукорпусах «безнамоточного» индукционного нагревателя установлены полувитки в виде медных планок, припаянных к контактной группе. При соединении нижнего и верхнего полукорпусов через контактную группу образуется «безнамоточный» индукционный нагреватель. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 188 889 U1 (51) МПК B23K 3/047 (2006.01) B23K 1/002 (2006.01) H05B 6/36 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 3/047 (2019.02); B23K 1/002 (2019.02); H05B 6/36 (2019.02) (21) (22) Заявка: 2018143644, 10.12.2018 (24) Дата начала отсчета срока действия патента: 10.12.2018 29.04.2019 (56) Список документов, цитированных в отчете о поиске: RU 162830 U1, 27.06.2016. SU (45) Опубликовано: 29.04.2019 Бюл. № 13 1107972 А, 15.08.1984. SU 1299743 А1, 30.03.1987. RU 2122298 С1, 20.11.1998. WO 2012/022879 A1, 23.02.2012. R U (54) Безнамоточный индукционный нагреватель для пайки трубопроводов в монтажных условиях (57) Реферат: Полезная модель относится к Решение поставленной задачи достигается тем, технологическому процессу монтажной пайки что в нижнем и верхнем полукорпусах ТВЧ трубопроводов, может быть использована «безнамоточного» индукционного нагревателя для монтажной пайки трубопроводов диаметрами установлены полувитки в виде медных планок, от 6 до 25 мм из стали и титановых сплавов. припаянных к контактной группе. При Задачей настоящей полезной модели является соединении нижнего и верхнего полукорпусов повышение качества, снижение трудоемкости через контактную группу образуется монтажной пайки трубопровода. «безнамоточный» ...

Подробнее
Номер записи: 1
12-01-2012 дата публикации

Repair apparatus and method for circuit board assembly

Номер: US20120008284A1
Автор: Bing Liu, Chi-An Yu, Hai-Gui Huang, Jie-Peng Kang, Jing-Bin Liang, Xi-Hang Li, Yu-Ching Liu, Zhi-Bing Li
Принадлежит: Futaihua Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd

A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.

Подробнее
Номер записи: 2
02-02-2012 дата публикации

Soldering apparatus

Номер: US20120024938A1
Автор: Minoru Yamamoto, Shinji Yoshino, Toshinori Mimura
Принадлежит: Panasonic Corp

A solder drawing member ( 402 ) is detachably attached on the outer side of a jet nozzle ( 303 ) that jets molten solder pumped from a solder tank ( 102 ) storing the molten solder. The solder drawing member ( 402 ) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle ( 303 ). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member ( 402 ), thereby reducing bridge phenomena and icicle phenomena.

Подробнее
Номер записи: 3
16-02-2012 дата публикации

Capillary and ultrasonic transducer for ultrasonic bonding

Номер: US20120037687A1
Автор: Takayoshi Matsumura
Принадлежит: Fujitsu Ltd

A capillary is attached to an ultrasonic transducer of a wire-bonding apparatus. The capillary includes a first part configured to be attached to the ultrasonic transducer, and a second part other than the first part and extending from the first part. The first part has a shape different from a shape of the second part so that the first part has a flexure rigidity larger than the second part.

Подробнее
Номер записи: 4
15-03-2012 дата публикации

Apparatus and method for mounting electronic component

Номер: US20120060356A1
Автор: Hirokazu Yamanishi, Mitsuo Takeuchi, Tohru HARADA, Toru Okada, Yoshiaki Yanagida
Принадлежит: Fujitsu Ltd

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Подробнее
Номер записи: 5
22-03-2012 дата публикации

Package substrate unit and method for manufacturing package substrate unit

Номер: US20120067635A1
Автор: Hideaki Yoshimura, Hitoshi Suzuki, Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi
Принадлежит: Fujitsu Ltd

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Подробнее
Номер записи: 6
24-05-2012 дата публикации

Inert environment enclosure

Номер: US20120125975A1
Автор: Frederick W. Wagner, Larry E. Yanaros
Принадлежит: FLEXTRONICS AP LLC

A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Подробнее
Номер записи: 7
24-05-2012 дата публикации

Thermal Gradient Reflow for Forming Columnar Grain Structures for Solder Bumps

Номер: US20120125981A1
Автор: Chih-Hang Tung, Chih-Horng Chang, Tsung-Fu Tsai, Yian-Liang Kuo
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Подробнее
Номер записи: 8
14-06-2012 дата публикации

Device and method for brazing a heat pipe

Номер: US20120145772A1
Автор: Wen-Chih Liao
Принадлежит: Individual

The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Подробнее
Номер записи: 9
28-06-2012 дата публикации

Device for supplying an inert gas to a wave soldering installation

Номер: US20120160898A1
Автор: Fernand Heine, Marc Leturmy
Принадлежит: LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

Подробнее
Номер записи: 10
02-08-2012 дата публикации

Terminal assembly with regions of differing solderability

Номер: US20120196493A1
Автор: James V. Murphy, Michael J. Murphy
Принадлежит: Advanced Interconnections Corp

An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Подробнее
Номер записи: 11
27-09-2012 дата публикации

Reflow furnace

Номер: US20120240424A1
Автор: Daisuke Kasahara, Hiroshi Taguchi, Koichiro Hosokawa, Takashi Sugihara, Yuta Saito
Принадлежит: Senju Metal Industry Co Ltd

To prevent evaporated flux from being attached to rotation axes of motors which rotate fans positioned in a preheating zone, a main heating zone and a cooling zone and being solidified, the evaporated flux is efficiently and surely collected with the flux liquefying before the flux is solidified and having fluidity. A drain portion 20 constituting a flux collection apparatus 10 A is formed at a side of a motor base 16 opposed to the fan and at a circumferential portion of the rotation axis 14. A surface of the drain portion 20 opposed to the fan is formed as an inclined surface 20 A which is inclined from a level position of the motor base 16 to a discharge port 46 provided at a back side of the motor base 16. The flux collected to a center portion of the motor base 16 by the rotation drive of the fan is flown to the drain portion 20 formed in the center portion of the motor base 16, is flown along the inclined surface 20 A and contained into a collection container 34 from the drain portion 20 through the discharge port 46, a drain pipe and a pipe 48.

Подробнее
Номер записи: 12
08-11-2012 дата публикации

Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit

Номер: US20120279170A1
Автор: Gregg E. Freebury, Michael Hulse, Neal J. Beidleman, William H. Francis, Iv
Принадлежит: EVERSEALED WINDOWS Inc

A Vacuum Insulating Glazing Unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed.

Подробнее
Номер записи: 13
20-12-2012 дата публикации

Semiconductor module manufacturing method, semiconductor module, and manufacturing device

Номер: US20120319253A1
Автор: HIROKI Mizuno
Принадлежит: Toyota Motor Corp

In the disclosed method for manufacturing a semiconductor module, a metal layer and a cooler, which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet. A work, comprising a semiconductor element placed on the metal layer with solder interposed therebetween, is fed into a reflow furnace. The work, in that state, is heated in the reflow furnace, thereby mounting the semiconductor element to the metal layer. The heating is carried out such that the temperature of the cooler and the temperature of the metal layer differ by an amount that make the cooler and the metal layer undergo the same amount of thermal expansion as each other.

Подробнее
Номер записи: 14
27-12-2012 дата публикации

Dross Removal

Номер: US20120325899A1
Автор: Lambertus Petrus Christinus Willemen
Принадлежит: ILLINOIS TOOL WORKS INC

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

Подробнее
Номер записи: 15
10-01-2013 дата публикации

Removal apparatuses for semiconductor chips and methods of removing semiconductor chips

Номер: US20130008020A1
Автор: Jaeyong Park, Junyoung Ko, Kyhyun Jung, Whasu Sin
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Подробнее
Номер записи: 16
24-01-2013 дата публикации

Grooved circuit board accommodating mixed-size components

Номер: US20130021763A1
Автор: FAN LI, Jie Huang, Surinder JASSAL
Принадлежит: Research in Motion Ltd

A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

Подробнее
Номер записи: 17
21-02-2013 дата публикации

Disc comprising an electrical connection element

Номер: US20130043066A1
Автор: Andreas Schlarb, Bernhard Reul, Harald Cholewa, Lothar Lesmeister, Lothar Schmidt, Mitja Rateiczak
Принадлежит: Saint Gobain Glass France SAS

The present invention relates to a pane with an electrical connection element, comprising: a substrate made of glass ( 1 ), an electrically conductive structure ( 2 ) with a layer thickness of 5 μm to 40 μm on a region of the substrate ( 1 ), a connection element ( 3 ), and a layer of a solder material ( 4 ), which electrically connects the connection element ( 3 ) to a portion ( 12 ) of the electrically conductive structure ( 2 ), wherein the connection element ( 3 ) contains at least an iron-nickel alloy or an iron-nickel-cobalt alloy, the connection element ( 3 ) is connected to the portion ( 12 ) of the electrically conductive structure ( 2 ) via a contact surface ( 11 ) over its entire surface, and the contact surface ( 11 ) has no corners.

Подробнее
Номер записи: 18
14-03-2013 дата публикации

SOLDERING ON THIN GLASS SHEETS

Номер: US20130062120A1
Автор: Galonska Steffen, Kriegel-Gemmecke Matthias
Принадлежит: Pilkington Group Limited

A process is disclosed, whereby soldered connections to electrical conductors incorporated on thin glass are achieved. Sufficient resistance to cracking is obtained by virtue of surface stresses induced locally in a region where soldering is to be done. In a preferred embodiment, surface stresses imparted during a press bending operation are relied upon. 121-. (canceled)22. A method of forming a soldered connection to a first electrical conductor formed on a glass substrate , said substrate having a thickness of less than 2.1 mm , the method comprising:printing a layer of conductive ink on said substrate and soldering a second electrical conductor to said first electrical conductor; andinducing locally in a region where soldering is to be done a surface stress in said substrate of greater than 8 MPa and less than 37 MPa prior to the soldering of the second electrical connector to the first electrical connector.23. A method according to claim 22 , where the substrate is subjected to heating above its annealing temperature and subsequent cooling at a rate sufficient to induce said surface stress.24. A method according to where the surface stress is less than 25 MPa.25. A method according to where the surface stress is less than 20 MPa.26. A method according to where the surface stress is less than 15 MPa.27. A method according to claim 23 , comprising:heating the glass sheet in a furnace to a temperature sufficient to facilitate bending;conveying the sheet from the furnace to a press bending station;shaping the sheet by pressing it between opposed complementary shaping surfaces provided on upper and lower press members andinducing the surface stress in the glass sheet by quenching the surfaces of the glass.28. A method according to claim 27 , further comprising differentially heating the glass sheet to provide increased localised surface stress in a region where the soldered connection is formed.29. A method according to claim 28 , where differential heating is ...

Подробнее
Номер записи: 19
14-03-2013 дата публикации

METHOD FOR WELDING TOGETHER TWO PLANAR COMPONENTS

Номер: US20130062397A1
Автор: Stroh Dieter, Stroh Heiko
Принадлежит: SCHUNK SONOSYSTEMS GMBH

A method for welding together at least two planar metal components oriented with respect to one another using ultrasound, wherein for the welding operation the components are arranged between a tool transmitting ultrasonic vibrations and a counter-holder and fixed between same by the application of pressure. In order for the components to have a desired orientation with respect to one another after the welding operation that corresponds to the orientation prior to the welding operation, according to the invention the components, prior to applying the ultrasonic vibrations for welding the same together, are deformed by means of at least one projection that projects from the tool and/or the counter-holder beyond the respective working surface using the application of force such that a translatable and rotatable relative movement is suppressed, or substantially suppressed, between the components and that the welding operation is carried out after the deformation. 11618202210121618202226343610122428. Procedure for welding at least two flat metallic structural components ( , , , ) aligned with each other , such as metal strips , using ultrasound , whereby for welding the structural components are arranged between the tool () transmitting the ultrasound pulses and a holding piece () and are fixed in place through the exertion of force , so characterized in that the structural components ( , , , ) before welding by the application of ultrasound pulses have at least one projection ( , , ) projecting from the tool () and/or the holding part () over the particular work surface ( , ) applied for welding and are deformed by the exertion of force in a way that a translating and rotating relative movement between the parts is prevented or essentially prevented , and the welding is done after the deformation.2161820223436. Procedure according to claim 1 , so characterized in that the structural components ( claim 1 , claim 1 , claim 1 , ) claim 1 , are deformed by at least 2 ...

Подробнее
Номер записи: 20
14-03-2013 дата публикации

Apparatus for and method of brazing aluminium products with closed loop conveyor within the furnace

Номер: US20130062399A1
Автор: Malcolm Roger McQuirk
Принадлежит: AFC Holcroft LLC

An apparatus ( 10 ) for the production of brazed aluminium products on a continuous flow basis includes, in sequence, a flux application zone ( 12 ), a tunnel furnace ( 14 ), a cooling zone ( 15,16 ) and a transportation element ( 25 ) for conveying ( 26 ) component parts or products though the apparatus, the transportation element including a closed loop conveyor having both conveying ( 26 ) and return ( 27 ) runs within the tunnel furnace.

Подробнее
Номер записи: 21
28-03-2013 дата публикации

Method for Manufacturing a Plate Heat Exchanger

Номер: US20130074994A1
Автор: Aleksey Igorevich Pashkov, Alexandr Nikolaevich Stratonovich, Igor Nikolaevich Pashkov, Irina Alekseevna Noskova
Принадлежит: NBBK OOO

Manufacturing a plate heat exchanger calls for punching plates, each of which having at least one projection in the form of a hollow truncated cone, cleaning surfaces of the plates, composing a plate assembly by mounting the projection of one plate into opening of an adjacent plate. A predetermined gap between adjacent surfaces of the plates is maintained, a channel for passing a heat carrier is formed. A soldering paste solution based on copper hydrocarbonate and nickel salts is prepared, into which the plate assembly is immersed, the applied solution is dried. The plate assembly is placed into a high-temperature through-type conveyor furnace with a protective medium containing free hydrogen. Two temperature zones are provided along the way of movement of the plate assembly. The plate assembly is annealed in the first temperature zone and then soldered and covered with the copper-based alloy in the second temperature zone.

Подробнее
Номер записи: 22
25-04-2013 дата публикации

METHODS FOR ATTACHING CUTTING ELEMENTS TO EARTH-BORING TOOLS AND RESULTING PRODUCTS

Номер: US20130098972A1
Автор: Cheng Xiaomin Chris, Sullivan Eric C., Trinh Tu Tien
Принадлежит: BAKER HUGHES INCORPORATED

Methods of attaching cutting elements to earth-boring tools, comprising abutting a portion a cutting element against at least one surface of an earth-boring tool with a braze material disposed therebetween; and brazing the cutting element to the earth-boring tool by applying high-frequency vibrations to cause the braze material to become flowable. Methods of securing cutting elements to earth-boring tools may comprise at least partially coating a cutting element with a braze material. The cutting element may be at least partially disposed in a pocket formed in a body of an earth-boring tool with the braze material adjacent surfaces defining the pocket. The cutting element and the braze material may be ultrasonically torsionally oscillated to braze the cutting element within the pocket. 1. A method of attaching a cutting element to an earth-boring tool , comprising:abutting a portion a cutting element against at least one surface of an earth-boring tool with a braze material disposed therebetween; andbrazing the cutting element to the earth-boring tool by applying high-frequency vibrations to cause the braze material to become flowable.2. The method of claim 1 , wherein brazing the cutting element to the earth-boring tool comprises ultrasonically torsionally oscillating the cutting element and the braze material.3. The method of claim 2 , wherein ultrasonically torsionally oscillating the cutting element and the braze material comprises ultrasonically oscillating the cutting element and the braze material at a frequency of between about 10 kHz and 100 kHz.4. The method of claim 2 , wherein ultrasonically torsionally oscillating the cutting element and the braze material comprises elevating a temperature of the braze material to a temperature above the liquidus temperature of the braze material.5. The method of claim 4 , wherein elevating the temperature of the braze material to the temperature above the liquidus temperature of the braze material comprises elevating ...

