УПРУГОЭЛАСТИЧНЫЙ ИЗМЕРИТЕЛЬНЫЙ ЭЛЕМЕНТ И СПОСОБ ЕГО ПОДСОЕДИНЕНИЯ

Изобретение относится к упругоэластичному измерительному элементу, в частности, для термометров, манометрических выключателей или манометров. Упругоэластичный измерительный элемент (1) содержит дугообразную или винтообразную измерительную трубку (3) и имеет основную часть (2) и присоединяемый элемент (10) для измерительного механизма. Соединение между измерительной трубкой (3) и основной частью (2), а также присоединяемым элементом (10) опосредовано через свариваемые соединительные элементы. Соединительный элемент (11, 12) выполнен в качестве отдельного элемента, связанного с измерительной трубкой (3) сварным швом, причем сварной шов (15, 16) проходит сквозь соединительный элемент (11, 12) до торцевой поверхности измерительной трубки (3). Выступающая область кромки соединительного элемента (11, 12) соединена с основной частью (2) или присоединяемым элементом с помощью второго сварного шва. Техническим результатом изобретения является возможность полного исключения примеси в измерительной ...

РАЗРЫВНОЙ ДИСК РЕВЕРСИВНОГО ДЕЙСТВИЯ С ОБРАЗУЕМОЙ ЛАЗЕРОМ ЭЛЕКТРОПОЛИРОВАННОЙ ЛИНИЕЙ ОСЛАБЛЕНИЯ И СПОСОБ ФОРМИРОВАНИЯ ЛИНИИ ОСЛАБЛЕНИЯ

Изобретение относится к арматуростроению и предназначено для использования в предохранительных устройствах для защиты систем высокого давления. Устройство для сброса давления содержит разрывной диск реверсивного действия, имеющий образуемую лазером электрополированную линию ослабляющей канавки. Имеются конструктивные варианты такого устройства и способ изготовления относительно тонкого металлического устройства для сброса давления. Этот способ содержит способ формирования электрополированной линии ослабляющей канавки в разрывном диске реверсивного действия, который гарантирует полное открывание диска при реверсировании. Заготовку разрывного диска подвергают предварительному выпучиванию, окончательному выпучиванию и затем обеспечивают слоем резистного материала. Для удаления, по меньшей мере, части слоя резистного материала, соответствующей желаемой линии ослабляющей канавки в вогнутой наружной поверхности выпученного разрывного диска, используют лазер. После этого диск подвергают операции ...

ОСВОБОЖДЕНИЕ ЗАКРЕПЛЕННЫХ СТЕКОЛ

Закрепленные стекла, например ветровые стекла транспортных средств, закрепленные в опорной раме однородным связующим материалом, освобождают, устанавливая устройство подачи энергии вблизи ветрового стекла, подавая затем от устройства подачи энергию сквозь ветровое стекло и освобождая тем самым это стекло из рамы благодаря вызванному этим разрушению части однородного связующего материала и/или раскалыванию или разрушению материала ветрового стекла. Подаваемая энергия может быть, например, ультразвуковым или лазерным излучением и предпочтительно сконцентрирована на выбранном участке для усиления высвобождающего действия. Технический результат заключается в повышении безопасности рабочего персонала и упрощении процесса. 3 с. и 13 з. п. ф-лы, 2 ил.

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Изобретение относится к способу лазерной нагартовки и изделию для лазерной нагартовки. На заготовку изделия наносят первый слой. Первый слой не содержит пустот или пузырьков, больших чем 1 Омикрон в диаметре. Первый слой напыляют или получают путем окунания. Наносят второй слой на первый слой. Затем направляют импульс лазерного света на второй слой. Упомянутый импульс имеет достаточную плотность энергии для абляции участка второго слоя, посредством чего выталкивается плазма. Плазма производит ударную волну, которая распространяется на первый слой и на заготовку, посредством чего осуществляется нагартовка заготовки. Любые пузырьки, образующиеся под верхними слоями, изолируются от подлежащей нагартовке поверхности. Процесс значительно снижает эффект появления выемок на нагартованных поверхностях. 2 н. и 26 з.п. ф-лы, 1 ил.

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Изобретение относится к способу изготовления сваренной лазером стальной трубы. Лазерная сварка включает испускание двух лазерных лучей вдоль краев на верхней поверхности открытой трубы. Указанные лазерные лучи передают через разные оптические стекловолокна, и лучи имеют сфокусированные пятна, диаметры которых превышают 0,3 мм. Испускают лазерные лучи таким образом, чтобы передний лазерный луч и задний лазерный луч были наклонены к направлению выполнения сварки, причем углы падения определяют относительно направления, перпендикулярного верхней поверхности открытой трубы. Передний лазерный луч падает на верхнюю поверхность открытой трубы в направлении сварки перед задним лазерным лучом, а задний лазерный луч падает на верхнюю поверхность открытой трубы в направлении сварки после переднего лазерного луча. Угол падения переднего лазерного луча устанавливают больше угла падения заднего лазерного луча. Устанавливают промежуток между центром переднего лазерного луча и центром заднего лазерного ...

ПРЕДВАРИТЕЛЬНО СФОРМОВАННАЯ В ГОРЯЧЕМ СОСТОЯНИИ СВАРНАЯ СТАЛЬНАЯ ДЕТАЛЬ С ВЫСОКОЙ МЕХАНИЧЕСКОЙ ПРОЧНОСТЬЮ И СПОСОБ ЕЕ ПОЛУЧЕНИЯ

Изобретение относится к сварной стальной детали и способу ее изготовления. Заготовка детали получена сваркой встык, по меньшей мере, одного первого и одного второго листа. Лист состоит, по меньшей мере, частично из стальной подложки и предварительного покрытия, в состав которого входит слой интерметаллического сплава в контакте со стальной подложкой, покрытый сверху слоем металлического сплава алюминия или сплава на основе алюминия. Слой (19, 20) металлического сплава удаляют с кромок (36) в непосредственной близости к зоне (35) сварки металла. Слой (17, 18) интерметаллического сплава сохраняют на месте. Сверху, по меньшей мере, части зоны (35) сварки металла соотношение между содержанием углерода в зоне сварки металла и содержанием углерода в подложке (25, 26) первого (11) или второго листа (12), который имеет наиболее высокое содержание углерода Cmax, находится между 1,27 и 1,59. Сварную заготовку (37) нагревают, чтобы получить металл зоны (35) сварки с полностью аустенитной структурой ...

ЛАЗЕРНЫЙ РАСПИЛОВОЧНЫЙ СТАНОК ДЛЯ АЛМАЗОВ

Изобретение относится к новому лазерному станку для распиливания алмазов. Техническим результатом является повышение качества и скорости распиливания алмазов. Для этого станок состоит из источника лазерного излучения, интерфейса центрального навигационного вычислительного устройства (числового программного управления CNC), системы подачи луча, переключающего высокочастотного драйвера модулятора добротности лазера, блока для охлаждения, камеры замкнутой телевизионной системы и прибора с зарядной связью (CCTV & CCD), блока подачи энергии, серво-стабилизатора и блока компьютера. 20 з.п. ф-лы, 9 ил.

СВАРКА АЛИТИРОВАННЫХ КОМПОНЕНТОВ И АЛИТИРОВАННЫЙ КОМПОНЕНТ

Изобретение относится к способу ремонта компонента газовой турбины и компоненту газовой турбины, подвергнутому ремонту указанным способом. Проводят алитирование субстрата (4) с образованием диффузионного слоя (6) глубиной от 150 до 300 мкм и покрывающего слоя (7) толщиной 100 мкм на диффузионном слое (6). Затем покрывающий слой по меньше мере частично удаляют до поверхности (13) диффузионного слоя (6) и в области (11) удаленного материала покрывающего слоя (7) выполняют наплавку. В частных случаях осуществления изобретения субстрат (4) представляет собой сталь, в частности молибденсодержащую сталь, преимущественно сталь 16Mo3. Субстрат (4) алитируют частично. По толщине покрывающего слоя (7) удаляют часть упомянутой толщины покрывающего слоя (7). Покрывающий слой (7) удаляют с поверхности (13) диффузионного слоя локально. В качестве материала для сварки наплавкой используют сталь, в частности молибденсодержащую сталь, преимущественно сталь 16Mo3. Ремонту подвергают компонент, субстрат ( ...

УСТАНОВКА И СПОСОБ ДЛЯ ИЗГОТОВЛЕНИЯ ТРУБЧАТОЙ БАЛКИ С ОДНОЙ ЦЕНТРАЛЬНОЙ СЕКЦИЕЙ

Изобретение относится к установке для формования листа (варианты), способу формования трубчатой балки (варианты) и к машине для роликового профилирования. Техническим результатом является повышение производительности оборудования и повышение точности размеров балки. Технический результат достигается установкой для формования листа в непрерывную балку, имеющую четыре наружные стенки и общую центральную секцию, простирающуюся между противоположными двумя из данных стенок. При этом четыре наружные стенки образуют прямоугольное поперечное сечение, и общая центральная секция разделяет прямоугольное поперечное сечение на первый и второй соседние трубчатые элементы. При этом общая центральная секция имеет закругленные по радиусу концы, а лист имеет края, которые упираются в закругленные по радиусу концы. Установка содержит машину для роликового профилирования, включающую позиции роликового профилирования с роликами для формования листа. При этом машина включает станцию сварки со сварочными аппаратами ...

СПОСОБ СВАРКИ ЗАГОТОВОК ИЗ ВЫСОКОЖАРОПРОЧНЫХ СУПЕРСПЛАВОВ С ОСОБОЙ МАССОВОЙ СКОРОСТЬЮ ПОДАЧИ СВАРОЧНОГО ПРИСАДОЧНОГО МАТЕРИАЛА

Изобретение относится к способу лазерной сварки заготовок (9) из высокожаропрочных суперсплавов. Создают с помощью лазерного источника (3) тепла зоны (11) подвода тепла на поверхности (10) заготовки. Подают с помощью устройства (5) сварочный присадочный материал (13) в зону (11) подвода тепла и осуществляют с помощью транспортировочного устройства (15) относительное перемещение между источником (3) тепла и устройством (5) подачи с одной стороны а также поверхностью (10) заготовки с другой стороны. Подачу сварочного присадочного материала осуществляют с массовой скоростью ≤350 мг/мин. Устанавливают, по меньшей мере, один из следующих параметров лазерной сварки: мощность лазера от 100 Вт до 300 Вт, диаметр лазерного луча от 500 мкм до 800 мкм, скорость сварки, по меньшей мере, 250 мм/мин. 17 з.п. ф-лы, 6 ил.

ПОДЛОЖКА С МИКРОРЕЛЬЕФОМ ДЛЯ ПОЛУЧЕНИЯ НЕТКАНОГО ПОЛОТНА И СПОСОБ ЕЕ ИЗГОТОВЛЕНИЯ. СПОСОБ ПОЛУЧЕНИЯ НЕТКАНОГО ПОЛОТНА И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

Предложены подложка со сформированным микрорельефом и способ изготовления подложки со сформированным микрорельефом, применяемой для получения нетканого полотна, в частности нетканого полотна, напоминающего трикотаж. Подложка со сформированным микрорельефом включает корпус, имеющий верхнюю поверхность с узором, образованным множеством пиков и впадин и множеством отверстий. Отверстия имеют коническую верхнюю часть, окруженную скоплением пиков и впадин. Расстояние между центрами соседних отверстий меньше, чем наибольший диаметр конической верхней части отверстий. Подложку со сформированным микрорельефом получают фокусированием лазерного луча так, что фокальная точка находится ниже верхней поверхности исходной заготовки, и нанесением с помощью лазерного луча заранее определенного рисунка, образованного конусообразными отверстиями. Рисунок из конусообразных отверстий образует скопление пиков и впадин, окружающих каждое отверстие на верхней поверхности полученной подложки. Указанные признаки ...

УСТРОЙСТВО И СПОСОБ НАРЕЗКИ ПО РАЗМЕРУ ЛЕНТЫ ДЕКОРАТИВНОЙ БУМАГИ И ПРИМЕНЕНИЕ УСТРОЙСТВА ДЛЯ НАРЕЗКИ ЛЕНТЫ

Изобретение относится к области полиграфии и касается устройства и способа нарезки по размеру ленты декоративной бумаги и применение устройства для нарезки ленты. Устройство для нарезки имеющих покрытие отрезков ленты декоративной бумаги включает поточную линию с приспособлениями для декорирования и пропитки бесконечной ленты бумаги для превращения в ленту декоративной бумаги и, по меньшей мере, одно приспособление для поперечного роспуска для отделения отрезков ленты декоративной бумаги определенной длины от ленты декоративной бумаги. В направлении подачи, по меньшей мере, перед одним приспособлением для поперечного роспуска установлено, по меньшей мере, одно приспособление для продольного роспуска для разделения ленты декоративной бумаги, по меньшей мере, на две бесконечные продольные ленты декоративной бумаги и, по меньшей мере одно отклоняющее приспособление, которое отдаляет обе продольные ленты одна относительно другой и подводит, соответственно, к отдельному приспособлению для поперечного ...

ПРОЦЕССЫ ЛАЗЕРНОГО СВЕРЛЕНИЯ ДЛЯ ИЗГОТОВЛЕНИЯ УСТРОЙСТВ ФОРМИРОВАНИЯ МАТЕРИАЛА И ПЛЕНКИ

Изобретение относится к области лазерной обработки и производству перфорированных материалов и может найти применение при производстве нетканых материалов или тканей и перфорированных пленок. Перфорированный элемент поддержки с гладкой поверхностью получают в процессе лазерной обработки. Лазерный луч перемещают в ряде растровых разверток относительно поверхности заготовки. Во время каждой развертки лазер включают в заранее определенные интервалы достаточного времени и интенсивности для сверления одной или более дискретных частей каждого из отверстий. Устройство для изготовления перфорированной пленки содержит полый барабан, имеющий перфорированную стенку, который изготовлен посредством лазерной обработки. Перфорированную пленку или нетканый материал формируют с использованием элемента поддержки с гладкой поверхностью. Изобретение позволяет улучшить физические свойства и внешний вид тканых материалов и перфорированной пленки. 5 с. и 13 з.п. ф-лы, 22 ил., 3 табл.

