SUBSTRATE INSPECTION METHOD AND SUBSTRATE INSPECTION SYSTEM USING SAME
The present invention refers to substrate inspecting method relates to cleaning system using the same and, more particularly increases the efficiency of and inspection sensor case fixed in the hole, by which a board can be using the same and method relates to cleaning system. Generally, in the electronic device at least one printed circuit board (printed circuit board; PCB) the frame is installed at the, this printed circuit circuit pattern from the printed circuit board, connection pads part, said connection pads part is electrically connected to driving chips and the like type of items, various circuit elements is mounted in. Such said printed circuit board, bare pad area of the substrate after the application the unit using PSTN, application area lead to terminals of electronic components manner that bundle is produced. Conventional, mounted to a printed circuit board electronic components prior to, temperature is lower than the reference unit using PSTN pad area of printed circuit board is applied whether inspecting a solder paste inspection (solder paste inspection, SPI) process is performed, electronic components after the mounted to a printed circuit board, said part 1 on the printed circuit board is mounted opposite direction of the spring force direction the various types detecting a defect of a automatic optical inspection (automated optical inspection, AOI) came process is undertaken. However, said printed circuit board such as the stomach prior to an inspection signals Q5 and Q6, following readout soldering (soldering) a bare substrate which cannot check, such converting the ion beam into a for mounting electronic part even when clock and letter receipt and key or non-inserting state generation of failure such as as well as increasing the likelihood that the, bare substrate initially for a bad path mounting electronic components includes guiding a sticker indicating the article would yield a goods and rejected goods the process is performed, and inspection sensor case fixed in the hole by this efficiency of. Therefore, the present invention is the problem of sensor case fixed in the hole and inspection increases the efficiency of method, by which a board can be provides by a rope.. The present invention on the other side if the second voice is inputted, increases the efficiency of and inspection sensor case fixed in the hole are laminated under the substrate support by a rope. light source. One exemplary embodiment of the present invention according the method LCD monitor, mounted parts of (mounter) mounter is used to produce a substrate (work stage) and transporting the work stage step, checking (warpage) warpage of said substrate, said substrate is said inspection result if it is good and transporting the mounter said said substrate and said inspection result if a decision is made that the production costs or poor substrate said said substrate and poor not transferring said mounter includes ascertaining. One embodiment to exemplify, [...] the step of said substrate, said substrate determining whether there [...], if there is not a [...] said substrate said determining to substrate with good, [...] in the presence of said substrate said step the comparison voltage magazine substrate, said substrate when finishes a burr by forcibly pressing a degree magazine, and said clock controller outputs an substrate with good said substrate has a value outside the allowable range when the degree of magazine, said determining is also low substrate may include. The the substrate inspecting method, [...] in the presence of said substrate, said substrate prior to a the comparison voltage magazine, said substrate, and displaying the 3 dimensional Image [...] may further include any. One embodiment to exemplify, the substrate inspecting method, said substrate is said inspection result if it is good, said substrate warpage of step of transmitting to a mounter said information may further include any. For example, said coordinate information warpage information warpage, warpage shape information, information warpage by regions, in respect of enhancing, warpage degree information may comprise an at least one. The, said mounter according to information warpage from cascade or chain structure and said corresponding result feedback information for corresponding result information corresponding and additional statistical analysis for performing report scheme may further include any. One embodiment to exemplify, the substrate inspecting method, said substrate onto a part of the region of the remaining region [...][...] present invention is also directed to said is not present or when as to create an excellent finishes a burr by forcibly pressing a, said clock controller outputs an good part substrate and said substrate said inspection result thereof if it is good, said substrate an exfoliation layer and transferring to said mounter may further include any. Furthermore, the substrate inspecting method, said inspection result thereof if it is good said substrate, said substrate warpage of said information step of transmitting to a mounter can further include, for example, available for dependency or mounting by regions, in respect of enhancing information said warpage may include a command field. One embodiment to exemplify, the substrate inspecting method, prior to the step of [...] said substrate, said height of a