Подробнее
Номер записи: 23
25-04-2013 дата публикации

Apparatus And Method For Providing An Inerting Gas During Soldering

Номер: US20130098974A1
Автор: Arslanian Gregory Khosrov, Dong Chun Christine, Ghosh Ranajit, Wang Victor, Wu Jerry
Принадлежит: AIR PRODUCTS AND CHEMICALS, INC.

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap. 1. An enclosure for providing an inerting gas during soldering of a work piece comprising:a base comprising an interior volume in fluid communication with an inerting gas source,a neck comprising an interior volume in fluid communication with the interior volume of the base and an opening,a cap proximal to the opening, anda tube comprising one or more openings for the flow of the inerting gas therethrough, wherein the tube resides within the base and is in fluid communication with the inerting gas source;wherein the inerting gas travels through the tube into the interior volume of the base and neck and out through the opening.2. The enclosure of claim 1 , wherein the neck further comprises one or more holes along its surface.3. An apparatus for providing an inerting gas during soldering of a work piece claim 1 , the apparatus comprising:at least one groove on the bottom of the apparatus for placing onto at least one edge of a solder reservoir, wherein the solder reservoir contains molten solder and wherein at least one side wall of the groove and at least one wall of the apparatus define a chamber outside of the solder reservoir;at least one opening on the ...

Подробнее
Номер записи: 24
09-05-2013 дата публикации

DEVICE AND METHOD OF VIBRO-SPOT WELDING

Номер: US20130112665A1
Автор: JIN In Tai
Принадлежит:

A device and a method of vibro-spot welding which weld overlapped metal plates by heating welding portions of the overlapped metal plates and applying linear and repetitive load to the welding portions are disclosed. The device of vibro-spot welding may include a pair of vibration welders facing each other with respect to overlapped metal plates, wherein at least one of the pair of vibration welders heats welding portions of the metal plates, generates plastic flow at the welding portions by moving the welding portions reciprocally between the pair of vibration welders, and joining the welding portions by applying pressure to the welding portions at which the plastic flow occurs. 1. A device of vibro-spot welding comprising a pair of vibration welders facing each other with respect to overlapped metal plates ,wherein at least one of the pair of vibration welders heats welding portions of the metal plates, generates plastic flow at the welding portions by moving the welding portions reciprocally between the pair of vibration welders, and joining the welding portions by applying pressure to the welding portions at which the plastic flow occurs.2. The device of claim 1 , wherein the at least one of the pair of vibration welders comprises:an electrode for heating the overlapped metal plates by receiving current;a cylinder mounted at a rear end portion of the electrode and receiving the pressure for reciprocally moving and pressing the welding portions of the metal plates; anda vibration piston having a front end and a rear end connected to each other, wherein the rear end is positioned in the cylinder so as to receive the pressure and the front end penetrates the cylinder and the electrode so as to reciprocally move or press the welding portions of the metal plates.3. The device of claim 2 , further comprising a pressing piston positioned at the rear of the vibration piston in the cylinder and pressing the welding portions of the metal plates by receiving the pressure ...

Подробнее
Номер записи: 25
09-05-2013 дата публикации

ULTRASONIC BONDING SYSTEMS INCLUDING WORKHOLDER AND RIBBON FEEDING SYSTEM

Номер: US20130112735A1
Автор: Luechinger Christoph Benno, Valentin Orlando Luis
Принадлежит: Orthodyne Electronics Corporation

An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation. 1. An ultrasonic ribbon bonding system comprising:a workholder for supporting a workpiece during an ultrasonic ribbon bonding operation, the workholder defining a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ultrasonic ribbon bonding operation; anda bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ultrasonic ribbon bonding operation.2. The ultrasonic ribbon bonding system of wherein the first plurality of standoffs are integral with the workholder.3. The ultrasonic ribbon bonding system of wherein the first plurality of standoffs are formed of a first material distinct from a material forming the surface of the workholder.4. The ultrasonic ribbon bonding system of wherein the first plurality of standoffs are comprised of tungsten-carbide claim 1 , steel claim 1 , or ceramic.5. The ultrasonic ribbon bonding system of wherein the first plurality of standoffs are comprised of aluminum or polyimide.6. The ultrasonic ribbon bonding system of wherein the workholder defines a second plurality of standoffs extending above the surface of the workholder claim 1 , the second plurality of standoffs having a second height above the surface of the workholder that is less than a first height of the first ...

Подробнее
Номер записи: 26
16-05-2013 дата публикации

METHOD FOR THE INDUCTION BRAZING OF PARTS HAVING COMPLEX SHAPES, AND SINGLE OR MULTIPLE BRAZING STATION FOR IMPLEMENTING SAME

Номер: US20130119048A1
Автор: Martin Amanda
Принадлежит: TURBOMECA

A method for brazing parts having complex profiles, while enabling reproducible implementation conditions to be defined. The method adjusts a heat cycle during brazing by controlling and mapping heat, while taking emissivity coefficient of the material to be brazed into account. Further, a brazing station includes a power generator configured to supply a predetermined voltage to a transformer connected to a circuit forming a shape inductor, the circuit having an overall shape of the parts to be brazed. A pressure mechanism exerts a load on the parts to be brazed. A camera establishes a heat map. A laser-sighted infrared pyrometer measures the brazing temperature by radiation after parameterizing an emissivity coefficient, other parameters being fixed. A controller supplies a set power to the generator on the basis of the measured temperature. 114-. (canceled)15. An induction brazing method for parts able to have a complex shape , comprising:defining a heating heat cycle comprising phases of temperature rise;leveling and cooling depending on a material to be brazed;depositing a brazing seam on a joint plan between the parts to be brazed;exerting a substantially uniform pressure onto the parts to be brazed;making available a heat mapping of the material to be brazed taking variations of emissivity coefficient for such material into account during a cycle for a heating homogenization check;then regulating such heat cycle by a closed servo loop from a sight in one point being heat representative by further taking variations of the emissivity coefficient of the material in such point into account and by a localized heat through a shape induction closest to the joint plan of the parts to be brazed, on which the brazing seam has been deposited.16. The induction brazing method according to claim 15 , wherein taking the emissivity coefficient for the material to be brazed into account with temperature is performed by calibrating a variation of the emissivity coefficient ...

Подробнее
Номер записи: 27
16-05-2013 дата публикации

DIRECTED HEATING FOR COMPONENT REWORK

Номер: US20130119051A1
Автор: Chen Weyman, Nikkhoo Michael M., Salehi Amir
Принадлежит: Apple Inc.

Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder. 1. A component rework station for efficiently removing an electrical component from a printed circuit board (PCB) , comprising:an alternating current power supply;a non-magnetic housing comprising an aperture disposed along a bottom surface of the non-magnetic housing;a magnetic energy emitter embedded within an upper portion of the non-magnetic housing and electrically coupled to the alternating current power supply; anda magnetic concentrator embedded within a lower portion of the non-magnetic housing and above the aperture, the magnetic concentrator configured to receive a first magnetic field from the magnetic energy emitter at a first magnetic flux density, provide a second magnetic field at a second flux density greater than the first flux density, and direct the second magnetic field towards a soldered connection electrically and mechanically coupling the electrical component to the PCB,wherein the directed second magnetic field transfers energy to the soldered connection by generating eddy currents within the soldered connection causing it to liquefy, thereby allowing removal of the electrical component.2. The component rework station as recited in claim 1 , wherein the aperture disposed along the bottom surface of the non-magnetic housing comprises a plurality of apertures disposed across a bottom surface of the non-magnetic housing claim 1 , and wherein the magnetic ...

Подробнее
Номер записи: 28
16-05-2013 дата публикации

Solder spattering suppressed reflow method

Номер: US20130119119A1
Автор: Horng Chih Horng
Принадлежит: AblePrint Technology Co Ltd

A solder spattering suppressed reflow method includes the following steps: (A) preparing a carrier; (B) placing at least one solderable object on the carrier by means of printing, dispensing, mounting or plating; and (C) moving the carrier into an enclosed chamber and carrying out a high-temperature and high-pressure reflow process to have the solderable object heated and melted to bond to the carrier.

Подробнее
Номер записи: 29
16-05-2013 дата публикации

Bi-Sn Based High-Temperature Solder Alloy

Номер: US20130121874A1
Автор: Minoru Toyoda, Minoru Ueshima, Yoshimi Inagawa
Принадлежит: Senju Metal Industry Co Ltd

A high-temperature solder alloy is a Bi—Sn based solder alloy containing at least 90 mass % of Bi, further containing 1-5 mass % of Sn, at least one element selected from Sb and/or Ag each in an amount of 0.5-5 mass %, and preferably further containing 0.0004-0.01 mass % of P.

Подробнее
Номер записи: 30
23-05-2013 дата публикации

REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS

Номер: US20130125364A1
Автор: Meloni Mark
Принадлежит: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed. 112-. (canceled)13. A system that is arranged to remove components from a printed circuit board , the system comprising:an assembly configured to secure the printed circuit board;a first directed air source configured to direct a first air onto a first surface of the printed circuit board; anda first collector configured to collect a first component removed from the printed circuit board.14. The system of claim 13 , further comprising:a second directed air source configured to direct a second air onto a second surface of the printed circuit board.15. The system of claim 14 , further comprising:a second collector configured to collect a second component removed from the printed circuit board.16. The system of claim 13 , further comprising:a second directed air source configured to direct a second air onto the first surface of the printed circuit board.17. The system of claim 13 , further comprising:a process unit control logic coupled to the assembly and the first directed air source, wherein the process unit control logic is configured to instruct the assembly to secure the printed circuit board and to instruct the first directed air source to direct the first air onto the first surface of the printed circuit board.18. An article comprising: a computer program product having stored therein instructions that claim 13 , if executed by a processing unit claim 13 , configure the processing unit to:secure a printed circuit board;direct a first air onto a first surface of the printed circuit board with a first directed air source to remove a first component from the printed circuit board; andcollect the first component from the printed circuit board.19. The article of claim 18 , the computer program product having stored therein further instructions that claim 18 , if executed by the processing unit claim 18 , configure the processing unit to:select ...

Подробнее
Номер записи: 31
30-05-2013 дата публикации

SELF-CLAMPING FRICTION WELDING TOOL

Номер: US20130134206A1
Автор: Bergmann Luciano, dos Santos Jorge F., FRITZ Jan, Roos Arne
Принадлежит: Helmholtz-Zentrum Geesthacht Zentrum für Material - und Küstenforschung GmbH

A friction welding tool having a pin and a clamping device with a counter bearing, a holddown element and a spring element. The pin has a coupling section for releasable, rotationally fixed coupling to a rotating output device of a machine tool. The counter bearing is held on the pin between the pin's coupling and engagement ends in a manner that allows the counter bearing to be axially immovable on but freely rotatable about a longitudinal axis of the pin. The holddown element surrounds the pin and is arranged on a side of the counter bearing facing the engagement end. The holddown element has a bearing surface for bearing on the workpiece arrangement. The spring element is provided between the holddown element and the counter bearing and is mounted on the pin in such a way that it is elastically slidable along the longitudinal axis of the pin. 1. A friction welding tool comprising:a pin, which has a coupling end and an engagement end lying opposite the coupling end and which is provided for executing a rotary motion about its longitudinal axis, said longitudinal axis extending between the coupling end and the engagement end, and, at the same time, for engaging by means of its engagement end with a surface of a workpiece arrangement, andhaving a clamping device, which surrounds the pin, can be moved along the longitudinal axis of the pin and is provided for exerting pressure on the surface of the workpiece arrangement,the clamping device having a counter bearing, which is held on the pin between the coupling end and the engagement end in a manner which allows it to be rotated freely around the longitudinal axis of the pin and prevents it from being moved in the direction of the longitudinal axis,the clamping device has having a holddown element, which surrounds the pin, is arranged on the side of the counter bearing facing the engagement end and has a bearing surface, which is provided for bearing on the workpiece arrangement,a spring element is provided between ...

Подробнее
Номер записи: 32
30-05-2013 дата публикации

Solder bump forming apparatus and soldering facility including the same

Номер: US20130134208A1
Автор: Dae Young Lee, Hueng Jae Oh, Jin Won Choi, Noriaki Mukai
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.

Подробнее
Номер записи: 33
27-06-2013 дата публикации

METHOD FOR ELECTRICALLY CONNECTING A PAIR OF CIRCUIT BOARDS USING A PAIR OF BOARD CONNECTORS AND AN INTERCONNECTOR

Номер: US20130161296A1
Автор: Hampo Richard J., Topolewski John N.
Принадлежит: LEAR CORPORATION

A system for electrically connecting circuit boards includes a pair of board connectors configured to be electrically connected to respective circuit boards. Each of the board connectors includes a plurality of electrical conductors and a housing configured to enclose at least a portion of the electrical conductors. An interconnector includes a plurality of electrical conductors, each of which is configured to be electrically connected to a respective electrical conductor of the board connectors, thereby electrically connecting the circuit boards. An interconnector housing is configured to cooperate with the housings of the board conductors to at least partially enclose the electrical connections between the electrical conductors of the interconnector and the board connectors. 1. A method for electrically connecting circuit boards , comprising:soldering a first board connector to a first circuit board;soldering a second board connector to a second circuit board;disposing one end of an interconnector through an aperture in the first circuit board to connect the interconnector to the first board connector; anddisposing another end of the interconnector through an aperture in the second circuit board to connect the interconnector to the second board connector, thereby electrically connecting the first and second board connectors.2. The method of claim 1 , wherein the steps of soldering the first and second board connectors to the first and second circuit boards further comprises:disposing the first board connector on a first side of the first circuit board, and soldering the first board connector from a second side of the first circuit board opposite the first side of the first circuit board; anddisposing the second board connector on a first side of the second circuit board, and soldering the second board connector from a second side of the second circuit board opposite the first side of the second circuit board, and wherein the interconnector is electrically ...

Подробнее
Номер записи: 34
11-07-2013 дата публикации

Introduction of nanoparticles

Номер: US20130174977A1
Автор: Wolfgang Danzer
Принадлежит: Linde GmbH

The invention relates to a method for joining objects made of metal, plastic, hybrid structures or ceramic by means of heat input such as soldering or welding, wherein materials such as particles, in particular nanoparticles, elements, atoms, molecules or ions are introduced into the joint. It is proposed according to the invention that a gas stream brings gaseous compounds to the joint which decompose at elevated temperature and deposit particles as heat is being applied to the joint.

