APPARATUS FOR TREATING SUBSTRATE
Device and method relates to the present invention refers to for treating substrate, heat treating the as-various kinds of substrate relates to device and method. Semiconductor device and electrophotographic process for its manufacture is flat display panel, etching, ashing, thin film deposition, and cleaning process of a polyimide resin, such processes are is carried out. This process are robot for transferring substrate one to a processing section substrate are sequentially and to transport at, each processing a web part manager traces which one substrate or plurality of for processing a substrate treating a. E.g., partial flow and returning it to the coating treatment substrate electrophotographic equipment is installed a photoresist layer is formed on the substrate, and returned into the exposure of the substrate is carried out processing unit wherein processing photoresist, a development process is performed to a processing section tearoom waitress seat screen developing the ALIGN key or an exposure and returned into the. Generally a photo process, the before and after the process is performed for thermally processing substrates a bake process is carried out. Bake process surface to load the substrate on the heating plate, heating via a heater unit and is heated same substrate. Heating plurality of heating plate revolved provided, heating zones are provided in heating plate respectively through heater is heating. However heating zone, the or an alien substance from an electric gun, erroneous judgement of a robot during a coordinate abnormal substrate due to. the syringe may be seated. Thereby is processing is heated non-uniformly substrate. Purified from each heating zone to measure the temperature sensors is provided. Heating each sensors are and to measure the temperature of some, the measuring values in maximum. value is computed in a difference between and a minimum value. The difference value higher than a reference value setting if it is determined that the, same clock controller outputs an abnormal state, generate caustic alarm. However also, such as 1, some substrates (W) the flat bottom is not provided, rounding is provided. Thereby been seated despite normal (W) substrate, substrate center region and corresponding temperature and edge region a heating zone temperature corresponding to a heating zone ., a difference is caused. Also thereby, such as 1, substrate (W) normal despite been seated, caustic generated abnormal substrate is a worker gives an alarm due to an intrinsic may occur when a can be confusing alarms and, folding actual substrate it is difficult to distinguish between.. The present invention refers to the face of each projection, obtained a rest to the substrate provided rounding to measure the device and method provides.. Caustic while being safely seated at normal substrate is in addition the present invention refers to that a receiving call is generated alarm the. provides device and method. In addition the present invention refers to folding actual alarm state is-nested is unusual that a receiving call is generated.. provides device and method. Heat treating the as-a substrate of the present invention embodiment provides device and method. Substrate processing device on an upper face of the plurality of heating zone has, that a substrate is placed the heating plate, , said to heat each of the subzones and heating said heating plate which is positioned within the heater, said heating of the subzones and each respective temperature through the measuring region, and said measurement member providing a and the temperature value measured from said one side of the substrate containing an control for determining, said pair said heating plate central axis which face is positioned opposing each other and, heating said different to measure the temperature zone number 1 number 2 sensor and a temperature sensor comprising a sensors, said number 1 sensor is installed in the inside of said controller and the temperature value and number 1 number 2 sensor is installed in the inside of said number 2 number 1 based on temperature value for the difference value. received diagnostic message to determine a status of said substrate. Said controller provided in said number 1 difference when cross point is, said one side of the substrate in a steady state clock controller outputs an, said differential value is said number 1 surface values of allowable range, said substrate guide includes two guide members can be clock controller outputs an abnormal state. Said number 1 said number 2 sensor and said sensor are equally spaced a heating plate out from the centre axis can be positioned. Said number 1 sensor and said sensor said number 2 heating plate edge region is located, said central heating plate said temperature sensor is placed in the area number 3 is includes a bonding agent flexible at, said number 2 said number 1 said controller and the temperature value and temperature value or said number 3 a sensor is installed in the inside of said differential value is number 2 number 3 temperature value for the even values of allowable range, said substrate guide includes two guide members can be clock controller outputs an abnormal state. Said temperature sensor said heating plate interval and made of quartz or Telfon, a face is positioned opposite to said number 3 sensor and includes a bonding agent flexible at number 4 is, said number 4 said controller and the temperature value said number 3 and number 4 sensor is installed in the inside of said differential value is number 3 value for the temperature values of allowable range surface, said substrate guide includes two guide members can be clock controller outputs an abnormal state. Substrate processing method heating plate heating the substrate mounted onto the sidewall by, heating plate for clearing nozzles of each respective temperature of the subzones and formed through the measuring region step, during of the subzones and heating said heating plate said symmetrical about the central axis of the subzones and a heating is positioned in the temperature differences between value of the capsule endoscope is calculated calculation step, and said temperature difference from said substrate state of safe arrival by the safe includes regular to decide, the controller reads the cross point is said temperature difference when provided in, said substrate state of safe arrival by the safe clock controller outputs an a normal state, said temperature differential value is said allowable range values of surface, said substrate guide includes two guide members can be clock controller outputs an abnormal state. The controller reads the of the subzones and heating said heating plate central axis during said asymmetric is positioned in a heating of the subzones and said differential value is external air even values of allowable range, in a steady state of said substrate can be clock controller outputs an, the calculation step said during said heating of the