substrate to obtain information and can further include the step of, [...] the step of said substrate, said height of a substrate obtained be on the basis of information determined. For example, height of a substrate said step to obtain information, said substrate in a cross pattern optical the step of irradiating the packaging material, said reflected by said substrate pattern of optical grating pattern and capturing an Image of said obtained pattern by using the pixel block of the height of a substrate said includes calculating the information can be. One embodiment to exemplify the substrate inspecting method, prior to the step of [...] said substrate, said are on the surface of a substrate more recognition at least two measuring the distance between the marks may further include any step. In this case, [...] the step of said substrate, said recognition mark distance between and comparing the reference distance may include. Another exemplary embodiment of the present invention: a substrate inspection system transfer unit work stage, includes transfer section mounter and inspection warpage. Said mounted parts of mounter the second transfer unit work stage is used to produce a substrate with the wheels 25 to convey work stage. Said substrate said stopped warpage [...] the arc determined by a line the substrate. The second transfer unit mounter said said substrate is said of the result of checking a inspection warpage if it is good, with the wheels 25 to convey said mounter said substrate. One embodiment to exemplify, said stopped warpage, said substrate determining whether there [...] judging section warpage, [...] in the presence of said substrate said substrate magazine the comparison voltage [...] a warpage check section and said substrate and if there is not a degree magazine member finishes a burr by forcibly pressing said substrate when said clock controller outputs an substrate with good, degree magazine said substrate when said substrate has a value outside the forcibly pressing a lower end of the an that the propriety a substrate capable of being detected by using a. has first and second detecting electrodes disposed. That the propriety determining unit detects said substrate, said substrate onto a part of the region of the remaining region [...][...] present invention is also directed to said is not present or when as to create an excellent finishes a burr by forcibly pressing a, said substrate can be clock controller outputs an good part, said said substrate inspection system command field available for dependency or mounting by regions, in respect of enhancing substrate including warpage said mounter for transmitting at least one information may further include any transmission element. For example, said stopped warpage, said 3 dimensional Image [...] substrate a display unit may further include any. For example, said display part displays, said substrate part shape displaying displaying-dimensional shape 3, displayed said substrate composition containing them display that control a shaping dimensional 3 and said substrate, and generates a control signal to a warpage [...] information display section may comprise an. One embodiment to exemplify, said substrate inspection system, said height of a substrate to obtain information further information acquisition part height may include. The, said stopped warpage, said height information acquisition part obtained by height of a substrate on the basis of information determined [...] inspection the substrate. For example, said height information acquisition part a, said light in a cross pattern substrate a projection part, said reflected by said substrate pattern of optical grating pattern and camera capturing an Image of said pattern obtained using Image information conveniently by calculating the height of a substrate said control unit may comprise an. One embodiment to exemplify, said substrate inspection system, said at least two are on the surface of a substrate more recognition between the marks measuring the distance the infrared lamp may include further, said warpage distance between recognition mark said stopped as compared to reference distance [...] inspection the substrate. And said stopped warpage, said mounter from warpage according to information received from the remote system feedback information for result corresponding, said corresponding result information for corresponding and additional statistical analysis report scheme can be. According to the present invention, substrate of the substrate before for mounting chips in to a measurement system for examining a [...], defect a decision is made that the mounter substrate and transfers them to an and poor not by pre-enters a command to, produce, and discharges, unwanted rotational brackets is formed to the productivity of the product and inspection can be increases the efficiency of. Furthermore, shape of the substrate the test the [...][...] and by, and generates a control signal to, [...] generated on the substrate is communicated with the discharge line, and an which enables a person to check for, using of the pre-determined entry tool that is displayed from the magazine and modulating shapes of substrates can be to set the allowable range. Also Figure 1 shows a one embodiment of the present invention based on a received substrate inspecting method is flow indicating a. Figure 2 shows a substrate inspecting method one regulation of the process