СВАРКА АВТОМОБИЛЬНЫХ ДЕТАЛЕЙ ЛАЗЕРНЫМ ПЛАКИРОВАНИЕМ

... 1. Деталь, содержащая:по меньшей мере две стальные заготовки, соединенные между собой сварным швом, содержащим по меньшей мере одно из никеля и железа и характеризующимся по существу полным отсутствием силикатных включений; ипокрытие, полученное путем окрашивания, фосфатирования или электрофоретического формирования покрытия и сцепленное по меньшей мере с частью указанного сварного шва, характеризующегося по существу полным отсутствием силикатных включений.2. Деталь по п. 1, в которой указанный сварной шов содержит никель.3. Деталь по п. 1, в которой указанный сварной шов содержит железо.4. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем окрашивания.5. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем фосфатирования.6. Деталь по п. 1, в которой указанное покрытие представляет собой покрытие, получаемое путем электрофоретического формирования покрытия.7. Способ изготовления детали, предусматривающий следующие ...

СПОСОБ СВАРКИ ВНАХЛЕСТКУ УЧАСТКА, СПОСОБ ИЗГОТОВЛЕНИЯ СВАРЕННОГО ВНАХЛЕСТКУ ЭЛЕМЕНТА, СВАРЕННЫЙ ВНАХЛЕСТКУ ЭЛЕМЕНТ И АВТОМОБИЛЬНАЯ ДЕТАЛЬ

... 1. Способ сварки участка нахлесточного соединения, в котором множество элементов из стальных листов соединено на участке нахлесточного соединения, и по меньшей мере один из множества элементов из стальных листов содержит мартенсит, причем способ включает в себя:- образование точечно-сварного участка, имеющего ядро на участке нахлесточного соединения; и- излучение лазерного пучка для образования расплавленного и затвердевшего участка, пересекающего конец ядра и расположенного между ядром и положением, внешне отстоящим от конца ядра не менее, чем на 3 мм, причем расплавленный и затвердевший участок образован в элементе из стальных листов, содержащем мартенсит, таким образом, чтобы он имел глубину не менее 50% от толщины элемента из стальных листов, содержащего мартенсит, в положении, внешне отстоящим от конца ядра на 1 мм.2. Способ сварки участка нахлесточного соединения, в котором множество элементов из стальных листов, включающих в себя оцинкованный стальной лист, имеющий образованное на ...

ЛАЗЕРНЫЙ РАСПИЛОВОЧНЫЙ СТАНОК ДЛЯ АЛМАЗОВ

... 1. Лазерный распиловочный станок для алмазов, состоящий из источника лазерного излучения, интерфейса центрального навигационного вычислительного устройства (числового программного управления CNC), системы подачи луча, высокочастотного переключающего драйвера модулятора добротности лазера, блока охлаждения, камеры замкнутой телевизионной системы и прибора с зарядной связью (CCTV & CCD), блока подачи энергии, серво-стабилизатора и блока компьютера. 2. Лазерный распиловочный станок для алмазов по п.1, в котором источник лазерного излучения состоит из лазерной головки, переключающего модулятора добротности лазера, диафрагмы, переднего и заднего зеркала, модулятора безопасности лазера и расширителя луча. 3. Лазерный распиловочный станок для алмазов по п.2, в котором переключающий модулятор добротности используется для сохранения световой энергии лазера для излучения в виде вспышки с высокой пиковой мощностью. 4. Лазерный распиловочный станок для алмазов по п.2, в котором диафрагма контролирует ...

КОМПОНЕНТЫ ТЕРМОСТАТИЧЕСКИХ БЛОКОВ И СПОСОБ ЛАЗЕРНОЙ СВАРКИ ДЛЯ ИЗГОТОВЛЕНИЯ ЭТИХ КОМПОНЕНТОВ

... 1. Способ соединения компонентов термостатических систем и тепловых реле для низковольтных выключателей, причем компоненты состоят по меньшей мере из одного биметаллического элемента, состоящего из тонкой пластинки с первой гранью и второй гранью, и по меньшей мере одного соединительного элемента, который имеет, по существу, плоскую концевую часть с третьей гранью и четвертой гранью, отличающийся тем, что он включает в себя этапы, на которых накладывают концевую часть первой грани биметаллического элемента на третью грань концевой части соединительного элемента и сцепляют их, подвергают концевую часть второй грани биметаллического элемента сварочному воздействию лазерным средством, чтобы создать сварной шов между биметаллическим элементом и соединительным элементом. 2. Способ по п.1, отличающийся тем, что лазерное средство сканирует вторую грань биметаллического элемента вдоль предварительно определенной траектории. 3. Способ по п.2, отличающийся тем, что предварительно определенная траектория ...

ЛИСТОВАЯ СВАРНАЯ ЗАГОТОВКА ДЛЯ ГОРЯЧЕЙ ШТАМПОВКИ, ГОРЯЧЕШТАМПОВАННЫЙ ЭЛЕМЕНТ И СПОСОБ ДЛЯ ЕГО ПРОИЗВОДСТВА

Изобретение относится к области металлургии, а именно к получению листовой сварной заготовке для горячей штамповки. Заготовка включает в себя сварную часть, сформированную путем сварки встык первого покрытого металлическим алюминием стального листа и второго покрытого металлическим алюминием стального листа. Сварная часть получена на режимах, обеспечивающих среднюю концентрацию алюминия в сварочном металле в сварной части от 0,3 мас.% до 1,5 мас.%, а температура точки Acсварочного металла составляет 1250°C или ниже. Обеспечивается требуемая прочность соединения после горячей штамповки. 4 н. и 12 з.п. ф-лы, 3 ил., 4 табл., 2 пр.

СПОСОБ ОСЛАБЛЕНИЯ ЭЛЕМЕНТА ОБЛИЦОВКИ АВТОМОБИЛЯ ДЛЯ ПОЛУЧЕНИЯ ОКНА ДЛЯ РАЗВЕРТЫВАНИЯ ПНЕВМОПОДУШКИ БЕЗОПАСНОСТИ И УСТРОЙСТВО ДЛЯ ЕГО ОСУЩЕСТВЛЕНИЯ

... 1. Способ ослабления элемента облицовки автомобиля, покрывающего устройство с пневмоподушкой, причем упомянутое устройство с пневмоподушкой содержит пневмоподушку, выполненную с возможностью ее накачивания и развертывания при фиксировании столкновения, при этом упомянутое ослабление обеспечивает формирование окна для развертывания пневмоподушки в упомянутом устройстве под действием давления, создаваемого развертыванием пневмоподушки, при этом элемент облицовки имеет по меньшей мере один слой, причем способ включает в себя следующие этапы: выполнение частичного врезания в поверхность элемента облицовки посредством направления режущего луча от источника режущего луча на упомянутую поверхность и перемещения элемента облицовки относительно режущего луча в соответствии с заданным рисунком ослабления; генерирование первого и второго измерительных лучей от первого датчика и второго датчика соответственно, и направление первого и второго измерительных лучей к соответствующим противоположным сторонам ...

Способ лазерной обработки прозрачного хрупкого материала и устройство его реализующее

Изобретение относится к области лазерной техники, к сканирующим импульсным лазерам, применяемым к резке хрупких подложек. Предлагаются способ и устройство формирования напряженной грани в подложке для разделения подложки, для чего формируют массив полостей в результате оптического пробоя в объеме материала при его облучении сфокусированным лазерным пучком с фиксированным фокусным расстоянием в процессе наклонной развертки лазерного луча, при продольном смещении вдоль подложки. Техническим результатом является: повышение прочностных характеристик изделий и качества формирования прямой или косой грани при разделении подложки, отсутствие сколов и микротрещин, высокая скорость формирования напряженной разделяющей грани, а значит и лазерной резки. 2 н. и 8 з.п. ф-лы, 1 ил.

УСТРОЙСТВО И СПОСОБ РЕЗАНИЯ ЛАЗЕРОМ С АВТОМАТИЧЕСКИМ РЕГУЛИРОВАНИЕМ ИМПУЛЬСОВ ГАЗА ПО ЧАСТОТЕ ИЛИ ПО ДАВЛЕНИЮ

... 1. Способ автоматического резания при помощи лазера, включающий в себя нагнетание потока газа в место резания, чтобы удалять шлаки и газы, производимые в ходе резания, при этом нагнетание осуществляют импульсами, отличающийся тем, что непрерывно измеряют интенсивность обратного рассеяния света лазера и изменяют либо частоту, либо давление, либо одновременно частоту и давление импульсов, поддерживая эту интенсивность на минимуме.2. Способ автоматического резания по п. 1, отличающийся тем, что частоту или давление меняют пошагово.3. Способ автоматического резания по п. 2, отличающийся тем, что значение шага частоты составляет от 1 Гц до 3 Гц.4. Способ автоматического резания по п. 2, отличающийся тем, что шаги давления имеют значение меньше 1 бар.5. Способ автоматического резания по любому из пп. 1-4, отличающийся тем, что частота или давление находится в пределах, и при достижении пределов производят увеличение мощности лазера.6. Способ автоматического резания по п. 3, отличающийся тем, ...

СПОСОБ ГИБРИДНОЙ ЛАЗЕРНОЙ/ДУГОВОЙ СВАРКИ И ИСПОЛЬЗУЮЩИЙ ЕГО СПОСОБ ИЗГОТОВЛЕНИЯ СВАРНОГО ИЗДЕЛИЯ

... 1. Способ гибридной лазерной/дуговой сварки для стыковой сварки плоских плит из нержавеющей стали, титана или титанового сплава или стыковой сварки обоих краев полосковой плиты из нержавеющей стали, титана или титанового сплава, из которой получают трубчатую форму, при этом в состыкованной части сварку осуществляют, направляя лазерное излучение и дуговой разряд по одной линии сварки таким образом, что за лазерной сваркой следует дуговая сварка TIG.2. Способ сварки по п.1, в котором фокусная точка лазерного луча для лазерной сварки занимает положение над подлежащим сварке целевым изделием, и лазерный луч расфокусируется таким образом, чтобы сделать диаметр лазерного луча, направленного на подлежащее сварке целевое изделие, не менее чем 1 мм.3. Способ сварки по п.1 или 2, в которомпри лазерной сварке лазерный луч направлен наклонно к направлению движения сварки, таким образом, что угол между вертикальным направлением и лазерным лучом составляет 10° или менее, или лазерный луч направлен вертикально ...

СПОСОБ РЕНТГЕНОВСКОЙ МИКРОСКОПИИ ДЛЯ ОЦЕНКИ ФОРМЫ ОТВЕРСТИЙ И РАЗМЕРОВ ХИРУРГИЧЕСКИХ ИГЛ

... 1. Способ характеризации высверленного лазером отверстия в хирургической игле, содержащий этапы, при которых:направляют рентгеновский пучок излучения от генератора рентгеновского излучения на проксимальный конец хирургической иглы, содержащий высверленное лазером отверстие;получают в цифровой форме изображение проксимального конца иглы, включающее изображение отверстия, с помощью датчика, на который падает рентгеновское излучение, при этом проксимальный конец иглы располагается между генератором рентгеновского излучения и датчиком; иобрабатывают цифровое изображение для определения отклонения отверстия от стандартных размеров, установленных спецификацией.2. Способ по п.1, в котором указанной игле присваивается уникальный цифровой идентификатор.3. Способ по п.1, в котором указанное отклонение преобразовывается в сигнал, отправляемый в контроллер.4. Способ по п.3, в котором контроллер вычисляет сигнал, отправляемый на устройство лазерного сверления, для модифицирования параметров лазера для ...

СПОСОБ И УСТРОЙСТВО ДЛЯ СТРУКТУРИРОВАНИЯ ПОВЕРХНОСТИ ТВЕРДОГО ТЕЛА, ПОКРЫТОГО ТВЕРДЫМ МАТЕРИАЛОМ, С ПОМОЩЬЮ ЛАЗЕРА

... 1. Способ структурирования, как минимум, одной области поверхности твердого тела (9), имеющего покрытие из твердого материала, посредством лазера, имеющего длительности импульса в наносекундном интервале (1), в соответствии со способом проекции шаблона, где гомогенное пятно (FS) системы придания формы оптическому лучу, шаблон (18) и затем диафрагма (6) используются перед оптическими системами создания изображения.2. Способ по п.1, отличающийся тем, что, как минимум, один шаблон и одна диафрагма установлены в обменное устройство, тем самым, любой требуемый шаблон или любая требуемая диафрагма могут помещаться в траекторию лазерного луча независимо друг от друга.3. Способ по п.1, отличающийся тем, что структурирование производится путем наложения множества микроструктур, при этом каждая из накладывающихся структур образует угол (α) с получившейся в результате наложения структурой.4. Способ по п.1, отличающийся тем, что шаблоны и диафрагмы установлены с возможностью вращения в обменном устройстве ...

Verfahren und Vorrichtung zur ablativen Behandlung von elastomerischen Produkten

Emulsion mask defect repair - by applying contoured UV beam of excimer laser

Defects in the emulsion layer of a photomask are repaired by irradiation of the defect with UV light in a shape to match the defect and by destroying the defect by this treatment. The UV beam of an excimer laser is used to pass through an aperture of suitable configuration. To correct a black spot defect (D) of the emulsion mask (7), the beam (2) of a laser oscillator (1) is expanded (3) and the UV component is reflected selectively (4) through an aperture (5x) of the plate (5) to project the shape of (5x) through a reproduction lens (6) on the mask. A lens (11) can be used to observe the spot through a semitransparent mirror (10). For the correction of white defects, a slightly adhesive resin (PVC, polyester, PU, epoxy resin) in an organic solvent is applied around the defective area.

VERFAHREN ZUM VERSCHWEISSEN MIT LASERSTRAHLUNG UND VORRICHTUNG ZUR DURCHFUEHRUNG DES VERFAHRENS

Process for welding by laser beam or similar high-energy radiation, in which two contiguous workpieces have a coating between them, the vaporization point of which is lower than the melting point of the material of the workpieces, and in which a gas flow is directed onto the weld. To improve this process so that coated workpieces can be welded without gaps and so that gas can escape through the vapour capillaries of the weld, a current of gas which promotes degasification of the vaporized coating through the vapour capillaries of the weld is used in addition to the current of protective or working gas which flows around the weld.

