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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 18. Отображено 18.
26-10-2016 дата публикации

ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020160123938A
Автор: LEE, DOO HWAN, KIM, HYOUNG JOON, KIM, JONG RIP, OH, KYUNG SEOB, SHIN, UNG HUI
Принадлежит:

The present invention relates to an electronic component package with reduced warpage, and a method for effectively manufacturing the same. The electronic component package comprises: a frame having first and second surfaces facing each other, and a cavity; an electronic component arranged in the cavity of the frame; a rewiring layer arranged on a first surface of the frame, and electrically connected to the electronic component; and an encapsulation material encapsulating the electronic component, and having an elastic modulus smaller than that of a material configuring the frame. COPYRIGHT KIPO 2016 ...

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Номер записи: 1
21-09-2016 дата публикации

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Номер: KR1020160109424A
Автор: KIM, JONG RIP, LEE, JONG MYEON, SHIN, UNG HUI, LEE, DOO HWAN
Принадлежит:

The present invention relates to a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes the following steps: forming a cavity in the size or smaller of a chip part to penetrate one area on a core layer of a core substrate to be embedded; extending the cavity, by a first external stimulation factor, to have the size bigger than the size of the chip part; embedding the chip part in the extended cavity; reducing the cavity in the core substrate with the embedded chip part by a second external stimulation factor to make a side of the cavity and a side of the chip part come in contact; and forming insulation layers on both sides of the core substrate with the embedded chip part. The present invention is to provide the printed circuit board with reduced warpage. COPYRIGHT KIPO 2016 (AA) Start (BB) End (S310) Form a cavity in the size of a chip part or smaller (the size of the chip part = the size of the cavity) (S320) Cavity ...

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Номер записи: 2
21-04-2017 дата публикации

FAN-OUT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170043440A
Автор: LEE, DOO HWAN, OH, KYUNG SEOB, KIM, JONG RIP, KIM, HYOUNG JOON
Принадлежит:

The present invention relates to a fan-out semiconductor package and a manufacturing method thereof. The fan-out semiconductor package comprises: a first connection member having a through hole; a semiconductor chip which is arranged on the through hole of the first connection member and has an active surface with an access pad and a non-active surface arranged on an opposite side of the active surface; an enclosing material to enclose at least a portion of the non-active surface of the semiconductor chip and the first connection member; and a second connection member arranged on the active surface of the semiconductor chip and the first connection member and provided with a rewiring layer electrically connected to the access pad. The first connection member includes a first insulation layer, a first rewiring layer which comes in contact with the second connection member and is buried in the first insulation layer, and a second rewiring layer arranged on a side of the first insulation layer ...

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Номер записи: 3
13-11-2018 дата публикации

인쇄회로기판 및 그 제조방법

Номер: KR0101903557B1
Автор: 민태홍, 조석현, 김종립, 이정한
Принадлежит: 삼성전기주식회사

... 본 발명은 인쇄회로기판 및 그 제조방법에 관한 것이다. 본 발명에 따른 인쇄회로기판은, 강성이 구비된 코어 보강재; 상기 코어 보강재의 양면에 형성된 절연층; 상기 절연층과 코어 보강재를 관통하여 형성된 관통홀; 및 상기 절연층 상에 형성된 회로층과 상기 회로층의 층간 연결을 위하여 상기 관통홀에 형성된 도금층;을 포함한다.

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Номер записи: 4
25-01-2017 дата публикации

ELECTRONIC COMPONENT PACKAGE

Номер: KR1020170009074A
Автор: KIM, JONG RIP, LEE, DOO HWAN, LEE, JONG MYEON
Принадлежит:

The present invention includes a core part and an electronic device. Especially, the core part includes first and second resin layers and a reinforcing layer arranged therebetween. The first and second resin layers have different thicknesses from each other. When the temperature is changed, the present invention provides alleviated bending properties. COPYRIGHT KIPO 2017 ...

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Номер записи: 5
06-12-2022 дата публикации

냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템 및 그 방법

Номер: KR20220160905A
Автор: 김희문, 강무경, 김종립
Принадлежит:

... 본 발명에 따른 냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템 및 그 방법은 컨테이너 선박의 냉동컨테이너의 상태에 따른 선박 전력부하의 변동을 예측하여 안정적이고 경제적인 선박 전력계통 운영을 하기 위한 것으로, 더욱 상세하게는, 본 발명에 따른 냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템은 컨테이너 선박에 선적되며, 냉매 압축기를 갖춘 복수의 냉동컨테이너 상기 냉동컨테이너에 전원을 공급하는 발전기 및 상기 냉동컨테이너의 상태정보를 수집하여 각 냉동컨테이너의 전력 사용을 제어하는 전력관리 서버를 포함한다.

