Поиск патентов

05-01-2012 дата публикации

Moisture resistant cord plate for a photovoltaic module

Номер: US20120000524A1

Автор: Brian E. Cohen, George Bukovinszky, James J. Poddany, Raymond Domsic

Принадлежит: Individual

This invention relates to a moisture resistant cord plate for a photovoltaic module, methods of manufacturing photovoltaic modules, and methods for generating electricity from photovoltaic modules.

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Номер записи: 1

05-01-2012 дата публикации

Method for manufacturing a liquid-tight electronic device, and liquid-tight electronic device

Номер: US20120002381A1

Автор: Umberto Zanoni

Принадлежит: STMICROELECTRONICS SRL

A method for manufacturing a liquid-tight electronic device includes: providing a first printed-circuit board having a first connector; providing a supporting structure having a first opening; forming a first assembly by coupling the supporting structure and the first printed-circuit board in such a way that the first connector extends through the first opening and delimits a bottom gap; and forming a second assembly having a protective shell. The method further includes: depositing a first layer of liquid resin within the bottom gap, and hardening the first layer of liquid resin; depositing a second layer of liquid resin within the second assembly; coupling the first and second assemblies in such a way that the second layer of liquid resin hermetically closes a first interstitial area between the protective shell and the supporting structure; and hardening the second layer of liquid resin.

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Номер записи: 2

05-01-2012 дата публикации

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies

Номер: US20120003844A1

Автор: Michael J. Taylor, Monte P. Dreyer, Rajesh Kumar

Принадлежит: Individual

Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

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Номер записи: 3

05-01-2012 дата публикации

Electrical connector for an electronic module

Номер: US20120003879A1

Автор: Jeffery W. Mason, Scott Spicer

Принадлежит: Tyco Electronics Corp

An electrical connector is provided for electrically connecting an electronic module to an electrical component. The electrical connector includes electrical contacts having mounting bases that are initially mechanically connected together by a connection strip. The connection strip extends along a connection path from the mounting base of one of the electrical contacts to the mounting base of the other electrical contact. The connection strip is broken along the connection path such that the electrical contacts are separated from each other. The electrical connector also includes a insulator having a module side and an opposite component side. The mounting bases of the electrical contacts are mechanically connected to the insulator on the module side of the insulator. The insulator includes a punch opening that extends into the module side of the insulator. The punch opening is aligned with the connection path of the connection strip and is configured to receive a punch tool for breaking the connection strip.

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Номер записи: 4

12-01-2012 дата публикации

Wiring board and method for manufacturing the same

Номер: US20120006592A1

Автор: Makoto Terui, Shigeru Yamada, Shinji OUCHI, Yoshinori Shizuno

Принадлежит: Ibiden Co Ltd

A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion.

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Номер записи: 5

12-01-2012 дата публикации

Crimp terminal, crimp structure of crimp terminal, and crimping method of crimp terminal

Номер: US20120006596A1

Автор: Goro Kuwayama, Yasumichi Kuwayama

Принадлежит: Yazaki Corp

An object is to provide a crimp terminal which can increase contact pressure at both sides of a conductor press-clamping portion by reducing difficulty with which an original crimped shape is restored after a thermal shock test by realizing an increase in rigidity at root portions of conductor clamping pieces. In a crimp terminal ( 10 ) in which a conductor press-clamping portion ( 12 ) is provided rearwards of an electrical connecting portion ( 11 ) and a sheath clamping portion ( 13, 32 ) is provided rearwards of the conductor press-clamping portion ( 12 ), and the conductor press-clamping portion is formed into a configuration having a substantially U-shaped cross section by a bottom plate ( 31 ) and a pair of conductor clamping pieces ( 32 ) which extend upwards from left- and right-hand side edges of the bottom plate ( 31 ), reinforcement concave-convex portions ( 40 ) of a limited size are formed at respective root portions of the pair of conductor clamping pieces ( 32, 32 ) in which either an inner surface side or an outer surface side of the conductor clamping piece ( 32 ) is formed into a depressed portion ( 41 ) and the other is formed into a projection portion ( 42 ).

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Номер записи: 6

12-01-2012 дата публикации

Semiconductor device

Номер: US20120007224A1

Автор: Hajime Hasebe, Tadatoshi Danno, Yukihiro Satou

Принадлежит: Hitachi Hokkai Semiconductor Ltd, Renesas Electronics Corp

In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.

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Номер записи: 7

19-01-2012 дата публикации

Method for Forming Electrodynamic Machine Insulated Coils

Номер: US20120011708A1

Автор: Klaus Schäfer, Nicholas G. Lang, Willi Lutz, William R. Finley

Принадлежит: Siemens Industry Inc

A method for manufacturing electrodynamic machine conductive coils, such as alternating current induction motor stator coils. A continuous strand of insulation coated wire is formed into a generally planar elongated closed loop having a circumference and an outer surface. Thereafter a permanent insulation layer is applied to the closed loop outer surface, preferably by spiral wrapping insulating tape about the circumference of the closed loop with a tape wrapping machine. The insulating tape has a catalytic chemical compound including at least one part of a multi-part epoxy resin. The closed loop is shaped into a rigid conductive coil by application pressure, in order to conform the coil to a desired profile. Application of the permanent insulation layer to the closed loop prior to its final shaping enables machine insulation taping over a larger portion of the coil circumference and reduces need for slower and more expensive hand taping.

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Номер записи: 8

19-01-2012 дата публикации

Stress sensor and its manufacturing method

Номер: US20120011938A1

Автор: Hubert Grange

Принадлежит: Commissariat a lEnergie Atomique et aux Energies Alternatives CEA

A device for measuring deformation including: a) at least one strain gauge ( 3 ), producing a signal following a deformation, where the said strain gauge is positioned on a face of a flexible support ( 32 ) favouring elongation of the strain gauge ( 3 ), and where the face opposite the strain gauge of the flexible support, which is intended to be brought into contact with, or glued to, a test body the deformation of which it is desired to measure, b) at least one first substrate, including at least signal processing means and/or signal transmission means, c) securing means ( 4, 5, 6 ) to assemble the strain gauge and the first substrate mechanically, where these means include a layer of material having elastic properties, called the elastic layer, positioned between the gauge and the first substrate, and where this elastic layer prevents the deformation of the gauge from being transmitted, or allows it to be transmitted as little as possible, to the first substrate ( 2, 20 ).

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Номер записи: 9

19-01-2012 дата публикации

Keyboard illumination

Номер: US20120012448A1

Автор: Aleksandar Pance, Brett Bilbrey

Принадлежит: Apple Inc

Methods and apparatuses disclosed herein relate to backlit visual display elements. One embodiment may take the form a keyboard including at least one keycap, a dome switch layer underlying the keycap, and an encapsulation layer underlying the dome switch layer. The encapsulation layer may include a first printed circuit layer configured to transmit a signal corresponding to the at least one keycap. The keyboard may further include a light emissive layer underlying the encapsulation layer. The light emissive layer may include at least one emissive area corresponding to the at least one keycap and a second printed circuit layer configured to supply a voltage to the at least one emissive area.

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Номер записи: 10

19-01-2012 дата публикации

Printed wiring board and a method of production thereof

Номер: US20120012464A1

Автор: Tomoyuki Ikeda

Принадлежит: Ibiden Co Ltd

A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

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Номер записи: 11

26-01-2012 дата публикации

Selective encapsulation of electronic components

Номер: US20120017436A1

Автор: Kenneth E. Wing, Scott T. Carroll

Принадлежит: Individual

A method for the selective encapsulation of electronic components on a printed circuit board comprising, in one embodiment, the steps of delivering the printed circuit board to an encapsulating nest at room temperature; damming the target areas with a dam resin having a latent curing agent and deposited in the shape of walls of predetermined heights, according to the desired fill heights; dispensing a fill resin to fill the dammed areas; and curing the dam and fill resins for a suitable amount of time. In a different embodiment, the invention comprises the additional steps of laying resin beads, each in a position corresponding to the footprint of each target component; and of positioning the target components over the beads and soldering the components.

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Номер записи: 12

26-01-2012 дата публикации

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Номер: US20120018205A1

Автор: Koji Sato, Yasuhiro Nishisaka, Yukio Sanada

Принадлежит: Murata Manufacturing Co Ltd

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

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Номер записи: 13

26-01-2012 дата публикации

Device for detecting physical state variables of a medium

Номер: US20120019271A1

Автор: Thomas Niemann, Torsten Eggers

Принадлежит: Hella KGaA Huek and Co

In the case of a device for detecting physical state variables of a medium, such as pressure or temperature, for example, of a liquid, comprising at least one measuring sensor, which is connected to at least one electrical conductor so as to transmit signals, wherein at least one section of the conductor, which encompasses the sensor, is embedded in a casting compound, the casting compound is embodied, according to the invention, from at least one casting core and a casting jacket, which encloses the casting core, and provision is made in the casting compound for at least one recess for a media-conducting access to a contact surface of the sensor.