whereby inspecting [...] conductive material of a substrate at various is of Figure 1 represent one embodiment. Also Figure 3 shows a one embodiment of the present invention based on a received cleaning system indicating a is general outline. Figure 4 shows a cleaning system warpage of one example of inspection of Figure 3 also is indicative of the block. Figure 5 shows a warpage for display unit inspection by being realized in effect of screen shown one example is a it is shown a concept of Figure 4. Modification of the present invention refers to various variety of forms that can apply may have a low bar, in the embodiment illustrated herein, and specific drawing are rapidly and to reduce a memory.. However, the present invention with a particular disclosure of the physical shape not defined to be, included within the scope of the present invention all changing a concept and techniques, including replacement water and equalization should understood. Various elements a set of terms, such as number 1, number 2 describes which may be used; however, said components are said terms is don't is defined by. Said terms are components of one an object from other components is carried out by using an acidulous only. For example, rights of the present invention without a wireless type through a wire number 1 number 2 component can be designated components, similarly number 2 number 1 component elements can be designated. The present application only a term use in a particular in the embodiment describes used to to be, is not intending to be defining the present invention. Contextually representation a plurality of differently it is apparent that without the carelessly, includes multiple representations. In the present application, "comprising" or "having." a specification described features a set of terms, such as, number, step, operation, components, discrete parts or a combination of these is designates the feature to which is present does, number to execute another aspect of one or more, step, operation, components, or a combination of these discrete parts existence of a without excluding the possibility or additionally pre should understood. Other is not defined, technical or scientific for a term including to the all terms are person with skill in the art in the present invention is in the field of the upwardly urged by equivalent to those that would have been understood photopolymerization initiator represented by chemical. Generally are defined as the dictionary used for, such as terms are contextually purpose :, and a semantic having meaningful whose initial Letters match the must be interpreted to, the present application, become manifest in a do not define, excessively or is ideal for the widest sense of the formal does not interpreted. Hereinafter, in reference to drawing based on a text content of the, . rapidly and to reduce a memory to more of the present invention preferred embodiment. Also Figure 1 shows a one embodiment of the present invention based on a received substrate inspecting method is flow indicating a. Also with a 1, one embodiment of the present invention for inspecting a substrate according to the, first parts of (mounter) mounter is used to produce a mounted with the wheels 25 to convey work stage substrate (work stage) (S110). Furthermore, for inspecting the substrate warpage of said (warpage) (S120). Said substrate from said substrate is initially [...] when for defect, said pattern including a bond finger and a after fabrication substrate the heat source equipment has an, said thickness of the wafer for a size that is thin in relation to when the child may may be viewed in. The, present or reduces bending and said substrate by is in existence, the sag may appear said [...]. Next, said inspection result if a decision is made that the substrate is good to said substrate with the wheels 25 to convey said mounter (S130). Specifically, good by said warpage inspection (S120) if the result of the determination is to said upper and side surfaces with said substrate is transported to a mounter, performs work for mounting chips. Furthermore, said inspection result if a decision is made that the production costs or poor substrate said said substrate and transfers them to an said mounter. ascertaining and poor not (S140). Specifically, a defect (S120) inspection warpage said if a decision is made that the substrate as the conventional said mounter for mounting chips is transported to a without having to perform a work, . ascertaining of immediately carrying. Therefore, [...] a histogram for mounting chips to perform the task by ascertaining defect all, said said on a substrate of a part using a mounter american shovel or clock and letter receipt and key during wearing the nozzles generating, said to a substrate the size of wafer based upon inspection error signal is generated to a. rotational brackets is formed to be. Figure 2 shows a substrate inspecting method one regulation of the process whereby inspecting [...] conductive material of a substrate at various is of Figure 1 represent one embodiment. Also refers to surface 2, regulation of the process whereby said substrate one embodiment to exemplify [...] inspecting, said substrate first checked whether the searched neutral vowel exists [...]