Подробнее
Номер записи: 35
01-08-2013 дата публикации

Method for Fixing an Opening Device, Composite Film and Tubular Bag Having an Opening Device

Номер: US20130192174A1
Автор: Ekenhorst Dirk, Weltert Joerg P.
Принадлежит: ROBERT BOSCH GMBH

A method is presented for fixing an opening device to a packaging container made of a composite film. The packaging container is a tubular bag, and the composite film includes a barrier layer and a further layer. The barrier layer is part of the composite film and the further layer includes a recess in the region of the opening device. The opening device is a connecting flange configured to be fixed to the composite film and includes a separating mechanism configured to sever the barrier layer to form a passage in the composite film. The further layer is arranged on the side facing away from the connecting flange. 1. A method for fixing an opening device on a packaging container , wherein a material of the packaging container comprises a composite sheet material with at least one barrier layer , wherein the opening device has a connection flange configured to be fixed to the composite sheet material , wherein the opening device has a severing mechanism configured to sever the at least one barrier layer to form a through-passage in the composite sheet material , wherein the composite sheet material , on a side which is directed toward the connection flange , has at least one further layer , wherein the at least one further layer , on the side which is directed toward the opening device , has at least a first carrier layer , and wherein the at least one further layer of the composite sheet material has an aperture in a region of the opening device , comprising:producing the packaging container from the composite sheet material such that the packaging container is configured as a tubular bag, and such that the aperture is smaller than the connection flange; andconnecting the connection flange to the first carrier layer by heat sealing or ultrasonic welding, without using any additional adhesive layer.2. A method for fixing an opening device on a packaging container , wherein a material of the packaging container comprises a composite sheet material with at least one ...

Подробнее
Номер записи: 36
29-08-2013 дата публикации

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE

Номер: US20130221521A1
Автор: Chen Hsiao-Yun, Hsiao Yi-Li, Shih Da-Yuan, Tung Chih-Hang, Wu Chung-Jung, Yang Su-Chun, Yu Chen-Hua
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device. 1. A method of producing a solder bump joint , comprising:heating a solder bump comprising tin above a melting temperature of the solder bump;stretching the solder bump to increase a height of the solder bump; andcooling down the solder bump.2. The method of claim 1 , wherein the solder bump is predominantly a eutectic Sn—Bi compound.3. The method of claim 1 , wherein the solder bump is predominantly a eutectic Sn—Pb compound.4. The method of claim 1 , wherein the solder bump further comprises copper.5. The method of claim 1 , wherein the solder bump further comprises silver.6. The method of claim 1 , wherein a contact angle is less than 90° after the stretching.7. The method of claim 1 , wherein a ratio of an average center width spacing to an average top contact width spacing is between 0.5 and 1.0.8. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure being predominantly orthogonal to an axis of stretching claim 1 , after the stretching.9. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure being predominantly parallel to an axis of stretching claim 1 , after the stretching.10. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure having a first portion and a second portion claim 1 , the first portion being predominantly parallel to an axis of stretching and the second portion being predominantly orthogonal to the axis of stretching claim 1 , after the stretching.11. The method of claim 1 , wherein the solder bump contains lamellar structure claim 1 , the lamellar structure including a Sn-rich phase having greater than 90% Sn plus an IMC phase where the IMC ...

Подробнее
Номер записи: 37
12-09-2013 дата публикации

IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES

Номер: US20130233832A1
Автор: Bartley Gerald K., Becker Darryl J., GERMANN PHILIP R., Maki Andrew B.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack. 110-. (canceled)11. A structure for implementing selective rework for chip stacks comprising:a chip stack including a plurality of chips;a chip in a chip stack;a backside metal layer on said chip; said backside metal layer for creating resistive heating;a rework tool for applying a predefined current to the backside metal layer to reflow solder connections on said chip backside and for separating selected chips in said chip stack.12. The structure for implementing selective rework for chip stacks as recited in wherein said backside metal layer includes a pair of landing pads proximate to opposed edges of said chip for engagement with said rework tool claim 11 , and a plurality of spaced apart traces claim 11 , said traces connected to said landing pads.13. The structure for implementing selective rework for chip stacks as recited in wherein said backside metal layer includes a pair of landing pads proximate to opposed edges of said chip for engagement with said rework tool claim 11 , and a grid connected to said landing pads.14. The structure for implementing selective rework for chip stacks as recited in wherein said rework tool includes a surface portion for physical engagement with said backside metal layer.15. The structure for implementing selective rework for chip stacks as recited in wherein said backside metal layer includes a pair of landing pads proximate to opposed edges of said chip and wherein said rework tool includes a surface portion for physical engagement with said landing pad.16. The structure for implementing selective rework for chip stacks as recited in wherein said rework tool has a wedge shape to ...

Подробнее
Номер записи: 38
19-09-2013 дата публикации

Tool for ultrasonic welding device

Номер: US20130240606A1
Автор: Georg Lang, Katharina Neuerer, Matthias Lodes, Stefan Rosiwal
Принадлежит: Individual

The invention relates to a tool for an ultrasonic welding device, wherein a contact face of a carrier body ( 1 ) produced from a metal facing a component to be welded is provided with a diamond coating ( 3 ). To improve the durability, it is proposed in accordance with the invention for the diamond coating to be produced by means of CVD methods and to have a thickness (D 2 ) in the range from 0.5 to 20 μm.

Подробнее
Номер записи: 39
19-09-2013 дата публикации

CLAMPING TOOL AND EQUIPMENT FOR REWORK PROCESS

Номер: US20130240608A1
Автор: HSIEH Hao-Chun, Lee Chia-Hsien
Принадлежит: WISTRON CORPORATION

A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other. 1. A clamping tool for rework process comprising:a casing having a base;two clamping members pivotally connected to the casing and located at opposite sides of the base; anda thermal expansion member disposed in the casing and located over the base, the thermal expansion member being capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.2. The clamping tool of claim 1 , wherein each of the two clamping members has a hook-shaped clamping portion.3. The clamping tool of claim 1 , wherein a heat tolerance of the thermal expansion member exceeds 350° C.4. The clamping tool of claim 3 , wherein the thermal expansion member is made of plastic or rubber.5. The clamping tool of claim 1 , wherein the thermal expansion member comprises a thermal expansion chamber and a thermal expansion substance filled in the thermal expansion chamber.6. The clamping tool of claim 5 , wherein the thermal expansion chamber is made of plastic or rubber and the thermal expansion substance is liquid or gas.7. An equipment for rework process comprising:a hot wind chamber;a moving mechanism movably disposed in the hot wind chamber; and a casing having a base, the moving mechanism being connected to the casing and used for driving the casing to move with respect to the hot wind chamber;', 'two clamping members pivotally connected to the casing and located at opposite sides of the base; and', 'a thermal expansion member disposed in the casing and located over the base, the thermal expansion member ...

Подробнее
Номер записи: 40
19-09-2013 дата публикации

Semiconductor device and method for manufacturing the same

Номер: US20130244380A1
Автор: Fumihiko Momose, Fumio Shigeta, Kazumasa Kido, Yoshitaka Nishimura
Принадлежит: Fuji Electric Co Ltd

An ultrasonic welding tool is used to bond end portions of an external connection terminal to circuit patterns of an insulating substrate, with a Vickers hardness not lower than 90. Bonding end portions are provided integrally with a bar in the external connection terminal. A bonding end portion located substantially in the lengthwise center of the bar is bonded first, then others are bonded alternately in order toward either end. Hardness of the bonding end portions is increased so that strength of the ultrasonic welding portions is increased, and displacement of the bonding end portion in either end from its regular position is suppressed to keep bonding strength high. Bonding strength of the ultrasonic welding portions between the external connection terminal and the circuit patterns of the insulating substrate can be increased so that long-term reliability can be secured in a semiconductor device.

Подробнее
Номер записи: 41
26-09-2013 дата публикации

BRAZING METHOD

Номер: US20130248518A1
Автор: Breznak Jeffrey Michael, Rakozy Kurt Allen, Witney Andrew Batton
Принадлежит: GENERAL ELECTRIC COMPANY

A brazing method for a dynamoelectric machine is provided, and includes the steps of providing a first dynamoelectric machine part and a second dynamoelectric machine part, where a first portion of the first dynamoelectric machine part is configured to fit inside a second portion of the second dynamoelectric machine part. A step of preplacing a non-self-fluxing braze alloy on the first portion or the second portion. A step of thermally treating the first portion or the second portion, to create a temperature differential and size differential between the first portion and the second portion. A step of inserting the first portion into the second portion, and heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy. The first portion is joined to the second portion by brazing in air, without the use of a flux, vacuum or inert atmosphere. 1. A brazing method for a dynamoelectric machine , the method comprising:providing a first dynamoelectric machine part and a second dynamoelectric machine part, at least a first portion of the first dynamoelectric machine part is configured to fit inside a second portion of the second dynamoelectric machine part;preplacing a non-self-fluxing braze alloy on one or more of the first portion and the second portion;thermally treating at least one of the first portion and the second portion, to create a temperature differential and size differential between the first portion and the second portion;inserting the first portion into the second portion;heating at least one of the first portion and the second portion to melt the non-self-fluxing braze alloy; andwherein, the first portion is joined to the second portion by brazing without the use of a flux, vacuum or inert atmosphere.2. The brazing method of claim 1 , wherein the non-self-fluxing braze alloy is a BAg-18 alloy or a BAg 24 alloy.3. The brazing method of claim 1 , wherein the thermally treating step further comprises:cooling the ...

Подробнее
Номер записи: 42
17-10-2013 дата публикации

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Номер: US20130269984A1
Автор: Katsumori Taniguro
Принадлежит: TANIGUROGUMI CORP

Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31 a ; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31 b , the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31 c.

Подробнее
Номер записи: 43
17-10-2013 дата публикации

METHOD FOR JOINING METALLIC MEMBERS, JOINT STRUCTURE AND BRAZING FILLER METAL

Номер: US20130270235A1
Автор: Okumura Tokuji, SUZUKI Takanori, Wakisaka Taisei
Принадлежит:

In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based brazing filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material. 1. A method for joining metallic members comprising:joining plural metallic members by a brazing filler metal using laser beam as a heat source;using an Fe-based metallic member containing an Fe-based material and an Al-based metallic member containing an Al-based material as the metallic members;using a Zn-based brazing filler metal as the brazing filler metal;evaporating the brazing filler metal by irradiation with the layer beam;forming a key hole by melting a joined part of the metal members; andmultiply reflecting the laser beam in the key hole.2. A method for joining metallic members comprising:joining plural metallic members by a brazing filler metal using laser beam as a heat source;using an Fe-based metallic member containing an Fe-based material and an Al-based metallic member containing an Al-based material as the metallic members;forming a groove shape by the Fe-based metallic member and the Al-based metallic member,evaporating the brazing filler metal by irradiation with the layer beam; andmultiply reflecting the laser beam in the key hole. The present application is a continuation of U.S. application Ser. No. 12/933,578, which entered the U.S. National Stage on Sep. 20, 2010 from PCT Application No. PCT/JP2009/057928, filed on Apr. 21, 2009. The contents of the parent application are hereby incorporated in full by reference. The present invention relates to a method for joining a Fe-based metallic member and an Al-based metallic member by interposing a brazing filler metal between the Fe-based metallic member and the Al-based metallic member, a joint structure, and a brazing filler metal.Joint structure of metallic members, such as various joints, is produced ...

Подробнее
Номер записи: 44
24-10-2013 дата публикации

Battery Module and Electrode Tab Ultrasonic Wave Welding Method

Номер: US20130280587A1
Автор: Kim Wook Hyun
Принадлежит: SK INNOVATION CO., LTD.

Provided are a battery module and an electrode tab ultrasonic wave welding method. The present invention relates to a battery module and an electrode tab ultrasonic wave welding method by forming the electrode tab in a zigzag form in which the electrode tab extending upwardly is bent downwardly and then, again bent upwardly to allow the electrode tab formed in the zigzag form to absorb vibrations even when a welding portion formed in parallel with a battery cell is fused by ultrasonic wave vibrations, thereby minimizing damage to the battery cell. 1. A battery module including at least two battery cells and an electrode tab extending from each of the battery cells and welded to each other by ultrasonic wave welding , the battery module comprising:an extension in which the electrode tab extending upwardly is bent downwardly and a welding portion in which the extension is again bent upwardly to form a welding surface in a direction parallel with the battery cell.2. The battery module of claim 1 , wherein the battery module has a serial form in which a negative electrode tab and a positive electrode tab that are adjacent to each other are welded to each other and the negative electrode tab and the positive electrode tab are bent in a direction facing each other so as to be welded through the welding surface.3. The battery module of claim 1 , wherein the battery module has a parallel form in which the adjacent electrode tabs having the same polarity are welded to each other and the electrode tabs are bent in a direction facing each other to be welded to each other through the welding surface.4. The battery module of claim 1 , wherein the extension includes a first extension extending upwardly in parallel with the battery cell and a second extension extending so as to be bent downwardly from an end of the first extension.5. The battery module of claim 1 , wherein the battery module is formed by repeatedly bending upwardly and downwardly the extension bent downwardly.6. ...

Подробнее
Номер записи: 45
31-10-2013 дата публикации

APPARATUS OF MOUNTING AND REMOVING COMPONENT, METHOD OF MOUNTING COMPONENT AND METHOD OF REMOVING COMPONENT

Номер: US20130284707A1
Автор: Harada Tooru, KUSAKABE Yasuyuki
Принадлежит: FUJITSU LIMITED

An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source. 1. An apparatus of mounting and removing a component comprising:a light source configured to radiate light toward a component supported by solder;a light sensor configured to sense displacement of the component; anda member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source.2. The apparatus according to claim 1 ,wherein the light sensor senses the displacement of the component when the solder is melted by light.3. The apparatus according to claim 1 ,wherein the hole is in communication with a hollow in the member to attenuate the light of the light source.4. The apparatus according to claim 1 ,wherein the hole has such a size as to encompass a range to be irradiated with the light of the light source.5. The apparatus according to claim 1 ,wherein at least one of a position of the hole, a dimension of the hole and a cross-sectional shape of the hole is set so that intensity of scattered light that scatters from the hole and is incident on the light sensor is adjusted to be less than a value.6. The apparatus according to claim 5 ,wherein the value is intensity of measurement light that is incident on the light sensor.7. A method of mounting a component comprising:mounting a member on a component to be supported by solder, the member including a hole to which light is incident and that reduces scattered light of the light;irradiating the hole with a light;sensing melting of the solder with a light sensor configured to sense displacement of the component; andstopping irradiation of the component with the light for which the melting of the solder is sensed.8. The ...