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Номер записи: 14

26-01-2012 дата публикации

Compact modular fuse block with integrated fuse clearance

Номер: US20120019345A1

Автор: Patrick A. Von Zur Muehlen

Принадлежит: Cooper Technologies Co

A fuse block assembly includes a nonconductive base formed with pedestal surfaces attachable to terminals from a location above the base, while providing a clearance between the body of a fuse and the middle portion of the base when a fuse is installed.

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Номер записи: 15

26-01-2012 дата публикации

Storage apparatus and method of manufacturing the same

Номер: US20120020151A1

Автор: Chang-Chih Chen, Chun-Feng Lee, Wei-Hung Lin

Принадлежит: Phison Electronics Corp

A storage apparatus including a circuit board, a control circuit element, a terminal module and a storage circuit element is provided. The circuit board includes a first surface, a second surface, a connect part, openings, metal contacts and metal units. The openings pass through the circuit board from the first surface to the second surface and the metal contacts are exposed on the first surface. The terminal module is disposed on the first surface and has elastic terminals and each of the elastic terminals has a first contact part and a second contact part. The first contact parts respectively contact with the metal contacts and the second contact parts respectively pass through the openings to protrude from the second surface. The metal units are disposed on the second surface and located between the openings and the connect part. Accordingly, the volume of the storage apparatus can be reduced.

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Номер записи: 16

26-01-2012 дата публикации

Negative electrode for lithium ion secondary battery, method for producing the same, and lithium ion secondary battery

Номер: US20120021285A1

Автор: Takuhiro Nishimura, Yasutaka Kogetsu

Принадлежит: Panasonic Corp

A negative electrode for a lithium ion secondary battery includes a current collector and a negative electrode active material layer supported on a surface of the current collector. The negative electrode active material layer includes a plurality of granular particles that include an alloyable active material. The granular particles are supported on a region of the current collector excluding a peripheral region that has a width of 20 μm to 500 μm from the edge thereof.

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Номер записи: 17

26-01-2012 дата публикации

Port seizing cable connector nut and assembly

Номер: US20120021642A1

Автор: Souheil Zraik

Принадлежит: PPC Broadband Inc

A coaxial cable connector includes a connector body having a first end and a second end, a coupling nut freely rotatable and disposed in relation to the first end of the connector body and a post having a first end and a second end, the post further including a open-ended port retaining portion. The coupling nut includes an internal threaded portion and is disposed in overlaying relation relative to the port retaining portion, which is configured for engaging an external port. The port retaining portion defines a locking collet that prevents loosening of the engaged port, while still guaranteeing electrical continuity without requiring excessive tightening of the connector.

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Номер записи: 18

26-01-2012 дата публикации

Mobile wireless communications device with shunt component and related methods

Номер: US20120021701A1

Автор: Adrian Matthew Cooke, Jari Kristian Van Wonterghem, John Alfred Whitmore, Joshua Kwan Ho Wong, Steven Eugene Downs

Принадлежит: Research in Motion Ltd

A mobile wireless communications device may include a portable housing including at least one electrically conductive housing portion configured to function as an antenna. The mobile wireless communications device may also include a printed circuit board (PCB) carried by the portable housing, and wireless transceiver circuitry carried by the PCB and including at least one circuit element carried by the PCB. The mobile wireless communications device may also include at least one current shunt component coupled between the at least one electrically conductive housing portion and the at least one circuit element.

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Номер записи: 19

02-02-2012 дата публикации

Touch screen rendering system and method of operation thereof

Номер: US20120026124A1

Автор: HAO LI, Steven Young, Yi Wei

Принадлежит: Motorola Inc

A touch-screen display apparatus, the apparatus may include first and second sheets having opposed major surfaces and a size and shape defined by a periphery. The periphery may be defined by opposed ends and opposed edges. The first and second sheets may each have a conductive pattern including a pair of opposed busbars and a plurality of traces electrically coupled to, and extending between, corresponding pairs of opposed busbars. The transparent force sensing (TFS) sheet may have opposed major surfaces and a variable resistance which is related to a force exerted upon one or more of its major surfaces. The TFS sheet may be situated between the first and second sheets. The apparatus may also include one or more separation portions situated between the TFS sheet and the first or second sheet to bias the TFS sheet apart from the first or second sheet.

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Номер записи: 20

02-02-2012 дата публикации

Electronics substrate with enhanced direct bonded metal

Номер: US20120026692A1

Автор: Donald Lynn Smith, Sy-Jenq Loong

Принадлежит: Wolverine Tube Inc

A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.

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Номер записи: 21

09-02-2012 дата публикации

Portable computer unified top case

Номер: US20120030930A1

Автор: Bartley K. Andre, Chris Ligtenberg, Christopher Stringer, Daniel J. Coster, John Brock, John Raff, Jonathan P. Ive, Matthew Theobald, Michelle Rae Goldberg, Ron Hopkinson

Принадлежит: Individual

A top case assembly for a portable computer is disclosed. The assembly may include an integral unified (e.g., homogenous) top case formed from a single part. The integral top case provides an enclosure, frame and cosmetic exterior of the portable computer. The integral top case also serves as the primary structure of the portable computer. The assembly may include a variety of subassemblies such as keyboards, touchpads, circuit boards, and drives that are carried by the underside of the integral top case. The integral top case may be formed from aluminum slab that has been machined to form walls, openings, attachment areas and cosmetic areas of the top case.

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Номер записи: 22

09-02-2012 дата публикации

Electrically active textiles, articles made therefrom, and associated methods

Номер: US20120030935A1

Автор: Andrew Houde, Jeremiah Slade, Patricia Wilson

Принадлежит: Infoscitex Corp

A method of making articles from electrically active textiles. First and second fabric pieces include conductors therein. A seam is established between the first and second fabric pieces. A determination is made, at the seam, based on one or more predetermined factors, which conductors of the first fabric piece intersect or overlap with which conductors of the second fabric piece. At the seam, an electrical and mechanical connection is formed between select conductors of the first fabric piece and select conductors of the second fabric piece.

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Номер записи: 23

09-02-2012 дата публикации

Multi-Layer Circuit Assembly And Process For Preparing The Same

Номер: US20120031655A1

Автор: Alan G. Wang, Kevin C. Olson

Принадлежит: PPG Industries Ohio Inc

A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

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Номер записи: 24

09-02-2012 дата публикации

Printed circuit board and method for manufacturing the same

Номер: US20120031658A1

Автор: Jo-Youn Won, Jun-Hyung SON, Young-Il Cho

Принадлежит: Samsung Electro Mechanics Co Ltd

A printed circuit board and a method for manufacturing a printed circuit board are disclosed. The printed circuit board in accordance with an embodiment of the present invention includes: a substrate; a first pad and a second pad, formed on one surface of the substrate and separated from each other; a first wiring extended from the first pad; a second wiring extended from the second pad and neighboring the first wiring; and a solder resist layer formed on one surface of the substrate so as to cover portions of the first wiring and the second wiring, and an indentation is formed in an area between the first wiring and the second wiring on one side of the solder resist layer.

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Номер записи: 25

09-02-2012 дата публикации

Rechargeable battery with current limiter

Номер: US20120034502A1

Автор: Kai Wei NIEH, Tung-Hsiu Shih

Принадлежит: Front Edge Technology Inc

A rechargeable battery comprises a battery cell comprising a plurality of battery component films on a substrate, the battery component films including at least a pair of electrodes about an electrolyte. A current limiter is electrically coupled to the battery cell to limit the current flowing through the battery cell when (i) the current flowing through the battery cell exceeds a predefined current, (ii) the temperature of the battery cell exceeds a predefined temperature, or (iii) both.

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Номер записи: 26

16-02-2012 дата публикации

Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components

Номер: US20120036710A1

Автор: Larry D. Pottebaum, Philip H. Thompson

Принадлежит: Skyworks Solutions Inc

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of the circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.