Rohrbalken mit zentralem Einzelträger

Vorrichtung zum Umformen eines Blechs zu einem durchgehenden Balken mit vier Außenwänden und einem gemeinsamen zentralen Träger, welcher sich zwischen zwei einander gegenüberliegenden Wänden erstreckt, wobei die vier Außenwände einen rechteckigen Querschnitt definieren, und der gemeinsame zentrale Träger den rechteckigen Querschnitt in ein erstes und ein zweites aneinandergrenzendes Rohr teilt, wobei der gemeinsame zentrale Träger gerundete Enden aufweist, welche jeweils Gleitebenen senkrecht zu dem gemeinsamen zentralen Träger definieren, und wobei das Blech Kanten aufweist, welche an die gerundeten Enden anstoßen, umfassend: Walzprofilierstationen mit Walzen zum Umformen des Blechs zu einem durchgehenden Balken mit den vier Außenwänden und dem gemeinsamen zentralen Träger; und eine Schweißstation mit Schweißeinrichtungen und einer Schweißboxvorrichtung, wobei die Schweißboxvorrichtung einen Vorrichtungsrahmen und äußere Dorne beinhaltet, welche von dem Vorrichtungsrahmen gestützt werden ...

Foam section cutter - has laser beam with controlled energy supply and cutting speed to cut and seal edges simultaneously

To cut shaped foam material sections, where the material is covered on both sides and the foam is compressed between the sections to the thickness of the covering layers, a laser beam is moved along the cutting line between sections which, simultaneously, severs the sections and seals the cut edges. The energy delivered by the laser beam, to melt the layers of the foam sections, is pref. carried over to the cut edges, and the ratio of beam energy to cutting speed is selected to ensure that the cut edges of the layers round the foam fuse together. The alignment of the laser beam is generally orthogonal to the plane of the layer to be cut over the foam. ADVANTAGE - The material can be cut and sealed rapidly and effectively, without complex appts., in a process which can be automated.

Energy ray ablation esp. of plastics e.g. PMMA - using dopant forming gas on absorption of one photon to increase efficiency and give clean hole

Energy ray ablation is carried out with a pulsed photon ray, esp. laser ray, operating on a restricted area of a workpiece (I). (I) contains an ablation-promoting dopant (II), which absorbs the ray much more strongly than the actual material of (I). The novelty is that (II) is decomposed into a gaseous component (III) of relatively small mol. wt. by the absorption of one photon. Pref. (III) includes a permanent gas and pref. consists mainly of di- or tri-atomic mols. (II) is diphenyltriazene (DPT) or 9,10-dihydroanthracene -9,10-dicarboxylic anhydride (DADA) and/or 1,4,5,6-tetrachloro-7-phenyl -bicyclo-2,2,2-oct-5-en -2,3-dione (TPBD); and (I) consists of plastics, e.g. PMMA. USE/ADVANTAGE - The deg. of ablation is increased and the use of (II) giving gaseous (III) makes ablation more effective and cleaner. The process is efficient and gives sharp edges without marked thermal stress, even at relatively long wavelengths.

Verfahren zur Bearbeitung von oxidischen Materialien mittels eines Laserstrahls

Verfahren zur Nanostrukturierung polymerer Materialien mit gepulster Laserstrahlung in reaktiver Atmosphäre

In einem Verfahren zur Erzeugung einer ein festes polymeres Material umfassenden Oberfläche, die Oberflächenstrukturen mit Abmessungen im Sub-Mikrometerbereich aufweist, wird die unbehandelte Oberfläche, auf der die Strukturen zu erzeugen sind und die für eine Laserbestrahlung zugänglich sind, mit einem gepulsten Laserstrahl in einer reaktiven Gasatmosphäre ein- oder mehrmals auf solche Weise abgetastet, dass benachbarte Lichtflecke des Laserstrahls lückenlos aneinander stoßen oder sich überlappen und ein bestimmter Bereich einer vorgegebenen Relation zwischen Verfahrensparametern eingehalten wird, wodurch die Oberflächen chemisch modifiziert wird.

Einrichtung zum Ritzen, Schneiden und Bohren von Leder mit Laserstrahlen wenigstens eines Lasers

LASER-BEHANDLUNG

Structuring of surfaces of components by removal of material with laser pulses

The method has a component (2) coated with a material, radiated with a laser pulse or a sequence of laser pulses for the ionisation of the coating material locally in the region of the desired structure. Each individual laser pulse (1) has an intensity which lies above the critical threshold intensity for the multi-photon ionisation of the coated material. Each laser pulse has wavelength and pulse duration, such that the expansion of the ionised material, by the laser pulse within the pulse duration, is smaller than the wavelength of the laser pulse, exciting the multi-photon ionisation.

Substrat und Verfahren zur Bruchvorbereitung eines Substrats für mindestens ein Leistungshalbleiterbauelement

Die Erfindung betrifft ein Verfahren zur Bruchvorbereitung eines Substrats (1) für mindestens ein Leistungshalbeiterbauelement mit folgenden Verfahrensschritten: a) Bereitstellen des Substrats (1), wobei das Substrat (1) einen elektrisch nicht leitenden Isolierstoffkörper (2) aufweist, b) Materialabtrag am Isolierstoffkörper (2) entlang gewünschter Bruchkanten (A, B, C, D, E) des Substrats (1), wobei der Materialabtrag derart durchgeführt wird, dass in Eckbereichen (14) an denen mindestens zwei gewünschte (A, B, C, D, E) Bruchkanten zusammentreffen, ein gegenüber dem Materialabtrag, welche in den übrigen Bereichen (17) der gewünschten Bruchkanten (A, B, C, D, E) durchgeführt wird, höherer Materialabtrag durchgeführt wird. Weiterhin betrifft die Erfindung ein diesbezügliches Substrat (1). Die Erfindung ermöglicht die Reduktion von unerwünschten Ausbrüche am Isolierstoffkörper (2) beim Brechen eines Substrats (1) für mindestens ein Leistungshalbeiterbauelement.

SCHEIDUNG VON NICHTMETALLISCHEN MATERIALIEN

Fehlerkompensationsverfahren zum Glätten einer Fläche einer durchsichtigen Platte

Vorrichtung zum Bearbeiten einer mit temperaturempfindlichen Schadstoffen belasteten Oberfläche

Metal-ceramic substrate for electrical circuit

Processes are claimed for producing an electrical circuit substrate by applying first and second metallisations (3, 4) onto both sides of a ceramic layer (2), the first metallisation (3) being a copper foil applied by a DCB (direct copper bond) technique. In one process, a substrate (1b) with a through-contact (10) is produced by providing an opening (11) in the ceramic layer and applying the second metallisation (4) as a metal-containing paste by a thick film or thin film technique such that the paste is also applied onto the opening (11) and a first metallisation area exposed in the opening. In another process, in which a metallic interlayer is to be formed for thermal and/or electrical connection of the substrate (1a) to another component (e.g. a metal base plate, 6), the second metallisation (4) is much thinner than the first metallisation (3) and is applied as a metal-containing paste by a thick film or thin film technique. Also claimed is a substrate produced by one of the above processes ...

ABSCHIRMUNG GEGEN LASERSTRAHLEN

Verfahren zur Desintegration von Gegenständen mittels eines Lasers.

Verfahren, Vorrichtung und Beugungsgitter zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, durch Änderung besagten Beugungsgitters

Verfahren zum Trennen von Halbleiterelementen, die auf einem Substrat gebildet werden, wie Halbleiterelementen, die in einem Wafer aus Halbleitermaterial gebildet werden, unter Verwendung eines Lasers, der mindestens einen primären Laserstrahl produziert, wobei besagter mindestens ein primäre Laserstrahl in eine Vielzahl von sekundären Laserstrahlen unter Verwendung eines ersten Beugungsgitters aufgetrennt wird, das eine erste Gitterstruktur besitzt und durch Auftreffen lassen des besagten mindestens einen primären Laserstrahls auf besagte erste Beugungsstruktur, und wobei mindestens eine erste Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine erste Richtung gebildet wird, besagtes Verfahren ferner umfassend einen Schritt zur Bildung mindestens einer zweiten Rille durch Bewegen des besagten Lasers relativ zu besagtem Substrat in eine zweite Richtung, charakterisiert dadurch, dass besagte zweite Gitterstruktur durch besagtes erstes Beugungsgitter umfasst ist, und ...

Apparat und Verfahren für eine X&Y-Senkrechtschnittrichtungsbearbeitung mit einer festgelegten Strahltrennung unter Verwendung einer 45° Strahlaufteilungsorientierung

Ein X & Y-Senkrechtschnittapparat zum Ritzen eines Paares von parallelen Schnitten auf ein planares Werkstück, wobei die Werkstückebene mit einer X-Achse und einer Y-Achse angeordnet ist, wobei der Apparat enthält: eine Laservorrichtung, wobei die Laservorrichtung mindestens zwei Strahlen einschließlich eines ersten Strahls und eines zweiten Strahls erzeugt, wobei der erste Strahl und der zweite Strahl an einem ersten und einem zweiten Auftreffpunkt auf das Werkstück auftreffen, wobei der erste und der zweite Auftreffpunkt diagonal bezüglich der X- und der Y-Achse des Werkstücks angeordnet sind; und mindestens ein Betätigungsglied, um den ersten und den zweiten Auftreffpunkt zu bewegen, um ein Paar von parallelen Schnitten zu ritzen.

Vorrichtung zur Laserreinigung beschichteter Materallien vor dem Schweissen

Ein System (200, 300, 500) und ein Verfahren werden bereitgestellt, bei dem ein beschichtetes Werkstück (W) mit hoher Geschwindigkeit mit minimaler Porosität und Spritzerbildung verschweißt werden. Die Beschichtung (C) auf dem Werkstück wird entfernt oder durch eine Hochenergie-Wärmequelle (109) abgetragen, bevor sie in einem Schweißvorgang geschweißt wird, so dass eine hohe Schweißgeschwindigkeit erzielt wird. Die Hochenergie-Wärmequelle (109) ist stromaufwärts des Schweißvorgangs angeordnet, um zumindest einen Teil der Oberflächenbeschichtungen an einem Werkstück (W) zu verdampfen oder zu entfernen.

Laser-Chipschneidvorrichtung

Laser-Chipschneidvorrichtung, die veranlasst, dass Laserlicht, von welchem eine Konzentrationsstelle zu dem Inneren eines Wafers angeordnet ist, durch die Oberfläche des Wafers einfällt, während das Laserlicht gescannt wird, und den Wafer durch Ausbilden eines modifizierten Bereichs innerhalb des Wafers in Chips zerschneidet, um den Wafer in einzelne Chips zu teilen, wobei die Laser-Chipschneidvorrichtung folgendes aufweist: eine Positionserfassungsvorrichtung, die eine Position bezüglich der Dickenrichtung der Oberfläche des Wafers bei der Einfallstelle des Laserlichts erfasst; eine zweite Positionserfassungsvorrichtung, die getrennt von der ersten Positionsvorrichtung vorgesehen ist und eine Position bezüglich der Dickenrichtung der Oberfläche des Wafers im Voraus erfasst; und einen Steuerabschnitt, der die Position bezüglich der Dickenrichtung der Konzentrationsposition innerhalb des Wafers steuert, wobei der Steuerabschnitt dann, wenn das Laserlicht von der Außenseite einer Peripherie ...

Structuring the surface of materials

Material such as glass, plastic, semiconductor material, wood or ceramic is surface worked using a laser beam of wavelength 1.4-3.0 mu m.

Verfahren zum Herstellen eines Schneidwerkzeugs

Eine Steuerung 13 führt einen ersten Prozess des Abtastens eines zylindrischen Bestrahlungsbereichs aus, umfassend einen fokussierten Punkt des Laserlichts 2, das von einem Laserlicht-Emitter 10 emittiert wurde, um eine Freiflächenseite eines Werkstücks 20 zu bearbeiten, um ein Schneidwerkzeug herzustellen, das eine Vielzahl von in einer Reihe angeordneten Schneidkanten aufweist. In dem ersten Prozess tastet die Steuerung 13 den zylindrischen Bestrahlungsbereich entlang eines Abtastpfads, der Periodizität aufweist und eine Bearbeitungstiefe ändert, um die Vielzahl von Schneidkanten zu bilden, ab. Die Steuerung 13 führt ferner einen zweiten Prozess des Abtastens des zylindrischen Bestrahlungsbereichs aus, umfassend den fokussierten Punkt des Laserlichts, das in einer Richtung unterschiedlich von einer Bestrahlungsrichtung des Laserlichts in dem ersten Prozess emittiert wird, um eine Spanflächenseite des Werkstücks 20 zu bearbeiten.

Herstellen von Metallmustern auf einem Substrat

Verfahren und Vorrichtung zur Mikrobearbeitung eines Werkstücks mit Laserstrahlung

The invention relates to a method for micromachining a workpiece (3), especially for producing a borehole in the workpiece (3), by means of ultrashort-pulse laser radiation. According to the invention, a sacrificial layer (7) is applied to a surface of the workpiece (3) in a fixed manner. Ultrashort laser pulses are then generated, said pulses penetrating the sacrificial layer (7) and removing material from the workpiece (3). The sacrificial layer (7) is removed once a sufficient amount of material has been removed from the workpiece (3).

Waferprodukt und Herstellungsverfahren dafür

Waferprodukt, das aufgrund einer Multiphotonenabsorption durch Schneiden mit einem umgestalteten Bereich (R) geschnitten und getrennt wird, der durch ein Laserlicht (L) ausgebildet wird, das an einen lichtkonvergierenden Punkt (P) aufgebracht wird, der als Startpunkt zum Schneiden angeordnet ist, wobei das Waferprodukt aufweist: einen Wafer (10) mit zwei Flächen (10a, 10b), von welchen eine eine Laserlichteinfallsfläche (10b) ist, dadurch gekennzeichnet, dass eine andere Fläche (10a), welche der Laserlichteinfallsfläche (10b) gegenüberliegend angeordnet ist, derart aufgeraut ist, dass sie gleichförmige Erhebungen und Vertiefungen (10c) daran aufweist, und eine maximale Höhe von Erhebungen und Vertiefungen einer Oberflächenrauheit gleich oder größer als eine Wellenlänge des Laserlichts (L) ist.

Verfahren und Vorrichtung zur Erzeugung einer Laserschweißverbindung

Vorrichtung zum Ausbilden einer geschlossenen, gekrümmten Schnittfläche

Vorrichtung zum Ausbilden einer ein Teilvolumen (T) innerhalb eines transparenten Materials (5) umschließenden Schnittfläche (9), mit einer Laserstrahlungsquelle (S), die Laserstrahlung (3) in das Material (5) fokussiert und dort optische Durchbrüche (8) bewirkt, wobei die Vorrichtung eine Scaneinrichtung (6, 10), die den Fokuspunkt (7) dreidimensional verstellt, und eine Steuereinrichtung aufweist, die die Scaneinrichtung (6, 10) ansteuert, um die Schnittfläche (9) durch Aneinanderreihen der optischen Durchbrüche (8) im Material (5) zu bilden, dadurch gekennzeichnet, dass die Scaneinrichtung zur Verstellung der Lage des Fokuspunktes (7) längs der optischen Achse (A) ein verstellbares Teleskop (6) aufweist und dass die Steuereinrichtung den Fokuspunkt (7) entlang einer Raumspirale (22) verstellt, die in der Schnittfläche (9) liegt und entlang einer im Wesentlichen rechtwinklig zur optischen Achse (A) liegenden Hauptachse (H) verläuft.