subzones and said heating plate edge is placed in the area heating zone temperature of central heating plate said difference value is placed in the area heating zone than. to be calculated and preferentially. According to the example of the present invention embodiment, substrate center region and edge region folding the normal supply by discriminating the separating, to the substrate provided rounding the face of each projection, obtained to measure the rest can be. Figure 1 shows a also having a round face of each projection, obtained when that a substrate is placed which are intended to be the cross show a state in which the.. Figure 2 shows a substrate processing equipment also. plane from the looked from above. Figure 3 shows a A-A equipment is surface door looked in the direction of Figure 2. Figure 4 shows a B-B equipment is surface door looked in the direction of Figure 2. Figure 5 shows a C-C equipment is surface door looked in the direction of Figure 2. Figure 6 shows a substrate supporing unit a is cross-sectional drawing of Figure 2. Figure 7 shows a heating plate is plane view of Figure 6 for showing. Figure 8 shows a heating plate placed at the normal which the substrate is also state is surface of Figure 6. Figure 9 shows a heating plate placed at the abnormal which the substrate is also state is surface of Figure 6. Hereinafter, of the present invention in the embodiment for with an described pulsating current is reference to a drawing. Various of the present invention in the embodiment may be deformed into, below range embodiment of the present invention which is defined by the examples is don't interpreted to. The present in the embodiment in the art having knowledge of the average user of the present invention to illustrate the concave is to be provided for. Thus drawing in the shape of the element in order to emphasize the description more specifically was blown up. The present embodiment the first deoxygenator a semiconductor wafer or flat panel display panel, such as of a photolithography processes motion with respect to the substrate and can be side. In particular the present embodiment the first deoxygenator equipment is connected for exposure apparatus with respect to the substrate coating process process is performed can be used. Wafer substrate under a moment when a is used the described example example. Also hereinafter also to 2 through 9 the described substrate processing equipment of the present invention. Also Figure 2 shows a substrate processing equipment and drawing a looked from above, Figure 3 shows a drawing A-A equipment and looked in the direction a, Figure 4 of Figure 2 and drawing a looked in the direction B-B equipment, Figure 5 of Figure 2 in the direction a looked C-C equipment is surface of Figure 2. Also refers to surface 5 also to 2, substrate processing equipment (1) the rod port (100), index module (200), buffer module number 1 (300), coating and developing module (400), number 2 buffer module (500), exposure before and after processing module (600), the interface module (700) includes. Load port (100), index module (200), buffer module number 1 (300), coating and developing module (400), number 2 buffer module (500), exposure before and after processing module (600), the interface module (700) unit to sequentially control the play of one is arranged in one row in the direction. Hereinafter, load port (100), index module (200), buffer module number 1 (300), coating and developing module (400), number 2 buffer module (500), exposure before and after processing module (600), the interface module (700) are arranged, with number 1 direction direction (12) and called, number 1 direction when looked at the top (12) oriented vertically and number 2 direction (14) and called, 88800000 87888 (12) direction number 1 and number 2 direction (14) number 3 direction oriented vertically, respectively (16). called. Substrate (W) a cassette (20) is moved to the opening is formed in. The cassette (20) an external sealed from has structure that allows them to be. E.g., cassette (20) include a front opening door, in front integral pod (Front Open Unified Pod; FOUP) may be used. Hereinafter in load port (100), index module (200), buffer module number 1 (300), coating and developing module (400), number 2 buffer module (500), exposure before and after processing module (600), the interface module (700) as further described relative to.. Load port (100) rails are (W) the substrates (20) is disposed at an upper side or the susceptor (120) has a. Susceptor (120) a plurality is provided, susceptor rim (200) the number 2 direction (14) is arranged in one row in the along the. In Figure 2 of the 4 susceptor (120) is provided. Index module (200) the load port (100) of susceptor (120) the underlying cassette (20) and a buffer module number 1 (300) arranged between transferring a (W). Index module (200) a frame (210), index robot (220), and guide rail (230) have a. Frame (210) the generally a hollow rectangular parallelepiped which is arranged to, load port (100) and a buffer module number 1 (300) is arranged between. Index module (200) frame (210) number 1 refers to the buffer module (300) frame (310) a lower level than the may be provided in. Index robot (220), a guide rail (230) a frame (210) is left as it is in the. Index robot (220) a substrate (W) a hand handling directly (221) is number 1 direction (12), number 2 direction (14), number 3 direction (16) is movable such a way that it can swivel is axis drive 4 has. Index robot (220) the handrail (221), arm (222), support (223), and support (224) has a. Hand (221) arm (222) is fixed to. Arm (222) the telescoping structure and a rotatable structure is provided. Support (223) number 3 direction direction the length thereof (16) is disposed. Arm (222) a support (223) along the support to be movable in a (223) and is coupled to. Support (223) the pedestal (224) is which is firmly connected to the. Guide rail (230) in either the longitudinal the number 2 direction (14) is provided to disposed. Support (224) has a guide rail (230) straight along to be movable in a guide rail (230) and is coupled to. Furthermore, although not shown, frame (210) the cassette (20) door opener opening and closing the door is is further provided. Number 1 buffer module (300) a frame (310), number 1 buffer (320), number 2 buffer (330), cooling chamber (350), and buffer robot number 1 (360) have a. Frame (310) is the interior which an empty rectangular parallelepiped is arranged to, index module (200) and coating and developing module (400) is arranged between. Number 1 buffer (320), number 2 buffer (330), cooling chamber (350), and buffer robot number 1 (360) a frame (310) in 2000. Cooling chamber (350), number 2 buffer (330), and number 1 buffer (320) number 3 direction sequentially out from underneath the upper portion of (16) is disposed. Number 1 buffer (320) the refers to coating and developing module (400) application of module (401) is located at about the same level is at least