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Номер записи: 27

16-02-2012 дата публикации

System for multiple energy storage and management and method of making same

Номер: US20120038216A1

Автор: Irene Michelle Berry, Paul Robert Gemin, Robert Dean King

Принадлежит: General Electric Co

A propulsion system includes an electric drive, a first energy storage system electrically coupled to the electric drive through a DC link, and a second energy storage system electrically coupled to the first energy storage system in a series connection. The first energy storage system comprises a high specific-energy storage device and the second energy storage system comprises a low specific-power storage device. The propulsion system also includes a third energy storage system comprising a high specific-energy storage device electrically coupled to the second energy storage system. A bi-directional boost converter is electrically coupled to the second and third energy storage systems such that a terminal of the third energy storage system is electrically coupled to a low voltage side of the bi-directional boost converter and a terminal of the second energy storage system is coupled to a high voltage side of the bi-directional boost converter.

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Номер записи: 28

16-02-2012 дата публикации

Electrical fuse

Номер: US20120038451A1

Автор: Alfons Kelnberger, Claudia Voigt, Hans-Jürgen Schreiner

Принадлежит: CERAMTEC GMBH

A method for producing an electrical fuse, in particular a fusible link, with electrically conducting materials which are enclosed by electrically insulating materials, and with electrically conducting terminal elements on the electrically conducting materials.

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Номер записи: 29

16-02-2012 дата публикации

Electronic paper display device and method for manufacturing the same

Номер: US20120038969A1

Автор: Boum Seock Kim, Eun Tae Park, Seung Gyo Jeong

Принадлежит: Samsung Electro Mechanics Co Ltd

There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

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Номер записи: 30

16-02-2012 дата публикации

Secondary battery pack of novel structure

Номер: US20120040209A1

Автор: Jinhyun Ryu, Juhwan Baek, Sangkwon Nam, Sukjin Song, Tae-Wook Kim

Принадлежит: LG Chem Ltd

Disclosed herein is a secondary battery pack including a battery cell including first and second electrode terminals of specific structures, a protection circuit module (PCM) including connection members A and B connected to the first and second electrode terminals and an electrically insulated top cap, wherein a connection portion of the connection member B connected to the second electrode terminal of the battery cell is located at the bottom of the PCB so that the connection member B is electrically connected to the second electrode terminal via the safety element, the connection member A is coupled to the bottom of the PCB in a state in which the connection member A protrudes from one end of the PCB in the lateral direction so that a connection portion of the connection member A connected to the first electrode terminal of the battery cell is exposed through a corresponding one of the through holes formed at the top cap, a coupling hole is formed at the protruding portion of the connection member A, and wherein coupling members are coupled into the respective coupling grooves of the battery cell through the through holes of the top cap in a state in which the PCM and the top cap are disposed at the top of the battery cell, and the connection member A is mechanically coupled and electrically connected to the first electrode terminal by a corresponding one of the coupling members.

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Номер записи: 31

16-02-2012 дата публикации

Rechargeable electrochemical cell and method of manufacturing a rechargeable electrochemical cell

Номер: US20120040230A1

Автор: James Lowe Sudworth

Принадлежит: General Electric Co

An electrochemical cell includes an outer casing defining at least a portion of an anode electrode chamber, an ionically conducting separator disposed within the outer casing, an inner surface of the separator defining a cathode electrode chamber, a cathode electrode disposed within the cathode chamber, a conductive current collecting body coupled with the cathode electrode, an alkali metal-containing electrolyte disposed in the cathode electrode chamber, and a sealing body coupled with the outer casing and sealing the anode electrode chamber from an external atmosphere disposed outside of the outer casing. The electrolyte supplies alkali metal through the separator to the anode electrode chamber in response to an electric charge applied to the conductive current collecting body. A first content of a gas component in the anode electrode chamber is in the anode electrode chamber in an amount that is less than an amount of a second content of the gas component in ambient air.

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Номер записи: 32

16-02-2012 дата публикации

Establishing continuity between a shield within an implantable medical lead and a shield within an implantable lead extension

Номер: US20120041529A1

Автор: Bruce R. Mehdizadeh, James M. Olsen, Michael J. Kern

Принадлежит: MEDTRONIC INC

Implantable medical leads and implantable lead extensions include a shield. The implantable medical lead is coupled to the implantable lead extension. Stimulation electrodes of the implantable medical lead contact stimulation connectors within a housing of the implantable extension to establish a conductive pathway for stimulation signals from filars of the implantable extension to filars of the implantable medical lead. Continuity is established between the shield of the implantable medical lead and the implantable extension by providing a radio frequency conductive pathway within the housing. The radio frequency conductive pathway extends from a shield of the implantable extension to a shield connector that contacts a shield electrode of the implantable medical lead. The radio frequency conductive pathway may have various forms such as a jumper wire or an extension of the shield within the implantable extension.

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Номер записи: 33

23-02-2012 дата публикации

Method of producing circuit board

Номер: US20120042511A1

Автор: Takashi Shoji, Takekazu Sakai

Принадлежит: Showa Denko KK

Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of forming an adhesive layer by applying an adhesiveness-imparting compound to the surface of a terminal of the circuit board; attaching solder particles onto the adhesive layer; applying an activator that includes a hydrohalic acid salt of an organic base to the solder particles and fixing the solder particles by heating the circuit board to which the solder particles have been attached at a temperature equal to or lower than the melting point of the solder; applying a flux to the circuit board to which the solder particles have been fixed; and melting the solder particles by heating the circuit board.

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Номер записи: 34

23-02-2012 дата публикации

Flexible circuit structure with stretchability and method of manufacturing the same

Номер: US20120043115A1

Автор: Ying-Ching Shih, Yu-Hua Chen

Принадлежит: Industrial Technology Research Institute ITRI

In one example embodiment, a flexible circuit structure with stretchability is provided that includes a flexible substrate, a plurality of flexible bumps formed on the flexible substrate, and a metal layer formed on the plurality of flexible bumps and the flexible substrate.

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Номер записи: 35

23-02-2012 дата публикации

Apparatuses and methods for using a capacitive touch controller with a conductive surface

Номер: US20120043914A1

Автор: James V. Mischel, Jr., Mark Joseph Stefka, Paul John Ropella, Ross Divanfard

Принадлежит: Electric Mirror LLC

An apparatus includes a surface; the surface has a conductive layer within a thickness of the surface. A trench is formed in the conductive layer to define a touch area, the touch area is isolated from the rest of the conductive layer. A conductive pickup is mounted on a back side of the surface over the touch area and the conductive pickup is electrically connected to a capacitive touch controller, such that when a user touches the touch area on a front side of the conductive the touch controller responds to the user's touch.

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Номер записи: 36

23-02-2012 дата публикации

Small fuse and manufacturing method thereof

Номер: US20120044038A1

Автор: Doo Won Kang, Gyu Jin Ahn, Jong Il Jung, Kyung Mi LEE, Sang Joon Jin

Принадлежит: Smart Electronics Inc

Disclosed are a small fuse and a method of manufacturing the same. A cover made from thermosetting resin is coupled with is a base to receive a fusing element therein. The fusing element does not cause damage to the cover even if the fusing element makes contact with an inner wall of the cover due to size reduction of the cover.

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Номер записи: 37

23-02-2012 дата публикации

Implantable pulse generator with a stacked battery and capacitor

Номер: US20120045668A1

Автор: Nick A. Youker

Принадлежит: Individual

One example includes a configurable power source system for an implantable device having a predetermined power requirement, the system comprising a housing for a battery and a capacitor, the housing including a distance D between a first internal face and a second internal face, the housing adapted to fit within dimensions of the implantable device, a plurality of batteries of different thicknesses, each battery adapted to fit within a perimeter of the housing, a plurality of capacitors of different thicknesses, each capacitor adapted to fit within the housing and adjacent the battery and a pick and place system adapted to assemble a selected battery from the plurality of batteries and a selected capacitor from the plurality of capacitors with the housing to form a configurable power source at least meeting the predetermined power requirement for the implantable device.

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Номер записи: 38

23-02-2012 дата публикации

Auxiliary electrodes for electrochemical cells containing high capacity active materials

Номер: US20120045670A1

Автор: Constantin I. Stefan, Ghyrn E. Loveness, Gregory Alan Roberts, Rainer J. Fasching, Ryan Kottenstette, Song Han

Принадлежит: Amprius Inc

Provided are novel electrochemical cells that include positive electrodes, negative electrodes containing high capacity active materials such as silicon, and auxiliary electrodes containing lithium. An auxiliary electrode is provided in the cell at least prior to its formation cycling and is used to supply lithium to the negative electrode. The auxiliary electrode may be then removed from the cell prior or after formation. The transfer of lithium to the negative electrode may be performed using a different electrolyte, a higher temperature, and/or a slower rate than during later operational cycling of the cell. After this transfer, the negative electrode may remain pre-lithiated during later cycling at least at a certain predetermined level. This pre-lithiation helps to cycle the cell at more optimal conditions and to some degree maintain this cycling performance over the operating life of the cell. Also provided are methods of fabricating such cells.