Laserstrahl-Bearbeitungssystem und Laserstrahl-Bearbeitungsverfahren

Schichtbauelement-Herstellungsverfahren

Schichtbauelement-Herstellungsverfahren zur Herstellung eines Schichtbauelements unter Verwendung eines verstärkten Wafers (20), bei dem der verstärkte Wafer (20) durch auf einer vorderen Oberfläche (20a) in einem Gittermuster angeordnete Straßen (21) in mehrere Bereiche unterteilt ist und einen mit Bauelementen (22) in den so abgeteilten Bereichen ausgebildeten Bauelementbereich (23) und einen äußeren Umfangsüberschussbereich (24), der den Bauelementbereich (23) umgibt, beinhaltet, ein Bereich einer hinteren Oberfläche (20b), der dem Bauelementbereich (23) entspricht, so geschliffen wird, dass der Bauelementbereich (23) so ausgebildet werden kann, dass er eine vorgegebene Dicke aufweist, und ein Bereich, der dem äußeren Umfangsüberschussbereich (24) entspricht, belassen werden kann, um einen ringförmigen verstärkten Abschnitt (24b) zu bilden, wobei das Verfahren umfasst:einen Waferschichtungsschritt, bei dem ein unten liegender Wafer (200), der einen Durchmesser aufweist, der geringfügig ...

Verfahren zum Ausbessern metallischer Einkristallgegenstände

Conditioning method for surface of grinding stone, by radiation treatment at first setting to remove binder and particles and then at second setting to remove binder only

An adhesive binder (3b) used to hold grinding particles (3a) together in the stone (3) is ablated by irradiation and the radiation energy density is changed from a first setting at which both binder and particles are ablated to a second setting at which only binder is ablated. A profiling step is carried out at the first setting in order to produce a stone shape with a symmetry axis relative to a rotary shaft (11) to which the stone is secured. A sharpening step is carried out at the second setting so that the particles protrude from the stone surface.

Micro laser perforation of line patterns in strip material involves repeated cutting of rows of waveform, zig-zag or similar pattern lines over a set material length using a deflected laser beam

Laser beam deflections are synchronized with the speed of the strip material passing below each perforating head. Perforations produced by each head have a waveform(47), zig-zag or similar shape as single(33) or multiple(34) perforation lines over a set strip length(36,37). The repeated pattern of lines does not run parallel with the direction of strip movement(32). Laser beam deflection is controlled by vibrating or non-symmetric, rotating beam deflectors which move the beam from its central axis to vary the position of perforated lines(33,34) parallel to the transporting direction. Use of a non-symmetric reflecting cone continuously changes the deflection angle of the laser beam as the cone rotates through 360[deg]. A wide range of perforation patterns can be produced with regard to the number of lines and their profile. Line profiles are precalculated in a control unit and used to control the beam deflections. Perforating heads for producing a group of lines are not in the same horizontal ...

VERFAHREN UND VORRICHTUNG ZUR MARKIERUNG VON GEGENSTÄNDEN UNTER VERWENDUNG VON GESINTERTEN MINERALPULVERN

Halbleiterwafer-Unterteilungsverfahren unter Verwendung eines Laserstrahls

Ein Verfahren, welches einen Halbleiterwafer ausreichend präzise entlang einer Straße durch eine Verwendung eines Laserstrahls unterteilen kann, während vollständig eine Kontamination von Schaltungen vermieden oder unterdrückt wird, die in rechteckigen Bereichen auf der Fläche bzw. Oberseite des Halbleiterwafers ausgebildet sind, und ohne daß eine Span- bzw. Abfallbildung an den rechteckigen Bereichen auf der Oberseite bewirkt wird. Ein Laserstrahl wird von außerhalb bzw. neben einer Rückseite und der Oberseite eines Halbleitersubstrats aufgebracht und auf der anderen Rückseite und der Oberseite des Halbleitersubstrats oder in der Nachbarschaft davon fokussiert, um teilweise wenigstens einen Bereich, der von der anderen Rückseite und der Oberseite des Halbleitersubstrats reicht, bis zu einer vorbestimmten Tiefe zu verschlechtern bzw. zu beschädigen.

Method of producing cutouts in a workpiece, e.g. in a vehicle body part

A clamping unit (20) with a guided cutting element (12) is attached to the part to be cut out of a workpiece (10). The clamping unit incorporates a clamping element (18) with opposing clamping surfaces for the workpiece material, and is provided with the cutting element. An Independent claim is also included for a device for carrying out the method.

Vorrichtung zum Materialabtragen bei Werkstücken mittels Laserstrahl

Die Erfindung betrifft eine Vorrichtung zum Abtragen von Material bei einem Werkstück mittels eines Laserstrahles, insbesondere eine Laserbohrvorrichtung, umfassend eine Laseranordnung zur Erzeugung eines Laserstrahles, der aus wenigstens einem Laserpuls besteht, der durch Parameterwerte wie z. B. Pulsdauer, Pulsabstand, Laserwellenlänge, Laserintensität charakterisiert ist. DOLLAR A Um eine derartige Vorrichtung hinsichtlich Abtragungsfortschritt und Abtragungspräzision zu verbessern, wird erfindungsgemäß vorgeschlagen, die Laseranordnung so auszugestalten, daß sie wenigstens zwei Typen von Laserpulsen erzeugt, die sich hinsichtlich mindestens eines Parameterwertes unterscheiden.

Spritzen verhindernde Beschichtung bei Laserbearbeitungen

Spritzen verhindernde Beschichtung bei Laserbearbeitungen

Verfahren zum Herstellen eines Lochs (20) in einem dünnen, metallischen Werkstück (10), umfassend die folgenden Verfahrensschritte: a) Aufbringen einer flüssigen, thermofixierbaren Polymervorstufensubstanz (12) auf mindestens einer Oberfläche (10a) des Werkstücks (10); b) Umwandeln der Polymervorstufensubstanz (12) in ein festes thermofixiertes Polymer erster Stufe (14) bei einer ersten Temperatur und einer ersten Dauer, wobei das Polymer erster Stufe (14) im Wesentlichen frei von carbonisiertem Polymer ist; c) Umwandeln des Polymers erster Stufe (14) in ein Polymer zweiter Stufe (16) durch Erhitzen des Polymers auf eine zweite Temperatur während einer zweiten Dauer derart, dass das Polymer in eine carbonisierte Form umgewandelt wird; d) Herstellen von mindestens einem Loch (20) zwischen der mindestens einen (10a) und einer anderen Oberfläche (10b) des Werkstücks (10); e) Entfernen des Polymers (16) vom Werkstück.

Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff

Producing radiation line focus on moving workpiece - esp. for automatically welding layered or tubular synthetic film

A device for treating a workpiece by moving focused radiation across it, e.g. in the welding of a synthetic film, includes an optical system for the prodn. of a line focus of a radiation beam on the moving workpiece, so that the direction of the line focus is at right angles to the direction of motion of the workpiece. It includes also means of deflecting the focussed beam over the workpiece in a direction which has a component in the direction of motion of the }workpiece of such a dimension that the actual motion of the line focus of the radiation beam relatively to the workpiece takes place in a straight line along the line focus. The optical system consists of a cylindrical focussing leans, a spherical intermediate focussing lens and a projecting lens. The deflectors consists of a mirror positioned between the intermediate lens and the projector, the alignment of which, relatively to the cylindrical lens can be altered, so as to alter the direction of the deflected track of the focussed ...

Laserbearbeitung eines mehrphasigen transparenten Materials, sowie mehrphasiger Kompositwerkstoff

Die Erfindung sieht ein Verfahren zur Erzeugung von Modifikationen in oder an einem transparenten Werkstück (2) mittels einer Laserbearbeitungsvorrichtung (1) vor, wobei eine Laserbearbeitungsvorrichtung (1) verwendet wird, die einen Kurzpuls- oder Ultrakurzpulslaser (10), der eine Laserstrahlung (12) mit einer Wellenlänge im Transparenzbereich des Werkstücks (2) ausstrahlt, und eine Strahlformungsoptik (11) zur Strahlformung, insbesondere zur Fokussierung der Laserstrahlung aufweist, und wobei ein transparentes Werkstück (2) verwendet wird, das aus einem Material besteht, welches mehrere Phasen aufweist, von denen zumindest zwei Phasen unterschiedliche Dielektrizitätszahlen besitzen, von denen wiederum die eine Phase eine in Form von Partikeln eingeschlossene Phase ist, die von der anderen Phase im Wesentlichen umgeben ist, und wobei das Produkt aus dem in Kubiknanometern angegebenen Volumen der Partikel und dem Verhältnis des Betrages der Differenz der zwei unterschiedlichen Dielektrizitätszahlen ...

Wafer-Bearbeitungsverfahren

Wafer-Bearbeitungsverfahren des Bearbeitens eines Wafers mit einer Vorrichtungsfläche, in der eine Mehrzahl von Vorrichtungen ausgebildet sind, und einer peripheren marginalen Fläche, welche die Vorrichtungsfläche umgibt, wobei eine Frontseite des Wafers durch eine Mehrzahl von sich kreuzenden Teilungslinien partitioniert wird, um eine Mehrzahl von separaten Regionen zu definieren, wo jeweils die Vorrichtungen ausgebildet sind. Das Wafer-Bearbeitungsverfahren beinhaltet: einen Halteschritt des Haltens der Frontseite des Wafers unter Verwendung eines Haltemittels, das eine Vertiefung, die dafür ausgelegt ist, zur Vorrichtungsfläche des Wafers gegenüber liegend zu sein, und einen peripheren Teil, der die Vertiefung so umgibt, dass er gegenüber dem äußeren Umfang der Vertiefung angehoben ist, aufweist, wobei der periphere Teil einer Halteoberfläche zum Halten der peripheren marginalen Fläche des Wafers in Kontakt damit aufweist; und einen modifizierten Schicht-Bildungsschritt des Anwendens ...

Verfahren und Vorrichtung zum Laserschweissen von zwei oder mehr überlappenden Blechen und zum Klemmen der Bleche

Process and apparatus for the production of can bodies from plastic-coated tinplate

In the process for the production of welded can bodies from plastic-coated tinplate, the plastic coating is removed in the region of the side edges (8, 12) under the action of a laser beam and the tinplate, after being bent round to form a longitudinal seam, is welded together. ...

Method and device for making a recess in a glass body

In order to improve a method of making a recess in a glass body in such a way that recesses can be made in a glass body without stress cracks and as effectively as possible, it is proposed that the glass body for making the recess be heated in the surrounding zone of the same and that the recess then be made by removing glass material with a laser beam.

Verfahren zum Kalibrieren einer Steuerung zur Ablenkung eines Laserstrahls

A process is disclosed for calibrating a laser beam scanning control. A light-sensitive medium (5) is irradiated at predetermined positions by a laser beam (2) in order to generate a test image (20), then partial digital images of sections (21) of the test image (20) are generated and the digital partial images are assembled into a total digital image of the test image (20). The data for correcting the laser beam (2) scanning control (4) are calculated on the basis of a comparison between real positions of the laser beam (2) on the total digital image and predetermined set co-ordinates.

Unit fixing plastic vehicle components in position on holder for laser trimming, grips component using contoured pattern held down by magnetic force

A holder (10) provided, corresponds with the shape of the component. A contoured pattern (11) is laid over the component and holder. A magnet (13) in the holder produces a magnetic force on the pattern, such that the pattern and component (12) are pressed against the holder. The pattern is a metal shell largely covering the component, when in the functional position. The component is cut by a robot-guided laser (14) beam (15). The magnet is preferably an electromagnet. The pattern is produced from CAD data. The component to be trimmed, is warped. An independent claim is included for the corresponding method.

Verfahren und Vorrichtung zum rissfreien Schweißen, Reparaturschweißen oder Auftragsschweißen heißrissanfälliger Werkstoffe

Verfahren zum rissfreien Schweißen, Reparaturschweißen oder Auftragschweißen heißrissanfälliger Werkstoffe mittels eines Schweißverfahrens hoher Leistungsdichte und einer weiteren, mit der Schweißgeschwindigkeit in einem konstanten Abstand zur Schweißzone mitlaufenden örtlichen Temperaturbeaufschlagung, dadurch gekennzeichnet, dass die mitlaufende örtliche Temperaturbeaufschlagung durch zwei beidseitig parallel oder nahezu parallel zur Schweißrichtung (8) verlaufende und sich zur Schweißrichtung (8) längs erstreckende elektromagnetisch durch eine Volumenenergiequelle im Inneren der Bauteile 1 und 2 (1, 2) (22) erzeugte Temperaturfelder (9, 10) erfolgt, die beide in Schweißrichtung (8) vor der Schweißzone (4) beginnen und deren Temperaturmaxima (13) sich außerhalb der Wärmeeinflusszone (14) und in Schweißrichtung (8) hinter der Erstarrungszone (6) befinden und die Tiefe der Temperaturfelder (9, 10) am Ort des Temperaturmaximums (13) mindestens die Schweißnahttiefe erreicht.

Medizinisches Implantat und Verfahren zur Herstellung desselben

Die vorliegende Erfindung bezieht sich auf ein Verfahren zur Herstellung eines medizinischen Implantats, vorzugsweise eines Herzschrittmachers oder eines Defibrillators. Ein derartiges medizinisches Implantat wird aus einem ersten Element (10, 20, 30) und mindestens einem zweiten Element (10, 20, 30), die jeweils eine Oberfläche aufweisen, zusammengesetzt. Das erste Element (10, 20, 30) und das mindestens eine zweite Element (10, 20, 30) werden dabei in einem Fügeschritt in dem jeweiligen, mindestens einen Teilbereich der jeweiligen Oberfläche bildenden Verbindungsbereich des ersten Elements (10, 20, 30) und des mindestens einen zweiten Elements (10, 20, 30) miteinander verbunden. In einem vor dem Fügeschritt durchzuführenden Plasmaaktivierungsschritt wird mindestens der Verbindungsbereich des ersten Elements (10, 20, 30) und/oder mindestens der Verbindungsbereich des mindestens einen zweiten Elementes (10, 20, 30) in einem Niederdruckplasma oder in einem bei Atmosphärendruck erzeugten ...