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Номер записи: 6
28-12-2017 дата публикации

FAN-OUT SEMICONDUCTOR PACKAGE

Номер: KR1020170142811A
Автор: LEE, DOO HWAN, KIM, JONG RIP, KIM, HYOUNG JOON, KIM, JIN YUL, OH, KYUNG SEOB
Принадлежит:

Disclosed is a fan-out semiconductor package comprising: a first connection member having a through-hole; a semiconductor chip arranged in the through-hole of the first connection member, and having an active surface on which a connection pad is arranged and an inactive surface which is arranged on the opposite side of the active surface; an encapsulant for encapsulating at least a part of the inactive surface of the semiconductor chip and the first connection member; a second connection member arranged on the active surface of the semiconductor chip and the first connection member; and a passivation layer arranged on the second connection member. Each of the first and second connection members includes a redistribution layer electrically connected to the connection pad. The second connection member includes an insulation layer on which the redistribution layer of the second connection member is arranged. The passivation layer has a greater elastic modulus than the insulation layer of the ...

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Номер записи: 7
07-12-2022 дата публикации

선박 전방위 추진기의 수밀 및 부하 테스트를 위한 장치

Номер: KR20220161678A
Автор: 김희문, 강무경, 김종립
Принадлежит:

... 본 발명은 선박 전방위 추진기의 테스트를 위한 장치에 관한 것으로서, 더욱 상세하게는 해상 운전 시 발생 가능한 문제점을 사전에 발견할 수 있도록 육상에서 전방위 추진기의 부하 및 축계의 수밀 테스트가 가능한 선박 전방위 추진기의 수밀 및 부하 테스트를 위한 장치에 관한 것이다. 육상에서 전방위 추진기의 수밀 및 부하 테스트가 가능한 선박 전방위 추진기의 수밀 및 부하 테스트를 위한 장치에 있어서, 상기 전방위 추진기가 내부에 탑재 및 탈거 가능하도록 일측이 개폐 가능한 형태로 형성된 케이싱과, 상기 케이싱 상부에 결합되며, 상기 케이싱 내부에 구비된 상기 전방위 추진기와 연결되어 구동력을 전달하는 유틸리티공급부와, 상기 케이싱 일측에 관통되어, 상기 케이싱 내부에 구비된 상기 전방위 추진기 일측과 연결되는 커넥팅샤프트와, 상기 커넥팅샤프트 타측에 연결되어, 상기 커넥팅샤프트를 통해 상기 전방위 추진기의 부하를 측정하는 부하장치와, 상기 커넥팅샤프트 외주면을 감싸도록 구비되어, 상기 케이싱과 상기 커넥팅샤프트 사이를 밀폐시키는 샤프트실링부재와, 상기 케이싱 일측에 구비되어, 해수면 하부와 유사한 환경을 구현하도록 상기 케이싱 내부를 가압 및 냉각시키는 물순환시스템부;를 포함하는 선박 전방위 추진기의 수밀 및 부하 테스트를 위한 장치를 제공할 수 있다.

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Номер записи: 8
31-01-2023 дата публикации

냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템 및 그 방법

Номер: KR102494607B1
Автор: 김희문, 강무경, 김종립
Принадлежит: 재단법인한국조선해양기자재연구원

... 본 발명에 따른 냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템 및 그 방법은 컨테이너 선박의 냉동컨테이너의 상태에 따른 선박 전력부하의 변동을 예측하여 안정적이고 경제적인 선박 전력계통 운영을 하기 위한 것으로, 더욱 상세하게는, 본 발명에 따른 냉동컨테이너 상태정보를 반영한 선박 전력관리 시스템은 컨테이너 선박에 선적되며, 냉매 압축기를 갖춘 복수의 냉동컨테이너 상기 냉동컨테이너에 전원을 공급하는 발전기 및 상기 냉동컨테이너의 상태정보를 수집하여 각 냉동컨테이너의 전력 사용을 제어하는 전력관리 서버를 포함한다.

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Номер записи: 9
24-08-2022 дата публикации

인쇄회로기판

Номер: KR102435128B1
Автор: 하형기, 이종면, 김종립
Принадлежит: 삼성전기주식회사

... 본 발명의 일측면에 따른 인쇄회로기판은, 복수의 유닛영역으로 구획되는 스트립 기판, 및 상기 유닛영역 각각에 내장되는 전자부품을 포함하고, 상기 복수의 유닛영역 사이에 이격공간이 마련된다.

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Номер записи: 10
21-04-2017 дата публикации

ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD THEREOF

Номер: KR1020170043427A
Автор: LEE, DOO HWAN, KIM, JONG RIP, KIM, HYOUNG JOON, OH, KYUNG SEOB
Принадлежит:

The present disclosure relates to an electronic component package and a manufacturing method thereof. The electronic component package includes a frame which has a through hole, an electronic component which is arranged in the through hole, and a rewiring layer which is arranged on one side of the electronic component and the frame. The rewiring layer includes a wiring pattern electrically connected to the electronic component. A wiring pattern which is buried to expose one side thereof and is electrically connected to the wiring pattern of the rewiring layer is arranged on one side of the frame. Accordingly, the present invention can solve a bending problem of the electronic component package and provide a wider routing area. COPYRIGHT KIPO 2017 ...