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Номер записи: 39

23-02-2012 дата публикации

Electric storage device

Номер: US20120045685A1

Автор: Daisuke Seki, Katsuhiro Yoshida, Kouji Maeda, Masako Ooya, Risa Miyagawa, Yukinori Hato

Принадлежит: NEC Tokin Corp

To provide an electric storage device whose negative electrode can be doped with lithium ions in a short time and whose resistance can be lowered. An electric storage device including a unit that is obtained by alternately stacking a positive-electrode sheet 9 and a negative-electrode sheet 10 with a separator 3 interposed therebetween, the positive electrode sheet 9 including a positive-electrode active material layer 1 and a positive-electrode charge collector 4 , and the negative electrode sheet 10 including a negative-electrode active material layer 2 and a negative-electrode charge collector 5 , in which a foil, an etching foil, or a porous lath foil is used as the positive-electrode charge collector 4 and the negative-electrode charge collector 5 , a cut is made in a coating area of the positive-electrode active material layer 1 and the negative-electrode active material layer 2 , and a lithium supply source is disposed so as to be opposed to the negative electrode sheet 10 of the unit.

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Номер записи: 40

23-02-2012 дата публикации

Thermal expansion compensator having an elastic conductive element bonded to two facing surfaces

Номер: US20120045948A1

Автор: Daniel Edward Matejczyk, William Determan

Принадлежит: Hamilton Sundstrand Corp

A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.

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Номер записи: 41

01-03-2012 дата публикации

Modifier of lithium ion battery and method for making the same

Номер: US20120049108A1

Автор: Jian Gao, Jian-Jun Li, Li-Chun Zhang, Wei-Hua Pu, Xiang-Ming He

Принадлежит: Hon Hai Precision Industry Co Ltd, TSINGHUA UNIVERSITY

A modifier of a lithium ion battery includes a mixture of a phosphorus source having a phosphate radical, a trivalent aluminum source, and a metallic oxide in a liquid phase solvent. A method for making the modifier of the lithium ion battery. In the method, a phosphorus source having a phosphate radical, a trivalent aluminum source, and a metallic oxide are provided. The phosphorus source, the trivalent aluminum source, and the metallic oxide are mixed in a liquid phase solvent to form a clear solution.

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Номер записи: 42

01-03-2012 дата публикации

Buffer Layer to Enhance Photo and/or Laser Sintering

Номер: US20120049384A1

Автор: Mohshi Yang, Peter B. Laxton, Zvi Yaniv

Принадлежит: Ishihara Chemical Co Ltd

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

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Номер записи: 43

01-03-2012 дата публикации

Piezoelectric vibrating devices and methods for manufacturing same

Номер: US20120049695A1

Автор: Ryoichi Ichikawa

Принадлежит: Nihon Dempa Kogyo Co Ltd

Methods are disclosed for manufacturing piezoelectric vibrating devices that do not contain any unwanted gas or water vapor inside the devices. In an exemplary method, a base wafer is prepared including multiple package bases each having a first main surface and a second main surface. The base wafer also includes a pair of through-holes disposed between adjacent package bases of the base wafer. A piezoelectric vibrating piece is placed on each package base. A lid wafer is prepared that includes multiple package lids. A sealing material is applied to the base wafer or lid wafer in peripheral bands used for bonding the bases and lids together and defines respective interior cavities. The band of sealing material includes a communicating groove that communicates from the inner cavity to the first through-hole. The base wafer and lid wafer are subject to heat and compression to effect bonding. Meanwhile, the cavities are allowed to ventilate through the communicating grooves and through-holes to ensure that the cavities have a desired vacuum level or inert gas contents before completion of sealing.

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Номер записи: 44

01-03-2012 дата публикации

System and Method for Displaying Images

Номер: US20120050839A1

Автор: David Joseph Mehrl, James N. Malina

Принадлежит: Texas Instruments Inc

System and method for simultaneous display of multiple images using a single light modulator array. A preferred embodiment comprises a light source that produces a light with desired spectral characteristics, a color filter optically coupled to the light source, and an array of light modulators optically coupled to the color filter. The color filter filters light from the light source to produce light of desired wavelengths and the array of light modulators simultaneously displays multiple images onto a display plane. Portions of the array of light modulators are designed so that each portion can independently display an image and the light source provides needed light to display the image.

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Номер записи: 45

01-03-2012 дата публикации

Packaging structure of electronic components and a manufacturing method thereof

Номер: US20120051002A1

Автор: Hsing-Kuei Lin, Shing-Yeu Juang

Принадлежит: ACSIP Tech Inc

A manufacturing method of a packaging structure of electronic components is provided, and includes the steps of: providing a substrate including at least an electronic component and a grounding area; covering the electronic component of the substrate with a molding unit; cutting out the molding unit to form a plurality of recessed spaces, wherein the recessed spaces are arranged around the electronic component and at least one of the recessed spaces is electrically connected to the grounding area of the substrate; and forming a plurality of columnar electromagnet barriers in the recessed spaces and an electromagnet barrier layer on an upper surface of the molding unit. A packaging structure of electronic components manufactured by the aforementioned method is also provided.

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Номер записи: 46

01-03-2012 дата публикации

Coil assembly and electrical device having such coil assembly

Номер: US20120051009A1

Автор: Chung-Hei Poon, Kwong-Ming Ching, Pak-Chuen Tang

Принадлежит: Delta Electronics Inc

An electrical device includes a coil assembly and a case structure. The coil assembly includes plural coil units in a stack arrangement. Each of the coil units includes alternate loops and vacant portions. The loops of each coil unit are aligned with the vacant portions of an adjacent coil unit. There is a spacing interval between every two adjacent loops of every two adjacent coil units. The case structure has a receptacle for accommodating the coil assembly.

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Номер записи: 47

01-03-2012 дата публикации

Separator of lithium ion battery, method for making the same, and lithium ion battery using the same

Номер: US20120052361A1

Автор: Jian Gao, Jian-Guo Ren, Jian-Jun Li, Li-Chun Zhang, Wei-Hua Pu, Xiang-Ming He

Принадлежит: Hon Hai Precision Industry Co Ltd, TSINGHUA UNIVERSITY

A separator of a battery includes a porous membrane and a modifier layer disposed on a surface of the porous membrane, wherein a material of the modifier layer is a dried mixture of a phosphorus source having a phosphate radical, a trivalent aluminum source, and a metallic oxide in a liquid phase solvent.

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Номер записи: 48

01-03-2012 дата публикации

Advanced high durability lithium-ion battery

Номер: US20120052365A1

Автор: Chun-Chieh Chang

Принадлежит: Individual

A sealing system for a Lithium-ion battery to extend the service life of the battery. The sealing system provides, in addition to an external case of the battery, at least one additional layer of hermetic sealing for cells within the external battery case. Films of various plastics, provided in a single layer or in a combination of layers, are used for assembling hermetically sealed enclosures for the cells.

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Номер записи: 49

08-03-2012 дата публикации

Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation

Номер: US20120055015A1

Автор: Eiji Toyoda, Shigetomi KIDO

Принадлежит: Nitto Denko Corp

The present invention relates to a method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein.

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Номер записи: 50

08-03-2012 дата публикации

Split wave compensation for open stubs

Номер: US20120055016A1

Автор: Dan Gorcea

Принадлежит: FLEXTRONICS AP LLC

In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

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Номер записи: 51

08-03-2012 дата публикации

Touch panel sensor

Номер: US20120056664A1

Автор: Dong Sik Nam

Принадлежит: Individual

A touch panel sensor for sensing a contact position of part of body comprises a substrate, a resist electrode part including resist electrodes formed on the substrate to have a capacitance changeable according to approaching of the part of body, and a signal electrode part including signal electrodes formed on the resist electrode having resistance coefficient less than the resist electrode.

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Номер записи: 52

08-03-2012 дата публикации

Printhead assembly incorporating ink distribution assembly

Номер: US20120056951A1

Автор: Kia Silverbrook

Принадлежит: SILVERBROOK RESEARCH PTY LTD

A printhead assembly includes an ink distribution assembly including an ink distribution molding, the ink distribution molding including a plurality of first ducts; at least one printhead integrated circuit in fluid communication with the ink distribution assembly; and a rotary platen having at least three surface, each surface for providing one of a platen surface, capping portion, and a blotting portion. The ink distribution assembly further includes a plurality of second ducts acutely angled with respect to the plurality of first ducts, a plurality of transfer ports facilitating fluid communication between the plurality of first ducts and the plurality of second ducts, and a plurality of ink inlet ports facilitating fluid communication between an ink cassette and the plurality of first ducts.