Laser drilling or machining method using electrical field for removal of metal and/or plasma ions from machining point

The drilling or machining method has a current-voltage source (4) connected between the workpiece (2) and a relatively spaced electrode (3), for providing an electrical field (5), causing metal and/or plasma ions (6) adjacent the drilling or machining point (2a) of the laser beam (1) to be accelerated from the positive workpiece to the negative electrode. An independent claim for a laser drilling or machining device is also included.

Laser welding method for coated panels used in automotive industry with selection of weld length and/or disturbance of weld by transversal movement of laser beam for preventing eruptive vaporization of coating material

The laser welding method uses a de-focused laser beam for welding together at least 2 coated panels which are held at a minimum spacing from one another, the length of the welding seam being selected to allow the vaporized coating material to exit through the weld and/or the weld continuously disturbed by a superimposed transversal movement of the laser beam.

Mfr. or repair of turbine blade tips using laser beam weld-coating and blade master alloy metal powder filler

The method is used to make or repairs turbine blades. Laser beam weld-coating is employed, using a metal powder filler. The novel approach involves forming a strip of metal sheet (3) into a fork-like shape. This is fitted tightly around the contour (4) of the blade tip (6) with the aid of an externally-surrounding encapsulation of injection-moulded plastic (5). This locks around the contour, faithful to its profile, forming a mould in the manner of shuttering. The strip projects beyond both encapsulation and blade tip. The internal region (8) rising above the tip, is completely filled. Also claimed are the corresponding mould, as described, and the method of making it. The flexible metal strip is formed about the tip of the blade and pressed on using an upper lamellar diaphragm (22). A contour-fitting lower lamellar diaphragm is set near the root of the blade, completing a closed cavity between upper and lower diaphragms. The plastic is then injected, exerting pressure on the lower regions ...

Verfahren zur Bearbeitung von Werkstücken mittels Laserstrahlung

Die Erfindung betrifft ein Verfahren zur Bearbeitung von Werkstücken mittels Laserstrahlung, wobei die zu bearbeitenden Werkstücke bei der Bearbeitung bewegt werden und mindestens ein Laserstrahl in Bezug zu zwei orthogonal zueinander ausgerichteten Achsen ausgelenkt wird. Es ist daher Aufgabe der Erfindung, großformatige Bearbeitungskonturen bei möglichst großer Bearbeitungsgeschwindigkeit und hoher Präzision auszubilden. Bei dem erfindungsgemäßen Verfahren wird so vorgegangen, dass ein Laserstrahl innerhalb eines Arbeitsfeldes in Bezug zu zwei orthogonal zueinander ausgerichteten Achsen ausgelenkt wird. Außerdem werden Positionskoordinaten der jeweiligen Bearbeitungskontur in einer elektronischen Auswerte- und Steuereinheit virtuellen Bearbeitungssegmenten zugeordnet, in denen die Bearbeitung sequentiell durchgeführt wird. Die Grenzen einzelner Bearbeitungssegmente sind vorgegeben, so dass der maximale Abstand von sich gegenüberliegend angeordneten Grenzen der jeweiligen Bearbeitungssegmente ...

Coating material gas removal method for laser welding process uses stimulated resonance oscillation of one of welded metal panels

The gas removal method uses a stimulation element (8) adjacent the free ends of the coated metal panels (1,2) to be welded, in contact with one of the coated metal panels, for stimulation of a resonance oscillation with a frequency of between 50 and 150 Hz and an amplitude of between 0.05 and 0.2 mm.

Method for scratching, cutting and drilling of leather with laser beam of lasers, comprises subjecting the leather to scratching, cutting or drilling with pulsed laser beam so that clean and ink-saving and/or odorless machining rims arise

The method comprises subjecting a leather to scratching, cutting or drilling with pulsed laser beam with a wavelength of less than 600 nm so that clean and ink-saving and/or odorless machining rims arise. The leather is subjected with pulsed and/or frequency-doubled or frequency-tripled lease beam of solid-state laser, with a wave length of 532-355 nm, and/or with a pulsed laser beam of an excimer laser with a wavelength of 351 nm, 308 nm or 248 nm. The pulse time of the pulsed laser beam is less than 200 ns. An independent claim is included for an arrangement for scratching, cutting and drilling of leather with laser beam of laser.

Methode zum Laserritzen von Solarzellen

Die vorliegende Erfindung betrifft eine Vorrichtung zur Ablation dünner Filme eines beschichteten Substrates in der Randregion des Substrates sowie das zugehörige Verfahren. Die erfindungsgemäße Vorrichtung umfasst einen Laser, eine optische Einheit, um das Laserlicht in einen Ablationsbereich zu lenken, und eine Halterung für plane Substrate. Die Halterung erlaubt, das Substrat in der Ebene des Substrates linear in zwei linear unabhängige Richtungen zu bewegen. Die Halterung erlaubt, das Substrat um eine Achse zu rotieren, welche senkrecht auf der Substratoberfläche steht. Dies erlaubt einen vereinfachten stationären Aufbau der Vorrichtung in Bezug auf optischer Einheit und Mittel zum endgültigen Entfernen der ablatierten Materialien.

Method for metal contacting a solar cell by laser cladding process, comprises applying a seed layer of metal on a surface of substrate through powder stream, melting the particles by laser beam and soldering with surface of the solar cell

The method comprises applying a seed layer of metal on a surface of a substrate through powder stream, melting the particles by laser beam (LS) and soldering with a surface of the solar cell, where a laser cladding process is carried out on the seed layer. The metal contact is implemented as solder pad or as welded zones with a solderable or weldable material. An independent claim is included for a laser cladding plant for producing metal contacts in a solar cell.

Substrate manufacture

The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius.

Micromachining holes in a coated workpiece

Method and apparatus for processing optical fibre

Material removal method

LASER DRILLING APPARATUS

... 1418972 Drilling by lasers PHOTON SOURCES Inc 22 May 1973 [5 June 1972] 24472/73 Heading B3V [Also in Division G2] Laser drilling apparatus is shown as comprising a frame 12 with a fixture 14 on which workpiece 16 can be securely attached. An optical drilling head (see Divisions G2-G3) is positioned above workpiece 16 and is rotatably drivable about axis 19 by means of motor 20, sprockets 22, 24 and chain 26. A movable mirror platform 28 is mounted above head 18 and carries mirrors 30, 32 which direct the laser beam to the head 18. An air input 34 and exhaust 36 are provided on opposite sides of head 18 for cooling and removal of contaminants. The drilling head 18 is such that when it is rotated, the laser beam traces out a circle of variable diameter through the workpiece and cores out a hole. If the motor 20 is stepped and the laser is correspondingly pulsed, series of holes can be drilled around the circumference of a circle. The head 18 is programmable for automatic operation.

Improvements in or relating to methods of drilling a hole in a workpiece with the aid of a high-energy beam of rays

... 1,145,611. Removing metal by high energy beams. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 5 April, 1967 [8 April, 1966], No. 15662/67. Headings B3A and B3V. In a method of piercing a hole 11 in a workpiece 9 by a high energy beam 21, the surface of the workpiece in the vicinity of the hole is provided with a covering layer 15 which is later removed. This layer prevents damage to the hole near the surface. The layer 15 may be of refractory metal such as tungsten and has a spacer 17 formed around the hole to be pierced. Alternatively a separate spacer ring may be used. An electron beam 13 first pierces a hole in the layer 15 and then the centre part of the beam pierces the hole 11 in the workpiece. The beam may be pulsed. After piercing, the layer is removed and the metal workpiece (51), Fig. 5 (not shown), may be then electroplated with copper (55). In another embodiment, Fig. 1, a workpiece (1) of nickel is provided before piercing with a thin layer of copper (5). Subsequently the ...

Apparatus and method for drilling microvia holesin electrical circuits interconnection packages

METHOD AND APPARATUS FOR USE IN MICROPROPAGATION.

In a method of cutting plant tissue for micropropagation, a container (42) containing plantlets (43) is rotated on a turntable (19). A laser beam (35) is focused on a side wall (36) of the container below the level of a nutrient medium (45). The container (42) is rotated while the laser (35) cuts free an upper portion (36) of the container (12). After cutting, plant material is cut in a subsequent step by the same laser. Preferably the container is inverted during cutting of container and plantlets.

Wire stripping using a laser

An insulating coating of a desired portion of an electric cable is removed by selectively irradiating the desired portion with a pulse laser beam having a pulse width of 5 mu sec or less and a peak output of 1 MW or more.

Laser etching of flooring material

A method of treating the surface of a flooring material comprises moving the impact point of an energy beam, specifically a laser beam, over the surface of the material to etch a pattern in the material surface. Apparatus for carrying out the method comprises a surface for supporting the material to be treated, an energy beam, and moving means for moving the energy beam to change its impact point on the material surface. The laser may be computer controlled. The material may be treated such that it changes colour upon impact of the laser. The speed and/or intensity of the laser may be varied so as to produce tonal or texture variations in the etching. The etched areas may contain a different material.

Method and apparatus for laser beam welding of overlapping sheets

While steel sheets, overlapping each other, (W1, W2) are positioned and held by a holding mechanism (12), a first laser beam (L1) is applied to a heating region (P1) of the steel sheet (W1) to space the steel sheet (W1) from the other steel sheet (W2) by a predetermined distance. A second laser beam (L2) is applied to a welding region (P2) to weld the steel sheets (W1, W2) and is moved the welding direction in synchronism with the first base beam (L1). An amount of heat applied by the first laser beam (L1), a moving speed of the first laser beam (L1), and a focused spot diameter of the first laser beam (L1) are set to keep the sheet (W1) irradiated with the first laser beam (L1) in an unmelted state and plastically deform the sheet (W1).

Micromachining holes in a coated workpiece

The invention provides a process and apparatus for the drilling of air holes in a workpiece to which a thermal barrier coating has been applied, comprising:
```mounting on the same support platform of a machining tool a laser head and, at a predetermined offset from the laser head, an EDM head;
```using the laser to ablate, under microprocessor control, the thermal barrier coating and any underlying bond coats over at least one site of an air hole to be drilled through a wall of the workpiece;
```moving the support platform laterally by the amount of the predetermined offset; and
```using the EDM head, under the same microprocessor control, to create the air hole through the wall of the workpiece beneath the or each surface-ablated site.

Scribing apparatus, substrate cutting apparatus equipped with the scribing apparatus, and substrate cutting method using the substrate cutting apparatus

High-temperature activation process

A method for processing a coated glass substrate may include a high-temperature activation process.

High Throughput Solar Cell Ablation System

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Method for Cutting C-Mn Steel with a Fiber Laser

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

Method to dice back-contact solar cells

A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed thereof, the first and second pluralities of interconnect pads having opposite operational charges. The back-contact solar cell is then diced to define at least first and second back-contact solar cell sections. The first back-contact solar cell section has at least two interconnect pads, of the plurality of interconnect pads, at respective opposed edges thereof.

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

Low deflection bi-metal rotor seals

A seal assembly for use in a turbomachine is provided. The seal assembly has an annular division wall with outside and inside surfaces, a carrier ring disposed adjacent the inside surface of the annular division wall, and a sealing substrate metallurgically-bonded to an inner-most surface of the carrier ring. The sealing substrate is machined to form a seal surface that can be disposed proximate a rotor and maintained substantially parallel thereto during operation of the turbomachine.

Polymer tubing laser micromachining

An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

Buffer Layer to Enhance Photo and/or Laser Sintering

Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Apparatus and method for laser scribing

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

Tubular beam with single center leg

A reinforcement beam for a vehicle bumper system comprises a single sheet deformed to define first and second tubes sharing a common single center wall. A channel rib is formed on each tubes and a crevice rib over the center leg forms a third rib. Edges of the sheet are deformed to a radius so that their surface consistently engages an associated radiused corner formed on ends of the center leg, which facilitates consistent abutting line engagement of material surfaces, and thus facilitates consistent welding. In a preferred beam, front wall sections of each tube are coplanar and form a face of the beam, with each channel rib and crevice rib providing added stiffness to the beam, and yet nothing extends forward of the coplanar front wall sections. Related apparatus and methods are also disclosed.

Method for manufacturing semiconductor device

In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating.

Laser ashing of polyimide for semiconductor manufacturing

A method for laser ashing of polyimide for a semiconductor manufacturing process using a structure, the structure comprising a supporting material attached to a semiconductor chip by a polyimide glue, includes releasing the supporting material from the polyimide glue, such that the polyimide glue remains on the semiconductor chip; and ashing the polyimide glue on the semiconductor chip using an ablating laser.

Laser processing method

A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

Orthogonal integrated cleaving device

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Pollution control device and inorganic fiber sheet material with a fused edge

Inorganic fiber mounting and insulating sheet materials for use in pollution control devices with at least one edge of the inorganic fiber sheet material having at least one group of two or more fibers fused together. A pollution control device comprising such a sheet material. A process for cutting at least one section from a sheet containing inorganic fiber material, where the sheet material is suitable for use in a pollution control device. The fibrous sheet material is cut so that the cut edge has at least one group of two or more fibers fused together. A laser beam can be used to cut the desired section out of the inorganic fiber sheet material.

Method and apparatus for cutting a brittle-material substrate, and window glass for vehicle obtained by the method

A method for cutting a brittle-material substrate by irradiating a converged laser beam on a brittle-material substrate along first and second cutting lines intersecting each other at least at one point, includes forming scribe lines along the first and the second cutting lines on a surface of the brittle-material substrate, and relatively moving an irradiation position of the laser beam on the surface of the brittle-material substrate along the scribe lines to cut the brittle-material substrate at a forward position of the irradiation position in the moving direction of the irradiation position. The irradiation of the laser beam is limited in a region in the vicinity of an intersection where the first and the second cutting lines intersect.

Cutting/polishing tool and manufacturing method thereof

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

Method and System for Mitigation of Particulate Inclusions in Optical Materials

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

Method for making an opening in a substrate

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

Scanned laser light source

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

Laser processing method and laser processing device

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

Apparatus and method for optical isolation

Provided herein is an apparatus for optically isolating a light beam from a laser, comprising an optical isolator configured to isolate a light beam having a beam quality; a reference plane; an output connector disposed at the output of the optical isolator, wherein the output connector is configured with a common collimator interface to connect to a collimator which is capable of being mechanically referenced to the reference plane; a first lens arrangement disposed proximal to a distal end of the output connector, wherein the first lens arrangement is selected to provide an output light beam having a predetermined divergence. The laser can be selected from the group consisting of a fiber laser, a disk laser and a rod laser. Also provided herein are a system, a plurality of lasers, and a method of providing a light beam that has a consistent divergence and distance from a reference plane.