. (S122). Said a whether there [...], in one example, 3-dimensional shape detecting is obtained through the Image data be based on. One embodiment to exemplify, prior to inspecting a [...] said substrate, said height of a substrate can be obtained information has been previewed. A process for the inspection [...] said substrate, said height of a substrate obtained be on the basis of information determined. For example, said height of a substrate information in order to obtain, in a cross pattern irradiated with light, said substrate, said substrate said reflected by pattern of optical grating pattern after obtaining the Image, using Image pattern obtained said height of a substrate said can be information is determined. The, said substrate is irradiated with the V-shaped grooves N the fixing grating light can be performs multiple such (N the natural number equal to or greater than 2), said height of a substrate information bucket algorithm (bucket algorithm) .can be calculated using. On the other hand, prior to inspecting a [...] said substrate, said are on the surface of a substrate at least two recognition mark distance between.. In this case, a process for the inspection [...] said substrate, said recognition mark distance between performed by comparing the reference distance be. Said substrate as judgment result of whether or not the presence [...] said substrate said [...] an absence of either the. clock controller outputs an substrate with good. Specifically, inspection result warpage said [...] said substrate a device if a decision is made that the, said. clock controller outputs an substrate with good. * Furthermore, [...] the in the presence of said substrate, said substrate (S126) checks the degree magazine, said substrate member finishes a burr by forcibly pressing degree magazine when said clock controller outputs an substrate with good, said substrate has a value outside the degree magazine when forcibly pressing a lower end of the, . capable of being detected by using a an said substrate. As said results the comparison voltage magazine said substrate, said substrate member finishes a burr by forcibly pressing degree magazine in said substrate is if it is good, said substrate with the wheels 25 to convey said mounter (S130). The, said rule and a [...] said information about the judgment result (hereinafter, "warpage information" assembling and welding steps) for said mounter which enable a, said information warpage, warpage coordinate information, information on the shape of each piece warpage, by regions, in respect of enhancing information warpage, warpage may include a degree information, and the like. Furthermore, said substrate onto a part of the region of [...][...] present invention is also directed to other areas is not present or when excellent finishes a burr by forcibly pressing a, said good current so as component mounting areas, in this case said substrate said clock controller outputs an good part can be transferring the mounter (S130). The, said information warpage which enable a mounter, said information warpage, warpage coordinate information, information on the shape of each piece warpage, by regions, in respect of enhancing information warpage, warpage degree information, such as command field available for dependency or mounting by regions, in respect of enhancing may include a. On the other hand, said substrate prior to the comparison voltage magazine (S126), said substrate [...] second priority data is generated, the 3 dimensional Image (S124). Said allowable range for cheking and degree of warpage said establishment of the reference and input on the middle of the on the basis of information determined automatically through computer or the like, and further be. Which, unlike is, said allowable range for cheking and degree of warpage said establishment of said 3 dimensional Image based on the displayed directly, in the sense to manually operator may. Hereinafter, said inspection a substrate such as a method for carrying out embodiment of cleaning system thereby, the cold air flows rapidly and to reduce a memory with reference drawing.. Also Figure 3 shows a one embodiment of the present invention based on a received cleaning system indicating a is general outline. Also with a 3, one embodiment of the present invention: a substrate inspection system (100) the work stage transfer unit (110), a weigher inspection section warpage (120) and mounter transfer unit (130) includes. Said transfer unit work stage (110) mounting the electronic component the mounter (PT) (MT) (BD) substrate is used to produce a. stage is transferred to the a work. Said transfer unit work stage (110) has door 1 and 2 shown in the course of transportation of the electronic stage said work substrate can be a (S110). A weigher inspection section warpage said (120) the substrate (BD) of said substrate (BD) [...] the. arc determined by a line. A weigher inspection section warpage said (120) has door 1 and 2 shown in of a product by automatically measuring a [...] said substrate can be a (S120). Figure 4 shows a cleaning system warpage of one example of inspection of Figure 3 also is indicative of the block. Also refers to surface 4, one embodiment to exemplify, said warpage inspection (120) the warpage judging section (122), warpage check section (124) and substrate that the propriety judging section (126) may comprise an. Said warpage judging section (122) (BD) to the substrate [...]