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Номер записи: 53

08-03-2012 дата публикации

Interlocking system for securing a printed circuit board

Номер: US20120057319A1

Автор: Soon Seng Kang

Принадлежит: Rockwell Automation Asia Pacific Business Center Pte Ltd

An electronic component and housing interlocking system is provided. The system includes a device housing configured to hold a printed circuit board. The printed circuit board includes a projection from a side of the printed circuit board. The system also includes a locking member having a tab coupled at a first end of the tab to a side wall of the device housing and free at a second end of the tab such that the tab is configured to flex about the first end when the printed circuit board is slid into the device housing and the projection is pushed against the second end of the tab. The tab includes an opening configured to receive the projection after being slid past the second end such that the tab engages the printed circuit board within the device housing in a locked position

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Номер записи: 54

08-03-2012 дата публикации

Singulated semiconductor device separable electrical interconnect

Номер: US20120058653A1

Автор: James Rathburn

Принадлежит: HSIO Technologies LLC

A socket assembly that forms a solderless electrical interconnection between terminals on a singulated integrated circuit device and another circuit member. The socket housing has an opening adapted to receive the singulated integrated circuit device. The compliant printed circuit is positioned relative to the socket housing to electrically couple with the terminals on a singulated integrated circuit device located in the opening. The compliant printed circuit includes a dielectric base layer printed onto a surface of a fixture, while leaving cavities in the surface of the fixture exposed. A plurality of contact members are formed in the plurality of cavities in the fixture and coupled to the dielectric base layer. The contact members are exposed wherein the compliant printed circuit is removed from the fixture. At least one dielectric layer with recesses corresponding to a target circuit geometry is printed on the dielectric base layer. A conductive material is deposited in at least a portion of the recesses to form conductive traces electrically coupling the contact members to the other circuit member.

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Номер записи: 55

15-03-2012 дата публикации

Polymer electrolyte for lithium battery and method for preparing lithium battery using same

Номер: US20120060360A1

Автор: Jiansheng Liu

Принадлежит: Guangzhou Tinci Materials Technology Co Ltd

The present invention discloses a polymer lithium-ion battery manufacturing method. With the method, first preparing the electrolyte, and then injecting the electrolyte into a battery; after aging and activating the semi-product, processes of evacuating, sealing, and capacity grading are required to complete the battery. In order to overcome the defects of the convention batteries in production and performance, the present invention creatively chooses the polymer with appropriate molecular weight and other functional ingredients for the electrolyte, whereby the safety performance, service lifetime, high and low temperature performance and rate capacity of the batteries are significantly improved, and the battery production according to the present invention is simple and ease to perform.

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Номер записи: 56

15-03-2012 дата публикации

Method of fabricating circuit board structure

Номер: US20120060368A1

Автор: Cheng-Po Yu, Han-Pei Huang

Принадлежит: Unimicron Technology Corp

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

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Номер записи: 57

15-03-2012 дата публикации

Method of fabricating a stimulation lead for delivering electrical pulses to tissue of a patient

Номер: US20120061358A1

Автор: Homar Cisneros

Принадлежит: Advanced Neuromodulation Systems Inc

In one embodiment, a method of fabricating stimulation leads, the method comprises: providing a spool of polymer film; providing a plurality of payout carriers of wires; drawing the polymer film from the spool and the wires from the plurality of payout carriers over a rotating drum, wherein the drum comprises a plurality of grooves over an outer circumferential surface of the drum for directing the wires from the plurality of payout carriers, wherein a distance of each groove from an edge of the drum is varied about the circumference of the drum; bonding the wires to the polymer film while performing the drawing to form an intermediate assembly comprising the polymer film as a carrier with the bonded wires in a repeating pattern along a length of the intermediate assembly.

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Номер записи: 58

15-03-2012 дата публикации

Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages

Номер: US20120062346A1

Автор: William E. McKinzie, III

Принадлежит: WEMTEC Inc

A parallel plate waveguide structure may be configured to suppress spurious propagating modes by including a lossy frequency selective surface (FSS) formed from a resistive film. The electromagnetic material properties of individual layers disposed between the conductive plates of the waveguide may be engineered to extend the suppression band of the fundamental TE mode up to the cutoff frequency of the second TE mode, and to simultaneously create a multi-octave TM mode suppression band. Applications include, for example, cavity mode suppression in microwave and millimeterwave assemblies at the board, package, and chip level.

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Номер записи: 59

15-03-2012 дата публикации

Thermal interface material application for integrated circuit cooling

Номер: US20120063094A1

Автор: Dong G. Kam, Duixian Liu, Michael A. Gaynes, Scott K. Reynolds

Принадлежит: International Business Machines Corp

Techniques provide improved thermal interface material application in an assembly associated with an integrated circuit package. For example, an apparatus comprises an integrated circuit module, a printed circuit board, and a heat transfer device. The integrated circuit module is mounted on a first surface of the printed circuit board. The printed circuit board has at least one thermal interface material application via formed therein in alignment with the integrated circuit module. The heat transfer device is mounted on a second surface of the printed circuit board and is thermally coupled to the integrated circuit module. The second surface of the printed circuit board is opposite to the first surface of the printed circuit board.

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Номер записи: 60

15-03-2012 дата публикации

Manufacturing method for electrooptic element and optical deflector including electrooptic element

Номер: US20120063715A1

Автор: Jun Nakagawa, Koichiro Nakamura, Shuichi Suzuki

Принадлежит: Ricoh Co Ltd

An electrooptic element includes an optical waveguide layer made from a ferroelectric material and having a polarization inverted region of a predetermined shape having an optical incidence face and an optical exit face, and an upper electrode layer and a lower electrode layer formed on a top face and a bottom face of the optical waveguide layer, respectively, in which the ferroelectric material is magnesium-oxide-doped lithium niobate, and at least one of the optical incidence face and the optical exit face of the optical waveguide layer is formed in parallel with a crystal face of the ferroelectric material.

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Номер записи: 61

15-03-2012 дата публикации

Lens barrel assembly for a camera

Номер: US20120063761A1

Автор: Jing Xu, Roman C. Gutierrez, Tony K. Tang

Принадлежит: DigitalOptics Corp MEMS

A lens barrel assembly for a camera is disclosed. The lens barrel assembly comprises a lens barrel, at least one optical element disposed within the lens barrel, and an actuator configured to move the optical element. The actuator can be disposed entirely or partially within the lens barrel. The actuator can be a MEMS actuator, such as a MEMS actuator that is formed at least partially of silicon. The optical element can be a lens.

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Номер записи: 62

22-03-2012 дата публикации

Lancet integrated test element tape dispenser

Номер: US20120067006A1

Автор: Daniel Wong, Frank A. Chan

Принадлежит: Roche Diagnostics Operations Inc

A lancet integrated test element tape includes a plurality of lancet integrated test elements. The lancet integrated test elements each include a lancet configured to form an incision in tissue and a test element configured to analyze body fluid from the incision in the tissue. A cartridge includes a supply compartment configured to store an unused section of the tape. The tape is folded within the supply compartment to limit damage to the lancet integrated test elements. The cartridge can further include a waste compartment in which a used section of the tape is stored. An indexing mechanism moves the tape between the supply and waste compartments.

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Номер записи: 63

22-03-2012 дата публикации

Package substrate unit and method for manufacturing package substrate unit

Номер: US20120067635A1

Автор: Hideaki Yoshimura, Hitoshi Suzuki, Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi

Принадлежит: Fujitsu Ltd

A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

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Номер записи: 64

22-03-2012 дата публикации

A method and a device for the electrical treatment of a plurality of containers

Номер: US20120067639A1

Автор: Andreas Heinze, Andreas WIRTH, Herbert Müller-Hartmann, Ludger Altrogge, Timo Gleissner

Принадлежит: LONZA COLOGNE GMBH

The invention relates to a method for the application of at least one voltage pulse to at least two containers fitted with electrodes, by means of which at least one voltage pulse is applied to at least one container, while at least one other container is subjected to a preparation or a post-processing. According to the invention the method comprises mutual exchange of the respective positions of the container to which a voltage pulse has already been applied and the further container. Furthermore, the invention relates to a device ( 1 ) for making electrical contact with at least one container fitted with electrodes, with at least one receptacle ( 3, 7 ) upon which at least one container can be set, and with at least one contact appliance ( 8 ) for making contact with the electrodes of the container. According to the invention at least two receptacles ( 3, 7 ) are provided, wherein one receptacle ( 7 ) is located at or inside the contact appliance ( 8 ), and wherein both receptacles ( 3, 7 ) and/or the contact appliance ( 8 ) can be moved such that after completion of the movement the other receptacle ( 3 ) is located at or inside the contact appliance ( 8 ).