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Номер записи: 11
01-07-2015 дата публикации

DRILLSHIP HAVING UNIT-TYPE DERRICK STRUCTURE AND DRILLING METHOD USING UNIT-TYPE DERRICK STRUCTURE

Номер: KR1020150073234A
Автор: MOON, SANG WON, KIM, JONG LIB, LEE, MU YEOL, LEE, SOO HO, KIM, SUNG SOO
Принадлежит:

The present invention relates to a drillship having a unit-type derrick structure. The drillship of the present invention has a turn table-type derrick structure and enables drilling operations to be carried out outside both sides of the ship since the derrick structure is rotated at 90 degrees during the real drilling operation. Since a separate moonpool structure and a hole in a bottom shell plate are not required, efficiency in the aspect of hull resistance can be improved, and simplification of a mooring system and saving of the capacity of the main engine can be expected. There has been some decreases in productivity caused by interference when a hull and the derrick structure are built in conventional ways. However, according to the present invention, since most of drilling equipment are made into units and installed in the derrick structure, the interface problem can be solved. Especially, interface points can be significantly reduced since the turn table-type derrick structure includes ...

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Номер записи: 12
02-02-2023 дата публикации

전자소자 패키지

Номер: KR102494332B1
Автор: 김종립, 이두환, 이종면
Принадлежит: 삼성전기주식회사

... 본 발명의 일 측면은 코어부 및 전자소자를 포함하며, 특히, 상기 코어부는 제1 및 제2 수지층과, 이들 사이에 배치된 보강층을 포함하되 상기 제1 및 제2 수지층의 두께가 서로 상이한 구조를 갖는다.

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Номер записи: 13
19-08-2016 дата публикации

PRINTED CIRCUIT BOARD

Номер: KR1020160098875A
Автор: SUNG, KI JUNG, KIM, JONG RIP, KANG, MYUNG SAM, KOOK, SEUNG YEOP, HAN, MI JA, LEE, YOUNG KWAN, LEE, SEUNG EUN
Принадлежит:

The present invention relates to a printed circuit board. According to the present invention, the printed circuit board comprises: an insulation layer with a via or a through-hole; a circuit layer formed on the insulation layer and having a pad connected to the via or the through-hole by forming a pattern; and a solder resist layer covered on the outermost layer insulation layer of the insulation layer. The circuit layer is configured in a bimetal shape in which heterogeneous kinds of metal layers are laminated. COPYRIGHT KIPO 2016 ...

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Номер записи: 14
24-03-2017 дата публикации

PRINTED CIRCUIT BOARD

Номер: KR1020170033112A
Автор: HA, HYUNG GI, LEE, JONG MYEON, KIM, JONG RIP
Принадлежит:

A printed circuit board according to an aspect of the present invention includes a strip substrate divided into a plurality of unit areas, and electronic parts embedded in each of the unit areas, wherein a separation space is provided between the plurality of unit areas. Accordingly, the present invention can reduce the warpage of the printed circuit board. COPYRIGHT KIPO 2017 ...

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Номер записи: 15
28-09-2016 дата публикации

SEMICONDUCTOR CHIP

Номер: KR1020160112345A
Автор: SHIN, UNG HUI, KIM, JONG RIP, LEE, DOO HWAN, CHO, SUNG HWAN
Принадлежит:

The present invention provides a semiconductor chip including a body part, a via formed on the surface of the body part, and a bending preventing member including a filling unit formed inside the via, thereby minimizing the bending of the chip. COPYRIGHT KIPO 2016 ...

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Номер записи: 16
01-08-2016 дата публикации

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Номер: KR1020160090637A
Автор: LEE, DOO HWAN, KIM, JONG RIP, SHIN, UNG HUI, CHO, SUNG WHAN
Принадлежит:

Disclosed are a printed circuit board which can control warpage, and a manufacturing method thereof. The printed circuit board comprises: a core substrate having a cavity; a device received in the cavity; and a first insulating layer formed between the cavity and the device. COPYRIGHT KIPO 2016 ...

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Номер записи: 17
09-12-2015 дата публикации

PACKAGE SUBSTRATE, PACKAGE, STACKED PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE

Номер: KR1020150137824A
Автор: PARK, JIN SEON, LEE, SEUNG EUN, HAN, MI JA, KOOK, SEUNG YEOP, YOO, JE GWANG, PARK, JU HEE, KIM, JONG RIP, KANG, MYUNG SAM
Принадлежит:

The present invention relates to a package substrate, a package, a stacked package, and a method for manufacturing a package substrate. According to an embodiment of the present invention, the package substrate comprises: an insulating layer; a circuit layer formed on the insulating layer; and a capacitor including a lower electrode, an upper electrode, and a dielectric layer formed between the lower electrode and the upper electrode, wherein the lower electrode and the dielectric layer are embedded in the insulating layer, and the upper layer is formed in an upper part of the insulating layer. COPYRIGHT KIPO 2016 ...

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Номер записи: 18