two bodies separated, number 2 buffer (330) and a cooling chamber (350) the refers to coating and developing module (400) developing module (402) is at least two bodies separated is located at about the same level. Number 1 buffer robot (360) the number 2 buffer (330), cooling chamber (350), and number 1 buffer (320) and a number 2 direction (14) emitted 2000. Number 1 buffer (320) and a number 2 buffer (330) each plurality of substrates (W). storing temporarily. Number 2 buffer (330) the housing (331) and a plurality of struts (332) have a. Struts (332) the housing (331) which is located in, number 3 direction between each other (16) is arranged along the. Each support (332). is placed the one substrate (W). Housing (331) the index robot (220), buffer robot number 1 (360), and refers to of module (402) of the developing unit robot (482) the housing (331) in support (332) the substrate (W) suppliable or unloading robot index to (220) provided with a direction, buffer robot number 1 (360) provided with a direction, then, the robot part (482) is provided opening direction and each having (not shown) has a. Number 1 buffer (320) the number 2 buffer (330) has a similar structure that generally. Just, number 1 buffer (320) housing (321) the buffer robot number 1 (360) is provided, to fragrance and refers to applied module (401) an entire coating face located in a robot (432) has opening direction and each having is provided. Number 1 buffer (320) provided a (322) the number of number 2 buffer (330) a provided (332) the number of. which may be the same or different. In one embodiment, number 2 buffer (330) a provided (332) the number of number 1 buffer (320) provided a (322) may greater than the number of. Number 1 buffer robot (360) the number 1 buffer (320) and a number 2 buffer (330) arranged between. on the (W). Number 1 buffer robot (360) the handrail (361), arm (362), the support (363) has a. Hand (361) arm (362) is fixed to. Arm (362) are provided in the telescoping structure, hand (361) is number 2 direction (14) outputs a relay driving signal. is movable along. Arm (362) a support (363) number 3 along the direction (16) support to be movable in a straight (363) and is coupled to. Support (363) the number 2 buffer (330) from a position corresponding to number 1 buffer (320) corresponding to end, a length extending to a position in which the wall has a. Support (363) above or below the overlapping and the valve disc is made longer direction may be provided. Number 1 buffer robot (360) of merely one hand (361) is number 2 direction (14) and number 3 direction (16) along a only axis drive 2 can be is provided to be. Cooling chamber (350) cooling the substrate (W) each. Cooling chamber (350) the housing (351) and cooling plate (352) has a. Cooling plate (352) the substrate (W) (W) and a control gate including a member to penetrate the cooling means for cooling a (353) have a. Cooling means (353) at quantity cooling, with speech recognition function of a polyimide resin, such can be a scheme is used. Furthermore, cooling chamber (350) the substrate (W) cooling plate (352) is placed on lift pin assembly (not shown) are adjusted.. Housing (351) the index robot (220) and refers to of module (402) provided to the robot the developing unit (482) the cooling plate (352) the substrate (W) suppliable or unloading robot index to (220) is provided, to fragrance and the developing unit robot (482) is provided opening direction and each having (not shown) has a. Furthermore, cooling chamber (350) of the doors, a foot the above-mentioned the (not shown) can be is provided. Coating and developing module (400) (W) the substrate prior to a developing process a process and photoresist on the substrate exposure process performs a process developing the (W). Coating and developing module (400) has a generally rectangular parallelepiped shape. Coating and developing module (400) coating module (401) the developing module (402) have a. Applied module (401) the developing module (402) between the objects are arranged so that a dimensional barcode layer. In one embodiment, applied module (401) the charging unit charges the photoreceptor module (402) is located at the top of.. Applied module (401) to a substrate (W) for applying a photoresist and a photoresist solution by using a flow process and controlling resist coating process (W) substrate before and after heat treatment, such as heating and cooling to includes process. Applied module (401) a resist applied chamber (410), bake chamber (420), and transfer chamber (430) has a. Resist coating chamber (410), bake chamber (420), and transfer chamber (430) the number 2 direction (14) are arranged sequentially along the. Thus resist coating chamber (410) and a bake chamber (420) unloading means has a chamber (430) number 2 direction separating members, wherein (14) apart from one another in 2000. Resist coating chamber (410) comprises a plurality is provided, number 1 direction (12) and number 3 direction (16) each plurality are provided and.. In drawing 6 of resist coating chamber (410) is provided with a are shown. Bake chamber (420) the number 1 direction (12) and number 3 direction (16) each plurality are provided and.. In drawing 6 of bake chamber (420) is provided with a are shown. However alternatively bake chamber (420) further the water inflow channels may be provided. Transfer chamber (430) buffer module the number 1 (300) of number 1 buffer (320) and a number 1 direction (12) is positioned in parallel at. Transfer chamber (430) in the robot an entire coating face (432), a guide rail (433). is located. Transfer chamber (430) has an essentially rectangular of shaped.. An entire coating face robot (432) are bake chambers (420), resist coating chambers (400), buffer module number 1 (300) of number 1 buffer (320), and number 2 refers to buffer module (500) of number 1 cooling chamber (520) transferring a (W) arranged between. Guide rail (433) in either the longitudinal the number 1 direction (12) is made aligned with a are arranged so that a. Guide rail (433) an entire coating face the robot (432) is number 1 direction (12). to the mobile straight. An entire coating face robot (432) the handrail (434), arm (435), support (436), and support (437) has a. Hand (434) arm (435) is fixed to. Arm (435) the telescoping structure is provided at hand (434) are horizontal moves toward the. Support (436) number 3 direction direction the length thereof (16) is provided to disposed. Arm (435) a support (436) number 3 along the direction (16) support to be movable in a straight (436) and is coupled to. Support (436) the pedestal (437) and is fixedly coupled to, support (437) has a guide rail (433) so as to be movable along guide rail (433) and is coupled to. Resist coating chambers (410) has a structure may all use the same. Just, each resist coating chamber (410) photoresist used in the kind of different. Neck-amplification-type resist is photoresist in one example (chemical amplification resist) may be used. Resist