Wafer dividing method

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

Method for dicing wafer stack

A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.

Method for processing rubber surface and sealing member

A method for processing a rubber surface and a sealing member treated with the method. In the first mode, a rubber surface is formed with a large number of small dimples in a regularly dotted pattern by irradiating laser beams from a laser irradiation device. In the second mode, a skin layer of the rubber surface is removed by irradiating laser beams from the laser irradiation device. In the third mode, the first mode and the third mode are combined. A sealing member comprises rubber including a seal lip part for elastically and slidably contacting a counterpart member, wherein a sliding contact surface of the seal lip part contacting the counterpart member is treated with one of the first, the second and the third modes of the method for processing a rubber surface.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Water soluble mask for substrate dicing by laser and plasma etch

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

Laser and plasma etch wafer dicing using water-soluble die attach film

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

Laser processing method

For modulating laser light for forming a modified region SD 3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an object 1, a quality pattern J having a first brightness region extending in a direction substantially orthogonal to a line 5 and second brightness regions located on both sides of the first brightness region in the extending direction of the line 5 is used. After forming modified regions SD 1, SD 2 at positions closer to the rear face 21 but before forming modified regions SD 4, SD 5 at positions closer to the rear face 21 while using the front face 3 as a laser light entrance surface, the modified region SD 3 is formed at the intermediate position by irradiation with laser light modulated according to a modulation pattern including the quality pattern J.

Laser ablation tooling via distributed patterned masks

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

Laser processing machine

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

Device for cutting plastic products provided in a continuous plastic band for use in the medical sector

Devices for cutting interconnected plastic products for use in the medical sector provided in a continuous band of plastic, comprising a laser, a laser control system and an optical acquisition and data processing unit are disclosed. Devices for the manufacture of plastic products, such as fillable or filled plastic containers for use in the medical sector, comprising a device for cutting interconnected plastic products provided in a continuous band of plastic as well as a process for cutting interconnected plastic products provided in a continuous band of plastic are disclosed. The optical acquisition unit may determine positional data for the interconnected plastic products provided in the band. From the positional data a cutting pattern may be calculated and transmitted to the laser control system. According to this cutting pattern, the position, intensity and focal point of the laser may be controlled by the laser control system, which may comprise a focusing optic, a deflection means and a beam-forming means.

Method for manufacturing sealing disks

Sealing disks ( 44 ) for producing peel-off lids comprising lid rings having a peel-off foil sealed onto the lid ring are produced in that an annular sealing part made of steel ( 54 ) is fastened on a main plate ( 53 ) made of copper, for example by electron-beam welding, whereupon the sealing part is hardened by laser hardening. In this way, a sealing disk having good thermal conductivity and high wear resistance can be favorably produced.

Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials

Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed.

Systems and processes that singulate materials

Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

Method for patterning nano particles

The invention provides a simple and inexpensive method to assemble nanomaterials into millimeter lengths. The method can be used to generate optical, sensing, electronic, magnetic and or catalytic materials. Also provided is a substrate comprised of fused nanoparticles. The invention also provides a diode comprised of assembled nanoparticles.

Laser-based lap welding of sheet metal components using laser induced protuberances to control gap

A method for laser welding first and second components is provided including moving a laser beam across a portion of a surface of the first component at a speed sufficient to generate protuberances on the surface of the first component by means of a humping effect, juxtaposing said first and second components such that opposed surfaces of the first and second components are separated by said protuberances on the surface of the first component, and laser welding said first and second components by scanning the laser beam in a region in which said surfaces are separated by said protuberances. The height of the protuberances can be controlled by controlling a scanning speed of the laser beam.

Transparent material processing with an ultrashort pulse laser

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Discontinuous section tower tube

A belt integrated seat tower for a seat system. The seat tower can include a single piece of bent sheet metal in the form of an elongated discontinuous section tube having a first longitudinal edge and a second longitudinal edge adjacent to the first longitudinal edge. A butt weld can join the first and second longitudinal edges to form a lapless seam and a generally flat weld surface.

Method for closed-loop controlling a laser processing operation and laser material processing head using the same

The present invention relates to a method for closed-loop controlling a processing operation of a workpiece, comprising the steps of: (a) recording a pixel image at an initial time point of an interaction zone by means of a camera, wherein the workpiece is processed using an actuator having an initial actuator value; (b) converting the pixel image into a pixel vector; (c) representing the pixel vector by a sum of predetermined pixel mappings each multiplied by a corresponding feature value; (d) classifying the set of feature values on the basis of learned feature values into at least two classes of a group of classes comprising a first class of a too high actuator value, a second class of a sufficient actuator value and a third class of a too low actuator value at the initial time point; (e) performing a control step for adapting the actuator value by minimizing the error e t between a quality indicator y e and a desired value; and (f) repeating the steps (a) to (e) for further time points to perform a closed-loop controlled processing operation.

Processing method for wafer

A wafer has, on a front face thereof, a device region in which a device is formed in regions partitioned by a plurality of scheduled division lines. An outer peripheral region surrounds the device region. A reflecting film of a predetermined width is formed from the outermost periphery of the wafer on a rear face of the wafer corresponding to the outer peripheral region. The front face side of the wafer is held in a chuck table, and a focal point of a pulsed laser beam of a wavelength having permeability through the wafer is positioned in the inside of the wafer corresponding to the scheduled division lines. The pulsed laser beam is irradiated from the rear face side of the wafer to form modified layers individually serving as a start point of division along the scheduled division lines in the inside of the wafer.

Methods for scribing of semiconductor devices with improved sidewall passivation

A method of singulating semi-conductor devices in the close proximity to active structures by controlling interface charge of semiconductor device sidewalls is provided that includes forming a scribe on a surface of a semi-conductor devices, where the scribe is within 5 degrees of a crystal lattice direction of the semi-conductor device, cleaving the semiconductor device along the scribe, where the devices are separated, using a coating process to coat the sidewalls of the cleaved semiconductor device with a passivation material, where the passivation material is disposed to provide a fixed charge density at a semiconductor interface of the sidewalls, and where the fixed charge density interacts with charge carriers in the bulk of the material.

Method and apparatus for repairing gas turbine components made of ceramic composite materials

Method for repairing a gas turbine component, which at least at the spot to be repaired consists of a ceramic composite material, where an energy beam locally heats the gas turbine component in a zone, and where one or more auxiliary materials and optionally fibers and/or particles are fed to this zone, wherein a ceramic is generated in the melting zone through the one or more auxiliary materials, and, optionally, the one or more auxiliary materials together with the fibers and/or particles forms a ceramic composite material.

In situ inductive ablation meter

Real time monitoring and detection of the depths of laser scribes used during pulsed laser ablation processes. During a laser scribing process, sensors are used to determine in real time an amount of ablated material from a substrate undergoing the process. Laser scribing can be terminated when the amount of ablated material as detected by the sensors corresponds to a desired scribe depth.

Apparatus and method for repair of defects in an electronic energy control or display device

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

Rotatable support elements for stents

Various embodiments of methods and devices for coating stents are described herein. The method includes applying a coating composition to the stent; rotating the stent with a rotatable element supporting at least a portion of the stent; and applying at least one pulse to the rotatable element during the stent coating process.

Laser Cladding Surface Treatments

A metal enclosure has a surface region which is coated with cladding material using a laser cladding process. The metal enclosure can form at least a portion of an electronic device housing. All or part of one or more surfaces of the enclosure can be coated with cladding material. The coating of cladding material can be varied at selective regions of the enclosure to provide different structural properties at these regions. The coating of cladding material can be varied at selective regions to provide contrast in cosmetic appearance.

Rotating laser wire stripping system

A laser wire stripping apparatus having a collet having a passageway for receiving a wire therein along an axis of insertion. The collet being fixed in position relative to the axis of insertion. A laser source for producing a laser beam. An optical assembly, the optical assembly moving relative to the collet and the axis of insertion for directing a laser beam along an axis of insertion of said wire.

Piezoelectric substrate for the study of biomolecules

A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.

Method of Joining at Least Two Components, a Method for Rendering a Component Resistant to Eroision, and a Turbine Blade

A method of joining at least two components, a method of preventing erosion of a base component and a turbine blade is provided. The method of joining at least two components includes providing a laser cladding apparatus, aligning a first component and second component, and jointing the first and second components by laser cladding. The first component includes a first joining surface adjacent to a seconding joining surface of the second component. The first joining surface and the second joining surface are joined by laser cladding along a joining plane. A joining material from the laser cladding provides at least one joining layer between the first joining surface and the second joining surface. The first and second joining surfaces include a bevel angle. A method for rendering a component resistant to erosion and a turbine blade are also provided.

Method for welding steel material to ni-based superalloy and welding joint

When a turbine impeller ( 4 ) formed from an Ni-based superalloy and a rotor shaft ( 2 ) formed from a steel material are joined by being fused together via welding in a boundary portion, a mixing ratio of a welding metal ( 6 ) that is formed in the boundary portion by fusing together the Ni-based superalloy forming the turbine impeller ( 4 ) and the steel material forming the rotor shaft ( 2 ) is between 0.5 and 0.8. As a result, it is possible to obtain a sound welding joint in which there are no cracks in the boundary between the welding metal ( 6 ) and the Ni-based superalloy ( 4 ).

Method and Apparatus to Fabricate Vias in Substrates for Gallium Nitride MMICs

A system for fabricating vias in SiC and CVD diamond substrates through controlled laser ablation using short pulse lengths and short wavelengths.

Sliding member and production method for same

A sliding member has a sliding surface of a different form than a conventional sliding surface, and exhibits stable sliding characteristics even under a high surface pressure. The sliding member has a sliding surface formed on a surface of a metal base material, and includes two surface textures: a hard part and a tough part. The tough part contacts with the hard part and has a hardness lower than that of the hard part. The sliding surface includes the surface texture, in which the hard part and the tough part that supports the hard part are present in a mixed fashion with a micro-meso region level, and stably exhibits excellent wear resistance.

Flange for pressure measurement cells or pressure transfer means and method for manufacture of such flanges

A flange for a corrosion resistant and nevertheless low cost flange for pressure measurement cells, or pressure transfer means, is composed essentially of a metal foundation of a standard material and is protected on the side facing a process medium by a there applied layer of a highly alloyed, special material.

Subsurface glass reticles

An optical instrument for light incoming along a principal optical axis includes a glass block and a subsurface object within the glass block. The subsurface object includes an arrangement of object marks. Each object mark includes a plurality of scattering layers stacked against the principal optical axis of the incoming light. First and second scattering layers of the plurality of scattering layers have different polarization responses.

Laser reinforced direct bonding of optical components

A method for the laser reinforced direct bonding of two optical components having a respective bonding surface and a reinforced optical assembly made thereby are provided. The method includes a first step of assembling the two optical components by direct bonding of their respective bonding surface together, thereby defining a direct-bonded interface therebetween. The method further includes a second step of reinforcing the direct-bonded interface with a weld seam including at least one substantially continuous reinforcing weld line forming a dosed shape enclosing a sealed direct-bonded region. Each weld line is inscribed by focusing ultrashort laser pulses at the direct-bonding interface so as to generate non-linear optical phenomena inducing a localized junction between the two optical components. Advantageously, embodiments of the present invention provide reinforced optical assemblies exhibiting hermetic and mechanically resistant bonds over a large area as well as negligible alteration of their optical transmission properties.

Multi-layer mask for substrate dicing by laser and plasma etch

Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a first mask material layer soluble in a solvent over the semiconductor substrate and a second mask material layer, insoluble in the solvent, over the first mask material layer. The multi-layered mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then plasma etched through the gaps in the patterned mask to singulate the IC with the second mask material layer protecting the first mask material layer for at least a portion of the plasma etch. The soluble material layer is dissolved subsequent to singulation to remove the multi-layered mask.

Laser scribing and plasma etch for high die break strength and clean sidewall

In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe and subsequent plasma etch is implemented for die singulation. The laser scribe process may be used to cleanly remove a mask layer, organic and inorganic dielectric layers, and device layers. The laser etch process may then be terminated upon exposure of, or partial etch of, the wafer or substrate. In embodiments, a multi-plasma etching approach is employed to dice the wafers where an isotropic etch is employed to improve the die sidewall following an anisotropic etch. The isotropic etch removes anisotropic etch byproducts, roughness, and/or scalloping from the anisotropically etched die sidewalls after die singulation.

Leads incorporating a laser processed electrode

Medical devices may include an electrode that has been processed to increase its surface area. In some cases, an electrode may be processed using an ultrafast laser to produce an electrode surface that includes macrostructures formed within the electrode surface and nanostructures formed on the macrostructures. The nanostructures may be formed of material that was removed from the electrode surface in forming the macrostructures.

Method for processing edge surface and edge surface processing apparatus

An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including grinding a second surface of a wafer, the second surface opposite to a first surface of the wafer being stuck with a surface protection material, forming a protective film on the first surface, irradiating a portion including an outside edge of the wafer with laser light to remove the portion including the outside edge in a state that the wafer is rotating and an irradiation position of the laser light is approaching to a rotation axis of the wafer, an absorption ratio of the wafer to the laser light being higher than an absorption ratio of the surface protection material to the laser light, and removing the protective film.

Laser welding method

A laser welding method includes emitting two laser beams along a weld line from an upper surface side of a workpiece, the two laser beams being transmitted through different optical fibers and having in-focus spot diameters of 0.3 mm or larger; emitting the laser beams such that a leading laser beam of the two laser beams and a trailing laser beam of the two laser beams are each inclined toward a direction in which welding proceeds at an incident angle with respect to a direction perpendicular to an upper surface of the workpiece, the leading laser beam being ahead of the trailing laser beam on the upper surface of the workpiece in the direction in which welding proceeds, the trailing laser beam being behind the leading laser beam; and setting the incident angle of the leading laser beam to be larger than the incident angle of the trailing laser beam.

System and method for manufacturing an airfoil

A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

Laser processing method and device

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S 11 and S 12 ) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S 13 and S 14 ) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

Laser Cutting Strengthened Glass

Methods for cutting strengthened glass are disclosed. The methods can include using a laser. The strengthened glass can include chemically strengthened, heat strengthened, and heat tempered glass. Strengthened glass with edges showing indicia of a laser cutting process are also disclosed. The strengthened glass can include an electrochromic film.