Подробнее
Номер записи: 46
07-11-2013 дата публикации

Flip chip assembly apparatus employing a warpage-suppressor assembly

Номер: US20130292455A1
Автор: Jae-Woong Nah, Katsuyuki Sakuma, Peter J. Brofman
Принадлежит: International Business Machines Corp

A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

Подробнее
Номер записи: 47
21-11-2013 дата публикации

Method of Brazing, in Particular Induction Brazing, and Assembly

Номер: US20130307261A1
Автор: Steck Alfred
Принадлежит: Faurecia Emissions Control Technologies, Germany GmbH

A brazing method connects an assembly made up of a pipe, a component provided with an opening, and a compensation element. The compensation element includes a support section and an insertion section that is arranged between an end of the pipe and the opening of the component. An inside diameter of the compensation element is smaller than a diameter of the opening in the component. The insertion section is inserted into the end of the pipe, and the support section is located between the pipe and the component and rests on the component at the edge of the opening. The compensation element, the pipe, and the component are heated, preferably inductively, in a region of the compensation element to a temperature above the melting temperature of brazing material that is present in the region of the brazing points. 1. A brazing method for connecting a pipe with a component provided with an opening , the method including the steps of:arranging a compensation element between an end of the pipe and the opening of the component, the compensation element including a support section and an insertion section, an inside diameter of the compensation element being smaller than a diameter of the opening in the component;inserting the insertion section into the end of the pipe, locating the support section between the pipe and the component, and resting the support section on the component at an edge of the opening; andinductively heating the compensation element and the pipe and the component in a region of the compensation element to a temperature above a melting temperature of brazing material that is present in the region of brazing points.2. The method according to claim 1 , wherein claim 1 , prior to the brazing claim 1 , the insertion section has a radial clearance in relation to an inside of the pipe.3. The method according to claim 1 , wherein a brazed joint between the pipe and the insertion section of the compensation element and a brazed joint between the component and the ...

Подробнее
Номер записи: 48
05-12-2013 дата публикации

LOW-OXYGEN ATMOSPHERE APPARATUS

Номер: US20130320001A1
Автор: KONDO Yuta
Принадлежит:

A low-oxygen atmosphere apparatus including a chamber which houses an object to be processed, microwave generators, and waveguides through which a microwave generated in the microwave generators is transmitted, and further including, in the chamber and/or the waveguides, oxygen-reducing materials to lower the oxygen concentration of the atmosphere in the chamber, which generates heat by the microwave in order to accelerate a reducing reaction of oxygen, thereby lowering the oxygen concentration of the atmosphere in the chamber. 1. A low-oxygen atmosphere apparatus comprising a chamber which houses an object to be processed , microwave generating means , and waveguides through which a microwave generated in the microwave generating means is transmitted to the chamber , and further comprising oxygen-reducing materials in the chamber and/or the waveguides , in order to lower the oxygen concentration of the atmosphere in the chamber , by generating heat using the microwave to accelerate a reducing reaction of oxygen.2. The low-oxygen atmosphere apparatus according to claim 1 , further comprising microwave absorbers claim 1 , which absorb the microwave claim 1 , adjacent to the oxygen-reducing materials in the chamber and/or in the waveguides.3. The low-oxygen atmosphere apparatus according to claim 2 , wherein an affinity of the oxygen-reducing materials to oxygen claim 2 , and an affinity of the microwave absorbers to oxygen are stronger than an affinity of the object to be processed to oxygen.4. The low-oxygen atmosphere apparatus according to claim 2 , wherein the oxygen-reducing materials and the microwave absorbers are powdery or fibrous.5. The low-oxygen atmosphere apparatus according to claim 4 , wherein a powder or fibers which constitute the oxygen-reducing materials claim 4 , and a powder or fibers which constitute the microwave absorbers are arranged such that they are mixed or in contact with each other.6. The low-oxygen atmosphere apparatus according to ...

Подробнее
Номер записи: 49
05-12-2013 дата публикации

ATTACHING OPTICAL COMPONENTS USING HOMOGENIZED LASER LIGHT

Номер: US20130322822A1
Автор: Roeger Brent C., Tatah Karim
Принадлежит:

An attachable optical component is aligned with a base optical component. The attachable optical component has a mounting surface interfacing with the base optical component and an exposed surface opposed to the mounting surface. Laser light is directed to the exposed surface of the attachable optical component for delivery to the mounting surface. The attachable optical component guides and homogenizes the laser light delivered to the mounting surface and uniformly heats a bonding feature between the mounting surface and the base optical component. The directing and subsequent removing of the laser light bonds the attachable optical component to the base optical component via the bonding feature 1. A method comprising:aligning an attachable optical component with a base optical component, the attachable optical component having a mounting surface interfacing with the base optical component and an exposed surface opposed to the mounting surface;directing laser light to the exposed surface of the attachable optical component for delivery to the mounting surface, wherein the attachable optical component guides and homogenizes the laser light delivered to the mounting surface and uniformly heats a bonding feature between the mounting surface and the base optical component; andremoving the laser light from the exposed surface, wherein the directing and removing of the laser light bonds the attachable optical component to the base optical component via the bonding feature.2. The method of claim 1 , wherein the attachable optical component comprises a laser submount and the base optical component comprises a slider body.3. The method of claim 2 , wherein aligning the attachable optical component with the base optical component comprises aligning a laser diode mounted on the laser submount with a waveguide coupler of the slider body.4. The method of claim 1 , wherein the uniform heating of the bonding feature reduces thermal expansion of tooling used to align the ...

Подробнее
Номер записи: 50
19-12-2013 дата публикации

FIBER MOUNT DEVICE, OPTICAL MODULE USING SAME, AND OPTICAL MODULE MANUFACTURING METHOD

Номер: US20130336625A1
Автор: KASAI Yohei, Sakamoto Akira, TOYOHARA Nozomu
Принадлежит: FUJIKURA LTD.

A fiber mount device includes a fiber sub-mount main body that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad that is provided on the upper surface of the fiber sub-mount main body , and a laser absorption layer that is provided on at least a part of the lower surface of the fiber sub-mount main body and absorbs the laser beam having the predetermined wavelength. 1. A fiber mount device comprising:a fiber sub-mount main body that is made of ceramic transmitting a laser beam having a predetermined wavelength;a bonding pad that is provided on the upper surface of the fiber sub-mount main body; anda laser absorption layer that is provided on at least a part of a lower surface of the fiber sub-mount main body and absorbs the laser beam having the predetermined wavelength.2. The fiber mount device according to claim 1 , wherein the laser absorption layer is provided so as to protrude from the bonding pad.3. The fiber mount device according to claim 1 , wherein a base is provided on the side of the laser absorption layer opposite to the fiber sub-mount main body.4. The fiber mount device according to claim 3 , wherein a heat insulating member of which the thermal conductivity is lower than the thermal conductivity of the fiber sub-mount main body is provided between the laser absorption layer and the base.5. The fiber mount device according to claim 3 ,wherein the fiber sub-mount main body includes a beam portion that is partitioned from the base by a space,the bonding pad is provided on the upper surface of the beam portion, andthe laser absorption layer is provided on at least a part of the lower surface of the beam portion.6. An optical module comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the fiber mount device according to ; and'}an optical fiber that is soldered on the bonding pad by heat that is caused by the laser beam having the predetermined wavelength and irradiating the laser absorption layer.7. A ...

Подробнее
Номер записи: 51
02-01-2014 дата публикации

APPARATUS AND METHOD FOR DETACHING A COMPONENT FROM A MOUNTING SURFACE

Номер: US20140000105A1
Автор: Bielick James D., Huang Michk, Lee Yun Ting
Принадлежит:

Disclosed is an apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive. The apparatus includes a right-angled hook, a curved hook, a connecting body and an adjusting member. On one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface. On another side of the component, the curved hook protrudes into a second space between the component and the mounting surface. The connecting body connects the right-angled hook and the curved hook. In response to a thermal process, the adhesion of the adhesive is reduced, and an adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface. A method for detaching a component from a mounting surface is also disclosed. 1. An apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive , the apparatus comprising:a right-angled hook, wherein on one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface;a curved hook, wherein on another side of the component, the curved hook protrudes into a second space between the component and the mounting surface;a connecting body connecting the right-angled hook and the curved hook; andan adjusting member coupled to one of the curved hook and the right-angled hook structured to adjust a distance between the right-angled hook and the curved hook.2. The apparatus of claim 1 , wherein claim 1 , in response to a thermal process claim 1 , the adhesion of the adhesive decreases claim 1 , and the adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface.3. The apparatus of claim 1 , wherein the adjusting member comprises an adjustable bolt member and a spring.4. The apparatus of claim 3 , wherein the adjustable ...

Подробнее
Номер записи: 52
09-01-2014 дата публикации

Methods, devices, systems for joining materials and resulting articles

Номер: US20140008335A1
Автор: Gen SATOH, Y. Lawrence Yao
Принадлежит: Columbia University of New York

A method, article of manufacture, and system for joining different materials is described. In a principal embodiment, two articles, for example different metals, are placed in proximity to one another with an interfacial area. One article is heated using a laser that is scanned across from a point remote from the interface to a point at or just short of the interface. In embodiments, the interfacial bond region is characterized by a homogenous mixed phase region with very low to substantially no brittle intermetallics.

Подробнее
Номер записи: 53
09-01-2014 дата публикации

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AND METHOD FOR TRANSFERRING SOLDER

Номер: US20140010991A1
Автор: Sakurai Daisuke
Принадлежит: Panasonic Corporation

A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused. 1. A solder transfer substrate , comprising:a base layer;an adhesive layer arranged on the base layer; andplural solder powders arranged on the adhesive layer, whereinin the base layer, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged.2. A solder transfer substrate according to claim 1 , whereinthe adhesive layer has a characteristic of expanding with the peeling-off liquid infused.3. A solder transfer substrate according to claim 1 , whereinthe base layer is a porous member.4. A solder transfer substrate according to claim 1 , whereinthe plurality of holes are provided so as to penetrate from a face of the base layer, which does not touch the adhesive layer, towards a face of the base layer, which touches the adhesive layer.5. A solder transfer substrate according to claim 4 , whereinthe plurality of holes are formed at least to an inside of the adhesive layer.6. A solder transfer substrate according to claim 1 , whereinthe base layer is larger than the adhesive layer in respect of a compression rate at a time of heating.7. A manufacturing method of a solder transfer substrate claim 1 , comprising:an adhesive layer forming step of forming an adhesive layer on a surface of a base layer having a plurality of holes; anda solder powder loading step of loading, on the adhesive ...

Подробнее
Номер записи: 54
16-01-2014 дата публикации

Method And System For Joining Workpieces

Номер: US20140014648A1
Автор: Avila Luis Felipe
Принадлежит: CARRIER CORPORATION

A system for joining articles includes a joining unit; a positioning unit coupled to the joining unit, the positioning unit positioning the joining unit; a vision system obtaining an image of an item to be joined on a workpiece; a controller for processing the image and controlling a position of the joining unit relative to the item to be joined in response to the image; and a temperature probe for monitoring a temperature; wherein the controller adjusts the position of the joining unit in response to the temperature. 1. A system for joining articles , the system comprising:a joining unit;a positioning unit coupled to the joining unit, the positioning unit positioning the joining unit;a vision system obtaining an image of an item to be joined on a workpiece;a controller for processing the image and controlling a position of the joining unit relative to the item to be joined in response to the image; anda temperature probe for monitoring a temperature;wherein the controller adjusts the position of the joining unit in response to the temperature.2. The system of wherein:wherein the controller adjusts heat output of the joining unit in response to the temperature.3. The system of wherein:the joining unit includes a torch, the controller adjusting fuel to the torch to adjust the heat output.4. The system of wherein:the joining unit includes an induction brazer, the controller adjusting power to the induction brazer to adjust the heat output.5. The system of further comprising:a second vision system obtaining a second image of the item to be joined on the workpiece;the controller processing the second image and controlling the position of the joining unit relative to the item to be joined in response to the image and the second image.6. The system of wherein:the vision system and second vision system are positioned on orthogonal axes.7. The system of wherein:the controller processes the image to detect a feature in the image.8. The system of wherein:the controller ...

Подробнее
Номер записи: 55
30-01-2014 дата публикации

Ultrasonic welding assembly and method of attaching an anvil to a bracket of the assembly

Номер: US20140026386A1
Автор: Bruce Johnston, Kwok Tom
Принадлежит: LG Chem Ltd

An ultrasonic welding assembly having an ultrasonic horn and an anvil having first, second, and third plate portions is provided. The third plate portion is coupled between the first and second plate portions. The first plate portion has a first knurled region on a first side disposed proximate to the ultrasonic horn, and the second plate portion has a second knurled region on the first side. The third plate portion has a first aperture extending therethrough. The assembly further includes a bracket that receives the second side of the anvil for holding the anvil thereon. The bracket has a second aperture extending therethrough that aligns with the first aperture, such that a coupling member extending through the first and second apertures removably couples the anvil to the bracket.

Подробнее
Номер записи: 56
30-01-2014 дата публикации

Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium

Номер: US20140027418A1
Автор: Azdasht Ghassem
Принадлежит: PAC TECH - PACKAGING TECHNOLOGIES GmbH

The present invention relates to a method for electrically contacting terminal faces of two substrates (), in particular of a chip () and of a carrier substrate (). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip () is positioned with its terminal faces against terminal faces of the substrate () and laser energy () is applied to the chip () at the rear and, in a subsequent second phase, in a housing (), a flux medium is applied and at the same time a reflow is performed by means of laser energy () being applied to the chip () at the rear, and a process of rinsing the housing interior is subsequently performed. The device according to the invention for performing a second phase of the method comprises a carrier table () and a housing (), which together with a top side of the carrier table () forms a housing interior, in which the component arrangement is positioned, and also a laser light source (), which is oriented in such a way that the laser radiation impinges on the first substrate () on the rear side. 1. A method for electrically contacting terminal faces of two substrates , said method comprising:providing a first substrate with terminal faces facing a second substrate, wherein the terminal faces of the first substrate are provided with a soldering agentpositioning the terminal faces of the first substrate against terminal faces of the second substrate;applying laser energy to a rear of the first substrate in such a manner that the soldering agent is melted at least to such an extent so as to enable a mechanical fixation of the first substrate on the second substrate and an electrical contacting of the terminal faces facing each other;applying a flux medium, in a housing interior, to a component arrangement formed by the first and second substrates;simultaneously with the step of ...

Подробнее
Номер записи: 57
30-01-2014 дата публикации

Pick-and-Place Tool for Packaging Process

Номер: US20140030849A1
Автор: Chien Ling Hwang, Yi-Li Hsiao, Ying-Jui Huang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

An apparatus includes a guide ring, and a bond head installed on the guide ring. The bond head is configured to move in loops along the guide ring. The bond head is configured to pick up dies and place the dies during the loops

Подробнее
Номер записи: 58
06-02-2014 дата публикации

Brazing method

Номер: US20140033523A1
Автор: Andrew Batton Witney, Jeffrey Michael Breznak, Kurt Allen Rakozy
Принадлежит: General Electric Co

A brazing method is provided including the steps of, preplacing a braze alloy on a first plurality of conductive strands, the first plurality of conductive strands comprising a first stator bar, preplacing a braze alloy on a second plurality of conductive strands, the second plurality of conductive strands comprising a second stator bar, and heating at least a portion of the first stator bar to join the first plurality of conductive strands and the second stator bar to join the second plurality of conductive strands. Another step is used for electrically connecting the first stator bar to the second stator bar.