coating chamber (410) the substrate (W) photoresist on.. Resist coating chamber (410) the housing (411), support plate (412), and nozzle (413) have a. Housing (411) open upper portion has has cup-shaped. Support plate (412) the housing (411) located in the casing, to support the foot panel 50. (W) substrate. Support plate (412) of the rotatably provided. Nozzle (413) the support plate (412) the underlying substrate (W) photoresist is supplied to on. Nozzle (413) is entrapped in an annular the diameter of the, center of substrate (W) able to supply a photoresist. Selectively nozzle (413) a substrate (W) has a length, the length of a corresponding to the diameter of the, nozzle (413) a discharge opening of slit stretching in the may be provided. Furthermore, additionally resist coating chamber (410) photoresist the substrate (W) such as deionized water for cleaning the surface nozzle having spiral structure for supplying the rotation groove (414) can be is further provided. Bake chamber (420) heat-treating the substrate (W) is provided a bake unit. Bake chamber (420) heating unit (421) and cooling unit (422) includes. The photoresist over the substrate prior to the (W) (W) a substrate by heating a to a temperature so that the moisture removing or organic surface hydrogen PREBAKE and exposing the photoresist of the first conductive layer pattern is (prebake) onto a substrate (W) a carried out after the soft bake (soft bake) used to perform process, or the like can be. Heating unit (421) heat treating the a substrate (W). Heating unit (421) heat treating (W) inside the substrate provides for use in a thermal processing space. Heat treatment the substrate supporing unit (820) is provided. Substrate supporing unit (820) to support the foot panel 50. a heat treatment by a heat treatment space (W) substrate. Figure 6 shows a substrate supporing unit a cross-sectional drawing and, Figure 7 shows a plane for showing heating plate also of Figure 6 is of Figure 2. Also 6 and 7 with a, substrate supporing unit (820) the heating plate (822), lift pin, guide (824), heater (826), measurement member (not shown), and controller (860) includes. Heating plate (822) a circular of plate-like having is provided to. Heating plate (822) on the upper surface of the plurality of pinhole (828) is are formed. E.g., pinhole (828) the 3 may be provided in two. Each pinhole (828) the heating plate (822) away along the circumferential direction of 2000. pin halls (828) is each other 2000 apart in portions at an interval equal to a robot picks the chip. Lift pin (823) each pinhole (828) to 2000. Lift pin (823) a driving member (not shown) up and down by the position and lowered position. movable. Elevation position the lift pin (823) of a top end of pinhole (828) has, projecting above a from, the lift pin lowered position (823) of a top end of pinhole (828) is provided. a position. The height of the lift pin by lifting located at (823) (W) from the an entire coating face of acceptance from or robot, can be phosphorus. Guide (824) heating plate (822) substrate to substrate (W) is exactly guiding a (W). Guide (824) comprises a plurality is provided. Each of the guide (824) heating plate (822) edge on an upper side of 2000. Each of the guide (824) has on their upper sides and a plate is heated (822) external surfaces of the concave and 2004 is provided to face in the direction of the downward sloping vanes. Each of the guide (824) heating plate (822) along the circumferential direction of apart from one another in 2000. Guide (824) the between each other in portions at an interval equal to apart 2000. Guide (824) the combined with one another, having the ring-shaped beams are is provided to. Heater (826) heating plate (822) that is situated in a.. Heater (826) comprises a plurality fitted with a, each essentially coplanar and 2000. Each heater (826) the heating plate is heated different areas each other. Thus heating plate (822) on the upper surface of the each heater (826) with an over heated by the heating zone (855 to 841) have a. Heating of the subzones and (855 to 841) the heater (826) and in one-to-one correspondence is provided to e.g., heating of the subzones and (855 to 841) the 15 can be two. Each heating zone (855 to 841) the each heater (826) face is positioned opposite to and a.. Each heater (826) with a presettable setting value corresponding to the SLUT heating at a temperature such that the is heated. Heater (826) is located outside the are connected with a power. Heater (826) the power from a rising is. Heating a heater (826) heating plate (822) the, is the heating plate, (822) heat treating the (W) the underlying substrate. Measurement member (not shown) the heating of the subzones and (855 to 841) each temperature measure the. Pair. includes a temperature sensor. Temperature sensor is different than the other of the subzones and a heating provided (855 to 841). to measure the temperature of. Temperature sensor 15 of the subzones and for clearing nozzles of two (855 to 841) to measure the temperature of sensor 15 may be provided in. In one embodiment, heating plate sensor number 1 number 2 sensor and (822) is placed in the area edge of temperature measure the heating zone. Number 3 sensor and heater plate, wherein sensor number 4 (822) is placed in the area center of heating zone measure the temperature. Number 1 number 2 sensor and heating zone is different than the other sensor measure the temperature. Number 1 number 2 sensor and sensor the heating plate, (822) face is positioned opposing each other and central axis of.. Number 1 number 2 sensor and heating plate each sensor (822) of with the openings being spaced from one out from the centre axis has is provided movably in the same distance. Number 3 sensor and heating zone is different than the other sensor number 4 measure the temperature. Number 3 sensor and heater plate, wherein sensor number 4 (822) face is positioned opposing each other and central axis of.. Number 3 sensor and heating plate each sensor number 4 (822) of with the openings being spaced from one out from the centre axis has is provided movably in the same distance. Also shown in two 15 for clearing nozzles of zone 7 (855 to 841) number 8 sensor number 1 number 2 sensor and during heating zone (848) and number 12 heating zone (852) and to measure the temperature of, heating zone number 2 sensor number 4 sensor and number 3 (842) and number 3 heating zone (843). temperature of. Controller (860) a measurement member measured from temperature calculated to determine the folding of the substrate. Controller (860) heating plate (822) central axis of a face is positioned opposing each other and provided from temperature sensor 2 calculated. received diagnostic message to determine a status of the substrate (W). Controller (860) of the 2 difference between values temperature sensor is installed in the inside of cross point is when provided in, same substrate (W) in a steady state of. clock controller outputs an. Alternatively