. checked whether the searched neutral vowel exists. Said warpage judging section (122) has door 1 and 2 shown in said substrate (BD) [...] to the step S118 is returned to decide whether there can be a (S122). Said warpage check section (124) (BD) to the [...] in the presence of substrate, to check degree magazine of said substrate (BD). Said warpage check section (124) has door 1 and 2 shown in said substrate (BD) of the process the comparison voltage magazine can be a (S126). Said substrate that the propriety judging section (126) of the substrate (BD) [...] (BD) and if there is not a degree magazine of said substrate when said substrate finishes a burr by forcibly pressing a clock controller outputs an good (BD), (BD) degree magazine of said substrate when said substrate has a value outside the (BD) by forcibly pressing a lower end of an. of being detected by using a laser. Said substrate that the propriety judging section (126) has door 1 and 2 shown in (S120) of a product by automatically measuring a [...] said substrate in the step S118 is returned to decide that the propriety of the substrate is substantially equal to and the contents stored in the database can be. A weigher inspection section warpage said (120) the, said substrate (BD) of the diode sensor has an end connected-time, and is displayed as dimensional Image 3 [...] (128) may include further. Figure 5 shows a warpage for display unit inspection by being realized in effect of screen shown one example is a it is shown a concept of Figure 4. Also refers to surface 4 and 5, said display unit (128) has door 1 and 2 shown in said substrate (BD) of the display device comprises the dimensional Image 3 (S120) [...] can to perform a process, such as screen of monitor device (monitor) (28) to said 3 dimensional Image can be the display. One embodiment to exemplify, said display unit (128) a shape display unit (128a), display composition containing them part (128b) and warpage information display section (128c) may comprise an. Said shape displaying part (128a) by the operator and delivers a degree magazine of said substrate (BD) to facilitate or shape the output displayed to the 3 said substrate (BD) of a display-dimensional shape. One embodiment to exemplify, also 5 such as shown in screen of monitor device (monitor) (28) to said substrate (BD) of 3 dimensional shape (28a) can be the display. Said display composition containing them part (128b) the displayed substrate (BD) the time of observation of the direction and scale factor or the like entered by the operator automatically displayed the network server computer does not (BD) of said substrate 3 dimensional shape (28a) regulating the. One embodiment to exemplify, also 5 such as shown in screen of monitor device (monitor) (28) composition containing them displayed on a tool (28b) using an operator to device inputs such as a mouse or keyboard or touchscreen input method through input based on the manner in the frame with attached wire/wireless (BD) substrate 3 dimensional shape (28a). capable of modulating. For example, said composition containing them tool (28b) of the first using tools said substrate (BD) the time of observation of the direction and the, said said composition containing them tool (28b) is positioned at a lower part of and a tool for centering are using magnification of said substrate. capable of modulating (BD). Said information display section warpage (128c) [...] of the substrate, and generates a control signal to the (BD). One embodiment to exemplify, also 5 such as shown in screen of monitor device (monitor) (28) to (Warpage Result) result warpage, shrinkage result (Shrinkage Result), maximum warpage including warpage information (Max Warpage) or the like (28c) station is able to display the.. Said warpage result measuring a magazine present in said substrate (BD) (BD) a maximum height of said substrate as a result, minimum height, the difference between the height, can include a such as offset (offset), said substrate (BD) are engaged with each said shrinkage results information as information shrinkage also, offset axis direction X, Y may include a offset axis direction. Said substrate (BD) as said maximum [...] magazine allowable range for the type of the predetermined value or automatically-calculated which is capable of displaying the value, is separately together or which, unlike input is communicated with the discharge line, to determination to remove the. 4 also again refers to surface, said mounter transfer unit (130) the warpage inspection (120) of the result of checking a good (BD) if a decision is made that the to said substrate, said substrate for said mounter with the wheels 25 to convey (MT) (BD). Said mounter transfer unit (130) has door 1 and 2 shown in said substrate (MT) to the course of transportation of the electronic (BD) for said mounter can be a (S130). On the other hand, the (MT) mounter said, described in Figure 2, said warpage. capable of receiving information. Said mounter said received (MT) based on information warpage said substrate and can be manufactured (PT) mounting a component onto a (BD), said speed of head comprising the corresponding warpage, .can be tailored for room to guide the. Furthermore, the (MT) mounter said parameters and outputs the result information according to said corresponding information warpage solder test equipment (not shown) can be fed back into the. In this case, a test equipment solder said corresponding said result information which to be located at the upper part, or further statistically analyzes can be to derive a corresponding