Optically Transparent Silk Hydrogels

The present application relates to silk fibroin-based hydrogels, methods for making and using the same. 161-. (canceled)62. A composition comprising:a plurality of crystalized silk fibroin spheres, wherein the crystalized silk fibroin spheres have an average diameter of between about 10 nm and about 150 nm,the plurality of crystalized silk fibroin spheres arranged together to form a freestanding hydrogel structure having at least 60% optical transmittance in the visible spectrum.63. The composition of claim 62 , the freestanding hydrogel structure having at least 95% transmittance in the visible spectrum.64. The composition of claim 62 , the freestanding hydrogel structure having a compressive modulus of between about 2 kPa and about 20 kPa when measured with a crosshead speed of about 2.0 mm/hr.65. The composition of claim 62 , wherein the silk fibroin is crosslinked.66. The composition of claim 65 , wherein the silk fibroin is crosslinked with a crosslinking agent.67. The composition of claim 66 , wherein the crosslinking agent is an amine-to-amine crosslinker claim 66 , amine-to-sulfhydryl crosslinker claim 66 , carboxyl-to-amine crosslinker claim 66 , photoreactive crosslinker claim 66 , sulfhydryl-to-carbohydrate crosslinker claim 66 , sulfhydryl-to-hydroxyl crosslinker claim 66 , sulfhydryl-to-sulfhydryl crosslinker claim 66 , or any combination thereof.68. The composition of claim 66 , wherein the crosslinking agent is EDTA.69. A composition comprising:nanosized crystalline particles comprising silk fibroin polypeptides having an average molecular weight of between about 3.5 kDa and about 120 kDa,the nanosized crystalline particles having an average diameter of between about 10 nm and about 150 nm,the nanosized crystalline particles arranged together to form a freestanding hydrogel structure having at least 60% optical transmittance in the visible spectrum.70. The composition of claim 69 , the silk fibroin polypeptides having an average molecular weight of ...

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

Self-aligned spatial filter

A spatial filter is made by forming a structure comprising a focusing element and an opaque surface, the opaque surface being disposed remotely from the focusing element in substantially the same plane as a focal plane of the focusing element; and by forming a pinhole in the opaque surface at or adjacent to a focal point of the focusing element by transmitting a substantially collimated laser beam through the focusing element so that a point optimally corresponding to the focal point is identified on the opaque surface and imperfection of the focusing element, if any, is reflected on the shape and position of the pinhole so formed.

METHOD FOR THE PREPARATION OF ALUMINIZED STEEL SHEETS TO BE WELDED AND THEN PRESS HARDENED

A method for the preparation of steel sheets for fabricating a welded steel blank is provided. The method includes procuring at least two pre-coated steel sheets, each having a pre-coating of an intermetallic alloy layer, topped by a layer of aluminum metal or aluminum alloy or aluminum-based alloy. The sheets have a principal face, an opposite principal face, and at least one secondary face. The sheets are positioned so a gap between 0.02 and 2 mm exists between the secondary faces. The secondary faces face each other. The positioning of the first and second sheets defines a median plane perpendicular to the principal faces. Layers of metal alloy are removed by melting and vaporization simultaneously on the principal faces, in a peripheral zone of the sheets, the peripheral zones being the zones of the principal faces closest in relation to the median plane. 1. A method for preparation of steel sheets to be used for fabrication of a welded steel blank , the method comprising the steps of:providing a pre-coated steel first sheet having a first steel substrate and a first pre-coating including a first intermetallic alloy layer in contact with the first steel substrate, topped by a first metal alloy layer of aluminum metal or aluminum alloy or aluminum-based alloy, the first sheet comprising a first principal face, a first opposite principal face and a first secondary face;providing a pre-coated steel second sheet having a second steel substrate and a second pre-coating including a second intermetallic alloy layer in contact with the second steel substrate, topped by a second metal alloy layer of aluminum metal or aluminum alloy or aluminum-based alloy, the second sheet comprising a second principal face, a second opposite principal face and a second secondary face;positioning the first and second sheets so that the first and second secondary faces face each other and define a median plane perpendicular to the first and second principal faces of the first; ...

DEVICE AND PROCESS FOR MARKING AN OPHTHALMIC LENS WITH A PULSED LASER OF WAVELENGTH AND ENERGY SELECTED PER PULSE

A device for marking an ophthalmic lens (), the lens () being made of at least one preset material, includes a laser () configured to produce permanent engravings on the lens () and configured to emit a focused beam of pulsed ultraviolet laser radiation that includes at least one radiation wavelength ranging between 200 nm and 300 nm, has a pulse length ranging between about 0.1 ns and about 5 ns, and has an energy per pulse ranging between about 5 μJ and about 100 μJ. A laser marking process configured to produce permanent engravings on an ophthalmic lens () via this device is also described. 1. A device for marking an ophthalmic lens , said ophthalmic lens being produced from at least one predetermined material , including a laser configured to produce permanent engravings on the ophthalmic lens , wherein the laser is configured to emit a focused pulsed beam of ultraviolet laser radiation , the focused beam having at least the following parameters:a radiation wavelength comprised between 200 nm and 300 nm;a pulse duration comprised between about 0.1 ns and about 5 ns; andan energy per pulse at the focal point comprised between about 10 μJ and about 80 μJ.2. The device as claimed in claim 1 , wherein the energy per pulse at the focal point is comprised between about 10 μJ and about 65 μJ.3. The device as claimed in claim 1 , wherein the energy per pulse at the focal point is comprised between about 10 μJ and about 60 μJ.4. The device as claimed in claim 1 , wherein the focused beam of ultraviolet laser radiation has a peak power comprised between about 2.5 kW and about 1 MW.5. The device as claimed in claim 4 , wherein the peak power is comprised between about 10 kW and about 100 kW.6. The device as claimed in claim 1 , wherein the focused beam of ultraviolet laser radiation has a pulse frequency comprised between about 100 Hz and about 10 kHz.7. The device as claimed in claim 6 , wherein the pulse frequency is comprised between about 100 Hz and about 1 kHz.8. The ...

Laser cutting method and apparatus thereof

The present invention relates to a laser cutting method and apparatus thereof. The method comprises the following steps of fixing a substrate to be cut on a base, processing a first alignment procedure via an image sensor, forming a first cutting channel on a first surface of the substrate by cutting the first surface via laser beams, flipping over the substrate to be cut and fixing the substrate on the base, processing a second alignment procedure via the image sensor, and forming a second cutting channel on a second surface of the substrate by cutting the second surface via laser beams. The method can achieve improvement to laser cutting quality and effectiveness of enhancing production.

Laser processing apparatus

A laser processing apparatus includes a beam splitting unit disposed between a pulsed laser beam oscillating unit and a condenser. The beam splitting unit includes a half-wave plate that rotates the plane of polarization of a pulsed laser beam, a birefringent lens that splits the pulsed laser beam that has passed through the half-wave plate into ordinary light and extraordinary light, the birefringent lens being formed by joining two kinds of crystalline bodies to each other across a curved plane of a concave surface and a convex surface, and a splitting angle adjusting unit that moves the birefringent lens in a direction orthogonal to the pulsed laser beam that has passed through the half-wave plate to change the angle of incidence with respect to the curved plane and adjust a beam splitting angle.

Device for drying coated stents

Various embodiments of methods and devices for drying coated stents in an oven are described herein.

Chemically Stable Visible Light Photoemission Electron Source

A method of producing electrons via photoemission comprising providing diamond doped p-type with boron, treating a surface of the diamond by exposing it to atomic hydrogen inside an ultrahigh vacuum chamber, illuminating the surface with photons, and extracting the photoemitted electons. A chemically stable visible light photoemission electron source comprising a diamond film having a surface terminated with hydrogen and a light source.

Structure body, structure body manufacturing method, and electronic apparatus

A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

Machining Metal Removal Control

A process is disclosed for controlling the length of chips or shavings on materials that is inherent to produce long undesired chips when machined. Based on the work piece configuration and surface area to machine a determined outlay and process application for a continuous scribe or arrangements of different scribe pattern or patterns for the part and or surface is selected to provide optimal chip control during the machining operation. Engineered Interruptions are applied to the work object prior to the machining operation to maximize optimal chip control. Controlling the depth of scribe of the laser is accomplished and managed through the interface of hardware, software and electronics. 1. A method of machining a work piece , comprising:emitting an energy beam onto a to piece to form a first cut in a spiral orientation along the work piece and having a defined space between adjacent spinal sections of the first cut;measuring a real-time cutting depth of the energy beam;generating a feedback signal representing the real-time cuffing depth; andmaking a second cut on the work piece with a cutting tool, the second out removing material from the work piece, the second cut being adjacent to where the first cut in the surface of the work piece was made by the energy beam, controlling the depth of the first cut made by the energy earn by adjusting, the position of the energy beam with respect to the work piece or adjusting the power supplied to the energy beam in response to the feedback signal, the depth of the first cut being from about 40% to about 60% of the depth of the second cut that remove material from the work piece, creating interruptions in the work piece with the first cut, the interruptions causing the material removed from the work piece by the cutting tool to break into pieces of a desired length, size of the defined space determining the desired length of the pieces.2. The method of in which adjusting the depth of the groove is accomplished by changing ...

LASER METAL DEPOSITION WELDING OF AUTOMOTIVE PARTS

A part, such as an automotive part, is provided. The part includes at least two work pieces of steel which are joined together at a weld seam which includes at least one of nickel and iron and is substantially entirely free of silicate islands. The part also includes a painted, phosphated or electrocoated coating which is bonded with at least a portion of the substantially entirely silicate island free weld seam. 1. A part , comprising:at least two work pieces that are made of a steel material;said at least two work pieces being joined together by a weld seam;said weld seam including said steel material of said at least two work pieces and including an additional material which includes only nickel or only iron or only nickel and iron;said weld seam being free of silicate islands; anda painted, phosphated, or electrocoated coating bonded with at least a portion of said weld seam.2. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only iron.3. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only nickel.4. The part as set forth in claim 1 , wherein said additional material of said weld seam includes only nickel and iron.5. The part as set forth in wherein said coating is a painted coating.6. The part as set forth in wherein said coating is a phosphated coating.7. The part as set forth in wherein said coating is an electrocoated coating.8. The part as set forth in wherein said coating is applied to said weld seam in an as-welded condition.9. The part as set forth in wherein no material of said weld seam is removed from said weld seam through material abrasion or chemical processes prior to said coating being applied to said weld seam.10. The part as set forth in wherein said weld seam is joined through a laser metal deposition operation.11. A part formed according to a process which includes the steps of:placing at least two work pieces of steel into a joint;directing a stream ...

Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide

A method for bonding a first silicon part to a second silicon part includes arranging the first silicon part and the second silicon part in direct physical contact on a surface in a thermal insulating structure; controlling pressure in the thermal insulating structure to a predetermined pressure; controlling temperature in the thermal insulating structure to a predetermined temperature using one or more heaters; and bonding the first silicon part and the second silicon part during a process period. The predetermined temperature is in a temperature range that is greater than or equal to 1335° C. and less than 1414° C.

Systems and methods for laser trimming dental aligners

A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.

IGNITION PLUG AND METHOD FOR MANUFACTURING IGNITION PLUG

An ignition plug such as a spark plug or a glow plug configured to ignite an air-fuel mixture in an internal combustion engine includes a mark that is formed of an oxide film generated on the surface of a metal member or is formed of the metal member and the oxide film. The mark is formed by promoting formation of the oxide film on the surface of the metal member or removing the oxide film through radiation of a laser beam onto the surface of the metal member. 1. A method for manufacturing an ignition plug configured to ignite an air-fuel mixture in an internal combustion engine , the method comprising:a preparation step of preparing a metal member that constitutes a part of the ignition plug; anda marking step of forming a mark that is formed of an oxide film or is formed of the metal member and the oxide film by radiating a laser beam onto a surface of the metal member.2. The method for manufacturing an ignition plug according to claim 1 , a first portion; and', 'a second portion having a reflectance higher than a reflectance of the first portion, and, 'wherein the mark compriseswherein the marking step comprises a first step of radiating the laser beam onto a portion on the surface of the metal member where the first portion is to be formed or a portion on the surface of the metal member where the second portion is to be formed.3. The method for manufacturing an ignition plug according to claim 2 , wherein the marking step further comprises claim 2 , after the first step claim 2 , a second step of radiating the laser beam onto the portion where the first portion is to be formed but the laser beam is not radiated in the first step or the portion where the second portion is to be formed but the laser beam is not radiated in the first step.4. The method for manufacturing an ignition plug according to claim 2 , wherein the marking step further comprises claim 2 , before the first step claim 2 , an underlayer forming step of forming an underlayer region by radiating ...

INTERPOSER AND METHOD FOR PRODUCING HOLES IN AN INTERPOSER

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10/K to 3.4×10/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip. 1. A method for producing holes in a board-shaped base substrate of an interposer which is adapted for electrical connection between a CPU chip and a circuit board , the method comprising the steps of:providing the board-shaped base substrate to be perforated, the board-shaped base substrate being made of glass;aligning laser beams to predetermined perforation points of the board-shaped base substrate;triggering focused laser pulses in a wavelength range between 1600 and 200 nm in which the glass is at least partially transparent and with a radiation intensity that causes local non-thermal destruction of the glass along filamentary channels at the predetermined perforation points; andwidening the filamentary channels to a desired diameter of the holes.2. The method of claim 1 , wherein the widening step comprises electro-thermal heating and evaporation of perforation material in the filamentary channels due to dielectric breakdowns.3. The method of claim 1 , wherein the widening step comprises directing reactive gases onto the filamentary channels.4. The method of claim 1 , wherein the widening step comprises etching.5. The method of claim 1 , wherein the board-shaped base substrate is made of a single layer of glass having a first and a second substrate surface.6. The method of claim 5 , wherein the board-shaped base substrate has transversely to the first and second substrate surfaces ...

Workpiece cutting method

An object cutting method includes: a first step of preparing an object including a single crystal silicon substrate and a functional device layer provided on a first main surface side; a second step of irradiating the object with laser light to form at least one row of modified regions in the single crystal silicon substrate and to form a fracture in the object so as to extend between the at least one row of modified regions and a second main surface of the object; and a third step of performing dry etching on the object from the second main surface side to form a groove opening to the second main surface. In the third step, in a state in which an etching protection layer having a gas passing region formed, is formed on the second main surface, the dry etching is performed by using a xenon difluoride gas.