controller (860) of the 2 difference between values temperature sensor is installed in the inside of cross point is when reflects beyond, substrate (W) guide includes two guide members. clock controller outputs an abnormal state. Controller (860) the substrate (W) state of safe arrival by the safe if it is determined as abnormal state, can generate a alarm. E.g., controller (860) a sensor is installed in the inside of the number 1 number 2 number 1 number 2 a sensor is installed in the inside of and the temperature value and temperature value for the number 1 comparing to the allowable range difference value, based on same. received diagnostic message to determine a status of substrate. In addition controller (860) a sensor is installed in the inside of the number 3 and number 4 and the temperature value number 3 sensor is installed in the inside of a temperature value for the number 2 number 4 comparing to the allowable range difference value, based on same. received diagnostic message to determine a status of substrate (W). Figure 8 shows a heating plate normal which the substrate is a state drawing and, also of Figure 6 Figure 9 shows a heating plate which the substrate is abnormal is inadequately loaded state is surface of Figure 6. Also refers to surface 8 and 9, controller (860) the number 2 heating zone (842) and number 3 heating zone (843), number 4 heating zone (844) and number 6 heating zone (846), number 5 heating zone (845) and number 7 heating zone (847), number 8 heating zone (848) and number 12 heating zone (852), number 9 heating zone (888000259 4888) and number 13 heating zone (853), number 10 heating zone (850) and number 14 heating zone (854), and number 11 heating zone (851) and number 15 heating zone (855) calculated temperature of the substrate (W) can be received diagnostic message to determine a status of. E.g., controller (860) heating plate (822) and the temperature value is placed in the area center of is placed in the area and an edge, with a difference between the temperature value and data is received diagnostic message to determine a status of a substrate (W) is not used as a basis. E.g., number 2 heating zone (842) number 10 value and temperature of heating zone (850), with a difference between the and the temperature value of is allowed even beyond cross point, received diagnostic message to determine a status of (W) of the substrate is not used as a basis. In addition each heating plate and the temperature value (822) to the edge area of a for even it will be a price, , a value is the if not opposite to each other, one side of the substrate same used as the basis for determining not. E.g., number 10 heating zone (850) number 11 value and temperature of heating zone (851) is allowed difference value for the temperature of even beyond cross point, received diagnostic message to determine a status of (W) of the substrate is not used as a basis. In addition controller (860) heating plate (822) is placed in the area center of edge than the first plasma source coil and the temperature value and the temperature value is placed in the area treated by fixing the. (W) of the substrate is abnormal an external relative to the central portion thereof and are found to exhibit significantly difference value for the is installed at a suction line, substrate (W) more state of safe arrival by the safe can be a device to quickly determine. Also again refers to surface 5 also to 2, cooling unit (421) for later affixation to a substrate (W) each heating process cooling the process, or the like is used to perform. The cooling plate and cooling unit includes a lift assembly. Cooling plate (421) one bake chamber the cooling plate (420) heated in plate (822) is located on one side of. Cooling and supports the inspection, internal a cooling water or thermoelectric elements and equal coolant means (423) is provided. Selectively bake chamber is provided at portion of cooling only, another portion may be provided only the heating unit. Developing module (402) a substrate (W) on, such as to obtain a pattern to the types of a resist or photoresist is supplied to an engine, developing process of removing a part of, and developing process before and after substrate (W) performed for a heating and cooling heat treatment, such as process includes. Developing module (402) the charging unit charges the photoreceptor chamber (460), bake chamber (470), and transfer chamber (480) has a. Developing chamber (460), bake chamber (470), and transfer chamber (480) the number 2 direction (14) are arranged sequentially along the. Thus developing chamber (460) and a bake chamber (470) unloading means has a chamber (480) number 2 direction separating members, wherein (14) apart from one another in 2000. Developing chamber (460) comprises a plurality is provided, number 1 direction (12) and number 3 direction (16) each plurality are provided and.. In drawing 6 of a chamber (460) is provided with a are shown. Bake chamber (470) the number 1 direction (12) and number 3 direction (16) each plurality are provided and.. In drawing 6 of bake chamber (470) is provided with a are shown. However alternatively bake chamber (470) the water inflow channels further may be provided. Transfer chamber (480) buffer module the number 1 (300) of number 2 buffer (330) and a number 1 direction (12) is positioned in parallel at. Transfer chamber (480) robot the developing unit in the (482), a guide rail (483). is located. Transfer chamber (480) has an essentially rectangular of shaped.. The developing unit robot (482) are bake chambers (470), developing chambers (460), buffer module number 1 (300) of number 2 buffer (330) and a cooling chamber (350), and number 2 buffer module (500) of number 2 cooling chamber (540) transferring a (W) arranged between. Guide rail (483) in either the longitudinal the number 1 direction (12) is made aligned with a are arranged so that a. Guide rail (483) the charging unit charges the photoreceptor part robot (482) is number 1 direction (12). to the mobile straight. The developing unit robot (482) the handrail (484), arm (485), support (486), and support (487) has a. Hand (484) arm (485) is fixed to. Arm (485) are provided in the telescoping structure hand (484) a moves toward the are horizontal. Support (486) number 3 direction direction the length thereof (16) is provided to disposed. Arm (485) a support (486) number 3 along the direction (16) support to be movable in a straight (486) and is coupled to. Support (486) the pedestal (487) is which is firmly connected to the. Support (487) has a guide rail (483) so as to be movable along guide rail (483) and is coupled to. Developing chambers (460) has a structure may all use the same. Just, each developing chamber (460) a developer used in the kind of different. Developing chamber (460) the substrate (W) is irradiated, a during photoresist on the areas are removed and an. The, protective film during removing of the housing to a region irradiated with light is. And selectively using photoresist