03-02-2022 дата публикации
Номер: US20220032406A1
A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn. 1. A solder alloy having an alloy composition consisting of , in mass % , Ag: 0 to 4% , Cu: 0.1 to 1.0% , Ni: 0.01 to 0.3% , Sb: 5.1 to 7.5% , Bi: 0.1 to 4.5% , Co: 0.001 to 0.3% , P: 0.001 to 0.2% , and a balance being Sn.2. The solder alloy according to claim 1 , wherein the alloy composition satisfies the following relationships (1) and (2):{'br': None, '0.50≤(Ag+Cu)×(Sb+Bi)×(Ni+Co+P)<7.0 \u2003\u2003(1)'}{'br': None, '0.17≤Co/P≤65 \u2003\u2003(2)'}wherein, Ag, Cu, Sb, Bi, Ni, Co, and P each represent a content (mass %) thereof in the alloy composition.3. A preform comprising the solder alloy according to .4. A paste comprising the solder alloy according to .5. A solder joint comprising the solder alloy according to .6. A preform comprising the solder alloy according to .7. A paste comprising the solder alloy according to .8. A solder joint comprising the solder alloy according to . This application claims the benefit of Japanese Priority Patent Application JP 2020-130472 filed on Jul. 31, 2020, the entire contents of which are incorporated herein by reference.The present technology relates to a solder alloy, in particular, a lead-free solder alloy.In recent years, car electronics has been improved for motor vehicles, and motor vehicles are shifting from gasoline vehicles to hybrid vehicles and electric vehicles. Hybrid vehicles and electric vehicles are equipped with an in-vehicle electronic circuit that has electronic components soldered to a printed circuit board. The in-vehicle electronic circuit used to be disposed in a vehicle interior in a relatively gentle vibration environment, but with the expansion in application, has been mounted directly in an engine room, in an oil chamber of a transmission, or even on a mechanical device.As described above, ...
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