COUNTER ELECTRODE MATERIAL FOR ELECTROCHROMIC DEVICES

Various embodiments herein relate to electrochromic devices, methods of fabricating electrochromic devices, and apparatus for fabricating electrochromic devices. In a number of cases, the electrochromic device may be fabricated to include a particular counter electrode material. The counter electrode material may include a base anodically coloring material. The counter electrode material may further include one or more halogens. The counter electrode material may also include one or more additives. 128-. (canceled)29. An integrated deposition system for fabricating an electrochromic device stack , the integrated deposition system comprising:a plurality of deposition stations aligned in series and interconnected and operable to pass a substrate from one station to the next without exposing the substrate to an external environment, wherein the plurality of deposition stations comprises(i) a first deposition station containing a first one or more material sources for depositing a cathodically coloring layer; wherein the second one or more material sources for depositing the anodically coloring layer comprise at least a first metal and a halogen, the second one or more material sources for depositing the anodically coloring layer optionally comprising one or more-additives,', 'wherein the first metal is selected from the group consisting of—chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), rhodium (Rh), and iridium (Ir), ruthenium (Ru), vanadium (V), and combinations thereof, and', 'wherein the optional one or more additives are selected from the group consisting of silver (Ag), arsenic (As), gold (Au), boron (B), cadmium (Cd), cesium (Cs), copper (Cu), europium (Eu), gallium (Ga), gadolinium (Gd), germanium (Ge), mercury (Hg), osmium (Os), lead (Pb), palladium (Pd), promethium (Pm), polonium (Po), platinum (Pt), radium (Ra), rubidium (Rb), terbium (Tb), technetium (Tc), thorium (Th), thallium (Tl), tungsten (W), and combinations thereof; and, '(ii) a ...

Method and device for etching patterns inside objects

Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

THREE-DIMENSIONAL STRUCTURES AND RELATED METHODS OF FORMING THREE-DIMENSIONAL STRUCTURES

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc. 26. A three-dimensional structure , comprising:a body having a first surface and a second surface, the first surface defining a first pattern of negative spaces that extend into and are further defined by the body, and the second surface defining a second pattern of negative spaces that extend into and are further defined by the body; andthe body further defining a combined negative space including each negative space of the first pattern of negative spaces in communication with each negative space of the second pattern of negative spaces.27. The three-dimensional structure of claim 26 , wherein:the first surface and the second surface are located at different positions on the body; andthe first surface opposes the second surface.28. The three-dimensional structure of claim 26 , wherein the body obstructs a line of sight through the combined negative space.29. The three-dimensional structure of claim 26 , wherein the three-dimensional structure forms a part of a housing for an electronic device.30. The three-dimensional structure of claim 26 , wherein the body comprises a metal.31. The three-dimensional structure of claim 26 , wherein the first pattern of negative spaces on the first ...

Method and device for providing through-openings in a substrate and a substrate produced in said manner

A method and device can create, with a laser beam, plural recesses in a substrate useful as an interposer, and a substrate produced thereby. A laser beam may be directed to the surface of a substrate. The duration of the laser beam effect is extremely short such that the substrate is only modified concentrically about the laser beam axis without reaching a substrate material recess. The laser beam is initially diverted by a transmission medium having a higher intensity-dependent refractive index than air, and subsequently reaching the substrate. Non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces; the refractive index also changes. The focus point of the laser beam moves between the outer surfaces of the substrate along the beam axis such that it reaches the desired modification along the beam axis without correcting the laser processing head in the z-axis.

LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A laser irradiation apparatus () according to an embodiment includes an optical-system module () configured to apply laser light (L) to an object to be irradiated, a shield plate () in which a slit () is formed, through which the laser light (L) passes, and a reflected-light receiving component () disposed between the optical-system module () and the shield plate (), in which the reflected-light receiving component () is able to receive, out of the laser light (L), reflected light (R) reflected by the shield plate (). 119-. (canceled)20. A laser irradiation apparatus comprising:an optical-system module configured to apply laser light to an object to be irradiated;a first shield plate in which a first slit is formed, through which the laser light passes; anda reflected-light receiving component disposed between the optical-system module and the first shield plate,wherein the reflected-light receiving component is positioned so as to receive, out of the laser light, first reflected light reflected by the first shield plate, andwherein the first shield plate is bent toward the optical-system module.21. The laser irradiation apparatus according to claim 20 , further comprising:a second shield plate in which a second slit is formed, through which the laser light that has passed through the first slit passes,wherein the reflected-light receiving component is further configured to receive, out of the laser light, second reflected light reflected by the second shield plate.22. The laser irradiation apparatus according to claim 20 ,wherein the reflected-light receiving component receives third reflected light, the third reflected light being light that is generated as the laser light that has been applied to the object to be irradiated is reflected by the object to be irradiated, andwherein an incident angle of the first reflected light differs from an incident angle of the third reflected light in a part of the reflected-light receiving component where the first and third ...

METHODS OF FORMING HOLES AND ETCHING SURFACES IN SUBSTRATES AND SUBSTRATES FORMED THEREBY

Methods capable of forming holes in, etching the surface of, or otherwise ablating substrates, and substrates formed thereby. A first method includes directing a first laser beam pulse towards a substrate to form a hole in a surface thereof and to form a plasma plume at least partially within the hole wherein the plasma plume has insufficient thermal energy and expansion velocity to etch sidewall of the hole, and directing a second laser beam pulse into the plasma plume to increase the temperature and expansion velocity of the plasma plume such that the sidewall is etched causing an increase in the cross-sectional dimension of the hole. A second method includes applying a liquid to a surface of a substrate, and directing a laser beam pulse into the liquid to create plasma on the surface of the substrate that etches portions of the surface of the substrate. 1. A method comprising:applying a liquid to a surface of a substrate; anddirecting a laser beam pulse into the liquid to create plasma on the surface of the substrate;wherein the plasma etches portions of the surface of the substrate.2. The method of claim 1 , wherein the liquid is water.3. The method of claim 1 , wherein the substrate is a composite comprising first and second materials claim 1 , and the plasma etches the first material and does not etch the second material.4. The method of claim 3 , wherein the first material is a matrix material and the second material is a fiber reinforcement within the matrix material.5. The method of claim 3 , wherein the first material is a polymer matrix material and the second material is a carbon fiber reinforcement within the matrix material.6. The method of claim 1 , wherein the laser beam pulse has a duration of between a few nanoseconds and one nanosecond.7. The method of claim 1 , wherein the substrate is formed of a conductive material.8. The method of claim 1 , wherein the substrate is formed of a non-conductive material. The present U.S. patent application is a ...

THREE-DIMENSIONAL STRUCTURES AND RELATED METHODS OF FORMING THREE-DIMENSIONAL STRUCTURES

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc. 125-. (canceled)26. A housing for an electronic device , comprising;a body defining an outer surface of the housing, the outer surface defining a first pattern of negative spaces that extend into and are further defined by the body; anda material combined with the body and defining an inner surface of the housing, the inner surface defining a second pattern of negative spaces that extend into and are further defined by the material;the first pattern of negative spaces intersect with the second pattern of negative spaces to form a combined negative space including a plurality of apertures defined by the body, the first pattern of negative spaces being offset relative to the second pattern of negative spaces.27. The housing of claim 26 , wherein the first pattern of negative spaces have a different size than the second pattern of negative spaces.28. The housing of claim 26 , wherein the first pattern of negative spaces have a different shape than the second pattern of negative spaces.29. The housing of claim 26 , wherein the material is disposed on a portion of the body.30. The housing of claim 26 , wherein the body comprises a metal.31. The housing of claim 26 , wherein the material ...

Planet carrier salvage process

A remanufactured planet carrier is disclosed having a first plate and a second plate spaced apart from and oriented generally parallel to the first plate. Supports join and support the first and second plates. The remanufactured planet carrier further has a plurality of first pin bores in the first plate and a plurality of second pin bores in the second plate. The first pin bores are parallel and generally aligned with the second pin bores. A cylindrical member extends from a central axis of the second plate away from the first plate with a shaft bore formed within the cylindrical member. The first and second pin bores and the shaft bore each have a surface layer with a hardness of at least about 180 BHN and a strength of at least about 500 MPa.

EARTH-BORING TOOLS HAVING PARTICLE-MATRIX COMPOSITE BODIES AND METHODS FOR WELDING PARTICLE-MATRIX COMPOSITE BODIES

Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate. 1. A method of joining a particle-matrix composite body of an earth-boring tool to a metallic body , the method comprising: forming a first bevel portion and a second bevel portion in a face portion of a weld groove; and', 'forming an overlapping interface at least proximate a root portion of the weld groove;, 'forming a joint between a particle-matrix composite body of the earth-boring tool and a metallic body of the earth-boring tool, comprisingheating a volume of the particle-matrix composite body within the weld groove to an elevated first temperature below the melting temperature of the matrix material of the particle-matrix composite body;heating at least a portion of the volume of the particle-matrix composite body within the weld groove with a welding torch to a second temperature greater than the melting temperature of the matrix material of the particle-matrix composite body;melting a metallic filler material;forming a weld bead to weld the metallic filler to the particle-matrix composite body and to the metallic body at the joint;providing the welded particle-matrix composite body, metallic filler ...

Laser light irradiating device

There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

Immersion laser fabrication method and system

The present invention discloses an immersion laser fabrication method and system, the method comprises providing a substrate with a first shape; disposing the substrate in a carrier, and a liquid is injected into the carrier; providing a laser source to generate a laser beam; cutting the substrate along a second shape by the laser beam based on an application program in order to separate the substrate into a main substrate and a sub-substrate, the sub-substrate is detached from the substrate and sinks to the bottom of the carrier, or the substrate is drilled by the laser beam based on the application program in order to form a hole and a derivative in the substrate, the derivative is detached from the substrate and sinks to the bottom of the carrier; and obtaining the main substrate, the substrate with the hole, or the main substrate with the hole.

Method for manufacturing a molding element by fritting with a completely planar unfritted portion, and corresponding molding element

The invention relates to a method of manufacturing a molding element for a tire mold. The molding element comprises a sintered part and a non-sintered part attached to the sintered part. The sintered part comprises a shell and a core internal to the shell and formed as one piece with the said shell. The core comprises a meshed structure comprising a plurality of cavities. The method of manufacture comprises a step of manufacturing the sintered part of the molding element from a metallic powder deposited on a flat surface of a support plate and fused layer by layer, the sintered part being attached to the support plate by fused metallic powder. The method also comprises a step of machining the support plate to form the non-sintered part of the molding element.

Laser processing method and laser processing apparatus

A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein at pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Device for Drying Coated Stents

Various embodiments of methods and devices for drying coated stents in an oven are described herein.

STEALTH DICING METHOD AND APPARATUS

The present disclosure provides a stealth dicing method and apparatus. With the method, the focusing element focuses the laser beam on the surface of material to be diced, and the dynamic-equilibrium plasma channel is formed in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced. The modified layer may be formed in the material to be diced throughout the plasma channel, so as to realize stealth dicing. 1. A stealth dicing method , comprises:generating, by a laser, a laser beam of femtosecond pulses, and focusing by a focusing element the laser beam on a surface of material to be diced to form light filament in the material to be diced, wherein a peak power of the laser beam is greater than a power threshold of forming the light filament in the material to be diced;generating a dynamic-equilibrium plasma channel in the material to be diced by means of self-focusing and defocusing effect of plasma generated by ionizing the material to be diced;forming a modified layer through the plasma channel to realize the stealth dicing of the material to be diced.2. The method of claim 1 , wherein the peak power of the laser beam is greater than 10W/cm.3. The method of claim 1 , wherein the plasma channel has a length in a range of 1-3 cm claim 1 , and has a diameter in a range of 10-100 μm.4. The method of claim 2 , wherein the plasma channel has a length in a range of 1-3 cm claim 2 , and has a diameter in a range of 10-100 μm.5. The method of claim 1 , wherein the material to be diced is at least one of silicon claim 1 , silicon carbide claim 1 , sapphire and semiconductor.6. The method of claim 2 , wherein the material to be diced is at least one of silicon claim 2 , silicon carbide claim 2 , sapphire and semiconductor.7. A stealth dicing method claim 2 , comprises:generating, by a laser light source, a plurality of laser beams of different wavelengths, and adjusting a direction and a spot size of ...

Orientation of interfacing projections

A method of joining a first component to a second component, the method comprising preparing the first component by forming an array of elongate projections on a bond surface of the component, each projection having a centreline, a tip, and a base. The centreline at the tip of each projection is oriented at an angle with respect to the normal to the bond surface at its base, and the angular orientation of the tip centrelines varies across the array of projections. Next, the first component and a flexible layer are brought together so as to embed the projections in the flexible layer before hardening the flexible layer to form the second component. Also, a joint so formed.

NEW PROCESS FOR PARTIAL MIRRORING OF GLASSES, AND GLASSES OBTAINED THROUGH THE PROCESS

A new method for partial silvering of spectacle lenses, and lenses obtained using said method. Applied to spectacle lenses comprising a varnished substrate on which one or several thin layers are arranged, uses a digitally controlled laser, said laser emitting through a solid fiber, the wavelength used being in the near infrared. When these lenses comprise three thin layers it is possible, by using the method according to the invention, to achieve partial silvering in which the laser has eliminated: the thin layers on a first part thereof, until reaching the varnished substrate, then the thin layers on a part thereof, revealing a part of the thin layer, and lastly the thin layer, on a part thereof, revealing a part of the thin layer. 1. A method allowing the partial silvering , or etching , of spectacle lenses , in particular solar lenses , comprising a varnished substrate on which one or several thin layers are deposited , where each thin layer is made up of evaporable materials , generally having a reflective effect , and commonly used in vacuum sunglass treatments , characterized in that it consists of using a digitally controlled laser , said laser emitting through a solid fiber , made from a metal belonging to the rare earths according to the periodic table of elements , the wavelength used being in the near infrared.2. The method according to claim 1 , wherein the metal belonging to the rare earths is ytterbium.3. The method according to claim 1 , wherein said wavelength is between 1 claim 1 ,000 and 1 claim 1 ,100 nm.4. The method according to claim 3 , wherein said wavelength is between 1 claim 3 ,050 and 1 claim 3 ,070 nm.5. The method according to claim 1 , wherein the beam of said laser has a diameter between 18 and 30 microns.6. The method according to claim 5 , wherein said diameter is about 25 microns.7. The method according to claim 1 , wherein said reflective effect is obtained owing to a thin layer made from a reflective metal.8. The method ...