Подробнее
Номер записи: 59
06-02-2014 дата публикации

METHODS AND SYSTEMS OF JOINING PIPES

Номер: US20140035279A1
Автор: Narayanan Badri, Procario John
Принадлежит: LINCOLN GLOBAL, INC.

A system and method is provided for joining pipes where a keyhole is formed in each of the pipe ends and then a filler metal is placed in the keyholes to join the pipes to each other. The filler metal can be deposited using a laser hot wire process. 1. A method of forming a joint between a first pipe of a first base material and a second pipe of a second base material , the method comprising:disposing the second pipe coaxially within the first pipe to define a pipe joint axis;forming at least one keyhole extending at least partially through the first and second pipes with a beam from a first heat source;forming a weld metal in the at least one keyhole from a filler wire heated by a second heat source; androtating the first and second pipes relative the filler wire and first heat source.2. The method of claim 1 , wherein forming the at least one keyhole includes delivering a laser beam to the first and second pipes.3. The method of claim 2 , wherein delivering the laser beam includes delivering the laser beam with a first intensity to the first pipe and delivering the laser beam to the second pipe with a second intensity claim 2 , the second intensity being different from the first intensity.4. The method of claim 2 , wherein delivering the laser beam includes delivering the laser beam with a first intensity to the first pipe and delivering the laser beam to the second pipe with a second intensity claim 2 , the second intensity being the same as the first intensity.5. The method of claim 2 , wherein delivering the laser beam includes delivering the laser beam with an intensity being a function of the first and second materials.6. The method of claim 2 , wherein forming the weld metal includes controlling the depth in which a molten puddle is maintained within the keyhole claim 2 , the depth being controlled by controlling the intensity of the laser beam to the keyhole.7. The method of claim 1 , further including forming an arc with the wire in the keyhole.8. The ...

Подробнее
Номер записи: 60
13-02-2014 дата публикации

Laser welding consumable

Номер: US20140042131A1
Автор: Elliott ASH
Принадлежит: Lincoln Global Inc

A system and method for heating a filler wire (consumable) using a laser in brazing, cladding, building up, filling, overlaying, welding, and joining applications. The filler wire includes a first surface that absorbs energy from a laser beam and a second surface separated from said first surface by a thickness t that is in a range of 0.010 inch to 0.045 inch. A cross-sectional shape of the filler wire includes at least one bend toward the laser beam along a length of the cross-sectional shape. The cross-sectional shape has a projected width w that is in a range of 0.030 inch to 0.095 inch.

Подробнее
Номер записи: 61
20-02-2014 дата публикации

Sealing Device for Slot-type Vacuum Glass

Номер: US20140048530A1
Автор: Li Yanbing, Wang Zhangsheng
Принадлежит: LUOYANG LANDGLASS TECHNOLOGY CO., LTD

A sealing device for slot-type vacuum glass is provided with a slot () through which a glass sheet to be sealed passes, inductive heating coils () are arranged around the slot, and the circumference of the glass sheet to be sealed is gradually hermetically sealed through metal brazing process as the glass sheet to be sealed passes through the slot via conveyor rollers (). The device is further provided with a casing (-) and press wheels or rollers (), and the slot extends through the casing, the inductive heating coils are arranged inside the casing around the slot, the press wheels or rollers () are set in the casing. The device is only required to be arranged in the middle of conveyor rollers in order to ensure that the glass sheet can pass through the slot, thereby simplifying equipment and sealing process, enhancing sealing efficiency. 1. A slot-type vacuum glass sealing device , characterized in that the device is an inductive heating device , wherein the device is provided with a slot through which a glass sheet to be sealed passes , inductive heating coils are arranged around the slot , and the circumference of the glass sheet to be sealed is gradually hermetically sealed through metal brazing process as the glass sheet to be sealed passes through the slot; the glass sheet to be sealed comprises two or a plurality of mutually compounded glass sheets , the circumference of the glass sheet is provided with a metal layer which is fixedly bonded therewith; the hermetical sealing means that the metal layers , corresponding to each other , at the circumferences of two adjacent glass sheets are directly interconnected in a manner of hermetical welding , or a metal sealing piece is arranged between the metal layers , corresponding to each other , at the circumferences of two adjacent glass sheets , and the metal sealing piece is respectively connected with the metal layers on the two glass sheets in a manner of hermetical welding.2. The slot-type vacuum glass sealing ...

Подробнее
Номер записи: 62
20-02-2014 дата публикации

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

Номер: US20140048584A1
Автор: Luechinger Christoph B., Valentin Orlando L., Xu Tao
Принадлежит: Orthodyne Electronics Corporation

An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece. 1. An ultrasonic bonding system comprising:a bond head assembly;a bonding tool for bonding a conductive bonding material to a workpiece, the bonding tool being supported by the bond head assembly; anda pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool, the pressing member including a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.2. The ultrasonic bonding system of further comprising an actuator adapted to move the plurality of pressing elements into and out of contact with the workpiece.3. The ultrasonic bonding system of wherein the pressing member includes at least one compression element being compressible during contact between at least one of the plurality of pressing elements and the workpiece.4. The ultrasonic bonding system of wherein the body portion of the pressing member is configured to surround the bonding tool at a position along the bonding tool during a wire bonding operation.5. The ultrasonic bonding system of wherein the body portion and the plurality of pressing elements are formed from a unitary piece of material.6. The ultrasonic bonding system of wherein the plurality of pressing ...

Подробнее
Номер записи: 63
06-03-2014 дата публикации

CONNECTION VERIFICATION TECHNIQUE

Номер: US20140061285A1
Автор: Kinsley Thomas
Принадлежит: MICRON TECHNOLOGY, INC.

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads. 1. A method comprising:positioning a plurality of solder balls between a plurality of first connection pads on a first substrate and a plurality of second connection pads on a second substrate, wherein either the plurality of first connection pads or the plurality of second connection pads comprises a plurality of multi-stage connection pads; andheating the plurality of solder balls such that each respective one of the plurality of solder balls electrically couples a respective one of the plurality of first connections pads to a respective one of the second plurality of connection pads, and such that each respective one of the plurality of solder balls establishes an electrical connection between multiple stages of the plurality multi-stage connection pads.2. The method of claim 1 , wherein each of the plurality of multi-stage connection pads includes a primary connection pad and a target connection pad.3. The method of claim 2 , wherein heating the plurality solder balls includes heating the plurality of solder balls such that each of the plurality solder balls establishes an electrical connection between a respective one of the primary connection pads and a respective one of the target connection pads.4. The method of claim 1 , wherein each of the plurality of multi-stage connection ...

Подробнее
Номер записи: 64
06-03-2014 дата публикации

JOINT STRUCTURE OF PACKAGE MEMBERS, METHOD FOR JOINING SAME, AND PACKAGE

Номер: US20140063757A1
Автор: TAKAGI Kazutaka
Принадлежит: KABUSHIKI KAISHA TOSHIBA

According to an embodiment, a joint structure of package members housing or holding an electronic component includes a first member, a second member joined to the first member, and a joint portion provided between the first member and the second member. The joint portion contains a metal element with a melting point of 400° C. or more and the metal element of 98 percent by weight or more. 1. A joint structure of package members housing or holding an electronic component , the joint structure comprising:a first member;a second member joined to the first member; anda joint portion provided between the first member and the second member and containing a metal element with a melting point of 400° C. or more, the joint portion containing the metal element of 98 percent by weight or more.2. The joint structure according to claim 1 , wherein the metal element is one of gold (Au) claim 1 , silver (Ag) claim 1 , copper (Cu) claim 1 , and nickel (Ni).3. The joint structure according to claim 1 , wherein the first member is made of copper or copper alloy; and the second member is made of an alloy containing iron (Fe).4. The joint structure according to claim 1 , wherein at least one of the first member and the second member contains an insulating material.5. The joint structure according to claim 1 , wherein at least one of the first member and the second member contains a ceramic material.6. The joint structure according to claim 1 , wherein a remelting temperature of the joint portion is 400° C. or more.7. A method for joining package members housing or holding an electronic component claim 1 , the method comprising:placing a first member and a second member into contact with each other via a joining material containing a fine particle, the fine particle containing a metal element with a melting point of 400° C. or more and having a particle size of 500 nm or less; andheating the first member and the second member contacting with each other via the joining material.8. The ...

Подробнее
Номер записи: 65
27-03-2014 дата публикации

Ultrasonic Welding Device with Rotary Coupler

Номер: US20140083623A1
Автор: Jurzitza Dieter
Принадлежит: HERMANN ULTRASCHALLTECHNIK GMBH & CO. KG

The present invention relates to an ultrasonic welding device with a generator for generating a high-frequency a.c. voltage, a converter for converting the a.c. voltage into a mechanical ultrasonic vibration and a sonotrdoe for transmitting the ultrasonic vibration to material to be worked, wherein the converter and the sonotrode are rotatable and a rotary coupler is arranged between the generator and the converter for the transmission of electrical energy from a static arrangement to a rotating arrangement, comprising a stationary element and an element that is rotatable in relation to the stationary element, wherein the stationary element comprises a primary circuit with two input terminals, which are connected to each other by means of a second coil with M turns, wherein the first and second coils are arranged in such a way that, when an a.c. voltage is applied to the input terminals, the magnetic field generated by the first coil induces an a.c. voltage in the second coil. 1. An ultrasonic welding device having a generator for generating a high frequency ac voltage , a converter for converting the ac voltage into a mechanical ultrasonic vibration and a sonotrode for transmitting the ultrasonic vibration to a material to be worked , wherein the converter and the sonotrode are rotatable and a rotary coupler is arranged between the generator and the converter for the transmission of electric energy from a stationary arrangement to a rotating arrangement , with a stationary element and an element which is rotatable relative to the stationary element , wherein the stationary element has a primary circuit with two input terminals which are connected together by way of a first coil with N turns and the rotatable element has a secondary circuit with two output terminals which are connected together by way of a second coil with M turns , wherein the first and second coils are so arranged that when an ac voltage is applied to the input terminals the magnetic field ...

Подробнее
Номер записи: 66
10-04-2014 дата публикации

SYSTEM AND METHOD FOR BRAZING TSP MATERIALS TO SUBSTRATES

Номер: US20140097159A1
Автор: Belnap J. Daniel, Keshavan Madapusi
Принадлежит: Smith International, Inc.

Methods and systems of attaching a thermally stable polycrystalline diamond (TSP) material layer to a substrate. The methods include placing a braze material between the TSP material layer and the substrate, pressing at least one of the TSP material layer and substrate against the other of the TSP material layer and the substrate, heating the braze material to a temperature of at least 800° C., and cooling the braze forming a bond attaching the TSP material layer to the substrate. 1. A method of attaching a thermally stable polycrystalline diamond (TSP) material layer to a substrate comprising:placing a braze material between the TSP material layer and the substrate;pressing at least one of said TSP material layer and substrate against the other of said TSP material layer and the substrate;heating said braze material to a temperature of at least 800° C.; andcooling said braze forming a bond attaching said TSP material layer to said substrate.2. The method as recited in claim 1 , wherein placing comprises placing a braze material between the TSP material layer and the substrate forming an assembly and wherein heating comprises heating said assembly within a furnace chamber.3. The method as recited in claim 2 , further comprising exposing said assembly to gas selected from the group of gases consisting essentially of hydrogen based gases claim 2 , nitrogen based gases claim 2 , argon based gases claim 2 , inert gases and combinations thereof4. The method as recited in claim 3 , further comprising drawing a vacuum through the chamber after exposing and prior to heating.5. The method as recited in claim 1 , wherein heating comprises heating said braze to a temperature greater than 920° C.6. The method as recited in claim 1 , wherein heating comprises heating said braze to a temperature greater than 1050° C.7. The method as recited in claim 1 , wherein heating comprises induction heating.8. The method as recited in claim 1 , further comprising surrounding at least a ...

Подробнее
Номер записи: 67
10-04-2014 дата публикации

METAL SHELL AND PLATE MEMBER WELDING METHOD

Номер: US20140097180A1
Автор: Chen Lien-Hsing, HSIANG HUI-HUNG
Принадлежит: POWER MATE TECHNOLOGY CO., LTD

A metal shell and plate member welding method includes the steps of: A) preparing a shell and a plate member, B) applying a solder material to the plate member, C) attaching the shell to the solder material at the plate member to form a semi-finished product and then putting the semi-finished product in a fence of a bottom tool member, D) moving the bottom tool member to insert the semi-finished product and the fence into the space surrounded by an induction coil of an induction heater and then pressing a top tool member on the semi-finished product, E) operating the induction coil to heat the border edge of the shell to a temperature level about 20° C.˜100° C. over the melting point of the solder material, thereby melting the solder material, and F) cooling down the solder material to finish the welding procedure. 1. A metal shell and plate member welding method , comprising the steps of:A) preparing a shell and a plate member, said shell being a metal member having a border edge for bonding;B) applying a solder material to a surface area of said plate member corresponding to said border edge of said shell to form a strip of solder material subject to a predetermined thickness and width;C) covering said shell on said plate member to attach said border edge of said shell to said solder material and to form a semi-finished product, and then putting said semi-finished product in a bottom tool member having a non-metal fence for enabling said bottom tool member to support said semi-finished product and said non-metal fence of said bottom tool member to surround said plate member and said shell to keep said plate member and said shell in place;D) moving said bottom tool member vertically to insert said semi-finished product and said fence into the space surrounded by an induction coil of an induction heater; and then pressing a top tool member on said plate member of said semi-finished product;E) operating said induction heater to generate an oscillating current through ...

Подробнее
Номер записи: 68
01-01-2015 дата публикации

Apparatus for Thermal Melting Process and Method of Thermal Melting Process

Номер: US20150001282A1
Автор: ABE Hideyuki
Принадлежит: AYUMI INDUSTRY CO., LTD.

Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.

Подробнее
Номер записи: 69
07-01-2016 дата публикации

MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE

Номер: US20160001388A1
Автор: HAYASHI Hiromasa, Nishikawa Kimihito, OI Sotaro, Oohiraki Tomoya
Принадлежит:

A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded. 1. A manufacturing method of power-module substrate wherein a plurality of copper-circuit plates are bonded at intervals on a ceramic plate having an area wherein ceramic substrates can be formed abreast , and then the ceramic plate is divided between the copper-circuit plates so as to manufacture the power-module substrates , comprising:a laminating step of forming bonding-material layers of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates on one of the ceramic plate or the plurality of copper-circuit plates, spreading temporal-stick material including polyethylene glycol as a major ingredient on the other of the ceramic plate or the plurality of copper-circuit plates, and temporary sticking the bonding-material layers and the copper-circuit plates in a state of laminating with positioning on the ceramic plate by the temporal-stick material; anda bonding step of bonding the ceramic plate and the copper-circuit plates by pressurizing and heating a laminated assembly thereof in a laminating direction.2. The manufacturing method of power- ...