passivation layer photoresist and of the rays or laser beams such that regions only be areas that are not. can be removed. Developing chamber (460) the housing (461), support plate (462), and nozzle (463) have a. Housing (461) open upper portion has has cup-shaped. Support plate (462) the housing (461) located in the casing, to support the foot panel 50. (W) substrate. Support plate (462) of the rotatably provided. Nozzle (463) the support plate (462) the underlying substrate (W) onto. the developer supply nozzle includes a nozzle. Nozzle (463) is entrapped in an annular the diameter of the, substrate (W) can be developing solution supply to the centre of the same. Selectively nozzle (463) a substrate (W) has a length, the length of a corresponding to the diameter of the, nozzle (463) a discharge opening of slit stretching in the may be provided. Furthermore, developing chamber (460) the additionally developer supplied with the substrate (W) such as deionized water for cleaning the surface nozzle having spiral structure for supplying cleaning liquid (464) can be is further provided. Developing module (402) of bake chamber (470) has an applicator module (401) of bake chamber (470), a reflector of the same shape as described above, has, to a dispensed therefore, the. Bake chamber (470) heat-treating the substrate (W). E.g., bake chambers (470) the charging unit charges the photoreceptor process is performed over the substrate prior to the heating a (W) is provided to reduce and developing process (W) the substrate heating a hard bake process and each bake process (W) of the substrate being heated after cooling the performs process, or the like. Bake chamber (470) comprises a cooling-plate (471) or heating plate (472) has a. Cooling plate (471) cooling water or thermoelectric elements and equal coolant means (473) is provided. Or heating plate (472) heating means such as thermoelectric elements and or like a triangle (474) is provided. Cooling plate (471) and the heating-plate (472) one bake chamber (470) may be provided in each. Selectively bake chamber (470) cooling plate that is some (471) and having only a, heating plate another portion (472) and can comprise of only. As described above coating and developing module (400) substance coated on module (401) the developing module (402) is provided allows for a decoupling of the between the objects. Furthermore, at the top look application as module (401) the developing module (402) the same material may have a chamber arrangement. Number 2 buffer module (500) the coating and developing module (400), exposure before and after processing module (600) between the substrate (W) is provided passage of the liquid is conveyed. Furthermore, buffer module number 2 (500) a substrate (W) the cooling of the first conductive layer pattern is a predetermined metric such as the edge exposure process, or the like performs process. Number 2 buffer module (500) a frame (510), buffer (520), number 1 cooling chamber (530), number 2 cooling chamber (540), edge exposure chamber (550), and buffer robot number 2 (560) have a. Frame (510) has the rectangular parallelepiped shape. Buffer (520), number 1 cooling chamber (530), number 2 cooling chamber (540), edge exposure chamber (550), and buffer robot number 2 (560) a frame (510) in 2000. Buffer (520), number 1 cooling chamber (530), and edge exposure chamber (550) has an applicator module (401) is arranged a height corresponding to. Number 2 cooling chamber (540) has a developing module (402) is arranged a height corresponding to. Buffer (520), number 1 cooling chamber (530), and number 2 cooling chamber (540) sequentially number 3 direction (16) is arranged in one row in the along the. At the top look when buffer (520) coating module (401)-to-be-treated carrying chamber (430) and a number 1 direction (12) is disposed. Edge exposure chamber (550) detects a (520) or number 1 cooling chamber (530) and a number 2 direction (14) is emitted. Number 2 buffer robot (560) the buffer (520), number 1 cooling chamber (530), and edge exposure chamber (550) arranged between carrying a (W). Number 2 buffer robot (560) edge exposure chamber (550) and the buffer (520) between the 2000. Number 2 buffer robot (560) the buffer robot number 1 (360) which are similar to those of may be provided in. Number 1 cooling chamber (530) and a edge exposure chamber (550) has an applicator module (401) is used for performing a drying process a substrates performs the insulating layer is further to (W). Number 1 cooling chamber (530) has an applicator module (401) is used for performing a drying process a substrate (W). cooling. Number 1 cooling chamber (530) buffer module the number 1 (300) cooling chamber of (350) has a which are similar to those of. Edge exposure chamber (550) the number 1 cooling chamber (530) in (W) substrates cooling process is performed with respect to exposed edge. Buffer (520) the edge exposure chamber (550) is used for performing a drying process a substrate (W) are refers to a preprocessing module (601) (W) the substrate prior to being conveyed to. storing temporarily. Number 2 cooling chamber (540) refers to the post-processing module (602) is used for performing a drying process a substrates (W) is developed module (402) before being conveyed to cooling the substrates to (W). Number 2 buffer module (500) the charging unit charges the photoreceptor module (402) are added to the height and corresponding may have further buffer. In this case, post-processing module (602) is used for performing a drying process a substrates (W) further the one buffer to the after temporarily storing developing module (402) can be transported to. Exposure before and after processing module (600) the, exposure device (900) is immersion exposure process the case of, applied to the (W) of a substrate during immersion exposure structure pattern is a second metal layer is applying a treated. Furthermore, exposure before and after processing module (600) the exposure for later affixation to a substrate comprising the step of cleaning (W) can be. Furthermore, chemical amplification type using resist application, and to when process is performed, exposure before and after processing module (600) the post exposure bake process treated. Exposure before and after processing module (600) a preprocessing module the (601) and the post-processing module (602) have a. A preprocessing module (601) (W) the substrate prior to the exposure connected to the second wire group subjected to a high frequency AC electric for processing, post-processing module (602) for later affixation to a substrate a developing process performs process (W). A preprocessing module (601) and the post-processing module (602) between the objects are arranged so that a dimensional barcode layer. In one embodiment, a preprocessing module (601) the post-processing module (602) is located at the top of.. A preprocessing module (601) coating module (401) is provided flush with the. Post-processing module (602) the charging unit