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Номер записи: 65

22-03-2012 дата публикации

Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same

Номер: US20120068331A1

Автор: Eric Peeters, Eugene M. Chow

Принадлежит: Palo Alto Research Center Inc

At least one microspring has applied thereover a laminate structure to provide: mechanical protection during handling and wafer processing, a spring spacer layer, strengthening of the anchor between spring and substrate, provision of a gap stop during spring deflection, and moisture and contaminant protection. A fully-formed laminate structure may be applied over the microspring structure or a partly-formed laminate structure may be applied over the microspring structure then cured or hardened. The tip portion of the microspring may protrude through the laminate structure and be exposed for contact or may be buried within the contact structure. The laminate structure may remain in place in the final microspring structure or be removed in whole or in part. The laminate structure may be photolithographically patternable material, patterned and etched to remove some or all of the structure, forming for example additional structural elements such as a gap stop for the microspring.

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Номер записи: 66

22-03-2012 дата публикации

System and method of forming a patterned conformal structure

Номер: US20120069523A1

Автор: Christopher James Kapusta, Donald Paul Cunningham

Принадлежит: General Electric Co

A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings therein positioned over contact pads on the surface of the electrical system. The conformal structure also includes a patterned conductive coating layered on the dielectric coating and on the contact pads such that an electrical connection is formed between the patterned conductive coating and the contact pads. The patterned conductive coating comprises at least one of an interconnect system, a shielding structure, and a thermal path.

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Номер записи: 67

22-03-2012 дата публикации

Moving Light Table

Номер: US20120069588A1

Автор: Chris Conti, Robin Lee

Принадлежит: PRODUCTION RESOURCE GROUP LLC

A moving light test system allows connecting moving lights to an interface board and conveying the lights and orienting and testing the lights while they are attached to the board. The lights can be mechanically and electrically connected to the board, and once connected, can be tested in multiple ways without reconfiguring or removing the lights. The board has a connector that can be plugged in at various locations, and the board can also be handled by mechanical devices. In this way, once the light is connected to the board, it does not need to be re-handled. In addition, lights can be tested in different orientations.

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Номер записи: 68

22-03-2012 дата публикации

Adapter for high-speed ethernet

Номер: US20120071011A1

Автор: Michael Kagan, Oren Tzvi Sela, Yoram Zer

Принадлежит: MELLANOX TECHNOLOGIES LTD

An adapter includes a mechanical frame, which is configured to be inserted into a SFP-type receptacle and contains a socket for receiving a plug of a twisted-pair-type cable. First electrical terminals, held by the mechanical frame, are configured to mate with a connector in the receptacle. Second electrical terminals, held within the socket, are configured to mate with electrical connections of the plug. Circuitry connects the first and second electrical terminals so as to enable interoperation of the plug with the receptacle.

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Номер записи: 69

22-03-2012 дата публикации

Different types of memory integrated in one chip by using a novel protocol

Номер: US20120072647A1

Автор: Fu-Chang Hsu, Peter Wung Lee

Принадлежит: Aplus Flash Technology Inc

A semiconductor chip contains four different memory types, EEPROM, NAND Flash, NOR Flash and SRAM, and a plurality of major serial/parallel interfaces such as I 2 C, SPI, SDI and SQI in one memory chip. The memory chip features write-while-write and read-while-write operations as well as read-while-transfer and write-while-transfer operations. The memory chip provides for eight pins of which two are for power and up to four pins have no connection for specific interfaces and uses a novel unified nonvolatile memory design that allow the integration together of the aforementioned memory types integrated together into the same semiconductor memory chip.

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Номер записи: 70

29-03-2012 дата публикации

Self-opening innerduct for a conduit

Номер: US20120073860A1

Автор: Jerry L. Allen

Принадлежит: Wesco Distribution Inc

An innerduct ( 10 ) for insertion into a conduit includes at least one cell ( 11 ) which forms a compartment ( 14 ). A self opening stiffener ( 15 ) includes branches ( 16 ) attached at their ends ( 17 ). When the innerduct ( 10 ) is on a roll, the branches ( 16 ) are positioned adjacent to each other. When the innerduct ( 10 ) is being inserted into the conduit, the branches ( 16 ) move away from each other to open the compartment.

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Номер записи: 71

29-03-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120073868A1

Автор: Takeshi Nakamura, Yoshinori Takenaka

Принадлежит: Ibiden Co Ltd

A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

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Номер записи: 72

29-03-2012 дата публикации

Multi-layered substrate

Номер: US20120073871A1

Автор: Bernd Karl Appelt, Ming-Chiang Lee, You-Lung Yen, Yuan-Chang Su

Принадлежит: Advanced Semiconductor Engineering Inc

The present invention directs to double-sided multi-layered substrate a base, at least a through-hole passing through the base, patterned first and second metal layers formed on the two opposite surfaces of the base, and first and second plating layers. The first plating layer covers a sidewall of the through-hole and the bottom surface surrounding a bottom opening of the through hole. The second plating layer covers the first plating layer and the top surface surrounding a top opening of the through hole.

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Номер записи: 73

29-03-2012 дата публикации

Interferometric optical display system with broadband characteristics

Номер: US20120075313A1

Автор: Evgeni Gousev, Gang Xu, Marek Mienko

Принадлежит: Qualcomm Mems Technologies Inc

Broad band white color can be achieved in MEMS display devices by incorporating a material having an extinction coefficient (k) below a threshold value for wavelength of light within an operative optical range of the interferometric modulator. One embodiment provides a method of making the MEMS display device comprising depositing said material over at least a portion of a transparent substrate, depositing a dielectric layer over the layer of material, forming a sacrificial layer over the dielectric, depositing an electrically conductive layer on the sacrificial layer, and forming a cavity by removing at least a portion of the sacrificial layer. The suitable material may comprise germanium, germanium alloy of various compositions, doped germanium or doped germanium-containing alloys, and may be deposited over the transparent substrate, incorporated within the transparent substrate or the dielectric layer.

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Номер записи: 74

29-03-2012 дата публикации

Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles

Номер: US20120075576A1

Автор: Masatomo Matsui

Принадлежит: Panasonic Corp

A first recess ( 102 ) of a lower substrate ( 100 ) is coated with conductive ink to form a first auxiliary electrode layer ( 104 ), a lower electrode pattern ( 105 ) is formed thereon by vacuum deposition, a second recess ( 202 ) of an upper substrate ( 200 ) is coated with the conductive ink to form a second auxiliary electrode layer ( 204 ), an upper electrode pattern ( 205 ) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element ( 300 ) interposed between the lower substrate ( 100 ) and the upper substrate ( 100 ), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer ( 104 ) and the lower electrode pattern ( 105 ) and the overlap portion of the second auxiliary electrode layer ( 204 ) and the upper electrode pattern ( 205 ) so as to expose the cut surfaces of the substrates.

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Номер записи: 75

29-03-2012 дата публикации

Integrated circuit packaging system with a shield and method of manufacture thereof

Номер: US20120075821A1

Автор: Reza Argenty Pagaila

Принадлежит: Individual

A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.

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Номер записи: 76

29-03-2012 дата публикации

High fiber count package inner module

Номер: US20120076460A1

Автор: Christopher Donaldson, Eddie Kimbrell, Ted Lichoulas

Принадлежит: AFL TELECOMMUNICATIONS LLC

Provided is an inner module for holding a plurality of connectors. The inner module includes a first cylindrical portion having a first outer wall spaced radially from a first inner wall to form an annular volume and a second cylindrical portion having a second outer wall spaced radially from a second inner wall to form an annular volume. The inner module also includes a connecting portion to connect the first cylindrical portion to the second cylindrical portion. Each of the first and second cylindrical portions have an opening in an axial direction having a width that is narrower than a distance between the first inner wall and the first outer wall.

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Номер записи: 77

05-04-2012 дата публикации

Array of baw resonators with mask controlled resonant frequencies

Номер: US20120079692A1

Автор: Deok-Yang Kim, L. Richard Carley, Rajarishi Sinha

Принадлежит: Cymatics Laboratories Corp

Methods that create an array of BAW resonators by patterning a mass load layer to control the resonant frequency of the resonators and resonators formed thereby, are disclosed. Patterning the surface of a mass load layer and introducing apertures with dimensions smaller than the acoustic wavelength, or dimpling the mass load layer, modifies the acoustic path length of the resonator, thereby changing the resonant frequency of the device. Patterns of variable density allow for further tuning the resonators and for individualized tuning of a resonator in an array of resonators. Patterning a reflowable material for the mass load layer, thereby providing a variable pattern density and distribution followed by elevating the temperature of the mass load layer above its melting point causes the material to liquefy and fill into the apertures to redistribute the mass load layer, thereby, upon subsequent cooling, providing resonators with a predetermined desired resonant frequency.