Подробнее
Номер записи: 70
07-01-2016 дата публикации

METHOD FOR PRODUCING A CIRCUIT CARRIER AND FOR CONNECTING AN ELECTRICAL CONDUCTOR TO A METALLIZATION LAYER OF A CIRCUIT CARRIER

Номер: US20160001393A1
Автор: Essert Mark, Nomann Marianna, Nuebel Thomas, Strotmann Guido
Принадлежит:

One aspect of the invention relates to a method for producing a circuit carrier. For this purpose, an electrically insulating carrier is provided, having an upper side and also an underside opposite from the upper side. A first metal foil and a hardening material are likewise provided. Then, an upper metallization layer, which is arranged on the upper side and has a hardening area, is produced. In this case, at least one contiguous portion of the hardening area is created by at least part of the hardening material being diffused into the first metal foil. 1. A method for producing a circuit carrier , comprising the steps of:providing an electrically insulating carrier, which has an upper side and also an underside opposite from the upper side;providing a first metal foil;providing a hardening material; andproducing an upper metallization layer arranged on the upper side and having a hardening area, at least one contiguous portion of the hardening area being created by at least part of the hardening material being diffused into the first metal foil.2. The method as claimed in claim 1 , in which the contiguous portion has a thickness of at least 5 μm and/or of at most 100 μm.3. The method as claimed in claim 1 , in which the contiguous portion has a base area of at least 1 mm.4. The method as claimed in claim 1 , in which the contiguous portion has at every location:a first hardness, which is greater than a second hardness of the first metal foil.5. The method as claimed in claim 1 , in which the carrier provided is formed as a ceramic layer or as a green sheet.6. The method as claimed in claim 1 , in which claim 1 , before the diffusion claim 1 , the hardening material is applied to the side of the first metal foil that is facing away from the carrier.7. The method as claimed in claim 1 , in which claim 1 , before the diffusion claim 1 , the hardening material is applied to the side of the first metal foil that is facing the carrier.8. The method as claimed in claim ...

Подробнее
Номер записи: 71
02-01-2020 дата публикации

REFLOW FURNACE AND SOLDERING METHOD

Номер: US20200001386A1
Автор: KANDA TOSHIRO, NAGAI Koichi, TAKANO Yasuyuki, YAMAGUCHI NAOSHI
Принадлежит:

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board. 1. A reflow furnace that has a heat zone in which a circuit board with a mounted electronic component is heated , and a cooling zone in which the heated circuit board is cooled ,the reflow furnace comprising:a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; anda tunnel-like cover coupled to the opening and extending along a transport direction of the circuit board.2. The reflow furnace according to claim 1 , further comprising an electrostatic-precipitation flux collection apparatus that includes a drawing unit that draws an atmosphere gas out of the reflow furnace in the heat zone claim 1 , and a flux collection unit that collects a flux contained in the atmosphere gas claim 1 , wherein the flux collection apparatus returns the gas to the cooling zone after collecting the flux.3. The reflow furnace according to claim 2 , wherein the drawing unit has a slit-like suction nozzle disposed over a width direction perpendicular to the transport direction of the circuit board in the reflow furnace.4. The reflow furnace according to claim 1 , which satisfies TP1>TP2>TP3>TP4 claim 1 , where TP1 is an ambient temperature of the heat zone claim 1 , TP2 is a temperature inside the tunnel-like cover on the heat zone side of the shield claim 1 , TP3 is a temperature inside the tunnel-like cover on the cooling zone side of the shield claim 1 , and TP4 is an ambient temperature ...

Подробнее
Номер записи: 72
03-01-2019 дата публикации

HEATING APPARATUS AND METHOD FOR PRODUCING PLATE-LIKE OBJECT

Номер: US20190001425A1
Автор: Matsuda Jun, NAGAHAMA Masanobu, OKUBO Tatsuo, OZAWA Naoto, SHINOHARA Shinichi, Suzuki Takayuki
Принадлежит:

To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater for heating target object W, and a support member disposed on a front face of the heater and for supporting a face Wf of the heating target object W. The support member supports the heating target object W in such a manner that: the support member prevents direct heat transfer between the face Wf and the support member a clearance between the front face and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member and heating the heating target object W with the heater to produce the plate-like object. 1. A heating apparatus for heating a plate-like heating target object , the heating apparatus comprising:a heater having a front face formed to have a size capable of covering a whole face of the heating target object and configured to generate heat to be applied to the heating target object; anda support member for supporting the face of the heating target object in such a manner that the support member is configured to prevent direct heat transfer between the face of the heating target object and the support member and a clearance between the front face and the face of the heating target object is maintained in a predetermined clearance when the heating target object is supported, wherein the predetermined clearance allows a fluid to be present between the front face and the face of the heating target object but does not induce convection of the fluid; a heating source for receiving external energy and converting the external energy into heat; and', 'a jig having the front face formed thereon, the jig being configured to receive heat from the heating source and transfer heat to the fluid ...

Подробнее
Номер записи: 73
03-01-2019 дата публикации

METHOD FOR BONDING FLEXIBLE PART INCLUDING INCLINED LEADS

Номер: US20190001426A1
Автор: CHO CHIHO, JI SEONG YONG, JU HYOUNG YEON, SHIM MOO SUP
Принадлежит: PROTEC CO., LTD.

A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface. 1. A method of bonding a flexible part including inclined leads , in which at least one inclined lead of a first part that is inclined with respect to a plane where the first part and a second part face each other , is bonded to at least one inclined pad of the second part formed to face the at least one inclined lead , the method comprising:(a) clamping the first part by using a first fixing member mounted to a support bracket that is rotatably mounted with respect to a base;(b) clamping the second part by using a second fixing member mounted to the support bracket;(c) transporting the second fixing member by using a second transporting unit that is fixed to the support bracket and transports the second fixing member relative to the support bracket so as to align a location of the second part with respect to the first part clamped by the first fixing member;(d) moving the first part, which is clamped by the first fixing member, near the second part clamped by the second fixing member, by using a first transporting unit that is mounted to the support bracket and transports the first fixing member relative to the support bracket;(e) rotating the support bracket with respect to the base by using a tilt unit rotating the support bracket with respect to the base, such that the at least one inclined lead of the first part and the at least one inclined pad of the second part face a bonding head bonding the at least one inclined lead to the at least one inclined pad; and(f) bonding the at least one inclined lead of the first part to the at least one inclined pad of the second part by using the bonding head ...

Подробнее
Номер записи: 74
03-01-2019 дата публикации

ULTRASONIC ANVIL HAVING LOW TRANSMISSIBILITY

Номер: US20190001430A1
Автор: Malchow Gregory L., Rajala Gregory John
Принадлежит:

An anvil system for use in an ultrasonic bonder includes an anvil assembly including an anvil bar having an anvil aperture in at least one anvil bar longitudinal end, the anvil aperture having an anvil aperture inner surface, a shaft separate from the anvil bar and partially disposed in the anvil aperture, the shaft having a circumferential surface and extending outwardly beyond the anvil bar longitudinal end, and a first elastomeric shaft O-ring disposed on the shaft between the shaft circumferential surface and the anvil aperture inner surface; a mounting bracket with a mounting bracket hole having a hole surface; a bushing disposed in the mounting bracket hole and sized to accommodate an end of the shaft, the bushing having a bushing inner surface; and a second elastomeric shaft O-ring disposed on the shaft between the shaft circumferential surface and the bushing inner surface. 1. An anvil system for use in an ultrasonic bonder , the anvil system comprising: an anvil bar having an axial direction, two anvil bar longitudinal ends, and an anvil aperture in at least one anvil bar longitudinal end, the anvil aperture having an anvil aperture inner surface,', 'a shaft separate from the anvil bar and partially disposed in the anvil aperture, the shaft having a circumferential surface and extending outwardly beyond the anvil bar longitudinal end, and', 'a first elastomeric shaft O-ring disposed on the shaft between the shaft circumferential surface and the anvil aperture inner surface;, 'an anvil assembly including'}a first mounting bracket with a first mounting bracket hole therein, the mounting bracket hole having a hole surface;a first bushing disposed in the first mounting bracket hole and sized to accommodate an end of the shaft, the first bushing having a bushing inner surface and a bushing outer surface; anda second elastomeric shaft O-ring disposed on the shaft between the shaft circumferential surface and the bushing inner surface.2. The anvil system of claim ...

Подробнее
Номер записи: 75
03-01-2019 дата публикации

Induction Curing of Cell-Based Structural Arrays

Номер: US20190001581A1
Автор: Banks David L., Georgeson Gary Earnest, Hafenrichter Joseph Lawrence, Marshall Joseph A., Miller Robert James, Mori Paul B.
Принадлежит:

Adhesive bondlines in a cell-based structural array are thermally cured using tooling blocks inserted into the cells. The tooling blocks have embedded susceptors that are inductively heated by an alternating electromagnetic field generated by an electromagnet. 1. Apparatus for use in heating at least one cell in a cell-based composite structure , comprising:a tooling block configured to be inserted into the cell, the tooling block including at least one susceptor responsive to electromagnetic energy from a source thereof for heating at least a portion of the cell.2. The apparatus of claim 1 , wherein the tooling block includes:a tool body formed of a material transparent to an electromagnetic field, andthe susceptor is embedded within the tool body.3. The apparatus of claim 2 , wherein the susceptor is centrally located within the tool body.4. The apparatus of claim 2 , wherein the susceptor is a tube having circular cross-sectional shape.5. The apparatus of claim 2 , wherein the susceptor is a tube having a square cross-sectional shape.6. The apparatus of claim 2 , wherein the susceptor is substantially hollow.7. The apparatus of claim 2 , wherein the susceptor includes at least one conductive wire wrapped around the tool body.8. The apparatus of claim 2 , wherein:the tool body has an outer peripheral surface configured to contact walls of the cell, andthe susceptor includes multiple susceptor elements embedded in and located proximal to the outer peripheral surface of the tool body.9. The apparatus of claim 2 , wherein:the tool body includes a central tool body core and an outer shell surrounding the central tool body core, andthe susceptor is wrapped around the central tool body core.10. Apparatus for thermally curing a composite structure having an array of composite cells formed by cell walls joined together by adhesive bondlines claim 2 , comprising:a bank of tooling blocks configured to be respectively inserted into the cells of the array of composite cells ...

Подробнее
Номер записи: 76
05-01-2017 дата публикации

METHOD AND APPARATUS FOR AN INSULATING GLAZING UNIT AND COMPLIANT SEAL FOR AN INSULATING GLAZING UNIT

Номер: US20170002602A1
Автор: BEIDLEMAN NEAL J., FRANCIS, FREEBURY GREGG E., HULSE MICHAEL, IV WILLIAM H.
Принадлежит: EVERSEALED WINDOWS, INC.

A Vacuum Insulating Glazing Unit (VIGU) comprises two or more glass lites (panes) spaced apart from one another and hermetically bonded to an edge seal assembly therebetween. The resulting cavity between the lites is evacuated to create at least one insulating vacuum cavity within which are disposed a plurality of stand-off members to maintain separation between the lites. The edge seal assembly is preferably compliant in the longitudinal (i.e., edgewise) direction to allow longitudinal relative motion between the two lites (e.g., from thermal expansion). The longitudinal compliance may be obtained by imprinting a three-dimensional pattern into the edge seal material. The edge seal assembly is preferably bonded to the lites with a first bond portion that is hermetic and a second bond portion that is load-resistant. Methods for producing VIGUs and/or compliant edge seal assemblies and VIGU and edge seal apparatus are disclosed. 1. (canceled)2. A method of manufacturing an insulating glazing unit , the method comprising the following steps:a) providing a length of first inner member, wrapping the length of inner member around a first lite, cutting and joining the first inner member to itself at the location where it would otherwise overlap itself, and joining the first inner member to the edge of the first lite where it is coincident after wrapping;b) providing a length of second inner member, wrapping the length of inner member around a second lite, cutting and joining the second inner member to itself at the location where it would otherwise overlap itself, and joining the second inner member to the edge of the second lite where it is coincident after wrapping;c) positioning the first lite and the second lite in a spaced-apart configuration forming the cavity;d) providing a length of an outer member having a compliant region with a three-dimensional surface pattern, wrapping the outer member around the assembly of first and second lites and first and second inner ...

Подробнее
Номер записи: 77
13-01-2022 дата публикации

LASER SOLDERING DEVICE AND LASER SOLDERING METHOD

Номер: US20220009029A1
Автор: CHEN Hung-Wen, DING Ren-Feng, WU Shu-Han
Принадлежит:

A laser soldering device includes a laser source, a lens group, a temperature sensor, and a feedback controller. The laser source emits a laser beam, which is power-adjustable, according to a control signal. The temperature sensor receives infrared rays radiated when the laser beam is irradiated to the soldering point to detect the temperature of the soldering point, and correspondingly outputs a sensing signal according to the detected temperature. When the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature. The feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature can be substantially equal to the target temperature. 1. A laser soldering device , comprising:a laser source, emitting a laser beam, which is power-adjustable, according to a control signal;a lens group, outputting the laser beam to a soldering point;a temperature sensor, receiving infrared rays radiated when the laser beam is irradiated to the soldering point to detect a temperature of the soldering point; and correspondingly outputting a sensing signal according to the detected temperature; anda feedback controller, receiving the sensing signal, and sending the control signal to the laser source according to the sensing signal;wherein when the detected temperature falls into a first temperature range based on a target temperature, the feedback controller executes a PID algorithm to calculate a predicted error value according to an error value between the detected temperature and the target temperature; the feedback controller controls the laser source according to the predicted error value, and adjusts the power of the laser beam accordingly, so that the detected temperature ...

Подробнее
Номер записи: 78
05-01-2017 дата публикации

Integrate Rinse Module in Hybrid Bonding Platform

Номер: US20170004964A1
Автор: Chao Lan-Lin, Chen Xiaomeng, HSIEH Yuan-Chih, Huang Xin-Hua, Kuang Hsun-Chung, LIN Hung-Hua, Liu Ping-Yin, Tsai Chia-Shiung
Принадлежит:

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. 1. A method comprising: a chamber;', 'a storage outside of the chamber, wherein the storage is configured to store liquid;', 'a nozzle in the chamber and connected to the storage; and', 'a retractable wafer support in the chamber, wherein the retractable wafer support is configured to rotate the package component, and spin the package component at different levels., 'an integrated cleaning station comprising, 'using an apparatus to form a package component, the apparatus comprising2. The method of claim 1 , wherein the integrated cleaning station further comprises a first container in the chamber claim 1 , and the method further comprises:adjusting the retractable wafer support to a first level, wherein at the first level, the package component is inside the first container, and is lower than first top edges of the first container;disposing a first chemical on the package component and simultaneously spinning the package component at the first level; anddraining the first chemical collected by the first container.3. The method of claim 2 , wherein the apparatus further comprises a second container claim 2 , with the first container located in the second container claim 2 , and the method further comprises:adjusting the retractable wafer support to spin the package component at a second level higher than the first top edges of the first container and lower than second top edges of the second container;disposing a second chemical on the package component and simultaneously spinning the package component at the second level; anddraining the second chemical collected by the second container.4. The method of further comprising:adjusting the retractable wafer support to spin the package component at a ...