scheme. Corresponding additional measures, for example, (BD) of said substrate in said substrate member finishes a burr by forcibly pressing degree magazine (BD) if it is good, or (BD) onto a part of the region of said substrate [...] present invention is also directed to other areas [...] is not present or as to create an excellent finishes a burr by forcibly pressing a user, so that the user's state (MT) mounter but transmitted to said corresponding information, in said mounter (BD) in a specific area of substrate (BD) or substrate (BD) attenuates if not avoids package can be is generated. the unit down to a predetermined allowable range can be L. Furthermore, before inspection warpage speed of head from said mounter (MT), height, maximum-collecting in letter form mounting angular information delivery under an externally applied information contained in the corresponding result information of the head comparison with request number to the memory and displays which, a decision is made that the displays, or parameters and outputs the result information transmitted back to said mounter (MT) may be loaded with. One embodiment to exemplify, said cleaning system (100) the, height of to obtain information (BD) said substrate height information acquisition part (140) may include further. The, said warpage inspection (120) the, said height information acquisition part (140) (BD) substrate obtained by (BD) of height information based on the inspection [...] of said substrate. For example, said height information acquisition part (140) has a projection portion (142), camera part (144) and the control unit (146) includes. Said projection part (142) the substrate (BD) irradiates the light in a cross pattern. Said camera part (144) the substrate (BD) reflected by capturing an Image of said pattern of optical grating pattern.. Said control unit (146) the said using Image pattern obtained (BD) calculates an height information of said substrate. Said height information acquisition part (140) has door 1 and 2 for measuring height shown in selected from a group consisting of silicon. One embodiment to exemplify, said cleaning system (100) the, said substrate (BD) formed on between the marks or more identification at least two measuring the distance the infrared lamp (not shown) may include further, a weigher inspection section warpage said (120) the recognition mark distance between reference distance (BD) as compared to a inspection [...] of said substrate. Inspection a substrate such as a sheet of said method and substrate inspection system, for mounting chips in substrate of the substrate before to a measurement system for examining a [...], defect a decision is made that the mounter substrate and transfers them to an and poor not by pre-enters a command to, produce, and discharges, unwanted rotational brackets is formed to the productivity of the product and inspection can be increases the efficiency of. Furthermore, shape of the substrate the test the [...][...] and by, and generates a control signal to, [...] generated on the substrate is communicated with the discharge line, and an which enables a person to check for, using of the pre-determined entry tool that is displayed from the magazine and modulating shapes of substrates can be to set the allowable range. Reticle the present detailed description of the invention but of the present invention preferred embodiment are described in reference to, corresponding art is a classic mirror server one skilled in the art with knowledge of the conventional to the technical field or a claim of the present invention is be refers to grow concept and techniques region within such a range that causes no away from the present invention various modified and change is even would be able. Therefore, the aforementioned elucidation and below the drawing of the present invention defining a slimly examples of the present invention which was not should interpreted to. 100: cleaning system 110: stage transfer unit 120: warpage inspection 122: warpage judging section 124: warpage check section 126: judging section that the propriety substrate 128: display unit 128a: shape displaying part 128b: display composition containing them part 128c: warpage-information presenting unit presents sub- 130: mounter transfer unit 140: height information acquisition part BD: substrate MT: mounter To inspect a substrate, firstly, a substrate, before a component is mounted by a mounter, is transmitted to a work stage. After that, the warpage of the substrate is inspected. Next, if the inspected substrate is determined to be good, the substrate is transferred to the mounter. If the inspected substrate is determined to be bad, the substrate is not transmitted to the mounter and then it is confirmed to be bad. Therefore, an unnecessary process is prevented. The productivity of products and the efficiency of inspection can be improved. COPYRIGHT KIPO 2016 Mounter mounted parts of (mounter) bare substrate (work stage) is used to produce a step and transporting the work stage; said bare substrate warpage of checking (warpage); said substrate is bare said inspection result if it is good, bare said step and transporting the mounter said substrate; and said bare said inspection result if a decision is made that the production costs or poor substrate, said bare substrate and transfers them to an said mounter step of ascertaining and poor not including substrate inspecting method.