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Номер записи: 78

05-04-2012 дата публикации

Circuit board for signal transmission and method of manufacturing the same

Номер: US20120080224A1

Автор: Bong Kyu Choi, Je Gwang Yoo, Yong Soo An

Принадлежит: Samsung Electro Mechanics Co Ltd

Provided is a circuit board for signal transmission and a method of manufacturing the same. The circuit board for signal transmission includes a first insulating layer, a plurality of signal interconnection disposed on the first insulating layer, ground interconnections disposed on the first insulating layer at both sides of the plurality of signal interconnections, a second insulating layer disposed on the first insulating layer including the plurality of signal interconnections and ground interconnections, a first shield layer disposed on the second insulating layer, a first shield wall for electrically connecting the ground interconnections and the first shield layer and passing through the second insulating layer, a second shield layer disposed under the first insulating layer, and a second shield wall for electrically connecting the ground interconnections and the second shield layer and passing through the first insulating layer.

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Номер записи: 79

05-04-2012 дата публикации

Multilayer printed wiring board and method for manufacturing multilayer printed wiring board

Номер: US20120080400A1

Автор: Iku Tokihisa, Sho Akai, Tatsuya Imai

Принадлежит: Ibiden Co Ltd

A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.

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Номер записи: 80

05-04-2012 дата публикации

Resistor storage cavity in plug of sensing edge

Номер: US20120081130A1

Автор: Jack Provenzano, Krishnaraj Tejeswi, Vinay Sao

Принадлежит: Miller Edge Inc

A sensing edge for providing a signal to a controller indicating that a forward edge of a door is obstructed during operation includes an elongated sheath and first and second end plugs. The elongated sheath is mounted to the forward door edge and has a first end, second end and first cavity connecting the ends. First and second spaced apart electrically conductive materials are disposed within the elongated sheath. The first end plug includes an inner end having first engaging structures positioned within the first cavity in an assembled configuration and an outer end having a first depression for housing an electronic component. The electronic component is electrically coupled to the electrically conductive materials. The second end plug includes an inner end having a sensing component and second engaging structures positioned within the first cavity in an assembled configuration. The sensing component is electrically coupled to the electrically conductive materials.

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Номер записи: 81

05-04-2012 дата публикации

Method for manufacturing lens for electronic spectacles, lens for electronic spectacles, and electronic spectacles

Номер: US20120081659A1

Автор: Masatomo Matsui

Принадлежит: Panasonic Corp

A first recess ( 102 ) of a lower substrate ( 100 ) is coated with conductive ink to form a first auxiliary electrode layer ( 104 ), a lower electrode pattern ( 105 ) is formed thereon by vacuum deposition, a second recess ( 202 ) of an upper substrate ( 200 ) is coated with the conductive ink to form a second auxiliary electrode layer ( 204 ), an upper electrode pattern ( 205 ) is formed thereon by vacuum deposition, the upper and lower substrates are bonded to each other with an electric element ( 300 ) interposed between the lower substrate ( 100 ) and the upper substrate ( 100 ), and the upper and lower substrates are cut at positions on the overlap portion of the first auxiliary electrode layer ( 104 ) and the lower electrode pattern ( 105 ) and the overlap portion of the second auxiliary electrode layer ( 204 ) and the upper electrode pattern ( 205 ) so as to expose the cut surfaces of the substrates.

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Номер записи: 82

05-04-2012 дата публикации

Electrofluidic imaging film, devices, and displays, and methods of making and using the same

Номер: US20120081777A1

Автор: Jason Heikenfeld, Kenneth Dean Andrew, Matthew Hagedon

Принадлежит: Gamma Dynamics LLC, University of Cincinnati

A device and method of making and using the same. The device includes first and second substrates that are spaced to define a fluid space. Polar and non-polar fluids occupy the fluid space. A first electrode, with a dielectric layer, is positioned on the first substrate and electrically coupled to at least one voltage source, which is configured to supply an electrical bias to the first electrode. The fluid space includes at least one fluid splitting structure that is configured to facilitate the movement of the non-polar fluid into a portion of the polar fluid. Fluid splitting structure assisted movement of the non-polar fluid splits the polar fluid.

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Номер записи: 83

05-04-2012 дата публикации

Chip Capacitor Precursors

Номер: US20120081832A1

Автор: Azuma Chikara

Принадлежит: Texas Instruments Inc

A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps.

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Номер записи: 84

05-04-2012 дата публикации

Electrochemical device and process of manufacturing same

Номер: US20120082888A1

Автор: Daisuke Hashimoto, Hiroshi Hata

Принадлежит: Showa Denko KK, Showa Denko Packaging Co Ltd

An electrochemical device capable of enhancing sealing performance of a lead terminal leading portion in an exterior film for accommodating an electrochemical element is provided. In an electrochemical device in which an electrochemical element 10 is covered by a laminated outer packaging film 4 having at least an innermost layer 41 made of heat adhesive synthetic resin, a sealing portion 4 d of the outer packaging film 4 is heat sealed. A laminated-type lead terminal coating film 7 is arranged at a lead terminal 5, 6 connected to the electrochemical element 10 corresponding to the sealing portion 4 d of the outer packaging film 4 , and the melding point of the outermost layer 73 of the lead terminal coating film 7 is set to be lower than the melding point of the innermost layer 41 of the outer packaging film 4.

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Номер записи: 85

05-04-2012 дата публикации

Method for producing nonaqueous electrolyte secondary battery and nonaqueous electrolyte secondary battery

Номер: US20120082898A1

Автор: Masahisa Fujimoto, Yasufumi Takahashi

Принадлежит: Sanyo Electric Co Ltd

A method for producing a nonaqueous electrolyte secondary battery including a positive electrode containing a positive electrode active material, a negative electrode containing a negative electrode active material, and a nonaqueous electrolyte, the negative electrode active material containing a carbon material and particles of at least one metal selected from zinc and aluminum. The method includes a step of preparing an aqueous negative electrode mixture slurry that contains the metal particles, the carbon material, and a polysaccharide polymer as a thickener and that has pH adjusted in the range of 6.0 to 9.0; and a step of forming a negative electrode by applying the negative electrode mixture slurry to a negative electrode current collector.

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Номер записи: 86

05-04-2012 дата публикации

Surgical instrument with jaw member

Номер: US20120083784A1

Автор: Aaron C. Voegele, Bingshi Wang, Chad P. Boudreaux, David K. Norvell, Gregory A. Trees, James R. Giordano, Jonathan T. Batross, Mark A. Davison, Scott B. Killinger

Принадлежит: Ethicon Endo Surgery Inc

A surgical instrument for supplying energy to tissue may comprise a handle, a trigger, an electrical input, and a shaft extending from the handle. The surgical instrument may comprise and end effector first and second tissue engaging surfaces that are slanted with respect to a transection plane. The end effector may, for example, have an electrode defining a V-shaped cross sectional profile. The end effector may comprise a plurality of raised surfaces that are received by a plurality of indentions when the end effector is in the closed position. The end effector may comprise a cutting member having a plurality of bands.

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Номер записи: 87

12-04-2012 дата публикации

Systems and methods for manufacturing passive waveguide components

Номер: US20120084968A1

Автор: Edwin NEALIS, Jayesh Nath, YING Shen

Принадлежит: Aviat US Inc

Various embodiments are directed toward systems and method for manufacturing low cost passive waveguide components. For example, various embodiments relate to low cost manufacturing of passive waveguide components, including without limitation, waveguide filters, waveguide diplexers, waveguide multiplexers, waveguide bends, waveguide transitions, waveguide spacers, and an antenna adapter. Some embodiments comprise manufacturing a passive waveguide component by creating a non-conductive structure using a low cost fabrication technology, such as injection molding or three-dimensional (3D) printing, and then forming a conductive layer over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.

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Номер записи: 88

12-04-2012 дата публикации

Common carrier for the integrated mandrel battery assembly

Номер: US20120084975A1

Автор: Brent J. Torgerson, Dona M. Suardini, Joseph J. Viavattine, Paul B. Aamodt, Sandeep Saurkar

Принадлежит: MEDTRONIC INC

A system for the automated coiling of a jelly roll electrode assembly for controlled assembly and tensioning of jelly roll assembly is provided. The system includes: a shuttle, and a mandrel to which electrodes are welded; a base, mateable with the shuttle and on which the battery head assembly is mounted for welding to the mandrel; and a coiling device. The coiling device has an upper spool, a lower spool, holding a separator strip and a platform between the two holding the base. The separator strip is threaded through a passage in the mandrel separating positive and negative portions. Rotating the mandrel coils the positive electrode, the separator strip and the negative electrode to coil around the mandrel. The coiling device may include a feedback loop braking one or both spools and allowing the coiling tension to be programmed to a desired level.