Подробнее
Номер записи: 79
05-01-2017 дата публикации

REFLOW APPARATUS

Номер: US20170005063A1
Автор: KANG Tae-Gyu, SONG Kun-ho, SUNG Jung-hun, Yu Ju-Young
Принадлежит:

A reflow apparatus include a carrier supporting a printed circuit board placed on a side thereof by using a vacuum pressure generated therein, and a processing chamber including a heating chamber and a cooling chamber, wherein the carrier includes at least one adsorption hole, formed in one side of the carrier, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing a vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside. 1. A reflow apparatus comprising:a carrier for a printed circuit board having a semiconductor chip on a top side thereof, the carrier fixing the printed circuit board on a side thereof via a vacuum pressure generated therein; anda processing chamber where the carrier is placed in and discharged from, and wherein a reflow process is performed to mount the semiconductor chip on the printed circuit board,wherein the carrier includes at least one adsorption hole in a side thereof, a vacuum space connected to the adsorption hole, and a vacuum control unit capable of maintaining or removing the vacuum pressure in the vacuum space by selective opening and closing a path connecting the vacuum space to the outside.2. The reflow apparatus of claim 1 , wherein the vacuum control unit comprises a vacuum maintaining unit and a vacuum removing unit.3. The reflow apparatus of claim 2 , wherein at least one of the vacuum maintaining unit and the vacuum removing unit comprises a vacuum valve.4. The reflow apparatus of claim 1 , further comprising a vacuum pump to remove a gas from the vacuum space through the vacuum control unit.5. The reflow apparatus of claim 1 , further comprising a conveying unit traversing the processing chamber and conveying the carrier.6. The reflow apparatus of claim 1 , wherein the carrier further comprises a recess region on one side thereof and the adsorption hole is placed inside the recess region.7. The reflow ...

Подробнее
Номер записи: 80
05-01-2017 дата публикации

BONDING DEVICE

Номер: US20170005064A1
Автор: Sugito Akio
Принадлежит:

[Problem] 1. A bonding device that includes a vibration driving portion to vibrate a capillary , the vibration driving portion comprising:a piezoelectric element that is expanded and contracted along an axial direction of a bonding arm with one end thereof fixed to a leading end of the bonding arm;a capillary holding portion that is in contact with a circumferential face of the capillary at a base end side thereof as being fixed to the other end of the piezoelectric element;a string-like member that is wound to a half circumferential face of the capillary at the base end side on a side opposite to the capillary holding portion; anda tension mechanism that is arranged at the bonding arm side to press and hold the capillary to the capillary holding portion by exerting tensile force on the string-like member.2. The bonding device according to claim 1 ,wherein the vibration driving portion operates without utilizing resonance.3. The bonding device according to claim 1 ,wherein the string-like member presses and holds the capillary to the capillary holding portion so that the capillary is capable of performing bonding operation owing to that tensile force is exerted on the string-like member by the tension mechanism.4. The bonding device according to claim 1 ,wherein the string-like member has tensile force exerted by the tension mechanism and applies preliminary pressure required for driving the capillary and fixing the capillary to the capillary holding portion.5. The bonding device according to claim 1 ,wherein the string-like member has a possible length of expansion and contraction being larger than a length of expansion and contraction of the piezoelectric element in a state that predetermined preliminary pressure required for driving the capillary and fixing the capillary to the capillary holding portion is applied as having tensile force exerted by the tension mechanism.6. The bonding device according to claim 1 ,wherein the tension mechanism causes ends of the ...

Подробнее
Номер записи: 81
13-01-2022 дата публикации

WIRE BONDING APPARATUS

Номер: US20220013491A1
Автор: LEE Jongeun
Принадлежит:

Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction. 1. A wire bonding apparatus , comprising:a capillary that extrudes a wire;a wire clamp assembly disposed on the capillary; anda support disposed on the wire clamp assembly, a first member;', 'a second member spaced apart from the first member;', 'a first contact member coupled to the first member; and', 'a second contact member coupled to the second member and spaced apart from the first contact member,, 'wherein the wire clamp assembly includes a first body that extends in a first direction; and', 'a first tilting member that extends at an acute angle relative to the first direction,, 'wherein the first member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction; and', 'a second tilting member that extends at the acute angle relative to the first direction and is spaced apart from the first tilting member,, 'wherein the second member includeswherein the first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member,wherein the second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member, andwherein the second member is movable in ...

Подробнее
Номер записи: 82
07-01-2016 дата публикации

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND BONDING MACHINES

Номер: US20160005709A1
Автор: Colosimo, JR. Thomas J., Schmidt-Lange Michael P., Wasserman Matthew B.
Принадлежит:

A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile. 1. A bonding machine for bonding semiconductor elements , the bonding machine comprising:a bond head assembly including a bonding tool for bonding semiconductor elements to a substrate;a support structure for supporting the substrate;a calibration station used in connection with the bond head assembly for measuring a time based z-axis height measurement characteristic of the bond head assembly during a model bonding process; anda computer for determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic.2. The bonding machine of wherein the calibration station is coupled to the support structure and moves along with the support structure along at least one motion axis.3. The bonding machine of wherein the calibration station includes a contact surface configured to be contacted by the bonding tool during the model bonding process.4. The bonding machine of further comprising a plurality of temperature sensors attached to a plurality of locations of the bond head assembly.5. The bonding machine of wherein the bond head assembly includes a force sensor for measuring a downward force applied by the bond head assembly.6. The bonding machine of further comprising a displacement sensor for measuring the time based z-axis height measurement characteristic in connection with the calibration station.7. The bonding machine of wherein the ...

Подробнее
Номер записи: 83
07-01-2016 дата публикации

METHODS OF ATTACHING ELECTRONIC COMPONENTS

Номер: US20160005710A1
Автор: de Beer Johan, Eltink Erik, Mavinkurve Amar, WALCZYK Sven
Принадлежит:

A method of attaching an electronic component to a metal substrate, wherein the electronic component comprises solder provided on an exposed solder region. The method comprising: forming a metal-based compound layer on the substrate; placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; and heating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate. The metal-based compound layer can have a minimum thickness of 10 nm. 1. A method of attaching an electronic component to a metal substrate , wherein the electronic component comprises solder provided on an exposed solder region , the method comprising:forming a metal-based compound layer on the substrate, wherein the metal-based compound layer has a minimum thickness of 10 nm;placing the electronic component on the metal substrate such that the solder region is in contact with a contact region of the metal-based compound layer; andheating the solder region such that the contact region of the metal-based compound layer dissolves and the solder region forms an electrical connection between the electronic component and the metal substrate.2. The method of claim 1 , wherein the metal-based compound layer has a maximum thickness of 50 nm.3. The method of claim 1 , wherein the step of forming the metal-based compound layer on the substrate comprises exposing the metal substrate to a reactive gas.4. The method of claim 3 , wherein forming the metal-based compound layer on the substrate comprises exposing the metal substrate to the reactive gas at a temperature in the range of about 150° C. to about 250° C.5. The method of claim 3 , wherein forming the metal-based compound layer on the substrate comprises exposing the metal substrate to a reactive gas for a predetermined period of ...

Подробнее
Номер записи: 84
02-01-2020 дата публикации

Integrate Rinse Module in Hybrid Bonding Platform

Номер: US20200006052A1
Автор: Chao Lan-Lin, Chen Xiaomeng, HSIEH Yuan-Chih, Huang Xin-Hua, Kuang Hsun-Chung, LIN Hung-Hua, Liu Ping-Yin, Tsai Chia-Shiung
Принадлежит:

A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component. 1. A method comprising: performing a plasma treatment on the package component in the surface treatment station;', 'removing oxides on surface metal pads of the package component in the integrated cleaning station; and', 'cleaning the package component using de-ionized water in the integrated cleaning station., 'using an apparatus to form a package component, the apparatus comprising a surface treatment station and an integrated cleaning station, and the method comprising2. The method of further comprising:dispensing a first chemical on the package component;collecting the first chemical using a first container in a chamber in the integrated cleaning station;dispensing a second chemical on the package component; andcollecting the second chemical using a second container in the first container.3. The method of claim 2 , wherein the collecting the first chemical comprises spinning the first chemical into the first container claim 2 , and the first chemical passes top edges of the second container and drops into the first container.4. The method of claim 2 , wherein the second container is fully inside the first container claim 2 , and the second container has top edges lower than top edges of the first container.5. The method of further comprising:cleaning the package component using de-ionized water; andcollecting the de-ionized water using a third container in the chamber.6. The method of further comprising:draining the collected first chemical out of the first container through a first outlet connecting from outside of the chamber to the first container; anddraining the collected second chemical out of the second container through a second outlet connecting from outside of the chamber to the second ...

Подробнее
Номер записи: 85
08-01-2015 дата публикации

METHOD AND DEVICE FOR CONNECTING AN OPTICAL ELEMENT TO A FRAME

Номер: US20150008215A1
Автор: Albrecht Guenter, Bingel Ulrich, EKSTEIN Claudia, Fedosenko Gennady, Gorkhover Leonid, Klose Gerd, Rau Johnannes, Schoeppach Armin, Trefz Hans-Joachim, Widmann Michael, Wiesner Stefan
Принадлежит: CARL ZEISS SMT GMBH

A method and a device for the material-fit connection of an optical element to a frame are disclosed. 136-. (canceled)37. A method , comprising:providing an optical element within a frame, a metal layer being disposed between the optical element and the frame;melting only one component selected from the group consisting of the metal layer and the frame; andsubsequently solidifying the component to connect the optical element with the frame.38. The method of claim 37 , wherein the component is the metal layer.39. The method of claim 38 , wherein:the metal layer comprises a first surface and a second surface;the second surface is between the first surface and the frame;the method comprises melting the second surface of the metal layer; andthe first surface of the metal layer is unmelted when the second surface of the metal layer is melted.40. The method of claim 37 , wherein the metal layer has a diameter of about 0.1-1.5 mm.41. The method of claim 37 , wherein the metal layer has a thickness of about 0.3-2 mm.42. The method of claim 37 , comprising using a laser to melt the component.43. The method of claim 37 , wherein the metal layer is on an optically inactive surface of the optical element.44. The method of claim 37 , wherein the optical element and the frame are in mechanical contact with one another via at least three connection positions through non-molten regions of the metal layer during each instant of the melting and subsequent solidification of the metal layer.45. The method of claim 37 , wherein claim 37 , after solidifying the component claim 37 , the optical element is not in direct contact with the frame.46. A method claim 37 , comprising:providing an optical element within a frame, a material being between the optical element and the frame, the material comprising a metal; andconnecting the optical element with the frame by melting the material and subsequently solidifying the material,wherein the material comprises an admixture to increase a ...

Подробнее
Номер записи: 86
08-01-2015 дата публикации

Device For Dispensing And Distributing Flux-Free Solder On A Substrate

Номер: US20150008249A1
Автор: Berchtold Heinrich, Galea Charles, STROEMBERG Christoffer
Принадлежит:

A device for dispensing and distributing flux-free solder on a substrate comprises an elongated tool, a tool mount, an ultrasonic generator, a wire guide tube, and optionally a heat sink and a housing. The tool can be fixed to the tool mount and has a longitudinal borehole which opens into an opening on the tip of the tool. The wire guide tube extends along a central longitudinal axis through the ultrasonic generator and the tool mount, protrudes into the longitudinal borehole of the tool and reaches up to a position above the tip of the tool. The wire guide tube does not touch the tool. The ultrasonic generator is fixed to the tool mount. Advantageously, a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator. 2. The device of claim 1 , wherein the tool mount comprises an extension in which the wire guide tube bears.3. The device of claim 2 , wherein the extension is arranged in a node of the ultrasonic waves generated by the ultrasonic generator.4. The device of claim 1 , further comprising a housing claim 1 , wherein a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.5. The device of claim 2 , further comprising a housing claim 2 , wherein a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.6. The device of claim 3 , further comprising a housing claim 3 , wherein a cooling chamber which can actively be cooled is formed between an inner wall of the housing and the ultrasonic generator.7. The device of claim 1 , further comprising a heat sink which is fixed to the wire guide tube.8. The device of claim 3 , further comprising a heat sink which is fixed to the wire guide tube.9. The device of claim 6 , further comprising a heat sink which is fixed to the wire guide tube.11. The writing head of claim 10 , wherein the tool mount comprises an extension in which ...

Подробнее
Номер записи: 87
08-01-2015 дата публикации

MANUFACTURING METHOD FOR A SHIELD CONDUCTOR

Номер: US20150008252A1
Автор: NAKAI Hirokazu, OOHIRA Yuki
Принадлежит:

A method is disclosed for manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity. The method includes fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region; attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part; melting the welding band that is attached in the fitting region; and welding the tubular part to the metallic braid part along a circumferential direction of the tubular part. 1. A method of manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity , the method comprising:fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region;attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part;melting the welding band that is attached in the fitting region; andwelding the tubular part to the metallic braid part along a circumferential direction of the tubular part.2. The method recited in claim 1 , whereinthe metallic wire of the metallic braid part is coated on a surface with copper or copper alloy,the welding band is fitted to an outer peripheral surface of an end part of the metallic braid part prior to welding, andthe welding band fitted to the end part of the metallic braid part is melted using an ultrasonic joining machine such that the welding band joins the metallic braid part with the tubular part.3. The method recited in claim 1 , further comprisingforming a positioning part for positioning the welding band on the outer peripheral surface of the tubular part, ...

Подробнее
Номер записи: 88
03-01-2019 дата публикации

Electrical connector assembly method

Номер: US20190006807A1
Автор: Ted Ju
Принадлежит: Lotes Co Ltd

An electrical connector assembly method, including the steps of: step 1: providing a terminal having a soldering portion; step 2: heating the soldering portion to a melting temperature of a solder; step 3: providing the solder, and press-fitting the solder to the soldering portion by a jig, so that the solder is fused and fixed to the soldering portion; and step 4: inserting the terminal fixed with the solder into an insulating body. Because only the soldering portion of the terminal is heated, less thermal energy is needed, thereby saving energy and reducing the production cost of the electrical connector. Moreover, the insulating body does not need to be heated, thus preventing the insulating body from being warped and deformed due to heat.

Подробнее
Номер записи: 89
07-01-2016 дата публикации

Ball Grid Array Rework

Номер: US20160007457A1
Автор: Kline Eric V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments of the invention relates to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. An apparatus comprising:a ball grid array (BGA) package assembled on to a printed circuit board;an expansion material placed between the BGA package and the printed circuit board, including interstitial placement of the material within a matrix of solder joints between the BGA package and the printed circuit board;an applicator in communication with the material, the application to apply a tensile force between a ball grid array (BGA) package and the printed circuit board, including delivery of electric current to the expansion material, wherein the application of the tensile force is controlled by a regulator in communication with the applicator;a localized heating of the expansion material created from the current;an expansion force applied to the solder joints from the heated material, the expansion force including separation of the BGA from the printed circuit board.7. The apparatus of claim 6 , further comprising the expansion force to elongate the solder joints into two parts claim 6 , including a first part to remain in communication with the BGA package and a second part to remain in communication with the printed circuit board.8. The apparatus of claim 6 , wherein the expansion material is selected from the group consisting of: a memory shape alloy and a high z-axis coefficient of thermal expansion ...