charges the photoreceptor module (402) is provided flush with the. A preprocessing module (601) can provide a protective film having a applied chamber (610), bake chamber (620), and transfer chamber (630) has a. The coated TFT chamber (610), transfer chamber (630), and bake chamber (620) the number 2 direction (14) are arranged sequentially along the. Thus the coated TFT chamber (610) and a bake chamber (620) unloading means has a chamber (630) number 2 direction separating members, wherein (14) apart from one another in 2000. The coated TFT chamber (610) comprises a plurality is provided, number 3 direction to layered each other (16) is disposed. Selectively the coated TFT chamber (610) the number 1 direction (12) and number 3 direction (16) each plurality may be provided one by one. Bake chamber (620) comprises a plurality is provided, number 3 direction to layered each other (16) is disposed. Selectively bake chamber (620) the number 1 direction (12) and number 3 direction (16) each plurality may be provided one by one. Transfer chamber (630) buffer module the number 2 (500) of number 1 cooling chamber (530) and a number 1 direction (12) is positioned in parallel at. Transfer chamber (630) in the pretreatment robot (632). is located. Transfer chamber (630) has an essentially square or rectangular of shaped.. Pretreatment robot (632) can provide a protective film having a applied chambers (610), bake chambers (620), number 2 buffer module (500) buffer (520), and refers to interface module (700) of number 1 buffer (720) transferring a (W) arranged between. Pretreatment robot (632) the handrail (633), arm (634), the support (635) has a. Hand (633) arm (634) is fixed to. Arm (634) the telescoping structure and a rotatable structure is provided. Arm (634) a support (635) number 3 along the direction (16) support to be movable in a straight (635) and is coupled to. The coated TFT chamber (610) has a liquid immersion exposure in the substrate (W) a second metal layer is resist film is coated at the on. The coated TFT chamber (610) the housing (611), support plate (612), and nozzle (613) have a. Housing (611) open upper portion has has cup-shaped. Support plate (612) the housing (611) located in the casing, to support the foot panel 50. (W) substrate. Support plate (612) of the rotatably provided. Nozzle (613) the support plate (612) the underlying substrate (W) capable of forming a protection film onto. supplying an aqueous liquid for for protecting. Nozzle (613) is entrapped in an annular the diameter of the, substrate (W) to the centre of the same can be supplying an aqueous liquid for protection. Selectively nozzle (613) a substrate (W) has a length, the length of a corresponding to the diameter of the, nozzle (613) a discharge opening of slit stretching in the may be provided. In this case, support plate (612) are locked state may be provided in. Includes of a foamed material liquid protection. A protection low affinity for photoresist and water can be material is used. E.g., a fluororesin liquid protection may comprise an solvent system. The coated TFT chamber (610) has support plate (612) the underlying substrate by the supporting member into rinse liquid (W) (W) substrate-section with a central area of. supplying an aqueous liquid for protection. Bake chamber (620) has a protective film coated with an heat-treating a substrate (W). Bake chamber (620) comprises a cooling-plate (621) or heating plate (622) has a. Cooling plate (621) cooling water or thermoelectric elements and equal coolant means (623) is provided. Or heating plate (622) heating means such as thermoelectric elements and or like a triangle (624) is provided. Heating plate (622) and cooling plates (621) one bake chamber (620) may be provided in each. Selectively bake chambers (620) and certain of the heating plate (622) and having only a, cooling plate another portion (621) and can comprise of only. Post-processing module (602) the cleaning chamber (660), post exposure bake chamber (670), and transfer chamber (680) has a. Cleaning chamber (660), transfer chamber (680), and post exposure bake chamber (670) the number 2 direction (14) are arranged sequentially along the. Thus cleaning chamber (660) and a post exposure bake chamber (670) unloading means has a chamber (680) number 2 direction separating members, wherein (14) apart from one another in 2000. Cleaning chamber (660) comprises a plurality is provided, number 3 direction to layered each other (16) can be disposed. Selectively cleaning chamber (660) the number 1 direction (12) and number 3 direction (16) each plurality may be provided one by one. Post exposure bake chamber (670) comprises a plurality is provided, number 3 direction to layered each other (16) can be disposed. Selectively post exposure bake chamber (670) the number 1 direction (12) and number 3 direction (16) each plurality may be provided one by one. Transfer chamber (680) number 2 when look in the upper buffer module (500) of number 2 cooling chamber (540) and a number 1 direction (12) is positioned in parallel at. Transfer chamber (680) has an essentially square or rectangular of shaped.. Transfer chamber (680) in the post-processing robot (682). is located. Post-processing robot (682) cleaning chambers (660), post exposure bake chambers (670), number 2 buffer module (500) of number 2 cooling chamber (540), and refers to interface module (700) of number 2 buffer (730) carrying a (W) arranged between. Post-processing module (602) robot process and the post-treatment is provided (682) a preprocessing module the (601) provided a pre-processing robot (632) is the same in structure and may be provided in. Cleaning chamber (660) for later affixation to a substrate the exposure process station cleans the (W). Cleaning chamber (660) the housing (661), support plate (662), and nozzle (663) have a. Housing (661) the upper opened and an intra-has cup-shaped. Support plate (662) the housing (661) located in the casing, to support the foot panel 50. (W) substrate. Support plate (662) of the rotatably provided. Nozzle (663) the support plate (662) the underlying substrate (W) a cleaning liquid is supplied onto the. At cleaning liquid, such as standing, deionized water can be is used. Cleaning chamber (660) has support plate (662) substrate (W) the underlying substrate-section with a central area of the supporting member into rinse liquid in a cleaning liquid is supplied a (W). Selectively substrate (W) is rotated during nozzle (663) in-section with a central area of a substrate (W) until edge region can be linearly moving or rotational movement. Post exposure bake chamber (670) has with far UV is used for performing an exposure process using a substrate heating a (W). Post exposure bake a substrate (W) by heating so that the photoresist patterns to be exposed by the same the resulting acid (acid) change properties of photoresist amplification of the. finished. Post exposure bake chamber (670) heating plate (672) has a. Heating plate (672) heating means such