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Номер записи: 89

12-04-2012 дата публикации

Compaction of electrical insulation for joining insulated conductors

Номер: US20120084978A1

Автор: Carrie Elizabeth Hartford, David Stuart Morgan

Принадлежит: Individual

A method for coupling ends of two insulated conductors includes coupling a core of a first insulated conductor to a core of a second insulated conductor. Exposed portions of the cores are located inside a box with an open top. Electrically insulating powder material is placed into the box and a first plunger is inserted through the open top of the box to compact the powder material. Additional electrically insulating powder material is placed into the box and a second plunger is inserted through the open top of the box to compact the powder material into compacted powder material that surrounds the exposed portions of the cores. The compacted powder material is formed into a substantially cylindrical shape. A sleeve is placed over the compacted powder material and coupling the sleeve to the jackets of the insulated conductors.

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Номер записи: 90

12-04-2012 дата публикации

Hydroformed splice for insulated conductors

Номер: US20120085564A1

Автор: Charles D'angelo Iii, David Jon Tilley, Ryan Michael Gonsoulin

Принадлежит: Individual

A method for coupling ends of two insulated conductors includes coupling an end portion of a core of a first insulated conductor to an end portion of a core of a second insulated conductor. At least a part of the end portions of the cores are at least partially exposed. Electrically insulating material is placed over the exposed portions of the cores. An inner sleeve is placed over end portions of the two insulated conductors to be coupled. An outer sleeve is placed over the inner sleeve. There is an open volume between the inner sleeve and the outer sleeve. The inner sleeve and the outer sleeve are coupled to jackets of the insulated conductors. A pressurized fluid is provided into the open volume between the inner sleeve and the outer sleeve to compress the inner sleeve into the electrically insulating material and compact the electrically insulating material.

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Номер записи: 91

12-04-2012 дата публикации

Wiring board and method for manufacturing the same

Номер: US20120085572A1

Автор: Shunsuke Sakai

Принадлежит: Ibiden Co Ltd

A wiring board including a core substrate having an accommodation portion, an electronic component in the accommodation portion having a substrate, a resin layer on a surface of the substrate and an electrode on the resin layer, a first interlayer resin insulation layer on a surface of the core substrate and a surface of the substrate of the component, and a second interlayer resin insulation layer on the opposite surface of the core substrate and a surface of the substrate having the resin layer and electrode. The first insulation layer has resin in the amount greater than the amount of resin in the second insulation layer such that the total amount of resin component including the resin in the first insulation layer is adjusted to be substantially the same as the total amount of resin component including the resin in the second insulation layer and resin in the resin layer.

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Номер записи: 92

12-04-2012 дата публикации

Panel having electrically conductive structures

Номер: US20120086614A1

Автор: Andreas Schlarb, Bernhard Reul, Christoph Degen, Gunther Vortmeier, Stefan Droste

Принадлежит: Saint Gobain Glass France SAS

A pane with electrically conductive structures is described. The pane has at least two electrically conductive structures galvanically separated from each other, a galvanic separating layer on at least on one of the electrically conductive structures, and an electrical conductor on the galvanic separating layer. The galvanic separating layer galvanically separates the conductor from at least one of the structures. A method for producing the pane and a use of the same are also described.

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Номер записи: 93

12-04-2012 дата публикации

Positionable lighting systems and methods

Номер: US20120087129A1

Автор: Christine Carlson, Joseph John Janos

Принадлежит: LD Kichler Co Inc

A lighting assembly includes a lighting unit having a housing defining an internal cavity and an opening. A light source is assembled within the internal cavity of the housing. An electrical wire is electrically connected to the light source at a first end and is configured to be contained at least in part within the housing. The opening is configured to permit withdrawal of a user selected amount of the electrical wire from within the internal cavity and/or to permit a user selected amount of the electrical wire to be inserted into the internal cavity.

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Номер записи: 94

12-04-2012 дата публикации

Electrode for molten salt battery, molten salt battery, and method for producing electrode

Номер: US20120088139A1

Автор: Atsushi Fukunaga, Koji Nitta, Masatoshi Majima, Shinji Inazawa, Syoichiro Sakai

Принадлежит: Sumitomo Electric Industries Ltd

An electrode for a molten salt battery includes a current collector connectable to an electrode terminal of the molten salt battery and an active material. The current collector has an internal space in which small spaces are mutually coupled. The internal space of the current collector is filled with the active material.

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Номер записи: 95

12-04-2012 дата публикации

Cam clamp for electrical connector

Номер: US20120088393A1

Автор: Larry N. Siebens

Принадлежит: Thomas and Betts International LLC

A connector may include a first member having a first bore therethrough. A second member having a second bore therethrough may be configured to align with the first bore in the first member. A cam clamp may be provided for securing the first member to the second member. The cam clamp may include a pin having a head and a shaft, wherein the shaft extends through the first bore and the second bore. A compression element may be positioned between the first bore and a head on the pin. A cam member may be rotatably mounted to an end of the shaft opposing the head and configured to move between a first position and a second position. The cam clamp may be configured to secure the second member to the first member when the cam member is rotated from the first position to the second position.

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Номер записи: 96

12-04-2012 дата публикации

Screwless connection terminal

Номер: US20120088415A1

Автор: Andreas Ramm, Walter Schepe

Принадлежит: Bals Elektrotechnik GmbH and Co KG

A screwless connection terminal with a contact element to which a conductor is to be electrically connected, the contact element comprising a connecting section and a contact surface, with a clamp spring by means of which the conductor is to be clamped to the contact surface of the contact element, wherein the clamp spring has a clamping leg, an abutting leg and a tensioning leg, wherein a clamp opening is formed in the clamping leg, through which clamp opening, the conductor is to be led, wherein the abutting leg of the clamp spring abuts on the contact element, and the tensioning leg of the clamp spring connects the abutting leg to the clamping leg, wherein the clamping leg further comprises a conductor clamp extension with a clamping face which is aligned substantially parallel to the contact surface of the contact element.

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Номер записи: 97

12-04-2012 дата публикации

Low cost-low profile lead set connector

Номер: US20120089002A1

Автор: Francis Kusti Mackie

Принадлежит: KONINKLIJKE PHILIPS ELECTRONICS NV

A patient worn medical monitoring device ( 10 ) includes a multi-channel electrical connector ( 18 ) for connecting a lead set ( 22 ) to a monitoring unit ( 16 ) is able to wirelessly transmit a patient's physiological data over a telemetric link to a receiver unit for remote monitoring purposes. The multi-channel electrical connector includes first and second connector elements ( 40,42 ) disposed on either one of the monitoring unit or lead set. The first connector element includes a plurality of rigid pins ( 44 ) disposed between a plurality of ribs ( 50 ). The second connector element includes a compressible substrate carrying flexible electrically conductive pads ( 46 ) that flex independently of one another. The connector elements to are configured to such that the pins of the first connector element electrically engage the flexible electrically conductive pads of the second connector element.

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Номер записи: 98

19-04-2012 дата публикации

Apparatus and method for manufacturing electromagnetic switch

Номер: US20120090165A1

Автор: Young Myoung Yeon

Принадлежит: LSIS Co Ltd

Disclosed is an electromagnetic switch capable of sealing a hermetic space after injecting extinguishing gas into the hermetic space. An apparatus for manufacturing an electromagnetic switch includes a chamber having an inner space hermetically sealed from outside, an extinguishing gas injector configured to inject extinguishing gas into the chamber, a supporter disposed in the chamber, and configured to support a temporary assembly having a vent hole at one side thereof, and a sealing means configured to seal the vent hole in a state that the extinguishing gas has been injected into the chamber.

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Номер записи: 99

19-04-2012 дата публикации

Parylene-c as a piezoelectric material and method to make it

Номер: US20120091858A1

Автор: Austin Cheng, Justin Young Hyun Kim, Yu-Chong Tai

Принадлежит: California Institute of Technology CalTech

A parylene C polymer that is electrically poled such that it is piezoelectric is presented. Methods for manufacturing the piezoelectric parylene C polymer with an optimal piezoelectric coefficient d33 are also disclosed. Actuators formed with piezoelectric parylene C are disclosed as well as sensor devices that incorporate piezoelectric parylene C using charge integrator circuits in which the integration time is longer than likely adiabatic temperature transients.

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Номер записи: 100

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