Подробнее
Номер записи: 90
07-01-2016 дата публикации

Ball Grid Array Rework

Номер: US20160007515A1
Автор: Kline Eric V., SINHA Arvind K.
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. 1. A method comprising:placing an expansion material between a ball grid array (BGA) package assembled in communication with a printed circuit board, including the expansion material placed interstitially within a matrix of solder joints between the BGA package and the printed circuit board;controlling a tensile force applied between a ball grid array (BGA) package and the printed circuit board, including delivering electric current to the expansion material; andthe electric current creating localized heating of the expansion material;the heated material applying an expansion force to the solder joints, including separation of the BGA from the printed circuit board.2. The method of claim 1 , further comprising the expansion force elongating the solder joints substantially into two parts claim 1 , including a first part remaining in communication with the BGA package and a second part remaining in communication with the printed circuit board.3. The method of claim 1 , wherein the expansion material is selected from the group consisting of: a memory shape alloy and a high z-axis coefficient of thermal expansion material.4. The method of claim 1 , further comprising aligning the material in parallel across the matrix claim 1 , including positioning parallel placements of the material between BGA package solder joints.5. The method of claim 1 , further comprising delivering heat from an external ...

Подробнее
Номер записи: 91
12-01-2017 дата публикации

JOINT DESIGN FOR IMPROVED STRENGTH OF PLASTIC AND COMPOSITE JOINTS

Номер: US20170008120A1
Автор: Rousseau Ingrid A., Shah Bhavesh
Принадлежит:

A number of variations may include a product that may include a final part that may include a first part that may include a first face and may define at least one through hole and a second part that may include a second face, at least one stake, and at least one energy director that may be disposed between the first face and the second face wherein the first face and the second face may be abutted against one another and the at least one stake may be passed through the at least one through-hole and the first part and the second part have been ultrasonically staked and ultrasonically welded such that an ultrasonically welded interface may be formed between the first part and the second part. 1. A product comprising:a final part comprising a first part comprising a first face and defining at least one through hole and a second part comprising a second face, at least one stake, and at least one energy director disposed between the first face and the second face wherein the first face and the second face are abutted against one another and the at least one stake is passed through the at least one through-hole and the first part and the second part have been ultrasonically staked and ultrasonically welded such that an ultrasonically welded interface is formed between the first part and the second part.2. A product as set forth in wherein the at least one energy director is disposed circumferentially around the at least one stake.3. A product as set forth in claim 1 , wherein the energy director is disposed on at least one of the first face or second face or both.4. A product as set forth in wherein the first part comprises a first phase transition temperature and the second part comprises a second phase transition temperature wherein the first phase transition temperature and the second phase transition temperature differ by about 0° C. to about 20° C.5. A product as set forth in wherein the ultrasonic staking and ultrasonic welding occurred simultaneously.6. A product ...

Подробнее
Номер записи: 92
14-01-2016 дата публикации

DEVICE FOR THERMAL MANAGEMENT OF SURFACE MOUNT DEVICES DURING REFLOW SOLDERING

Номер: US20160008904A1
Автор: Buschel Daniel James, Fisher Michael J., Tersigni James Edward
Принадлежит:

An apparatus includes a top plate sized to cover components for a PCB in a solder operation to attach the components to a top surface of the PCB. The apparatus may include heat shielding devices and/or heat attracting devices. Each heat shielding device reduces heat transfer to a component to be soldered to the PCB and is positioned in the top plate to decrease heat to the component corresponding to the heat shielding device. Each heat attracting device increases heat transfer to a component to be soldered to the PCB and each heat attracting device is positioned in the top plate to increase heat to the component under the heat attracting device. The top plate is coupled to the heat shielding and/or heat attracting devices and includes a recess for each component configured with a heat shielding device or a heat attracting device. 1. An apparatus comprising:a top plate sized to cover a plurality of components for a printed circuit board (“PCB”) in a reflow solder operation to attach the plurality of components to a top surface of the PCB; and one or more heat shielding devices, each heat shielding device reducing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat shielding device positioned in the top plate to decrease heat to the component corresponding to the heat shielding device; and', 'one or more heat attracting devices, each heat attracting device increasing heat transfer to a component to be soldered to the PCB during the reflow solder operation and each heat attracting device positioned in the top plate to increase heat to the component corresponding to the heat attracting device,, 'one or more of'}wherein the top plate is coupled to the one or more heat shielding and heat attracting devices and the top plate comprises a recess for each component of the plurality of components configured with a heat shielding device or a heat attracting device.2. The apparatus of claim 1 , wherein each recess is sized with ...

Подробнее
Номер записи: 93
11-01-2018 дата публикации

JOINING APPARATUS AND METHOD FOR LOADING A JOINING ELEMENT

Номер: US20180009056A1
Автор: FISCHERMANNS Bettina, IVO Hubert, Schneider Michael
Принадлежит:

Joining apparatus for joining joining elements onto workpieces, comprising a joining element holding device, which is configured to radially hold a joining element, and comprising a loading pin arrangement, which is configured to slide a joining element axially into a holding position in the joining element holding device, and/or to axially support the joining element during a joining process, wherein the loading pin arrangement has a loading pin, which is slidable by means of a loading pin actuator arrangement in the direction of the joining element holding device. The loading pin arrangement is here designed to variably establish a loading pin stroke of the loading pin between at least two stages, so that in a first stage the loading pin is displaceable less far in the direction of the joining element holding device than in a second stage. 1. A joining apparatus for joining joining elements onto workpieces , comprising a joining element holding device , which is configured to radially hold a joining element , and comprising a loading pin arrangement , which is configured to slide a joining element axially into a holding position (H) in the joining element holding device , and/or to axially support the joining element during a joining process , wherein the loading pin arrangement has a loading pin , which is slidable by means of a loading pin actuator arrangement in the direction of the joining element holding device , wherein the loading pin arrangement is designed to variably establish a loading pin stroke of the loading pin between at least two stages , so that in a first stage the loading pin is displaceable less far in the direction of the joining element holding device than in a second stage.266. The joining apparatus according to claim 1 , wherein the loading pin is coupled with a loading pin piston of a loading pin cylinder which defines a first piston stroke () for the loading pin piston.3. The joining apparatus according to claim 2 , wherein the loading ...

Подробнее
Номер записи: 94
09-01-2020 дата публикации

METHOD FOR PRODUCING BONDED BODY, METHOD FOR PRODUCING INSULATED CIRCUIT BOARD, AND METHOD FOR PRODUCING INSULATED CIRCUIT BOARD WITH HEATSINK

Номер: US20200009671A1
Автор: Nagatomo Yoshiyuki, Ooi Soutarou, Yumoto Ryouhei
Принадлежит:

A method for producing a bonded body includes: a laminating step of forming a laminated body in which a first member and a second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member; and a bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other. In the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P at a decomposition temperature Tof the organic material included in the temporary bonding material is lower than a pressurization load P at the bonding temperature. 1. A method for producing a bonded body in which a first member and a second member are bonded to each other , the method comprising:a laminating step of forming a laminated body in which the first member and the second member are temporarily bonded to each other by providing a temporary bonding material including an organic material on at least one of a bonding surface of the first member and a bonding surface of the second member and laminating the first member and the second member via the temporary bonding material; anda bonding step of pressurizing and heating the laminated body in a laminating direction and bonding the first member and the second member to each other,{'b': 2', '1, 'sub': 'D', 'wherein in the bonding step, during a temperature increase process of heating the laminated body up to a predetermined bonding temperature, at least a pressurization load P at a decomposition temperature Tof the organic material included in the temporary bonding material is lower than a pressurization load P at the bonding temperature.'}2. The method for producing a bonded body according to claim 1 ,{'b': '2', 'sub': D', 'D', 'D, 'wherein the ...

Подробнее
Номер записи: 95
27-01-2022 дата публикации

MOUNTING METHOD AND MOUNTING STRUCTURE FORMED BY THE SAME

Номер: US20220030721A1
Автор: MATSUNO Koso, OHASHI Naomichi, OKAWA YASUHIRO
Принадлежит:

A method for mounting an electronic component on a resin base material, the method including: 1. A mounting method for mounting an electronic component on a resin base material , the method comprising:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;(3) placing the electronic component on the solder paste; and(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, whereina melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.2. The mounting method of claim 1 , whereinin step (4), a heating temperature is maintained for at least 5 minutes.3. The mounting method of claim 1 , whereinthe solder paste further contains a curing agent.4. The mounting method of claim 1 , whereinthe thermosetting resin is an epoxy resin.5. A mounting structure in which an electronic component is mounted on a resin base material claim 1 , the mounting structure comprising:a resin base material; a wiring pattern formed of a conductive paste on the resin base material; an electronic component disposed on the resin base material; and a solder bonding portion electrically connecting the wiring pattern and the electronic component, whereina cured thermosetting resin portion is interposed between the solder bonding portion and the resin base material.6. The mounting structure of claim 5 , whereina ratio of an area occupied by the cured thermosetting resin portion on a main surface of the resin base material to a sum of this area thereof and an area occupied by ...

Подробнее
Номер записи: 96
12-01-2017 дата публикации

Systems of Bonded Substrates and Methods for Bonding Substrates with Bonding Layers

Номер: US20170012016A1
Автор: JOSHI Shailesh N., Noguchi Masao
Принадлежит: Toyota Motor Engineering & Manufacturing North America, Inc.

A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a bonding layer precursor, positioning the bonding layer precursor between the first substrate and the second substrate, and bonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer. The first substrate may include a bonding surface, and a geometry of the bonding surface of the first substrate may include a plurality of microchannels. The second substrate may include a complementary bonding surface and the bonding layer precursor may include a metal. The bonding layer may fill the microchannels of the first substrate and may contact substantially the entire bonding surface of the first substrate. 1. A method for bonding a first substrate to a second substrate , the method comprising:providing the first substrate comprising a bonding surface comprising a plurality of microchannels spaced apart from one another such that one or more portions of the bonding surface of the first substrate are the microchannels and other portions of the bonding surface are positioned between the microchannels;providing the second substrate comprising a complementary bonding surface;providing a bonding layer precursor comprising a metal;positioning the bonding layer precursor between the first substrate and the second substrate, wherein the first surface of the bonding layer precursor is in contact with at least a portion of the bonding surface of the first substrate, and the second surface of the bonding layer precursor is in contact with at least a portion of the complementary bonding surface of the second substrate; andbonding the first substrate to the second substrate by heating the bonding layer precursor to form a bonding layer, wherein the bonding layer fills the microchannels of the first substrate and contacts substantially the entire bonding surface of the first ...

Подробнее
Номер записи: 97
09-01-2020 дата публикации

PRESSURE DETECTION UNIT AND PRESSURE SENSOR USING SAME

Номер: US20200011754A1
Автор: AOYAMA Tomohisa, MUKAI Motohisa, OGIWARA Kai, SHIMURA Tomonori, TAKATSUKI Osamu, TAMURA Youko
Принадлежит:

The present invention provides a pressure detection unit and a pressure sensor using the same that have a high degree of airtightness and that are capable of suppressing bonding defects even when the base is made of ceramics. In the pressure detection unit, a linear expansion coefficient of ceramic that forms the ceramic base is set to Δ1 (10/K) and a linear expansion coefficient of metal that forms the metal ring member is set to Δ2 (10/K), a relationship of 0.7×Δ2≤Δ1 exists between the linear expansion coefficients Δ1 and Δ2, and the metal ring member is formed of a metal such as SUS420J2, SUS410, or SUS444, for example, which does not precipitate aluminum oxide on a brazing surface with a projecting portion. 1. A pressure detection unit comprising:a ceramic base;a metal ring member bonded to the ceramic base by brazing;a receiving member bonded to the metal ring member by welding;a diaphragm interposed between the metal ring member and the receiving member; anda semiconductor pressure detection device attached to the ceramic base in a pressure receiving space formed between the ceramic base and the diaphragm; {'sup': −6', '−6, 'a linear expansion coefficient of ceramic that forms the ceramic base is set to Δ1 (10/K) and a linear expansion coefficient of metal that forms the metal ring member is set to Δ2 (10/K), a relationship of 0.7×Δ2≤Δ1 exists between the linear expansion coefficients Δ1 and Δ2, and the metal ring member is formed of a metal that does not precipitate aluminum oxide on a brazing surface with the ceramic base.'}, 'wherein2. The pressure detection unit according to claim 1 , wherein the metal that forms the metal ring member is martensitic stainless steel or ferritic stainless steel.3. The pressure detection unit according to claim 1 , wherein the metal that forms the ring member is any of SUS420J2 claim 1 , SUS410 or SUS444.4. The pressure detection unit according to claim 1 , wherein the ceramic that forms the ceramic base is alumina or alumina ...

Подробнее
Номер записи: 98
12-01-2017 дата публикации

METHOD AND APPARATUS FOR FORMING INTERFACE BETWEEN COAXIAL CABLE AND CONNECTOR

Номер: US20170012397A1
Автор: Paynter Jeffery D.
Принадлежит:

A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage; lowering the connector body and insulator onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; and applying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator. 1. A method of forming a solder joint between a coaxial cable and a coaxial connector , comprising the steps of:positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector, wherein the connector includes an insulator with a suction passage;lowering the connector body and insulator onto a mounting structure;melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the insulator and/or the connector body; andapplying suction to the melting solder element from a suction source to reduce the formation of bubbles within the solder joint, wherein a suction path between the suction source and the solder element includes the suction passage in the insulator.2. The method defined in claim 1 , wherein the suction path includes a passage through the mounting structure.3. The method defined in claim 2 , wherein the mounting structure includes a cap claim 2 , and wherein the suction path passes through the cap.4. The method defined in claim 1 , wherein the suction passage of the insulator ...

Подробнее
Номер записи: 99
15-01-2015 дата публикации

WAVE SOLDERING APPARATUS AND NOZZLE THEREOF

Номер: US20150014394A1
Автор: LING Li, PU Ke, Wang Chun C., Zhang Wei Feng
Принадлежит:

An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings. 1. An apparatus used for wave soldering , comprising:a nozzle device configured to discharge molten solder to a circuit board near a solder tank,wherein, the nozzle device comprises at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings.2. The apparatus according to claim 1 , wherein each nozzle opening of the pair of nozzle openings is formed by a vertical plate and an inclined plate claim 1 , the vertical plate of each nozzle opening at the inner side of the pair of nozzle openings claim 1 , and the inclined plate of each nozzle opening at the outer side of the pair of nozzle openings.3. The apparatus according to claim 1 , wherein the distance between the pair of nozzle openings is configured so that the time period during which the component on the circuit board passes through the high temperature solder between the pair of nozzle openings conforms to a specification on the staying period of a component in a high temperature solder.4. The apparatus according to claim 2 , wherein the inclination of the inclined plate of each nozzle opening is adjustable between 0 and 90 degree5. The apparatus according to claim 1 , further comprising a pump device being a single pump device and configured to drive the molten solder in the solder tank through a conduit to each nozzle opening in the adjacent nozzle openings of the nozzle device.6. The apparatus according to claim 5 , wherein the pump device is installed on a side of the solder tank.7. The apparatus according to claim 6 , wherein the pump device comprises:a rotation shaft inserted into the solder tank through an ...

Подробнее
Номер записи: 100