as thermoelectric elements and or like a triangle (674) is provided. Post exposure bake chamber (670) inside the slurry cooling plate (671) and can comprise of further. Cooling plate (671) cooling water or thermoelectric elements and equal coolant means (673) is provided. Furthermore, selectively cooling plate (671) having only a black and a bake chamber and an can be is further provided. Processing module before and after exposure as described above (600) a preprocessing module in (601) and the post-processing module (602) between the objects is provided to completely separate. Furthermore, a preprocessing module (601)-to-be-treated carrying chamber (630) and a post-processing module (602)-to-be-treated carrying chamber (680) is provided at the same size, when look at the top between each other can be provided to fully overlaps a. Furthermore, the coated TFT chamber (610) and a cleaning chamber (660) each other are provided in the same size when look at the top between each other can be provided to fully overlaps a. Furthermore, bake chamber (620) and a post exposure bake chamber (670) is provided at the same size, when look at the top between each other can be provided to fully overlaps a. Interface module (700) before and after the exposure processing module (600), and exposure device (900) arranged between transferring a (W). Interface module (700) a frame (710), number 1 buffer (720), number 2 buffer (730), the interface robot (740) has a. Number 1 buffer (720), number 2 buffer (730), the interface robot (740) a frame (710) in 2000. Number 1 buffer (720) and a number 2 buffer (730) is arranged spaced apart the main absorbent each other has, is and arranged so as to be stacked one atop the other, particularly. Number 1 buffer (720) the number 2 buffer (730) is is disposed higher than. Number 1 buffer (720) the a preprocessing module (601) is located at about the same level is at least two bodies separated, number 2 buffer (730) has process and the post-treatment module (602) is arranged the height corresponding to. When look at the top number 1 buffer (720) the a preprocessing module (601)-to-be-treated carrying chamber (630) and a number 1 direction (12) and are arranged in one row in the along the, number 2 buffer (730) has process and the post-treatment module (602)-to-be-treated carrying chamber (630) and a number 1 direction (12) with a series of be disposed in a 2000. Interface robot (740) the number 1 buffer (720) and number 2 buffer (730) and a number 2 direction (14) apart 2000. Interface robot (740) the number 1 buffer (720), number 2 buffer (730), and exposure device (900) arranged between carrying a (W). Interface robot (740) the buffer robot number 2 (560) has a similar structure that generally. Number 1 buffer (720) the a preprocessing module (601) is used for performing a drying process a substrate (W) are exposure device (900) before they is moved to. temporarily storing. And number 2 buffer (730) has exposure device (900) in process is performed regarding a substrate (W) are post-processing module (602) is moved to before they. temporarily storing. Number 1 buffer (720) the housing (721) and a plurality of struts (722) have a. Struts (722) the housing (721) which is located in, number 3 direction between each other (16) is arranged along the. Each support (722). is placed the one substrate (W). Housing (721) the interface robot (740) robot DC error in ghost canceller (632) the housing (721) into support (722) (W)/ out unloading substrate interface robot (740) is provided, to fragrance and pretreatment robot (632) is provided opening direction and each having (not shown) has a. Number 2 buffer (730) the number 1 buffer (720) has a similar structure that generally. Just, number 2 buffer (730) housing (4531) the interface robot (740) provided with a robot and a post-processing direction (682) is provided opening direction and each having (not shown) has a. Interface module (W) relative to the substrate in the process chamber and supports of the chamber without provided and robot buffers as described above can be unit. The above-mentioned in the embodiment the measurement member (not shown) and a controller (860) is resist coating module (401) provided a bake chamber and an (420) described is provided on. However measurement member (not shown) and a controller (860) has a developing module (402) into a bake unit of (420) may be provided to. 822: heating plate 826: heater 840 to 855: heating of the subzones and 860: controller Provided are an apparatus and a method for treating a substrate by heat. The apparatus for treating a substrate comprises: a heating plate having a plurality of heating zones on an upper surface, and where the substrate is settled; a heater located in the heating plate to heat each heating zone; a measurement member measuring the temperature of each heating zone; and a controller receiving a temperature value measured from the measurement member and deciding a settlement condition of the substrate. The measurement member face the heating plate around a central axis, and comprises temperature sensors having a first sensor and a second sensor measuring the different temperature of heating zones. The controller decides the settlement condition of the substrate based on a first difference value between a first temperature value provided from the first sensor, and a second temperature value provided from the second sensor. Also, the controller separates the normal settlement condition about a central area and an edge area of the substrate and decides the same, thereby precisely understanding the settlement condition about the substrate in which one surface is round. COPYRIGHT KIPO 2015 On the upper surface has plurality of heating zone, and the heating plate, that a substrate is placed; said to heat each of the subzones and heating said heating plate which is positioned within the heaters and; heating said each respective temperature of the subzones and through the measuring region and; said measurement member providing a and the temperature value measured from said one side of the substrate containing an control for determining, said pair, said heating plate central axis which face is positioned opposing each other and, heating said different to measure the temperature zone number 1 number 2 sensor and a temperature sensor comprising a sensors, said number 1 sensor is installed in the inside of said controller and the temperature value and number 1 number 2 sensor is installed in the inside of said number 2 number 1 value for the temperature difference value based on one side of the substrate said device substrate processing for determining. According to Claim 1, said number 1 difference said controller when provided in cross point is, said one side of the substrate in a steady state clock controller outputs an, said differential value is said number 1 surface values of allowable range, said substrate guide includes two guide members a substrate processing device to print images abnormal state.
